Light-emitting device, lamp panel and display apparatus

By using a packaged carrier board and a stacked connection of light source and driver chips, the problems of low production efficiency, high cost, and uneven display of Mini LED light boards are solved, achieving efficient and uniform light output and improving display quality.

WO2025241276A1PCT designated stage Publication Date: 2025-11-27HGC (WUHAN) TECH CO LTD +1
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Patent Information

Application Number
PCT/CN2024/104658
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-05-22
Filing Date
2024-07-10
Publication Date
2025-11-27

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Abstract

The present disclosure relates to the technical field of display, and specifically relates to a light-emitting device, a lamp panel and a display apparatus. In the light-emitting device, a first bonding pad is arranged on a first surface of a packaging substrate body, and a second bonding pad is arranged on a second surface of the packaging substrate body; a driver chip is located on a packaging substrate and electrically connected to the second bonding pad; and one light source chip is located on the driver chip and stacked with the driver chip, the driver chip being used for driving the light source chip to emit light.
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Citation Information

Patent Citations

  • Display module package

    CN112447696A

  • Stacking type packaging body structure, technology and light-emitting chip device

    CN115881704A

  • Light-emitting diode packaging piece of secondary expanded bonding pad

    CN117766668A

  • Light-emitting device, lamp panel and display device

    CN118213363A

  • Light emitting unit

    US20030025657A1