Electronic device including volume key

Abstract

An electronic device according to one embodiment of the present invention comprises: a housing including a first surface, a second surface, and a side member surrounding a space between the first surface and the second surface; a volume key disposed on the outer surface of the side member; a support member disposed inside the side member and integrally formed with the side member; a printed circuit board disposed on one surface of the support member; and a processor, wherein the volume key includes a first conductive pattern, a second conductive pattern, a ground pattern, a first switch for conducting the first conductive pattern and the ground pattern, and a second switch for conducting the second conductive pattern and the ground pattern. The side member and the support member include a first conductive portion formed by being surrounded by a first non-conductive portion, a second conductive portion formed by being surrounded by a second non-conductive portion, and a ground formed between the first non-conductive portion and the second non-conductive portion. The printed circuit board includes a first terminal and a second terminal, a first conductive path connecting the first terminal and the processor, and a second conductive path connecting the second terminal and the processor. The first conductive pattern may be bonded to the first conductive portion through a first conductive adhesive member, the second conductive pattern may be bonded to the second conductive portion through a second conductive adhesive member, and the ground pattern may be bonded to the ground through a third conductive adhesive member.

Description

Electronic device containing volume keys

[0001] Various embodiments of the present invention disclose an electronic device including a volume key.

[0002] The use of electronic devices such as bar type, foldable type, rollable type, or sliding type smartphones is increasing, and various functions are being provided to electronic devices.

[0003] The electronic device may include a volume key disposed on an outer surface of a housing forming an exterior.

[0004] The above electronic device can output a sound corresponding to a volume up signal or a sound corresponding to a volume down signal, depending on the operation of the volume key.

[0005] The electronic device may have at least one electronic component arranged on a printed circuit board (PCB) contained within the internal space.

[0006] The electronic device may have at least one electronic component that does not operate normally or is damaged by foreign substances such as moisture flowing in from the outside.

[0007] For example, the electronic device may have a waterproof tape attached to the inner surface of the housing (e.g., a side member) forming the exterior to prevent foreign substances such as moisture from entering the interior of the housing.

[0008] When the volume key is arranged on the outer surface of the housing, the FPCB (flexible printed circuit board) on which the volume key is arranged can be electrically connected to a PCB arranged inside the electronic device across a portion of the waterproof tape attached to the inner surface of the housing.

[0009] The area where the FPCB on which the above volume keys are arranged crosses a portion of the waterproof tape may not be waterproof and / or dustproof.

[0010] Various embodiments of the present invention can provide an electronic device in which an FPCB of a volume key can transmit a volume up signal or a volume down signal corresponding to an operation of a volume key to a processor disposed on a PCB without crossing a part of a waterproof tape.

[0011] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] An electronic device according to one embodiment of the present invention may include a housing including a first surface, a second surface, and a side member surrounding a space between the first surface and the second surface, a volume key disposed on an outer surface of the side member, a support member disposed inside the side member and formed integrally with the side member, a printed circuit board disposed on one surface of the support member, and a processor. According to one embodiment, the volume key may include a first conductive pattern, a second conductive pattern, and a ground pattern, a first switch for conducting the first conductive pattern and the ground pattern, and a second switch for conducting the second conductive pattern and the ground pattern. According to one embodiment, the side member and the support member may include a first conductive portion formed and surrounded by a first non-conductive portion, a second conductive portion formed and surrounded by a second non-conductive portion, and a ground formed between the first non-conductive portion and the second non-conductive portion. In one embodiment, the printed circuit board may include a first terminal and a second terminal, a first conductive path connecting the first terminal and the processor, and a second conductive path connecting the second terminal and the processor. In one embodiment, the first conductive pattern may be bonded to the first conductive portion via a first conductive adhesive member. In one embodiment, the second conductive pattern may be bonded to the second conductive portion via a second conductive adhesive member. In one embodiment, the ground pattern may be bonded to the ground via a third conductive adhesive member.

[0013] An electronic device according to one embodiment of the present invention may include a housing including a first surface, a second surface, and a side member surrounding a space between the first surface and the second surface, a volume key disposed on an outer surface of the side member, a support member disposed inside the side member and formed integrally with the side member, a printed circuit board disposed on one surface of the support member, and a processor. According to one embodiment, the volume key may include a first conductive pattern, a second conductive pattern, and a ground pattern, a first switch for conducting the first conductive pattern and the ground pattern, and a second switch for conducting the second conductive pattern and the ground pattern. According to one embodiment, the side member and the support member may include a first conductive portion formed and surrounded by a first non-conductive portion, a second conductive portion formed and surrounded by a second non-conductive portion, and a ground formed between the first non-conductive portion and the second non-conductive portion. In one embodiment, the printed circuit board may include a first terminal, a first sensor, a second terminal, and a second sensor, a first conductive path connecting the first sensor and the processor, and a second conductive path connecting the second sensor and the processor. In one embodiment, the first conductive portion and the first terminal may be spaced apart from each other and arranged to overlap each other. In one embodiment, the second conductive portion and the second terminal may be spaced apart from each other and arranged to overlap each other.

[0014] According to various embodiments of the present invention, the FPCB of the volume key can transmit a volume up signal or a volume down signal corresponding to the operation of the volume key to a processor disposed on the PCB without crossing a part of the waterproof tape.

[0015] In addition, various effects may be provided, either directly or indirectly, through this document.

[0016] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0017] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0018] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present invention.

[0019] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present invention.

[0020] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0021] FIG. 4 is a drawing schematically showing the configuration of a volume key button assembly disposed on an outer surface of a side member of an electronic device according to one embodiment of the present invention.

[0022] FIG. 5A is a drawing schematically showing the configuration of a first side of a volume key according to one embodiment of the present invention.

[0023] FIG. 5b is a drawing schematically showing the configuration of a second side of a volume key according to one embodiment of the present invention.

[0024] FIG. 6 is a drawing schematically showing the configuration of a side member and a support member of an electronic device according to one embodiment of the present invention.

[0025] FIG. 7 is a drawing schematically showing the configuration of a printed circuit board of an electronic device according to one embodiment of the present invention.

[0026] FIG. 8 is a drawing schematically showing the combined configuration of a side member and a volume key of an electronic device according to one embodiment of the present invention.

[0027] FIG. 9 is a drawing schematically showing a cross-section of part B or part C disclosed in FIG. 8 according to one embodiment of the present invention.

[0028] FIG. 10 is a diagram schematically showing a circuit configuration of the electronic device disclosed in FIG. 8 according to one embodiment of the present invention.

[0029] FIG. 11 is a drawing schematically showing the configuration of a printed circuit board of an electronic device according to various embodiments of the present invention.

[0030] FIG. 12 is a drawing schematically showing the combined configuration of a side member and a volume key of an electronic device according to various embodiments of the present invention.

[0031] FIG. 13 is a drawing schematically showing a cross-section of part D or part E disclosed in FIG. 12 according to various embodiments of the present invention.

[0032] FIG. 14 is a diagram schematically showing the circuit configuration of the electronic device disclosed in FIG. 12 according to various embodiments of the present invention.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present invention.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present invention. FIG. 2B is a perspective view of the rear of an electronic device according to various embodiments of the present invention.

[0057] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIGS. 2A and 2B . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0058] In the illustrated embodiment, the front plate (202) may include a first region (210D) extending seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) extending seamlessly from the second surface (210B) toward the front plate (102), at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region (210D) and the second region (210E), and may only include a flat surface that is arranged parallel to the second side (210B). In the above embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0059] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0060] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). In some embodiments, the corners of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In other embodiments (not shown), the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially identical in order to expand the area over which the display (201) is exposed.

[0061] In another embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), and a camera module (205) may be included aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (204), and a camera module (205) may be included on a back surface of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first area (210D) and / or the second area (210E).

[0062] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in some embodiments, multiple microphones may be disposed to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0063] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first side (210A) of the housing (210) (e.g., the display (201) as well as the second side (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0064] The camera modules (205, 212, 213) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0065] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In other embodiments, the key input device (217) may be implemented using a pressure sensor included in the display (201). In some embodiments, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0066] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0067] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0068] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0069] Referring to FIG. 3, the electronic device (300) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket), a front plate (320), a display (330), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be the same as or similar to at least one of the components of the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2A and / or FIG. 2B, and any overlapping descriptions will be omitted below.

[0070] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310) (e.g., the housing (210) of FIG. 2A and / or FIG. 2B) or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. The printed circuit board (340) may be equipped with, for example, a processor (120), a memory (130), and / or an interface (177) disclosed in FIG. 1. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0071] The memory (e.g., memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0072] An interface (e.g., interface (177) of FIG. 1) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0073] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be integrally disposed within the electronic device (300). In another embodiment, the battery (350) may be disposed so as to be detachable from the electronic device (300).

[0074] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side member (310) and / or the first support member (311).

[0075] In one embodiment, the side member (310) may form at least a portion of the exterior of the electronic device (300). For example, the side member (310) may include the side member (210C), the side member (218), or the housing (210) disclosed in FIGS. 2A and 2B . A waterproof tape (315) may be disposed on the inner surface and / or the inner side of the side member (310). The waterproof tape (315) may surround the inner surface of the side member (310) in a closed loop manner. The waterproof tape (315) may prevent foreign substances such as moisture and / or dust from entering the interior of the side member (310) (e.g., the housing). In one embodiment, a volume key button assembly (400) may be disposed on the outer surface of the side member (310). For example, the volume key button assembly (400) may be disposed on a portion of the outer surface of the side member (310). For example, the volume key button assembly (400) may include the key input device (217) disclosed in FIG. 2A. According to one embodiment, a printed circuit board (340) may be disposed on one surface (e.g., in the -z-axis direction) of the first support member (311). The printed circuit board (340) may include a first PCB (340a) and / or a second PCB (340b). For example, the first PCB (340a) and the second PCB (340b) may be disposed to be spaced apart from each other and may be electrically connected using a connecting member (345) (e.g., a coaxial cable and / or an FPCB). In one embodiment, the printed circuit board (340) may include a structure in which a plurality of printed circuit boards (PCBs) are stacked. For example, the printed circuit board (340) may include an interposer structure. In one embodiment, the printed circuit board (340) may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB).

[0076] According to one embodiment, the electronic device (300) of FIG. 3 may include embodiments disclosed in the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A and / or FIG. 2B. The electronic device (300) of FIG. 3 may include embodiments that are at least partially similar to, or different from, the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A and / or FIG. 2B.

[0077] According to one embodiment, the embodiments related to the electronic device (200) of FIGS. 2A and 2B and the electronic device (300) of FIG. 3 are described with respect to a bar-type electronic device, but various embodiments of the present invention are not limited to the above-described examples and can be substantially equally applied to electronic devices such as a foldable type, a rollable type, a sliding type, or a wearable type.

[0078] According to various embodiments, in the description of the electronic device (300) disclosed below, the same reference numerals are given to components that are substantially the same as those described in the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2A and 2B, and the electronic device (300) of FIG. 3, and a duplicate description thereof may be omitted.

[0079] FIG. 4 is a schematic diagram illustrating the configuration of a volume key button assembly disposed on an outer surface of a side member of an electronic device according to one embodiment of the present invention. FIG. 5a is a schematic diagram illustrating the configuration of a first side of a volume key according to one embodiment of the present invention. FIG. 5b is a schematic diagram illustrating the configuration of a second side of a volume key according to one embodiment of the present invention.

[0080] Referring to FIGS. 3 and 4, the volume key button assembly (400) may be positioned on the outer surface of the side member (310) (e.g., the housing (210) of FIG. 2A). The volume key button assembly (400) may include a volume key (410) and a button assembly (420).

[0081] According to one embodiment, the volume key (410) may be positioned on an outer surface (e.g., in the x-axis direction) of the side member (310). For example, the volume key (410) may be positioned on a portion (e.g., in the y-axis direction) of the outer surface of the side member (310).

[0082] According to one embodiment, the button assembly (420) may be disposed on one side (e.g., in the x-axis direction) of the volume key (410). The button assembly (420) may perform waterproofing and / or dustproofing of the volume key (410).

[0083] According to various embodiments, the button assembly (420) may include a waterproof member (421), a support plate (423), and a button (425).

[0084] According to one embodiment, the waterproof member (421) can cover one side (e.g., in the x-axis direction) of the volume key (410). The waterproof member (421) can perform waterproofing and / or dustproofing of the volume key (410). The waterproof member (421) can include the volume key (410) inside. For example, the waterproof member (421) can include a sealing member such as rubber or silicone.

[0085] According to one embodiment, the support plate (423) may be disposed on the waterproof member (421). The support plate (423) may be disposed on one surface (e.g., in the x-axis direction) of the waterproof member (421). The support plate (423) may include a conductive material (e.g., a metal) and / or a non-conductive material. For example, the conductive material may include aluminum, stainless steel (STS), or magnesium. For example, the non-conductive material may include a polymer.

[0086] In one embodiment, the button (425) may be disposed on the support plate (423). The button (425) may be disposed on one surface (e.g., in the x-axis direction) of the support plate (423). The button (425) may operate the first switch (410a) and the second switch (410b) of the volume key (410). The button (425) may actuate the first switch (410a) and the second switch (410b) of the volume key (410). For example, the button (425) may actuate the first switch (410a) when a part of the first direction (e.g., the y-axis direction) is pushed in the -x-axis direction. For example, the button (425) may actuate the second switch (410b) when a part of the second direction (e.g., the -y-axis direction) is pushed in the -x-axis direction. For example, the button (425) may be operated by pressing the first switch (410a) or the second switch (410b) as part of the first direction (e.g., y-axis direction) or part of the second direction (e.g., -y-axis direction) is pushed in the -x-axis direction.

[0087] Referring to FIGS. 4, 5a, and 5b, the volume key (410) may be disposed between the side member (310) and the button assembly (420). The volume key (410) may include an FPCB (415). The volume key (410) may include a first conductive pattern (411), a second conductive pattern (412), and a ground pattern (413). The ground pattern (413) may be disposed between the first conductive pattern (411) and the second conductive pattern (412). The volume key (410) may include a first switch (410a) and a second switch (410b).

[0088] According to one embodiment, a first-first conductive pattern (411a), a second-first conductive pattern (412a), and a first ground pattern (413a) may be formed on a first surface (e.g., in the x-axis direction) of an FPCB (415) of a volume key (410). The first ground pattern (413a) may be disposed between the first-first conductive pattern (411a) and the second-first conductive pattern (412a).

[0089] According to one embodiment, a first-second conductive pattern (411b), a second-second conductive pattern (412b), and a second ground pattern (413b) may be formed on a second side (e.g., in the -x-axis direction) of an FPCB (415) of a volume key (410). The second ground pattern (413b) may be disposed between the first-second conductive pattern (411b) and the second-second conductive pattern (412b).

[0090] According to one embodiment, the 1-1 conductive pattern (411a) formed on the first side (e.g., in the x-axis direction) of the FPCB (415) and the 1-2 conductive pattern (411b) formed on the second side (e.g., in the -x-axis direction) of the FPCB (415) can be electrically connected through the first via (V1) formed in the FPCB (415).

[0091] According to one embodiment, a 2-1 conductive pattern (412a) formed on a first side (e.g., in the x-axis direction) of the FPCB (415) and a 2-2 conductive pattern (412b) formed on a second side (e.g., in the -x-axis direction) of the FPCB (415) may be electrically connected through a second via (V2) formed in the FPCB (415).

[0092] According to one embodiment, a first ground pattern (413a) formed on a first side (e.g., in the x-axis direction) of the FPCB (415) and a second ground pattern (413b) formed on a second side (e.g., in the -x-axis direction) of the FPCB (415) may be electrically connected through a third via (V3) formed on the FPCB (415).

[0093] According to one embodiment, the first conductive pattern (411) of the volume key (410) may include a 1-1 conductive pattern (411a) formed on a first surface (e.g., in the x-axis direction) of the FPCB (415) and a 1-2 conductive pattern (411b) formed on a second surface (e.g., in the -x-axis direction) of the FPCB (415) and electrically connected to the 1-1 conductive pattern (411a) through a first via (V1).

[0094] According to one embodiment, the second conductive pattern (412) of the volume key (410) may include a 2-1 conductive pattern (412a) formed on a first surface (e.g., in the x-axis direction) of the FPCB (415) and a 2-2 conductive pattern (412b) formed on a second surface (e.g., in the -x-axis direction) of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a) through a second via (V2).

[0095] According to one embodiment, the ground pattern (413) of the volume key (410) may include a first ground pattern (413a) formed on a first surface (e.g., in the x-axis direction) of the FPCB (415) and a second ground pattern (413b) formed on a second surface (e.g., in the -x-axis direction) of the FPCB (415) and electrically connected to the first ground pattern (413a) through a third via (V3).

[0096] According to one embodiment, the first switch (410a) can conduct the first conductive pattern (411) (e.g., the 1-1 conductive pattern (411a) and the 1-2 conductive pattern (411b)) and the ground pattern (413) (e.g., the first ground pattern (413a) and the second ground pattern (413b)). For example, the first switch (410a) can electrically connect the first conductive pattern (411) and the ground pattern (413).

[0097] According to one embodiment, when the first conductive pattern (411) and the ground pattern (413) are conductive (e.g., connected) based on the operation (e.g., push) of the first switch (410a), a volume up signal may be generated. For example, the first switch (410a) may include a tact switch.

[0098] In one embodiment, the second switch (410b) can conduct the second conductive pattern (412) (e.g., the 2-1 conductive pattern (412a) and the 2-2 conductive pattern (412b)) and the ground pattern (413) (e.g., the 1-1 ground pattern (413a) and the 2-2 ground pattern (413b)). For example, the second switch (410b) can electrically connect the 2-1 conductive pattern (412) and the ground pattern (413).

[0099] According to one embodiment, based on the operation of the second switch (410b), when the second conductive pattern (412) and the ground pattern (413) are conductive (e.g., connected), a volume down signal may be generated. For example, the second switch (410b) may include a tact switch.

[0100] FIG. 6 is a drawing schematically showing the configuration of a side member and a support member of an electronic device according to one embodiment of the present invention.

[0101] For example, FIG. 6 may be a drawing schematically showing part A of the electronic device (300) disclosed in FIG. 4 according to one embodiment of the present invention.

[0102] Referring to FIGS. 4 and 6, the support member (311) may include the first support member (311) disclosed in FIG. 3. The support member (311) may be disposed inside the electronic device (300) and connected to the side member (310) (e.g., the housing (210) of FIGS. 2A and / or 2B), or may be formed integrally with the side member (310). The side member (310) and the support member (311) may be formed of, for example, a conductive material (e.g., a metal) and / or a non-conductive material (e.g., a polymer). For example, a display (330) may be coupled to one surface (e.g., in the z-axis direction) of the support member (311), and a printed circuit board (340) may be coupled to the other surface (e.g., in the −z-axis direction).

[0103] In one embodiment, the side member (310) and the support member (311) can include a first conductive portion (610), a first non-conductive portion (615), a second conductive portion (620), a second non-conductive portion (625), and a ground (630). For example, the first conductive portion (610), the second conductive portion (620), and the ground (630) can include a conductive material (e.g., a metal). For example, the first non-conductive portion (615) and the second non-conductive portion (625) can include a non-conductive material (e.g., a polymer). For example, the first non-conductive portion (615) and the second non-conductive portion (625) can include an injection region that includes a non-conductive injection molded material. For example, the non-conductive injection-molded body may be composed of a non-conductive material (e.g., a polymer) unlike the first conductive portion (610), the second conductive portion (620), and the ground (630). For example, the side member (310) and the support member (311) may be manufactured by double injection-molding by combining a metal region (e.g., the first conductive portion (610), the second conductive portion (620), and / or the ground (630)) for securing the rigidity of the electronic device (300) and a non-conductive region (e.g., the first non-conductive portion (615) and / or the second non-conductive portion (625)) for securing antenna performance. According to one embodiment, the first switch (410a) of the volume key (410) may be formed at a position corresponding to the first conductive portion (610) of the side member (310). According to one embodiment, the second switch (410b) of the volume key (410) may be formed at a position corresponding to the second conductive portion (610) of the side member (310). According to one embodiment, the first conductive portion (610) may be formed to be surrounded by the first non-conductive portion (615). The first conductive portion (610) may be separated from the ground (630) through the first non-conductive portion (615).The first conductive portion (610) can be separated from the ground (630) via the first non-conductive portion (615).

[0104] In one embodiment, the second conductive portion (620) may be formed by being surrounded by a second non-conductive portion (625). The second conductive portion (620) may be separated from the ground (630) through the second non-conductive portion (625). The second conductive portion (620) may be separated from the ground (630) through the second non-conductive portion (625).

[0105] In one embodiment, the ground (630) may be formed between the first non-conductive portion (615) and the second non-conductive portion (625). For example, the ground (630) may not be electrically connected to the first conductive portion (610) and the second conductive portion (620) via the first non-conductive portion (615) and the second conductive portion (625).

[0106] FIG. 7 is a drawing schematically showing the configuration of a printed circuit board of an electronic device according to one embodiment of the present invention.

[0107] For example, FIG. 7 may be a drawing schematically showing a portion of a printed circuit board (340) (e.g., first PCB (340a)) of the electronic device (300) disclosed in FIG. 4 according to one embodiment of the present invention.

[0108] Referring to FIG. 7, the printed circuit board (340) may include a first terminal (710), a first conductive path (715), a second terminal (720), a second conductive path (725), and a processor (120).

[0109] In one embodiment, the first terminal (710) may be disposed at a first end of the printed circuit board (340). For example, the first terminal (710) may be connected to the first conductive portion (610) disclosed in FIG. 6. For example, the first terminal (710) may be directly connected to the first conductive portion (610) disclosed in FIG. 6. The first terminal (710) may include a conductive material. For example, the first terminal (710) may be one of a conductive double-sided tape, a gasket, or a C-clip disposed at the first end of the printed circuit board (340).

[0110] In one embodiment, a first conductive path (715) (e.g., a first GPIO (general purpose input / output)) may electrically connect a first terminal (710) and a processor (120) (e.g., an AP (application processor) chip). For example, the first conductive path (715) may include a conductive wire, an FPCB, a conductive connecting member (e.g., a coaxial cable), or a conductive pattern. For example, the first conductive path (715) may include a GPIO (general purpose input / output). For example, the first conductive path (715) may include a volume up GPIO.

[0111] In one embodiment, the second terminal (720) may be disposed at a second end of the printed circuit board (340). For example, the second terminal (720) may be connected to the second conductive portion (620) disclosed in FIG. 6. For example, the second terminal (720) may be directly connected to the second conductive portion (620) disclosed in FIG. 6. The second terminal (720) may include a conductive material. For example, the second terminal (720) may be one of a conductive double-sided tape, a gasket, or a C-clip disposed at the second end of the printed circuit board (340).

[0112] In one embodiment, the second conductive path (725) (e.g., the second GPIO) may electrically connect the second terminal (720) and the processor (120). For example, the second conductive path (725) may include a conductive wire, an FPCB, a conductive connecting member (e.g., a coaxial cable), or a conductive pattern. For example, the second conductive path (725) may include a GPIO (general purpose input / output). For example, the second conductive path (725) may include a volume down GPIO.

[0113] According to one embodiment, the processor (120) (e.g., an application processor (AP) chip) may receive a volume up signal through the first terminal (710) and the first conductive path (715) (e.g., a volume up GPIO) based on the operation (e.g., a push) of the first switch (410a), and increase the volume of the electronic device (300).

[0114] According to one embodiment, the processor (120) may receive a volume down signal through the second terminal (720) and the second conductive path (725) (e.g., volume down GPIO) based on the operation (e.g., push) of the second switch (410b), and decrease the volume of the electronic device (300). For example, the processor (120) may include an AP (application processor) chip.

[0115] FIG. 8 is a schematic diagram illustrating a combination configuration of a side member and a volume key of an electronic device according to an embodiment of the present invention. FIG. 9 is a schematic diagram illustrating a cross-section of part B or part C disclosed in FIG. 8 according to an embodiment of the present invention. FIG. 10 is a schematic diagram illustrating a circuit configuration of an electronic device disclosed in FIG. 8 according to an embodiment of the present invention.

[0116] Referring to FIG. 8, the volume key (410) may be disposed on an outer surface (e.g., in the x-axis direction) of the side member (310). For example, the button assembly (420) disclosed in FIG. 4 may be disposed on one surface (e.g., in the x-axis direction) of the volume key (410). For example, the volume key (410) may be disposed between the side member (310) and the button assembly (420).

[0117] According to one embodiment, the volume key (410) may include a first conductive pattern (411), a second conductive pattern (412), and a ground pattern (413) arranged on an FPCB (415), as disclosed in FIGS. 5A and 5B. The volume key (410) may include a first switch (410a) that conducts the first conductive pattern (411) and the ground pattern (413). The volume key (410) may include a second switch (410b) that conducts the second conductive pattern (412) and the ground pattern (413).

[0118] According to one embodiment, the first conductive pattern (411) of the volume key (410) may be bonded to the first conductive portion (610) formed on the side member (310) and the support member (311) via the first conductive adhesive member (810). For example, the first conductive adhesive member (810) may be disposed between the first conductive pattern (411) and the first conductive portion (610) and may bond the first conductive pattern (411) and the first conductive portion (610). For example, the first conductive pattern (411) and the first conductive portion (610) may be electrically connected via the first conductive adhesive member (810). For example, the first conductive adhesive member (810) may include a conductive double-sided tape.

[0119] According to one embodiment, the second conductive pattern (412) of the volume key (410) may be bonded to the second conductive portion (620) formed on the side member (310) and the support member (311) via a second conductive adhesive member (820). For example, the second conductive adhesive member (820) may be disposed between the second conductive pattern (412) and the second conductive portion (620) and may bond the second conductive pattern (412) and the second conductive portion (620). For example, the second conductive pattern (412) and the second conductive portion (620) may be electrically connected via the second conductive adhesive member (820). For example, the second conductive adhesive member (820) may include a conductive double-sided tape.

[0120] According to one embodiment, the ground pattern (413) of the volume key (410) may be bonded to the ground (630) formed on the side member (310) and the support member (311) via a third conductive adhesive member (830). For example, the third conductive adhesive member (830) may be disposed between the ground pattern (413) and the ground (630) and may bond the ground pattern (413) and the ground (630). For example, the ground pattern (413) and the ground (630) may be electrically connected via the third conductive adhesive member (830). For example, the third conductive adhesive member (830) may include a conductive double-sided tape.

[0121] According to various embodiments, the waterproof member (421) of the volume key button assembly (400) (e.g., the button assembly (420)) can cover the volume key (410), the first conductive adhesive member (810), the second conductive adhesive member (820), and the third conductive adhesive member (830). For example, the waterproof member (421) of the button assembly (420) can seal the volume key (410), the first conductive adhesive member (810), the second conductive adhesive member (820), and the third conductive adhesive member (830).

[0122] According to one embodiment, when the first switch (410a) of the volume key (410) is actuated (e.g., pushed), a volume up signal may be transmitted to the processor (120) through the first conductive pattern (411), the first conductive portion (610), the first terminal (710), and the first conductive path (715) (e.g., volume up GPIO).

[0123] According to various embodiments, the processor (120) may receive a volume up signal through the first conductive pattern (411), the first conductive portion (610), the first terminal (710), and the first conductive path (715) based on the operation (e.g., push) of the first switch (410a) of the volume key (410).

[0124] In one embodiment, the first conductive portion (610) and the first terminal (710) can be connected. In various embodiments, the first conductive portion (610) and the first terminal (710) can be electrically connected via a first conductive connecting member (915), as disclosed in FIG. 9. For example, the first conductive connecting member (915) can include any one of a conductive double-sided tape, a gasket, or a C-clip.

[0125] According to one embodiment, when the second switch (410b) of the volume key (410) is actuated (e.g., pushed), a volume down signal may be transmitted to the processor (120) via the second conductive pattern (412), the second conductive portion (620), the second terminal (720), and the second conductive path (725) (e.g., volume down GPIO).

[0126] According to various embodiments, the processor (120) may receive a volume up signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (720), and the second conductive path (725) based on the operation (e.g., push) of the second switch (410b) of the volume key (410).

[0127] In one embodiment, the second conductive portion (620) and the second terminal (720) can be connected. In various embodiments, the second conductive portion (620) and the second terminal (720) can be electrically connected via a second conductive connecting member (925), as disclosed in FIG. 9. For example, the second conductive connecting member (925) can include any one of a conductive double-sided tape, a gasket, or a C-clip.

[0128] Referring to FIG. 10, the processor (120) may receive a volume up signal through the first conductive pattern (411), the first conductive portion (610), the first terminal (710), and the first conductive path (715) based on the operation (e.g., push) of the first switch (410a), and increase the volume of the electronic device (300). The processor (120) may receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (720), and the second conductive path (725), based on the operation of the second switch (410b), and decrease the volume of the electronic device (300).

[0129] According to one embodiment, the first switch (410a) and the second switch (410b) of the volume key (410) may be normally open.

[0130] According to one embodiment, when the first switch (410a) is operated (e.g., pushed), the first conductive pattern (411), the first conductive portion (610), the first terminal (710), and the first conductive path (715) are recognized as ground (630), so that the processor (120) can recognize that the first switch (410a) is operated (e.g., pushed). For example, when the first switch (410a) of the volume key (410) is operated by the user of the electronic device (300), the processor (120) can recognize that the first switch (410a) is pushed based on the signal flowing through the first conductive pattern (411), the first conductive portion (610), the first terminal (710), the first conductive path (715) (e.g., volume up GPIO) and the ground (630) being sensed as a low signal.

[0131] According to one embodiment, when the second switch (410b) is actuated (e.g., pushed), the second conductive pattern (412), the second conductive portion (620), the second terminal (720), and the second conductive path (725) are recognized as ground (630), so that the processor (120) can recognize that the second switch (410b) is actuated (e.g., pushed). For example, the processor (120) can recognize that the second switch (410n) is pushed based on the signal flowing through the second conductive pattern (412), the second conductive portion (620), the second terminal (720), the second conductive path (725) (e.g., volume down GPIO) and the ground (630) being sensed as a low signal when the second switch (410b) of the volume key (410) is operated by the user of the electronic device (300).

[0132] FIG. 11 is a drawing schematically showing the configuration of a printed circuit board of an electronic device according to various embodiments of the present invention.

[0133] For example, FIG. 11 may be a drawing schematically showing various embodiments of a portion of a printed circuit board (340) (e.g., a first PCB (340a)) of an electronic device (300) disclosed in FIG. 4 according to one embodiment of the present invention.

[0134] According to various embodiments, at least some of the embodiments disclosed in FIGS. 1 to 10 described above may be included in the embodiments disclosed in FIGS. 11 to 14. In the description of FIGS. 11 to 14, components that are substantially the same as those in the embodiments disclosed in FIGS. 1 to 10 described above are given the same reference numerals, and redundant descriptions thereof may be omitted.

[0135] According to various embodiments, when it is difficult to directly connect the first conductive portion (610) and the first terminal (710), and the second conductive portion (620) and the second terminal (720), as shown in FIGS. 8 to 10, due to issues such as dropping of the electronic device (300) or mounting space of electronic components, for example, as shown in FIGS. 11 to 14, the first conductive portion (610) and the first terminal (1101), and the second conductive portion (620) and the second terminal (1102) are physically separated, but a structure capable of sensing electrical changes occurring between the first conductive portion (610) and the first terminal (1101), and between the second conductive portion (620) and the second terminal (1102) can be formed. For example, the first terminal (1101) may be formed in a structure that overlaps and is spaced apart from the first conductive portion (610) disclosed in FIG. 6. For example, the second terminal (1102) may be formed in a structure that overlaps and is spaced apart from the second conductive portion (620) disclosed in FIG. 6.

[0136] Referring to FIG. 11, a printed circuit board (340) according to various embodiments of the present invention may include a first terminal (1101), a first sensor (1110), a first conductive path (1115), a second terminal (1102), a second sensor (1120), a second conductive path (1125), and a processor (120).

[0137] According to one embodiment, the first terminal (1101) may be disposed at a first end of the printed circuit board (340). For example, the first terminal (1101) may be disposed spaced apart from the first conductive portion (610) disclosed in FIG. 6. For example, the first terminal (1101) may be disposed spaced apart from the first conductive portion (610) disclosed in FIG. 6 and overlap each other. For example, the first terminal (1101) may be disposed so as to be separated from and indirectly conductive with the first conductive portion (610) disclosed in FIG. 6. For example, the first terminal (1101) may be disposed in a capacitance structure with the first conductive portion (610) disclosed in FIG. 6. For example, the first terminal (1101) is physically separated from the first conductive portion (610) disclosed in FIG. 6, and an electrical change (e.g., capacitance value) occurring between the first terminal (1101) and the first conductive portion (610) can be transmitted to the first sensor (1110).

[0138] According to one embodiment, the first sensor (1110) can sense a change in the amount of charge generated between the first terminal (1101) and the first conductive portion (610). For example, the first sensor (1110) can detect a change in a capacitance value between the first terminal (1101) and the first conductive portion (610) when the first switch (410a) is operated (e.g., pushed). For example, the first sensor (1110) can detect a change in a capacitance value between the first terminal (1101) and the first conductive portion (610) when the first switch (410a) is operated (e.g., pushed), and convert the detected change in the capacitance value into an electrical signal. For example, the first sensor (1110) can include a grip sensor.

[0139] According to one embodiment, a first conductive path (1115) (e.g., a first general purpose input / output (GPIO)) may electrically connect a first sensor (1110) and a processor (120) (e.g., an application processor (AP) chip). The first conductive path (1115) may transmit an electrical signal corresponding to a change in a capacitance value converted by the first sensor (1110) to the processor (120). For example, the first conductive path (1115) may include a general purpose input / output (GPIO). For example, the first conductive path (1115) may include a volume up GPIO.

[0140] In one embodiment, the second terminal (1102) may be disposed at the second end of the printed circuit board (340). For example, the second terminal (1102) may be disposed spaced apart from the second conductive portion (620) disclosed in FIG. 6. For example, the second terminal (1102) may be disposed spaced apart from the second conductive portion (620) disclosed in FIG. 6 and overlap each other. For example, the second terminal (1102) may be disposed so as to be separated from and indirectly conductive with the second conductive portion (620) disclosed in FIG. 6. For example, the second terminal (1102) may be disposed in a capacitance structure with the second conductive portion (620) disclosed in FIG. 6. For example, the second terminal (1102) may be physically separated from the second conductive portion (620) disclosed in FIG. 6, and may transmit an electrical change (e.g., capacitance value) occurring between the second terminal (1102) and the second conductive portion (620) to the second sensor (1120).

[0141] In one embodiment, the second sensor (1120) can sense a change in the amount of charge generated between the second terminal (1102) and the second conductive portion (620). For example, the second sensor (1120) can detect a change in a capacitance value between the second terminal (1102) and the second conductive portion (620) when the second switch (410b) is actuated (e.g., pushed). For example, the second sensor (1120) can detect a change in a capacitance value between the second terminal (1102) and the second conductive portion (620) when the second switch (410b) is actuated (e.g., pushed), and convert the detected change in the capacitance value into an electrical signal. For example, the second sensor (1120) can include a grip sensor.

[0142] In one embodiment, a second conductive path (1125) (e.g., a second GPIO (general purpose input / output)) can electrically connect a second sensor (1120) and a processor (120). The second conductive path (1125) can transmit an electrical signal corresponding to a change in a capacitance value converted by the second sensor (1120) to the processor (120). For example, the second conductive path (1125) can include a GPIO (general purpose input / output). For example, the second conductive path (1125) can include a volume down GPIO.

[0143] According to one embodiment, the processor (120) may receive a volume up signal through the first terminal (1101), the first sensor (1110), and the first conductive path (1115) based on the operation (e.g., push) of the first switch (410a), and increase the volume of the electronic device (300).

[0144] According to one embodiment, the processor (120) may receive a volume down signal through the second terminal (1102), the second sensor (1120), and the second conductive path (1125) based on the operation of the second switch (410b), and reduce the volume of the electronic device (300).

[0145] FIG. 12 is a diagram schematically illustrating a combination configuration of a side member and a volume key of an electronic device according to various embodiments of the present invention. FIG. 13 is a diagram schematically illustrating a cross-section of a portion D or E disclosed in FIG. 12 according to various embodiments of the present invention. FIG. 14 is a diagram schematically illustrating a circuit configuration of an electronic device disclosed in FIG. 12 according to various embodiments of the present invention.

[0146] Referring to FIG. 12, the volume key (410) may be disposed on an outer surface (e.g., in the x-axis direction) of the side member (310). For example, the button assembly (420) disclosed in FIG. 4 may be disposed on one surface (e.g., in the x-axis direction) of the volume key (410). For example, the volume key (410) may be disposed between the side member (310) and the button assembly (420).

[0147] According to one embodiment, the volume key (410) may include a first conductive pattern (411), a second conductive pattern (412), and a ground pattern (413) arranged on an FPCB (415), as disclosed in FIGS. 5A and 5B. The volume key (410) may include a first switch (410a) that conducts the first conductive pattern (411) and the ground pattern (413). The volume key (410) may include a second switch (410b) that conducts the second conductive pattern (412) and the ground pattern (413).

[0148] According to one embodiment, the first conductive pattern (411) of the volume key (410) can be bonded to the first conductive portion (610) formed on the side member (310) and the support member (311) via the first conductive adhesive member (810). For example, the first conductive adhesive member (810) can be disposed between the first conductive pattern (411) and the first conductive portion (610) and bond the first conductive pattern (411) and the first conductive portion (610). For example, the first conductive adhesive member (810) can include a conductive double-sided tape.

[0149] According to one embodiment, the second conductive pattern (412) of the volume key (410) can be bonded to the second conductive portion (620) formed on the side member (310) and the support member (311) via the second conductive adhesive member (820). For example, the second conductive adhesive member (820) can be disposed between the second conductive pattern (412) and the second conductive portion (620) and bond the second conductive pattern (412) and the second conductive portion (620). For example, the second conductive adhesive member (820) can include a conductive double-sided tape.

[0150] According to one embodiment, the ground pattern (413) of the volume key (410) can be bonded to the ground (630) formed on the side member (310) and the support member (311) via a third conductive adhesive member (830). For example, the third conductive adhesive member (830) can be disposed between the ground pattern (413) and the ground (630) and bond the ground pattern (413) and the ground (630). For example, the third conductive adhesive member (830) can include a conductive double-sided tape.

[0151] According to various embodiments, the waterproof member (421) of the volume key button assembly (400) can cover the volume key (410), the first conductive adhesive member (810), the second conductive adhesive member (820), and the third conductive adhesive member (830). For example, the waterproof member (421) of the button assembly (420) can seal the volume key (410), the first conductive adhesive member (810), the second conductive adhesive member (820), and the third conductive adhesive member (830).

[0152] According to one embodiment, when the first switch (410a) of the volume key (410) is actuated (e.g., pushed), a volume up signal may be transmitted to the processor (120) through the first conductive pattern (411), the first conductive portion (610), the first terminal (1101), the first sensor (1110), and the first conductive path (1115) (e.g., volume up GPIO).

[0153] According to various embodiments, the processor (120) may receive a volume up signal through the first conductive pattern (411), the first conductive portion (610), the first terminal (1101), the first sensor (1110), and the first conductive path (1115) based on the operation (e.g., push) of the first switch (410a) of the volume key (410).

[0154] In one embodiment, the first conductive portion (610) and the first terminal (1101) may be disposed to be spaced apart from each other. For example, the first terminal (1101) may be disposed to be separated from the first conductive portion (610) and indirectly conductive. For example, the first terminal (1101) may be disposed in a capacitive structure with the first conductive portion (610). For example, the first terminal (1101) may be physically separated from the first conductive portion (610) and may transmit an electrical change (e.g., a capacitance value) occurring between the first terminal (1101) and the first conductive portion (610) to the first sensor (1110).

[0155] According to one embodiment, the first sensor (1110) can detect a change in a capacitance value between the first terminal (1101) and the first conductive portion (610) when the first switch (410a) is operated (e.g., pushed), and convert the detected change in the capacitance value into an electrical signal.

[0156] According to one embodiment, an electrical signal converted through the first sensor (1110) can be transmitted to the processor (120) through the first conductive path (1115).

[0157] According to one embodiment, when the second switch (410b) of the volume key (410) is actuated (e.g., pushed), a volume down signal may be transmitted to the processor (120) via the second conductive pattern (412), the second conductive portion (620), the second terminal (1102), the second sensor (1120), and the second conductive path (1125) (e.g., a volume down GPIO).

[0158] According to various embodiments, the processor (120) may receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (1102), the second sensor (1120), and the second conductive path (1125) based on the operation (e.g., push) of the second switch (410b) of the volume key (410).

[0159] In one embodiment, the second conductive portion (620) and the second terminal (1102) may be spaced apart from each other. For example, the second terminal (1102) may be positioned to be separated from the second conductive portion (620) and indirectly conductive. For example, the second terminal (1102) may be positioned in a capacitive structure with the second conductive portion (620). For example, the second terminal (1102) may be physically separated from the second conductive portion (620) and may transmit an electrical change (e.g., a capacitance value) that occurs between the second terminal (1102) and the second conductive portion (620) to the second sensor (1120).

[0160] According to one embodiment, an electrical signal converted through the second sensor (1120) can be transmitted to the processor (120) through the second conductive path (1125).

[0161] Referring to FIG. 14, the processor (120) may receive a volume up signal through the first conductive pattern (411), the first conductive portion (610), the first terminal (1101), the first sensor (1110), and the first conductive path (1115) based on the operation (e.g., push) of the first switch (410a), and increase the volume of the electronic device (1100). The processor (120) may receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (1102), the second sensor (1120), and the second conductive path (1125), based on the operation of the second switch (410b), and decrease the volume of the electronic device (1100).

[0162] According to one embodiment, the first switch (410a) and the second switch (410b) of the volume key (410) may be normally open.

[0163] According to one embodiment, when the first switch (410a) is actuated (e.g., pushed), an electrical change (e.g., a capacitance value) may occur between the first conductive portion (610) and the first terminal (1101). For example, the first sensor (1110) may convert the electrical change (e.g., a capacitance value) occurring between the first conductive portion (610) and the first terminal (1101) into an electrical signal. For example, the electrical signal converted through the first sensor (1110) may be transmitted to the processor (120) through the first conductive path (1115).

[0164] According to various embodiments, when the second switch (410b) is actuated (e.g., pushed), an electrical change (e.g., a capacitance value) may occur between the second conductive portion (620) and the second terminal (1102). For example, the second sensor (1120) may convert the electrical change (e.g., a capacitance value) occurring between the second conductive portion (620) and the second terminal (1102) into an electrical signal. For example, the electrical signal converted by the second sensor (1120) may be transmitted to the processor (120) through the second conductive path (1125).

[0165] An electronic device (101, 200, 300) according to one embodiment of the present invention may include a housing (210) including a first surface (210A), a second surface (210B), and a side member (310) surrounding a space between the first surface (210A) and the second surface (210B), a volume key (410) disposed on an outer surface of the side member (310), a support member (311) disposed inside the side member (310) and formed integrally with the side member (310), a printed circuit board (340) disposed on one surface of the support member (311), and a processor (120). According to one embodiment, the volume key (410) may include a first conductive pattern (411), a second conductive pattern (412), and a ground pattern (413), a first switch (410a) for conducting the first conductive pattern (411) and the ground pattern (413), and a second switch (410b) for conducting the second conductive pattern (412) and the ground pattern (413). According to one embodiment, the side member (310) and the support member (311) may include a first conductive portion (610) formed by being surrounded by a first non-conductive portion (615), a second conductive portion (620) formed by being surrounded by a second non-conductive portion (625), and a ground (630) formed between the first non-conductive portion (615) and the second non-conductive portion (625). According to one embodiment, the printed circuit board (340) may include a first terminal (710) and a second terminal (720), a first conductive path (715) connecting the first terminal (710) and the processor (120), and a second conductive path (725) connecting the second terminal (720) and the processor (120).The first conductive pattern (411) can be bonded to the first conductive portion (610) through a first conductive adhesive member (810), the second conductive pattern (412) can be bonded to the second conductive portion (620) through a second conductive adhesive member (820), and the ground pattern (413) can be bonded to the ground (630) through a third conductive adhesive member (830).

[0166] According to one embodiment, the processor (120) may be configured to receive a volume up signal through the first conductive pattern (411), the first conductive portion (610), the first terminal (710), and the first conductive path (715) based on the operation of the first switch (410a), and to receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (720), and the second conductive path (725) based on the operation of the second switch (410b).

[0167] According to one embodiment, the first conductive portion (610) and the first terminal (710) may be connected, and the second conductive portion (620) and the second terminal (720) may be connected.

[0168] According to one embodiment, the first conductive portion (610) and the first terminal (710) may be electrically connected through a first conductive connecting member (915), and the second conductive portion (620) and the second terminal (720) may be electrically connected through a second conductive connecting member (925).

[0169] In one embodiment, the first conductive connecting member (915) may include any one of a conductive double-sided tape, a gasket, or a C-clip, and the second conductive connecting member (925) may include any one of a conductive double-sided tape, a gasket, or a C-clip.

[0170] According to one embodiment, the volume key (410) includes an FPCB (415), and the first conductive pattern (411) includes a 1-1 conductive pattern (411a) formed on a first surface of the FPCB (415) and a 1-2 conductive pattern (411b) formed on a second surface of the FPCB (415) and electrically connected to the 1-1 conductive pattern (411a), and the second conductive pattern (412) includes a 2-1 conductive pattern (412a) formed on a first surface of the FPCB (415) and a 2-2 conductive pattern (412b) formed on a second surface of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a), and the ground pattern (413) includes a 1-2 conductive pattern (412b) formed on a second surface of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a). It may include a first ground pattern (413a) formed on one side and a second ground pattern (413b) formed on the second side of the FPCB (415) and electrically connected to the first ground pattern (413a).

[0171] According to one embodiment, the first-first conductive pattern (411a) and the first-second conductive pattern (411b) may be electrically connected through a first via (V1), the second-first conductive pattern (412a) and the second-second conductive pattern (412b) may be electrically connected through a second via (V2), and the first ground pattern (413a) and the second ground pattern (413b) may be electrically connected through a third via (V3).

[0172] According to one embodiment, the ground pattern (413) may be disposed between the first conductive pattern (411) and the second conductive pattern (412).

[0173] According to one embodiment, the electronic device may include a button assembly (420) disposed on one side of the volume key (410).

[0174] According to one embodiment, the button assembly (420) may include a waterproof member (421) covering one side of the volume key (410), a support plate (423) disposed on the waterproof member (421), and a button (425) disposed on the support plate (423).

[0175] An electronic device (101, 200, 300, 1100) according to one embodiment of the present invention may include a housing (210) including a first surface (210A), a second surface (210B), and a side member (310) surrounding a space between the first surface (210A) and the second surface (210B), a volume key (410) disposed on an outer surface of the side member (310), a support member (311) disposed inside the side member (310) and formed integrally with the side member (310), a printed circuit board (340) disposed on one surface of the support member (311), and a processor (120). According to one embodiment, the volume key (410) may include a first conductive pattern (411), a second conductive pattern (412), and a ground pattern (413), a first switch (410a) for conducting the first conductive pattern (411) and the ground pattern (413), and a second switch (410b) for conducting the second conductive pattern (412) and the ground pattern (413). According to one embodiment, the side member (310) and the support member (311) may include a first conductive portion (610) formed by being surrounded by a first non-conductive portion (615), a second conductive portion (620) formed by being surrounded by a second non-conductive portion (625), and a ground (630) formed between the first non-conductive portion (615) and the second non-conductive portion (625). According to one embodiment, the printed circuit board (340) may include a first terminal (1101), a first sensor (1110), a second terminal (1102), and a second sensor (1120), a first conductive path (1115) connecting the first sensor (1110) and the processor (120), and a second conductive path (1125) connecting the second sensor (1120) and the processor (120).According to one embodiment, the first conductive portion (610) and the first terminal (1101) may be spaced apart and arranged to overlap each other, and the second conductive portion (610) and the second terminal (1102) may be spaced apart and arranged to overlap each other.

[0176] According to one embodiment, the first conductive pattern (411) may be bonded to the first conductive portion (610) through a first conductive adhesive member (810), the second conductive pattern (412) may be bonded to the second conductive portion (620) through a second conductive adhesive member (820), and the ground pattern (413) may be bonded to the ground (630) through a third conductive adhesive member (830).

[0177] According to one embodiment, the processor (120) may be configured to receive a volume up signal through the first conductive pattern (411), the first conductive portion (610), the first terminal (1101), the first sensor (1110), and the first conductive path (1115) based on the operation of the first switch (410a), and to receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (1102), the second sensor (1120), and the second conductive path (1125) based on the operation of the second switch (410b).

[0178] According to one embodiment, the first sensor (1110) may be configured to detect an electrical change occurring between the first conductive portion (610) and the first terminal (1101), and the second sensor (1120) may be configured to detect an electrical change occurring between the second conductive portion (620) and the second terminal (1101).

[0179] According to one embodiment, the first sensor (1110) or the second sensor (1120) may include a grip sensor.

[0180] According to one embodiment, the volume key (410) includes an FPCB (415), and the first conductive pattern (411) includes a 1-1 conductive pattern (411a) formed on a first surface of the FPCB (415) and a 1-2 conductive pattern (411b) formed on a second surface of the FPCB (415) and electrically connected to the 1-1 conductive pattern (411a), and the second conductive pattern (412) includes a 2-1 conductive pattern (412a) formed on a first surface of the FPCB (415) and a 2-2 conductive pattern (412b) formed on a second surface of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a), and the ground pattern (413) includes a 1-2 conductive pattern (412b) formed on a second surface of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a). It may include a first ground pattern (413a) formed on one side and a second ground pattern (413b) formed on the second side of the FPCB (415) and electrically connected to the first ground pattern (413a).

[0181] According to one embodiment, the first-first conductive pattern (411a) and the first-second conductive pattern (411b) may be electrically connected through a first via (V1), the second-first conductive pattern (412a) and the second-second conductive pattern (412b) may be electrically connected through a second via (V2), and the first ground pattern (413a) and the second ground pattern (413b) may be electrically connected through a third via (V3).

[0182] According to one embodiment, the ground pattern (413) may be disposed between the first conductive pattern (411) and the second conductive pattern (412).

[0183] According to one embodiment, the electronic device may include a button assembly (420) disposed on one side of the volume key (410).

[0184] According to one embodiment, the button assembly (420) may include a waterproof member (421) covering one side of the volume key (410), a support plate (423) disposed on the waterproof member (421), and a button (425) disposed on the support plate (423).

[0185] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0186] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0187] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0188] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0189] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0190] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0191] Although the present invention has been described above according to various embodiments of the present invention, it is obvious that changes and modifications made by a person having ordinary skill in the art to which the present invention pertains within a scope that does not depart from the technical characteristics of the present invention also belong to the present invention.

Claims

1. In electronic devices (101, 200, 300), A housing (210) comprising a first side (210A), a second side (210B), and a side member (310) surrounding a space between the first side (210A) and the second side (210B); A volume key (410) arranged on the outer surface of the above side member (310); A support member (311) disposed inside the side member (310) and formed integrally with the side member (310); A printed circuit board (340) placed on one side of the above support member (311); and Includes a processor (120), The above volume key (410) is A first conductive pattern (411), a second conductive pattern (412) and a ground pattern (413); A first switch (410a) that conducts the first conductive pattern (411) and the ground pattern (413); and It includes a second switch (410b) that conducts the second conductive pattern (412) and the ground pattern (413), The above side member (310) and the above support member (311) are, A first conductive portion (610) formed by being surrounded by a first non-conductive portion (615); A second conductive portion (620) formed by being surrounded by a second non-conductive portion (625); and Includes a ground (630) formed between the first non-conductive portion (615) and the second non-conductive portion (625), The above printed circuit board (340) is First terminal (710) and second terminal (720); A first conductive path (715) connecting the first terminal (710) and the processor (120); and Including a second conductive path (725) connecting the second terminal (720) and the processor (120), The first conductive pattern (411) is bonded to the first conductive portion (610) through the first conductive adhesive member (810), The second conductive pattern (412) is bonded to the second conductive portion (620) through the second conductive adhesive member (820), The above ground pattern (413) is an electronic device bonded to the ground (630) through a third conductive adhesive member (830).

2. In paragraph 1, The above processor (120) Based on the operation of the first switch (410a), a volume up signal is received through the first conductive pattern (411), the first conductive portion (610), the first terminal (710) and the first conductive path (715), An electronic device configured to receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (720), and the second conductive path (725) based on the operation of the second switch (410b).

3. In paragraph 1 or 2, An electronic device in which the first conductive portion (610) and the first terminal (710) are connected, and the second conductive portion (620) and the second terminal (720) are connected.

4. In paragraph 1 or 2, An electronic device in which the first conductive portion (610) and the first terminal (710) are electrically connected through a first conductive connecting member (915), and the second conductive portion (620) and the second terminal (720) are electrically connected through a second conductive connecting member (925).

5. In paragraph 4, The first conductive connecting member (915) comprises one of a conductive double-sided tape, a gasket or a C-clip, The second conductive connecting member (925) is an electronic device comprising any one of a conductive double-sided tape, a gasket or a C-clip.

6. In any one of paragraphs 1 to 5, The above volume key (410) includes a flexible printed circuit board (FPCB) (415), The above first challenge pattern (411) is It includes a 1-1 conductive pattern (411a) formed on the first surface of the FPCB (415) and a 1-2 conductive pattern (411b) formed on the second surface of the FPCB (415) and electrically connected to the 1-1 conductive pattern (411a). The above second challenge pattern (412) is It includes a 2-1 conductive pattern (412a) formed on the first surface of the FPCB (415) and a 2-2 conductive pattern (412b) formed on the second surface of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a). The above ground pattern (413) is An electronic device including a first ground pattern (413a) formed on a first surface of the FPCB (415) and a second ground pattern (413b) formed on a second surface of the FPCB (415) and electrically connected to the first ground pattern (413a).

7. In paragraph 6, The above 1-1 conductive pattern (411a) and the above 1-2 conductive pattern (411b) are electrically connected through the first via (V1), The above 2-1 conductive pattern (412a) and the above 2-2 conductive pattern (412b) are electrically connected through the second via (V2), An electronic device in which the first ground pattern (413a) and the second ground pattern (413b) are electrically connected through a third via (V3).

8. In any one of paragraphs 1 to 7, The above ground pattern (413) is an electronic device arranged between the first conductive pattern (411) and the second conductive pattern (412).

9. In any one of paragraphs 1 to 8, An electronic device comprising a button assembly (420) arranged on one side of the volume key (410).

10. In paragraph 9, The above button assembly (420) is A waterproof member (421) covering one side of the above volume key (410); A support plate (423) placed on the above waterproof member (421); and An electronic device comprising a button (425) arranged on the support plate (423).

11. In electronic devices (101, 200, 300, 1100), A housing (210) comprising a first side (210A), a second side (210B), and a side member (310) surrounding a space between the first side (210A) and the second side (210B); A volume key (410) arranged on the outer surface of the above side member (310); A support member (311) disposed inside the side member (310) and formed integrally with the side member (310); A printed circuit board (340) placed on one side of the above support member (311); and Includes a processor (120), The above volume key (410) is A first conductive pattern (411), a second conductive pattern (412) and a ground pattern (413); A first switch (410a) that conducts the first conductive pattern (411) and the ground pattern (413); and It includes a second switch (410b) that conducts the second conductive pattern (412) and the ground pattern (413), The above side member (310) and the above support member (311) are, A first conductive portion (610) formed by being surrounded by a first non-conductive portion (615); A second conductive portion (620) formed by being surrounded by a second non-conductive portion (625); and Includes a ground (630) formed between the first non-conductive portion (615) and the second non-conductive portion (625), The above printed circuit board (340) is A first terminal (1101), a first sensor (1110), a second terminal (1102) and a second sensor (1120); A first conductive path (1115) connecting the first sensor (1110) and the processor (120); and A second conductive path (1125) connecting the second sensor (1120) and the processor (120) is included. The first conductive portion (610) and the first terminal (1101) are spaced apart from each other and overlap each other, An electronic device in which the second conductive portion (610) and the second terminal (1102) are spaced apart from each other and overlap each other.

12. In paragraph 11, The first conductive pattern (411) is bonded to the first conductive portion (610) through the first conductive adhesive member (810), The second conductive pattern (412) is bonded to the second conductive portion (620) through the second conductive adhesive member (820), The above ground pattern (413) is an electronic device bonded to the ground (630) through a third conductive adhesive member (830).

13. In paragraph 11 or 12, The above processor (120) Based on the operation of the first switch (410a), a volume up signal is received through the first conductive pattern (411), the first conductive portion (610), the first terminal (1101), the first sensor (1110) and the first conductive path (1115), An electronic device configured to receive a volume down signal through the second conductive pattern (412), the second conductive portion (620), the second terminal (1102), the second sensor (1120) and the second conductive path (1125) based on the operation of the second switch (410b).

14. In any one of paragraphs 11 to 13, The first sensor (1110) is configured to detect an electrical change occurring between the first conductive portion (610) and the first terminal (1101), The second sensor (1120) is an electronic device configured to detect an electrical change occurring between the second conductive portion (620) and the second terminal (1101).

15. In any one of paragraphs 11 to 14, The above volume key (410) includes an FPCB (415), The above first challenge pattern (411) is It includes a 1-1 conductive pattern (411a) formed on the first surface of the FPCB (415) and a 1-2 conductive pattern (411b) formed on the second surface of the FPCB (415) and electrically connected to the 1-1 conductive pattern (411a). The above second challenge pattern (412) is It includes a 2-1 conductive pattern (412a) formed on the first surface of the FPCB (415) and a 2-2 conductive pattern (412b) formed on the second surface of the FPCB (415) and electrically connected to the 2-1 conductive pattern (412a). The above ground pattern (413) is An electronic device including a first ground pattern (413a) formed on a first surface of the FPCB (415) and a second ground pattern (413b) formed on a second surface of the FPCB (415) and electrically connected to the first ground pattern (413a).

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