Load lock chamber and substrate processing apparatus including same

Abstract

The present invention relates to a substrate processing apparatus for processing a substrate and, more particularly, to a load lock chamber in which a substrate to be transferred is held, and a substrate processing apparatus including same. According to an embodiment, the load lock chamber may comprise: a housing providing a holding space in which a substrate is held; a support unit supporting the substrate in the holding space; a pressure adjustment unit for decompressing the holding space; and an elevation unit for moving the support unit up and down in the holding space. The elevation unit may comprise: a shaft extending through the lower wall of the housing to be coupled to the lower portion of the support unit; an elevation plate installed on the lower portion of the shaft; a bellows coupled to the lower wall of the housing and a guide plate, and provided to surround the shaft; and a driver for moving the guide plate in the vertical direction. A slit may be formed on the side surface of the shaft.

Description

Load lock chamber and substrate processing device including the same

[0001] The present invention relates to a substrate processing device for processing a substrate, and more particularly, to a load lock chamber for temporarily storing a substrate and a substrate processing device including the same.

[0002] Semiconductors are generally manufactured by sequentially performing a series of unit processes such as film formation, pattern formation, and metal wiring formation. The above unit processes are generally performed inside a process chamber, and the substrate processing device includes a load port, a equipment front end module, a load lock chamber, and a transfer chamber to provide the substrate into the process chamber. The load port supports a carrier containing the substrate, and the equipment front end module includes a transfer robot that transfers the substrate between the load port and the load lock chamber. The load lock chamber temporarily waits for a substrate that has completed substrate processing before being transferred to the load port or for a substrate that is provided for substrate processing before being transferred to the process chamber, and the transfer chamber transfers the substrate between the load lock chamber and the process chamber.

[0003] Typically, the load-lock chamber is provided as a sealable chamber and is opened and closed by a shutter. Furthermore, before the shutter is opened, the internal pressure of the load-lock chamber is adjusted to match the internal pressure of the equipment's front-end module or transfer chamber. The time it takes for the pressure to be adjusted affects the substrate processing speed of the substrate processing device.

[0004] A load lock chamber includes a support unit that supports a plurality of substrates in a housing that accommodates the substrates, and an elevating unit that elevates the support unit. A slot formed in the support unit is positioned at a height corresponding to an opening formed in the housing by the elevating unit. Accordingly, a substrate is loaded into the slot, or a substrate placed in the slot is removed.

[0005] The lifting unit includes a shaft that penetrates the lower wall of the housing and is connected to the support unit, an actuator that provides lifting force to the shaft, and a bellows provided to surround the shaft. The bellows compresses when the shaft is raised and expands when the shaft is lowered. Consequently, gas may leak and remain in the space between the bellows and the shaft. This residual gas is released into the housing when the interior of the housing is depressurized, increasing the depressurization time of the housing.

[0006] The present invention aims to provide a load lock chamber capable of reducing the pressure control time of the load lock chamber and a substrate processing device including the same.

[0007] The present invention aims to provide a load lock chamber capable of easily discharging gas remaining in a space between a bellows and a shaft, and a substrate processing device including the same.

[0008] The present invention aims to provide a load lock chamber capable of improving the substrate processing speed of a substrate processing device and a substrate processing device including the same.

[0009] The purpose of the present invention is not limited thereto, and other purposes not mentioned will be clearly understood by those skilled in the art from the description below.

[0010] The present invention discloses a device for processing a substrate. According to one embodiment, the device comprises: a front module for equipment having a load port on which a container for receiving a substrate is placed and an index robot for transporting the substrate; a processing module having a transport robot for transporting the substrate and a process chamber for processing the substrate; and a load lock chamber positioned between the front module for equipment and the processing module to provide a path for moving the substrate between the front module for equipment and the processing module, wherein the index robot is provided to transport the substrate between the container placed on the load port and the load lock chamber, and the transport robot is provided to transport the substrate between the load lock chamber and the process chamber, wherein the load lock chamber comprises: a housing providing a waiting space in which a substrate waits; a support unit for supporting the substrate in the waiting space; a pressure control unit for depressurizing the waiting space; and an elevation unit for elevating the support unit within the waiting space, wherein the elevation unit comprises: a shaft penetrating a lower wall of the housing and coupled to a lower portion of the support unit; an elevation plate installed at a lower portion of the shaft; A bellows coupled to the lower wall of the housing and the guide plate and provided to surround the shaft; and a driver for moving the guide plate in an up-and-down direction, wherein a slit may be formed on a side of the shaft.

[0011] In one embodiment, the slit may be formed along the longitudinal direction of the shaft.

[0012] In one embodiment, the slit may be formed to connect the space between the shaft and the bellows and the waiting space.

[0013] According to one embodiment, the housing includes an opening formed in a side wall, the support unit includes a plurality of slots for supporting a plurality of substrates by vertically spacing them apart, the elevating unit moves the guide plate between a compression position in which the bellows is compressed and an expansion position in which the bellows is expanded, the compression position being a position in which a slot provided at a lowest height among the slots corresponds to the opening, and the expansion position being a position in which a slot provided at a highest height among the slots corresponds to the opening, and the slit may be formed to be exposed to the waiting space when the shaft is located at the expansion position.

[0014] In one embodiment, the slit may be formed to be exposed in the space between the shaft and the bellows when the shaft is positioned in the compressed position.

[0015] In one embodiment, the slits may be provided in multiple locations spaced apart from each other along the circumference of the shaft.

[0016] In one embodiment, the lifting unit may further include a guide rod installed vertically on the lower wall of the housing and penetrating the guide plate.

[0017] In one embodiment, an exhaust port is formed at the lower part of one side wall of the housing, and the pressure regulating unit may include an exhaust member for exhausting the atmospheric space; and an exhaust line connecting the exhaust port and the exhaust member.

[0018] In one embodiment, the load lock chamber may be provided in multiples.

[0019] The present invention discloses a load lock chamber. According to one embodiment, the load lock chamber comprises: a housing providing a waiting space in which a substrate waits; a support unit supporting a substrate in the waiting space; a pressure control unit depressurizing the waiting space; and an elevating unit elevating the support unit within the waiting space, wherein the elevating unit comprises: a shaft penetrating a lower wall of the housing and coupled to a lower portion of the support unit; an elevating plate installed at a lower portion of the shaft; a bellows coupled to the lower wall of the housing and the guide plate and provided to surround the shaft; and a driver for moving the guide plate in a vertical direction, wherein a slit may be formed on a side surface of the shaft.

[0020] In one embodiment, the slit may be formed along the longitudinal direction of the shaft.

[0021] In one embodiment, the slit may be formed to connect the inner space of the bellows and the atmospheric space.

[0022] According to one embodiment, an opening which is an entrance / exit of an external conveying device is formed in a side wall of the housing, the support unit includes a plurality of slots which support a plurality of substrates by separating them vertically, the elevating unit moves a guide plate between a compression position in which the bellows is compressed and an expansion position in which the bellows is expanded, the compression position being a position in which a slot provided at a lowest height among the slots corresponds to the opening, and the expansion position being a position in which a slot provided at a highest height among the slots corresponds to the opening, and the slit can be formed to communicate the waiting space and the internal space when the shaft is positioned at the expansion position.

[0023] In one embodiment, the slit may be formed to be exposed to communicate the atmospheric space and the internal space when the shaft is positioned in the compressed position.

[0024] In one embodiment, the slits may be provided in multiple locations spaced apart from each other along the circumference of the shaft.

[0025] In one embodiment, the lifting unit may further include a guide rod installed vertically on the lower wall of the housing and penetrating the guide plate.

[0026] In one embodiment, an exhaust port is formed in a lower region of one side wall of the housing, and the pressure control unit may include an exhaust member for exhausting the atmospheric space; and an exhaust line connecting the exhaust port and the exhaust member.

[0027] The present invention discloses a device for processing a substrate. According to one embodiment, the device comprises: a front module for equipment having a load port on which a container for receiving a substrate is placed and an index robot for transporting the substrate; a processing module having a transport robot for transporting the substrate and a process chamber for processing the substrate; a plurality of load lock chambers positioned between the front module for equipment and the processing module to provide a path for moving the substrate between the front module for equipment and the processing module, the load lock chambers including: a housing providing a waiting space for a substrate to wait; a support unit for supporting the substrate in the waiting space; a pressure control unit for depressurizing the waiting space; and an elevating unit for elevating the support unit within the waiting space, wherein the elevating unit comprises: a shaft penetrating a lower wall of the housing and coupled to a lower portion of the support unit; a guide plate installed at a lower portion of the shaft; a bellows coupled to the lower wall of the housing and the guide plate and provided to surround the shaft; And it includes a driver for moving the guide plate up and down, and a slit is formed on a side of the shaft, and the slit is formed along the longitudinal direction of the shaft, and can be formed to connect the space between the shaft and the bellows and the waiting space.

[0028] According to one embodiment, the housing includes an opening formed in a side wall, the support unit includes a plurality of slots for supporting a plurality of substrates by vertically spacing them apart, the elevating unit moves the guide plate between a compression position in which the bellows is compressed and an expansion position in which the bellows is expanded, the compression position being a position in which a slot provided at a lowest height among the slots corresponds to the opening, and the expansion position being a position in which a slot provided at a highest height among the slots corresponds to the opening, and the slit may be formed such that when the shaft is positioned at the expansion position, it is exposed to the waiting space, and when the shaft is positioned at the compression position, it is exposed to the space between the shaft and the bellows.

[0029] According to one embodiment, the lifting unit may further include a guide rod installed vertically on the lower wall of the housing and penetrating the guide plate, an exhaust port may be formed on the lower part of one side wall of the housing, and the pressure control unit may include an exhaust member for exhausting the atmospheric space; and an exhaust line connecting the exhaust port and the exhaust member.

[0030] According to one embodiment of the present invention, the pressure control time of the load lock chamber can be reduced.

[0031] According to one embodiment of the present invention, gas remaining in the space between the bellows and the shaft can be easily discharged.

[0032] According to one embodiment of the present invention, the substrate processing speed of a substrate processing device can be improved.

[0033] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person skilled in the art to which the present invention pertains from this specification and the attached drawings.

[0034] The various features and advantages of the non-limiting embodiments of this disclosure will become more apparent upon review of the detailed description in conjunction with the accompanying drawings. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. The accompanying drawings are not to scale unless explicitly stated otherwise. Various dimensions in the drawings may be exaggerated for clarity.

[0035] FIG. 1 is a plan view schematically showing a substrate processing device according to one embodiment of the present invention.

[0036] FIG. 2 is a schematic drawing of a load lock chamber according to one embodiment of the present invention.

[0037] FIG. 3 is a schematic drawing showing one embodiment of the shaft of FIG. 2.

[0038] Figure 4 is an enlarged view of part A of Figure 2.

[0039] Fig. 5 is a drawing showing a cross-section of the shaft A-A' of Fig. 3.

[0040] Figure 6 is a drawing showing the appearance of the load lock chamber when the support unit is positioned in the compressed position.

[0041] Figure 7 is a drawing showing the appearance of the load lock chamber when the support unit is positioned in the expanded position.

[0042] Figure 8 is a drawing showing the process of loading a substrate into a load lock chamber.

[0043] Figure 9 is a drawing showing the substrate being loaded into the load lock chamber and the support unit being raised.

[0044] Figure 10 is a drawing showing the exhaust inside the load lock chamber.

[0045] Figure 11 is a drawing showing the process of removing a substrate from a load lock chamber.

[0046] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. These exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope of the present disclosure to those skilled in the art. To provide a thorough understanding of the embodiments of the present disclosure, numerous specific details, such as examples of specific components, devices, and methods, are set forth. It will be apparent to those skilled in the art that specific details are not necessarily required, and that the exemplary embodiments can be implemented in many different forms, and neither should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail.

[0047] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the example embodiments. As used herein, the singular or non-plural forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are open-ended and thus specify the presence of stated features, elements, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, elements, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations herein are not necessarily to be construed as necessarily being performed in the particular order discussed or described, unless such order is explicitly stated. Additionally, additional or alternative steps may be selected.

[0048] When an element or layer is referred to as being "on," "connected," "joined," "attached," "adjacent," or "covering" another element or layer, it is intended that it is directly on, connected, joined, attached, adjacent, or covering said other element or layer, or that intermediate elements or layers may be present. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, it should be understood that no intermediate elements or layers are present. Like reference numerals refer to like elements throughout the specification. The term "and / or" as used herein includes all combinations and subcombinations of one or more of the listed items.

[0049] Although terms such as first, second, third, etc. may be used herein to describe various elements, regions, layers, and / or sections, it should be understood that these elements, regions, layers, and / or sections are not limited by these terms. These terms are used merely to distinguish one element, region, layer, or section from another element, region, layer, or section. Thus, a first element, a first region, a first layer, or a first section discussed below could also be referred to as a second element, a second region, a second layer, or a second section without departing from the teachings of the exemplary embodiments.

[0050] Spatially relative terms (e.g., "beneath," "beneath," "lower," "above," "top," etc.) may be used for convenience of description to describe the relationship of one element or feature to other element(s) or features as depicted in the drawings. It should be understood that spatially relative terms are intended to encompass not only the orientation depicted in the drawings, but also other orientations of the device in use or operation. For example, if the device in the drawings were turned over, elements described as "beneath" or "below" other elements or features would then be oriented "above" the other elements or features. Thus, the term "beneath" can encompass both above and below orientations. The device can be oriented differently (rotated 90 degrees, or at other orientations), and the spatially relative descriptive phrases used herein can be interpreted accordingly.

[0051] When using the terms "same" or "same" in the description of embodiments, it should be understood that there may be some inaccuracy. Therefore, when one element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance (e.g., ±10%).

[0052] When the terms "approximately" or "substantially" are used herein in connection with a numerical value, it should be understood that the numerical value includes manufacturing or operating tolerances (e.g., ±10%) of the stated value. Furthermore, when the terms "typically" and "substantially" are used in connection with geometrical shapes, it should be understood that geometrical accuracy is not required, but that latitude in the shape is within the disclosed scope.

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. Furthermore, terms, including terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with their meaning within the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0054] In this embodiment, a wafer is used as an example of a processing target. However, the technical concept of the present invention can also be applied to devices used for processing other types of substrates other than wafers.

[0055] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings.

[0056] FIG. 1 is a plan view schematically showing a substrate processing device according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing device (1) has an index module (100), a load lock chamber (300), and a processing module (300). The index module (100), the load lock chamber (300), and the processing module (300) are arranged along a certain direction. The index module (100), the load lock chamber (300), and the processing module (300) are arranged along a first direction (11).

[0057] The index module (100) returns the substrate (W) from the container (10) containing the substrate (W) to the processing module (300), and stores the substrate (W) that has been processed in the processing module (300) into the container (10). The index module (100) is provided with its length direction in the second direction (12). The index module (100) has a load port (120) and an index frame (140). The load port (120) is located on the opposite side of the processing module (300) with respect to the index frame (140). The container (10) containing the substrates (W) is placed on the load port (120). A plurality of load ports (120) may be provided.

[0058] A sealed container (10) such as a front open unified pod (FOUP) may be used as the container (10). The container (10) may be placed on a load port (120) by a transport means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle, or by a worker.

[0059] The index frame (140) may have a sealed space from the outside. The space within the index frame (140) may be provided with atmospheric pressure. Optionally, the space within the index frame (140) may be provided with a pressure higher than atmospheric pressure. A fan filter unit (not shown) is provided at the top of the index frame (140). The fan filter unit forms a descending airflow within the index frame (140). A door opener (not shown) for opening and closing the door of the container (10) may be provided within the index frame (140).

[0060] An index robot (142) is provided in the index frame (140). A guide rail (148) is provided within the index frame (140) whose length direction is provided in the second direction (12), and the index robot (142) can be provided to be movable on the guide rail (148). The index robot (142) includes a hand (142a) on which a substrate (W) is placed, and the hand (142a) can be provided to be capable of moving forward and backward, rotating about an axis in the up-down direction, and moving along the up-down direction. A plurality of hands (142a) are provided to be spaced apart from each other in the up-down direction, and the hands (142a) can move forward and backward independently of each other.

[0061] The load lock chamber (200) is arranged adjacent to the index frame (140). The load lock chamber (200) may be arranged between the transfer chamber (340) and the index module (100). The substrate (W) returned from the container (10) to the process chamber (360) may be temporarily stored in the load lock chamber (200) after being removed from the container (10). In addition, the substrate (W) whose process has been completed in the process chamber (360) may be temporarily stored in the load lock chamber (200) while being returned to the container (10). A plurality of load lock chambers (200) may be provided. The substrate (W) may be returned between the index frame (140) and the transfer chamber (340) through each load lock chamber (200). Optionally, the substrate (W) may be returned from the index frame (140) to the transfer chamber (340) through one of the load lock chambers (200), and may be returned from the transfer chamber (340) to the index frame (140) through another of the load lock chambers (200). The specific structure of the load lock chamber (200) will be described later.

[0062] The processing module (300) includes a transfer chamber (340) and a process chamber (360). The transfer chamber (340) is disposed adjacent to the load lock chamber (320). When viewed from above, the transfer chamber (340) may be provided in a polygonal shape. A transfer robot (342) is disposed in the transfer chamber (340). The transfer robot (342) transfers a substrate (W) between the load lock chamber (320) and the process chamber (360). The interior of the transfer chamber (340) may be provided with a vacuum pressure.

[0063] A transport robot (342) includes a hand (342a) on which a substrate (W) is placed, and the hand (342a) may be provided to be capable of moving forward and backward, rotating about an axis in an up-down direction, and moving in an up-down direction. A plurality of hands (342a) are provided spaced apart from each other in an up-down direction, and the hands (342a) may be independently moved forward and backward. One of the hands (342a) may support a substrate (W) being transported from a load lock chamber (320) to a process chamber (360), and the other of the hands (342a) may support a substrate (W) being transported from a process chamber (360) to a load lock chamber (320).

[0064] The process chamber (360) is arranged on the side of the transfer chamber (340). For example, the process chambers (360) may be arranged on each side of the transfer chamber (340). The process chambers (360) may be provided to perform the same process on the substrate (W). Optionally, some of the process chambers (360) may be provided to sequentially perform a series of processes on the substrate (W). In one example, the process chamber (360) may perform a process of forming plasma using an inductively coupled plasma (ICP) method and treating the substrate (W) using the plasma. For example, the process chamber (360) may perform a process of etching a thin film on the substrate (W).

[0065] FIG. 2 is a schematic diagram of a load lock chamber according to one embodiment of the present invention. Referring to FIG. 2, the load lock chamber (200) includes a housing (210), a support unit (230), a pressure control unit (250), and an elevating unit (270).

[0066] The housing (210) provides a waiting space (210a) in which a substrate (W) waits. The housing (210) can seal the waiting space (210a). A first opening (211a) may be formed in a first side wall (211) of the housing (210). A first door (211b) for opening and closing the first opening (211a) is provided in the first opening (211a). In addition, a second opening (212a) may be formed in a second side wall (212) of the housing (210). The second side wall (212) may be a side wall facing the first side wall (211). The first opening (211a) may be provided at the same height as the second opening (212a). A second door (212b) for opening and closing the second opening (212a) is provided in the second opening (212a). The first opening (211a) and the second opening (212a) are provided so that an index robot (142) or a transfer robot (342) can enter and exit therethrough. Accordingly, a substrate (W) can enter and exit the waiting space (210a). An exhaust port (213a) to which a pressure control unit (250) to be described later is connected is formed in the third side wall (213) of the housing (210). The exhaust port (213a) may be formed at the lower portion of the third side wall (213).

[0067] A support unit (230) is provided in the waiting space (210a). The support unit (230) supports the substrate (W). The support unit (230) includes a base (231), a support (233), and a connecting portion (235).

[0068] A base (231) is provided as a base of a support unit (230). The base (231) may be provided in various shapes. For example, the base (231) includes a circular plate (231a), a ring plate (231b), and a fixing member (231c). The diameter of the ring plate (231b) may be provided to be larger than the diameter of the circular plate (231a). The circular plate (231a) may be located on the inside of the ring plate (231b). The fixing member (231c) connects the circular plate (231a) and the ring plate (231b). The circular plate (231a) and the ring plate (231b) are fixed. The fixing members (231c) may be provided in multiple numbers. An elevating unit (270) is coupled to the circular plate (231a). A support member (231c) is coupled to the ring plate (231b). However, the shape of the base (231) is not limited to the above-described example, and any shape is sufficient as long as the support (233) and the lifting unit (270) can be combined.

[0069] The support (233) supports the substrate (W). The support (233) may be provided in a shape having a longitudinal direction in a third direction (13). The third direction (13) may be a direction perpendicular to the first direction (11) and the second direction (12). Hereinafter, the third direction (13) and the reverse direction of the third direction (13) are referred to as the up-down direction. The support (233) may be provided in multiples. In one example, three supporters (233) may be provided and installed to support the substrate (W) in three directions. The substrate (W) is supported by a slot (234) formed in the support (233). The support (233) is installed so as not to interfere with an index robot (142) or a transfer robot (342) entering and exiting the first opening (211a) or the second opening (212a). A slot (234) is formed in the support (233). The slot (234) has a shape extending from the support (233) toward the inside of the waiting space (210a). The slot (234) supports the lower edge of the substrate (W). A plurality of slots (234) may be formed in the third direction (13). Accordingly, a plurality of substrates (W) may be stacked while being spaced apart from each other by a certain distance. In one example, the slots (234) may be provided to support 25 substrates (W). Accordingly, the support unit (230) may support a plurality of substrates (W). Hereinafter, the slots located at the lowest position to the slots located at the highest position are referred to as the first slot (234-1) to the 25th slot (234-25).

[0070] The connecting portion (235) connects a plurality of supports (233). The connecting portion (235) secures the plurality of supports (233). The connecting portion (235) is coupled to the upper ends of the plurality of supports (233). In one example, the connecting portion (235) may be provided in a ring shape. By securing the supports (233) by the connecting portion (235), the substrate (W) can be stably supported.

[0071] The pressure control unit (250) controls the pressure of the atmospheric space (210a). The pressure control unit (250) can convert the atmospheric space (210a) between a first pressure and a second pressure. The first pressure is the same as or similar to the pressure within the index frame (140), and the second pressure is the same as or similar to the pressure within the transfer chamber (340). For example, the first pressure may be atmospheric pressure, and the second pressure may be vacuum pressure. The pressure control unit (250) may include a purge gas supply member (not shown), an exhaust line (251), and an exhaust member (253). The purge gas supply member supplies purge gas to the atmospheric space (410a). Before the first door (211b) provided on the first side wall (211) is opened, purge gas is supplied to the atmospheric space (210a) through the purge gas supply line while the doors (211b, 212b) provided on the first side wall (211) and the second side wall (212) are closed, and the pressure within the load lock chamber (200) is converted from the second pressure to the first pressure. The exhaust line (251) is connected to the exhaust port (213a). In addition, an exhaust member (253) may be installed in the exhaust line (251). In one example, the exhaust member (253) may be a pump. The exhaust member (253) applies negative pressure to the exhaust line (251) to exhaust the atmospheric space (210a). Before the door (212b) provided on the second side wall (212) is opened, the pressure in the atmospheric space (210a) is converted from the first pressure to the second pressure by exhausting the gas within the load lock chamber (200) through the exhaust line.

[0072] The lifting unit (270) moves the support unit (230) up and down. The lifting unit (270) includes a shaft (272), a guide rod (274), an lifting plate (275), a bellows (277), and a driver (279).

[0073] FIG. 3 is a schematic drawing showing one embodiment of the shaft of FIG. 2, FIG. 4 is an enlarged drawing of part A of FIG. 2, and FIG. 5 is a drawing showing a cross-section of the shaft taken along line A-A' of FIG. 3. Referring to FIGS. 3 to 5, the shaft (272) is provided in a shape having a longitudinal direction in the third direction (13). According to one example, the shaft (272) may be provided in a cylindrical shape. In addition, the upper portion of the shaft (272) may be provided as a coupling portion (272a). The coupling portion (272a) is inserted into the base (231). As a result, the shaft (272) may be coupled to the base (231).

[0074] A slit (273) is formed on the side surface of the shaft (272). The slit (273) is formed to have a recessed shape on the cross-section of the shaft (272). In addition, the slit (273) is formed along the longitudinal direction of the shaft (272). The slit (273) is formed to communicate the atmospheric space (210a) with the internal space (277a) of the bellows (277). Accordingly, the slit (273) can be provided as a path for moving gas remaining in the internal space (277a) to the atmospheric space (210a). In addition, a plurality of slits (273) can be provided. The slits (273) can be provided along the circumferential direction of the shaft (272). In one example, six slits (273) can be provided.

[0075] Referring again to FIG. 2, a lifting plate (275) is coupled to the lower portion of the shaft (272). The actuator (279) moves the lifting plate (275) up and down. Accordingly, when the lifting plate (275) moves up and down, the shaft (272) can also move up and down.

[0076] A guide rod (274) is provided on the side of the shaft (272). The guide rod (274) is installed on the lower wall of the housing (210). The guide rod (274) has a shape extending vertically from the lower wall of the housing (210). A support plate (274a) may be coupled to the lower end of the guide rod (274). The support plate (274a) is provided so that its position is fixed. In addition, the guide rod (274) is provided so as to penetrate the lifting plate (275). Accordingly, the guide rod (274) guides the support plate (230) to be stably raised and lowered when it is raised and lowered. The guide rod (274) may be provided in multiple numbers. In one example, the guide rod (274) may be provided so as to be inserted into the shaft (272), or may be provided in multiple numbers on the side of the shaft (272).

[0077] The bellows (277) is provided as a corrugated pipe that expands and contracts by the up-and-down movement of the shaft (272). The bellows (277) is installed along the longitudinal direction of the shaft (272). The bellows (277) is provided to surround the shaft (272). The upper end of the bellows (277) may be coupled to the lower wall of the housing (210), and the lower end of the bellows (277) may be coupled to the lifting plate (275). In addition, the bellows (277) has an internal space (277a). The internal space (277a) may be a space defined by the bellows (277) and the shaft (272).

[0078] FIG. 6 is a drawing showing the appearance of the load lock chamber when the support unit is positioned in the compressed position, and FIG. 7 is a drawing showing the appearance of the load lock chamber when the support unit is positioned in the expanded position. Referring to FIGS. 6 and 7, the driver (279) moves the lifting plate (275) up and down. The driver (279) moves the support unit (230) between the expanded position (H2) and the compressed position (H1). The compressed position (H1) may be a position where the support unit (230) is raised. The compressed position (H1) may be a position where the bellows (277) is compressed. The compressed position (H1) may be a position where the first slot (234-1) corresponds to the first opening (211a). The compressed position (H1) may be a position where the first slot (234-1) is provided at the same height as the first opening (211a). The expansion position (H2) may be a position where the support unit (230) is lowered. The expansion position (H2) may be a position where the bellows (277) is expanded. The expansion position (H2) may be a position where the 25th slot (234-25) corresponds to the second opening. The expansion position (H2) may be a position where the 25th slot (234-25) is provided at the same height as the second opening. In one example, the driver (279) may be a motor.

[0079] Hereinafter, a method of transferring a substrate (W) using the load lock chamber (200) described above will be described. FIGS. 8 to 11 are drawings sequentially showing the process of loading a substrate from an index module into the load lock chamber and removing the substrate from the transfer chamber.

[0080] Fig. 8 is a drawing showing a process of loading a substrate into a load lock chamber. Referring to Fig. 8, an index robot (142) loads a substrate (W) from a carrier (2). The pressure of the waiting space (210a) of the load lock chamber (200) is formed at a first pressure. The support unit (230) is positioned at a compression position (H1). Thereafter, the first opening (211a) is opened, and the substrate (W1) is loaded into the waiting space (210a), and the substrate (W1) is supported in the first slot (234-1). When loading multiple substrates, the lifting unit (270) lowers the support unit (230) so that the second slot (234-2) corresponds to the first opening (211a). Thereafter, the index robot (142) loads the substrate (W2) into the second slot (234-2). Depending on the number of substrates (W) being imported, the lifting unit (270) can further lower the support unit (230). As the support unit (230) is lowered, the bellows (277) expands.

[0081] FIG. 9 is a drawing showing the state in which the substrate is loaded into the load lock chamber and the support unit is raised, and FIG. 10 is a drawing showing the state in which the inside of the load lock chamber is exhausted. Referring to FIGS. 9 and 10, when the substrate (W) is loaded into the load lock chamber (200), the support unit (230) is moved back to the compression position (H1). Accordingly, the bellows (277) is compressed again. The pressure control unit (250) exhausts the atmospheric space (210a). The pressure control unit (250) adjusts the atmospheric space (410a) to a second pressure. The arrows shown in FIG. 10 show that the gas in the atmospheric space (210a) is exhausted to the exhaust port (213a). In addition, it shows that the gas remaining in the internal space (274a) is exhausted to the exhaust port (213a). Since the gas remaining in the internal space (277a) can be directly exhausted, the time required to reach the second pressure can be reduced. The processes illustrated in FIGS. 9 and 10 can be performed simultaneously or sequentially.

[0082] Fig. 11 is a drawing showing a process of removing a substrate from a load lock chamber. Referring to Fig. 11, after the pressure of the waiting space (210a) becomes the second pressure, the second opening (212a) is opened, and the transfer robot (342) removes the substrate (W1) from the first slot (234-1). When removing multiple substrates, the lifting unit (270) lowers the support unit (230) so that the second slot (234) corresponds to the second opening (212a). Thereafter, the transfer robot (342) removes the substrate (W2) from the second slot (234). Depending on the number of substrates (W) being removed, the lifting unit (270) may further lower the support unit (230).

[0083] In the above-described example, the height of the support unit (230) is changed to be positioned in the first opening (211a) or the second opening (212a) for each selected slot (234). However, the present invention is not limited thereto, and if the size of the first opening (211a) or the second opening (212a) is provided to be sufficiently large, even if the selected slot (234) is changed, the height of the support unit (230) does not change, and the substrate (W) can be loaded or unloaded. In one example, when the support unit (230) is positioned at the first position, the substrate (W) can be loaded or unloaded for five adjacent slots (234).

[0084] According to one embodiment of the present invention, during the process of loading or unloading the substrate (W) into or out of the load lock chamber (200), the bellows (277) is repeatedly compressed and expanded. At this time, gas existing in the atmospheric space (210a) may leak into the internal space (277a) of the expanding bellows (277). The leaked gas remains in the internal space (277a). This residual gas is released into the atmospheric space (210a) when the atmospheric space (210a) is depressurized, thereby preventing the atmospheric space (210a) from being depressurized to a certain pressure. However, according to one embodiment of the present invention, the slit (273) connects the atmospheric space (210a) of the housing (210) and the internal space (277a) of the bellows (277). Accordingly, the gas remaining in the internal space (277a) can be easily discharged into the atmospheric space (210a) through the slit (273). Accordingly, the time for adjusting the pressure of the waiting space (210a) can be reduced. As a result, the substrate (W) transport speed through the load lock chamber (200) can be improved, thereby improving the substrate (W) processing efficiency of the substrate processing device (1).

[0085] The detailed description above is illustrative of the present invention. Furthermore, the above description illustrates and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. In other words, changes or modifications are possible within the scope of the inventive concept disclosed in this specification, the scope equivalent to the written disclosure, and / or the scope of technology or knowledge in the art. The written embodiments illustrate the best possible state for implementing the technical idea of ​​the present invention, and various modifications required for specific applications and uses of the present invention are also possible. Therefore, the detailed description of the invention above is not intended to limit the present invention to the disclosed embodiments. Furthermore, the appended claims should be construed to include other embodiments.

Claims

1. In a device for processing a substrate, A front module of the equipment having a load port on which a container for receiving a substrate is placed and an index robot for returning the substrate; A processing module having a return robot for returning a substrate and a process chamber for processing the substrate, A load lock chamber is located between the equipment front module and the processing module, and provides a path for the substrate to move between the equipment front module and the processing module. The above index robot is provided to return the substrate between the container placed on the load port and the load lock chamber, The above return robot is provided to return the substrate between the load lock chamber and the process chamber, The above load lock chamber is, A housing providing a waiting space for the substrate to wait; A support unit that supports a substrate in the above-mentioned waiting space; a pressure regulating unit for depressurizing the above-mentioned waiting space; and Including an elevating unit that elevates the support unit within the above waiting space, The above lifting unit, A shaft penetrating the lower wall of the housing and coupled to the lower portion of the support unit; An elevator plate installed at the lower part of the above shaft; A bellows coupled to the lower wall of the housing and the lifting plate and provided to surround the shaft; and It includes a driving device that moves the above-mentioned lifting plate up and down, A substrate processing device in which a slit is formed on the side of the above shaft.

2. In paragraph 1, A substrate processing device in which the above slit is formed along the longitudinal direction of the shaft.

3. In paragraph 2, A substrate processing device in which the above slit is formed to connect the space between the shaft and the bellows and the waiting space.

4. In paragraph 3, The housing includes an opening formed in a side wall, The above support unit includes a plurality of slots that support a plurality of substrates by spacing them apart in the vertical direction, The above lifting unit, The guide plate is moved between the compression position where the bellows is compressed and the expansion position where the bellows is expanded, The above compression position is a position where the slot provided at the lowest height among the slots corresponds to the opening, The above expansion position is a position where the slot provided at the highest height among the slots corresponds to the above opening, The above slit is, A substrate processing device formed so as to be exposed to the atmospheric space when the shaft is positioned at the expansion position.

5. In paragraph 4, The above slit is, A substrate processing device formed so as to be exposed to the space between the shaft and the bellows when the shaft is positioned at the compressed position.

6. In paragraph 3, The above slit is, A substrate processing device provided in multiple locations spaced apart from each other along the circumference of the above shaft.

7. In paragraph 3, The above lifting unit, A substrate processing device further comprising a guide rod installed vertically on the lower wall of the housing and penetrating the guide plate.

8. In paragraph 3, An exhaust port is formed at the bottom of one side wall of the above housing, The above pressure regulating unit, An exhaust member for exhausting the above-mentioned waiting space; and; A substrate processing device including an exhaust line connecting the exhaust port and the exhaust member.

9. In paragraph 3, The above load lock chamber is a substrate processing device provided in multiples.

10. A housing providing a waiting space for the substrate to wait; A support unit that supports a substrate in the above-mentioned waiting space; a pressure regulating unit for depressurizing the above-mentioned waiting space; and Including an elevating unit that elevates the support unit within the above waiting space, The above lifting unit, A shaft penetrating the lower wall of the housing and coupled to the lower portion of the support unit; An elevator plate installed at the lower part of the above shaft; A bellows coupled to the lower wall of the housing and the lifting plate and provided to surround the shaft; and It includes a driving device that moves the above-mentioned lifting plate up and down, A load lock chamber having a slit formed on the side of the shaft.

11. In paragraph 10, The above slit is a load lock chamber formed along the longitudinal direction of the shaft.

12. In paragraph 11, A load lock chamber in which the above slit is formed to connect the internal space of the bellows and the atmospheric space.

13. In paragraph 12, An opening, which is an entrance / exit for an external return device, is formed in the side wall of the above housing, The above support unit includes a plurality of slots that support a plurality of substrates by spacing them apart in the vertical direction, The above lifting unit, The guide plate is moved between the compression position where the bellows is compressed and the expansion position where the bellows is expanded, The above compression position is a position where the slot provided at the lowest height among the slots corresponds to the opening, The above expansion position is a position where the slot provided at the highest height among the slots corresponds to the above opening, The above slit is, A load lock chamber formed to connect the atmospheric space and the internal space when the shaft is positioned at the expansion position.

14. In paragraph 13, The above slit is, A load lock chamber formed so as to be exposed to communicate the atmospheric space and the internal space when the shaft is positioned at the compressed position.

15. In paragraph 12, The above slit is, A plurality of load lock chambers provided spaced apart from each other along the circumference of the above shaft.

16. In paragraph 12, The above lifting unit, A load lock chamber further comprising a guide rod installed vertically on the lower wall of the housing and penetrating the guide plate.

17. In paragraph 12, An exhaust port is formed in the lower area of ​​one side wall of the above housing, The above pressure regulating unit, An exhaust member for exhausting the above-mentioned waiting space; and; A load lock chamber including an exhaust line connecting the exhaust port and the exhaust member.

18. In a device for processing a substrate, A front module of the equipment having a load port on which a container for receiving a substrate is placed and an index robot for returning the substrate; A processing module having a return robot for returning a substrate and a process chamber for processing the substrate, and having a plurality of load lock chambers positioned between the equipment front module and the processing module, and providing a path for moving the substrate between the equipment front module and the processing module; The above load lock chamber is, A housing providing a waiting space for the substrate to wait; A support unit that supports a substrate in the above-mentioned waiting space; a pressure regulating unit for depressurizing the above-mentioned waiting space; and Including an elevating unit that elevates the support unit within the above waiting space, The above lifting unit, A shaft penetrating the lower wall of the housing and coupled to the lower portion of the support unit; A guide plate installed at the lower part of the above shaft; A bellows coupled to the lower wall of the housing and the guide plate and provided to surround the shaft; and It includes a driver that moves the above guide plate in the up and down direction, A slit is formed on the side of the above shaft, The above slit is, Formed along the longitudinal direction of the above shaft, A substrate processing device formed to connect the space between the shaft and the bellows and the atmospheric space.

19. In paragraph 18, The housing includes an opening formed in a side wall, The above support unit includes a plurality of slots that support a plurality of substrates by spacing them apart in the vertical direction, The above lifting unit, The guide plate is moved between the compression position where the bellows is compressed and the expansion position where the bellows is expanded, The above compression position is a position where the slot provided at the lowest height among the slots corresponds to the opening, The above expansion position is a position where the slot provided at the highest height among the slots corresponds to the above opening, The above slit is, When the shaft is positioned in the expansion position, it is exposed to the atmospheric space, A substrate processing device formed so as to be exposed to the space between the shaft and the bellows when the shaft is positioned at the compressed position.

20. In paragraph 19, The above lifting unit is installed vertically on the lower wall of the housing and further includes a guide rod penetrating the guide plate. An exhaust port is formed at the bottom of one side wall of the above housing, The above pressure regulating unit, An exhaust member for exhausting the above-mentioned waiting space; and; A substrate processing device including an exhaust line connecting the exhaust port and the exhaust member.

Images