Anti-deformation grinding member with electroplated single-layer diamond, grinding ring and special-shaped grinding wheel

Abstract

An anti-deformation grinding member with electroplated single-layer diamond, a grinding ring and a special-shaped grinding wheel. The anti-deformation grinding member comprises a grinding layer (1) and a grinding member base (2), wherein the grinding layer (1) is fixedly bonded to the grinding member base (2); and the grinding layer (1) is a plated layer of single-layer diamond abrasive particles. The length of a cross section of the grinding layer (1) from one side corresponding to the minimum axial machining allowance of a workpiece to the other side is equal to the thickness of the grinding layer (1); and the length of a cross section of the grinding layer (1) from one side corresponding to another axial point of the workpiece to the other side is equal to the machining allowance of an axial point / the minimum machining allowance×the thickness of the grinding layer. The longer the length of the circumferential corresponding grinding layer, the more the diamond abrasive particles contained in the grinding layer, and thus the higher the wear resistance; and the grinding layer corresponds to a part with a large machining allowance. The shorter the length of the circumferential corresponding grinding layer, the fewer the diamond abrasive particles contained in the grinding layer, and thus the lower the wear resistance; and the grinding layer corresponds to a part with a small machining allowance. By means of adjusting the circumferential length of the grinding layer corresponding to each axial point of a workpiece, the uniform wear of the grinding member is realized, and the shape of the outer peripheral surface of a special-shaped grinding wheel remains unchanged during machining.

Description

Electroplated single-layer diamond anti-deformation grinding piece, grinding ring and special-shaped grinding wheel TECHNICAL FIELD

[0001] The present application relates to the technical field of diamond grinding wheel, in particular to an electroplated single-layer diamond anti-deformation grinding piece, a grinding ring and a special-shaped grinding wheel. BACKGROUND

[0002] The diamond special-shaped grinding wheel is used for a rotary special-shaped surface of a required grinding surface shape profile curve of a workpiece, and the machining allowances of each point of the outer periphery grinding surface of the grinding wheel in the axial direction are not equal, so that the outer periphery grinding surface of the grinding wheel in the axial direction is easily caused to correspond to different machining amounts to cause different abrasions, i.e., deformation phenomenon.

[0003] At present, the diamond special-shaped grinding wheel is mainly manufactured by using a powder metallurgy, a ceramic, a brazing and an electroplating binder. If the diamond special-shaped grinding wheel is a surface inlaid type, although the diamond special-shaped grinding wheel has a shape preserving property, the service life of the diamond special-shaped grinding wheel is short, and the sharpness of the diamond special-shaped grinding wheel is easily exponentially decreased and invalid due to the abrasion of the diamond, so that the effective service life of the diamond special-shaped grinding wheel is short. If the diamond special-shaped grinding wheel is a pregnant inlaid type, the establishment of the anti-deformation ability is usually solved by using different formulations of each part or by a functional structure. In the traditional special-shaped grinding wheel, the solid processing area of the grinding ring can be formed by a one-time forming mode or various spliced forming modes, but the two modes have the problems of complex mold, difficult to guarantee the consistency of the solid density and difficult to quantify the anti-deformation effect, and the problems of complicated processing technology, high manufacturing cost and the like are difficult to solve. SUMMARY

[0004] The present application provides an electroplated single-layer diamond anti-deformation grinding piece, a grinding ring and a special-shaped grinding wheel, and aims to solve the problems in the prior art.

[0005] The technical scheme for solving the above technical problems is as follows:

[0006] The application discloses a plated single-layer diamond anti-deformation grinding piece, which comprises a grinding layer and a grinding piece base body, wherein the grinding layer is fixed on the grinding piece base body; the grinding layer is a plated layer of single-layer diamond abrasive grains; the cross-section length of the grinding layer from one side to the other side of the minimum machining allowance of a workpiece corresponds to the thickness of the grinding layer; and the cross-section length of the grinding layer from one side to the other side of each point of the workpiece corresponds to the machining allowance of the point / the minimum machining allowance multiplied by the thickness of the grinding layer.

[0007] Based on the technical scheme, the application further has the following improvements.

[0008] Further, the grinding layer and the grinding piece base body are respectively in an arc-shaped sheet structure.

[0009] The grinding piece base body is in the same shape as the grinding layer, so that the grinding piece base body is convenient to assemble, and the strength and stability of the grinding layer are ensured, and subsequent processing is facilitated.

[0010] Further, the grinding end faces of the grinding layer and the grinding piece base body are respectively in an arc-shaped or trapezoidal structure.

[0011] The grinding layer is in the same shape as the workpiece to be processed (trapezoidal), so that the workpiece is conveniently processed; meanwhile, the grinding piece base body is in the same shape as the grinding layer, so that the grinding piece base body is convenient to assemble, and the strength and stability of the grinding layer are ensured, and subsequent processing is facilitated.

[0012] Further, the two ends of the grinding piece base body are fixedly connected with assembling plates.

[0013] The grinding piece base body is in the same shape as the grinding layer, so that the grinding piece base body is convenient to assemble, and the strength and stability of the grinding layer are ensured, and subsequent processing is facilitated.

[0014] Further, the grinding layer is located on one side of the circumference of the grinding element base.

[0015] The beneficial effect of the further scheme is that the grinding layer and the grinding element base are distributed reasonably, and the consolidation strength of the grinding layer is ensured.

[0016] The application also relates to a grinding ring comprising a plurality of functional plates and a plurality of electroplated single-layer diamond anti-deformation grinding elements as described above, the plurality of functional plates and the plurality of grinding element bases are alternately distributed in a circle to form a circular ring, and one side of the plurality of grinding element bases extends to the outside of the corresponding side of the plurality of functional plates.

[0017] The beneficial effect of the further scheme is that the grinding ring provided by the application has simple grinding element structure and reasonable design, can realize equal consumption of the grinding element, ensure that the grinding surface shape of the grinding element does not change in the whole machining process, and can be easily manufactured in large scale.

[0018] Further, the plurality of functional plates are respectively provided with water supply channels, the plurality of water supply channels respectively extend along the radial direction of the circular ring, and the two ends of the water supply channels are respectively open; at least one chip removal water channel is arranged on each side of each functional plate along the radial direction of the circular ring, and each chip removal water channel is in communication with the water supply channel on the functional plate.

[0019] The beneficial effect of the further scheme is that the structure of the functional plate is reasonably designed, the water supply channel can realize continuous internal cooling during the machining process of the workpiece, and the plurality of chip removal water channels can realize rapid chip removal, and the machining quality of the workpiece is ensured.

[0020] Further, a plurality of chip removal water channels are evenly and separately arranged on each side of each functional plate along the radial direction of the circular ring, and the plurality of chip removal water channels on each side of each functional plate are alternately and staggeredly distributed.

[0021] The beneficial effect of the further scheme is that the chip removal water channels on the two sides of the functional plate are reasonably distributed, which can realize chip removal during the machining process of the workpiece, and can also abut against the grinding element to assist in supporting the grinding element, ensure the strength of the grinding element, prolong the service life of the grinding element, and reduce the cost.

[0022] The application also relates to a special-shaped grinding wheel, which comprises a grinding wheel base body and a ring-shaped pressing plate, and further comprises a grinding ring as described above, a plurality of the functional plates and a plurality of the grinding piece base bodies are alternately distributed on the circumference of the grinding wheel base body in sequence; a ring-shaped step is arranged on the grinding wheel base body, the ring-shaped pressing plate is fixedly installed on the ring-shaped step, the outer side of the ring-shaped pressing plate tightly presses the plurality of functional plates, and a gap is arranged between the inner side of the ring-shaped pressing plate and the grinding wheel base body, and the inner side of the ring-shaped pressing plate and the grinding wheel base body form a cold water cavity which is in communication with the plurality of water supply channels respectively.

[0023] The beneficial effect of the further scheme is that the application further provides a special-shaped grinding wheel, which has simple structure and reasonable design, so that the consumption rates of each point on the outer circumferential surface of the grinding wheel are the same, equal shape consumption is achieved, and the anti-deformation function is realized.

[0024] In addition, the grinding wheel can be assembled in an automatic manner, the grinding wheel can realize grinding, cooling and chip removal at the same time, has good performance, is suitable for expansion or combination with various binders, and is convenient, easy, quantifiable and better in effect for anti-deformation of a complex grinding surface.

[0025] Further, the center of the grinding wheel base body is provided with an installation hole which penetrates up and down and is used for installing a center shaft.

[0026] The beneficial effect of the further scheme is that the structure is simple, and the installation hole is reasonably arranged to facilitate subsequent assembly. DETAILED DESCRIPTION

[0027] Fig. 1 is a schematic structural view of the grinding wheel in the first embodiment of the application;

[0028] Fig. 2 is an enlarged view of A in Fig. 1;

[0029] Fig. 3 is a top view of the grinding wheel in the first embodiment of the application;

[0030] Fig. 4 is a sectional view of B-B in Fig. 3;

[0031] Fig. 5 is a schematic structural view of the circumference of the grinding wheel in the first embodiment of the application;

[0032] Fig. 6 is an enlarged view of C in Fig. 5;

[0033] Fig. 7 is a schematic structural view of a workpiece to be processed and a machining allowance in the first embodiment of the application;

[0034] Fig. 8 is a schematic structural view of the circumferential length of the grinding layer in the first embodiment of the application;

[0035] Fig. 9 is a schematic structural view of the grinding wheel in the second embodiment of the application;

[0036] Fig. 10 is an enlarged view of F in Fig. 9;

[0037] Fig. 11 is a top view of the grinding wheel of the second embodiment of the present application;

[0038] Fig. 12 is a sectional view of G-G in Fig. 11;

[0039] Fig. 13 is a structural schematic view of the circumference of the grinding wheel of the second embodiment of the present application;

[0040] Fig. 14 is an enlarged view of H in Fig. 13;

[0041] Fig. 15 is a structural schematic view of the workpiece to be processed and the processing allowance of the second embodiment of the present application;

[0042] Fig. 16 is a structural schematic view of the circumferential length of the grinding layer when assembled in the second embodiment of the present application;

[0043] Fig. 17 is an assembly view of the grinding wheel base, the single grinding element and the functional plate of the present application;

[0044] Fig. 18 is an enlarged view of D in Fig. 17;

[0045] Fig. 19 is an assembly view of the grinding wheel base and the single functional plate of the present application;

[0046] Fig. 20 is an enlarged view of E in Fig. 19;

[0047] Fig. 21 is a structural schematic view of the single grinding element of the present application;

[0048] Fig. 22 is a partial sectional view of the single grinding element of the present application;

[0049] Fig. 23 is a structural schematic view of the single functional plate of the present application.

[0050] In the drawings, the components represented by the respective reference numerals are listed as follows:

[0051] 1. grinding layer; 2. grinding element base; 3. assembly plate; 4. functional plate; 5. water supply channel; 6. chip removal water channel; 7. grinding wheel base; 8. annular pressing plate; 9. cold water cavity; 10. mounting hole; 11. workpiece; 12. fixing seat. DETAILED DESCRIPTION

[0052] It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0053] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" and the like can be explicitly or implicitly included one or more. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0054] In the description of the present application, it needs to be understood that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0055] The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0056] Embodiment 1

[0057] As shown in FIGS. 1 to 23, the present embodiment provides an electroplated single-layer diamond anti-deformation grinding piece, which comprises a grinding layer 1 and a grinding piece substrate 2, the grinding layer 1 is fixed on the grinding piece substrate 2; the grinding layer 1 is a plating layer of single-layer diamond abrasive particles; the cross-sectional length of the grinding layer 1 from one side to the other side corresponding to the minimum machining allowance of the workpiece in the axial direction is one time the thickness of the grinding layer 1; the cross-sectional length of the grinding layer 1 from one side to the other side corresponding to each point in the axial direction of the workpiece is: the machining allowance / the minimum machining allowance x the thickness of the grinding layer.

[0058] It needs to be noted that the cross-sectional length of the grinding layer 1 from one side to the other side corresponding to the minimum machining allowance of the workpiece in the axial direction refers to the circumferential length of the grinding layer 1 after being assembled into a special-shaped grinding wheel, that is, the machining allowance indicated in FIG. 8 and FIG. 16.

[0059] Based on the above scheme, the grinding layer 1 is a plating layer of single-layer diamond abrasive particles, the manufacturing process is simple, and it is suitable for large-scale production.

[0060] In addition, the material of the grinding element base 2 can be selected from various materials on which electroplating or electroless plating can be performed, which facilitates the grinding element to be suitable for various application scenarios.

[0061] During the machining of the workpiece 11, the grinding layer 1 and the grinding element base 2 are consumed synchronously.

[0062] The design method of the circumferential surface of the grinding element in the embodiment is as follows:

[0063] S1, setting and calculation:

[0064] The minimum machining allowance of the workpiece is A0, and the machining amounts of the other points in the axial direction are A1, A2, A3, … A n , respectively. n A0 represents the machining allowance of any point.

[0065] The particle size of the diamond abrasive grains is b.

[0066] The reference surface (line) of the grinding element is located on the outer surface of the circumferential surface of the grinding layer, and the reference surface (line) passes through the axis of the grinding wheel base in the radial direction.

[0067] The point corresponding to A0 on the grinding end is located on the reference surface in the radial direction.

[0068] Obviously, the circumferential length L0 of the grinding layer corresponding to the point A0 is equal to the thickness of the grinding layer and is equal to b.

[0069] The circumferential length of the outer surface of the grinding layer required by any other point is L n : L n = A n / A0×b / K,

[0070] wherein L n is the circumferential length of the outer surface of the grinding layer corresponding to the point A n ; K is an adjustment coefficient, which involves factors such as the lengthening of the circumferential length of the outer surface of the grinding layer after the bending of the grinding layer, i.e., the superposition effect of the diamond abrasive grains when the single layer becomes “multi-layer”, and K is greater than or equal to 1. θ n = arccos(b / L n ),

[0071] wherein θ n is the angle between the bending of the outer surface of the grinding layer and the reference surface when L n is achieved.

[0072] S2, calculation:

[0073] According to the machining allowances A n, take a plurality of points including key points (including but not limited to minimum machining amount, maximum machining amount, inflection point, end point, curve intersection point, etc.) to calculate L n , θ n ;

[0074] In the absence of test experiments, the value of K is 1.0-1.1; the optimized value needs to be obtained through test experiments;

[0075] S3, drawing

[0076] Smoothly connecting the end points of L n , the curved graph required by the outer surface of the grinding layer can be obtained;

[0077] S4, according to the requirements of the grinding wheel, draw the manufacturing process diagram and process file of the grinding piece, and complete the design;

[0078] The manufacturing process route of the product, an electroplated single-layer diamond special-shaped grinding wheel, is as follows:

[0079] I. According to the process file, manufacture the grinding piece base; prepare each part of the grinding wheel;

[0080] II. Plating processing of the grinding layer;

[0081] III. Processing of the grinding piece (including bending processing of the grinding layer, solidification);

[0082] IV. Assembly of each part is completed;

[0083] V. Grinding wheel shaping, blade processing, dynamic balance adjustment;

[0084] VI. Forming of the electroplated single-layer diamond special-shaped grinding wheel.

[0085] The grinding piece provided by the embodiment has simple structure and reasonable design, can realize equal shape consumption of the grinding piece, ensures that the grinding surface shape of the grinding piece does not change in the entire processing process; at the same time, the grinding piece is easy to manufacture in large scale, the single-layer diamond abrasive grain mode makes the electroplating process easy to control and low in cost; in addition, the grinding wheel adopts the assembly mode and can be suitable for automatic mode, the grinding wheel can realize grinding, cooling and chip removal at the same time, has good performance, is suitable for expansion or combination to various binders, is suitable for implementing anti-deformation on the grinding surface with complex shape, and is more convenient, easy, quantifiable and better in effect.

[0086] Embodiment 2

[0087] On the basis of embodiment 1, as shown in FIGS. 1-7, in the embodiment, the grinding layer 1 and the grinding piece base 2 respectively have an arc-shaped sheet structure.

[0088] The shape of the grinding piece base 2 is consistent with the grinding layer 1, assembly is convenient, and the strength and stability of the grinding layer 1 are ensured, which is convenient for subsequent processing.

[0089] In assembly, the plurality of grinding elements are circumferentially distributed, at which time each grinding layer 1 and the grinding element base 2 are respectively bent along the circumferential direction to form an arc-shaped sheet structure.

[0090] Embodiment 3

[0091] In this embodiment, on the basis of Embodiment 2, the grinding end faces of the grinding layer 1 and the grinding element base 2 are respectively arc-shaped or trapezoidal structures.

[0092] The shape of the grinding layer 1 is consistent with the shape (arc-shaped or trapezoidal) of the workpiece 11 to be processed, so as to process the workpiece; at the same time, the shape of the grinding element base 2 is consistent with the grinding layer 1, which is convenient for assembly and ensures the strength and stability of the grinding layer 1, facilitating subsequent processing.

[0093] Based on the above scheme, when each grinding layer 1 and the grinding element base 2 are assembled to form a special-shaped grinding wheel, they are bent along the circumferential direction of the grinding wheel to form an arc-shaped sheet structure; then the outer side of the grinding layer 1 and the grinding element base 2, i.e. the side away from the center axis of the grinding wheel, is concave to form an arc-shaped or trapezoidal structure consistent with the shape of the workpiece 11 to be processed.

[0094] The specific scheme of the arc-shaped or trapezoidal structure of the grinding end faces of the grinding layer 1 and the grinding element base 2 is as follows:

[0095] Scheme 1: As shown in FIGS. 1-8, the grinding wheel provided in this embodiment is a circular arc wheel (i.e. a PE wheel):

[0096] In this embodiment, the shapes of the grinding end faces of the grinding layer 1 and the grinding element base 2 are both circular arc-shaped (also known as PE-shaped) structures.

[0097] The grit size of the grinding layer 1 is 70 / 80 (70#) with a particle size of 0.212 mm;

[0098] The workpiece conditions and requirements in this embodiment are as follows: the workpiece thickness is 10 mm, the arch height is 3 mm, and the minimum processing allowance is 2 mm;

[0099] The maximum processing allowance of the workpiece can be calculated as 2+3=5 (mm);

[0100] The specific parameters are shown in the following table:

[0101] As shown in FIG. 7, the processing allowance indicated at the left end of the workpiece refers to the amount of the workpiece to be ground, and the size indicated at the right end of the workpiece refers to the processing allowance of each point in the axial direction of the workpiece, with the unit being mm. The processing allowance gradually increases from the center line of the circumferential surface of the workpiece to both sides.

[0102] As shown in FIG. 8, the particle size of a single abrasive grain is indicated at the left end of the grinding element, and the L nThe size corresponds to the machining allowance of each point of the workpiece, the design is reasonable, and equal deformation of the grinding piece during grinding is realized.

[0103] In the embodiment, the minimum machining allowance point of the workpiece is on the thickness center line of the workpiece.

[0104] The shape of the grinding layer 1 and the grinding piece base 2 at the grinding end (i.e. on the outer peripheral grinding surface) is the machining shape (i.e. PE shape) required by the workpiece, so as to machine the workpiece 11, and the shape of the grinding piece base 2 is consistent with the grinding layer 1, convenient to assemble, and ensures the strength and stability of the grinding layer 1, and facilitates subsequent machining.

[0105] Scheme two: as shown in FIGS. 9 to 16, the grinding wheel provided in the embodiment is a trapezoidal wheel (i.e. FA wheel):

[0106] In the embodiment, the shape of the grinding layer 1 and the grinding end of the grinding piece base 2 is trapezoidal (also called FA shape).

[0107] The grinding wheel provided in the embodiment is a trapezoidal wheel:

[0108] The grit size number in the grinding layer 1 is 70 / 80 (70#), and the particle size is 0.212 mm;

[0109] The workpiece conditions and requirements in the embodiment are: the thickness of the workpiece is 10 mm, the chamfer is 2x45°, and the minimum machining allowance is 2 mm;

[0110] The maximum machining allowance of the workpiece is calculated to be: 2+2=4 (mm);

[0111] As shown in FIG. 15, the machining allowance indicated at the left end of the workpiece refers to the amount to be ground of the workpiece, and the size indicated at the right end of the workpiece is the machining allowance of each point of the workpiece in the axial direction, with the unit of mm. The machining amount of the center line of the outer peripheral surface of the workpiece to one of the two sides gradually increases.

[0112] As shown in FIG. 16, the particle size of a single abrasive grain is indicated at the left end of the grinding piece, and L n The size corresponds to the machining allowance of each point of the workpiece, the design is reasonable, and equal deformation of the grinding piece during grinding is realized.

[0113] In the embodiment, the minimum machining allowance point of the workpiece is on the thickness center line of the workpiece.

[0114] In the embodiment, the minimum machining allowance point of the workpiece is on the thickness center line of the workpiece, and the machining allowance is equal within the range of 6 mm in the axial direction.

[0115] The shape of the grinding layer 1 and the grinding element base 2 at the grinding face end (i.e. on the outer peripheral grinding face) is the machining shape (i.e. the FA shape) required by the workpiece, so as to machine the above-mentioned workpiece 11, while the shape of the grinding element base 2 is consistent with the grinding layer 1, facilitating assembly, and ensuring the strength and stability of the grinding layer 1, facilitating subsequent machining.

[0116] Embodiment 4

[0117] On the basis of the above-mentioned embodiments, in the present embodiment, the two ends of the grinding element base 2 are fixedly connected with the assembly plates 3.

[0118] This scheme has simple structure and reasonable design, and the assembly plates 3 can be used to realize quick assembly of the grinding element base 2, facilitating assembly.

[0119] Preferably, in the present embodiment, the above-mentioned two assembly plates 3 are preferably long strip-shaped structures, which respectively extend along the direction from one side to the other side of the grinding element base 2.

[0120] The above-mentioned two assembly plates 3 are respectively provided separately from the functional plates 4, or can be integrally formed with the functional plates 4.

[0121] Embodiment 5

[0122] On the basis of the above-mentioned embodiments, in the present embodiment, the grinding layer 1 is located at one side of one side of the grinding element base 2.

[0123] The grinding layer 1 and the grinding element base 2 are reasonably distributed, ensuring smooth machining of the workpiece.

[0124] Embodiment 6

[0125] On the basis of the above-mentioned embodiments, as shown in FIGS. 17 to 23, the present embodiment further provides a grinding ring, which comprises a plurality of functional plates 4 and a plurality of the above-mentioned electroplated single-layer diamond anti-deformation grinding elements, the plurality of functional plates 4 and the plurality of grinding element bases 2 are alternately distributed in a circle to form a circular ring, and one side of the plurality of grinding element bases 2 extends to the outside of the corresponding side of the plurality of functional plates 4.

[0126] The present embodiment further provides a grinding ring, which has simple structure and reasonable design, can realize equal consumption of the grinding elements, ensures that the shape of the grinding face does not change during the entire machining process, is easy to mass-produce, has single-layer diamond abrasive grains, makes the electroplating process easy to control and low in cost, can be automatically processed in a group assembly mode, can realize grinding, cooling and chip removal at the same time, has good performance, is suitable for expansion or combination with various binders, and is more convenient, easy, quantifiable and effective for anti-deformation of the grinding face with complex shape.

[0127] Preferably, in the embodiment, the two sides of each functional plate 4 at both ends are respectively attached to the two assembly plates 3 at both ends of the corresponding two grinding element substrates 2.

[0128] In addition, each functional plate 4 has a structure of being narrow on the inner side and wide on the outer side.

[0129] Preferably, in the embodiment, the thickness H (mm) of the plated layer in the grinding layer 1 is greater than, equal to, or less than the particle size b (mm) of the diamond abrasive particles, and the thickness of the plated layer of all the grinding elements in the grinding ring is selected to be consistent. The process of electroplating the binder is easy to realize automatic control, and the performance of the binder is balanced and stable relative to other binders, and the diamond concentration is relatively fixed at about 50% by volume. Under the above basic conditions, it is suitable for quantitative design.

[0130] Embodiment 7

[0131] On the basis of Embodiment 5, in the embodiment, a plurality of water supply channels 5 are respectively arranged in the plurality of functional plates 4, the plurality of water supply channels 5 respectively extend along the radial direction of the circular ring, and both ends thereof are respectively open; at least one chip removal water channel 6 is arranged on each of the two sides of each functional plate 4 along the radial direction of the circular ring, and each chip removal water channel 6 is in communication with the water supply channel 5 on the functional plate 4.

[0132] The structure of the functional plate 4 is reasonable, and the use of the water supply channel 5 can realize continuous internal cooling during the machining of the workpiece, and the plurality of chip removal water channels 6 can realize rapid chip removal, thereby ensuring the machining quality of the workpiece 11.

[0133] The chip removal water channel 6 can be an empty space, but when the rigidity of the grinding element is insufficient, the functional plate 4 can be arranged between the grinding elements, the functional plate 4 abuts against the grinding element, and assists in supporting the grinding element. The composite structure is easy to implement, and is conducive to expanding various application conditions. In theory, under the condition of arranging the functional plate, the circumferential thickness of the grinding element substrate 2 can tend to or equal to 0, which can greatly reduce or eliminate the influence of the grinding element substrate material on the grinding performance.

[0134] Embodiment 8

[0135] On the basis of Embodiment 7, in the embodiment, a plurality of chip removal water channels 6 are uniformly and separately arranged on each of the two sides of each functional plate 4 along the radial direction of the circular ring, and the plurality of chip removal water channels 6 on each of the two sides of each functional plate 4 are distributed in sequence and staggered.

[0136] The distribution of the chip removal water channels 6 on the two sides of the functional plate 4 is reasonable, which can not only realize rapid chip removal during the machining of the workpiece, but also abut against the grinding element to assist in supporting the grinding element, thereby ensuring the strength of the grinding element, prolonging the service life of the grinding element, and reducing the cost.

[0137] Alternatively, the plurality of chip removal water channels 6 on both sides of each functional plate 4 can be distributed in sequence relative to each other, but the strength of the grinding piece in this scheme is not as good as the above scheme.

[0138] Embodiment 9

[0139] On the basis of any one of Embodiments 6 to 8, the present embodiment further provides a profiled grinding wheel, comprising a grinding wheel base 7 and a ring-shaped pressing plate 8, and further comprising a grinding ring as described above, a plurality of the functional plates 4 and a plurality of the grinding piece bases 2 are distributed in sequence and alternately on the circumference of the grinding wheel base 7; the grinding wheel base 7 is provided with a ring-shaped step, and the ring-shaped pressing plate 8 is fixedly installed on the ring-shaped step, the outer side of the ring-shaped pressing plate 8 tightly presses the plurality of the functional plates 4, and the inner side of the ring-shaped pressing plate 8 is provided with a gap with the grinding wheel base 7, and the inner side of the ring-shaped pressing plate 8 and the grinding wheel base 7 form a cold water cavity 9 which is in communication with the plurality of the water supply channels 5 respectively.

[0140] The present embodiment further provides a profiled grinding wheel, which has simple structure and reasonable design, so that the consumption rates of each point on the outer circumferential surface of the grinding wheel are the same to achieve equal shape consumption and realize the anti-deformation function.

[0141] In addition, the grinding wheel can be assembled and suitable for automatic mode, and the grinding wheel can realize grinding, cooling and chip removal at the same time, has good performance, is suitable for expansion or combination with various binders, and is more convenient, easy, quantifiable and better in effect for anti-deformation of complex grinding surfaces.

[0142] Preferably, in the present embodiment, the grinding wheel base 7 has a structure of being thin at the upper end and thick at the lower end.

[0143] In addition, a plurality of fixing seats 12 are fixedly installed on the ring-shaped step at uniform intervals along the circumferential direction, and the ring-shaped pressing plate 8 is fixedly connected with the plurality of fixing seats 12 through bolts.

[0144] Furthermore, the lower end of the inner side of the plurality of functional plates 4 is attached to the ring-shaped step, and the upper end of the inner side of the plurality of functional plates 4 is attached to the ring-shaped pressing plate 8, so as to realize stable assembly of the plurality of functional plates 4.

[0145] Based on the above scheme, the shape of the outer circumferential surface of the profiled grinding wheel is the same as the shape of the grinding surface required by the workpiece 11, which is beneficial to complete the profiled surface machining.

[0146] In addition, when the profile line of the required grinding surface of the workpiece is a straight line and parallel to the axis of the grinding wheel, the circumferential surface of the grinding piece is a plane; when the profile line of the required grinding surface of the workpiece is a curve, the circumferential surface of the grinding piece is a curved surface, so as to realize the anti-deformation function. This scheme is beneficial to forming machining and realizes the anti-deformation function of the profiled grinding wheel.

[0147] In the embodiment, a plurality of grinding elements are arranged on the outer circumferential surface of the grinding wheel base 7 in a ring shape to form a grinding ring; the outer circumferential surface of the grinding ring is provided with a special-shaped surface of a curve as a profile line of a required grinding surface shape of the workpiece 11; the outer circumferential surface end of the grinding ring where the grinding elements are located is a grinding end; the grinding elements are separated by water grooves for chip removal; and the grinding ring is fixed on the grinding wheel base 7 through fastening components to form a special-shaped grinding wheel, which is simple in structure, easy to implement, capable of realizing batch processing, and simple in process.

[0148] Embodiment 10

[0149] In the embodiment, the center of the grinding wheel base 7 is provided with an installation hole 10 penetrating upward and downward for installing a center shaft.

[0150] The structure of the scheme is simple, and the installation hole 10 is reasonably arranged to facilitate subsequent assembly.

[0151] During assembly, the driving element is fixedly connected with one end of the vertically arranged center shaft, and the other end of the center shaft extends into the installation hole 10 and is fixedly connected.

[0152] The grinding principle of the present application is as follows:

[0153] The consumption rates of each point on the outer circumferential surface of the grinding wheel are the same to achieve equal shape consumption and realize the anti-deformation function.

[0154] In addition, the grinding wheel can be assembled and applied in an automatic manner, and the grinding wheel can realize grinding, cooling and chip removal at the same time, has good performance, is suitable for expansion or combination with various binders, and is more convenient, easy, quantifiable and better in effect for implementing anti-deformation on a complex grinding surface.

[0155] The anti-deformation mechanism adopted by the present application is a general mechanism: according to the different machining allowances of each point on the outer circumferential surface of the grinding wheel, the number of diamond abrasive grains is different; the number of diamond abrasive grains on the corresponding position on the grinding element is large at a position with a large machining allowance, and the wear resistance is high; the number of diamond abrasive grains on the corresponding position on the grinding element is small at a position with a small machining allowance, and the wear resistance is low; thus, the consumption rates of each point on the outer circumferential surface of the grinding wheel tend to be the same to achieve equal shape consumption and realize the anti-deformation function.

[0156] The creativity of the present application lies in: according to the different machining allowances of each point on the grinding wheel, the circumferential surface of the grinding element is bent to adjust the circumferential length of the grinding layer on the grinding element at the corresponding points on the grinding end (the circumferential length of the grinding layer is in a proportional relationship with the number of diamond abrasive grains), so as to realize the anti-deformation function. The process is simple and easy to implement; the optimized scheme: the grinding element can be batch-produced in a planar manner, the plating layer is first completed, and then the bending, stretching, extruding and stamping processes are used to form the required, easily quantifiable, bent grinding element for different workpiece special-shaped requirements.

[0157] The beneficial effects of the present application are as follows:

[0158] (1) The grinding member is easy to manufacture in scale, in a single layer of diamond abrasive grain manner, so that the electroplating process is easy to control and low in cost;

[0159] (2) The grinding wheel can be assembled and suitable for automatic operation;

[0160] (3) The grinding wheel can realize grinding, cooling and chip removal at the same time, and has good performance.

[0161] (4) It is suitable for expansion or combination with various binders;

[0162] (5) It is convenient, easy, quantifiable and better in effect for implementing anti-deformation on a complex grinding surface, compared with the prior art.

[0163] It should be noted that the left end of the two workpieces 11 to be processed in FIG. 7 and FIG. 14 is the finished shape, and the right end is the unfinished shape.

[0164] It is apparent to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to encompass all changes falling within the meaning and scope of the equivalent elements of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

[0165] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.

[0166] The above is only the preferred embodiment of the present application, and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An electroplated single layer diamond anti-deformation grinding element, characterized by: The grinding layer (1) is a single-layer diamond abrasive grain plated layer, and the cross-sectional length of the grinding layer (1) from one side to the other side corresponding to the minimum machining allowance of the workpiece is one time of the thickness of the grinding layer (1); the cross-sectional length of the grinding layer (1) from one side to the other side corresponding to each point of the workpiece is: the machining allowance of the point / the minimum machining allowance x the thickness of the grinding layer.

2. The electroplated single layer diamond anti-deformation grinding element according to claim 1, characterized in that: The grinding layer (1) and the grinding element substrate (2) are respectively in an arc-shaped sheet structure.

3. The electroplated single layer diamond anti-deformation grinding element according to claim 2, characterized in that: The grinding end faces of the grinding layer (1) and the grinding element substrate (2) are respectively in an arc-shaped or trapezoidal structure.

4. The electroplated single layer diamond anti-deformation grinding element according to any one of claims 1 to 3, characterized in that: The two ends of the grinding element substrate (2) are fixedly connected with the assembly plates (3).

5. The electroplated single layer diamond anti-deformation grinding element according to any one of claims 1 to 3, characterized in that: The grinding layer (1) is located on one side of the circumferential side of the grinding element substrate (2).

6. A grinding ring characterized by: The plurality of functional plates (4) and the plurality of grinding element substrates (2) are alternately distributed in a circle to form a ring, and one side of the plurality of grinding element substrates (2) extends to the outside of the corresponding side of the plurality of functional plates (4).

7. The grinding ring of claim 6, wherein: The plurality of functional plates (4) are respectively provided with water supply channels (5), the plurality of water supply channels (5) respectively extend along the radial direction of the ring, and the two ends thereof are respectively open; at least one chip removal water channel (6) is arranged on each side of each functional plate (4) along the radial direction of the ring, and each chip removal water channel (6) is in communication with the water supply channel (5) on the functional plate (4).

8. The grinding ring of claim 7, wherein: A plurality of chip removal water channels (6) are uniformly and separately arranged on each side of each functional plate (4) along the radial direction of the ring, and the plurality of chip removal water channels (6) on each side of each functional plate (4) are alternately and staggeredly distributed.

9. A profiled grinding wheel comprising a grinding wheel base (7) and a ring-shaped platen (8), characterized in that: The grinding ring of any one of claims 7-8 is further included, the plurality of functional plates (4) and the plurality of grinding element substrates (2) are alternately distributed in a circle on the circumference of the grinding wheel substrate (7); the grinding wheel substrate (7) is provided with an annular step, the annular pressing plate (8) is fixedly installed on the annular step, the outer side of the annular pressing plate (8) tightly presses the plurality of functional plates (4), the inner side of the annular pressing plate (8) is provided with a gap with the grinding wheel substrate (7), and the inner side of the annular pressing plate (8) and the grinding wheel substrate (7) form a cold water cavity (9) in communication with the plurality of water supply channels (5).

10. The profiled abrasive wheel of claim 9, wherein: The center of the grinding wheel substrate (7) is provided with an installation hole (10) penetrating upward and downward for installing a center shaft.

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