Housing assembly and electronic device

Abstract

The present application relates to the technical field of electronic devices, and provides a housing assembly and an electronic device, capable of improving the arrangement density of electric connection terminals on a housing. The housing assembly comprises a housing, electric connection terminals, a circuit board, and a transition member. The housing is provided with mounting holes, and an area on the inner wall surface of the housing where the mounting holes are located is a first area. At least part of each electrical connection terminal is accommodated in the corresponding mounting hole. The circuit board comprises a first circuit board portion, and the first circuit board portion is located inside the housing and fixed to the first area. The first circuit board portion is provided with first through holes, the first through holes are opposite to the mounting holes, and the surface of the first circuit board portion facing toward or away from the first area is provided with a first metal layer; in the axial direction of the first through holes, part of the edge of the first metal layer is aligned with the inner wall surfaces of the first through holes. The transition member covers the first through holes and the first metal layer and is fixed and electrically connected to the first metal layer, and the ends of the electric connection terminals facing the inner side of the housing are electrically connected to the transition member.

Description

Housing assembly and electronic device

[0001] The present application claims priority to the Chinese Patent Application No. 202410651184.1, filed on May 23, 2024, and entitled "Housing assembly and electronic device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic devices, and in particular to a housing assembly and an electronic device. BACKGROUND

[0003] The housing of an electronic device such as a smart watch, a smart bracelet, or smart glasses can be embedded with an electrical connection terminal to achieve power and signal transmission between electronic components inside and outside the housing. The end of the electrical connection terminal inside the housing can be electrically connected to the electronic components on the inside of the housing through a circuit board such as an FPC board.

[0004] The electrical connection terminal and the housing need to have a certain fixing strength, and the electrical connection terminal and the circuit board need to have a certain electrical connection stability to ensure the impact and drop resistance of the entire device. The occupied area of the electrical connection terminal, the fixing structure of the electrical connection terminal and the housing, and the electrical connection structure of the electrical connection terminal and the circuit board on the housing needs to be as small as possible to improve the setting density of the electrical connection terminal on the housing, so as to be suitable for small volume and diversified functions of the electronic device. However, the prior art often cannot meet both of these two requirements. SUMMARY

[0005] The present application provides a housing assembly and an electronic device, which can improve the fixing strength of the electrical connection terminal and the housing, the electrical connection stability between the electrical connection terminal and the circuit board, and the setting density of the electrical connection terminal on the housing.

[0006] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, a housing assembly is provided, which includes a housing, an electrical connection terminal, a circuit board, and a transition piece. The housing is provided with a mounting hole, which is in communication with the inside and outside of the housing. The area of the inner wall surface of the housing where the mounting hole is located is a first area. At least part of the electrical connection terminal is accommodated in the mounting hole, that is, the electrical connection terminal can be entirely accommodated in the mounting hole or partially accommodated in the mounting hole. The circuit board includes a first circuit board part, which is located on the inner side of the housing and fixed to the first area. The first circuit board part is provided with a first through hole, which is opposite to the mounting hole. The surface of the first circuit board part facing or facing away from the first area is provided with a first metal layer. Along the axial direction of the first through hole, part of the edge of the first metal layer is aligned with the inner wall surface of the first through hole. The transition piece is located on the side of the first circuit board part where the first metal layer is provided. The transition piece covers the first through hole and the first metal layer and is fixed and electrically connected to the first metal layer. The end of the electrical connection terminal facing the inner side of the housing is fixed and electrically connected to the transition piece.

[0008] The end of the electrical connection terminal facing the inner side of the housing is fixed and electrically connected to the transition piece by means of the transition piece. Based on this, the transition piece is laminated with at least the part of the first circuit board part where the first metal layer is provided and is fixed and electrically connected. The first circuit board part can cooperate with the transition piece to prevent the transition piece from being skewed by the electrical connection terminal when the whole machine is impacted, and to prevent the first circuit board part from being torn at the transition piece part. At the same time, the electrical connection terminal is limited by the first circuit board part from the peripheral side of the electrical connection terminal, which can reduce the risk of deformation or falling out of the mounting hole of the electrical connection terminal when the whole machine is impacted. Moreover, along the axial direction of the first through hole, part of the edge of the first metal layer is aligned with the inner wall surface of the first through hole. In this way, under the premise that the area and shape of the first metal layer are constant, the first metal layer can be closer to the first through hole, and the fixed and electrically connected part between the transition piece and the first metal layer can also be closer to the first through hole, which is conducive to reducing the orthographic projection area of the transition piece on the first circuit board part and improving the arrangement density of the electrical connection terminal.

[0009] Optionally, the first metal layer is provided on the surface of the first circuit board part facing away from the first area, and the transition piece is located on the side of the first circuit board part facing away from the first area, and part of the electrical connection terminal is accommodated in the first through hole. This structure is simple and easy to implement.

[0010] Optionally, the first metal layer is provided on the surface of the first circuit board part facing the first area, and the transition piece is located between the circuit board and the first area. In this way, along the axial direction of the mounting hole, the distance between the transition piece and the first area is short, which can reduce the length of the electrical connection terminal along the axial direction of the mounting hole, so that the electrical connection terminal is not easy to bend and deform.

[0011] Optionally, the shell assembly further comprises a first adhesive layer. The first adhesive layer is arranged between the first circuit board portion and the first region, and the first circuit board portion is fixed to the first region by the first adhesive layer. This structure is simple and easy to implement.

[0012] Optionally, the first adhesive layer is a back adhesive. The operation of using a back adhesive for adhesion is simple, and can reduce the assembly difficulty.

[0013] Optionally, the first adhesive layer is provided with a second through hole, the second through hole is opposite and communicates with the first through hole and the mounting hole, and the area of the second through hole is greater than the area of the first through hole. In this way, during the process of adhesion of the first adhesive layer to the first circuit board portion and adhesion of the first circuit board portion with the first adhesive layer to the first region, the first adhesive layer can be prevented from blocking the first through hole due to assembly errors.

[0014] Optionally, at least part of the transition piece, at least part of the first metal layer, at least part of the first circuit board portion and at least part of the first adhesive layer are arranged in overlap, that is, the orthographic projections of the at least part of the transition piece, the at least part of the first metal layer, the at least part of the first circuit board portion and the at least part of the first adhesive layer on the first region overlap. In this way, at least part of the first metal layer and at least part of the transition piece are arranged on the part of the first circuit board portion opposite to the first adhesive layer, and there is no gap between this part of the first circuit board portion and the shell, so that the inclination of the electric connection terminal caused by the transition piece can be effectively prevented.

[0015] Optionally, the shell assembly further comprises a reinforcing plate. The reinforcing plate is arranged between the first circuit board portion and the first region, and is arranged in stack with the first circuit board portion and fixedly connected thereto. The reinforcing plate is provided with a third through hole, the third through hole is opposite and communicates with the first through hole and the mounting hole, and the area of the third through hole is greater than the area of the first through hole. The electric connection terminal is limited by the first circuit board portion, the reinforcing plate, the first adhesive layer and the second adhesive layer from the peripheral side of the electric connection terminal, which can improve the limiting strength and reduce the risk of inclination, deformation or disengagement of the electric connection terminal from the mounting hole when the whole machine is impacted. At the same time, since the area of the third through hole is greater than the area of the first through hole, the reinforcing plate can be prevented from blocking the first through hole due to assembly errors during assembly of the first circuit board portion and the reinforcing plate.

[0016] Optionally, the shell assembly further comprises a first adhesive layer. The first adhesive layer is arranged between the reinforcing plate and the first region, and the reinforcing plate is fixed to the first region by the first adhesive layer. This structure is simple and easy to implement.

[0017] Optionally, the first adhesive layer is provided with a second through hole, the second through hole is opposite and communicated with the first through hole, the third through hole and the mounting hole, and an area of the second through hole is greater than an area of the third through hole. In this way, during assembly of the reinforcing plate and the first adhesive layer, the first adhesive layer is prevented from blocking the third through hole due to assembly errors.

[0018] Optionally, at least a portion of the transition piece, at least a portion of the first metal layer, at least a portion of the first circuit board portion, at least a portion of the reinforcing plate and at least a portion of the first adhesive layer are arranged in an overlapping manner, that is, the at least a portion of the transition piece, the at least a portion of the first metal layer, the at least a portion of the first circuit board portion, the at least a portion of the reinforcing plate and the at least a portion of the first adhesive layer are overlapped in orthographic projection on the first area. In this way, the at least a portion of the first metal layer and the at least a portion of the transition piece are arranged on a portion of the first circuit board portion opposite to the first adhesive layer and the reinforcing plate, and there is no gap between the portion of the first circuit board portion and the housing, so that the inclination of the electric connection terminal caused by the transition piece can be effectively prevented.

[0019] Optionally, the housing assembly further comprises a reinforcing plate. The reinforcing plate is arranged on a side of the first circuit board portion opposite to the first area, and is arranged in a laminated manner and fixedly connected with the first circuit board portion. The reinforcing plate is provided with a third through hole, and the third through hole is opposite and communicated with the first through hole. In this way, the structural strength of the first circuit board portion can be increased by means of the reinforcing plate, and the convenience of assembly operation can be improved. At the same time, the fixing and electric connection operation of the transition piece and the electric connection terminal can be performed through the third through hole and the first through hole.

[0020] Optionally, the first metal layer is arranged around a periphery of the through hole. In an axial direction of the first through hole, an inner edge of the first metal layer is aligned with an inner wall of the first through hole. In this way, under the premise that the area of the first metal layer is constant, the orthographic projection area of the transition piece on the first circuit board portion can be further reduced, and the arrangement density of the electric connection terminal can be improved.

[0021] Optionally, the inner wall of the first through hole is provided with a second metal layer, and the second metal layer is connected with the first metal layer. The gap between the side wall of the electric connection terminal and the inner wall of the first through hole can be reduced by means of the second metal layer, so as to further prevent the electric connection terminal from being inclined or deformed in the first through hole. At the same time, since the second metal layer is connected with the first metal layer, the second metal layer and the first metal layer can be integrally formed, and the difficulty of forming can be reduced.

[0022] Optionally, the surface of the first circuit board portion opposite to the first metal layer is further provided with a third metal layer, and the third metal layer is connected with the second metal layer. In this way, the opposite two surfaces of the first circuit board portion are both provided with metal layers, and the metal layers of the two surfaces are electrically connected through the metal layer of the inner wall of the through hole. No matter which of the two metal layers is opposite to the first area and is fixed and electrically connected with the transition piece, the internal circuit of the first circuit board portion can be electrically connected with the transition piece, and therefore the assembly difficulty can be reduced during assembly.

[0023] Optionally, the circuit board is an FPC.

[0024] The second aspect further provides a shell assembly, which comprises a shell, an electric connection terminal, a circuit board and a transition piece. The shell is provided with a mounting hole, and the mounting hole is connected between the inside and outside of the shell. The area of the shell where the mounting hole is located is a first area. A part of the electric connection terminal is accommodated in the mounting hole. The circuit board comprises a first circuit board portion, and the first circuit board portion is located on the inside of the shell and is bonded to the first area through a first adhesive layer. The first circuit board portion is provided with a first through hole, and the first adhesive layer is provided with a second through hole. The first through hole, the second through hole and the mounting hole are opposite to each other and are connected. Another part of the electric connection terminal is accommodated in the first through hole and the second through hole. The surface of the first circuit board portion opposite to the first area is provided with a solder pad. The transition piece is located on the side of the first circuit board portion opposite to the first area, and the transition piece covers the first through hole and the solder pad and is fixed and electrically connected to the solder pad. The end of the electric connection terminal towards the inside of the shell is fixed and electrically connected to the transition piece.

[0025] In the present application, the part of the first circuit board portion opposite to the second through hole is a second portion, and the second portion is the part of the first circuit board portion where there is a gap between the first circuit board portion and the shell. The gap will result in poor position stability of the second portion relative to the shell. The area of the second portion is small, and under the premise of ensuring the position stability of the transition piece relative to the shell, the setting area of the solder pad and the orthogonal projection area of the transition piece on the first circuit board portion can be designed to be small, so as to improve the setting density of the electric connection terminal.

[0026] Optionally, the area of the second through hole is greater than the area of the first through hole. In this way, during the process of bonding the first circuit board portion to the first area through the first adhesive layer, the first adhesive layer can be prevented from blocking the first through hole due to assembly errors.

[0027] Optionally, the first adhesive layer is a back adhesive.

[0028] The third aspect further provides an electronic device, which comprises a first electronic component and the shell assembly according to any one of the technical solutions above. The first electronic component is arranged on the inside of the shell of the shell assembly, and the first electronic component is electrically connected with the electric connection terminal through the circuit board in the shell assembly.

[0029] The electronic device provided in the present application comprises the shell assembly as in any of the above technical solutions, and thus the same technical problems can be solved and the same effects can be achieved.

[0030] Optionally, the electronic device comprises a watch body and a watchband connected to the watch body, and the second electronic component is arranged on the watchband. The shell assembly is arranged on the watch body, and the electrically connecting terminal of the shell assembly is electrically connected to the second electronic component. BRIEF DESCRIPTION OF DRAWINGS

[0031] FIG. 1 is a structural block diagram of an electronic device provided in some embodiments of the present application;

[0032] FIG. 2 is a structural schematic diagram of an electronic device provided in some embodiments of the present application;

[0033] FIG. 3 is a perspective view of a shell assembly in the electronic device shown in FIG. 2;

[0034] FIG. 4 is a structural schematic diagram of an end portion of a first watchband portion for connecting to the watch body in the electronic device shown in FIG. 2;

[0035] FIG. 5 is a sectional structural schematic diagram of the electronic device shown in FIG. 2 along the A-A direction;

[0036] FIG. 6 is a perspective view of a circuit board in the electronic device shown in FIG. 5 from one viewing angle;

[0037] FIG. 7 is a perspective view of the circuit board in the electronic device shown in FIG. 5 from another viewing angle;

[0038] FIG. 8 is a sectional structural schematic diagram of a shell assembly provided in the related art;

[0039] FIG. 9 is a schematic diagram of the relative positions of the electrically connecting terminal and the shell of the electronic device after falling;

[0040] FIG. 10 is a structural schematic diagram of an inner surface of the shell assembly of the electronic device after falling;

[0041] FIG. 11 is a sectional structural schematic diagram of another shell assembly provided in the related art;

[0042] FIG. 12 is a sectional structural schematic diagram of a shell assembly provided in some embodiments of the present application;

[0043] FIG. 13 is a sectional structural schematic diagram of a shell assembly provided in yet some embodiments of the present application;

[0044] FIG. 14 is a sectional structural schematic diagram of a shell assembly provided in yet some embodiments of the present application;

[0045] FIG. 15 is a sectional structural schematic diagram of a shell assembly provided in yet some embodiments of the present application;

[0046] Fig. 16 is a cross-sectional structural schematic view of a housing assembly according to some embodiments of the present application;

[0047] Fig. 17 is a cross-sectional structural schematic view of a housing assembly according to some embodiments of the present application;

[0048] Fig. 18 is a cross-sectional structural schematic view of a housing assembly according to some embodiments of the present application;

[0049] Fig. 19 is a flow chart of a processing method of a housing assembly according to some embodiments of the present application;

[0050] Fig. 20 is a perspective view of a circuit board assembly obtained in the processing method of the housing assembly shown in Fig. 19, from one viewing angle;

[0051] Fig. 21 is a perspective view of a circuit board assembly obtained in the processing method of the housing assembly shown in Fig. 19, from another viewing angle;

[0052] Fig. 22 is a perspective view of a housing assembly obtained in the processing method of the housing assembly shown in Fig. 19;

[0053] Fig. 23 is a structural schematic view of an electronic device after the housing assembly shown in Fig. 12 is applied to the electronic device shown in Fig. 5.

[0054] Reference Signs:

[0055] 100, electronic device;

[0056] 10, watch body; 20, watchband; 201, first watchband portion; 202, second watchband portion;

[0057] 1, housing assembly; 11, housing; 11a, mounting hole; 12, electrical connection terminal; 13, circuit board; 131, first circuit board portion; 131a, first through hole; 132, second circuit board portion; 2, first electronic component;

[0058] 3, second electronic component; 4, sealing ring; 5, spring needle; S1, first region; 6, first adhesive layer; 6a, second through hole; a, pad; a1, inner hole; b, solder joint; 7, reinforcing plate; 7a, third through hole; 8, transition piece; 9, second adhesive layer; g, gap; N1, first portion; N2, second portion; m1, first metal layer; m2, second metal layer; m3, third metal layer; c, soldering material. DETAILED DESCRIPTION

[0059] In the embodiments of the present application, the terms "first", "second", "third" are only used for descriptive purpose and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", "third" can explicitly or implicitly include one or more of the features.

[0060] In the embodiments of the present application, the terms "including", "comprising" or any other variant thereof are intended to cover the non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0061] The present application provides an electronic device, which can be a user equipment (UE) or a terminal device, etc. For example, the electronic device can be a portable android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, or the like. The wearable device can be a watch, a bracelet, smart glasses, and smart clothes.

[0062] Referring to FIG. 1, FIG. 1 is a structural block diagram of an electronic device 100 provided by some embodiments of the present application, the electronic device 100 including a housing assembly 1 and a first electronic component 2. The housing assembly 1 can include a housing 11 and an electrically connecting terminal 12 embedded on the housing 11.

[0063] The first electronic component 2 is located on the inner side of the shell 11. In the embodiments and the following embodiments, the inner side of the shell 11 refers to the side of the shell 11 facing the internal accommodating space, and the outer side of the shell 11 refers to the side of the shell 11 facing away from the internal space. The first electronic component 2 can be a main control board, a charging module, a camera, a speaker module, a vibration motor, a screen, a Bluetooth module, a radio frequency module, or a battery module, etc., which are not limited in the present application. The first electronic component 2 is electrically connected to the second electronic component 3 on the outer side of the shell 11 by means of the electric connection terminal 12. The second electronic component 3 can or can not belong to the electronic device 100. The second electronic component 3 can be a Bluetooth module, a solar cell module, a main control board, or a charging module, etc., which are not limited in the present application.

[0064] On the basis of the above, please continue to refer to FIG. 1, the shell assembly 1 can further include a circuit board 13. The circuit board 13 is connected between the first electronic component 2 and the electric connection terminal 12, so as to pull the first electronic component 2 away from the electric connection terminal 12, so that the installation position of the first electronic component 2 in the shell 11 can not be limited by the position of the electric connection terminal 12.

[0065] In the shell assembly 1, a certain fixing strength needs to be ensured between the electric connection terminal 12 and the shell 11, and a certain electrical connection stability needs to be ensured between the electric connection terminal 12 and the circuit board 13, so as to improve the impact resistance and drop resistance performance of the shell assembly 1 and even the electronic device 100. At the same time, the number of electric connection terminals 12 provided on the shell 11 is often multiple, so as to transmit power and at least one signal respectively. Based on this, it is necessary to reduce the setting density of the multiple electric connection terminals 12 to adapt to the electronic device with limited shell space. However, the prior art often cannot meet these two aspects of needs at the same time.

[0066] The above technical problems will be described in detail below by taking an example of an electronic device being a smart watch.

[0067] Please refer to FIG. 2, which is a structural schematic diagram of an electronic device 100 provided by some embodiments of the present application. In the present embodiment, the electronic device 100 is a smart watch, and the smart watch includes a watch body 10 and a watchband 20. The watchband 20 is used to wear the watch body 10 on the wrist of a human body.

[0068] In some embodiments, please refer to FIG. 2, the watchband 20 can include a first watchband portion 201 and a second watchband portion 202, one end of the first watchband portion 201 and one end of the second watchband portion 202 are connected to opposite ends of the watch body 10. The other end of the first watchband portion 201 is provided with a first locking portion, and the other end of the second watchband portion 202 is provided with a second locking portion. The first locking portion and the second locking portion are detachably locked with each other to wear the watch body 10 on the wrist of a human body. Among them, the matching structure composed of the first locking portion and the second locking portion can be a watch buckle structure such as a hook, a clasp, a butterfly buckle, a belt buckle, a folding safety buckle, a folding buckle or a needle buckle, which is not limited in the present application.

[0069] Please refer to FIG. 2, the watch body 10 includes a shell assembly 1. Please refer to FIG. 3, which is a perspective view of the shell assembly 1 in the electronic device 100 shown in FIG. 2. The shell assembly 1 can include a shell 11, which can be the watch body, the bottom shell of the watch body, or the decorative piece on the screen side of the watch body. The present application is exemplarily illustrated by taking the shell 11 as the watch body.

[0070] The position of the shell 11 for connecting the first watchband portion 201 is embedded with an electrical connection terminal 12. The number of the electrical connection terminal 12 can be one or multiple, and the present application is exemplarily illustrated by taking the number of the electrical connection terminal 12 as multiple, which can be used to transmit power and at least one signal respectively.

[0071] The electrical connection terminal 12 includes but is not limited to a plug-in terminal, a spring needle terminal or a contact terminal. In some embodiments, please refer to FIG. 3, the electrical connection terminal 12 can be a metal contact piece, and the material thereof includes but is not limited to stainless steel, copper, copper alloy, aluminum, aluminum alloy and the like.

[0072] The inner side of the shell 11 is provided with a first electronic component. In some embodiments, the first electronic component can be a main control board. Please refer to FIG. 2, the first watchband portion 201 is provided with a second electronic component 3, which can be a Bluetooth module, a solar cell module and the like. The first electronic component is electrically connected with the second electronic component 3 through the electrical connection terminal 12 on the shell assembly 1 to realize the transmission of power and at least one signal.

[0073] In some embodiments, please refer to FIG. 4 and FIG. 5, FIG. 4 is a structural schematic view of the end of the first watchband portion 201 for connecting the watch body 10 in the electronic device 100 shown in FIG. 2, and FIG. 5 is a sectional structural schematic view of the electronic device 100 along A-A direction shown in FIG. 2.

[0074] The first watchband part 201 is provided with spring pins (PoGo Pin) 5. The number of spring pins 5 can be one or multiple. The application is exemplarily described by taking the number of spring pins 5 as multiple. The multiple spring pins 5 are in elastic contact and electrically conductive with the multiple electric connection terminals 12 respectively. The number of multiple spring pins 5 can be equal to or different from the number of multiple electric connection terminals 12. One spring pin 5 can be in elastic contact and electrically conductive with one electric connection terminal 12, or two or more spring pins 5 can be in elastic contact and electrically conductive with one electric connection terminal 12. The application is exemplarily described by taking the number of spring pins 5 equal to the number of electric connection terminals 12, and one spring pin 5 in elastic contact and electrically conductive with one electric connection terminal 12, which cannot be considered as a special limitation to the application. The first electronic component 2 is electrically connected with the second electronic component 3 by means of the assembly of electric connection terminals 12 and spring pins 5.

[0075] The electric connection terminals 12 can be integrally formed with the shell 11, or separately formed with the shell 11 and assembled, and the application is exemplarily described by taking the electric connection terminals 12 separately formed with the shell 11 and assembled.

[0076] In some embodiments, referring to FIGS. 3 and 5, the shell 11 can be provided with mounting holes 11a, which are communicated between the inside and outside of the shell 11. The number of mounting holes 11a can be equal to the number of electric connection terminals 12, and one mounting hole 11a can accommodate one electric connection terminal 12.

[0077] At least part of the electric connection terminals 12 is mounted in the mounting holes 11a, that is, the electric connection terminals 12 can be entirely accommodated in the mounting holes 11a, or partially accommodated in the mounting holes 11a. Optionally, referring to FIG. 5, part of the electric connection terminals 12 is accommodated in the mounting holes 11a, and the other part is extended into the inside of the shell 11, so as to be electrically connected with the first electronic component 2.

[0078] At least part of the material of the shell 11 forming the mounting holes 11a can be insulating material, and the material of other parts can be insulating material or conductive material. The insulating material includes but is not limited to plastic and glass, and the conductive material includes but is not limited to stainless steel and aluminum alloy, etc. In this way, the electric quantity or signal transmitted on the electric connection terminals 12 can be prevented from leaking to the shell 11.

[0079] In some embodiments, referring to FIG. 5, the shell assembly 1 can further include a sealing ring 4, which is arranged between the inner wall surface of the mounting hole 11a and the electric connection terminal 12, so as to play a waterproof sealing role.

[0080] Referring to FIG. 5, the shell assembly 1 can further include a circuit board 13. Referring to FIG. 6 and FIG. 7, FIG. 6 is a perspective view of the circuit board 13 in the electronic device 100 shown in FIG. 5 from one perspective, and FIG. 7 is a perspective view of the circuit board 13 in the electronic device 100 shown in FIG. 5 from another perspective.

[0081] The circuit board 13 can be a hard board, a soft board, or a combination of a hard board and a soft board. The hard board can be a printed circuit board (PCB), and the soft board can be a flexible printed circuit (FPC) board. The circuit board 13 can be made of an FR-4 medium board, a Rogers medium board, a combination of a Rogers medium board and an FR-4 medium board, or the like. For example, referring to FIG. 6 and FIG. 7, the circuit board 13 can be an FPC board. The circuit board 13 is connected between the first electronic component 2 and the electrical connection terminal 12. Specifically, referring to FIG. 6 and FIG. 7, the part of the circuit board 13 for connecting the electrical connection terminal 12 is a first circuit board part 131, and the part of the circuit board 13 for connecting the first electronic component 2 is a second circuit board part 132. By means of the circuit board 13, the distance between the first electronic component 2 and the electrical connection terminal 12 can be increased, so that the installation position of the first electronic component 2 in the shell 11 can not be limited by the position of the electrical connection terminal 12. Moreover, when the circuit board 13 is an FPC board, the circuit board 13 can also enable the first electronic component 2 to be assembled to the inner side of the shell 11 after being electrically connected to the electrical connection terminal 12, or to be taken out from the shell 11 for maintenance, so as to simplify the assembly and maintenance difficulty of the first electronic component 2.

[0082] The electrical connection terminal 12 and the shell 11 need to have a certain fixing strength, and the electrical connection terminal 12 and the circuit board 13 need to have a certain electrical connection stability, so as to improve the impact resistance and drop resistance performance of the shell assembly 1 and the electronic device 100. Moreover, the area occupied by the electrical connection terminal 12, the fixing structure of the electrical connection terminal 12 and the shell 11, and the electrical connection structure of the electrical connection terminal 12 and the circuit board 13 on the shell 11 needs to be as small as possible, so as to improve the setting density of the electrical connection terminal 12 on the shell 11, and to be suitable for small-volume and diversified electronic devices.

[0083] It should be noted that, for the convenience of the description of the following embodiments, referring to FIG. 5, the area where the mounting hole 11a on the inner wall surface of the shell 11 is located is defined as a first area S1. In some embodiments, the first area S1 can be a planar area, and in some other embodiments, the first area S1 can also be an arc surface area.

[0084] Please refer to FIG. 8, which is a sectional structural schematic diagram of a shell assembly 1 provided by the related art. In the embodiment, the first circuit board part 131 is located at the inner side of the shell 11 and is fixed to the first region S1 by means of the first adhesive layer 6. The first adhesive layer 6 can be back adhesive or point adhesive. The first circuit board part 131 is provided with a first through hole 131a, the first adhesive layer 6 is provided with a second through hole 6a, the second through hole 6a, the first through hole 131a and the mounting hole 11a are opposite and communicate with each other. A part of the electric connection terminal 12 is accommodated in the first through hole 131a and the second through hole 6a, and another part is located at the side of the first circuit board part 131 which is opposite to the first region S1. The surface of the first circuit board part 131 which is opposite to the first region S1 is provided with a solder pad a, and the solder pad a is soldered with the electric connection terminal 12 to realize the electrical connection between the first circuit board part 131 and the electric connection terminal 12.

[0085] The number of the solder pad a can be one or multiple. The number of the solder pad a is exemplarily illustrated as multiple in the present application. The number of the multiple solder pads a can be equal to or different from the number of the multiple electric connection terminals 12. One solder pad a can be soldered with one electric connection terminal 12, or one solder pad a can be soldered with two or more electric connection terminals 12. The following embodiments are further illustrated on the basis that the number of the multiple solder pads a is equal to the number of the multiple electric connection terminals 12, and one solder pad a is soldered with one electric connection terminal 12, which cannot be considered as a special limitation to the present application.

[0086] The solder pad a and the electric connection terminal 12 can be soldered by spot welding process to form a solder joint b. The spot welding process can be used for welding operation in a small space, and can be suitable for welding in a small shell. However, due to the small volume and low structural strength of the spot welding part, stress concentration occurs, which causes the electric connection terminal 12 to be inclined, deformed or separated from the mounting hole 11a relative to the shell 11, or causes the first circuit board part 131 to be torn at the solder joint part when the electronic device falls or is impacted by external force. For example, please refer to FIG. 9 and FIG. 10, FIG. 9 is a schematic diagram of the relative position between the electric connection terminal 12 and the shell 11 after the electronic device 100 falls, and FIG. 10 is a structural schematic diagram of the inner surface of the shell assembly 1 after the electronic device 100 falls. The electric connection terminal 12 is inclined relative to the shell 11. Therefore, the fixing strength between the electric connection terminal 12 and the shell 11, and the electrical connection stability between the electric connection terminal 12 and the circuit board 13 are poor, and the impact resistance and drop resistance performance of the shell assembly 1 and the electronic device 100 are poor.

[0087] To solve the above problems, please refer to FIG. 11, which is a schematic diagram of a cross-section structure of another casing assembly 1 provided by the related art. In the embodiment, the casing assembly 1 can further include a reinforcing plate 7 and a transition piece 8 in addition to the casing 11, the electrical connection terminal 12 and the circuit board 13.

[0088] The reinforcing plate 7 can be a rigid structure or a flexible structure. The reinforcing plate 7 can be located between the first circuit board portion 131 and the first area S1, and is arranged in a stack with the first circuit board portion 131 and fixedly connected thereto. The material of the reinforcing plate 7 includes but is not limited to polycarbonate (PC), polyamide (PA), PA6, PA66, polyphenylene sulfide (PPS), polyphthalamide (PPA), polybutylene terephthalate (PBT), polyphenylene sulfone resins (PPSU) and other plastics, and stainless steel, copper alloy, aluminum, aluminum alloy, magnesium, magnesium-aluminum alloy, magnesium alloy, copper, copper alloy, titanium, titanium alloy, galvanized sheet, brass and other metals.

[0089] Optionally, the reinforcing plate 7 can be fixedly bonded to the circuit board 13 by means of a second adhesive layer 9. The second adhesive layer 9 can be dispensing or back glue, which is not limited in the present application.

[0090] The first adhesive layer 6 is arranged between the reinforcing plate 7 and the first area S1, and the reinforcing plate 7 is bonded to the first area S1 by means of the first adhesive layer 6. In order to facilitate assembly, the first adhesive layer 6 can be back glue.

[0091] The reinforcing plate 7 is provided with a third through hole 7a, which is opposite and communicates with the first through hole 131a, the second through hole 6a and the mounting hole 11a, and a part of the electrical connection terminal 12 is accommodated in the third through hole 7a.

[0092] The surface of the first circuit board portion 131 opposite to the first area S1 is provided with a solder pad a. The transition piece 8 is arranged on the side of the first circuit board portion 131 opposite to the first area S1, and the transition piece 8 covers the first through hole 131a and the solder pad a, and is welded to the solder pad a by means of a welding material c. The welding material c includes but is not limited to solder.

[0093] The transition piece 8 can be a rigid structure. In some embodiments, the transition piece 8 can be a metal piece, and the material of the metal piece can include, but is not limited to, one or more of stainless steel, copper alloy, aluminum, aluminum alloy, magnesium, magnesium-aluminum alloy, magnesium alloy, copper, copper alloy, titanium, titanium alloy, galvanized sheet, brass, and the like. In other embodiments, the transition piece 8 can also include an insulating material and a metal conductive piece embedded in the insulating material, for example, the transition piece 8 can be a PCB board. The transition piece 8 can be in the form of a plate, a sheet, a block, a mesh, a hollowed-out shape, or the like, and the present application is exemplarily described with the transition piece 8 in the form of a plate. The thickness of the transition piece 8 can be greater than or equal to 0.1 mm and less than or equal to 0.2 mm. In some embodiments, the thickness of the transition piece 8 can be 0.1 mm, 0.12 mm, 0.13 mm, 0.15 mm, 0.16 mm, 0.18 mm, 0.19 mm, or 0.2 mm. In this way, the thickness of the transition piece 8 is moderate, which is conducive to the thinning of the shell assembly, avoids interference with the components on the inner side of the shell 11, and can also take into account the structural strength of the transition piece 8.

[0094] The end of the electric connection terminal 12 facing the inner side of the shell 11 is electrically connected to the transition piece 8. In some embodiments, the electric connection terminal 12 and the transition piece 8 can be electrically connected by welding. The electric connection terminal 12 and the transition piece 8 can be welded by laser welding process or by surface mount technology (SMT). In other embodiments, the electric connection terminal 12 and the transition piece 8 can also be electrically connected by conductive adhesive bonding, which is not limited in the present application. In this way, with the aid of the transition piece 8, the electric connection terminal 12 and the first circuit board portion 131 can be electrically connected to realize the transmission of electric quantity or signal.

[0095] The number of transition pieces 8 can be one or more, and the number of transition pieces 8 can be equal to the number of electric connection terminals 12 and the number of pads a, and one transition piece 8 is electrically connected between one electric connection terminal 12 and one pad a, thereby preventing short circuit between multiple electric connection terminals 12.

[0096] In the related art shown in FIG. 11, the end portion of the electric connection terminal 12 facing the inside of the housing 11 is fixed by means of the transition piece 8. Based on this, the transition piece 8 is laminated and fixed by welding with at least the portion of the first circuit board portion 131 in which the pad a is provided, and the first circuit board portion 131 can cooperate with the transition piece 8 to prevent the transition piece 8 from being skewed by the electric connection terminal 12 when the entire machine is subjected to an impact, and to prevent the first circuit board portion 131 from being torn at the transition piece 8. At the same time, the electric connection terminal 12 is positioned by means of the first circuit board portion 131, the reinforcing plate 7, and the first adhesive layer 6 from the peripheral side of the electric connection terminal 12, which can reduce the risk of deformation or falling out of the mounting hole 11a of the electric connection terminal 12 when the entire machine is subjected to an impact.

[0097] However, in the related art shown in FIG. 11, the first through-hole 131a is usually formed by drilling in the area of the first circuit board portion 131 opposite the inner hole a1 of the pad a. Based on this, in order to reduce the difficulty of setting the first through-hole 131a, the area of the inner hole a1 is usually larger than the area of the first through-hole 131a. For example, the first through-hole 131a and the inner hole a1 are both circular holes, and the radius of the first through-hole 131a can be 0.2 mm smaller than the radius of the inner hole a1, thereby avoiding the first through-hole 131a from being drilled onto the pad a due to machining errors during the process of drilling the first through-hole 131a. However, in this way, in order to ensure the connection strength of the transition piece 8 and the first circuit board portion 131, it is necessary to increase the size of the outer edge of the pad a and the transition piece 8, which results in a larger occupied area of the transition piece 8 on the first circuit board portion 131 and reduces the setting density of the electric connection terminal 12. The outer edge of the pad a refers to the edge of the pad a away from the inner hole a1.

[0098] In addition, in the related art shown in FIG. 11, the area of the third through-hole 7a is usually larger than the area of the first through-hole 131a, and the area of the second through-hole 6a is usually larger than the area of the third through-hole 7a. For example, the first through-hole 131a, the third through-hole 7a, and the second through-hole 6a are all circular holes, and the radius of the third through-hole 7a can be 0.2 mm larger than the radius of the first through-hole 131a, and the radius of the second through-hole 6a can be 0.2 mm larger than the radius of the third through-hole 7a. In this way, during the assembly of the first circuit board portion 131, the reinforcing plate 7, and the first adhesive layer 6, it can be prevented that the reinforcing plate 7 blocks the first through-hole 131a due to assembly errors, and it can be prevented that the first adhesive layer 6 blocks the third through-hole 7a due to assembly errors.

[0099] However, please continue to refer to FIG. 11, the part of the reinforcing plate 7 opposite to the second through hole 6a is the first part N1, and the part of the first circuit board part 131 opposite to the second through hole 6a is the second part N2. There is a gap g (i.e. the part of the space in the second through hole 6a) between the first part N1 and the shell 11, and between the second part N2 and the shell 11, which will cause the position stability of the first part N1 and the second part N2 relative to the shell 11 to be poor. In this way, if the outer edge of the pad a and the outer edge of the orthographic projection of the transition piece 8 on the first circuit board part 131 are located in the second part N2, the electric connection terminal 12 is prone to be skewed together with the transition piece 8 when the whole machine is impacted, and the first circuit board part 131 is prone to be torn at the position of the transition piece 8. In order to avoid this problem, the size of the pad a and the transition piece 8 needs to be further increased, so that the outer edge of the pad a and the outer edge of the orthographic projection of the transition piece 8 on the first circuit board part 131 are located in the area of the first circuit board part 131 opposite to the first adhesive layer 6, but in this way, the size of the pad a and the transition piece 8 is further increased, and the setting density of the electric connection terminal 12 is reduced.

[0100] Furthermore, in the related art shown in FIG. 11, the reinforcing plate 7 is additionally arranged in the shell assembly 1, and the reinforcing plate 7 occupies the inner space of the shell 11, which causes the size of other electronic components (such as a main control board or a battery) in the shell 11 to be compressed.

[0101] Different from the related art shown in FIG. 11, please refer to FIG. 12, which is a schematic view of the cross-sectional structure of the shell assembly 1 provided by some embodiments of the present application. In the present embodiment, the shell assembly 1 comprises a shell 11, an electric connection terminal 12, a circuit board 13 and a transition piece 8. The structures of the shell 11, the electric connection terminal 12, the circuit board 13 and the transition piece 8 can be the same as those described in any of the above embodiments, and will not be described here.

[0102] The shell 11 is provided with a mounting hole 11a, which communicates the inside and the outside of the shell 11. At least part of the electric connection terminal 12 is accommodated in the mounting hole 11a.

[0103] The first circuit board part 131 of the circuit board 13 is located on the inner side of the shell 11 and is fixed to the first area S1. Specifically, the first circuit board part 131 can be fixed to the first area S1 by means of an adhesive, can be directly formed on the first area S1, or can be fixed to the first area S1 by means of other intermediate structures. FIG. 12 is exemplarily illustrated by taking the first circuit board part 131 adhered to the first area S1 by means of the first adhesive layer 6.

[0104] The thickness of the first circuit board portion 131 can be greater than or equal to 0.08 mm and less than or equal to 0.15 mm. For example, the thickness of the first circuit board portion 131 can be 0.08 mm, 0.1 mm, 0.11 mm, or...

[0105] 0.12mm, 0.13mm, 0.14mm, or 0.15mm. In this way, the thickness of the first circuit board portion 131 is moderate, which can balance structural strength and thickness, and is conducive to reducing the thickness of the housing assembly 1 and avoiding interference with the inner components of the housing 11.

[0106] The first adhesive layer 6 can be a backing adhesive or a dotted adhesive. This application uses the first adhesive layer 6 as a backing adhesive for illustrative purposes. Using a backing adhesive simplifies the bonding process and reduces assembly difficulty. The thickness of the first adhesive layer 6 can be less than or equal to 0.1 mm. For example, the thickness of the first adhesive layer 6 can be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, or 0.1 mm. This smaller thickness of the first adhesive layer 6 facilitates the thinning of the housing assembly 1 and avoids interference with the inner components of the housing 11.

[0107] The first circuit board portion 131 has a first through hole 131a, which is opposite to and communicates with the mounting hole 11a. A portion of the electrical connection terminal 12 is accommodated within the first through hole 131a. In some embodiments, the area of ​​the first through hole 131a is larger than the cross-sectional area of ​​the portion of the electrical connection terminal 12 accommodated within the first through hole 131a. For example, the first through hole 131a is circular, and the portion of the electrical connection terminal 12 accommodated within the first through hole 131a is cylindrical. The radius of the first through hole 131a may be 0.1 mm larger than the cross-sectional radius of the portion of the electrical connection terminal 12 accommodated within the first through hole 131a.

[0108] A first metal layer m1 is provided on the surface of the first circuit board portion 131 facing away from the first region S1. The material of the first metal layer m1 can be copper, copper alloy, aluminum alloy, or other metals. Along the axial direction of the first through hole 131a (that is, the Z-axis direction), a portion of the edge of the first metal layer m1 is aligned with the inner wall of the first through hole 131a.

[0109] The transition piece 8 is located on the side of the first circuit board part 131 where the first metal layer m1 is arranged. The transition piece 8 covers the first through hole 131a and the first metal layer m1, that is, the orthographic projection of the transition piece 8 on the first circuit board part 131 covers the first through hole 131a and the first metal layer m1. The transition piece 8 can also be fixed and electrically connected to the first metal layer m1. In some embodiments, the transition piece 8 is welded to the first metal layer m1 by means of the welding material c to achieve the fixed and electrical connection of the transition piece 8 to the first metal layer m1. In other embodiments, the transition piece 8 can also be fixed and electrically connected to the first metal layer m1 by means of conductive glue. The end of the electrical connection terminal 12 facing the inner side of the shell 11 is electrically connected to the transition piece 8, and the electrical connection of the electrical connection terminal 12 to the transition piece 8 can be implemented according to any of the above-mentioned electrical connection modes of the electrical connection terminal 12 to the transition piece 8, which will not be described here. By means of the transition piece 8, the electrical connection of the electrical connection terminal 12 to the first circuit board part 131 can be achieved to realize the transmission of electrical quantity and at least one signal between the electrical connection terminal 12 and the first circuit board part 131.

[0110] In the present embodiment, the end of the electrical connection terminal 12 facing the inner side of the shell 11 is fixed by means of the transition piece 8. Based on this, the transition piece 8 is laminated with at least the part of the first circuit board part 131 where the first metal layer m1 is arranged and is fixed and electrically connected, and the first circuit board part 131 can cooperate with the transition piece 8 to prevent the transition piece 8 from being skewed by the electrical connection terminal 12 when the whole machine is impacted, preventing the first circuit board part 131 from being torn at the transition piece 8. At the same time, the electrical connection terminal 12 is limited by the first circuit board part 131 and the first adhesive layer 6 from the peripheral side of the electrical connection terminal 12, which can reduce the risk of deformation or disengagement of the electrical connection terminal 12 from the mounting hole 11a when the whole machine is impacted. Moreover, along the axial direction of the first through hole 131a, part of the edge of the first metal layer m1 is aligned with the inner wall of the first through hole 131a. In this way, under the premise of a certain area and shape of the first metal layer m1, the first metal layer m1 can be closer to the first through hole 131a, and the fixed and electrical connection part between the transition piece 8 and the first metal layer m1 can also be closer to the first through hole 131a, which is conducive to reducing the orthographic projection area of the transition piece 8 on the first circuit board part 131 and improving the arrangement density of the electrical connection terminal 12.

[0111] The first metal layer m1 can be arranged around one side of the first through hole 131a, or can be located on one side, two sides or three sides of the first through hole 131a. The present application is exemplarily described by taking the first metal layer m1 arranged around one side of the first through hole 131a, which can improve the stability of the fixed and electrical connection between the transition piece 8 and the first circuit board part 131.

[0112] When the first metal layer m1 is arranged around one turn of the first through hole 131a, along the axial direction of the first through hole 131a, the inner edge of the first metal layer m1 can be aligned with the inner wall of the first through hole 131a as a whole, or part of the inner edge of the first metal layer m1 can be aligned with the inner wall of the first through hole 131a. The present application is exemplarily described by taking the inner edge of the first metal layer m1 as a whole to be aligned with the inner wall of the first through hole 131a. In this way, the area of the first metal layer m1 being certain, the area of the positive projection of the transition piece 8 on the first circuit board portion 131 can be further reduced, and the arrangement density of the electric connection terminals 12 can be improved.

[0113] In some embodiments, referring to FIG. 13, which is a schematic view of a cross-sectional structure of the shell assembly 1 according to some embodiments of the present application. In the present embodiment, the shell assembly 1 can further include a second metal layer m2. The material of the second metal layer m2 can be copper, copper alloy, aluminum alloy, or other metal. The second metal layer m2 is arranged on the inner wall of the first through hole 131a. The second metal layer m2 is connected with the first metal layer m1. The second metal layer m2 can reduce the gap between the side wall of the electric connection terminal 12 and the inner wall of the first through hole 131a, so as to further prevent the electric connection terminal 12 from being skewed or deformed in the first through hole 131a. Meanwhile, since the second metal layer m2 is connected with the first metal layer m1, the second metal layer m2 and the first metal layer m1 can be integrally formed, and the difficulty of forming can be reduced.

[0114] In some other embodiments, referring to FIG. 14, which is a schematic view of a cross-sectional structure of the shell assembly 1 according to some other embodiments of the present application. In the present embodiment, the shell assembly 1 can further include a third metal layer m3. The material of the third metal layer m3 can be copper, copper alloy, aluminum alloy, or other metal. The third metal layer m3 is arranged on the surface of the first circuit board portion 131 which faces away from the first metal layer m1, and the third metal layer m3 is connected with the second metal layer m2. In this way, the first through hole 131a, the first metal layer m1, the second metal layer m2, and the third metal layer m3 can be formed by a process of processing a metalized via, and the process of processing a metalized via is mature and easy to process.

[0115] The thickness of the welding material c can be less than or equal to 0.05 mm. For example, the thickness of the welding material c can be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, or 0.05 mm. In this way, the thickness of the welding material c is small, which is conducive to the thinness of the shell assembly 1 and can avoid interference with the components inside the shell 11.

[0116] The above embodiments are exemplarily described by taking the first circuit board part 131 adhered to the first region S1 by the first adhesive layer 6, based on which the second through hole 6a is provided on the first adhesive layer 6, and the second through hole 6a is opposite to and communicates with the first through hole 131a and the mounting hole 11a.

[0117] In some embodiments, the area of the second through hole 6a is generally larger than the area of the first through hole 131a. For example, the first through hole 131a and the second through hole 6a are both circular holes, and the radius of the second through hole 6a can be 0.2 mm larger than the radius of the first through hole 131a. In this way, in the process of adhering the first adhesive layer 6 to the first circuit board part 131 and adhering the first circuit board part 131 with the first adhesive layer 6 to the first region S1, the first adhesive layer 6 can be prevented from blocking the first through hole 131a due to assembly errors.

[0118] On the basis of the above embodiments, referring to FIG. 12, the part of the first circuit board part 131 opposite to the second through hole 6a is a second part N2, that is, the part of the first circuit board part 131 having a gap with the shell 11, and the gap will result in poor position stability of the second part N2 relative to the shell 11. Compared with the second part N2 in the related art shown in FIG. 11, the area of the second part N2 in the present embodiment is smaller, and under the premise of ensuring the position stability of the transition piece 8 relative to the shell 11, the setting area of the first metal layer m1 and the area of the orthographic projection of the transition piece 8 on the first circuit board part 131 can be designed to be smaller, so as to facilitate improving the setting density of the electrical connection terminal 12.

[0119] Moreover, in the present embodiment, no reinforcing plate is provided between the first circuit board part 131 and the first region S1, so that the stacking thickness of the shell assembly 1 is smaller, and the shell assembly 1 does not occupy too much space inside the shell, and does not greatly compress the size of other electronic components (such as a main control board or a battery) inside the shell 11.

[0120] In some embodiments, referring to FIG. 12, at least part of the transition piece 8, at least part of the first metal layer m1, at least part of the first circuit board part 131, and at least part of the first adhesive layer 6 are arranged in overlap, that is, the orthographic projections of the at least part of the transition piece 8, the at least part of the first metal layer m1, the at least part of the first circuit board part 131, and the at least part of the first adhesive layer 6 on the first region S1 overlap. In this way, at least part of the first metal layer m1 and at least part of the transition piece 8 are arranged on the part of the first circuit board part 131 opposite to the first adhesive layer 6, and there is no gap between this part of the first circuit board part 131 and the shell 11, so that the transition piece 8 driven by the electrical connection terminal 12 can be effectively prevented from being skewed.

[0121] In other embodiments, referring to FIG. 15, which is a schematic view of a cross section of a housing assembly 1 according to other embodiments of the present application. In the present embodiment, the housing assembly 1 can further include a reinforcing plate 7. The reinforcing plate 7 can have the same structure as the reinforcing plate 7 in any of the above embodiments, and thus will not be described again here.

[0122] The reinforcing plate 7 is disposed between the first circuit board portion 131 and the first adhesive layer 6, and is bonded to the first region S1 by the first adhesive layer 6. The thickness of the reinforcing plate 7 can be greater than or equal to 0.1 mm to ensure the structural strength of the reinforcing plate 7.

[0123] The reinforcing plate 7 is laminated with and fixed to the first circuit board portion 131. Optionally, the reinforcing plate 7 can be bonded and fixed to the circuit board 13 by a second adhesive layer 9. The second adhesive layer 9 can be a dispensing adhesive or a back adhesive. The thickness of the second adhesive layer 9 can be greater than or equal to 0.01 mm and less than or equal to 0.08 mm. Optionally, the thickness of the second adhesive layer 9 can be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, or 0.08 mm. In this way, the thickness of the second adhesive layer 9 is moderate, which can ensure the bonding strength of the reinforcing plate 7 and the first circuit board portion 131, and is also conducive to the thinning of the housing assembly 1.

[0124] The reinforcing plate 7 is provided with a third through hole 7a, which is opposite and communicates with the first through hole 131a, the second through hole 6a, and the mounting hole 11a, and a portion of the electrical connection terminal 12 is accommodated in the third through hole 7a.

[0125] In this way, the first circuit board portion 131, the reinforcing plate 7, the first adhesive layer 6, and the second adhesive layer 9 limit the electrical connection terminal 12 from the side of the electrical connection terminal 12, which can improve the limiting strength and reduce the risk of the electrical connection terminal 12 being skewed, deformed, or coming out of the mounting hole 11a when the whole machine is impacted.

[0126] In some embodiments, the area of the third through hole 7a is greater than the area of the first through hole 131a, and the area of the second through hole 6a is generally greater than the area of the third through hole 7a. For example, the first through hole 131a, the third through hole 7a, and the second through hole 6a are all circular holes, and the radius of the third through hole 7a can be 0.2 mm greater than the radius of the first through hole 131a, and the radius of the second through hole 6a can be 0.2 mm greater than the radius of the third through hole 7a. In this way, during the assembly of the first circuit board portion 131, the reinforcing plate 7, and the first adhesive layer 6, the reinforcing plate 7 can be prevented from blocking the first through hole 131a due to assembly errors, and the first adhesive layer 6 can be prevented from blocking the third through hole 7a due to assembly errors.

[0127] In some embodiments, referring to FIG. 15, at least a portion of the transition piece 8, at least a portion of the first metal layer m1, at least a portion of the first circuit board portion 131, at least a portion of the reinforcing plate 7, and at least a portion of the first adhesive layer 6 are arranged in an overlapping manner, that is, the orthographic projections of the at least a portion of the transition piece 8, the at least a portion of the first metal layer m1, the at least a portion of the first circuit board portion 131, the at least a portion of the reinforcing plate 7, and the at least a portion of the first adhesive layer 6 on the first region S1 overlap. In this way, at least a portion of the first metal layer m1 and at least a portion of the transition piece 8 are arranged on the portion of the first circuit board portion 131 opposite to the first adhesive layer 6 and the reinforcing plate 7, and there is no gap between the first circuit board portion 131 and the housing 11 at this portion, so that the inclination of the electrical connection terminal 12 caused by the transition piece 8 can be effectively prevented.

[0128] It should be noted that the embodiments shown in FIG. 15 are described in combination with the embodiments in which the housing assembly 1 includes the first metal layer m1, the second metal layer m2, and the third metal layer m3, and in other embodiments, the embodiments shown in FIG. 15 can also be described in combination with the embodiments in which the housing assembly 1 includes the first metal layer m1 and does not include at least one of the second metal layer m2 and the third metal layer m3, and this should not be considered as a special limitation to the present application.

[0129] The above embodiments are described by way of example with the transition piece 8 arranged on the side of the first circuit board portion 131 opposite to the first region S1. In other embodiments, the transition piece 8 can also be arranged between the first circuit board portion 131 and the first region S1. For example, referring to FIG. 16, which is a schematic view of the cross-sectional structure of the housing assembly 1 according to some embodiments of the present application. In this embodiment, the first metal layer m1 is arranged on the surface of the first circuit board portion 131 facing the first region S1, and the transition piece 8 is arranged between the first circuit board portion 131 and the first region S1. The transition piece 8 covers the first through-hole 131a and the first metal layer m1, and is fixed and electrically connected to the first metal layer m1. The end of the electrical connection terminal 12 facing the inner side of the housing 11 is fixed and electrically connected to the transition piece 8, so as to be electrically connected to the first circuit board portion 131 through the transition piece 8. In this way, the distance between the transition piece 8 and the first region S1 is short in the axial direction of the mounting hole, and the length of the electrical connection terminal 12 in the axial direction of the mounting hole 11a can be reduced, so that the electrical connection terminal 12 is less likely to be bent and deformed.

[0130] In the above embodiments, referring to FIG. 16, the inner surface of the first through-hole 131a can also be provided with the second metal layer m2, and the surface of the first circuit board portion 131 opposite to the first metal layer m1 can also be provided with the third metal layer m3. In other embodiments, the housing assembly 1 can not include one of the second metal layer m2 and the third metal layer m3.

[0131] In other embodiments, referring to FIG. 17, which is a schematic view of a cross-sectional structure of the shell assembly 1 according to some embodiments of the present application, in the embodiments, the shell assembly 1 further comprises a reinforcing plate 7. The reinforcing plate 7 is arranged on the side of the first circuit board portion 131 opposite to the first region S1, and is arranged in a stack with the first circuit board portion 131 and is fixedly connected with the first circuit board portion 131. Optionally, the reinforcing plate 7 can be fixedly connected with the circuit board 13 by means of the second adhesive layer 9. The second adhesive layer 9 can be a back adhesive or a point adhesive. In this way, the structural strength of the first circuit board portion 131 can be increased by means of the reinforcing plate 7, and the convenience of the assembly operation can be improved.

[0132] In the above embodiments, the reinforcing plate 7 can be provided with a third through hole 7a opposite and communicating with the first through hole 131a. The fixing and electrical connection operation between the transition piece 8 and the electrical connection terminal 12 can be performed through the third through hole 7a and the first through hole 131a.

[0133] The above embodiments are described by taking the fixing and electrical connection between the first circuit board portion 131 and the transition piece 8 by means of the first metal layer m1 as an example. In other embodiments, when the first circuit board portion 131 is fixedly connected with the first region S1 by means of the first adhesive layer 6, and the transition piece 8 is arranged on the side of the first circuit board portion 131 opposite to the first region S1, the fixing and electrical connection between the transition piece 8 and the first circuit board portion 131 can also be achieved by means of a pad.

[0134] Specifically, referring to FIG. 18, which is a schematic view of a cross-sectional structure of the shell assembly 1 according to some embodiments of the present application, in the embodiments, the first circuit board portion 131 is fixedly connected with the first region S1 by means of the first adhesive layer 6, and the first adhesive layer 6 is provided with a second through hole 6a opposite and communicating with the first through hole 131a and the mounting hole 11a. The transition piece 8 is arranged on the side of the first circuit board portion 131 opposite to the first region S1. The surface of the first circuit board portion 131 opposite to the first region S1 is provided with a pad a, the transition piece 8 covers the first through hole 131a and the pad a, and the transition piece 8 is fixedly and electrically connected with the pad a. For example, the transition piece 8 and the pad a can be welded by means of a welding material c to achieve the fixing and electrical connection therebetween.

[0135] In the above embodiment, the portion of the first circuit board portion 131 opposite to the second through hole 6a is the second portion N2, which is also the portion of the first circuit board portion 131 having a gap with the housing 11, and the gap will result in poor position stability of the second portion N2 relative to the housing 11. Compared with the second portion N2 in the related art shown in FIG. 11, the area of the second portion N2 in the embodiment is smaller, and under the premise of ensuring the position stability of the transition piece 8 relative to the housing 11, the setting area of the pad a and the area of the orthographic projection of the transition piece 8 on the first circuit board portion 131 can be designed to be smaller, so as to facilitate improving the setting density of the electrical connection terminal 12.

[0136] In some embodiments, referring to FIG. 18, the area of the inner hole a1 of the pad a can be greater than the area of the first through hole 131a. For example, the inner hole of the pad a and the first through hole 131a are both circular holes, and the radius of the inner hole of the pad a can be 0.2 mm greater than the radius of the first through hole 131a. In this way, during the processing of the first through hole 131a, the first through hole 131a can be prevented from being set on the pad a due to processing errors.

[0137] In some embodiments, referring to FIG. 18, the area of the second through hole 6a is generally greater than the area of the first through hole 131a. For example, the first through hole 131a and the second through hole 6a are both circular holes, and the radius of the second through hole 6a can be 0.2 mm greater than the radius of the first through hole 131a. In this way, during the process of bonding the first circuit board portion 131 to the first region S1 by using the first adhesive layer 6, the first adhesive layer 6 can be prevented from blocking the first through hole 131a due to assembly errors.

[0138] In some embodiments, referring to FIG. 18, at least a portion of the transition piece 8, at least a portion of the pad a, at least a portion of the first circuit board portion 131, and at least a portion of the first adhesive layer 6 are arranged in an overlapping manner, that is, the orthographic projections of the at least a portion of the transition piece 8, the at least a portion of the pad a, the at least a portion of the first circuit board portion 131, and the at least a portion of the first adhesive layer 6 on the first region S1 overlap. In this way, at least a portion of the pad a and at least a portion of the transition piece 8 are arranged on the portion of the first circuit board portion 131 opposite to the first adhesive layer 6, and there is no gap between this portion of the first circuit board portion 131 and the housing 11, so that the transition piece 8 driven by the electrical connection terminal 12 can be effectively prevented from being skewed.

[0139] Some embodiments of the present application also provide a processing method of the housing assembly 1. Referring to FIG. 19, FIG. 19 is a flowchart of the processing method of the housing assembly 1 provided by some embodiments of the present application, and the processing method includes the following steps S10-S60.

[0140] Step S10: A first through hole 131a is formed in the first circuit board portion 131, and a first metal layer m1 is formed on one surface of the first circuit board portion 131, and the edge of the first metal layer m1 is aligned with the inner wall of the first through hole 131a along the axial direction of the first through hole 131a.

[0141] In some embodiments, step S10 can include: forming a metal layer on one surface of the first circuit board portion 131; forming a first through hole 131a in the region of the first circuit board portion 131 where the metal layer is formed, and making the first through hole 131a penetrate the metal layer; and the part of the metal layer located at the periphery of the first through hole 131a forms the first metal layer m1. This processing method is simple and easy to implement.

[0142] In yet some embodiments, step S10 can include: forming a first through hole 131a in the first circuit board portion 131; forming a metal layer on the opposite two surfaces of the first circuit board portion 131 and the inner wall of the first through hole 131a; and the part of the metal layer located on one surface of the first circuit board portion 131 forms the first metal layer m1. This processing method is simple, and the metal layer will not be cut during the process of forming the first through hole 131a, so that burrs will not be generated. The process of forming the metal layer on the opposite two surfaces of the first circuit board portion 131 and the inner wall of the first through hole 131a can be electroplating process or chemical deposition process, which is not limited in the present application.

[0143] Step S20: A transition piece 8 is formed on the side of the first circuit board portion 131 where the first metal layer m1 is formed, so that the transition piece 8 covers the first through hole 131a and the first metal layer m1, and the transition piece 8 is fixed and electrically connected to the first metal layer m1.

[0144] In some embodiments, the transition piece 8 can be welded to the first metal layer m1 by welding process to achieve the fixation and electrical connection of the transition piece 8 and the first metal layer m1, so that a welding material is provided between the transition piece 8 and the first metal layer m1, and the welding material can be solder.

[0145] Step S30: A first adhesive layer 6 is formed on the surface of the first circuit board portion 131 opposite to the first metal layer m1 or the surface where the first metal layer m1 is formed, and the circuit board 13, the transition piece 8 and the first adhesive layer 6 form a circuit board assembly. Please refer to FIG. 20 and FIG. 21, FIG. 20 is a perspective view of the circuit board assembly obtained in the processing method of the housing assembly 1 shown in FIG. 19 from one perspective, and FIG. 21 is a perspective view of the circuit board assembly obtained in the processing method of the housing assembly 1 shown in FIG. 19 from another perspective.

[0146] In some embodiments, the first adhesive layer 6 can be a back adhesive, which is simple to assemble and is beneficial to improve the assembly efficiency. In other embodiments, the first adhesive layer 6 can also be a dispensing adhesive.

[0147] Step S40: An installation hole 11a is arranged on the shell 11 to communicate the inside and outside of the shell 11, and an electrical connection terminal 12 is arranged in the installation hole 11a. The area of the inner wall surface of the shell 11 where the installation hole 11a is located is a first area S1.

[0148] Step S50: The circuit board assembly is adhered to the first area S1 of the inner wall surface of the shell 11 by means of the first adhesive layer 6, and the transition piece 8 in the circuit board assembly is in contact with the end of the electrical connection terminal 12 that faces the inside of the shell 11.

[0149] Step S60: The transition piece 8 and the end of the electrical connection terminal 12 that faces the inside of the shell 11 are fixed and electrically connected together to obtain the shell assembly 1. Please refer to FIG. 22, which is a perspective view of the shell assembly obtained in the processing method of the shell assembly 1 shown in FIG. 19.

[0150] In some embodiments, in step S60, the transition piece 8 can be welded to the end of the electrical connection terminal 12 that faces the inside of the shell 11 by means of a laser welding process to realize the fixation and electrical connection of the transition piece 8 and the electrical connection terminal 12. The laser welding process is simple to operate and easy to realize.

[0151] In the processing method of the shell assembly 1 provided by the embodiments of the present application, the circuit board, the transition piece, and the first adhesive layer are assembled to form a circuit board assembly, and then the circuit board assembly is adhered to the shell provided with the electrical connection terminal as a whole, and the electrical connection terminal is in contact with the transition piece, and finally the electrical connection terminal and the transition piece are welded together. This assembly method is simple and convenient to operate.

[0152] In the above embodiments, step S40 can be executed before steps S50 and S60, and the sequence of step S40 and steps S10-S30 is not specifically limited.

[0153] In addition, in step S50, in order to ensure that the transition piece 8 can contact the end of the electrical connection terminal 12 facing the inner side of the housing 11, in some embodiments, the distance from the inner surface of the transition piece 8 to the surface of the first adhesive layer 6 facing away from the first circuit board portion 131 in the circuit board assembly is a first distance, wherein the inner surface of the transition piece 8 refers to the surface of the transition piece 8 facing the first region S1 when the circuit board assembly is assembled to the housing 11. The first distance can be less than the length of the electrical connection terminal 12 extending into the inner side of the housing 11. Alternatively, the difference between the length of the electrical connection terminal 12 extending into the inner side of the housing 11 and the first distance can be 0.05 mm. In this way, a certain amount of interference can be maintained to ensure that the transition piece 8 can contact the end of the electrical connection terminal 12 facing the inner side of the housing 11 when the circuit board assembly is assembled to the first region S1 of the housing 11.

[0154] Referring to FIG. 23, FIG. 23 is a structural schematic diagram of the housing assembly 1 shown in FIG. 12 applied to the electronic device 100 shown in FIG. 5. In this embodiment, the position stability of the electrical connection terminal 12 in the housing assembly 1 relative to the housing 11 and the electrical connection stability with the circuit board 13 are relatively good when the entire device is dropped or subjected to external impact, and the stable and reliable connection of the first electronic component 2 and the second electronic component 3 can be achieved.

[0155] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0156] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A housing assembly, characterized by, The application relates to a housing, an electric connection terminal, a circuit board and a transition piece. The housing is provided with a mounting hole which is communicated between the inside and outside of the housing, and the area of the mounting hole on the inner wall surface of the housing is a first area. The electric connection terminal is at least partially accommodated in the mounting hole. The circuit board comprises a first circuit board part which is located on the inside of the housing and fixed to the first area; the first circuit board part is provided with a first through hole which is opposite to the mounting hole; the surface of the first circuit board part which faces or is opposite to the first area is provided with a first metal layer; and the partial edge of the first metal layer is aligned with the inner wall surface of the first through hole along the axial direction of the first through hole. The transition piece is located on the side of the first circuit board part which is provided with the first metal layer; the transition piece covers the first through hole and the first metal layer, and is fixed and electrically connected to the first metal layer; and the end of the electric connection terminal which faces the inside of the housing is fixed and electrically connected to the transition piece.

2. The housing assembly of claim 1, wherein, The first metal layer is arranged on the surface of the first circuit board part which is opposite to the first area; the transition piece is located on the side of the first circuit board part which is opposite to the first area; and the electric connection terminal is partially accommodated in the first through hole.

3. The housing assembly of claim 1, wherein, The first metal layer is arranged on the surface of the first circuit board part which faces the first area; and the transition piece is located between the circuit board and the first area.

4. The housing assembly of any one of claims 1-3, wherein, Further comprising: A first adhesive layer is arranged between the first circuit board part and the first area; and the first circuit board part is adhesively fixed to the first area through the first adhesive layer.

5. The housing assembly of claim 4, wherein, The first adhesive layer is provided with a second through hole which is opposite to and communicated with the first through hole and the mounting hole; and the area of the second through hole is larger than that of the first through hole.

6. A housing assembly according to claim 4 or 5, wherein, At least part of the transition piece, at least part of the first metal layer, at least part of the first circuit board part and at least part of the first adhesive layer are arranged in an overlapping manner.

7. The housing assembly of claim 2, wherein, Further comprising: A reinforcing plate is arranged between the first circuit board part and the first area, and is arranged in a laminated manner and fixedly connected to the first circuit board part; the reinforcing plate is provided with a third through hole which is opposite to and communicated with the first through hole and the mounting hole; and the area of the third through hole is larger than that of the first through hole.

8. The housing assembly of claim 7, wherein, Further comprising: A first adhesive layer is arranged between the reinforcing plate and the first area; and the reinforcing plate is adhesively fixed to the first area through the first adhesive layer.

9. The housing assembly of claim 8, wherein, The first adhesive layer is provided with a second through hole which is opposite to and communicated with the first through hole, the third through hole and the mounting hole; and the area of the second through hole is larger than that of the third through hole.

10. The housing assembly of claim 8 or 9, wherein, At least part of the transition piece, at least part of the first metal layer, at least part of the first circuit board part, at least part of the reinforcing plate and at least part of the first adhesive layer are arranged in an overlapping manner.

11. The housing assembly of claim 3, wherein, Further comprising: A reinforcing plate is located on the side of the first circuit board portion opposite the first area, and is arranged in layers with the first circuit board portion and fixedly connected thereto. The reinforcing plate is provided with a third through hole, which is opposite and communicates with the first through hole.

12. The housing assembly of any one of claims 1-11, wherein, The first metal layer is arranged around the periphery of the through hole. In the axial direction of the first through hole, the entire inner edge of the first metal layer is aligned with the inner wall of the first through hole.

13. The housing assembly of any one of claims 1-12, wherein, The inner wall of the first through hole is provided with a second metal layer, which is connected to the first metal layer.

14. The housing assembly of claim 13, wherein, The surface of the first circuit board portion opposite the first metal layer is further provided with a third metal layer, which is connected to the second metal layer.

15. The housing assembly of any one of claims 1-14, wherein, The circuit board is an FPC.

16. A housing assembly characterized by, Comprising: A housing is provided with a mounting hole, which communicates the inside and outside of the housing. The area on the inner wall of the housing where the mounting hole is located is a first area. An electrical connection terminal, part of which is accommodated in the mounting hole. A circuit board comprising a first circuit board portion, which is located on the inner side of the housing and is bonded to the first area by means of a first adhesive layer. The first circuit board portion is provided with a first through hole, and the first adhesive layer is provided with a second through hole. The first through hole, the second through hole, and the mounting hole are opposite and communicate with each other. Another part of the electrical connection terminal is accommodated in the first through hole and the second through hole. The surface of the first circuit board portion opposite the first area is provided with a solder pad. A transition piece is located on the side of the first circuit board portion opposite the first area. The transition piece covers the first through hole and the solder pad and is fixedly and electrically connected to the solder pad. The end of the electrical connection terminal facing the inner side of the housing is fixedly and electrically connected to the transition piece.

17. The housing assembly of claim 16, wherein, The area of the second through hole is greater than the area of the first through hole.

18. The housing assembly of claim 16 or 17, wherein, The first adhesive layer is a back adhesive.

19. An electronic device, comprising: Comprising: A first electronic component; The housing assembly of any one of claims 1-18, the first electronic component is arranged on the inner side of the housing 11 in the housing assembly, and the first electronic component is electrically connected to the electrical connection terminal by means of the circuit board in the housing assembly.

20. The electronic device of claim 19, wherein, The electronic device comprises a watch body and a watchband connected to the watch body, and the watchband is provided with a second electronic component; The housing assembly is arranged on the watch body, and the electrical connection terminal of the housing assembly is electrically connected to the second electronic component.

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