Epoxy resin composition for molding

Abstract

The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using same.

Description

Epoxy resin composition for molding

[0001] The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using the same.

[0002]

[0003] A resin composition for sealing is used as a material to seal semiconductor devices such as integrated circuits (ICs), large scale integrated circuits (LSIs), transistors, and diodes, thereby improving the characteristics and reliability of semiconductor devices. Recently, with the trend toward miniaturization, weight reduction, and higher performance of electronic devices, the integration of semiconductors has accelerated, and research is continuing in various fields to improve the performance of materials used for sealing semiconductor devices. For example, Japanese Patent Application Laid-Open No. 2017-197620 relates to an epoxy resin composition for semiconductor sealing, which includes an epoxy resin, a phenol resin curing agent, and a filler, and discloses a technology for improving electrical connection reliability by controlling the content of the filler and the thermoelastic modulus of the cured product of the epoxy resin composition.

[0004] However, conventional epoxy resin compositions have problems such as forming an irregular network structure during the curing reaction, causing warping and volume expansion of the cured product, and generating internal stress due to differences in thermal expansion coefficients between the cured molding material and silicon chips and wafers. As a result, cracks may occur in semiconductor devices, and the adhesive strength between the encapsulant and the lead frame may be reduced, resulting in reduced reliability.

[0005] Accordingly, there is a need for development of an epoxy resin composition for molding that has a low coefficient of thermal expansion (CTE) and excellent reliability.

[0006]

[0007] The present invention provides an epoxy resin composition for molding which has excellent mechanical strength and reliability due to a low coefficient of thermal expansion, and excellent physical properties without lowering the glass transition temperature, and a semiconductor device molded using the same.

[0008]

[0009] The present invention comprises an epoxy resin, a curing agent, an inorganic filler and an organic filler, wherein the epoxy resin comprises a bisphenol A-novolac epoxy resin having an epoxy equivalent of 170 to 200 g / eq and a weight average molecular weight of 2,000 to 3,000 g / mol, and the organic filler has a particle size (D 50 ) provides an epoxy resin composition for molding comprising core-shell rubber particles having a size of 3 to 15 μm.

[0010]

[0011] The present invention provides an epoxy resin composition for molding, which has excellent mechanical strength and reliability due to its low coefficient of thermal expansion, and excellent physical properties without lowering the glass transition temperature, and a semiconductor device molded using the same. The present invention uses an epoxy resin having specific physical properties and a specific structure, thereby reducing the formation rate of an irregular network structure during a curing reaction, thereby suppressing warping and volume expansion of a cured product, and as a result, reducing the difference in thermal expansion coefficient between a cured molding material and a silicon chip or wafer, thereby reducing the occurrence of internal stress. In addition, the present invention provides an epoxy resin composition for molding, which has a low coefficient of thermal expansion, by using an organic filler having a specific particle size. Therefore, when a semiconductor device is molded using the epoxy resin composition for molding according to the present invention, cracking of the semiconductor device is suppressed, and excellent adhesion between the molding material and the lead frame is maintained, thereby providing excellent reliability.

[0012]

[0013] The present invention will be described in detail below. However, it is not limited to the following description, and each component may be modified or selectively mixed as needed. Therefore, it should be understood that all modifications, equivalents, and alternatives included within the spirit and technical scope of the present invention are included.

[0014] The “weight average molecular weight” used in this specification is measured by a conventional method known in the art, and can be measured, for example, by the GPC (gel permeation chromatography) method. The functional group such as the “hydroxyl value” is measured by a conventional method known in the art, and can be measured, for example, by the titration method. “Particle size (D 50 )” is measured by a conventional method known in the art, and can be measured, for example, by laser light scattering (LLS).

[0015]

[0016] <Epoxy resin composition for molding>

[0017] An epoxy resin composition for molding according to the present invention comprises an epoxy resin, a curing agent, an inorganic filler, and an organic filler. The present invention provides an epoxy resin composition for molding having a low coefficient of thermal expansion by using an epoxy resin having specific physical properties and a specific structure and an organic filler having a specific particle size.

[0018]

[0019] epoxy resin

[0020] The epoxy resin composition for molding of the present invention comprises an epoxy resin. The epoxy resin is used as a main resin, and upon reaction with a curing agent and curing, forms a three-dimensional network structure, thereby imparting strong and solid adhesion to an adherend and heat resistance, chemical resistance, and electrical insulation properties.

[0021] The above epoxy resin includes a bisphenol A-novolac epoxy resin as the first epoxy resin. The present invention uses a bisphenol A-novolac epoxy resin to reduce the formation rate of an irregular network structure during a curing reaction, thereby suppressing warping and volume expansion of a cured product, and as a result, reducing the difference in thermal expansion coefficient between the cured molding material and the silicon chip or wafer, thereby reducing the occurrence of internal stress.

[0022] The above bisphenol A-novolac epoxy resin can be represented by the following chemical formula 1.

[0023] [Chemical Formula 1]

[0024]

[0025] In the above chemical formula 1, n is 3 to 10.

[0026] The epoxy equivalent of the above first epoxy resin may be 170 to 200 g / eq, and the weight average molecular weight may be 2,000 to 3,000 g / mol. If the epoxy equivalent is less than the above-mentioned range, a network structure within the resin may be insufficiently formed, and if it exceeds the above-mentioned range, the viscosity may increase due to over-curing. If the weight average molecular weight is less than the above-mentioned range, the target glass transition temperature may not be reached, and if it exceeds the above-mentioned range, the strength may be excessively high compared to the target physical properties.

[0027] Based on the total weight of the epoxy resin composition for molding, the content of the first epoxy resin may be 5 to 30 wt%, for example, 5 to 10 wt%. If the content of the first epoxy resin is less than the above-mentioned range, the effect of lowering the coefficient of thermal expansion may be insufficient, and if it exceeds the above-mentioned range, the reliability of the molding material may deteriorate due to an increase in moisture absorption, and the strength may be reduced due to a relative decrease in the content of the filler.

[0028] The above epoxy resin may further include a second epoxy resin in addition to the bisphenol A-novolac epoxy resin. The second epoxy resin may be an epoxy resin commonly used in the relevant technical field.

[0029] Non-limiting examples of usable second epoxy resins include bisphenol A type epoxy resins, alicyclic epoxy resins, cresol novolac type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, naphthalene type epoxy resins, anthracene epoxy resins, tetramethyl biphenyl type epoxy resins, phenol novolac type epoxy resins, bisphenol S novolac type epoxy resins, biphenyl novolac type epoxy resins, naphthol novolac type epoxy resins, naphthol phenol cocondensed novolac type epoxy resins, naphthol cresol cocondensed novolac type epoxy resins, aromatic hydrocarbon formaldehyde resin modified phenol resin type epoxy resins, triphenyl methane type epoxy resins, tetraphenyl ethane type epoxy resins, dicyclopentadiene type epoxy resins, dicyclopentadiene phenol addition reaction type epoxy resins, biphenyl type epoxy resins, phenol aralkyl type epoxy resins, multifunctional phenol resins, naphthol aralkyl type epoxy resins, etc. It may include one or more of these. For example, the second epoxy resin may include a biphenyl epoxy resin, for example, 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl)(4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl)).

[0030] The epoxy equivalent of the second epoxy resin may be 150 to 200 g / eq, and the weight average molecular weight may be 300 to 500 g / mol. If the epoxy equivalent is less than the above-mentioned range, the hygroscopicity of the epoxy resin composition may increase, which may cause blocking, and if it exceeds the above-mentioned range, the curability of the epoxy resin composition may decrease. If the weight average molecular weight is less than the above-mentioned range, the viscosity of the epoxy resin composition may decrease, which may cause blocking, and if it exceeds the above-mentioned range, the flowability of the epoxy resin composition may decrease.

[0031] Based on the total weight of the epoxy resin composition for molding, the content of the second epoxy resin may be 0.1 to 10 wt%, for example, 0.1 to 3 wt%. If the content of the second epoxy resin is less than the above-mentioned range, the flowability of the epoxy resin composition may be reduced, and if it exceeds the above-mentioned range, the reliability of the molding material may be deteriorated due to an increase in moisture absorption, and the strength may be reduced due to a relative decrease in the filler content.

[0032]

[0033] hardener

[0034] The epoxy resin composition for molding of the present invention includes a curing agent. The curing agent reacts with the epoxy resin to promote curing of the composition.

[0035] As the above curing agent, a curing agent known in the relevant technical field that undergoes a curing reaction with an epoxy resin can be used, and the curing agent can be a phenol-based compound having two or more phenolic hydroxyl groups in one molecule. Non-limiting examples of curing agents that can be used include a biphenylene skeleton-containing phenol aralkyl-type phenol resin, a phenol novolac resin, a cresol novolac resin, a phenol aralkyl resin, a multifunctional phenol compound, and the like, and the curing agent can include one or more of these. For example, the curing agent can be a biphenylene skeleton-containing phenol aralkyl-type phenol resin.

[0036] The above-mentioned hardener may be one having a hydroxyl equivalent of 80 to 250 g / eq, for example, 120 to 190 g / eq, and a softening point of 20 to 140°C, for example, 50 to 110°C. If the hydroxyl equivalent is less than the above-mentioned range, moisture resistance reliability may be poor, and if it exceeds the above-mentioned range, curing properties may be poor. If the softening point is less than the above-mentioned range, caking properties may be poor, and if it exceeds the above-mentioned range, uneven distribution may occur during manufacturing.

[0037] Based on the total weight of the epoxy resin composition for molding, the content of the curing agent may be 1 to 20 wt%, for example, 1 to 10 wt%. If the content of the curing agent is less than the above-mentioned range, curability and moldability may be reduced, and if it exceeds the above-mentioned range, the reliability of the molding material may be deteriorated and the strength may be reduced due to increased moisture absorption.

[0038]

[0039] Weapon filler

[0040] The epoxy resin composition for molding of the present invention includes an inorganic filler. The inorganic filler serves to improve the mechanical properties of the epoxy resin composition for molding.

[0041] The inorganic filler mentioned above may be any filler commonly used in the relevant technical field without any particular limitations. For example, inorganic fillers such as silica, silica nitride, alumina, aluminum nitride, and boron nitride may be used, and these may be used alone or in combination of two or more.

[0042] The shape of the above-mentioned inorganic filler is not particularly limited, and both angular and spherical shapes can be used. For example, spherical silica particles, spherical alumina particles, or mixtures thereof can be used.

[0043] The above inorganic filler may include two or more types of inorganic fillers having different particle sizes. In this case, the moldability and workability of the epoxy resin composition can be further improved. For example, the above inorganic filler may have an average particle size (D 50 ) of a first inorganic filler (e.g., silica) having an average particle diameter (D) of 5 to 20 um, for example, 10 to 20 um. 50 ) may include a second inorganic filler (e.g., alumina) having a particle size of 20 to 40 um, for example, 22 to 29 um.

[0044] Based on the total weight of the epoxy resin composition for molding, the content of the inorganic filler may be 50 to 95 wt%, for example, 70 to 90 wt%. If the content of the inorganic filler is less than the aforementioned range, the moisture absorption of the cured product may increase, which may lower the reliability of the molding material, and if it exceeds the aforementioned range, the fluidity may be reduced, resulting in poor moldability.

[0045]

[0046] organic filler

[0047] The epoxy resin composition for molding of the present invention includes an organic filler. The organic filler serves to lower the coefficient of thermal expansion (CTE) of the epoxy resin composition for molding.

[0048] The organic filler comprises core-shell rubber particles. The core may be composed of butadiene, siloxane, silsesquioxane, etc., and the materials may be used singly or in a mixture of two or more. The shell may be composed of an acrylic-staddiene copolymer, acrylic, polymethyl methacrylate, etc., and the materials may be used singly or in a mixture of two or more.

[0049] The particle size (D) of the above organic filler 50) may be 3 to 15 ㎛. If the particle size is less than the above-mentioned range, the flowability of the epoxy resin composition may be reduced, and the effect of reducing the coefficient of thermal expansion may be insufficient. If the particle size is more than the above-mentioned range, surface abnormalities of the cured product may occur due to undispersed particles, and the effect of reducing the coefficient of thermal expansion may be insufficient. As a result, when the temperature rises, the average distance between the particles in the epoxy resin composition for molding increases, and the volume of the molding material increases and expands, which may cause problems such as contamination of moldability and manufacturing equipment in the semiconductor package manufacturing process, swelling of the manufactured semiconductor package, peeling between the molding material manufactured with the epoxy resin composition for molding and the element, or cracks.

[0050] Based on the total weight of the epoxy resin composition for molding, the content of the organic filler may be 0.1 to 10 wt%, for example, 0.1 to 3 wt%. If the content of the organic filler is less than the above-mentioned range, the effect of lowering the coefficient of thermal expansion may be insufficient, and if it exceeds the above-mentioned range, the strength and hardening property of the cured product may be reduced.

[0051]

[0052] additives

[0053] The epoxy resin composition for molding of the present invention may additionally include additives commonly used in such compositions. Non-limiting examples of usable additives include flame retardants, release agents, catalysts, colorants, coupling agents, and the like.

[0054] Flame retardants are used to provide flame retardancy, and metal hydroxides, etc. can be used. Release agents are added to secure release properties between the epoxy molding compound (EMC) and the mold. Examples of release agents include waxes such as paraffin wax, carnauba wax, polyethylene wax, and ester wax; and silicone oils such as both-terminal amine-modified silicone oil. Catalysts promote curing reactions, and examples of catalysts include imidazole compounds, naphthalene-based latent catalysts, amine compounds, organometallic compounds, organophosphorus compounds, and boron compounds. Colorants are added to provide color to the resin composition, and examples of colorants include carbon black and Bengala. Coupling agents promote bonding between inorganic and organic substances and improve adhesion to metal substrates, and examples of amino silane and epoxy silane can be used.

[0055] The above additives may be added within a content range known in the relevant technical field, and for example, may be included in an amount of 0.01 to 5 wt%, respectively, based on the total weight of the epoxy resin composition for molding, but is not limited thereto.

[0056]

[0057] The epoxy resin composition for molding according to the present invention can be manufactured by a conventional method known in the art, for example, a melt mixing method using a Banbury mixer, a kneader, a roll, a single-screw or twin-screw extruder, a co-kneader, etc. The epoxy resin composition for molding according to the present invention can be manufactured in a powder, granule, liquid, etc. form. For example, in the case of a powder or granule epoxy resin composition for molding, the above-described components are uniformly mixed, then melt-mixed at a temperature of 80 to 130°C using a heat kneader, cooled to room temperature, pulverized into a powder state, and then subjected to a sieving process, but the present invention is not limited thereto.

[0058] The epoxy resin composition for molding according to the present invention may have low reactivity with metal wiring materials, low ion transferability, sufficient mechanical strength to withstand processes such as chemical mechanical polishing (CMP), low moisture absorption to prevent peeling or increase in dielectric constant, heat resistance to withstand process processing temperatures, a low coefficient of thermal expansion to eliminate cracking due to temperature changes, and adhesive strength, crack resistance, low stress, and low high-temperature gas generation that can minimize various stresses and peeling that may occur at the interface with a semiconductor device. Specifically, the coefficient of thermal expansion of the epoxy resin composition for molding according to the present invention may be 10.5 ppm / ℃ or less, for example, 9 ppm / ℃ or less, or as another example, 7 to 9 ppm / ℃. If the coefficient of thermal expansion is below the above-mentioned range, the shrinkage rate may be reduced, which may result in poor release properties after molding. If it exceeds the above-mentioned range, the difference in coefficient of thermal expansion between the cured molding material and the silicon chip or wafer may cause internal stress, which may result in cracks in the semiconductor element, warping of the semiconductor package, or reduced adhesive strength between the encapsulating material and the lead frame, which may result in poor reliability.

[0059]

[0060] Electronic Components

[0061] The present invention may be an electronic component device including a sealed element using the epoxy resin composition for molding described above.

[0062] Specifically, the present invention provides a semiconductor device molded using the aforementioned epoxy resin composition for molding. The semiconductor device may be an IC (Integrated Circuit), an LSI (Large-Scale Integration) transistor, a diode, a microprocessor, a semiconductor memory, a power semiconductor, or the like.

[0063] Meanwhile, the epoxy resin composition for molding described above can seal a passive element, wherein the passive element may be a capacitor, a resistor, a coil, etc.

[0064] The method for molding a semiconductor device using the epoxy resin composition for molding of the present invention can be appropriately selected and performed according to a conventional method in the relevant technical field, such as transfer molding, compression molding, injection molding, or dispense molding.

[0065]

[0066] Hereinafter, the present invention will be described in more detail through examples. However, the following examples are intended only to aid understanding of the present invention and are not intended to limit the scope of the present invention in any way.

[0067]

[0068] [Experimental Example 1-13]

[0069] After mixing each component according to the composition described in Tables 1 and 2 below, the mixture was melt-mixed at a temperature of 80 to 130°C using a melt kneader, cooled to room temperature, pulverized into a powder state, and then subjected to a sieving process to manufacture a powder-type molding epoxy resin composition for each experimental example.

[0070]

[0071]

[0072]

[0073]

[0074] Epoxy resin 1: Bisphenol A-novolac epoxy resin (SQAN-201, EEW 192 g / eq, Mw 2,659 g / mol)

[0075] Epoxy resin 2: Bisphenol A-novolac epoxy resin (EEW ​​192 g / eq, Mw 2,000 g / mol)

[0076] Epoxy resin 3: Bisphenol A-novolac epoxy resin (EEW ​​192 g / eq, Mw 3,000 g / mol)

[0077] Epoxy resin 4: Bisphenol A-novolac epoxy resin (EEW ​​192 g / eq, Mw 1,950 g / mol)

[0078] Epoxy resin 5: Bisphenol A-novolac epoxy resin (EEW ​​192 g / eq, Mw 3,050 g / mol)

[0079] Epoxy resin 6: Bisphenol A-novolac epoxy resin (EEW ​​205 g / eq, Mw 2,800 g / mol)

[0080] Epoxy resin 7: Aromatic epoxy resin (VG-3101L, EEW 210 g / eq, Mw 642 g / mol)

[0081] Epoxy Resin 8: Biphenyl Epoxy Resin (YX-4000HK)

[0082] Curing agent: Aralkyl type phenol resin containing biphenylene skeleton (MEH-7403H, OH equivalent 132 g / eq, Mw 1,064 g / mol)

[0083] Inorganic filler: Silica (D 50 14.9 um)

[0084] Organic filler 1: Core-shell rubber particles (Core: Co-polymer siloxane, Shell: Acrylic, D 50 5 um, cut size 13 um)

[0085] Organic filler 2: Core-shell rubber particles (Core: Co-polymer siloxane, Shell: Acrylic, D 50 3 um, cut size 10 um)

[0086] Organic filler 3: Core-shell rubber particles (Core: Co-polymer siloxane, Shell: Acrylic, D 50 15 um, cut size 20 um)

[0087] Organic filler 4: Core-shell rubber particles (Core: Co-polymer siloxane, Shell: Acrylic, D 50 0.5 um, cut size 13 um)

[0088] Organic filler 5: Core-shell rubber particles (Core: Co-polymer siloxane, Shell: Acrylic, D 50 20 um, cut size 35 um)

[0089] Flame retardant: magnesium hydroxide

[0090] Brother: Montan Wax

[0091] Catalyst: 5-Methyl-2-phenylimidazole-4-methanol

[0092] Colorant: Carbon black

[0093] Coupling agent: N-[3-(Trimethoxysilyl)propyl]benzenamine

[0094]

[0095] [Physical property evaluation]

[0096] The physical properties of the epoxy resin composition manufactured in each experimental example were measured as follows, and the results are shown in Tables 3 and 4 below.

[0097]

[0098] spiral flow

[0099] The epoxy resin composition manufactured according to each experimental example was molded using a spiral flow mold in a heat transfer molding machine (pressure 70 kg / cm2, temperature 175 ℃, curing time 120 seconds), and then the flowability of the product was measured.

[0100]

[0101] gelation time

[0102] A small amount of the epoxy resin composition manufactured according to each experimental example was spread widely and evenly on a gel timer, and the gelation time of the composition was measured.

[0103]

[0104] Hot hardness

[0105] The epoxy resin composition manufactured according to each experimental example was molded using a bleed / flash mold with a heat transfer molding machine (pressure 70 kg / cm2, temperature 175 ℃, curing time 120 seconds), and then the hardness of Cull was measured using a durometer.

[0106]

[0107] Adhesion strength on Cu

[0108] The epoxy resin composition manufactured according to each experimental example was used to manufacture a specimen attached to a copper coupon using a bonding strength specimen manufacturing mold. After molding using a heat transfer molding machine (pressure 70 kg / cm2, temperature 175°C, curing time 120 sec), the specimen was post-cured in an oven at 175°C for 4 hours, and then the bonding strength between the layers formed by the copper and the epoxy resin composition was measured using an adhesion measuring device (Nordson Dage-series-4000PXY).

[0109]

[0110] Coefficient of thermal expansion (CTE)

[0111] The epoxy resin composition of each experimental example was injected into a mold (length x width x thickness, 6 mm x 6 mm x 6 mm) and then cured at 175 ℃ for 4 hours to prepare a specimen. The cured specimen was heated from 25 ℃ to 300 ℃ at a heating rate of 10 ℃ / min using a TMA device (TA Q400, Expansion mode), and the coefficient of thermal expansion (CTE) of the recooled specimen was continuously measured. Among the results of the second measurement, the coefficient of thermal expansion at a temperature below the glass transition temperature (Tg) was indicated as CTE 1, and the coefficient of thermal expansion at a temperature exceeding Tg was indicated as CTE 2.

[0112]

[0113] Glass transition temperature (Tg)

[0114] It was measured using differential scanning calorimetry (DSC).

[0115]

[0116] Flexural strength

[0117] Measured according to ASTM D638, D256, D790.

[0118]

[0119] Flexural modulus

[0120] The epoxy resin composition manufactured according to each experimental example was molded using a specimen manufacturing mold (width 125 mm, length 12.5 mm, thickness 6 mm) in a heat transfer molding machine (pressure 70 kg / cm2, temperature 175 ℃, curing time 120 seconds), and then post-cured in an oven at 175 ℃ for 4 hours, and then measured using a UTM (Universal Testing Machine).

[0121]

[0122] Shrinkage After PMC

[0123] The epoxy resin composition manufactured according to each experimental example was molded using a specimen manufacturing mold (width 125 mm, length 12.5 mm, thickness 6 mm) in a heat transfer molding machine (pressure 70 kg / cm2, temperature 175°C, curing time 120 seconds), and then post-cured in an oven at 175°C for 4 hours. The length of the shrunken specimen was measured using a Vernier Caliper.

[0124]

[0125]

[0126]

[0127]

[0128] As shown in Tables 3 and 4 above, the epoxy resin composition for molding of Experimental Examples 1-5 according to the present invention exhibited excellent physical properties across all measured items. In particular, the epoxy resin composition for molding of Experimental Examples 1-5 exhibited a low coefficient of thermal expansion without any deterioration in physical properties such as glass transition temperature.

[0129] On the other hand, the molding epoxy resin compositions of Experimental Example 6 that did not include bisphenol A-novolac epoxy resin, Experimental Example 7 that included aromatic epoxy resin instead of bisphenol A-novolac epoxy resin, Experimental Examples 8-10 that included bisphenol A-novolac epoxy resin (epoxy resin 4-6) that exceeded the range of properties according to the present invention, Experimental Example 11 that did not include organic filler, and Experimental Examples 12 and 13 that used core-shell rubber particles (organic fillers 4, 5) that exceeded the range of particle diameters according to the present invention as organic fillers showed inferior properties in all measured items compared to the molding epoxy resin compositions of Experimental Examples 1-5.

[0130]

[0131] The present invention provides an epoxy resin composition for molding which has excellent mechanical strength and reliability due to a low coefficient of thermal expansion, and excellent physical properties without lowering the glass transition temperature, and a semiconductor device molded using the same.

Claims

1. Contains epoxy resin, hardener, inorganic filler and organic filler, wherein the epoxy resin comprises a first epoxy resin, The first epoxy resin comprises a bisphenol A-novolac epoxy resin having an epoxy equivalent of 170 to 200 g / eq and a weight average molecular weight of 2,000 to 3,000 g / mol, The above organic filler has a particle size (D 50 ) An epoxy resin composition for molding comprising core-shell rubber particles having a size of 3 to 15 μm.

2. In the first paragraph, the bisphenol A-novolac epoxy resin is an epoxy resin composition for molding represented by the following chemical formula 1: [Chemical Formula 1] In the above chemical formula 1, n is 3 to 10.

3. In the first paragraph, the epoxy resin further comprises a second epoxy resin, The second epoxy resin comprises a biphenyl epoxy resin, An epoxy resin composition for molding, wherein the epoxy equivalent of the second epoxy resin is 150 to 200 g / eq and the weight average molecular weight is 300 to 500 g / mol.

4. In the first paragraph, the core of the organic filler is made of at least one selected from the group consisting of butadiene, siloxane, and silsesquioxane, An epoxy resin composition for molding, wherein the shell of the organic filler is composed of at least one selected from the group consisting of an acrylic-staddiene copolymer, acrylic, and polymethyl methacrylate.

5. In the third paragraph, an epoxy resin composition for molding comprising 5 to 30 wt% of the first epoxy resin, 0.1 to 10 wt% of the second epoxy resin, 1 to 20 wt% of the curing agent, 50 to 95 wt% of the inorganic filler, and 0.1 to 10 wt% of the organic filler, based on the total weight of the epoxy resin composition for molding.

6. An epoxy resin composition for molding having a coefficient of thermal expansion of 10.5 ppm / ℃ or less in the first paragraph.

7. A semiconductor device molded using an epoxy resin composition for molding according to any one of claims 1 to 6.

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