Power device, system, and method for producing a power device

Abstract

A power device (1) is specified, comprising - at least one power semiconductor chip arranged on a mounting portion (2), - a package body (3), for the at least one power semiconductor chip, with at least one recess (4) ex posing at least one partial region of a connection region (5), - a terminal block (6) comprising - a molded block (7) with at least one further recess (8), and - at least one first terminal (9) arranged in the at least one further recess (8), wherein - the terminal block (6) is arranged on the package body (3), - the at least one first terminal (9) is further arranged in the at least one recess (4) of the package body (3), - the at least one first terminal (9) is electrically connected to the at least one partial region of the connection region (5). Furthermore, a system and a method for producing a power device are specified.

Description

[0001] P2024,0403 WO N / P240010WO01 April23,2025 -1 - Description POWER DEVICE,SYSTEM, AND METHOD FOR PRODUCING A POWER DEVICEThe present disclosure relates to a power device, a system,and a method forproducing a powerdevice.Typically, integration of vertically arranged termi nals in atransfer molded power device is a complex challenge . Also animplementation of hollow sleeves as holders for pin terminalsto be embedded in a typical molded package body mak es atransfer molding process comparatively complicated.Embodiments of the disclosure relate to a power dev ice withvertically arranged terminals which is comparativel y easy tohandle.Furtherembodimentsrelate to a system and a method forproducing such a powerdevice.This is achieved by the subject-matter of the indep endentclaims. Further embodiments are evident from the de pendentclaimsand the following description. A powerdevice isdescribed.The term “power”here and in thefollowing, for example, refers to power semiconduct or devicesand / or power semiconductor chips adapted for proces singvoltages and currents of more than 100 V and / or mor e than 10A, exemplarily voltages of up to 10 kV and electric alcurrentsofup to 10 kA.According to an embodiment, the power device compri ses atleast one power semiconductor chip arranged on a mo untingportion. The power semiconductor chip comprises, fo r example,a semiconductor material such as at least one of si licon P2024,0403 WO N / P240010WO01 April23,2025 -2 -(Si), silicon carbide (SiC), and gallium nitride (G aN). Thepower semiconductor chip is, for example, a power d iodeand / or a power metal insulating semiconductor field -effecttransistor, power MISFET for short. The term MISFET shallalso include MOSFETs, which have an oxide as an ins ulatingmaterial at a gate. The power semiconductor chip ma y also bean insulated-gate bipolartransistor,IGBT.The mounting portion is, for example, part of a car rier, alead frame, a baseplate, an insulated metal substra te or asubstrate of the power device. The mounting portion has, forexample, a main extension plane. The main extension planeextends particularly in lateral directions. A verti caldirection isoriented perpendicularto the lateraldirections. Exemplarily, the power semiconductor ch ip has amain extension plane parallel to the lateral direct ions.According to the embodiment, the power semiconducto r devicecomprises a package body for the at least one powersemiconductor chip. The package body has at least o ne recessexposing at least one partial region of a connectio n region.The power semiconductor chip is, for example, embed ded in thepackage body. “Embedded” means here and in the foll owing thatthe package bodyisarranged atleastpartlyon at leastone outersurface ofthe powersemiconductorchip.For example,the power semiconductor chip is completely surround ed, e.g.three-dimensionally, by the package body and the mo untingportion.Exemplarily, the package body comprises or consists of anelectrically insulating material. A length and / or a width inlateral directions of the package body is, for exam ple, atleast 10 mm or at least 20 mm and / or at most 100 mm . A height P2024,0403 WO N / P240010WO01 April23,2025 -3 -in vertical direction of the package body is, for e xample, atleast2 mm.Exemplarily, the connection region comprises an ele ctricallyconductive material and exemplarily comprises a met al or ametallic alloy. The connection region is, for examp le,electrically connected with a contact portion of th e powersemiconductor device. The connection region can hav e anoptional conductive coating such as nickel, silver, and / orgold layer.For example, the recess completely penetrates the p ackagebody in a vertical direction. “Exposing” means here and inthe following that at least the partial region of t heconnection region or the whole area of the connecti on regionisnotcovered bythe package body.In particular, thepartial region of the connection region and the rec esscompletely overlap in lateral directions in a top v iew.Exemplarily, the connection region comprises at lea st one ofa metal pattern of a substrate, a coated region wit h acoating, a diepad and / or a terminal of a leadframe.For example, the package body comprises a plurality ofrecesses exposing a plurality of connection regions .Exemplarily, a number of recesses and a number of c onnectionregions are equal to one another. Each of the reces sesexposesatleastone ofthe connection regions,in particularexactly one of the connection regions, particularly a partthereof.At least one or at least some of the connection reg ions canbe partofthe mounting portion.Alternativelyor P2024,0403 WO N / P240010WO01 April23,2025 -4 - additionally,atleastone oratleastsome ofthe connection regionscan be partofthe semiconductorchip.According to the embodiment, the power device compr ises aterminalblock.According to the embodiment of the power device, th e terminalblock comprises a molded block with at least one fu rtherrecess.Exemplarily,the molded blockcomprisesor consistsof an electrically insulating material like thermos etting orthermoplastic resin. For example, the further reces scompletely penetrates the molded block in a vertica ldirection.For example, the molded block comprises a plurality offurther recesses. Exemplarily, the number of recess es and anumber of further recesses are equal to one another .According to the embodiment of the power device, th e terminalblock comprises at least one first terminal arrange d in theat least one further recess. Exemplarily, the first terminalhas a main extension direction being parallel to th e verticaldirection. The first terminal comprises or consists of anelectrically conductive material like copper, alumi num,and / orcorresponding alloy.Exemplarily, the terminal block comprises a plurali ty offirst terminals. For example, the number of further recessesand the numberoffirstterminalsare equalto one another.In particular, each one of the first terminals is a rranged inone ofthe furtherrecesses. P2024,0403 WO N / P240010WO01 April23,2025 -5 -According to the embodiment of the power device, th e terminalblock is arranged on the package body. For example, themolded block has a top surface and a bottom surface oppositethe top surfaces. The top surface and the bottom su rface areconnected with a first side surface and a second si de surfaceas well as a first face surface and a second face s urface. Inparticular,the bottom surface ofthe molded block isarranged on the package body. Exemplarily, the pack age bodyhas a cut-out, in particular a cut-out in the top s urface.The terminal block is, for example, arranged within the cut-out.Exemplarily, the terminal block, particularly the m oldedblock, has main extension plane parallel to the lat eraldirections. Exemplarily, the terminal block, partic ularly themolded block,doesnotprotrude beyond the package bodyinlateral directions. Alternatively, the molded block protrudesbeyond the package body in lateral directions, at l east atone side surface ofthe package body.According to the embodiment of the power device, th e at leastone first terminal is further arranged in the at le ast onerecessofthe package body.According to the embodiment of the power device, th e at leastone first terminal is electrically connected to the at leastone partial region of the connection region. For ex ample, thefirst terminal is in direct contact with the connec tionregion.Exemplarily, an electrical signal can be transmitte d betweenthe first terminal and the power semiconductor chip via theconnection region. The first terminal is exemplaril y P2024,0403 WO N / P240010WO01 April23,2025 -6 - configured to be a controlterminalofthe power semiconductorchip.Alternativelyoradditionally, the firstterminal is exemplarily configured as a power termi nal, atleast for a power semiconductor chip. In this case, the firstterminal is connected with a common connection regi on, inparticular with a common part of the connection reg ion usingone common or multiple individual further recesses.Ifthe firstterminalisexemplarilyconfigured as power terminal,the terminalblockcomprisesa plurality offirstterminals, wherein at least some of the first termi nals areconnected in parallel, and wherein the at least som e of thefirst terminals are configured as the power termina l.Advantageously, the use of the terminal block to be mountedon the package body with the first terminal leads t o asignificant process simplification, including easie r transfermolding process,and reducesequipmentexpenditure e.g.forpin insertion. By using the molded block, an improv edalignment tolerance between the first terminals the mselvesand between first terminals and the recess due to a highprecision process like injection molding or transfe r moldingcan advantageouslybe guaranteed.In particular, a generally improved alignment toler ancetowards a customer can be achieved as well as an im proveddesign flexibility, wherein a design of the first t erminalstructure,e.g.a choice ofa firstterminaltype, can beadjusted according to a customer’s request. Additio nally, thedesign of the terminal block itself can be adjusted accordingto customerapplication,e.g.fora single package orforasixpack setup, where there is a common terminal blo ck forthree single packages,. P2024,0403 WO N / P240010WO01 April23,2025 -7 -Further, as the terminal block can be mounted on th ecustomer’s end advantageously improves process flex ibility.With the first terminal arranged in the molded bloc k, acomparatively increased stiffness of the first term inal isachieved, which advantageously leads to a less risk yinsertion process, e.g. of a press-fit section into anopening ofa printed circuitboard,particularlya control board.The proposed power device comprises the recesses in thepackage body,such thatportionsofthe connection regions are exposed from the package body,where the first terminalscan get in contact with the connection regions or a t least inelectricalconnection.In particular,the terminal blockcan be a controlterminalstructure,where one ormore firstterminals are embedded in the molded block. In part icular,the first terminal is a control terminal for the po wersemiconductorchip.Alternativelyoradditionally, the first terminalcan also be used asa powerterminal.According to a further embodiment of the power devi ce, thepower device comprises at least one second terminalelectricallyconnected to the atleastone powersemiconductor chip. Exemplarily, the second termina l isembedded at least partially in the package body. An endregion of the second terminal protrudes, for exampl e,initially beyond the package body in lateral direct ions. Theend region is, for example, configured to be contac tedexternally. The second terminal is formed, for exam ple, as apowerterminal. P2024,0403 WO N / P240010WO01 April23,2025 -8 -According to a further embodiment of the power devi ce, the atleast one first terminal has a main extension direc tion beingoblique to a main extension plane of the at least o ne secondterminal. Exemplarily, the main extension direction of thefirst terminal is approximately perpendicular to th e mainextension plane of the second terminal. “Approximat elyperpendicular” means here that the first terminal h as anangle of90°plus / minusatmost5°,in particularapproximately at most 1° to the main extension plan e of thesecond terminal.According to a further embodiment of the power devi ce, themounting portion comprises a top metallization laye r, aninsulating layerand a bottom metallization layer. The topmetallization is in particular a circuit metallizat ion. Thetop metallization layer can comprise a plurality of parts. Atleast some of the parts of the top metallization la yer arespaced apart from one another in lateral directions . At leastsome of the parts spaced apart from one another hav e nodirect electrical connection. Exemplarily, the powe rsemiconductor chip is arranged on a first part of t he topmetallization layer. The top and / or bottom metalliz ationlayercan comprise a coating e.g.ofa noble metal like nickel,gold orsilver.Exemplarily, the mounting portion comprises a diepa d ofterminalsin a leadframe-based powerpackage.According to a further embodiment of the power devi ce, apartial region of the top metallization layer is ex posed bythe at least one recess of the package body for for ming thepartial region of the connection region. In particu lar, thepartial region of the top metallization layer is fo rmed by a P2024,0403 WO N / P240010WO01 April23,2025 -9 -second part of the top metallization layer spaced a part fromthe first part. Exemplarily, the complete second pa rt or onlya portion ofa second partisexposed.According to a further embodiment of the power devi ce, the atleast one first terminal has the form of a pin. Exe mplarily,the first terminal has a cylindrical shape, a conic al shapeor a tapered shape. Exemplarily, the first terminal has adiameter in lateral directions of at least 0.1 mm t o at most5 mm.The first terminal exemplarily comprises or consist s of anelectrically conductive metal such as copper, alumi num,brass, nickel, silver and / or gold, in particular al loysthereof. Exemplarily, the first terminal can have a coatingcomprising orconsisting ofa furtherelectrically conductivemetal covering the electrically conductive metal. E xemplarilythe coating comprises or consists of nickel, silver and / orgold.According to a further embodiment of the power devi ce, the atleast one first terminal has a top part facing away from themounting portion or exemplarily facing away from th e packagebody or the recess, an intermediate part arranged i n thefurther recess, and a bottom part arranged in the r ecess. Inparticular, the top part and the bottom part protru de beyondthe molded block in vertical directions, whereas th eintermediate part is arranged in the further recess . Thebottom part is configured to be electrically connec ted to theconnection region, and the top part is configured t o beelectricallycontactable externally. P2024,0403 WO N / P240010WO01 April23,2025 -10 -According to a further embodiment of the power devi ce, the atleast one first terminal comprises at least one pin connectorand / or at least one press fit connector for externa lconnection.According to a further embodiment of the power devi ce, theintermediate partisstructured.Exemplarily,theintermediate part can have a width which is smaller than awidth ofa top partand / ora bottom partofthe at leastone firstterminal.Forexample,the intermediate part can have a cut-out.The intermediate part being structured can comprise a press-fit connector, a glue connection, an elastic portio n, or aspring portion and / or a bedstop. The structure is i nparticular configured to prevent movement or displa cement ofthe firstterminal.Advantageously, a fixation of the first terminal wi th theintermediate part being structured in the further r ecess isparticularlystrong and reliable.According to a further embodiment of the power devi ce, thebottom partisstructured.Exemplarily,the bottom partcomprises regions with different widths. For exampl e, thebottom partbeing structured can comprise the same elementsas the intermediate part being structured described hereinabove.According to a further embodiment of the power devi ce, theintermediate parthasa width which islargerthan a width ofthe top part and / or the bottom part of the at least one firstterminal. Due to the comparatively large width, a s urface P2024,0403 WO N / P240010WO01 April23,2025 -11 -area connected to a side surface delimiting the fur therrecess is increased and thus advantageously improve s themechanical fixation of the first terminal in the fu rtherrecess.According to a further embodiment of the power devi ce, the atleast one first terminal is connected to the connec tionregion by a connection element. The connection elem entcomprises or consists of an electrically conductive materialconfigured to provide an electrically conductive co nnectionbetween the first terminal and the connection regio n.According to a further embodiment of the power devi ce, theconnection element is at least one of an elastic co nnection ,a glue, and a solder material. In particular, the g lue is anelectrically conductive glue. Exemplarily, the elas ticconnection is a spring. If the connection element i s anelastic connection, the connection element can be a n integralpart of the first terminal, in particular of the bo ttom part.Alternatively, the first terminal is connected to t heconnection region via welding such as a resistive w elding ora laserwelding.The glue, the solder material is exemplarily arrang ed withinthe recess. The glue, the welding material or the s oldermaterialisin particulardirectlyarranged on the connectionregion. The glue, or the solder material is arrange d in therecess up to a predetermined height in a vertical d irection.Exemplarily, the predetermined height is equal to o r smallerthan a height of the recess in a vertical direction . P2024,0403 WO N / P240010WO01 April23,2025 -12 - The connection elementisconfigured to provide an electricaland / or mechanical connection between the first term inal andthe connection region, which is exemplarily realize d by aconductive glue, a solder material such as a low te mperaturesolder,a snap-fitconnection to e.g.a previously existing partbonded to the connection region,oranyother applicablejoining method. Exemplarily, a spring connection or otherkinds of flexible connection elements between the f irstterminal and the connection region are conceivable.According to a further embodiment of the power devi ce, thepackage body and / or the molded block comprises a re sin.Exemplarily, the package body comprises or consists of athermoplasticresin ora thermosetting resin.According to a further embodiment of the power devi ce, themolded block comprises at least one filler material . Inparticular,the fillermaterialisincorporated in the resin.The filler material comprises or consists of partic les and / orfibers,e.g.comprising orconsisting ofsilica. Advantageously,the fillermaterialismainlyused for mechanicalenforcementofthe molded block.According to a further embodiment of the power devi ce, the atleastone firstterminalisin directcontactwith the molded block.According to a further embodiment of the power devi ce, themolded block comprises at least one structural elem ent on atop surface facing awayfrom the package body.The structural elementofthe top surface ofthe molded blockis, forexample, at least one elevation or at least one fur ther cut- P2024,0403 WO N / P240010WO01 April23,2025 -13 -out, both extending in a vertical direction, having a widthin lateraldirections.Exemplarily,the structural elementofthe top surface of the molded block surrounds the f irstterminal in lateral directions completely or partia lly. Inparticular, the structural element is adjacent to t he firstterminal. The structuralelementscan be advantageouslyused foranimproved creepage, to overcome manufacturing limita tionsand / or mechanical stability. With such a terminal b lock, allcreepage distancescan be met.If the terminal block comprises the plurality of fi rstterminals, the molded block comprises a plurality o fstructural elements on the top surface of the molde d block,wherein at least one structural element is arranged betweentwo directly neighboring first terminals, in partic ularbetween the top partsthereof.According to a further embodiment of the power devi ce, themolded block comprises at least one structural elem ent on abottom surface facing the package body. The structu ralelement of the bottom surface of the molded block i s, forexample, at least one elevation or at least one fur ther cut-outboth extending in a verticaldirection,having a width inlateral directions. Exemplarily, the structural ele ment ofthe bottom surface surroundsthe firstterminalin lateral directionscompletelyorpartially.The structural element can be adjacentto firstterminal,particularlyif the structuralelementisused foran alignment.If the terminal block comprises the plurality of fi rstterminals, the molded block comprises a plurality o f P2024,0403 WO N / P240010WO01 April23,2025 -14 -structural elements on the bottom surface of the mo ldedblock, wherein at least one structural element is a rrangedbetween two directly neighboring first terminals, i nparticularbetween the bottom partsthereof.According to a further embodiment of the power devi ce, thepackage body comprises at least one structural elem ent on atop surface facing the molded block. In particular, thestructural element is formed on a top surface of th e cut-outof the package body facing the molded block. The st ructuralelementofthe top surface ofthe package bodyis, forexample, at least one elevation or at least one fur ther cut-out, both extending in a vertical direction, having a widthin lateraldirections.Exemplarily,the structural elementofthe top surface of the package body surrounds the f irstterminal in lateral directions completely or partia lly.Ifthe structuralelementofthe bottom surface of the moldedblock is an elevation, the top surface of the packa ge body isa furthercut-out,and vice versa.According to a further embodiment of the power devi ce, the atleastone structuralelementon the top surface of thepackage body and the at least one structural elemen t on thebottom surface of the molded block interlock. Exemp larily,the bottom surface of the molded block is an elevat ion andthe top surface of the package body is a further cu t-out,wherein the elevation fitsin the furthercut-out.Alternatively, the bottom surface of the molded blo ck is afurthercut-outand the top surface ofthe package bodyisanelevation, wherein the elevation fits in the furthe r cut-out. P2024,0403 WO N / P240010WO01 April23,2025 -15 -A further embodiment relates to a system, in partic ularcomprising a power device as described herein above .Therefore,the featuresasdescribed in connection with the system are also applicable to the powerdevice and vice versa.According to the embodiment, the system comprises a powerdevice described herein above.According to the embodiment, the system comprises a coolerand / or heat sink on which the power device is arran ged. Theheat sink comprises, for example, fins and / or otherstructures configured to increase a surface area be ing incontactwith a coolantand particularlyincrease a coolingefficiency. The heat sink is exemplarily configured to absorband dissipate heat from the power semiconductor chi p. Thecooler comprises, for example, a channel through wh ich acooling fluid can flow.Exemplarily,the heatsink isarranged on the cooler being in contact with the co olant. Inparticular, the cooler is exemplarily configured to absorband dissipate heat from the power semiconductor chi p and / orthe heatsink. Exemplarily,the coolerhasan extrudate extending in avertical direction up to the molded block. Alternat ively oradditionally, the molded block has an extrudate ext ending ina verticaldirection down to the cooler.According to the embodiment of the system, the term inal blockis connected to the package body by a fixing elemen t and / orthe terminalblockisconnected to the coolerbya furtherfixing element. Exemplarily, at least one of the te rminalblock, the package body and the cooler comprises at least one P2024,0403 WO N / P240010WO01 April23,2025 -16 -fixing element. The fixing element can be e.g. at l east oneof a glue, a rivet, a snap-fit connection, a clamp, a screw.Forexample,the terminalblockand / orthe package bodycan comprise the fixing element,respectively,wherein therespective fixing elements are configured to fix th e terminalblock to the package body. Exemplarily, the termina l blockand / or the cooler can comprise the further fixing e lement,respectively, wherein the respective further fixing elementsare configured to fix the terminal block to the coo ler.Exemplarily, the package body and / or the cooler can comprisean additional fixing element, respectively, wherein therespective additional fixing elements are configure d to fixthe package bodyto the cooler.According to the embodiment of the system, the term inalblock, the package body and / or the cooler each comp rise atleast one alignment structure, respectively. The al ignmentstructure can be at least one of an opening and a p rotrudingpart. Exemplarily, alignment structures are fitting tocorresponding alignmentstructuresofa connection partner.Exemplarily, the cooler comprises at least one prot rudingpart and the terminal block and / or the package body eachcomprise at least one opening. The openings and theprotruding part are overlapping in lateral directio ns in atop view. The openings are configured to receive th eprotruding part.The protruding partisa pin,for example.Exemplarily, the package body comprises at least on eprotruding part and the terminal block comprises at least oneopening. P2024,0403 WO N / P240010WO01 April23,2025 -17 -The protruding part can be also used e.g. for an im provedglue connection. The alignment structure advantageo uslyprovides a proper positioning with respect to the p ackagebody. Therefore, an alignment of the cooler, the te rminalblock and / or the package body with respect to one a nother isadvantageouslyachieved.According to a further embodiment, the system compr ises aplurality of power devices. The power devices are e xemplarilyarranged on the cooler and / or the heat sink, wherei n thepowerdevicesare spaced apartfrom one anotherin lateraldirections. In particular, the power devices are ar ranged asan arrayorin a row.According to a further embodiment of the system, ea ch of atleastsome ofthe powerdevicescomprisesa single terminalblock. In particular, all power devices each compri se one ofthe single terminal blocks. This means that each po wer deviceis assigned to one terminal block. A number of powe r devicesparticularlyequalsa numberofterminalblocks.According to a further embodiment of the system, at leastsome of the power devices comprise a common termina l block.In particular, all power devices comprise the commo n terminalblock being the terminal block. This means that the terminalblock extends over all power devices in a lateral d irection.A further embodiment relates to a method for produc ing apower device, in particular a power device as descr ibedherein above.Therefore,the featuresasdescribed inconnection with the method are also applicable to t he powerdevice and vice versa. P2024,0403 WO N / P240010WO01 April23,2025 -18 -According to the embodiment of the method, at least one powersemiconductor chip arranged on a mounting portion i sprovided.According to the embodiment of the method, a packag e body,for the at least one power semiconductor chip, with at leastone recess in the package body for exposing at leas t onepartialregion ofa connection region isprovided. Thepackage body is produced by a transfer molding proc ess, forexample.According to the embodiment of the method, a molded blockwith at least one further recess is provided for fo rming atleastone terminalblock.The molded blockis,for example,produced by an injection molding process or another moldingprocess,such asa transfermolding process.According to the embodiment of the method, the at l east oneterminal block is arranged on the package body such that atleast one first terminal is arranged in the at leas t onefurther recess of the molded body, and the at least one firstterminal is further arranged in the at least one re cess ofthe package body, and the at least one first termin al isconnected to the at least one partial region of theconnection region.According to a further embodiment of the method, th e at leastone firstterminalisprovided in the molded block beforearranging the at least one terminal block on the pa ckagebody. Exemplarily, the first terminal is embedded i n themolded block during the production of the molded bl ock, in P2024,0403 WO N / P240010WO01 April23,2025 -19 -particular such that the first terminal is an integ ral partofthe terminalblock.According to a further embodiment of the method, th e at leastone firstterminalisprovided in the molded block afterarranging the at least one terminal block on the pa ckagebody.This means that the insertion of the first terminal in themolded block can be done after the production of th e moldedblock,butalso afterthe production ofthe molded blockand in particularaftera mounting ofthe molded block on the package body.Exemplarily, the first terminal is fixed in the fur therrecess by at least one of a press-fit connector for fixationof the first terminal in the further recess, a glueconnection between the first terminal and the furth er recess,and a spring portion, an elastic portion and a beds toplocated on a bottom surface ofthe molded block.The use of a terminal block with the integrated fir stterminalmakesthe assemblyofthe powerdevice advantageouslymore flexible.On the one hand,the terminalblock can be mounted directly after the assembly of the powersemiconductor chip and the package body. On the oth er hand,it is possible to mount the terminal block after jo ining ofone or more power semiconductor chips with respecti ve packagebodies to a cooler. Additionally, a design of the f irstterminalcan be adjusted according to a customer’s request,e.g. by a corresponding choice of the terminal type . Even thedesign ofthe whole terminalblockcan be adjusted according to customerrequirements. P2024,0403 WO N / P240010WO01 April23,2025 -20 - The accompanying figuresare included to provide a furtherunderstanding. In the figures, elements of the same structureand / orfunctionalitymaybe referenced bythe same reference signs.Itisto be understood thatthe embodiments shown inthe figures are illustrative representations and ar e notnecessarilydrawn to scale.Figure 1 shows a schematic view of a power device a ccordingto an exemplaryembodiment. Figures2,3 and 4 each show a schematicview ofa firstterminal of a power device according to an exemplar yembodiment.Figures 5, 6 and 7 schematically show method stages of themethod for producing a power device according to an exemplaryembodiment.Figures 8 and 9 each show a schematic view of a sys temcomprising a power device according to an exemplaryembodiment.The power device 1 according to the exemplary embod iment ofFigure 1 comprises at least one power semiconductor chip notshown in Figure 1,which isarranged on a mounting portion 2.The mounting portion 2 comprises a top metallizatio n layer11, an insulating layer 12 and a bottom metallizati on layer13.The powerdevice 1 furthercomprisesa package body3with recesses 4 each exposing a partial region of aconnection region 5. In particular, a partial regio n of thetop metallization layer 11 is exposed by recesses 4 of thepackage body 3 for forming the partial region of th e P2024,0403 WO N / P240010WO01 April23,2025 -21 - connection region 5.The recesses4 each extend in a vertical direction,perpendicularto lateraldirections.The power semiconductor chip is embedded in the pac kage body3, particularly such that the mounting portion 2 an d thepackage body 3 completely, e.g. three-dimensionally , surroundthe powersemiconductorchip.The power device 1 comprises second terminals 10, b eingelectrically connected to the power semiconductor c hip. Thesecond terminals 10 have a main extension plane bei ngparallelto a main extension plane ofthe mounting portion 2and / or the power semiconductor chip. The lateral di rectionsare oriented along the main extension planes. The s econdterminals10 are partiallyembedded in the package body3.End regions of the second terminals 10 each protrud e inlateraldirectionsbeyond the package body3.The package body 3 has a cut-out, wherein the cut-o ut 23, asshown in connection to Figure 6, comprises a top su rface. Inparticular, the package body 3 comprises structural elements17 on the top surface of the cut-out 23. The struct uralelements 17 comprise elevations, wherein two neighb oringelevationsform a furthercut-out24.The power device 1 comprises a terminal block 6, wh erein theterminal block 6 comprises a molded block 7 with fu rtherrecesses 8, and first terminals 9. Each terminal is arrangedin one of the further recesses 8. The terminal bloc k 6 isarranged on the package body 3, in particular in th e cut-out23, such that each of the first terminals 9 is furt herarranged in one of the recesses 4 of the package bo dy 3. P2024,0403 WO N / P240010WO01 April23,2025 -22 -Each of the first terminals 9 is electrically conne cted toeach partial region of each of the connection regio ns 5.The first terminals 9 each have a main extension di rectionbeing oblique,in particularperpendicular,to the mainextension plane of the second terminals 10. This me ans thatthe first terminals 9 each extend in a vertical dir ection. Atop part14 ofeach ofthe firstterminals9 faces awayfromthe mounting portion 2, particularly protruding bey ond themolded block 7 in a vertical direction, being illus trated inFigures 2, 3 and 4 in greater detail. In particular , each ofthe top parts is configured to be connected externa lly. Anintermediate part 15 of each of the first terminals 9 isarranged in the further recess 8. In particular, ea ch of theintermediate parts is configured to provide a stabl emechanical connection between the first terminals 9 and themolded block 7. A bottom part 16 of each of the fir stterminals 9 face the mounting portion 2, particular lyprotruding beyond the molded block7 in a vertical direction.In particular, each of the bottom parts is configur ed to beelectrically connected to the respective connection region 5.The molded block 7 comprises structural elements 17 on a topsurface facing away from the package body 3. Furthe r, themolded block7 comprisesstructuralelements17 on a bottomsurface facing the package body 3. The structural e lements 17on the bottom surface comprise elevations,wherein one oftheelevations fits in the further cut-out of the packa ge body 3.This means that at least some structural elements 1 7 on thetop surface of the package body 3 and at least somestructural elements 17 on the bottom surface of the moldedblock 7 interlock. Exemplarily, the structural elem ents 17 on P2024,0403 WO N / P240010WO01 April23,2025 -23 -the bottom surface of the molded block 7 can be arr anged atleast partly in the recess 4 of the package body 3.The first terminal 9 according to the exemplary emb odimentsof Figures 2, 3 and 4 comprises, as described in co nnectionwith Figure 1,a top part14,an intermediate part 15,and a bottom part16.The bottom part16 isconnected to theconnection region 5 by a connection element 18. Theconnection element18 according to Figure 4 isan electricallyconductive glue,which isprovided in the recess 4.The connection element18 according to Figure 3 isanelastic connection such as a spring, which is provi ded in therecess4.The firstterminal9 according to Figure 2 isdirectly connected to the top metallization layer 1 1 in theconnection region 5.The bottom part 16 in Figure 4 of the first termina l 9 isstructured with broadened parts. Further, the inter mediatepart 15 has a width which is larger than a width of the toppart14 orthe bottom part.The broadened parts at the bottom part 16 are exemp larilyused to increase an interface between the glue and the firstterminal, therefore enhancing conductive gluing con nection.The intermediate part 15 being broadened is in part icularimportant to improve manufacturability, handling, m echanicalstability of pin and adhesion between pin and injec tedplasticaround it.In connection with the method stage according to Fi gure 5, amolded block 7 with further recesses 8 is provided. Furtherfirst terminals 9 are arranged in the further reces ses 8, P2024,0403 WO N / P240010WO01 April23,2025 -24 - particularlyduring orafterthe production ofthe molded block7,forforming a terminalblock6.In connection with the method stage according to Fi gure 6, atleast one power semiconductor chip arranged on a mo untingportion 2 and a package body 3 are provided. The pa ckage body3 has the recesses 4 as described in connection wit h Figure1.In connection with the method stage according to Fi gure 7,the terminal block 6 is arranged on the package bod y 3 forproducing a power device 1 according to the exempla ryembodiment of Figure 1, such that structural elemen ts of themolded block and the package body are fitting to ea ch other,and that the bottom parts of first terminals are in sertedinto the recesses.The system 22 according to the exemplary embodiment s ofFigures 8 and 9 comprises three of the power device s 1described in Figure 1. The power devices 1 are arra nged on acooler19,e.g.byfurtherfixing elements21.In Figure 8, each power device 1 comprising a singl e packagebody3 isprovided with a single terminalblock6. Further,each terminal block 6 according to Figure 9 is conn ected tothe cooler 19 by further fixing elements 21, each b eingformed ofa screw.For fixing purposes, dimensions in lateral directio ns of theterminal block may exceed a perimeter of the packag e body inparticularfora fixation to the cooler. P2024,0403 WO N / P240010WO01 April23,2025 -25 -In Figure 9, a single common terminal block 6 is pr ovided toall the three power devices 1 comprising a single p ackagebody3.Further,the terminalblock6 according to Figure 9is connected to the cooler 19 by further fixing ele ments 21,each being formed e.g. of a screw or a clamp, exemp larily, ifthe cooler provides corresponding fixation structur es likescrew holesorstructuresforclamping.The exemplary embodiments, in particular features o f theexemplary embodiments, of the Figures can be combin ed withone another.

[0002] P2024,0403 WO N / P240010WO01 April23,2025 -26 - Reference Signs 1 powerdevice 2 mounting portion 3 package body 4 recess 5 connection region 6 terminalblock 7 molded block 8 furtherrecess 9 firstterminal 10 second terminal 11 top metallization layer 12 insulating layer 13 bottom metallization layer 14 top part 15 intermediate part 16 bottom part 17 structuralelement 18 connection element 19 cooler 20 fixing element 21 furtherfixing element 22 system 23 cut-out 24 furthercut-out

Claims

P2024,0403 WO N / P240010WO01 April23,2025 -27 - Claims 1.Powerdevice (1)comprising- at least one power semiconductor chip arranged on amounting portion (2), -a package body(3),forthe atleastone powersemiconductor chip, with at least one recess (4) ex posing atleast one partial region of a connection region (5) ,-a terminalblock(6)comprising -a molded block (7) with at least one further rece ss(8),and -at least one first terminal (9) arranged in the a tleastone furtherrecess(8),wherein- the terminal block (6) is arranged on the package body (3),- the at least one first terminal (9) is further ar ranged inthe at least one recess (4) of the package body (3) ,- the at least one first terminal (9) is electrical lyconnected to the at least one partial region of theconnection region (5). 2.Powerdevice (1)according to claim 1,wherein- the power device (1) comprises at least one secon d terminal(10) electrically connected to the at least one pow ersemiconductorchip,and- the at least one first terminal (9) has a main ex tensiondirection being oblique to a main extension plane o f the atleastone second terminal(10).

3. Power device (1) according to one of claims 1 an d 2,wherein- the mounting portion (2) comprises a top metalliz ationlayer(11),an insulating layer(12)and a bottom metallization layer(13),andP2024,0403 WO N / P240010WO01 April23,2025 -28 -- a partial region of the top metallization layer ( 11) isexposed by the at least one recess (4) of the packa ge body(3) for forming the partial region of the connectio n region(5).

4. Power device (1) according to one of claims 1 to 3,wherein -the atleastone firstterminal(9)hasthe form ofa pin, and / or -the atleastone firstterminal(9)comprisesat leastonepin connector and / or at least one press fit connect or.

5. Power device (1) according to one of claims 1 to 4,wherein- the at least one first terminal (9) has a top par t (14)facing away from the mounting portion (2), an inter mediatepart (15) arranged in the further recess (8), and a bottompart(16)arranged in the recess(4). 6.Powerdevice (1)according to claim 5,wherein -the intermediate part(15)isstructured, -the bottom part(16)isstructured,and / or- the intermediate part (15) has a width which is l arger thana width of the top part (14) and / or the bottom part (16) ofthe atleastone firstterminal(9).

7. Power device (1) according to one of claims 1 to 6,wherein -the atleastone firstterminal(9)isconnected to theconnection region (5) by a connection element (18), and- the connection element (18) is at least one of an elasticconnection , a glue, and a solder material.P2024,0403 WO N / P240010WO01 April23,2025 -29 -8. Power device (1) according to one of claims 1 to 7,wherein -the package body(3)and / orthe molded block(7) comprise(s)a resin,and / or- the molded block (7) comprises at least one fille rmaterial.

9. Power device (1) according to one of claims 1 to 8,wherein -the atleastone firstterminal(9)isin direct contact with the molded block(7).

10. Power device (1) according to one of claims 1 t o 9,wherein- the molded block (7) comprises at least one struc turalelement(17)on a top surface facing awayfrom the package body(3),- the molded block (7) comprises at least one struc turalelement (17) on a bottom surface facing the package body (3),and / or- the package body (3) comprises at least one struc turalelement (17) on a top surface facing the molded blo ck (7).

11. Power device (1) according to claim 10, wherein- the at least one structural element (17) on the t op surfaceof the package body (3) and the at least one struct uralelement (17) on the bottom surface of the molded bl ock (7)interlock. 12.System (22)comprising- a power device (1) according to one of claims 1 t o 11, and- a cooler (19) and / or heat sink on which the power device(1)isarranged,whereinP2024,0403 WO N / P240010WO01 April23,2025 -30 -- the terminal block (6) is connected to the packag e body (3)bya fixing element(20)and / orthe terminalblock (6)isconnected to the cooler (19) by a further fixing el ement(21),and / or- the terminal block (6), the package body (3) and / or thecooler (19) each comprise at least one alignment st ructure,respectively. 13.System (22)according to claim 12,comprising -a pluralityofpowerdevices(1),wherein- each of at least some of the power devices (1) co mprises asingle terminalblock(6),and / or- at least some of the power devices (1) comprise a commonterminalblock(6).

14. Method for producing a power device (1), compri sing:-providing -at least one power semiconductor chip arranged on amounting portion (2), -a package body(3),forthe atleastone power semiconductor chip, with at least one recess (4) in thepackage body(3)forexposing atleastone partial region ofa connection region (5), -providing -a molded block (7) with at least one further rece ss(8), for forming at least one terminal block (6), a nd-arranging the atleastone terminalblock(6)on the package body(3)such that- at least one first terminal (9) is arranged in t he atleastone furtherrecess(8),- the at least one first terminal (9) is further ar ranged inthe at least one recess (4) of the package body (3) ,P2024,0403 WO N / P240010WO01 April23,2025 -31 - -the atleastone firstterminal(9)isconnected to the atleast one partial region of the connection region ( 5).

15. Method for producing a power device (1) accordi ng toclaim 14,wherein- the at least one first terminal (9) is provided i n themolded block(7)before arranging the atleastone terminal block(6)on the package body(3),or- the at least one first terminal (9) is provided i n themolded block (7) after arranging the at least one t erminalblock(6)on the package body(3).

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