Die-cutting circuit waste removal method and system, and die-cutting circuit board processing method and system

Abstract

Provided in the present application are a die-cutting circuit waste removal method and system, and a die-cutting circuit board processing method and system. The die-cutting circuit waste removal method comprises: providing a backing film (11), wherein an isolation layer (121) made of a release film (12) is provided on the backing film (11); attaching an electrically conductive film (14) onto the backing film (11); performing die cutting on the electrically conductive film (14), so as to form a circuit layer (141) to be retained and a waste layer (142) to be removed, wherein the shape of the isolation layer (121) corresponds to the shape of the waste layer (142), and the isolation layer (121) is located between the waste layer (142) and the backing film (11); using a waste removal adhesive tape (15) to adhere to the electrically conductive film (14) subjected to die cutting, tearing off the waste removal adhesive tape (15), so as to remove the waste layer (142), and retaining the circuit layer (141) on the backing film (11).

Description

Waste removal methods and systems for die-cut circuit boards, and processing methods and systems for die-cut circuit boards.

[0001] Cross-references

[0002] This application claims priority to Chinese Patent Application No. 202410686260.2, filed on May 29, 2024, entitled “Method and System for Waste Removal from Die-Cut Circuit Boards, and Method and System for Processing Die-Cut Circuit Boards”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of circuit board processing technology, and more specifically, it relates to a method for removing waste from die-cut circuits, a system for removing waste from die-cut circuits, a method for processing die-cut circuit boards, and a system for processing die-cut circuit boards. Background Technology

[0004] Energy conservation and emission reduction are key to the sustainable development of the automotive industry, and electric vehicles, due to their energy-saving and environmentally friendly advantages, have become an important part of the sustainable development of the automotive industry.

[0005] Flexible die-cut circuit board processing typically involves using a cutting tool to die-cut circuits onto copper foil on a substrate. Adhesive tape is then used to adhere the cut copper foil to remove excess copper and leave the die-cut circuitry on the substrate. However, during the removal of excess copper, the tape adheres to the circuitry, and tearing the tape can pull on the circuitry, potentially causing it to break.

[0006] Application content

[0007] The purpose of this application is to provide a method for removing waste from die-cut circuits, a system for removing waste from die-cut circuits, a method for processing die-cut circuit boards, and a system for processing die-cut circuit boards, so as to solve the problem that copper foil waste removal during the die-cut circuit board processing process can easily lead to circuit breakage.

[0008] In a first aspect, embodiments of this application provide a method for removing waste from die-cut circuits, including:

[0009] A backing film is provided, which has an isolation layer made of release film.

[0010] A conductive film is attached to the side of the backing film that has an isolation layer, with the isolation layer positioned between the conductive film and the backing film.

[0011] The conductive film is die-cut to form the circuit layer to be retained and the waste layer to be removed. The shape of the isolation layer corresponds to the shape of the waste layer, and the isolation layer is located between the waste layer and the backing film.

[0012] Use waste removal tape to bond the die-cut conductive film, then peel off the waste removal tape to remove the waste layer and leave the circuit layer on the backing film.

[0013] In the technical solution of this application embodiment, by setting an isolation layer made of release film on the base film, the shape of the isolation layer corresponds to the waste layer to be removed formed by the die-cut conductive film, and the isolation layer is located between the waste layer and the base film, so as to reduce the adhesive force between the waste layer and the base film. When the waste removal tape is torn off, the force required for the waste removal tape to peel the waste layer off the base film is less than the force required to peel the circuit layer off the base film, thereby facilitating the removal of the waste layer by the waste removal tape and reducing the risk of the waste removal tape breaking the circuit layer.

[0014] In some embodiments, the steps for fabricating the isolation layer are as follows:

[0015] Provide a base film, and set a release film on the base film;

[0016] The release film is die-cut to form an isolation layer and a waste pattern layer outside the isolation layer;

[0017] Use waste tape to bond the die-cut release film, and then remove the waste tape to remove the waste pattern layer and leave the release layer on the backing film.

[0018] Die-cutting the isolation layer onto the base film is convenient and facilitates the positioning of the isolation layer. This allows for more precise alignment between the isolation layer and the waste material layer to be removed during the die-cutting of the conductive film.

[0019] In some embodiments, the adhesion between the base film and the release film is greater than the adhesion between the waste removal tape and the release film.

[0020] By setting the adhesive strength between the waste removal tape and the release film to be relatively low, the risk of peeling the lines in the release layer off the backing film can be reduced during the process of pulling out the waste pattern layer, so that the release layer can be well retained on the backing film.

[0021] In some embodiments, the backing film, conductive film, and release film are all roll materials.

[0022] Using roll materials facilitates feeding, enables mass production, and improves efficiency.

[0023] In some embodiments, the adhesion between the insulating layer and the conductive film is less than the adhesion between the insulating layer and the backing film.

[0024] If the adhesion between the isolation layer and the conductive film is less than that between the isolation layer and the backing film, then after die-cutting, the adhesion force per unit area between the waste layer and the isolation layer will be less than that between the circuit layer and the backing film, so that the waste layer can be removed by the waste tape, while the circuit layer is retained on the backing film.

[0025] In some embodiments, the insulating layer is not adhesive at least on the side closest to the conductive film.

[0026] By making the side of the isolation layer closest to the conductive film non-adhesive, the connection strength between the isolation layer and the waste layer can be further reduced, so that the waste removal tape can remove the waste layer.

[0027] In some embodiments, the adhesion between the base film and the conductive film is greater than that between the waste discharge tape and the conductive film.

[0028] By setting the adhesion between the waste removal tape and the conductive film to a low level, the risk of peeling the lines in the circuit layer off the backing film can be reduced during the process of pulling out the waste layer, so that the circuit layer can be well retained on the backing film.

[0029] In some embodiments, the adhesion between the base film and the conductive film ranges from 200gf to 400gf, and the adhesion between the waste discharge tape and the conductive film ranges from 100gf to 150gf.

[0030] The adhesion between the backing film and the conductive film is set to 200gf-400gf, and the adhesion between the waste removal tape and the conductive film is set to 100gf-150gf. This ensures that the backing film can adhere to the circuit layer while the waste removal tape can effectively pull the waste layer out, thereby reducing the risk of line displacement or peeling of the backing film in the circuit layer.

[0031] In some embodiments, the thickness of the insulating layer is greater than or equal to the thickness of the conductive film.

[0032] By setting the thickness of the isolation layer to be greater than that of the conductive film, the isolation layer can lift up the waste layer after the conductive film is die-cut. This not only facilitates the adhesion of the waste removal tape to remove the waste layer, but also reduces the contact area between the waste removal tape and the circuit layer, thereby reducing the risk of the waste removal tape pulling the lines in the circuit layer to shift or peeling off the backing film.

[0033] In some embodiments, the thickness of the isolation layer is 2-3 times the thickness of the conductive film.

[0034] The thickness of the aforementioned isolation layer, while facilitating its processing and fabrication, allows for the effective ejection of the waste layer, thus enabling its removal.

[0035] In some embodiments, the difference between the width of each line in the isolation layer and the corresponding line width in the waste layer ranges from -0.1 mm to 0.1 mm.

[0036] The width difference between the corresponding positions of the isolation layer and the waste layer is set to a range of -0.1mm to 0.1mm. This allows the isolation layer to push out of the waste layer, making it easier for the waste layer to bond with the waste removal tape. It also reduces the bonding area between the waste removal tape and the circuit layer. As a result, during the process of removing the waste removal tape, it is not only easier to peel off and remove the waste layer, but also reduces the risk of the waste removal tape pulling the lines in the circuit layer to shift or peeling off the backing film.

[0037] In some embodiments, the difference between the width of each line in the isolation layer and the width of the corresponding line in the waste layer is greater than 0 and less than or equal to 0.1 mm.

[0038] The width difference between the corresponding positions of the isolation layer and the waste layer should be greater than 0 and less than or equal to 0.1 mm, so that the isolation layer can better push out of the waste layer, making it easier for the waste layer to adhere to the waste discharge tape and be pulled off by the waste discharge tape.

[0039] In some embodiments, the conductive film includes one of copper foil, aluminum foil, gold foil, and silver foil.

[0040] The conductive film uses one of copper foil, aluminum foil, gold foil, and silver foil. It has a simple structure and can be configured as needed.

[0041] Secondly, embodiments of this application provide a method for processing die-cut circuit boards, including the waste removal method for die-cut circuit boards as described in the above embodiments.

[0042] Thirdly, embodiments of this application provide a waste removal system for die-cut circuit boards, including:

[0043] A bonding device for bonding a conductive film onto the side of a base film that has an isolation layer made of release film;

[0044] The first die-cutting device is used to die-cut the conductive film to form the circuit layer to be retained and the waste layer to be removed, and to make the shape of the isolation layer correspond to the shape of the waste layer, and the isolation layer is located between the waste layer and the backing film.

[0045] The waste removal device is used to drive the waste removal tape through the die-cut conductive film to remove the waste layer and retain the circuit layer on the bottom film.

[0046] In the technical solution of this application embodiment, a base film with an isolation layer is used, and a conductive film is bonded to the side of the base film with the isolation layer using a bonding device. The conductive film is die-cut into a circuit layer and a waste layer using a first die-cutting device, and a waste removal device is used to drive a waste removal tape to remove the waste layer. This facilitates the removal of the waste layer by the waste removal tape, reduces the risk of the waste removal tape breaking the circuit layer, and allows for mass production.

[0047] In some embodiments, the die-cut circuit waste removal system further includes:

[0048] The second die-cutting device is used to die-cut the release film on the base film to form an isolation layer and a waste pattern layer outside the isolation layer;

[0049] The waste removal device is used to drive the waste removal tape through the die-cut release film to remove the waste pattern layer and retain the isolation layer on the base film.

[0050] Using a second die-cutting device and a waste removal device, the isolation layer is directly made on the base film, which is convenient for processing and manufacturing, and also facilitates the positioning of the isolation layer. In the process of die-cutting the conductive film, it is easier for the isolation layer and the waste layer to be more accurately aligned, resulting in higher efficiency and precision.

[0051] In some embodiments, the die-cutting line waste removal system further includes a conveyor line for conveying the base film, and the second die-cutting device, the waste removal device, the laminating device, the first die-cutting device, and the waste removal device are arranged sequentially along the conveying direction of the conveyor line.

[0052] A conveyor line is set up to transport the base film, which facilitates the subsequent production of the die-cutting line.

[0053] In some embodiments, the backing film is a roll, and the conveyor line includes a plurality of support rollers for supporting the backing film and conveyor rollers that cooperate with the support rollers to clamp and convey the backing film.

[0054] The system uses support rollers and conveyor rollers to transport the bottom film, resulting in a simple structure that facilitates the transport of relatively long bottom films.

[0055] In some embodiments, the second die-cutting apparatus includes a roller die for rolling die-cutting the release film.

[0056] The second die-cutting device uses a roller die, which can conveniently and continuously die-cut the release film, with high efficiency and high processing accuracy.

[0057] In some embodiments, the waste removal tape is a roll, and the waste removal device includes a feeding shaft for supporting and releasing the waste removal tape, a pressing roller for pushing the waste removal tape against the release film, and a receiving shaft for pulling the waste removal tape away from the backing film.

[0058] During the conveying process of the waste removal tape, the tape passes around the pressing roller and is pressed onto the release film by the pressing roller, thus bonding with the release film. As the tape moves, it is torn off from the release film, thereby peeling off and removing the waste pattern layer. The structure is simple, easy to process continuously, and highly efficient.

[0059] In some embodiments, the bonding device includes a bonding roller for pushing a conductive film against a backing film.

[0060] The conductive film is bonded using a bonding roller, which has a simple structure and is easy to produce in continuous batches.

[0061] In some embodiments, the first die-cutting apparatus includes a rolling die for rolling die-cutting the conductive film.

[0062] The first die-cutting device uses a rolling die, which can conveniently and continuously die-cut the conductive film, resulting in high efficiency and high processing accuracy.

[0063] In some embodiments, the waste discharge tape is a roll material, and the waste discharge device includes a feeding roller for supporting and releasing the waste discharge tape, a pressing roller for pushing the waste discharge tape against the conductive film, and a taking-up roller for pulling the waste discharge tape away from the backing film.

[0064] During the waste discharge conveyor belt process, the waste discharge conveyor belt is made to bypass the pressure roller and be pressed onto the conductive film by the pressure roller, thus adhering to the conductive film. As the waste discharge conveyor belt moves, it is torn off from the conductive film, thereby peeling off and discharging the waste layer. The structure is simple, easy to process continuously, and highly efficient.

[0065] Fourthly, embodiments of this application provide a die-cutting circuit board processing system, including the die-cutting circuit waste removal system as described in the above embodiments.

[0066] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0067] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0068] Figure 1 is a flowchart of a waste removal method for die-cut circuits according to some embodiments of this application;

[0069] Figure 2 is a flowchart of a waste removal method for die-cut circuits according to some other embodiments of this application;

[0070] Figure 3 is a schematic diagram of the processing process of the die-cutting circuit waste removal system according to some embodiments of this application;

[0071] Figure 4 is a schematic diagram of the structure of waste discharge tape attached to the conductive film according to some embodiments of this application.

[0072] The main markings in the attached figures are as follows:

[0073] 11-Backing film; 12-Release film; 121-Isolation layer; 122-Waste pattern layer; 13-Waste removal tape; 14-Conductive film; 141-Circuit layer; 142-Waste layer; 15-Waste discharge tape;

[0074] 21-Conveyor line; 211-Support roller; 212-Conveyor roller; 22-Laminating device; 221-Laminating roller; 23-First die-cutting device; 231-Rolling die; 24-Waste removal device; 241-Pressure roller; 242-Feeding roller; 243-Receiving roller; 25-Second die-cutting device; 251-Rolling die; 26-Waste removal device; 261-Pressure roller; 262-Feeding shaft; 263-Receiving shaft. Embodiments of the present invention

[0075] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0076] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0077] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0078] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments in any suitable manner.

[0079] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0080] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces). "Several" means one or more, unless otherwise explicitly specified.

[0081] In the description of the embodiments of this application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0082] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0083] In the description of the embodiments of this application, unless otherwise expressly specified and limited, when an element is referred to as "fixed to" or "set on" another element, it may be directly on or indirectly on the other element. When an element is referred to as "connected to" another element, it may be directly connected to or indirectly connected to the other element.

[0084] In the description of the embodiments in this application, unless otherwise expressly specified and limited, the technical term "proximity" refers to being close in location. For example, among three components A1, A2, and B, the distance between A1 and B is greater than the distance between A2 and B. Therefore, A2 is closer to B than A1, meaning A2 is adjacent to B, or B is adjacent to A2. Similarly, when there are multiple components C, namely C1, C2, ..., C... N If one of the C components, such as C2, is closer to the B component than the other C components, then B is adjacent to C2, or C2 is adjacent to B.

[0085] The English names of the embodiments in this application are explained as follows:

[0086] CCS: Cells Contact System, integrated busbar;

[0087] PCB: Printed Circuit Board;

[0088] FPC: Flexible Printed Circuit.

[0089] FFC: Flexible Flat Cable;

[0090] FDC: Flexible Die-cutting Circuit;

[0091] PET: polyethylene glycol terephthalate;

[0092] PP: Polypropylene;

[0093] PE: Polyethylene.

[0094] CCS is the electrical connection structure inside the battery, mainly composed of signal acquisition components, plastic structural components, copper and aluminum busbars, etc. It is connected into a whole through processes such as hot pressing or riveting, and installed inside the battery to realize high voltage series and parallel connection of battery cells, as well as battery temperature sampling, battery cell voltage sampling functions, and overcurrent fuse functions. It provides temperature and voltage to the battery management system through FPC / PCB and connector components.

[0095] In the early stages of the CCS industry, the main products were injection-molded tray wire harness sampling CCS. With continuous innovation in battery structure, the signal acquisition components and integration processes of CCS have also been developing. Currently, CCS signal acquisition components include wire harnesses, PCBs, FPCs, FFCs, and FDCs, while integration processes include injection-molded brackets, vacuum forming plates, hot pressing, and die cutting, resulting in a situation where multiple technical routes are developing in parallel.

[0096] Flexible die-cut circuit boards (FDCs) are highly reliable, flexible circuits made from polyimide or polyester film as the substrate through a die-cutting process. They are characterized by their ability to be freely bent, folded, and rolled, and to move and stretch freely in three-dimensional space. Compared to FPCs, FDCs have fewer processing steps, are environmentally friendly due to their die-cutting process, have shorter processing cycles, and are more efficient, effectively saving on product manufacturing costs.

[0097] FDC (Flexible Die-Cut Circuit) typically involves using a cutting tool to die-cut circuitry onto copper foil on a substrate. Adhesive tape is then used to adhere the cut copper foil, removing any excess copper foil and leaving only the die-cut circuitry on the substrate to form a flexible die-cut circuit board. However, because the tape adheres to the copper foil corresponding to the circuitry, removing the tape to remove excess copper foil can pull on the circuitry, potentially causing breakage.

[0098] Based on the above considerations, in order to solve the problem that copper foil waste removal during die-cut circuit board processing can easily lead to circuit breakage, this application provides a method for waste removal in die-cut circuits. By setting an isolation layer made of release film on the base film, the shape of the isolation layer corresponds to the waste layer to be removed formed by the die-cut conductive film, and the isolation layer is located between the waste layer and the base film. This reduces the adhesive force between the waste layer and the base film. When the waste removal tape is removed, the force required for the waste removal tape to peel the waste layer from the base film is less than the force required to peel the circuit layer from the base film, thus facilitating the removal of the waste layer and reducing the risk of the waste removal tape breaking the circuit layer.

[0099] The waste removal method for die-cut circuits in this application embodiment can be applied to the waste removal of conductive circuits in flexible die-cut circuit boards, and can also be applied to the processing and manufacturing of flexible die-cut circuit boards. Of course, it can also be applied to the processing and manufacturing of other die-cut circuit boards, such as the processing and manufacturing of rigid die-cut circuit boards.

[0100] Please refer to Figures 1, 3, and 4. According to some embodiments of this application, this application provides a method for removing waste from die-cut circuits, including:

[0101] S1. A bottom support film 11 is provided, and an isolation layer 121 made of release film 12 is provided on the bottom support film 11;

[0102] S2. A conductive film 14 is attached to the side of the base film 11 where the isolation layer 121 is provided, and the isolation layer 121 is located between the conductive film 14 and the base film 11.

[0103] S3. The conductive film 14 is die-cut to form a circuit layer 141 to be retained and a waste layer 142 to be removed. The shape of the isolation layer 121 corresponds to the shape of the waste layer 142, and the isolation layer 121 is located between the waste layer 142 and the base film 11.

[0104] S4. Use waste removal tape 15 to bond the die-cut conductive film 14, and then remove the waste removal tape 15 to remove the waste layer 142, while leaving the circuit layer 141 on the backing film 11.

[0105] Die-cutting is a process that uses a pre-designed die to cut corresponding shapes and patterns onto a sheet or film. Die-cutting allows printed materials or other paper products to be cut into shapes using a die-cutting plate, thus freeing the printed materials from being limited to straight edges and right angles.

[0106] The backing film 11 refers to the membrane structure used to support structural layers such as the insulating layer 121 and the conductive film 14. The backing film 11 can be a film made of PET material, PP material, etc., or it can be a film made of other insulating materials such as plastic. The backing film 11 is adhesive so that the conductive film 14 and the insulating layer 121 can be bonded and fixed. For example, an adhesive layer can be provided on the backing film 11, or the backing film 11 can be made of an adhesive material.

[0107] The conductive film 14 refers to a film structure with conductive properties. The conductive film 14 can be a metal film or a film made of other conductive materials. The conductive film 14 is set on the base film 11. After the conductive film 14 is die-cut, the circuit layer 141 of the circuit board to be manufactured and the waste material layer 142 to be discarded outside the circuit layer 141 can be formed on the base film 11. That is to say, the circuit layer 141 and the waste material layer 142 are both conductive patterns formed by die-cutting the conductive film 14.

[0108] Release film 12 refers to a film with a distinguishable surface. When in contact with specific materials under limited conditions, release film 12 exhibits no adhesion or only slight adhesion. For example, release film 12 may have significant adhesion to the backing film 11, while it may have little or no adhesion to the conductive film 14. Alternatively, release film 12 may also have little or no adhesion to the backing film 11, and little or no adhesion to the conductive film 14. Release film 12 is also known as peel film, release film, separation film, adhesive barrier film, release membrane, film, plastic film, masking film, silicone film, silicone paper, anti-stick film, template paper, slip film, thinner paper, release paper, silicone film, and non-woven film.

[0109] The release layer 121 is a layer made using release film 12, whose shape corresponds to the waste layer 142, and is located between the waste layer 142 and the backing film 11, serving as an intermediate layer separating the waste layer 142 from the backing film 11. The release layer 121 can be a structural layer made of PET material, PP material, etc., or a film layer made of other insulating materials such as plastic. Since the release layer 121 is made using release film 12, there can be minimal adhesion between the release layer 121 and the conductive film 14, or no adhesion at all. This ensures that after die-cutting, the release layer 121 is located between the waste layer 142 and the backing film 11, allowing for minimal adhesion or no adhesion between the release layer 121 and the waste layer 142, making it easy for the waste removal tape 15 to remove the waste layer 142.

[0110] Waste removal tape 15 refers to an adhesive tape. The waste removal tape 15 is applied to the die-cut conductive film 14 and then removed to remove the waste layer 142, while the circuit layer 141 is retained on the base film 11 for later fabrication as circuits in the die-cut circuit board.

[0111] S1. A bottom support film 11 is provided, and the bottom support film 11 is provided with an isolation layer 121 made of release film 12.

[0112] A base film 11 is provided as a substrate to carry and support the conductive film 14 during the die-cutting process. The raised base film 11 can be a roll or a flattened sheet. The base film 11 can be raised manually or transported and raised using a conveyor line 21. An isolation layer 121 is provided on the base film 11. The isolation layer 121 is made of release film 12 so that after the conductive film 14 is die-cut, the isolation layer 121 can separate the waste layer 142 from the base film 11. The isolation layer 121 can be directly formed on the base film 11, such as by spraying or printing. Of course, the isolation layer 121 can also be made separately and then laminated onto the base film 11.

[0113] S2. A conductive film 14 is attached to the side of the base film 11 where the isolation layer 121 is provided, and the isolation layer 121 is located between the conductive film 14 and the base film 11.

[0114] The conductive film 14 can be bonded to the base film 11 using the bonding device 22. The conductive film 14 can be a roll or a flattened sheet. Bonding the conductive film 14 to the base film 11 allows the base film 11 to support the conductive film 14, facilitating die-cutting to create a circuit layer 141 and a waste layer 142. An insulating layer 121 is positioned between the conductive film 14 and the base film 11 to separate the waste layer 142 from the base film 11 after die-cutting.

[0115] S3. The conductive film 14 is die-cut to form a circuit layer 141 to be retained and a waste layer 142 to be removed. The shape of the isolation layer 121 corresponds to the shape of the waste layer 142, and the isolation layer 121 is located between the waste layer 142 and the base film 11.

[0116] The conductive film 14 can be die-cut using the first die-cutting device 23, thereby forming a circuit layer 141 and a waste layer 142. Die-cutting the conductive film 14 into circuit layer 141 and waste layer 142 is convenient and produces a consistent circuit layer 141. The shape of the isolation layer 121 corresponds to the shape of the waste layer 142, and the isolation layer 121 is located between the waste layer 142 and the base film 11. Therefore, after die-cutting, the isolation layer 121 not only separates the waste layer 142 from the base film 11, reducing the adhesion between them, but also lifts the waste layer 142. This allows the waste removal tape 15 to adhere more tightly to the waste layer 142 when used for waste removal, facilitating the removal of the waste layer 142 by the tape.

[0117] S4. Use waste removal tape 15 to bond the die-cut conductive film 14, and then remove the waste removal tape 15 to remove the waste layer 142, while leaving the circuit layer 141 on the backing film 11.

[0118] The waste layer 142 can be removed by driving the waste removal tape 15 using the waste removal device 24. The waste removal tape 15 can be in rolls or in sheets. The waste removal tape 15 is bonded to the die-cut conductive film 14. Since the isolation layer 121 can lift the waste layer 142, the bonding between the waste removal tape 15 and the waste layer 142 is tighter than that between the circuit layer 141. Furthermore, the isolation layer 121 separates the waste layer 142 from the backing film 11, reducing the adhesion between the waste layer 142 and the backing film 11. This makes it easier to peel off the waste layer 142 when removing the waste removal tape 15 and reduces the pulling on the circuit layer 141, thus better preserving the circuit layer 141 on the backing film 11 and reducing the risk of displacement or breakage of the circuit layer 141.

[0119] In the technical solution of this application embodiment, by providing an isolation layer 121 on the base film 11, the isolation layer 121 is made of release film 12, so that the shape of the isolation layer 121 corresponds to the waste layer 142 to be removed formed by the die-cut conductive film 14, and the isolation layer 121 is located between the waste layer 142 and the base film 11, so as to reduce the adhesive force between the waste layer 142 and the base film 11. When the waste removal tape 15 is torn off, the force required for the waste removal tape 15 to peel the waste layer 142 off the base film 11 will be less than the force required to peel the circuit layer 141 off the base film 11, thereby facilitating the removal of the waste layer 142 by the waste removal tape 15 and reducing the risk of the waste removal tape breaking the circuit layer 141.

[0120] Please refer to Figures 1 to 4. In some embodiments, the steps for fabricating the isolation layer 121 are as follows:

[0121] S11. Provide a base film 11, and set a release film 12 on the base film 11;

[0122] S12, Die-cut the release film 12 to form an isolation layer 121 and a waste pattern layer 122 outside the isolation layer 121;

[0123] S13. Use waste tape 13 to bond the die-cut release film 12, and tear off the waste tape 13 to remove the waste pattern layer 122, and retain the isolation layer 121 on the base film 11.

[0124] Waste removal tape 13 refers to an adhesive tape. The waste removal tape 13 is applied to the die-cut release film 12, and then the waste tape 13 is removed to remove the waste pattern layer 122, while the release layer 121 is retained on the backing film 11.

[0125] S11. Provide a base film 11, and set a release film 12 on the base film 11.

[0126] The release film 12 can be manufactured together with the base film 11 as raw material. Alternatively, the release film 12 can be adhered to the base film 11 using a film-applying device. The release film 12 can be a roll or a sheet. The release film 12 is placed on the raised base film 11 to allow for die-cutting of the release layer 121.

[0127] S12, Die-cut the release film 12 to form an isolation layer 121 and a waste pattern layer 122 outside the isolation layer 121.

[0128] The release film 12 can be die-cut using a second die-cutting device 25, thereby forming an isolation layer 121 and a waste pattern layer 122 on the release film 12. After die-cutting the release film 12, the isolation layer 121 to be made and the waste pattern layer 122 to be removed outside the isolation layer 121 can be formed on the base film 11. That is to say, both the isolation layer 121 and the waste pattern layer 122 are patterns formed after the release film 12 is die-cut.

[0129] The release film 12 is cut into an isolation layer 121 and a waste pattern layer 122 by die cutting, which is convenient to process and the isolation layer 121 has good consistency.

[0130] S13. Use waste tape 13 to bond the die-cut release film 12, and remove the waste tape 13 to remove the waste pattern layer 122, and retain the isolation layer 121 on the base film 11.

[0131] The waste removal device 26 can be used to drive the waste removal tape 13 to remove the waste pattern layer 122. The waste removal tape 13 can be in rolls or in sheets. When the waste removal tape 13 is adhered to the die-cut release film 12, the waste removal tape 13 can pull the waste pattern layer 122 off from the backing film 11 during the process of tearing off the waste removal tape 13, thus forming the release layer 121.

[0132] Since the waste tape 13 is bonded to both the isolation layer 121 and the waste pattern layer 122, the backing film 11 and the waste pattern layer 122 can be bent during the process of removing the waste tape 13, making it easier for the waste pattern layer 122 to peel off from the backing film 11.

[0133] The isolation layer 121 is die-cut on the base film 11, which is convenient for processing. In particular, during die-cutting, it is only necessary to keep the base film 11 moving stably. After die-cutting the isolation layer 121 on the base film 11, the conductive film 14 can be die-cut in the same position to align the waste layer 142 with the isolation layer 121, so that the isolation layer 121 and the waste layer 142 to be removed are more precisely aligned.

[0134] Please refer to Figures 2 to 4. In some embodiments, the adhesion between the base film 11 and the release film 12 is greater than that between the waste removal tape 13 and the release film 12.

[0135] Adhesion also refers to the viscous force per unit area of ​​an object. The adhesion between two objects refers to the bonding, adhesive, or viscous force per unit area, typically one square millimeter. Viscous force refers to the adsorption or attraction between the surfaces of objects, causing them to stick together tightly. The magnitude of the viscous force depends on the properties of the object surfaces and the contact area between them.

[0136] Setting the adhesion between the waste removal tape 13 and the release film 12 to be less than that between the base film 11 and the release film 12 allows the base film 11 to better adhere and fix the release layer 121. This reduces the risk of peeling the lines in the release layer 121 off the base film 11 during the process of pulling and removing the waste pattern layer 122, ensuring the release layer 121 remains well on the base film 11. After die-cutting, a cut is formed on the release film 12 corresponding to the waste pattern layer 122. The waste removal tape 13 adheres to the waste pattern layer 122, and pulling the tape 13 makes it easy to peel the waste pattern layer 122 off the base film 11 from the cut. In particular, the ends of the lines in the waste pattern layer 122 can be bent on the base film 11, causing the ends of the lines in the waste pattern layer 122 to curl up and be adhered and peeled off by the waste removal tape 13. Of course, the adhesion of the waste pattern layer 122 on the release film 12 can be set to be smaller, or the waste pattern layer 122 on the release film 12 can be set to be non-adhesive or have a smaller adhesion to the backing film 11, so that the waste removal tape 13 can peel off and remove the waste pattern layer 122.

[0137] Please refer to Figures 2 to 4. In some embodiments, the base film 11, the conductive film 14, and the release film 12 are all roll materials.

[0138] Roll material refers to material that is continuously rolled up. The backing film 11, conductive film 14, and release film 12 are all roll materials, which means that the incoming material of the backing film 11, conductive film 14, and release film 12 is a roll material. That is, the initial state of the backing film 11, conductive film 14, and release film 12 is a roll material. Therefore, the backing film 11 is continuously rolled up, the conductive film 14 is continuously rolled up, and the release film 12 is also continuously rolled up.

[0139] Using roll materials facilitates feeding, enables mass production, and improves efficiency.

[0140] Please refer to Figures 2 to 4. In some embodiments, the adhesion between the isolation layer 121 and the conductive film 14 is less than the adhesion between the isolation layer 121 and the base film 11.

[0141] The adhesive force per unit area between the isolation layer 121 and the conductive film 14 also refers to the adhesion between the isolation layer 121 and the conductive film 14.

[0142] The adhesive force per unit area between the isolation layer 121 and the base film 11 refers to the adhesion between the isolation layer 121 and the base film 11.

[0143] If the adhesion between the isolation layer 121 and the conductive film 14 is less than that between the isolation layer 121 and the base film 11, then after die-cutting, the adhesive force per unit area between the waste layer 142 and the isolation layer 121 will be less than the adhesive force per unit area between the circuit layer 141 and the base film 11, so that the waste tape 15 can remove the waste layer 142, while the circuit layer 141 is retained on the base film 11.

[0144] Please refer to Figures 2 to 4. In some embodiments, the insulating layer 121 is not adhesive at least on the side closest to the conductive film 14.

[0145] The statement that the insulating layer 121 is not sticky at least on the side closest to the conductive film 14 means that the insulating layer 121 is not sticky on the side closest to the conductive film 14, or that the two opposite sides of the insulating layer 121 are not sticky.

[0146] By making the side of the isolation layer 121 close to the conductive film 14 non-adhesive, the connection strength between the isolation layer 121 and the waste layer 142 can be further reduced, so that the waste removal tape 15 can remove the waste layer 142.

[0147] Please refer to Figures 2 to 4. In some embodiments, the adhesion between the bottom support film 11 and the conductive film 14 is greater than that between the waste discharge tape 15 and the conductive film 14.

[0148] The adhesion between the waste discharge tape 15 and the conductive film 14 is set to be less than that between the base film 11 and the conductive film 14. Since the circuit layer 141 is die-cut from the conductive film 14, the base film 11 can better adhere and fix the circuit layer 141. During the process of pulling and discharging the waste layer 142, the risk of peeling the lines in the circuit layer 141 off the base film 11 can be reduced, so that the circuit layer 141 is well retained on the base film 11.

[0149] Please refer to Figures 2 to 4. In some embodiments, the adhesion between the base film 11 and the conductive film 14 is in the range of 200gf-400gf, and the adhesion between the waste discharge tape 15 and the conductive film 14 is in the range of 100gf-150gf.

[0150] A gram force represents the gravitational force acting on an object weighing one gram. From G = mg, where G is gravity, m is mass, and g is the acceleration due to gravity, g ≈ 9.8 N / kg, so 1000 gram force (gf) ≈ 9.81 Newtons (N), that is, 1000gf ≈ 9.81 N. Therefore, 1 Newton ≈ 102 gram force, that is, 1 N ≈ 102gf.

[0151] The adhesive strength between the backing film 11 and the conductive film 14 ranges from 200gf to 400gf, meaning the adhesive force per unit area between the backing film 11 and the conductive film 14 ranges from 200gf to 400gf. For example, the adhesive forces per unit area between the backing film 11 and the conductive film 14 could be 200gf, 210gf, 220gf, 230gf, 240gf, 250gf, 260gf, 270gf, and 280gf. The film is coated with various gf values, including 290gf, 300gf, 310gf, 320gf, 330gf, 340gf, 350gf, 360gf, 370gf, 380gf, 390gf, and 400gf, to ensure good adhesion of the backing film 11, thereby securing the isolation layer 121 to the circuit layer 141. Furthermore, it allows for the effective removal of any waste material layer 142 adhered to the backing film 11. Unit area refers to one square millimeter.

[0152] The adhesive strength between the waste removal tape 15 and the conductive film 14 is 100gf-150gf, meaning the adhesive force per unit area between the waste removal tape 15 and the conductive film 14 is 100gf-150gf. For example, the adhesive force per unit area between the waste removal tape 15 and the conductive film 14 can be 100gf, 105gf, 110gf, 115gf, 120gf, 125gf, 130gf, 135gf, 140gf, 145gf, 150gf, etc., so that the waste removal tape 15 can reduce the pulling force on the circuit layer 141 while still being able to peel off and remove the waste layer 142.

[0153] The adhesion between the backing film 11 and the conductive film 14 is set to 200gf-400gf, and the adhesion between the waste removal tape 15 and the conductive film 14 is set to 100gf-150gf. This allows the backing film 11 to adhere to the circuit layer 141 while the waste removal tape 15 can effectively pull the waste layer 142 out, thereby reducing the risk of line displacement or peeling of the backing film 11 in the circuit layer 141.

[0154] Please refer to Figures 2 to 4. In some embodiments, the thickness h2 of the isolation layer 121 is greater than or equal to the thickness h1 of the conductive film 14.

[0155] The thickness h2 of the isolation layer 121 is set to be greater than the thickness h1 of the conductive film 14. After the conductive film 14 is die-cut, the isolation layer 121 can lift the waste layer 142, which not only facilitates the bonding of the waste removal tape 15 to remove the waste layer 142, but also reduces the contact area between the waste removal tape 15 and the circuit layer 141, thereby reducing the risk of the waste removal tape 15 pulling the lines in the circuit layer 141 to shift or peel off the backing film 11.

[0156] In addition, setting the thickness h2 of the isolation layer 121 to be greater than the thickness h1 of the conductive film 14 can also make the hardness of the isolation layer 121 greater. In particular, the isolation layer 121 is made by die-cutting the release film 12, which can facilitate the removal of the waste pattern layer 122 by the waste tape 13.

[0157] Please refer to Figures 2 to 4. In some embodiments, the thickness h2 of the isolation layer 121 is 2-3 times the thickness h2 of the conductive film 14. For example, the thickness h2 of the isolation layer 121 can be 2 times, 2.5 times, or 3 times the thickness h1 of the conductive film 14. This setting of the thickness h2 of the isolation layer 121 facilitates the processing and fabrication of the isolation layer 121 and allows for the proper ejection of the waste layer 142, thus enabling the removal of the waste layer 142.

[0158] Please refer to Figures 2 to 4. In some embodiments, the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 is in the range of -0.1mm to 0.1mm. For example, the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 can be -0.1mm, -0.08mm, -0.05mm, -0.02mm, 0, 0.02mm, 0.05mm, 0.08mm, or 0.1mm.

[0159] If the projections of the lines in the isolation layer 121 and the projections of the lines in the waste layer 142 largely overlap along the thickness direction of the base film 11, then the two lines are considered to correspond. That is, the projections of the corresponding lines in the isolation layer 121 and the corresponding lines in the waste layer 142 on the base film 11 are at least largely overlapping, and the two corresponding lines are stacked along the thickness direction of the base film 11.

[0160] When the difference between the width W2 of each line in the isolation layer 121 and the width W1 of the corresponding line in the waste layer 142 is greater than or equal to -0.1 mm and less than 0, and the width W2 of each line in the isolation layer 121 is smaller than the width W1 of the corresponding line in the waste layer 142, after the conductive film 14 is die-cut, the isolation layer 121 can lift most of the width direction of each line in the waste layer 142, and only a small part of the edge of each line in the width direction is bonded to the base film 11, or the edge of each line in the width direction is also separated from the base film 11, so that the waste tape 15 can remove the waste layer 142.

[0161] When the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 is equal to 0, the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 are equal. After the conductive film 14 is die-cut, the isolation layer 121 can just lift up each line in the waste layer 142 so that the waste removal tape 15 can remove the waste layer 142.

[0162] When the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 is greater than 0 and less than or equal to 0.1 mm, and the width W2 of each line in the isolation layer 121 is larger than the corresponding width W1 of the line in the waste layer 142, then after the conductive film 14 is die-cut, the isolation layer 121 can lift up each line in the waste layer 142, while only a small portion of the edge of each line in the width direction is lifted up by the isolation layer 121. Therefore, during the waste removal process... In the waste layer 142, the entire line is bonded to the waste removal tape 15 so that the waste removal tape 15 can peel off and remove the waste layer 142; while the edge portion of the line in the width direction of the circuit layer 141 is bonded to the waste removal tape 15. In this way, when the waste removal tape 15 is torn off, the pulling force of the waste removal tape 15 on the circuit layer 141 will be very small, and much smaller than the adhesive force between the backing film 11 and the circuit layer 141. Thus, the risk of the circuit layer 141 breaking or shifting is reduced during the process of tearing off the waste removal tape 15.

[0163] The width difference between the corresponding positions of the isolation layer 121 and the waste layer 142 is set to a range of -0.1mm to 0.1mm, so that the isolation layer 121 can push out of the waste layer 142, making it easier for the waste layer 142 to bond with the waste removal tape 15. It can also reduce the bonding area between the waste removal tape 15 and the circuit layer 141. Therefore, during the process of tearing off the waste removal tape 15, it is not only easier to peel off and remove the waste layer 142, but also eliminates the risk of the tape 15 pulling the lines in the circuit layer 141 to shift or peel off the backing film 11.

[0164] Please refer to Figures 2 to 4. In some embodiments, the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 is greater than 0 and less than or equal to 0.1 mm. For example, the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 can be 0.01 mm, 0.02 mm, 0.05 mm, 0.08 mm, 0.1 mm, etc., that is, the difference between the width W2 of each line in the isolation layer 121 and the corresponding width W1 of the line in the waste layer 142 is positive.

[0165] If the width W2 of each line in the isolation layer 121 is larger than the width W1 of the corresponding line in the waste layer 142, then after the conductive film 14 is die-cut, the isolation layer 121 can better lift up all the lines in the waste layer 142. During the waste removal process, the lines in the waste layer 142 are bonded to the waste removal tape 15 so that the waste removal tape 15 can peel off and remove the waste layer 142.

[0166] Please refer to Figures 2 to 4. In some embodiments, the conductive film 14 includes one of copper foil, aluminum foil, gold foil, and silver foil.

[0167] Copper foil refers to metal foil made of metallic copper.

[0168] Aluminum foil refers to metal foil made of aluminum.

[0169] Gold foil refers to metal foil made of gold.

[0170] Silver foil refers to metal foil made of metallic silver.

[0171] The conductive film 14 uses one of copper foil, aluminum foil, gold foil, and silver foil, and has a simple structure that can be configured as needed.

[0172] Please refer to Figures 2 to 4. In some embodiments, the waste discharge tape 15 and the waste removal tape 13 can use the same tape to reduce costs.

[0173] Please refer to Figures 2 to 4. According to some embodiments of this application, this application provides a die-cut circuit board processing method, including the die-cut circuit waste removal method as described in the above embodiments.

[0174] The die-cut circuit board processing method of this application uses the die-cut circuit waste removal method of the above embodiment. While removing the waste layer 142, the circuit layer 141 can be well preserved, reducing the risk of the waste glue pulling off the circuit layer 141 and improving the quality of the die-cut circuit board.

[0175] Please refer to Figures 2 to 4. In some embodiments, the die-cutting circuit board processing method further includes the following steps:

[0176] Cover the side where the circuit layer 141 is located with a first protective film, and then remove the backing film 11 and the isolation layer 121;

[0177] The second protective film is attached to the side of the first protective film on which the circuit layer 141 is provided, so that the first protective film and the second protective film cooperate to clamp the circuit layer 141.

[0178] The first and second protective films are insulating film structures used to protect the circuit layer 141.

[0179] The first protective film can be a film made of PET, PP, or other materials. Of course, it can also be a film made of other insulating materials such as plastic.

[0180] The second protective film can be a film made of PET, PP, or other insulating materials, or it can be a film made of plastic or other insulating materials.

[0181] By setting the first protective film and the second protective film, the circuit layer 141 is well protected, thereby improving the quality of the die-cut circuit board.

[0182] Please refer to Figures 2 to 4. In some embodiments, after excluding the waste layer 142, the resulting structure of the bottom film 11 combined with the circuit layer 141 can be directly used as a die-cut circuit board.

[0183] Please refer to Figures 2 to 4. In some embodiments, after removing the waste layer 142, a first protective film can be covered on the side where the circuit layer 141 is located, so that the bottom film 11 and the first protective film cooperate to clamp and protect the circuit layer 141, thereby obtaining a die-cut circuit board.

[0184] Please refer to Figures 2 to 4. According to some embodiments of this application, this application provides a die-cut circuit waste removal system, including a bonding device 22, a first die-cutting device 23, and a waste removal device 24. The bonding device 22 is used to bond a conductive film 14 to one side of the base film 11 where an isolation layer 121 made of release film 12 is provided; the first die-cutting device 23 is used to die-cut the conductive film 14 to form a circuit layer 141 to be retained and a waste layer 142 to be removed, and to make the shape of the isolation layer 121 correspond to the shape of the waste layer 142, and the isolation layer 121 is located between the waste layer 142 and the base film 11; the waste removal device 24 is used to drive a waste removal tape 15 through the die-cut conductive film 14 to remove the waste layer 142 and retain the circuit layer 141 on the base film 11.

[0185] The bonding device 22 is a device used to bond the conductive film 14 to the base film 11. The bonding device 22 is used to bond the conductive film 14 to the base film 11 to facilitate the bonding of the conductive film 14 to the base film 11.

[0186] The first die-cutting device 23 refers to the cutting tool used to die-cut the conductive film 14. The first die-cutting device 23 is used to die-cut the conductive film 14 so that the conductive film 14 forms a circuit layer 141 and a waste layer 142, thereby realizing the die-cutting process of the conductive film 14.

[0187] Waste removal device 24 refers to the device used to drive waste removal belt 15 to remove waste layer 142. Using waste removal device 24 to drive waste removal belt 15 facilitates the removal of waste layer 142, enabling mass production.

[0188] By using a base film 11 with an isolation layer 121, and using a bonding device 22 to bond a conductive film 14 to the side of the base film 11 with the isolation layer 121, the conductive film 14 is die-cut into a circuit layer 141 and a waste layer 142 using a first die-cutting device 23, and the waste layer 142 is removed by driving a waste removal tape 15 using a waste removal device 24. This facilitates the removal of the waste layer 142 by the waste removal tape 15, reduces the risk of the waste removal tape breaking the circuit layer 141, and allows for mass production.

[0189] Please refer to Figures 2 to 4. In some embodiments, the die-cutting waste removal system further includes a second die-cutting device 25 and a waste removal device 26: the second die-cutting device 25 is used to die-cut the release film 12 on the base film 11 to form an isolation layer 121 and a waste pattern layer 122 outside the isolation layer 121; the waste removal device 26 is used to drive the waste removal tape 13 past the die-cut release film 12 to remove the waste pattern layer 122 and retain the isolation layer 121 on the base film 11.

[0190] The second die-cutting device 25 refers to the cutting tool used to die-cut the release film 12. The second die-cutting device 25 is used to die-cut the release film 12 so that the release film 12 forms an isolation layer 121 and a waste pattern layer 122, thereby realizing the die-cutting process of the release film 12.

[0191] The waste removal device 26 refers to the device used to drive the waste removal tape 13 to remove the waste pattern layer 122. Using the waste removal device 26 to drive the waste removal tape 13 facilitates the removal of the waste pattern layer 122, enabling mass production.

[0192] Using the second die-cutting device 25 and the waste removal device 26, the isolation layer 121 is directly made on the base film 11, which is convenient for processing and manufacturing, and also facilitates the positioning of the isolation layer 121. In the process of die-cutting the conductive film 14, it is easier for the isolation layer 121 and the waste layer 142 to be more accurately aligned, resulting in higher efficiency and precision.

[0193] Please refer to Figures 2 to 4. In some embodiments, the die-cutting line waste removal system also includes a conveyor line 21 for conveying the base film 11. The second die-cutting device 25, the waste removal device 26, the bonding device 22, the first die-cutting device 23, and the waste removal device 24 are arranged sequentially along the conveying direction of the conveyor line 21.

[0194] Conveyor line 21 is a basic and common type of production line. Its main function is to transport materials from one workstation to another via conveyor belts or roller conveyors.

[0195] A conveyor line 21 is provided to transport the base film 11, which facilitates the subsequent production of the die-cutting line.

[0196] Please refer to Figures 2 to 4. In some embodiments, the base film 11 is a roll material, and the conveyor line 21 includes a plurality of support rollers 211 for supporting the base film 11 and conveyor rollers 212 that cooperate with the support rollers 211 to clamp and convey the base film 11.

[0197] Support roller 211 refers to a roller structure that can be used to support the base film 11. Conveyor roller 212 refers to a rotatable roller structure. Conveyor roller 212 can be driven to rotate by an external motor, or a motor can be installed inside it to drive the rotation of conveyor roller 212.

[0198] When the bottom support film 11 is made of roll material, the conveyor line 21 may include multiple support rollers 211 and conveyor rollers 212. The conveyor rollers 212 cooperate with the support rollers 211 to clamp the bottom support film 11, and the conveyor rollers 212 rotate to convey the bottom support film 11.

[0199] The support roller 211 and the conveyor roller 212 are used to transport the bottom film 11. The structure is simple and it is convenient to transport a relatively long bottom film 11.

[0200] In some embodiments, a support plate may be used to support the base film 11, and the conveyor line 21 may be a conveyor line 21 with a conveyor line 21 or a multi-roller structure to convey the support plate, thereby conveying the base film 11. The support plate refers to a plate used to support the base film 11 so that the base film 11 can be flattened.

[0201] Please refer to Figures 2 to 4. In some embodiments, the second die-cutting device 25 includes a roller die 251 for rolling die-cutting the release film 12.

[0202] The hobbing die 251 refers to a cylindrical die with a cutting die on its outer circumference.

[0203] The second die-cutting device 25 uses a roller die 251, which can conveniently and continuously die-cut the release film 12 with high efficiency and high processing accuracy. Of course, in some embodiments, the second die-cutting device 25 can also use a die with a die set on the plate.

[0204] Please refer to Figures 2 to 4. In some embodiments, the waste removal device 26 can be a pressing roller 261. The pressing roller 261 refers to a roller structure that can press the waste removal tape 13 against the die-cut release film 12. For example, if the waste removal tape 13 is placed above the release film 12, the pressing roller 261 is used to press the waste removal tape 13, causing the waste removal tape 13 to pass around the pressing roller 261 and be pressed onto the release film 12, thus adhering to the release film 12. During the movement of the waste removal tape 13, the waste removal tape 13 will leave the release film 12 and be torn off from the release film 12, thereby peeling off and removing the waste pattern layer 122. Using the pressing roller 261 has a simple structure, is convenient for continuous processing, and has high efficiency.

[0205] Referring to Figures 2 to 4, in some embodiments, the waste removal device 26 further includes a feeding shaft 262 and a receiving shaft 263. The feeding shaft 262 is a shaft structure used to support and release the waste removal tape 13. The receiving shaft 263 is a shaft structure used to recycle the released waste removal tape 13, such as by driving the receiving shaft 263 to rotate to recycle the waste removal tape 13. Through the cooperation of the feeding shaft 262 and the receiving shaft 263, the waste removal tape 13 is released and recycled, realizing the movement of the waste removal tape 13 to peel off the waste layer 142.

[0206] Please refer to Figures 2 to 4. In some embodiments, the waste removal tape 13 is a roll material, and the waste removal device 26 includes a feeding shaft 262 for supporting and releasing the waste removal tape 13, a pressing roller 261 for pushing the waste removal tape 13 against the release film 12, and a receiving shaft 263 for pulling the waste removal tape 13 away from the bottom film 11.

[0207] During the conveying process of the waste removal tape 13, the waste removal tape 13 is made to pass around the pressing roller 261 and be pressed onto the release film 12 by the pressing roller 261, thus adhering to the release film 12. During the movement of the waste removal tape 13, it is torn off from the release film 12, thereby causing the waste pattern layer 122 to peel off and be discharged. The structure is simple, easy to process continuously, and has high efficiency.

[0208] In some embodiments, the waste removal device 26 may also use other structures, such as a scraper. The scraper presses the waste removal tape 13 against the release film 12 along the length of the waste removal tape 13. During the movement of the scraper, the waste removal tape 13 is pulled up from the release film 12 and the waste pattern layer 122 is peeled off and removed.

[0209] Please refer to Figures 2 to 4. In some embodiments, the bonding device 22 includes a bonding roller 221 for pushing the conductive film 14 against the bonding film 11.

[0210] The bonding roller 221 refers to the roller structure that can press against the conductive film 14.

[0211] The conductive film 14 is bonded by a bonding roller 221, which has a simple structure.

[0212] Please refer to Figures 2 to 4. In some embodiments, when the conductive film 14 is made of roll material, the bonding device 22 uses a bonding roller 221 to press the conductive film 14 against the base film 11 to bond the conductive film 14 to the base film 11. The structure is simple and convenient for continuous batch production.

[0213] Please refer to Figures 2 to 4. In some embodiments, an adsorption plate can be used to adsorb the conductive film 14, and then the conductive film 14 can be attached to the base film 11. The adsorption plate refers to a plate with suction holes. A vacuum structure is connected through the adsorption plate to generate negative pressure on the suction holes to adsorb the conductive film 14.

[0214] Please refer to Figures 2 to 4. In some embodiments, the first die-cutting device 23 includes a rolling die 231 for rolling die-cutting of the conductive film 14.

[0215] Rolling die 231 refers to a cylindrical mold with a die on its outer circumference.

[0216] The first die-cutting device 23 uses a rolling die 231, which can conveniently and continuously die-cut the conductive film 14, with high efficiency and high processing accuracy.

[0217] Of course, in some embodiments, the first die-cutting device 23 may also use a mold with a die set on the sheet metal.

[0218] Referring to Figures 2 to 4, in some embodiments, the waste removal device 24 may include a pressure roller 241. The pressure roller 241 is a roller structure that presses the waste removal tape 15 against the die-cut conductive film 14. If the waste removal tape 15 is placed above the conductive film 14, the pressure roller 241 is used to press the waste removal tape 15, causing it to bypass the pressure roller 241 and be pressed onto the conductive film 14, thus adhering to it. During the movement of the waste removal tape 15, it will leave the conductive film 14 and be torn off, thereby peeling off and removing the waste layer 142. Using the pressure roller 241 results in a simple structure, facilitates continuous processing, and has high efficiency.

[0219] Referring to Figures 2 to 4, in some embodiments, the waste discharge device 24 further includes a discharge roller 242 and a take-up roller 243. The discharge roller 242 is a shaft structure used to support and release the waste discharge tape 15. The take-up roller 243 is a shaft structure used to recover the released waste discharge tape 15, such as by driving the take-up roller 243 to rotate to recover the waste discharge tape 15. Through the cooperation of the discharge roller 242 and the take-up roller 243, the waste discharge tape 15 is released and recovered, realizing the movement of the waste discharge tape 15 to peel off the waste layer 142.

[0220] Please refer to Figures 2 to 4. In some embodiments, the waste discharge tape 15 is a roll material, and the waste discharge device 24 includes a feeding roller 242 for supporting and releasing the waste discharge tape 15, a pressing roller 241 for pushing the waste discharge tape 15 against the conductive film 14, and a receiving roller 243 for pulling the waste discharge tape 15 away from the bottom film 11.

[0221] During the conveying process of the waste discharge belt 15, the waste discharge belt 15 is made to pass around the pressure roller 241 and be pressed onto the conductive film 14 by the pressure roller 241, thus adhering to the conductive film 14. During the movement of the waste discharge belt 15, it is torn off from the conductive film 14, thereby causing the waste layer 142 to peel off and be discharged. The structure is simple, easy to process continuously, and has high efficiency.

[0222] In some embodiments, the waste discharge device 24 may also use other structures, such as a scraper. The scraper presses the waste discharge tape 15 against the conductive film 14 along the length of the waste discharge tape 15. During the movement of the scraper, the waste discharge tape 15 is pulled up from the conductive film 14 and the waste layer 142 is peeled off and discharged.

[0223] Referring to Figures 2 to 4, in some embodiments, a film-applying device can be used to apply the release film 12 to the base film 11 to facilitate the application of the release film 12 to the base film 11. A film-applying device refers to a device used to apply the film.

[0224] Please refer to Figures 2 to 4. In some embodiments, the base film 11 is made of roll material, and the release film 12 is also made of roll material. Both the base film 11 and the release film 12 can pass through the conveyor line 21, the support roller 211, and the conveyor roller 212. The release film 12 is attached to the base film 11 by the cooperation of the conveyor roller 212 and the support roller 211. The structure is simple, easy to process continuously, and has high efficiency.

[0225] Referring to Figures 2 to 4, in some embodiments, the film application device may also use a pressure roller to press and adhere the release film 12 onto the base film 11. A pressure roller refers to a cylindrical roller structure.

[0226] Please refer to Figures 2 to 4. In some embodiments, a suction plate can also be used to adsorb the release film 12, and then the release film 12 is attached to the base film 11. The suction plate refers to a plate with suction holes. A vacuum structure is connected to the suction plate to generate negative pressure on the suction holes to adsorb the release film 12.

[0227] The die-cutting circuit waste removal system of this application embodiment can implement the die-cutting circuit waste removal method of this application embodiment, that is, the die-cutting circuit waste removal method of this application embodiment can also be implemented using the die-cutting circuit waste removal system of this application embodiment. Therefore, the various devices, structures, and components in the die-cutting circuit waste removal system of this application embodiment can be adapted to the die-cutting circuit waste removal method of this application embodiment; correspondingly, the various processes, steps, and parameter settings of the die-cutting circuit waste removal method of this application embodiment can also be adapted to the die-cutting circuit waste removal system of this application embodiment.

[0228] According to some embodiments of this application, and referring to Figures 2 to 4, this application provides a die-cutting circuit board processing system, including the die-cutting circuit waste removal system as described in the above embodiments.

[0229] The die-cutting circuit board processing system of this application embodiment can implement the die-cutting circuit board processing method of this application embodiment; that is, the die-cutting circuit board processing method of this application embodiment can also be implemented using the die-cutting circuit board processing system of this application embodiment. Therefore, the various devices, structures, and components of the die-cutting circuit board processing system of this application embodiment can be adaptively applied to the die-cutting circuit board processing method of this application embodiment; correspondingly, the various processes, steps, and parameter settings of the die-cutting circuit board processing method of this application embodiment can also be adaptively applied to the die-cutting circuit board processing system of this application embodiment.

[0230] Please refer to Figures 2 to 4. According to some embodiments of this application, this application provides a method for removing waste from die-cut circuits, including:

[0231] S11. A bottom support film 11 is provided, and a release film 12 is provided on the bottom support film 11;

[0232] S12, Die-cut the release film 12 to form an isolation layer 121 and a waste pattern layer 122 outside the isolation layer 121;

[0233] S13. Use waste tape 13 to bond the die-cut release film 12, and tear off the waste tape 13 to remove the waste pattern layer 122, and retain the isolation layer 121 on the backing film 11.

[0234] S2. A conductive film 14 is attached to the side of the base film 11 where the isolation layer 121 is provided, and the isolation layer 121 is located between the conductive film 14 and the base film 11.

[0235] S3. The conductive film 14 is die-cut to form a circuit layer 141 to be retained and a waste layer 142 to be removed. The shape of the isolation layer 121 corresponds to the shape of the waste layer 142, and the isolation layer 121 is located between the waste layer 142 and the base film 11.

[0236] S4. Use waste removal tape 15 to bond the die-cut conductive film 14, and then remove the waste removal tape 15 to remove the waste layer 142, while leaving the circuit layer 141 on the backing film 11.

[0237] By setting an isolation layer 121 on the base film 11, the shape of the isolation layer 121 corresponds to the waste layer 142 to be removed formed by the die-cut conductive film 14, and the isolation layer 121 is located between the waste layer 142 and the base film 11, thereby reducing the adhesive force between the waste layer 142 and the base film 11. When the waste removal tape 15 is removed, the force required for the waste removal tape 15 to peel the waste layer 142 from the base film 11 is less than the force required to peel the circuit layer 141 from the base film 11, thus facilitating the removal of the waste layer 142 by the waste removal tape 15 and reducing the risk of the waste removal tape breaking the circuit layer 141. The isolation layer 121 is die-cut on the base film 11, which is convenient for processing and manufacturing, and also facilitates the positioning of the isolation layer 121. This allows for more precise alignment between the isolation layer 121 and the waste layer 142 to be removed during the die-cutting process of the conductive film 14.

[0238] Please refer to Figures 2 to 4. According to some embodiments of this application, this application provides a die-cutting circuit waste removal system, including a bonding device 22, a first die-cutting device 23, a waste removal device 24, a second die-cutting device 25, and a waste removal device 26. The second die-cutting device 25 is used to die-cut the release film 12 on the base film 11 to form an isolation layer 121 and a waste pattern layer 122 outside the isolation layer 121. The waste removal device 26 is used to drive the waste removal tape 13 past the die-cut release film 12 to remove the waste pattern layer 122 and retain the isolation layer 121 on the base film 11. The bonding device 22 is used to bond a conductive film 14 to the side of the base film 11 where the isolation layer 121 is provided. The first die-cutting device 23 is used to die-cut the conductive film 14 to form a circuit layer 141 to be retained and a waste layer 142 to be removed, and to make the shape of the insulating layer 121 correspond to the shape of the waste layer 142, with the insulating layer 121 located between the waste layer 142 and the base film 11. The waste removal device 24 is used to drive the waste removal tape 15 past the die-cut conductive film 14 to remove the waste layer 142 and retain the circuit layer 141 on the base film 11. A second die-cutting device 25 and a waste removal device 26 are also included.

[0239] Using the second die-cutting device 25 and the waste removal device 26, the isolation layer 121 is directly fabricated on the base film 11, which facilitates processing and manufacturing, and also makes it easier to position the isolation layer 121. Using the bonding device 22, a conductive film 14 is bonded to the side of the base film 11 where the isolation layer 121 is located. The first die-cutting device 23 then die-cuts the conductive film 14 into a circuit layer 141 and a waste layer 142. The waste removal device 24 drives the waste removal tape 15 to remove the waste layer 142, facilitating the removal of the waste layer 142 and reducing the risk of the waste tape breaking the circuit layer 141. Furthermore, it allows for mass production.

[0240] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for removing waste from die-cut circuits, characterized in that, include: A base film is provided, wherein the base film has an isolation layer made of release film; A conductive film is attached to the side of the base film where the insulating layer is provided; The conductive film is die-cut to form a circuit layer to be retained and a waste layer to be removed. The shape of the isolation layer corresponds to the shape of the waste layer, and the isolation layer is located between the waste layer and the base film. The die-cut conductive film is bonded with waste removal tape, and the waste removal tape is then removed to remove the waste layer, leaving the circuit layer on the backing film.

2. The waste removal method for die-cut circuits as described in claim 1, characterized in that, The steps for manufacturing the isolation layer are as follows: The base film is provided, and a release film is disposed on the base film; The release film is die-cut to form the isolation layer and a waste pattern layer outside the isolation layer; Use waste removal tape to bond the die-cut release film, and then peel off the waste removal tape to remove the waste pattern layer, leaving the release layer on the backing film.

3. The waste removal method for die-cut circuits as described in claim 2, characterized in that, The adhesion between the base film and the release film is greater than the adhesion between the waste removal tape and the release film.

4. The waste removal method for die-cut circuits as described in any one of claims 1-3, characterized in that, The base film, the conductive film, and the release film are all roll materials.

5. The waste removal method for die-cut circuits as described in any one of claims 1-4, characterized in that, The adhesion between the isolation layer and the conductive film is less than the adhesion between the isolation layer and the base film.

6. The waste removal method for die-cut circuits as described in claim 5, characterized in that, The insulating layer is not adhesive at least on the side facing the conductive film.

7. The waste removal method for die-cut circuits as described in any one of claims 1-6, characterized in that, The adhesion between the base film and the conductive film is greater than the adhesion between the waste discharge tape and the conductive film.

8. The waste removal method for die-cut circuits as described in claim 7, characterized in that, The adhesion between the base film and the conductive film is in the range of 200gf-400gf, and the adhesion between the waste discharge tape and the conductive film is in the range of 100gf-150gf.

9. The waste removal method for die-cut circuits as described in any one of claims 1-8, characterized in that, The thickness of the isolation layer is greater than or equal to the thickness of the conductive film.

10. The waste removal method for die-cut circuits as described in claim 9, characterized in that, The thickness of the isolation layer is 2-3 times the thickness of the conductive film.

11. The waste removal method for die-cut circuits as described in any one of claims 1-10, characterized in that, The difference between the width of each line in the isolation layer and the width of the corresponding line in the waste layer ranges from -0.1mm to 0.1mm.

12. The waste removal method for die-cut circuits as described in claim 11, characterized in that, The difference between the width of each line in the isolation layer and the width of the corresponding line in the waste layer is greater than 0 and less than or equal to 0.1 mm.

13. The waste removal method for die-cut circuits as described in any one of claims 1-12, characterized in that, The conductive film includes one of copper foil, aluminum foil, gold foil, and silver foil.

14. A method for die-cutting circuit boards, characterized in that, This includes the waste removal method for die-cut circuits as described in any one of claims 1-13.

15. A waste removal system for die-cut circuit boards, characterized in that, include: A bonding device for bonding a conductive film onto the side of a base film that has an isolation layer made of release film; A first die-cutting device is used to die-cut the conductive film to form a circuit layer to be retained and a waste layer to be removed, and to make the shape of the isolation layer correspond to the shape of the waste layer, and the isolation layer is located between the waste layer and the base film; A waste removal device is used to drive a waste removal tape through the die-cut conductive film to remove the waste layer and retain the circuit layer on the base film.

16. The die-cut circuit waste removal system as described in claim 15, characterized in that, The die-cutting line waste removal system also includes: The second die-cutting device is used to die-cut the release film on the base film to form the isolation layer and the waste pattern layer outside the isolation layer; A waste removal device is used to drive the waste removal tape through the die-cut release film to remove the waste pattern layer and retain the isolation layer on the base film.

17. The die-cut circuit waste removal system as described in claim 16, characterized in that, The die-cutting line waste removal system also includes a conveyor line for conveying the base film, and the second die-cutting device, the waste removal device, the bonding device, the first die-cutting device and the waste removal device are arranged sequentially along the conveying direction of the conveyor line.

18. The die-cut circuit waste removal system as described in claim 17, characterized in that, The base film is a roll material, and the conveyor line includes a plurality of support rollers for supporting the base film and conveyor rollers that cooperate with the support rollers to clamp and convey the base film.

19. The waste removal system for die-cut circuits as described in any one of claims 16-18, characterized in that, The second die-cutting device includes a roller die for rolling and die-cutting the release film.

20. The waste removal system for die-cut circuits as described in any one of claims 16-19, characterized in that, The waste removal tape is a roll material, and the waste removal device includes a feeding shaft for supporting and releasing the waste removal tape, a pressing roller for pushing the waste removal tape against the release film, and a receiving shaft for pulling the waste removal tape away from the backing film.

21. The waste removal system for die-cut circuits as described in any one of claims 15-20, characterized in that, The bonding device includes a bonding roller for pushing the conductive film against the bonding film that is adhered to the base film.

22. The waste removal system for die-cut circuits as described in any one of claims 15-21, characterized in that, The first die-cutting device includes a rolling die for rolling the conductive film.

23. The waste removal system for die-cut circuits as described in any one of claims 15-22, characterized in that, The waste discharge tape is a roll material, and the waste discharge device includes a feeding roller for supporting and releasing the waste discharge tape, a pressing roller for pushing the waste discharge tape against the conductive film, and a receiving roller for pulling the waste discharge tape away from the bottom film.

24. A die-cutting circuit board processing system, characterized in that, Includes the die-cutting circuit waste removal system as described in any one of claims 15-23.

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