Temperature measuring assembly, wearable device, and temperature measuring method

Abstract

A temperature measuring assembly, a wearable device, and a temperature measuring method The temperature measuring assembly comprises a first device and a second device; the first device and the second device are spaced in a first direction, a heat conduction member extending in the first direction and connected to the first device and the second device and a heat insulation layer surrounding the heat conduction member are arranged between the first device and the second device, and the first direction is perpendicular to the skin surface of a subject; the first device comprises a heat conductivity sensor and a first temperature sensor, and the first temperature sensor is used for measuring the temperature of the skin surface; the second device comprises a second temperature sensor. By means of the temperature collected by the first temperature sensor, the second temperature sensor, the heat conductivity of the heat conduction member, and the heat conductivity at the preset depth below the skin surface of the subject, the temperature measuring assembly can accurately measure the temperature at a preset depth below the skin surface of the subject.

Description

Temperature measurement assembly, wearable device and temperature measurement method

[0001] The present application claims priority to the Chinese patent application No. 202410652392.3, filed on May 22, 2024, and entitled "Temperature measurement assembly, wearable device and temperature measurement method", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of temperature measurement, and in particular to a temperature measurement assembly, a wearable device and a temperature measurement method. BACKGROUND

[0003] With the development of electronic technology, the means of body temperature testing has become increasingly diversified. At present, the body temperature of a person can be detected by contacting a temperature measurement assembly with the surface layer of the skin of the person, but the existing temperature measurement assembly is not accurate when measuring the body temperature of a person. SUMMARY

[0004] The present application provides a temperature measurement assembly, a wearable device and a temperature measurement method that can improve the accuracy of temperature measurement.

[0005] In a first aspect, the present application provides a temperature measurement assembly, comprising a first device and a second device; the first device and the second device are arranged at intervals along a first direction, and a heat conduction member extending along the first direction and connected with the first device and the second device and a thermal insulation layer surrounding the heat conduction member are arranged between the first device and the second device, the first direction being perpendicular to the surface layer of the skin of a person to be measured; the first device comprises a thermal conductivity sensor and a first temperature sensor, and the first temperature sensor is used to measure the temperature of the surface layer of the skin; the second device comprises a second temperature sensor.

[0006] In this scheme, the thermal conductivity sensor collects the thermal conductivity of the person to be measured, and the temperature collected by the first temperature sensor, the second temperature sensor, the thermal conductivity of the heat conduction member and the thermal conductivity of the person to be measured at a predetermined thickness from the surface layer of the skin can accurately measure the temperature at a predetermined thickness from the surface layer of the skin of the person to be measured. In the process of temperature measurement by the temperature measurement assembly, heat is transferred from the person to be measured at a predetermined thickness from the surface layer of the skin to the first temperature sensor and the second temperature sensor, and the thermal insulation layer can constrain the heat in the heat conduction member from diffusing towards the periphery of the thermoelectric element, so that the heat is transferred in the first direction in the heat conduction member, which can reduce the interference of the ambient temperature on the heat transfer of the heat conduction member, and can improve the accuracy of temperature measurement by the temperature measurement assembly.

[0007] With reference to the first aspect, in a possible implementation manner, the temperature measurement assembly further comprises a protective cover for heat insulation, and the protective cover is arranged on a side of the second device away from the first device. The protective cover can constrain the heat conduction element from diffusing when the heat conduction element transmits heat to the second temperature sensor, can reduce the interference of the ambient temperature on the heat conduction element in transmitting heat, and can improve the temperature measurement accuracy of the temperature measurement assembly.

[0008] With reference to the first aspect, in a possible implementation manner, the thermal conductivity of the heat conduction element is greater than the thermal conductivity of the material of the heat insulation layer. The difference in thermal conductivity between the heat conduction element and the heat insulation layer can make the heat preferentially transmit in the first direction, and the heat insulation layer can constrain the heat from diffusing from the periphery of the heat conduction element, thereby improving the temperature measurement accuracy of the temperature measurement assembly.

[0009] With reference to the first aspect, in a possible implementation manner, the thermal conductivity of the heat insulation layer is less than or equal to 0.1 W / m·K. The smaller the thermal conductivity of the heat insulation layer, the more conducive to constraining the heat of the heat conduction element from diffusing along the periphery, and the more conducive to improving the temperature measurement accuracy of the temperature measurement assembly.

[0010] With reference to the first aspect, in a possible implementation manner, the thermal conductivity of the heat conduction element is between 0.1 W / m·K and 1 W / m·K. If the thermal conductivity of the heat conduction element is too small, for example, less than 0.1 W / m·K, the heat conduction element is difficult to effectively transmit heat in the first direction, which reduces the temperature measurement accuracy of the temperature measurement assembly. If the thermal conductivity of the heat conduction element is too large, the temperature measured by the first temperature sensor and the temperature measured by the second temperature sensor can have no obvious difference, and the temperature measurement assembly cannot accurately calculate the temperature at the preset depth from the skin surface of the subject.

[0011] With reference to the first aspect, in a possible implementation manner, the heat conduction element comprises at least one of polydimethylsiloxane, silicone rubber, electronic heat-conducting pouring sealant, imide, polyethylene, phenolic resin, and polyurethane.

[0012] With reference to the first aspect, in a possible implementation manner, the heat insulation layer comprises at least one of general-purpose polystyrene, foamed polystyrene, heat insulation cotton, foamed polyurethane, foamed polyvinyl chloride, foamed polyethylene, foamed phenolic resin, rock wool felt, glass wool felt, aluminum silicate cotton felt, and aerogel.

[0013] With reference to the first aspect, in a possible implementation manner, the first device further comprises a first circuit board, and the thermal conductivity sensor and the first temperature sensor are arranged on the first circuit board.

[0014] With reference to the first aspect, in a possible implementation manner, a projection of the thermal conductivity sensor in the first direction does not overlap with a projection of the first temperature sensor in the first direction. When the thermal electric conductivity sensor measures the thermal electric conductivity of the subject, the thermal conductivity sensor generates heat to transfer heat to the subject according to the first aspect. If the projection of the first temperature sensor in the first direction overlaps with the projection of the thermal conductivity sensor in the first direction, the first temperature sensor will interfere with the heat transfer of the thermal electric conductivity sensor in the first direction, which is not conducive to the accurate measurement of the thermal conductivity of the subject by the thermal electric conductivity sensor.

[0015] With reference to the first aspect, in a possible implementation manner, the number of the first temperature sensors is a plurality, and the plurality of first temperature sensors surround the thermal conductivity sensor. The area where the thermal conductivity sensor is located is an area where the plurality of first temperature sensors measure temperature. The thermal conductivity sensor transfers heat to the subject, and the thermal conductivity of the subject is measured. When the first temperature sensor measures the temperature of the skin surface layer of the subject, the subject transfers heat to the area surrounded by the plurality of first temperature sensors, so that the area where the thermal conductivity sensor is located and the area surrounded by the plurality of first temperature sensors are the same area, which can effectively reduce the temperature measurement error of the temperature measurement assembly.

[0016] With reference to the first aspect, in a possible implementation manner, the second device further includes a second circuit board, and the number of the second temperature sensors is a plurality, and the plurality of second temperature sensors are arranged on the second circuit board and surround a circle. In the temperature measurement process of the temperature measurement assembly, the heat of the subject is transferred to the plurality of second temperature sensors along the first direction. The plurality of second temperature sensors surround a circle, which can more uniformly collect the temperature of the heat conduction member in the surrounding area of the plurality of second temperature sensors, and can reduce the accidental error of the temperature measurement assembly.

[0017] With reference to the first aspect, in a possible implementation manner, along the first direction, projections of the plurality of first temperature sensors overlap with projections of the plurality of second temperature sensors.

[0018] With reference to the first aspect, in a possible implementation manner, the temperature measurement assembly further includes a contact surface in contact with the skin surface layer, and a material of the contact surface is sapphire. Sapphire can make the temperature measurement assembly have better touch feeling. Sapphire also has good thermal conductivity and high heat uniformity, which can reduce the temperature measurement error of the temperature measurement assembly.

[0019] With reference to the first aspect, in a possible implementation manner, the temperature measurement assembly further includes a processor configured to acquire information collected by the thermal conductivity sensor, the first temperature sensor and the second temperature sensor. The processor can calculate the temperature at a preset depth from the skin surface layer in the subject according to the information collected by the thermal conductivity sensor, the first temperature sensor and the second temperature sensor.

[0020] In a second aspect, the present application provides a wearable device, the wearable device comprising the temperature measurement assembly according to the first aspect.

[0021] In a third aspect, the present application provides a temperature measurement method, the temperature measurement method being applied to the temperature measurement assembly according to the first aspect, the temperature measurement method comprising:

[0022] acquiring, by a thermal conductivity sensor, a thermal conductivity of the subject; acquiring, by the first temperature sensor, a first temperature of the skin surface layer;

[0023] acquiring, by a second temperature sensor, a second temperature of the end of the heat conduction member away from the first device;

[0024] obtaining, by a processor, a temperature of a set thickness of the subject based on the first temperature, the second temperature, the thermal conductivity of the subject and the thermal conductivity of the heat conduction member.

[0025] With reference to the third aspect, in a possible implementation manner, the thermal conductivity sensor is configured to generate and transmit electric heat to the skin surface layer, and the acquiring, by the thermal conductivity sensor, of the thermal conductivity of the subject comprises:

[0026] acquiring, by the first temperature sensor, a temperature change value of the skin surface layer of the subject within a set time;

[0027] obtaining, by the processor, the thermal conductivity of the subject based on the temperature change value, an electric heat parameter of the thermal conductivity sensor and a projection area of the thermal conductivity sensor on the skin surface layer.

[0028] With reference to the third aspect, in a possible implementation manner, the electric heat parameter of the thermal conductivity sensor comprises voltage and current, and the obtaining, by the processor, of the thermal conductivity of the subject based on the temperature change value, the electric heat parameter of the thermal conductivity sensor and the projection area of the thermal conductivity sensor on the skin surface layer comprises:

[0029] obtaining, by the processor, heat flow based on the voltage, the current and the projection area of the thermal conductivity sensor on the skin surface layer;

[0030] obtaining, by the processor, thermal resistance of the subject based on the temperature change value and the heat flow;

[0031] obtaining, by the processor, a slope of the subject based on the thermal resistance and a square root of the set time;

[0032] obtaining, by the processor, the thermal conductivity of the subject based on a linear relationship between the slope of the subject and the thermal conductivity of the subject.

[0033] In the scheme, the linear relationship between the slope of the to-be-tested person and the thermal conductivity of the to-be-tested person is obtained by fitting the slope-thermal conductivity coordinates of a plurality of skin-imitating materials, the thermal conductivity of the to-be-tested person is obtained by using this mode, the calculation amount of the processor can be greatly reduced, the response speed of the processor is improved, and meanwhile, the temperature measuring assembly has a wider application scenario. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0035] Fig. 1 is a structural schematic diagram of a watch according to an embodiment of the present application;

[0036] Fig. 2 is a structural schematic diagram of a temperature measuring assembly according to an embodiment of the present application;

[0037] Fig. 3 is an exploded schematic diagram of a temperature measuring assembly according to an embodiment of the present application;

[0038] Fig. 4 is a structural schematic diagram of a temperature measuring device according to an embodiment of the present application;

[0039] Fig. 5 is a flow schematic diagram of a temperature measuring method according to an embodiment of the present application;

[0040] Fig. 6 is a coordinate diagram of time-temperature change values of a plurality of skin-imitating materials according to an embodiment of the present application;

[0041] Fig. 7 is a coordinate diagram of time square root-thermal resistance of a plurality of skin-imitating materials according to an embodiment of the present application;

[0042] Fig. 8 is a coordinate diagram of thermal conductivity-slope of a plurality of skin-imitating materials according to an embodiment of the present application.

[0043] Legend: 100, temperature measuring assembly; 110, first device; 111, first circuit board; 112, first temperature sensor; 113, thermal conductivity sensor; 120, second device; 121, second circuit board; 122, second temperature sensor; 130, heat conducting piece; 140, heat insulation layer; 150, protective cover; 160, processor; 161, control board; 162, acquisition board; 170, contact surface; 180, signal transmission flat cable; 200, watch body. DETAILED DESCRIPTION

[0044] With the development of electronic technology, the temperature testing means has been increasingly diversified, and various technical means such as infrared temperature measurement, thermocouple temperature measurement and thermal resistance temperature measurement have emerged. The testing sites have also developed from the oral cavity, armpit and rectum to the esophagus, eardrum, ear canal and nasal cavity. At present, if the deep temperature of a specific organ (such as the heart, brain, etc.) of the human body needs to be accurately measured, a relatively effective method is to insert a sensitive element into the specific organ for minimally invasive measurement. However, from a clinical point of view, the invasive measurement makes the patient feel painful, causes bleeding and increases the possibility of infection. For some organs such as the heart and brain, even minimal damage is unacceptable. If a temperature measurement assembly that contacts the skin is used to measure the body temperature, the temperature error of the temperature measurement will be relatively large due to the influence of factors such as environmental temperature difference, blood flow and water content of the skin, and the core temperature of the human body cannot be accurately measured.

[0045] In view of this, the present application provides a temperature measurement assembly, a wearable device and a temperature measurement method. The temperature measurement assembly can accurately measure the core temperature of the human body by contacting the skin of the human body.

[0046] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be described in further detail below with reference to the drawings.

[0047] The present application discloses a wearable device, which comprises a temperature measurement assembly and a body for fixing the temperature measurement assembly. It should be noted that the temperature measurement assembly protrudes from the body. When measuring the body temperature of a human body, the temperature measurement assembly can directly contact the skin surface of the measured person to measure the body temperature of the measured person.

[0048] In the embodiments provided by the present application, the wearable device can be a watch, earphone, etc. The present application does not specifically limit the specific product type of the wearable device.

[0049] Please refer to FIG. 1. For the convenience of understanding, taking the wearable device as a watch as an example, the watch comprises a watch body 200 and a temperature measurement assembly 100. The watch body 200 fixes the temperature measurement assembly 100. Part of the temperature measurement assembly 100 protrudes from the watch body 200. The area of the temperature measurement assembly 100 that protrudes from the watch body 200 can contact the skin surface of the measured person.

[0050] Please refer to FIG. 2 and FIG. 3. The temperature measurement assembly 100 comprises a first device 110 and a second device 120. The first device 110 and the second device 120 are arranged at intervals along a first direction. A heat-conducting member 130 extending along the first direction and connected with the first device 110 and the second device 120 and a heat-insulating layer 140 surrounding the heat-conducting member 130 are arranged between the first device 110 and the second device 120. The first direction is perpendicular to the skin surface of the measured person.

[0051] The first device 110 comprises a thermal conductivity sensor 113 and a first temperature sensor 112 for measuring the temperature of the skin surface layer.

[0052] The second device 120 comprises a second temperature sensor 122.

[0053] In the embodiments provided in the present application, the thermal conductivity sensor 113 is used to measure the thermal conductivity of the skin surface layer, and the second temperature sensor 122 is used to measure the temperature of the end of the heat conduction member 130 away from the first device 110.

[0054] In the embodiments provided in the present application, the thermal conductivity of the person to be measured can be measured by the thermal conductivity sensor 113, the first temperature of the skin surface layer of the person to be measured can be measured by the first temperature sensor 112, and the second temperature of the end of the heat conduction member away from the first device 110 can be measured by the second temperature sensor 122.

[0055] When the third temperature of the human body at a preset thickness from the skin surface layer is measured by the temperature measurement assembly 100, the heat of the human body is transmitted to the first temperature sensor 112 through the skin, and the heat of the human body is also transmitted to the second temperature sensor 122 through the skin and the heat conduction member 130.

[0056] The thermal conductivity of the heat conduction member 130 is known, the thermal conductivity of the heat conduction member 130 is determined by the material of the heat conduction member 130, the thickness of the heat conduction member 130 is known, the heat conduction member 130 transmits heat along the thickness direction, the cross-sectional area of the heat conduction member 130 along the thickness direction is known, and the thermal resistance of the heat conduction member 130 can be calculated according to the thickness of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the thermal conductivity of the heat conduction member 130.

[0057] The thermal conductivity of the person to be measured is collected by the thermal conductivity sensor 113, and the thermal resistance of the person to be measured can be calculated according to the preset thickness from the skin surface layer of the person to be measured and the area of the skin surface layer of the person to be measured for transmitting heat. The area of the skin surface layer of the person to be measured for transmitting heat includes the area of the region collected by the first temperature sensor 112.

[0058] In a possible implementation, the temperature measurement assembly 100 can comprise a processor 160, which can be integrated into the first device 110 or the second device 120, and the processor 160 is configured to acquire information collected by the thermal conductivity sensor 113, the first temperature sensor 112, and the second temperature sensor 122. The information collected by the thermal conductivity sensor 113, the first temperature sensor 112, and the second temperature sensor 122 can include the thermal conductivity, the first temperature, and the second temperature of the person to be measured.

[0059] The processor 160 can calculate the thermal resistance of the heat conduction member 130 according to the thickness of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the thermal conductivity of the heat conduction member 130, and can calculate the thermal resistance of the subject at the preset thickness from the skin surface according to the preset thickness of the subject from the skin surface and the area of the skin surface of the subject, and can calculate the third temperature according to the first temperature, the second temperature, the thermal resistance of the subject at the preset thickness from the skin surface, and the thermal resistance of the heat conduction member 130. It can be understood that in the present application, the processor 160 obtains the thermal conductivity of the subject, the first temperature and the second temperature, and the processor 160 can calculate the third temperature according to the thermal conductivity of the subject, the first temperature, the second temperature, the thermal conductivity of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the area of the region collected by the first temperature sensor 112.

[0060] In another possible implementation, please refer to FIG. 4, the temperature measurement assembly 100 is applied to a temperature measurement device, and the temperature measurement device further comprises a processor 160 which is arranged outside the temperature measurement assembly 100, and the processor 160 is electrically connected with the first temperature sensor 112, the second temperature sensor 122 and the thermal conductivity sensor 113. The processor 160 can obtain the information collected by the first temperature sensor 112, the second temperature sensor 122 and the thermal conductivity sensor 113, and can calculate the thermal resistance of the heat conduction member 130 according to the thickness of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the thermal conductivity of the heat conduction member 130. The processor 160 can also calculate the thermal resistance of the subject at the preset thickness from the skin surface according to the preset thickness of the subject from the skin surface and the area of the skin surface of the subject, and can calculate the third temperature according to the first temperature, the second temperature, the thermal resistance of the subject at the preset thickness from the skin surface, and the thermal resistance of the heat conduction member 130. It can be understood that in the present application, the processor 160 obtains the thermal conductivity of the subject, the first temperature and the second temperature, and the processor 160 can calculate the third temperature according to the thermal conductivity, the first temperature, the second temperature, the thermal conductivity of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the area of the region collected by the first temperature sensor 112.

[0061] In the embodiments provided in the present application, the processor 160 comprises a control board 161 and a collection board 162, the control board 161 and the collection board 162 are electrically connected with the first temperature sensor 112 through the signal transmission cable 180, the control board 161 and the collection board 162 are electrically connected with the thermal conductivity sensor 113 through the signal transmission cable 180, and the control board 161 and the collection board 162 are also electrically connected with the thermal conductivity sensor 113 through the signal transmission cable 180.

[0062] In the embodiments provided in the present application, the acquisition board 162 is integrated with a switch matrix, a current source module and a voltage acquisition module, and the switch matrix can control the opening and closing of the first temperature sensor 112, the opening and closing of the second temperature sensor 122 and the opening and closing of the thermal conductivity sensor 113.

[0063] The current source module can supply power for the thermal conductivity sensor 113, for example, can provide a precision current of 50 mA, and the voltage acquisition module acquires the real-time voltage of the thermal conductivity sensor 113.

[0064] In the embodiments provided in the present application, in the case of obtaining the thermal conductivity of the person to be measured, the temperature measurement assembly 100 can obtain the third temperature at a preset thickness from the skin surface layer of the person to be measured according to the first temperature, the second temperature, the thermal conductivity of the heat conduction member 130, and the thermal conductivity of the person to be measured.

[0065] In the process of heat transfer from the person to be measured at a preset thickness from the skin surface layer to the second sensor, the heat flux density of the heat conduction member 130 is equal to the heat flux density of the skin tissue of the person to be measured, and the specific formula for calculating the third temperature is as follows:

[0066] After transformation, we have:

[0067] Where T core is the third temperature, T bottom is the first temperature, T top is the second temperature, R tissue is the thermal resistance of the heat transfer at a preset thickness from the person to be measured, and R partition is the thermal resistance of the heat conduction member 130.

[0068] The processor 160 can calculate the thermal resistance of the heat conduction member 130 according to the thickness of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the thermal conductivity of the heat conduction member 130. The processor 160 can also calculate the thermal resistance at a preset thickness from the skin surface layer of the person to be measured according to the preset thickness from the skin surface layer of the person to be measured and the area of the skin surface layer of the person to be measured. The processor 160 can calculate the third temperature according to the first temperature, the second temperature, the thermal resistance at a preset thickness from the skin surface layer of the person to be measured, and the thermal resistance of the heat conduction member 130. It can be understood that in the present application, the processor 160 obtains the thermal conductivity of the person to be measured, the first temperature and the second temperature, and the processor 160 can calculate the third temperature T core .

[0069] In the embodiments provided in the present application, continuing to refer to FIG. 3, the heat insulation layer 140 surrounds the heat conduction member 130, the heat insulation layer 140 can constrain the heat diffusion from the periphery of the heat conduction member 130, so that the heat is transmitted in the first direction when the heat is transmitted on the heat conduction member 130, the measurement error of the second temperature sensor 122 can be reduced, the influence of the ambient temperature on the temperature measurement assembly 100 can also be reduced, the accuracy of the temperature measurement assembly 100 when measuring the temperature is improved, and the temperature measurement result of the temperature measurement assembly 100 has repeatability. It should be noted that the temperature measurement result of the temperature measurement assembly 100 has repeatability, the temperature measurement assembly 100 is less disturbed by the measurement environment or other factors, and the measurement result obtained by repeated measurement by the temperature measurement assembly 100 will not have a large deviation.

[0070] In the embodiments provided in the present application, the thermal conductivity of the heat conduction member 130 is greater than the thermal conductivity of the heat insulation layer 140. The difference in thermal conductivity between the heat conduction member 130 and the heat insulation member can make the heat preferentially transmit in the first direction, and the heat insulation member can constrain the heat diffusion from the periphery of the heat conduction member 130, which is beneficial to improve the temperature measurement accuracy of the temperature measurement assembly 100.

[0071] The thermal conductivity of the heat insulation layer 140 is less than or equal to 0.1 W / m·K, and the thermal conductivity of the heat conduction member 130 is between 0.1 W / m·K and 1 W / m·K.

[0072] The heat conduction member 130 can be made of any heat-conducting and insulating material with a thermal conductivity between 0.1 W / m·K and 1 W / m·K. The material of the heat conduction member 130 can include at least one of polydimethylsiloxane, silicone rubber, electronic heat-conducting pouring sealant, imide, polyethylene, phenolic resin, and polyurethane. It can be understood that the material of the heat conduction member 130 can be a combination of one or more of polydimethylsiloxane, silicone rubber, electronic heat-conducting pouring sealant, imide, polyethylene, phenolic resin, and polyurethane.

[0073] The thickness of the heat conduction member 130 in the first direction can be between 2 mm and 4 mm. If the heat conduction member 130 is too thick (greater than 4 mm), the heat transmission time in the heat conduction member 130 will be longer, the response time of the second temperature sensor 122 will be longer, and the response time of the temperature measurement assembly 100 when measuring the temperature will be increased. At the same time, the heat loss in the heat conduction member 130 will be more serious, which will reduce the sensitivity of the second temperature sensor 122 when measuring the temperature, and further reduce the sensitivity of the temperature measurement assembly 100 when measuring the temperature. If the heat conduction member 130 is too thin (less than 2 mm), the heat loss when the heat is transmitted in the heat conduction member 130 is too low, the difference between the first temperature measured by the first temperature sensor 112 and the second temperature measured by the second temperature sensor 122 is small, and the temperature measurement assembly 100 is difficult to accurately calculate the third temperature of the person to be measured.

[0074] The thermal insulation layer 140 comprises at least one of general-purpose polystyrene, foamed polystyrene, thermal insulation cotton, foamed polyurethane, foamed polyvinyl chloride, foamed polyethylene, foamed phenolic resin, rock wool felt, glass wool felt, aluminum silicate cotton felt and aerogel. It can be understood that the thermal insulation layer 140 can be one or more combinations of general-purpose polystyrene, foamed polystyrene, thermal insulation cotton, foamed polyurethane, foamed polyvinyl chloride, foamed polyethylene, foamed phenolic resin, rock wool felt, glass wool felt, aluminum silicate cotton felt and aerogel.

[0075] The thickness of the thermal insulation layer 140 along the first direction is greater than or equal to the thickness of the heat conduction member 130 along the first direction, so that the thermal insulation layer 140 can better constrain the heat of the heat conduction member 130 from diffusing from the periphery. In a possible implementation, a through hole is formed in the thermal insulation layer 140 along the thickness direction, and a thermally conductive insulating material is poured into the through hole to form the heat conduction member 130. It can be obtained that the thickness of the thermal insulation layer 140 along the first direction determines the thickness of the heat conduction member 130 along the first direction, and the size of the thermal insulation layer 140 along the first direction is 2mm-4mm.

[0076] In the embodiments provided in the present application, the temperature measurement assembly 100 further comprises a protective cover 150, which is arranged on the side of the second device 120 away from the first device 110.

[0077] The material of the protective cover 150 can be consistent with the material of the thermal insulation layer 140, and the material of the protective cover 150 can comprise at least one of general-purpose polystyrene, foamed polystyrene, thermal insulation cotton, foamed polyurethane, foamed polyvinyl chloride, foamed polyethylene, foamed phenolic resin, rock wool felt, glass wool felt, aluminum silicate cotton felt and aerogel. It can be understood that the protective cover 150 can be one or more combinations of general-purpose polystyrene, foamed polystyrene, thermal insulation cotton, foamed polyurethane, foamed polyvinyl chloride, foamed polyethylene, foamed phenolic resin, rock wool felt, glass wool felt, aluminum silicate cotton felt and aerogel.

[0078] The greater the thickness of the protective cover 150 along the first direction, the better, and the thickness of the protective cover 150 along the first direction is generally greater than 2mm. Since the space occupied by the protective cover 150 in the temperature measurement assembly 100 needs to be considered, the thickness of the protective cover 150 along the first direction can be set according to the size of the temperature measurement assembly 100.

[0079] In the embodiments provided in the present application, the temperature measurement assembly 100 further comprises a contact surface 170, which is used to contact the skin surface of the person to be measured, and the material of the contact surface 170 can be sapphire.

[0080] The greater the thermal conductivity of the contact surface 170, the more conducive to improving the accuracy of the first temperature sensor 112, and thus the accuracy of the temperature measurement assembly 100 in measuring the third temperature. The thermal conductivity of the contact surface 170 is greater than or equal to 30W / (m·K).

[0081] The greater the area of the contact surface 170, the greater the contact surface 170 and the subject to be measured, the greater the accuracy of the first temperature sensor 112, and the greater the temperature measurement accuracy of the temperature measurement assembly 100. For example, the contact surface 170 is circular, the diameter of the contact surface 170 is greater than or equal to ≥ 20 mm, and the smaller the thickness of the contact surface 170, the smaller the heat loss in the contact surface 170, the greater the accuracy of the first temperature sensor 112 temperature measurement, and the greater the temperature measurement accuracy of the temperature measurement assembly 100.

[0082] In the embodiments provided in the present application, the first device 110 further comprises a first circuit board 111, and the thermal conductivity sensor 113 and the first temperature sensor 112 are arranged on the first circuit board 111. The thermal conductivity sensor 113 is arranged between the first circuit board 111 and the thermal insulation layer 140, and the side of the thermal conductivity sensor 113 away from the first circuit board 111 directly contacts the thermal insulation layer 140.

[0083] The thermal conductivity sensor 113 is electrically connected to the first circuit board 111. The first circuit board 111 can use polyimide as a substrate. In the first direction, the thermal conductivity sensor 113 and the first temperature sensor 112 can be arranged on the same side of the first circuit board 111, and the thermal conductivity sensor 113 and the first temperature sensor 112 can also be arranged on opposite sides of the first circuit board 111 in the first direction.

[0084] In the embodiments provided in the present application, the number of first temperature sensors 112 is multiple, and the projection of the multiple first temperature sensors 112 in the first direction can surround the thermal conductivity sensor 113. The multiple first temperature sensors 112 can be arranged in a circular region, and the temperature measured by the multiple first temperature sensors 112 is the temperature of the circular region surrounded by the multiple first temperature sensors 112. The first temperature is the average of the temperatures measured by the multiple first temperature sensors 112.

[0085] In the embodiments provided in the present application, the second device 120 further comprises a second circuit board 121, and the second temperature sensor 122 is arranged on the second circuit board 121 and surrounds a circle. The second circuit board 121 can use a polyimide substrate.

[0086] The projection of the region surrounded by the multiple second temperature sensors 122 in the first direction overlaps the region surrounded by the multiple first temperature sensors 112. The second temperature is the average of the temperatures measured by the multiple second temperature sensors 122.

[0087] The second temperature sensors 122 correspond to the first temperature sensors 112 one by one, and the projection of the second temperature sensors 122 in the first direction overlaps the projection of the corresponding first temperature sensors 112 in the first direction.

[0088] The number of the first temperature sensors 112 can be 3, 4, 5, 6, 7, 8 or more, and the application does not specifically limit the number of the first temperature sensors 112.

[0089] Correspondingly, the number of the second temperature sensors 122 can be 3, 4, 5, 6, 7, 8 or more, and the application does not specifically limit the number of the second temperature sensors 122. The number of the first temperature sensors and the second temperature sensors is corresponding.

[0090] In the embodiments provided in the application, the opening and closing of the plurality of first temperature sensors 112 and the plurality of second temperature sensors 122 are controlled by the switch matrix.

[0091] Please refer to FIG. 5, the application also provides a temperature measurement method, the temperature measurement method comprises:

[0092] S101, collecting the thermal conductivity of the person to be measured by the thermal conductivity sensor, and collecting the first temperature of the skin surface layer by the first temperature sensor;

[0093] S102, collecting the second temperature of the end of the heat conduction piece away from the first device by the second temperature sensor;

[0094] S103, obtaining the temperature of the set thickness of the person to be measured by the processor based on the first temperature, the second temperature, the thermal conductivity of the person to be measured and the thermal conductivity of the heat conduction piece.

[0095] The thermal conductivity sensor 113 is used to generate electric heat and transmit the electric heat to the skin surface layer, and the collection of the thermal conductivity of the person to be measured by the thermal conductivity sensor 113 comprises:

[0096] Obtaining the temperature change value of the skin surface layer of the person to be measured within a set time by the first temperature sensor 112;

[0097] Obtaining the thermal conductivity of the person to be measured by the processor 160 based on the temperature change value, the electric heat parameter of the thermal conductivity sensor 113 and the projection area of the thermal conductivity sensor 113 on the skin surface layer.

[0098] The electric heat parameter of the thermal conductivity sensor 113 includes voltage and current, and the thermal conductivity of the person to be measured is obtained by the processor 160 based on the temperature change value, the electric heat parameter of the thermal conductivity sensor 113 and the projection area of the thermal conductivity sensor 113 on the skin surface layer, comprising:

[0099] obtaining, by the processor 160, heat flow based on the voltage, the current and the projected area of the thermal conductivity sensor 113 on the skin surface layer;

[0100] obtaining, by the processor 160, thermal resistance of the subject based on the temperature change value and the heat flow;

[0101] obtaining, by the processor 160, the subject slope based on the thermal resistance and the square root of the set time;

[0102] obtaining, by the processor 160, the thermal conductivity of the subject based on the linear relationship between the subject slope and the thermal conductivity of the subject.

[0103] The linear relationship between the subject slope and the thermal conductivity of the subject is fitted by the thermal conductivity-slope coordinates of a plurality of skin-protective materials. In this way, the thermal conductivity of the subject is obtained, which can greatly reduce the calculation amount of the processor 160, improve the response speed of the processor 160, and also make the temperature measurement assembly 100 have a wider application scenario.

[0104] The thermal conductivity sensor 113 can be a copper disc formed by densely arranging copper double helical wires. When measuring the thermal conductivity of the subject, the thermal conductivity sensor 113 is supplied with a constant current. Due to the Joule heating effect, the thermal conductivity sensor 113 forms a heating zone in the area of the thermal conductivity sensor 113 on the first circuit board 111. The first temperature sensor 112 measures the change value of the heating zone over time.

[0105] In the embodiments provided in the present application, when the thermal conductivity sensor 113 is heated, the heat insulation layer 140 can constrain the heat of the heating zone, so that the heat of the heating zone is transmitted to the skin surface layer of the subject along the first direction. The formula for the change of the temperature change of the heating zone with the heating time τ is as follows:

[0106] is transformed as follows:

[0107] wherein ΔT is the temperature change value of the heating zone, τ is the heating time, is the heat absorption coefficient of the subject, q c (τ) is the heat flow density of the heating zone, is the material density of the subject, c p is the specific heat capacity of the subject at constant pressure.

[0108] U τ is the voltage of the thermal conductivity sensor 113 after heating for t time, I is the current flowing through the thermal conductivity sensor 113, and r is the radius of the heating zone.

[0109] In the embodiments provided in the present application, for the temperature change value ΔT, the power flow module is used to power the thermal conductivity sensor 113, and generally the last voltage point U of the first second (17 sampling points per second) after the thermal conductivity sensor 113 is powered on is taken τ As a reference voltage for temperature rise conversion, the voltage collection module is used to collect the voltage of the thermal conductivity sensor 113 regularly, and all the voltage rise data collected within 60s is converted into temperature rise data, and then one average is taken every 17 points to obtain 60 temperature rise data points.

[0110] ΔT(0, τ) can be calculated by the thermal resistance temperature measurement principle, when the passed current of the thermal conductivity sensor 113 is constant: R τ = R0 × (1 + α × ΔT)

[0111] It can be obtained that: U τ = U0 × (1 + α × ΔT)

[0112] Further, it can be obtained that:

[0113] Wherein, R τ is the resistance of the thermal conductivity sensor 113 after heating for t time, R0 is the resistance of the thermal conductivity sensor at the beginning of heating, α is a constant, and ΔT is the temperature change of the thermal conductivity sensor 113 after heating for t time. U τ is the voltage of the thermal conductivity sensor 113 after heating for t time, and U0 is the voltage of the thermal conductivity sensor at the beginning of heating.

[0114] It should be noted that, is the thermal resistance of the heating area to the measured person in time τ, which can be understood that the thermal conductivity sensor 113 generates Joule heat effect after being powered on, the temperature change value of the heating area is measured by the first temperature sensor 112, and according to the temperature change value ΔT of the heating area and the heat flow density generated by the thermal conductivity sensor after being powered on, the thermal resistance of the measured person can be determined and are linearly related, that is, according to the thermal resistance of the measured person and , the slope of the measured person can be determined.

[0115] Since the thermal resistance of the measured person and are linearly related, it can be inferred that the thermal resistance of the skin-like material and are also linearly related.

[0116] Specifically, please refer to FIG. 6 and FIG. 7, FIG. 6 is a coordinate graph of time-temperature change values of various skin-like materials provided by an embodiment of the present application, and FIG. 7 is a coordinate graph of time square root-thermal resistance of various skin-like materials provided by an embodiment of the present application, the various skin-like materials are polydimethylsiloxane (PDMS), polyamide resin (PA), polyimide (PI) and high density polyethylene (HDPE) respectively.

[0117] Since the heat absorption coefficient of the various skin-like materials, the material density of the skin-like material, the thermal conductivity of the skin-like material and the material constant-pressure specific heat of the skin-like material are known, the thermal resistance of the skin-like material can be determined and the slope of the skin-like material.

[0118] wherein, is the heat absorption coefficient of the skin-like material, is the material density of the skin-like material, c meas is the material constant-pressure specific heat of the skin-like material, λ meas is the thermal conductivity of the skin-like material. The material thermal conductivity of each skin-like material and the slope of the skin-like material can be determined.

[0119] Specifically, the various skin-like materials include but are not limited to polydimethylsiloxane (PDMS), polyamide resin (PA66), polyimide (PI) and high density polyethylene (HDPE), by determining the thermal conductivity-slope coordinates of polydimethylsiloxane, polyamide resin, polyimide and high density polyethylene, please refer to FIG. 8, FIG. 8 is a coordinate graph of thermal conductivity-slope of various skin-like materials provided by an embodiment of the present application, according to the thermal conductivity-slope coordinates of the various skin-like materials, the relationship between the slope of the skin-like material and the slope of the skin-like material can be determined:

[0120] slope = -0.000171501 λ meas + 0.000212299

[0121] The slope of the skin-like material and the linear relationship of the slope of the skin-like material are applied to the temperature measuring assembly 100, and the thermal conductivity of the person to be measured can be obtained. slope = -0.000171501 λ + 0.000212299 λ = (slope-0.000212299) / (-0.000171501)

[0122] In the embodiments provided in the present application, in the case of obtaining the thermal conductivity of the person to be measured, the temperature measuring assembly 100 can obtain the third temperature at the preset thickness from the skin surface layer in the person to be measured according to the first temperature, the second temperature, the thermal conductivity of the heat conduction member 130, and the thermal conductivity of the person to be measured.

[0123] In the embodiments provided in the present application, the processor 160 can calculate the third temperature according to the first temperature, the second temperature, the thermal resistance of the person to be measured, and the thermal resistance of the heat conduction member 130.

[0124] In the process of heat transfer from the person to be measured at the preset thickness from the skin surface layer to the second sensor, the heat of the heat conduction member 130 is equal to the heat of the skin tissue of the person to be measured, and the specific formula for calculating the third temperature is as follows:

[0125] The transformation is as follows:

[0126] Wherein, T core is the third temperature, T bottom is the first temperature, T top is the second temperature, R tissue is the thermal resistance of the person to be measured, and R partition is the thermal resistance of the heat conduction member 130.

[0127] The processor 160 can calculate the thermal resistance of the heat conduction member 130 according to the thickness of the heat conduction member 130, the cross-sectional area of the heat conduction member 130 along the thickness direction, and the thermal conductivity of the heat conduction member 130. The processor 160 can also calculate the thermal resistance of the person to be measured at the preset thickness from the skin surface layer in the person to be measured according to the area of the heat transfer of the surface layer of the person to be measured. The processor 160 can calculate the third temperature according to the first temperature, the second temperature, the thermal resistance of the person to be measured at the preset thickness from the skin surface layer, and the thermal resistance of the heat conduction member 130. It can be understood that in the present application, the processor 160 obtains the thermal conductivity of the person to be measured, the first temperature and the second temperature, and the processor 160 can calculate the third temperature T core .

[0128] The first, second, third, fourth and various numerical references referred to herein are only for the convenience of differentiation and do not serve to limit the scope of the application.

[0129] It should be understood that the size of the sequence number of the above processes in various embodiments of the application does not mean the order of execution, the execution order of the processes should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the application.

[0130] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit it; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the application.

Claims

1. A temperature measuring assembly, characterized by The temperature measuring assembly comprises a first device and a second device; the first device and the second device are arranged at intervals along a first direction, and a heat-conducting member extending along the first direction and connected with the first device and the second device and a heat-insulating layer surrounding the heat-conducting member are arranged between the first device and the second device, and the first direction is perpendicular to a skin surface layer of a person to be measured; The first device comprises a thermal conductivity sensor and a first temperature sensor, and the first temperature sensor is used for measuring the temperature of the skin surface layer; The second device comprises a second temperature sensor.

2. The temperature measuring assembly of claim 1, wherein The temperature measuring assembly further comprises a protective cover for heat insulation, and the protective cover is arranged on a side of the second device away from the first device.

3. The temperature measuring assembly according to any of claims 1-2, characterized in that The thermal conductivity of the heat-insulating layer is less than or equal to 0.1 W / m·K.

4. The temperature measuring assembly according to any one of claims 1 to 3, characterized in that The thermal conductivity of the heat-conducting member is between 0.1 W / m·K and 1 W / m·K.

5. The temperature measuring assembly according to any one of claims 1 to 4, characterized in that The heat-conducting member comprises at least one of polydimethylsiloxane, silicone rubber, electronic heat-conducting pouring sealant, imide, polyethylene, phenolic resin, and polyurethane.

6. The temperature measuring assembly according to any one of claims 1 to 5, characterized in that The heat-insulating layer comprises at least one of general-purpose polystyrene, foamed polystyrene, heat-insulating cotton, foamed polyurethane, foamed polyvinyl chloride, foamed polyethylene, foamed phenolic resin, rock wool felt, glass wool felt, aluminum silicate cotton felt, and aerogel.

7. The temperature measuring assembly according to any one of claims 1 to 6, wherein The first device further comprises a first circuit board, and the thermal conductivity sensor and the first temperature sensor are arranged on the first circuit board.

8. The temperature measuring assembly according to any one of claims 1 to 7, characterized in that The projection of the thermal conductivity sensor in the first direction does not overlap with the projection of the first temperature sensor in the first direction.

9. The temperature measuring assembly of any of claims 1-8, wherein, The number of the first temperature sensors is multiple, and the multiple first temperature sensors surround the thermal conductivity sensor.

10. The temperature sensing assembly of claim 9, wherein the temperature sensing assembly is configured to be positioned on the patient's skin. The second device further comprises a second circuit board, and the number of the second temperature sensors is multiple, and the multiple second temperature sensors are arranged on the second circuit board and surround the second circuit board.

11. The temperature sensing assembly of claim 10, wherein the temperature sensing assembly is configured to be positioned on the patient's skin. In the first direction, the projection of the multiple first temperature sensors overlaps with the projection of the multiple second temperature sensors.

12. The temperature measurement assembly of claim 1, wherein The temperature measuring assembly further comprises a contact surface in contact with the skin surface layer, and the material of the contact surface is sapphire.

13. The temperature measuring assembly of any of claims 1-12, wherein, A processor is further included, and the processor is used for acquiring information collected by the thermal conductivity sensor, the first temperature sensor, and the second temperature sensor.

14. A wearable device, comprising: The temperature measuring assembly comprises the temperature measuring assembly according to any one of claims 1 to 13.

15. A temperature measurement method, characterized by, The temperature measuring method is applied to the temperature measuring assembly according to any one of claims 1 to 13, and the temperature measuring method comprises the following steps: collecting the thermal conductivity of the person to be measured by the thermal conductivity sensor and collecting the first temperature of the skin surface layer by the first temperature sensor; collecting the second temperature of one end of the heat-conducting member away from the first device by the second temperature sensor; obtaining the temperature of the person to be measured with a set thickness based on the first temperature, the second temperature, the thermal conductivity of the person to be measured, and the thermal conductivity of the heat-conducting member by the processor.

16. The temperature measurement method of claim 15, wherein, The thermal conductivity sensor is used for generating electric heat and transmitting the electric heat to the skin surface layer, and the collecting of the thermal conductivity of the person to be measured by the thermal conductivity sensor comprises the following steps: acquiring the temperature change value of the skin surface layer of the person to be measured within a set time by the first temperature sensor; The processor obtains the thermal conductivity of the subject based on the temperature change value, the electrothermal parameter of the thermal conductivity sensor, and the projected area of the thermal conductivity sensor on the skin surface layer.

17. The temperature measurement method of claim 16, wherein, The electrothermal parameter of the thermal conductivity sensor includes voltage and current, and the processor obtains the thermal conductivity of the subject based on the temperature change value, the electrothermal parameter of the thermal conductivity sensor, and the projected area of the thermal conductivity sensor on the skin surface layer, including: The processor obtains the heat flow based on the voltage, the current, and the projected area of the thermal conductivity sensor on the skin surface layer. The processor obtains the thermal resistance of the subject based on the temperature change value and the heat flow. The processor obtains the subject slope based on the thermal resistance and the square root of the set time. The processor obtains the thermal conductivity of the subject based on the linear relationship between the subject slope and the thermal conductivity of the subject.

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