Additive manufacturing method and additive manufacturing device

Abstract

This additive manufacturing method is a method for manufacturing an additively manufactured article W including a plurality of solidified layers 30 laminated in one direction and including a first hole 40 provided in the plurality of solidified layers 30. The method comprises: supplying a raw material powder F to form a powder bed 20; scanning a beam B on the powder bed 20 to form a solidified layer 30; and measuring the contour shape of the first hole 40 in the solidified layer 30. In the forming of the solidified layer 30, when forming a solidified layer 30 of a predetermined layer, an actually measured contour shape 45 measured of a solidified layer 30 lower than the solidified layer 30 of the predetermined layer is compared with a target contour shape 46 set in advance for the lower solidified layer 30, and a scanning path 80 of the beam B is corrected so that the contour shape of the solidified layer 30 of the predetermined layer approaches a target contour shape 47 set in advance for the solidified layer 30 of the predetermined layer.

Description

Additive manufacturing method and additive manufacturing device

[0001] The technology disclosed herein relates to additive manufacturing methods and apparatus.

[0002] For example, in a method disclosed in Patent Document 1, when a fluid communication hole is provided in an additively manufactured product, the hole is manufactured by additive manufacturing at the same time as the additively manufactured product.

[0003] Special Publication No. 2007-504977

[0004] However, the above-described method leaves room for improvement in terms of improving the accuracy of the shape of the holes provided in the additively manufactured product.

[0005] The technique disclosed herein has been made in view of the above points, and its purpose is to improve the accuracy of the hole shape.

[0006] The additive manufacturing method disclosed herein is an additive manufacturing method for producing an additively manufactured product comprising a plurality of solidified layers stacked in one direction and comprising holes formed in the plurality of solidified layers, and includes: supplying raw material powder to form a powder bed; scanning a beam over the powder bed to form the solidified layer; and measuring the contour shape of the hole in the solidified layer.When forming the solidified layer of a specified layer, the actual contour shape measured in the solidified layer below the solidified layer of the specified layer is compared with a target contour shape preset in the solidified layer of the lower layer, and the scanning path of the beam is corrected so that the contour shape in the solidified layer of the specified layer approaches the target contour shape preset in the solidified layer of the specified layer.

[0007] The additive manufacturing method disclosed herein is an additive manufacturing method for producing an additively manufactured product comprising a plurality of solidified layers stacked in one direction and comprising horizontal holes provided in the plurality of solidified layers, and includes: supplying raw material powder to form a powder bed; and scanning a beam over the powder bed to form the solidified layer, wherein in forming the solidified layer, the beam is scanned in a direction that intersects a predetermined virtual axis of the hole at a predetermined angle when viewed from the one direction in at least a nearby region of a region corresponding to the contour of the hole in the powder bed and a surrounding region surrounding the nearby region of the powder bed.

[0008] The additive manufacturing apparatus disclosed herein is an additive manufacturing apparatus for manufacturing an additively manufactured product that includes a plurality of solidified layers stacked in one direction and that includes holes formed in the plurality of solidified layers, and comprises: a platform; a bed forming device that supplies raw material powder to the platform to form a powder bed; a beam emitter that emits a beam; a scanner that scans the beam over the powder bed; a measuring device that measures the contour shape of the hole in the solidified layer; and a control device that controls the scanner, wherein when forming the solidified layer of a specified layer, the control device compares the actual contour shape measured in the solidified layer below the solidified layer of the specified layer with a target contour shape that has been preset in the solidified layer of the lower layer, and corrects the scanning path of the beam so that the contour shape in the solidified layer of the specified layer approaches the target contour shape that has been preset in the solidified layer of the specified layer.

[0009] The additive manufacturing apparatus disclosed herein is an additive manufacturing apparatus for manufacturing an additively manufactured product including a plurality of solidified layers stacked in one direction and including horizontal holes formed in the plurality of solidified layers, and comprises: a platform; a bed forming device for supplying raw material powder to the platform to form a powder bed; a beam emitter for emitting a beam; a scanner for scanning the beam over the powder bed; and a control device for controlling the scanner, wherein the control device scans the beam in a direction intersecting a predetermined virtual axis of the hole at a predetermined angle when viewed from the one direction in at least the vicinity of an area corresponding to the contour of the hole in the powder bed and a surrounding area surrounding the vicinity of the area in the powder bed.

[0010] The additive manufacturing method and the additive manufacturing apparatus can improve the accuracy of the hole shape.

[0011] FIG. 1 is a schematic configuration diagram showing an additive manufacturing apparatus according to an embodiment. FIG. 2 is a schematic perspective view of an additively manufactured product. FIG. 3 is a diagram showing a schematic hardware configuration of a control device. FIG. 4 is a block diagram showing the configuration of a control system of a processor. FIG. 5 is a schematic plan view showing a measured contour shape and a target contour shape of a solidified layer of a layer immediately below the solidified layer of a predetermined layer. FIG. 6 is a schematic plan view showing a beam scanning path before correction in a powder bed of a predetermined layer that forms the solidified layer of the predetermined layer. FIG. 7 is a schematic plan view showing a beam scanning path after correction in a powder bed of a predetermined layer that forms the solidified layer of the predetermined layer. FIG. 8 is a schematic configuration diagram showing an additive manufacturing apparatus according to Modification 1. FIG. 9 is a schematic perspective view of an additively manufactured product. FIG. 10 is a schematic plan view showing a beam scanning path in a powder bed of a predetermined layer. FIG. 11 is a schematic perspective view showing the beam scanning direction in a region near the powder bed corresponding to the solidified layer.

[0012] Exemplary embodiments will be described in detail below with reference to the drawings. Fig. 1 is a schematic configuration diagram showing an additive manufacturing apparatus 100 according to an embodiment. Fig. 2 is a schematic perspective view of an additively manufactured product W. The additive manufacturing apparatus 100 includes a chamber 1, a platform 2, a bed forming device 3 that supplies raw material powder F to the platform 2 to form a powder bed 20, a beam emitter 4 that emits a beam B, a scanner 5 that scans the beam B over the powder bed 20, a measurement device 6, and a control device 7.

[0013] The additive manufacturing apparatus 100 manufactures an additively manufactured product W by scanning the beam B over the powder bed 20 to melt or sinter and solidify the raw material powder F in the surface layer of the powder bed 20. For example, the additive manufacturing apparatus 100 performs additive manufacturing using powder bed fusion. The powder bed fusion method is a manufacturing method in which raw material powder F is spread on the platform 2, the raw material powder F is melted or sintered by the beam B, and the solidified solidified layer 30 is stacked to form a shape.

[0014] The additively manufactured product W includes multiple solidified layers 30. The multiple solidified layers 30 are stacked in one direction. In this example, the one direction is from bottom to top. The multiple solidified layers 30 are formed by melting or sintering and solidifying the powder bed 20 layer by layer. In the drawings, the boundaries between adjacent solidified layers 30 are shown with solid lines, but when adjacent solidified layers 30 are actually fused together, the boundaries may not be clearly visible.

[0015] The additively manufactured product W includes a first hole 40. The first hole 40 is an example of a "hole" in the present disclosure. The first hole 40 is provided in a plurality of solidified layers 30. The first hole 40 extends in one direction. Specifically, the first hole 40 extends in a direction at an angle of 10° or more and 90° or less with respect to a plane perpendicular to the one direction. In other words, the angle of inclination of the axis 40a of the first hole 40 with respect to the plane is 10° or more and 90° or less. This angle is an absolute value and refers to an acute angle, not an obtuse angle. The axis 40a of the first hole 40 is a line passing through the center of gravity in a cross section perpendicular to the extension direction of the first hole 40. The axis 40a of the first hole 40 is a straight line, but may also be a curved line. If the axis 40a of the first hole 40 is a curved line, the first hole 40 extends in one direction when viewed partially. Each solidified layer 30 has an outline 41 of the first hole 40. The contour shape of the first hole 40 is elliptical, but may be other shapes such as circular or polygonal.

[0016] The chamber 1 defines an area in which the additively manufactured product W is formed. An inert gas can flow into the chamber 1. The inert gas is a gas that does not substantially react with the powder bed 20 or the solidified layer 30. For example, the inert gas is nitrogen gas, argon gas, helium gas, or the like. A window portion 1a that transmits the beam B is provided on the upper surface of the chamber 1. The window portion 1a is made of a material that can transmit the beam B from the scanner 5. For example, the material of the window portion 1a is quartz glass, borosilicate glass, or the like.

[0017] The platform 2 is disposed within the chamber 1. A raw material powder F is supplied to the upper surface of the platform 2, and a powder bed 20 and a solidified layer 30 are formed, thereby producing an additively manufactured product W. The platform 2 is configured to be movable in the vertical direction. The platform 2 is driven in the vertical direction by, for example, a motor. Each time one layer of the solidified layer 30 is formed, the platform 2 descends by the thickness of the solidified layer 30.

[0018] Specifically, a cylindrical partition wall 15 is disposed in the chamber 1. The platform 2 is disposed within the partition wall 15 and is movable in the vertical direction within the partition wall 15. Since the platform 2 is surrounded by the partition wall 15, the raw material powder F can be held on the platform 2.

[0019] The bed forming device 3 supplies raw material powder F to the platform 2 to form a powder bed 20 layer by layer. The powder bed 20 refers to the raw material powder F in the uppermost layer of the raw material powder F placed in layers on the platform 2. The raw material powder F is, for example, a metal powder such as stainless steel, maraging steel, copper alloy, nickel alloy, titanium alloy, aluminum alloy, cobalt-chromium-molybdenum alloy, gold alloy, or platinum-based metallic glass. Alternatively, the raw material powder F may be a resin powder such as polyamide (PA), filler-reinforced resin powder, polypropylene (PP), or polystyrene (PS).

[0020] The bed forming device 3 has a supply piston 11 and a recoater 12. The supply piston 11 is disposed in the chamber 1. The supply piston 11 is configured to be movable in the vertical direction. Specifically, a supply space 16 is provided between the side wall of the chamber 1 and a partition wall 15. The supply piston 11 is disposed in the supply space 16 and is movable in the vertical direction within the supply space 16. The raw material powder F is accommodated on the supply piston 11 within the supply space 16.

[0021] The recoater 12 is configured to be capable of reciprocating horizontally. Specifically, the recoater 12 is configured to be capable of moving toward or away from the platform 2. The recoater 12 scrapes off the raw material powder F on the supply piston 11 and transfers it to the platform 2, thereby forming a powder bed 20. Each time the recoater 12 forms one layer of the powder bed 20 on the platform 2, the supply piston 11 rises by a predetermined amount.

[0022] The beam emitter 4 emits the beam B. The beam emitter 4 is disposed above the chamber 1. The beam emitter 4 may be disposed below the chamber 1. The beam B may be any beam capable of sintering or melting the raw material powder F. The beam B is a laser beam. The laser beam may be a solid-state laser, a gas laser, or a semiconductor laser. In this case, the beam emitter 4 is a laser oscillator. The beam may be an electron beam. In this case, the beam emitter 4 is an electron gun. The beam emitter 4 may be capable of changing the output of the beam B.

[0023] The scanner 5 scans the beam B emitted from the beam emitter 4 over the powder bed 20. As a result, the powder bed 20 is melted and solidified by the heat of the beam B to form a solidified layer 30. At this time, the scanner 5 scans the beam B so as to form an outline 41 of the first hole 40 in the solidified layer 30.

[0024] Specifically, after the bed formation device 3 forms a first powder bed 20 on the platform 2, the scanner 5 scans the beam B over the first powder bed 20, whereby the first powder bed 20 is solidified by the heat of the beam B to form a first solidified layer 30. Thereafter, after the bed formation device 3 forms a second powder bed 20 on the first solidified layer 30, the scanner 5 scans the beam B over the second powder bed 20, whereby the second powder bed 20 is solidified by the heat of the beam B to form a second solidified layer 30. By repeating this process, multiple solidified layers 30 are stacked in one direction to produce the additively manufactured product W.

[0025] The scanner 5 is disposed above the chamber 1. The scanner 5 includes a galvanometer mirror 13 and a motor 14. The galvanometer mirror 13 reflects the beam B emitted from the beam emitter 4 toward the powder bed 20 of the platform 2. The motor 14 drives the galvanometer mirror 13 so that the beam B reflected by the galvanometer mirror 13 scans the powder bed 20 in planar directions (X and Y directions). Specifically, the motor 14 rotates the galvanometer mirror 13 around a first axis to move the irradiation point of the beam B on the powder bed 20 in a first direction (X direction), and rotates the galvanometer mirror 13 around a second axis to move the irradiation point of the beam B on the powder bed 20 in a second direction (Y direction). Note that the scanner 5 may use other configurations, such as a polygon mirror, instead of the galvanometer mirror 13. A focus adjustment device for adjusting the size of the focus of the beam B may be provided upstream or downstream of the galvanometer mirror 13 in the traveling direction of the beam B. The galvanometer mirror 13 may include a first galvanometer mirror that moves the irradiation point of the beam B on the powder bed 20 in a first direction (X direction), and a second galvanometer mirror that moves the irradiation point of the beam B on the powder bed 20 in a second direction (Y direction).

[0026] The measuring device 6 measures the contour shape of the first hole 40 in the solidified layer 30. Specifically, each time the scanner 5 scans the beam B over the powder bed 20 to form a solidified layer 30, the measuring device 6 measures the contour shape of the first hole 40 in the solidified layer 30. In other words, the measuring device 6 measures the contour shape of the first hole 40 in the solidified layer 30 of each layer.

[0027] The measuring device 6 is disposed in the chamber 1. Specifically, the measuring device 6 is attached to the upper wall of the chamber 1. The measuring device 6 is disposed above the platform 2 and observes the solidified layer 30 of the platform 2 from above. The measuring device 6 is, for example, an infrared camera, but may also be a sensor such as a geometric measurement sensor.

[0028] The control device 7 controls each device. For example, the control device 7 causes the bed forming device 3 to form a powder bed 20 and the scanner 5 to scan the beam B over the powder bed 20, thereby melting or sintering the raw material powder F and solidifying it. The control device 7 repeats this process to manufacture the additively manufactured product W. Note that in FIG. 1 , only the signal lines connecting the control device 7 to the scanner 5 and the measuring device 6 are depicted, and signal lines connecting the control device 7 to the other devices are omitted.

[0029] The control device 7 controls the scanner 5. Specifically, the control device 7 controls the scanner 5 in accordance with a preset scanning path of the beam B. Furthermore, the control device 7 performs feedback control of the scanner 5 based on the measurement results of the measurement device 6. Specifically, the control device 7 controls the motor 4 based on the measurement results of the measurement device 6 to adjust the scanning path of the beam B caused by the galvanometer mirror 13.

[0030] In detail, when forming the solidified layer 30 of a predetermined layer, the control device 7 compares the contour shape of the first hole 40 actually measured in a solidified layer 30 below the solidified layer 30 of the predetermined layer with the contour shape of a target first hole 40 preset in the lower solidified layer 30, and corrects the scanning path of the beam B so that the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer approaches the contour shape of the target first hole 40 preset in the solidified layer 30 of the predetermined layer. The contour shape of the actually measured first hole 40 will hereinafter also be simply referred to as the measured contour shape. The contour shape of the target first hole 40 will hereinafter also be simply referred to as the target contour shape.

[0031] The solidified layer 30 of a predetermined layer may be the solidified layer 30 of each layer, or may be the solidified layer 30 for every multiple layers. In other words, the frequency of correction of the scanning path of the beam B may be corrected every time one solidified layer 30 is formed, or may be corrected every time multiple solidified layers 30 are formed. The solidified layer 30 of a predetermined layer is input and set in advance, and is changeable.

[0032] The measured contour shape is the measurement result obtained by the measuring device 6. The target contour shape is the contour shape targeted for each solidified layer 30, and is input and set in advance and can be changed. The measured contour shape to be compared with the target contour shape may be the measured contour shape of any one layer, or may be the measured contour shape of multiple layers. In the case of the measured contour shape of multiple layers, it may be the average contour shape of the measured contour shapes of the multiple layers, and in this case, the target contour shape may also be the average contour shape of the target contour shapes of the multiple layers.

[0033] 3 is a diagram showing a schematic hardware configuration of the control device 7. The control device 7 has a processor 71, a storage device 72, and a memory 73.

[0034] The processor 71 controls the entire control device 7. The processor 71 performs various types of arithmetic processing. For example, the processor 71 is formed of a processor such as a CPU (Central Processing Unit). The processor 71 may be formed of an MCU (Micro Controller Unit), an MPU (Micro Processor Unit), an FPGA (Field Programmable Gate Array), a PLC (Programmable Logic Controller), a system LSI, or the like.

[0035] The memory 72 stores various programs and various data executed by the processor 71. The memory 72 is formed of a non-volatile memory, a hard disk drive (HDD), a solid state drive (SSD), or the like. The various programs cause the control device 7 to realize various functions. The memory 72 stores the relationship between the result of comparison between the measured contour shape and the target contour shape and the correction of the scanning path of the beam B.

[0036] The memory 73 temporarily stores data, etc. For example, the memory 73 is formed of a volatile memory. The solidified layer 30 of a predetermined layer that is the target of correction of the scanning path of the beam B is stored in the storage device 72 or the memory 73. For example, the solidified layer 30 of the predetermined layer that is the target of correction is set and stored by user input. The measurement results of the measuring device 6, i.e., the measured contour shape, are stored in the storage device 72 or the memory 73. The target contour shape of the solidified layer 30 of each layer is stored in the storage device 72 or the memory 73. For example, the target contour shape is stored by reading drawing data such as a design drawing or by user input. The result of comparison between the measured contour shape and the target contour shape is stored in the storage device 72 or the memory 73.

[0037] 4 is a block diagram showing the configuration of a control system of the processor 71. The processor 71 realizes various functions by reading a program from the storage unit 72 into the memory 73 and expanding the program. More specifically, the processor 71 functions as a comparator 74, a corrector 75, and an adjuster 76.

[0038] When forming the solidified layer 30 of a predetermined layer, the comparator 74 compares the measured contour shape of the solidified layer 30 below the predetermined layer with a predetermined target contour shape of the lower solidified layer 30. Specifically, the comparator 74 acquires information about the solidified layer 30 of the predetermined layer, information about the measured contour shape of the lower solidified layer 30, and information about the target contour shape. The comparator 74 compares the measured contour shape with the target contour shape from the acquired information. For example, the comparator 74 calculates the difference between the measured contour shape and the target contour shape as the comparison result. Note that the comparison result is not limited to the difference, and other comparison values ​​may also be used.

[0039] An example of how the comparator 74 determines the difference will be described below. Assume that the measured contour shape is the contour shape of the solidified layer 30 of the layer immediately below the solidified layer 30 of the predetermined layer. Figure 5 is a schematic plan view showing the measured contour shape 45 and the target contour shape 46 of the solidified layer 30 of the layer immediately below the solidified layer 30 of the predetermined layer. In Figure 5, the measured contour shape 45 is indicated by a solid line, and the target contour shape 46 is indicated by a two-dot chain line.

[0040] The comparator 74 calculates the distance between the measured contour shape 45 and the target contour shape 46 in the planar direction. Specifically, the comparator 74 calculates the distance by which the measured contour shape 45 is separated from the target contour shape 46 in the circumferential direction of the measured contour shape 45. For example, the comparator 74 calculates the distance of a portion of the measured contour shape 45 that is located radially inward from the target contour shape 46 as a positive numerical value, and calculates the distance of a portion of the measured contour shape 45 that is located radially outward from the target contour shape 46 as a negative numerical value. In this way, the comparator 74 calculates the difference between the measured contour shape 45 and the target contour shape 46.

[0041] Based on the comparison result by the comparator 74, the corrector 75 corrects the scanning path of the beam B so that the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer approaches a preset target contour shape in the solidified layer 30 of the predetermined layer. Specifically, the corrector 75 obtains information on the difference between the measured contour shape 45 and the target contour shape 46 from the comparator 74. The corrector 75 obtains information on the relationship between the comparison result between the measured contour shape 45 and the target contour shape 46 and the correction of the scanning path of the beam B from the memory 72. The corrector 75 corrects the scanning path of the beam B in the solidified layer 30 of the predetermined layer based on the obtained information.

[0042] The correction of the scanning path of beam B by the corrector 75 will now be described. The corrector 75 corrects the scanning path of beam B based on the difference described in FIG. 5. FIGS. 6 and 7 are schematic plan views showing the scanning path of beam B in the powder bed 20 of a predetermined layer that forms the solidified layer 30 of the predetermined layer. FIGS. 6 and 7 show a virtual scanning path of beam B before actual scanning with beam B. FIG. 6 shows a scanning path 80 of beam B before correction. FIG. 7 shows a scanning path 80a of beam B after correction. In FIG. 7, a target contour shape 47 of the solidified layer 30 of the predetermined layer is shown by a two-dot chain line. The target contour shape 47 is the same shape as the target contour shape 46 shown in FIG. 5. Note that the target contour shapes of the solidified layers 30 of each layer may be different from each other.

[0043] The scanning path 80 of the beam B includes a first scanning path 81 and a second scanning path 82. The first scanning path 81 is a scanning path of the beam B that scans over a first region Z1 that corresponds to the outline of the first hole 40 in the powder bed 20. The first scanning path 81 includes one circular path. The first scanning path 81 corresponds to the target outline shape 47. Note that the first scanning path 81 may include multiple circular paths. In other words, the first scanning path 81 may be a path formed by scanning the beam B in a circular pattern multiple times.

[0044] The second scanning path 82 is a scanning path of the beam B that scans a second region Z2 surrounding the first region Z1 of the powder bed 20. The second scanning path 82 includes a plurality of linear paths that are arranged in parallel. Note that the ends of adjacent linear paths may be connected to form a linear connection. In other words, the plurality of linear paths may be connected in an accordion-like (zigzag) shape.

[0045] The corrector 75 corrects either or both of the first scanning path 81 and the second scanning path 82. In this example, the corrector 75 corrects both the first scanning path 81 and the second scanning path 82.

[0046] Specifically, in the first scanning path 81, the corrector 75 corrects the target contour shape 46 shown in Fig. 5 so that it is symmetrical with the measured contour shape 45 shown in Fig. 5. For example, the corrector 75 corrects the portion of the measured contour shape 45 shown in Fig. 5 that is located radially inside the target contour shape 46 shown in Fig. 5 so that it is located radially outside the target contour shape 47 in the first scanning path 81. On the other hand, the corrector 75 corrects the portion of the measured contour shape 45 shown in Fig. 5 that is located radially outside the target contour shape 46 shown in Fig. 5 so that it is located radially inside the target contour shape 47 in the first scanning path 81. In this way, the corrector 75 corrects the first scanning path 81 to a first scanning path 81a.

[0047] In the second scanning path 82, the corrector 75 performs correction corresponding to the correction of the first scanning path 81. That is, the corrector 75 corrects the second scanning path 82 to a second scanning path 82a corresponding to the first scanning path 81a.

[0048] The adjuster 76 acquires information on the scanning path 80a of the beam B after the correction from the corrector 75, and controls the scanner 5 based on the information to scan the beam B. Specifically, the adjuster 76 controls the scanner 5 to scan the beam B along the second scanning path 82a, and then scan the beam B along the first scanning path 81a. Note that the adjuster 76 may also scan the beam B along the first scanning path 81a, and then scan the beam B along the second scanning path 82a.

[0049] As a result, in the portion of the first scanning path 81a located radially outside the target contour shape 47, the contour shape approaches the target contour shape 47. On the other hand, in the portion of the first scanning path 81a located radially inside the target contour shape 47, the contour shape approaches the target contour shape 47. Therefore, the contour shape of the first hole 40 in the solidified layer 30 of a predetermined layer can be made to approach the target contour shape 47.

[0050] Next, additive manufacturing methods will be described.

[0051] The additive manufacturing method is a method for manufacturing an additively manufactured product W that includes a plurality of solidified layers 30 stacked in one direction and includes a first hole 40 formed in the plurality of solidified layers 30.

[0052] First, the bed forming device 3 supplies raw material powder F to form a powder bed 20. Next, the scanner 5 scans the beam B over the powder bed 20, forming a solidified layer 30 by the heat of the beam B. Next, the measuring device 6 measures the contour shape of the first hole 40 in the solidified layer 30.

[0053] For example, first, the bed forming device 3 forms a first powder bed 20 on the platform 2. The scanner 5 scans the first powder bed 20 with the beam B to form a first solidified layer 30. Specifically, the scanner 5 scans the beam B along the second scanning path 82, and then scans the beam B along the first scanning path 81. Note that the scanner 5 may scan the beam B along the first scanning path 81, and then scan the beam B along the second scanning path 82. The measuring device 6 measures the contour shape of the first hole 40 in the first solidified layer 30.

[0054] Next, before forming a second layer of powder bed 20 on platform 2, supply piston 11 rises a predetermined amount, and platform 2 descends by the thickness of one layer of powder bed 20. Thereafter, bed formation device 3 forms second layer of powder bed 20 on first solidified layer 30. Scanner 5 scans beam B over second layer of powder bed 20, forming second layer of solidified layer 30. Measuring device 6 measures the contour shape of first hole 40 in second layer of solidified layer 30. This process is then repeated to manufacture additively manufactured product W.

[0055] In forming the solidified layer 30, when forming the solidified layer 30 of a predetermined layer, the control device 7 compares the contour shape of the actual first hole 40 measured in a solidified layer 30 below the solidified layer 30 of the predetermined layer with the contour shape of a target first hole 40 set in advance in the solidified layer 30 of the lower layer, and corrects the scanning path of the beam B so that the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer approaches the contour shape of the target first hole 40 set in advance in the solidified layer 30 of the predetermined layer. Specifically, in correcting the scanning path of the beam B, the control device 7 corrects both or either of the first scanning path 81 and the second scanning path 82. In this example, the control device 7 corrects both the first scanning path 81 and the second scanning path 82.

[0056] According to the additive manufacturing apparatus 100 described above, when forming the solidified layer 30 of a predetermined layer, the control device 7 compares the contour shape of the first hole 40 actually measured in a solidified layer 30 below the solidified layer 30 of the predetermined layer with the contour shape of a target first hole 40 set in advance in the solidified layer 30 of the lower layer, and corrects the scanning path of the beam B so that the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer approaches the contour shape of the target first hole 40 set in advance in the solidified layer 30 of the predetermined layer. This allows the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer to approach the target contour shape 47. Therefore, the accuracy of the shape of the first hole 40 can be improved.

[0057] More specifically, for example, precision parts such as combustors can be manufactured using additive manufacturing. The precision parts have multiple holes, and the required accuracy of the hole shapes is high. Conventional methods do not achieve the required accuracy of the hole shapes, and subsequent machining or other processes are required. In contrast, the additive manufacturing device 100 described above can improve the accuracy of the hole shapes.

[0058] Furthermore, the control device 7 corrects both or either one of the first scanning path 81 and the second scanning path 82, and therefore can correct the scanning path 80 of the beam B by dividing it into the first scanning path 81 and the second scanning path 82. This improves the accuracy of the correction by the control device 7, and can improve the accuracy of the shape of the first hole 40.

[0059] According to the additive manufacturing method described above, when forming the solidified layer 30 of a predetermined layer, the contour shape of the first hole 40 actually measured in a solidified layer 30 below the solidified layer 30 of the predetermined layer is compared with the contour shape of a target first hole 40 previously set in the solidified layer 30 of the lower layer, and the scanning path of the beam B is corrected so that the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer approaches the contour shape of the target first hole 40 previously set in the solidified layer 30 of the predetermined layer. This allows the contour shape of the first hole 40 in the solidified layer 30 of the predetermined layer to approach the target contour shape 47. Therefore, the accuracy of the shape of the first hole 40 can be improved.

[0060] Furthermore, in correcting the scanning path of beam B, both or either one of the first scanning path 81 and the second scanning path 82 is corrected, so that the scanning path 80 of beam B can be corrected by dividing it into the first scanning path 81 and the second scanning path 82. This improves the accuracy of correction by the control device 7, and also improves the accuracy of the shape of the first hole 40.

[0061] <<Modification 1>> Fig. 8 is a schematic configuration diagram showing an additive manufacturing apparatus 100A according to Modification 1. Fig. 9 is a schematic perspective view of an additively manufactured product W. The additive manufacturing apparatus 100A according to Modification 1 differs from the additive manufacturing apparatus 100 according to the embodiment in the configuration of the additively manufactured product W to be manufactured, the configuration of the control device 7A, and the omission of the measuring device 6. The following will mainly describe the configuration of the additive manufacturing apparatus 100A according to Modification 1 that differs from the additive manufacturing apparatus 100 according to the embodiment. Note that in the additive manufacturing apparatus 100A according to Modification 1, the same reference numerals as those in the additive manufacturing apparatus 100 according to the embodiment have the same configuration as the additive manufacturing apparatus 100 according to the embodiment, and therefore description thereof will be omitted.

[0062] The additive manufacturing apparatus 100A according to the first modification includes a chamber 1, a platform 2, a bed forming device 3, a beam emitter 4, a scanner 5, and a control device 7A. The additive manufacturing apparatus 100A manufactures an additively manufactured product W by repeatedly forming a powder bed 20 and a solidified layer 30 on the platform 2.

[0063] The additively manufactured product W includes multiple solidified layers 30. The multiple solidified layers 30 are stacked in one direction. The multiple solidified layers 30 are formed by melting or sintering and solidifying the powder bed 20 layer by layer. The thickness of the solidified layer 30 is, for example, 0.02 mm or more and 0.10 mm or less.

[0064] The additively manufactured product W includes a second hole 50. The second hole 50 is an example of a "horizontal hole" in the present disclosure. A "horizontal hole" refers to a hole extending in a horizontal direction when one direction is defined as a vertical direction. In other words, the "horizontal hole" refers to a hole extending horizontally relative to one direction, and does not refer only to a hole extending in an absolute direction, such as horizontally relative to a vertical direction. For example, when the additively manufactured product W is being manufactured, the horizontal hole extends horizontally relative to the vertical direction, but when the additively manufactured product W is being used, the horizontal hole may extend vertically.

[0065] The second holes 50 are provided in multiple solidified layers 30. The second holes 50 extend in a direction between 0° and 30° relative to a plane perpendicular to one direction. That is, the angle of inclination of the axis 40a of the second holes 50 relative to the plane is between 0° and 30°. This angle is an absolute value and refers to an acute angle, not an obtuse angle. The axis 50a of the second holes 50 is a line passing through the center of gravity in a cross section perpendicular to the extension direction of the second holes 50. The axis 50a of the second holes 50 is a straight line, but may also be a curved line. The second holes 50 are elliptical, but may also be other shapes such as circular or polygonal. The diameter of the second holes 50 is, for example, between 10 and 100 times the thickness of one solidified layer 30. Each solidified layer 30 has an outline 51 of the second holes 50. In FIG. 9, for convenience, the thickness of the solidified layer 30 is depicted as being thick, and the number of layers of the solidified layer 30 is depicted as being small.

[0066] The chamber 1, platform 2, bed forming device 3, and beam emitter 4 have the same configuration as in the embodiment, and therefore their description will be omitted.

[0067] The scanner 5 scans the beam B over the powder bed 20. Specifically, the scanner 5 scans the beam B emitted from the beam emitter 4 over the powder bed 20. As a result, the powder bed 20 is melted and solidified by the heat of the beam B, and a solidified layer 30 is formed. At this time, the scanner 5 scans the beam B so as to form an outline 51 of the second hole 50 in the solidified layer 30.

[0068] The control device 7A controls the scanner 5. Specifically, the control device 7A controls the motor 4 to adjust the scanning path of the beam B caused by the galvanometer mirror 13. The control device 7A has a processor 71, a storage device 72, and a memory 73.

[0069] Figure 10 is a schematic plan view showing a scanning path 90 of the beam B in the powder bed 20 of a predetermined layer. In Figure 10, the state before the second hole 50 is formed is shown, and therefore the second hole 50 is shown with a two-dot chain line. Accordingly, the outline 51 of the second hole 50 is shown with a two-dot chain line, and the axis 50a of the second hole 50 is shown as a virtual axis 50a. The outline 51 and virtual axis 50a of the second hole 50 are input and set in advance and are changeable.

[0070] The control device 7A scans the beam B in a direction that intersects with a predetermined imaginary axis 50a of the second hole 50 at a predetermined angle when viewed from one direction in at least a nearby region Z3 of the powder bed 20, which is a nearby region Z3 of the region corresponding to the outline 51 of the second hole 50, and a surrounding region Z4 surrounding the nearby region Z3 of the powder bed 20. Specifically, the processor 71 scans the beam B in a direction that intersects with the imaginary axis 50a of the second hole 50 at a predetermined angle when viewed from one direction. The nearby region Z3 is, for example, a region between the outline 51 of the second hole 50 and a predetermined position that is 0.5 mm or more and 5 mm or less from the outline 51 of the second hole 50. When viewed from one direction, the imaginary axis 50a overlaps with the center line between the two outlines 51 located on either side of the imaginary axis 50a.

[0071] The control device 7A makes the scanning direction of the beam B in the nearby region Z3 different from the scanning direction of the beam B in the surrounding region Z4.

[0072] Specifically, the scanning path 90 of the beam B includes a first scanning path 91 and a second scanning path 92. The first scanning path 91 is the scanning path of the beam B that scans the nearby region Z3. The first scanning path 91 includes multiple linear paths that are arranged in parallel. A first scanning direction 91d of the first scanning path 91 is the scanning direction of the beam B in the nearby region Z3.

[0073] When viewed from one direction, the first scanning direction 91d intersects with the virtual axis 50a of the second hole 50 at a predetermined angle. The predetermined angle is an angle at which the first scanning direction 91d intersects with the virtual axis 50a of the second hole 50 at an angle between 45° and 90° when viewed from one direction. The predetermined angle is an absolute value and refers to an acute angle, not an obtuse angle. In this example, the predetermined angle is an angle at which the first scanning direction 91d intersects with the virtual axis 50a of the second hole 50 at an angle of 90° when viewed from one direction.

[0074] When viewed from one direction, the first scanning direction 91d coincides with the direction from the contour 51 of the second hole 50 toward the imaginary axis 50a. Specifically, when viewed from one direction, the first scanning direction 91d coincides with the direction toward the radially inner side of the second hole 50. Note that the first scanning direction 91d may also be the direction from the imaginary axis 50a toward the contour 51 of the second hole 50 when viewed from one direction.

[0075] At least in the same layer of the powder bed 20, the scanning directions of the multiple linear paths constituting the first scanning path 91 are all the same direction. The first scanning direction 91d includes the scanning directions of the multiple linear paths. Note that the scanning directions of adjacent linear paths may be different from each other. For example, the scanning directions of adjacent linear paths may be opposite to each other. When the axis 50a of the second hole 50 is curved, the scanning directions of the multiple linear paths are different.

[0076] The second scanning path 92 is a scanning path of the beam B that scans the surrounding area Z4. The second scanning path 92 includes a plurality of linear paths that are arranged in parallel. Note that the ends of adjacent linear paths may be connected to form a straight line. In other words, the linear paths may be connected in an accordion-like (zigzag) pattern. The linear paths may also be arranged in a lattice pattern.

[0077] A second scanning direction 92d of the second scanning path 92 is the scanning direction of the beam B in the peripheral region Z4. The second scanning direction 92d is different from the first scanning direction 91d.

[0078] Here, the second scanning direction 92d in the powder bed 20 of each layer may be different for each layer. In this case, it is possible to reduce the anisotropy of the strength in the multiple solidified layers 30. For example, the scanning direction of the beam B is changed for each layer. This allows the second scanning direction 92d to be different for each layer.

[0079] At least in the same layer of the powder bed 20, the scanning directions of the multiple linear paths constituting the second scanning path 92 are all the same direction. The second scanning direction 92d includes the scanning directions of the multiple linear paths. Note that the scanning directions of adjacent linear paths may be different from each other. For example, the scanning directions of adjacent linear paths may be opposite to each other.

[0080] FIG. 11 is a schematic perspective view showing the scanning direction of the beam B in a nearby region Z3 of the powder bed 20 corresponding to the solidified layer 30. FIG. 11 shows the state in which the solidified layer 30 is formed from the powder bed 20, and therefore the powder bed 20 and the nearby region Z3 are indicated by a two-dot chain lead line. In FIG. 11, the scanning direction of the beam B for each of the multiple linear paths constituting the first scanning path 91 is depicted as a scanning direction 91d1. The outline of the second hole 50 is an ellipse, but in FIG. 11, for convenience, the outline of the second hole 50 is depicted as a stepped ellipse. In FIG. 11, for convenience, the thickness of the solidified layer 30 is depicted as thick, and the number of layers of the solidified layer 30 is depicted as small.

[0081] When forming a solidified layer 30b of the layer immediately above a specified layer that extends further toward the virtual axis 50a than the solidified layer 30a of the specified layer, the control device 7A scans the beam B in a direction from the contour 51 of the second hole 50 toward the virtual axis 50a in the vicinity region Z3 of the powder bed 20 when viewed from one direction.

[0082] Specifically, in the powder bed 20 corresponding to the solidified layer 30b of the layer immediately above, the first scanning direction 91d coincides with the direction from the contour 51 of the second hole 50 toward the imaginary axis 50a when viewed from one direction. In this example, the first scanning direction 91d is a direction that intersects with the imaginary axis 50a at an angle of 90° when viewed from one direction. Note that the first scanning direction 91d may be a direction that intersects with the imaginary axis 50a at an angle of 45° to 90°, as long as it is a direction from the contour 51 of the second hole 50 toward the imaginary axis 50a when viewed from one direction.

[0083] Specifically, in the powder bed 20 of the layer immediately above, the scanning direction 91d1 of each of the multiple linear paths is a direction from the outline 51 of the second hole 50 toward the imaginary axis 50a when viewed from one direction. In this example, each scanning direction 91d1 is a direction that intersects with the imaginary axis 50a at an angle of 90° when viewed from one direction.

[0084] Next, additive manufacturing methods will be described.

[0085] The additive manufacturing method is a method for manufacturing an additively manufactured product W that includes a plurality of solidified layers 30 stacked in one direction and includes a second hole 50 formed in the plurality of solidified layers 30.

[0086] First, the bed forming device 3 supplies raw material powder F to form a powder bed 20. Next, the scanner 5 scans the beam B over the powder bed 20, forming a solidified layer 30 by the heat of the beam B. Specifically, the scanner 5 scans the beam B in the surrounding region Z4, and then scans the beam B in the nearby region Z3. Note that the scanner 5 may also scan the beam B in the nearby region Z3, and then scan the beam B in the surrounding region Z4.

[0087] In forming the solidified layer 30, the control device 7A scans the beam B in a direction that intersects the virtual axis 50a of the predetermined second hole 50 at a predetermined angle when viewed from one direction in the vicinity region Z3 of the powder bed 20 and at least the vicinity region Z3 of the surrounding region Z4 of the powder bed 20.

[0088] In forming the solidified layer 30, the control device 7A makes the scanning direction of the beam B in the vicinity region Z3 different from the scanning direction of the beam B in the surrounding region Z4.

[0089] When forming the solidified layer 30, the control device 7A scans the beam B in a direction from the contour 51 of the second hole 50 toward the virtual axis 50a in the vicinity region Z3 of the powder bed 20 when viewed from one direction, when forming the solidified layer 30b of the layer immediately above that extends more toward the virtual axis 50a than the solidified layer 30a of the specified layer.

[0090] According to the additive manufacturing apparatus 100A of the first modification, the control device 7A scans the beam B in a direction that intersects the predetermined imaginary axis 50a of the second hole 50 at a predetermined angle when viewed from one direction in the vicinity region Z3 of the powder bed 20 and at least the vicinity region Z3 of the peripheral region Z4 of the powder bed 20. This improves the accuracy of the contour shape of the second hole 50 in the vicinity region Z3. Therefore, the accuracy of the shape of the second hole 50 can be improved.

[0091] Specifically, when viewed from one direction, if the nearby region Z3 has a non-overlapping portion that extends toward the imaginary axis 50a beyond the solidified layer 30 directly below and does not overlap with the solidified layer 30 directly below, scanning the non-overlapping portion with the beam B in a direction that intersects the imaginary axis 50a of the second hole 50 at an angle parallel or nearly parallel to the imaginary axis 50a of the second hole 50 when viewed from one direction will not solidify the non-overlapping portion while bonding it to the solidified layer 30 directly below. Therefore, the shape of the solidified layer 30 formed by solidification of the non-overlapping portion will be unstable. In contrast, when viewed from one direction, scanning the nearby region Z3 with the beam B in a direction that intersects the imaginary axis 50a of the second hole 50 at a predetermined angle will solidify the overlapping portion that overlaps the nearby region Z3 with the solidified layer 30 directly below while bonding it to the solidified layer 30 directly below, while solidifying the non-overlapping portion while bonding it to the solidified overlapping portion. Therefore, the shape of the solidified layer 30 formed by solidification of the nearby region Z3 will be stable.

[0092] The control device 7A also differentiates the scanning direction of the beam B in the nearby region Z3 from the scanning direction of the beam B in the surrounding region Z4. This allows the scanning direction of the beam B in the nearby region Z3 of the powder bed 20 forming each layer of the solidified layer 30 to be maintained in a direction that intersects with the virtual axis 50a at a predetermined angle, even when the scanning direction of the beam B in the surrounding region Z4 of the powder bed 20 forming each layer of the solidified layer 30 is differentiated for each layer to reduce the anisotropy of strength in the multiple layers of the solidified layer 30.

[0093] Furthermore, when forming a solidified layer 30b of a layer immediately above a predetermined layer that extends further toward the imaginary axis 50a than the solidified layer 30a of the predetermined layer, the control device 7A scans the beam B in a direction from the outline 51 of the second hole 50 toward the imaginary axis 50a in the nearby region Z3 of the powder bed 20 when viewed from one direction. This improves the accuracy of the shape of the second hole 50. Specifically, the beam B can be scanned from the overlapping portion of the nearby region Z3 that overlaps with the solidified layer 30 immediately below, and the nearby region Z3 can be solidified while being fixed to the solidified layer 30 immediately below. This stabilizes the shape of the solidified layer 30 formed by solidifying the nearby region Z3.

[0094] According to the additive manufacturing method described above, in forming the solidified layer 30, the beam B is scanned in a direction that intersects the predetermined imaginary axis 50a of the second hole 50 at a predetermined angle when viewed from one direction in the vicinity region Z3 of the powder bed 20 and at least the vicinity region Z3 of the peripheral region Z4 of the powder bed 20. This improves the accuracy of the contour shape of the second hole 50 in the vicinity region Z3. Therefore, the accuracy of the shape of the second hole 50 can be improved.

[0095] Furthermore, in forming the solidified layer 30, the scanning direction of the beam B in the nearby region Z3 is made different from the scanning direction of the beam B in the surrounding region Z4. This makes it possible to maintain the scanning direction of the beam B in the nearby region Z3 of the powder bed 20 where each layer of the solidified layer 30 is formed in a direction that intersects with the virtual axis 50a at a predetermined angle, even when the scanning direction of the beam B in the surrounding region Z4 of the powder bed 20 where each layer of the solidified layer 30 is formed is made different for each layer to reduce the anisotropy of strength in the multiple layers of the solidified layer 30.

[0096] Furthermore, when forming the solidified layer 30, when forming the solidified layer 30b of the layer immediately above that which extends further toward the imaginary axis 50a than the solidified layer 30a of a predetermined layer, the beam B is scanned in a direction from the outline 51 of the second hole 50 toward the imaginary axis 50a in the vicinity region Z3 of the powder bed 20 when viewed from one direction. This improves the accuracy of the shape of the second hole 50.

[0097] Although the description of other configurations, actions, and effects will be omitted, the description of the additive manufacturing device 100 according to the embodiment can be used to describe the additive manufacturing device 100A according to the first modified example.

[0098] Other Embodiments As described above, the above-described embodiments have been described as examples of the technology disclosed in the present application. However, the technology disclosed herein is not limited to these embodiments and can be applied to embodiments in which modifications, substitutions, additions, omissions, etc. are made as appropriate. Furthermore, the components described in the above-described embodiments can be combined to create new embodiments. Furthermore, the components described in the accompanying drawings and detailed description may include not only components essential for solving the problem, but also components that are not essential for solving the problem in order to exemplify the technology. Therefore, the fact that these non-essential components are described in the accompanying drawings or detailed description should not be interpreted as immediately determining that these non-essential components are essential.

[0099] For example, in the embodiment and the first modified example, the additively manufactured product W including one hole is targeted, but the additively manufactured product W including multiple holes may also be targeted.

[0100] In the embodiment, the measuring device 6 is attached to the top wall of the chamber 1, but may also be attached to a side wall of the chamber 1 or to the recoater 12. When the measuring device 6 is attached to the recoater 12, the measuring device 6 is disposed upstream in the traveling direction of the recoater 12 toward the platform 2. This allows the measuring device 6 to measure the contour 41 of the first hole 40 in the underlying solidified layer 30 before the recoater 12 forms the powder bed 20 in the underlying solidified layer 30.

[0101] In the embodiment, the measuring device 6 measures the contour shape of the first hole 40 in each solidified layer 30, but the contour shape of the first hole 40 may be measured for each of multiple solidified layers 30.

[0102] In the embodiment, the control device 7 corrects both the first scanning path 81 and the second scanning path 82, but it may correct either the first scanning path 81 or the second scanning path 82.

[0103] In the embodiment, the scanner 5 scans the beam B on the first scanning path 81 and the second scanning path 82, but the first scanning path 81 may be omitted and the beam B may be scanned only on the second scanning path 82 to form the outline of the first hole 40.

[0104] In the embodiment, the additively manufactured product W including the first hole 40 is targeted, but the additively manufactured product W may also include the second hole 50. For example, the additively manufactured product W may also include only the second hole 50, or the additively manufactured product W may also include the first hole 40 and the second hole 50, or the additively manufactured product W may also include a hole that includes at least one of the first hole 40 and the second hole 50.

[0105] In Modification 1, the control device 7A differentiates the scanning direction of the beam B in the vicinity region Z3 from the scanning direction of the beam B in the surrounding region Z4, but the scanning direction of the beam B in the surrounding region Z4 may be the same as the scanning direction of the beam B in the vicinity region Z3. In other words, the control device 7A may set the scanning direction of the beam B in the surrounding region Z4 to a direction that intersects the virtual axis 50a of the second hole 50 at a predetermined angle when viewed from one direction.

[0106] In Modification 1, when forming the solidified layer 30b of the layer immediately above that extends further toward the virtual axis 50a than the solidified layer 30a of a given layer, the first scanning direction 91d, i.e., the scanning direction 91d1 of each linear path in the powder bed 20 corresponding to the solidified layer 30b of the layer immediately above is the direction from the contour 51 of the second hole 50 toward the virtual axis 50a when viewed from one direction, but the scanning directions 91d1 of adjacent linear paths may be different from each other. For example, the scanning directions 91d1 of adjacent linear paths may be opposite to each other.

[0107] In the first modification, the additively manufactured product W including the second hole 50 is targeted, but the additively manufactured product W may also be targeted to have holes including the second hole 50 in at least a portion thereof.

[0108] The additive manufacturing apparatus 100 of the embodiment may be added with the features of the additive manufacturing apparatus 100A of Modification 1. Specifically, the functions of the control apparatus 7A of Modification 1 may be added to the control apparatus 7 of the embodiment.

[0109] The additive manufacturing method of the embodiment is not limited to the additive manufacturing apparatus 100 of the embodiment, but can also be realized by other apparatuses. The additive manufacturing method of Modification 1 is not limited to the additive manufacturing apparatus 100A of Modification 1, but can also be realized by other apparatuses.

[0110] In the embodiment and variant example 1, holes are formed by adjusting the scanning of beam B, but holes may also be formed by adjusting the size of the focal point of beam B, the output of beam B, the scanning speed of beam B, the size of the raw material powder F, the thickness of the powder bed 20, etc. in addition to the scanning path of beam B.

[0111] The functions performed by the components described herein may be implemented in circuitry or processing circuitry, including general-purpose processors, application-specific processors, integrated circuits, ASICs (Application Specific Integrated Circuits), a Central Processing Unit (CPU), conventional circuits, and / or combinations thereof, programmed to perform the described functions. A processor includes transistors and other circuits and is considered a circuit or processing circuit. A processor may also be a programmable processor that executes a program stored in a memory.

[0112] In this specification, a circuit, unit, or means is hardware that is programmed to realize or performs the described functions, which may be any hardware disclosed herein or any hardware known to be programmed to realize or perform the described functions.

[0113] If the hardware is a processor considered to be a type of circuitry, the circuit, means, or unit is a combination of hardware and software used to configure the hardware and / or processor.

[0114] [Aspects] The above-described embodiments are specific examples of the following aspects.

[0115] (Aspect 1) An additive manufacturing method is an additive manufacturing method for manufacturing an additively manufactured product W that includes a plurality of solidified layers 30 stacked in one direction and that includes a first hole 40 (an example of a hole) provided in the plurality of solidified layers 30, the additive manufacturing method including: supplying a raw material powder F to form a powder bed 20; scanning a beam B over the powder bed 20 to form the solidified layer 30; and measuring a contour shape of the first hole 40 in the solidified layer 30, wherein, in forming the solidified layer 30 of a predetermined layer, a measured contour shape 45 measured in the solidified layer 30 below the solidified layer 30 of the predetermined layer is compared with a target contour shape 46 preset in the solidified layer 30 of the lower layer, and a scanning path 80 of the beam B is corrected so that the contour shape in the solidified layer 30 of the predetermined layer approaches a target contour shape 47 preset in the solidified layer 30 of the predetermined layer.

[0116] According to this configuration, the accuracy of the shape of the first hole 40 can be improved.

[0117] (Aspect 2) In the additive manufacturing method described in Aspect 1, when correcting the scanning path 80 of the beam B, both or either of a first scanning path 81 of the beam B that is scanned over a first area Z1 corresponding to the contour 41 of the first hole 40 in the powder bed 20 and a second scanning path 82 of the beam B that is scanned over a second area Z2 that surrounds the first area Z1 of the powder bed 20 is corrected.

[0118] According to this configuration, the accuracy of the shape of the first hole 40 can be improved.

[0119] (Aspect 3) An additive manufacturing method is an additive manufacturing method for manufacturing an additively manufactured product W that includes a plurality of solidified layers 30 stacked in one direction and that includes a second hole 50 (an example of a horizontal hole) provided in the plurality of solidified layers 30, and includes: supplying a raw material powder F to form a powder bed 20; and scanning a beam B over the powder bed 20 to form the solidified layer 30. In forming the solidified layer 30, the beam B is scanned in a direction that intersects a predetermined angle with a virtual axis 50a of the second hole 50, when viewed from the one direction, in at least a nearby region Z3 of a region corresponding to the outline 51 of the second hole 50 in the powder bed 20 and a surrounding region Z4 surrounding the nearby region Z3 in the powder bed 20.

[0120] This configuration can improve the accuracy of the shape of the second hole 50.

[0121] (Aspect 4) In the additive manufacturing method described in Aspect 3, when forming the solidified layer 30, the scanning direction of the beam B in the nearby region Z3 (first scanning direction 91d) is made different from the scanning direction of the beam B in the surrounding region Z4 (second scanning direction 92d).

[0122] According to this configuration, even when the scanning direction of the beam B in the surrounding region Z4 of the powder bed 20 that forms the solidified layer 30 of each layer is made different for each layer to reduce the strength anisotropy in the solidified layer 30 of multiple layers, the scanning direction of the beam B in the nearby region Z3 of the powder bed 20 that forms the solidified layer 30 of each layer can be maintained in a direction that intersects with the virtual axis 50a at a predetermined angle.

[0123] (Aspect 5) In the additive manufacturing method described in Aspect 3 or Aspect 4, when forming the solidified layer 30, when forming the solidified layer 30b of the layer immediately above that extends more toward the virtual axis 50a than the solidified layer 30a of a specified layer, the beam B is scanned in the direction from the contour 51 of the second hole 50 toward the virtual axis 50a in the nearby region Z3 of the powder bed 20 when viewed from the one direction.

[0124] This configuration can improve the accuracy of the shape of the second hole 50.

[0125] (Aspect 6) An additive manufacturing apparatus 100 is an additive manufacturing apparatus for manufacturing an additively manufactured product W including a plurality of solidified layers 30 stacked in one direction and including a first hole 40 (an example of a hole) provided in the plurality of solidified layers 30, the additive manufacturing apparatus 100 including: a platform 2; a bed forming device 3 that supplies raw material powder F to the platform 2 to form a powder bed 20; a beam emitter 4 that emits a beam B; a scanner 5 that scans the beam B over the powder bed 20; and a measuring device 6 that measures a contour shape of the first hole 40 in the solidified layer 30. and a control device 7 that controls the scanner 5, and when forming the solidified layer 30 of a specified layer, the control device 7 compares an actual contour shape 45 measured in the solidified layer 30 below the solidified layer 30 of the specified layer with a target contour shape 46 that is preset in the solidified layer 30 of the lower layer, and corrects the scanning path 80 of the beam B so that the contour shape in the solidified layer 30 of the specified layer approaches the target contour shape 47 that is preset in the solidified layer 30 of the specified layer.

[0126] According to this configuration, the accuracy of the shape of the first hole 40 can be improved.

[0127] (Aspect 7) In the additive manufacturing apparatus 100 described in aspect 6, the scanning path 80 of the beam B includes a first scanning path 81 of the beam B scanned over a first area Z1 corresponding to the contour 41 of the first hole 40 in the powder bed 20, and a second scanning path 82 of the beam B scanned over a second area Z2 surrounding the first area Z1 of the powder bed 20, and the control device 7 corrects both or either of the first scanning path 81 and the second scanning path 82.

[0128] According to this configuration, the accuracy of the shape of the first hole 40 can be improved.

[0129] (Aspect 8) An additive manufacturing apparatus 100A is an additive manufacturing apparatus 100A that manufactures an additively manufactured product W that includes a plurality of solidified layers 30 stacked in one direction and that includes second holes 50 (an example of horizontal holes) provided in the plurality of solidified layers 30, and includes: a platform 2; a bed formation device 3 that supplies raw material powder F to the platform 2 to form a powder bed 20; a beam emitter 4 that emits a beam B; a scanner 5 that scans the beam B over the powder bed 20; and a control device 7A that controls the scanner 5, wherein the control device 7A scans the beam B in a direction that intersects with a predetermined angle with respect to a virtual axis 50 a of the second hole 50, which is set in advance, when viewed from the one direction, in at least the nearby region Z3 of a nearby region Z3 of a region corresponding to a contour 51 of the second hole 50 in the powder bed 20 and a surrounding region Z4 that surrounds the nearby region Z3 of the powder bed 20.

[0130] This configuration can improve the accuracy of the shape of the second hole 50.

[0131] (Aspect 9) In the additive manufacturing apparatus 100A described in aspect 8, the control device 7A makes the scanning direction of the beam B in the nearby region Z3 (first scanning direction 91d) different from the scanning direction of the beam B in the surrounding region Z4 (second scanning direction 92d).

[0132] According to this configuration, even when the scanning direction of the beam B in the surrounding region Z4 of the powder bed 20 that forms the solidified layer 30 of each layer is made different for each layer to reduce the strength anisotropy in the solidified layer 30 of multiple layers, the scanning direction of the beam B in the nearby region Z3 of the powder bed 20 that forms the solidified layer 30 of each layer can be maintained in a direction that intersects with the virtual axis 50a at a predetermined angle.

[0133] (Aspect 10) In the additive manufacturing apparatus 100A described in Aspect 8 or Aspect 9, when forming the solidified layer 30b of the layer immediately above a specified layer that extends further toward the virtual axis 50a than the solidified layer 30a of the specified layer, the control device 7A scans the beam B in the direction from the contour 51 of the second hole 50 toward the virtual axis 50a in the nearby region Z3 of the powder bed 20 when viewed from the one direction.

[0134] This configuration can improve the accuracy of the shape of the second hole 50.

[0135] 100, 100A Additive manufacturing device 2 Platform 3 Bed forming device 4 Beam emitter 5 Scanner 6 Measuring device 7, 7A Control device 20 Powder bed 30 Solidified layer 30a Solidified layer of a given layer 30b Solidified layer of the layer immediately above 40 First hole (hole) 41 Contour 45 Measured contour shape 46 Target contour shape 47 Target contour shape 50 Second hole (horizontal hole) 50a Axis 51 Contour 80 Scanning path 81 First scanning path 82 Second scanning path 91d First scanning direction (scanning direction of the beam in the nearby region) 92d Second scanning direction (scanning direction of the beam in the surrounding region) B Beam F Raw material powder W Additively manufactured product Z1 First region Z2 Second region Z3 Nearby region Z4 Surrounding region

Claims

1. An additive manufacturing method for producing an additively manufactured product including a plurality of solidified layers stacked in one direction and including holes formed in the plurality of solidified layers, the method comprising: supplying raw material powder to form a powder bed; scanning a beam over the powder bed to form the solidified layers; and measuring the contour shape of the hole in the solidified layer, wherein, in forming the solidified layer of a predetermined layer, the method compares the actual contour shape measured in the solidified layer below the solidified layer of the predetermined layer with a target contour shape preset in the solidified layer of the lower layer, and corrects the scanning path of the beam so that the contour shape in the solidified layer of the predetermined layer approaches the target contour shape preset in the solidified layer of the predetermined layer.

2. An additive manufacturing method as described in claim 1, wherein correcting the scanning path of the beam includes correcting both or either a first scanning path of the beam that is scanned over a first area corresponding to the contour of the hole in the powder bed, and a second scanning path of the beam that is scanned over a second area surrounding the first area in the powder bed.

3. An additive manufacturing method for producing an additively manufactured product including a plurality of solidified layers stacked in one direction and including a horizontal hole provided in the plurality of solidified layers, the additive manufacturing method comprising: supplying raw material powder to form a powder bed; and scanning a beam over the powder bed to form the solidified layer, wherein in forming the solidified layer, the beam is scanned in a direction that intersects a predetermined imaginary axis of the horizontal hole at a predetermined angle when viewed from the one direction in at least a nearby region of a region in the powder bed corresponding to the outline of the horizontal hole and a surrounding region surrounding the nearby region of the powder bed.

4. An additive manufacturing method according to claim 3, wherein in forming the solidified layer, the scanning direction of the beam in the nearby region is made different from the scanning direction of the beam in the surrounding region.

5. An additive manufacturing method as claimed in claim 3, wherein, in forming the solidified layer, when forming the solidified layer of the layer immediately above a given layer that extends further towards the virtual axis than the solidified layer of the given layer, the beam is scanned in a direction from the outline of the horizontal hole towards the virtual axis in the adjacent region of the powder bed when viewed from the one direction.

6. An additive manufacturing apparatus for manufacturing an additively manufactured product including a plurality of solidified layers stacked in one direction and including holes formed in the plurality of solidified layers, the additive manufacturing apparatus comprising: a platform; a bed forming device that supplies raw material powder to the platform to form a powder bed; a beam emitter that emits a beam; a scanner that scans the beam over the powder bed; a measuring device that measures the contour shape of the hole in the solidified layer; and a control device that controls the scanner, wherein when forming the solidified layer of a predetermined layer, the control device compares an actual contour shape measured in the solidified layer below the solidified layer of the predetermined layer with a target contour shape that is preset in the solidified layer of the lower layer, and corrects the scanning path of the beam so that the contour shape in the solidified layer of the predetermined layer approaches the target contour shape that is preset in the solidified layer of the predetermined layer.

7. An additive manufacturing apparatus according to claim 6, wherein the scanning path of the beam includes a first scanning path of the beam scanned over a first area corresponding to the contour of the hole in the powder bed, and a second scanning path of the beam scanned over a second area surrounding the first area in the powder bed, and the control device corrects both or either of the first scanning path and the second scanning path.

8. An additive manufacturing apparatus for manufacturing an additively manufactured product including a plurality of solidified layers stacked in one direction and including horizontal holes provided in the plurality of solidified layers, the additive manufacturing apparatus comprising: a platform; a bed forming device that supplies raw material powder to the platform to form a powder bed; a beam emitter that emits a beam; a scanner that scans the beam over the powder bed; and a control device that controls the scanner, wherein the control device scans the beam in a direction that intersects with a predetermined imaginary axis of the horizontal hole at a predetermined angle when viewed from the one direction in at least a nearby region of a region corresponding to the outline of the horizontal hole in the powder bed and a surrounding region surrounding the nearby region of the powder bed.

9. An additive manufacturing apparatus according to claim 8, wherein the control device causes the scanning direction of the beam in the nearby region to differ from the scanning direction of the beam in the surrounding region.

10. An additive manufacturing apparatus as described in claim 8, wherein the control device, when forming the solidified layer of the layer immediately above a predetermined layer that extends further toward the virtual axis than the solidified layer of the predetermined layer, scans the beam in a direction from the outline of the horizontal hole toward the virtual axis in the nearby region of the powder bed when viewed from the one direction.

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