Transparent display device

Abstract

This transparent display device may comprise: a plurality of transparent substrates, each including a plurality of pixels; a plurality of light-emitting elements disposed in the plurality of pixels on the plurality of transparent substrates; a plurality of conductive wires disposed in a first direction on the plurality of transparent substrates, and electrically connected to the plurality of light-emitting elements; and one or more interconnectors positioned on end areas of the plurality of conductive wires so as to electrically connect the end areas of the plurality of conductive wires in the first direction.

Description

transparent display device

[0001] The embodiment relates to a transparent display device.

[0002] Various display devices that implement images are being developed. Examples include LCD (liquid crystal display) display devices, light-emitting element display devices, and OLED (organic light-emitting diode) display devices.

[0003] Meanwhile, transparent display devices that can display images without obstructing the view by allowing light to pass through from the front and back are gaining attention.

[0004] Transparent display devices can be used in a variety of applications, including show windows, refrigerator doors, billboards, and public displays. Specifically, they provide visual information in spaces that are transparent from the inside to the outside and vice versa, such as building windows. This is called a "see-through screen." Transparent display devices create new value in the digital signage display field, enabling people to communicate and experience in a transparent space.

[0005] Meanwhile, there are limitations to scaling up the transparent display device itself. As an alternative, multiple transparent substrates (or panels) can be connected in a tiling fashion to form a single, large substrate (or panel).

[0006] Previously, multiple transparent substrates were connected using bezel kits. However, the bezel kits placed between adjacent transparent substrates reduced visibility.

[0007] In addition, there is a problem that electrical connection between adjacent transparent substrates in transparent display devices is not easy, and defects such as electrical short circuits occur, reducing reliability.

[0008] The present invention aims to solve the above-mentioned and other problems.

[0009] Another object of the embodiment is to provide a transparent display device that can improve visibility without using a bezel kit.

[0010] Another object of the present invention is to provide a transparent display device capable of improving reliability by preventing defects such as electrical short-circuiting.

[0011] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0012] According to one aspect of the embodiment to achieve the above or other objects, a transparent display device includes: a plurality of transparent substrates each including a plurality of pixels; a plurality of light-emitting elements arranged on the plurality of pixels on the plurality of transparent substrates; a plurality of conductive wires arranged along a first direction on the plurality of transparent substrates and electrically connected to the plurality of light-emitting elements; and one or more interconnectors positioned on end regions of the plurality of conductive wires to electrically connect the end regions of the plurality of conductive wires along the first direction.

[0013] The interconnector may include a connecting wiring film disposed on the end regions of the plurality of conductive wires to electrically connect the adjacent transparent substrates.

[0014] The above connecting wiring film includes a transparent film; and a plurality of connecting wires arranged along the first direction under the transparent film; wherein the plurality of connecting wires can electrically connect the end regions of the plurality of conductive wires.

[0015] The plurality of conductive wires may have a plurality of first periods along the second direction, and the plurality of first periods may be determined by a first width of each of the plurality of conductive wires and first intervals between the plurality of conductive wires, respectively. The plurality of connection wires may have a plurality of second periods along the second direction, and the plurality of second periods may be determined by a second width of each of the plurality of connection wires and second intervals between the plurality of connection wires, respectively.

[0016] The first cycle may be greater than the second cycle.

[0017] The above first period may have a multiple greater than 1 of the above second period.

[0018] Each of the above plurality of conductive wires may have a mesh structure including at least two sub-wires.

[0019] The above first period may be smaller than the above second period.

[0020] Among the plurality of conductive wires, the interval between one sub-wire of the first conductive wire and one sub-wire of the second conductive wire adjacent to the first conductive wire may be greater than the interval between at least two sub-wires of the first conductive wire or the interval between at least two sub-wires of the second conductive wire.

[0021] The above plurality of conductive wires may include a plurality of signal wires and a plurality of power wires.

[0022] The transparent display device may further include other light-emitting elements arranged on the adjacent transparent substrates.

[0023] The above light emitting element can be positioned on the interconnector.

[0024] The interconnector is arranged on the lower surfaces of the adjacent transparent substrates, and can electrically connect the end regions of the plurality of conductive wires to the other light-emitting elements by penetrating the adjacent transparent substrates.

[0025] The above interconnector is arranged on the lower surfaces of the adjacent transparent substrates, and can electrically connect the end regions of the plurality of conductive wires by penetrating the adjacent transparent substrates.

[0026] The interconnector may include a plurality of conductive paste connecting wires electrically connecting the end regions on the plurality of conductive wires.

[0027] The transparent display device may further include a plurality of pads electrically connected to the plurality of conductive wires on the plurality of transparent substrates.

[0028] The width of the pad is greater than the width of the conductive wiring, and the interconnector can be electrically connected between the plurality of pads along the first direction.

[0029] Each of the above plurality of pads may include at least two sub pads.

[0030] The above pad may include a plurality of perforations.

[0031] The end regions of the plurality of conductive wires may be spaced inwardly from the edges of the transparent substrates that are electrically connected to each other.

[0032] The effects of the transparent display device according to the embodiment are described as follows.

[0033] According to at least one of the embodiments, there is an advantage in that visibility can be improved without using a bezel kit by electrically connecting a plurality of transparent substrates through one or more interconnectors.

[0034] According to at least one of the embodiments, by electrically connecting a plurality of conductive wires on a plurality of transparent substrates through one or more interconnectors, there is an advantage in that reliability can be improved by preventing defects such as electrical short-circuiting through adjustment of wire spacing or wire width spacing.

[0035] According to at least one of the embodiments, the plurality of conductive wires have end regions spaced inwardly from the edges of the plurality of transparent substrates, thereby preventing scratches or electrical shorts caused by metal fragments generated when cutting to separate the plurality of transparent substrates from the mother substrate.

[0036] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0037] Fig. 1 is a plan view illustrating a transparent display device according to an embodiment.

[0038] Fig. 2 is a cross-sectional view illustrating a transparent display device according to an embodiment.

[0039] Figure 3 illustrates electrical connection of adjacent transparent substrates using a connecting wiring film.

[0040] FIG. 4 is a first exemplary diagram illustrating the arrangement relationship between a plurality of connecting wires of a connecting wiring film and a plurality of conductive wires on transparent substrates.

[0041] Figure 5 illustrates a plurality of conductive wires on transparent substrates, each having a mesh structure.

[0042] FIG. 6a is a second exemplary diagram illustrating the arrangement relationship between a plurality of connecting wires of a connecting wiring film and a plurality of conductive wires on transparent substrates.

[0043] Figure 6b illustrates in detail the mesh structure of each of the plurality of conductive wires on the transparent substrates.

[0044] Figure 7 illustrates electrically connecting transparent substrates using various process methods.

[0045] Figure 8 illustrates another light emitting element arranged on transparent substrates.

[0046] Figure 9 is a plan view illustrating an interconnector electrically connected to a plurality of pads on transparent substrates.

[0047] Figure 10 is a cross-sectional view illustrating an interconnector electrically connected to a plurality of pads on transparent substrates.

[0048] Figure 11 is a plan view illustrating an interconnector electrically connected to a plurality of pads, each of which includes a plurality of sub-pads.

[0049] Figure 12 illustrates a plurality of perforations formed in the connecting wiring of the connecting wiring film.

[0050] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0051] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0052] Fig. 1 is a plan view illustrating a transparent display device according to an embodiment. Fig. 2 is a cross-sectional view illustrating a transparent display device according to an embodiment.

[0053] Referring to FIGS. 1 and 2, a transparent display device (100) according to an embodiment may include a plurality of transparent substrates (110, 120), a plurality of light-emitting elements (141, 143), a plurality of conductive wires (112, 122), one or more interconnectors (130), etc.

[0054] In an embodiment, a plurality of transparent substrates (110, 120) may be electrically connected horizontally to each other to form a single large screen. Through this connection method, a large screen of infinite size may be realized.

[0055] The transparent substrate (110, 120) may be made of a transparent material. For example, the transparent substrate (110, 120) may be made of a PET (Polyethylene Terephthalate) material, but is not limited thereto.

[0056] The transparent substrate (110, 120) may include a plurality of pixels (PX). A pixel (PX) may be the minimum unit capable of displaying a full color image.

[0057] Although not shown, a display that can be expanded infinitely can be implemented by arranging a plurality of transparent substrates (110, 120) not only in the first direction (x) but also in the second direction (y). In this case, among the plurality of transparent substrates arranged in the first direction (x), the first transparent substrates (110) positioned on both sides may have a pad area (PR) and a display area (DR), and the remaining transparent substrates between the first transparent substrates (110), i.e., the second transparent substrates (120), may have a display area (DR). Similarly, among the plurality of transparent substrates arranged in the second direction (y), the first transparent substrates (110) positioned on both sides may have a pad area (PR) and a display area (DR), and the remaining transparent substrates between the first transparent substrates (110), i.e., the second transparent substrates (120), may have a display area (DR). A plurality of transparent substrates (110, 120) are electrically connected through one or more interconnectors (130), so that power voltage or data signals can be supplied via the plurality of transparent substrates.

[0058] A drive board, a power supply unit, etc. may be mounted on a flexible printed circuit board. The drive board may output, for example, digital data, programming signals, etc., and the power supply unit may output a first power voltage, a second power voltage, etc. The power supply unit may also be included in the drive board. The digital data, programming signals, the first power voltage, the second voltage, etc. may be provided to a plurality of transparent substrates (110, 120) along a first direction (x).

[0059] For example, the plurality of light-emitting elements may include a first light-emitting element that emits a first color light, a second light-emitting element that emits a second color light, and a third light-emitting element that emits a third color light. For example, the first color light may be red light, the second color light may be green light, and the third color light may be blue light, but this is not limited thereto.

[0060] The driving circuit can generate a plurality of driving signals using a plurality of digital data, a first power voltage, a second power voltage, etc. For example, a first light-emitting element can emit a first color light in response to a first driving signal, a second light-emitting element can emit a second color light in response to a second driving signal, and a third light-emitting element can emit a third color light in response to a third driving signal.

[0061] A plurality of conductive wires (112, 122) can be arranged along a first direction (x) on a plurality of transparent substrates (110, 120). The plurality of conductive wires (112, 122) can be electrically connected to a plurality of light-emitting elements (141, 143).

[0062] A plurality of conductive wires (112, 122) can be electrically connected to a plurality of pads on the pad area (PR).

[0063] As illustrated in FIG. 5, the plurality of conductive wires (112, 122) may include a plurality of signal wires, power wires, etc. The plurality of signal wires and the plurality of power wires may be electrically connected to a plurality of light-emitting elements (141, 143) arranged in the first direction (x).

[0064] The plurality of signal wires may include a first signal wire (115, 125) and a second signal wire (116, 126), and the plurality of power wires may include a first power wire (113, 123) and a second power wire (114, 124). The second signal wire (116, 126) may be omitted.

[0065] The first power supply wire (113, 123) can supply a first power supply voltage, and the second power supply wire (114, 124) can supply a second power supply voltage that is lower than the first power supply voltage. The first power supply voltage can be referred to as a high-potential voltage, and the second power supply voltage can be referred to as a low-potential voltage. The second power supply voltage is 0 V and can be grounded, but is not limited thereto.

[0066] The first signal wire (115, 125) can supply digital data, and the second signal wire (116, 126) can supply a programming signal, but is not limited thereto.

[0067] As an example, the plurality of digital data and / or the plurality of programming signals supplied to the plurality of light-emitting elements (141, 143) during one frame may be different from each other. Accordingly, the plurality of light-emitting elements (141, 143) may emit light to display images of different grayscales during one frame. As another example, the digital data and / or the programming signals provided to the same light-emitting element for each frame may be different from each other. Accordingly, the same light-emitting element may emit light to display images of different grayscales for each frame.

[0068] A plurality of conductive wires (112, 122) may have end regions (112a, 122a) spaced inwardly from the edges of transparent substrates (110, 120) that are electrically connected to each other. The end regions (112a, 122a) may be spaced apart from the edges of the transparent substrates (110, 120) by a predetermined distance (d1, d2). Here, d1 and d2 may be the same, but are not limited thereto.

[0069] The conductive wires (112, 122) on the first transparent substrate (110) may have end regions (112a) spaced inwardly of the first transparent substrate (110) along the (-) x direction from the edge of the first transparent substrate (110) adjacent to the second transparent substrate (120).

[0070] The conductive wires (112, 122) on the second transparent substrate (120) may have end regions (122a) spaced apart from the edge of the second transparent substrate (120) adjacent to the first transparent substrate (110) toward the inside of the second transparent substrate (120) along the (+) x direction.

[0071] Typically, a cutting process is performed on a mother substrate on which a plurality of conductive wires (112, 122) are formed, so that a first transparent substrate (110) and a second transparent substrate (120) can be manufactured. Since the plurality of conductive wires (112, 122) are arranged over the entire area of ​​the mother substrate, the conductive wires (112, 122) can also be cut during the cutting process. When the conductive wires (112, 122) are cut, scratches may be generated on the surface of the first transparent substrate (110) and / or the second transparent substrate (120) due to metal fragments generated from the conductive wires (112, 122). When the conductive wires (112, 122) are cut, metal fragments generated from the conductive wires (112, 122) may adhere to the surface of the first transparent substrate (110) and / or the second transparent substrate (120), which may cause defects such as electrical shorts between adjacent conductive wires (112, 122).

[0072] In order to solve the above-described problem, according to an embodiment, after a plurality of conductive wires (112, 122) are formed on a mother substrate, conductive wires (112, 122) corresponding to a predetermined distance (d1, d2) on both sides of a cutting line (or cutting area) (each edge of the first transparent substrate (110) and the second transparent substrate (120)) for separating a first transparent substrate (110) and a second transparent substrate (120) may be removed. Accordingly, since there are no conductive wires (112, 122) in the cutting line (or cutting area), even if a cutting process is performed along the cutting line (or cutting area), metal fragments due to the conductive wires (112, 122) may not be generated. Accordingly, scratches on the surface of the first transparent substrate (110) and / or the second transparent substrate (120) caused by metal fragments or electrical shorts between conductive wires (112, 122) can be prevented.

[0073] Alternatively, conductive wires (112, 122) may be formed on the motherboard using a mask process, excluding an area corresponding to a predetermined distance (d1, d2) on both sides of the cutting line.

[0074] Meanwhile, one or more interconnectors (130) may be positioned on a plurality of transparent substrates (110, 120). One or more interconnectors (130) may be disposed on end regions (112a, 122a) of a plurality of conductive wires (112, 122) on a plurality of transparent substrates (110, 120). The interconnectors (130) may electrically connect the end regions (112a, 122a) of the plurality of conductive wires (112, 122) along the first direction (x).

[0075] A plurality of conductive wires (112, 122) may be arranged along a first direction (x) on a plurality of transparent substrates (110, 120), and one or more interconnectors (130) may be arranged along the first direction (x) on the plurality of transparent substrates (110, 120). The one or more interconnectors (130) may electrically connect the plurality of conductive wires (112, 122) on the plurality of transparent substrates (110, 120). Accordingly, digital data, programming signals, etc. output from a driving board, or a first power voltage, a second power voltage, etc. output from a power supply device may be provided to the plurality of transparent substrates (110, 120) through the plurality of conductive wires (112, 122). Digital data, programming signals, a first power voltage, a second power voltage, etc. can be provided to a plurality of transparent substrates (110, 120) through one or more interconnectors (130).

[0076] Meanwhile, the transparent display device (100) according to the embodiment may include a protective film (152), a molding layer (161), a cover film (162), etc.

[0077] The transparent display device (100) according to the embodiment may be a top-emitting transparent display device, but is not limited thereto. In this case, light generated from a plurality of light-emitting elements (141, 143) may be emitted upward through the molding layer (161) and the cover film (162).

[0078] A molding layer (161) may be placed on a plurality of light-emitting elements (141, 143), and a cover film (162) may be placed on the molding layer (161).

[0079] In the transparent display device (100), the cover film (162) can be attached to the glass window of a building or the like using an adhesive (163). Before the transparent display device (100) is attached to the glass window of a building or the like, it is necessary to protect it from foreign substances or impact during transportation. To this end, a release film (164) can be attached to the cover film (162) using an adhesive (163). After the release film (164) is removed, the cover film (162) of the transparent display device (100) can be attached to the glass window of a building or the like. The cover film (162) can have an adhesive strength or fixing strength that can withstand the load of all components of the transparent display device (100) according to the embodiment. The transparent display device (100) according to the embodiment can also be fixed to the glass window of a building or the like using a frame coupled to the edge.

[0080] When a transparent display device (100) is attached to an inner glass window of a building, viewers outside the building can view images provided by the transparent display device (100). At this time, the back surfaces of the transparent substrates (110, 120) of the transparent display device (100) are exposed to the outside, and may become contaminated with foreign substances or vulnerable to impact.

[0081] In an embodiment, a protective film (152) may be attached to a plurality of transparent substrates (110, 120) via an adhesive (151), thereby protecting the plurality of transparent substrates (110, 120). In addition, by attaching the plurality of transparent substrates (110, 120) by the integrally formed protective film (152), the fixation and rigidity of the plurality of transparent substrates (110, 120) may be enhanced.

[0082] A manufacturing process of a transparent display device according to an embodiment is briefly described.

[0083] First, a plurality of transparent substrates (110, 120) including a plurality of conductive wires (112, 122) can be manufactured by cutting from a mother substrate through a cutting process. Alternatively, a plurality of transparent substrates (110, 120) can be received from a customer. The plurality of transparent substrates (110, 120) can be attached to a protective film (152) using an adhesive (151), thereby enhancing the strength and rigidity of the plurality of transparent substrates (110, 120).

[0084] Thereafter, a plurality of light-emitting elements (141, 143) can be mounted on a plurality of pixels (PX) on a plurality of transparent substrates (110, 120).

[0085] Thereafter, one or more interconnectors (130) may be mounted on a plurality of transparent substrates (110, 120). A plurality of conductive wires (112, 122) on a plurality of transparent substrates (110, 120) may be electrically connected through one or more interconnectors (130).

[0086] Thereafter, a molding layer (161) and a cover film (162) are formed on a plurality of light-emitting elements (141, 143) and one or more interconnectors (130), and a release film (164) can be attached to the cover film (162) through an adhesive (163).

[0087] In an embodiment, the interconnector (130) may include a connecting wiring film (131 of FIGS. 3 and 7a), conductive paste connecting wirings (135, 136 of FIGS. 7b and 7c), a wire (138 of FIG. 7d), etc.

[0088] Figure 3 illustrates electrical connection of adjacent transparent substrates using a connecting wiring film.

[0089] As illustrated in FIG. 3, a connecting wiring film (131) can be disposed on end regions (112a, 122a) of a plurality of conductive wirings (112, 122) on a plurality of transparent substrates (110, 120). The connecting wiring film (131) can electrically connect a plurality of conductive wirings (112, 122) to each other on the end regions (112a, 122a) of the plurality of conductive wirings (112, 122). For example, a plurality of conductive wirings (112) on a first transparent substrate (110) can be electrically connected to a plurality of conductive wirings (122) on a second transparent substrate (120) through the connecting wiring film (131).

[0090] The connecting wiring film (131) may include a transparent film (132) and a plurality of connecting wires (133) under the transparent film (132). The plurality of connecting wires (133) may be arranged along the first direction (x). In this case, the plurality of connecting wires (133) may electrically connect end regions (112a, 122a) of the plurality of conductive wires (112, 122) on the plurality of transparent substrates (110, 120).

[0091] FIG. 4 is a first exemplary diagram illustrating the arrangement relationship between a plurality of connecting wires of a connecting wiring film and a plurality of conductive wires on transparent substrates.

[0092] As illustrated in FIG. 4, a plurality of conductive wires (112, 122) and a plurality of connecting wires (133) may be arranged in the same direction, for example, along the first direction (x). A plurality of conductive wires (112) on a first transparent substrate (110) may be arranged along the first direction (x), a plurality of conductive wires (122) on a second transparent substrate (120) adjacent to the first transparent substrate (110) may be arranged along the first direction (x), and a plurality of connecting wires (133) of a connecting wire film (131) positioned on the first transparent substrate (110) and the second transparent substrate (120) may be arranged along the first direction (x).

[0093] A plurality of conductive connection wires (133) on a plurality of transparent substrates (110, 120) can be electrically connected through at least one connection wire among a plurality of connection wires (133) of a connection wire film (131). To this end, the width of each of the plurality of conductive wires (112, 122), the intervals between the plurality of conductive wires (112, 122), the width of each of the plurality of connection wires (133), the intervals between the plurality of connection wires (133), etc. need to be optimized.

[0094] As illustrated in FIG. 4, a first period (T11, T12) may be defined by a first width (W11, W12) of each of a plurality of conductive wires (112, 122) and first intervals (G11, G12) between the plurality of conductive wires (112, 122), and a second period (T21) may be defined by a second width (W21) of each of a plurality of connection wires (133) and second intervals (G21) between the plurality of connection wires (133). In this case, the plurality of conductive wires (112, 122) may have a plurality of first periods (T11, T12) along the second direction (y), and the plurality of connection wires (133) may have a plurality of second periods (T21) along the second direction (y).

[0095] As an example, the first period (T11, T12) may be greater than the second period (T21). For example, the first period (T11, T12) may have a multiple greater than 1 of the second period (T21). For example, the first period (T11, T12) may be 1.1 times or more of the second period (T21). When this condition is satisfied, even if the connection wiring film (131) shifts along the second direction (y) during the electrical connection process of the connection wiring film (131) and misalignment occurs, the plurality of connection wirings (133) of the connection wiring film (131) may be electrically connected to the plurality of conductive wirings (112, 122) on the plurality of transparent substrates (110, 120). If the above-described conditions are not satisfied, a plurality of adjacent conductive wires (112, 122) may be electrically short-circuited by some of the plurality of connecting wires (133) of the connecting wiring film (131).

[0096] Fig. 5 illustrates a plurality of conductive wires on transparent substrates, each having a mesh structure. Fig. 6a is a second exemplary diagram illustrating the arrangement relationship between a plurality of connecting wires of a connecting wire film and a plurality of conductive wires on transparent substrates. Fig. 6b illustrates in detail the mesh structure of each of the plurality of conductive wires on the transparent substrates.

[0097] As illustrated in FIGS. 5, 6a, and 6b, each of the plurality of conductive wires (112, 122) on the plurality of transparent substrates (110, 120) may have a mesh structure including two or more sub-wires (113a to 113c, 123a to 123c). Since each of the plurality of conductive wires (112, 122) has a mesh structure, resistance characteristics are improved, IR drop is minimized, and defects such as signal distortion can be prevented.

[0098] When each of the plurality of conductive wires (112, 122) on the plurality of transparent substrates (110, 120) includes two or more sub-wires (113a to 113c, 123a to 123c), the first period (T11, T12) may be smaller than the second period (T21). When this condition is satisfied, even if the connection wire film (131) shifts along the second direction (y) during the electrical connection process of the connection wire film (131) and misalignment occurs, the plurality of connection wires (133) of the connection wire film (131) can be electrically connected to the plurality of conductive wires (112, 122) on the plurality of transparent substrates (110, 120).

[0099] As illustrated in FIG. 5, a plurality of light-emitting elements (141, 143) can be electrically connected to a plurality of pads (117-1 to 117-6, 127-1 to 127-6) using solder.

[0100] Meanwhile, one or more stuffing patterns (118, 128) may be arranged around the light emitting element (141, 143). One or more stuffing patterns (118, 128) may be formed on a plurality of conductive wires (112, 122). The stuffing patterns (118, 128) may have a closed-loop structure. The stuffing patterns (118, 128) may have a ring shape, but are not limited thereto.

[0101] A light emitting element (141, 143) can be mounted on a pixel (PX) using solder. When the light emitting element (141, 143) is pressurized, the solder of the light emitting element (141, 143) may flow laterally. In this case, an electrical short may occur between a plurality of conductive wires (112, 122) due to the solder that has flowed laterally, or an insufficient amount of solder under the light emitting element (141, 143) may cause poor electrical contact of the light emitting element (141, 143). Since the solder that has flowed laterally fills the plurality of stuffing patterns (118, 128), it no longer flows laterally. Accordingly, the solder under the light emitting element (141, 143) no longer flows laterally, so poor electrical contact can be minimized.

[0102] As illustrated in FIGS. 6a and 6b, among the plurality of conductive wires (112, 122), a gap (G31) between one sub-wiring of the first conductive wire and one sub-wiring of the second conductive wire adjacent to the first conductive wire may be greater than a gap (G32) between at least two sub-wirings (113a to 113c) of the first conductive wire or a gap (G33) between at least two sub-wirings (123a to 123c) of the second conductive wire.

[0103] Figure 7 illustrates electrically connecting transparent substrates using various process methods.

[0104] As illustrated in FIG. 7a, when a connecting wiring film (131) is positioned on adjacent transparent substrates (110, 120) and a bonding jig (200) is pressed, a plurality of connecting wirings (133) of the connecting wiring film (131) can be electrically connected to a plurality of conductive wirings (112, 122) on adjacent transparent substrates (110, 120). The plurality of connecting wirings (133) can be electrically connected to a plurality of conductive wirings (112, 122) on adjacent transparent substrates (110, 120) using an anisotropic conductive film (ACF), but is not limited thereto.

[0105] For example, the bonding jig (200) can be pressurized with a pressure of 12.0 kgf in a temperature atmosphere of 150°C, but this is not limited thereto.

[0106] By electrically connecting a plurality of conductive wires (112, 122) on transparent substrates (110, 120) through a plurality of connecting wiring films (131), the structure of the transparent display device (100) according to the embodiment has the advantage of being sturdy.

[0107] As illustrated in FIG. 7b, solder or silver paste may be jetted onto edge regions of adjacent transparent substrates (110, 120) using a jetting dispensing device (210), and the jetted solder or conductive paste may be melted and then hardened using a laser hardening device (220). The conductive paste may include, for example, silver (Ag), but is not limited thereto. Accordingly, end regions (112a, 122a) of a plurality of conductive wires (112, 122) on adjacent transparent substrates (110, 120) may be electrically connected by a plurality of conductive paste connection wires (135).

[0108] The space between a plurality of transparent substrates (120, 130) can be filled by the sprayed liquid from the spray device (230). The sprayed liquid may be a molding material or a resin material, but is not limited thereto.

[0109] As illustrated in FIG. 7c, a mask (250) is positioned on the edge regions of adjacent transparent substrates (110, 120) and a printing process is performed using a squeeze (240) using the mask (250), so that end regions (112a, 122a) of a plurality of conductive wires (112, 122) on adjacent transparent substrates (110, 120) can be electrically connected by a plurality of conductive paste connection wires (136).

[0110] By electrically connecting a plurality of conductive wires (112, 122) on a plurality of transparent substrates (110, 120) through a plurality of conductive paste connection wires (136), the connection resistance is lowered, which not only prevents defects such as signal distortion but also increases productivity.

[0111] As illustrated in FIG. 7d, a wire bonding process is performed so that end regions (112a, 122a) of a plurality of conductive wires (112, 122) on adjacent transparent substrates (110, 120) can be electrically connected by a plurality of wires (138).

[0112] By electrically connecting a plurality of conductive wires (112, 122) on transparent substrates (110, 120) via a plurality of wires (138), connection resistance is reduced, thereby preventing defects such as signal distortion. In addition, when electrically connecting via wires (138), there is an advantage in manufacturing high-definition panels.

[0113] Figure 8 illustrates another light emitting element arranged on transparent substrates.

[0114] As illustrated in FIG. 8, other light-emitting elements (145) may be placed on a plurality of transparent substrates (110, 120).

[0115] A plurality of light-emitting elements (141, 143) may be mounted on a plurality of pixels (PX) on a first transparent substrate (110) and a plurality of pixels (PX) on a second transparent substrate (120). Additional light-emitting elements (145) may be placed on one or more interconnectors (130).

[0116] One or more interconnectors (130) may be disposed on the lower surfaces of the plurality of transparent substrates (110, 120). One or more interconnectors (130) may be electrically connected to end regions (112a, 122a) of a plurality of conductive wires (112, 122) disposed on the upper surfaces of the plurality of transparent substrates (110, 120) by penetrating the plurality of transparent substrates (110, 120) on the lower surfaces of the plurality of transparent substrates (110, 120). One or more interconnectors (130) may be electrically connected to other light-emitting elements (145) disposed on adjacent transparent substrates (110, 120) by penetrating the plurality of transparent substrates (110, 120) on the lower surfaces of the plurality of transparent substrates (110, 120).

[0117] A plurality of pads (154 to 159) are arranged on edge regions of adjacent transparent substrates (110, 120), and one or more interconnectors (130) can be electrically connected to other light-emitting elements (145) through the plurality of pads (154 to 159) on the lower surfaces of the plurality of transparent substrates (110, 120).

[0118] Even if the spacing between the light-emitting elements is narrow, other light-emitting elements (145) can be arranged on the interconnector (130) so that they can be used equally with the pixels of the display area (DR) between adjacent transparent substrates (110, 120).

[0119] Figure 9 is a plan view illustrating an interconnector electrically connected to a plurality of pads on transparent substrates. Figure 10 is a cross-sectional view illustrating an interconnector electrically connected to a plurality of pads on transparent substrates.

[0120] As illustrated in FIGS. 9 and 10, a plurality of pads (171 to 174, 181 to 184) may be arranged on a plurality of transparent substrates (110, 120). The plurality of pads (171 to 174, 181 to 184) may be arranged at end regions (112a, 122a) of a plurality of conductive wires (112, 122) on the plurality of transparent substrates (110, 120). For example, the plurality of pads (171 to 174) may be arranged at end regions (112a, 122a) of a plurality of conductive wires (112) on the first transparent substrate (110). For example, a plurality of pads (181 to 184) may be arranged at end regions (112a, 122a) of a plurality of conductive wires (122) on a second transparent substrate (120). A plurality of pads (171 to 174, 181 to 184) may be electrically connected to a plurality of conductive wires (112, 122). A plurality of pads (171 to 174, 181 to 184) and a plurality of conductive wires (112, 122) may be formed integrally by performing the same patterning process with the same metal, but are not limited thereto.

[0121] The width (W42) of the pads (171 to 174, 181 to 184) may be greater than the width (W41) of the conductive wires (112, 122). The widths (W42) of the plurality of pads (171 to 174, 181 to 184) on the first transparent substrate (110) may be greater than the widths (W41) of the plurality of conductive wires (112, 122), respectively. The widths (W42) of the plurality of pads (171 to 174, 181 to 184) on the second transparent substrate (120) may be greater than the widths (W41) of the plurality of conductive wires (112, 122), respectively.

[0122] Since the width (W42) of the pads (171 to 174, 181 to 184) is greater than the width (W41) of the conductive wiring (112, 122), the electrical contact area with the interconnector (130) can be increased. Accordingly, IR drop can be minimized, and defects such as signal distortion can be prevented.

[0123] One or more interconnectors (130) can be electrically connected to a plurality of pads (171 to 174, 181 to 184) on a plurality of transparent substrates (110, 120). The interconnector (130) can electrically connect a plurality of pads (171 to 174) of a first transparent substrate (110) and a plurality of pads (181 to 184) of a second transparent substrate (120).

[0124] The drawing illustrates that molding layers (161-1, 161-2) on a plurality of transparent substrates (110, 120) are arranged spaced apart from each other. In this case, interconnectors (130) arranged on edge regions of the plurality of transparent substrates (110, 120) may be exposed. However, in an embodiment, the molding layers (161-1, 161-2) may be connected to each other on the plurality of transparent substrates (110, 120) and formed integrally.

[0125] Although not shown, a protective film (152) may be attached on the lower surfaces of a plurality of transparent substrates (10, 120).

[0126] Figure 11 is a plan view illustrating an interconnector electrically connected to a plurality of pads, each of which includes a plurality of sub-pads.

[0127] As illustrated in FIG. 11, each of the plurality of pads on the plurality of transparent substrates (110, 120) may include at least two sub-pads (173-1, etc., 174-1, etc., 175-1, etc., 176-1, etc., 183-1, etc., 184-1, etc., 185-1, etc., 186-1, etc.).

[0128] Here, the pad may be a wiring portion for connection to an interconnector (130) at the edge of the substrate.

[0129] In this case, even if the interconnector (130) shifts along the second direction (y) during the electrical connection process of the interconnector (130) and misalignment occurs, each of the connecting members on the interconnector (130), for example, the plurality of connecting wires (133) of the connecting wiring film (131), can be electrically connected to one or more sub pads among two or more sub pads (173-1, etc., 174-1, etc., 175-1, etc., 176-1, etc., 183-1, etc., 184-1, etc., 185-1, etc., 186-1, etc.). Accordingly, electrical connection failure can be prevented, and product reliability can be improved.

[0130] Figure 12 illustrates a plurality of perforations formed in the connecting wiring of the connecting wiring film.

[0131] The pad (133) illustrated in FIG. 12 represents one of the plurality of pads (171 to 174, 181 to 184) illustrated in FIG. 9 or one of two or more sub-pads (173-1, etc., 174-1, etc., 175-1, etc., 176-1, etc., 183-1, etc., 184-1, etc., 185-1, etc., 186-1, etc.) of each of the plurality of pads illustrated in FIG. 11.

[0132] As illustrated in Fig. 12, the pad may include a plurality of perforations (134). The perforations (134) may be holes penetrating the pad (133).

[0133] The transparency can be improved by ensuring visibility of transmission through multiple perforations (134).

[0134] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalency range of the embodiments are intended to be included within the scope of the embodiments.

Claims

1. A plurality of transparent substrates each including a plurality of pixels; A plurality of light-emitting elements arranged in the plurality of pixels on the plurality of transparent substrates; A plurality of conductive wires arranged along a first direction on the plurality of transparent substrates and electrically connected to the plurality of light-emitting elements; and One or more interconnectors positioned on the end regions of the plurality of conductive wires and electrically connecting the end regions of the plurality of conductive wires along the first direction; Transparent display device.

2. In paragraph 1, The above interconnector, A connecting wiring film disposed on the end regions of the plurality of conductive wirings to electrically connect the adjacent transparent substrates, Transparent display device.

3. In paragraph 2, The above connecting wiring film is, transparent film; and A plurality of connecting wires arranged along the first direction under the transparent film; The above plurality of connecting wires electrically connect the end regions of the above plurality of conductive wires, Transparent display device.

4. In paragraph 3, The above plurality of conductive wires have a plurality of first periods along the second direction, The plurality of first periods are each determined by a first width of each of the plurality of conductive wires and first intervals between the plurality of conductive wires, The above plurality of connecting wires have a plurality of second periods along the second direction, The plurality of second periods are each determined by the second width of each of the plurality of connecting wires and the second intervals between the plurality of connecting wires. Transparent display device.

5. In paragraph 4, The above first cycle is greater than the above second cycle, Transparent display device.

6. In paragraph 5, The first cycle has a multiple greater than 1 of the second cycle, Transparent display device.

7. In paragraph 4, Each of the plurality of conductive wires has a mesh structure including at least two sub-wires, Transparent display device.

8. In paragraph 7, The above first cycle is smaller than the above second cycle, Transparent display device.

9. In paragraph 7, Among the plurality of conductive wires, the interval between one sub-wire of the first conductive wire and one sub-wire of the second conductive wire adjacent to the first conductive wire is greater than the interval between at least two sub-wires of the first conductive wire or the interval between at least two sub-wires of the second conductive wire. Transparent display device.

10. In paragraph 3, The above plurality of conductive wires include a plurality of signal wires and a plurality of power wires, Transparent display device.

11. In paragraph 10, Further comprising: another light emitting element disposed on the adjacent transparent substrates; Transparent display device.

12. In paragraph 11, The above light emitting element is positioned on the interconnector, Transparent display device.

13. In paragraph 12, The interconnector is arranged on the lower surfaces of the adjacent transparent substrates, and electrically connects the end regions of the plurality of conductive wires to the other light-emitting elements by penetrating the adjacent transparent substrates. Transparent display device.

14. In paragraph 11, The interconnector is arranged on the lower surfaces of the adjacent transparent substrates, and electrically connects the end regions of the plurality of conductive wires by penetrating the adjacent transparent substrates. Transparent display device.

15. In paragraph 1, The above interconnector, A plurality of conductive paste connecting wires electrically connecting the end regions on the plurality of conductive wires, Transparent display device.

16. In paragraph 1, Further comprising a plurality of pads electrically connected to the plurality of conductive wires on the plurality of transparent substrates; The width of the above pad is greater than the width of the above conductive wiring, The above interconnector is electrically connected to the plurality of pads along the first direction, Transparent display device.

17. In paragraph 16, Each of the above plurality of pads includes at least two sub pads, Transparent display device.

18. In paragraph 16, The above pad includes a plurality of perforations, Transparent display device.

19. In paragraph 1, The end regions of the plurality of conductive wires are spaced inwardly from the edges of the transparent substrates that are electrically connected to each other. Transparent display device.

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