Epoxy resin composition for molding

Abstract

The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using same.

Description

Epoxy resin composition for molding

[0001] The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using the same.

[0002]

[0003] A resin composition for sealing is used as a material to seal semiconductor devices such as integrated circuits (ICs), large scale integrated circuits (LSIs), transistors, and diodes, thereby improving the characteristics and reliability of semiconductor devices. Recently, with the trend toward miniaturization, weight reduction, and higher performance of electronic devices, the integration of semiconductors has accelerated, and research is continuing in various fields to improve the performance of materials used for sealing semiconductor devices. For example, Japanese Patent Application Laid-Open No. 2017-197620 relates to an epoxy resin composition for semiconductor sealing, which includes an epoxy resin, a phenol resin curing agent, and a filler, and discloses a technology for improving electrical connection reliability by controlling the content of the filler and the thermoelastic modulus of the cured product of the epoxy resin composition.

[0004] In particular, when applied to multi-layered semiconductor packages, filling micro-gaps is important, so it is required to secure excellent spreading properties in the epoxy resin composition to enhance filling properties. However, conventional epoxy resin compositions with enhanced filling properties have the problem of swelling, in which the epoxy resin composition for molding leaks out of the mold cavity during compression molding under high pressure in a vacuum environment.

[0005] Accordingly, there is a need for the development of an epoxy resin composition for molding that has excellent spreading properties, thereby improving filling properties, and excellent swelling suppression properties.

[0006]

[0007] The present invention provides an epoxy resin composition for molding having excellent spreading and swelling inhibition properties and a semiconductor device molded using the same.

[0008]

[0009] The present invention provides an epoxy resin composition for molding having an r value of more than 4 and less than 6 according to the following formula 1.

[0010] [Formula 1]

[0011]

[0012] In the above formula,

[0013] GT is the gel time of the epoxy resin composition for molding,

[0014] VT is the time for the mold to close and melt the epoxy resin composition for molding under vacuum.

[0015] CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the time it takes for pressure to be applied.

[0016]

[0017] The present invention provides an epoxy resin composition for molding, which has excellent spreadability, thereby improving filling properties, and excellent swelling suppression properties. The epoxy resin composition according to the present invention is applicable to compression molding, and in particular, due to its excellent swelling suppression properties, it can be applied as an epoxy resin composition for granule-type molding.

[0018]

[0019] Figure 1 is a schematic diagram showing a method for evaluating the spreading property of an epoxy resin composition.

[0020] Figure 2 is a schematic diagram showing a method for evaluating the swelling characteristics of an epoxy resin composition.

[0021]

[0022] The present invention will be described in detail below. However, it is not limited to the following description, and each component may be modified or selectively mixed as needed. Therefore, it should be understood that all modifications, equivalents, and alternatives included within the spirit and technical scope of the present invention are included.

[0023] The “softening point” used in this specification is measured by a conventional method known in the art, and can be measured, for example, using a dropping point meter (Dropping Point system calorimetry DP70) from Mettler Toledo. The “viscosity” is measured by a conventional method known in the art, and can be measured, for example, using a Brookfield viscometer at room temperature (25°C). “Particle size (D 50 )" is measured by a conventional method known in the art, and can be measured, for example, by a laser particle size analyzer.

[0024]

[0025] Epoxy resin composition

[0026] The epoxy resin composition for molding of the present invention has an r value of more than 4 and less than 6 according to the following formula 1.

[0027] [Formula 1]

[0028]

[0029] In the above formula,

[0030] GT is the gel time of the epoxy resin composition for molding,

[0031] VT is the time for the mold to close and melt the epoxy resin composition for molding under vacuum.

[0032] CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the time it takes for pressure to be applied.

[0033] When the r value is less than the above-mentioned range, it means that VT and CT are excessively high compared to the gel time (GT) of the epoxy resin composition for molding, and in this case, the time for which pressure is applied to the epoxy resin composition for molding becomes longer than the gel time, which may reduce spreadability. When the r value is more than the above-mentioned range, it means that VT and CT are excessively short compared to the gel time of the epoxy resin composition for molding, and in this case, the time for which pressure is applied to the epoxy resin composition for molding becomes excessively short, which may cause a swelling phenomenon. The present invention provides an epoxy resin composition for molding, which has excellent spreadability and swelling suppression characteristics, thereby improving formability and reliability, by controlling the r value to the above-mentioned range.

[0034] GT refers to the time until the epoxy resin composition for molding begins to gel, i.e., the gel time of the epoxy resin composition for molding, and can be measured using a gel timer. The longer the GT, the longer the time it takes for the molten epoxy resin composition for molding to harden through a thermal curing reaction, so that the epoxy resin composition for molding applied to a moving cavity remains molten for a longer period of time. GT can vary depending on the measurement temperature, and the GT measurement temperature of the epoxy resin composition for molding, i.e., the molding temperature, is typically 140 to 180°C. GT can be 25 to 200 seconds, for example, 55 to 72 seconds. If GT is less than the aforementioned range, curing may proceed while the upper plate (upper press of the compression mold (C-mold)) and the lower plate (moving cavity) of the mold-in-mold are engaged and closed, and after the upper and lower plates of the mold are completely engaged, the molding epoxy resin composition may spread inside the mold, lose its flowability before molding, and harden, resulting in reduced spreadability even if the r-value satisfies the condition of more than 4 and less than 6. As a result, the molding epoxy resin composition may not be molded into a desired shape, resulting in appearance defects. On the other hand, if GT exceeds the aforementioned range, the molding epoxy resin composition, which has not been cured and has a high viscosity, may move inside the mold for a long period of time, resulting in leakage or swelling outside the mold. This may result in contamination of the manufacturing equipment or deterioration of the reliability of the semiconductor package.

[0035] VT is the time taken for the mold-in-mold (the upper press and moving cavity of the compression mold (C-mold)) to close and melt the epoxy resin composition for molding under vacuum. If the VT is long, the time taken to reach the pressure application stage becomes long, and the spreadability of the epoxy resin composition for molding, which has partially gelled during this period, may decrease. On the other hand, if the VT is short, the spreadability is improved, but since the epoxy resin composition for molding is exposed to the vacuum state for only a short time, air bubbles in the molten epoxy resin composition for molding may not be completely removed, and this may cause the epoxy resin composition for molding to swell and leak out of the mold during the high-temperature thermal curing reaction, which may result in a swelling phenomenon. The VT may be 2 to 15 seconds, for example, 2 to 5 seconds. If the VT is less than the aforementioned range, a swelling phenomenon may occur, and if it is more than the aforementioned range, the spreadability may decrease.

[0036] CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the time it takes for the pressure to be applied. When the press top of the compression mold closes, the substrate fixed on the top and the epoxy resin composition for molding move to the packing position, so that the cavity and the epoxy resin composition for molding come into close contact, and after the close contact, pressure is applied. CT refers to the time required for the entire process. CT can be controlled by adjusting the moving speed of the mold top plate and the speed of pressure application. If CT is long, the time it takes to reach the pressure application step becomes long, and the spreadability of the epoxy resin composition for molding, which has partially gelled during this period, may deteriorate. On the other hand, if CT is short, pressure can be applied directly to the epoxy resin composition for molding in a molten state, so the spreadability may be improved. CT may be 8 to 30 seconds, for example, 12 to 15 seconds. The shorter the CT, the faster the pressure is applied to the molten epoxy resin composition for molding, resulting in better spreadability. However, due to limitations in the physical speed of the mold, it may be difficult for the CT to fall below the aforementioned range, and if the CT exceeds the aforementioned range, the spreadability may deteriorate.

[0037] The present invention can provide an epoxy resin composition for molding with improved moldability and reliability by controlling process variables GT, VT and CT during a compression molding process, thereby having excellent spreadability and swelling suppression characteristics.

[0038] The epoxy resin composition of the present invention can be manufactured in a liquid, powder, granule, or sheet form, and can be used as a sealant for semiconductor devices or a molding material or fixing material for various electronic components and automobile components. For example, the epoxy resin composition for molding of the present invention can be applied for sealing a large-area semiconductor package that is large in size and thin in thickness, and can be manufactured as a granule-type epoxy resin composition for molding that can be applied to a compression type molding process, a C-molding process, or a lamination process.

[0039]

[0040] epoxy resin

[0041] The epoxy resin composition of the present invention comprises an epoxy resin. The epoxy resin is used as a main resin, and by reacting with a curing agent and curing, forms a three-dimensional network structure, thereby imparting strong and solid adhesion properties to an adherend and heat resistance.

[0042] As the above epoxy resin, an epoxy resin commonly used in the relevant technical field can be used. Non-limiting examples of usable epoxy resins include bisphenol A type epoxy resins, alicyclic epoxy resins, cresol novolac epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, naphthalene type epoxy resins, anthracene epoxy resins, tetramethyl biphenyl type epoxy resins, phenol novolac epoxy resins, bisphenol A novolac epoxy resins, bisphenol S novolac epoxy resins, biphenyl novolac epoxy resins, naphthol novolac epoxy resins, naphthol phenol cocondensed novolac epoxy resins, naphthol cresol cocondensed novolac epoxy resins, aromatic hydrocarbon formaldehyde resin modified phenol resin epoxy resins, triphenyl methane type epoxy resins, tetraphenyl ethane type epoxy resins, dicyclopentadiene type epoxy resins, dicyclopentadiene phenol addition reaction epoxy resins, biphenyl type epoxy resins, phenol aralkyl type epoxy resins, multifunctional phenol resins, and naphthol. There are aralkyl type epoxy resins, etc., and one or more of these may be included.

[0043] For example, the epoxy resin may include formaldehyde, polymer with 1,1'-biphenyl and phenol, glycidyl ether, 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl), or mixtures thereof.

[0044] For example, the epoxy resin may include a polymer of formaldehyde, 1,1'-biphenyl, and phenol, glycidyl ether, and 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl). In this case, the viscosity and flowability properties can be further improved while maintaining the mechanical strength properties, such as the flexural strength, of the epoxy resin composition.

[0045] The above epoxy resin may be used having an epoxy equivalent weight (EEW) of 100 to 500 g / eq, for example, 150 to 300 g / eq. If the epoxy equivalent weight is less than the above-mentioned range, the cured density may increase, resulting in poor moisture resistance reliability. If the epoxy equivalent weight exceeds the above-mentioned range, the curing property may be poor.

[0046] The above epoxy resin may be used with a softening point of 30 to 150°C, for example, 50 to 110°C. If the softening point is below the above-mentioned range, caking properties may be poor, and if it exceeds the above-mentioned range, uneven distribution may occur during manufacturing.

[0047] Based on the total weight of the epoxy resin composition, the content of the epoxy resin may be 2 to 20 wt%, for example, 5 to 15 wt%. If the content of the epoxy resin is less than the above-mentioned range, adhesion, flowability, and moldability may be reduced, and if it exceeds the above-mentioned range, the reliability of the semiconductor may be deteriorated due to an increase in moisture absorption, and the strength may be reduced due to a relative decrease in the filler content.

[0048]

[0049] hardener

[0050] The epoxy resin composition of the present invention includes a curing agent. The curing agent reacts with the epoxy resin to promote curing of the composition.

[0051] The curing agent may be any curing agent known in the art that undergoes a curing reaction with an epoxy resin. The curing agent may be a phenol-based compound having two or more phenolic hydroxyl groups in one molecule. Non-limiting examples of usable curing agents include phenol novolac resins, cresol novolac resins, phenol aralkyl resins, and multifunctional phenol compounds, and the curing agent may include one or more of these.

[0052] For example, the curing agent may include a phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl, a phenol polymer with formaldehyde, or a mixture thereof.

[0053] For example, the curing agent may include a phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl and a phenol polymer with formaldehyde. In this case, the viscosity and melt-ability properties can be further improved while maintaining the mechanical strength properties, such as the flexural strength, of the epoxy resin composition.

[0054] The above-mentioned hardener may be used having a hydroxyl equivalent of 90 to 300 g / eq, for example, 100 to 200 g / eq. If the hydroxyl equivalent is less than the above-mentioned range, moisture resistance reliability may be poor, and if it exceeds the above-mentioned range, curing property may be poor.

[0055] The above-mentioned hardener may be one having a softening point of 50 to 120°C, for example, 55 to 90°C. If the softening point is below the above-mentioned range, the caking property may be poor, and if it exceeds the above-mentioned range, the fluidity may be poor.

[0056] Based on the total weight of the epoxy resin composition, the content of the curing agent may be 2 to 20 wt%, for example, 2 to 10 wt%. If the content of the curing agent is less than the above-mentioned range, curability and formability may be reduced, and if it exceeds the above-mentioned range, the reliability of the semiconductor may be deteriorated and the strength may be reduced due to an increase in moisture absorption.

[0057]

[0058] filling

[0059] The epoxy resin composition of the present invention includes a filler. The filler improves the mechanical properties (e.g., strength) of the epoxy resin composition and reduces moisture absorption.

[0060] As the above-mentioned filler, any inorganic filler commonly used in the field of electronic materials can be used without any particular restrictions. For example, inorganic fillers such as silica, silica nitride, alumina, aluminum nitride, and boron nitride can be used, and these can be used alone or in combination of two or more.

[0061] The shape of the above filler is not particularly limited, and both angular and spherical shapes can be used. Non-limiting examples of fillers that can be used in the present invention include natural silica, synthetic silica, and fused silica, and for example, spherical silica particles can be used.

[0062] The above filler may include two or more types of fillers having different particle sizes to improve mechanical properties. In this case, the moldability and workability of the epoxy resin composition can be further improved. For example, the filler may have an average particle size (D 50) is 3.5 to 20 um, for example 3.5 to 15 um, and the first filler and the average particle diameter (D 50 ) may include a second filler having a thickness of 0.1 to 3 um, for example, 0.1 to 1 um.

[0063] Based on the total weight of the epoxy resin composition, the content of the filler may be 50 to 90 wt%, for example, 70 to 90 wt%. If the content of the filler is less than the aforementioned range, the moisture absorption of the cured product may increase, which may lower the reliability of the semiconductor device. If the content exceeds the aforementioned range, the fluidity may be reduced, resulting in poor formability.

[0064]

[0065] organosiloxane

[0066] The epoxy resin composition of the present invention may include an organosiloxane to improve dispersibility. The organopolysiloxane is a linear organosiloxane having a symmetrical structure with epoxy groups at both ends. By using an organopolysiloxane having such a structure, an epoxy resin composition for molding with excellent spreadability and swelling suppression properties can be provided.

[0067] The above organosiloxane has a symmetrical linear molecular structure, and thus has high compatibility with an epoxy resin composition, particularly an epoxy resin composition including a biphenyl-based epoxy resin. In addition, the organosiloxane has reactive epoxy groups at both ends, and thus can participate in a cross-linking curing reaction between the epoxy resin and the phenol curing agent as a reactive diluent, thereby effectively dispersing the epoxy resin composition. As a result, by lowering the surface tension of the molten epoxy resin composition, the phenomenon of internal bubbles in the cured epoxy resin composition swelling can be suppressed, and the viscosity of the molten epoxy resin composition can be lowered, thereby improving formability. In addition, the organosiloxane can maintain the adhesiveness of the epoxy resin composition, while improving meltability and swelling suppression characteristics.

[0068] For example, the organosiloxane may be represented by the following chemical formula 1.

[0069] [Chemical Formula 1]

[0070]

[0071] In the above chemical formula 1,

[0072] EP is an epoxy group,

[0073] R1 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms,

[0074] R2 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms,

[0075] a is an integer from 1 to 5,

[0076] n is an integer from 1 to 5.

[0077] For example, in the above formula, EP is an epoxy group, R1 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, R2 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, a is an integer from 1 to 5, and n is an integer from 1 to 5.

[0078] For example, in the above formula, EP is an epoxy group, R1 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, R2 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, a is an integer of 1 to 3, and n is an integer of 1 to 3.

[0079] For example, in the above formula, EP is an epoxy group, R1 is a methyl group, R2 is a methyl group, a is 1, and n is 3.

[0080] The above organosiloxane may be used having a molecular weight of 300 to 800 g / mol, for example, 300 to 500 g / mol, and a viscosity (25°C) of 0.005 to 1 Pa·s, for example, 0.05 to 0.1 Pa·s. When an organosiloxane with a low molecular weight and low viscosity within the aforementioned range is used, it is advantageous for mixing with an epoxy resin composition, thereby exhibiting high dispersibility. When the molecular weight or viscosity exceeds the aforementioned range, the compatibility between the epoxy resin composition and the organosiloxane may decrease, resulting in a deteriorated dispersibility effect and appearance defects such as flow marks.

[0081] As another example, the organosiloxane may be a symmetrical disiloxane having alicyclic epoxy groups at both ends. By using an organosiloxane having such a structure, an epoxy resin composition for molding with excellent dispersibility, flowability, and thermal conductivity can be provided. The epoxy group included in the organosiloxane structure participates in the curing reaction of epoxy and phenol, thereby reducing side effects such as a decrease in strength and the occurrence of flow marks that occur when adding conventional organosiloxane compounds. In particular, by including an alicyclic epoxy group, the phenomenon of a lowering of the glass transition temperature when using an organosiloxane with a linear structure can be prevented. In addition, an organosiloxane with a symmetrical structure has a structural similarity to a crystalline epoxy resin, enabling crosslinking with the epoxy resin, thereby increasing dispersibility, enabling a higher filler content formulation design, and thereby improving the thermal conductivity of the epoxy resin composition for molding.

[0082] For example, the organosiloxane may be represented by the following chemical formula 2.

[0083] [Chemical Formula 2]

[0084]

[0085] In the above chemical formula 2,

[0086] R1 is an alicyclic epoxy having 5 to 10 carbon atoms,

[0087] R2 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms,

[0088] R3 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms,

[0089] a is an integer from 1 to 10.

[0090] For example, in the above formula, R1 is an alicyclic epoxy having 5 to 10 carbon atoms, R2 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, R3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 10.

[0091] For example, in the above formula, R1 is an alicyclic epoxy having 5 to 7 carbon atoms, R2 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, R3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, and a is an integer of 1 to 5.

[0092] For example, in the above formula, R1 is an alicyclic epoxy having 6 carbon atoms, R2 is a methyl group, R3 is a methyl group, and a is 2.

[0093] For example, the organosiloxane may be represented by the following chemical formula 3.

[0094] [Chemical Formula 3]

[0095]

[0096] The above organosiloxane may be used having a molecular weight of 200 to 800 g / mol, for example, 250 to 450 g / mol, and a viscosity (at 25°C) of 5 to 1,000 mPa·s, for example, 10 to 200 mPa·s. If the molecular weight is less than the above-mentioned range, the formability may be reduced, and if it exceeds the above-mentioned range, the flowability may be reduced. If the viscosity exceeds the above-mentioned range, the flowability may be reduced.

[0097] Based on the total weight of the epoxy resin composition, the content of the organosiloxane may be 0.05 to 5 wt%, for example, 0.1 to 3 wt%. If the content of the organosiloxane is less than the above-mentioned range, the effects of improving meltability and suppressing swelling may be limited, and if it exceeds the above-mentioned range, the reliability and strength of the epoxy resin composition may be reduced.

[0098]

[0099] additives

[0100] The epoxy resin composition of the present invention may additionally include additives commonly used in molding compositions. Non-limiting examples of usable additives include ion catchers, catalysts, coupling agents, colorants, and release agents.

[0101] The ion scavenger reduces corrosion by capturing and removing impurity ions, and inorganic ion exchangers such as magnesium aluminum hydroxide carbonate hydrate can be used. The catalyst promotes the curing reaction, and imidazole compounds, naphthalene latent catalysts, amine compounds, organometallic compounds, organophosphorus compounds, boron compounds, etc. can be used. The coupling agent promotes the bonding between inorganic and organic substances, and amino silane, epoxy silane, etc. can be used. The colorant is added to give color to the resin composition, and carbon black, Bengala, etc. can be used as the colorant. The release agent is added to secure the releasability between the cured epoxy resin composition and the mold, and the release agent can be paraffin wax, carnauba wax, polyethylene wax, ester wax, etc.

[0102] The above additives may be added within a content range known in the relevant technical field, and for example, may be included in an amount of 0.01 to 5 wt%, respectively, based on the total weight of the epoxy resin composition, but is not limited thereto.

[0103]

[0104] The epoxy resin composition according to the present invention can be produced by a conventional method known in the art, for example, a melt mixing method using a semi-bar mixer, a kneader, a roll, a single-screw or twin-screw extruder, and a con-kneader.

[0105] The epoxy resin composition of the present invention can be manufactured in powder form, granule form, etc. In particular, the epoxy resin composition according to the present invention has excellent swelling inhibition properties, so it can be manufactured in granule form and applied to a compression molding method.

[0106] For example, in the case of a powder-type or granular epoxy resin composition, the components as described above are uniformly mixed, melted and mixed at a temperature of 80 to 130°C using a heat kneader, cooled to room temperature, pulverized into a powder state, and then subjected to a sieving process, but the present invention is not limited thereto.

[0107]

[0108] Semiconductor devices and automotive components

[0109] The present invention provides a semiconductor device molded using the epoxy resin composition described above. The semiconductor device may be a transistor, a diode, a microprocessor, a semiconductor memory, a power semiconductor, or the like.

[0110] In addition, the present invention provides a vehicle component molded using the epoxy resin composition described above. For example, the epoxy resin composition described above can be used as a molding material to fix and seal components within the vehicle component. Specifically, a permanent magnet can be inserted into a hollow space formed within a rotor core of a vehicle motor, and the epoxy resin composition of the present invention can be filled between the hollow space and the permanent magnet to fix the permanent magnet within the rotor core.

[0111] A method for molding a semiconductor device or a vehicle part using the epoxy resin composition of the present invention can be appropriately selected and performed according to a conventional method in the relevant technical field, such as transfer molding, compression molding, or injection molding.

[0112]

[0113] Hereinafter, the present invention will be described in more detail through examples. However, the following examples are intended only to aid understanding of the present invention and are not intended to limit the scope of the present invention in any way.

[0114]

[0115] [Experimental Example 1-15]

[0116] After mixing each component according to the composition described in Tables 1 and 2 below, the mixture was melt-mixed at a temperature of 100 to 130°C using a melt kneader, cooled to room temperature, pulverized into a powder state, and then subjected to a sieving process to produce a granular epoxy resin composition for each experimental example.

[0117] Using the epoxy resin composition of each experimental example, a compression molding process was performed under the process conditions of Tables 1 and 2 below. In Tables 1 and 2 below, GT is the gel time of the epoxy resin composition for molding, VT is the time for the mold to be closed and the epoxy resin composition for molding to be melted in a vacuum state, CT is the sum of the time for the upper press of the compression mold (C-mold) to move to the packing position and the pressure application time, am.

[0118]

[0119]

[0120]

[0121]

[0122] Epoxy resin 1: Multifunctional epoxy resin (Formaldehyde, polymer with 1,1'-biphenyl and phenol, glycidyl ether, Cas no. 1201169-35-8)

[0123] Epoxy resin 2: Biphenyl epoxy resin (4,4-Bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl))

[0124] Curing agent 1: Polyfunctional phenol resin (Phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl, Cas no. 0106466-55-1)

[0125] Curing agent 2: Phenol polymer with formaldehyde (Cas no. 9003-35-4)

[0126] Filler: Silicon dioxide

[0127] Organosiloxane 1: 1,3-Bis(3-(2,3-epoxypropoxy)propyl) 1,1,3,3-tetramethyldisiloxane

[0128] Organosiloxane 2: 3-[2-(3,4-epoxycyclohexyl)ethyl]-heptamethyltrisiloxane

[0129] Catalyst: 5-Methyl-2-phenylimidazole-4-methanol

[0130] Ester wax

[0131]

[0132] [Physical property evaluation]

[0133] The physical properties of the epoxy resin composition manufactured in each experimental example were measured as follows, and the results are shown in Tables 3 and 4 below.

[0134]

[0135] spreading

[0136] As illustrated in Fig. 1, the epoxy resin composition (6.0 g) manufactured according to each experimental example was dispensed over a narrow area on a release film, and compression molded using compression molding equipment at a temperature of 175°C, a maximum pressure of 30 tons, a compression time of each experimental example according to Tables 1 and 2, and a cure time of 120 s, and then the spreading area over which the epoxy resin composition was melted was measured. The spreading area ratio was calculated using the following formula, and the meltability of the epoxy resin composition was evaluated.

[0137]

[0138]

[0139] Swelling

[0140] As illustrated in Fig. 2, the epoxy resin compositions manufactured according to each experimental example were compression-molded using compression molding equipment at a temperature of 175°C, a maximum pressure of 30 tons, a compression time of each experimental example according to Tables 1 and 2, and a cure time of 120 s. Then, it was checked whether the epoxy resin composition for molding overflowed out of the cavity due to a swelling phenomenon during the compression-molding process. The swelling characteristics of the epoxy resin compositions were evaluated using the following formula.

[0141]

[0142] M O : Amount of epoxy resin composition for molding (g)

[0143] △M: M O - Amount (g) of epoxy resin composition for molding leaked during compression molding

[0144]

[0145]

[0146]

[0147]

[0148] As shown in Table 3-4 above, the epoxy resin composition having an r value according to the present invention exhibited excellent spreadability and swelling inhibition properties. On the other hand, the epoxy resin composition having an r value outside the range of the present invention exhibited poor spreadability and swelling inhibition properties in at least one of the properties.

[0149]

[0150] The present invention provides an epoxy resin composition for molding having excellent spreading and swelling inhibition properties and a semiconductor device molded using the same.

Claims

1. An epoxy resin composition for molding having an r value of more than 4 and less than 6 according to the following formula 1: [Formula 1] In the above formula, GT is the gel time of the epoxy resin composition for molding, VT is the time for the mold to close and melt the epoxy resin composition for molding under vacuum. CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the pressure application time.

2. An epoxy resin composition for molding in the first paragraph, wherein the GT is 25 to 200 seconds, the VT is 2 to 15 seconds, and the CT is 8 to 30 seconds.

3. In the first paragraph, it comprises an epoxy resin, a hardener and a filler, The epoxy equivalent weight (EEW) of the above epoxy resin is 100 to 500 g / eq, and the softening point is 30 to 150°C, An epoxy resin composition for molding, wherein the hydroxyl equivalent of the above-mentioned hardener is 90 to 300 g / eq and the softening point is 50 to 120°C.

4. In the third paragraph, further comprising an organosiloxane An epoxy resin composition for molding, wherein the above organosiloxane is a linear organosiloxane having a symmetrical structure having epoxy groups at both terminals.

5. In the fourth paragraph, the epoxy resin composition for molding, wherein the organosiloxane is represented by any one of the following chemical formulas 1 to 3: [Chemical Formula 1] In the above chemical formula 1, EP is an epoxy group, R1 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, R2 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, a is an integer from 1 to 5, n is an integer from 1 to 5, [Chemical Formula 2] In the above chemical formula 2, R1 is an alicyclic epoxy having 5 to 10 carbon atoms, R2 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, R3 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, a is an integer from 1 to 10, [Chemical Formula 3] .

6. In the fifth paragraph, the organosiloxane is represented by the chemical formula 1, has a molecular weight of 300 to 800 g / mol, and a viscosity (25°C) of 0.005 to 1 Pa·s, or An epoxy resin composition for molding, wherein the above organosiloxane is represented by the above chemical formula 2, has a molecular weight of 200 to 800 g / mol, and a viscosity (25° C.) of 5 to 1,000 mPa·s.

7. An epoxy resin composition for molding, comprising 2 to 20 wt% of the epoxy resin, 2 to 20 wt% of the curing agent, 50 to 90 wt% of the filler, and 0.05 to 5 wt% of the organosiloxane, based on the total weight of the epoxy resin composition in paragraph 4.

8. A semiconductor device molded using an epoxy resin composition for molding according to any one of claims 1 to 7.

Images