Bonding device and control method

Abstract

A component mounting device (1), which is a bonding device, comprises: a pickup unit (14) for picking up a chip (6a) in a non-contact manner, that includes a pickup nozzle (14a) having a suction hole (14c) for sucking the chip (6a) and a vibrator for vibrating the pickup nozzle (14a) in order to generate a sound wave from the pickup nozzle (14a), and that outputs a detection signal corresponding to the vibration of the pickup nozzle (14a); a component mounting nozzle (20a) configured to receive the chip (6a) from the pickup unit (14) and bond the chip (6a) to another component; and a control unit (101) for controlling the component mounting nozzle (20a) on the basis of the detection signal.

Description

Bonding device and control method

[0001] The present disclosure relates to a joining device for joining a component to another component.

[0002] To improve the functionality of semiconductor packages, hybrid bonding that does not use bumps or bonding materials is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or other device using hydrogen bonding or other methods while the surface of the semiconductor chip is kept clean. Therefore, in hybrid bonding, the surface of the semiconductor chip must be kept highly clean from the time it is picked up from the adhesive sheet dicing tape until it is bonded.

[0003] To address this issue, a mounting device has been proposed that picks up electronic components such as semiconductor chips without contact and mounts them on a substrate (see, for example, Patent Document 1). Specifically, the mounting device includes a pickup collet and a mounting head. The pickup collet picks up and holds the electronic components without contact and transfers them to the mounting head. The mounting head then suction-holds the electronic components and mounts them on the substrate. This allows the electronic components to be picked up without contact, thereby maintaining a high level of cleanliness on the surfaces of the electronic components (i.e., semiconductor chips). Note that such mounting devices are also called bonding devices because they mount components such as electronic components on a substrate by bonding them to the substrate.

[0004] JP 2023-50145 A

[0005] However, when attempting to pick up a semiconductor chip non-contact using sound waves such as ultrasound, there is a problem that the mounting device (i.e., bonding device) of Patent Document 1 above may have difficulty in properly transferring the semiconductor chip to the mounting head.

[0006] Therefore, the present disclosure provides a joining device and the like that can increase the likelihood of achieving proper delivery of components such as semiconductor chips.

[0007] A joining device according to one aspect of the present disclosure includes a pickup unit that picks up a component without contact, the pickup unit including a pickup nozzle having a suction hole for sucking the component and a vibrator that vibrates the pickup nozzle to generate sound waves from the pickup nozzle, the pickup unit outputting a detection signal in response to the vibration of the pickup nozzle; a component mounting nozzle configured to receive the component from the pickup unit and join the component to another component; and a control unit that controls the component mounting nozzle based on the detection signal.

[0008] These general or specific aspects may be realized as an apparatus or a method, or may be realized as any combination of a system, an apparatus, and a method.

[0009] The joining device of the present disclosure can increase the likelihood that parts will be properly handed over.

[0010] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and configurations described in the specification and drawings, but not necessarily all of the configurations.

[0011] FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment. FIG. 2 is a diagram for explaining an operation of the component mounting apparatus according to an embodiment in which the component mounting apparatus mounts a chip on a substrate. FIG. 3 is a diagram for schematically and illustratively illustrating the main configuration of the component mounting apparatus according to an embodiment. FIG. 4A is a diagram for illustratively illustrating a part of an operation in which a pickup system according to an embodiment picks up a chip using a pickup nozzle and transfers it to a component mounting nozzle. FIG. 4B is a diagram for illustratively illustrating the remaining part of an operation in which a pickup system according to an embodiment picks up a chip using a pickup nozzle and transfers it to a component mounting nozzle. FIG. 5 is a diagram for illustrating an example of the appearance of a pickup unit according to an embodiment. FIG. 6 is a diagram for illustrating the electrical configuration of a pickup unit according to an embodiment. FIG. 7 is a diagram for illustrating a state when a chip is transferred from a pickup nozzle to a component mounting nozzle according to an embodiment. FIG. 8 is a diagram for illustrating a state of a chip transferred to a component mounting nozzle according to an embodiment. FIG. 9 is a diagram for illustrating an example of a detection value indicated by a detection signal according to an embodiment. FIG. 10 is a flowchart showing an example of a processing operation of the component mounting apparatus according to an embodiment. FIG. 11 is a diagram for illustrating various examples of a first adjustment process and a second adjustment process according to an embodiment. FIG. 12 is a diagram for explaining the electrical configuration of a pickup unit in a modification of the embodiment.

[0012] The present inventors have discovered the following problem with the mounting device of Patent Document 1 described in the "Background Art" section. In the mounting device of Patent Document 1, the pickup collet holds components in a non-contact manner using gas ejected from fine holes and negative pressure from suction holes. On the other hand, sound waves such as ultrasonic waves can be used instead of gas ejection to hold components in a non-contact manner. However, if sound waves are used instead of gas ejection from fine holes in the mounting device of Patent Document 1, the non-contact held components may be shaken by the sound waves. As a result, if a component held in a non-contact manner by the pickup collet shakes when being transferred to the mounting nozzle, the component may be sucked and held in a position that is different from the predetermined position of the mounting nozzle. This poses a problem that the component may not be transferred properly.

[0013] To solve this problem, a bonding device according to a first aspect of the present disclosure includes a pickup unit that picks up a component without contact, the pickup unit including a pickup nozzle having a suction hole for sucking the component and a vibrator that vibrates the pickup nozzle to generate sound waves from the pickup nozzle, the pickup unit outputting a detection signal in response to the vibration of the pickup nozzle, a component mounting nozzle configured to receive the component from the pickup unit and bond the component to another component, and a control unit that controls the component mounting nozzle based on the detection signal. Note that the sound waves are used in a broad sense and may be ultrasonic waves.

[0014] Here, when a component is transferred from the pickup unit to the component mounting nozzle, the state of the detection signal differs depending on whether the component is likely to be transferred without shaking or not. The state of the detection signal is the state immediately before the component is transferred. Therefore, in the first aspect, the component mounting nozzle is controlled based on the detection signal, so that the pickup unit can transfer the component picked up in a non-contact manner to the component mounting nozzle with reduced shaking. This increases the likelihood of achieving proper component transfer.

[0015] In the bonding device according to a second aspect, the control unit may start suction of the component by the component mounting nozzle based on the detection signal. Note that the second aspect may be dependent on the first aspect.

[0016] This allows the control unit to start suction of the component by the component mounting nozzle when there is a high possibility that the component will be delivered without shaking. As a result, the component mounting nozzle can receive the component from the pickup unit with reduced shaking. This increases the possibility that the component will be delivered properly.

[0017] In the bonding device according to a third aspect, the control unit may start suction of the component by the component mounting nozzle when the detection value indicated by the detection signal is within a predetermined range. Note that the third aspect may be dependent on the first or second aspect.

[0018] For example, it has been confirmed in advance that when the detection value is within a predetermined range, there is a high probability that the component will be transferred from the pickup unit to the component mounting nozzle without shaking. Therefore, since there is a high probability that the component will not shake when the detection value is within that predetermined range, in the third aspect, by starting suction of the component by the component mounting nozzle at that time, it is possible to increase the probability that the component will be transferred appropriately.

[0019] In the bonding device according to a fourth aspect, the control unit may adjust the position of the component mounting nozzle based on the detection signal. Note that the fourth aspect may be subordinate to any one of the first to third aspects.

[0020] This allows the vertical position of the component mounting nozzle to be changed depending on the state of the detection signal. The influence of the component being picked up by the pickup unit in a non-contact manner, i.e., the influence of sound waves such as ultrasonic waves generated by the vibration of the vibrator, on the component being picked up can be changed depending on the position of the component mounting nozzle. This increases the likelihood of reducing component wobble and improving the likelihood of proper component transfer.

[0021] In the bonding device according to a fifth aspect, the control unit may move the component mounting nozzle closer to the pickup unit until the detection value indicated by the detection signal falls within a predetermined range. Note that the fifth aspect may be dependent on the fourth aspect.

[0022] As a result, even if the detection value is not within the predetermined range, the component mounting nozzle approaches the pickup unit until the detection value falls within the predetermined range. When the detection value falls within the predetermined range, the component is likely to remain stable. Therefore, when the component is in this state, starting suction of the component by the component mounting nozzle increases the likelihood of achieving proper component transfer.

[0023] In the bonding device according to a sixth aspect, the control unit may move the component mounting nozzle away from the pickup unit if the detection value indicated by the detection signal is smaller than a predetermined value. Note that the sixth aspect may be dependent on the fourth or fifth aspect.

[0024] For example, the predetermined value is the lower limit of the predetermined range. In this case, even if the detected value is smaller than the predetermined value, i.e., even if it is smaller than the predetermined range, the component mounting nozzle moves away from the pickup unit until the detected value falls within the predetermined range. When the detected value falls within the predetermined range, the component is likely to remain stable. Therefore, when the component is in this condition, starting suction of the component by the component mounting nozzle can increase the likelihood of achieving proper component transfer.

[0025] In the bonding apparatus according to a seventh aspect, the control unit may be configured to further control the vibrator of the pickup unit, and adjust the vibration intensity of the vibrator based on the detection signal when the component mounting nozzle receives the component from the pickup unit. Note that the seventh aspect may be subordinate to any one of the first to sixth aspects.

[0026] This controls the vibration intensity of the vibrator based on the detection signal, thereby changing the influence on the component picked up by the pickup unit in a non-contact manner, i.e., the influence on the component picked up by the pickup unit from the ultrasonic waves and other sound waves generated by the vibration of the vibrator. This increases the possibility of reducing component vibration, and the pickup unit can deliver the component picked up in a non-contact manner to the component mounting nozzle with reduced vibration. This increases the possibility of achieving proper component delivery.

[0027] In the bonding device according to an eighth aspect, the control unit may be configured to further control a suction force with which the component is sucked by the pickup unit, and adjust the suction force of the pickup unit based on the detection signal when the component mounting nozzle receives the component from the pickup unit. Note that the eighth aspect may be dependent on any one of the first to seventh aspects.

[0028] This allows the suction force of the pickup unit to be adjusted based on the detection signal, so that components can be attracted toward or moved away from the pickup nozzle. As a result, the influence on components picked up by the pickup unit without contact, i.e., the influence of sound waves such as ultrasonic waves generated by the vibration of the vibrator, can be changed. This increases the possibility of reducing component vibration, and the pickup unit can transfer components picked up without contact to the component mounting nozzle with reduced vibration. This increases the possibility of achieving proper component transfer.

[0029] Furthermore, a control method according to a first aspect is a control method for controlling a bonding device that includes a pickup unit that picks up components in a non-contact manner and a component mounting nozzle, wherein the pickup unit includes a pickup nozzle having a suction hole for sucking the component and a vibrator that vibrates the pickup nozzle to generate sound waves from the pickup nozzle, and the control method acquires a detection signal output from the pickup unit in response to the vibration of the pickup nozzle, and controls the component mounting nozzle based on the detection signal to cause the component mounting nozzle to receive the component from the pickup unit and to bond the component to another component.

[0030] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0031] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step sequences shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in the independent claims that represent the highest concepts are described as optional components. Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, identical components in each figure are assigned the same reference numerals. Furthermore, expressions such as "approximately the same" are used in the following embodiments. For example, "approximately the same" does not only mean completely the same, but also means substantially the same, with an error of, for example, a few percent. Furthermore, "approximately the same" means the same to the extent that the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately the same."

[0032] (Embodiment) FIG. 1 is a perspective view of a component mounting apparatus according to the present embodiment.

[0033] The component mounting apparatus 1 in this embodiment picks up components and mounts the picked-up components on the substrate 7. Therefore, the component mounting apparatus 1 in this embodiment is equipped with a pickup system that picks up components. Mounting components on the substrate 7 is also referred to as bonding the components to the substrate 7. Therefore, the component mounting apparatus 1 is also referred to as a bonding apparatus. The substrate 7 in this embodiment is not limited to a specific type of substrate and may be a silicon substrate, a component, a silicon chip, or the like. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, a direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, left-right direction, or lateral direction, and a direction perpendicular to the Y-axis direction in the perpendicular plane is referred to as the X-axis direction or depth direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In this disclosure, the positive side in the X-axis direction is the rear side or back, and the negative side in the X-axis direction is the front side or front. An example of a component is a semiconductor chip or chips. In this disclosure, "pickup" refers to the action of holding a component, or, among the actions of holding a component, particularly the action of picking up a component from an adhesive sheet such as dicing tape.

[0034] The component mounting device 1 includes a base 2, a component supply unit 3, a board holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is the base of the component mounting device 1 and supports each of the components included in the component mounting device 1.

[0035] The component supply unit 3 is placed on the base 2 and supplies components to the component holder 15. The component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a movable plate 32, and multiple support members 33. The holding table 3a holds the semiconductor wafer unit 6 aligned horizontally. The semiconductor wafer unit 6 includes an adhesive sheet 6b and multiple chips 6a. The multiple chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet also known as dicing tape. The multiple chips 6a are affixed to the upper surface of the adhesive sheet 6b. Each of the multiple support members 33 is a columnar member placed on the movable plate 32 so as to stand upright from the movable plate 32. The multiple support members 33 support the holding table 3a while separating the semiconductor wafer unit 6 held by the holding table 3a above the movable plate 32. The movable plate 32 is a plate placed on the XY table mechanism 31. The XY table mechanism 31 moves the movable plate 32 in the X-axis direction and the Y-axis direction. As the movable plate 32 moves, the semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction. In other words, the multiple chips 6a move along the XY plane.

[0036] The pickup camera 21 is disposed above the component supply section 3 and captures an image of the chip 6 a to be picked up from the semiconductor wafer unit 6 .

[0037] The substrate holder 5 holds the substrate 7 in a horizontally aligned state. Such a substrate holder 5 is provided with transport rails 5a. The substrate holder 5 positions and holds the substrate 7 transported by the transport rails 5a at a mounting position. The mounting position is a position where the chip 6a is mounted.

[0038] The component holder 15 includes an arm 15a, a rotational movement mechanism 15b, and a pickup unit 14. The arm 15a is a columnar member that is attached to the rotational movement mechanism 15b along the X-axis direction. That is, one longitudinal end (i.e., the base end) of the arm 15a is attached to the rotational movement mechanism 15b. The pickup unit 14 is attached to the other end (i.e., the tip end) of the arm 15a.

[0039] The rotational movement mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis, Y-axis, and Z-axis directions. Furthermore, the rotational movement mechanism 15b rotates the arm 15a around a central axis along the longitudinal direction of the arm 15a. In other words, the rotational movement mechanism 15b rotates the arm 15a around the X-axis. The pickup unit 14 is attached to the tip of the arm 15a as described above. The pickup unit 14 also includes a pickup nozzle 14a, made of, for example, metal, that holds the chip 6a non-contact by vacuum suction and ultrasonic waves. Note that vacuum suction is an action of sucking air and is also simply referred to as suction. Therefore, the pickup nozzle 14a is driven by the rotational movement mechanism 15b to move in the X-axis, Y-axis, and Z-axis directions and rotate around the X-axis. The rotational movement mechanism 15b also moves the pickup nozzle 14a based on the image captured by the pickup camera 21. This allows rotational movement mechanism 15b to lower pickup nozzle 14a so that it can accurately approach the top surface of chip 6a to be picked up. Note that pickup nozzle 14a in this embodiment is also referred to simply as a nozzle, and has an opening for holding chip 6a in a non-contact manner using vacuum suction and ultrasonic waves.

[0040] The frame 11 is disposed on the positive side of the X-axis direction on the base 2, and includes two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support the Y-axis frame 11b while the Y-axis frame 11b is aligned along the Y-axis direction and spaced above the top surface of the base 2. In other words, the Y-axis frame 11b is suspended by the two support posts 11a. As described above, the rotational movement mechanism 15b is suspended from this Y-axis frame 11b.

[0041] Y-axis drive mechanism 12 is attached to the surface of Y-axis frame 11b on the negative side in the X-axis direction, and moves component mounting section 13 in the Y-axis direction. Component mounting section 13 includes a mounting unit 20. Component mounting section 13 receives chip 6a held by pickup nozzle 14a using mounting unit 20, and mounts chip 6a on board 7 positioned at the mounting position.

[0042] FIG. 2 is a diagram for explaining the operation of component mounting apparatus 1 to mount chip 6 a on substrate 7 .

[0043] The component mounting device 1 picks up a chip 6a that is positioned at a predetermined pick-up work position P in the XY plane from among multiple chips 6a attached to an adhesive sheet 6b, and mounts the chip 6a on a substrate 7.

[0044] Specifically, the XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to place the chip 6 a to be picked up at the pick-up work position P. The chip 6 a to be picked up that has been placed at the pick-up work position P is pushed up by the push-up section 34.

[0045] 2, the component mounting apparatus 1 in this embodiment is provided with a push-up unit 34 arranged at the pick-up operation position P. The push-up unit 34 may also be provided in the component supply unit 3. The push-up unit 34 pushes up the chip 6a attached to the adhesive sheet 6b from below to above via the adhesive sheet 6b. Specifically, the push-up unit 34 pushes up the chip 6a to be picked up that is arranged at the pick-up operation position P.

[0046] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. The pickup camera 21 captures an image of the pickup operation position P and its surroundings among the multiple chips 6a attached to the adhesive sheet 6b from above the component supply unit 3. This captures an image of the chip 6a to be picked up, and the position of the chip 6a to be picked up is recognized based on the image capture result. In other words, the position of the chip 6a is recognized.

[0047] The pickup nozzle 14a of the pickup unit 14 is lowered by the rotational movement mechanism 15b, approaches the chip 6a from above, the position of which has been recognized based on the image capture results of the pickup camera 21, and holds the chip 6a. The pickup nozzle 14a then rises while holding the chip 6a, and further moves, for example, to the negative side in the Y-axis direction. Here, the pickup nozzle 14a faces upward with the lower surface (i.e., the bottom surface) of the held chip 6a as a result of the rotation of the arm 15a by the rotational movement mechanism 15b. As a result, the chip 6a is held by the pickup nozzle 14a in an upside-down state.

[0048] 2, the component mounting section 13 includes not only the mounting unit 20 but also a movable plate 13a, an elevating mechanism 13b, and an elevating plate 13c. The movable plate 13a is attached to the Y-axis driving mechanism 12 so as to be movable in the Y-axis direction. In other words, the movable plate 13a moves in the Y-axis direction by being driven by the Y-axis driving mechanism 12.

[0049] The lifting mechanism 13b is attached to the front of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a, which holds the chip 6a in an upside-down state, for example. For example, the component mounting nozzle 20a is moved above the chip 6a by the driving of the Y-axis drive mechanism 12 and the lifting mechanism 13b, and holds the chip 6a by, for example, vacuum suction. Then, while holding the chip 6a, the component mounting nozzle 20a moves toward the substrate 7 along the Y-axis direction and mounts the chip 6a on the substrate 7.

[0050] That is, the component mounting nozzle 20 a in this embodiment is configured to receive the chip 6 a from the pickup unit 14 of the component holder 15 and bond the chip 6 a to another component such as the substrate 7 .

[0051] FIG. 3 is a diagram showing a schematic example of the main configuration of the component mounting apparatus 1 according to the present embodiment.

[0052] The component mounting apparatus 1 in this embodiment includes a component mounting unit 13 having a component mounting nozzle 20a, a Y-axis drive mechanism 12, a pickup system 100, and a control unit 101. The pickup system 100 is provided in the component mounting apparatus 1 and is a system for picking up the chip 6a in a non-contact manner, and includes, for example, the component holding unit 15 and the push-up unit 34 described above.

[0053] The component holder 15 includes a pickup unit 14, a negative pressure generator 153, and a rotational movement mechanism 15b. The pickup unit 14 is a mechanism for picking up the chip 6a in a non-contact manner, and includes a pickup nozzle 14a, an ultrasonic generator 152a, and an ultrasonic horn 152b.

[0054] The ultrasonic generator 152a vibrates the pickup nozzle 14a to generate ultrasonic waves from the pickup nozzle 14a. Specifically, the ultrasonic generator 152a has, for example, a Langevin-type ultrasonic vibrator, which vibrates (i.e., ultrasonically vibrates) in response to the voltage applied to the ultrasonic vibrator. The ultrasonic horn 152b is connected to the ultrasonic generator 152a and the pickup nozzle 14a, amplifying the vibrations of the ultrasonic generator 152a and transmitting them to the pickup nozzle 14a. As a result, ultrasonic waves are generated around the opening 14b of the pickup nozzle 14a. In other words, the pickup nozzle 14a vibrates ultrasonically in the vertical direction, transmitting the vibrations to the air in contact with the underside of the pickup nozzle 14a. For example, the ultrasonic generator 152a vibrates the pickup nozzle 14a ultrasonically with a maximum amplitude of approximately 10 to 20 μm. The pickup nozzle 14a uses the ultrasonic waves generated by the vibrations to pick up the tip 6a in a non-contact manner.

[0055] In this embodiment, the ultrasonic generator 152a generates ultrasonic waves having a frequency of, for example, 20 kHz or higher, but may also generate sound waves in the broad sense. In this case, the ultrasonic generator 152a may be called a sound wave generator, a sound wave vibrator, or a vibrator. In other words, the sound waves generated by the ultrasonic generator 152a may be sound waves in the narrow sense, i.e., elastic waves that propagate through the air at a frequency audible to humans (e.g., 10 kHz or higher but less than 20 kHz), or may be ultrasonic waves. In other words, the ultrasonic generator 152a in this embodiment may generate elastic waves of any frequency in the air as long as they can exert a repulsive force on the tip 6a.

[0056] The negative pressure generator 153 generates negative pressure in the suction hole 14c of the pickup nozzle 14a. In this embodiment, the negative pressure generator 153 is configured as, for example, a vacuum pump. Specifically, the ultrasonic horn 152b has a suction path 152c, which is a hole for sucking the tip 6a, and the pickup nozzle 14a has a suction hole 14c connected to the suction path 152c and communicating with the opening 14b. The negative pressure generator 153 generates negative pressure around the opening 14b of the pickup nozzle 14a by creating a negative pressure within the suction path 152c and the suction hole 14c. In other words, the negative pressure generator 153 generates negative pressure around the opening 14b by sucking air around the opening 14b through the suction path 152c and the suction hole 14c. The negative pressure generator 153 also has an adjustment valve for adjusting the negative pressure and generates negative pressure of a magnitude corresponding to the opening of the adjustment valve.

[0057] The pickup nozzle 14a is a nozzle having a suction hole 14c for sucking the tip 6a. The pickup nozzle 14a holds the tip 6a in a non-contact manner around the opening 14b based on a repulsive force that pulls the tip 6a away from the pickup nozzle 14a, generated by the ultrasonic waves of the ultrasonic generator 152a, and a suction force that attracts the tip 6a to the pickup nozzle 14a, generated by the negative pressure of the negative pressure generator 153. The repulsive force is a force generated by the formation of a squeeze film by the ultrasonic waves. This repulsive force is not limited to ultrasonic waves, and may be a force generated by sound waves in a broad sense.

[0058] The rotational movement mechanism 15b includes, for example, a motor, and moves the pickup nozzle 14a in the X-axis, Y-axis, and Z-axis directions. The rotational movement mechanism 15b also rotates the arm 15a, thereby rotating the pickup nozzle 14a of the pickup unit 14 attached to the tip of the arm 15a. The time required for the pickup nozzle 14a to rotate 180 degrees, i.e., the time required for the pickup nozzle 14a to reverse, is, for example, less than 0.5 seconds.

[0059] The push-up unit 34 has a plurality of push-up pins 34a, and raises and lowers the plurality of push-up pins 34a. The plurality of push-up pins 34a rise and push up the adhesive sheet 6b, thereby pushing up the chips 6a attached to the adhesive sheet 6b.

[0060] The control unit 101 controls the component mounting unit 13, the Y-axis drive mechanism 12, the push-up unit 34, and the component holding unit 15. That is, the control unit 101 controls the component mounting nozzle 20a, the Y-axis drive mechanism 12, the push-up unit 34, the ultrasonic generator 152a, the negative pressure generator 153, and the rotational movement mechanism 15b. For example, the control unit 101 adjusts the repulsive force on the chip 6a by controlling the voltage applied to the ultrasonic vibrator of the ultrasonic generator 152a. The control unit 101 also adjusts the suction force on the chip 6a by controlling the adjustment valve of the negative pressure generator 153. This allows for effective adjustment of the repulsive and suction forces on the chip 6a. The control unit 101 also controls the component mounting unit 13 and the Y-axis drive mechanism 12 to raise and lower the component mounting nozzle 20a, move the component mounting nozzle 20a in the Y-axis direction, and adsorb the chip 6a onto the component mounting nozzle 20a. The component mounting nozzle 20a picks up the chip 6a by sucking air. That is, the component mounting nozzle 20a attracts and picks up the chip 6a by sucking in the surrounding air, in other words, by sucking in the chip 6a.

[0061] In this embodiment, the component holder 15 includes the ultrasonic wave generator 152a and the negative pressure generator 153, but the ultrasonic wave generator 152a and the negative pressure generator 153 do not have to be included in the component holder 15. Also, in this embodiment, the ultrasonic horn 152b and the pick-up nozzle 14a are separate entities, but they may be integrated into one body. In other words, the pick-up unit 14 does not have to include the ultrasonic horn 152b.

[0062] 4A and 4B are diagrams showing an example of the operation of the pickup system 100 in this embodiment, in which the pickup nozzle 14a is used to pick up the chip 6a and deliver it to the component mounting nozzle 20a.

[0063] For example, when the XY table mechanism 31 moves the movable plate 32, the adhesive sheet 6b held on the holding table 3a moves in the X-axis direction and the Y-axis direction. This movement of the adhesive sheet 6b causes the chip 6a to be picked up to be positioned at the pick-up operation position P, as shown in (a) of Figure 4A. That is, the chip 6a to be picked up is positioned on the multiple push-up pins 34a of the push-up unit 34.

[0064] Next, as shown in (b) of FIG. 4A, the push-up unit 34 raises the multiple push-up pins 34a, pushing up the chip 6a through the adhesive sheet 6b. Then, as shown in (c) of FIG. 4A, the pickup nozzle 14a descends, and the ultrasonic generator 152a generates ultrasonic waves. Specifically, the ultrasonic generator 152a vibrates the pickup nozzle 14a via the ultrasonic horn 152b under the control of the control unit 101, generating ultrasonic waves from around the opening 14b of the pickup nozzle 14a. The ultrasonic waves generated by the ultrasonic generator 152a are generated by the pickup nozzle 14a vibrating at a vibration speed of, for example, 10 mm / s or more and 5000 mm / s or less. Next, as shown in (d) of FIG. 4A, the negative pressure generator 153 suctions air under the control of the control unit 101. This generates negative pressure around the opening 14b of the pickup nozzle 14a. As a result, control unit 101 causes pick-up nozzle 14a to hold tip 6a without contact, using the suction force caused by the negative pressure around opening 14b and the repulsive force caused by the ultrasonic waves around opening 14b. In other words, pick-up nozzle 14a holds tip 6a without contact, using the suction force that draws tip 6a toward opening 14b of pick-up nozzle 14a and the repulsive force that moves tip 6a away from opening 14b.

[0065] In other words, the pickup unit 14, specifically the pickup nozzle 14a, picks up the chip 6a without contact. Alternatively, the pickup unit 14, specifically the pickup nozzle 14a, is in a non-contact holding state. In this non-contact holding state, a gap of, for example, about 20 to 60 μm in width is generated between the pickup nozzle 14a and the chip 6a.

[0066] Then, as shown in (a) of FIG. 4B, the control unit 101 controls the rotational movement mechanism 15b to raise the pickup nozzle 14a. In other words, the chip 6a is peeled off from the adhesive sheet 6b and rises. Furthermore, as shown in (b) of FIG. 4B, the control unit 101 controls the rotational movement mechanism 15b to rotate the pickup nozzle 14a. That is, as shown in (b) and (c) of FIG. 4B, the rotational movement mechanism 15b rotates the arm 15a, thereby rotating the pickup nozzle 14a by 180 degrees so that the opening 14b of the pickup nozzle 14a faces upward. In other words, as the arm 15a rotates, the pickup unit 14 attached to the tip of the arm 15a is inverted. As a result, the pickup nozzle 14a included in the pickup unit 14 is inverted. This also inverts the chip 6a held in a non-contact state by the pickup nozzle 14a, and the lower surface of the chip 6a, which was attached to the adhesive sheet 6b, faces upward. Before inverting the pickup nozzle 14a, the rotational movement mechanism 15b may move the pickup nozzle 14a in the X-axis direction and the Y-axis direction to a chip transfer position where the chip 6a is transferred to the component mounting nozzle 20a.

[0067] 4B(c), the component mounting nozzle 20a picks up the inverted chip 6a from above, and as a result, the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0068] Fig. 5 is a diagram showing an example of the appearance of the pickup unit 14. Fig. 5(a) is a perspective view of the pickup unit 14, and Fig. 5(b) is a diagram showing the appearance of the pickup unit 14 as seen from the negative side in the Z axis direction.

[0069] As shown in FIG. 5A, the pickup unit 14 includes an ultrasonic generator 152a, an ultrasonic horn 152b, and a pickup nozzle 14a, which are connected in this order from the positive side in the Z axis direction. The pickup nozzle 14a includes a first portion 14aa, a second portion 14ab, and a third portion 14ac, which are arranged in this order from the positive side in the Z axis direction. The third portion 14ac has a shape corresponding to the shape of the chip 6a. This allows the chip 6a to be held appropriately and non-contact without being restricted by the shape and size of the second portion 14ab. Specifically, the third portion 14ac is connected to the bottom surface of the second portion 14ab and has a rectangular parallelepiped shape. This rectangular parallelepiped shape corresponds to the shape of the chip 6a. In other words, the bottom surface of the third portion 14ac has substantially the same shape and size as the top surface of the chip 6a. More specifically, the third portion 14ac, i.e., the lower surface of the third portion 14ac, has a rectangular shape with a longitudinal side and a lateral side, which allows the rectangular chip 6a to be held appropriately in a non-contact manner.

[0070] The pickup unit 14 outputs a detection signal corresponding to the vibration of the pickup nozzle 14a, and the control unit 101 in this embodiment controls the component mounting nozzle 20a based on the detection signal.

[0071] FIG. 6 is a diagram for explaining the electrical configuration of the pickup unit 14. As shown in FIG.

[0072] The ultrasonic wave generator 152a included in the pickup unit 14 has a piezoelectric element 51 for vibrating the pickup nozzle 14a. Specifically, the piezoelectric element 51 is included in the vibrator described above. An AC voltage is applied to the piezoelectric element 51 by the AC power supply 201. This causes the piezoelectric element 51 to vibrate periodically. As a result, the pickup nozzle 14a vibrates.

[0073] The pickup unit 14 in this embodiment also includes a detection element 52 that detects the vibration of the pickup nozzle 14a and outputs the detection signal. Specifically, the detection element 52 is a piezoelectric element that outputs a detection signal indicating a detection value corresponding to the vibration speed of the pickup nozzle 14a. More specifically, the detection element 52 outputs a detection signal indicating a larger detection value as the vibration speed of the pickup nozzle 14a increases. For example, the detection signal is a sine wave signal corresponding to the frequency of the AC power supply 201, and the detection value indicated by the detection signal is a voltage value. The faster the vibration speed, the larger the amplitude of the detection signal, i.e., the detection value at the peak of each crest included in the wave of the detection signal. The vibration speed and the amplitude of the detection signal may be proportional to each other.

[0074] The monitoring circuit 53 monitors the detection signal output from the detection element 52 and outputs the detection signal to the control unit 101. The monitoring circuit 53 may be provided in the ultrasonic generator 152a, the pickup unit 14, the control unit 101, or the pickup system 100. The monitoring circuit 53 may also perform digital signal processing on the detection signal to convert the detection signal into a signal format that can be processed by the control unit 101, and output the converted detection signal to the control unit 101. For example, the monitoring circuit 53 may output to the control unit 101, as the converted detection signal, a signal that indicates only the detection values ​​at the peaks of the waves of the detection signal output from the detection element 52.

[0075] The control unit 101 in this embodiment controls the component mounting nozzle 20a based on such a detection signal.

[0076] FIG. 7 is a diagram for explaining the state when the chip 6a is transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0077] As shown in (c) of FIG. 4B, the pickup nozzle 14a rotates so that the opening 14b of the pickup nozzle 14a faces upward. At this time, as shown in (a) of FIG. 7, the pickup nozzle 14a holds the chip 6a on its upper side without contact. That is, ultrasonic waves generated around the opening 14b of the pickup nozzle 14a generate pressure Pr1 between the pickup nozzle 14a and the chip 6a. This pressure Pr1 generates the repulsive force described above, causing the chip 6a to float above the pickup nozzle 14a. The ultrasonic waves then cause the chip 6a to vibrate slightly in the vertical direction. For example, the vibration frequency of the chip 6a is approximately the same as the vibration frequency of the pickup nozzle 14a. When the pickup nozzle 14a and the chip 6a are in this state, the component mounting nozzle 20a descends toward the chip 6a.

[0078] As shown in FIG. 7B, when the component mounting nozzle 20a approaches the chip 6a, the chip 6a vibrates, generating pressure Pr2 between the chip 6a and the component mounting nozzle 20a. This pressure Pr2 generates a repulsive force that separates the chip 6a and the component mounting nozzle 20a. Then, as shown in FIG. 7C, the component mounting nozzle 20a descends further toward the chip 6a in order to receive the chip 6a from the pickup nozzle 14a, that is, to pick up the chip 6a by suction. This narrows the gap between the component mounting nozzle 20a and the pickup nozzle 14a, bringing the chip 6a closer to the pickup nozzle 14a, and increasing pressures Pr1 and Pr2.

[0079] The chip 6a is subjected to a large repulsive force from above and below due to the large pressures Pr1 and Pr2, which may cause the chip 6a to wobble or shift in the Y-axis or X-axis direction, or rotate around an axis along the Z-axis, as shown in Fig. 7(d).

[0080] FIG. 8 is a diagram for explaining the state of the chip 6a that has been delivered to the component mounting nozzle 20a.

[0081] As shown in FIG. 7B, the component mounting nozzle 20a begins suction when the chip 6a is held by the pickup nozzle 14a without contacting the component mounting nozzle 20a and is not in contact with the component mounting nozzle 20a. That is, the control unit 101 generates negative pressure in the suction hole 20b formed in the component mounting nozzle 20a by controlling, for example, the negative pressure generator 153 provided in the component mounting unit 13. As a result, the chip 6a is sucked onto the component mounting nozzle 20a. This allows the chip 6a to be transferred from the pickup nozzle 14a to the component mounting nozzle 20a. When the chip 6a is properly transferred, as shown in FIG. 8A, the chip 6a is sucked onto the component mounting nozzle 20a at a predetermined position and in a predetermined orientation, as shown in FIG.

[0082] However, if the component mounting nozzle 20a begins to pick up the chip 6a while it is misaligned, wobbling, or rotating, as shown in FIG. 7D, the chip 6a may be improperly transferred, as shown in FIG. 8B. That is, the chip 6a may be picked up at a position that is different from the predetermined position of the component mounting nozzle 20a, as shown in FIG. 8B. Alternatively, the chip 6a may be picked up while facing in a direction different from the predetermined direction. As a result, the accuracy of transferring the chip 6a to the component mounting nozzle 20a may be reduced. Furthermore, there is a risk that the chip 6a may come into contact with the pickup nozzle 14a.

[0083] Therefore, the control unit 101 in this embodiment controls the component mounting nozzle 20a based on the detection signal so that the chip 6a is transferred appropriately. The control unit 101 may also control the pickup unit 14.

[0084] Fig. 9 is a diagram showing an example of the detection value indicated by the detection signal. Specifically, the detection value is the voltage value of each peak included in the sine wave-like voltage waveform output from the detection element 52, and Fig. 9 shows the voltage value in the form of a graph. The vertical axis of the graph represents the voltage value, and the horizontal axis represents time.

[0085] For example, the state of the detection signal can be any one of states 1 to 5. Note that the state of the detection signal is a state during a detection period in which the pickup nozzle 14a and the component mounting nozzle 20a are not moving and the suction force and ultrasonic output of the pickup unit 14 are kept constant.

[0086] Specifically, when the detection signal is in the first state, the detection value indicated by the detection signal is equal to or greater than V3. In this first state, as shown in FIG. 7A, the component mounting nozzle 20a is far above the chip 6a and the pickup nozzle 14a, causing the pickup nozzle 14a to vibrate greatly. In this first state, because the component mounting nozzle 20a is far away from the chip 6a, even if suction by the component mounting nozzle 20a begins, the chip 6a may not be picked up by the component mounting nozzle 20a and may not be delivered to the component mounting nozzle 20a.

[0087] On the other hand, when the detection signal is in the fourth state, the detection value indicated by the detection signal is smaller than value V2. Value V2 is also smaller than value V3. In this fourth state, as shown in (c) and (d) of Figures 7A and 7B, the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a, so the vibration of the pickup nozzle 14a is significantly suppressed by pressures Pr1 and Pr2. In this fourth state, the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a, which may cause the chip 6a to shift, wobble, or rotate. Therefore, when suction by the component mounting nozzle 20a begins, the chip 6a may be improperly transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0088] Furthermore, when the state of the detection signal is the fifth state, the detection value indicated by the detection signal is smaller than value V1. Value V1 is also smaller than the aforementioned value V2. In this fifth state, the component mounting nozzle 20a approaches the chip 6a and the pickup nozzle 14a even closer until the chip 6a comes into contact with the pickup nozzle 14a. As a result, the vibration of the pickup nozzle 14a is further suppressed. When the chip 6a comes into contact with the pickup nozzle 14a, the chip 6a may be scratched, for example, and treated as a defective product. Therefore, value V1 can be considered a threshold for determining whether or not the chip 6a is to be treated as a defective product. Therefore, when the state of the detection signal is the fifth state, the chip 6a is discarded.

[0089] Furthermore, when the detection signal is in the second state, the detection value indicated by the detection signal is maintained substantially constant and stable within a predetermined range greater than or equal to V2 and less than V3. In this second state, as shown in FIG. 7B, the component mounting nozzle 20a is neither too close nor too far from the chip 6a and the pickup nozzle 14a. As a result, the pickup nozzle 14a vibrates less than in the first state and more than in the fourth state. Therefore, when the component mounting nozzle 20a starts suction while the detection signal is in the second state, the chip 6a is properly transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0090] Furthermore, when the state of the detection signal is in the third state, the detection value indicated by the detection signal is unstable due to fluctuations. In this third state, the chip 6a may be significantly shaken, for example, in the vertical direction. Therefore, if suction by the component mounting nozzle 20a is started while the detection signal is in the third state, the chip 6a may be improperly transferred from the pickup nozzle 14a to the component mounting nozzle 20a.

[0091] Therefore, in this embodiment, the control unit 101 determines whether the state of the detection signal is state 1 to state 5, and controls the component mounting nozzle 20a according to the determination result. Note that the control unit 101 may further control the component mounting nozzle 20a and the pickup unit 14 according to the determination result, or may control the pickup unit 14 without controlling the component mounting nozzle 20a.

[0092] FIG. 10 is a flowchart showing an example of the processing operation of the component mounting apparatus 1, which is a joining apparatus in this embodiment.

[0093] First, the control unit 101 controls the rotational movement mechanism 15b to rotate the pickup unit 14 (step S1). This causes the pickup nozzle 14a to rotate, as shown in FIG. 4B . Then, the control unit 101 controls the Y-axis drive mechanism 12 and other components to move the component mounting nozzle 20a of the mounting unit 20 to above the pickup nozzle 14a. Furthermore, the control unit 101 controls the lifting mechanism 13b and other components to lower the component mounting nozzle 20a so that the component mounting nozzle 20a approaches the chip 6a held by the pickup nozzle 14a without contacting it (step S2).

[0094] Next, the control unit 101 acquires the detection signal output from the detection element 52 via the monitoring circuit 53 (step S3). That is, the control unit 101 acquires the detection value during a predetermined detection period. Then, the control unit 101 determines whether the acquired detection value is within a predetermined range and stable (step S4). That is, the control unit 101 determines whether the state of the detection signal is the second state. Here, if the control unit 101 determines that the detection value is within the predetermined range and stable (Yes in step S4), that is, if the control unit 101 determines that the state of the detection signal is the second state, it starts suction by the component mounting nozzle 20a (step S5). This transfers the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a. Thus, in this embodiment, the control unit 101 starts suction of the chip 6a by the component mounting nozzle 20a based on the detection signal. That is, if the detection value indicated by the detection signal is within the predetermined range, the control unit 101 starts suction of the chip 6a by the component mounting nozzle 20a.

[0095] Then, the control unit 101 stops the suction and ultrasonic wave output by the pickup unit 14 (step S6). That is, the control unit 101 stops the generation of negative pressure by the negative pressure generator 153 and further causes the ultrasonic wave generator 152a to stop vibrating the pickup nozzle 14a. Thereafter, the component mounting nozzle 20a moves while suctioning the chip 6a, and mounts the chip 6a on the board 7.

[0096] On the other hand, if the control unit 101 determines in step S4 that the acquired detection value is not within the predetermined range and stable (No in step S4), it further determines whether the detection value is unstable (step S7). That is, the control unit 101 determines whether the state of the detection signal is in the third state. Here, if the control unit 101 determines that the detection value is unstable (Yes in step S7), that is, if it determines that the state of the detection signal is in the third state, it executes a first adjustment process (step S8). In the first adjustment process, for example, the control unit 101 adjusts the position of the component mounting nozzle 20a by controlling the lifting mechanism 13b based on the detection signal. Then, the control unit 101 repeatedly executes the process from step S3.

[0097] Furthermore, if the control unit 101 determines that the detection value is not unstable (No in step S7), it further determines whether the detection value is less than value V2, which is the lower limit of the predetermined range, and greater than or equal to threshold value V1 (step S9). That is, the control unit 101 determines whether the state of the detection signal is in the fourth state. Here, if the control unit 101 determines that the detection value is less than value V2 and greater than or equal to threshold value V1 (Yes in step S9), that is, if the control unit 101 determines that the state of the detection signal is in the fourth state, it executes a second adjustment process (step S10). In the second adjustment process, for example, the control unit 101 controls the lifting mechanism 13b to raise the component mounting nozzle 20a. That is, if the detection value indicated by the detection signal is smaller than a predetermined value, the control unit 101 moves the component mounting nozzle 20a away from the pickup unit 14. The predetermined value is, for example, value V2, which is the lower limit of the predetermined range. Then, the control unit 101 repeatedly executes the process from step S3.

[0098] On the other hand, if the control unit 101 determines in step S9 that the acquired detection value is not less than value V2 and not greater than or equal to threshold value V1 (No in step S9), it further determines whether the detection value is less than threshold value V1 (step S11). That is, the control unit 101 determines whether the state of the detection signal is in the fifth state. Here, if the control unit 101 determines that the detection value is less than threshold value V1 (Yes in step S11), that is, if it determines that the state of the detection signal is in the fifth state, it executes processing to discard the tip 6a (step S12).

[0099] For example, in the process of discarding the chip 6 a, the control unit 101 moves the pickup nozzle 14 a to a predetermined location and stops suction, thereby dropping the chip 6 a held by the pickup nozzle 14 a to that location. Discarding the chip 6 a in this way prohibits the transfer of the chip 6 a from the pickup nozzle 14 a to the component mounting nozzle 20 a.

[0100] Furthermore, in step S11, if the control unit 101 determines that the detection value is not less than the threshold value V1 (No in step S11), that is, if it determines that the state of the detection signal is the first state, it repeats the process from step S2. As a result, the component mounting nozzle 20a descends toward the pickup nozzle 14a. That is, the control unit 101 moves the component mounting nozzle 20a closer to the pickup unit 14 until the detection value indicated by the detection signal falls within a predetermined range.

[0101] By performing steps S1 to S12, the control unit 101 can position the component mounting nozzle 20a at an appropriate position in the Z-axis direction, and can accurately transfer the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a. Note that if the pickup unit 14 picks up a new chip 6a after step S6 or step S12, the control unit 101 repeatedly performs the processes from step S1 on the new chip 6a.

[0102] Here, there are several other examples of the first adjustment process and the second adjustment process other than the above examples.

[0103] FIG. 11 is a diagram showing various examples of the first adjustment process and the second adjustment process.

[0104] The first adjustment process is a process for stabilizing the detection value when the state of the detection signal is in the third state, i.e., when the detection value is unstable. Here, the causes of the detection signal being in the third state are not limited to one, but may be various. Furthermore, the causes may be resolved over time. Therefore, as the first adjustment process, the control unit 101 executes standby, raising and lowering the component mounting nozzle 20a, changing the ultrasonic output from the pickup nozzle 14a, changing the suction force of the pickup nozzle 14a, etc.

[0105] When the first adjustment process is on standby, the control unit 101 keeps the component mounting nozzle 20a and the pick-up nozzle 14a stopped. Furthermore, the control unit 101 keeps the vibrations generated by the ultrasonic generator 152a and the negative pressure generated by the negative pressure generator 153 constant. In other words, the control unit 101 keeps the ultrasonic output and suction force of the pick-up nozzle 14a constant.

[0106] When the first adjustment process is to raise or lower the component mounting nozzle 20a, the control unit 101 controls, for example, the lifting mechanism 13b to raise or lower the component mounting nozzle 20a. Alternatively, the control unit 101 controls the lifting mechanism 13b to lower the component mounting nozzle 20a.

[0107] When the first adjustment process is to change the ultrasonic output of pickup nozzle 14a, control unit 101 controls ultrasonic generator 152a to weaken the intensity of the ultrasonic waves generated from pickup nozzle 14a, or control unit 101 increases the intensity of the ultrasonic waves.

[0108] When the first adjustment process is to change the suction force of pickup nozzle 14a, control unit 101 controls negative pressure generator 153 to increase the suction force of pickup nozzle 14a, or to decrease the suction force.

[0109] By performing such a first adjustment process, it is possible to change the influence on the tip 6a, thereby stabilizing the vibration of the tip 6a and increasing the possibility of stabilizing the detection signal.

[0110] The second adjustment process is a process for raising the detection value when the state of the detection signal is in the fourth state, i.e., when the detection value is smaller than a predetermined range. Here, a possible cause of the detection signal being in the fourth state is that the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a. Therefore, as the second adjustment process, the control unit 101 performs adjustments such as raising the component mounting nozzle 20a, reducing the ultrasonic output of the pickup nozzle 14a, and increasing the suction force of the pickup nozzle 14a.

[0111] When the second adjustment process is to raise the component mounting nozzle 20a, the control unit 101 raises the component mounting nozzle 20a by controlling, for example, the lifting mechanism 13b.

[0112] When the second adjustment process is to reduce the ultrasonic output of the pickup nozzle 14a, the control unit 101 controls the ultrasonic generator 152a to weaken the intensity of the ultrasonic waves generated by the pickup nozzle 14a so that the chip 6a approaches the pickup nozzle 14a. That is, in this embodiment, the control unit 101 is configured to control the vibrator of the pickup unit 14. Then, when the component mounting nozzle 20a receives the chip 6a from the pickup unit 14, the control unit 101 adjusts the vibration intensity of the vibrator based on the detection signal.

[0113] When the second adjustment process is to increase the suction force of the pickup nozzle 14a, the control unit 101 controls the negative pressure generator 153 to strengthen the suction force of the pickup nozzle 14a so that the chip 6a is drawn to the pickup nozzle 14a. As described above, in this embodiment, the control unit 101 is configured to control the suction force with which the chip 6a is sucked by the pickup unit 14. Then, when the component mounting nozzle 20a receives the chip 6a from the pickup unit 14, the control unit 101 adjusts the suction force of the pickup unit 14 based on the detection signal.

[0114] If the component mounting nozzle 20a is too close to the chip 6a and the pickup nozzle 14a, the chip 6a may approach the pickup nozzle 14a. In other words, the chip 6a may come into contact with the pickup nozzle 14a. Therefore, in the second adjustment process, the ultrasonic output may be increased so that the chip 6a moves away from the pickup nozzle 14a. Alternatively, in the second adjustment process, the suction force may be reduced so that the chip 6a moves away from the pickup nozzle 14a.

[0115] By performing such a second adjustment process, the detection value indicated by the detection signal can be increased, and the possibility of changing the state of the detection signal from the fourth state to the second state can be increased.

[0116] As described above, in this embodiment, the control unit 101 controls the component mounting nozzle 20a based on the detection signal. Here, when the chip 6a is transferred from the pickup unit 14 to the component mounting nozzle 20a, the state of the detection signal differs depending on whether there is a high possibility that the chip 6a will be transferred without shaking or whether there is a low possibility of this happening. Note that the state of the detection signal is the state immediately before the chip 6a is transferred. Therefore, in the first aspect, the component mounting nozzle 20a is controlled based on the detection signal, so that the pickup unit 14 can transfer the chip 6a, which it picks up in a non-contact manner, to the component mounting nozzle 20a with reduced shaking. This increases the likelihood that the chip 6a will be transferred appropriately.

[0117] Furthermore, in this embodiment, the control unit 101 starts suction of the chip 6a by the component mounting nozzle 20a based on the detection signal. This allows the control unit 101 to start suction of the chip 6a by the component mounting nozzle 20a when the chip 6a is likely to be delivered without shaking. As a result, the component mounting nozzle 20a can receive the chip 6a from the pickup unit 14 in a state where shaking is suppressed. This increases the likelihood that the chip 6a will be delivered appropriately.

[0118] Furthermore, in this embodiment, the control unit 101 starts suction of the chip 6a by the component mounting nozzle 20a when the detection value is within a predetermined range. For example, it is confirmed in advance that when the detection value is within the predetermined range, there is a high possibility that the chip 6a will be transferred from the pickup unit 14 to the component mounting nozzle 20a without shaking. Therefore, when the detection value is within the predetermined range, there is a high possibility that the chip 6a will not shake. Therefore, in this embodiment, by starting suction of the chip 6a by the component mounting nozzle 20a at that time, it is possible to increase the possibility that the chip 6a will be transferred appropriately.

[0119] Furthermore, in this embodiment, the control unit 101 adjusts the position of the component mounting nozzle 20a based on the detection signal. This allows the position of the component mounting nozzle 20a, for example, in the vertical direction, to be changed depending on the state of the detection signal. This allows the influence on the chip 6a picked up by the pickup unit 14 in a non-contact manner, i.e., the influence on the chip 6a from sound waves such as ultrasonic waves generated by the vibration of the vibrator, to be changed depending on the position of the component mounting nozzle 20a. This increases the possibility of reducing the wobble of the chip 6a and increasing the possibility of achieving proper transfer of the chip 6a.

[0120] Furthermore, in this embodiment, even if the detection value is not within the predetermined range, the control unit 101 moves the component mounting nozzle 20a closer to the pickup unit 14 until the detection value falls within the predetermined range. When the detection value falls within the predetermined range, the chip 6a is likely to be stable, and therefore, by starting suction of the chip 6a by the component mounting nozzle 20a at that time, the possibility of achieving proper transfer of the chip 6a can be increased.

[0121] Furthermore, in this embodiment, if the detection value is smaller than a predetermined value, the control unit 101 moves the component mounting nozzle 20a away from the pickup unit 14. In other words, even if the detection value is smaller than the predetermined range, the component mounting nozzle 20a moves away from the pickup unit 14 until the detection value falls within the predetermined range. When the detection value falls within the predetermined range, the chip 6a is likely to be stable, and therefore, by starting suction of the chip 6a by the component mounting nozzle 20a at that time, the likelihood of achieving proper transfer of the chip 6a can be increased.

[0122] Furthermore, in this embodiment, the vibration intensity of the vibrator is controlled based on the detection signal. Therefore, it is possible to change the influence on the chip 6a picked up by the pickup unit 14 in a non-contact manner, i.e., the influence on the chip 6a from sound waves such as ultrasonic waves generated by the vibration of the vibrator. This increases the possibility of reducing the shaking of the chip 6a, and the pickup unit 14 can deliver the chip 6a picked up in a non-contact manner to the component mounting nozzle 20a with reduced shaking. This increases the possibility of achieving proper delivery of the chip 6a.

[0123] Furthermore, in this embodiment, the suction force of the pickup unit 14 is adjusted based on the detection signal. This allows the chip 6a to be attracted toward or moved away from the pickup nozzle 14a. As a result, the influence on the chip 6a picked up by the pickup unit 14 in a non-contact manner, i.e., the influence of sound waves such as ultrasonic waves generated by the vibration of the vibrator, can be changed. This increases the possibility of reducing the wobble of the chip 6a, and the pickup unit 14 can deliver the chip 6a picked up in a non-contact manner to the component mounting nozzle 20a with reduced wobble. This increases the possibility of achieving proper delivery of the chip 6a.

[0124] (Modification) In the above embodiment, the pickup unit 14 includes the detection element 52. On the other hand, in this modification, the pickup unit 14 does not include the detection element 52, and a signal indicating the current flowing through the piezoelectric element 51 of the ultrasonic generator 152a is output as the detection signal.

[0125] FIG. 12 is a diagram for explaining the electrical configuration of the pickup unit 14 in this modified example.

[0126] As in the above embodiment, the ultrasonic wave generator 152a included in the pickup unit 14 has a piezoelectric element 51 for vibrating the pickup nozzle 14a. A predetermined AC voltage is applied to this piezoelectric element 51 by an AC power supply 201. This causes the piezoelectric element 51 to vibrate periodically. As a result, the pickup nozzle 14a vibrates. The current flowing through the piezoelectric element 51 varies depending on the vibration speed of the pickup nozzle 14a.

[0127] Therefore, in this modification, the pickup unit 14 outputs a signal indicating the current flowing through the piezoelectric element 51 as a detection signal corresponding to the vibration of the pickup nozzle 14a. The monitoring circuit 54 monitors the current flowing through the piezoelectric element 51 and outputs a detection signal indicating the current to the control unit 101. The monitoring circuit 54 may be provided in the ultrasonic generator 152a, the pickup unit 14, the control unit 101, or the pickup system 100. The monitoring circuit 54 may also perform digital signal processing on the detection signal to convert the detection signal into a signal format that can be processed by the control unit 101 and output the converted detection signal to the control unit 101.

[0128] The control unit 101 in this modification controls the component mounting nozzle 20a, etc. based on such detection signals. Therefore, in this modification, the piezoelectric element 51 can be used to vibrate the pickup nozzle 14a and output a detection signal corresponding to the vibration, thereby simplifying the configuration of the pickup unit 14.

[0129] The component mounting apparatus 1, which is a bonding apparatus according to one or more aspects, has been described above based on the embodiment and its modified examples, but the present disclosure is not limited to the embodiment and modified examples. As long as the modifications do not deviate from the spirit of the present disclosure, various modifications that a person skilled in the art can conceive of to the above embodiment or modified examples may also be included in the present disclosure.

[0130] For example, in the above embodiment and modified example, the pickup nozzle 14a holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may also hold the chip 6a in a non-contact manner, similar to the pickup nozzle 14a.

[0131] In the above embodiment, the control unit 101 controls the component mounting nozzle 20a and the like based on a detection signal indicating a voltage value as the detection value. In the modified example, the control unit 101 controls the component mounting nozzle 20a and the like based on a detection signal indicating a current value as the detection value. However, the detection signal may be any signal that indicates a value corresponding to the vibration speed of the pickup nozzle 14a. For example, the detection signal may be a signal indicating impedance.

[0132] Furthermore, the detection element 52 in the above embodiment may have a dielectric constant greater than or equal to that of the piezoelectric element 51 of the ultrasonic generator 152 a. Furthermore, the detection element 52 may have substantially the same configuration as the piezoelectric element 51.

[0133] In each of the above-described embodiments and modifications, the control unit 101 may estimate the vibration velocity of the pick-up nozzle 14a based on the detection signal, and may control the component mounting nozzle 20a, etc., based on the vibration velocity. For example, the control unit 101 may estimate the vibration velocity by multiplying the detection value indicated by the detection signal by a coefficient.

[0134] Furthermore, in the above-described embodiment and modified example, the control unit 101 controls the component mounting nozzle 20a based on the detection signal, but the control unit 101 may control the pickup unit 14 without controlling the component mounting nozzle 20a. In other words, the control unit 101 may control at least one of the suction force and ultrasonic output of the pickup nozzle 14a.

[0135] In the above embodiment and modified example, the control unit 101 controls the pickup system 100 including the pickup nozzle 14a, the Y-axis drive mechanism 12, and the component mounter 13. However, these may be controlled by multiple control units. For example, one of the multiple control units may control the pickup nozzle 14a, and the other control units may control the Y-axis drive mechanism 12 and the component mounter 13.

[0136] In the above-described embodiment and modified examples, the control unit 101 and other components may be configured with dedicated hardware or may be realized by executing a software program suitable for the control unit 101. The control unit 101 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software realizing the control unit 101 and other components causes a computer to execute, for example, each step of the flowchart shown in FIG. 10. Such a processing method by the control unit 101 is also called a control method.

[0137] The following cases are also included in this disclosure:

[0138] (1) Specifically, the control unit 101 may be a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The control unit 101 achieves its functions by the microprocessor operating in accordance with the computer program. Here, the computer program is composed of a combination of multiple instruction codes that indicate commands to the computer to achieve a predetermined function.

[0139] (2) The control unit 101 may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions by the microprocessor operating in accordance with the computer program.

[0140] (3) The control unit 101 may be configured as a removable IC card or a standalone module. The IC card or module is a computer system configured with a microprocessor, ROM, RAM, etc. The IC card or module may include the ultra-multifunctional LSI described above. The IC card or module achieves its functions when the microprocessor operates in accordance with a computer program. This IC card or module may be tamper-resistant.

[0141] The present disclosure is applicable to, for example, devices, units, systems, and the like that pick up parts and perform work using those parts.

[0142] REFERENCE SIGNS LIST 1 Component mounting device (bonding device) 2 Base 3 Component supply unit 3a Holding table 5 Substrate holding unit 5a Transport rail 6 Semiconductor wafer unit 6a Chip (component) 6b ​​Adhesive sheet 7 Substrate 11 Frame 11a Support post 11b Y-axis frame 12 Y-axis drive mechanism 13 Component mounting unit 13a Moving plate 13b Lifting mechanism 13c Lifting plate 14 Pickup unit 14a Pickup nozzle (nozzle) 14aa First portion 14ab Second portion 14ac Third portion 14b Opening 14c Suction hole 15 Component holding unit 15a Arm 15b Rotational movement mechanism 20 Mounting unit 20a Component mounting nozzle 20b Suction hole 21 Pickup camera 31 XY table mechanism 32 Moving plate 33 Support member 34 Push-up portion 34a Push-up pin 51 Piezoelectric element 52 Detection element (piezoelectric element) 53, 54 Monitoring circuit 100 Pickup system 101 Control unit 152a Ultrasonic wave generating unit (vibrator) 152b Ultrasonic wave horn 152c Suction path 153 Negative pressure generating unit 201 AC power supply

Claims

1. A bonding device comprising: a pickup unit that picks up components without contact, the pickup unit including a pickup nozzle having a suction hole for sucking the components and a vibrator that vibrates the pickup nozzle to generate sound waves from the pickup nozzle, the pickup unit outputting a detection signal in response to the vibration of the pickup nozzle; a component mounting nozzle configured to receive the component from the pickup unit and bond the component to another component; and a control unit that controls the component mounting nozzle based on the detection signal.

2. The bonding device according to claim 1, wherein the control unit starts suction of the component by the component mounting nozzle based on the detection signal.

3. The joining device according to claim 2, wherein the control unit starts suction of the component by the component mounting nozzle when the detection value indicated by the detection signal is within a predetermined range.

4. The bonding device according to claim 1, wherein the control unit adjusts the position of the component mounting nozzle based on the detection signal.

5. The bonding device according to claim 4, wherein the control unit moves the component mounting nozzle closer to the pickup unit until the detection value indicated by the detection signal falls within a predetermined range.

6. The bonding device according to claim 4, wherein the control unit moves the component mounting nozzle away from the pickup unit if the detection value indicated by the detection signal is smaller than a predetermined value.

7. A bonding device as described in any one of claims 1 to 6, wherein the control unit is configured to further control the vibrator of the pickup unit, and adjust the vibration intensity of the vibrator based on the detection signal when the component mounting nozzle receives the component from the pickup unit.

8. A joining device as described in any one of claims 1 to 6, wherein the control unit is further configured to control the suction force with which the component is sucked by the pickup unit, and adjusts the suction force of the pickup unit based on the detection signal when the component mounting nozzle receives the component from the pickup unit.

9. A control method for controlling a bonding device including a pickup unit that picks up components without contact and a component mounting nozzle, wherein the pickup unit includes a pickup nozzle having a suction hole for sucking the component, and a vibrator that vibrates the pickup nozzle to generate sound waves from the pickup nozzle, the control method comprising: acquiring a detection signal output from the pickup unit in response to the vibration of the pickup nozzle; controlling the component mounting nozzle based on the detection signal to cause the component mounting nozzle to receive the component from the pickup unit; and causing the component mounting nozzle to bond the component to another component.

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