LED heater system and semiconductor wafer processing device having same

Abstract

The present invention provides an LED heater system and a semiconductor wafer processing device including same, wherein multiple LED modules are divided and arranged in a circumferential direction, and multiple channels in which multiple LEDs are grouped in a radial direction in each LED module are arranged in the circumferential direction to enable individual control of the channels, thereby uniformly controlling a heating temperature of a semiconductor wafer as a whole.

Description

LED heater system and semiconductor wafer processing device equipped therewith

[0001] The present invention relates to an LED heater system and a semiconductor wafer processing device having the same.

[0002] Typically, semiconductor wafer processing in the semiconductor manufacturing process involves various processes, including photoresist coating, developing, etching, and ashing. Each process involves a wet cleaning process using chemicals or deionized water to remove various contaminants attached to the semiconductor wafer, and a drying process to dry any remaining chemicals or deionized water on the surface of the semiconductor wafer. Recently, etching processes that selectively remove silicon nitride and silicon oxide films have been performed using high-temperature chemical aqueous solutions, such as sulfuric acid or phosphoric acid. In semiconductor wafer processing equipment using high-temperature chemical aqueous solutions, IR lamp heaters are being used to heat semiconductor wafers to improve the etching rate.

[0003] However, the patterns formed on semiconductor wafers have recently become increasingly finer, and as a result, the phenomenon of wafer pattern collapse (or leaning) due to the surface tension of the cleaning solution during drying of semiconductor wafers is increasing. One cause of semiconductor wafer pattern collapse is the residue of the cleaning solution on the semiconductor wafer surface. To solve this problem, it is necessary to develop a drying technology that can uniformly heat the entire semiconductor wafer while simultaneously rapidly heating the cleaning solution.

[0004] Examples of using LED as a heating source include Patent Publication No. 10-2101536 (hereinafter referred to as “prior invention 1”) and Patent Publication No. 10-2078157 (hereinafter referred to as “prior invention 2”).

[0005] Prior Art 1 is a technology that groups multiple LEDs along a circumferential direction, divides them into multiple LED zones, and controls the multiple LED zones in a radial direction. However, Prior Art 1 is a technology that rather applies a temperature difference to a semiconductor wafer in the radial direction, and thus has limitations in its use for the purpose of uniformly controlling the temperature of a semiconductor wafer. Even if some structure is adopted for temperature uniformity, the method of grouping multiple LEDs along a circumferential direction, which are located at the same radius or adjacent to the same radius, and controlling them along the radial direction has limitations in precisely controlling minute temperature deviations occurring in a radial direction in a rotating semiconductor wafer.

[0006] Meanwhile, prior art 2 proposes a technology that divides the heating zone of a heating plate into a central zone, an intermediate zone, and an edge zone, and proposes a structure in which the central zone is provided in a slanted or curved manner so that heating light is concentrated on the central region of the substrate, the edge zone is provided in a slanted or curved manner so that heating light is concentrated on the edge region of the substrate, and the intermediate zone is formed horizontally with the substrate. However, prior art 2 has a limitation in that it is difficult to control for uniformity when a temperature deviation occurs in a semiconductor wafer by only adopting an inclined structure for each zone of the heating plate.

[0007] In addition, when adopting a configuration in which LEDs are simply arranged densely at regular intervals within a single partition area, as in prior art inventions 1 and 2, there is a limit to compensating for minute temperature differences occurring in a semiconductor wafer.

[0008] Meanwhile, in order to solve the problems of the conventional IR lamp heater, the applicant has proposed a patent application No. 10-2232654 (hereinafter referred to as “prior invention 3”) and a patent application No. 10-2102277 (hereinafter referred to as “prior invention 4”) that use an LED as a heating source.

[0009] FIGS. 1A to 1C are drawings disclosed in prior art 3. Referring to FIGS. 1A to 1C, a semiconductor wafer processing device (10) of prior art 3 includes a chuck stage (100) configured to hold a semiconductor wafer and rotatably installed, a heating unit (500) configured to heat the semiconductor wafer, a cover (700) installed on the upper part of the body to cover the heating unit (500), and a control unit (not shown) that controls the heating unit (500). The chuck stage (100) includes an outer part (130) on which a plurality of chuck pins (170) for holding a semiconductor wafer and a plurality of support pins (180) are arranged, and a groove part (150) on which a heating unit (500) is positioned. The wafer processing device (10) is configured to include a heating unit (500) having a first LED group composed of a plurality of first LEDs (531) that vertically irradiate the lower surface of the non-outer area of ​​the wafer (W), and a second LED group composed of a plurality of second LEDs (551) that irradiate the lower surface of the outer area of ​​the wafer (W) in an inclined direction in the outer direction. Prior art 3 is to uniformly heat a semiconductor wafer through a first LED group and a second LED group (drawing reference numeral 111, which is not described here, is a connecting member, 310 is a post cover, 510 is a plate, 511 is a second hollow, 513 is an inlet, 515 is an outlet, 520 is an inclined portion, 521 is an inclined surface, 530 is a first LED substrate, 550 is a second LED substrate, and 710 is a third hollow of the cover).

[0010] FIG. 2 is a drawing disclosed in prior art 4. Referring to FIG. 2, the LED heating system (30) is divided into at least two or more multiple regions in the circumferential direction. For example, the LED heating system (30) is divided into a first region (311), a second region (312), and a third region (313) so as to have an angle of 120 degrees, and each region can be individually controlled. In addition, a plurality of LED elements (320) provided in each region are divided into a plurality of groups. In addition, the first region (311), the second region (312), and the third region (313) are each divided into three groups. From the center in a radial direction, they are divided into a first group (3111, 3121, 3131), a second group (3112, 3122, 3132), and a third group (3113, 3123, 3133). In this way, the LED heating system (30) of prior art 4 is divided into a plurality of regions in the circumferential direction, the plurality of regions can be individually controlled, and the plurality of regions are provided as setting regions or compensation regions to uniformly heat the semiconductor wafer.

[0011] Prior inventions 3 and 4 proposed by the applicant of the present invention have the useful advantage of dividing a plurality of LEDs into multiple regions to heat a semiconductor wafer. However, there is a need for a method that can more precisely and uniformly control the temperature of the semiconductor wafer overall while utilizing the advantages of prior inventions 3 and 4. Therefore, the inventor of the present invention needed to devise a structure different from the existing one while dividing a plurality of LEDs into multiple regions to heat a semiconductor wafer.

[0012] [Prior Art Literature]

[0013] [Patent Document]

[0014] (Patent Document 1) Prior Art 1: Patent Publication No. 10-2101536

[0015] (Patent Document 2) Prior Art 2: Patent Publication No. 10-2078157

[0016] (Patent Document 3) Prior Art 3: Patent Publication No. 10-2232654

[0017] (Patent Document 4) Prior Art 4: Patent Publication No. 10-2102277

[0018] The present invention has been made to solve the problems of the above-described prior art, and the purpose of the present invention is to provide an LED heater system capable of uniformly controlling the heating temperature of a semiconductor wafer as a whole by dividing the LED module into a plurality of LED modules and arranging them in a circumferential direction, and arranging a plurality of channels in which a plurality of LEDs are grouped in a radial direction in each LED module so that these channels can be individually controlled, and a semiconductor wafer processing device having the same.

[0019] In order to achieve the above-described object, the LED heater system according to the present invention is an LED heater system for heating a semiconductor wafer, wherein the LED heater system includes a heat sink and a plurality of LED modules provided along a circumferential direction on the heat sink, each of the LED modules includes a circuit board and a plurality of LEDs mounted on the circuit board, and each of the LED modules includes a channel for grouping and controlling a plurality of LEDs arranged in a radial direction, and a plurality of the channels are provided along the circumferential direction.

[0020] Additionally, each of the above LED modules includes multiple channels.

[0021] Additionally, the arrangement of LEDs provided in at least one LED module among the plurality of LED modules is different from the arrangement of LEDs provided in at least one other LED module.

[0022] Additionally, the arrangement of the LEDs provided in at least one channel among the plurality of channels is different from the arrangement of the LEDs provided in at least one other channel.

[0023] Additionally, the above multiple channels can be individually controlled for each channel.

[0024] Additionally, the above multiple channels can control output for each channel.

[0025] Additionally, the plurality of said channels are controlled so that the heating temperature of the semiconductor wafer is uniform.

[0026] Meanwhile, a semiconductor wafer processing device according to the present invention comprises: a chuck stage configured to hold a semiconductor wafer; an LED heater system installed to heat the semiconductor wafer held on the chuck stage; wherein the LED heater system comprises a heat sink and a plurality of LED modules provided circumferentially on the heat sink, each of the LED modules including a circuit board and a plurality of LEDs mounted on the circuit board, and each of the LED modules includes a channel for grouping and controlling a plurality of LEDs arranged in a radial direction, and a plurality of the channels are provided circumferentially.

[0027] In addition, the semiconductor wafer is uniformly heated by individually controlling each of the plurality of channels.

[0028] In addition, the semiconductor wafer is uniformly heated by controlling the output of each of the plurality of channels.

[0029] Additionally, the heat sink is equipped with at least one of water cooling, air cooling, and heat sink fins.

[0030] The present invention provides an LED heater system capable of uniformly controlling the heating temperature of a semiconductor wafer as a whole by dividing the LED module into a plurality of LED modules and arranging them in a circumferential direction, and arranging a plurality of channels in which a plurality of LEDs are grouped in a radial direction in each LED module so that these channels can be individually controlled, and a semiconductor wafer processing device having the same.

[0031] Figure 1a is a perspective view of a semiconductor wafer processing device according to prior art prior art 3.

[0032] Figure 1b is an exploded perspective view of a semiconductor wafer processing device according to prior art prior art 3.

[0033] Figure 1c is an exploded perspective view of a heating unit according to prior art prior art 3.

[0034] Figure 2 is a plan view of an LED heating system according to prior art prior art 4.

[0035] Figure 3 is a plan view of an LED heater system according to a preferred embodiment of the present invention.

[0036] Figure 4 is a plan view of the entire LED module according to a preferred embodiment of the present invention.

[0037] Figure 5 is an exploded perspective view of the entire LED module according to a preferred embodiment of the present invention.

[0038] Figure 6 is a plan view of a first LED module according to a preferred embodiment of the present invention.

[0039] Figure 7 is a plan view of a second LED module according to a preferred embodiment of the present invention.

[0040] Figure 8 is a plan view of a third LED module according to a preferred embodiment of the present invention.

[0041] Figure 9 is a plan view of a heat sink according to a preferred embodiment of the present invention.

[0042] Fig. 10 is a perspective view of an LED heater system according to a modified example of a preferred embodiment of the present invention.

[0043] Fig. 11 is a plan view of an LED heater system according to a modified example of a preferred embodiment of the present invention.

[0044] The following merely exemplifies the principles of the invention. Therefore, those skilled in the art will be able to implement the principles of the invention and invent various devices within the scope and spirit of the invention, even if not explicitly described or illustrated herein. Furthermore, all conditional terms and embodiments listed herein are expressly intended, in principle, to facilitate understanding of the invention's concepts and should be understood as being solely intended to facilitate understanding and are not intended to be limited to the specifically enumerated embodiments and conditions.

[0045] The above-described purposes, features and advantages will become clearer through the following detailed description with reference to the attached drawings, so that a person having ordinary skill in the art to which the invention pertains can easily practice the technical idea of ​​the invention.

[0046] Embodiments described herein will be described with reference to cross-sectional and / or perspective views, which are ideal exemplary drawings of the present invention. The thicknesses of films and regions, etc., illustrated in these drawings are exaggerated for the purpose of effectively explaining the technical contents. The form of the exemplary drawings may be modified due to manufacturing techniques and / or tolerances. Embodiments of the present invention are not limited to the specific forms illustrated, but also include changes in form resulting from the manufacturing process. Technical terms used herein are used only to describe specific embodiments and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, it should be understood that terms such as "comprise" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in this specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0047] The LED heater system (1000) of the present invention is divided into a plurality of LED modules (1200) and arranged in a circumferential direction, and has a plurality of channels (1230) in which LEDs (1220) are grouped in a radial direction, and the plurality of channels (1230) are spatially divided in the circumferential direction while allowing the plurality of channels (1230) to be individually controlled, thereby uniformizing the temperature of a semiconductor wafer, which is a heating target, as a basic technical idea. In addition, the present invention is a technical idea in which the arrangement and / or number of LEDs (1220) in the central zone, the middle zone, and the outer zone of at least one channel (1230) spatially divided in the circumferential direction are different from the arrangement and number of LEDs (1220) in the central zone, the middle zone, and the outer zone of another channel (1230), so that one channel (1230) can compensate for the amount of LED light in the radial direction of another channel (1230).

[0048] Hereinafter, the technical idea of ​​the present invention will be described in detail with reference to the attached drawings.

[0049] FIG. 3 is a plan view of an LED heater system (1000) according to a preferred embodiment of the present invention, FIG. 4 is a plan view of an entire LED module (1200) according to a preferred embodiment of the present invention, FIG. 5 is an exploded perspective view of an entire LED module (1200) according to a preferred embodiment of the present invention, FIG. 6 is a plan view of a first LED module (1201) according to a preferred embodiment of the present invention, FIG. 7 is a plan view of a second LED module (1202) according to a preferred embodiment of the present invention, FIG. 8 is a plan view of a third LED module (1203) according to a preferred embodiment of the present invention, FIG. 9 is a plan view of a heat sink (1100) according to a preferred embodiment of the present invention, FIG. 10 is a perspective view of an LED heater system (1000) according to a modified example of a preferred embodiment of the present invention, and FIG. 11 is a plan view of an LED heater system (1000) according to a modified example of a preferred embodiment of the present invention.

[0050] Referring to a part of the structure illustrated in FIGS. 1A and 1B, a semiconductor wafer processing device (10) according to a preferred embodiment of the present invention includes a chuck stage (100) configured to hold a semiconductor wafer (W) and rotatably provided, a cover (700) installed on the upper portion of the chuck stage (100), and a control unit (not shown). The chuck stage (100) includes an outer portion (130) in which a plurality of chuck pins (170) for holding a semiconductor wafer (W) and a plurality of support pins (180) are arranged, and a groove portion (150). The cover (700) is provided to protect the LED heater system (1000). The cover (700) may be provided transparently. The cover (700) may be rotated together with the chuck stage (100).

[0051] The chuck stage (100) has a circular upper surface. The chuck stage (100) is coupled to a rotating part and rotates. The chuck pins (170) align the semiconductor wafer supported by a plurality of support pins (180) so that the semiconductor wafer is placed in the correct position. During the process, the chuck pins (170) come into contact with the side of the semiconductor wafer to prevent the semiconductor wafer from being displaced from the correct position.

[0052] An LED heater system (1000) is installed inside a semiconductor wafer processing device (10). The LED heater system (1000) heats a semiconductor wafer during a process. The LED heater system (1000) uses light emitting diodes (LEDs, 1220) as a light source. The LEDs (1220) emit light of a wavelength or multiple wavelengths that are easily absorbed by the semiconductor wafer.

[0053] The LED heater system (1000) includes a heat sink (1100) and a plurality of LED modules (1200) provided along the circumference of the heat sink (1100). The semiconductor wafer is provided so as to be rotatable by a chuck stage (100), while the LED heater system (1000) is fixedly installed. Accordingly, the LED heater system (100) heats the rotating semiconductor wafer.

[0054] The heat sink (1100) may be circular in shape with a size substantially equal to or larger than the area of ​​the plurality of LED modules (1200). The heat sink (1100) is installed in a fixed manner that does not rotate together with the chuck stage (100). The heat sink (1100) is equipped with at least one of a water-cooled type, an air-cooled type, and a heat sink fin.

[0055] Each LED module (1200) includes a circuit board (1210) and a plurality of LEDs (1220) mounted on the circuit board (1210). The LEDs (1220) are mounted on the circuit board (1210) and electrically connected to a power source through the circuit board (1210). The circuit board (1210) is attached to a heat sink (1100) by screws and / or thermal grease. The thermal grease is provided between the circuit board (1210) and the heat sink (1100) to ensure thermal conduction between the circuit board (1210) and the heat sink (1100). The circuit board (1210) has a fastening hole (h), and by fastening a screw to the fastening hole (h), the circuit board (1210) is fixed to the heat sink (1100), thereby fixing the LED module (1200) to the heat sink (1100).

[0056] Referring to FIGS. 4 and 5, each LED module (1200), more specifically, each circuit board (1210), is provided in a fan shape that surrounds a radius and an arc, and when a plurality of LED modules (1200) are all fastened to a heat sink (1100), the overall shape is circular. The LED module (1200) can be divided into a total of six, and the division angles can be evenly divided as equal angles. However, the number of divisions and the division angles of the LED module (1200) are not limited thereto.

[0057] Each LED module (1200), more specifically, each circuit board (1210), includes an inner portion (1211), an outer portion (1212), a left radius portion (1213) connecting the inner portion (1211) and the outer portion (1212), and a right radius portion (1214). The left radius portion (1213) and the right radius portion (1214) are provided in a stepped form to form a free space portion (1260) that provides a space between adjacent circuit boards (1210). A wire (not shown) connected to a connector (1280) is positioned in the free space portion (1260). Positioning of the wire (not shown) is facilitated through the free space portion (1260).

[0058] Each LED module (1200), more specifically, each circuit board (1210), has a recessed portion (1270) on its outer surface. The recessed portion (1270) is provided in the outer groove portion (1212) and is provided in a concave shape toward the inside. The recessed portion (1270) is provided at a central position in the circumferential direction of the outer groove portion (1212).

[0059] The circuit board (1210) has a pad and a wiring pattern on which the LED (1220) is mounted. Since the LED (1220) dissipates a large portion of its total power as heat, it is preferable that the circuit board (1210) be a high-heat dissipation substrate to effectively dissipate the heat generated by the LED (1220). For example, the circuit board (1210) may be a high-heat dissipation substrate such as a metal base substrate using a metal plate as a base or a ceramic substrate, but is not limited thereto.

[0060] The circuit board (1210) is provided with a connector (1280) to which external wires are connected. The connector (1280) is provided on the upper surface of the circuit board (1210) within the fan-shaped circuit board (1210). The circuit board (1210) has an LED non-installation area (1250) where an LED (1220) is not installed, and the connector (1280) is provided in the LED non-installation area (1250). Since the middle area has a relatively lower density of LEDs (1220) and has idle space compared to the center area and the outer area, it is preferable that the connector (1280) be provided in the middle area among the center area, the middle area, and the outer area.

[0061] At least one of the plurality of circuit boards (1210) is provided with a through hole (1240). The through hole (1240) may be provided in the form of a long hole that is bored along the circumference. The through hole (1240) is provided at a position corresponding to a heat sink through hole (1110) provided in a heat sink (1100), and corresponds to an installation position of a wafer detection sensor (not shown) installed at the bottom of the heat sink (1100). The wafer detection sensor (not shown) performs a function of detecting whether a semiconductor wafer is present on the chuck stage (100), and detects the presence or absence of a semiconductor wafer provided thereon through the heat sink through hole (1110) and the through hole (1240).

[0062] The LED heating system (1000) according to the present invention is divided into a plurality of LED modules (1200) and arranged in a spatially divided manner in the circumferential direction, and in each LED module (1200), a channel (1230) groups a plurality of LEDs (1220) arranged in a radial direction.

[0063] In the case where a configuration of multiple LED modules (1200) spaced in a circumferential direction is adopted instead of adopting a single LED module (1200) as a whole, it becomes easier to arrange the LED modules (1200) in an optimal combination so that each LED module (1200) can be easily replaced and the overall temperature uniformity can be improved.

[0064] Meanwhile, when a plurality of LED modules (1200) are spatially divided in the radial direction, a temperature deviation in the radial direction may occur in the semiconductor wafer due to the manufacturing and assembly tolerance of each LED module (1200). However, the present invention adopts a configuration in which a plurality of LED modules (1200) are spatially divided in the circumferential direction, thereby preventing a temperature deviation in the radial direction occurring in the semiconductor wafer.

[0065] The plurality of LED modules (1200) include at least one LED module (1200) in which the arrangement of the LEDs (1220) is different from each other. In other words, the arrangement of the LEDs (1220) provided in at least one LED module (1200) among the plurality of LED modules (1200) may be different from the arrangement of the LEDs (1220) provided in at least one other LED module (1200).

[0066] Alternatively, all of the multiple LED modules (1200) may have different arrangements of their respective LEDs (1220).

[0067] Each LED module (1200) includes at least one channel (1230) that controls a plurality of LEDs (1220) arranged in a radial direction. The channel (1230) groups the plurality of LEDs (1220) arranged in a radial direction so that the plurality of LEDs (1220) can be controlled together. The channel (1230) groups the plurality of LEDs (1220) arranged in a radial direction so that the LEDs (1220) can be controlled simultaneously. The arrangement and number of LEDs (1220) grouped in a radial direction in each channel (1230) may be different from each other.

[0068] When dividing the sections from the inner side to the outer side in the radial direction, the central section is the section from the center point to the first radius, the middle section is the section from the first radius to the second radius, and the outer section is the section from the second radius to the third radius. Alternatively, when the LEDs arranged in the entire LED module (1200) are arranged at a constant interval from the inner side to the outer side in the radial direction, the radial sections can be divided into R1 to Rn (where n is a natural number) from the inner side to the outer side in the radial direction. Here, these sections can be divided into three sections, and can be divided into a central section, a middle section, and an outer section from the inner side. Alternatively, these sections can be equally divided into three sections and can be divided into a central section, a middle section, and an outer section. Alternatively, at least one of the central section, the middle section, and the outer section can be one radial section. For example, the central section can be the R1 section, the outer section can be the Rn section, and the section between R1 and Rn can be the middle section. Meanwhile, the intermediate zone may be divided into two or more zones, such as a first intermediate zone and a second intermediate zone. The ranges of the central zone, intermediate zone, and outer zone may vary depending on how the LEDs (1220) are radially partitioned to ensure a uniform temperature distribution of the semiconductor wafer.

[0069] A plurality of channels (1230) are formed by: (a) a channel (1230) that groups in a radial direction at least one LED (1220) provided in a central region, at least one LED (1220) provided in a middle region, and at least one LED (1220) provided in an outer region; (b) a channel (1230) that groups in a radial direction at least one LED (1220) provided in a central region and at least one LED (1220) provided in an middle region; (c) a channel (1230) that groups in a radial direction at least one LED (1220) provided in a central region and at least one LED (1220) provided in an outer region; (d) a channel (1230) that groups in a radial direction at least one LED (1220) provided in a middle region and at least one LED (1220) provided in an outer region; (e) a channel (1230) that groups in a radial direction at least one LED (1220) provided in a central region, at least one LED (1220) provided in a middle region, and at least one LED (1220) provided in an outer region; Among the channels (1230) including one of the LEDs (1220), at least one channel (1230) may be included.

[0070] Preferably, at least one channel (1230) controls a plurality of LEDs (1220) arranged radially from the central region to the peripheral region, including at least one LED (1220) provided in the central region and at least one LED (1220) provided in the peripheral region. Or preferably, when the radial region is divided from the inner side to the outer side in the radial direction into R1 to Rn (wherein, n is a natural number), at least one channel (1230) controls a plurality of LEDs (1220) arranged radially from the R1 region to the Rn region, including at least one LED (1220) in the R1 region and at least one LED (1220) in the Rn region.

[0071] Alternatively, all of the plurality of channels (1230) include at least one LED (1220) provided in a central region and at least one LED (1220) provided in an outer region, but at least one channel (1230) of the plurality of channels (1230) may have an arrangement of the plurality of LEDs (1220) arranged between the central region and the outer region that is different from the LED arrangement (1220) of any other channel (1230). Or preferably, when the radial sections are divided from the inner side to the outer side in the radial direction into R1 to Rn (wherein n is a natural number), all of the plurality of channels (1230) include at least one LED (1220) in the R1 section and at least one LED (1220) in the Rn section, but at least one channel (1230) among the plurality of channels (1230) may have an arrangement of the plurality of LEDs (1220) arranged between the R2 section and the Rn-1 section that is different from the LED arrangement (1220) of any other channel (1230).

[0072] Each LED module (1200) may include at least one channel (1230). Since a plurality of LED modules (1200) are provided, a plurality of channels (1230) may be provided in a number greater than the number of LED modules (1200). The plurality of channels (1230) are provided along the circumferential direction.

[0073] Each LED module (1200) may have different arrangements of LEDs (1220) and / or different numbers of LEDs (1220) in the central zone, the middle zone, and the outer zone. Additionally, each channel (1230) may have different arrangements of LEDs (1220) and / or different numbers of LEDs (1220) in the central zone, the middle zone, and the outer zone.

[0074] Each LED module (1200) or each channel (1230) is controlled so that the heating temperature of the semiconductor wafer is uniform. The semiconductor wafer is heated uniformly by individually controlling and / or output-controlling each of the plurality of LED modules (1200). Alternatively, the semiconductor wafer is heated uniformly by individually controlling and / or output-controlling each of the plurality of channels (1230).

[0075] A plurality of LED modules (1200) can be individually controlled for each LED module (1200). Alternatively, a plurality of channels (1230) can be individually controlled for each channel (1230). Among the plurality of LED modules (1200), at least some of the LED modules (1200) can be controlled to be in an On state, and the remaining LED modules (1200) can be controlled to be in an Off state. Here, the number of channels (1230) that are turned On and Off can be selected or changed in order to uniformly heat the temperature of the semiconductor wafer.

[0076] Alternatively, among a plurality of channels (1230), at least some of the channels (1230) may be controlled to be in an On state, and the remaining channels (1230) may be controlled to be in an Off state. Here, the number of channels (1230) that are turned On and Off may be selected or changed to uniformly heat the temperature of the semiconductor wafer.

[0077] A plurality of LED modules (1200) can control the output of each LED module (1200). The output levels of the plurality of LED modules (1200) may be different. For example, among the plurality of LED modules (1200), the output of at least some of the LED modules (1200) may be controlled to 100%, the output of the remaining some of the LED modules (1200) may be controlled to 75%, and the output of the remaining LED modules (1200) may be controlled to 50%. Here, the output level and number of each LED module (1200) may be selected or changed in order to uniformly heat the temperature of the semiconductor wafer.

[0078] Alternatively, the output of the plurality of channels (1230) can be controlled individually for each channel (1230). The output levels of the plurality of channels (1230) may be different. For example, among the plurality of channels (1230), the output of at least some of the channels (1230) may be controlled at 100%, the output of the remaining some of the channels (1230) may be controlled at 75%, and the output of the remaining channels (1230) may be controlled at 50%. Here, the output level and number of each channel (1230) may be selected or changed in order to uniformly heat the temperature of the semiconductor wafer.

[0079] In addition, multiple LED modules (1200) can be individually controlled and output controlled simultaneously for each LED module (1200). Among the multiple LED modules (1200), at least some of the LED modules (1200) are controlled to an On state, and the remaining LED modules (1200) are controlled to an Off state, and the output levels of the LED modules (1200) controlled to an On state can be different from each other. Through this, the slight temperature unevenness occurring in the semiconductor wafer can be resolved.

[0080] Alternatively, multiple channels (1230) can be individually controlled and output controlled simultaneously for each channel (1230). Among the multiple channels (1230), at least some of the channels (1230) are controlled to an On state, and the remaining channels (1230) are controlled to an Off state, and the output levels of the channels (1230) controlled to an On state may be different from each other.

[0081] A plurality of LED modules (1200) or channels (1230) can be set to conditions that can uniformly heat the temperature of a semiconductor wafer. In this case, since each LED module (1200) or channel (1230) can be individually controlled and output controlled, each channel (1230) can be set to conditions that can uniformly heat the temperature of a semiconductor wafer.

[0082] Meanwhile, depending on the processing process of the semiconductor wafer or the state of the semiconductor wafer, the temperature of the semiconductor wafer may not be uniform even if the LED module (1200) or channel (1230) is controlled under the initial setting conditions or later changed conditions. In this case, the temperature non-uniformity of the semiconductor wafer can be resolved by changing the control conditions of each controllable LED module (1200) or channel (1230) or replacing one of them.

[0083] Meanwhile, the semiconductor wafer processing device may include a temperature detection means (not shown) for detecting the temperature of the semiconductor wafer. By detecting the temperature of the semiconductor wafer in real time using the temperature detection means and individually controlling a plurality of channels (1230) based on the detected temperature data, the temperature non-uniformity of the semiconductor wafer can be resolved. More specifically, the temperature detection means detects the temperature distribution over the entire area of ​​the semiconductor wafer in real time and provides temperature data. A method for controlling each LED module (1200) or channel (1230) according to the temperature data distribution can be learned in advance and stored in memory in the form of a table. Therefore, by performing control and output control of each LED module (1200) or channel (1230) based on the temperature data provided in real time by the temperature detection means and using the table information, the temperature uniformity of the semiconductor wafer can be resolved.

[0084] The plurality of LED modules (1200) may include at least three LED modules (1200) having different arrangements of LEDs (1220). For example, as illustrated in FIGS. 4 and 5, the plurality of LED modules (1200) include a first LED module (1201), a second LED module (1202), and a third LED module (1203) having different arrangements of LEDs (1220). However, the number of LED modules (1200) having different arrangements of LEDs (1220) is not limited thereto, and the plurality of LED modules (1200) may be provided in two units, such as a first LED module (1201) and a second LED module (1202), as LED modules (1200) having different arrangements of LEDs (1220), or may be provided in four or more units, and the arrangements of the LEDs (1220) of all of the plurality of LED modules (1200) may be different from each other.

[0085] At least one of the plurality of LED modules (1200) has a through hole (1240) in its internal area, and at least one other does not have a through hole (1240). In order to compensate for the insufficient LED light amount due to the through hole (1240), the arrangement of the LEDs (1220) of the LED module (1200) without the through hole (1240) may be different from the arrangement of the LEDs (1220) of the LED module (1200) with the through hole (1240). For example, the first LED module (1201) has a through hole (1240) penetrating the circuit board (1210), but the second LED module (1202) and the third LED module (1203) do not have the through hole (1240). The first LED module (1201) must place the LED (1220) to avoid the location of the through hole (1240), and the LED light amount to be compensated accordingly is resolved through the LED arrangement of the second LED module (1202) and the third LED module (1203) that do not have the through hole (1240).

[0086] At least one of the first LED module (1201), the second LED module (1202), and the third LED module (1203) may be provided. Preferably, a total of six LED modules (1200) may be provided, including two first LED modules (1201), two second LED modules (1202), and two third LED modules (1203).

[0087] The two first LED modules (1201) are provided in positions opposite to each other, the two second LED modules (1202) are also provided in positions opposite to each other, and the two third LED modules (1203) are also provided in positions opposite to each other. Accordingly, when the plurality of LED modules (1200) are composed of a total of six LED modules (1200), they are arranged in the following order along the circumferential direction: the first LED module (1201), the second LED module (1202), the third LED module (1203), the first LED module (1201), the second LED module (1202), and the third LED module (1203).

[0088] Meanwhile, as illustrated in FIGS. 4 and 5, the six LED modules (1200) may all have different arrangements of LEDs (1220). In other words, the LED module (1200) positioned opposite the first LED module (1201) may have different arrangements of LEDs (1220), the LED module (1200) positioned opposite the second LED module (1202) may have different arrangements of LEDs (1220), and the LED module (1200) positioned opposite the third LED module (1203) may have different arrangements of LEDs (1220). However, in the following, in order to avoid duplication of explanation, only the first LED module (1201), the second LED module (1202), and the third LED module (1203) will be described.

[0089] FIG. 6 is a drawing illustrating a first LED module (1201). Referring to FIG. 6, the first LED module (1201) includes a plurality of channels (1230), preferably two channels (1230). In FIG. 6, the dotted line is a virtual line indicating a channel (1230).

[0090] The first LED module (1201) includes a first-first channel (1231a) and a first-second channel (1231b). In Fig. 6, the one located on the left side of the dotted line is the first-first channel (1231a), and the one located on the right side of the dotted line is the first-second channel (1231b). The first-first channel (1231a) and the first-second channel (1231b) include the same number of LEDs (1220), but are not limited thereto.

[0091] The first channel (1231a) includes LEDs (1220) arranged in a radial direction between the central region and the peripheral region, including LEDs (1220) provided in the central region and LEDs (1220) provided in the peripheral region, and is configured to include, for example, a total of 12 LEDs (1220). In the first channel (1231a), a plurality of LEDs (1220) are arranged in an overall "ㄱ" or "T" shape.

[0092] If we divide the radial sections from the inner side to the outer side in the radial direction, they can be divided into R1 to R11. The number of LEDs (1220) in each divided radial section of the 1-1 channel (1231a) is different. In the 1-1 channel (1231a), 1 LED (1220) is arranged in each of the R1 to R6 sections, 0 LEDs (1220) are arranged in the R7 section, 1 LED (1220) is arranged in the R8 section, 0 LEDs (1220) are arranged in the R9 section, 1 LED (1220) is arranged in the R10 section, and 4 LEDs (1220) are arranged in the R11 section.

[0093] The first-second channel (1231b) includes LEDs (1220) arranged in a radial direction between the central region and the peripheral region, including LEDs (1220) provided in the central region and LEDs (1220) provided in the peripheral region, and is configured to include, for example, a total of 17 LEDs (1220). In the first-second channel (1231b), a plurality of LEDs (1220) are arranged in an overall inverted "ㄱ" or "T" shape.

[0094] The number of LEDs (1220) in each of the divided radial sections of the 1st-2nd channel (1231b) is different. In the 1st-2nd channel (1231b), one LED (1220) is arranged in each of the R1 and R2 sections, three LEDs (1220) in the R3 section, two LEDs (1220) in the R4 section, one LED (1220) in the R5 section, zero LEDs (1220) in the R6 section, one LED (1220) in each of the R7 to R9 sections, and three LEDs (1220) in each of the R10 and R11 sections.

[0095] Channel 1-1 (1231a) and channel 1-2 (1231b) are the same in that they group LEDs (1220) arranged along the radial direction, but the number of LEDs (1220) in each radial section is different, so the arrangement of the LEDs (1220) is different, and thus the two channels (1230) have different light quantities in each radial section.

[0096] The first LED module (1201) includes a first-first connector (1281a) connected to a first-first channel (1231a), and a first-second connector (1281b) connected to a first-second channel (1231b). The first-first channel (1231a) receives electricity through the first-first connector (1281a), and the first-second channel (1231b) receives electricity through the first-second connector (1281b).

[0097] The first-first connector (1281a) and the first-second connector (1281b) are provided in the LED non-installation area (1250) within the circuit board (1210). The first-first connector (1281a) and the first-second connector (1281b) are provided in a location where the LEDs (1220) are arranged the least among the respective radius sections and also has a large amount of free space. The first-first connector (1281a) is located between the R6 section and the R10 section, and the first-second connector (1281b) is located between the R6 section and the R9 section. The first-first connector (1281a) is provided on the left side of the first-first channel (1231a), and the first-second connector (1281b) is provided on the right side of the first-second channel (1231b).

[0098] The first LED module (1201) has a recessed portion (1270) on the outer surface, and the first-first channel (1231a) and the first-second channel (1231b) are distinguished on the left and right sides of the recessed portion (1270), respectively. Therefore, the first-first channel (1231a) and the first-second channel (1231b) can be easily distinguished through the position of the recessed portion (1270).

[0099] FIG. 7 is a drawing illustrating a second LED module (1202). Referring to FIG. 7, the second LED module (1202) includes a plurality of channels (1230), preferably two channels (1230). In FIG. 7, the dotted line is a virtual line indicating a channel (1230).

[0100] The second LED module (1202) includes a second-first channel (1232a) and a second-second channel (1232b). In Fig. 7, the one located on the left side of the dotted line is the second-first channel (1232a), and the one located on the right side of the dotted line is the second-second channel (1232b). The second-first channel (1232a) and the second-second channel (1232b) include, but are not limited to, the same number of LEDs (1220).

[0101] The second-first channel (1232a) includes LEDs (1220) arranged in a radial direction between the central region and the peripheral region, including LEDs (1220) provided in the central region and LEDs (1220) provided in the peripheral region, and is configured to include, for example, a total of 18 LEDs (1220). In the second-first channel (1232a), a plurality of LEDs (1220) are arranged in an overall "ㄱ" or "T" shape.

[0102] If the radial sections are divided from the inner side to the outer side in the radial direction, they can be divided into R1 to R11. The number of LEDs (1220) in each divided radial section of the 2-1 channel (1232a) is different. In the 2-1 channel (1232a), one LED (1220) is arranged in each of the R1 to R3 sections, two LEDs (1220) are arranged in the R4 section, three LEDs (1220) are arranged in each of the R5 and R6 sections, one LED (1220) is arranged in each of the R7 to R9 sections, zero LEDs (1220) are arranged in the R10 section, and four LEDs (1220) are arranged in the R11 section.

[0103] The second-second channel (1232b) includes LEDs (1220) arranged in a radial direction between the central region and the peripheral region, including LEDs (1220) provided in the central region and LEDs (1220) provided in the peripheral region, and is configured to include, for example, a total of 11 LEDs (1220). In the second-second channel (1232b), a plurality of LEDs (1220) are arranged in an overall inverted "ㄱ" or "T" shape.

[0104] The number of LEDs (1220) in each of the divided radial sections of the 2-2 channel (1232b) is different. In the 2-2 channel (1232b), 1 LED (1220) is arranged in each of the R1 and R2 sections, 0 LEDs (1220) in each of the R3 sections, 1 LED (1220) in each of the R4 and R5 sections, 0 LEDs (1220) in each of the R6 and R7 sections, 1 LED (1220) in each of the R8 sections, 0 LEDs (1220) in each of the R9 sections, 2 LEDs (1220) in each of the R10 sections, and 4 LEDs (1220) in each of the R11 sections.

[0105] The 2-1 channel (1232a) and the 2-2 channel (1232b) are the same in that they group LEDs (1220) arranged along the radial direction, but the number of LEDs (1220) in each radial section is different, so the arrangement of the LEDs (1220) is different, and therefore the two channels (1230) have different light quantities in each radial section.

[0106] The second LED module (1202) includes a second-1 connector (1282a) connected to a second-1 channel (1232a), and a second-2 connector (1282b) connected to a second-2 channel (1232b). The second-1 channel (1232a) receives electricity through the second-1 connector (1282a), and the second-2 channel (1232b) receives electricity through the second-2 connector (1281b).

[0107] The 2-1 connector (1282a) and the 2-2 connector (1282b) are provided in the LED non-installation area (1250) within the circuit board (1210). The 2-1 connector (1282a) and the 2-2 connector (1282b) are provided in a location where the LEDs (1220) are arranged the least among the respective radial sections and also has a large amount of free space. The 2-1 connector (1282a) is located between the R7 section and the R11 section, and the 2-2 connector (1282b) is located between the R7 section and the R10 section. The 2-1 connector (1282a) is provided on the left side of the 2-1 channel (1232a), and the 2-2 connector (1282b) is provided on the right side of the 2-2 channel (1232b).

[0108] The second LED module (1202) has a recessed portion (1270) on the outer surface, and the second-first channel (1232a) and the second-second channel (1232b) are distinguished on the left and right sides of the recessed portion (1270), respectively. Therefore, the second-first channel (1232a) and the second-second channel (1232b) can be easily distinguished through the position of the recessed portion (1270).

[0109] FIG. 8 is a drawing illustrating a third LED module (1203). Referring to FIG. 8, the third LED module (1203) includes a plurality of channels (1230), preferably two channels (1230). In FIG. 8, the dotted line is a virtual line indicating a channel (1230).

[0110] The third LED module (1203) includes a third-first channel (1233a) and a third-second channel (1233b). In Fig. 8, the one located on the left side of the dotted line is the third-first channel (1233a), and the one located on the right side of the dotted line is the third-second channel (1233b). The third-first channel (1233a) and the third-second channel (1233b) include, but are not limited to, the same number of LEDs (1220).

[0111] The 3-1 channel (1233a) includes LEDs (1220) arranged in a radial direction between the central region and the peripheral region, including LEDs (1220) provided in the central region and LEDs (1220) provided in the peripheral region, and is configured to include, for example, a total of 16 LEDs (1220). In the 3-1 channel (1233a), a plurality of LEDs (1220) are arranged in an overall "ㄱ" or "T" shape.

[0112] If we divide the radial section from the inner side to the outer side in the radial direction, it can be divided into R1 to R11. The number (1220) of LEDs (1220) in each divided radial section of the 3-1 channel (1233a) is different. In the 3-1 channel (1233a), 2 LEDs (1220) are arranged in each of the R1 and R2 sections, 0 LEDs (1220) are arranged in the R3 section, 1 LED (1220) is arranged in the R4 section, 0 LEDs (1220) are arranged in the R5 section, 1 LED (1220) is arranged in the R6 section, 2 LEDs (1220) are arranged in the R7 section, 3 LEDs (1220) are arranged in each of the R8 and R9 sections, 0 LEDs (1220) are arranged in the R10 section, and 4 LEDs (1220) are arranged in the R11 section.

[0113] The 3-2 channel (1233b) includes LEDs (1220) arranged in a radial direction between the central region and the peripheral region, including LEDs (1220) provided in the central region and LEDs (1220) provided in the peripheral region, and is configured to include, for example, a total of 11 LEDs (1220). In the 3-2 channel (1233b), a plurality of LEDs (1220) are arranged in an overall inverted "ㄱ" or "T" shape.

[0114] The number of LEDs (1220) in each of the divided radius sections of the 3-2 channel (1233b) is different. In the 3-2 channel (1233b), 1 LED (1220) is arranged in the R1 section, 0 LEDs (1220) in the R2 and R3 sections, 1 LED (1220) in each of the R4 and R5 sections, 0 LEDs (1220) in the R6 section, 1 LED (1220) in the R7 section, 0 LEDs (1220) in the R8 section, 1 LED (1220) in the R9 section, 2 LEDs (1220) in the R10 section, and 4 LEDs (1220) in the R11 section.

[0115] The 3-1 channel (1233a) and the 3-2 channel (1233b) are the same in that they group LEDs (1220) arranged along the radial direction, but the number of LEDs (1220) in each radial section is different, so the arrangement of the LEDs (1220) is different, and therefore the two channels (1230) have different light quantities in each radial section.

[0116] The third LED module (1203) includes a third-1 connector (1283a) connected to a third-1 channel (1233a), and a third-2 connector (1283b) connected to a third-2 channel (1233b). The third-1 channel (1233a) receives electricity through the third-1 connector (1283a), and the third-2 channel (1233b) receives electricity through the third-2 connector (1281b).

[0117] The 3-1 connector (1283a) and the 3-2 connector (1283b) are provided in the LED non-installation area (1250) within the circuit board (1210). The 3-1 connector (1283a) and the 3-2 connector (1283b) are provided in a location where the LEDs (1220) are arranged the least among the respective radial sections and also has a large amount of free space. The 3-1 connector (1283a) is located between the R1 section and the R6 section, and the 3-2 connector (1283b) is located between the R1 section and the R9 section. The 3-1 connector (1283a) is provided on the left side of the 3-1 channel (1233a), and the 3-2 connector (1283b) is provided on the right side of the 3-2 channel (1233b).

[0118] The third LED module (1203) has a recessed portion (1270) on the outer surface, and the third-first channel (1233a) and the third-second channel (1233b) are distinguished on the left and right sides of the recessed portion (1270), respectively. Therefore, the third-first channel (1233a) and the third-second channel (1233b) can be easily distinguished through the position of the recessed portion (1270).

[0119] The arrangement of the LEDs (1220) of the 1st channel (1231a), the 2nd channel (1232a), and the 3rd channel (1233a) may be the same. Conversely, the 1st channel (1231b), the 2nd channel (1232b), and the 3rd channel (1233b) may have an arrangement different from the arrangement of the LEDs (1220) of the other channels (1230). In other words, the arrangement of the LEDs (1220) provided in the 2nd channel (1231b), the 2nd channel (1232b), and the 3rd channel (1233b) has an arrangement different from the arrangement of the LEDs (1220) provided in any other channel (1230).

[0120] Among multiple channels (1230), the radius section of one channel (1230) has a different number of LEDs (1220) than the radius section of another channel (1230). When divided into a central zone, a middle zone, and an outer zone from the inner side in the radial direction to the outer side, the 1st-2nd channel (1231b) has a larger number of LEDs (1220) arranged in the central zone than the 2nd-2nd channel (1232b) and the 3rd-2nd channel (1233b), the 2nd-2nd channel (1232b) has a larger number of LEDs (1220) arranged in the outer zone than the 1st-2nd channel (1231b) and the 3rd-2nd channel (1233b), and the 3rd-2nd channel (1233b) has a larger number of LEDs (1220) arranged in the middle zone than the 1st-2nd channel (1231b) and the 2nd-2nd channel (1232b). Through this, at least one channel (1230) among the plurality of channels (1230) can compensate for the light amount of another channel (1230).

[0121] The distribution of the amount of light generated by the 1st-1 channel (1231a), the 2nd-1 channel (1232a), and the 3rd-1 channel (1233a) is compensated for by the distribution of the amount of light generated by the 1st-2 channel (1231b), the 2nd-2 channel (1232b), and the 3rd-2 channel (1233b), thereby enabling uniform control of the heating temperature of the semiconductor wafer.

[0122] The first LED module (1201) includes a first-first channel (1231a) and a first-second channel (1231b) in a clockwise direction, the second LED module (1202) includes a second-first channel (1232a) and a second-second channel (1232b) in a clockwise direction, and the third LED module (1203) includes a third-first channel (1233a) and a third-second channel (1233b) in a clockwise direction. Since the plurality of LED modules (1200) are arranged in the order of the first LED module (1201), the second LED module (1202), the third LED module (1203), the first LED module (1201), the second LED module (1202), and the third LED module (1203) in a clockwise direction, a total of 12 channels (1230) are provided in this arrangement.

[0123] The 1st channel (1231a), the 1st channel (1231b), the 2nd channel (1232a), the 2nd channel (1232b), the 3rd channel (1233a), and the 3rd channel (1233b) can be individually controlled for each channel (1230). At least some of the channels (1230) among the 1st channel (1231a), the 1st channel (1231b), the 2nd channel (1232a), the 2nd channel (1232b), the 3rd channel (1233a), and the 3rd channel (1233b) can be controlled to an On state, and the remaining channels (1230) can be controlled to an Off state. Alternatively, among a total of 12 channels (1230), at least some of the consecutive channels (1230) can be controlled to an On state, and the remaining channels (1230) can be controlled to an Off state. Here, the number of channels (1230) that are turned on and off can be selected or changed to uniformly heat the temperature of the semiconductor wafer.

[0124] The output of the 1st channel (1231a), the 1st channel (1231b), the 2nd channel (1232a), the 2nd channel (1232b), the 3rd channel (1233a), and the 3rd channel (1233b) can be controlled individually for each channel (1230). Among the 1st channel (1231a), the 1st channel (1231b), the 2nd channel (1232a), the 2nd channel (1232b), the 3rd channel (1233a), and the 3rd channel (1233b), at least some of the channels (1230) can be controlled to output at 100%, the output of the remaining some of the channels (1230) can be controlled to output at 50%, and the output of the remaining channels (1230) can be controlled to output at 75%. Here, the degree and number of outputs per channel (1230) can be selected or changed to uniformly heat the temperature of the semiconductor wafer.

[0125] In the above, the first LED module (1201), the second LED module (1202), and the third LED module (1203) among the six LED modules (1200) have been described as the basis, but the remaining LED modules (1200) have the same configuration as the first LED module (1201), the second LED module (1202), and the third LED module (1203) described above, except for the arrangement of the LEDs (1220), so a detailed description thereof will be omitted.

[0126] Referring to Fig. 9, the heat sink (1000) is formed in an overall circular shape, has a hollow hole (1130) formed in the center, has a heat sink concave portion (1120) formed on the edge side, and has a heat sink through hole (1110) inside.

[0127] The heat sink through hole (1110) is provided at a position corresponding to the through hole (1240) formed in the circuit board (1210).

[0128] The heat sink recess (1120) is provided at a position corresponding to the recess (1270) formed on the circuit board (1210). However, unlike this, as shown in FIGS. 10 and 11, the heat sink recess (1120) may not be provided on the heat sink (1000).

[0129] The heat sink (1000) includes a bolt insertion hole (1140), and bolts are inserted into the bolt insertion hole (1140) to secure the heat sink (1000) to a component located underneath it. A plurality of LED modules (1200) are arranged spaced apart from each other by the bolt insertion hole (1140) on both sides of the bolt insertion hole (1140) (see FIG. 3).

[0130] The heat sink (1000) may be provided with at least one of a water-cooled type, an air-cooled type, and a heat sink fin. Preferably, the heat sink (1000) may be provided with a water-cooled type.

[0131] Next, an LED heater system (1000) according to a modified example of a preferred embodiment of the present invention will be described. However, the modified example described below will be described focusing on characteristic components compared to the preferred embodiment, and descriptions of components identical or similar to the embodiment will be omitted as much as possible.

[0132] FIG. 10 is a perspective view of an LED heater system (1000) according to a modified example of a preferred embodiment of the present invention, and FIG. 11 is a plan view of an LED heater system (1000) according to a modified example of a preferred embodiment of the present invention.

[0133] Fig. 10 omits the illustration of the LED (1220) for the sake of simplicity, and Fig. 11 illustrates only a portion of the LED (1220).

[0134] The LED heating system (1000) according to this modified example is divided into a plurality of LED modules (1200) and arranged in a circumferential direction, and a plurality of channels (1230) are adopted to control the plurality of LEDs (1220) together by grouping the plurality of LEDs (1220) arranged in a radial direction in each LED module (1200), and one channel (1230) arranged in the circumferential direction compensates and controls another channel (1230).

[0135] Unlike the previous embodiment in which one LED module (1200) has multiple channels (1230), the modified example has a structural difference in that one LED module (1200) has one channel (1230). Therefore, it becomes easier to combine them by channel (1230) to ensure a uniform temperature distribution of the semiconductor wafer.

[0136] In Fig. 11, the semiconductor wafer is divided into a central zone (C), a first intermediate zone (M1), a second intermediate zone (M2), and an outer zone (E) by way of example, but this is only one example, and as described above, the semiconductor wafer can be divided in various ways to ensure uniform temperature distribution.

[0137] As described above, the present invention has been described with reference to preferred embodiments thereof, but it will be apparent to those skilled in the art that various modifications or variations may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the following claims.

[0138] [Explanation of symbols]

[0139] 1000: LED heater system

[0140] 1100: Heatsink

[0141] 1200: LED module

[0142] 1210: Circuit board

[0143] 1220: LED

[0144] 1230: Channel

[0145] 1240: Through hole

[0146] 1250: LED non-installation area

[0147] 1260: Free space

[0148] 1270: Concave

[0149] 1280: Connector

[0150] 1201: First LED module

[0151] 1202: 2nd LED module

[0152] 1203: Third LED module

[0153] 1231a: Channel 1-1

[0154] 1231b: Channels 1-2

[0155] 1232a: Channel 2-1

[0156] 1232b: Channel 2-2

[0157] 1233a: Channel 3-1

[0158] 1231b: Channel 3-2

Claims

1. In an LED heater system for heating a semiconductor wafer, The above LED heater system includes a heat sink and a plurality of LED modules provided along the circumference of the heat sink, Each of the above LED modules includes a circuit board and a plurality of LEDs mounted on the circuit board, Each of the above LED modules includes a channel that groups and controls a plurality of LEDs arranged in a radial direction, An LED heater system in which the above channels are provided in multiple numbers along the circumferential direction.

2. In paragraph 1, An LED heater system, wherein each of the above LED modules comprises a plurality of channels.

3. In paragraph 1, An LED heater system, wherein the arrangement of LEDs provided in at least one LED module among the plurality of LED modules is different from the arrangement of LEDs provided in at least one other LED module.

4. In paragraph 1, An LED heater system, wherein the arrangement of LEDs provided in at least one channel among the plurality of channels is different from the arrangement of LEDs provided in at least one other channel.

5. In paragraph 1, The above multiple channels are an LED heater system in which each channel can be individually controlled.

6. In paragraph 1, The above multiple channels are LED heater systems capable of controlling output for each channel.

7. In paragraph 1, An LED heater system in which a plurality of said channels are controlled so that the heating temperature of the semiconductor wafer is uniform.

8. A chuck stage configured to hold a semiconductor wafer; An LED heater system installed to heat the semiconductor wafer held on the chuck stage; The above LED heater system includes a heat sink and a plurality of LED modules provided along the circumference of the heat sink, Each of the above LED modules includes a circuit board and a plurality of LEDs mounted on the circuit board, Each of the above LED modules includes a channel that groups and controls a plurality of LEDs arranged in a radial direction, A semiconductor wafer processing device, wherein the above channels are provided in multiple numbers along the circumferential direction.

9. In paragraph 8, A semiconductor wafer processing device that heats the semiconductor wafer uniformly by individually controlling each of the plurality of channels.

10. In paragraph 8, A semiconductor wafer processing device that controls the output of each of the plurality of channels to uniformly heat the semiconductor wafer.

11. In paragraph 8, A semiconductor wafer processing device, wherein the above heat sink is equipped with at least one of a water-cooling type, an air-cooling type, and a heat sink fin.

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