Method and device for producing radio frequency identification, RFID, transponders

Abstract

A method for producing RFID transponders comprises the following steps: - conveying at least two antenna wires in a conveying direction by means of a wire-conveying device, the antenna wires being tensioned parallel to one another at least in parts by the wire-conveying device in the conveying direction or transversely to the conveying direction, so that the antenna wires have a material tension in the conveying direction or transversely to the conveying direction; - moving a transponder chip to a transfer point which is located above or below the tensioned antenna wires in a vertical direction orthogonal to the conveying direction; - heating a solder arranged on the transponder chip until the solder liquefies; and - arranging the transponder chip with the liquefied solder on the tensioned antenna wires by moving the transponder chip or the antenna wires in the vertical direction, wherein the heating of the solder arranged on the transponder chip occurs at least partially during the movement of the transponder chip.

Description

[0001] Method and apparatus for the manufacture of Radio Frequency Identification (RFID) transponders

[0002] Herein we disclose a method and a device for the manufacture of Radio Frequency Identification (RFID) transponders.

[0003] RFID transponders typically comprise a transponder chip and one or more antennas, each formed by antenna wires. Manufacturing such RFID transponders therefore requires arranging the transponder chips on the antenna wires and making electrically conductive contact with them. In the industrial mass production of RFID transponders, this is primarily achieved by soldering the transponder chips to the antenna wires.

[0004] Examples of devices for the industrial mass production of RFID transponders, which also include a soldering device for soldering transponder chips to antenna wires, are disclosed, for example, in documents DE 10 2018 005 569 Al and DE 10 2018 005 568 Al.

[0005] A technical problem that arises particularly in the industrial mass production of RFID transponders is the limitation of the overall throughput of a larger production line by the time required by a soldering station to solder the transponder chips to the antenna wires. In other words, the soldering station needs more time to position the transponder chips on the antenna wires, heat the solder, and connect the transponder chips and antenna wires than other production stations need to perform their respective manufacturing steps to produce RFID transponders, thus creating a bottleneck in the industrial mass production of RFID transponders.

[0006] Therefore, there is a need for an improved manufacturing process for RFID transponders and an improved device for manufacturing RFID transponders, each of which will improve the overall manufacturing throughput of an RFID transponder manufacturing setup.

[0007] This problem is solved by a method and a device according to the independent claims. Advantageous embodiments of the method and the devices are defined by the dependent claims. A method for manufacturing RFID transponders comprises the following steps:

[0008] - Conveying at least two antenna end wires in a conveying direction with a wire conveying device, wherein the antenna end wires are tensioned parallel to each other at least section by the wire conveying device in the conveying direction or transversely to the conveying direction, in particular at an angle of substantially 90° to the conveying direction, so that the antenna end wires have a material tension in the conveying direction or transversely to the conveying direction;

[0009] - Moving a transponder chip to a transfer point located above or below the taut antenna wires in a vertical direction orthogonal to the conveying direction, which in particular runs orthogonally to an imaginary plane extending through the mutually parallel sections of the taut antenna wires;

[0010] - Heating a solder arranged on the transponder chip until it liquefies; and

[0011] - Arranging the transponder chip with the liquefied solder on the taut antenna wires by moving the transponder chip or the antenna wires in the vertical direction, wherein the heating of the solder arranged on the transponder chip occurs at least partially during the movement of the transponder chip.

[0012] One advantage of this process is that the solder can be heated and / or liquefied while the transponder chip is moving to the transfer point, rather than only at the transfer point itself. By synchronizing the chip transport and solder liquefaction steps, the arrangement of the transponder chips on the antenna wires and the electrical contacting of the transponder chips with the antenna wires are accelerated overall, thus improving the throughput of an RFID transponder manufacturing setup.

[0013] Another advantage is that the transponder chip can be positioned on the two parallel antenna wires from a position vertically above the antenna wires as well as from a position vertically below the antenna wires.

[0014] Optionally, the heating and / or liquefaction of the solder applied to the transponder chip can occur at least partially during the movement of the transponder chip to the transfer point. Alternatively or additionally, the heating and / or liquefaction of the solder applied to the transponder chip can also occur at least partially during the vertical movement of the transponder chip. The transfer point, that is, the point to which the transponder chip is conveyed for the purpose of subsequent placement on the antenna wires and / or soldering to the antenna wires, can be located vertically, in particular, directly above or directly below the tensioned antenna wires.

[0015] One advantage of this is that a transponder chip initially positioned at the transfer point can be contacted with the antenna wires simply by a subsequent movement of the transponder chip and / or the antenna wires in the vertical direction.

[0016] Optionally, the arrangement of the transponder chip with the liquefied solder on the taut and / or at least sectionally parallel antenna wires can also be achieved by moving the transponder chip and / or the antenna wires in the vertical direction and in the conveying direction and / or in a transverse direction orthogonal to the conveying direction and the vertical direction.

[0017] For example, the antenna wires can be pressed against the transponder chip, positioned at the transfer point, for placement and / or soldering. This can be achieved, for instance, by temporarily raising or lowering the taut antenna wires vertically. The taut wires can then come into contact with the molten solder on the transponder chip. Once the taut antenna wires have made contact with the molten solder, the mounting device at the transfer point can release or release the transponder chip, ensuring that the transponder chip adheres to the antenna wires when they are returned to their original position after the temporary raising or lowering.It is not absolutely necessary to wait for the liquefied solder to solidify completely, as the transponder chip already adheres to the taut antenna wires due to adhesion of the still liquid solder.

[0018] Alternatively or additionally, the transponder chip, which is initially moved to the transfer point, can also be brought into contact with the taut antenna wires by raising or lowering it in the vertical direction, so that the liquefied solder arranged on the transponder chip contacts the antenna wires and the transponder chip adheres to the taut antenna wires, in particular due to adhesion of the still liquid solder.

[0019] One advantage of this is that the manufacturing process for RFID transponders can be further accelerated, since further conveying of the antenna wires, which are at least partially parallel to each other, in the conveying direction can take place before the solder has completely solidified.

[0020] Optionally, the heating of the solder arranged on the transponder chip can be carried out by heating the transponder chip with a heated placement device, wherein the heated placement device may in particular be configured to pick up the transponder chip at a receiving point and move it to the transfer point.

[0021] One advantage of the heated placement device, which can move and heat the transponder chips simultaneously, at least temporarily, is improved efficiency in RFID transponder manufacturing, as a separate transport device and a separate soldering heating or liquefaction device are no longer necessary. Heating and / or liquefaction thus does not have to occur directly through direct contact of the solder with a heated device, but can happen indirectly through heating the transponder chip itself, which in turn can be heated during its movement through the placement device.

[0022] The heated placement device can fix the transponder chip in place during movement, particularly by means of a vacuum. The placement device can also be configured to release the vacuum after the transponder chip has been positioned or pressed against the antenna wires with the molten solder and / or after the antenna wires have been positioned or pressed against the transponder chip with the molten solder, thus ending the fixation of the transponder chip by the placement device.

[0023] One advantage here is that both the fixing and transport of the transponder chip, as well as its subsequent release, can be carried out at high speed and with precise control.

[0024] Furthermore, the heated placement device can move the transponder chip on a circular path from the receiving point to the transfer point.

[0025] One advantage of this method is that the transponder chip can be moved from a position spaced apart in the conveying direction from the tensioned antenna wires to the transfer position, which is positioned vertically above or below the antenna wires. The solder can be arranged at at least two spatially separated positions on the transponder chip, so that after its liquefaction, at least two spatially separated solder droplets form, which, when the transponder chip is positioned on the antenna wires tensioned by the wire conveying device, each make material-bonded contact with one of the antenna wires.

[0026] In other words, the solder can be arranged on the transponder chip in such a way that, after its liquefaction, at least two solder droplets form which have at least essentially the same distance to each other as the two antenna wires stretched parallel to each other on which the transponder chip is arranged.

[0027] A device for manufacturing RFID transponders includes a wire feeder configured to convey at least two antenna wires in a conveying direction. The wire feeder is further configured to tension the antenna wires parallel to each other, at least section by section, in the conveying direction or perpendicular to the conveying direction, such that the antenna wires exhibit material tension in the conveying direction or perpendicular to the conveying direction.

[0028] Furthermore, the device for manufacturing RFID transponders comprises at least one assembly device configured to move a transponder chip with a solder mounted on it to a transfer point located in a vertical direction orthogonal to the conveying direction, either above or below the tensioned antenna wires. The vertical direction can, in particular, be orthogonal to an imaginary plane extending through the mutually parallel sections of the at least two tensioned antenna wires.

[0029] The placement device can be configured to position the transponder chip on the tensioned antenna wires with a movement in a vertical direction orthogonal to the conveying direction. Alternatively or additionally, the wire conveying device can be configured to position the tensioned antenna wires on the transponder chip with a movement in the vertical direction.

[0030] Furthermore, the assembly device is further configured to liquefy the solder arranged on the transponder chip by heating it at least partially during the movement of the transponder chip.

[0031] The at least one heated placement device can be configured, in particular, to heat the solder together with the transponder chip. Optionally, the at least one heated placement device can further be configured to contact and / or heat a surface of the transponder chip facing away from the solder. In this case, the heating and / or liquefaction need not occur directly through direct contact of the solder with a heated device, but can occur indirectly through heating the transponder chip itself, whereby the transponder chip can in turn be heated during its movement through the placement device.

[0032] The at least one heated placement device can, for example, be designed as a heated bonding tool.

[0033] Furthermore, at least one heated placement device may be designed to fix the transponder chip at least temporarily with a vacuum during heating and / or during movement.

[0034] In one variant, at least one heated loading device can be designed as a heating stamp.

[0035] Optionally, at least one heated placement device can be set up to move the transponder chip on a circular path.

[0036] Furthermore, the device for manufacturing RFID transponders may include additional manufacturing stations, for example a flux dispenser designed to apply a flux to the parallel sections of the antenna wires.

[0037] One advantage of this is that the flux applied to the antenna wires before the transponder chip is placed makes it easier to create a solder contact between the antenna wires and the transponder chip.

[0038] Furthermore, the device for manufacturing RFID transponders may include a heating device designed to heat the antenna wires and / or the transponder chip arranged on the antenna wires with infrared light and / or hot air.

[0039] One advantage of the heating device is that it further improves the mechanical fastening and electrical contact between the transponder chip and the antenna wires, as achieved by the assembly device. Heating the antenna wires and / or the transponder chip attached to them with infrared light and / or hot air allows the solder to be at least partially liquefied or softened, thus improving the solder distribution between and / or on the antenna wires and the transponder chip. In particular, this results in a more uniform solder distribution between and / or on the antenna wires and the transponder chip.

[0040] Furthermore, the device for manufacturing RFID transponders may include an inspection device, in particular an optically and / or electronically detecting inspection device, which is designed to detect property and / or positioning errors of the transponder chip arranged on the antenna end wires.

[0041] One advantage of the inspection device is that defective RFID transponders can be excluded from further processing or discarded as rejects if a property and / or positioning error is detected. This improves the manufacturing efficiency of the RFID transponder production device.

[0042] In one variant, the device for manufacturing RFID transponders may further include a connecting device designed to establish an electrically conductive connection between the antenna end wires.

[0043] One advantage here is that the connecting device can further improve the antennas of the RFID transponders, for example by manufacturing one or more loop antennas.

[0044] Optionally, the device for manufacturing RFID transponders may also include an insulating device configured to surround at least a portion of the antenna wires and / or at least a portion of the electrically conductive connection with an insulating material. Alternatively or additionally, the device for manufacturing RFID transponders may also include a sealing device configured to apply a seal to at least a portion of the transponder chip and / or at least a portion of the insulating material and / or at least a portion of the antenna wires.

[0045] Furthermore, the device for manufacturing RFID transponders can include a cutting device, in particular a laser cutting device, which is configured to cut the antenna end wires and / or the insulating material and / or the seal, so that a single transponder assembly with at least one transponder chip and at least one antenna assembly, in particular with a loop antenna, is manufactured, wherein the antenna assembly, in particular the loop antenna of the transponder assembly, can comprise a section of the cut antenna end wires and / or the electrically conductive connection.

[0046] Further features, properties, advantages, and possible variations will become clear to a person skilled in the art from the following description, which refers to the accompanying drawings. All features described and / or illustrated, individually or in any combination, depict the object disclosed herein. The dimensions and proportions of the devices and components shown in the figures are not to scale.

[0047] Fig. 1 schematically shows an example of a device for manufacturing RFID transponders with antenna wires stretched transversely to the conveying direction.

[0048] Fig. 2 schematically shows a wafer with several transponder chips.

[0049] Fig. 3 schematically shows a single transponder chip with a solder mounted on it.

[0050] Fig. 4 schematically shows a transponder chip arranged on two antenna wires arranged parallel to each other.

[0051] Fig. 5 schematically shows an example of handling a transponder chip with a heated placement tool.

[0052] Fig. 6 schematically shows another example of handling a transponder chip with a heated placement tool.

[0053] Fig. 7 shows a method for manufacturing RFID transponders.

[0054] Comparable or identical components and features with the same effect are identified by the same reference numerals in the figures. For clarity, reference numerals for individual features and components have sometimes been omitted in the figures, although these features and components are already identified by reference numerals in other figures. The components and features not described again in relation to the other figures are similar in design and function to the corresponding components and features shown in the other figures. Figure 1 shows a device 1000 for manufacturing RFID transponders. The device 1000 has two supply reels 100a, 100b, each of which provides a quasi-endless antenna wire 200a, 200b.The provided quasi-endless antenna wires 200a, 200b are each stretched by a laying device (not shown) with one laying arm (not shown) for each of the two provided antenna wires 200a, 200b between the wire feed units 300a, 300b shown in Fig. 1.

[0055] For this purpose, the antenna wires 200a, 200b are arranged in a U-shape around the paired antenna wire holders 302 by the laying arms of the laying device in a top view and under material tension, resulting in a meandering arrangement of the antenna wires 200a, 200b on or between the wire feed units 300a, 300b. In the example shown, the antenna wire holders 302 are L-shaped receiving hooks attached to the wire feed units 300a, 300b, which in this specific example are designed as conveyor chains circulating in the conveying direction X (i.e., clockwise). The antenna wire receivers 302 extend radially from the wire feed units 300a, 300b (or the circulating conveyor chains) and are attached in pairs at regular intervals to the wire feed units 300a, 300b or 302.arranged on the circulating conveyor chains such that the provided antenna wires 200a, 200b each span an interior space between the wire conveyor units 300a, 300b parallel to each other.

[0056] The wire conveying units 300a, 300b and the circulating conveyor chains convey the tensioned antenna end wires 200a, 200b, which are arranged under material tension in a U-shape around the paired antenna wire receivers 302, intermittently in the conveying direction X. The tensioned antenna end wires 200a, 200b are arranged parallel to each other, at least in sections, and are stretched at an angle of essentially 90° to the conveying direction X.

[0057] Furthermore, the wire feed units 300a and 300b can have an automatically or manually adjustable distance between them. This allows the length of the antenna wire sections stretched transversely to the feed direction X to be set or adjusted, and / or the material tension of the antenna wire sections to be increased or decreased.

[0058] A heated assembly device can be arranged above or below the parallel antenna wire sections conveyed in the conveying direction X. An assembly device is not shown in Fig. 1, but will be described in more detail with reference to the following figures. Furthermore, additional processing stations for the production of RFID transponders, also not shown in Fig. 1, can be arranged above and / or below the tensioned antenna wire sections. These could include, for example, a flux dispenser or a heating device designed to heat the antenna wire sections and / or the transponder chip attached to the antenna wire sections with infrared light and / or hot air.

[0059] After the antenna wires 200a, 200b, arranged under material tension on the wire feed units 300a, 300b, have been conveyed past the last processing station in the conveying direction X, the antenna wires 200a, 200b with the transponder chips attached to them are released from the wire feed units 300a, 300b by a pickup device (not shown) and conveyed past an inspection device 400 via a deflection roller 502 to a common receiving roller 500. The pickup device is optional and expressly not required in all embodiments. In particular, the wire feed units 300a, 300b and / or receivers 302 of the wire feed units 300a, 300b can be designed such that they release the antenna end wires 200a, 200b at a predetermined (feeding) position.

[0060] The inspection device 400 uses optical and electronic sensors and readout devices to check whether the manufactured transponder chips of the RFID transponders produced by the device 1000 exhibit any defects in properties or positioning. Based on the inspection by the inspection device 400, defective RFID transponders, i.e., RFID transponders with damaged and / or incorrectly positioned transponder chips, can be subsequently rejected and / or excluded from further production.

[0061] The manufacturing of RFID transponders is further illustrated in Figures 2 to 6.

[0062] Fig. 2 shows a wafer 10 containing several transponder chips 12 for RFID transponders. Fig. 3 shows a single one of these transponder chips 12. A solder 16a, 16b is arranged at two locations on the surface of the transponder chip 12, which, after liquefaction, forms two separate solder droplets on the surface of the transponder chip 12.

[0063] Figure 4 schematically shows a transponder chip 12 arranged on two parallel antenna wires 200a, 200b in a top view. The solder 16a, 16b fixes the transponder chip 12 to the antenna wires 200a, 200b and electrically contacts the antenna wires 200a, 200b with the transponder chip 12, i.e., with contact elements on the surface of the transponder chip 12. To position the transponder chip 12 on the antenna wires 200a, 200b, the transponder chip 12 can be moved using a heated placement device in the form of a heated bonding tool 310, as schematically shown in Figure 4.

[0064] The heated bonding tool 310 shown in Fig. 5 can fix the transponder chip 12 using a vacuum and simultaneously move and heat the fixed transponder chip 12. For this purpose, the heated bonding tool 310 has a vacuum channel 314 through which a vacuum generated by the bonding tool 310 can act on a surface of the transponder chip 12 located in a contact area of ​​the bonding tool. In other words, the transponder chip 12 can be drawn into the bonding tool 310 so that it can be picked up at a transfer point, for example from the wafer 10, and subsequently released at another location, for example on the two antenna wires 200a, 200b, by releasing the vacuum acting through the vacuum channel 314.

[0065] Furthermore, the heated bonding tool 310 shown in Fig. 5 has a heating device 312 which is configured to heat the transponder chip 12 positioned in the contact area of ​​the bonding tool 310, i.e., the transponder chip 12 fixed by the heated bonding tool 310. The transponder chip 12 heated by the bonding tool 310 can transfer some of the heat supplied to it to the solder 16a, 16b arranged on it. In other words, the heated bonding tool 310 is configured to heat the transponder chip 12 so that it, in turn, heats the solder 16a, 16b arranged on it.

[0066] The transponder chip 12 can be heated by the heated bonding tool 310 until the solder 16a, 16b liquefies, whereby at least part of this heating can occur while the transponder chip 12 is being moved by the heated bonding tool 310. Optionally, a further part of the heating of the transponder chip 12 required to liquefy the solder 16a, 16b can also occur while the transponder chip 12 is held in a specific position, for example, while the transponder chip 12 is fixed by the heated bonding tool at the transfer point or at a transfer point vertically above or vertically below the antenna wires 200a, 200b for a specific period of time.

[0067] When the solder 16a, 16b is liquefied by the heat supplied to the transponder chip 12 by the heated bonding tool 310, two separate or spaced-apart solder droplets form on the surface of the transponder chip 12. The transponder chip 12 can be positioned with the solder droplets on the antenna wires 200a, 200b, so that each of the separate or spaced-apart solder droplets contacts one of the antenna wires 200a, 200b, thus establishing an electrically conductive connection between the respective antenna wires 200a, 200b and the transponder chip 12.

[0068] The transponder chip 12 can be positioned on the antenna wires 200a, 200b by raising or lowering the antenna wires 200a, 200b towards the transponder chip 12 positioned at the transfer point and / or by raising or lowering the transponder chip 12 positioned at the transfer point towards the antenna wires 200a, 200b.

[0069] By releasing the vacuum acting on the transponder chip via the vacuum channel 314, the fixation of the transponder chip 12 by the heated bonding tool can be released. It is not necessary to wait for the solder 16a, 16b located between the antenna wires 200a, 200b and the transponder chip 12 to solidify. The adhesive effect of the still-liquid solder 16a, 16b is sufficient to cause the transponder chip 12 to adhere to the antenna wires 200a, 200b.

[0070] An alternative heated placement device is shown in Fig. 6.

[0071] Alternatively or in addition to the heated bonding tool 310 shown in Fig. 5, the transponder chip 12 can also be moved and heated simultaneously with a heated placement device in the form of a heating stamp 320.

[0072] The transponder chip 12 can be removed from the wafer 10, for example using a vacuum pipette, and placed on the heating die 320. The heating die 320, together with the transponder chip 12 mounted on it, can then be moved to a transfer point above or below the tensioned antenna wires 200a, 200b. The heating die 320 can heat the transponder chip 12, at least during part of this movement.

[0073] The transponder chip 12, heated by the heating stamp 320, can transfer some of the heat supplied to it to the solder 16a, 16b arranged on it. In other words, the heating stamp 320 is configured to heat the transponder chip 12, so that it in turn heats the solder 16a, 16b arranged on it.

[0074] The transponder chip 12 can be heated by the heating stamp until the solder 16a, 16b liquefies, whereby at least part of this heating can occur while the transponder chip 12 is moving through the heating stamp 320. Optionally, a further part of the heating of the transponder chip 12 required to liquefy the solder 16a, 16b can also occur during a temporary rest or standstill of the heating stamp 320, for example at the transfer point.

[0075] Once the solder 16a, 16b has liquefied due to the heat supplied to the transponder chip 12 by the heating stamp 320, two separate or spaced-apart solder droplets form on the surface of the transponder chip 12. The transponder chip 12 can be positioned with the solder droplets on the antenna wires 200a, 200b, so that each of the separate or spaced-apart solder droplets contacts one of the antenna wires 200a, 200b, establishing an electrically conductive connection between the respective antenna wires 200a, 200b and the transponder chip 12. The heating stamp 320 can then be moved away from the transponder chip 12 and the taut antenna wires 200a, 200b. It is not necessary to wait for the lot 16a, 16b arranged between the antenna wires 200a, 200b and the transponder chip 12 to solidify.The adhesion of the still liquid solder 16a, 16b already causes the transponder chip 12 to adhere to the antenna wires 200a, 200b.

[0076] As further shown in Fig. 7, several heated placement devices can also be used for the production of RFID transponders. Fig. 7 schematically shows an example with several heating dies 320 that can be moved along a circular path from a transfer point A to a transfer point B or D, with the heating dies 320 shown being arranged on a common rotary device 322. However, this is expressly not necessary in all embodiments.

[0077] The movement of the heating pistons 320 can, for example, be sequential and coordinated with the movement of the antenna wires 200a, 200b, which are stretched in pairs between the antenna wire receivers 302, in the conveying direction X. Fig. 7 shows the wire conveying units 300a, 300b, also shown in Fig. 1, with the antenna wire receivers 302 and the antenna wires 200a, 200b, in a top view.

[0078] The transponder chips 12 can be removed from the wafer 10 by a vacuum pipette 330 and conveyed to a transfer point A, as schematically shown. The transfer point A can be arranged at a distance from the tensioned antenna wires 200a, 200b in the conveying direction X. In other words, the transfer point A can be spaced at a distance from the antenna wires in the conveying direction X and, in particular, can be arranged not vertically aligned above or below the tensioned antenna wires 200a, 200b. At the transfer point A, the transponder chip 12 can be detached from the vacuum pipette 330 and placed on a surface of the heating plunger. The heating plunger can then move the transponder chip in a circular path to one of the transfer points B or D, heating it in the process. Heating the transponder chip 12 can also cause a solder (in the Fig. 2) located on a surface of the transponder chip facing away from the heating plunger to heat the chip.7 (not shown) are heated.

[0079] The transfer points B and D are each arranged in the vertical direction Z, orthogonal to the conveying direction X, below the tensioned antenna wires 200a, 200b. As soon as a heating stamp 320 with a transponder chip 12 mounted on it reaches the transfer points B or D, the transponder chip 12 can be moved towards the tensioned antenna wires 200a, 200b by moving the heating stamp 320 in the direction of the tensioned antenna wires, i.e. in the vertical direction Z, so that the antenna wires contact the solder heated by the transponder chip 12. Alternatively or additionally, the taut antenna wires 200a, 200b can also be moved in the vertical direction Z towards the transponder chip located at the transfer point, for example with a pressure element (not shown), so that the solder arranged on the transponder chip contacts the taut antenna wires.

[0080] The solder applied to the transponder chip 12 can be liquefied by the heating of the transponder chip 12 at the time of contact with the antenna wires 200a, 200b, forming two separate solder droplets, each of which contacts one of the taut antenna wires 200a, 200b, so that the transponder chip 12 adheres to the taut antenna wires 200a, 200b by adhesion of the solder. Therefore, it is not necessary to wait for the solder to solidify before the heating stamp 320 is removed from the transponder chip 12, which is adhered to the antenna wires 200a, 200b, in the vertical direction Z and / or further along the circular path.

[0081] After the transponder chip 12 has been attached to the antenna wires 200a, 200b, the heating stamp 320 can be moved back to the transfer point A and the antenna wires can be conveyed further in the conveying direction X.

[0082] It is understood that the movements of the antenna wires and the multiple heating elements shown in Fig. 7 can be coordinated or synchronized with each other, and that the multiple heating elements can each feed different transponder chips simultaneously or at least with some overlap in time. It is further understood that one of the multiple heating elements can pick up a transponder chip at the transfer point A, while another heating element contacts a transponder chip with the antenna wires.

[0083] Figure 8 shows a process for manufacturing RFID transponders with the following steps:

[0084] Sl: Conveying at least two antenna end wires with a wire conveying device in a conveying direction, wherein the antenna end wires are tensioned parallel to each other at least section by the wire conveying device in the conveying direction or transversely to the conveying direction, so that the antenna end wires have a material tension in the conveying direction or transversely to the conveying direction.

[0085] S2: Moving a transponder chip to a transfer point located in a vertical direction orthogonal to the conveying direction, either above or below the tensioned antenna wires.

[0086] S3: Heating a solder arranged on the transponder chip until it liquefies.

[0087] S4: Positioning the transponder chip with the liquefied solder on the taut antenna wires by moving the transponder chip or the antenna wires in the vertical direction.

[0088] The heating of the solder arranged on the transponder chip can occur at least partially while the transponder chip is being moved.

[0089] It is understood that the exemplary embodiments described above are not exhaustive and do not limit the subject matter disclosed herein. In particular, it is evident to the person skilled in the art that they can combine the described features in any way they wish and / or omit various features without deviating from the subject matter disclosed herein.

Claims

Patent claims 1. Method (2000) for the manufacture of RFID transponders, comprising the steps: - Conveying (Sl) at least two antenna end wires (200a, 200b) in a conveying direction (X) with a wire conveying device, wherein the antenna end wires (200a, 200b) are tensioned parallel to each other at least section by the wire conveying device in the conveying direction (X) or transversely to the conveying direction (X), so that the antenna end wires (200a, 200b) have a material tension in the conveying direction (X) or transversely to the conveying direction (X); - Moving (S2) a transponder chip (12) to a transfer point (B, D) which is located in a vertical direction (Z) orthogonal to the conveying direction (X) above or below the tensioned antenna wires (200a, 200b); - Heating (S3) a lot (16a, 16b) arranged on the transponder chip (12) until it liquefies; and - Arranging (S4) the transponder chip (12) with the liquefied solder (16a, 16b) on the taut antenna wires (200a, 200b) by moving the transponder chip (12) or the antenna wires (200a, 200b) in the vertical direction (Z), wherein the heating (S3) of the solder (16a, 16b) arranged on the transponder chip (12) occurs at least partially during the movement of the transponder chip (12).

2. Method according to claim 1, wherein the heating (S3) of the plumb line (16a, 16b) arranged on the transponder chip (12) takes place at least partially during the movement (S2) of the transponder chip (12) to the transfer point (B, D), and / or the heating (S3) of the plumb line (16a, 16b) arranged on the transponder chip (12) takes place at least partially during the movement of the transponder chip (12) in the vertical direction (Z).

3. Method according to claim 1 or 2, wherein the transfer point (B, D) is aligned in the vertical direction (Z) above or below the tensioned antenna wires (200a, 200b); and / or the arrangement (S4) of the transponder chip (12) with the liquefied solder (16a, 16b) on the tensioned antenna wires (200a, 200b) is carried out by moving the transponder chip (12) and / or the antenna wires (200a, 200b) in the vertical direction (Z) and in the conveying direction (X) and / or in a transverse direction (Y) orthogonal to the conveying direction (X) and to the vertical direction (Z).

4. Method (2000) for manufacturing RFID transponders according to one of claims 1 to 10 3, wherein the heating (S3) of the lot (16a, 16b) arranged on the transponder chip (12) is carried out by heating the transponder chip (12) with a heated placement device (310, 320), wherein the heated placement device (310, 320) is in particular configured to receive the transponder chip (12) at a receiving point (A) and move it to the transfer point (B, D).

5. Method (2000) for manufacturing RFID transponders according to one of claims 1 to 10 4, wherein the heated placement device (310) secures the transponder chip (12) during movement with a vacuum.

6. Method (2000) for manufacturing RFID transponders according to one of claims 1 to 10 5, wherein the heated placement device (320) moves the transponder chip (12) on a circular path from the receiving point (A) to the transfer point (B, D).

7. Method (2000) for manufacturing RFID transponders according to one of claims 1 to 10 6, wherein the solder (16a, 16b) is arranged at at least two spatially separated positions on the transponder chip (12), such that after its liquefaction at least two spatially separated solder droplets are formed, which, when the transponder chip (12) is arranged (S4) on the antenna end wires (200a, 200b) tensioned by the wire feed device, each contact one of the antenna end wires (200a, 200b) in a materially bonded manner.

8. Device (1000) for the manufacture of RFID transponders, comprising - a wire conveying device configured to convey at least two antenna end wires (200a, 200b) in a conveying direction (X), wherein the wire conveying device is further configured to tension the antenna end wires (200a, 200b) in the conveying direction (X) or transversely to the conveying direction (X) at least sectionally parallel to each other, so that the antenna end wires (200a, 200b) have a material tension in the conveying direction (X) or transversely to the conveying direction (X); - at least one placement device (310, 320) which is configured to place a transponder chip (12) with a solder (16a, 16b) arranged thereon to a transfer point (B, D) which is located in a vertical direction (Z) orthogonal to the conveying direction (X) to move the transponder chip (12) above or below the tensioned antenna wires (200a, 200b), wherein the assembly device (310, 320) is further configured to arrange the transponder chip (12) on the tensioned antenna wires (200a, 200b) with a movement in a vertical direction (Z) orthogonal to the conveying direction, or wherein the wire conveying device is further configured to arrange the tensioned antenna wires (200a, 200b) on the transponder chip (12) with a movement in the vertical direction (Z), and wherein the assembly device (310, 320) is further configured to liquefy the solder (16a, 16b) arranged on the transponder chip (12) by heating it at least partially during the movement of the transponder chip (12).

9. Device (1000) according to claim 8, wherein the at least one heatable placement device (310, 320) is further configured to heat the solder (16a, 16b) together with the transponder chip (12), and / or the at least one heatable placement device (310, 320) is further configured to contact and / or heat a surface of the transponder chip (12) facing away from the solder (16a, 16b).

10. Device (1000) according to one of claims 8 or 9, wherein the at least one heatable placement device (310) is designed as a heatable bonding tool, and / or the at least one heatable placement device (310) is configured to fix the transponder chip (12) at least temporarily with a vacuum during heating and / or during movement.

11. Device (1000) according to one of claims 8 or 9, wherein the at least one heatable placement device is designed as a heating stamp (320), and / or the at least one heatable placement device (310) is configured to move the transponder chip (12) on a circular path.

12. Device (1000) according to any one of the preceding claims 8 to 11, further comprising - a flux dispenser designed to apply flux to the parallel sections of the antenna wires (200a, 200b); and / or - a heating device configured to heat the antenna wires (200a, 200b) and / or the transponder chip (12) arranged on the antenna wires (200a, 200b) with infrared light and / or with hot air; and / or - an inspection device (400) configured to detect property and / or positioning errors of the transponder chip (12) arranged on the antenna end wires (200a, 200b); and / or - a connecting device designed to establish an electrically conductive connection between the antenna ends; and / or - an insulating device designed to surround at least part of the antenna end wires (200a, 200b) and / or at least part of the electrically conductive connection with an insulating material; and / or - a sealing device configured to apply a seal at least to a part of the transponder chip (12) and / or at least to a part of the insulating material and / or at least to a part of the antenna wires (200a, 200b); and / or - a cutting device, in particular a laser cutting device, which is configured to cut the antenna end wires (200a, 200b) and / or the insulating material and / or the sealing, so that a single transponder assembly with at least one transponder chip (12) and at least one antenna assembly, in particular a loop antenna, is produced, wherein the antenna assembly, in particular the loop antenna, of the transponder assembly comprises a section of the cut antenna end wires (200a, 200b) and / or the electrically conductive connection.

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