Monitoring device capable of measuring temperature in low-temperature environment

Abstract

Disclosed is a monitoring device capable of measuring temperature in a low-temperature environment. The monitoring device comprises: a first cover arranged on an object to be diagnosed and having a plurality of grooves formed in the top surface thereof; a circuit board partially inserted into the grooves; and electronic elements arranged on the circuit board. Here, a heat blocking layer that blocks heat transferred from the object being diagnosed to a specific electronic element is arranged inside a groove into which a portion of the circuit board where the specific electronic element is located is inserted, the circuit board is arranged on the heat blocking layer, and the specific electronic element operates normally even in a sub-zero state due to the heat blocking layer.

Description

Monitoring device capable of measuring temperature in low-temperature environments

[0001] The present invention relates to a monitoring device capable of measuring temperature in a low-temperature environment.

[0002] The electrostatic chuck supporting the wafer controls the temperature distribution by lowering the wafer temperature. To verify that the electrostatic chuck is properly controlling the wafer temperature distribution, a monitoring device was developed. This monitoring device could only monitor the electrostatic chuck temperature through video. This is because some of the electronic components within the device do not function properly in sub-zero temperatures.

[0003] Recently, semiconductor devices have been evolving from planar to 3D structures, and their critical dimensions have decreased to the nanoscale. Consequently, the temperature of the electrostatic chuck (ESC) is gradually decreasing, and it is necessary to monitor the temperature of the ESC at sub-zero temperatures, especially at cryogenic temperatures. For example, as the semiconductor device evolves to a 3D structure, deeper channel holes must be formed, but the depth at which channel holes can be formed in an imaging state has been limited. To address this, technologies are being developed to maintain anisotropic characteristics during channel hole etching by maintaining the wafer temperature at sub-zero temperatures. However, because this process is performed in a sub-zero temperature environment, it is impossible to use existing monitoring equipment to confirm whether the ESC is properly controlling the temperature distribution of the wafer.

[0004] The present invention provides a monitoring device capable of measuring temperature in a low-temperature environment.

[0005] In order to achieve the above-described object, according to one embodiment of the present invention, a monitoring device comprises: a first cover arranged on a sensing body and having a plurality of grooves formed on an upper surface; a circuit board partially inserted into the grooves; and electronic components arranged on the circuit board. Here, a heat shielding layer is arranged inside a groove in which a portion of the circuit board where a specific electronic component is positioned is inserted, which blocks heat transferred from the sensing body to the specific electronic component, and the circuit board is arranged on the heat shielding layer, and due to the heat shielding layer, the specific electronic component operates normally even in sub-zero conditions.

[0006] According to another embodiment of the present invention, a monitoring device includes: a first cover; a second cover positioned over the first cover; a third cover positioned over the second cover; a circuit board arranged over the first cover; and a plurality of electronic components arranged over the circuit board. Here, first holes are formed in the second cover, at least some of the electronic components are inserted into the first holes, and a first filler is filled in an area outside the first hole of the electronic components.

[0007] A monitoring device according to another embodiment of the present invention comprises a cover; a circuit board arranged on the cover; and electronic components having a temperature sensor for measuring the temperature of a sensing body. Here, a hole is formed in a region surrounding the point where the temperature sensor is located on the circuit board to block heat generated from the circuit board from being transferred to the temperature component.

[0008]

[0009] The monitoring device according to the present invention can block heat transferred from the sensing element to the electronic element by arranging a heat shielding layer within the hole where the electronic element, which may not function properly in a low-temperature environment, is located. Consequently, the monitoring device can normally measure the temperature of the sensing element even in a low-temperature environment.

[0010] In addition, a hole may be formed in the area surrounding the point where the temperature sensor is located among the circuit elements, so that heat generated from the circuit element or the circuit board may not be transferred to the temperature sensor, so that the temperature sensor can normally measure the temperature of the sensing body without being affected by the heat.

[0011] FIG. 1 is a drawing illustrating the structure of a chamber according to one embodiment of the present invention.

[0012] FIG. 2 is a drawing illustrating the structure of a monitoring device according to one embodiment of the present invention.

[0013] FIG. 3 is a drawing illustrating an installation structure of a circuit board according to one embodiment of the present invention.

[0014] FIG. 4 is a drawing illustrating the structure of a second cover according to one embodiment of the present invention.

[0015] FIG. 5 is a drawing showing the arrangement structure of covers and circuit boards according to one embodiment of the present invention.

[0016] FIGS. 6 and 7 are drawings illustrating the structure of a circuit board according to one embodiment of the present invention.

[0017] As used herein, singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "consist of" or "include" should not be construed to necessarily include all components or steps described in the specification, and should be construed to mean that some of the components or steps may not be included, or that additional components or steps may be included. In addition, terms such as "part" and "module" described in the specification mean a unit that processes at least one function or operation, which may be implemented by hardware or software, or by a combination of hardware and software.

[0018]

[0019] The present invention relates to a monitoring device, which can measure the temperature distribution, inclination, etc. of a feedback device, such as an electrostatic chuck, used in semiconductor or display processes, not only in an image environment but also in a sub-zero environment (low-temperature environment). Here, the image environment and low-temperature environment can be determined based on the heat generated by the feedback device. For example, the low-temperature environment may mean that the temperature of the heat transferred to the feedback device is 0°C or lower.

[0020] Unlike the prior art that could not normally measure the temperature of a body in a low-temperature environment, the monitoring device of the present invention can measure the temperature of a body even in a low-temperature environment, particularly an extremely low-temperature environment of -70°C.

[0021] In one embodiment, the monitoring device may be a wafer-type monitoring device, and all electronic components may operate normally even in a low-temperature environment, enabling the temperature distribution of the sensing element to be measured. Furthermore, the monitoring device may also be capable of normally measuring the temperature distribution of the sensing element in a video environment.

[0022]

[0023] Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

[0024] FIG. 1 is a drawing illustrating the structure of a chamber according to one embodiment of the present invention, FIG. 2 is a drawing illustrating the structure of a monitoring device according to one embodiment of the present invention, and FIG. 3 is a drawing illustrating the installation structure of a circuit board according to one embodiment of the present invention. FIG. 4 is a drawing illustrating the structure of a second cover according to one embodiment of the present invention, and FIG. 5 is a drawing illustrating the arrangement structure of covers and a circuit board according to one embodiment of the present invention, and FIGS. 6 and 7 are drawings illustrating the structure of a circuit board according to one embodiment of the present invention.

[0025] Referring to FIG. 1, a chuck, for example, an electrostatic chuck (102), may be positioned at the lower side of the internal space of the chamber (100), and a shower head may be positioned at the upper side.

[0026] According to one embodiment, a monitoring device (104) may be arranged on an electrostatic chuck (102), and a temperature control device for heating / cooling a wafer may be arranged inside the electrostatic chuck (102).

[0027] The monitoring device (104) can measure process parameters, particularly temperature distribution, of a test body, for example, an electrostatic chuck (102). In particular, the monitoring device (104) can measure the temperature distribution of the test body in a low-temperature environment. In addition, the monitoring device (104) can measure the temperature distribution in a process state in a plasma environment generated during a semiconductor process in a chamber (100).

[0028] Referring to FIG. 2, the monitoring device (104) of the present embodiment may include a first cover (200), a second cover (202), a third cover (204), a circuit board (206), at least one electronic element (208), a first filler (210), a second filler (212), a first EMI shield layer (214), a second EMI shield layer (216), and a heat shield layer (218).

[0029] The third cover (204) can serve as an upper cover and protect electronic components (208) on the circuit board (206) from an external environment, for example, a plasma environment.

[0030] According to one embodiment, the third cover (204) may have a circular shape, which is the same shape as the wafer, a flat surface, and may be formed of silicon or glass, which are materials frequently used in semiconductor processes. Alternatively, the third cover (204) may be formed of silicon carbide, sapphire, ceramics such as Y2O3, YOF, or Al2O3, or engineering plastics such as Teflon, PEEK, or carbon fiber.

[0031] The second cover (202) is an intermediate cover arranged between the third cover (204) and the first cover (200), and can be processed into a certain shape to individually separate the electronic elements (208). The second cover (202) can have similar thermal characteristics (expansion coefficient, thermal conductivity) to the third cover (204), and can be formed of silicon, glass, silicon carbide, sapphire, Y2O3, YOF, Al2O3, Teflon, PEEK, carbon fiber, etc.

[0032] The first cover (200) serves as a lower cover and protects the electronic components (208) from the external environment, and may have similar thermal characteristics (expansion coefficient, thermal conductivity) to the third cover (204) or the second cover (202), and may be formed of silicon, glass, silicon carbide, sapphire, Y2O3, YOF, Al2O3, Teflon, PEEK, carbon fiber, etc. In addition, the first cover (200) is in direct contact with the electrostatic chuck (102), which is a vibration unit, and therefore, the first cover (200) may have the same flatness as a silicon wafer.

[0033] According to one embodiment, grooves (300) may be formed in the first cover (200) as illustrated in FIG. 3, and a circuit board (206) may be partially inserted into the grooves (300). However, the upper surface of the circuit board (206) may have a height equal to or greater than the top of the groove (300). For example, the thickness of the circuit board (206) may be greater than the depth of the groove (300). The circuit board (206) may be formed of a flexible PCB, FR-4, a glass substrate, or the like.

[0034] Electronic components (208) may be arranged on a circuit board (206) and may include a microprocessor, at least one sensor, a signal processing device, a wireless communication component, a battery, or a wireless charging component. Here, a temperature sensor as the sensor may measure the temperature distribution of the sensing body.

[0035] According to one embodiment, one electronic element (208) may be arranged on the circuit board (206) based on an individual groove (300). Of course, two or more electronic elements (208) may be arranged corresponding to an individual groove (300). Due to the groove (300), the circuit board (206) can maintain a certain alignment, and since the circuit board (206) is inserted into the groove (300), the thickness of the monitoring device (104) can be reduced. In addition, the groove (300) can dissipate heat generated in the circuit board (206) to the first substrate (200), the second substrate (202), and the third substrate (204).

[0036] However, among the electronic components (208), there are electronic components that do not operate normally in low-temperature environments (electronic components vulnerable to low-temperature environments). For example, microprocessors, batteries, communication ICs, charging ICs, etc. may not operate normally in low-temperature environments.

[0037] According to one embodiment, in order to solve this problem, a heat blocking layer (218) may be arranged in a groove (300) into which a circuit board (206) on which an electronic element (208a) vulnerable to a low-temperature environment is arranged is inserted. This heat blocking layer (218) is positioned between the driven body and the circuit board (206) to block heat generated from the driven body from being transferred to the electronic element (208a), so that the electronic element (208a) can operate normally even in a low-temperature, particularly, ultra-low-temperature, environment. At this time, since the heat generated from the third cover (204) is transferred to the electronic element (208a) vulnerable to a low-temperature environment as ions are applied to the third cover (204) during the plasma process, the electronic element (208a) can operate normally even in an ultra-low-temperature environment due to the transferred heat and the effect of the heat blocking layer (218). Meanwhile, the thickness of the heat blocking layer (218) can be designed differently depending on the heat transferred from the above-mentioned heat generating unit.

[0038] A heat shield layer may not be present in the groove (300) corresponding to a location where an electronic component (208) robust to low-temperature environments, rather than an electronic component (208a) vulnerable to low-temperature environments, is located. This is because the electronic component (208) can operate normally even without a heat shield layer. Of course, a heat shield layer may be arranged in all grooves (300).

[0039] Looking at the structure of the monitoring device (104) based on one home (300), an electronic element (208) is arranged on a circuit board (206), a first filler (210) surrounds the electronic element (208) on the circuit board (206), a second cover (202) is positioned on the left and right sides of the first filler (210), and a first EMI shield layer (214) can be arranged on the upper part of the first filler (210). That is, an electronic element (208) is arranged in a hole (400) formed in the second cover (202), and the first filler (210) can cover the electronic element (208) in the space. From another perspective, a portion of the hole (400) excluding the electronic element (208) can be filled with the first filler (210).

[0040] Additionally, a second EMI shield layer (216) may be arranged on the lower side of the circuit board (206) within the home (300), and a heat shield layer (218) and a second EMI shield layer (216) may be arranged on the lower side of the circuit board (206) on which electronic components (208a) that are vulnerable at low temperatures are arranged.

[0041] Above, the circuit board (206), the heat shielding layer (218), and the second EMI shielding layer (216) are arranged within the groove (300), but the circuit board (206) may be positioned on top of the first cover (200) and the second EMI shielding layer (216) may be positioned within the first cover (200) or between the circuit board (206) and the first cover (200). In this case, a groove may be formed only at the lower portion of the circuit board (206) where the electronic components (208a) vulnerable to low temperatures are arranged, and the heat shielding layer may be arranged within the groove.

[0042] In another embodiment, the thermal barrier layer (218) may be implemented so as to surround the electronic element (208a) that is vulnerable at low temperatures, rather than being located within the groove (300). In this case, the first filler (210) may be filled in the area within the hole (400) other than the electronic element (208a) and the thermal barrier layer surrounding it.

[0043] In another embodiment, the depth of at least one of the grooves (300) may be different. For example, the depth of the groove (300) corresponding to the electronic component (208a) vulnerable at low temperatures may be greater than the depth of the groove (300) corresponding to the other electronic component (208). In this case, the second EMI shield layer (216) within the groove (300) corresponding to the electronic component (208a) vulnerable at low temperatures may have the same thickness as the second EMI shield layer (216) within the other groove (300).

[0044] The first filler (210) may be formed of a material identical to or similar to that of the cover (200, 202, or 204). That is, the first filler (210) may have thermal characteristics or expansion / contraction characteristics identical to or similar to those of the cover (200, 202, or 204), so that the sensor can accurately detect heat generated by ion bombardment on the surface of the third cover (204) when plasma is generated within the chamber (100). The first filler (210) may be formed of a material having high thermal conductivity.

[0045] Additionally, the first filler (210) can overcome the step between the electronic element (208) and the second cover (202).

[0046] According to one embodiment, the first filler (210) may be a liquid, and a curable resin-based material (UV curable type material) may be used, for example, an epoxy or silicone-based material may be used. Of course, the first filler (210) may also be a solid.

[0047] The second filler (212) is filled in another hole (402) of the second cover (202) and may be made of the same or similar material as the first filler (210). This second filler (212) is used to facilitate heat conduction between the covers (200, 202, and 204). Consequently, the time for reaching thermal equilibrium between the third cover (204) and the first cover (200) can be shortened due to the second filler (212). Accordingly, the electronic component (208a) that is vulnerable to heat can be better protected even at extremely low temperatures. Specifically, the third cover (204) is in a state where heat is generated by the impact of ions generated during the plasma process, and the first cover (200) is arranged on the electrostatic chuck (102), which is a vibration unit, and is cooled, so that a thermal difference occurs between the third cover (204) and the first cover (200). In this case, the second filler (212) can compensate for the thermal difference between the third cover (204) and the first cover (200), thereby realizing rapid thermal equilibrium.

[0048] The first EMI shield layer (214) is positioned between the second cover (202) and the first filler (210) and the third cover (204), and can protect electronic components from electrical noise caused by plasma generated during the semiconductor manufacturing process. Here, the first EMI shield layer (214) can be formed by applying a liquid material or can be formed as a film, and can be formed of a material such as gold, silver, copper, nickel, aluminum, or a mixed material thereof.

[0049] The second EMI shield layer (216) may be arranged under the circuit board (206) within the groove (300) of the first cover (200) and may be formed of a material identical to or similar to the first EMI shield layer (214).

[0050] According to another embodiment, the first EMI shield layer (214) may be located inside the third cover (204), and the second EMI shield layer (216) may be located inside the first cover (200).

[0051]

[0052] Below, we will examine the overall three-dimensional structure of a monitoring device (104) having such a structure and function.

[0053] Referring to FIGS. 4 and 5, a first hole (400) and a second hole (420) can be formed in the second cover (202).

[0054] The first hole (400) is a hole into which an electronic element (208) is inserted, and the area excluding the electronic element (208) can be filled with a first filler (210).

[0055] The second hole (402) is a hole filled with a second filler (212) for rapid thermal equilibrium between the third cover (204) and the first cover (200). These second holes (402) can be evenly formed throughout the second cover (202) without overlapping with the first holes (400).

[0056] According to one embodiment, the outer diameter of the second cover (202) may be the same as that of the third cover (204) or the first cover (200), as illustrated in FIG. 5, and the first holes (400) or the second holes (402) may be formed side by side, as illustrated in FIG. 4. Additionally, the size of the first hole (400) may be larger than the size of the second hole (402).

[0057] Referring to FIGS. 6 and 7, a third hole (604) in the shape of a ring may be formed in a peripheral area of ​​a point where a temperature sensor is positioned as an electronic element (208) in the circuit board (206), and a first hole (600) and a second hole (602) may be formed in the remaining area. At this time, the first hole (600) may be formed at a position corresponding to the second hole (402) of the second cover (202) and may be filled with a second filler (212), and the second hole (602) is a hole for maintaining the alignment of the first cover (200) and the circuit board (206). Heat generated in the circuit board (206) may be dissipated to the first cover (200) through the second holes (602).

[0058] Referring to FIG. 7, looking specifically at the third hole (604), the circuit board (206) is formed of a metal material such as copper or gold, and such a metal material reacts sensitively to the rise and fall of heat, so that when measuring temperature, not only the desired point is measured, but also the temperature of the surrounding metal material is measured, which may affect the noise. Therefore, in order to block the thermal noise generated in the circuit board (206) from being transmitted to the temperature sensor, the third hole (604) may be formed in a peripheral area of ​​the temperature sensor on the circuit board (206). At this time, the third hole (604) may be formed to surround the temperature sensor in the peripheral area of ​​the temperature sensor.

[0059] Meanwhile, since electrical wiring is connected to the temperature sensor, a third hole (604) may be formed in a ring shape in the peripheral area of ​​the temperature sensor, excluding the electrical wiring portion. At this time, the first hole (600) may also eliminate thermal noise generated from the circuit board (206). Of course, the third hole (604) is not limited to a ring shape surrounding the temperature sensor and may have various shapes.

[0060] In another embodiment, a heat shielding layer other than the third hole (604) may be formed in the peripheral area of ​​the temperature sensor.

[0061] In summary, the monitoring device (104) of the present embodiment inserts the circuit board (206) into the groove (300) of the first cover (200), and arranges a heat shielding layer (218) in the groove (300) corresponding to the electronic element (208a) vulnerable to low temperatures, thereby enabling the electronic element (208a) to operate normally even in a low-temperature environment.

[0062]

[0063] Meanwhile, the components of the aforementioned embodiments can be easily understood from a process perspective. That is, each component can be understood as a separate process. Furthermore, the processes of the aforementioned embodiments can be easily understood from the perspective of the device components.

[0064] In addition, the technical contents described above may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the medium may be those specially designed and configured for the embodiments or may be known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc. The hardware devices may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

[0065] The above-described embodiments of the present invention are disclosed for the purpose of illustration, and those skilled in the art with common knowledge of the present invention will be able to make various modifications, changes, and additions within the spirit and scope of the present invention, and such modifications, changes, and additions should be considered to fall within the scope of the following patent claims.

Claims

1. A first cover arranged on a plate body and having a plurality of grooves formed on the upper surface; a circuit board partially inserted into the above grooves; and Including electronic components arranged on the circuit board, A monitoring device characterized in that a heat blocking layer is arranged inside a groove in which a portion of the circuit board where a specific electronic element is located is inserted, which blocks heat transferred from the piezoelectric element to the specific electronic element, and the circuit board is arranged on the heat blocking layer, and the specific electronic element operates normally even in sub-zero conditions due to the heat blocking layer.

2. In the first paragraph, the electronic components include a temperature sensor, and the specific electronic component is a microprocessor, a battery, a communication IC, or a charging IC. A monitoring device characterized in that the temperature sensor measures the temperature of the body, and the specific electronic element operates normally even at -70°C due to the heat shielding layer.

3. A monitoring device characterized in that, in the first paragraph, a heat shielding layer is not formed inside a groove into which a portion of the circuit board in which an electronic element other than the specific electronic element is positioned is inserted.

4. A monitoring device characterized in that, in the third paragraph, a second EMI shield layer is formed inside a groove where the heat blocking layer exists, and a second EMI shield layer is also formed inside a groove where the heat blocking layer does not exist.

5. In paragraph 1, A second cover is further included, arranged on the first cover and having first holes and second holes spaced apart from each other, A monitoring device characterized in that the electronic components are inserted into the first holes while being arranged on the circuit board, the remaining portion of each of the first holes except for the electronic components is filled with a first filler, and the second holes are filled with a second filler.

6. In paragraph 5, a third cover arranged on the second cover; and Further comprising a first EMI shield layer positioned between the third cover, the second cover, and the first filler, A monitoring device characterized in that the upper part of the second cover and the upper part of the first filler have the same height.

7. A monitoring device according to claim 6, characterized in that at least one of the covers is formed of silicon, glass, silicon carbide, sapphire, ceramic series Y2O3, YOF, Al2O3, or Teflon, PEEK or carbon fiber, and at least one of the fillers is formed of epoxy or silicone series material.

8. In the first paragraph, a plurality of holes are formed in the circuit board, A monitoring device characterized in that the above holes are used for alignment with the first cover.

9. In the first paragraph, a plurality of holes are formed in the circuit board, A monitoring device characterized in that the holes are formed in the surrounding area of ​​the point where the temperature sensor is located to block heat generated from the circuit board from being transferred to the temperature sensor.

10. 1st cover; A second cover positioned above the first cover; A third cover positioned above the second cover; a circuit board arranged on the first cover; and Including a plurality of electronic components arranged on the circuit board, A monitoring device characterized in that first holes are formed in the second cover, at least some of the electronic components are inserted into the first holes, and a first filler is filled in an area other than the electronic components within the first hole.

11. In the 10th paragraph, second holes are additionally formed in the second cover, A monitoring device characterized in that a second filler is filled inside the second hole to shorten the time for reaching thermal equilibrium between the first cover and the third cover, and the first filler and the second filler are formed of the same material.

12. A monitoring device according to claim 11, characterized in that the circuit board is formed with first holes filled with the second filler, second holes for alignment with the first cover, and a third hole formed in a peripheral area of ​​a point where a temperature element among the electronic elements is located.

13. A monitoring device according to claim 10, characterized in that the heat shielding layer is arranged in a groove formed in the first cover or is arranged to surround a specific electronic element.

14. Cover; a circuit board arranged on the cover; and Including electronic components having a temperature sensor for measuring the temperature of the body, A monitoring device characterized in that a hole is formed in an area surrounding a point where the temperature sensor is located on the circuit board to block heat generated from the circuit board from being transferred to the temperature element.

15. In the 14th paragraph, a plurality of grooves are formed on the cover, A monitoring device characterized in that the circuit board is partially inserted into the grooves of the cover, the height of the circuit board is greater than the depth of the groove, and a heat shielding layer exists inside the groove in which specific electronic components are arranged.

16. In paragraph 14, Further comprising an additional cover positioned over the above cover, A monitoring device characterized in that a plurality of holes are formed in the additional cover, the electronic components are respectively arranged in the holes of the additional cover, and a filler is filled in an area other than the electronic components within the holes of the additional cover.

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