Substrate processing apparatus

Abstract

The present invention provides a substrate processing apparatus comprising: an inner chamber which includes an inner housing and an inner door, the inner door defining a processing chamber for accommodating, together with the inner housing, a substrate to be processed, wherein a reaction gas supplied to the processing chamber at a first pressure higher than atmospheric pressure is heated to reach a processing temperature; an outer chamber which accommodates the inner chamber and is formed to accommodate a protective gas supplied at a second pressure which is set in relation to the first pressure; a sealing unit disposed between the inner housing and the inner door and formed to isolate the reaction gas and the protective gas from each other; and a relief unit positioned at a level corresponding to a level at which the sealing unit is positioned, and formed to mitigate the thermal influence of the sealing unit.

Description

substrate processing device

[0001] The present invention relates to a device used for processing a substrate.

[0002]

[0003] Typically, during the semiconductor device manufacturing process, semiconductor wafers undergo various processing. Examples of these processes include oxidation, nitriding, deposition, and ion implantation. Hydrogen or deuterium heat treatment is also used to improve the interface properties of semiconductor devices.

[0004] Process gases used for processing are supplied within the chamber and act on the semiconductor wafers. To prevent process gas leakage, the chamber must be airtight. Sealing materials may be placed between the structures joined together within the chamber.

[0005] The sealing member seals the gap between the structures, preventing process gases from flowing out of the chamber or the outside atmosphere from flowing in. However, as the temperature of the process occurring in the chamber increases, the sealing member may deteriorate. If the sealing member deteriorates and the sealing member is compromised, accidents such as process gases leaking from the chamber or atmosphere flowing into the chamber may occur.

[0006] The background technology described above is technical information that the inventor possessed for the purpose of deriving embodiments of the present invention or acquired during the derivation process, and cannot necessarily be said to be publicly known technology disclosed to the general public prior to the present application.

[0007]

[0008] One object of the present invention is to provide a substrate processing device capable of effectively alleviating thermal effects on a configuration that maintains the confidentiality of a chamber.

[0009] Another object of the present invention is to provide a substrate processing device that can maintain the sealing of the chamber intact for a long time.

[0010]

[0011] According to one aspect of the present invention for achieving the above-described object, a substrate processing device may include an inner housing, an inner door defining a processing chamber for receiving a substrate to be processed together with the inner housing, and an inner chamber in which a reaction gas supplied to the processing chamber to reach a first pressure higher than atmospheric pressure is heated to reach a processing temperature; an outer chamber configured to receive the inner chamber and a protection gas supplied to reach a second pressure set in relation to the first pressure; a sealing unit disposed between the inner housing and the inner door, the sealing unit configured to isolate the reaction gas and the protection gas from each other; and a relief unit configured to be located at a level corresponding to a level at which the sealing unit is located and to alleviate a thermal effect of the sealing unit.

[0012] Here, the inner door is formed to open and close the processing room by moving along the height direction, and at least a part of the relief unit can be positioned within a height section occupied by the sealing unit along the height direction.

[0013] Here, the relief unit may be formed to be positioned inside the closed loop formed by the sealing unit and block heat proceeding toward the sealing unit.

[0014] Here, the relief unit may be formed to be located outside the closed loop formed by the sealing unit and to take away heat from the sealing unit.

[0015] Here, the relief unit can be arranged to be in direct contact with the sealing unit.

[0016] Here, the relief unit may include a refrigerant tube containing refrigerant therein.

[0017] Here, the refrigerant tube may form another closed loop concentric with the closed loop formed by the sealing unit.

[0018] Here, the relief unit may further include a refrigerant passage communicating with the refrigerant tube.

[0019] Here, the refrigerant passage may include a refrigerant injection passage formed to guide the refrigerant into the interior of the refrigerant tube; and a refrigerant discharge passage formed to guide the refrigerant out of the refrigerant tube.

[0020] Here, the refrigerant tube is located on the upper surface side of the inner door, and the refrigerant passage can extend through the inner door from the upper surface side of the inner door.

[0021] Here, the refrigerant tube may include a concave portion formed on its outer surface such that a portion of the sealing unit is inserted therein.

[0022] According to another aspect of the present invention, a substrate processing device may include: a first casing; a second casing formed to accommodate a substrate to be processed together with the first casing; a heater unit arranged to heat the substrate to be processed; a sealing unit arranged between the first casing and the second casing and formed to seal a space in which the substrate is accommodated from the outside; and a relief unit positioned at a level corresponding to a level at which the sealing unit is positioned and formed to alleviate a thermal effect of the sealing unit due to operation of the heater unit.

[0023] Here, the second casing is formed to open and close a space for receiving the substrate to be processed by moving along the height direction, and at least a part of the relief unit can be positioned within a height section occupied by the sealing unit along the height direction.

[0024] Here, the relief unit may be formed to be positioned inside the closed loop formed by the sealing unit and block heat proceeding toward the sealing unit.

[0025] Here, the relief unit may be formed to be located outside the closed loop formed by the sealing unit and to take away heat from the sealing unit.

[0026] Here, the relief unit can be arranged to be in direct contact with the sealing unit.

[0027] Here, the relief unit may include a refrigerant tube containing refrigerant therein.

[0028]

[0029] According to the substrate processing device according to the present invention configured as described above, a sealing unit disposed between the inner housing of the inner chamber accommodated in the outer chamber and the inner door is configured to isolate a reaction gas supplied to the inner chamber to reach a first pressure and a protective gas supplied to the outer chamber to reach a second pressure from each other, and a relief unit positioned corresponding to the sealing unit is configured to alleviate a thermal effect on the sealing unit, so that the sealing unit can effectively resist a thermal effect applied thereto. Thanks to the support of the relief unit, the sealing unit can maintain the chamber's airtightness intact for a long time.

[0030]

[0031] FIG. 1 is a conceptual diagram of a substrate processing device (100) according to one embodiment of the present invention.

[0032] Fig. 2 is a cross-sectional view showing the open state of the inner chamber (110) of Fig. 1.

[0033] Figure 3 is a perspective view showing the sealing unit (150) and relief unit (160) of Figure 2.

[0034] Fig. 4 is a partial cross-sectional view showing the closed state of the inner chamber (110) of Fig. 2.

[0035] FIG. 5 is a cross-sectional view showing an open state of an internal chamber (210) according to another embodiment of the present invention.

[0036] FIG. 6 is a partial perspective view showing the relationship between the sealing unit (250) and the relief unit (260) when the internal chamber (210) of FIG. 5 is switched to a closed state.

[0037] Fig. 7 is a partial cross-sectional view showing an open state of an internal chamber (310) according to another embodiment of the present invention.

[0038] FIG. 8 is a partial cross-sectional view showing an open state of an inner chamber (410) according to yet another embodiment of the present invention.

[0039]

[0040] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0041] The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and with various modifications. However, these embodiments are provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but should be understood to include all modifications, equivalents, and substitutes included within the technical spirit and scope of the present invention, as well as substitutions or additions of the components of one embodiment with those of another embodiment.

[0042] The attached drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification, but should be understood to encompass all modifications, equivalents, and substitutes included within the spirit and technical scope of the present invention. In the drawings, the components may be expressed in exaggerated sizes or thicknesses for ease of understanding, but the scope of protection of the present invention should not be construed as being limited thereby.

[0043] The terminology used in this specification is only used to describe specific implementations or examples and is not intended to limit the present invention. In addition, the singular expression includes the plural expression unless the context clearly indicates otherwise. In the specification, terms such as "comprises" and "consists of" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification. In other words, it should be understood that terms such as "comprises" and "consists of" do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0044] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0045] When a component is referred to as being "connected / connected" or "connected" to another component, it should be understood that it may be directly connected / connected to that other component, or that there may be other components in between. Conversely, when a component is referred to as being "directly connected / connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0046] When a component is referred to as being "above" or "below" another component, it should be understood that it is not only positioned directly above that other component, but that there may also be other components present in between.

[0047] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0048] FIG. 1 is a conceptual diagram of a substrate processing device (100) according to one embodiment of the present invention.

[0049] Referring to this drawing, the substrate processing device (100) may include an inner chamber (110), an outer chamber (120), an air supply module (130), and an exhaust module (140).

[0050] The inner chamber (110) forms a processing area for processing a substrate. The inner chamber (110) may be made of a non-metallic material, for example, quartz, to reduce the risk of contamination of the substrate in a high-temperature and high-pressure working environment. Depending on the operation of a heater unit (not shown) disposed outside the inner chamber (110), the temperature (processing temperature) of the processing area may reach several hundred to several thousand degrees Celsius. The substrate may be, for example, a semiconductor wafer mounted on a holder. The substrate is not limited to the wafer, and may be any other basic structure for forming a circuit. For example, the substrate may also include glass for manufacturing a display. The holder may be a boat capable of stacking the substrate in multiple layers.

[0051] The outer chamber (120) is arranged to accommodate the inner chamber (110). Unlike the inner chamber (110), the outer chamber (120) can be made of metal, as it is free from concerns about contamination of the substrate. The outer chamber (120) has a hollow shape with an inner space that accommodates the inner chamber (110).

[0052] The gas supply module (130) is configured to supply gas to the inner chamber (110) and the outer chamber (120). The gas supply module (130) has a gas supply unit (131) connected to a utility (gas supply facility) of a semiconductor factory. The gas supply unit (131) can selectively supply, as a reaction gas to the inner chamber (110), for example, hydrogen (H2) / deuterium (D2) gas, fluorine (F2) gas, ammonia (NH3) gas, chlorine (Cl2) gas, nitrogen (N2) gas, etc. The gas supply unit (131) can supply, as a protective gas to the outer chamber (120), for example, nitrogen gas, which is an inert gas. These reaction gases and protective gases are introduced into the inner chamber (110) or the outer chamber (120) through a reaction gas line (133) or a protective gas line (135), respectively. The protective gas introduced into the external chamber (120) is specifically supplied to the space (protection space) between the external chamber (120) and the internal chamber (110). The reaction gas and the protective gas may also be simply referred to as process gas.

[0053] The above process gas can be supplied to the chambers (110, 120) at a pressure higher than atmospheric pressure (high pressure), for example, from several atmospheres to several tens of atmospheres. When the pressure of the inner chamber (110) is a first pressure and the pressure of the outer chamber (120) is a second pressure, these pressures can be maintained within a set relationship (range). For example, the second pressure can be set to be substantially the same as or slightly greater than the first pressure. Such a pressure relationship provides the advantage of preventing the reaction gas from leaking from the inner chamber (110) and preventing the inner chamber (110) from being broken. The second pressure can also be set to be slightly lower than the first pressure, and in that case, similar effects to those in the above relationship can be achieved.

[0054] The exhaust module (140) is configured to exhaust the process gas. In order to exhaust the reaction gas from the inner chamber (110), an exhaust pipe (141) may be connected to the upper portion of the inner chamber (110). Similarly, in order to exhaust the protective gas from the outer chamber (120), an exhaust pipe (145) connected to the outer chamber (120) may be provided. Since these exhaust pipes (141 and 145) are connected to each other, the reaction gas is diluted in the protective gas during the exhaust process, thereby lowering its concentration.

[0055] Fig. 2 is a cross-sectional view showing the open state of the inner chamber (110) of Fig. 1.

[0056] Referring to this drawing, the inner chamber (110) includes an inner housing (111) and an inner door (115). The inner housing (111) has a hollow space for forming the processing chamber, and its lower part may have an open shape. The inner housing (111) may be mounted on an outer housing, which will be described later. The inner door (115) has a shape that closes the open lower part of the inner housing (111). The inner door (115) may define the processing chamber together with the inner housing (111). As the inner door (115) moves downward in a moving direction, specifically in a height direction (H), the processing chamber is opened (open state, see FIG. 2). The moving direction is a direction in which the inner door (115) approaches or moves away from the inner housing (111). The substrate may be loaded into or unloaded from the processing chamber in the open state. As the inner door (115) rises along the height direction (H), the inner door (115) is connected to the inner housing (111) via a sealing unit (150) to be described later. In this case, the processing room can be said to be closed (closed state, see Fig. 4).

[0057] Further explaining the outer chamber (120), the outer chamber (120) may also include an outer housing (not shown) and an outer door (not shown). The outer housing may also have a hollow space to entirely accommodate the inner chamber (110). Accordingly, the outer housing may be formed to surround not only the inner housing (111) but also the inner door (115). The outer door may also open and close the outer housing as it moves. The outer door may be connected to the inner door (115). In this case, the inner door (115) may open and close the treatment room while moving in conjunction with the elevation of the outer door.

[0058] Referring again to the inner chamber (110), a sealing unit (150) is positioned between the inner housing (111) and the inner door (115). The sealing unit (150) can isolate the reaction gas within the processing chamber and the protective gas within the protective space from each other. Although the processing chamber is ultimately closed by the sealing unit (150), in a broad sense, the processing chamber can be described as being limited by the inner housing (111) and the inner door (115).

[0059] For the installation of the sealing unit (150), a flange portion (113) may be formed in the edge area of ​​the inner housing (111). The flange portion (113) may be generally parallel to the edge area of ​​the inner door (115). The flange portion (113) may have a donut shape. Corresponding to the shape of the flange portion (113), the sealing unit (150) may also have a closed-loop shape. Specifically, the sealing unit (150) may be an O-ring having a circular shape. The O-ring may contain rubber or the like to have cushioning properties and may have airtightness to prevent gas leakage therethrough. The O-ring is exemplified as being disposed on the upper surface of the inner door (115), but a mounting groove (not shown) may be formed in the inner door (115) and the O-ring may be seated in the groove. Depending on the material of the inner housing (111) or the structure added thereto, the mounting groove may be formed in the inner housing (111).

[0060] The sealing unit (150) is subjected to thermal influence from the heater unit and further from the process gas heated by the heater unit. Due to the continuous thermal influence, the sealing unit (150) may degrade.

[0061] In order to alleviate the thermal influence of the sealing unit (150), a relief unit (160) is additionally provided. The relief unit (160) is positioned at a level corresponding to the level occupied by the sealing unit (150), so as to more effectively prevent deterioration of the sealing unit (150). The relief unit (160) is a separate member independent from the sealing unit (150), and the cross-section of the relief unit (160) may be positioned outside a boundary line (e.g., a circle) that defines the cross-section of the sealing unit (150).

[0062] The above level may be set along the height direction (H). Specifically, the sealing unit (150) may occupy a certain height section (HZ1) along the height direction (H). At least a part of the relief unit (160) may belong to the above height section (HZ1). For example, in the present embodiment, the upper and lower ends of the refrigerant tube (161) of the relief unit (160) along the height direction (H) are located within the section occupied by the upper and lower ends of the sealing unit (150). Specifically, along the height direction (H), the upper end of the refrigerant tube (161) may be located at a lower level than the upper end of the sealing unit (150).

[0063] The refrigerant tube (161) accommodates refrigerant therein. The refrigerant, as a gas or liquid, can flow within the refrigerant tube (161). The refrigerant tube (161) may be formed of a material with excellent thermal conductivity, for example, a metal material. However, the material of the refrigerant tube (161) is not limited to a metal material, and even a non-metallic material may be formed of a material with relatively excellent thermal conductivity and heat resistance, such as epoxy resin. The refrigerant tube (161) is exemplified as being arranged on the upper surface of the inner door (115), but may also be seated in a mounting groove (not shown) similar to the sealing unit (150).

[0064] A refrigerant passage (165) may be connected to the refrigerant tube (161). The refrigerant passage (165) is for providing or recovering the refrigerant to the refrigerant tube (161). If the refrigerant tube (161) is located on the upper surface side of the inner door (115), the refrigerant passage (165) may extend through the inner door (115) from the upper surface side of the inner door (115). In the present embodiment, the refrigerant passage (165) is arranged to pass through the inner door (115) along the height direction (H).

[0065] Figure 3 is a perspective view showing the sealing unit (150) and relief unit (160) of Figure 2.

[0066] Referring to this drawing, the sealing unit (150) may be a closed loop, specifically, having a circular shape. Corresponding to the sealing unit (150), the refrigerant tube (161) of the relief unit (160) may also have a circular shape. The sealing unit (150) and the refrigerant tube (161) may also have a concentric relationship.

[0067] The refrigerant tube (161) has a smaller diameter than the sealing unit (150), and is thus positioned within the area defined by the sealing unit (150). Accordingly, the refrigerant tube (161) can block the progress of heat (T) toward the sealing unit (150). The heat (T) was intended to progress from the center of the processing chamber toward the sealing unit (150). The refrigerant tube (161) can block the heat (T) for the entire area along the circumference of the sealing unit (150). Due to the concentric relationship between the refrigerant tube (161) and the sealing unit (150), the sealing unit (150) can be uniformly protected against the heat (T) in the entire area along the circumference. As a result, a vulnerable area of ​​the sealing unit (150) that is not protected or is weakly protected may not occur.

[0068] The refrigerant tube (161) may also take heat away from the sealing unit (150). To do this effectively, the refrigerant tube (161) may be positioned in direct contact with the sealing unit (150).

[0069] The refrigerant passage (165) can be broadly divided into two parts: a refrigerant injection passage (166) and a refrigerant discharge passage (167). The refrigerant injection passage (166) is formed to guide the refrigerant into the refrigerant tube (161). The refrigerant discharge passage (167) is formed to guide the refrigerant out of the refrigerant tube (161). In an alternative embodiment, the refrigerant passage (165) may not be divided into two parts. In that case, the process of injecting the refrigerant into the refrigerant tube (161) and the process of discharging the refrigerant from the refrigerant tube (161) may be sequentially performed through a single refrigerant passage (165).

[0070] Fig. 4 is a partial cross-sectional view showing the closed state of the inner chamber (110) of Fig. 2.

[0071] Referring to this drawing, the sealing unit (150) is compressed by the inner door (115) coming as close as possible to the inner housing (111). As a result, the height section (HZ2) occupied by the sealing unit (150) becomes smaller than the height section (HZ1) described above. Even in this case, the refrigerant tube (161) can be positioned within the reduced height section (HZ2). In addition, along the height direction (H), the upper end of the refrigerant tube (161) is at the same level as or still lower than the upper end of the sealing unit (150), so that the refrigerant tube (161) may or may not slightly contact the flange portion (113). Due to this size of the refrigerant tube (161), the refrigerant tube (161) may not be deformed or damaged by being compressed by the flange portion (113) and the inner door (115) in the closed state.

[0072] FIG. 5 is a cross-sectional view showing an open state of an internal chamber (210) according to another embodiment of the present invention.

[0073] Referring to this drawing, a substrate processing device (200) according to another embodiment also has an inner chamber (210). The inner chamber (210) is also composed of an inner housing (211) and an inner door (215), and a sealing unit (250) and a relief unit (260) are arranged between them (211 and 215).

[0074] The refrigerant tube (261) of the relief unit (260) is arranged on the outside of the sealing unit (250), as opposed to the previous embodiment. Specifically, if the sealing unit (250) forms a small closed loop, the refrigerant tube (261) can form another larger closed loop.

[0075] By this arrangement, the relief unit (260) can take away the heat accumulated in the sealing unit (250). The heat of the sealing unit (250) can be conducted to the relief unit (260), and for this purpose, the sealing unit (250) can be in direct contact with the relief unit (260).

[0076] FIG. 6 is a partial perspective view showing the relationship between the sealing unit (250) and the relief unit (260) when the internal chamber (210) of FIG. 5 is switched to a closed state.

[0077] Referring to this drawing, in the closed state, the sealing unit (250) can come into contact with the relief unit (260) over a wider area.

[0078] In order to maximize the contact area with the sealing unit (250), a concave portion (262) may be formed on the outer surface of the refrigerant tube (261). The concave portion (262) is a portion having a circular arc shape in cross section, and may be a place where an adjacent portion of the compressed sealing unit (250) is inserted.

[0079] By providing a concave portion (262) corresponding to the outline of the sealing unit (250) in the above closed state, the contact area between the sealing unit (250) and the refrigerant tube (261) can be maximized. This expansion of the contact area allows the heat of the sealing unit (250) to be more efficiently conducted to the refrigerant tube (261).

[0080] Fig. 7 is a partial cross-sectional view showing an open state of an internal chamber (310) according to another embodiment of the present invention.

[0081] Referring to this drawing, the substrate processing device (300) according to the present embodiment also has an internal chamber (310). The internal chamber (310) is composed of an internal housing (311) and an internal door (315), and a sealing unit (350) and a relief unit (360) are arranged between them (311 and 315).

[0082] The relationship between the sealing unit (350) and the relief unit (360) is similar to the previous embodiment. Accordingly, the sealing unit (350) forms an inner closed loop, and the refrigerant tube (361) of the relief unit (360) forms an outer closed loop.

[0083] A barrier (369) may be additionally formed on the inside of the sealing unit (350). The barrier (369) may be formed integrally with the inner door (315). Alternatively, the barrier (369) may be formed as a separate structure made of a different material from the inner door (315), for example, a material having superior insulation properties than the inner door (315), and then mounted on the inner door (315). The barrier (369) may serve to block heat from traveling to the sealing unit (350).

[0084] By means of the barrier (369), the amount of heat accumulated in the sealing unit (350) can be reduced. Accordingly, the burden on the relief unit (360) that must discharge the heat of the sealing unit (350) can be reduced.

[0085] FIG. 8 is a partial cross-sectional view showing an open state of an inner chamber (410) according to yet another embodiment of the present invention.

[0086] Referring to this drawing, a substrate processing device (400) according to another embodiment also has an inner chamber (410). The inner chamber (410) is also composed of an inner housing (411) and an inner door (415), and a sealing unit (450) and a relief unit (460) are arranged between them (411 and 415).

[0087] Unlike the previous embodiments, the sealing unit (450) and the relief unit (460) may be stacked along the height direction (H). For example, the sealing unit (450) may be placed on the upper side of the relief unit (460), specifically, the refrigerant tube (461). These (450 and 460) may be in direct contact with each other.

[0088] For alignment between these (450 and 460), a receiving groove (416) may be formed in the inner door (415). If the relief unit (460) is fully received in the receiving groove (416), only the lower part of the sealing unit (450) may be received in the receiving groove (416).

[0089] In the above, the sealing unit (150, 250, 350, 450) and the relief unit (160, 260, 360, 460) have been described as being applied between the inner housing (111, 211, 311, 411) and the inner door (115, 215, 315, 415), but the present invention is not limited thereto. The sealing unit and the relief unit may also be applied as is between the outer housing and the outer door. In that case, the outer housing may ultimately accommodate the substrate together with the outer door, and the sealing unit may be understood to seal the space accommodating the substrate against the outside air. The outer housing may be referred to as a first casing, and the outer door may be referred to as a second casing.

[0090] In this specification, a high-pressure substrate processing device (100) having a dual chamber (110, 120) has been described as an example, but the present invention is not limited thereto. A processing device having a single chamber is also within the scope of the present invention. The single chamber is composed of a plurality of structures combined to accommodate the substrate. A process gas for processing the substrate, for example, a reaction gas, is supplied to the space where the substrate is accommodated and heated to a processing temperature. Two structures that meet among the plurality of structures may be referred to as the first casing and the second casing in that they define a space for accommodating the substrate. The sealing unit and the relief unit are arranged between the first casing and the second casing, and can be applied as such to the processing device having the single chamber.

[0091] The configuration of the sealing unit and the relief unit, etc., described above can also be applied to a semi-dual chamber, which is an intermediate form between the dual chamber and the single chamber. The semi-dual chamber can have a single door that opens and closes the inner housing and the outer housing. The inner and outer housings can be combined by their own shapes or by interposing a separate member to form a closed space (corresponding to the protective space). Similar to the previous embodiment, the substrate is placed in the processing chamber of the inner housing and the reaction gas is injected, and the protective gas can be injected into the closed space. Unlike the previous embodiments, the door is not completely protected by the protective gas and is exposed to the outside. The sealing unit and the relief unit can be placed between the inner housing and the door, or between the outer housing and the door.

[0092] Although this specification exemplifies a batch-type processing device, the present invention is not limited thereto. The present invention can also be applied to a single-wafer type processing device.

[0093]

[0094] The present invention has industrial applicability in the field of manufacturing substrate processing devices.

Claims

1. An inner chamber having an inner housing and an inner door defining a processing chamber for receiving a substrate to be processed together with the inner housing, wherein a reaction gas supplied to the processing chamber to reach a first pressure higher than atmospheric pressure is heated to reach a processing temperature; An outer chamber configured to accommodate the inner chamber and to accommodate a protective gas supplied thereto to reach a second pressure set in relation to the first pressure; A sealing unit disposed between the inner housing and the inner door, and formed to isolate the reaction gas and the protective gas from each other; and A substrate processing device comprising a relief unit positioned at a level corresponding to the level at which the sealing unit is positioned and formed to alleviate the thermal influence of the sealing unit.

2. In paragraph 1, The above inner door, It is formed to move along the height direction and open and close the above processing room, At least a portion of the above relief unit, A substrate processing device located within a height section occupied by the sealing unit along the height direction.

3. In paragraph 1, The above relief unit, A substrate processing device positioned on the inside of a closed loop formed by the sealing unit, and formed to block heat proceeding toward the sealing unit.

4. In paragraph 1, The above relief unit, A substrate processing device positioned on the outside of a closed loop formed by the sealing unit, and formed to take away heat from the sealing unit.

5. In paragraph 1, The above relief unit, A substrate processing device arranged to be in direct contact with the above sealing unit.

6. In paragraph 1, The above relief unit, A substrate processing device comprising a refrigerant tube containing refrigerant therein.

7. In paragraph 6, The above refrigerant tube, A substrate processing device that forms another closed loop concentric with the closed loop formed by the above sealing unit.

8. In paragraph 6, The above relief unit, A substrate processing device further comprising a refrigerant passage communicating with the refrigerant tube.

9. In paragraph 8, The above refrigerant passage, A refrigerant injection path formed to guide the refrigerant into the interior of the refrigerant tube; and A substrate processing device comprising a coolant discharge path formed to guide the coolant out of the coolant tube.

10. In paragraph 8, The above refrigerant tube, Located on the upper side of the inner door, The above refrigerant passage, A substrate processing device extending through the inner door from the upper surface side of the inner door.

11. In paragraph 6, The above refrigerant tube, A substrate processing device comprising a recess formed on its outer surface to allow a portion of the sealing unit to be inserted therein.

12. First casing; A second casing formed to accommodate a substrate to be processed together with the first casing; A heater unit arranged to heat the above-mentioned processing substrate; A sealing unit disposed between the first casing and the second casing and formed to seal the space in which the substrate is accommodated to the outside; and A substrate processing device comprising a relief unit positioned at a level corresponding to the level at which the sealing unit is positioned, and formed to alleviate the thermal influence of the sealing unit due to the operation of the heater unit.

13. In paragraph 12, The above second casing, It is formed to move along the height direction and open and close the space that accommodates the above-mentioned processing substrate, At least a portion of the above relief unit, A substrate processing device located within a height section occupied by the sealing unit along the height direction.

14. In paragraph 12, The above relief unit, A substrate processing device positioned on the inside of a closed loop formed by the sealing unit, and formed to block heat proceeding toward the sealing unit.

15. In paragraph 12, The above relief unit, A substrate processing device positioned on the outside of a closed loop formed by the sealing unit, and formed to take away heat from the sealing unit.

16. In paragraph 12, The above relief unit, A substrate processing device arranged to be in direct contact with the above sealing unit.

17. In paragraph 12, The above relief unit, A substrate processing device comprising a refrigerant tube containing refrigerant therein.

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