Inductor component

Abstract

An inductor component (1) comprises: a first conductor layer (11) positioned on a first virtual plane; and a first inductor wiring (21) provided on the first conductor layer and extending around a first turning axis (A1) along a first direction intersecting the first virtual plane. The first conductor layer comprises a first body portion (111) extending around the first turning axis, and a first lead-out portion (151) extending, from the first body portion, in a second direction intersecting the first direction, either away from or toward the first turning axis. The first lead-out portion has at least one opening (1511).

Description

Inductor Components

[0001] The present disclosure relates to inductor components.

[0002] Patent Document 1 discloses a coil component including a substrate and a coil formed by plating on a main surface of the substrate. In the coil component of Patent Document 1, a seed pattern for plating the coil is formed on the substrate. The seed pattern includes a spiral pattern and a conductive pattern extending from the spiral pattern toward the outside of the substrate.

[0003] JP 2016-103591 A

[0004] In the coil component of Patent Document 1, the conductive pattern extends straight in a direction perpendicular to the side surface of the substrate, and therefore the wiring may be eroded and dissolved by an etching solution during manufacturing. If the wiring is dissolved during manufacturing, there is a risk that the DC resistance of the coil component may vary or increase.

[0005] An object of the present disclosure is to provide an inductor component that can suppress variations and increases in DC resistance.

[0006] An inductor component according to one embodiment of the present disclosure comprises: a first conductor layer located on a first imaginary plane; and a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane, wherein the first conductor layer includes: a first main body portion extending around the first pivot axis; and a first lead-out portion extending from the first main body portion in a second direction intersecting the first direction and away from the first pivot axis, or in the second direction and toward the first pivot axis, wherein the first lead-out portion has at least one opening.

[0007] According to the inductor component of the above aspect, variations and increases in DC resistance can be suppressed.

[0008] 1. A plan view showing an inductor component according to one embodiment of the present disclosure. A cross-sectional view taken along line II-II in FIG. 1. A schematic plan view illustrating a layer of a first inductor wiring of the inductor component of FIG. 1. A schematic plan view illustrating a layer of a second inductor wiring of the inductor component of FIG. 1. A first diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A second diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A third diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A fourth diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A fifth diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A sixth diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A seventh diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A eighth diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A ninth diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A tenth diagram illustrating an example of a method for manufacturing the inductor component of FIG. 1. A schematic plan view illustrating a first modified example of the inductor component of FIG. 1. A schematic plan view illustrating a second modified example of the inductor component of FIG. 1. A schematic plan view illustrating a third modified example of the inductor component of FIG. 1.

[0009] Various aspects of the present disclosure will now be described.

[0010] An inductor component of a first aspect comprises: a first conductor layer located on a first imaginary plane; and a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane, wherein the first conductor layer includes: a first main body portion extending around the first pivot axis; and a first lead-out portion extending from the first main body portion in a second direction intersecting the first direction and away from the first pivot axis, or in the second direction and approaching the first pivot axis, and the first lead-out portion has at least one opening.

[0011] The inductor component of a second aspect is the inductor component of the first aspect, wherein the opening has a concave shape that is recessed from one end of the first lead portion in the first direction toward the other end of the first lead portion in the first direction.

[0012] The inductor component of a third aspect is the inductor component of the second aspect, wherein the first conductor layer includes a plurality of layers stacked along the first direction, the plurality of layers have an outermost layer that is farthest from the first inductor wiring in the first direction, and the outermost layer is located between the bottom of the opening and the first imaginary plane in the first direction.

[0013] An inductor component of a fourth aspect is the inductor component of the first aspect, wherein the opening penetrates the first lead portion in the first direction.

[0014] The inductor component of the fifth aspect is an inductor component of any of the first to fourth aspects, wherein the dimension of the first draw-out portion in a direction intersecting the first direction and the second direction is defined as the width of the first draw-out portion, and the dimension of the first inductor wiring in a direction intersecting the first direction and the direction in which the first inductor wiring extends is defined as the width of the first inductor wiring, and the width of the first draw-out portion is larger than the width of the first inductor wiring.

[0015] An inductor component of a sixth aspect is the inductor component of any one of the first to fifth aspects, wherein the first lead portion has a plurality of the openings.

[0016] An inductor component of a seventh aspect is the inductor component of the sixth aspect, wherein the plurality of openings include a first opening and a second opening having a shape different from that of the first opening.

[0017] The inductor component of the eighth aspect is the inductor component of the sixth aspect, wherein the plurality of openings are positioned along a width direction that intersects the first direction and the second direction, and the positions of adjacent openings in the width direction are different in the second direction.

[0018] The inductor component of a ninth aspect is an inductor component of any one of the first to eighth aspects, comprising: an element body in which the first conductor layer and the first inductor wiring are located; and a first insulating layer located inside the element body and in contact with a side of the first inductor wiring that intersects with the second direction, and the inside of the opening is filled with the first insulating layer.

[0019] The inductor component of a tenth aspect is an inductor component of any one of the first to ninth aspects, comprising an element body containing a magnetic material and having the first conductor layer and the first inductor wiring located therein, the element body having therein a first region closer to the first pivot axis than the first inductor wiring and a second region farther from the first pivot axis than the first inductor wiring, and the magnetic material located in the first region and the second region.

[0020] An inductor component of an eleventh aspect is an inductor component of any one of the first to tenth aspects, comprising an element body containing a magnetic material and having the first conductor layer and the first inductor wiring located therein; a first insulating layer located inside the element body and in contact with a side of the first inductor wiring that intersects with the second direction; of both ends of the first draw-out portion in the first direction, the end closest to the first inductor wiring is in contact with the first insulating layer; and of both ends of the first draw-out portion in the second direction, the end farther from the first main body is in contact with the magnetic material.

[0021] The inductor component of a twelfth aspect is an inductor component of any one of the first to eleventh aspects, wherein the first conductor layer has a thickness in the first direction that is less than 1.0 μm, and the thickness of the first conductor layer is smaller than 1 / 100 of the thickness of the first inductor wiring.

[0022] An inductor component of a thirteenth aspect is an inductor component of any one of the first to twelfth aspects, comprising an element body containing a magnetic material and having the first conductor layer and the first inductor wiring located therein; an external terminal provided on an outer surface of the element body that intersects with the first direction; and a vertical wiring located inside the element body, wherein the element body has within it a first region that is closer to the first pivot axis than the first inductor wiring and a second region that is farther from the first pivot axis than the first inductor wiring, and the vertical wiring is located at a position that does not overlap with the first region and the second region when viewed along the first direction, is in contact with the magnetic material of the element body in the second direction, and extends in the first direction to connect the first inductor wiring and the external terminal.

[0023] The inductor component of the 14th aspect is the inductor component of any one of the 1st to 13th aspects, wherein the first lead-out portion extends from the first main body portion in the second direction and in a direction approaching the first pivot axis, and is provided at a portion of the first main body portion that faces the first pivot axis in the second direction and is farthest from the first pivot axis.

[0024] An inductor component of a 15th aspect is the inductor component of any of the first to 14th aspects, further comprising: a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; and a second inductor wiring provided on the second conductor layer, located between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction, wherein the second conductor layer includes: a second main body portion extending around the second pivot axis; and a second lead-out portion extending from the second main body portion in the second direction and in a direction away from the second pivot axis, wherein the first lead-out portion extends from the first main body portion in the second direction and in a direction away from the first pivot axis, and further comprising: a second insulating layer in contact with an end of the first lead-out portion close to the first inductor wiring, of both ends in the first direction, and a third insulating layer in contact with an end of the second lead-out portion close to the second inductor wiring, of both ends in the first direction, When viewed along the first direction, the third insulating layer is the same size as or smaller than the second insulating layer, and the second insulating layer overlaps the entire third insulating layer.

[0025] The inductor component of the 16th aspect is an inductor component of any one of the 1st to 15th aspects, comprising an element body in which the first conductor layer and the first inductor wiring are located, the element body having a side surface that intersects with the second direction, the first draw-out portion extending in a direction away from the first pivot axis, and of both ends of the first draw-out portion in the second direction, the tip end that is farther from the first main body portion is exposed from the side surface and is in contact with at least one insulating layer.

[0026] The inductor component of a 17th aspect is the inductor component of any of the 1st to 16th aspects, further comprising: a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; and a second inductor wiring provided on the second conductor layer, located between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction, wherein the first inductor wiring has a first input portion connected to a first input element and a first output portion connected to an output element, and the second inductor wiring has a second input portion connected to a second input element different from the first input element and a second output portion connected to the output element, and when viewed along the first direction, the first input portion and the second input portion are positioned apart in the second direction, and the first output portion and the second output portion are adjacent to each other.

[0027] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is merely exemplary in nature, and appropriate modifications can be made without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of the dimensions do not necessarily correspond to the actual ones. In the following description, terms such as "about," "approximately," or "substantially" mean that the values, shapes, etc. following these terms include an acceptable range of error as determined by a person skilled in the art.

[0028] 1 and 2 , the inductor component 1 of the present disclosure includes a first conductor layer 11 and a first inductor wiring 21. The first conductor layer 11 is located on a first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends along the first imaginary plane S1. The first inductor wiring 21 extends (is located) around a first pivot axis A1 that intersects (e.g., is perpendicular to) the first imaginary plane S1. As an example, the first imaginary plane S1 is located at the boundary between the insulating layer 71 and the first conductor layer 11.

[0029] In this embodiment, the inductor component 1 includes an element body 2 having a substantially rectangular parallelepiped shape, a second conductor layer 12, and a second inductor wiring 22, as shown in FIGS.

[0030] As shown in FIG. 2 , the second conductor layer 12 is located on a second imaginary plane S2 that is adjacent and parallel to the first imaginary plane S1. Here, "the second imaginary plane S2 is adjacent and parallel to the first imaginary plane S1" means that the first imaginary plane S1 and the second imaginary plane S2 are parallel to each other and that the second imaginary plane S2 is located at a distance in a direction perpendicular to the first imaginary plane S1. The first inductor wiring 21 is located between the first conductor layer 11 and the second conductor layer 12 in a first direction (e.g., the Z direction) that intersects the first imaginary plane S1 and the second imaginary plane S2. The second inductor wiring 22 is provided on the second conductor layer 12 and extends along the second imaginary plane S2. The second inductor wiring 22 is located on the opposite side of the second conductor layer 12 from the first inductor wiring 21 in the first direction Z, and is located around a second pivot axis A2 that intersects (e.g., is perpendicular to) the second imaginary plane S2. As an example, the first pivot axis A1 and the second pivot axis A2 are located on the same straight line (see FIG. 2). The second imaginary plane S2 is located at the boundary between the insulating layer 72 and the second conductor layer 12.

[0031] The element body 2 includes a magnetic material (magnetic layer) 201, and includes a first conductor layer 11, a second conductor layer 12, a first inductor wiring 21, and a second inductor wiring 22 located therein. The element body 2 measures, for example, 1.2 × 1.04 × 0.55 mm. As shown in FIG. 2 , the element body 2 has an outer surface (hereinafter referred to as the main surface 202) that intersects with the first direction Z. As shown in FIG. 1 , the main surface 202 is provided with a plurality of external terminals 101-103 and an insulating layer 76. The insulating layer 76 has a thickness of, for example, 10 μm. In this embodiment, the second inductor wiring 22 is located closest to the main surface 202 (i.e., the external terminal 101) in the first direction Z. The external terminals 101-103 are formed, for example, from a laminate of Cu / Ni / Au (=5 / 5 / 0.1 μm).

[0032] A layer of the first inductor wiring 21 is located between the first imaginary plane S1 and the second imaginary plane S2, and a layer of the second inductor wiring 22 is located between the second imaginary plane S2 and the main surface 202 of the element body 2 described later.

[0033] 3, the first inductor wiring 21 has a spiral shape when viewed along the first direction Z, for example. The first pivot axis A1 is located at the center of the outer shape of the first inductor wiring 21, for example. Vias 51 and 52 are connected to both ends of the first inductor wiring 21 in the direction in which the first inductor wiring 21 extends, respectively. The first inductor wiring 21 is formed of, for example, an L / S / t (=100 / 10 / 150 μm) laminate.

[0034] The first inductor wiring 21 has a first portion 211 to a seventh portion 217 .

[0035] The first portion 211 extends from an end portion located near the first pivot axis A1 to which the via 51 is connected in a direction away from the side surface 206 of the element body 2 along the short direction Y. As an example, the portion of the first portion 211 to which the via 51 is connected constitutes a first output portion. The side surface 206 is one of a pair of side surfaces of the element body 2 extending along the longitudinal direction X.

[0036] The second portion 212 extends in the longitudinal direction X from one of the ends of the first portion 211 in the short-side direction Y that is farther from the side surface 206 of the element body 2 .

[0037] The third portion 213 extends from one of the ends of the second portion 212 in the longitudinal direction X that is farther from the first portion 211 along the lateral direction Y in a direction approaching the side surface 206 of the element body 2 .

[0038] The fourth portion 214 extends from one of the ends of the third portion 213 in the short-side direction Y that is farther from the second portion 212 in the longitudinal direction X toward the first portion 211 .

[0039] The fifth portion 215 extends from one of the ends of the fourth portion 214 in the longitudinal direction X that is farther from the third portion 213 along the short direction Y in a direction away from the side surface 206 of the element body 2. The fifth portion 215 is located farther from the first pivot axis A1 in the longitudinal direction X than the first portion 211, and when viewed from the first pivot axis A1 along the longitudinal direction X, a part of the fifth portion 215 overlaps with the first portion 211. The fifth portion 215 and the first portion 211 are insulated from each other.

[0040] The sixth portion 216 extends from one of the ends of the fifth portion 215 in the short direction Y that is farther from the fourth portion 214 in the longitudinal direction X toward the third portion 213. The sixth portion 216 is located farther from the first pivot axis A1 in the short direction Y than the second portion 212, and when viewed from the first pivot axis A1 in the short direction Y, a part of the sixth portion 216 overlaps with the second portion 212. The sixth portion 216 and the second portion 212 are insulated from each other.

[0041] The seventh portion 217 extends from one of the ends of the sixth portion 216 in the longitudinal direction X that is farther from the fifth portion 215 along the short-side direction Y in a direction approaching the side surface 206 of the element body 2. The seventh portion 217 is located farther from the first pivot axis A1 in the longitudinal direction X than the third portion 213, and when viewed from the first pivot axis A1 along the longitudinal direction X, a portion of the seventh portion 217 overlaps with the third portion 213. The seventh portion 217 and the third portion 213 are insulated from each other. A via 52 is connected to one of the ends of the seventh portion 217 in the short-side direction Y that is closer to the side surface 206 of the element body 2. As an example, the portion of the seventh portion 217 to which the via 52 is connected configures a first input section.

[0042] 3 , the first conductor layer 11 includes a first body portion 111 extending (positioned) around the first pivot axis A1 and a first lead portion extending from the first body portion 111 in a second direction intersecting the first direction and away from the first pivot axis A1, or in the second direction and toward the first pivot axis A1. In this embodiment, the first conductor layer 11 includes a protrusion 112 provided on the first body portion 111. When viewed along the first direction Z, the first body portion 111 has substantially the same shape as the first inductor wiring 21, and the entire first body portion 111 overlaps the first inductor wiring 21. The second direction may be any direction intersecting the first direction, such as the transverse direction X or the longitudinal direction Y, or a direction having components or vectors in both the transverse direction X and the longitudinal direction Y.

[0043] In this embodiment, the first conductor layer 11 has, as the first lead portions, one lead portion 151, one lead portion 153, and four lead portions 154. By configuring the first conductor layer 11 to include the multiple lead portions 151, 153, and 154, it is possible to suppress changes in the DC resistance of the inductor component 1.

[0044] When viewed along the first direction Z, the lead-out portion 151 extends in the second direction (e.g., the short-side direction Y) and in a direction approaching the first pivot axis A1 from a portion of the first body portion 111 that overlaps with the fourth portion 214 of the first inductor wiring 21. The portion of the first body portion 111 where the lead-out portion 151 is provided is the portion of the first body portion 111 that faces the first pivot axis A1 in the second direction (e.g., the short-side direction Y) and is farthest from the first pivot axis A1.

[0045] Of both ends of the lead portion 151 in the short-side direction Y, the tip end farther from the first main body portion 111 is in contact with the magnetic material 201 located in the first region B1 described below.

[0046] The lead portion 151 has at least one opening 1511 (four substantially circular openings 1511 in this embodiment). The opening 1511 may or may not penetrate the lead portion 151 in the first direction Z. When the opening 1511 does not penetrate the lead portion 151, for example, the opening 1511 has a concave shape that is recessed from one end of the lead portion 151 in the first direction Z toward the other end of the lead portion 151 in the first direction Z. In this case, if the first conductor layer 11 has multiple layers and the layer of the first conductor layer 11 farthest from the first inductor wiring 21 in the first direction Z is defined as the farthest layer, the farthest layer of the first conductor layer 11 is located between the bottom of the opening 1511 and the first imaginary plane S1.

[0047] In this embodiment, of the two ends of the lead-out portion 151 in the first direction Z, the end closest to the first inductor wiring 21 is in contact with an insulating layer 77, which will be described later. As an example, the inside of the opening 1511 of the lead-out portion 151 is filled with the insulating layer 77, which will be described later.

[0048] When viewed along the first direction Z, the draw-out portion 153 extends from the portion that overlaps with the fifth portion 215 of the first inductor wiring 21 in the first main body portion 111 in the second direction (e.g., the longitudinal direction X) and in a direction away from the first pivot axis A1.

[0049] When viewed along the first direction Z, each lead-out portion 154 extends from a portion of the first body portion 111 that overlaps with the seventh portion 217 of the first inductor wiring 21 in the second direction (e.g., the longitudinal direction X) away from the first pivot axis A1, in the opposite direction to the lead-out portion 153. The four lead-out portions 154 are positioned at intervals along the Y direction.

[0050] Of both ends of the lead portion 153 in the longitudinal direction X, the tip end farther from the first body portion 111 is exposed from a side surface 205 of the element body 2. Of both ends of each lead portion 154 in the longitudinal direction X, the tip end farther from the first body portion 111 is exposed from a side surface 204 of the element body 2. Each side surface 204, 205 extends along the short direction Y. The side surface 204 faces the seventh portion 217 of the first inductor wiring 21 in the longitudinal direction X, and the side surface 205 faces the fifth portion 215 of the first inductor wiring 21 in the longitudinal direction X.

[0051] For example, the "width of the lead-out portion 151" and the "width of the first inductor wiring 21" are defined as follows. In this case, the width of the lead-out portion 151 is greater than the width of the first inductor wiring 21. When viewed along the first direction Z, the size of the lead-out portion 151 in a direction intersecting the direction in which the lead-out portion 151 extends (for example, the longitudinal direction X) is defined as the "width of the lead-out portion 151." The size of the first inductor wiring 21 in a direction intersecting the direction in which the first inductor wiring 21 extends is defined as the "width of the first inductor wiring 21."

[0052] The protrusion 112 is configured to extend from the first main body 111 toward the first pivot axis A1 not via the shortest route but via a deviated route (i.e., a roundabout route). When viewed along the first direction Z, the protrusion 112 does not extend the shortest distance D1 from the connection portion 1123 with the first main body 111 toward the end of the insulating layer 71. As an example, the end of the insulating layer 71 is located at the boundary between the insulating layer 71 and the insulating material 201 in the first region B1. The protrusion 112 is configured so that the dimension in the extension direction of the protrusion 112 is greater than the shortest distance D1. In this embodiment, the protrusion 112 extends from the first main body 111 in a direction intersecting a first virtual straight line L1 passing through the connection portion with the first main body 111 and the first pivot axis A1, toward the first pivot axis A1. Because the protrusion 112 is directed toward the first pivot axis A1 via a roundabout route rather than the shortest route, it is possible to prevent the first inductor wiring 21 from being eroded by an etching solution, for example, when forming the magnetic path hole. As a result, it is possible to suppress variations and increases in the DC resistance of the inductor component 1. Furthermore, the provision of the protrusion 112 allows power to be supplied via an insulating layer, so the first inductor wiring 21 can be formed by plating growth. Plating growth (e.g., electrolytic plating) can form a first conductor layer 11 with extremely high purity, thereby forming a first inductor wiring 21 with high conductivity. As a result, it is possible to reduce the DC electrical resistance of the inductor component 1.

[0053] In this aspect, the protrusion 112 includes an extending portion 1121 and a curved portion 1122. When viewed along the first direction Z, the extending portion 1121 extends from a portion of the first main body 111 that overlaps with the first portion 211 of the first inductor wiring 21 toward the side surface 206 of the element body 2 in the short direction Y. The curved portion 1122 curves from one of both ends of the extending portion 1121 in the short direction Y that is closer to the side surface 206 of the element body 2 toward the first pivot axis A1. In other words, the first inductor wiring 21 and the protrusion 112 form an angle other than a right angle.

[0054] 3 , in this embodiment, of the ends of the protruding portion 112 in the direction in which the protruding portion 112 extends, the end farther from the first main body portion 111 (i.e., of the ends of the curved portion 1122 in the direction in which the curved portion 1122 extends, the end closer to the first pivot axis A1) is in contact with the magnetic material 201 of the element body 2 located in a first region B1 described below. Of the ends of the protruding portion 112 in the first direction Z, the end closer to the first inductor wiring 21 is in contact with an insulating layer 77 (an example of a first insulating layer). The insulating layer 77 is in contact with a first side surface 2101 of the first inductor wiring 21 that is located near the first pivot axis A1 in the second direction (e.g., the longitudinal direction X) among the side surfaces that intersect with the second direction (e.g., the longitudinal direction X). The first main body portion 111 and the protruding portion 112 may be formed of the same material or different materials.

[0055] Contact with the magnetic material 201 refers to contact with a portion of the material constituting the magnetic material 201. When the magnetic material 201 is formed, for example, of a composite of resin and inorganic filler (e.g., a composite of epoxy and FeSiCr), the tip portion of the first main body portion 111 contacts at least one of the resin and inorganic filler of the magnetic material 201. The resin contained in the magnetic material 201 includes, for example, epoxy, acrylic, liquid crystal polymer, phenol, or a combination thereof, and provides the strength and good insulation of the element body 2. The inorganic filler contained in the magnetic material 201 includes, for example, a metal magnetic powder (e.g., Fe, FeSi-based, FeSiCr-based, FeNi-based, or other materials containing Fe as a main component). In this case, the magnetic material 201 has high magnetic permeability and high magnetic saturation density. The inorganic filler does not need to be a single type of magnetic powder, but may be a combination of magnetic powders with different compositions and particle sizes, or may contain an insulating filler such as silica to ensure a linear expansion coefficient and insulating properties.

[0056] 3 , the element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. In this embodiment, the first region B1 is surrounded by the first portion 211 to the fifth portion 215 of the first inductor wiring 21 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region B1. The magnetic material 201 in the first region B1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the overlapping portions of the first inductor wiring 21 (the first portion 211 to the third portion 213 in this embodiment) when viewed along the second direction from the first pivot axis A1. In other words, the magnetic material 201 is adjacent to the portion with the largest number of first inductor wirings 21 when viewed along the second direction from the first pivot axis A1. When viewed from the first pivot axis A1 along the second direction, the nonmagnetic material 203 in the first region B1 is provided between the magnetic material 201 in the first region B1 and portions (in this embodiment, the fourth portion 214 and the fifth portion 215) that are not overlapped with the first inductor wiring 21. The nonmagnetic material 203 in the first region B1 includes an insulating layer 77, and when viewed along the first direction Z, extends along the third portion 213, the fourth portion 214, and the fifth portion 215. The magnetic material 201 is located throughout the entire second region B2.

[0057] As shown in FIG. 4 , the second inductor wiring 22 extends (is located) around a second pivot axis A2 along the first direction Z. In this embodiment, the second inductor wiring 22 has a spiral shape that is spiral in the opposite direction to the first inductor wiring 21 when viewed along the first direction Z. The second pivot axis A2 is located at the center of the outer shape of the second inductor wiring 22, for example. The second inductor wiring 22 is configured, for example, as an L / S / t (=100 / 10 / 150 μm) laminate. Vias 53 and 54 extending in the first direction Z are connected to both ends of the second inductor wiring 22 in the extension direction of the second inductor wiring 22. As shown in FIG. 2 , the via 53 connects the second inductor wiring 22 and the vertical wiring 61. The vertical wiring 61 connects the second inductor wiring 22 and the external terminal 101 via the via 53. An insulating layer 75 is located between the second inductor wiring 22 and the vertical wiring 61 in the first direction Z. The insulating layer 75 has a thickness of, for example, 15 μm.

[0058] The second inductor wiring 22 has a first portion 221 to a seventh portion 227 .

[0059] The first portion 221 extends from an end portion located near the first pivot axis A1 to which the via 53 is connected in the short direction Y toward the side surface 206 of the element body 2. As an example, the portion of the first portion 221 to which the via 53 is connected constitutes the second output portion. When viewed along the first direction Z, the via 51 and the via 53 are adjacent to each other. The via 51 connects the portion of the first inductor wiring 21 to which the via 51 is connected and the portion of the second inductor wiring 22 to which the via 53 is connected. In other words, the first output portion and the second output portion are adjacent to each other. "The first output portion and the second output portion are adjacent to each other" refers to, for example, a state in which the via 51 and the via 53 are located in a very small area (e.g., within 20 μm) when viewed along the first direction Z. In this embodiment, the via 51 and the via 53 are located at a distance of approximately 10 μm when viewed along the first direction Z.

[0060] The second portion 222 extends in the longitudinal direction X from one of both ends of the first portion 221 in the lateral direction Y that is closer to the side surface 206 of the element body 2 .

[0061] The third portion 223 extends from one of the ends of the second portion 222 in the longitudinal direction X that is farther from the first portion 221 along the lateral direction Y in a direction away from the side surface 206 of the element body 2 .

[0062] The fourth portion 224 extends from one of the ends of the third portion 223 in the short-side direction Y that is farther from the second portion 222 along the longitudinal direction X in a direction approaching the first portion 221 .

[0063] The fifth portion 225 extends from one of the ends of the fourth portion 224 in the longitudinal direction X that is farther from the third portion 223 along the short direction Y in a direction approaching the side surface 206 of the element body 2. The fifth portion 225 is located farther from the second pivot axis A2 in the longitudinal direction X than the first portion 221, and when viewed from the second pivot axis A2 along the longitudinal direction X, a part of the fifth portion 225 overlaps with the first portion 221. The fifth portion 225 and the first portion 221 are insulated from each other.

[0064] The sixth portion 226 extends from one of the ends of the fifth portion 225 in the short direction Y that is farther from the fourth portion 224 in the longitudinal direction X toward the third portion 223. The sixth portion 226 is located farther from the second pivot axis A2 in the short direction Y than the second portion 222, and when viewed from the second pivot axis A2 in the short direction Y, a part of the sixth portion 226 overlaps with the second portion 222. The sixth portion 226 and the second portion 222 are insulated from each other.

[0065] The seventh portion 227 extends from one of the ends of the sixth portion 226 in the longitudinal direction X that is farther from the fifth portion 225 along the short-side direction Y in a direction away from the side surface 206 of the element body 2. The seventh portion 227 is located farther from the second pivot axis A2 in the longitudinal direction X than the third portion 223, and when viewed from the second pivot axis A2 along the longitudinal direction X, a portion of the seventh portion 227 overlaps with the third portion 223. The seventh portion 227 and the third portion 223 are insulated from each other. A via 54 is connected to one of the ends of the seventh portion 227 in the short-side direction Y that is farther from the side surface 206 of the element body 2. As an example, the portion of the seventh portion 227 to which the via 54 is connected constitutes a second input section. As shown in FIGS. 3 and 4 , when viewed along the first direction Z, the vias 52 and 54 are spaced apart in the short-side direction Y. That is, the first input portion and the second input portion are spaced apart in the second direction (e.g., the short-side direction Y). When viewed along the first direction Z, the vias 52 and 54 are spaced apart by 200 μm or more (e.g., 500 μm), which allows the first input portion and the second input portion to be separated.

[0066] 4 , the second conductor layer 12 includes a second body portion 121 extending (positioned) around the second pivot axis A2 and a protrusion 122 (an example of a second protrusion) provided on the second body portion 121. When viewed along the first direction Z, the second body portion 121 has a swirling portion 1211 having substantially the same shape as the second inductor wiring 22, and a non-swirling portion 1212 adjacent to the swirling portion 1211 and electrically independent of it. In this embodiment, when viewed along the first direction Z, the swirling portion 1211 entirely overlaps with the second inductor wiring 22. When viewed along the first direction Z, the non-swirling portion 1212 has an oval shape extending along the short-side direction Y, and is adjacent to the portion where the sixth portion 226 and the seventh portion 227 of the second inductor wiring 22 are connected. The swivel portion 1211 and the protrusion portion 122 of the second main body portion 121 may be made of the same material, or may be made of different materials.

[0067] A lead-out portion 165 is provided at the center of the non-orbiting portion 1212 in the short direction Y. The lead-out portion 165 extends from the non-orbiting portion 1212 in the longitudinal direction X and in a direction away from the second rotation axis A2. Of both ends of the lead-out portion 165 in the longitudinal direction X, the tip end farther from the non-orbiting portion 1212 is in contact with the magnetic material 201 of the element body 2. The non-orbiting portion 1212 and the lead-out portion 165 of the second main body portion 121 may be made of the same material or different materials.

[0068] The protrusion 122 is configured to extend from the second main body 121 toward the second pivot axis A2 not via the shortest route but via a deviated route (i.e., a roundabout route). When viewed along the first direction Z, the protrusion 122 does not extend the shortest distance D2 from the connection portion 1223 with the second main body 121 toward the end of the insulating layer 72. As an example, the end of the insulating layer 72 is located at the boundary between the insulating layer 72 and the insulating material 201 in the first region C1. The protrusion 122 is configured so that the dimension in the extension direction of the protrusion 122 is greater than the shortest distance D2. In this embodiment, the protrusion 122 extends from the second main body 121 in a direction intersecting a second virtual straight line L2 passing through the connection portion 1223 with the second main body 121 and the second pivot axis A2, toward the second pivot axis A2. In this aspect, the protrusion 122 includes an extending portion 1221 and a curved portion 1222. When viewed along the first direction Z, the extending portion 1221 extends in the longitudinal direction Y from a portion of the second main body 121 that overlaps with the first portion 221 of the second inductor wiring 22 in a direction away from the second center line CL2. The curved portion 1222 curves from one of both ends of the extending portion 1221 in the longitudinal direction Y that is farther from the second center line CL2 toward the second pivot axis A2. In other words, the second inductor wiring 22 and the protrusion 122 form an angle other than a right angle.

[0069] 4 , in this embodiment, of the two ends of the protruding portion 122 in the direction in which the protruding portion 122 extends, the end farther from the second main body portion 121 (i.e., of the two ends of the curved portion 1222 in the direction in which the curved portion 1222 extends, the end closer to the second pivot axis A2) is in contact with the magnetic material 201 of the element body 2 located in the first region C1 described below. Of the two ends of the protruding portion 122 in the first direction Z, the end closer to the second inductor wiring 22 is in contact with the insulating layer 78. The insulating layer 78 is in contact with a second side surface 2201 of the second inductor wiring 22 that is located near the second pivot axis A2 in the second direction (e.g., the longitudinal direction X) among the side surfaces that intersect with the second direction (e.g., the longitudinal direction X). The second main body portion 121 and the protruding portion 122 may be formed of the same material or different materials.

[0070] As shown in FIG. 4 , in this embodiment, the second conductor layer 12 includes five lead portions 161 , 162 , 163 , 164 , and 165 .

[0071] When viewed along the first direction Z, the draw-out portion 161 extends from the portion that overlaps with the second portion 222 of the second inductor wiring 22 in the second main body portion 121 in the second direction (e.g., the short direction Y) and in a direction approaching the second pivot axis A2.

[0072] When viewed along the first direction Z, the draw-out portion 162 extends from the portion that overlaps with the third portion 223 of the second inductor wiring 22 in the second main body portion 121 in the second direction (e.g., the longitudinal direction X) and in a direction approaching the second pivot axis A2.

[0073] Of the ends of the lead-out portion 161 in the short-side direction Y, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 located in the first region C1 described below. Of the ends of the lead-out portion 162 in the long-side direction X, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 located in the first region C1.

[0074] When viewed along the first direction Z, the draw-out portion 163 extends from the portion of the swirl portion 1211 that overlaps with the seventh portion 227 of the second inductor wiring 22 in the second direction (e.g., the longitudinal direction X) and in a direction away from the second swirl axis A2.

[0075] When viewed along the first direction Z, the draw-out portion 164 extends from the portion of the swirl portion 1211 that overlaps with the fifth portion 225 of the second inductor wiring 22 in the second direction (e.g., the longitudinal direction X) and away from the second swirl axis A2, in the direction opposite to the draw-out portion 163.

[0076] When viewed along the first direction Z, the drawer portion 165 extends from the non-rotating portion 1212 in the second direction (e.g., the longitudinal direction X) and away from the second rotation axis A2, in the same direction as the drawer portion 163.

[0077] Of the ends of the lead portions 163 and 165 in the longitudinal direction X, the tip end farther from the swirl portion 1211 is exposed from the side surface 204 of the element body 2. Of the ends of the lead portion 164 in the longitudinal direction X, the tip end farther from the swirl portion 1211 is exposed from the side surface 205 of the element body 2.

[0078] As an example, the tip portions exposed from the side surfaces 204 and 205 of the lead portions 153, 154, 163, 164, and 165 are in contact with at least one insulating layer. For example, by forming the side surfaces 204 and 205 by down-cutting or up-cutting (moving the blade while rotating it along the first direction Z) during singulation (see FIG. 14 ), the insulating layers (e.g., insulating layers 71, 72, 73, and 74) located around the lead portions 153, 154, 163, 164, and 165 are stretched, covering the tip portions of the lead portions 153, 154, 163, 164, and 165. This results in the lead portions 153, 154, 163, 164, and 165 having tip portions in contact with at least one insulating layer.

[0079] 4 , the element body 2 has therein a first region C1 that is closer to the second pivot axis A2 than the second inductor wiring 22, and a second region C2 that is farther from the second pivot axis A2 than the second inductor wiring 22. In this embodiment, the first region C1 is surrounded by the first portion 221 to the fifth portion 225 of the second inductor wiring 22 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region C1. The magnetic material 201 in the first region C1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the first portion 211 to the fourth portion 224. In other words, when viewed along the second direction from the second pivot axis A2, the magnetic material 201 is adjacent to the portion with the largest number of second inductor wirings 22. The non-magnetic material 203 of the first region C1 includes an insulating layer 78, and is adjacent to the magnetic material 201, the first portion 221, the fourth portion 224, and the fifth portion 225 of the first region C1 when viewed along the first direction Z. The magnetic material 201 is located throughout the second region C2.

[0080] 4, the inductor component 1 includes a first pad portion 81 located on a second imaginary plane S2. When viewed along the first direction Z, the first pad portion 81 is located so as to overlap with the non-wound portion 1212 of the second conductor layer 12. Of both ends of the first pad portion 81 in the short-side direction Y, a via 55 is connected to the end closest to the second center line CL2.

[0081] 2 , the inductor component 1 includes an insulating layer 71 and an insulating layer 72 located inside the element body 2. The insulating layer 71 is provided on the first conductor layer 11 and is located on the opposite side of the first inductor wiring 21 in the first direction Z. The insulating layer 72 is provided on the second conductor layer 12 and is located on the opposite side of the second inductor wiring 22 in the first direction Z.

[0082] As an example, the first conductor layer 11 has a thickness in the first direction Z that is less than 1.0 μm. The thickness of the first conductor layer 11 is smaller than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 may also be configured in the same manner as the first conductor layer 11. In other words, the second conductor layer 12 may be configured to have a thickness that is less than 1.0 μm and smaller than 1 / 100 of the thickness of the second inductor wiring 22.

[0083] As an example, each of the first conductor layer 11 and the second conductor layer 12 includes a single layer (Cu or Ag) or multiple layers (e.g., Ti / Cu) stacked along the first direction Z. This configuration increases the design flexibility of the inductor component 1, thereby reducing costs without compromising the quality of the inductor component 1. For example, the number of layers forming each conductor layer can be set arbitrarily depending on the layer. For example, by configuring the first conductor layer 11 to include two layers (Ti / Cu) and the second conductor layer 12 to include two layers (Cu), the adhesion of the first conductor layer 11 to the resin can be improved while the adhesion of the second conductor layer 12 to copper (sacrificial copper) can be improved.

[0084] In this embodiment, as shown in FIG. 2 , the inductor component 1 includes an insulating layer 73 (an example of a second insulating layer) and an insulating layer 74 (an example of a third insulating layer) located inside the element body 2. The insulating layer 73 contacts one of both ends in the first direction Z of the lead portions 153, 154 (an example of a first lead portion) of the first conductor layer 11, the end closer to the first inductor wiring 21. As an example, the insulating layer 73 extends along the first direction Z from a first imaginary plane S1 to a second imaginary plane S2. The insulating layer 73 is formed so that its dimension in the first direction Z (i.e., thickness) is larger than that of the first inductor wiring 21. This reliably ensures insulation between the first layer including the first conductor layer 11 and the first inductor wiring 21 and the second layer including the second conductor layer 12 and the second inductor wiring 22. The insulating layer 74 is in contact with one of the ends in the first direction Z of the lead portions 163, 164, 165 (an example of a second lead portion) of the second conductor layer 12 that is closer to the second inductor wiring 22. As an example, the insulating layer 74 extends from the second imaginary plane S2 along the first direction Z toward the main surface 202. The insulating layer 74 is formed to be thicker than the second inductor wiring 22.

[0085] 3 and 4 , portions of the four lead portions 154 of the first conductor layer 11 and the lead portions 163, 165 of the second conductor layer 12 are positioned to overlap in the first direction Z, and the lead portion 153 of the first conductor layer 11 and the lead portion 164 of the second conductor layer 12 are positioned to overlap in the first direction Z. When viewed along the first direction Z, the insulating layer 74 is the same size as or smaller than the insulating layer 73, and the insulating layer 73 overlaps with the entire insulating layer 74.

[0086] 2 , the inductor component 1 includes an external terminal 101 provided on the main surface 202 and a vertical wiring 61 located inside the element body 2. The vertical wiring 61 extends in the first direction Z and connects the second inductor wiring 22 to the external terminal 101 while being in contact with the magnetic material 201 of the element body 2 in the second direction. In this embodiment, the vertical wiring 61 is provided at a position that does not overlap with the first regions B1, C1 and the second regions B2, C2 when viewed along the first direction Z.

[0087] The insulating layers (e.g., insulating layers 71, 72, 75) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the first direction Z and the insulating layers (e.g., insulating layers 73, 74, 77, 78) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the second direction are formed of, for example, different materials. As an example, the insulating layers 71, 72, 75 are formed of an insulating material made of an epoxy system and an inorganic filler, and the insulating layers 73, 74, 77, 78 are formed of an acrylic insulating material.

[0088] An example of a method for manufacturing the inductor component 1 will be described with reference to Figures 5 to 14. Figures 5 to 14 are drawings corresponding to a cross section taken along line II-II in Figure 1. In the manufacturing method shown in Figures 5 to 14, some or all of the steps are performed automatically using, for example, a manufacturing apparatus for the inductor component 1.

[0089] As shown in FIGS. 5 and 6 , the manufacturing equipment forms an insulating layer 71 on a first laminate 1001, which is formed by laminating an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000. Then, a pattern seed 1300 covering the insulating layer 71 and the seed layer 1200 and a permanent resist 1400 are formed to form a second laminate 1002. The pattern seed 1300 constitutes the first conductor layer 11. The insulating layer 71 is formed, for example, by a process including laminating an insulating layer, photolithography (photolithography), and curing. The pattern seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the nonmagnetic material 203 and the insulating layer 73.

[0090] 7 , the manufacturing equipment simultaneously forms the first inductor wiring 21 and the sacrificial copper 1500 on the second laminate 1002, and then forms the insulating layer 72 on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 72 is formed, for example, by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1501 and the vias 51 and 52 are simultaneously formed during the photolithography process.

[0091] As shown in FIG. 8 , the manufacturing equipment forms a pattern seed 1600 located on the insulating layer 72 and a permanent resist 1700 on the third laminate 1003 to form a fourth laminate 1004. The pattern seed 1600 constitutes the second conductor layer 12. The pattern seed 1600 is formed by a process including, for example, sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and hardening. A portion of the permanent resist 1700 constitutes the insulating layer 74.

[0092] The pattern seed 1600 may be formed of the same material as the pattern seed 1300 of the second stacked body 1002, or may be formed of a material different from the pattern seed 1300. The pattern seeds 1300 and 1600 are formed by selecting the optimum material for each layer. For example, by forming the first-layer pattern seed 1300 from a conductive material containing Ti, it is possible to improve adhesion to the insulating layer 71 and the seed layer 1200. By forming the second-layer pattern seed 1600 from the same conductive material as the second inductor wiring 22 (for example, only Cu), it is possible to improve connectivity with the vias 53 and 54.

[0093] As shown in FIG. 9 , the manufacturing equipment forms the second inductor wiring 22 and the sacrificial copper 1800 together in the fourth laminate 1004, then forms an insulating layer 75 on the second inductor wiring 22, and forms a vertical wiring 61 on the insulating layer 75 to form the fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1801 and the vias 53 and 54 are simultaneously formed during the photolithography process. The vertical wiring 61 is formed, for example, by a process including sputtering (full-surface seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0094] 10 , the manufacturing equipment forms a protective layer 1900 on the vertical wiring 61 of the fifth stack 1005, then removes the sacrificial copper 1500 and 1800 to form a magnetic path hole 2000, thereby forming a sixth stack 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The sacrificial copper 1500 and 1800 are removed, for example, by etching. If the first-layer pattern seed 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0095] As shown in FIG. 11 , the manufacturing equipment removes the protective layer 1900 from the sixth laminate 1006, then forms a magnetic layer 2100, and forms a solder resist (insulating layer) 2200 on the magnetic layer 2100 to form the seventh laminate 1007. The protective layer 1900 is removed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material pressing, curing, and grinding. The grinding exposes the vertical wiring 61 to the outside. The magnetic layer 2100 constitutes a part of the magnetic material 201. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and curing. The solder resist 2200 has openings 2201 that expose the vertical wiring 61 to the outside. The solder resist 2200 constitutes the insulating layer 76.

[0096] 12 , the manufacturing equipment removes the substrate 1000, the adhesive layer 1100, and the seed layer 1200 from the seventh laminate 1007 to create the eighth laminate 1008. The substrate 1000 and the adhesive layer 1100 are removed, for example, by mechanically peeling off the adhesive layer 1100. The seed layer 1200 is removed, for example, by wet etching or polishing. When the seed layer 1200 is removed by wet etching, part of the metal magnetic powder in the magnetic layer 2100 is etched, roughening the surface, thereby improving adhesion with the magnetic layer 2300 formed in the next process.

[0097] As shown in Figure 13, the manufacturing equipment forms a magnetic layer 2300 on the eighth laminate 1008 to form a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding is performed to adjust the thickness of the element body 2. The thickness of the element body 2 may be adjusted by adjusting the amount of pressing when forming the magnetic layer 2300 without performing grinding. The magnetic layer 2300 constitutes a part of the magnetic material 201.

[0098] 14 , the manufacturing equipment forms external terminals 101 on the ninth laminate 1009, forms a tenth laminate 1010, and then singulates the tenth laminate 1010 to form the inductor component 1 shown in FIG. 2 . The external terminals 101 are formed by processes including, for example, sputtering (Cu seed), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching. The singulation is performed, for example, along the dashed lines shown in FIG. 14 .

[0099] Instead of forming the external terminals 101, the exposed vertical wiring 61 may serve as the external terminals. By adopting a configuration in which the external terminals 101 are formed in the openings 2201 of the solder resist 2200 and connected to the vertical wiring 61, as in this embodiment, the area of ​​the external terminals 101 can be increased, thereby improving the adhesive strength of the inductor component 1 to other devices, etc. Furthermore, since the external terminals 101 can be formed in any shape, such as a convex shape, the degree of freedom when mounting the inductor component 1 is improved.

[0100] The external terminals 101 may be formed without forming the solder resist 2200. The external terminals 101 may be formed by forming a seed layer on the entire surface and then performing electrolytic plating, as with the vertical wiring 61. In this case, the external terminals 101 have a structure similar to that of a Cu bump.

[0101] The inductor component 1 can provide the following effects.

[0102] The inductor component 1 includes a first conductor layer 11 and a first inductor wiring 21. The first conductor layer 11 is located on a first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends around a first pivot axis A1. The first conductor layer 11 includes a first body portion 111 extending around the first pivot axis A1 and a lead portion 151 extending from the first body portion 111 in a second direction and toward the first pivot axis A1. The lead portion 151 has at least one opening 1511. The lead portion 151 has the opening 1511, which narrows the path through which an etching solution can penetrate the first inductor wiring 21, making it more difficult for the etching solution to reach the first inductor wiring 21 during magnetic path formation. This suppresses variations and increases in the DC resistance of the inductor component 1. Furthermore, the increase and variation in the DC resistance of the inductor component 1 are suppressed, and the efficiency with which the inductor component 1 obtains inductance can be improved.

[0103] The opening 1511 has a concave shape recessed from one end of the first lead portion 151 in the first direction Z toward the other end of the first lead portion 151 in the first direction Z. With this configuration, the thickness of the portion of the first lead portion 151 where the opening 1511 is formed is thinner than the first body portion 111. Therefore, for example, when etching sacrificial copper, the portion of the first lead portion 151 where the opening 1511 is provided opens before the first body portion 111, thereby suppressing further erosion by the etching solution. As a result, it is possible to suppress an increase and variation in the DC resistance of the first inductor wiring 21. The concave opening 1511 can be formed, for example, by controlling the etching time.

[0104] The first conductor layer 11 includes multiple layers stacked along the first direction Z. The multiple layers include a farthest layer that is farthest from the first inductor wiring 21 in the first direction Z. The farthest layer is located between the bottom of the opening 1511 and the first imaginary plane S1 in the first direction Z. This configuration allows the selection of an optimal metal material for the first conductor layer 11. For example, when the first conductor layer 11 is made of Ti / Cu, Ti improves adhesion to the base (e.g., the insulating layer 71), while Cu, which has high conductivity, improves shape controllability of the first inductor wiring 21. If the farthest layer is made of only Ti, the opening 1511 can be provided with high adhesion even if it is thin. If the farthest layer is made of multiple layers, selective etching is possible, thereby suppressing increases and variations in the DC resistance of the first inductor wiring 21.

[0105] The opening 1511 penetrates the first lead portion 151 in the first direction Z. This configuration blocks the path of penetration of the etching solution into the first inductor wiring 21, thereby suppressing an increase and variation in the DC resistance of the first inductor wiring 21 caused by corrosion of the first inductor wiring 21 by the etching solution. For example, when the opening 1511 penetrates the first lead portion 1511, the insulating layer 77 comes into contact with the base (e.g., the insulating layer 71) through the opening 1511, and the first lead portion 151 is sandwiched between the two insulating layers 71, 77. This provides the first conductor layer 11 with sufficient adhesion to the insulating layers 71, 77.

[0106] The first conductor layer 11 includes a lead-out portion 151. The lead-out portion 151 extends from the first body portion 111 in the second direction and in a direction approaching the first pivot axis A1. When viewed along the first direction Z, the width of the lead-out portion 151 is greater than the width of the first inductor wiring 21. This configuration reduces the resistance of the first conductor layer 11. Furthermore, since the path for supplying power to the first inductor wiring 21 is thick and difficult to cut, stable plating growth of the first inductor wiring 21 can be achieved. As a result, variation in the first inductor wiring 21 can be suppressed.

[0107] The first lead portion 151 has a plurality of openings 1511. This configuration can reduce the resistance of the first conductor layer 11. Furthermore, since the path for supplying power to the first inductor wiring 21 is thick and difficult to cut, stable plating growth of the first inductor wiring 21 can be achieved. As a result, variation in the first inductor wiring 21 can be suppressed.

[0108] The inductor component 1 includes an insulating layer 77 (an example of a first insulating layer) located inside the element body 2 and in contact with a side surface 2101 extending along the first direction Z of the first inductor wiring 21. The interior of the opening 1511 is filled with the insulating layer 77. With this configuration, the insulating layer 77 and the base (e.g., insulating layer 71) of the first conductor layer 11 are connected via the opening 1511, thereby preventing the insulating layer 77 from collapsing or peeling off.

[0109] The inductor component 1 includes an element body 2 containing a magnetic material 201 and having a first conductor layer 11 and a first inductor wiring 21 located therein. The element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. The magnetic material 201 is located in the first region B1 and the second region B2. This configuration can improve the efficiency with which the inductor component 1 obtains inductance.

[0110] The inductor component 1 includes an insulating layer 77 (an example of a first insulating layer). The insulating layer 77 is located inside the element body 2 and contacts a first side surface 2101, which is one of the side surfaces of the first inductor wiring 21 that intersects the second direction and is located near the first pivot axis A1 in the second direction. Of both ends of the protrusion 112 in the first direction Z, the end closest to the first inductor wiring 21 contacts the insulating layer 77. Of both ends of the protrusion 112 in the extension direction of the protrusion 112, the end farther from the first body portion 111 contacts the magnetic material 201. With this configuration, the protrusion 112 is protected by the insulating layer 77, and the first inductor wiring 21 is not etched during magnetic path formation, thereby preventing a decrease in the DC resistance of the inductor component 1 due to erosion. By filling the formed magnetic path with the magnetic material 201, the inductance acquisition efficiency of the inductor component 1 can be improved.

[0111] The first conductor layer 11 has a thickness of less than 1.0 μm. The thickness of the first conductor layer 11 is less than 1 / 100 of the thickness of the first inductor wiring 21. With this configuration, the first conductor layer 11 is sufficiently thin compared to the first inductor wiring 21, so that the resistance of the first inductor wiring 21, rather than the first conductor layer 11, becomes dominant. As a result, the selectivity of the metal material constituting the first conductor layer 11 is improved. Furthermore, because the thickness of the first conductor layer 11 itself is sufficiently thin, interlayer short circuits via the first conductor layer 11 can be suppressed. For example, if the first conductor layer 11 is Ti / Cu deposited by sputtering, the Ti is formed to a thickness of 30 nm and the Cu is formed to a thickness of 800 nm. The first conductor layer 11 can be formed by electroless plating or printing, in addition to sputtering. For example, Au, Ag, or Al can be used as the material for the first conductor layer 11.

[0112] The inductor component 1 includes an external terminal 101 provided on an outer surface of the element body 2 that intersects with the first direction Z, and a vertical wiring 61 located inside the element body 2. The vertical wiring 61 is provided at a position that does not overlap the first region B1 and the second region B2 when viewed along the first direction Z, and is in contact with the magnetic material 201 of the element body 2 in the second direction. The vertical wiring 61 extends in the first direction Z to connect the first inductor wiring 21 and the external terminal 101. With this configuration, unnecessary force is not applied to the vertical wiring 61 when filling with the magnetic material 201, thereby preventing breakage of the vertical wiring 61. Furthermore, by configuring the vertical wiring 61 to be in contact with the magnetic material 201 in the second direction, the volume of the magnetic material 201 can be increased, thereby improving the inductance acquisition efficiency of the inductor component 1. Since the vertical wiring 61 is a wiring for connection to the external terminal 101, insulation can be ensured even without an insulating layer. This eliminates the need for a process of forming an insulating layer on the vertical wiring 61, thereby reducing the manufacturing cost of the inductor component 1. The vertical wiring 61 is not limited to being connected to the second inductor wiring 22 via the via 53, and may be directly connected to the second inductor wiring 22. Furthermore, the vertical wiring 61 may be connected to the second inductor wiring 22 not only via the via 53 but also via a seed layer or a layer required for forming the vertical wiring 61.

[0113] The lead-out portion 151 extends from the first body portion 111 in the second direction toward the first pivot axis A1 and is provided in a portion of the first body portion 111 that faces the first pivot axis A1 in the second direction and is farthest from the first pivot axis A1. This configuration can suppress dissolution of the first inductor wiring 21 due to etching when forming a magnetic path around the first pivot axis A1. As a result, an increase in the DC resistance of the inductor component 1 can be prevented.

[0114] The inductor component 1 includes a second conductor layer 12 provided on a second imaginary plane S2 and a second inductor wiring 22 provided on the second conductor layer 12. The second conductor layer 12 includes a second body portion 121 extending around the second pivot axis A2 and a protrusion 122 extending from the second body portion 121 in a direction intersecting the second imaginary line L2. The first conductor layer 11 includes lead portions 153 and 154 (examples of first lead portions) extending from the first body portion 111 in a direction away from the first pivot axis A1 along the second direction. The second conductor layer 12 includes lead portions 163, 164, and 165 (examples of second lead portions) extending from the second body portion 121 in a direction away from the second pivot axis A2 along the second direction. The inductor component 1 includes an insulating layer 73 (an example of a second insulating layer) that contacts the ends of the lead portions 153 and 154 in the first direction Z that are closer to the first inductor wiring 21, and an insulating layer 74 (an example of a third insulating layer) that contacts the ends of the lead portions 163, 164, and 165 in the first direction Z that are closer to the second inductor wiring 22. When viewed along the first direction Z, the lead portions 152 and 153 and the lead portions 163, 164, and 165 overlap each other, and the insulating layer 74 is the same size as or smaller than the insulating layer 73, and the insulating layer 74 overlaps the entire insulating layer 74. When forming the magnetic material 201 in the second regions B2 and C2, if the insulating layer 74 is larger than the insulating layer 73, a region (a void) where the magnetic material 201 cannot be formed may be generated. In this case, the inductance acquisition efficiency of the inductor component 1 and the strength of the element body 2 may be reduced. With the above-described configuration, the inductor component 1 can prevent a decrease in the efficiency of obtaining inductance from the inductor component 1 and a decrease in the strength of the element body 2 .

[0115] Of both ends of the lead portions 153, 154 of the first conductor layer 11 in the second direction, the tip end farthest from the first body portion 111 is exposed from the side surfaces 204, 205 of the element body 2 and is in contact with at least one insulating layer. With this configuration, the parts of the lead portions 153, 154 that are exposed to the outside of the element body 2 can be covered with an insulating layer, thereby preventing metal corrosion of the lead portions 153, 154. For example, by configuring the inductor component 1 so that the tip ends of the lead portions 153, 154 are in contact with multiple insulating layers, the coverage of the tip ends of the lead portions 153, 154 can be increased.

[0116] The inductor component 1 includes a second conductor layer 12 and a second inductor wiring 22. The second conductor layer 12 is provided on a second imaginary plane S2 adjacent to and parallel to the first imaginary plane S1. The second inductor wiring 22 is provided on the second conductor layer 12, is located between the first conductor layer 11 and the second conductor layer 12, and extends around a second pivot axis A2. The first inductor wiring 21 has a first input portion connected to a first input element and a first output portion connected to an output element. The second inductor wiring 22 has a second input portion connected to a second input element different from the first input element and a second output portion connected to the output element. When viewed along the first direction Z, the first input portion and the second input portion are spaced apart in the second direction, and the first output portion and the second output portion are adjacent to each other. Since the input portion is separate and the output portion is shared, the inductor component 1 can be used in a multi-phase DC-DC converter. Furthermore, since the output section is shared, the first inductor wiring 21 and the second inductor wiring 22 are at the same potential, which increases the resistance of the inductor component 1 to static electricity.

[0117] The inductor component 1 can be configured as follows.

[0118] The first conductor layer 11 may include, as the first lead portion, a lead portion having at least one opening. For example, the lead portions 153 and 154 may be omitted. For example, in addition to or instead of the lead portion 151, the first conductor layer 11 may be configured to include a lead portion having at least one opening, extending from the first main body portion 111 in the second direction and in a direction away from the first pivot axis A1. For example, the first conductor layer 11 may be configured to include one or more lead portions provided in a portion of the first main body portion 111 that overlaps with the fourth portion 214 or the sixth portion 216 when viewed along the first direction Z.

[0119] As shown in FIG. 15 , when the lead-out portion 151 has multiple openings 1511, the lead-out portion 151 may be configured so that the multiple openings 1511 have first openings 1512 and second openings 1513 having a different shape from the first openings 1512. For example, in the inductor component 1 shown in FIG. 15 , a semicircular first opening 1512 is provided at one of both ends of the lead-out portion 151 in the short-side direction Y that contacts the magnetic material 201, and a substantially rectangular second opening 1513 is provided in the middle of the lead-out portion 151 in the short-side direction Y. The first opening 1512 and the second opening 1513 are spaced apart along the longitudinal direction X. The second openings 1513 located at both ends in the long-side direction X are open to both ends of the lead-out portion 151 in the long-side direction X. In this way, the lead-out portion 151 can have openings of any shape. For example, by providing the first openings 1512, the first inductor wiring 21 is less likely to break. Furthermore, by providing the second opening 1513, the path along which the etching solution can penetrate into the first inductor wiring 21 becomes longer, which more reliably suppresses the etching solution from corroding the first inductor wiring 21. In other words, the degree of freedom in designing the lead-out portion 151 is increased.

[0120] As shown in FIG. 16, the lead-out section 151 may be configured so that the plurality of openings 1511 only have openings of the same shape (in FIG. 16, as an example, a first opening 1512 having a semicircular shape).

[0121] 17 , the lead-out portion 151 may be configured such that a plurality of openings 1511 are positioned along a width direction intersecting the first direction Z and the second direction, and the positions of adjacent openings 1511 in the width direction are different in the second direction. In the inductor component 1 shown in FIG. 17 , a first group D1 in which two openings 1511 are positioned at an interval along the second direction (e.g., the short-side direction Y) and a second group D2 in which one opening 1511 is positioned are alternately positioned at an interval along the width direction (e.g., the longitudinal direction X) of the lead-out portion 151. The opening 1511 of the second group D2 is positioned between two openings 1511 of the first group D1 in the short-side direction Y. That is, the lead-out portion 151 has a plurality of openings 1511 positioned in a staggered or lattice pattern. This configuration narrows the path through which the etching solution penetrates the first inductor wiring 21, thereby more reliably suppressing erosion of the first inductor wiring 21 by the etching solution.

[0122] The inductor component 1 may be configured to include conductor layers located on three or more imaginary planes parallel to each other, and inductor wiring provided on each of these conductor layers. In other words, the inductor component 1 may include three or more layers of inductor wiring.

[0123] The inductor component 1 may be configured so that only the first conductor layer 11 is located on the first imaginary plane S1, or so that two or more conductor layers including the first conductor layer 11 are located on the first imaginary plane S1. Similarly, the inductor component 1 may be configured so that only the second conductor layer 12 is located on the second imaginary plane S2, or so that two or more conductor layers including the second conductor layer 12 are located on the second imaginary plane S2. In other words, it is possible to realize an inductor component 1 in which multiple electrically independent inductor wirings are arranged on the same imaginary plane.

[0124] The insulating layers (e.g., the first insulating layer 71, the second insulating layer 72, the third insulating layer 73, and the fourth insulating layer 74) located inside the element body 2, the vertical wiring 61, and the vias 51, 52, 53, 54, and 55 may be omitted depending on the design of the inductor component 1, etc.

[0125] The shape and size of each part constituting the inductor component 1 are not limited to the above-described embodiment and can be set arbitrarily depending on the design of the inductor component 1. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to being less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0126] Each inductor wiring may have a spiral shape when viewed in the first direction Z. For example, each inductor wiring may be a curve with one or more turns, or a curve with less than one turn. Each inductor wiring may have a linear shape in part.

[0127] The embodiments and modifications of the present disclosure can be combined with each other, or with modifications, or with each other. Features included in the embodiments and modifications of the present disclosure can also be combined with each other.

[0128] The disclosure of the present disclosure may vary in structural details, and changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the claimed disclosure.

[0129] REFERENCE SIGNS LIST 1 inductor component 2 element body 201 magnetic material 202 main surface 203 non-magnetic material 204, 205 side surface 11 first conductor layer 111 first body portion 112 protrusion portion 12 second conductor layer 121 second body portion 122 protrusion portion 21 first inductor wiring 22 second inductor wiring 51, 52, 53, 54, 55 via 61 vertical wiring 71, 72, 73, 74, 75, 76, 77, 78 insulating layer 81 first pad portion 101, 102, 103 external terminal 151, 153, 154, 155, 161, 162, 163, 164, 165 lead portion

Claims

1. An inductor component comprising: a first conductor layer located on a first imaginary plane; and a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting with the first imaginary plane, wherein the first conductor layer includes: a first main body portion extending around the first pivot axis; and a first lead-out portion extending from the first main body portion in a second direction intersecting with the first direction and away from the first pivot axis, or in the second direction and approaching the first pivot axis, wherein the first lead-out portion has at least one opening.

2. The inductor component according to claim 1, wherein the opening has a concave shape recessed from one end of the first lead portion in the first direction toward the other end of the first lead portion in the first direction.

3. An inductor component as described in claim 2, wherein the first conductor layer includes a plurality of layers stacked along the first direction, the plurality of layers having an outermost layer that is farthest from the first inductor wiring in the first direction, and the outermost layer is located between the bottom of the opening and the first imaginary plane in the first direction.

4. The inductor component according to claim 1, wherein the opening penetrates the first lead portion in the first direction.

5. An inductor component according to any one of claims 1 to 4, wherein the dimension of the first lead-out portion in a direction intersecting the first direction and the second direction is defined as the width of the first lead-out portion, and the dimension of the first inductor wiring in a direction intersecting the first direction and the direction in which the first inductor wiring extends is defined as the width of the first inductor wiring, and the width of the first lead-out portion is larger than the width of the first inductor wiring.

6. An inductor component according to any one of claims 1 to 5, wherein the first lead portion has a plurality of the openings.

7. The inductor component according to claim 6, wherein the plurality of openings include a first opening and a second opening having a shape different from that of the first opening.

8. An inductor component according to claim 6, wherein a plurality of said openings are positioned along a width direction intersecting said first direction and said second direction, and the positions of said openings adjacent to each other in said width direction are different in said second direction.

9. An inductor component according to any one of claims 1 to 8, comprising: an element body in which the first conductor layer and the first inductor wiring are located; and a first insulating layer located inside the element body and in contact with a side surface of the first inductor wiring that intersects with the second direction, wherein the inside of the opening is filled with the first insulating layer.

10. An inductor component according to any one of claims 1 to 9, comprising an element body containing a magnetic material, the first conductor layer and the first inductor wiring being located therein, the element body having within it a first region that is closer to the first pivot axis than the first inductor wiring, and a second region that is farther from the first pivot axis than the first inductor wiring, the magnetic material being located in the first region and the second region.

11. An inductor component according to any one of claims 1 to 10, comprising an element body containing a magnetic material and having the first conductor layer and the first inductor wiring located therein, a first insulating layer located inside the element body and in contact with a side surface of the first inductor wiring that intersects with the second direction, of both ends of the first lead-out portion in the first direction, the end closest to the first inductor wiring is in contact with the first insulating layer, and of both ends of the first lead-out portion in the second direction, the end farther from the first body portion is in contact with the magnetic material.

12. An inductor component according to any one of claims 1 to 11, wherein the first conductor layer has a thickness in the first direction that is less than 1.0 μm, and the thickness of the first conductor layer is smaller than 1 / 100 of the thickness of the first inductor wiring.

13. An inductor component as described in any one of claims 1 to 12, comprising an element body containing a magnetic material, the first conductor layer and the first inductor wiring being located therein; an external terminal provided on an outer surface of the element body that intersects with the first direction; and a vertical wiring located inside the element body, the element body having within it a first region that is closer to the first pivot axis than the first inductor wiring and a second region that is farther from the first pivot axis than the first inductor wiring, the vertical wiring being located in a position that does not overlap with the first region and the second region when viewed along the first direction, making contact with the magnetic material of the element body in the second direction, and extending in the first direction to connect the first inductor wiring and the external terminal.

14. An inductor component as described in any one of claims 1 to 13, wherein the first lead portion extends from the first body portion in the second direction and in a direction approaching the first pivot axis, and is provided at a portion of the first body portion that faces the first pivot axis in the second direction and is farthest from the first pivot axis.

15. An inductor component comprising: a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; and a second inductor wiring provided on the second conductor layer, located between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction, wherein the second conductor layer comprises: a second main body portion extending around the second pivot axis; and a second lead-out portion extending from the second main body portion in the second direction and in a direction away from the second pivot axis, wherein the first lead-out portion extends from the first main body portion in the second direction and in a direction away from the first pivot axis, and comprises: a second insulating layer in contact with an end of the first lead-out portion closest to the first inductor wiring, of both ends of the first lead-out portion in the first direction; and a third insulating layer in contact with an end of the second lead-out portion closest to the second inductor wiring, of both ends of the second lead-out portion in the first direction. An inductor component according to any one of claims 1 to 14, wherein, when viewed along the first direction, the third insulating layer is the same size as or smaller than the second insulating layer, and the second insulating layer overlaps the entire third insulating layer.

16. An inductor component as described in any one of claims 1 to 15, comprising an element body in which the first conductor layer and the first inductor wiring are located, the element body having a side surface that intersects with the second direction, the first lead-out portion extending in a direction away from the first pivot axis, and of both ends of the first lead-out portion in the second direction, the tip end that is farther from the first main body portion is exposed from the side surface and is in contact with at least one insulating layer.

17. An inductor component as recited in any one of claims 1 to 16, comprising: a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; and a second inductor wiring provided on the second conductor layer, located between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction, wherein the first inductor wiring has a first input portion connected to a first input element and a first output portion connected to an output element, and the second inductor wiring has a second input portion connected to a second input element different from the first input element and a second output portion connected to the output element, wherein when viewed along the first direction, the first input portion and the second input portion are spaced apart in the second direction, and the first output portion and the second output portion are adjacent to each other.

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