Cooling apparatus, retrofit kit, shrinking device, shrinking system and method

Abstract

The invention relates to a cooling apparatus (1) for a shrinking device (50), comprising: a cooling sleeve means (2), which has an inner circumferential surface (3) for heat-coupling placement against a shrink-fit chuck (60) to be cooled by means of the cooling apparatus (1), and which has at least one cooling channel (4), which is fluid-conductingly separated from the inner circumferential surface (3) and through which a cooling fluid (L) can flow in order to absorb and transport away heat introduced on the inner circumferential side; and a sensor means (5) mounted on the cooling sleeve means (2) for detecting a temperature of the shrink-fit chuck (60) to be cooled, wherein the sensor means (5) is designed to detect the temperature of the shrink-fit chuck (60) to be cooled axially outside the inner circumferential surface (3) when the inner circumferential surface (3) is heat-couplingly placed against the shrink-fit chuck (60) to be cooled.

Description

[0001] Cooling device, retrofit kit, shrinking device, shrinking system and process

[0002] The invention relates to a cooling device for a shrink-fitting device and a retrofit kit for converting a basic cooling device into such a cooling device. Furthermore, the invention relates to a shrink-fitting device for thermally actuating a shrink-fit chuck for a clamping and / or unclamping process. The invention further relates to a shrink-fitting system with such a shrink-fitting device. Furthermore, the invention relates to a method for operating such a cooling device.

[0003] The invention is based on a cooling device of a shrink-fit device of a shrink-fit system known from DE 10 2004 042 898 B3. The known cooling device serves to cool shrink-fit chucks during thermal clamping and unclamping by means of the shrink-fit device, i.e., for clamping and shrink-fitting tools. The cooling device is designed as a cooling adapter, which can be brought into large-area contact with a previously heated tool-holding section of the shrink-fit chuck to dissipate heat from the shrink-fit chuck.

[0004] To carry out the thermal clamping or unclamping process, a tool holding section of the shrink fit chuck is typically heated and thereby expanded using a heating device, for example in the form of an inductor, a hot air blower, or an open flame. Typical temperatures for a shrink fit chuck during such a heating process are between 200°C and 400°C. When the shrink fit chuck is heated, a tool can be partially inserted through a tool holding opening into a holding space of the shrink fit chuck. By appropriately oversizing an outer diameter of a tool shank of the tool compared to an inner diameter of the tool holding opening and the holding space, an interference fit between the tool and the shrink fit chuck is achieved during subsequent cooling of the shrink fit chuck, which can be carried out in particular with the assistance of the cooling device.The tool is then connected to the shrink fit chuck in an axially force-locking and / or rotationally fixed manner and can be used, for example, for machining tasks such as those encountered during the cutting of workpieces. To unclamp the tool from the shrink fit chuck, the tool holder section is also heated. This heating should occur so quickly that the tool itself does not experience significant heating or at least no significant thermal expansion. During and after heating of the shrink fit chuck, the user should be protected from burning themselves on the hot shrink fit chuck. Shrink fit chucks are usually made of metallic materials and therefore have particularly good thermal conductivity properties compared to other materials.While this is advantageous for the shrinking process, the good thermal conductivity also poses the risk of skin burns from touching the heated shrink fit chuck. For this reason, long cooling times are typically specified for the cooling process following heating. These ensure that the shrink fit chuck has cooled sufficiently at the end of the cooling process to allow it to be handled for further use without protective measures such as gloves or tools. However, such long cooling times conflict with the requirement for quick tool changes and rapid reusability of the shrink fit chucks.

[0005] It is therefore an object of the present invention to provide a cooling device for a shrink-fit device, a retrofit kit for retrofitting a basic cooling device to such a cooling device, a shrink-fit device for thermally actuating a shrink-fit chuck for a clamping and / or unclamping process, a shrink-fit system with a shrink-fit device, and a method for operating such a cooling device, in particular in a shrink-fit device, in particular one provided by a shrink-fit system, each of which has improved properties. In particular, the aim is to enable particularly rapid reusability of the shrink-fit chuck after a clamping or unclamping process.

[0006] This object is achieved by the subject matter of the independent claims. Preferred embodiments are the subject matter of the dependent claims.

[0007] A cooling device according to the invention is designed for a shrink-fitting device. In particular, the cooling device can be used in such a shrink-fitting device. The shrink-fitting device serves to thermally actuate a shrink-fit chuck for a clamping and / or unclamping process. The cooling device can be used, in particular, for the thermal clamping process.

[0008] The cooling device can be used to extract heat from a shrink fit chuck to cool it. As a result of the cooling of the shrink fit chuck, a tool receiving space of the shrink fit chuck can be narrowed, particularly in a controlled manner, to clamp a tool shank located in the tool receiving space. It is understood that the cooling device can also be used to cool the shrink fit chuck without a tool shank located in the tool receiving space, particularly if no new tool is to be clamped after the unclamping process.

[0009] The cooling device comprises a cooling sleeve device. The cooling sleeve device has an inner circumferential surface for thermally coupling contact with the shrink fit chuck to be cooled by the cooling device. In particular, the inner circumferential surface is designed to be fully contacted with an outer circumferential surface of the shrink fit chuck that is complementary to the inner circumferential surface. In particular, the inner circumferential surface is a circumferential section of a surface on an inner circumference of the cooling sleeve device, in particular in the form of a lateral surface. In the present context, "contact" can be understood as synonymous with "contacting" and / or "touching."

[0010] The cooling sleeve device of the cooling apparatus has at least one cooling channel through which a cooling fluid can flow, separated from the inner peripheral surface, in a fluid-conducting manner. This allows heat introduced on the inner peripheral surface to be absorbed and transported away. In particular, heat originating from the cooled shrink fit chuck can be introduced into the cooling sleeve device via the inner peripheral surface, which is thermally coupled to the shrink fit chuck. Said heat introduced into the cooling sleeve device can be absorbed by the cooling fluid flowing through the cooling channel and transported away from the inner peripheral surface.

[0011] The cooling device also has a sensor device designed to detect the temperature of the shrink fit chuck to be cooled. The sensor device is mounted on the cooling sleeve device. "Mounted" can mean "fixedly mounted" or "movably mounted," in particular "guided and movable."

[0012] According to the invention, the sensor device of the cooling device is designed to detect the temperature of the shrink-fit chuck to be cooled axially outside the inner peripheral surface when the inner peripheral surface is thermally coupled to the shrink-fit chuck to be cooled. The sensor device is expediently designed to detect the temperature of the shrink-fit chuck to be cooled in a surface area of ​​the shrink-fit chuck to be cooled, which surface area is different from the outer peripheral surface of the shrink-fit chuck that is or can be applied to the inner peripheral surface.Advantageously, in a thermally coupled state of the shrink fit chuck to be cooled and the cooling sleeve device, the entire inner circumferential surface of the cooling sleeve device and the entire outer circumferential surface of the shrink fit chuck, which is preferably applied thereto over its entire surface, are available for heat transfer between the cooling device and the shrink fit chuck, which enables particularly rapid cooling of the shrink fit chuck.

[0013] Under certain circumstances, the temperature of the shrink fit chuck to be cooled can also be detected by means of the sensor device if there is no full-surface contact between the inner peripheral surface and the shrink fit chuck to be cooled, for example if a foreign body, in particular such as a chip or the like, is present in a gap between the inner peripheral surface and the shrink fit chuck.

[0014] It is conceivable that the sensor device is designed to detect the temperature of the shrink fit chuck exclusively in the thermally coupled state of the shrink fit chuck and the cooling sleeve device. The sensor device can be used to check whether thermal coupling is present for the thermally coupled state. The sensor device can thus serve a dual function, both for temperature detection and for thermal coupling verification.

[0015] In an embodiment of the invention, the sensor device is designed to locally detect the temperature of the shrink fit chuck to be cooled in a, in particular point-like or spot-shaped, temperature detection area of ​​the cooling device, in particular contact-like or contactless. The temperature detection area is directly adjacent to a front-side peripheral edge of the inner peripheral surface. In particular, the peripheral edge forms a transition from the inner peripheral surface to a front side of the cooling sleeve device. As an alternative to arranging the temperature detection area directly adjacent to the peripheral edge, an axial distance, in particular of a maximum of 20 mm, can be present between the peripheral edge and the temperature detection area.

[0016] If the temperature sensing area is directly adjacent to the peripheral edge, there is in particular no axial distance or a zero distance between the peripheral edge and the temperature sensing area. If there is an axial distance between the peripheral edge and the temperature sensing area, this axial distance is in particular greater than 0 mm. The temperature sensing area can therefore be arranged away from their thermal coupling between the shrink fit chuck to be cooled and the cooling sleeve device. This advantageously allows the temperature of the shrink fit chuck to be measured in a region of the shrink fit chuck that is not directly cooled, in which area the shrink fit chuck can be touched by the user after it has been cooled for removal from the cooling device.In this respect, the temperature can be measured locally in precisely that area of ​​the shrink fit chuck which is particularly relevant for a possible burn to the user's hand, particularly because of its accessibility for gripping.

[0017] In a further embodiment of the invention, the inner circumferential surface is designed to be continuous, particularly without recesses, all the way around. This enables particularly uniform thermal coupling and heat transfer between the cooling sleeve device and the shrink fit chuck to be cooled. In alternative embodiments of the invention, the inner circumferential surface can be only partially continuous, i.e., not continuous, and / or interrupted, particularly in the form of an axial slot.

[0018] In a further embodiment of the invention, the cooling device has a display device, in particular optical and / or acoustic and / or haptic, for displaying the detected temperature, in particular optically and / or acoustically and / or haptically. Alternatively or additionally, the display device can be designed for displaying, in particular optically and / or acoustically and / or haptically, a message dependent on the detected temperature, in particular for the user. In this way, it can be made clear to the user when the cooling device can and / or cannot be touched.

[0019] In a further embodiment of the invention, the cooling device has a control device, in particular an electronic one. The control device accesses the sensor device and—alternatively or additionally—the display device of the cooling device. The control device can access the sensor device and—alternatively or additionally—the display device through data access and / or signal access. The control device can be connected to the sensor device and / or the display device for data and / or signal transmission.

[0020] In a further embodiment of the invention, the inner circumferential surface defines a, in particular tapered, receiving space for the cooling sleeve device. The receiving space can be conical. The receiving space of the cooling sleeve device serves to partially accommodate the shrink fit chuck to be cooled. In particular, the receiving space is designed to complement a tool receiving section of the shrink fit chuck. The receiving space extends axially along a central axis of the cooling sleeve device. In a further embodiment of the invention, the sensor device has a temperature sensor for, in particular, contact or non-contact temperature detection and a carrier for supporting the temperature sensor. The temperature sensor can be selected from the group comprising: thermocouple, infrared sensor, ratio pyrometer, resistance thermometer, thermistor.It is understood that several temperature sensors may be present, which are selected from the above group, in particular of the same type or independently of one another.

[0021] A position of the temperature detection area is expediently defined by the temperature sensor. In particular, the temperature detection area is present on the temperature sensor and / or is provided by the temperature sensor.

[0022] The temperature sensor designed for contact temperature measurement can be suitably rigid or elastically flexible. An elastically flexible temperature sensor can be implemented in the form of a leaf spring that can be applied tangentially to the shrink fit chuck to be cooled. Such a leaf spring-like design is particularly suitable if the temperature sensor has a thermocouple that can be applied to the shrink fit chuck to be cooled for temperature measurement.

[0023] In an embodiment of the invention, the cooling device comprises a bearing device. By means of the bearing device, the sensor device is mounted on the cooling sleeve device, in particular such that the sensor device is movable relative to the inner circumferential surface. The sensor device can therefore be adjustable relative to the inner circumferential surface. As a result of such adjustability of the sensor device relative to the inner circumferential surface, a thermally coupled attachment of the shrink fit chuck to be cooled to the inner circumferential surface and / or a thermally separated removal of the shrink fit chuck from the inner circumferential surface can be facilitated, in particular by moving the sensor device away from the inner circumferential surface to release the receiving space of the cooling sleeve device. Furthermore, such adjustability of the sensor device can enable reliable temperature detection, in particular with respect to diameter, of shrink fit chucks of different dimensions.

[0024] In a further embodiment of the invention, the carrier is movably mounted relative to the inner circumferential surface in order to radially adjust the temperature sensor of the sensor device relative to the inner circumferential surface by moving the carrier. This facilitates the aforementioned adaptability of the sensor device with regard to its outer diameter to differently dimensioned shrink fit chucks. In a further embodiment of the invention, the bearing device defines a pivot axis of the cooling device, wherein the carrier of the sensor device is pivotable about the pivot axis relative to the inner circumferential surface. In particular, the temperature sensor is attached to the carrier at a distance from the pivot axis. The carrier is expediently designed as a pivot arm. Alternatively or additionally, the carrier is mounted on an end face of the cooling sleeve device.

[0025] It is advisable that the pivot axis and the central axis of the cooling device are truly parallel to each other.

[0026] In a further embodiment of the invention, the bearing device defines a guide direction of the cooling device, wherein the carrier is adjustable along the guide direction relative to the inner circumferential surface, in particular linearly and—alternatively or additionally—radially. The carrier is expediently designed as a slide, in particular as a linear slide. Alternatively or additionally, the carrier is attached to the cooling sleeve device, in particular to a jacket-shaped outer circumferential surface of the cooling sleeve device and—alternatively or additionally—to the end face.

[0027] In a further embodiment of the invention, the cooling device comprises an elastic preloading device for generating a preload force. The temperature sensor of the sensor device can be applied, in particular automatically, to the shrink fit chuck to be cooled by means of the preload force. This allows for a particularly reliable temperature-sensing contact between the temperature sensor and the shrink fit chuck, particularly while compensating for different outer diameters of different shrink fit chucks.

[0028] In a further embodiment of the invention, the cooling device has a locking device. By means of the locking device, the sensor device can be releasably locked in a non-detection position relative to the inner circumferential surface, in particular counter to the preload force. In the non-detection position, the temperature detection area of ​​the cooling device can be radially removed from the inner circumferential surface and / or the shrink fit chuck applied thereto, in particular such that in the non-detection position, no temperature of the shrink fit chuck can be detected by the sensor device. In the non-detection position, the temperature sensor of the sensor device can be removed and / or pivoted away from the shrink fit chuck to be cooled in such a way that a temperature of the shrink fit chuck cannot be detected by the temperature sensor.In a further embodiment of the invention, the cooling sleeve device has an exchangeable insert sleeve for adapting the cooling device to the shrink fit chuck to be cooled, in particular geometrically and - alternatively or additionally - in an adapter-like manner. The insert sleeve has the inner circumferential surface. The insert sleeve can be slotted, in particular so that its inner circumferential surface only partially extends and / or is interrupted. A respective insert sleeve can be selected from a group of insert sleeves, wherein the insert sleeves of the group differ with regard to the geometric shape of their inner circumferential surfaces. In particular, the sensor device is mounted on the cooling sleeve device independently of the insert sleeve. In particular, the sensor device is not mounted on the insert sleeve, in particular at least not directly.Advantageously, the insert sleeve alone, in particular without the sensor device, can be replaced in order to adapt the cooling device to the respective shrink fit chuck to be cooled.

[0029] The insert sleeve expediently does not have a cooling channel through which cooling fluid can flow.

[0030] A retrofit kit according to the invention serves to retrofit a basic cooling device into a cooling device according to the invention as described above. The basic cooling device has the cooling sleeve device. The retrofit kit has at least the sensor device. The retrofit kit can also have the bearing device and / or the pretensioning device and / or the locking device. By retrofitting the basic cooling device using the retrofit kit, the above-described advantages of the cooling device according to the invention can be advantageously achieved.

[0031] A shrink-fit device according to the invention serves to thermally actuate a shrink-fit chuck for a clamping and / or unclamping process. As a result of the clamping and / or unclamping process, a tool can be thermally clamped or unclamped by means of the shrink-fit chuck. The shrink-fit device has a heating station designed to heat the shrink-fit chuck, in particular inductively, in order to expand a tool receiving space of the shrink-fit chuck. In addition, the shrink-fit device has a cooling station designed to cool the shrink-fit chuck in order to narrow the tool receiving space. The cooling station has at least one cooling device according to the invention, as described above. In this respect, the advantages of the cooling device according to the invention explained above also apply to the shrink-fit device according to the invention.

[0032] The shrinking device expediently comprises a cooling unit, by means of which heat can be extracted from the cooling fluid and dissipated to the external environment. The cooling unit and the cooling channel of the cooling sleeve device can be arranged in a cooling fluid circuit through which the cooling fluid can circulate. In particular, heat carried by the cooling fluid, which has been at least partially absorbed by the cooling fluid in the cooling channel of the cooling sleeve device, can be dissipated to the external environment by means of the cooling unit.

[0033] The shrink-fit device expediently comprises a heating device, particularly an inductive one, for heating the shrink-fit chuck. The heating station may also comprise a heating control device configured to control the heating device.

[0034] A shrinking system according to the invention comprises a shrinking device according to the invention as described above. In this respect, the above-explained advantages of the shrinking device according to the invention also apply to the shrinking system according to the invention. In addition, the shrinking system has at least one shrink chuck. It is understood that the shrinking system can have a plurality of shrink chucks, in particular of differently dimensioned ones. The at least one shrink chuck of the shrinking system has a tool receiving section which can be received, in particular with a precise fit, in the receiving space of the cooling sleeve device. The tool receiving section has an outer circumferential surface which is complementary to the inner circumferential surface of the cooling sleeve device. The tool receiving section also has a tool receiving space in which a complementarily designed tool shank can be received and thermally clamped.

[0035] The shrink-fit system expediently comprises a plurality of differently dimensioned insert sleeves for the at least one cooling sleeve device. In particular, the insert sleeves are matched to the shrink-fit chucks of the shrink-fit system with regard to their inner circumferential surfaces.

[0036] A method according to the invention serves to operate a cooling device according to the invention as described above. In particular, the cooling device according to the invention is operated according to the method. Expediently, according to the method, the cooling device is operated in a shrinking device according to the invention as described above, in particular in a shrinking system according to the invention corresponding to the above description. The method comprises a step according to which a temperature is detected by means of the sensor device. Expediently, the temperature detected by means of the sensor device can be a temperature of this shrink chuck or another temperature, for example an ambient temperature - depending on whether or not a shrink chuck is currently thermally coupled to the inner circumferential surface of the cooling sleeve device.The method further comprises a step of monitoring a sensor signal generated by the sensor device. The sensor signal can, in particular, represent the detected temperature. Thus, monitoring the sensor signal can be used to monitor the detected temperature and / or a rate of change of the detected temperature.

[0037] The method may expediently comprise a step according to which the inner circumferential surface is applied to a shrink fit chuck that is currently to be cooled, so that the temperature detected by means of the sensor device is a temperature of the shrink fit chuck.

[0038] In an embodiment of the invention, the method comprises a step according to which the flow of cooling fluid through the cooling channel is activated when the temporal rate of change of the detected temperature exceeds a predetermined positive threshold. Alternatively or additionally, the method comprises a step according to which an interruption of a signal line connecting the sensor device to a control device of the cooling device is detected as a function of a, in particular unexpected, change in the state of the monitored sensor signal. Alternatively or additionally, the method comprises a step according to which a removal of the inner peripheral surface from the shrink fit chuck to be cooled is detected, in particular by an operator, when the temporal rate of change of the detected temperature falls below a predetermined negative threshold.

[0039] In a further embodiment of the invention, the method comprises a step for predicting a cooling duration for a shrink fit chuck currently being cooled. In particular, the prediction is performed using a machine learning algorithm trained on data from past cooling processes. The electronic control device of the cooling device according to the invention can expediently be configured and—alternatively or additionally—programmed to carry out the method.

[0040] Further advantages and features of the invention will become apparent from the claims and the following description of preferred embodiments of the invention, which are illustrated with reference to the drawings. Like reference numerals refer to like, similar, or functionally identical components. It is understood that the features mentioned above and those to be explained below can be used not only in the respective combinations specified, but also in other combinations or on their own, without departing from the scope of the present invention.

[0041] Fig. 1 shows a schematic perspective view of an embodiment of a cooling device according to the invention, wherein a sensor device of the cooling device is hidden for better clarity,

[0042] Fig. 2 shows a schematic perspective view of another embodiment of the cooling device according to the invention,

[0043] Fig. 3 shows a schematic perspective view of another embodiment of the cooling device according to the invention,

[0044] Fig. 4 shows a schematic perspective view of another embodiment of the cooling device according to the invention, and

[0045] Fig. 5 is a roughly schematic overview of an embodiment of a shrinking system according to the invention with an embodiment of a shrinking device according to the invention.

[0046] A shrinking device 50 according to the invention is for thermally actuating a shrink chuck

[0047] 60 is provided for a clamping and / or unclamping process. The shrinking device 50 is provided, for example, by a shrinking system 70 according to the invention. The shrinking system 70 comprises a single or multiple shrink chucks 60. The clamping process serves to clamp a tool 80 for its releasable attachment to the shrink chuck 60. The unclamping process serves to unclamp the tool 80 for releasing its attachment to the shrink chuck 60. For the clamping and unclamping process, a tool receiving space 61 of the shrink chuck 60 can be thermally expanded and contracted by means of the shrinking device 50, in particular due to thermal expansion. The tool receiving space

[0048] 61 is designed, for example, to receive a tool shank 81 of the tool 80 to be clamped or unclamped.

[0049] The shrink-fit device 50 has a heating station 51. The heating station 51 is designed to heat the shrink-fit chuck 60 in order to expand the tool receiving space 61 of the shrink-fit chuck 60. In the present case, the heating station 51 has a heating device 54 designed for inductive heating of the shrink-fit chuck 60. The heating station 51 also has a heating control device 53 designed to control the heating device 54.

[0050] The shrink-fit device 50 in this case has a cooling station 52, which is designed to cool the shrink-fit chuck 60 in order to narrow the tool receiving space 61. The cooling station 52 in this case has at least one cooling device 1 according to the invention. The cooling station 52 also has a cooling unit 22. A cooling fluid L can flow through the cooling unit 22. By means of the cooling unit 22, heat can be extracted from the cooling fluid L and released into an external environment.

[0051] The cooling device 1 comprises a cooling sleeve device 2. The cooling sleeve device 2 has at least one cooling channel 4 through which the cooling fluid L can flow. The cooling sleeve device 2 also has an inner peripheral surface 3. The inner peripheral surface 3 is designed for thermally coupling contact with the shrink fit chuck 60 to be cooled by means of the cooling device 1. In this case, the inner peripheral surface 3 is complementary to an outer peripheral surface 62 of the shrink fit chuck 60. The outer peripheral surface 62 of the shrink fit chuck 60 runs, in particular, coaxially with the tool receiving space 61. In the illustrations in Figs. 1 to 4, the shrink fit chuck 60 to be cooled is thermally coupled to the inner peripheral surface 3.

[0052] The cooling channel 4 is fluidly conductive and separate from the inner peripheral surface 3 of the cooling fluid L, so that heat introduced into the cooling sleeve device 2 via the inner peripheral surface 3 can be absorbed by the cooling fluid L and transported away from the inner peripheral surface 3. In this way, heat can be extracted from the shrink fit chuck 60 to be cooled via the thermal coupling on the inner peripheral surface 3 in order to cool the shrink fit chuck 60.

[0053] The inner circumferential surface 3 in this case defines a receiving space 17 of the cooling sleeve device 2. The receiving space 17 is designed to partially accommodate the shrink fit chuck 60 to be cooled. The receiving space 17 is designed, in particular, to be complementary to a tool receiving section of the shrink fit chuck 60 to be cooled, which tool receiving section has the outer circumferential surface 62. The receiving space 17 tapers in this case. For example, the receiving space 17 is conical. The receiving space 17 extends axially along a central axis M of the cooling sleeve device 2. The central axis M in this case runs parallel to an axial direction A of the cooling device 1. A radial direction R of the cooling device 1 runs perpendicular to the axial direction A. A circumferential direction C of the cooling device 1 runs around the axial direction A, in particular within a plane oriented perpendicular to the axial direction A.The inner circumferential surface 3 runs, for example, along the circumferential direction C around the central axis M.

[0054] The inner circumferential surface 3 is formed as a continuous, circumferential surface. The inner circumferential surface 3 is formed as a continuous, circumferential surface without any recesses.

[0055] The cooling device 1 has a sensor device 5 designed to detect a temperature of the shrink fit chuck 60 to be cooled. The sensor device 5 is mounted on the cooling sleeve device 2. For example, the sensor device 5 is movably mounted on the cooling sleeve device 2, as shown by way of example in Figs. 2 and 3. Alternatively, the sensor device 5 can be fixedly mounted on the cooling sleeve device 2, for example, as shown in Fig. 4.

[0056] The sensor device 5 is designed to detect the temperature of the shrink fit chuck 60 to be cooled axially outside the inner circumferential surface 3 when the inner circumferential surface 3 is thermally coupled to the shrink fit chuck 60 to be cooled.

[0057] The sensor device 5 comprises, for example, a temperature sensor 10. The temperature sensor 10 serves for temperature detection, in particular by contact or non-contact means. The sensor device 5 also comprises, for example, a carrier 11 for supporting the temperature sensor 10.

[0058] The temperature sensor 10 has, for example, a thermocouple 10A for contact temperature detection, shown as an example in Figs. 2 and 3. Alternatively or additionally, the temperature sensor 10 can have an infrared sensor and / or a ratio pyrometer 10C for contactless temperature detection, as shown in Fig. 4. A detection beam of the infrared sensor 10B and / or the ratio pyrometer 10C is shown as an example in Fig. 4 and provided with the reference numeral 23. Alternatively or additionally, the temperature sensor 10 can have a resistance thermometer and / or a thermistor. For example, the sensor device 5 is designed to locally detect the temperature of the shrink fit chuck 60 to be cooled, in particular only, in a temperature detection area 6 of the cooling device 1. The temperature detection area 6 can be point-like or spot-like.The sensor device 5 can be designed for contact or non-contact detection of the temperature of the shrink fit chuck 60 to be cooled. The temperature detection area 6 is not located within the inner peripheral surface 3.

[0059] In this case, the temperature detection area 6 is not arranged within the receiving space 17. The receiving space 17 is tapered along the axial direction A, directed away from the temperature detection area 6.

[0060] For example, the temperature detection area 6 directly adjoins, in particular tangentially, a front-side peripheral edge 7 of the inner peripheral surface 3. As an alternative to the embodiments shown in the figures, it is conceivable that there is an axial distance, for example of a maximum of 20 mm, between the peripheral edge 7 and the temperature detection area 6.

[0061] For example, the cooling device 1 has a bearing device 12. By means of the bearing device 12, the sensor device 5 is movably mounted on the cooling sleeve device 2 relative to the inner peripheral surface 3, as shown, for example, in Figs. 2 and 3. The carrier 11 can be movably mounted relative to the inner peripheral surface 3 in order to radially adjust the temperature sensor 10 relative to the inner peripheral surface 3 by moving the carrier 11.

[0062] The bearing device 12 defines, for example, a pivot axis S of the cooling device 1, as can be seen by way of example in Fig. 2. The carrier 11 is pivotable about the pivot axis S relative to the inner circumferential surface 3. The carrier 11 can be designed as a pivot arm 13. Alternatively or additionally, the carrier 11 can be mounted on an end face 14 of the cooling sleeve device 2—as in the example in Fig. 2, for example. The pivot axis S and the central axis M are different from one another in the present case. The pivot axis S and the central axis M can be truly parallel to one another.

[0063] Alternatively or additionally, the bearing device 12 can define a guide device FR of the cooling device 1, as shown by way of example in Fig. 3. The carrier 11 can be adjusted along the guide direction FR relative to the inner circumferential surface 3, for example, linearly and—alternatively or additionally—radially guided. The carrier 11 can be designed as a slide 15, in particular as a linear slide 16, as shown in Fig. 3. Alternatively or additionally, the bearing device 12 can be attached to a jacket-shaped outer circumferential surface of the cooling sleeve device 2.

[0064] For example, the cooling sleeve device 2 has a replaceable insert sleeve 20. The insert sleeve 20 can be designed, for example, to geometrically or—alternatively or additionally—as an adapter-like match the cooling device 1 to the shrink fit chuck 60 to be cooled. The insert sleeve 20 has the inner circumferential surface 3. The sensor device 5 is preferably not mounted on the insert sleeve 20 of the cooling sleeve device 2.

[0065] The insert sleeve 20 can be slotted, particularly axially. In this case, the inner circumferential surface 3 may not be completely continuous along the circumferential direction C and / or may only be interrupted in certain areas.

[0066] For example, the sensor device 5 is mounted on an outer part 30 of the cooling sleeve device 2, wherein the outer part 30 is different from the insert sleeve 20. The cooling channel 4 extends, in particular, only in the outer part 30. The insert sleeve 20 can be fastened to the outer part 30 in particular such that the outer part 30 surrounds the insert sleeve 20. In the present case, the insert sleeve 20 is free of the cooling channel 4 for cooling fluid L. The insert sleeve 20 is free of the bearing device 12.

[0067] The cooling device 1 has, for example, an elastic preloading device 18 designed to generate a preload force. The elastic preloading device 18 can, for example, have or be an elastically deformable spring element. The temperature sensor 10 of the sensor device 5 can be applied, in particular automatically, to the shrink fit chuck 60 to be cooled by means of the preload force (see, for example, Figs. 2 and 3). The insert sleeve 20 is, in particular, free of the preloading device 18.

[0068] The cooling device 1 has, for example, a locking device 19. By means of the locking device 19, the sensor device 5 can be releasably locked in a non-detecting position of the sensor device 5 relative to the inner peripheral surface 3, for example, counter to the preload force. The insert sleeve 20 is in particular free of the locking device 19.

[0069] The cooling device 1 has, for example, a display device 8. The display device 8 serves to display the detected temperature. Alternatively or additionally, the display device 8 can be configured to display a message dependent on the detected temperature. The display device 8 can be used to indicate to a user of the cooling device 1 whether the cooling device 1 is ready for touching, particularly in terms of temperature.

[0070] The cooling device 1 has, for example, a control device 9, in this case an electronic one. The control device 9 accesses, for example, the sensor device 5. Alternatively or additionally, the control device 9 accesses the display device 8 of the cooling device 1. The control device 9 can be connected to the sensor device 5 and—alternatively or additionally—to the display device 8 for data and / or signal transmission.

[0071] The cooling device 1 according to the invention can be based on a basic cooling device 100. The basic cooling device 100 has, in particular at least or only, the cooling sleeve device 2. According to Figs. 1 to 4, the basic cooling device 100 is retrofitted by means of a retrofit kit 40 according to the invention to form one embodiment of the cooling device 1 according to the invention. In this case, the retrofit kit 40 has at least the sensor device 5. Since the sensor device 5 is hidden in the illustration in Fig. 1, Fig. 1 can be interpreted as a representation of only the basic cooling device 100.

[0072] The cooling device 1 can be operated according to a method according to the invention. In particular, the cooling device 1 can be operated according to the method during operation of the shrinking device 50 of the shrinking system 70. The method for operating the cooling device 1 comprises a step according to which a temperature is detected by means of the sensor device 5. In addition, the method comprises a step according to which a sensor signal generated by the sensor device 5 is monitored. The sensor signal can represent the detected temperature. Expediently, a shrink chuck 60 to be cooled at any time can be applied in a thermally coupled manner to the inner circumferential surface 3 of the cooling device 1 before and / or during and / or after the temperature is detected by the sensor device 5.When the inner peripheral surface 3 is applied to the shrink fit chuck 60, according to the method, in particular only a temperature of the shrink fit chuck 60, in particular locally next to the inner peripheral surface 3, is detected by means of the sensor device 5.

[0073] For example, the method comprises a further step according to which the flow of cooling fluid L through the cooling channel 4 is activated when a temporal rate of change of the detected temperature exceeds a predetermined positive threshold. For example, the method comprises a further step according to which, depending on a, for example, unexpected, change in the state of the monitored sensor signal, an interruption in a signal line 21 connecting the sensor device 5 to the control device 9 of the cooling device 1 is detected.

[0074] For example, the method comprises a further step according to which a removal, in particular carried out by the operator, of the inner circumferential surface 3 from the shrink fit chuck 60 to be cooled is detected when the temporal rate of change of the detected temperature falls below a predetermined negative threshold value.

[0075] For example, the method comprises a further step according to which a cooling time, in particular an expected cooling time, is predicted for a shrink fit chuck 60 currently being cooled. For example, the cooling time is predicted using a machine learning algorithm trained based on data from past cooling processes. The control device 9 is expediently configured and / or programmed to carry out the method. In particular, the machine learning algorithm can be implemented in the control device 9.

[0076] The cooling duration can be predicted based on and / or dependent on parameters such as the outer diameter of the shrink fit chuck 60 to be cooled, the number of other shrink fit chucks 60 currently being cooled in parallel, the temperature of the cooling fluid L, the outside temperature, and / or other parameters, if applicable. Additional sensors and / or a further control system may be present to determine the values ​​of the corresponding parameters.

Claims

Patent claims 1. Cooling device (1) for a shrink-fit device (50), comprising: a cooling sleeve device (2) which has an inner circumferential surface (3) for thermally coupling contact with a shrink-fit chuck (60) to be cooled by means of the cooling device (1), and which has at least one cooling channel (4) through which a cooling fluid (L) can flow in a fluid-conducting manner from the inner circumferential surface (3) separately, in order to absorb and transport away heat introduced on the inner circumferential surface, and a sensor device (5) mounted on the cooling sleeve device (2) for detecting a temperature of the shrink-fit chuck (60) to be cooled, characterized in that the sensor device (5) is designed to detect the temperature of the shrink-fit chuck (60) to be cooled axially outside the inner circumferential surface (3) when the inner circumferential surface (3) is thermally coupled to the shrink-fit chuck (60) to be cooled.

2. Cooling device (1) according to claim 1, characterized in that the sensor device (5) is designed to locally detect the temperature of the shrink fit chuck (60) to be cooled in a, in particular point-like or spot-shaped, temperature detection area (6) of the cooling device (1), in particular contacting or contactless, - wherein the temperature detection area (6) is either directly adjacent to a front-side peripheral edge (7) of the inner peripheral surface (3) or wherein there is an axial distance, in particular of a maximum of 20 mm, between the peripheral edge (7) and the temperature detection area (6).

3. Cooling device (1) according to claim 1 or 2, characterized in that the inner peripheral surface (3) is continuous, in particular recess-free, circumferential.

4. Cooling device (1) according to one of claims 1 to 3, characterized in that the cooling device (1) has a display device (8) for displaying the detected temperature and / or a message dependent on the detected temperature.

5. Cooling device (1) according to one of the preceding claims, characterized in that the cooling device (1) has a, in particular electronic, control device (9) which accesses the sensor device (5) and / or a display device (8) of the cooling device (1).

6. Cooling device (1) according to one of the preceding claims, characterized in that the inner peripheral surface (3) defines a, in particular tapered and / or conical, receiving space (17) of the cooling sleeve device (2) for sectionally receiving the shrink fit chuck (60) to be cooled, wherein the receiving space (17) extends axially along a central axis (M) of the cooling sleeve device (2).

7. Cooling device (1) according to one of the preceding claims, characterized in that the sensor device (5) has a temperature sensor (10) for, in particular, contact or contactless, temperature detection and a carrier (11) for carrying the temperature sensor (10).

8. Cooling device (1) according to one of the preceding claims, characterized in that the cooling device (1) has a bearing device (12) by means of which the sensor device (5) is movably mounted on the cooling sleeve device (2), in particular relative to the inner peripheral surface (3).

9. Cooling device (1) according to claims 7 and 8, characterized in that the carrier (11) is movably mounted relative to the inner circumferential surface (3) in order to radially adjust the temperature sensor (10) relative to the inner circumferential surface (3) by moving the carrier (11).

0. Cooling device (1) according to claim 9, characterized in that the bearing device (12) defines a pivot axis (S) of the cooling device (1), wherein the carrier (11) is pivotable about the pivot axis (S) relative to the inner circumferential surface (3), in particular wherein the carrier (11) is designed as a pivot arm (13) and / or is mounted on an end face (14) of the cooling sleeve device (2).

11. Cooling device (1) according to one of claims 8 to 10, characterized in that the bearing device (12) defines a guide direction (FR) of the cooling device (1), wherein the carrier (11) is adjustable in a guided manner along the guide direction (FR) relative to the inner circumferential surface (3), in particular linearly and / or radially, in particular wherein the carrier (11) is designed as a slide (15), in particular a linear slide (16), and / or is mounted on the cooling sleeve device (2).

12. Cooling device (1) according to one of the preceding claims, characterized in that the cooling device (1) has an elastic pretensioning device (18) for generating a pretensioning force, wherein a temperature sensor (10) of the sensor device (5) can be applied to the shrink fit chuck (60) to be cooled, in particular automatically, by means of the pretensioning force.

13. Cooling device (1) according to one of the preceding claims, characterized in that the cooling device (1) has a locking device (19) by means of which the sensor device (5) can be releasably locked in a non-detecting position relative to the inner circumferential surface (3), in particular against a prestressing force.

14. Cooling device (1) according to one of the preceding claims, characterized in that the cooling sleeve device (2) has an exchangeable insert sleeve (20) for, in particular geometrically and / or adapter-like, matching of the cooling device (1) to the shrink fit chuck (60) to be cooled, wherein the insert sleeve (20) has the inner circumferential surface (3), in particular wherein the sensor device (5) is mounted on the cooling sleeve device (2) independently of the insert sleeve (20).

15. Retrofit kit (40) for retrofitting a basic cooling device (100) to a cooling device (1) according to one of the preceding claims, wherein the basic cooling device (100) has the cooling sleeve device (2), and wherein the retrofit kit (40) has at least the sensor device (5).

16. Shrinking device (50) for thermally actuating a shrink chuck (60) for a clamping and / or unclamping process, wherein the shrink chuck (50) comprises: a heating station (51) which is designed to heat the shrink chuck (60), in particular inductively, in order to widen a tool receiving space (61) of the shrink chuck (60), and a cooling station (52) which is designed to cool the shrink chuck (60) in order to narrow the tool receiving space (61), characterized in that the cooling station (52) has at least one cooling device (1) according to one of the preceding claims.

17. Shrinking system (70) comprising the shrinking device (50) according to claim 16 and at least one shrink chuck (60).

18. A method for operating a cooling device (1) according to one of claims 1 to 14, in particular in a shrinking device (50) according to claim 16, in particular a shrinking system (70) according to claim 17, wherein the method comprises the following steps: Detecting a temperature by means of the sensor device (5); and Monitoring a sensor signal generated by the sensor device (5).

19. The method according to claim 18, characterized in that the method comprises at least one of the following steps: Activating a flow of cooling liquid (L) through the cooling channel (4) when a temporal rate of change of the detected temperature exceeds a predetermined positive threshold value; Detecting an interruption of a signal line (21) connecting the sensor device (5) to a control device (9) of the cooling device (1) as a function of a, in particular unexpected, change in state of the monitored sensor signal; Detecting a removal, in particular carried out by the operator, of the inner peripheral surface (3) from the shrink fit chuck (60) to be cooled when the temporal rate of change of the detected temperature falls below a predetermined negative threshold value.

20. Method according to claim 18 or 19, characterized in that the method comprises the following step: Predicting a cooling time for a shrink fit chuck (60) currently to be cooled, in particular by means of a machine learning algorithm trained on the basis of data from past cooling processes.

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