Control system actuated foam density controller

Abstract

Various implementations disclosed herein include devices, systems, and methods that automatically control an actuator position with respect to a density controller for creating a mixture of adhesive and gas. For example, a process may obtain parameters associated with forming the mixture of adhesive and gas. The parameters may include a target position of an actuator with respect to a density controller that includes an elongated structure and a disc. The process may further control movement of the elongated structure in a direction towards the disc until electrical contact between the elongated structure and the disc is detected. The electrical contact may enable a flow of gas into the density controller. The process may further control movement of the elongated structure in a direction away from the disc to disable electrical contact between the elongated structure and the disc disabling the flow of gas into the density controller.

Description

CONTROL SYSTEM ACTUATED FOAM DENSITY CONTROLLER RELATED APPLICATION

[0001] This application claims priority to U.S. Provisional Application No. 63 / 651,703, entitled Control System Actuated Foam Density Controller, filed May 24. 2024, incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] The present disclosure generally relates to multi-mode electrically actuated foam dispensers for hot melt adhesives. Specifically, the present disclosure relates to a control system configured to enable and control an electrically actuated foam density controller that may be used with hot melt adhesive foam dispensers.BACKGROUND

[0003] Dispensing equipment involving the mixture of hot melt adhesive and gas requires the ability to control the ratio of gas to adhesive in order to sustain various different application requirements. Current dispensers require manual operation in order to maintain a desired density reduction percentage, and do not provide adequate control of the foam density' rate. The manual process of controlling the introduction of gas leads to inconsistent density reduction rates and leaves the operator blind with regard to how far to adjust a manual control knob. This provides challenges of precisely controlling the density of the resulting foam as well as causing too much gas to be introduced into the system. Providing a control system to automatically, electrically actuate foam density controller would allow for a precise way to control the amount of gas introduced in the system under a broader range of conditions and to sustain and reach the required density of the foam product.SUMMARY

[0004] In one embodiment, a hardware controller such as a programable logic controller (PLC) may be configured to execute a software algorithm for automatically controlling (e.g., in response to input parameters such as, temperature, pressure set point, RPM gas pressure, duty cycle, etc.) a linear actuator position with respect to an automated foam dispenser apparatus to create a specified mixture of hot melt adhesive and gas by automatically controlling a ratio of the gas with respect to the adhesive in order to reach a required / desired density reduction. The hardware controller may be configured to control movement of an electrical actuator with respect to a density7controller assembly (that includes an elongated structure and a disc) to adjust a position and velocity of the elongated structure to locate the disc and in response, the hardware controller is configured to move the elongated member (via movement of the linear actuator) to the disc to make contact and transmit a control signal to a gas valve configured to inject gas into the adhesive to achieve a desired foam ratio and volumetric flow rate. The hardware controller may be configured to operate with respect to 3 modes of operation: a manual mode, a fully automated mode, and a hybrid mode. Each mode may provide a differing level of control of the automated foam dispenser apparatus.

[0005] In one embodiment, a hardware controller has a processor and an interface. The hardware controller may be configured to obtain input parameters, via the interface, associated with forming a foam substance comprising a specified mixture of adhesive and gas. The input parameters may include a target position of an electrical actuator with respect to a density controller assembly. The density7controller assembly may include a housing structure enclosing an elongated structure and a disc. The hardware controller may be further configured to move the elongated structure in a first direction towards the disc untilelectrical contact between the elongated structure and the disc is detected. The electrical contact enables a flow of gas into the density controller assembly. In response to achieving the specified mixture of adhesive and gas. the hardware controller may be further configured to move the elongated structure in a second direction away from the disc to disable electrical contact between the elongated structure and the disc to disable the flow of gas into the density controller assembly.

[0006] In another embodiment, the electrical actuator may be configured to automatically move the elongated structure in a first direction towards the disc until the elongated structure electrically contacts the disc to transmit a control signal to a gas valve configured to inject the gas into the adhesive to achieve a predetermined specified density of the foam substance.

[0007] In another embodiment, the electrical actuator may include a motor and a linear actuator. The motor may be a variable speed stepper motor.

[0008] In another embodiment, a target position of the electrical actuator may be obtained manually from a user via the interface. Alternatively, the target position of the electrical actuator may be obtained from a control sequence such as a model.

[0009] In another embodiment, a proportional-integral-derivative (PID) loop may initiate and control movement of the elongated structure in the first direction and the second direction.

[0010] In another embodiment, a reversing contactor may be activated to enable the electrical actuator to move the elongated member in the first direction and the second direction to achieve the specified mixture of adhesive and gas.

[0011] In another embodiment, a cunent position of the electrical actuator may be detected by determining a travel distance of the electrical actuator based on the input parameters.

[0012] In another embodiment, moving the elongated structure in the first direction enables a desired foam ratio and associated volumetric flow of the foam substance.

[0013] In another embodiment, a position or speed of the electrical actuator may be controlled or monitored.

[0014] In another embodiment, input parameters may include parameters such as, inter alia, temperature, a foam pressure set point, an RPM value for the actuator, a gas pressure, a spring deflection value, a duty cycle, etc.

[0015] In another embodiment, enabling the flow of gas into the density controller assembly may include activating a variable flow gas valve.

[0016] In another embodiment, a temperature of the electrical actuator may be monitored and in response to the monitored temperature exceeding a temperature value threshold, a fan apparatus may be activated to maintain an operating temperature of the electrical actuator.BRIEF DESCRIPTION OF THE DRAWINGS

[0017] So that the present disclosure can be understood by those of ordinary skill in the art, a more detailed description may be had by reference to aspects of some illustrative implementations, some of which are shown in the accompanying drawings.

[0018] Figure 1 illustrates an example of a system comprising a hardware controller and a hot adhesive retaining / melting structure, in accordance with some implementations.

[0019] Figure 2 is a front perspective view of one embodiment of the electrically actuated foam density controller assembly attached to internal components of a foam adhesive dispenser, in accordance with some implementations.

[0020] Figure 3 is an exploded view of one embodiment of the electrically actuated foam density controller assembly, in accordance with some implementations.

[0021] Figure 4A is a front view of one embodiment of the electrically actuated foam density controller assembly attached to internal components of a foam adhesive dispenser, in accordance with some implementations.

[0022] Figures 4B and 4C are cross-sectional side views of the manifold and foam density controller portions of the foam density controller assembly, in accordance with some implementations.

[0023] Figure 4D is a front view cutaway of the foam density7controller assembly of Figure 2, in accordance with some implementations.

[0024] Figures 5-7 illustrates examples of a hardware / software implemented user interface associated with control of the system of figure 1, in accordance with some implementations.

[0025] Figure 8 illustrates a graph representing an exponential curve, such as a model, usable during a hybrid (and fully automatic) mode for enabling linear actuator movement, in accordance with some implementations.

[0026] Figure 9 illustrates an examples of a hardware / software implemented user interface associated with control of the system of figure 1, in accordance with some implementations.

[0027] Figure 10 illustrates a system diagram representing a process using a model during a hybrid and fully automatic mode for enabling linear actuator movement, in accordance with some implementations.

[0028] Figures 11-14 illustrate alternative examples of a hardware / software implemented user interface associated with control of the system of figure 1, in accordance with some implementations.

[0029] Figure 15 illustrates an example of a control / feedback schematic, in accordance with some implementations.

[0030] Figures 16A-16C illustrate multiple mode processes for enabling the hardware controller of figure 1 to enable control of a foam dispenser apparatus to create a specified mixture of hot melt adhesive and gas to create a foam substance having a specified density, in accordance with some implementations.

[0031] Figure 17 is a flowchart representation of an exemplary method that enables automatic control of an actuator position with respect to a density controller for creating a mixture of adhesive and gas, in accordance with some implementations.

[0032] Figure 18 illustrates a hardware device used by or comprised a system for improving software / hardware control technology associated with automatic control of an actuator position with respect to a density controller for creating a mixture of adhesive and gas, in accordance with some implementations.

[0033] In accordance with common practice the various features illustrated in the drawings may not be drawn to scale. Accordingly, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. In addition, some of the drawings may not depict all of the components of a given system, method or device. Finally, like reference numerals may be used to denote like features throughout the specification and figures.DESCRIPTION

[0034] Numerous details are described in order to provide a thorough understanding of the example implementations shown in the drawings. However, the drawings merely show some example aspects of the present disclosure and are therefore not to be considered limiting. Those of ordinary skill in the art will appreciate that other effective aspects and / or variants do not include all of the specific details described herein. Moreover, well-known systems, methods, components, devices and circuits have not been described in exhaustive detail so as not to obscure more pertinent aspects of the example implementations described herein.

[0035] Figure 1 illustrates an example of a system 100 comprising a hardware controller 100a and an adhesive retaining / melting structure 100b, in accordance with some implementations. Hardware controller 100a is configured to execute specialized software for automatically creating a specified mixture of adhesive and gas to create a foam substance having a specified density7. In some implementations, hardware controller 100a may include a programable logic controller (PLC), a proportional-integral-derivative (PID) controller, a dedicated specialized controller, etc. In some implementations, adhesive retaining / melting structure 100b may be used to dispense an adhesive, such as hot melt, that is combined in a dispenser 10 (as described with respect to figure 2, infra) with a gas, such as nitrogen, to create a foam adhesive.

[0036] In some implementations, hardware controller 100a may be configured to execute a specialized software algorithm to obtain input parameters associated with forming a foam adhesive that includes a specified mixture of adhesive and gas by automatically controlling a position of an electrical actuator (e g., comprising a motor 56 such as a steppermotor and a linear actuator 60 as described with respect to figure 4A, infra) with respect to an automated density controller assembly such as density controller portion 30 as described with respect to figure 3, infra. In some implementations, input parameters may include parameters such as. inter alia, temperature, a pressure set point. RPMs. gas pressure, duty cycle, etc.

[0037] In some implementations, a required position of a linear actuator (to obtain a specified foam substance having a specified density reduction) may be manually entered via an interface of hardware controller 100a. In some implementations, a required position of the linear actuator may be specified in a control sequence such as a model (e.g., model 1008 as described with respect to figure 10, infra) and / or based on feedback signals from sensors. In some implementations, the linear actuator may be positioned (via movement of, for example, a stepper motor or servo) with respect to an automated foam dispenser apparatus (e.g., that includes a density controller assembly (comprising an elongated structure such as adjustment rod 42 and a disc such as slug 36 as described with respect to figures 4A and 4B, infra). In some implementations, the position of the linear actuator may be configured to create a specified mixture of hot melt adhesive and gas (e.g., nitrogen gas) by automatically controlling a ratio of the gas with respect to the adhesive in order to reach a required / desired density reduction. In some implementations, hardware controller 100a executing the software algorithm may control movement of the electrical actuator (i.e., the linear actuator) to adjust a position and velocity of the elongated structure to locate the disc. In response, hardware controller 100a executing the software algorithm may control movement of the elongated structure (via movement of the motor and the linear actuator) towards the disc to make electrical contact and transmit a control signal to a gas valve configured to inject gas into the adhesive to achieve a desired foam ratio and volumetric flow rate.

[0038] Figure 2 illustrates an example of the main body components of a foam adhesive dispenser 10, in accordance with some implementations. The foam adhesive dispenser 10 may include, but is not limited to, a hopper 18 configured to receive the adhesive material, a pump motor 20 configured to move adhesive material through the dispenser 10. a reservoir designed to receive the melted hot melt adhesive 22. an assembly guard structure 24 disposed about a density controller assembly 14, and an alignment plate 26 configured to stabilize the density controller assembly 14 in relation to main body components. It should be apparent that additional components of the dispenser may be included in the device as a whole.

[0039] Figure 3 illustrates an example of an electrically actuated foam density controller assembly 14, in accordance with some implementations. In some implementations, electrically actuated foam density controller assembly 14 includes a first housing or manifold 28, a disc (not shown), a foam density controller portion 30, and an electrical actuator system 32, the components of which will be discussed in more detail herein.

[0040] Figure 4A illustrates an example of internal main body components of one embodiment of a foam adhesive dispenser 10, in accordance with some implementations. Figure 6 shows an example of the internal main body components of one embodiment of a foam adhesive dispenser 10 attached to the electrically actuated foam density controller assembly 14. In one embodiment, the density of a foam adhesive output is dictated by the amount of nitrogen gas mixed with the hot melt adhesive.

[0041] As shown in Figures 4A, 4B, and 4C, the first housing, or manifold, 28 of the assembly 14 may be configured as an outer casing and may include an inlet port 34 capable of receiving melted adhesive material within the manifold and an outlet port (not shown) configured to dispense the adhesive and gas mixture (i.e., foam) from the assembly 14.

[0042] As shown in Figures 4B and 4C, the manifold 28 may also be configured to include a disc, or slug 36, and a spring 38, disposed within an internal chamber 40 of the manifold 28. The slug 36 may generally be capable of moving within the chamber 40 from a first position A, to a second position B, as molten the adhesive material is injected through inlet port 34. In one embodiment, the pressure of the injected adhesive causes the slug 36 to move between position A to position B, compressing and decompressing spring 38, depending on the amount of adhesive and pressure at which the adhesive enters the manifold 28.

[0043] Referring now to Figures 3-4D, the foam density controller portion 30 of the controller assembly 14 is configured to open and close a gas valve (not shown) within the assembly 14, facilitating the mixture of nitrogen gas. for example, with the adhesive disposed within the internal chamber 40 of the manifold 28. In one embodiment, the foam density controller portion 30 includes an elongated structure or adjustment rod 42 having an adjustment rod tip 44, disposed through a second housing 46 and an internal seal / insulator 48, as show n in Figures 7-9. In one embodiment, the proximal end of the second housing 46 is connected to the distal end of the manifold 28 and further includes an opening therethrough configured to allow the adjustment rod 42 to stably extend between and within the internal chamber 40 of the manifold 28 at its proximal end and through the distal end of the housing 46 at its distal end.

[0044] The density controller portion may also include a brass (or other suitable material) linear bearing 50 with a set of screws 51 and wire leads (not shown), which is affixed the distal end of the second housing 46. In one embodiment, the screw s 51 and wire leads are further configured to facilitate the opening and closing of the gas valve as the adjustment rod 42 contacts the slug 36 (as discussed, infra).

[0045] In one embodiment, the brass linear bearing 50 is further configured to attach to the second housing 46, while allowing the adjustment rod 42 to extend through an opening having an internal wall through the middle of the bearing 50. In one embodiment, the bearing 50 may also be configured to be fitted with an electrically conductive coil spring 52 that is designed to sit within a cut out in the internal wall of the linear bearing 50. As the adjustment rod 42 passes through the opening in the inner wall of the linear bearing 50, at least a portion of the rod 42 is configured to be in contact with the conductive spring 52, providing an enhanced electrical connection to the assembly 14.

[0046] The foam density controller portion 30 may be connected to the electrical actuator system 32 using a coupling structure 54. In one embodiment, the electrical actuator system 32 includes a motor 56, such as a stepper motor, a motor coupling 58, and a linear actuator 60. such as an electromechanical cylinder. In one embodiment, the coupling structure 54 includes a first coupling member 62, a second coupling member 64, and a coupling shaft 66 disposed therebetween. The first coupling member 62 may be an alignment coupling configured to attach a first end of the coupling shaft 66 to the linear actuator 60. In this embodiment, at least a portion of the linear actuator 60 extends through the alignment plate 26 (Figures 4 and 6) to attach to the first coupling member 62, stabilizing the electrical actuator system relative to the internal components 16 of the dispenser 10. The second coupling 64 may be a clevis pin coupling and be configured to attach a second end of the coupling shaft 66 to the elongated adjustment rod 42.

[0047] The motor 56 of the electrical actuator system 32 may be used to automate the movement of the adjustment rod 42 in a linear direction. The linear actuator 60 may be used to convert the rotational movement of the motor 56 to linear motion, thereby allowing a user to precisely control the movement of the adjustment rod 42. It should be appreciated thatthe linear actuator 60 may be an electromechanical or electropneumatic actuator. It should be appreciated that any suitable actuator maybe used to convert the rotary movement of the motor to the linear movement of the rod. The overall movement of the rod 42 may be about 40 mm, as the linear actuator extends and retracts. In one embodiment, the motor 56 and linear actuator 60 may be capable of moving the adjustment rod in increments of 0.1 mm, providing precision of movement and location to the system.

[0048] Referring again to Figures 4A-4C, the operator of the dispenser enters application parameters and target density reduction values into an interface of hardware controller 100a. In response, hardware controller 100a (e.g., a programmable logic controller (PLC)) then sets the required system pressure and pump speeds for the application. The hardware controller 100a then uses computer logic, a motor 56 (e.g., a stepper motor), and the linear actuator 60 (which is configured to move from a retracted to extended position) to micro adjust the position of adjustment rod 42 relative to the slug 36. When the tip 44 of the adjustment rod 42 contacts the slug 36 within the manifold (as shown in Figures 4B and 4C), an electrical circuit is completed and the gas valve is opened, allowing nitrogen gas to mix with the molten adhesive.

[0049] In one embodiment, the hardware controller 100a continuously adjusts the motor 56, linear actuator 60, and therefore the adjustment rod 42, to provide the desired amount of gas to the system. By continuously adjusting the flow and amount of gas within the system, the desired level of foam density (z.e., the desired density reduction of the adhesive) may be achieved. The assembly 14 may be operated by the PLC in a manual, hybrid, or fully automated mode, providing continuous feedback to the dispenser system.

[0050] It should be appreciated that both the pressure of the adhesive moving distally through the manifold against the slug and the position of the rod moving automatically in aproximal and distal direction, to contact the slug from the opposite side, according to the system parameters, dictates the ultimate movement of the rod within the assembly to precisely control the foam characteristics.

[0051] Figure 5 illustrates an example of a hardware / software implemented user interface (UI) 500a and 500b for initiating control of system 100 of figure 1, in accordance with some implementations. UI 500a is configured to enable input for controlling a glue melter apparatus using a mobile directional control valve (MDCV) to control a flow of gas into a density controller assembly. Likewise, UI 500b is configured to enable input for controlling linear actuator functionality (e.g., with respect to a manual mode, a hybrid mode, or an automated mode) to control a flow of gas into a density controller assembly.

[0052] Figure 6 illustrates an example of a hardware / software implemented user interface (UI) 600a and 600b for enabling manual control of system 100 of figure 1, in accordance with some implementations. UI 600a is configured to allow manual user input for enabling a process for manually controlling movement of a linear actuator to control gas flow based on a user specified linear actuator position. UI 600b is configured to allow a user to enter slug / linear actuator parameters via interface portion 605. For example, a user may manually enter a position such as 6.2 and system 100 may store that position such that when a temperature setpoint is reached, the linear actuator will automatically move to the entered position.

[0053] Figure 7 illustrates an example of a hardware / software implemented user interface (UI) 700a and 700b for enabling hybrid (i.e., manual / auto) mode control of system 100 of figure 1, in accordance with some implementations. UI 700a is configured to allow hybrid user input for enabling a process for automatically controlling movement of a linear actuator to control gas flow based on a position of a linear actuator specified in a model.Likewise, a real time density reduction process may be controlled by a proportional-integral- derivative (PID) controller / loop. For example, a target position and an actual position may be presented with a PID control value with respect to a gauge and trend chart. During a hybrid mode, a user is permitted to adjust an RPM value and a pressure setpoint. Likewise, during a hybrid mode, the system may enable precise density reduction control.

[0054] The hybrid mode is enabled via the following operation conditions: melter apparatus temperature is ready, pump is running, and pressure is stable. Likewise, the following sequence is executed during the hybrid mode:1.The linear actuator searches for its balance position (e.g., Density Valve On -> Off, or Off -> On position).2. When the balance position has been located, based on the model input, the system will calculate a real time density reduction value.

[0055] Figure 8 illustrates a graph 800 representing an exponential curve 804, such as a model, usable during a hybrid (and fully automatic) mode for enabling linear actuator movement, in accordance with some implementations. Exponential curve 804 may be determined via the following equation:

[0056] DR = DR_Max * (d / d_Max)A(l / n), where DR = Density Reduction (in real time); DR Max = Theoretical Max Density Reduction Value; d = Linear Actuator Travel Distance (in mm); d_Max = Linear Actuator Physical Limit (in mm); and n = Exponential factor. The value n may be determined by material type, temperature, mechanical character of the hot melt adhesive.

[0057] Figure 9 illustrates an example of a hardware / software implemented user interface (UI) 900a and 900b for enabling use of exponential curve 804 of figure 8 to enable hybrid mode control of system 100 of figure 1, in accordance with some implementations.UI 900a and 900b are configured to allow input for calculating density reduction (DR) via the equation as described with respect to figure 8, supra. For example, by default, an n value may be set to 1 because the system does not know all system factors and based on a current factor and a DR setpoint, the linear actuator searches for its balance position. Subsequently, an operator may obtain a cup weight and perform a calibration process enabling the system to calculate the n value to determine a final curve such as exponential curve 804 of figure 8. The aforementioned process allows the system to determine a true relationship between d and DR thereby enabling a real-time DR to be calculated.

[0058] Figure 10 illustrates a system diagram 1000 representing a process using a model 1008 during a hybrid (and fully automatic) mode for enabling linear actuator movement, in accordance with some implementations. The process accepts as input, a density reduction setpoint 1001 for input into a PID controller 1002 configured to generate a control signal 1003 for control of a gas valve 1004. The gas valve 1004 provides feedback to the system 1006 for control of a linear actuator position 1007 with respect to model 1008 thereby providing an actual density' reduction for the hot melt adhesive.

[0059] Figure 11 illustrates an example of a hardware / software implemented UI 1100a and 1100b for enabling automatic mode control of system 100 of figure 1, in accordance with some implementations. UI 1100a is configured to allow automated input control for enabling a process for automatically controlling movement of a linear actuator to control gas flow based on a position of a linear actuator specified in a model. UI 1100a and 1100b allow a real time density reduction to be presented and controlled by a PID loop. Likewise, a target position and an actual position may be presented in combination with a PID control value and associated trend chart. In this implementation, an RPM value and pressure setpoint are predefined such that a user is unable to modify them.

[0060] Figure 12 illustrates an example of a hardware / software implemented UI 1200a and 1200b for enabling a gas setup interface for use during automatic control of system 100 of figure 1, in accordance with some implementations. UI 1200a and 1200b allow a user to use a gas setup interface to create a working environment including application properties, adhesive properties, hose properties and nozzle properties. The working environment enables a linear actuator to dynamically locate a balance position, based on a model, such that the system will calculate a density reduction value and control the density reduction value based on a setpoint.

[0061] The automated mode is configured to calculate a density reduction (DR) via the following equations:1. P_reg = P_Noz + delta_P_Hose + delta_P_DCV + delta_P_Manifold2. r_SpringRatio * (d_f — d) / (A_fs - A_os) = P_Reg3. delta_P_n = K*Ln*Add_On*Viscosity / (eff * Density _sol*eff*DnA4)

[0062] In some implementations, the aforementioned equations may be combined as follows:

[0063] r_SpringRatio * (d_f - d) / (A_fs - A_os) = P_Noz + S(Kn*Ln / DnA4)*effA2, thereby providing an equation of d and eff as follows: f(d,eff) = 0; A*effA2 + B*eff +C = 0, thereby allowing an efficiency to be calculated followed by a density reduction calculation.

[0064] Figure 13 illustrates an example of a hardware / software implemented UI 1300 for enabling a key to line mode and fill system options for use during manual, hybrid, and automatic control modes of system 100 of figure 1, in accordance with some implementations. UI 1300 allows a user to use key to line mode to follow up a line speed via analog input and a fieldbus command. Likewise, UI 1300 allows a user to be used for the following fill system modes: bulk feed, bulk fill, or no fill.

[0065] Figure 14 illustrates an example of a hardware / software implemented UI 1400 for enabling heat scheduling options, in accordance with some implementations. UI 1400 allows a user to select a date and time enabling or disabling heater / standby mode.

[0066] Figure 15 illustrates an example of a control / feedback schematic 1500 for enabling hardware controller 100a of figure 1 to automatically create a specified mixture of hot melt adhesive and gas to create a foam substance having a specified density, in accordance with some implementations. Control / feedback schematic 1500 implements a PLC based control system 1502 to monitor pressure via components 1505 and 1509 and control a pump 1504 based on feedback 1507. Likewise, PLC based control system 1502 is configured to control a motor 1514 and density control valve 1512 and transmit a control signal to a gas valve configured to inject gas into the adhesive to achieve a desired foam ratio and volumetric flow rate for application via applicator 1516.

[0067] Figure 16A illustrates a manual mode process 1600 for enabling hardware controller 100a of figure 1 to allow a user to manually control a foam dispenser apparatus to create a specified mixture of hot melt adhesive and gas to create a foam substance having a specified density, in accordance with some implementations. Manual mode process 1600a allows user manual input to control a density' controller system comprising a two-stage pump, a variable speed motor, a variable flow gas valve, an automated density’ controller, a control panel, and a dispense applicator to achieve a desired density reduction. The manual process illustrated in figure 16A allows a user to manually enter a target position of a linear actuator, a pump speed of the two stage pump and a density' reduction setpoint to obtain a specified foam substance having a specified density reduction.

[0068] Figure 16B illustrates a hybrid mode process 1600b for enabling hardware controller 100a of figure 1 to allow hybrid control of a foam dispenser apparatus create aspecified mixture of hot melt adhesive and gas to create a foam substance having a specified density, in accordance with some implementations. Hybrid mode process 1600b allows hybrid control of a density controller to achieve a desired density reduction. The hybrid process illustrated in figure 16B automatically utilizes a target density reduction to control movement of a linear actuator to obtain a specified foam substance having a specified density reduction.

[0069] Figure 16C illustrates an automatic mode process 1600c for enabling hardware controller 100a of figure 1 to allow fully automated control of a foam dispenser apparatus create a specified mixture of hot melt adhesive and gas to create a foam substance having a specified density, in accordance with some implementations. Automatic mode process 1600b allows automatic control (without any user input) of a density controller to achieve a desired density reduction. The automatic process illustrated in figure 16C automatically utilizes a target density reduction to control movement of a linear actuator to obtain a specified foam substance having a specified density reduction.

[0070] Figure 17 is a flowchart representation of an exemplary method 1700 that enables automatic control of an actuator position with respect to a density controller for creating a mixture of adhesive and gas, in accordance with some implementations. In some implementations, the method 1700 is performed by a hardware controller with an interface, such as a controller, a PLC, server device, or any combination thereof. In some implementations, the method 1700 is performed by processing logic, including hardware, firmware, software, or a combination thereof. In some implementations, the method 1700 is performed by a processor executing code stored in a non-transitory computer-readable medium (e.g., a memory). Each of the blocks in the method 1700 may be enabled and executed in any order.

[0071] At block 1702, the method 1700 obtains input parameters associated with forming a foam substance that includes a specified mixture of adhesive and gas. In some implementations, the input parameters comprise a target position of an electrical actuator with respect to a density controller assembly. The density controller assembly may include a housing structure enclosing an elongated structure and a disc.

[0072] In some implementations, the electrical actuator comprises a motor and a linear actuator such that the target position of the electrical actuator comprises a target position of the linear actuator. In some implementations, the motor is a variable speed stepper motor.

[0073] In some implementations, the target position of the electrical actuator is obtained manually from a user via the interface. In some implementations, the target position of the electrical actuator is obtained from a control sequence such as a model.

[0074] In some implementations, the input parameters comprise parameters such as temperature, a foam pressure set point, an RPM value for the actuator, a gas pressure, a spring deflection value, a duty cycle, etc. In some implementations, the input parameters are obtained via the interface of the hardware controller.

[0075] At block 1704, the method 1700 moves (e.g., via the electrical actuator) the elongated structure in a first direction towards the disc until electrical contact between the elongated structure and the disc is detected. The electrical contact enables a flow of gas into the density controller assembly. In some implementations, moving the elongated structure in the first direction may enable a desired foam ratio and associated volumetric flow of the foam substance. In some implementations, a position or speed of the electrical actuator may be monitored or controlled.

[0076] At block 1706, the method 1700 in response to achieving the specified mixture of adhesive and gas, moves (e.g., via the electrical actuator) the elongated structure in a second direction away from the disc to disable electrical contact between the elongated structure and the disc to disable the flow of gas into the density controller assembly. In some implementations, a proportional-integral-derivative (PID) loop initiates and controls the movement in the first direction and the second direction.

[0077] In some implementations, a reversing contactor may be enabled to cause the electrical actuator to move the elongated member in the first direction and the second direction to achieve the specified mixture of adhesive and gas.

[0078] In some implementations, a current position of the electrical actuator may be detected by determining a travel distance of the electrical actuator based on the input parameters. In some implementations, enabling the flow of gas into the density controller assembly comprises activating a variable flow gas valve.

[0079] In some implementations, a temperature of the electrical actuator may be monitored and in response to the temperature exceeding a temperature value threshold, a fan apparatus may be activated to maintain an operating temperature of the electrical actuator.

[0080] Figure 18 illustrates a hardware device 1800 (e.g., a controller hardware device, a server hardware device, etc.) used by or comprised a system for improving software / hardware control technology associated with automatic control of an actuator position with respect to a density controller for creating a mixture of adhesive and gas, in accordance with some implementations.

[0081] Aspects of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software,micro-code, etc.) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit,” “module,” or “system.”

[0082] The present invention may be a system, a method, and / or a computer program product. The computer program product may include a computer readable storage medium (or media) having computer readable program instructions thereon for causing a processor to carry out aspects of the present invention.

[0083] The computer readable storage medium can be a tangible device that can retain and store instructions for use by an instruction execution device. The computer readable storage medium may be, for example, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. A non- exhaustive list of more specific examples of the computer readable storage medium includes the following: a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanically encoded device such as punch-cards or raised structures in a groove having instructions recorded thereon, and any suitable combination of the foregoing. A computer readable storage medium, as used herein, is not to be construed as being transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission media (e.g., light pulses passing through a fiber-optic cable), or electrical signals transmitted through a wire.

[0084] Computer readable program instructions described herein can be downloaded to respective computing / processing devices from a computer readable storage medium or to an external computer or external storage device via a network, for example, the Internet, a local area network, a wide area network and / or a wireless network. The network may comprise copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and / or edge servers. A network adapter card or network interface in each computing / processing apparatus receives computer readable program instructions from the network and forwards the computer readable program instructions for storage in a computer readable storage medium within the respective computing / processing device.

[0085] Computer readable program instructions for carrying out operations of the present invention may be assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state-setting data, or either source code or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C++, spark, R language, or the like, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The computer readable program instructions may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connectionmay be made to an external computer (for example, through the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, programmable logic circuitry, field-programmable gate arrays (FPGA), or programmable logic arrays (PLA) may execute the computer readable program instructions by utilizing state information of the computer readable program instructions to personalize the electronic circuitry, in order to perform aspects of the present invention.

[0086] Aspects of the present invention are described herein with reference to flowchart illustrations and / or block diagrams of methods, device (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer readable program instructions.

[0087] These computer readable program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing device, create means for implementing the functions / acts specified in the flowchart and / or block diagram block or blocks. These computer readable program instructions may also be stored in a computer readable storage medium that can direct a computer, a programmable data processing device, and / or other devices to function in a particular manner, such that the computer readable storage medium having instructions stored therein comprises an article of manufacture including instructions which implementaspects of the function / act specified in the flowchart and / or block diagram block or blocks.

[0088] The computer readable program instructions may also be loaded onto a computer, other programmable data processing device, or other device to cause a series of operational steps to be performed on the computer, other programmable device or other device to produce a computer implemented process, such that the instructions which execute on the computer, other programmable device, or other device implement the functions / acts specified in the flowchart and / or block diagram block or blocks.

[0089] The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the Figures. For example, two blocks shown in succession may, in fact, be accomplished as one step, executed concurrently, substantially concurrently, in a partially or wholly temporally overlapping manner, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and / or flowchart illustration, and combinations of blocks in the block diagrams and / or flowchart illustration, can be implemented by special purpose hardware- based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.

[0090] The hardware device 1800 illustrated in Fig. 18 includes a processor 1830, an input device / sensors 1807 coupled to the processor 1830, an output device 1806 coupled to the processor 1830, and memory devices 1802 and 1814 each coupled to the processor 1830. The input device / sensors 1807 may be, inter alia, a keyboard, a mouse, a camera, a touchscreen, any type of sensors, etc. The output device 1806 may be, inter alia, a printer, a plotter, a computer screen, a magnetic tape, a removable hard disk, a floppy disk, etc. The memory devices 1802 and 1814 may be, inter alia, a hard disk, a floppy disk, a magnetic tape, an optical storage such as a compact disc (CD) or a digital video disc (DVD), a dynamic random access memory (DRAM), a read-only memory (ROM), etc. The memory device 1814 includes a computer code 1896. The computer code 1896 includes algorithms (e.g., the algorithm of Figure 17) for improving software / hardware implemented controller technology associated with automatic control of an actuator position with respect to a density controller for creating a mixture of adhesive and gas. The processor 1830 executes the computer code 1896. The memory device 1802 includes input data 1897. The input data 1897 includes input required by the computer code 1896. The output device 1806 displays output from the computer code 1896. Either or both memory devices 1802 and 1814 (or one or more additional memory devices such as ROM device or firmware 1815) may include algorithms (e.g., the algorithm of Figure 17) and may be used as a computer usable medium (or a computer readable medium or a program storage device) having a computer readable program code embodied therein and / or having other data stored therein, wherein the computer readable program code includes the computer code 1896. Generally, a computer program product (or,alternatively, an article of manufacture) of the hardware device 1800 may include the computer usable medium (or the program storage device).

[0091] In some embodiments, rather than being stored and accessed from a hard drive, optical disc or other writeable, rewriteable, or removable hardware memory device 1814, stored computer program code 1896 (e.g., including algorithms) may be stored on a static, nonremovable, read-only storage medium such as a Read-Only Memory (ROM) device or firmware 1815, or may be accessed by processor 1830 directly from such a static, nonremovable, ROM device or firmware 1815. Similarly, in some embodiments, stored computer program code 1896 may be stored as computer-readable ROM device or firmware 1815, or may be accessed by processor 1830 directly from such ROM device or firmware 1815, rather than from a more dynamic or removable hardware memory device 1814, such as a hard drive or optical disc.

[0092] While Fig. 18 shows the hardware device 1800 as a particular configuration of hardware and software, any configuration of hardware and software, as would be known to a person of ordinary skill in the art, may be utilized for the purposes stated supra in conjunction with the particular hardware device 1800 of FIG. 18. For example, the memory devices 1802 and 1814 may be portions of a single memory device rather than separate memory devices.

[0093] This written description sets forth the best mode of carrying out the invention and describes the invention so as to enable a person of ordinary' skill in the art to make and use the invention, by presenting examples of the elements recited in the claims. The detailed descriptions of those elements do not impose limitations that are not recited in the claims, either literally or under the doctrine of equivalents.

Claims

What is claimed is:

1. A method comprising: at hardware controller having a processor and an interface: obtaining input parameters associated with forming a foam substance comprising a specified mixture of adhesive and gas, the input parameters comprising a target position of an electrical actuator with respect to a density controller assembly, the density controller assembly comprising a housing structure enclosing an elongated structure and a disc; moving the elongated structure in a first direction towards the disc until electrical contact between the elongated structure and the disc is detected, the electrical contact enabling a flow of gas into the density controller assembly; and in response to achieving the specified mixture of adhesive and gas, moving the elongated structure in a second direction away from the disc to disable electrical contact between the elongated structure and the disc to disable the flow of gas into the density controller assembly.

2. The method of claim 1, wherein the electrical actuator comprises a motor and a linear actuator, and wherein the target position of the electrical actuator comprises a target position of the linear actuator.

3. The method of claim 2, wherein the motor is a variable speed stepper motor.

4. The method of claim 1, wherein the target position of the electrical actuator is obtained manually from a user via the interface.

5. The method of claim 1, wherein the target position of the electrical actuator is obtained from a control sequence.

6. The method of claim 1, wherein a proportional-integral-derivative (PID) loop initiates and controls moving the elongated structure.

7. The method of claim 1, further comprising: activating a reversing contactor to enable the electrical actuator to move the elongated structure in the first direction and the second direction to achieve the specified mixture of adhesive and gas.

8. The method of claim 1, further comprising: detecting a current position of the electrical actuator by determining a travel distance of the electrical actuator based on the input parameters.

9. The method of claim 1, wherein moving the elongated structure in the first direction enables a desired foam ratio and associated volumetric flow of the foam substance.

10. The method of claim 1, further comprising: monitoring a position of the electrical actuator.

11. The method of claim 1, further comprising: monitoring a speed of the electrical actuator.

12. The method of claim 1, further comprising: based on the input parameters, controlling a speed of the electrical actuator.

13. The method of claim 1, wherein the input parameters comprise parameter selected from the group consisting of temperature, a foam pressure set point, anRPM value for the electrical actuator, a gas pressure, a spring deflection value, and a duty cycle.

14. The method of claim 1, wherein said enabling the flow of gas into the density controller assembly comprises activating a variable flow gas valve.

15. The method of claim 1 , wherein the input parameters are obtained via the interface of the hardware controller.

16. The method of claim 1, further comprising: monitoring a temperature of the electrical actuator; and in response to the temperature exceeding a temperature value threshold, activating a fan apparatus to maintain an operating temperature of the electrical actuator.

17. A hardware controller comprising: an interface; a non-transitory computer-readable storage medium; and one or more processors coupled to the non-transitory computer- readable storage medium, wherein the non-transitory computer-readable storage medium comprises program instructions that, when executed on the one or more processors, cause the hardware controller to perform operations comprising: obtaining input parameters associated with forming a foam substance comprising a specified mixture of adhesive and gas, the input parameters comprising a target position of an electrical actuator with respect to a density controller assembly, the density controller assembly comprising a housing structure enclosing an elongated structure and a disc;moving the elongated structure in a first direction towards the disc until electrical contact between the elongated structure and the disc is detected, the electrical contact enabling a flow of gas into the density’ controller assembly; and in response to achieving the specified mixture of adhesive and gas, moving the elongated structure in a second direction away from the disc to disable electrical contact between the elongated structure and the disc to disable the flow of gas into the density controller assembly.

18. The hardware controller of claim 17, wherein the target position of the electrical actuator is obtained manually from a user via the interface.

19. The hardware controller of claim 17, wherein the target position of the electrical actuator is obtained from a control sequence.

20. A non-transitory computer-readable storage medium storing program instructions executable via one or more processors to perform operations comprising: obtaining input parameters associated with forming a foam substance comprising a specified mixture of adhesive and gas, the input parameters comprising a target position of an electrical actuator with respect to a density’ controller assembly, the density7controller assembly comprising a housing structure enclosing an elongated structure and a disc; moving the elongated structure in a first direction towards the disc until electrical contact between the elongated structure and the disc is detected, the electrical contact enabling a flow of gas into the density controller assembly; andin response to achieving the specified mixture of adhesive and gas. moving the elongated structure in a second direction away from the disc to disable electrical contact between the elongated structure and the disc to disable the flow of gas into the density controller assembly.

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