Electronic device including shield can

Abstract

An electronic device according to one embodiment of the present disclosure comprises: a printed circuit board; an electronic component disposed on the printed circuit board; a shield can including a flat portion which includes a seating portion formed in a groove shape including an injection hole and a side portion extending from the flat portion, and coupled to the printed circuit board to cover the electronic component; a cover member disposed in the seating portion of the shield can; and a heat transfer material filled inside the shield can, wherein the cover member may be bent for insertion of an external object for injecting the heat transfer material into the shield can through the injection hole.

Description

Electronic devices containing shield cans

[0001] Various embodiments disclosed in this document relate to an electronic device including a shield can.

[0002] With technological advancements, high-performance electronic components are increasingly being incorporated into electronic devices. These components can generate heat during operation. This heat can impact their performance. For example, if the heat generated by an electronic component is not sufficiently dissipated to the outside of the device, its performance may deteriorate. Therefore, various heat dissipation structures are being designed into electronic devices to dissipate the heat generated by the electronic components to the outside.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] Electronic devices may contain electronic components that generate high levels of heat, such as application processors (APs). A shield can be placed on the printed circuit board where these components are placed, covering the electronic components. The shield can shields electromagnetic waves generated by the electronic components or dissipates heat generated by the electronic components to the surrounding area. The shield can be filled with a liquid heat-conducting material to conduct heat generated by the electronic components to the surrounding area.

[0005] Meanwhile, an opening may be formed in a portion of the shield can that is connected to the printed circuit board, allowing circuits arranged on the printed circuit board to pass through the shield can. The opening formed in the shield can may be configured to connect the inside and the outside of the shield can. In this case, a heat transfer material filled inside the shield can may be released to the outside of the shield can through the opening. Therefore, the heat transfer material may be released to an unintended area (e.g., the outside of the shield can), which may deteriorate the quality of the electronic device.

[0006] Additionally, a nozzle is inserted into the injection hole formed in the shield can, and a heat transfer material can be sprayed from the nozzle. A cover member that covers the injection hole can be placed in the shield can to prevent the heat transfer material from flowing back from the injection hole. If the cover member is placed in the shield can, the internal space of the electronic device may require additional space occupied by the cover member. Therefore, the thickness of the electronic device may increase and / or the space for arranging electronic components within the electronic device may become insufficient.

[0007] Various embodiments of the present disclosure may provide an electronic device including a shield can that may help prevent or prevent a phenomenon in which a heat transfer material is released to the outside of the shield can through an opening.

[0008] Various embodiments may provide an electronic device configured to control the flow rate of a heat transfer material within a shield can and the extent to which the heat transfer material is discharged from a nozzle by controlling the composition ratio of the heat transfer material.

[0009] Various embodiments may provide an electronic device including a shield can that can prevent an increase in thickness of the electronic device.

[0010] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0011] According to one embodiment of the present disclosure, an electronic device includes a printed circuit board, an electronic component disposed on the printed circuit board, a flat portion including a mounting portion formed in a groove shape including an injection hole, and a side portion extending from the flat portion, a shield can coupled to the printed circuit board and covering the electronic component, a cover member disposed on the mounting portion of the shield can, and a heat transfer material filled inside the shield can, wherein the cover member is bendable for insertion of an external object for injecting the heat transfer material into the inside of the shield can through the injection hole.

[0012] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board, an electronic component disposed on the printed circuit board, a shield can including a planar portion including an injection hole and a side portion extending from the planar portion and having an opening formed therein, the shield can being coupled to the printed circuit board and covering the electronic component, a heat transfer material filled into the interior of the shield can through the injection hole, and a first partition portion positioned between the printed circuit board and the planar portion of the shield can within the shield can, at least a portion of which faces the opening to block the heat transfer material from flowing into the opening.

[0013] According to one embodiment disclosed in the present document, the shield can may include a partition wall positioned between the shield can and the printed circuit board within the shield can. At least a portion of the partition wall faces the opening of the shield can, and may block a heat transfer material injected through an injection hole of the shield can from flowing into the opening. Accordingly, a phenomenon in which the heat transfer material is released to the outside of the shield can through the opening may be prevented or prevented.

[0014] In addition, by adjusting the composition ratio of the heat transfer material, the speed at which the heat transfer material flows inside the shield can and the degree to which the heat transfer material is discharged from the nozzle can be controlled.

[0015] In addition, by forming the area where the cover member is placed in the shield can in the shape of a groove or hole, the cover member can be configured so that it does not protrude from one surface of the shield can when placed in the shield can. Accordingly, since no additional space is required equivalent to the space occupied by the cover member inside the electronic device, an increase in the thickness of the electronic device can be prevented.

[0016] In addition, various effects may be provided, either directly or indirectly, through this document.

[0017] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0018] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0019] FIG. 1A is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 1B is a perspective view of the rear surface of the electronic device of FIG. 1A, according to one embodiment of the present disclosure.

[0021] FIG. 2 is an exploded perspective view of the electronic device of FIG. 1A, according to one embodiment of the present disclosure.

[0022] FIG. 3A is a front perspective view of a shield can according to one embodiment of the present disclosure.

[0023] FIG. 3b is a rear perspective view of a shield can according to one embodiment of the present disclosure.

[0024] FIGS. 4A to 4C are drawings illustrating a phenomenon in which a heat transfer material injected into a shield can flows into an opening of the shield can, according to one embodiment of the present disclosure, is blocked through a first bulkhead portion of the shield can.

[0025] FIGS. 5A to 5C are drawings illustrating a gap between a first bulkhead portion of a shield can and an electronic component of a printed circuit board according to one embodiment of the present disclosure.

[0026] FIG. 6 is a drawing of a second bulkhead portion of a shield can arranged to surround a communication module of a printed circuit board according to one embodiment of the present disclosure.

[0027] FIGS. 7A and 7B are drawings illustrating a distance between one side of a printed circuit board and an injection hole to prevent a heat transfer material filled in a shield can from flowing back through the injection hole, according to one embodiment of the present disclosure.

[0028] FIGS. 8A to 8B are drawings showing a mounting portion of a shield can formed in a groove shape with an injection hole formed therein and a first cover member positioned on the mounting portion, according to one embodiment of the present disclosure.

[0029] Figure 9 is a cross-sectional view taken along line AA of Figure 8b.

[0030] FIG. 10A is a drawing showing a second cover member positioned inside a hole formed in a mounting portion of a shield can according to one embodiment of the present disclosure.

[0031] FIG. 10b is a drawing of a second cover member and a plate coupled to the second cover member, according to one embodiment of the present disclosure.

[0032] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0033] In the following description, various embodiments of this document are described with reference to the attached drawings. It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described herein to specific embodiments, but rather encompass various modifications, equivalents, or alternatives of the embodiments.

[0034] In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items, unless the context clearly indicates otherwise.

[0035] In this document, the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0036] FIG. 1A is a perspective view of a front side of an electronic device according to an embodiment of the present disclosure. FIG. 1B is a perspective view of a rear side of the electronic device of FIG. 1A according to an embodiment of the present disclosure.

[0037] Referring to FIGS. 1A and 1B , an electronic device (100) according to one embodiment may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (110A), the second side (110B), and the side surface (110C) of FIG. 1A . According to one embodiment, the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The rear plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side bezel structure (118) (or “side member”) that is coupled to the front plate (102) and the rear plate (111) and comprises a metal and / or polymer. In some embodiments, the rear plate (111) and the side bezel structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0038] In the illustrated embodiment, the front plate (102) may include a first region (110D) that extends seamlessly from the first surface (110A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 1B), the rear plate (111) may include a second region (110E) that extends seamlessly from the second surface (110B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (102) or the rear plate (111) may include only one of the first region (110D) or the second region (110E). In some embodiments, the front plate (102) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (110B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (118) may have a first thickness (or width) on the side that does not include the first region (110D) or the second region (110E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (110D) or the second region (110E).

[0039] According to one embodiment, the electronic device (100) may include at least one of a display (101), an input device (103), an audio output device (107, 114), a sensor module (104, 119), a camera module (105, 112), a key input device (117), an indicator (not shown), and a connector hole (108). In some embodiments, the electronic device (100) may omit at least one of the components (e.g., the key input device (117) or the indicator) or may additionally include other components.

[0040] The display (101) may be visually exposed, for example, through a substantial portion of the front plate (102). In some embodiments, at least a portion of the display (101) may be exposed through the front plate (102), which forms the first surface (110A) and the first region (110D) of the side surface (110C). The display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (104, 119), and / or at least a portion of the key input device (117), may be disposed in the first region (110D), and / or the second region (110E).

[0041] The input device (103) may include a microphone (103). In some embodiments, the input device (103) may include a plurality of microphones (103) arranged to detect the direction of sound. The audio output device (107, 114) may include speakers (107, 114). The speakers (107, 114) may include an external speaker (107) and a call receiver (114). In some embodiments, the microphone (103), the speakers (107, 114), and the connector hole (108) may be arranged at least partially in the internal space of the electronic device (100) and may be exposed to the external environment through at least one hole formed in the housing (110). In some embodiments, the hole formed in the housing (110) may be used in common for the microphone (103) and the speakers (107, 114). In some embodiments, the audio output device (107, 114) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (110).

[0042] The sensor module (104, 119) can generate an electric signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module (104, 119) may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface (110B) of the housing (110). The fingerprint sensor may be disposed on the first surface (110A) of the housing (110) (e.g., a home key button), a portion of the second surface (110B), and / or under the display (101). The electronic device (100) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0043] The camera modules (105, 112) may include a first camera module (105) disposed on a first side (110A) of the electronic device (100), a second camera module (112) disposed on a second side (110B), and / or a flash (113). The camera modules (105, 112) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (100).

[0044] The key input device (117) may be positioned on a side surface (110C) of the housing (110). In one embodiment, the electronic device (100) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101). In one embodiment, the key input device (117) may be implemented using a pressure sensor included in the display (101).

[0045] The indicator may be disposed, for example, on the first surface (110A) of the housing (110). The indicator may provide, for example, status information of the electronic device (100) in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (105). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0046] The connector hole (108) may include a first connector hole (108) that can accommodate a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0047] Some of the camera modules (105, 112), some of the sensor modules (104, 119), or indicators may be arranged to be visually exposed through the display (101). For example, the camera module (105), the sensor module (104), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (100) to the front plate (102) of the display (101). According to one embodiment, an area where the display (101) and the camera module (105) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (105) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (101) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (105) may include an under-display camera (UDC). In one embodiment, some of the sensor modules (104) may be arranged to perform their functions without being visually exposed through the front plate (102) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (101) facing the sensor module may not require a perforated opening.

[0048] According to one embodiment, the electronic device (100) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (100) may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device", "slidable electronic device", "stretchable electronic device" and / or "rollable electronic device" may refer to an electronic device that is capable of bending deformation of a display (e.g., a display (230) of FIG. 2) so that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and / or can be housed inside a housing (e.g., a housing (110) of FIGS. 1A and 1B). The foldable electronic device, the slidable electronic device, the stretchable electronic device and / or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside, depending on the needs of the user.

[0049] FIG. 2 is an exploded perspective view of the electronic device of FIG. 1A, according to one embodiment of the present disclosure.

[0050] The electronic device (200) of FIG. 2 may be at least partially similar to the electronic device (100) of FIGS. 1A and 1B, or may include other embodiments of the electronic device.

[0051] Referring to FIG. 2, an electronic device (200) (e.g., the electronic device (100) of FIG. 1A or FIG. 1B) may include a side member (210) (e.g., a side bezel structure), a first support member (211) (e.g., a bracket or a support structure), a front plate (220) (e.g., a front cover), a display (230) (e.g., the display (101) of FIG. 1A), a substrate (240) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (250), a second support member (260) (e.g., a rear case), an antenna (270), and a rear plate (280) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (100) of FIG. 1A or FIG. 1B, and any redundant description thereof will be omitted below.

[0052] The first support member (211) may be disposed inside the electronic device (200) and connected to the side member (210), or may be formed integrally with the side member (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (211) may have a display (230) coupled to one surface and a substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0053] The memory may include, for example, volatile memory or non-volatile memory.

[0054] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0055] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the substrate (240). The battery (250) may be integrally disposed within the electronic device (200). In one embodiment, the battery (250) may be disposed so as to be detachably attached to or detached from the electronic device (200).

[0056] The antenna (270) may be positioned between the rear plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure (210) and / or the first support member (211).

[0057] FIG. 3a is a front perspective view of a shield can according to one embodiment of the present disclosure. FIG. 3b is a rear perspective view of the shield can according to one embodiment of the present disclosure.

[0058] According to one embodiment, an electronic device (e.g., the electronic device (100) of FIGS. 1A and 1B and / or the electronic device (200) of FIG. 2) may include electronic components (302) having various performances. In one embodiment, the electronic components (302) may be electrically operated by being connected to a printed circuit board (301) (e.g., the board (340) of FIG. 2) disposed within a housing (e.g., the housing (110) of FIG. 1A). The electronic components (302) may generate heat as they operate. If the heat generated in the electronic components (302) is not sufficiently dissipated to the outside of the electronic device (100, 200), a degradation in the performance of the electronic components (302) may occur. Accordingly, a heat dissipation member (e.g., a shield can (e.g., a shield can (310) of FIG. 3a, a shield can (410) of FIGS. 8a and 8b, a shield can (510) of FIG. 10a and / or a heat transfer material) may be placed inside the housing (110) to spread the heat generated from the electronic component (302) to the surroundings.

[0059] According to one embodiment, the shield can (310) may be disposed on the printed circuit board (301) to cover at least a portion of the electronic component (302). In one embodiment, referring to FIGS. 3A and 3B, the shield can (310) may include a planar portion (311) (e.g., a front portion) at least partially facing the electronic component (302) and a side portion (312) extending from the planar portion (311) and coupled to the printed circuit board (301). In one embodiment, the planar portion (311) may include at least a portion of a substantially flat surface. In one embodiment, the side portion (312) may be bent in a direction substantially perpendicular to the planar portion (311). In one embodiment, the shield can (310) may be coupled to the printed circuit board (301) by soldering the side portion (312) to the printed circuit board (301). In addition, the shield can (310) can be coupled to the printed circuit board (301) in various ways, such as through a clip or socket.

[0060] In one embodiment, the shield can (310) may include a conductive material to shield electromagnetic waves generated from the printed circuit board (301) and electronic components (302) or to disperse heat generated from the electronic components (302) to the surroundings. For example, the shield can (310) may be formed of a metal material or a material such as graphite. In addition, the shield can (310) may be formed of various materials that shield electromagnetic waves and have heat conductive properties. In addition, the shield can (310) may be formed of a material having a certain level of rigidity so as to protect the electronic components (302) located inside the shield can (310) from external impact.

[0061] According to one embodiment, a liquid heat transfer material may be injected into the shield can (310). In one embodiment, the heat transfer material may be injected into the shield can (310) to diffuse heat from an electronic component (302) disposed inside the shield can (310) to the outside of the shield can (310). For example, heat generated from the electronic component (302) may be transferred to the outside of the shield can (310) through the heat transfer material - the shield can (310). Accordingly, heat generation of the electronic component (302) may be reduced, thereby improving malfunction of the electronic component (302) due to heat generation.

[0062] According to one embodiment, as illustrated in FIGS. 3A and 3B, and FIGS. 8A, 8B, and 10A described below, an injection hole (314) (e.g., the injection hole (414) of FIG. 8A, the cut portion (611) and / or the mounting portion (513) of the second cover member (610) of FIG. 10A) may be formed in the flat portion (311) of the shield can (310) as a passage through which a liquid heat transfer material is injected. A nozzle through which the heat transfer material is applied may be inserted into the injection hole (314) of the shield can (310) to apply the heat transfer material to the space between the printed circuit board (301) and the shield can (310). Therefore, the space between the shield can (310) and the printed circuit board (301) may be filled with the heat transfer material.

[0063] According to one embodiment, a cover member (e.g., the first cover member (600) of FIG. 8B and / or the second cover member (610) of FIG. 10A) that covers the injection hole (314) may be disposed in the shield can (310). In one embodiment, the cover members (600, 610) may prevent the heat transfer material introduced into the interior of the shield can (310) from flowing back into the injection hole (314).

[0064] In one embodiment, the cover member (600, 610) may be placed in the mounting portion (313) of the shield can (310). In one embodiment, the mounting portion (313) may be an area in the shield can (310) where the cover member (600, 610) is placed. In one embodiment, the mounting portion (313) may be formed in various shapes.

[0065] In one embodiment, referring to FIGS. 8A and 8B described below, the mounting portion (413) (e.g., the mounting portion (313) of FIG. 3A) may be formed in a groove shape in which one surface of the shield can (410) (e.g., the shield can (310) of FIG. 3A) is concave. In this case, the injection hole (414) (e.g., the injection hole (314) of FIG. 3A) may be formed in the mounting portion (413). A cover member (e.g., the first cover member (600)) may cover the injection hole (414) by being placed in the groove-shaped mounting portion (413).

[0066] In one embodiment, referring to FIG. 10A to be described later, the mounting portion (513) (e.g., the mounting portion (313) of FIG. 3A) may be a hole in which a cover member (e.g., a second cover member (610)) is placed. For example, the mounting portion (513) may be a hole having a shape corresponding to the cover member (610) so that the cover member (610) may be placed. In other words, the mounting portion (513) of FIG. 10A may be an embodiment in which the groove of the mounting portion (413) of FIG. 8A is formed in a hole shape. In this case, the injection hole (e.g., the injection hole (314) of FIG. 3A) may be a cut portion (611) formed by cutting a portion of the cover member (610). Alternatively, the injection hole may be included in the hole-shaped mounting portion (513). In one embodiment, the cutting portion (611) is formed to bend in the insertion direction of the nozzle, through which the heat transfer material is sprayed, as the nozzle is inserted into the cutting portion (611), thereby allowing the nozzle to be inserted into the interior of the shield can (510) (e.g., the shield can (310) of FIG. 3A), and preventing backflow of the heat transfer material while the nozzle is not inserted. A description of the mounting portions (313, 413, 513) of the shield cans (310, 410, 510) and the cover members (600, 610) according to the shape of the mounting portions (313, 413, 513) will be given with reference to FIGS. 8A to 10B below.

[0067] According to one embodiment, the cover member (600, 610) may be formed of various materials. For example, the cover member (600, 610) may be formed of a heat-resistant and elastic material, such as silicone, urethane, or TPU. Accordingly, the cover member (600, 610) may not be deformed due to the temperature of the heat transfer material. In addition, the cut portion (601, 611) of the cover member (600, 610) may be restored through elasticity when the nozzle is removed from the cut portion.

[0068] According to one embodiment, as illustrated in FIGS. 3A and 3B, an opening (315) may be formed in the side portion (312) of the shield can (310). In one embodiment, the opening (315) may be in the form of one end of the side portion (312) being open. For example, the opening (315) may be a space formed by removing an area of ​​the side portion (312) facing the printed circuit board (301). In one embodiment, the opening (315) may be configured such that when the shield can (310) is placed on the printed circuit board (301), circuits placed on the printed circuit board (301) pass into the shield can (310). In one embodiment, the shield can (310) may be placed on the printed circuit board (301) such that electric circuits placed on the printed circuit board (301) pass through the opening (315).

[0069] Meanwhile, when a heat transfer material is injected into the internal space of the shield can (310) (e.g., the space between the shield can (310) and the printed circuit board (301)) through the injection hole (314) of the shield can (310), the heat transfer material can be released from the inside of the shield can (310) to the outside of the shield can (310) through an opening (315) formed in the side portion (312) of the shield can (310). In addition, the opening (315) may be a gap generated between soldering areas as the side portion (312) of the shield can (310) is soldered to the printed circuit board (301) (e.g., soldering (s) of FIG. 10A). In this case, when a heat transfer material is injected into the internal space of the shield can (310) through the injection hole (314) of the shield can (310), the heat transfer material may be released from the inside of the shield can (310) to the outside of the shield can (310) through the gap between the soldering areas. Therefore, the heat transfer material may be released to an unintended area (e.g., the outside of the shield can (310)) through the opening (315) of the shield can (310) and / or the gap between the soldering areas that connect the shield can (310) and the printed circuit board (301), which may deteriorate the quality of the electronic device.

[0070] According to one embodiment of the present disclosure, as illustrated in FIG. 3b and FIGS. 4a to 4c and 5a to 5c described below, the shield can (310) may include a first partition wall portion (320). In one embodiment, the first partition wall portion (320) may be disposed between the shield can (310) and the printed circuit board (301) to block a heat transfer material injected between the shield can (310) and the printed circuit board (301) through the injection hole (314) from flowing into the opening (315) of the shield can (310). For example, referring to FIG. 3b and FIGS. 4a to 4c, the first partition wall portion (320) may surround a side portion (312) in which the opening (315) is formed so as to prevent the heat transfer material from flowing into the opening (315). The first bulkhead portion (320) may be formed in a shape capable of shielding the opening (315), such as a '-', 'ㄴ', or 'ㄷ' shape. A detailed description of the first bulkhead portion (320) will be provided with reference to FIGS. 4a to 4c and 5a to 5c below.

[0071] FIGS. 4A to 4C are drawings illustrating a phenomenon in which a heat transfer material injected into a shield can is blocked from flowing into an opening of the shield can through a first partition wall portion of the shield can according to one embodiment of the present disclosure. FIGS. 5A to 5C are drawings illustrating a gap between a first partition wall portion of the shield can and an electronic component of a printed circuit board according to one embodiment of the present disclosure.

[0072] In the following description, FIGS. 4a, 4b and 4c may be drawings for explaining that the shape of the first bulkhead portion (320) can be variously modified based on the positional relationship between the injection hole (314) of the shield can (310) and the opening (315) of the shield can (310).

[0073] In addition, in the following description, FIGS. 5a, 5b and 5c may be drawings for explaining that the shape of the first partition wall portion (320) can be variously modified in consideration of the arrangement relationship between the electronic component (302) placed on the printed circuit board (301) and the first partition wall portion (320).

[0074] According to one embodiment, as illustrated in FIGS. 4a to 4c, the first bulkhead portion (320) can be deformed into various shapes based on the positional relationship between the injection hole (314) and the opening (315) of the shield can (310).

[0075] In one embodiment, referring to FIG. 4A, the first partition wall portion (320) may be positioned on the side portion (312) where the shield can (310) is formed to shield the opening (315). For example, the first partition wall portion (320) may be formed in a 'ㄷ' shape to block the heat transfer material filled inside the shield can (310) from flowing into the opening (315).

[0076] In one embodiment, referring to FIG. 4b, the injection hole (314) of the shield can (310) may be positioned in the -X direction and the +Y direction with respect to the opening (315) of the shield can (310). In this case, when a heat transfer material is introduced through the injection hole (314), the heat transfer material may move in the +X direction and the -Y direction. Accordingly, the first partition wall portion (320) is formed in an 'ㄱ' shape as shown in FIG. 4b and is disposed in the shield can (310), thereby blocking the heat transfer material from being introduced into the opening (315) of the shield can (310).

[0077] In one embodiment, referring to FIG. 4c, the injection hole (314) of the shield can (310) may be positioned in the - X direction and the - Y direction with respect to the opening (315) of the shield can (310). In this case, when a heat transfer material is introduced through the injection hole (314), the heat transfer material may move in the + X direction and the + Y direction. Accordingly, the first partition wall portion (320) is formed in a '┛' shape as shown in FIG. 4c and is disposed in the shield can (310), thereby blocking the heat transfer material from being introduced into the opening (315) of the shield can (310).

[0078] In one embodiment, referring to FIGS. 5A, 5B, and 5C, the first partition wall portion (320) may be formed in various shapes depending on the position where the electronic component (302) is placed on the printed circuit board (301). For example, the first partition wall portion (320) may be formed in a shape that accommodates a portion of the electronic component (302), as illustrated in FIG. 5B, and may be formed in a straight line shape and placed between the electronic components (302), as illustrated in FIG. 5C.

[0079] According to one embodiment, as illustrated in FIGS. 5A, 5B, and 5C, the first partition wall portion (320) may be positioned between the shield can (310) and the printed circuit board (301) to form a predetermined gap (L2) with respect to the electronic component (302). In one embodiment, since the predetermined gap (L2) is secured between the electronic component (302) and the first partition wall portion (320), a tolerance between the electronic component (302) and the first partition wall portion (320) may be allowed.

[0080] In one embodiment, as illustrated in FIG. 5b, since the first partition wall portion (320) and the electronic component (302) are arranged at a predetermined interval (L2), a portion of the heat transfer material may pass through the space between the first partition wall portion (320) and the electronic component (302) and flow into the opening (315) of the shield can (310). Therefore, the interval (L2) between the first partition wall portion (320) and the electronic component (302) may be determined in consideration of the viscosity of the heat transfer material and the diffusion speed of the heat transfer material within the shield can (310) so as to minimize the flow of the heat transfer material into the space between the first partition wall portion (320) and the electronic component (302).

[0081] According to one embodiment, the first bulkhead portion (320) may be formed separately from the shield can (310) and joined to the shield can (310). For example, the first bulkhead portion (320) may be joined to the flat portion (311) of the shield can (310) by welding so as to be substantially perpendicular to the flat portion (311) of the shield can (310). In this case, the first bulkhead portion (320) may be formed to have a certain thickness (e.g., L1 of FIG. 4A) or more so as to be easily joined to the shield can (310).

[0082] In one embodiment, the first bulkhead portion (320) may be formed integrally with the shield can (310). For example, the first bulkhead portion (320) may be formed to extend substantially perpendicularly to the flat surface (311) of the shield can (310) during the process of manufacturing the shield can (310).

[0083] In one embodiment, when the first bulkhead portion (320) is placed on the printed circuit board (301) while being coupled to the shield can (310), there may be no gap or a micro-gap on one side of the printed circuit board (301).

[0084] According to one embodiment of the present disclosure, the first partition wall portion (320) is disposed between the shield can (310) and the printed circuit board (301) to block the heat transfer material injected between the shield can (310) and the printed circuit board (301) through the injection hole (314) from flowing into the opening (315) of the shield can (310). Accordingly, the phenomenon of the heat transfer material being released into an unintended area (e.g., the outside of the shield can (310)) through the opening (315) of the shield can (310) and / or the gap between the soldering area connecting the shield can (310) and the printed circuit board (301) can be prevented or prevented.

[0085] In one embodiment, the heat transfer material may be required to have a certain level of thermal conductivity so as to be able to conduct heat generated from the electronic components (302) to the surroundings. In addition, the heat transfer material may be required to have a certain level of viscosity so as to be easily filled into the internal space of the shield can (310). When the heat transfer material is formed with a low viscosity, the heat transfer material may not stop flowing after the internal space of the shield can (310) is completely filled, and may be discharged through the injection hole (314) and / or the opening (315) of the shield can (310). Conversely, when the heat transfer material is formed with a high viscosity, the heat transfer material may be difficult to discharge from the nozzle. In one embodiment of the present disclosure, the composition of the heat transfer material may be configured to have a certain level of thermal conductivity, a viscosity that facilitates dischargeability from the nozzle, and flow control within the shield can (310).

[0086] In one embodiment, the heat transfer material can be formed such that the heat transfer particles comprise at least 90% of the mixture constituting the heat transfer material. For example, the volume occupied by the heat transfer particles in a unit volume of the mixture constituting the heat transfer material can be at least 90% of the unit volume. In other words, the composition of the heat transfer material can include at least about 90% to 95% by weight of the heat transfer particles. Accordingly, the heat transfer material can have a thermal conductivity of at least about 7 W / mk and at most about 10 W / mk by being comprised of at least about 90% to 95% by weight of the mixture constituting the heat transfer material.

[0087] In one embodiment, the heat-dissipating particles may be composed of various elements. In one embodiment, the heat-dissipating particles may be ceramic particles such as Al2O3, AlN, SiC, Boron Nitride (BN), Si3N4, and insulating coated Carbon particles (Carbon fibers, Graphene, Graphite), and combinations thereof.

[0088] In one embodiment, the heat transfer material may be formed by mixing a low-molecular silicone resin, a high-molecular silicone resin, and silicone oil to have a certain level of viscosity. In one embodiment, the high-molecular silicone may be connected to the nozzle to prevent the heat transfer particles from delaminating from other mixtures within the case where the heat transfer material is stored. The low-molecular silicone and silicone oil may enhance the ejection properties of the heat transfer material from the nozzle.

[0089] In one embodiment, the composition of the heat transfer material can include about 1.3 to 4 wt % of a high molecular silicone resin, about 0.5 to 1.5 wt % of a low molecular silicone resin, and about 0 to 1.5 wt % of a silicone oil. The heat transfer material can have a viscosity of about 200,000 to 600,000 CPS (centipoise), depending on the weight ratio of the high molecular silicone resin, the low molecular silicone resin, and the silicone oil.

[0090] In one embodiment, the silicone resin and silicone oil may have a structure of [-Si(CH3)2O-]n, such as polydimethylsiloxane (PDMS). The high molecular weight silicone resin and low molecular weight silicone resin described above may be determined based on the molecular weight of the silicone. For example, when the molecular weight of the silicone is about 200 to 2000 Mw, it may be a low molecular weight silicone resin. Additionally, when the molecular weight of the silicone is about 90,000 to 200,000 Mw, it may be a high molecular weight silicone resin.

[0091] The composition of the heat transfer material of the present disclosure may include about 90 to 95 wt % of heat-radiating particles, about 1.3 to 4 wt % of high molecular silicone resin, about 0.5 to 1.5 wt % of low molecular silicone resin, and about 0 to 1.5 wt % of silicone oil. Accordingly, the heat transfer material may have a thermal conductivity of about 7 W / mk or more and 10 W / mk or less, and a viscosity of about 200,000 to 600,000 CPS (centipoise). Looking at the specific composition ratio of the heat-radiating particles and the thermal conductivity and viscosity based thereon, when the composition of the heat transfer material is configured to include about 90 to 94 wt% of the heat-radiating particles, about 1.5 to 4 wt% of the high molecular silicone resin, about 0.5 to 1.5 wt% of the low molecular silicone resin, and about 0 to 1.5 wt% of the silicone oil, the heat transfer material can be configured with a thermal conductivity of about 7 W / mk and a viscosity of about 200,000 to 400,000 CPS. In addition, when the composition of the heat transfer material is configured to include about 94 to 95 wt % of heat-radiating particles, about 1.3 to 3 wt % of high molecular silicone resin, about 0.5 to 1.3 wt % of low molecular silicone resin, and about 0 to 1.2 wt % of silicone oil, the heat transfer material can be configured to have a thermal conductivity of about 10 W / mk and a viscosity of about 400,000 to 600,000 CPS.

[0092] The numerical values ​​of thermal conductivity and viscosity according to the composition of the heat transfer material described above may be examples, and the numerical values ​​of thermal conductivity and viscosity may be modified within a range that can be predicted by a person skilled in the art.

[0093] FIG. 6 is a drawing showing a second partition wall portion (330) of a shield can (310) arranged to surround a communication module (303) of a printed circuit board (301) according to one embodiment of the present disclosure.

[0094] According to one embodiment, a communication module (303) may be disposed on the printed circuit board (301). In one embodiment, the communication module (303) may include a wireless communication module (e.g., a cellular communication module (303), a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (e.g., a local area network (LAN) communication module, or a power line communication module). Of these communication modules, the corresponding communication module (303) may communicate with an external electronic device via a first network (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (e.g., a long-range communication network such as a legacy cellular network, a fifth generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules (303) may be integrated into one component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips).

[0095] According to one embodiment, as illustrated in FIG. 6, the shield can (310) may include a second partition wall portion (330) that surrounds a communication module (303) disposed on a printed circuit board (301). For example, the second partition wall portion (330) may be positioned between the printed circuit board (301) and the flat portion (311) of the shield can (310) and may surround at least a portion of the communication module (303) so as to isolate the communication module (303) from the surrounding space within the shield can (310).

[0096] In one embodiment, the second partition wall portion (330) may include a conductive material to shield electromagnetic waves generated from the electronic component (302) or to disperse heat generated from the electronic component (302) to the surroundings. In one embodiment, the second partition wall portion (330) may be arranged to surround the communication module (303), thereby blocking electrical noise generated from the communication module (303) from being induced to other electronic components (302) of the printed circuit board (301). In addition, in one embodiment, the second partition wall portion (330) may block electrical noise generated from the electronic component (302) arranged on the printed circuit board (301) from being induced to the communication module (303).

[0097] In one embodiment, the communication module (303) may not come into contact with the heat transfer material injected through the injection hole (314) of the shield can (310) as it is wrapped by the second bulkhead portion (330). In one embodiment, the second bulkhead portion (330) may block the heat transfer material from flowing into the opening (315) of the shield can (310) formed at a position adjacent to the communication module (303).

[0098] According to one embodiment, the second bulkhead portion (330) may be formed separately from the shield can (310) and joined to the shield can (310). For example, the second bulkhead portion (330) may be joined to the flat surface (311) of the shield can (310) by welding so as to be substantially perpendicular to the flat surface (311) of the shield can (310).

[0099] In one embodiment, the second bulkhead portion (330) may be formed integrally with the shield can (310). For example, the second bulkhead portion (330) may be formed to extend substantially perpendicularly to the flat surface (311) of the shield can (310) during the process of manufacturing the shield can (310).

[0100] In one embodiment, when the second bulkhead portion (330) is placed on the printed circuit board (301) while being coupled to the shield can (310), there may be no gap or a micro-gap on one side of the printed circuit board (301).

[0101] FIGS. 7A and 7B are drawings illustrating a distance between one side of a printed circuit board and an injection hole to prevent a heat transfer material filled in a shield can from flowing back through the injection hole, according to one embodiment of the present disclosure.

[0102] According to one embodiment, when the nozzle through which the heat transfer material is sprayed faces the electronic component (302) of the printed circuit board (301) while being introduced into the injection hole (314) of the shield can (310) or the gap between the nozzle and the printed circuit board (301) is not sufficiently secured, the heat transfer material sprayed from the nozzle may flow back into the injection hole (314).

[0103] According to one embodiment of the present disclosure, as illustrated in FIGS. 7A and 7B, the shield can (310) may be formed with a thickness such that a predetermined gap (W) can be secured between the injection hole (314) and one surface of the printed circuit board (301). For example, when viewed in a direction substantially perpendicular to the flat surface (311) of the shield can (310), at least a portion of the injection hole (314) may not overlap with the electronic component (302). In addition, the injection hole (314) may be spaced apart by a gap of 1 mm or more between the flat surface (311) of the shield can (310) in which the injection hole (314) is formed and the printed circuit board (301). Accordingly, when the nozzle through which the heat transfer material is sprayed is introduced into the injection hole (314) of the shield can (310), the phenomenon of the heat transfer material sprayed from the nozzle flowing back through the injection hole (314) can be improved or prevented as the gap between the printed circuit board (301) and the nozzle is sufficiently secured.

[0104] FIGS. 8A and 8B are drawings showing a mounting portion of a shield can formed in a groove shape with an injection hole formed therein, and a first cover member positioned on the mounting portion, according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view taken along line AA of FIG. 8B.

[0105] Hereinafter, a shield can (410) (e.g., the shield can (310) of FIG. 3a) having one side formed concavely and including a groove-shaped mounting portion (413) in which a first cover member (600) is placed will be described. In the following description of the shield can (410), it may be the same as or similar to the shield can (310) of FIGS. 3a to 7b. For example, the shield can (410) of FIGS. 8A, 8B, and 9 may include a flat portion (411) (e.g., the flat portion (311) of FIG. 3A), a side portion (412) (e.g., the side portion (312) of FIG. 3A), a mounting portion (413) (e.g., the mounting portion (313) of FIG. 3A), an injection hole (414) (e.g., the injection hole (314) of FIG. 3A), and an opening (not shown) (e.g., the opening (315) of FIG. 3A). In the following description, descriptions of configurations identical or similar to those of the shield can (310) through FIGS. 3A to 7B are omitted.

[0106] In addition, the structure of the shield can (410) described below can be applied equally to the shield can (310) described through FIGS. 3a to 7b.

[0107] According to one embodiment, FIG. 8a may be a drawing in which a groove-shaped mounting portion (413) is formed on a flat portion (411) of a shield can (410). FIG. 8b may be a drawing in which an injection hole (414) formed in the mounting portion (413) is covered by the first cover member (600) as the first cover member (600) is placed on the mounting portion (413) of the shield can (410).

[0108] According to one embodiment, as illustrated in FIG. 8A, the mounting portion (413) may be formed in a groove shape in which one surface of the shield can (410) is concave. For example, the mounting portion (413) may be formed in a groove shape on one surface of the shield can (410) through press processing. In one embodiment, the injection hole (414) may be formed inside the mounting portion (413). In one embodiment, referring to FIG. 8B, the first cover member (600) may cover the injection hole (414) by being placed in the groove-shaped mounting portion (413). Therefore, the heat transfer material may not flow back to the outside of the shield can (410) through the injection hole (414).

[0109] According to one embodiment, as illustrated in FIGS. 8A and 8B, the first cover member (600) may include a cut portion (601) formed by cutting a portion of the first cover member (600). The cut portion (601) may be formed to bend in the insertion direction of the nozzle when the nozzle for spraying the heat transfer material is inserted into the cut portion (601). Accordingly, the cut portion (601) may allow the nozzle to be inserted into the interior of the shield can (410) and may block the injection hole (414) formed in the mounting portion (413) while the nozzle is not inserted.

[0110] According to one embodiment, as illustrated in FIG. 9, the mounting portion (413) may be formed to have a size that can accommodate the first cover member (600). For example, the depth (H2) of the mounting portion (413) may be formed to be equal to or greater than the thickness (H1) of the first cover member (600). Accordingly, in order to place the first cover member (600) in the shield can (410), an additional space equivalent to the space occupied by the first cover member (600) inside the electronic device (e.g., the electronic device (100) of FIGS. 1A and 1B and / or the electronic device (200) of FIG. 2) may not be required.

[0111] FIG. 10A is a drawing of a second cover member positioned within a hole formed in a mounting portion of a shield can according to one embodiment of the present disclosure. FIG. 10B is a drawing of a second cover member and a plate coupled to the second cover member according to one embodiment of the present disclosure.

[0112] The shield can (510) below may be an example of a shield can (510) in which the mounting portion (413) of the shield can (410) of FIGS. 8a and 8b is formed in a hole shape corresponding to a cover member (e.g., second cover member (610)).

[0113] In the following description of the shield can (510), it may be identical or similar to the shield can (310) through FIGS. 3A to 7B. For example, the shield can (510) of FIGS. 8A, 8B, and 9 may include a flat portion (511) (e.g., the flat portion (311) of FIG. 3A), a side portion (512) (e.g., the side portion (312) of FIG. 3A), a mounting portion (513) (e.g., the mounting portion (313) of FIG. 3A), an injection hole (not shown) (e.g., the injection hole (314) of FIG. 3A), and an opening (not shown) (e.g., the opening (315) of FIG. 3A). In the following description, a description of a configuration identical or similar to the shield can (310) through FIGS. 3A to 7B will be omitted. In addition, the structure of the shield can (510) described below can be applied equally to the shield can (310) described through FIGS. 3a to 7b.

[0114] According to one embodiment, as illustrated in FIG. 10A, the mounting portion (513) may be a hole in which the second cover member (610) is placed. For example, the mounting portion (513) may be a hole having a shape corresponding to the second cover member (610) so that the second cover member (610) can be placed. In this case, the injection hole into which the nozzle for spraying the heat transfer material is inserted may be a part of the mounting portion (513) or a cut portion (611) formed by cutting a part of the second cover member (610). The cut portion (611) may be formed to bend in the insertion direction of the nozzle as the nozzle is inserted into the cut portion (611), thereby allowing the nozzle to be inserted into the interior of the shield can (510) and preventing backflow of the heat transfer material while the nozzle is not inserted.

[0115] In one embodiment, referring to FIG. 10A, the mounting portion (513) may be formed to a size that includes the second cover member (610). In one embodiment, the depth (H4) of the mounting portion (513) may be formed to be equal to or greater than the thickness (H3) of the second cover member (610). Accordingly, an additional space equivalent to the space occupied by the second cover member (610) may not be required inside the electronic device (e.g., the electronic device (100) of FIGS. 1A and 1B and / or the electronic device (200) of FIG. 2) to place the second cover member (610) in the shield can (510).

[0116] According to one embodiment, as illustrated in FIG. 10b, the second cover member (610) may be coupled to the shield can (510) via a plurality of plates (620). In one embodiment, the plurality of plates (620) may be arranged to face each other based on the cut portion (611) of the second cover member (610). In one embodiment, the plurality of plates (620) may be formed of a metal material and may be welded to the inner surface of the shield can (510). In addition, the plurality of plates (620) may be coupled to the shield can (510) via an adhesive tape or a coupling member (e.g., bolts, nuts, screws).

[0117] According to one embodiment of the present disclosure, an electronic device (100, 200) includes a printed circuit board (240, 301),

[0118] The printed circuit board may include an electronic component (302) disposed on the printed circuit board, a flat portion (311, 411, 511) including a mounting portion (313, 413, 513) formed in a groove shape including an injection hole, and a side portion (312, 412, 512) extending from the flat portion, a shield can (310, 410, 510) coupled to the printed circuit board to cover the electronic component, a cover member (600, 610) disposed on the mounting portion of the shield can, and a heat transfer material filled inside the shield can. The cover member may be bent for insertion of an external object for injecting the heat transfer material into the inside of the shield can through the injection hole.

[0119] In one embodiment, the cover member may include a plurality of cutting portions (601, 611) that are bent in the direction in which the external object is inserted.

[0120] In one embodiment, the mounting portion may be formed as a groove having a shape corresponding to the cover member, and the injection hole may be formed in the groove.

[0121] In one embodiment, the injection hole may not overlap at least a portion of the electronic component when viewed in a direction substantially perpendicular to the flat surface of the shield can.

[0122] In one embodiment, the groove of the mounting portion may be formed to a depth that accommodates the cover member.

[0123] In one embodiment, the groove of the mounting portion is a hole formed in a shape corresponding to the cover member, and the hole can be formed to a depth that accommodates the cover member.

[0124] In one embodiment, the electronic device may further include at least one plate (620) coupled with one surface of the cover member and coupled with the flat portion within the shield can.

[0125] In one embodiment, the shield can may include an opening (315) formed on a side surface of the shield can and facing the circuit of the printed circuit board, and a first partition wall portion (320) positioned between the printed circuit board and the flat surface of the shield can, at least a portion of which faces the opening to block the inflow of the heat transfer material into the opening.

[0126] In one embodiment, the first bulkhead portion may extend at least partially to the side portion to shield the opening.

[0127] In one embodiment, the electronic component may include a communication module (303). In one embodiment, the shield can may include a second partition wall portion (330) positioned between the printed circuit board and the flat portion of the shield can and at least a portion of which surrounds the communication module so as to isolate the communication module from the surrounding space within the shield can.

[0128] In one embodiment, the heat transfer material may include 1.3 to 4 wt % of a high molecular silicone resin and 0.5 to 1.5 wt % of a low molecular silicone resin.

[0129] In one embodiment, the heat transfer material may comprise 0.1 to 1.5 wt % of silicone oil.

[0130] In one embodiment, the heat transfer material may have a viscosity of 200,000 CPS to 600,000 CPS.

[0131] In one embodiment, the heat transfer material may comprise 90 to 95 weight percent of heat dissipating particles.

[0132] In one embodiment, the heat dissipating particles may include at least one of Al2O3, AlN, SiC, Boron Nitride (BN), Si3N4, Carbon fibers, Graphene, and Graphite.

[0133] In one embodiment, the heat transfer material may have a thermal conductivity of 7 W / mK to 10 W / mK.

[0134] According to one embodiment of the present disclosure, an electronic device (100, 200) may include a printed circuit board (240, 301), an electronic component (302) disposed on the printed circuit board, a flat portion (311, 411, 511) including an injection hole, and a side portion (312, 412, 512) extending from the flat portion and having an opening (315) formed therein, a shield can (310, 410, 510) coupled to the printed circuit board and covering the electronic component, a heat transfer material filled into the interior of the shield can through the injection hole, and a first partition wall portion (320) positioned between the printed circuit board and the flat portion of the shield can within the shield can, at least a portion of which faces the opening to block the heat transfer material from flowing into the opening.

[0135] In one embodiment, the first bulkhead portion may extend at least a portion of the side portion where the opening is formed to shield the opening.

[0136] In one embodiment, the electronic device may further include a communication module (303) disposed on the printed circuit board and a second partition wall portion (330) positioned between the printed circuit board and the flat portion of the shield can within the shield can and at least a portion of which surrounds the communication module so as to isolate the communication module from the surrounding space within the shield can.

[0137] In one embodiment, the shield can further include a cover member (600, 610) disposed in the shield can to shield the injection hole and include a plurality of cutting portions (601, 611) that are bent in the direction in which an external object is inserted. The shield can may include a mounting portion (313, 413, 513) in which the injection hole is formed and in the shape of a hole or groove, on which the cover member is disposed.

[0138] It will be appreciated that the present invention contemplates and encompasses embodiments based on any combination of two or more of the disclosed embodiments, as well as embodiments comprising any combination of the features disclosed herein. That is, the absence of an explicit indication that two features or two embodiments can be combined does not imply that such a combination is not envisioned, but rather that such a combination is intended to be included herein.

[0139] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0140] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0141] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0142] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0143] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0144] An embodiment of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0145] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0146] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0147] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices (100, 200), Printed circuit board (240, 301); Electronic components (302) placed on the above printed circuit board; A shield can (310, 410, 510) including a flat portion (311, 411, 511) including a mounting portion (313, 413, 513) formed in a groove shape including an injection hole and a side portion (312, 412, 512) extending from the flat portion, and which is combined with the printed circuit board to cover the electronic component; A cover member (600, 610) placed on the mounting portion of the above shield can; and A heat transfer material filled inside the above shield can; The above cover member is an electronic device that is bent for insertion of an external object for injecting the heat transfer material into the interior of the shield can through the injection hole.

2. In paragraph 1, The above cover member, An electronic device comprising a plurality of cutting portions (601, 611) that are bent in the direction in which the external object is inserted.

3. In paragraph 1, The above-mentioned fixing part is, An electronic device formed with a groove having a shape corresponding to the cover member, and wherein the injection hole is formed in the groove.

4. In paragraph 1, The above injection hole is, An electronic device in which at least a portion of the shield can does not overlap with the electronic component when viewed in a direction perpendicular to the flat surface of the shield can.

5. In paragraph 3, The groove of the above-mentioned fixing part is, An electronic device formed to a depth that accommodates the above cover member.

6. In paragraph 1, The groove of the above-mentioned fixing part is, A hole formed in a shape corresponding to the above cover member, An electronic device wherein the hole is formed to a depth that accommodates the cover member.

7. In paragraph 6, An electronic device further comprising at least one plate (620) coupled to one side of the cover member and coupled to the flat portion inside the shield can.

8. In paragraph 1, The above shield can is, An opening (315) formed on the side of the shield can and facing the circuit of the printed circuit board, and An electronic device comprising a first partition wall portion (320) positioned between the printed circuit board and the flat surface of the shield can, at least a portion of which faces the opening to block the inflow of the heat transfer material into the opening.

9. In paragraph 8, The above first bulkhead part is, An electronic device wherein at least a portion extends to said side portion to shield said opening.

10. In paragraph 1, The above electronic component includes a communication module (303), The above shield can is, An electronic device comprising a second bulkhead portion (330) positioned between the printed circuit board and the flat surface of the shield can and at least a portion of which surrounds the communication module so as to isolate the communication module from the surrounding space inside the shield can.

11. In paragraph 1, The above heat transfer material is, 1.3 to 4 wt % of high molecular weight silicone resin, and An electronic device comprising 0.5 to 1.5 wt % of a low molecular weight silicone resin.

12. In electronic devices (100, 200), Printed circuit board (240, 301); Electronic components (302) placed on the above printed circuit board; A shield can (310, 410, 510) including a flat portion (311, 411, 511) including an injection hole and a side portion (312, 412, 512) extending from the flat portion and having an opening (315) formed therein, and which is combined with the printed circuit board to cover the electronic component; A heat transfer material filled into the interior of the shield can through the injection hole; and An electronic device comprising a first partition wall (320) positioned between the printed circuit board and the flat surface of the shield can inside the shield can, at least a portion of which faces the opening to block the heat transfer material from flowing into the opening.

13. In paragraph 12, The above first bulkhead part is, An electronic device wherein at least a portion extends to the side portion where the opening is formed, thereby shielding the opening.

14. In paragraph 12, A communication module (303) placed on the above printed circuit board; and An electronic device further comprising a second partition wall portion (330) positioned between the printed circuit board and the flat surface of the shield can inside the shield can and at least a portion of which surrounds the communication module so as to isolate the communication module from the surrounding space inside the shield can.

15. In paragraph 12, It further includes a cover member (600, 610) arranged in the shield can to shield the injection hole and including a plurality of cutting portions (601, 611) that are bent in the direction in which an external object is inserted; The above shield can is, An electronic device including a mounting portion (313, 413, 513) in which the above injection hole is formed and the cover member is placed in a hole or groove shape.

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