Resonant cavity antenna and electronic device

Abstract

The present application relates to the technical field of terminal devices, and particularly relates to a resonant cavity antenna and an electronic device. The resonant cavity antenna is used for an electronic device having a metal housing, wherein the electronic device comprises an audio module. The resonant cavity antenna has a closed internal cavity, wherein the internal cavity is used for being in communication with an audio chamber of the audio module, so as to serve as a portion of a sound cavity of the audio module. The resonant cavity antenna comprises a dielectric substrate, and a metal sheet and a metal ground, which are fixed to the dielectric substrate, wherein the metal sheet and the metal ground are spaced apart from each other, a grounding point of the metal sheet is conductively connected to the metal ground, a resonant cavity is formed between the metal sheet and the metal ground, and electromagnetic waves sent or received by the resonant cavity antenna may be reflected in the resonant cavity. The internal cavity is at least partially located between the metal sheet and the metal ground. The resonant cavity antenna uses its own structure to expand the volume of the sound cavity of the audio module, so that the sound effect of the audio module can be optimized.

Description

Resonant cavity antennas and electronic equipment

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410483819.1, filed on April 22, 2024, entitled "Resonant Cavity Antenna and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of terminal equipment technology, and in particular to a resonant cavity antenna and electronic device. Background Technology

[0004] Currently, consumers have high demands for the appearance, texture, and slim design of terminal devices, leading to an evolution in their structure from sandwich architecture to a unibody all-metal design. The all-metal body of a terminal device typically features a seamless design, allowing for the use of resonant cavity antennas to meet the device's communication needs.

[0005] However, existing resonant cavity antennas typically have a large physical structure, occupying a significant amount of space in terminal devices. This can compress the acoustic cavity space of the speaker module and affect the speaker's sound quality. Summary of the Invention

[0006] This application provides a resonant cavity antenna and electronic device. The resonant cavity antenna utilizes its own structure to expand the acoustic cavity of an audio module, thereby optimizing the sound effect of the audio module.

[0007] In a first aspect, this application provides a resonant cavity antenna that can be used in an electronic device to perform communication functions. The electronic device also includes an audio module for sound generation. The resonant cavity antenna has a closed internal cavity that communicates with the audio chamber of the audio module to serve as part of the audio module's sound cavity. The resonant cavity antenna includes a dielectric substrate and a metal plate and a metal ground fixed to the dielectric substrate. The metal plate and the metal ground are spaced apart, and the ground point of the metal plate is electrically connected to the metal ground. A resonant cavity is formed between the metal plate and the metal ground, and electromagnetic waves transmitted or received by the resonant cavity antenna can be reflected within the resonant cavity. The internal cavity is at least partially located between the metal plate and the metal ground.

[0008] The aforementioned resonant cavity antenna forms an internal cavity based on its own structure, without increasing the space occupied by the resonant cavity antenna. The internal cavity is connected to the audio chamber of the audio module, which can expand the volume of the audio module's sound cavity, thereby improving the audio module's sound effect and reducing the impact of the large size of the resonant cavity antenna on the space compression of the audio module.

[0009] Depending on the antenna implementation, the metal sheet can be a steel sheet or a flexible printed circuit board (FPC).

[0010] To isolate the metal sheet from the ground plane, the dielectric substrate has opposing first and second surfaces. The metal sheet is fixed to the first surface of the dielectric substrate, and the ground point of the metal sheet is exposed on the second surface of the dielectric substrate; the ground plane is fixed to the second surface of the dielectric substrate and is electrically connected to the ground point of the metal sheet.

[0011] There are multiple ways to realize the internal cavity formed by a resonant cavity antenna.

[0012] In some possible implementations, the dielectric substrate includes a cutout connecting the first surface and the second surface, and a metal sheet seals the opening of the cutout on the first surface. A ground plane can seal the opening of the cutout on the second surface, thus forming an internal cavity between the metal sheet, the cutout of the dielectric substrate, and the ground plane. The structural component can be made of plastic and can be specifically disposed between the second surface of the dielectric substrate and the ground plane. To ensure conductive connection between the grounding point of the metal sheet and the ground plane, the structural component needs to avoid the grounding point of the ground plane so that the grounding point of the metal sheet is exposed on the second surface for conductive connection. The metal sheet and the dielectric substrate can be integrally injection molded, and the ground plane and the structural component can also be integrally injection molded before the structural component is connected to the dielectric substrate.

[0013] Alternatively, the dielectric substrate includes a cutout connecting the first surface and the second surface, with a metal sheet sealing the opening of the cutout on the first surface. The resonant cavity antenna includes a structural component that seals the opening of the cutout on the second surface, forming an internal cavity between the metal sheet, the cutout of the dielectric substrate, and the structural component. The structural component can also be made of metal, allowing for a thinner structure. With the overall thickness of the resonant cavity antenna remaining constant, a thinner structural component can expand the internal cavity, further increasing its capacity when connected to the audio chamber of the audio module. When the structural component is made of metal such as steel, the grounding point of the metal sheet can be connected to the structural component, and the structural component is connected to the metal ground. The grounding point of the metal sheet is essentially connected to the metal ground through the structural component.

[0014] In some possible implementations, the dielectric substrate includes an opening groove located on a first surface, a metal sheet sealing the opening groove on the first surface, and an internal cavity formed between the metal sheet and the opening groove of the dielectric substrate. The internal cavity can be formed by integral injection molding of the metal sheet and the dielectric substrate.

[0015] In some possible implementations, the dielectric substrate includes an opening groove located on a second surface, a metal ground sealing the opening groove located on a first surface, and an internal cavity formed between the metal ground and the opening groove of the dielectric substrate. The metal sheet and the dielectric substrate can be integrally injection molded, and then the metal ground is fixed to the second surface of the dielectric substrate to seal the opening of the opening groove.

[0016] Alternatively, the dielectric substrate includes an opening slot located on the second surface, and the resonant cavity antenna includes a structural component. The structural component seals the opening slot located on the first surface, and an internal cavity is formed between the structural component and the opening slot of the dielectric substrate. The metal sheet and the dielectric substrate can be integrally injection molded, and the metal ground and the structural component can be integrally injection molded before connecting the structural component to the dielectric substrate.

[0017] In some possible implementations, the dielectric substrate is a cavity structure, with the inner wall of the cavity structure forming an internal cavity.

[0018] In some possible implementations, the dielectric substrate includes a first substrate and a second substrate connected together; the surface of the first substrate facing away from the second substrate is a first surface, and a metal sheet can be fixed to the first substrate using an integral injection molding process. The surface of the second substrate facing away from the first substrate is a second surface, and a metal ground can be fixed to the second substrate using an integral injection molding process. It should be understood that, depending on the different implementations of the dielectric substrate—whether it has a cavity structure, a cutout penetrating the first and second surfaces, or an opening slot located on either the first or second surface—the specific structures of the first and second substrates need to be adaptively adjusted accordingly.

[0019] In some possible implementations, the dielectric substrate includes a first connection port and a communication channel, the communication channel connecting the internal cavity and the first connection port, the first connection port being used to communicate with the audio chamber of the audio module.

[0020] In some possible implementations, the metal sheet includes a top plate and pins connected to the top plate, the pins serving as grounding points for the metal sheet. One end of the pin, which connects to the metal housing, can make surface contact with the metal housing, improving contact reliability.

[0021] In some possible implementations, the grounding point of the metal sheet is connected to the metal ground via conductive foam. The conductive foam serves both as an electrical connection and a buffer, and its deformability allows for a tighter, more continuous connection between the metal casing and the metal sheet.

[0022] Secondly, this application provides an electronic device, which can be a mobile phone, tablet computer, or other device with communication and audio functions. The resonant cavity antenna includes a dielectric substrate and a metal plate and a metal ground fixed to the dielectric substrate. The metal plate and the metal ground are spaced apart, and the grounding point of the metal plate is electrically connected to the metal ground, forming a resonant cavity between the metal plate and the metal ground. The resonant cavity antenna includes a closed internal cavity, at least a portion of which is part of the resonant cavity. The audio module has an audio chamber, which is connected to the internal cavity. The internal cavity can serve as part of the audio module's sound cavity, enabling expansion of the audio module's capacity.

[0023] In some possible implementations, the electronic device includes a metal housing, a portion of which serves as the metal ground for the resonant cavity antenna.

[0024] In some possible implementations, the metal housing includes a metal outer shell and a metal middle frame perpendicular to the metal outer shell, and the dielectric substrate is fixed to the metal outer shell; the surface of the dielectric substrate for fixing to the metal ground includes opposing first and second sides, the first side being adjacent to the metal middle frame and the second side being opposite to the metal middle frame; the grounding points for connecting the metal ground are distributed on the second side.

[0025] In some possible implementations, a gap exists between the resonant cavity antenna and the metal frame, through which the resonant cavity antenna is used to transmit or receive electromagnetic waves.

[0026] In one possible implementation, the resonant cavity antenna includes a first connection port communicating with an internal cavity; the audio module includes a second connection port communicating with an audio chamber, and the second connection port is sealed to the first connection port. A sealing ring may be provided between the first and second connection ports, surrounding the channel formed by the communication between the first and second connection ports. The sealing ring may be sealing foam or a sealing sleeve.

[0027] In one possible implementation, the audio module and the resonant cavity antenna are arranged on the same layer. Along the arrangement direction of the audio module and the resonant cavity antenna, the end face of the first connection port for mating with the end face of the second connection port for mating with the first connection port is parallel to each other. When the audio module and the resonant cavity antenna are engaged, the first connection port and the second connection port are arranged along the thickness direction of the electronic device, and they can be press-fitted together to improve the tightness of the connection.

[0028] In one possible implementation, the resonant cavity antenna includes a first protrusion, and the audio module includes a second protrusion. The first and second protrusions are overlapped and fixed along a direction perpendicular to the arrangement of the audio module and the resonant cavity antenna. The device can be fixedly connected to the metal housing of the electronic device by bolts, screws, or other connectors passing sequentially through the first and second protrusions.

[0029] Thirdly, an electronic device is provided, which can be a mobile phone, tablet computer, or other device with communication and audio functions. This electronic device includes an audio module and any of the resonant cavity antennas provided in the first aspect. The internal cavity of the resonant cavity antenna can be connected to the audio module of the audio module to expand the acoustic cavity. The structure of the resonant cavity antenna can refer to the resonant cavity antenna provided in the first aspect. Attached Figure Description

[0030] Figure 1a is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0031] Figure 1b is a partial structural schematic diagram of an electronic device provided in an embodiment of this application;

[0032] Figure 1c is a magnified view of the details at V1 in Figure 1b;

[0033] Figure 2 is a simplified structural diagram of a resonant cavity antenna and audio module co-cavity design of an electronic device provided in an embodiment of this application;

[0034] Figure 3 is a simplified structural schematic diagram of a cross-section of a resonant cavity antenna provided in an embodiment of this application;

[0035] Figure 4a is a schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 1 of this application;

[0036] Figure 4b is a schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 1 of this application;

[0037] Figure 4c is an exploded view of a resonant cavity antenna provided in Embodiment 1 of this application;

[0038] Figure 4d is an exploded view of a resonant cavity antenna provided in Embodiment 1 of this application;

[0039] Figure 5 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 1 of this application;

[0040] Figure 6a is a schematic diagram of the structure of a resonant cavity antenna and audio module co-cavity design of an electronic device according to Embodiment 1 of this application;

[0041] Figure 6b is a magnified view of the details at V2 in Figure 6a;

[0042] Figure 6c is a magnified view of the details at V3 in Figure 6a;

[0043] Figure 6d is a schematic diagram of the structure of a resonant cavity antenna and audio module co-cavity design of an electronic device provided in Embodiment 1 of this application;

[0044] Figure 7a is a schematic diagram of the resonant cavity antenna and audio module of an electronic device provided in Embodiment 1 of this application;

[0045] Figure 7b is a schematic diagram of the resonant cavity antenna and audio module of an electronic device provided in Embodiment 1 of this application;

[0046] Figure 7c is a partial cross-sectional view of a resonant cavity antenna and audio module co-cavity design of an electronic device according to Embodiment 1 of this application;

[0047] Figure 8a is a partial structural schematic diagram of an electronic device provided in Embodiment 1 of this application;

[0048] Figure 8b is a partial cross-sectional structural diagram of an electronic device provided in Embodiment 1 of this application;

[0049] Figure 9 is a simplified structural schematic diagram of a cross-section of a resonant cavity antenna provided in Embodiment 2 of this application;

[0050] Figure 10a is a schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 2 of this application;

[0051] Figure 10b is an exploded view of a resonant cavity antenna provided in Embodiment 2 of this application;

[0052] Figure 10c is an exploded view of a resonant cavity antenna provided in Embodiment 2 of this application;

[0053] Figure 11 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 2 of this application;

[0054] Figure 12 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 3 of this application;

[0055] Figure 13a is a schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 3 of this application;

[0056] Figure 13b is a schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 3 of this application;

[0057] Figure 13c is an exploded view of a resonant cavity antenna provided in Embodiment 3 of this application;

[0058] Figure 13d is an exploded view of a resonant cavity antenna provided in Embodiment 3 of this application;

[0059] Figure 14 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 3 of this application;

[0060] Figure 15 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 4 of this application;

[0061] Figure 16 is an exploded view of a resonant cavity antenna provided in Embodiment 4 of this application;

[0062] Figure 17 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 4 of this application;

[0063] Figure 18 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 5 of this application;

[0064] Figure 19 is an exploded view of a resonant cavity antenna provided in Embodiment 5 of this application;

[0065] Figure 20 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 5 of this application;

[0066] Figure 21 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 6 of this application;

[0067] Figure 22a is an exploded view of a resonant cavity antenna provided in Embodiment Six of this application;

[0068] Figure 22b is an exploded view of a resonant cavity antenna provided in Embodiment Six of this application;

[0069] Figure 23 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment Six of this application;

[0070] Figure 24 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 7 of this application;

[0071] Figure 25a is an exploded view of a resonant cavity antenna provided in Embodiment 7 of this application;

[0072] Figure 25b is an exploded view of a resonant cavity antenna provided in Embodiment 7 of this application;

[0073] Figure 26 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 7 of this application;

[0074] Figure 27 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 8 of this application;

[0075] Figure 28 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 8 of this application;

[0076] Figure 29 is a simplified cross-sectional view of a resonant cavity antenna provided in Embodiment 9 of this application;

[0077] Figure 30a is an exploded view of a resonant cavity antenna provided in Embodiment 9 of this application;

[0078] Figure 30b is an exploded view of a resonant cavity antenna provided in Embodiment 9 of this application;

[0079] Figure 31 is a partial cross-sectional structural diagram of a resonant cavity antenna provided in Embodiment 9 of this application.

[0080] Reference numerals: 10-Resonant cavity antenna; 101-First connection port; 102-Connecting channel; 20-Metal housing; 201-Metal outer shell; 202-Metal frame; 30-Audio module; 301-Second connection port; 40-Screen; 50-Sealing ring; 60-Conductive foam; 70-Buffer foam; 80-Sealing foam; 1-Metal sheet; 11-Pin; 12-Top plate; 2-Dielectric substrate; 21-First substrate; 22-Second substrate; 23-Protrusion; 3-Metal ground; 4-Structural component; 5-Connector; a1-First surface; a2-Second surface; c-Sound outlet; d1-First side; d2-Second side; j-Gap; s1-Injection hole; s2-Protrusion; t - Annular boss; B - Clearance opening; C - Opening groove; J - Connecting hole; K1 - First through hole; K2 - Second through hole; Q1 - Internal cavity; Q2 - Audio chamber; T1 - First boss; T2 - Second boss; U1 - First through groove; U2 - Second through groove; V - Hollow out. Detailed Implementation

[0081] With the rapid development of technology, terminal devices are evolving at an unprecedented pace. Consumers not only have basic needs for communication, photography, and audio, but also demand a premium look, feel, and a slim, lightweight design. Existing terminal devices are gradually evolving from sandwich architecture to a unibody all-metal design. To ensure a seamless metal body, resonant cavity antennas are typically used. The main problem with resonant cavity antennas is that they are usually large solid structures, which can compress the cavity space of the speaker module and affect the speaker's sound quality.

[0082] Based on this situation, this application provides a resonant cavity antenna and an electronic device having the resonant cavity antenna. The internal cavity of the resonant cavity antenna can be used to communicate with the audio cavity of the electronic device, so that the internal cavity serves as part of the audio cavity of the audio module, thereby expanding the audio cavity of the audio module and optimizing the sound effect while satisfying the antenna performance.

[0083] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0084] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0085] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0086] This application provides an electronic device, which can be a terminal device such as a laptop, tablet, mobile phone, or wearable device. The electronic device has a unibody metal casing and provides audio and communication functions. Taking the tablet shown in Figure 1a as an example, the tablet includes a metal casing 20 and a screen 40. The screen 40 is embedded in the metal casing 20, and a space is formed between the screen 40 and the metal casing 20 to accommodate other components of the tablet. Referring to the partial structure of the tablet after hiding the screen 40 shown in Figure 1b, the tablet also includes an audio module 30 and a resonant cavity antenna 10, which are disposed between the metal casing 20 and the screen 40. The metal casing 20 of the electronic device provided in this application is a seamless unibody design; therefore, a resonant cavity antenna 10 is used for communication.

[0087] Referring to Figures 1a and 1b, the metal housing 20 includes a metal outer shell 201 and a metal middle frame 202. The metal outer shell 201 can be considered as the bottom wall of the metal housing 20, and the metal middle frame 202 can be considered as the side wall of the metal housing 20, surrounding the edge of the metal outer shell 201. For example, a sound outlet c is provided at a certain point on the metal middle frame 202, and an audio module 30 can be provided corresponding to this sound outlet c. The sound emitted by the audio module 30 can be transmitted through the sound outlet c. Specifically, there can be one or more audio modules 30, and different audio modules 30 are distributed at different positions on the corners of the metal housing 20 according to the design of the electronic device. Figure 1c is a detailed enlarged view of V1 in Figure 1b. As shown in Figure 1c, there is a gap j between the side of the resonant cavity antenna 10 and the metal middle frame 202 of the metal housing 20, and the screen 40 will cover this gap j when it is installed on the metal housing 20. The screen 40 will not affect the transmission of electromagnetic waves. When the resonant cavity antenna 10 is installed inside the metal housing 20 of the electronic device, the resonant cavity antenna 10 can transmit or receive electromagnetic waves through the gap j.

[0088] Based on the electronic devices illustrated in Figures 1a and 1b, the audio module 30 in Figure 1b is exemplified by two tweeters; the larger the audio cavity, the better the sound effect. In the electronic device provided in this application embodiment, the audio module 30 can share a cavity design with the adjacent resonant cavity antenna 10 to expand the volume of the sound cavity.

[0089] Figure 2 illustrates a simplified cross-sectional view of the shared cavity design of the resonant cavity antenna 10 and the audio module 30. As shown in Figure 2, the resonant cavity antenna 10 has an internal cavity Q1, which is a relatively closed space formed by the structure of the resonant cavity antenna 10 itself. The audio module 30 has an audio chamber Q2. The resonant cavity antenna 10 and the audio module 30 are connected, and the internal cavity Q1 and the audio chamber Q2 are connected. The internal cavity Q1 and the audio chamber Q2 can be sealed and connected to form the sound cavity of the audio module 30. That is to say, a closed sound cavity can be formed between the resonant cavity antenna 10 and the audio module 30. It should be understood that the relatively closed space formed by the internal cavity Q1 here means that there are no other openings except for the connection with the audio chamber Q2, which meets the closed design requirements of the audio module 30 for the sound cavity. For ease of understanding, a three-dimensional reference coordinate system is established in Figure 2, with the X, Y, and Z directions perpendicular to each other. Combining the electronic devices shown in Figures 1a and 1b, the X direction is the arrangement direction of the resonant cavity antenna 10 and the audio module 30, and the X direction is parallel to the metal casing 201 of the electronic device. The Y direction is parallel to the metal casing 201 and perpendicular to the X direction. The Z direction is perpendicular to the metal casing 201. It can be considered that the Z direction is the thickness direction of the resonant cavity antenna 10.

[0090] For the resonant cavity antenna 10, the resonant cavity used to reflect electromagnetic waves is basically adapted to the volume of the resonant cavity antenna 10. The internal cavity Q1 is part of the resonant cavity of the resonant cavity antenna 10, or at least shares a portion of the space with the resonant cavity of the resonant cavity antenna 10. That is to say, based on the structure of the resonant cavity antenna 10 itself, the structural design of the internal cavity Q1 does not increase the space occupied by the resonant cavity antenna 10 itself. By forming the internal cavity Q1 through the resonant cavity antenna 10 and connecting it with the audio cavity Q2 of the audio module 30, the acoustic cavity of the audio module 30 can be expanded, which can improve the sound effect of the audio module 30 and reduce the impact of the large volume of the resonant cavity antenna 10 on the space compression of the audio module 30. It should be understood that electronic devices may also include some woofers that do not require much acoustic cavity space, but these are not exemplified here.

[0091] The resonant cavity antenna 10 provided in this application embodiment may have multiple implementations. The following will provide an exemplary description of the co-cavity design of the resonant cavity antenna 10 and the audio module 30 through several specific embodiments.

[0092] Example 1

[0093] Figure 3 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, a metal ground 3, and a structural member 4. The metal sheet 1, the dielectric substrate 2, and the structural member 4 can cooperate to form the aforementioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes opposing first surfaces a1 and second surfaces a2. Along the Z direction, the metal sheet 1 includes a top plate 12 and at least one pin 11. At least a portion of the top plate 12 is located on the first surface a1 of the dielectric substrate 2. The pin 11 is connected to the top plate 12 and extends to the second surface a2 of the dielectric substrate 2. The pin 11 is connected to the metal ground 3. The dielectric substrate 2 has a cutout V penetrating the first surface a1 and the second surface a2. The top plate 12 of the metal sheet 1 can cover the opening at the first surface a1 of the dielectric substrate 2, and the structural member 4 can cover the opening at the second surface a2 of the dielectric substrate 2, thereby forming a closed internal cavity Q1 between the metal sheet 1, the dielectric substrate 2, and the structural member 4.

[0094] The resonant cavity antenna 10 also includes a first connection port 101 connected to the internal cavity Q1. The first connection port 101 is used to communicate with the audio chamber of the audio module 30. Exemplarily, the first connection port 101 is connected to the internal cavity Q1 via a connecting channel 102. Both the first connection port 101 and the connecting channel 102 are formed on the dielectric substrate 2. Since the dielectric substrate 2 is formed by injection molding, connecting the internal cavity Q1 and the first connection port 101 via the connecting channel 102 simplifies the structure of the internal cavity Q1 and facilitates its formation.

[0095] Referring to the structure of an electronic device, when the resonant cavity antenna 10 is mounted to the metal housing 20 of the electronic device, the second surface a2 of the dielectric substrate 2 faces the metal outer shell 201, and the first surface a1 is the side of the dielectric substrate 2 facing away from the metal housing 20. It can be considered that the first surface a1 faces the screen 40 of the electronic device. When the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 here; that is, the metal ground 3 can be the metal outer shell 201 or at least a part of the metal outer shell 201.

[0096] Referring to Figure 3, the metal ground 3 is located on the side of the structural member 4 facing away from the second surface a2 of the dielectric substrate 2. The pins 11 of the metal sheet 1 extend towards the second surface a2 of the dielectric substrate 2 and are electrically connected to the metal ground 3 to achieve grounding. The structural member 4 avoids the pins 11. The metal sheet 1 is used to receive or transmit electromagnetic waves in the resonant cavity antenna 10. At least a portion of the dielectric substrate 2 is located between the metal ground 3 and the metal sheet 1, such that there is a certain gap between the metal sheet 1 and the metal ground 3. The resonant cavity of the resonant cavity antenna 10 can be formed between the metal sheet 1 and the metal ground 3. The electromagnetic waves emitted or received by the resonant cavity antenna 10 can be reflected multiple times within the resonant cavity, thus enabling the communication function of the resonant cavity antenna 10. The space between the metal sheet 1 and the metal ground 3 can be considered as the resonant cavity of the resonant cavity antenna 10, and this resonant cavity may include at least a portion of the physical space occupied by the dielectric substrate 2. The internal cavity Q1 of the resonant cavity antenna 10 is formed by the metal sheet 1 and the dielectric substrate 2. It can be considered that the internal cavity Q1 is part of the resonant cavity, or that the internal cavity Q1 shares a part of the space with the resonant cavity. The formation of the internal cavity Q1 will not increase the space occupied by the overall structure of the resonant cavity antenna 10.

[0097] It should be understood that the first surface a1 and the second surface a2 of the dielectric substrate 2 are not necessarily planar, and may have structures such as bosses and grooves depending on the spatial design of the electronic device and the structural layout of the resonant cavity antenna 10. At least a portion of the top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2, and the pin 11 is partially located on the second surface a2 of the dielectric substrate 2. The position of the pin 11 can be adjusted according to the application scenario. When the pin 11 corresponds to the position of the first connection port 101 and passes through the communication channel height 102, the pin 11 is provided with at least one clearance port B. When the pin 11 is injection molded and fixed to the dielectric substrate 2, the clearance port B can conduct the internal cavity Q1 and the first connection port 101.

[0098] Figures 4a to 4d illustrate specific possible implementations of the resonant cavity antenna 10 shown in Figure 3. Figure 4a is a view of the resonant cavity antenna 10 from the top side along the Z-direction in the thickness direction of the resonant cavity antenna 10; Figure 4b is a view of the resonant cavity antenna 10 from the bottom side along the Z-direction in the thickness direction of the resonant cavity antenna 10; Figure 4c is an exploded view of the resonant cavity antenna 10 from the top side along the Z-direction in the thickness direction of the resonant cavity antenna 10; and Figure 4d is an exploded view of the resonant cavity antenna 10 from the bottom side along the Z-direction in the thickness direction of the resonant cavity antenna 10.

[0099] Referring to Figures 4a and 4b, the metal sheet 1 can be made of steel. The metal sheet 1 is fixed to the dielectric substrate 2 by integral injection molding, and the dielectric substrate 2 provides support for the metal sheet 1. Along the Z-direction, at least a portion of the top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. Along the Z-direction, both the structural member 4 and the metal ground 3 are disposed on one side of the second surface a2 of the dielectric substrate 2. The structural member 4 is exemplarily located between the metal ground 3 and the dielectric substrate 2. The pins 11 of the metal sheet 1 are at least partially located on the second surface a2 of the dielectric substrate 2, and the pins 11 do not contact the structural member 4 on the second surface a2 of the dielectric substrate 2. The metal ground 3 is fixed to the second surface a2 of the dielectric substrate 2 and at least partially stacked on the side of the structural member 4 facing away from the first surface a1 of the dielectric substrate 2. The metal ground 3 is electrically connected to the pins 11 to achieve grounding.

[0100] Referring to Figures 4a and 4b, in order to fix the resonant cavity antenna 10 to the metal housing 201 or to connect and fix the resonant cavity antenna 10 to other structures, the dielectric substrate 2 is also provided with a plurality of connection holes J. Depending on the function, the connection holes J can penetrate the dielectric substrate 2 or can be blind holes. Each connection hole J is not connected to the internal cavity Q1 formed between the metal sheet 1, the dielectric substrate 2, and the structural component 4. The resonant cavity antenna 10 also includes a first boss T1 for engaging with the audio module 30 and a first through hole K1 disposed on the first boss T1. The first boss T1 can be part of the dielectric substrate 2 or have an integral structure with the dielectric substrate 2. The number of first bosses T1 is not limited. In this embodiment, one first boss T1 is provided on each side of the first connection port 101 along the Y direction. Specifically, the shape of the first boss T1 is not limited; it can be a protruding plate protruding from the dielectric substrate 2 along the X direction or a groove formed on the edge of the dielectric substrate 2.

[0101] As shown in Figures 4c and 4d, the resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, a metal ground 3, and a structural component 4. A cutout V in the dielectric substrate 2 extends through the substrate 2 along its thickness direction. The metal sheet 1 can be integrally injection molded with the dielectric substrate 2, and its top plate 12 can cover and close the opening of the cutout V on the first surface a1. The structural component 4 is fixed to one side of the second surface a2 of the dielectric substrate 2 to cover and close the opening of the cutout V on the second surface a2, thereby forming an internal cavity Q1 of the resonant cavity antenna 10 between the metal sheet 1, the dielectric substrate 2, and the structural component 4. This internal cavity Q1 is a relatively closed space. The cutout V communicates with the first connection port 101. In this resonant cavity antenna 10, the first connection port 101, the communication channel 102, and the first boss T1 for mounting the audio module 30 are formed by the dielectric substrate 2. The metal ground 3 is fixed to one side of the second surface a2 of the dielectric substrate 2 and is electrically connected to the pins 11 of the metal sheet 1.

[0102] Referring to Figure 4c, the metal sheet 1 includes a top plate 12 and a plurality of pins 11. Each pin 11 is connected to the edge of the top plate 12 and bends towards the dielectric substrate 2. The top plate 12 is at least partially located on the first surface a1 of the dielectric substrate 2, and the plurality of pins 11 extend to expose the second surface a2 of the dielectric substrate 2. One of the pins 11 corresponds to the location of the first connection port 101, and this pin 11 is provided with at least one clearance opening B. When the pin 11 is injection molded and fixed to the dielectric substrate 2, the clearance opening B can conduct through the opening slot C and the first connection port 101. The number and shape of the pins 11 are not limited, and the partial structure of the pin 11 located on the second surface a2 of the dielectric substrate 2 is exemplaryly close to a rectangle. The pin 11 is zigzag-shaped, and the end of the pin 11 used to connect to the metal ground 3 forms a contact plane to make contact with the metal ground 3 surface, thereby enhancing the connection reliability. The metal sheet 1 also has a plurality of injection holes s1, which can be distributed on the edge of the top plate 12. When the metal sheet 1 and the dielectric substrate 2 are integrally formed by injection molding, the molten liquid used to form the dielectric substrate 2 can enter multiple injection holes s1. After the metal sheet 1 and the dielectric substrate 2 are cooled and formed, the dielectric substrate 2 includes protrusions s2 filling the injection holes s1. The injection holes s1 of the metal sheet 1 and the protrusions s2 of the dielectric substrate 2 can form an interlocking connection structure, enhancing the structural strength of the resonant cavity antenna 10.

[0103] Figure 5 shows a partial cross-sectional structure of the resonant cavity antenna 10. The top plate 12 of the metal sheet 1 covers the opening of the cutout V on the first surface a1 of the dielectric substrate 2. The structural component 4 is fixed to one side of the second surface a2 of the dielectric substrate 2 and covers the opening of the cutout V on the second surface a2. An internal cavity Q1 is formed between the top plate 12, the dielectric substrate 2, and the structural component 4. The pin 11 of the metal sheet 1 protrudes from the second surface a2 of the dielectric substrate 2 and is electrically connected to the metal ground 3 to achieve grounding. When the structural component 4 is fixed to the second surface a2 of the dielectric substrate 2, it avoids the pin 11 of the metal sheet 1, allowing the pin 11 to protrude from the second surface a2 of the dielectric substrate 2. The pin 11 and the metal ground 3 can be electrically connected through conductive foam 60. The conductive foam 60 serves both as an electrical connection and a buffer, and its deformable characteristics allow for a tighter and more continuous contact between the conductive foam 60 and the pin 11, as well as between the conductive foam 60 and the metal ground 3, resulting in a better electrical connection.

[0104] Specifically, structural component 4 and dielectric substrate 2 can be integrally injection molded with metal sheet 1. Alternatively, metal sheet 1 and dielectric substrate 2 can be integrally injection molded, and then dielectric substrate 2 and structural component 4 can be fixed by welding or other methods. It should be understood that structural component 4 can be a plastic part of the same material as dielectric substrate 2, in which case structural component 4 and dielectric substrate 2 can be connected by ultrasonic welding, dispensing, or other methods.

[0105] In some embodiments, structural component 4 can be made of a metallic material, such as steel sheet. A metallic structural component 4 has a thinner profile, which increases the space of the internal cavity Q1 while maintaining the overall thickness of the resonant cavity antenna 10. Connecting the internal cavity Q1 of the resonant cavity antenna 10 to the audio chamber Q2 of the audio module 30 further expands the audio capacity of the audio module 30.

[0106] When using structural components 4 made of metal materials such as steel sheets, structural components 4 can be connected to metal sheets 1 by spot welding or other methods, using structural components 4 as the grounding point for metal sheets 1. That is, metal sheets 1 can be grounded by conductively connecting to metal ground 3 via pin 11, or by conductively connecting to metal ground 3 via structural components 4; one or both methods can be chosen. When metal sheets 1 are not used and the metal structural components 4 are used to conductively connect to metal ground 3, spot welding is not required between structural components 4 and metal sheets 1, which reduces costs.

[0107] Figure 6a illustrates the structure of the resonant cavity antenna 10 and the audio module 30 in this embodiment. Exemplarily, the resonant cavity antenna 10 and the audio module 30 are arranged adjacent to each other along the X direction.

[0108] Figure 6b is a magnified view of the detail at V2 in Figure 6a. Referring to Figures 6a and 6b together, the resonant cavity antenna 10 has a first protrusion T1 on the side facing the audio module 30, and the audio module 30 has a second protrusion T2 on the side facing the resonant cavity antenna 10. The first protrusion T1 and the second protrusion T2 can overlap along the Z direction of the resonant cavity antenna 10, and the resonant cavity antenna 10 and the audio module 30 can be fixed by screws that pass through the first protrusion T1 and the second protrusion T2 in sequence. The resonant cavity antenna 10 and the audio module 30 can also be fixed together to the metal housing 201 or other structures by screws. Of course, the resonant cavity antenna 10 and the audio module 30 may also be fixed in other ways, which are not limited in this application. The structures of the first protrusion T1 and the second protrusion T2 are only examples.

[0109] Figure 6c is a magnified view of the detail at V3 in Figure 6a. As shown in Figure 6c, a first connection port 101 is formed on the side of the resonant cavity antenna 10 facing the audio module 30. This first connection port 101 is used to connect to the internal cavity Q1 of the resonant cavity antenna 10. A second connection port 301 is formed on the side of the audio module 30 facing the resonant cavity antenna 10. This second connection port 301 is used to connect to the audio chamber Q2 of the audio module 30. The first connection port 101 and the second connection port 301 are mated and connected, which can connect the internal cavity Q1 and the audio chamber Q2, realizing the common cavity design of the resonant cavity antenna 10 and the audio module 30. Exemplarily, in order to enhance the connection reliability and sealing, the first connection port 101 and the second connection port 301 are connected by a sealing ring 50. When the first connection port 101 and the second connection port 301 are mated, the sealing ring 50 is pressed between the end faces of the first connection port 101 and the second connection port 301. The sealing ring 50 surrounds the first connection port 101 and the second connection port 301 to form a channel, thereby achieving a seal. The sealing ring 50 can be a sealing foam, a sealing rubber ring, or other structures. Of course, the sealed connection between the first connection port 101 and the second connection port 301 can also be achieved through other methods such as adhesive bonding. It should be understood that the internal cavity Q1 is the internal structure of the resonant cavity antenna 10, and the audio chamber Q is the internal structure of the audio module 30; therefore, neither the internal cavity Q1 nor the audio chamber Q2 is shown here.

[0110] Referring to Figures 6a and 6d, the mating structure of the resonant cavity antenna 10 and the audio module 30 is observed from the second surface a2 side of the dielectric substrate 2 along the Z direction. As shown in Figure 6d, the metal plate 1 of the resonant cavity antenna 10 has at least one pin 11 exposed on the side of the dielectric substrate 2 facing the metal housing 201. These pins 11 can serve as grounding points for the metal plate 1 and be connected to the metal ground 3. When specifically fixing the resonant cavity antenna 10 to the metal housing 201, a buffer structure such as insulating foam can be added between the dielectric substrate 2 and the metal housing 201 to protect the resonant cavity antenna 10.

[0111] Based on the cooperative structure of the resonant cavity antenna 10 and the audio module 30 shown in Figures 6a to 6d, Figures 7a and 7b show the structure in which the resonant cavity antenna 10 and the audio module 30 are separated.

[0112] Referring to Figures 7a and 7b, the first connection port 101 of the resonant cavity antenna 10 and the second connection port 301 of the audio module 30 can be connected by a sealing ring 50 to expand the acoustic cavity of the audio module 30 and optimize the audio effect. For example, the resonant cavity antenna 10 forms two first protrusions T1 on one side for connecting the audio module 30, used for overlapping and connecting the audio module 30. Each first protrusion T1 is provided with a first through hole K1 penetrating through it, and a second protrusion T2 for overlapping with the first protrusion T2 is provided with a second through hole K2 penetrating through it. When the first protrusion T1 overlaps with the second protrusion T2, the first through hole K1 and the second through hole K2 can correspond and communicate along the thickness direction of the resonant cavity antenna 10. At this time, it can be fixedly connected to the metal casing 201 of the electronic device by bolts, screws, or other connecting parts passing through the first through hole K1 and the second through hole K2 in sequence.

[0113] For example, along the arrangement direction of the audio module 30 and the resonant cavity antenna 10, the end face of the first connection port 101 used to mate with the end face of the second connection port 301 is inclined and parallel to each other. Specifically, the end face of the first connection port 101 of the resonant cavity antenna 10 is inclined and faces away from the metal housing 201, while the end face of the second connection port 301 of the audio module 30 is inclined and faces closer to the metal housing 201. When installing the audio module 30 and the resonant cavity antenna 10, the sealing ring 50 can be first glued and fixed to the first connection port 101 of the resonant cavity antenna 10, with the sealing ring 50 surrounding the first connection port 101. Then, along the direction from the screen 40 of the electronic device towards the metal housing 201, the second connection port 301 of the audio module 30 is pressed against the second connection port 301 of the resonant cavity antenna 10, so that the first connection port 101 and the second connection port 301 are sealed together by the sealing ring 50. The end faces of the first connection port 101 and the second connection port 301 are inclined and parallel to each other. During press-fitting, external force can be used to strengthen the tightness of the connection between the first connection port 101 and the second connection port 301. After the resonant cavity antenna 10 and the audio module 30 are fixed to the metal housing 201 by screws or other fasteners, the end face of the second connection port 301 of the audio module 30 presses against the end face of the first connection port 101 of the resonant cavity antenna 10 on the metal housing 201, so that a certain clamping force is always maintained between the first connection port 101 and the second connection port 301, which can ensure that the first connection port 101 and the second connection port 301 are sealed together by the sealing ring 50.

[0114] The tilting methods of the end faces of the first connection port 101 and the second connection port 301 can be interchanged. That is, the end face of the first connection port 101 can also be pressed against the end face of the second connection port 301. Of course, the first connection port 101 of the resonant cavity antenna 10 and the second connection port 301 of the audio module 30 can also be connected and fixed in other ways, which will not be elaborated here.

[0115] Figure 7c shows a partial cross-sectional structure of a resonant cavity antenna 10 connected to an audio module 30 according to an embodiment of this application. As shown in Figure 7c, the resonant cavity antenna 10 has an internal cavity Q1. Exemplarily, the dielectric substrate 2, the top plate 12 of the metal sheet 1, and the structural component 4 of the resonant cavity antenna 10 cooperate to form the internal cavity Q1, which is a relatively sealed space. The relative sealing of the internal cavity Q1 can be considered as the internal cavity Q1 being sealed except for the connection with the first connection port 101. The pins 11 of the metal sheet 1 are exposed on the bottom surface of the dielectric substrate 2 facing the metal shell 201 and are electrically connected to the metal ground 3 through conductive foam 60, so that the resonant cavity of the resonant cavity antenna 10 is formed between the metal sheet 1 and the metal shell 201. At least a portion of the internal cavity Q1 is located within the resonant cavity of the resonant cavity antenna 10. It can be considered that the internal cavity Q1 shares a portion of the space with the resonant cavity, and the formation of the internal cavity Q1 does not increase the space occupied by the overall structure of the resonant cavity antenna 10. It should be understood that the structure of structural component 4 may be irregular and may be adaptively irregular in shape depending on the application scenario. The irregular shape of structural component 4 will affect the shape of the internal cavity Q1. For example, the inner wall of structural component 4 of the resonant cavity antenna 10 illustrated in Figure 7c may have grooves, protrusions, or other structures.

[0116] When the resonant cavity antenna 10 provided in this embodiment is applied to an electronic device having a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 of the resonant cavity antenna 10. Figure 8a illustrates the resonant cavity antenna 10 disposed at a corner of the metal housing 20. The resonant cavity antenna 10 includes at least one first side d1 and at least one second side d2. The first side d1 is adjacent to the metal frame 202 of the metal housing 20, and the second side d2 is opposite to the metal frame 202 of the metal housing 20. It can be considered that the second side d2 is the side of the resonant cavity antenna 10 away from the metal frame 202. The resonant cavity antenna 10 is approximately rectangular. Exemplarily, the two pins 11 of the metal sheet 1 are respectively disposed near the two second sides d2 of the resonant cavity antenna 10 away from the metal frame 202. The two dashed boxes indicate the positions of the pins 11 of the metal sheet 1, and the two rectangular pins 11 are respectively opposite to the two metal frames 202. When the two pins 11 are connected to the metal housing 201, which serves as the metal ground 3, a near-cubic-shaped resonant cavity is formed between the metal sheet 1 and the metal housing 201. The metal housing 201, the metal frame 202, and the two pins 11 are respectively equivalent to at least a portion of the sidewall of the resonant cavity of the resonant cavity antenna 10, which can optimize the antenna performance.

[0117] Figure 8b is a partial cross-sectional view of the resonant cavity antenna 10, audio module 30, and metal housing 201 in conjunction. As shown in Figure 8b, the pins 11 of the metal sheet 1 protrude from the dielectric substrate 2 and are electrically connected to the metal housing 201 via conductive foam 60 or other conductive connectors. Buffer foam 70 can be filled between the dielectric substrate 2 and the metal housing 201 to increase shock resistance and protect the resonant cavity antenna 10. The audio module 30 is fixed to the metal housing 201. The second connection port 301 of the audio module 30 is sealed to the first connection port 101 via a sealing ring 50, enabling communication between the audio chamber Q2 and the internal cavity Q1. Alternatively, buffer foam or other buffer structures can be filled between the audio module 30 and the metal housing 201 to protect the audio module 30.

[0118] Example 2

[0119] Figure 9 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in Embodiment 1, the resonant cavity antenna 10 provided in this embodiment does not include structural component 4. The metal sheet 1 and the dielectric substrate 2 can cooperate to form the aforementioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes opposing first surfaces a1 and second surfaces a2. At least a portion of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. Specifically, the dielectric substrate 2 has an opening slot C with an opening located on the first surface a1. The top plate 12 of the metal sheet 1 can cover the opening slot C at the first surface a1 of the dielectric substrate 2, thereby forming a closed internal cavity Q1 between the metal sheet 1 and the dielectric substrate 2.

[0120] Figures 10a to 10c illustrate specific possible implementations of the resonant cavity antenna 10 shown in Figure 9. Figure 10a is a view of the resonant cavity antenna 10 from the bottom side along the thickness direction of the resonant cavity antenna 10 in the Z direction; Figure 10b is an exploded view of the resonant cavity antenna 10 from the top side along the thickness direction of the resonant cavity antenna 10 in the Z direction; and Figure 10c is an exploded view of the resonant cavity antenna 10 from the bottom side along the thickness direction of the resonant cavity antenna 10 in the Z direction. The structure of the resonant cavity antenna 10 viewed from the top side along the thickness direction of the resonant cavity antenna 10 in the Z direction can be similar to the structure shown in Figure 4a of Embodiment 1, and is not illustrated here.

[0121] As shown in Figure 10a, a portion of the pin 11 of the metal sheet 1 is located on the second surface a2 of the dielectric substrate 2. This pin 11 is connected to the metal ground 3 to ground the metal sheet 1.

[0122] As shown in Figure 10b, the dielectric substrate 2 has an opening groove C, the opening of which is located on the first surface a1. A metal sheet 1 can be fixed to the first surface a1 of the dielectric substrate 2 and seal the opening of the opening groove C, thus forming an internal cavity Q1 between the metal sheet 1 and the dielectric substrate 2. This internal cavity Q1 is a relatively closed space. A first connection port 101 is formed on the outer surface of the dielectric substrate 2 facing the audio module 30, and the first connection port 101 is connected to the opening groove C.

[0123] Figure 11 shows a partial cross-sectional view of the resonant cavity antenna 10. The top plate 12 of the metal sheet 1 covers the opening of the slot C of the dielectric substrate 2, and the top plate 12 and the slot C of the dielectric substrate 2 cooperate to form a relatively closed internal cavity Q1. A first connection port 101 is formed on the dielectric substrate 2, and the first connection port 101 is connected to the internal cavity Q1 through a connecting channel 102. The pins 11 of the metal sheet 1 are exposed on the second surface a2 of the dielectric substrate 2. The pins 11 and the metal ground 3 can be electrically connected through conductive foam 60. The conductive foam 60 serves both as an electrical connection and a buffer, and its deformable characteristics allow for a tighter and more continuous contact between the conductive foam 60 and the pins 11, as well as between the conductive foam 60 and the metal ground 3, resulting in a better electrical connection.

[0124] It should be understood that the structure of the dielectric substrate 2 may be irregular and may be adapted to the application scenario to have an irregular shape. The irregular shape of the dielectric substrate 2 will affect the shape of the internal cavity Q1. For example, the inner wall of the dielectric substrate 2 of the resonant cavity antenna 10 illustrated in Figure 7c may have grooves, protrusions and other structures formed.

[0125] Example 3

[0126] Figure 12 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in Embodiment 2, the metal sheet 1, dielectric substrate 2, and metal ground 3 of the resonant cavity antenna 10 provided in this embodiment can cooperate to form the aforementioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes a first surface a1 and a second surface a2. Specifically, the dielectric substrate 2 has a cutout V that penetrates the first surface a1 and the second surface a2. The top plate 12 of the metal sheet 1 can cover the opening at the first surface a1 of the dielectric substrate 2, and the metal ground 3 can cover the opening at the second surface a2 of the dielectric substrate 2, thereby forming a closed internal cavity Q1 between the metal sheet 1, the dielectric substrate 2, and the metal ground 3.

[0127] Figures 13a to 13d illustrate specific possible implementations of the resonant cavity antenna 10 shown in Figure 12. Figure 13a shows the structure of the resonant cavity antenna 10 viewed from the top side along the Z-direction in the thickness direction of the resonant cavity antenna 10; Figure 13b shows the structure of the resonant cavity antenna 10 viewed from the bottom side along the Z-direction in the thickness direction of the resonant cavity antenna 10; Figure 13c is an exploded view viewed from the top side along the Z-direction in the thickness direction of the resonant cavity antenna 10; and Figure 13d is an exploded view viewed from the bottom side along the Z-direction in the thickness direction of the resonant cavity antenna 10.

[0128] As shown in Figures 13a and 13b, the metal sheet 1 is fixed to the dielectric substrate 2 using an integral injection molding process. Figure 13a shows the top plate 12 of the metal sheet 1 on the first surface a1 of the dielectric substrate 2, and Figure 13b shows the pin 11 of the metal sheet 1 on the second surface a2 of the dielectric substrate 2. The metal ground 3 is fixed to the second surface a2 of the dielectric substrate 2 and is electrically connected to the pin 11.

[0129] As shown in Figures 13c and 13d, exemplarily, the dielectric substrate 2 has a cutout V with a second opening v2 connecting the first surface a1 and the second surface a2. The top plate 12 of the metal sheet 1 can cover and close the opening of the cutout V on the first surface a1, and the metal ground 3 can cover and close the opening of the cutout V on the second surface a2. The number of openings of the cutout V on the first surface a1 and the number of openings of the cutout V on the second surface a2 are not limited. For example, there is one opening of the cutout V on the first surface a1 and two openings of the cutout V on the second surface a2. The cutout V communicates with the first connection port 101. In this resonant cavity antenna 10, the first connection port 101, the communication channel 102, and the first boss T1 for mounting the audio module 30 are formed by the dielectric substrate 2.

[0130] As shown in Figure 13d, on the second surface a2 of the dielectric substrate 2, an annular protrusion t can be formed around the opening of the cutout V on the second surface a2. This annular protrusion t at least partially protrudes from the second surface a2 of the dielectric substrate 2 and is used for a sealing connection with the metal ground 3, thereby closing the opening of the cutout V on the second surface a2. When there are multiple openings of the cutout V on the second surface a2, the annular protrusion t corresponding to each opening of the cutout V on the second surface a2 can be coplanar with the surface of the metal sheet 1 facing away from it. This facilitates the metal ground 3 in simultaneously closing multiple openings, simplifying the process and improving sealing performance.

[0131] Figure 14 shows a partial cross-sectional structure of the resonant cavity antenna 10. As shown in Figure 14, after the metal sheet 1 and the dielectric substrate 2 are injection molded, the top plate 12 of the metal sheet 1 covers the opening of the closed perforation V on the first surface a1. The metal ground 3 is fixed to the second surface a2 of the dielectric substrate 2 and covers the opening of the closed perforation V on the second surface a2. The pins 11 of the metal sheet 1 extend to the second surface a2 of the dielectric substrate 2 and are electrically connected to the metal ground 3. A closed internal cavity Q1 is formed between the metal sheet 1, the perforation V of the dielectric substrate 2, and the metal ground 3.

[0132] Specifically, on one side of the second surface a2 of the dielectric substrate 2, an annular protrusion t surrounding the opening of the cutout V on the second surface a2 can be sealed to the metal ground 3 via a structure such as sealing foam 80. The pins 11 of the metal sheet 1 can be electrically connected to the metal ground 3 via conductive foam 60. The space between the dielectric substrate 2 and the metal ground 3 can be filled with a structure such as buffer foam 70 to protect the resonant cavity antenna 10.

[0133] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0134] Example 4

[0135] Figure 15 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in Embodiment 3, the metal sheet 1 and the metal ground 3 of the resonant cavity antenna 10 provided in this embodiment are connected by a connector 5. Here, the connector 5 is a structure independent of the metal sheet 1, and the connector 5 can be considered as a separate pin 11 of the metal sheet 1. The two ends of the connector 5 are used to connect to the top plate 12 of the metal sheet 1 and the metal ground 3, respectively. The connector 5 is independent of the top plate 12 and the metal ground 3 of the metal sheet 1.

[0136] Figure 16 is an exploded view of a possible implementation of the resonant cavity antenna 10 shown in Figure 15. The connector 5 is conductive and may be made of a metallic material. The connector 5 is independent of the metal sheet 1 and the metal ground 3. The top plate 12 of the metal sheet 1 can be connected to the metal ground 3 via the connector 5. The connector 5 is bent, with one bent plane at one end for contact with the top plate 12 of the metal sheet 1, and the other bent plane at the other end for contact with the metal ground 3. Exemplarily, the connector 5 is located on one side of the connection port 101, and the connector 5 is provided with a clearance hole B for connecting the spaces on both sides of the connector 5. Of course, the metal sheet 1 may also include pins 11 as in Embodiment 2, and be electrically connected to the metal ground 3 through the pins 11.

[0137] Figure 17 shows a partial cross-sectional view of the resonant cavity antenna 10. The top plate 12 of the metal sheet 1 is disposed on the first surface a1 of the dielectric substrate 2 and covers the opening of the sealed perforation V on the first surface a1. The metal ground 3 is disposed on the second surface a2 of the dielectric substrate 2 and covers the opening of the perforation V on the second surface a3. The top plate 12 of the metal sheet 1, the dielectric substrate 2, and the metal ground 3 together form an internal cavity Q1. The top plate 12 of the metal sheet 1 and the metal ground 3 can be electrically connected via a connector 5 or via pins 11 of the metal sheet 1. Alternatively, in this resonant cavity antenna 10, the metal sheet 1 can omit the pins 11 to simplify the structure. The connector 5 is exemplarily located on one side of the first connection port 101, and the clearance hole B on the connector 5 allows the internal cavity Q1 to communicate with the first connection port 101 via a connecting channel 102. The top plate 12 of the metal sheet 1 and the connector 5 can be spot-welded together, as can the metal ground 3 and the connector 5.

[0138] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0139] Example 5

[0140] Figure 18 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in Embodiment 4, the dielectric substrate 2 of the resonant cavity antenna 10 provided in this embodiment includes a first substrate 21 and a second substrate 22. The first substrate 21 and the second substrate 22 are connected to form the dielectric substrate 2. The surface of the first substrate 21 facing away from the second substrate 22 can be considered as the first surface a1 of the dielectric substrate 2, and the surface of the second substrate 22 facing away from the first substrate 21 can be considered as the second surface a2 of the dielectric substrate 2. Both the first substrate 21 and the second substrate 22 are frame-type structures, and the structure formed by connecting the first substrate 21 and the second substrate 22 is similar to the dielectric substrate 2 in Embodiment 4. The metal sheet 1 and the metal ground 3 can be connected by a connector 5, with both ends of the connector 5 connected between the top plate 12 of the metal sheet 1 and the metal ground 3, respectively.

[0141] Figure 19 is an exploded view of a possible implementation of the resonant cavity antenna 10 shown in Figure 18. The first substrate 21 has a first through-slot U1 penetrating the first substrate 21, and the second substrate 22 has a second through-slot U2 penetrating the second substrate 22. The first substrate 21 and the second substrate 22 are connected to form a dielectric substrate 2. The first through-slot U1 and the second through-slot U2 can communicate to form a hollow V. It can be considered that the surface of the first substrate 21 facing away from the second substrate 22 is the first surface a1 of the dielectric substrate 2, and the surface of the second substrate 22 facing away from the first substrate 21 is the second surface a2 of the dielectric substrate 2. A metal sheet 1 is used to integrally injection mold with the first substrate 21 and seal the opening of the first through-slot U1 located on the first surface a1. A metal ground 3 is used to integrally injection mold with the second substrate 22 and seal the opening of the second through-slot U2 located on the second surface a2. The first substrate 21 and the second substrate 22 are then connected by welding or other methods, ultimately forming an internal cavity Q1 between the metal sheet 1, the first substrate 21, the second substrate 22, and the structure 3. In this resonant cavity antenna 10, the dielectric substrate 2 is designed as a first substrate 21 and a second substrate 22, which can simplify the manufacturing process.

[0142] Figure 20 is a partial cross-sectional view of the resonant cavity antenna 10. The metal sheet 1 can be integrally injection molded with the first substrate 21 and covers and seals the opening of the first through groove U1 on the first surface a1. The metal ground 3 can be integrally injection molded with the second substrate 22 and covers and seals the opening of the second through groove U2 on the second surface a2. The first substrate 21 and the second substrate 22 can be connected and fixed by welding or other means. The first through groove U1 and the second through groove U2 can be connected to form the cutout V of the dielectric substrate 2. An internal cavity Q is formed between the metal sheet 1, the first substrate 21, the second substrate 22, and the structural component 4. The top plate 12 of the metal sheet 1 and the structural component 4 can be electrically connected by the connector 5 or by the pins 11 of the metal sheet 1.

[0143] The first substrate 21 and the second substrate 22 can be connected by ultrasonic welding, dispensing, or other methods to form the dielectric substrate 2. This method can also be applied to the dielectric substrate 2 shown in Embodiment 1. When the structural component 4 is made of a metal structure such as a steel sheet, the structural component 4 can be integrally injection molded with the substrate 22, and the internal cavity Q1 is formed between the metal sheet 1, the first substrate 21, the second substrate 22, and the structural component 4.

[0144] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0145] Example 6

[0146] Figure 21 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. The difference from the structure of the resonant cavity antenna 10 shown in Embodiment 1 is that the structural component 4 is omitted in this embodiment. The metal sheet 1 and the metal ground 3 cooperate to form the aforementioned internal cavity Q1. Along the Z-direction, the dielectric substrate 2 includes opposing first surfaces a1 and second surfaces a2. The metal sheet 1 can be made of steel and is fixed to the dielectric substrate 2 by integral injection molding. The top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. The dielectric substrate 2 has an opening slot C, the opening of which is located on the second surface a2. The metal ground 3 is fixed to one side of the second surface a2 of the dielectric substrate 2 and closes the opening of the opening slot C, thus forming the internal cavity Q1 between the dielectric substrate 2 and the metal ground 3.

[0147] Figures 22a and 22b are exploded views of a possible implementation of the resonant cavity antenna 10 shown in Figure 21, and Figure 23 is a partial cross-sectional view of the resonant cavity antenna 10. Figure 22a is a view of the resonant cavity antenna 10 from the top side along the Z-direction in the thickness direction, and Figure 22b is a view of the resonant cavity antenna 10 from the bottom side along the Z-direction in the thickness direction. The first surface a1 of the dielectric substrate 2 is closed. The opening of the slot C of the dielectric substrate 2 is located on the second surface a2. The metal ground 3 is fixed to the dielectric substrate 2 and closes the opening of the slot C, forming a relatively closed internal cavity Q1 between the dielectric substrate 2 and the metal ground 3. The metal ground 3 and the dielectric substrate 2 can be integrally injection molded with the metal sheet 1. Alternatively, the metal sheet 1 and the dielectric substrate 2 can be integrally injection molded, and then the dielectric substrate 2 and the metal ground 3 can be fixed by welding or other methods. In this structure, when the structural component 4 is made of metal, the structural component 4 can be connected to the metal sheet 1 to serve as a grounding point for the metal sheet 1. The structure of the resonant cavity antenna 10 after assembly can be referred to as shown in Embodiment 1, which is not illustrated again here.

[0148] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0149] Example 7

[0150] Figure 24 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, a metal ground 3, and a structural component 4. The difference between this and the resonant cavity antenna 10 shown in Embodiment Six is ​​that the dielectric substrate 2 and the structural component 4 of the resonant cavity antenna 10 provided in this embodiment cooperate to form the aforementioned internal cavity Q1. Along the Z-direction, the dielectric substrate 2 includes opposing first surfaces a1 and second surfaces a2. The metal sheet 1 can be made of steel and is fixed to the dielectric substrate 2 by integral injection molding. The top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. The dielectric substrate 2 has an opening slot C, the opening of which is located on the second surface a2. The structural component 4 is fixed to one side of the second surface a2 of the dielectric substrate 2 and closes the opening of the opening slot C, thus forming the internal cavity Q1 between the dielectric substrate 2 and the structural component 4. The metal ground 3 is disposed on the side of the structural member 4 away from the second surface a2 of the dielectric substrate 2. The pin 11 of the metal sheet 1 extends to the second surface a2 of the dielectric substrate 2 and is electrically connected to the metal ground 3. The structural member 4 avoids the pin 11.

[0151] Figures 25a and 25b are exploded views of a possible implementation of the resonant cavity antenna 10 shown in Figure 24, and Figure 26 is a partial cross-sectional view of the resonant cavity antenna 10. The first surface a1 of the dielectric substrate 2 is closed. The opening of the slot C of the dielectric substrate 2 is located on the second surface a2. The structural member 4 is fixed to the dielectric substrate 2 and closes the opening of the slot C, forming a closed internal cavity Q1 between the dielectric substrate 2 and the structural member 4. The pins 11 of the metal sheet 1 are electrically connected to the metal ground 3 via conductive foam 60. In this structure, when the structural member 4 is made of metal, it can be connected to the metal sheet 1 to act as a grounding point for the metal sheet 1 to connect to the metal ground 3.

[0152] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0153] Example 8

[0154] Figure 27 shows a simplified cross-sectional view of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. The difference between this and the structure of the resonant cavity antenna 10 shown in Embodiment 1 is that the dielectric substrate 2 of the resonant cavity antenna 10 provided in this embodiment forms the aforementioned internal cavity Q1. Along the Z-direction, the dielectric substrate 2 includes opposing first surfaces a1 and second surfaces a2. The top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2, and the pins 11 of the metal sheet 1 pass through the dielectric substrate 2, at least partially exposing the second surface a2 of the dielectric substrate 2. The metal ground 3 is located on one side of the second surface a2 of the dielectric substrate 2, and the metal ground 3 is electrically connected to the pins 11.

[0155] Figure 28 is a partial cross-sectional view of one possible implementation of the resonant cavity antenna 10 shown in Figure 27. The metal sheet 1 can be made of steel and is integrally injection molded to the dielectric substrate 2, such that the top plate 12 is located on the first surface a1 of the dielectric substrate 2, and the pin 11 passes through the dielectric substrate 2 and protrudes from the second surface a2. The metal ground 3 can be fixed to the second surface a2 of the dielectric substrate 2 by welding, and the metal ground 3 is exemplarily electrically connected to the pin 11 through conductive foam 60. The dielectric substrate 2 has a cavity structure, and the inner wall of its cavity structure can form a closed internal cavity Q1. Both the first surface a1 and the second surface a2 of the dielectric substrate 2 are closed. The connecting channel 102 and the first connection port 101 are also formed on the dielectric substrate 2, and the first connection port 101 is connected to the internal cavity Q1 through the connecting channel 102.

[0156] It should be understood that the dielectric substrate 2 in the resonant cavity antenna 10 can be injection molded from the structural component 4 in Embodiment 7 and the dielectric substrate 2, or the dielectric substrate 2 in the resonant cavity antenna 10 can be formed by two dielectric substrate 2 grooves in Embodiment 2 being fastened together.

[0157] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0158] Example 9

[0159] Figure 29 shows a simplified cross-sectional view of a resonant cavity antenna 10. The difference from Embodiment 7 is that the metal sheet 1 of the resonant cavity antenna 10 provided in this embodiment is made of a flexible circuit board. The metal sheet 1 is wrapped around the surface of the dielectric substrate 2, with at least a portion of the metal sheet 1 located on the first surface a1 and at least a portion located on the second surface a2 of the dielectric substrate 2. The dielectric substrate 2 has an opening slot C located on the second surface a2. A metal ground 3 closes the opening of the opening slot C, so that the dielectric substrate 2 and the metal ground 3 cooperate to form an internal cavity Q1.

[0160] Figures 30a and 30b are exploded views of one possible implementation of the resonant cavity antenna 10 shown in Figure 29, and Figure 31 is a partial cross-sectional view of the resonant cavity antenna 10. The metal sheet 1 has a bent structure, including a top plate 12 and pins 11 with an integral structure. The metal sheet 1 is bent and covers the outer surface of the dielectric substrate 2. The top plate 12 is located on the first surface a1 of the dielectric substrate 2, and the pins 11 are located on the second surface a2 of the dielectric substrate 2. The space between the top plate 12 and the pins 11 is used to accommodate the dielectric substrate 2. A metal ground 3 is located on one side of the second surface a2 of the dielectric substrate 2, and the pins 11 are used to connect to the metal ground 3 to achieve grounding.

[0161] It should be understood that the metal ground 3 in this embodiment can be an integral structure with the pin 11. That is, the metal sheet 1 can be large enough to cover the opening of the slot C of the dielectric substrate 2 after bending. The part of the structure of the metal sheet 1 located on the second surface a2 of the dielectric substrate 2 can be regarded as the metal ground 3.

[0162] The structure of the dielectric substrate 2 and the formation of the internal cavity Q1 can also be implemented in other embodiments. For example, when the first surface a1 of the dielectric substrate 2 in this embodiment is open and sealed by the metal sheet 1, the dielectric substrate 2 can be considered as the dielectric substrate shown in Embodiment Three. When the first surface a1 of the dielectric substrate 2 in this embodiment is open and sealed by the metal sheet 1, and the second surface a2 is open and sealed by the metal ground 3, the dielectric substrate 2 can be considered as the dielectric substrate 2 shown in Embodiment Two. When the first surface a1 of the dielectric substrate 2 in this embodiment is open and sealed by the metal sheet 1, and the second surface a2 is open and sealed by the structural member 4, the dielectric substrate 2 can be considered as the dielectric substrate 2 described in Embodiment One. When the dielectric substrate 2 in this embodiment is formed by connecting the first substrate 21 and the second substrate 22, the dielectric substrate 2 can be considered as a structural deformation of the dielectric substrate 2 in Embodiment Five.

[0163] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity plate of the audio module 30, the internal cavity Q1 can serve as part of the sound cavity, thereby expanding the sound cavity capacity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, the difference being the specific implementation of the internal cavity Q1 and the viewing method of the metal plate 1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not described here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10. The cooperation method is also specifically described in Embodiment 1 and will not be repeated here.

[0164] It should be understood that the above embodiments are several possible structural examples of the resonant cavity antenna 10 provided in this application, and are not limited to the above embodiments. The structures in the different embodiments listed above can be superimposed, substituted, or simplified according to the application scenario, as long as a closed internal cavity Q1 can be formed in the resonant cavity antenna 10. This internal cavity Q1 can communicate with the audio chamber of the audio module 30 to expand the audio cavity, which is the technical solution to be protected by the embodiments of this application. For example, the metal ground 3 in Embodiment 4 can also be used as the metal structural component 4 in Embodiment 3; both can be considered as metal structures, and are not limited to the definition of the name. Or, for example, the method of forming the dielectric substrate 2 through the first substrate 21 and the second substrate 22 in Embodiment 5 can also be applied to the formation method of the dielectric substrate 2 of the resonant cavity antenna 10 in other embodiments. Regarding the implementation of the flexible circuit board with metal sheet 1, various structural deformations of dielectric substrate 2, the formation of an internal cavity Q1 between dielectric substrate 2 and metal sheet 1, the formation of an internal cavity Q1 between dielectric substrate 2 and structural component 4, and the formation of an internal cavity Q1 between dielectric substrate 2 and metal ground 3 can all be implemented based on this, and will not be elaborated here.

[0165] In summary, the resonant cavity antenna 10 provided in this application embodiment utilizes its own structure to form an internal cavity Q1. This internal cavity Q1 can be used to communicate with the audio cavity Q2 of the audio module 30, thereby expanding the acoustic cavity of the audio module 30 and improving its sound effects. This internal cavity Q1 expands the acoustic cavity of the audio module 30 without increasing the space occupied by the resonant cavity antenna 10 itself, thus addressing the problem of the resonant cavity antenna 10 compressing the acoustic cavity space of the audio module 30. Electronic devices equipped with this resonant cavity antenna 10 offer a better audio playback experience.

[0166] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A resonant cavity antenna, characterized in that, The resonant cavity antenna is used in an electronic device, which includes an audio module; The resonant cavity antenna has a closed internal cavity, which is used to communicate with the audio chamber of the audio module; The resonant cavity antenna includes a dielectric substrate and a metal sheet and a metal ground fixed to the dielectric substrate. The metal sheet and the metal ground are spaced apart and the ground point of the metal sheet is electrically connected to the metal ground. A resonant cavity is formed between the metal sheet and the metal ground. The internal cavity is at least partially located between the metal sheet and the metal ground.

2. The resonant cavity antenna according to claim 1, characterized in that, The dielectric substrate has opposing first and second surfaces; The metal sheet is fixed to the first surface of the dielectric substrate, and the grounding point of the metal sheet is exposed on the second surface of the dielectric substrate; The metal ground is fixed to the second surface of the dielectric substrate and is electrically connected to the grounding point of the metal sheet.

3. The resonant cavity antenna according to claim 2, characterized in that, The dielectric substrate includes a cutout connecting the first surface and the second surface, and the metal sheet seals the opening of the cutout located on the first surface; The metal ground seals the opening of the cutout located on the second surface, and the internal cavity is formed between the metal sheet, the cutout of the dielectric substrate, and the metal ground; or, the resonant cavity antenna includes a structural component for sealing the opening of the cutout located on the second surface, and the internal cavity is formed between the metal sheet, the cutout of the dielectric substrate, and the structural component.

4. The resonant cavity antenna according to claim 3, characterized in that, The structural component is made of metal, and the grounding point of the metal sheet is connected to the metal ground through the structural component.

5. The resonant cavity antenna according to claim 2, characterized in that, The dielectric substrate includes an opening groove located on the first surface, and the metal sheet seals the opening groove located on the first surface, forming the internal cavity between the metal sheet and the opening groove of the dielectric substrate.

6. The resonant cavity antenna according to claim 2, characterized in that, The dielectric substrate includes an opening groove with the opening located on the second surface; The metal ground seals the opening of the slot located on the first surface, and the internal cavity is formed between the metal ground and the slot of the dielectric substrate; or, the resonant cavity antenna includes a structural member that seals the opening of the slot located on the first surface, and the internal cavity is formed between the structural member and the slot of the dielectric substrate.

7. The resonant cavity antenna according to claim 2, characterized in that, The dielectric substrate has a cavity structure, and the inner wall of the cavity structure forms the internal cavity.

8. The resonant cavity antenna according to any one of claims 2-7, characterized in that, The dielectric substrate includes a first substrate and a second substrate connected in series; The surface of the first substrate that is opposite to the second substrate is the first surface, and the metal sheet is fixed to the first substrate; The surface of the second substrate that is opposite to the first substrate is the second surface, and the metal ground is fixed to the second substrate.

9. The resonant cavity antenna according to any one of claims 1-8, characterized in that, The dielectric substrate includes a first connection port and a communication channel. The communication channel is connected between the internal cavity and the first connection port. The first connection port is used to communicate with the audio chamber of the audio module.

10. The resonant cavity antenna according to any one of claims 1-9, characterized in that, The metal sheet includes a top plate and pins connected to the top plate. The pins are used as grounding points of the metal sheet and are connected to the metal ground. The pins are in surface contact with the metal ground.

11. The resonant cavity antenna according to any one of claims 1-10, characterized in that, The metal sheet is a steel sheet or a flexible circuit board.

12. The resonant cavity antenna according to any one of claims 1-11, characterized in that, The grounding point of the metal sheet is connected to the metal ground via conductive foam.

13. An electronic device, characterized in that, The electronic device's audio module and resonant cavity antenna; The resonant cavity antenna includes a dielectric substrate and a metal sheet and a metal ground fixed to the dielectric substrate. The metal sheet and the metal ground are spaced apart and the ground point of the metal sheet is electrically connected to the metal ground. A resonant cavity is formed between the metal sheet and the metal ground. The resonant cavity antenna includes a closed internal cavity, at least a portion of which is part of the resonant cavity body; The audio module has an audio chamber, which is connected to the internal cavity.

14. The electronic device according to claim 13, characterized in that, The electronic device includes a metal housing, a portion of which serves as the metal ground for the resonant cavity antenna.

15. The electronic device according to claim 14, characterized in that, The metal housing includes a metal housing and a metal frame perpendicular to the metal housing, and the dielectric substrate is fixed to the metal housing; The dielectric substrate for fixing to the surface of the metal ground includes a first side and a second side opposite to each other, the first side being adjacent to the metal frame and the second side being opposite to the metal frame; The grounding points for connecting the metal sheet to the metal ground are distributed on the second side.

16. The electronic device according to claim 15, characterized in that, There is a gap between the resonant cavity antenna and the metal frame, and the resonant cavity antenna is used to transmit or receive electromagnetic waves through the gap.

17. The electronic device according to any one of claims 13-16, characterized in that, The resonant cavity antenna includes a first connection port, which is connected to the internal cavity. The audio module includes a second connection port, which is connected to the audio chamber and is sealed to the first connection port.

18. The electronic device according to claim 17, characterized in that, A sealing ring is provided between the first connection port and the second connection port, and the sealing ring surrounds the channel formed by the communication between the first connection port and the second connection port.

19. The electronic device according to claim 18, characterized in that, The sealing ring is a sealing foam or a sealing rubber sleeve.

20. The electronic device according to claim 18 or 19, characterized in that, The audio module and the resonant cavity antenna are arranged on the same layer. Along the arrangement direction of the audio module and the resonant cavity antenna, the end face of the first connection port used to dock with the second connection port is inclined and parallel to the end face of the second connection port used to dock with the first connection port.

21. The electronic device according to any one of claims 13-20, characterized in that, The resonant cavity antenna includes a first protrusion, and the audio module includes a second protrusion. The first protrusion and the second protrusion are overlapped and fixed along a direction perpendicular to the arrangement of the audio module and the resonant cavity antenna.

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