Wafer transfer device and wafer processing device

Abstract

A wafer transfer device 2 comprises an intermediate placement part 23 (24) which is provided for temporarily placing a wafer ring structure W (Ws) and on which an annular frame Wf (Wsf) of the wafer ring structure W (Ws) is placed. The wafer transfer device 2 comprises a transfer head 25 (26) including: a holding part 25a (26a) for holding the annular frame Wf (Wsf) when transferring the wafer ring structure W (Ws) from the intermediate placement part 23 (24) to a prescribed location 35 (1); a positioning part 25e (25f) for positioning the wafer ring structure W (Ws) in a horizontal direction in a state in which the wafer ring structure W (Ws) has been placed on the intermediate placement part 23 (24); and a pressing movement part 25h for moving the wafer ring structure W (Ws) so as to be pressed against the positioning part 25e (25f).

Description

Wafer transfer device and wafer processing device

[0001] The present invention relates to a wafer transfer device and a wafer processing device.

[0002] 2. Description of the Related Art Conventionally, wafer transfer devices and wafer processing devices have been known, such as those disclosed in Japanese Patent No. 5,653,183.

[0003] The above-mentioned Japanese Patent Publication No. 5653183 discloses a processing apparatus (wafer processing apparatus) that includes a cutting unit, a chuck table, a frame clamp, and an air cylinder.

[0004] The cutting unit in Japanese Patent No. 5653183 includes a cutting blade that cuts wafers in a wafer unit (wafer ring structure) held by suction on a chuck table. The wafer is divided into multiple chips by the cutting blade. Here, the wafer unit includes an adhesive tape, a wafer attached to the adhesive tape, and an annular frame attached to the adhesive tape.

[0005] The chuck table in Japanese Patent No. 5653183 is configured to be movable horizontally and rotatable about a vertical axis of rotation. The portion of the adhesive tape on the wafer unit to which the wafer is attached is placed on the chuck table. The frame clamp is configured to be rotatable between a clamping position where it clamps (holds) the annular frame of the wafer unit held by suction on the chuck table and a release position where it releases the clamp. Four frame clamps are arranged at equal angular intervals. The air cylinder is configured to move the frame clamp, when rotated to the release position, radially inward and outward, perpendicular to the direction of the rotation axis.

[0006] In the processing apparatus of Japanese Patent No. 5653183, before the wafer unit placed on the chuck table is suction-held, the wafer unit is centered (positioned) using an air cylinder and a frame clamp positioned at the release position. Specifically, in the processing apparatus, each of the multiple frame clamps positioned at the release position is moved radially inward by the air cylinder, and each of the multiple frame clamps is brought into contact with the annular frame, thereby positioning the wafer unit.

[0007] Patent No. 5653183

[0008] However, in the processing apparatus of Japanese Patent No. 5653183, when the wafer unit is positioned by abutting each of the multiple frame clamps against the annular frame, the wafer unit slides on the chuck table. In this case, the adhesive tape on the wafer unit slides on the chuck table, causing the adhesive tape to become charged, and the charged adhesive tape also charges the wafer. Therefore, in the processing apparatus of Japanese Patent No. 5653183, when the wafer unit is positioned and then the cutting blade is used to divide the wafer into multiple chips, if the cutting blade comes into contact with the charged wafer, it is possible that electricity will be applied to the wafer due to discharge from the wafer to the cutting blade. Therefore, it is desirable to prevent the wafer from becoming charged when the wafer unit (wafer ring structure) is positioned.

[0009] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a wafer transfer device and a wafer processing device that can prevent the wafer from becoming charged when the wafer ring structure is positioned horizontally.

[0010] A wafer transfer device according to a first aspect of the present invention is a wafer transfer device that transfers a wafer ring structure including a wafer attached to a sheet member and an annular frame attached to the sheet member, and is equipped with a transfer head that includes an intermediate loading section on which the annular frame of the wafer ring structure is temporarily placed, a holding section that holds the annular frame when transferring the wafer ring structure from the intermediate loading section to a predetermined location, a positioning section that positions the wafer ring structure horizontally while the wafer ring structure is placed on the intermediate loading section, and a pressing and moving section that moves the wafer ring structure so as to press it against the positioning section.

[0011] As described above, the wafer working device according to the first aspect of the present invention includes a transfer head including a positioning unit that horizontally positions the wafer ring structure while the wafer ring structure is placed on the intermediate placement unit, and a pressing and moving unit that moves the wafer ring structure so as to press it against the positioning unit. Because the annular frame of the wafer ring structure is placed on the intermediate placement unit, when the pressing and moving unit moves the wafer ring structure for horizontal positioning, the sheet member to which the wafer is attached does not slide on the intermediate placement unit. This prevents charging of the sheet member due to sliding, thereby preventing charging of the wafer attached to the sheet member. As a result, charging of the wafer can be prevented when the wafer ring structure is horizontally positioned.

[0012] In the wafer working device according to the first aspect, the positioning unit is preferably arranged on one side in a first horizontal direction and includes a head-side positioning engaging member that engages with a frame-side positioning engaging member provided on the outer periphery of the annular frame, and the pressing and moving unit is arranged on the other side in the first direction and is configured to move the wafer ring structure to one side in the first direction so as to press the frame-side positioning engaging member against the head-side positioning engaging member. With this configuration, the pressing and moving unit moves the wafer ring structure to one side in the first direction while engaging the frame-side positioning engaging member of the annular frame with the head-side positioning engaging member, thereby moving the wafer ring structure horizontally so as to eliminate misalignment of the wafer ring structure with respect to the transfer head, thereby facilitating horizontal positioning of the wafer ring structure with respect to the transfer head.

[0013] In this case, the pressing and moving unit preferably includes a contact portion that contacts the other side of the annular frame in the first direction, and a movement drive unit that linearly moves the contact portion to one side in the first direction to move the wafer ring structure so as to press the frame-side positioning engaging portion against the head-side positioning engaging member. With this configuration, the horizontal positioning of the wafer ring structure relative to the transfer head can be achieved simply by linearly moving the contact portion with the movement drive unit. As a result, an air cylinder or the like can be used as a drive source for linear movement, thereby simplifying the configuration for positioning the wafer ring structure.

[0014] In a wafer transfer device equipped with a transfer head including the head-side positioning engaging member, the head-side positioning engaging member preferably includes a pair of pins arranged side by side in the second direction, corresponding to a pair of notches arranged side by side in the horizontal direction perpendicular to the first direction, as frame-side positioning engaging portions. With this configuration, the wafer ring structure can be positioned by both the engagement between one of the pair of notches and one of the pair of pins and the engagement between the other of the pair of notches and the other of the pair of pins. For example, the engagement between one of the pair of notches and one of the pair of pins can position the wafer ring structure in the first and second directions in the horizontal plane, and the engagement between the other of the pair of notches and the other of the pair of pins can position the wafer ring structure in the rotational direction. As a result, the wafer ring structure can be positioned in the first direction, the second direction, and the rotational direction relative to the transfer head in the horizontal plane.

[0015] In a wafer transfer device equipped with a transfer head including the head-side positioning engaging member, the head-side positioning engaging member preferably includes a first head-side positioning engaging member provided to align with the position of the frame-side positioning engaging portion of a first annular frame as the annular frame, and a second head-side positioning engaging member provided to align with the position of the frame-side positioning engaging portion of a second annular frame having a dimension smaller than that of the first annular frame. With this configuration, wafer ring structures of different sizes can be positioned using a single transfer head, and therefore, unlike when wafer ring structures of different sizes are positioned using separate transfer heads, there is no need to provide separate transfer heads dedicated to positioning wafer ring structures of different sizes.

[0016] In this case, the transfer head preferably includes a first mounting member and a second mounting member to which the first and second head-side positioning engaging members are attached, the second mounting member being attached so as to be relatively movable on one side in the first direction and the other side in the first direction. With this configuration, by moving the second mounting member in the first direction relative to the first mounting member, the first head-side positioning engaging member can be adjusted to match the position of the frame-side positioning engaging portion of the first annular frame, and the second head-side positioning engaging member can be adjusted to match the position of the frame-side positioning engaging portion of the second annular frame. Therefore, the positions of the first and second head-side positioning engaging members can be adjusted in a second direction, horizontally perpendicular to the first direction, in addition to the first direction, without moving each of the first and second head-side positioning engaging members relative to the second mounting member. Here, when each of the first head-side positioning engaging member and the second head-side positioning engaging member is moved relative to the second mounting member in the second direction, a structure for moving each of the first head-side positioning engaging member and the second head-side positioning engaging member relative to the second mounting member is required, and the accuracy of the positioning of each of the first head-side positioning engaging member and the second head-side positioning engaging member is reduced by the tolerance of the structure. However, since a structure for relative movement in the second direction is not required, the tolerance does not occur, and each of the first head-side positioning engaging member and the second head-side positioning engaging member can be accurately positioned on the second mounting member. As a result, by using the first head-side positioning engaging member and the second head-side positioning engaging member accurately positioned on the second mounting member, the wafer ring structure can be accurately positioned relative to the transfer head.

[0017] In the wafer transfer device equipped with a transfer head including the second head-side positioning engaging member, the second head-side positioning engaging member is preferably configured to be movable to an engaging position when positioning the second wafer ring structure including the second annular frame, and to be movable to a retracted position from the engaging position when positioning the first wafer ring structure including the first annular frame. This configuration prevents interference between the first annular frame and the second head-side positioning engaging member when positioning the first wafer ring structure. Furthermore, the first head-side positioning engaging member is positioned to fit the first annular frame, which is larger than the second annular frame, and is therefore positioned outside the second head-side positioning engaging member. This eliminates the need for a retractable first head-side positioning engaging member when positioning the second wafer ring structure, thereby reducing the complexity of the transfer head structure compared to when the first head-side positioning engaging member is also retractable.

[0018] The wafer transfer device including the pressing and moving unit provided with the abutment unit and the movement drive unit preferably further includes a control unit that controls the movement drive unit to linearly move the abutment unit to one side in the first direction when positioning the wafer ring structure in the horizontal direction before transferring the wafer ring structure to a predetermined location from the intermediate placement unit. With this configuration, the control unit can position the wafer ring structure with respect to the transfer head, and then transfer the positioned wafer ring structure to the predetermined location.

[0019] In this case, the control unit is preferably configured to linearly move the abutting unit to position the wafer ring structure in the horizontal direction, and then control the holding unit to hold the annular frame and transfer the wafer ring structure onto a table that serves as a predetermined location for adsorbing the wafer ring structure. With this configuration, if the table is located directly below the transfer head, the wafer ring structure can be positioned horizontally relative to the transfer head, and then the transfer head can transfer the wafer ring structure to the table directly below, thereby transferring the wafer ring structure while it is positioned horizontally relative to the table.

[0020] The wafer transfer device equipped with the above-described control unit preferably further includes a hand unit that transfers the wafer ring structure to a cassette unit, which is a predetermined location for storing the wafer ring structure, and the control unit is configured to linearly move the abutment unit to position the wafer ring structure in the horizontal direction, and then control the hand unit to transfer the wafer ring structure to the cassette unit. With this configuration, the hand unit can hold the wafer ring structure in a positioned state, and therefore can transfer the wafer ring structure while holding a predetermined location on the annular frame. As a result, when the hand unit transfers the wafer ring structure, the wafer ring structure can be transported to the cassette unit in a stable state.

[0021] In the wafer transfer device equipped with the control unit, the transfer heads preferably include a first transfer head and a second transfer head, and the control unit is configured to control the other of the first transfer head and the second transfer head to hold the pre-processed wafer ring structure, which has been horizontally positioned by the positioning unit, before one of the first transfer head and the second transfer head processes the wafer while it is held by suction on a table serving as a predetermined location for suctioning the wafer ring structure and transfers the processed wafer ring structure onto the intermediate placement unit. With this configuration, while processing is being performed on the wafer ring structure held by the single table, the other of the first transfer head and the second transfer head can hold and prepare for transfer the next pre-processed wafer ring structure to be processed. Then, when processing of the wafer held on the table is completed, one of the first transfer head and the second transfer head can receive the processed wafer ring structure from the table, and the other of the first transfer head and the second transfer head can deliver the prepared pre-processed wafer ring structure to the table. As a result, when wafers are processed using a single table, it is possible to prevent the waiting time before the wafers are processed from becoming long, and thus it is possible to process a plurality of wafers efficiently.

[0022] As described above, the wafer processing apparatus according to the second aspect of the present invention comprises a suction table section that adsorbs a wafer ring structure including a wafer attached to a sheet member and an annular frame attached to the sheet member, a wafer processing section that processes the wafer of the wafer ring structure adsorbed to the suction table section, an intermediate mounting section on which the annular frame of the wafer ring structure is temporarily placed, a holding section that holds the annular frame when transferring the wafer ring structure from the intermediate mounting section to a predetermined location, a positioning section that positions the wafer ring structure horizontally while the wafer ring structure is placed on the intermediate mounting section, and a pressing and moving section that moves the wafer ring structure so as to press it against the positioning section.

[0023] In a second aspect of the present invention, a wafer processing apparatus includes a transfer head including a positioning unit that horizontally positions the wafer ring structure while the wafer ring structure is placed on the intermediate placement unit, and a pressing and moving unit that moves the wafer ring structure so as to press it against the positioning unit. The annular frame of the wafer ring structure is placed on the intermediate placement unit, and when the pressing and moving unit moves the wafer ring structure for positioning, the sheet member to which the wafer is attached does not slide on the intermediate placement unit. This prevents charging of the sheet member due to sliding, thereby preventing charging of the wafer attached to the sheet member. As a result, a wafer processing apparatus can be provided that prevents charging of the wafer that occurs when the wafer ring structure is horizontally positioned.

[0024] According to the present invention, as described above, it is possible to prevent the wafer from being charged when the wafer ring structure is positioned in the horizontal direction.

[0025] FIG. 1 is a plan view of a laser processing apparatus according to an embodiment; FIG. 2 is a plan view of a wafer before laser processing is performed in the laser processing apparatus according to an embodiment; FIG. 3 is a block diagram showing a control configuration of the laser processing apparatus according to an embodiment; FIG. 4 is a side view of a first transfer head and a second transfer head of the laser processing apparatus according to an embodiment; FIG. 5 is a side view of the first transfer head and a first rail unit of the laser processing apparatus according to an embodiment; FIG. 6 is a perspective view of the first transfer head and the second transfer head of the laser processing apparatus according to an embodiment; FIG. 7 is a perspective view of the first transfer head of the laser processing apparatus according to an embodiment in a first head size state; FIG. 8 is a perspective view of the first transfer head of the laser processing apparatus according to an embodiment in a second head size state; FIG. 9 is a bottom view showing the positioning of a wafer ring structure by a pair of first positioning pins and a pressing moving unit of the laser processing apparatus according to an embodiment before positioning; FIG. 10 is a bottom view showing the positioning of a wafer ring structure by a pair of first positioning pins and a pressing moving unit of the laser processing apparatus according to an embodiment, midway through positioning; FIG. 11 is a bottom view showing the completed state of positioning of the wafer ring structure by the pair of first positioning pins and a pressing moving unit of the laser processing apparatus according to an embodiment; FIG. 12 is a plan view of the first transfer head of the laser processing apparatus according to an embodiment in a first head size state. FIG. 1 is a plan view of a first transfer head of a laser processing apparatus in a second head size state according to an embodiment; FIG. 2 is a plan view for explaining supply of wafer ring structures of a laser processing apparatus in an embodiment; FIG. 3 is a plan view for explaining replacement of wafer ring structures of a laser processing apparatus in an embodiment; FIG. 4 is a flowchart showing a state in which a wafer ring structure before processing is transferred to a chuck table portion in a wafer processing method by a control unit of a laser processing apparatus in an embodiment; and FIG. 5 is a flowchart showing a state in which a processed wafer ring structure is transported from the chuck table portion to a cassette portion in a wafer processing method by a control unit of a laser processing apparatus in an embodiment.

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0027] The configuration of a laser processing apparatus 100 according to an embodiment of the present invention will be described with reference to Figures 1 to 17. The laser processing apparatus 100 is an example of the "wafer processing apparatus" in the claims.

[0028] (Configuration of Laser Processing Apparatus) As shown in FIG. 1, the laser processing apparatus 100 is configured to form a modified layer inside the wafer We for dividing the wafer We.

[0029] The laser processing apparatus 100 includes a cassette unit 1, a wafer transport unit 2, a dicing unit 3, and a control unit 4. The cassette unit 1 is an example of a "predetermined location" in the claims. The wafer transport unit 2 is an example of a "wafer transfer device" in the claims.

[0030] Here, the up-down direction is the Z direction, the up direction is the Z1 direction, and the down direction is the Z2 direction. The horizontal direction perpendicular to the Z direction is the X direction, one side of the X direction is the X1 direction, and the other side of the X direction is the X2 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The Y direction is an example of a "first direction" in the claims. The Y1 direction is an example of a "one side of the first direction" in the claims. The Y2 direction is an example of a "other side of the first direction" in the claims. The X direction is an example of a "second direction" in the claims.

[0031] The cassette unit 1 is configured to accommodate a plurality of cassettes each containing a wafer We attached to a sheet member Wt (see FIG. 2) and a wafer ring structure W formed by an annular frame Wf attached to the sheet member Wt (see FIG. 2). Here, the annular frame Wf is formed in an annular shape. The wafer We is disposed inside the annular frame Wf. The wafer ring structure W is an example of a "first wafer ring structure" in the claims. The annular frame Wf is also an example of a "first annular frame" in the claims.

[0032] The cassette unit 1 includes a plurality of cassette placement units 11 and a Z-direction movement mechanism 12 .

[0033] The multiple cassette placement units 11 include one cassette placement unit (not shown) and another cassette placement unit (not shown). A cassette housing a plurality of wafer ring structures W including unprocessed wafers We is placed on one cassette placement unit. Furthermore, a cassette housing a plurality of wafer ring structures W including processed wafers We is placed on another cassette placement unit. The Z-direction movement mechanism 12 is configured to move the multiple cassette units 1 integrally in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 12 includes, for example, a linear conveyor module or a drive unit including a ball screw and a motor with an encoder. Note that a cassette housing a plurality of unprocessed wafers We may be placed on one cassette placement unit, and processed wafers We may be removed from one cassette placement unit and placed back at the same position. Similarly, other cassette loading sections may be loaded with cassettes containing multiple unprocessed wafers We, and processed wafers We may be removed from other cassette loading sections and loaded again at the same position from which they were removed.

[0034] The wafer transfer unit 2 is configured to transfer the wafer ring structure W between the cassette unit 1 and the dicing unit 3. Specifically, the wafer transfer unit 2 has a clamp hand unit 21, a Y-direction movement mechanism 22, a first rail unit 23, a second rail unit 24, a first transfer head 25, a second transfer head 26, and a Z-direction movement mechanism 27. The clamp hand unit 21 is an example of a "hand unit" in the claims. The first rail unit 23 and the second rail unit 24 are each an example of an "intermediate placement unit" in the claims. The first transfer head 25 and the second transfer head 26 are each an example of a "transfer head" in the claims.

[0035] The clamp hand unit 21 is configured to clamp the annular frame Wf of the wafer ring structure W and remove it from the cassette unit 1 or store it in the cassette unit 1. The clamp hand unit 21 moves in the Y1 direction and the Y2 direction by a Y-direction movement mechanism 22. The Y-direction movement mechanism 22 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0036] The clamp hand unit 21 is configured to transport the wafer ring structure W removed from the cassette unit 1 to either the first rail unit 23 or the second rail unit 24 by the Y-direction movement mechanism 22. The clamp hand unit 21 is also configured to transfer (transport) the wafer ring structure W from either the first rail unit 23 or the second rail unit 24 to the cassette unit 1 by the Y-direction movement mechanism 22.

[0037] The first rail portion 23 is configured to support, from the Z2 direction, the wafer ring structure W placed by the clamp hand portion 21. The second rail portion 24 is configured to support, from the Z2 direction, the wafer ring structure W placed by the clamp hand portion 21. The first rail portion 23 and the second rail portion 24 are arranged side by side in this order from the Y2 direction side toward the Y1 direction side.

[0038] The first transfer and placement head 25 and the second transfer and placement head 26 are each configured to suck the annular frame Wf of the wafer ring structure W from the Z1 direction side. The first transfer and placement head 25 and the second transfer and placement head 26 are each provided with a holding portion 25a and a holding portion 26a that are provided with suction holes or the like for sucking the annular frame Wf of the wafer ring structure W. The Z-direction movement mechanism 27 is configured to independently move the first transfer and placement head 25 and the second transfer and placement head 26 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 27 has, for example, a linear conveyor module or a drive unit that has a ball screw and a motor with an encoder.

[0039] The structures of the first rail portion 23, the second rail portion 24, the first transfer head 25, and the second transfer head 26 will be described in detail later.

[0040] 1, the dicing unit 3 includes a laser irradiation unit 31, a Z-direction moving unit 32, a Y-direction moving unit 33, an X-direction moving unit 34, a chuck table unit 35, a low-magnification imaging unit 36, a high-magnification imaging unit 37, a Z-direction moving mechanism 38, and a frame 39. The laser irradiation unit 31 is an example of a "wafer processing unit" in the claims. The chuck table unit 35 is an example of a "predetermined location," a "table," and a "suction table" in the claims.

[0041] The laser irradiation unit 31 is configured to process the wafer We of the wafer ring structure W held by chuck table 35. That is, the laser irradiation unit 31 is configured to irradiate the wafer We, on which a plurality of semiconductor chips Ch (see FIG. 2) are provided, with a laser to form a modified layer inside the wafer We. Specifically, the laser irradiation unit 31 is configured to irradiate the wafer We with a laser along each of a plurality of streets Wst (see FIG. 2) on the wafer We while moving the wafer We relative to the laser irradiation unit 31 using the chuck table 35. The laser irradiation unit 31 is attached to a frame 39 via a Z-direction moving unit 32. The Z-direction moving unit 32 is configured to move the laser irradiation unit 31 in each of the Z1 and Z2 directions. The Z-direction moving unit 32 includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0042] The Y-direction moving unit 33 is configured to move the chuck table unit 35 in both the Y1 direction and the Y2 direction. The Y-direction moving unit 33 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The X-direction moving unit 34 is configured to move the chuck table unit 35 in both the X1 direction and the X2 direction. The X-direction moving unit 34 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0043] The X-direction moving section 34 is attached to the Y-direction moving section 33. As a result, the X-direction moving section 34 is moved in the Y1 direction and the Y2 direction by the Y-direction moving section 33.

[0044] The chuck table 35 is configured to hold the wafer We by suctioning the sheet member Wt of the wafer ring structure W. The chuck table 35 is attached to the X-direction moving unit 34. This allows the chuck table 35 to move in the X1 and X2 directions by the X-direction moving unit 34. The chuck table 35 is also moved in the Y1 and Y2 directions together with the X-direction moving unit 34 by the Y-direction moving unit 33. The chuck table 35 is configured to rotate about a rotation axis that extends in the vertical direction.

[0045] Each of the low-magnification imaging unit 36 ​​and the high-magnification imaging unit 37 is configured to capture an image of the wafer We held on the chuck table unit 35. Each of the low-magnification imaging unit 36 ​​and the high-magnification imaging unit 37 is a near-infrared imaging camera. Each of the low-magnification imaging unit 36 ​​and the high-magnification imaging unit 37 is attached to a frame 39 via a Z-direction movement mechanism 38. The Z-direction movement mechanism 38 is configured to move the low-magnification imaging unit 36 ​​and the high-magnification imaging unit 37 integrally in each of the Z1 direction and the Z2 direction. The Z-direction movement mechanism 38 includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0046] 3 , the control unit 4 is configured to control each of the cassette unit 1, wafer transport unit 2, and dicing unit 3 to process the wafer We in the laser processing apparatus 100. The control unit 4 is electrically connected to the cassette unit 1. The control unit 4 is electrically connected to each of the clamp hand unit 21, Y-direction movement mechanism 22, first rail unit 23, second rail unit 24, first transfer head 25, second transfer head 26, and Z-direction movement mechanism 27. The control unit 4 is electrically connected to each of the laser irradiation unit 31, Z-direction movement unit 32, Y-direction movement unit 33, X-direction movement unit 34, chuck table unit 35, low-magnification image capture unit 36, high-magnification image capture unit 37, and Z-direction movement mechanism 38.

[0047] Specifically, the control unit 4 includes a CPU (Central Processing Unit), a storage unit having a HDD (Hard Disk Drive) and an SSD (Solid State Drive), etc., and a memory having a ROM (Read Only Memory), a RAM (Random Access Memory), etc. The storage unit stores a control program for the laser processing apparatus 100, including the processing of the wafer We with a laser.

[0048] 4 and 5, the first rail portion 23 extends along the Y direction. A pair of first rail portions 23 are provided facing each other in the X direction.

[0049] The pair of first rail portions 23 are provided for temporarily placing (temporarily placing) the unprocessed wafer ring structure W transported by the clamp hand portion 21 from the cassette portion 1 before it is transferred to the chuck table portion 35. The pair of first rail portions 23 are also provided for temporarily placing (temporarily placing) the processed wafer ring structure W transferred from the chuck table portion 35 by the first transfer head 25 before it is stored in the cassette portion 1.

[0050] That is, the pair of first rail portions 23 are arranged at a placement position Pa (see FIG. 5) where the annular frame Wf of the wafer ring structure W is placed, in order to temporarily place (temporarily place) the unprocessed wafer ring structure W transported by the clamp hand portion 21. The pair of first rail portions 23 are configured to retract to a retracted position Pb (see FIG. 5) where they do not interfere with the first transfer head 25 when the wafer ring structure W temporarily placed on the first rail portions 23 is transferred from the first rail portions 23 to the chuck table portion 35 using the first transfer head 25.

[0051] Furthermore, when the first transfer head 25 is used to transfer the processed wafer ring structure W from the chuck table 35 to the first rail portion 23, the first rail portion 23 is configured to retract to a retracted position Pb (see FIG. 5) where it does not interfere with the first transfer head 25. The pair of first rail portions 23 are then arranged at a placement position Pa (see FIG. 5) where the annular frame Wf of the wafer ring structure W is placed, in order to temporarily place (temporarily place) the processed wafer ring structure W held by the first transfer head 25.

[0052] As shown in FIG. 5 , the pair of first rail portions 23 are configured to be positionable at both the placement position Pa and the retracted position Pb. Specifically, the first rail portion 23 of the pair of first rail portions 23 on the X1 direction side moves to the placement position Pa and the retracted position Pb by rotating. The first rail portion 23 of the pair of first rail portions 23 on the X2 direction side moves in the X1 direction to the placement position Pa and in the X2 direction to the retracted position Pb. The pair of first rail portions 23 may be configured such that the first rail portion 23 on the X1 direction side moves in the X2 direction to the placement position, and the first rail portion 23 on the X2 direction side moves in the X1 direction to the placement position. The pair of first rail portions 23 may be configured such that the first rail portion 23 on the X1 direction side moves in the X1 direction to the retracted position, and the first rail portion 23 on the X2 direction side moves in the X2 direction to the retracted position.

[0053] Although not shown, the second rail portion 24 has the same configuration as the first rail portion 23 .

[0054] That is, the pair of second rail portions 24 are provided for temporarily placing (temporarily placing) the unprocessed wafer ring structure W transported by the clamp hand portion 21 from the cassette portion 1 before it is transferred to the chuck table portion 35. The pair of second rail portions 24 are also provided for temporarily placing (temporarily placing) the processed wafer ring structure W transferred from the chuck table portion 35 by the second transfer head 26 before it is stored in the cassette portion 1.

[0055] The pair of second rail portions 24 are arranged at a placement position Pa where the annular frame Wf of the wafer ring structure W is placed, in order to temporarily place (temporarily place) the unprocessed wafer ring structure W transported by the clamp hand portion 21. The pair of second rail portions 24 are configured to retract to a retract position Pb where they do not interfere with the second transfer head 26 when the wafer ring structure W temporarily placed on the second rail portions 24 is transferred to the chuck table portion 35 using the second transfer head 26.

[0056] Furthermore, when the processed wafer ring structure W is transferred from the chuck table 35 to the second rail portions 24 using the second transfer head 26, the second rail portions 24 are configured to retract to a retracted position Pb that does not interfere with the second transfer head 26. The pair of second rail portions 24 are then arranged at a placement position Pa where the annular frame Wf of the wafer ring structure W is placed, in order to temporarily place (temporarily place) the processed wafer ring structure W held by the second transfer head 26.

[0057] In this way, the pair of second rail portions 24 are configured to be positionable at both the placement position Pa and the retracted position Pb. Specifically, the second rail portion 24 of the pair of second rail portions 24 on the X1 direction side moves to the placement position Pa and the retracted position Pb by rotating. Furthermore, the second rail portion 24 of the pair of second rail portions 24 on the X2 direction side moves in the X1 direction to move to the placement position Pa and in the X2 direction to move to the retracted position Pb. Note that the pair of second rail portions 24 may be configured such that the second rail portion 24 on the X1 direction side moves in the X2 direction to move to the placement position, and the second rail portion 24 on the X2 direction side moves in the X1 direction to move to the placement position. Alternatively, the pair of second rail portions 24 may be configured such that the second rail portion 24 on the X1 direction side moves in the X1 direction to move to the retracted position, and the second rail portion 24 on the X2 direction side moves in the X2 direction to move to the retracted position.

[0058] As described above, the wafer transfer unit 2 includes the first rail portion 23 and the second rail portion 24. However, the wafer transfer unit may include a pair of rail portions. In this case, the wafer ring structure W is temporarily placed at the holding position directly below the first transfer head 25 and the holding position directly below the second transfer head 26 by the pair of rail portions.

[0059] (First Transfer and Loading Head and Second Transfer and Loading Head) As shown in Fig. 6, in the laser processing apparatus 100 of this embodiment, the first transfer and loading head 25 positions the wafer ring structure W while it is temporarily placed on the first rail portion 23. Also, the second transfer and loading head 26 positions the wafer ring structure W while it is temporarily placed on the second rail portion 24. Fig. 6 shows, as an example, a state in which the wafer ring structure W placed on the first rail portion 23 is positioned.

[0060] The first transfer head 25 includes a holding portion 25a, a holding portion mounting member 25b, a holding portion position adjustment switching portion 25c, a holding portion guide portion 25d, a first positioning pin 25e, a second positioning pin 25f, a pin switching portion 25g, a pressing movement portion 25h, a first mounting member 25i, a second mounting member 25j, a second mounting member switching portion 25k, a second mounting member guide portion 25l, a third mounting member 25m, a third mounting member switching portion 25n, and a third mounting member guide portion 25o.

[0061] The first positioning pin 25e is an example of a "positioning portion," a "pair of pins," a "head-side positioning engaging member," and a "first head-side positioning engaging member" in the claims. The second positioning pin 25f is an example of a "positioning portion," a "pair of pins," a "head-side positioning engaging member," and a "second head-side positioning engaging member" in the claims.

[0062] The second transfer head 26 also includes a holding portion 26a, a holding portion mounting member 26b, a holding portion position adjustment switching portion 26c, a holding portion guide portion 26d, a first positioning pin 26e (see Figure 4), a second positioning pin 26f (see Figure 4), a pin switching portion 26g, a pressing movement portion 26h, a first mounting member 26i, a second mounting member 26j, a second mounting member switching portion 26k, a second mounting member guide portion 26l, a third mounting member 26m, a third mounting member switching portion 26n, and a third mounting member guide portion 26o.

[0063] The first positioning pin 26e is an example of a "positioning portion," a "pair of pins," a "head-side positioning engaging member," and a "first head-side positioning engaging member" in the claims. The second positioning pin 26f is an example of a "positioning portion," a "pair of pins," a "head-side positioning engaging member," and a "second head-side positioning engaging member" in the claims.

[0064] Here, the first transfer and placement head 25 and the second transfer and placement head 26 that position the wafer ring structure W have the same structure, so only the structure of the first transfer and placement head 25 will be described below.

[0065] 6 and 7 , the holding portion 25a is configured to hold the annular frame Wf when the wafer ring structure W is transferred from the first rail portion 23 to the chuck table portion 35. The holding portion 25a is also configured to hold the annular frame Wf when the wafer ring structure W is transferred from the chuck table portion 35 to the first rail portion 23. The holding portion 25a has a suction pad that suction-holds the surface of the annular frame Wf on the Z1 direction side by generating negative pressure.

[0066] A plurality of (four) holding portions 25a are arranged at equal angular intervals in the circumferential direction around the central axis C of the first transfer head 25. The holding portions 25a are attached in pairs to the second mounting member 25j lined up in the X direction via holding portion mounting members 25b. The plurality of holding portions 25a are attached in pairs to the third mounting member 25m lined up in the X direction via holding portion mounting members 25b. Note that one to three or five or more holding portions 25a may be arranged.

[0067] <Holding portion mounting member, holding portion position adjustment switching portion, and holding portion guide portion> A plurality of (four) holding portion mounting members 25b are arranged in accordance with the arrangement positions of the holding portions 25a. Note that the number of holding portion mounting members 25b may be one to three or five or more, depending on the number of holding portions 25a.

[0068] Of the multiple holder mounting members 25b, each of the pair of holder mounting members 25b on the Y1 direction side is a plate-shaped member for mounting the holder 25a arranged on the Y1 direction side to the second mounting member 25j. A holder 25a is attached to the tip of each of the pair of holder mounting members 25b on the Y1 direction side. Each of the pair of holder mounting members 25b on the Y1 direction side is attached to the second mounting member 25j by a holder position adjustment switch 25c.

[0069] Of the multiple holder mounting members 25b, each of the pair of holder mounting members 25b on the Y2 direction side is a plate-shaped member for mounting the holder 25a arranged on the Y2 direction side to the third mounting member 25m. A holder 25a is attached to the tip of each of the pair of holder mounting members 25b on the Y2 direction side. Each of the pair of holder mounting members 25b on the Y2 direction side is attached to the third mounting member 25m by a holder position adjustment switch 25c.

[0070] The holder position adjustment switcher 25c is a clamp lever. The holder position adjustment switcher 25c is configured to be switchable between a release position where the holder mounting member 25b can be moved in the X direction and a grip position where the holder mounting member 25b is attached to the second mounting member 25j (third mounting member 25m). The holder position adjustment switcher 25c is attached to the second mounting member 25j (third mounting member 25m) via a long hole 253d (described later) in the holder guide portion 25d.

[0071] The holder guide portion 25d is configured to guide the movement of the holder mounting member 25b in the X direction. The holder guide portion 25d has a restricting portion 251d, a restricting portion 252d, an elongated hole 253d, and an elongated hole 254d. The restricting portions 251d and 252d have plate-like members that restrict the movement of the holder mounting member 25b in the Y direction. The restricting portion 252d has a plate-like member that restricts the movement of the holder mounting member 25b in the Z1 direction. The elongated hole 253d extends along the X direction. A shaft of the holder position adjustment switcher 25c is inserted into the elongated hole 253d. The elongated hole 254d extends along the X direction. A pin (not shown) attached to the second mounting member 25j (third mounting member 25m) is inserted into the elongated hole 254d.

[0072] 6 and 7 , the first positioning pin 25e is a member for horizontally positioning the wafer ring structure W when the wafer ring structure W is placed on the first rail portion 23. The horizontal positioning of the wafer ring structure W refers to the positioning of the center position Cw of the wafer ring structure W relative to the central axis C of the first transfer head 25 in the X and Y directions and in the rotational direction about the central axis C, as viewed from the Z1 direction side (see FIGS. 9 to 11 ).

[0073] The first positioning pins 25e are provided as a pair aligned in the X direction. Each of the pair of first positioning pins 25e is arranged on the Y1 direction side of the pressing movement section 25h. Each of the pair of first positioning pins 25e is arranged at the end of the second mounting member 25j on the Y1 direction side. Each of the pair of first positioning pins 25e protrudes in the Z2 direction from the end of the second mounting member 25j on the Z2 side. Each of the pair of first positioning pins 25e has a tapered shape.

[0074] Of the pair of first positioning pins 25e, the first positioning pin 25e on the X1 direction side engages with a first notch Wf1 provided on the outer periphery of the annular frame Wf. Of the pair of first positioning pins 25e, the first positioning pin 25e on the X2 direction side engages with a second notch Wf2 provided on the outer periphery of the annular frame Wf. The pair of first positioning pins 25e are provided to match the positions of the pair of first notches Wf1 and second notches Wf2, respectively. The pair of first notches Wf1 and second notches Wf2 are examples of the "frame-side positioning engagement portion" and "pair of notches" in the claims.

[0075] Here, the first notch Wf1 is a portion that determines the rotation direction of the center position Cw of the wafer ring structure W about the central axis C relative to the central axis C of the first transfer and loading head 25. The first notch Wf1 is an obtuse-angled notch. The second notch Wf2 is a portion that determines the XY direction position of the center position Cw of the wafer ring structure W relative to the central axis C of the first transfer and loading head 25. The second notch Wf2 is an acute-angled notch. The first notch Wf1 and the second notch Wf2 are provided as a pair, side by side in the X direction.

[0076] <Second Positioning Pin and Pin Switching Unit> As shown in FIG. 8 , the second positioning pin 25f is a member for horizontally positioning the wafer ring structure Ws when the wafer ring structure Ws is placed on the first rail portion 23. The wafer ring structure Ws includes an annular frame Wsf whose dimensions are smaller than the annular frame Wf. The horizontal positioning of the wafer ring structure Ws refers to the positioning of the center position Cw of the wafer ring structure Ws relative to the central axis C of the first transfer head 25 in the X and Y directions and in the rotational direction around the central axis C, as viewed from the Z1 direction side. The wafer ring structure Ws is an example of a "second wafer ring structure" in the claims. The annular frame Wsf is also an example of a "second annular frame" in the claims.

[0077] In FIG. 8, the positions of the holding portion 25a, the second mounting member 25j, and the third mounting member 25m are adjusted to fit the dimensions of the annular frame Wsf, and this adjustment will be described in detail later.

[0078] The second positioning pins 25f are provided as a pair, aligned in the X direction. Each of the pair of second positioning pins 25f is arranged on the Y1 direction side of the pressing movement section 25h. Of the pair of second positioning pins 25f, the second positioning pin 25f on the X1 direction side is arranged closer to the central axis C than the first positioning pin 25e on the X1 direction side. Of the pair of second positioning pins 25f, the second positioning pin 25f on the X2 direction side is arranged closer to the central axis C than the first positioning pin 25e on the X2 direction side. Each of the pair of second positioning pins 25f protrudes in the Z2 direction from the Z2 side end of the second mounting member 25j. Each of the pair of second positioning pins 25f has a tapered shape.

[0079] Of the pair of second positioning pins 25f, the second positioning pin 25f on the X1 direction side engages with a first notch Wsf1 provided on the outer periphery of the annular frame Wsf. Of the pair of second positioning pins 25f, the second positioning pin 25f on the X2 direction side engages with a second notch Wsf2 provided on the outer periphery of the annular frame Wsf. The pair of second positioning pins 25f are positioned to match the positions of the pair of first notches Wsf1 and second notches Wsf2, respectively.

[0080] Here, the first notch Wsf1 is a portion that determines the rotation direction of the center position Cw of the wafer ring structure Ws relative to the central axis C of the first transfer and loading head 25. The first notch Wsf1 is an obtuse-angled notch. The second notch Wsf2 is a portion that determines the XY direction position of the center position Cw of the wafer ring structure Ws relative to the central axis C of the first transfer and loading head 25. The second notch Wsf2 is an acute-angled notch. The first notch Wsf1 and the second notch Wsf2 are provided as a pair, side by side in the X direction.

[0081] Furthermore, each of the pair of second positioning pins 25f is configured to be movable to the engagement position Pe when positioning the wafer ring structure Ws including the annular frame Wsf, and to be movable to a retracted position Pv (see Figure 7) retracted from the engagement position Pe when positioning the wafer ring structure W including the annular frame Wf.

[0082] Specifically, the pin switching unit 26g is configured to move the second positioning pin 25f in the Z2 direction from the retracted position Pv to the engagement position Pe, and to move the second positioning pin 25f in the Z1 direction from the engagement position Pe to the retracted position Pv.

[0083] The pin switching unit 26g is configured to switch the second positioning pin 25f to a state where it can move in the Z direction by rotating the disk-shaped switching handle at the end on the Z1 direction side in one direction to a release position. As a result, by moving the switching handle in the Z2 direction, the second positioning pin 25f moves to the engagement position Pe. Furthermore, by moving the switching handle in the Z1 direction, the second positioning pin 25f moves to the retracted position Pv. Furthermore, the pin switching unit 26g is configured to switch the second positioning pin 25f to a state where it cannot move in the Z direction by rotating the disk-shaped switching handle at the end on the Z1 direction side in the other direction opposite to the one direction to a fixed position. As a result, the second positioning pin 25f is held at the engagement position Pe. Furthermore, the second positioning pin 25f is held at the retracted position Pv.

[0084] <Pressing and moving unit> As shown in Figure 7, the pressing and moving unit 25h is configured to press and move the wafer ring structure W in the Y2 direction so as to press the first notch Wf1 against the first positioning pin 25e and to press the second notch Wf2 against the first positioning pin 25e.

[0085] The pressing movement unit 25h is disposed on the Y2 side of the first positioning pin 25e. The pressing movement unit 25h is attached to the end of the third mounting member 25m on the Y2 side. The pressing movement unit 25h is disposed in alignment with the center position of the third mounting member 25m in the X direction.

[0086] The pressing and moving unit 25h has an air cylinder 251h and a contact unit 252h. The air cylinder 251h is an example of the "movement driving unit" in the claims.

[0087] The air cylinder 251h is a drive source for moving the contact portion 252h in each of the Y1 direction and the Y2 direction. Here, the air cylinder 251h linearly moves the contact portion 252h in the Y1 direction to press the first notch Wf1 against the first positioning pin 25e and move the wafer ring structure W in the Y1 direction so that the second notch Wf2 presses against the first positioning pin 25e. The air cylinder 251h also linearly moves the contact portion 252h in the Y2 direction to move the contact portion 252h to a position away from the wafer ring structure W.

[0088] The contact portion 252h is a portion that contacts the portion of the annular frame Wf on the Y2 direction side. The contact portion 252h is a plate-shaped member. The contact portion 252h is attached to the Y2 direction end of the air cylinder 251h. The contact portion 252h extends in the Z2 direction from the Y2 direction end of the air cylinder 251h.

[0089] <Positioning of Wafer Ring Structure> Here, the positioning of the wafer ring structure W will be described with reference to Figures 9 to 11. When positioning the wafer ring structure W, the first transfer head 25 moves to a position slightly above the wafer ring structure W so that the holding portion 25a does not come into contact with the annular frame Wf. In this state, the wafer ring structure W is positioned. Note that the positioning of the wafer ring structure Ws is performed in the same manner as the positioning of the wafer ring structure W, and therefore a description thereof will be omitted.

[0090] 9, a case will be described as an example in which the wafer ring structure W is placed on the first rail portion 23 before positioning. In FIG. 9, when viewed from the Z2 direction side, the center position Cw of the wafer ring structure W is misaligned with the central axis C of the first transfer head 25.

[0091] As shown in Fig. 10, the contact portion 252h moves in the Y1 direction from the state shown in Fig. 9, and the wafer ring structure W moves in the Y1 direction integrally with the contact portion 252h. As a result, during positioning shown in Fig. 10, the first positioning pin 25e on the X1 direction side of the pair of first positioning pins 25e abuts against the first notch Wf1, and the first positioning pin 25e on the X2 direction side of the pair of first positioning pins 25e abuts against the second notch Wf2.

[0092] 10, as the contact portion 252h moves further in the Y1 direction, the wafer ring structure W moves in a direction inclined relative to the Y1 direction along the inclination of the first notch Wf1 and the second notch Wf2, as shown in Fig. 11. As a result, in the positioning completion state shown in Fig. 11, the center position Cw of the wafer ring structure W substantially coincides with the central axis C of the first transfer head 25.

[0093] <First Mounting Member, Second Mounting Member, and Third Mounting Member> As shown in Figure 12, the first mounting member 25i, the second mounting member 25j, and the third mounting member 25m are each a plate-shaped member. The first mounting member 25i is disposed on the central axis C. The second mounting member 25j is attached to the first mounting member 25i via a second mounting member switcher 25k and a second mounting member guide 25l so as to be relatively movable in both the Y1 and Y2 directions. The second mounting member 25j is equipped with a holder mounting member 25b, a holder position adjustment switcher 25c, a holder guide 25d, a first positioning pin 25e, and a second positioning pin 25f. The third mounting member 25m is attached to the first mounting member 25i via a third mounting member switcher 25n and a third mounting member guide 25o so as to be relatively movable in both the Y1 and Y2 directions. A holder mounting member 25b, a holder position adjustment switching unit 25c, a holder guide unit 25d, and a pressing movement unit 25h are mounted on the third mounting member 25m.

[0094] <Second Mounting Member Switching Portion and Second Mounting Member Guide Portion> The second mounting member switching portion 25k is a clamp lever. A pair of second mounting member switching portions 25k is provided on the X1 direction side and the X2 direction side. Each of the pair of second mounting member switching portions 25k is configured to be switchable between a release position in which the second mounting member 25j can be moved in the Y direction and a gripping position in which the second mounting member 25j is attached to the first mounting member 25i. Each of the pair of second mounting member switching portions 25k is attached to the first mounting member 25i via a long hole 251l (described later) in the second mounting member guide portion 25l.

[0095] The second mounting member guide portions 25l are configured to guide movement of the second mounting member 25j in the Y direction. A pair of second mounting member guide portions 25l is provided on the X1 direction side and the X2 direction side. Each of the pair of second mounting member guide portions 25l has an elongated hole 251l, a restricting portion 252l, and an elongated hole 253l. The elongated hole 251l extends along the Y direction. A shaft of the second mounting member switching unit 25k is inserted into the elongated hole 251l. The restricting portion 252l has a plate-shaped member that restricts movement of the second mounting member 25j in the Y direction and the Z1 direction. The elongated hole 253l extends along the Y direction. A pin (not shown) attached to the second mounting member 25j is inserted into the elongated hole 253l.

[0096] <Third Mounting Member Switching Portion and Third Mounting Member Guide Portion> The third mounting member switching portion 25n is a clamp lever. A pair of third mounting member switching portions 25n is provided on the X1 direction side and the X2 direction side. Each of the pair of third mounting member switching portions 25n is configured to be switchable between a release position in which the third mounting member 25m can be moved in the Y direction and a gripping position in which the third mounting member 25m is attached to the first mounting member 25i. Each of the pair of third mounting member switching portions 25n is attached to the first mounting member 25i via a long hole 251o (described later) in the third mounting member guide portion 25o.

[0097] The third mounting member guide portions 25o are configured to guide movement of the third mounting member 25m in the Y direction. A pair of third mounting member guide portions 25o is provided on the X1 direction side and the X2 direction side. Each of the pair of third mounting member guide portions 25o has an elongated hole 251o, a restricting portion 252o, and an elongated hole 253o. The elongated hole 251o extends along the Y direction. The shaft of the third mounting member switching portion 25n is inserted into the elongated hole 251o. The restricting portion 252o has a plate-shaped member that restricts movement of the third mounting member 25m in the Y direction and the Z1 direction. The elongated hole 253o extends along the Y direction. A pin (not shown) attached to the third mounting member 25m is inserted into the elongated hole 253o.

[0098] <First head size state and second head size state> Here, as shown in Figures 12 and 13, the first transfer head 25 is configured to be able to change its head size between a first head size state that matches the dimensions of the annular frame Wf of the wafer ring structure W, and a second head size state that matches the dimensions of the annular frame Wsf of the wafer ring structure Ws.

[0099] 12, the user switches the holder position adjustment switching unit 25c on the X1 direction side of the second mounting member 25j to the release position, and then moves the holder position adjustment switching unit 25c to the grip position. The user then performs the same operation as described above on the holder position adjustment switching unit 25b on the X2 direction side of the second mounting member 25j, the holder position adjustment switching unit 25b on the X1 direction side of the third mounting member 25m, and the holder position adjustment switching unit 25c on the X2 direction side of the third mounting member 25m.

[0100] In addition, after the user switches both of the pair of second mounting member switching sections 25k of the second mounting member 25j to the release position, the user moves the second mounting member 25j to its limit of movement in the Y1 direction, and switches both of the pair of second mounting member switching sections 25k to the gripping position.

[0101] In addition, after the user switches both of the pair of third mounting member switching sections 25n of the third mounting member 25m to the release position, the user moves the third mounting member 25m to its limit of movement in the Y2 direction, and switches both of the pair of third mounting member switching sections 25n to the gripping position.

[0102] These operations by the user result in a change to the first head size state shown in FIG.

[0103] 12, the user switches the holder position adjustment switching unit 25c on the X1 direction side of the second mounting member 25j to the release position, and then moves the holder position adjustment switching unit 25c to the grip position by moving the holder position adjustment switching unit 25c on the X2 direction side. The user then performs the same operations as described above on the holder position adjustment switching unit 25b on the X2 direction side of the second mounting member 25j, the holder position adjustment switching unit 25b on the X1 direction side of the third mounting member 25m, and the holder position adjustment switching unit 25c on the X2 direction side of the third mounting member 25m.

[0104] In addition, after the user switches both of the pair of second mounting member switching sections 25k of the second mounting member 25j to the release position, the user moves the second mounting member 25j to its limit of movement in the Y2 direction, and switches both of the pair of second mounting member switching sections 25k to the gripping position.

[0105] In addition, after the user switches both of the pair of third mounting member switching sections 25n of the third mounting member 25m to the release position, the user moves the third mounting member 25m to its limit of movement in the Y1 direction, and switches both of the pair of third mounting member switching sections 25n to the gripping position.

[0106] These operations by the user result in a change to the second head size state shown in FIG.

[0107] (Wafer processing control)

[0108] 14 and 15 , in the laser processing apparatus 100, wafer processing control is performed using both the first transfer head 25 and the second transfer head 26. In the following description, laser processing of the wafer We of the wafer ring structure W will be described.

[0109] The control unit 4 controls the transfer of the processed wafer ring structure W received from the chuck table unit 35 to one of the first rail unit 23 and the second rail unit 24 by one of the first transfer head 25 and the second transfer head 26, and the transfer of the unprocessed wafer ring structure W received from one of the first rail unit 23 and the second rail unit 24 to the chuck table unit 35 by the other of the first transfer head 25 and the second transfer head 26.

[0110] 14(A) and 14(B), the control unit 4 causes the clamp hand unit 21 to transfer the wafer ring structure W1 from the cassette unit 1 to directly below the first transfer head 25 on the first rail unit 23. Before transferring the wafer ring structure W1 from the first rail unit 23 to the chuck table unit 35, the control unit 4 controls the air cylinder 251h to linearly move the abutment unit 252h in the Y1 direction in order to position the wafer ring structure W1 in the horizontal direction (see FIGS. 9 to 11).

[0111] The control unit 4 linearly moves the contact portion 252h to position the wafer ring structure W1 in the horizontal direction, and then controls the first transfer head 25 to hold the annular frame Wf and transfer the wafer ring structure W1 onto the chuck table 35. That is, the control unit 4 causes the first transfer head 25 to suck and hold the wafer ring structure W1 directly below, retracts the first rail portion 23 to the retracted position Pb, and raises the first transfer head 25. As shown in FIG. 14C , the control unit 4 moves the chuck table 35 to directly below the first transfer head 25 (wafer ring structure W1). Then, the wafer ring structure W1 held by the first transfer head 25 is transferred to the chuck table 35 located directly below.

[0112] 14(D), the control unit 4 moves the chuck table 35 holding the wafer ring structure W1 to a processing position where the laser irradiation unit 31 performs laser processing on the wafer We1 of the wafer ring structure W1. Then, the control unit 4 irradiates the wafer ring structure W1 held on the chuck table 35 with a laser from the laser irradiation unit 31 to perform processing.

[0113] While the wafer ring structure W1 held on the chuck table 35 is being processed, the control unit 4 performs control to prepare the wafer ring structure W2 to be laser processed next. As shown in FIG. 14(E), while processing the wafer ring structure W1, the control unit 4 uses the clamp hand unit 21 to transfer the wafer ring structure W2 from the cassette unit 1 to directly below the first transfer head 25 on the first rail 23. Before transferring the wafer ring structure W2 from the first rail 23 to the chuck table 35, the control unit 4 controls the air cylinder 251h to linearly move the abutment portion 252h in the Y1 direction to position the wafer ring structure W2 in the horizontal direction (see FIGS. 9 to 11).

[0114] Then, the control unit 4 causes the first transfer head 25 to suck and hold the wafer ring structure W2 directly below.

[0115] As shown in Figure 15, when the laser processing process is completed for the previous wafer ring structure W1, the control unit 4 swaps the wafer ring structure W1 and wafer ring structure W2 held on the chuck table unit 35, and performs laser processing on the next wafer ring structure W2.

[0116] 15(A), the laser processing process for the wafer ring structure W1 held on the chuck table 35 is completed. In Fig. 15(B), the control unit 4 moves the chuck table 35 to directly below the second transfer head 26. The control unit 4 then transfers the wafer ring structure W1 held on the chuck table 35 to the second transfer head 26 located directly above. At this time, the control unit 4 retracts the second rail 24 to the retracted position Pb.

[0117] 15(C), the control unit 4 moves the chuck table 35 to a position directly below the first transfer head 25 (wafer ring structure W2). Then, the control unit 4 transfers the wafer ring structure W2 held by the first transfer head 25 to the chuck table 35 located directly below. At this time, the control unit 4 retracts the first rail 23 to the retracted position Pb.

[0118] In this way, the control unit 4 controls the first transfer head 25 to hold the unprocessed wafer ring structure W2 that has been positioned horizontally before the second transfer head 26 transfers the processed wafer ring structure W1 onto the second rail portion 24.

[0119] 15(D), the control unit 4 moves the chuck table 35 holding the wafer ring structure W2 to a processing position where the laser irradiation unit 31 performs laser processing on the wafer We2 of the wafer ring structure W2. Then, the control unit 4 irradiates the wafer ring structure W2 held on the chuck table 35 with a laser from the laser irradiation unit 31 to perform processing.

[0120] While processing is being performed on the wafer ring structure W2 held on the chuck table 35, the control unit 4 controls the storing of the processed wafer ring structure W1 in the cassette unit 1 and the preparation of the wafer ring structure W3 to be laser processed next. That is, in FIG. 15(E), the control unit 4 transfers the wafer ring structure W1 from the second transfer head 26 onto the second rail 24 while processing the wafer ring structure W2. The control unit 4 linearly moves the abutment portion 262h to position the wafer ring structure W1 in the horizontal direction, and then controls the transfer of the wafer ring structure W1 to the cassette 1 by the clamp hand unit 21 (see FIGS. 9 to 11). That is, the control unit 4 transfers the wafer ring structure W1 from the second rail 24 to the cassette 1 by the clamp hand unit 21.

[0121] 15(F), the control unit 4 causes the clamp hand unit 21 to transfer the wafer ring structure W3 from the cassette unit 1 to directly below the first transfer head 25 on the first rail unit 23. Then, the control unit 4 controls the air cylinder 251h to linearly move the abutment unit 252h in the Y1 direction to position the wafer ring structure W3 in the horizontal direction before transferring it from the first rail unit 23 to the chuck table unit 35 (see FIGS. 9 to 11). The control unit 4 then causes the first transfer head 25 to suck and hold the wafer ring structure W3 directly below.

[0122] The control unit 4 repeats the processes of FIGS. 15(A) to 15(F) to sequentially perform laser processing on a plurality of wafer ring structures W.

[0123] (Wafer Processing Method) Here, a wafer processing method performed in the control unit 4 will be described with reference to FIGS.

[0124] 16, in step S1, the wafer ring structure W is pulled out from the cassette unit 1 by the clamp hand unit 21. In step S2, the wafer ring structure W is placed on the first rail unit 23. In step S3, the first transfer head 25 is lowered. In step S4, before the first transfer head 25 holds the annular frame Wf of the wafer ring structure W, the wafer ring structure W is positioned by the pressing and moving unit 25h and the pair of first positioning pins 25e (the pair of second positioning pins 25f).

[0125] In step S5, the first transfer and loading head 25 holds the annular frame Wf of the wafer ring structure W. In step S6, the first transfer and loading head 25 descends. In step S7, the wafer ring structure W held by the descended first transfer and loading head 25 is held by the chuck table unit 35. In step S8, the first transfer and loading head 25 releases its hold on the wafer ring structure W. In step S9, the first transfer and loading head 25 ascends.

[0126] 17 , in step S21, the chuck table unit 35 moves to a position directly below the second transfer and placement head 26. In step S22, the second transfer and placement head 26 descends. In step S23, the second transfer and placement head 26 receives the processed wafer ring structure W from the chuck table unit 35 and then places the wafer ring structure W on the second rail unit 24. In step S24, the second transfer and placement head 26 releases its hold on the annular frame Wf of the wafer ring structure W, and then positions the wafer ring structure W using the pressing and moving unit 25h and the pair of first positioning pins 25e (the pair of second positioning pins 25f).

[0127] In step S25, the second transfer head 26 moves up. In step S26, the clamp hand unit 21 transports the processed wafer ring structure W to the cassette unit 1.

[0128] After the above-described process is performed for a predetermined number of wafer ring structures W, the wafer processing method is completed.

[0129] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0130] In this embodiment, as described above, the wafer transport unit 2 includes the first transfer head 25 (second transfer head 26) including the first positioning pins 25e (second positioning pins 25f) that position the wafer ring structure W (wafer ring structure Ws) in the horizontal direction when the wafer ring structure W (wafer ring structure Ws) is placed on the first rail portion 23 (second rail portion 24), and the pressing and moving unit 25h that moves the wafer ring structure W (wafer ring structure Ws) so as to press it against the first positioning pins 25e (second positioning pins 25f). Because the annular frame Wf (annular frame Wsf) of the wafer ring structure W (wafer ring structure Ws) is placed on the first rail portion 23 (second rail portion 24), when the wafer ring structure W (wafer ring structure Ws) is moved by the pressing and moving unit 25h for horizontal positioning, the sheet member Wt to ​​which the wafer We is attached does not slide on the first rail portion 23 (second rail portion 24). Therefore, charging of the sheet member Wt due to sliding can be suppressed, and charging of the wafer We attached to the sheet member Wt can also be suppressed, which results in suppressing charging of the wafer We when positioning the wafer ring structure W (wafer ring structure Ws) in the horizontal direction.

[0131] In the present embodiment, as described above, the first positioning pin 25e (second positioning pin 25f) is disposed on the Y1 side in the horizontal Y direction and engages with the first notch Wf1 (first notch Wsf1) and the second notch Wf2 (second notch Wsf2) provided on the outer periphery of the annular frame Wf (annular frame Wsf). The pressing and moving unit 25h is disposed on the Y2 side in the Y direction and is configured to move the wafer ring structure W (wafer ring structure Ws) toward the Y1 side in the Y direction so as to press the first notch Wf1 (first notch Wsf1) and the second notch Wf2 (second notch Wsf2) against the first positioning pin 25e (second positioning pin 25f). As a result, while the first notch Wf1 (first notch Wsf1) and the second notch Wf2 (second notch Wsf2) of the annular frame Wf (annular frame Wsf) are engaged with the first positioning pin 25e (second positioning pin 25f), the pressing moving unit 25h moves the wafer ring structure W (wafer ring structure Ws) toward the Y1 direction in the Y direction, thereby moving the wafer ring structure W (wafer ring structure Ws) horizontally so as to eliminate any misalignment of the wafer ring structure W (wafer ring structure Ws) relative to the first transfer loading head 25 (second transfer loading head 26), thereby making it easy to horizontally position the wafer ring structure W (wafer ring structure Ws) relative to the first transfer loading head 25 (second transfer loading head 26).

[0132] In this embodiment, as described above, the pressing and moving unit 25h includes an abutting portion 252h that abuts against a portion of the annular frame Wf (annular frame Wsf) on the Y2 side in the Y direction. The pressing and moving unit 25h includes an air cylinder 251h that linearly moves the abutting portion 252h toward the Y1 side in the Y direction to move the wafer ring structure W (wafer ring structure Ws) so that the first notch Wf1 (first notch Wsf1) and the second notch Wf2 (second notch Wsf2) abut against the first positioning pin 25e (second positioning pin 25f). This allows the wafer ring structure W (wafer ring structure Ws) to be horizontally positioned with respect to the first transfer head 25 (second transfer head 26) simply by linearly moving the abutting portion 252h with the air cylinder 251h. As a result, an air cylinder 251h or the like can be used as a drive source for linear movement, so that the structure for positioning the wafer ring structure W (wafer ring structure Ws) can be realized with a simpler structure.

[0133] Furthermore, in this embodiment, as described above, the pair of first positioning pins 25e and second positioning pins 25f are a pair of pins arranged side by side in the X direction in accordance with the pair of first notch Wf1 (first notch Wsf1) and second notch Wf2 (second notch Wsf2) arranged side by side in the X direction, which is perpendicular to the Y direction in the horizontal direction. As a result, the wafer ring structure W (wafer ring structure Ws) can be positioned by both the engagement between the first notch Wf1 (first notch Wsf1) and the pair of first positioning pins 25e and the engagement between the second notch Wf2 (second notch Wsf2) and the second positioning pins 25f, so that the wafer ring structure W (wafer ring structure Ws) is positioned in the rotational direction by the engagement between the first notch Wf1 (first notch Wsf1) and the pair of first positioning pins 25e, and the wafer ring structure W (wafer ring structure Ws) can be positioned in the X and Y directions in a horizontal plane by the engagement between the second notch Wf2 (second notch Wsf2) and the second positioning pins 25f. As a result, the wafer ring structure W (wafer ring structure Ws) can be positioned in the X and Y directions in a horizontal plane relative to the first transfer head 25 (second transfer head 26).

[0134] Furthermore, in this embodiment, as described above, the first positioning pin 25e is provided to align with the positions of the first notch Wf1 and the second notch Wf2 of the annular frame Wf. The second positioning pin 25f is provided to align with the positions of the first notch Wsf1 and the second notch Wsf2 of the annular frame Wsf, which has a smaller dimension than the annular frame Wf. This allows the positioning of wafer ring structures W (wafer ring structures Ws) of different dimensions to be performed by a single first transfer head 25 (second transfer head 26). Therefore, unlike when wafer ring structures W (wafer ring structures Ws) of different dimensions are positioned by separate first transfer heads 25 (second transfer heads 26), there is no need to provide separate transfer heads dedicated to positioning wafer ring structures W (Ws) of different dimensions.

[0135] Furthermore, in this embodiment, as described above, the first transfer head 25 (second transfer head 26) includes a first mounting member 25i (first mounting member 26i) and a second mounting member 25j (second mounting member 26j) to which a first positioning pin 25e (first positioning pin 26e) and a second positioning pin 25f (second positioning pin 26f) are attached, and which is attached to the first mounting member 25i (first mounting member 26i) so as to be movable relative to the first mounting member 25i (first mounting member 26i) in the Y direction. As a result, by moving the second mounting member 25j (second mounting member 26j) in the Y direction relative to the first mounting member 25i (first mounting member 26i), the first positioning pin 25e (first positioning pin 26e) can be adjusted to match the positions of the first notch Wf1 and the second notch Wf2 of the annular frame Wf, and the second positioning pin 25f (second positioning pin 26f) can be adjusted to match the positions of the first notch Wsf1 and the second notch Wsf2 of the annular frame Wsf. Therefore, the positions of the first positioning pin 25e (first positioning pin 26e) and the second positioning pin 25f (second positioning pin 26f) can be adjusted in the X direction as well as the Y direction without moving each of the first positioning pin 25e (first positioning pin 26e) and the second positioning pin 25f (second positioning pin 26f) relative to the second mounting member 25j (second mounting member 26j). Here, when each of the first positioning pin 25e (first positioning pin 26e) and the second positioning pin 25f (second positioning pin 26f) is moved relative to the second mounting member 25j (second mounting member 26j), a structure is required to move each of the first positioning pin 25e (first positioning pin 26e) and the second positioning pin 25f (second positioning pin 26f) relative to the second mounting member 25j (second mounting member 26j), and the accuracy of the positioning of each of the first positioning pin 25e (first positioning pin 26e) and the second positioning pin 25f (second positioning pin 26f) is reduced by the tolerance of that structure.Therefore, since a structure for relatively moving the wafer ring structure W (Ws) in the X direction is not required, the tolerance does not occur, and the first positioning pin 25 e (first positioning pin 26 e) and the second positioning pin 25 f (second positioning pin 26 f) can be accurately positioned on the second mounting member 25 j (second mounting member 26 j). As a result, by using the first positioning pin 25 e (first positioning pin 26 e) and the second positioning pin 25 f (second positioning pin 26 f) accurately positioned on the second mounting member 25 j (second mounting member 26 j), the wafer ring structure W (Ws) can be accurately positioned with respect to the first transfer head 25 (second transfer head 26).

[0136] Furthermore, in this embodiment, as described above, the second positioning pins 25f are configured to be movable to the engagement position Pe when positioning the wafer ring structure Ws including the annular frame Wsf, and to be movable to a retracted position Pv from the engagement position Pe when positioning the wafer ring structure W including the annular frame Wf. This prevents interference between the annular frame Wf and the second positioning pins 25f when positioning the wafer ring structure W. Furthermore, the first positioning pins 25e (first positioning pins 26e) are positioned to fit the annular frame Wf, which is larger than the annular frame Wsf, and are therefore positioned outside the second positioning pins 25f (second positioning pins 26f). This prevents interference between the annular frame Wf and the first positioning pins 25e (first positioning pins 26e) even without retracting the first positioning pins 25e (first positioning pins 26e) when positioning the wafer ring structure Ws, eliminating the need for a retractable configuration for the first positioning pins 25e (first positioning pins 26e). As a result, the complexity of the structure of the first transfer head 25 (second transfer head 26) can be reduced compared to when the first positioning pin 25e (first positioning pin 26e) is also configured to be retractable.

[0137] Furthermore, in this embodiment, as described above, the laser processing apparatus 100 includes the control unit 4 that controls the air cylinder 251h to linearly move the abutment portion 252h toward the Y1 direction in the Y direction when positioning the wafer ring structure W (wafer ring structure Ws) in the horizontal direction before transferring the wafer ring structure W (wafer ring structure Ws) from the first rail portion 23 (second rail portion 24) to the chuck table portion 35 and the cassette portion 1. This allows the control unit 4 to position the wafer ring structure W (wafer ring structure Ws) with respect to the first transfer head 25 (second transfer head 26), and then transfer the positioned wafer ring structure W (wafer ring structure Ws) to the chuck table portion 35 and the cassette portion 1.

[0138] Furthermore, in this embodiment, as described above, the control unit 4 linearly moves the abutment portion 252h to position the wafer ring structure W (wafer ring structure Ws) in the horizontal direction, and then controls the holding portion 25a (26a) to hold the annular frame Wf (annular frame Wsf) and transfer the wafer ring structure W (wafer ring structure Ws) onto the chuck table 35, which serves as a predetermined location for adsorbing the wafer ring structure W (wafer ring structure Ws). As a result, if the chuck table 35 is disposed directly below the first transfer head 25 (second transfer head 26), the wafer ring structure W (wafer ring structure Ws) can be positioned horizontally relative to the first transfer head 25 (second transfer head 26) and then transferred by the first transfer head 25 (second transfer head 26) to the chuck table 35 directly below, thereby transferring the wafer ring structure W (wafer ring structure Ws) while also being positioned horizontally relative to the chuck table 35.

[0139] Furthermore, in this embodiment, as described above, the wafer transfer unit 2 includes a clamp hand unit 21 that transfers the wafer ring structure W (wafer ring structure Ws) to the cassette unit 1 that accommodates the wafer ring structure W (wafer ring structure Ws). The control unit 4 linearly moves the abutment unit 252h to position the wafer ring structure W (wafer ring structure Ws) in the horizontal direction, and then controls the clamp hand unit 21 to transfer the wafer ring structure W (wafer ring structure Ws) to the cassette unit 1. This allows the clamp hand unit 21 to hold the wafer ring structure W (wafer ring structure Ws) in a positioned state, allowing the clamp hand unit 21 to transfer the wafer ring structure W (wafer ring structure Ws) while holding a predetermined portion of the annular frame Wf (annular frame Wsf). As a result, when the hand unit transfers the wafer ring structure W (wafer ring structure Ws), the wafer ring structure W (wafer ring structure Ws) can be transported to the cassette unit 1 in a stable state.

[0140] Furthermore, in this embodiment, as described above, the wafer transport unit 2 includes the first transfer and loading head 25 and the second transfer and loading head 26. Before one of the first transfer and loading head 25 and the second transfer and loading head 26 processes the wafer We while it is attracted to the chuck table 35 and transfers the processed wafer ring structure W (wafer ring structure Ws) onto the first rail 23 (second rail 24), the control unit 4 controls the other of the first transfer and loading head 25 and the second transfer and loading head 26 to hold the unprocessed wafer ring structure W (wafer ring structure Ws) that has been horizontally positioned by the first positioning pins 25 e (second positioning pins 25 f). In this way, while the wafer ring structure W (wafer ring structure Ws) held by the single chuck table 35 is being processed, the other of the first transfer and loading head 25 and the second transfer and loading head 26 can prepare to hold and transfer the next unprocessed wafer ring structure W (wafer ring structure Ws) to be processed. Then, when the processing of the wafer We held on the chuck table portion 35 is completed, one of the first transfer head 25 and the second transfer head 26 receives the processed wafer ring structure W (wafer ring structure Ws) from the chuck table portion 35, and the other of the first transfer head 25 and the second transfer head 26 delivers the prepared unprocessed wafer ring structure W (wafer ring structure Ws) to the chuck table portion 35. As a result, when processing the wafer We using a single chuck table portion 35, it is possible to prevent the waiting time before processing the wafer We from becoming long, and therefore it is possible to efficiently process a plurality of wafer ring structures W (wafer ring structures Ws).

[0141] [Modifications] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above-mentioned embodiments, and further includes all modifications (modifications) within the meaning and scope of the claims.

[0142] For example, in the above embodiment, the "wafer processing apparatus" in the claims is the laser processing apparatus 100, but the present invention is not limited to this. In the present invention, the wafer processing apparatus may be a dicing apparatus that dices a wafer with a blade. The wafer processing apparatus may be a laser processing apparatus that grooves a wafer with a laser.

[0143] In the above embodiment, the laser processing apparatus 100 (wafer processing apparatus) is provided with the chuck table 35 that holds the wafer We by suctioning the sheet member Wt, but the present invention is not limited to this. In the present invention, the wafer processing apparatus may be provided with a table that holds the wafer ring structure by a method such as clamping.

[0144] In the above embodiment, the pushing and moving unit 25h is driven by the air cylinder 251h, but the present invention is not limited to this. In the present invention, the pushing and moving unit may have a motor or the like as a drive source.

[0145] In the above embodiment, the first positioning pin 25e and the second positioning pin 25f, and the first positioning pin 26e and the second positioning pin 26f are engaged with the first notch Wf1 and the second notch Wf2 of the annular frame Wf, but the present invention is not limited to this. In the present invention, a structure in which a convex portion provided on the annular frame is engaged with a concave portion provided on the moving head may also be used.

[0146] In the above embodiment, for convenience of explanation, the control processing of the control unit 4 is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven processing.

[0147] REFERENCE SIGNS LIST 1 Cassette unit 2 Wafer transport unit (wafer transfer device) 4 Control unit 21 Clamp hand unit (hand unit) 23 First rail unit (intermediate placement unit) 24 Second rail unit (intermediate placement unit) 25 First transfer head 25a Holding unit 25e First positioning pin (positioning unit, head side positioning engaging member, first head side positioning engaging member, pair of pins) 25f Second positioning pin (positioning unit, head side positioning engaging member, second head side positioning engaging member, pair of pins) 25h Pressing and moving unit 25i First mounting member 25j Second mounting member 26 Second transfer head 26a Holding unit 26e First positioning pin (positioning unit, head side positioning engaging member, first head side positioning engaging member, pair of pins) 26f Second positioning pin (positioning unit, head side positioning engaging member, second head side positioning engaging member, pair of pins) 26h Pressing and moving unit 26i First mounting member 26j Second mounting member 35 Chuck table portion (table) 100 Laser processing device (wafer processing device) 251h Air cylinder (movement drive portion) 252h Contact portion Pe Engagement position Pv Retracted position W, W1, W2, W3, Ws Wafer ring structure We, We1, We2 Wafer Wf, Wsf Annular frame Wf1, Wsf1 First notch (frame side positioning engagement portion, pair of notches) Wf2, Wsf2 Second notch (frame side positioning engagement portion, pair of notches) Wt Sheet member

Claims

1. A wafer transfer device for transferring a wafer ring structure including a wafer attached to a sheet member and an annular frame attached to the sheet member, comprising: an intermediate placement section on which the annular frame of the wafer ring structure is temporarily placed; a holding section for holding the annular frame when transferring the wafer ring structure from the intermediate placement section to a predetermined location; and a transfer head including a positioning section for positioning the wafer ring structure horizontally while the wafer ring structure is placed on the intermediate placement section; and a pressing and moving section for moving the wafer ring structure so as to press it against the positioning section.

2. A wafer transfer device as described in claim 1, wherein the positioning unit is arranged on one side in a horizontal first direction and includes a head-side positioning engaging member that engages with a frame-side positioning engaging portion provided on the outer periphery of the annular frame, and the pressing and moving unit is arranged on the other side in the first direction and is configured to move the wafer ring structure to one side in the first direction so as to press the frame-side positioning engaging portion against the head-side positioning engaging member.

3. A wafer transfer device as described in claim 2, wherein the pressing and moving unit includes an abutment portion that abuts against the other side portion of the annular frame in the first direction, and a moving drive unit that moves the abutment portion linearly to one side in the first direction, thereby moving the wafer ring structure so as to press the frame side positioning engaging portion against the head side positioning engaging member.

4. A wafer transfer device as described in claim 2, wherein the head-side positioning engagement member includes a pair of pins arranged side by side in a second direction perpendicular to the first direction in the horizontal direction, in alignment with a pair of notches as the frame-side positioning engagement portion arranged side by side in the second direction.

5. A wafer transfer device as described in claim 2, wherein the head-side positioning engaging member includes a first head-side positioning engaging member provided to match the position of the frame-side positioning engaging portion of a first annular frame as the annular frame, and a second head-side positioning engaging member provided to match the position of the frame-side positioning engaging portion of a second annular frame having dimensions smaller than those of the first annular frame.

6. A wafer transfer device as described in claim 5, wherein the transfer head includes: a first mounting member; and a second mounting member to which the first head side positioning engaging member and the second head side positioning engaging member are attached, and which is attached to the first mounting member so as to be relatively movable to one side in the first direction and the other side in the first direction.

7. A wafer transfer device as described in claim 5, wherein the second head side positioning engagement member is configured to be movable to an engagement position when positioning a second wafer ring structure including the second annular frame, and to be movable to a retracted position retracted from the engagement position when positioning a first wafer ring structure including the first annular frame.

8. A wafer transfer device as described in claim 3, further comprising a control unit that controls the movement drive unit to linearly move the abutment portion to one side in the first direction when positioning the wafer ring structure horizontally before transferring the wafer ring structure from the intermediate placement portion to the predetermined location.

9. A wafer transfer device as described in claim 8, wherein the control unit is configured to linearly move the abutment portion to position the wafer ring structure horizontally, and then control the wafer ring structure to be transferred onto a table as the predetermined location where the holding portion holds the annular frame and adsorbs the wafer ring structure.

10. A wafer transfer device as described in claim 8, further comprising a hand unit that transfers the wafer ring structure to a cassette unit that is the predetermined location where the wafer ring structure is stored, and the control unit is configured to linearly move the abutment unit to position the wafer ring structure horizontally, and then control the hand unit to transfer the wafer ring structure to the cassette unit.

11. The wafer transfer device of claim 8, wherein the transfer heads include a first transfer head and a second transfer head, and the control unit is configured to control one of the first transfer head and the second transfer head to hold the unprocessed wafer ring structure, which has been positioned horizontally by the positioning unit, before transferring the processed wafer ring structure onto the intermediate placement unit after processing the wafer while the wafer is adsorbed onto a table serving as the predetermined location for adsorbing the wafer ring structure.

12. A wafer processing device comprising: a suction table section that suctions a wafer ring structure including a wafer attached to a sheet member and an annular frame attached to the sheet member; a wafer processing section that processes the wafer of the wafer ring structure that has been sucked onto the suction table section; an intermediate placement section on which the annular frame of the wafer ring structure is temporarily placed; a holding section that holds the annular frame when transferring the wafer ring structure from the intermediate placement section to a predetermined location; and a transfer head that includes a positioning section that positions the wafer ring structure in the horizontal direction while the wafer ring structure is placed on the intermediate placement section; and a pressing and moving section that moves the wafer ring structure so as to press it against the positioning section.

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