Electrical article

Abstract

The purpose of the present invention is to provide a technique whereby even when a filmy base layer is used as an insert in insert molding, edge portions of the base layer can be inhibited from deforming. This electrical article comprises: a circuit component including a filmy base layer having a first surface and a second surface, which face in opposite directions, and an electroconductive layer formed on the first surface of the base layer; and a molded resin part formed by insert molding using the circuit component as an insert. The base layer comprises: a main body where the molded resin part is formed; and an extension part extending from the main body. The electroconductive layer is provided to some of the first surface of the main body. The molded resin part is formed on the electroconductive layer and on the first surface of the main body. In the molded resin part, a gate mark is provided at a position that overlaps with the extension part.

Description

Electrical equipment

[0001] The present disclosure relates to electrical equipment.

[0002] Patent Document 1 discloses a molded product in which a decorative sheet, a flexible printed circuit board, and a molded body are integrated together. The molded body is made of a thermoplastic resin and is formed by insert molding.

[0003] JP 2019-28928 A

[0004] In the molded product described in Patent Document 1, when insert molding a molded body using a decorative sheet as an insert, there is a risk that the edge of the decorative sheet may be deformed by the heat or pressure of the flowing resin. Furthermore, if a gap occurs between the mold and the base layer due to dimensional variations in the film three-dimensional molding process, there is a risk that the resin may flow into the design surface of the decorative sheet.

[0005] Therefore, an object of the present invention is to provide a technology that can suppress deformation of the edge of a base material layer even when insert molding is performed using a film-like base material layer as an insert.

[0006] The electrical equipment disclosed herein comprises a circuit component including a film-like base layer having a first surface and a second surface facing in opposite directions, a conductive layer laminated on the first surface of the base layer, and a resin molded portion insert-molded using the circuit component as an insert, wherein the base layer has a main body portion on which the resin molded portion is provided and an extension portion extending from the main body portion, the conductive layer is partially provided on the first surface of the main body portion, the resin molded portion is laminated on the conductive layer and the first surface of the main body portion, and the gate trace of the resin molded portion is provided in a position overlapping with the extension portion.

[0007] According to the present disclosure, even when insert molding is performed using a film-like base layer as an insert, deformation of the edge portion of the base layer can be suppressed.

[0008] FIG. 1 is a plan view showing an electrical component according to a first embodiment. FIG. 2 is a side view showing the electrical component according to the first embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1. FIG. 4 is an enlarged view of area A1 in FIG. 3. FIG. 5 is a view showing a process for manufacturing the electrical component. FIG. 6 is a view showing a process for manufacturing the electrical component. FIG. 7 is a view showing a process for manufacturing the electrical component. FIG. 8 is a view showing a process for manufacturing the electrical component. FIG. 9 is a perspective view showing a mold. FIG. 10 is an exploded perspective view showing a mold. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 9. FIG. 12 is a view showing a process for cutting out the resin at the gate portion. FIG. 13 is a view showing a process for cutting out the resin at the gate portion. FIG. 14 is a cross-sectional view showing the electrical component after the resin at the gate portion has been cut out. FIG. 15 is a rear view showing the electrical component after the resin at the gate portion has been cut out. FIG. 16 is a rear view showing an electrical component according to a modified example.

[0009] [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] The electrical equipment of the present disclosure is as follows.

[0011] (1) An electrical device comprising: a circuit component including a film-like base layer having a first surface and a second surface facing inversely to each other; a conductive layer laminated on the first surface of the base layer; and a resin molded portion insert-molded using the circuit component as an insert; wherein the base layer has a main body portion on which the resin molded portion is provided and an extension portion extending from the main body portion; the conductive layer is partially provided on the first surface of the main body portion; the resin molded portion is laminated on the conductive layer and the first surface of the main body portion; and the gate trace of the resin molded portion is provided in a position overlapping with the extension portion.

[0012] According to the electrical equipment (1), the resin molded portion is provided, for example, for insulating and protecting the conductive layer. Because the gate trace of the resin molded portion is positioned to overlap the extension portion, the entrance of the fluid resin poured into the mold during insert molding is located at the extension portion. This prevents the edge of the base layer in the main body portion from being caught in the fluid resin flowing from outside the edge, thereby preventing deformation of the edge of the base layer in the main body portion. Furthermore, it also prevents the resin from flowing toward the second surface of the base layer.

[0013] (2) In the electrical equipment of (1), the conductive layer may extend to the first surface of the extension portion, and the conductive layer of the extension portion may be provided with a connection portion for connection with a connection wiring, thereby making it easy to connect the conductive layer and the connection wiring using the connection portion of the extension portion after molding of the resin molded portion.

[0014] (3) In the electrical equipment of (2), the path of the conductive layer in the extension portion may be a path that avoids the gate mark. The portion of the extension portion that corresponds to the gate mark is more affected by heat from the flowing resin than the portion that does not correspond to the gate mark. By having the path of the conductive layer in the extension portion be a path that avoids the gate mark, the effect of heat on the conductive layer in the extension portion can be suppressed.

[0015] (4) In the electrical equipment of (2) or (3), a protective resin part may be provided that is a separate part from the resin molded part and covers the first surface of the extension part and the conductive layer of the extension part, thereby protecting the conductive layer of the extension part.

[0016] (5) In the electrical component of any one of (1) to (4), the width of the extension may be greater than the width of the gate mark, thereby more reliably preventing the outer edge of the base material layer from being caught in the fluid resin.

[0017] (6) In the electrical equipment of any one of (1) to (5), the main body portion may have a three-dimensional shape with the first surface being concave and the second surface being convex, and the extension portion may have a flat shape with both the first surface and the second surface being flat. Because the main body portion has a three-dimensional shape with the first surface being concave and the second surface being convex, if the extension portion were not present, the outer edge of the main body portion would be easily caught in the fluid resin near the gate, and the resin would easily flow toward the second surface of the base layer. Even in this case, providing the extension portion more reliably prevents the outer edge of the main body portion from being caught in the fluid resin and the resin from flowing toward the second surface of the base layer.

[0018] (7) In the electrical equipment of any one of (1) to (6), the base layer may include a base film layer and a decorative layer laminated on the base film layer, the decorative layer including a colorant and appearing on the first surface of the base layer. The decorative layer may be affected by heat. Even in this case, by providing a gate mark on the extension portion, the main body portion is farther from the gate, thereby suppressing the thermal effect of the flowing resin on the decorative layer in the main body portion.

[0019] (8) In the electrical equipment of any one of (1) to (7), the circuit component may include a light source mounted on the conductive layer and a light guide layer surrounding the light source, and the resin molded portion may include a reflective layer in contact with the light guide layer to reflect light from the light source. This makes it possible to suppress deformation of the edge of the base layer due to flowing resin when the reflective layer is provided on the base layer.

[0020] [Details of the embodiment of the present disclosure] Specific examples of electrical equipment of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0021] [First Embodiment] An electrical component according to a first embodiment will now be described. Fig. 1 is a plan view showing an electrical component 10 according to the first embodiment. Fig. 2 is a side view showing the electrical component 10 according to the first embodiment. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is an enlarged view of an area A1 in Fig. 3. Arrow A2 in Fig. 4 indicates the path of light emitted from the light source 50. Figs. 5 to 8 are diagrams showing the manufacturing process of the electrical component 10. Each figure shows three mutually orthogonal directions: an X direction, a Y direction, and a Z direction.

[0022] The electrical equipment 10 includes a circuit component 12 and a resin molded portion 70. The resin molded portion 70 is insert-molded using the circuit component 12 as an insert. The circuit component 12 includes a base layer 20 and a conductive layer 30. The base layer 20 has a main body portion 23 on which the resin molded portion 70 is provided, and an extension portion 24 extending from the main body portion 23. The conductive layer 30 is laminated on the base layer 20. The resin molded portion 70 is laminated on the conductive layer 30 and the main body portion 23.

[0023] Here, the circuit component 12 includes an electrostatic switch electrode 40, a light source 50, and a light guide layer 60 surrounding the light source 50. The electrostatic switch electrode 40 is provided on the base layer 20. The light source 50 is mounted on the conductive layer 30. The light source 50 is an example of an electronic element, such as a light emitting diode (LED). Hereinafter, the light source 50 may be referred to as an LED 50. The light guide layer 60 surrounds the light source 50. The light guide layer 60 is provided so as to cover the area from the light source 50 to the electrostatic switch electrode 40. Here, the light guide layer 60 is also considered to be an insert.

[0024] The resin molded part 70 is a resin part that is insert-molded using the circuit component 12, which has the base material layer 20, the conductive layer 30, the electrostatic switch electrode 40, the light source 50, and the light guide layer 60, as an insert. Here, the resin molded part 70 includes a reflective layer 72 and a light-shielding wall 74. The reflective layer 72 is in contact with the light guide layer 60 and reflects light from the light source 50. The reflective layer 72 is provided on the side of the light guide layer 60 opposite the base material layer 20. The light-shielding wall 74 surrounds the side of the light guide layer 60.

[0025] The electrical component 10 is, for example, a touch panel device. The electrical component 10 is mounted on a vehicle such as an automobile. Here, the electrical component 10 is an interior component in which an electronic circuit for an automobile and a resin molded portion 70 are integrally molded. In the vehicle, the electrical component 10 may be mounted on, for example, an instrument panel. The resin molded portion 70 may constitute a part of the instrument panel.

[0026] The touch panel device includes an operation switch unit and a backlight illumination unit. The portion including the electrostatic switch electrode 40 constitutes the operation switch unit. The portion including the light source 50 constitutes the backlight illumination unit. As shown in FIG. 2 , the outer surface of the operation switch unit constitutes an operation surface that a user touches with a finger UF or the like. The electrostatic switch electrode 40 is located inside the operation surface. The backlight illumination unit illuminates the operation surface from the inside, making it easier for the user to see the operation surface. Here, the backlight illumination unit illuminates the operation switch unit by reflecting light emitted from the light source 50 toward the opposite side of the operation surface with a reflective layer 72, as shown by arrow A2 in FIG. 4 . As shown in FIG. 1 , indicators 14 (also referred to as icons, etc.) may be formed on the operation surface to indicate the location to be touched by the user and the function assigned to the electrostatic switch electrode 40. The backlight illumination unit may illuminate the indicators 14.

[0027] The base layer 20 is formed in a film shape. The base layer 20 has a first surface 21 and a second surface 22 facing opposite each other. The first surface 21 is provided with a conductive layer 30, an electrostatic switch electrode 40, a light source 50, a light guide layer 60, and a resin molded portion 70. The second surface 22 is the surface facing the user.

[0028] The base layer 20 is three-dimensionally molded. Three-dimensional molding here refers to processing a member having a flat shape (2D shape) into a three-dimensional shape (3D shape). Three-dimensional molding is performed using a mold, for example, by vacuum molding, high-pressure molding, or vacuum / pressure molding. During three-dimensional molding, bending and stretching of the member may occur when processing from a flat shape to a three-dimensional shape. Therefore, the member processed three-dimensionally has flexibility that allows it to accommodate bending and stretching. Here, the base layer 20 is processed from a flat shape extending in the XY plane to a three-dimensional shape that also extends in the Z direction, as shown in FIG. 5 . Here, the base layer 20 includes a main body portion 23 and an extension portion 24. The main body portion 23 has a three-dimensional shape. The three-dimensional shape of the main body portion 23 is not particularly limited and can be set as appropriate. Here, the main body portion 23 has a three-dimensional shape in which the first surface 21 is concave and the second surface 22 is convex. The extension portion 24 extends laterally (in the X direction or the Y direction) from the outer edge of the main body portion 23. Here, the extension portion 24 is formed flat. The extension portion 24 has a flat shape in which the first surface 21 and the second surface 22 are both flat surfaces. The number of extension portions 24 may be one or more. Herein, a pair of extension portions 24 are provided in opposite directions from the main body portion 23 along the Y direction. Hereinafter, when it is necessary to distinguish between the pair of extension portions 24, they may be referred to as extension portions 24A and 24B.

[0029] The base layer 20 includes a first region 25 and a second region 26. The first region 25 and the second region 26 are different regions. The first region 25 is a region where the conductive layer 30 is provided. The second region 26 is a region where the electrostatic switch electrode 40 is provided. The second region 26 is light-transmitting. The first region 25 may or may not be light-transmitting.

[0030] The base layer 20 includes a translucent base film layer 20A. As shown in FIG. 4 , the base layer 20 may include a decorative layer 20B laminated on the base film layer 20A. The decorative layer 20B is provided, for example, on the first surface 21 side of the base film layer 20A. The decorative layer 20B appears on the first surface 21 of the base layer 20. The decorative layer 20B includes a colorant. The colorant may be paint or ink. The decorative layer 20B is formed by painting the base film layer 20A with paint or printing with ink. The decorative layer 20B may have light-blocking properties. The colorant may be light-blocking paint or light-blocking ink. The decorative layer 20B may be a single layer or multiple layers with different colors. For example, the base film layer 20A may extend over the entire base layer 20, and the decorative layer 20B may be provided in a partial region of the base film layer 20A. A portion of the base material layer 20 where the decorative layer 20B is not provided relative to the base material film layer 20A forms a second region 26. Here, the first region 25 is a portion of the base material layer 20 where the decorative layer 20B is provided. The first region 25 may also be a portion of the base material layer 20 where the decorative layer 20B is not provided.

[0031] The thickness of the base film layer 20A is not particularly limited, but if the base film layer 20A is too thick, shape conformability will be poor, and if it is too thin, tearing, wrinkles, etc. In consideration of these, the thickness of the base film layer 20A may be, for example, 0.025 mm or more and 1 mm or less.

[0032] The base film layer 20A preferably has a predetermined heat resistance. In the electrical equipment 10, the base film layer 20A is subjected to heat, for example, when the wiring pattern is cured or when the resin molded portion 70 is insert-molded. If the heat resistance of the base film layer 20A is too low, the heat may cause tears, wrinkles, etc. in the base film layer 20A. By ensuring that the base film layer 20A has a predetermined heat resistance, tears, wrinkles, etc. caused by heat during manufacturing can be suppressed.

[0033] The heat shrinkage rate at 120°C for 30 minutes in an air atmosphere may be used as an indicator of heat resistance. The 30-minute heat shrinkage rate simulates the conditions for the heat treatment applied to the base film layer 20A during the manufacturing process of the electrical component 10. The heat shrinkage rate of the base film layer 20A can be calculated by {(length of the base film layer 20A before heating - length of the base film layer 20A after heating) / length of the base film layer 20A before heating} × 100. The temperature before heating is room temperature. The length of the base film layer 20A after heating is the length of the base film layer 20A when it is returned to room temperature after being subjected to a 30-minute heat treatment at 120°C. The predetermined heat resistance of the base film layer 20A is preferably such that the heat shrinkage rate is 5% or less. A heat shrinkage rate of 5% or less facilitates the prevention of damage to the base film layer 20A during the manufacturing process of the electrical component 10. More preferably, the predetermined heat resistance of the base film layer 20A is a heat resistance that satisfies the above-mentioned thermal shrinkage rate of 3% or less.

[0034] The base film layer 20A may be a directional film having anisotropic stretchability, such as a uniaxially stretched film, or may be a film having isotropic stretchability, such as a biaxially stretched film. When the base film layer 20A is composed of a directional film, the heat shrinkage rate of the base film in both the MD (machine direction) and the TD (transverse direction) is preferably 5% or less, and more preferably 3% or less.

[0035] The surface of the base film layer 20A may be modified to improve adhesion to the conductive layer 30. Such surface modification may be performed by primer treatment, plasma irradiation, corona irradiation, UV irradiation, or the like.

[0036] The base film layer 20A is made of, for example, a resin, and the resin may include at least one selected from the group consisting of polyesters such as polyethylene terephthalate (PET), polycarbonate (PC), polystyrene (PS), syndiotactic polystyrene (SPS), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polyethylene naphthalate (PEN), nylons such as polyamide (PA), polyphenylene sulfide (PPS), polyphenylene ether (PPE), modified polyphenylene ether (m-PPE), cycloolefin polymer (COP), and acrylic (PMMA).

[0037] The conductive layer 30 is laminated on the decorative layer 20B of the base material layer 20. The conductive layer 30 has a pattern for an LED and a pattern for an electrostatic switch electrode. The conductive layer 30 may have a pattern for a purpose other than the pattern for an LED and the pattern for an electrostatic switch electrode.

[0038] The electrostatic switch electrode 40 is light-transmitting. The electrostatic switch electrode 40 is laminated on the base film layer 20A of the base layer 20. A portion of the electrostatic switch electrode 40 extends to the first region 25 and is connected to the electrostatic switch electrode pattern. The electrostatic switch electrode 40 may be formed of a conductive polymer such as PEDOT:PSS (polyethylenedioxythiophene:polystyrenesulfonate). The electrostatic switch electrode 40 may be adjacent to the LED 50 in the direction along the second surface 22, or may be spaced apart from the LED 50.

[0039] The LEDs 50 are mounted on the LED pattern of the conductive layer 30. Light from the LEDs 50 passes through the electrostatic switch electrode 40 and the second region 26 and exits the electrical component 10. Here, the conductive layer 30 and the decorative layer 20B are located closer to the second surface 22 than the LEDs 50, so the light emitted from the LEDs 50 is prevented from directly passing through the electrostatic switch electrode 40 and the second region 26. The light emitted from the LEDs 50 is reflected by the reflective layer 72 and exits the electrical component 10 after passing through the electrostatic switch electrode 40 and the second region 26.

[0040] The LED 50 is mounted on the conductive layer 30 via a bonding layer 32. Here, the bonding layer 32 is a low-temperature solder 32. Therefore, the conductive layer 30 has good solder wettability. The electrical equipment 10 may also include electronic elements other than the LED 50. Such electronic elements may be, for example, resistors, capacitors, or control IC chips. It is preferable that such electronic elements are mounted using the same mounting method as the LED 50.

[0041] The low-temperature solder 32 is a solder with a melting point of 184 degrees Celsius or lower. The low-temperature solder 32 is, for example, a Sn—Bi system. By using the low-temperature solder 32 for the bonding layer 32, the heat applied to the base layer 20 during soldering can be reduced. The heating method for the low-temperature solder 32 is not particularly limited and can be set as appropriate. The heating method for the low-temperature solder 32 is preferably an instantaneous local heating method using an infrared laser. As a result, the heat applied to the base layer 20 is instantaneous and localized only at the mounting location, thereby suppressing damage to the base layer 20 due to heating (warping, tearing, etc.).

[0042] The conductive layer 30 is a coating formed from a conductive paste. The conductive paste is provided on the base layer 20 by printing. The printing method is not particularly limited, and may be, for example, screen printing, flexographic printing, Clavia printing, Clavia offset printing, inkjet printing, or dispenser printing. The conductive paste printed on the base layer 20 is heated and cured to form a coating. The method for curing the paste coating is not particularly limited, and may be, for example, drying in a hot air oven.

[0043] The conductive paste contains a metal filler and a thermoplastic resin binder. The metal type of the filler is, for example, silver, copper, or silver-coated copper powder. The filler and binder remain in the coating even after the conductive paste is heat-cured.

[0044] The conductive paste material may contain, in addition to filler and binder, solvent, additives, etc. The conductive paste may consist of filler, binder, solvent, and additive. Because the solvent volatilizes when a coating is formed by heating, the mass fraction of the solvent in the coating is smaller than the mass fraction of the solvent in the conductive paste. The entire amount of solvent may volatilize, and no solvent may remain in the coating. Due to the reduction of the solvent during heat curing, the mass fraction of the filler in the coating may change from the mass fraction of the filler in the conductive paste before heat curing, and may usually become larger.

[0045] The solvent enhances the fluidity of the conductive paste. Examples of the solvent include glycol-based, glycol ether-based, glycol ester-based, and ketone-based solvents. The solvent preferably contains at least one selected from the group consisting of glycol-based, glycol ether-based, glycol ester-based, and ketone-based solvents.

[0046] The additives may be, for example, a thixotropic agent, an anti-settling agent, an antioxidant, etc. The thixotropic agent is added to prevent sagging of the conductive paste and ensure smooth application. The anti-settling agent prevents the filler from settling. The antioxidant prevents the filler from oxidizing.

[0047] Here, the conductive layer 30 is three-dimensionally molded together with the base layer 20. Therefore, the conductive layer 30 also has flexibility that allows it to be bent and stretched. Regarding the thickness of the coating after the conductive paste has hardened, if the film thickness is too thin, the resistance value is likely to increase due to insufficient contact of the filler. Furthermore, if the film thickness is too thick, costs increase and shape conformability during three-dimensional molding decreases. In view of these, the thickness of the coating is preferably, for example, 5 μm or more and 100 μm or less, and more preferably 10 μm or more and 50 μm or less.

[0048] Here, the LED 50 is mounted on the conductive layer 30 using low-temperature solder 32. Therefore, the conductive layer 30 has good solder wettability. The filler and binder in the conductive paste are blended to provide good three-dimensional molding processability and solder wettability.

[0049] Specifically, the filler has a flake or scale shape. The flake shape is, for example, a thin, flat plate shape. The scale shape is a shape in which the main surface of the flake shape is curved. In addition to the flake or scale shape, spherical shapes may also be mixed into the filler.

[0050] Regarding the average particle size of the filler, if the average particle size of the filler is too small, it is difficult to obtain good three-dimensional molding processability and solder wettability. The larger the average particle size of the conductive paste filler, the easier it is for the fillers to maintain contact with each other even when the conductive layer 30 is stretched during three-dimensional molding process, and the increase in resistance can be suppressed. Furthermore, the larger the average particle size of the filler, the more likely the filler will appear on the coating surface, resulting in good solder wettability. Furthermore, if the average particle size of the filler is too large, it will be more likely to clog the nozzle during printing, resulting in poor printability. The smaller the average particle size of the filler, the less likely it is to clog the nozzle during printing.

[0051] The average particle size of the multiple fillers can be determined by observing the cross section of the conductive layer 30 under a microscope. The cross section of the conductive layer 30 is, for example, a cross section along the stacking direction of the base layer 20 and the conductive layer 30. Five or more microscopic images are obtained from the cross section of the conductive layer 30. Each microscopic image is binarized to determine the particle size of all fillers in the image. The measured particle size of the filler is the maximum dimension of each filler in the cross section. The average value of the particle sizes of all fillers is the average particle size of the multiple fillers.

[0052] In consideration of the above two contradictory conditions, the average particle size of the filler is preferably 6 μm or more and 20 μm or less. When the average particle size of the filler is 6 μm or more, good three-dimensional molding processability and solder wettability are easily obtained. When the average particle size of the filler is 8 μm or more, even better three-dimensional molding processability and solder wettability are easily obtained. When the average particle size is 20 μm or less, the filler is less likely to clog the nozzle during printing. Therefore, the conductive paste can be printed well even by inkjet printing and dispenser printing.

[0053] The binder is made of a thermoplastic resin. Such a thermoplastic resin is preferably a thermoplastic resin having a hydroxyl group as a functional group. The presence of a highly reactive hydroxyl group improves the affinity between the binder and the filler, making it less likely for the interfacial breakdown between the binder and the filler to occur even when the cured coating is stretched. Furthermore, the binder also has excellent adhesion to the base layer 20. Furthermore, during the solder mounting process, when localized instantaneous heating is applied, the coating is heated above the softening temperature of the thermoplastic resin and softens, allowing the solder to penetrate into the coating, and the filler and the metal component of the solder tend to form an alloy layer.

[0054] Such thermoplastic resins may be, for example, phenoxy resin, hydroxy polyurethane resin, polyvinyl alcohol resin, polyvinyl acetal resin, vinyl chloride-vinyl acetate-hydroxyalkyl acrylate copolymer resin, or the like.

[0055] The hydroxyl groups may be urethane-modified by reacting with an isocyanate. This imparts rubber elasticity to the cured coating, improving stretchability. A blocked isocyanate compound is preferred as the isocyanate. Because a urethane reaction does not occur below the dissociation temperature of the blocking agent, the storage stability of the conductive paste at room temperature is excellent. From the perspective of the drying and curing temperature of the conductive paste, the blocked isocyanate compound is preferably 3,5-dimethylpyrazole (DMP), diethyl malonate (DEM), or a DMP / DEM hybrid, which have a blocking agent dissociation temperature of 120°C or less. The isocyanate is preferably trimer-type hexamethylene diisocyanate or biuret-type hexamethylene diisocyanate, which have excellent flexibility, and more preferably biuret-type hexamethylene diisocyanate.

[0056] Regarding the mass fraction of the filler in the coating, if the mass fraction of the filler in the coating is too small, the resin component of the binder becomes too high, making it difficult for the filler and the metal component of the solder to form an alloy, and the solder becomes more likely to aggregate. If the mass fraction of the filler in the coating is too large, the resin component of the binder becomes too low, impairing flexibility and making it difficult to obtain flexibility that can withstand three-dimensional molding. In light of these factors, when mounting with low-temperature solder 32, the mass fraction of the filler in the coating is preferably 90 wt% or more and 97 wt% or less. This allows for both good solder wettability and flexibility that can withstand three-dimensional molding. Specifically, if the mass fraction of the filler in the coating is 90 wt% or more, the filler and the metal component of the solder easily form an alloy, making it difficult for the solder to aggregate, and making it easier to obtain good solder wettability. Furthermore, if the filler loading amount in the coating is 97 wt% or less, the resin component of the binder easily provides flexibility that can withstand three-dimensional molding. More preferably, the mass fraction of the filler in the coating is 94 wt % or more, which makes it easier to obtain better solder wettability.

[0057] The light-guiding layer 60 is partially provided in the switch illumination area of ​​the base layer 20, including the LED 50. The light-guiding layer 60 is made of a transparent resin. The resin may be a UV-curable resin or a thermosetting resin. Light-diffusing particles such as acrylic or silicone may be added to the transparent resin. The light-guiding layer 60 allows light to be emitted not only near the LED 50 but also over a wide area. Furthermore, the light-guiding layer 60 reduces brightness unevenness by increasing the distance between the reflective layer 72 and the operation switch. The thickness of the light-guiding layer 60 is greater than the thickness of the LED mounting portion and the electrostatic switch electrode 40. The light-guiding layer 60 surrounds the LED 50 on all four sides and below (the side opposite the base layer 20). The light-guiding layer 60 surrounds the electrostatic switch electrode 40 on all four sides and below (the side opposite the base layer 20). The light-guiding layer 60 has a portion that contacts the base layer 20.

[0058] Here, insert molding is performed after the LEDs 50 are mounted. The light guide layer 60 is provided after the LEDs 50 are mounted but before insert molding. The light guide layer 60 is interposed between the LEDs 50 and the resin molded portion 70. During insert molding, molding heat and molding pressure are typically applied to the insert. The light guide layer 60 prevents the low-temperature solder 32 from melting due to the molding heat and molding pressure. This prevents the electronic elements including the LEDs 50 from peeling off from the conductive layer 30. The light guide layer 60 also protects the electronic elements including the LEDs 50 from the molding heat and molding pressure.

[0059] The reflective layer 72 reflects, toward the inside of the light-guiding layer 60, light emitted from the LEDs 50 that passes through the light-guiding layer 60 and strikes the surface of the reflective layer 72. Here, the light-shielding wall 74 is also formed of the same material as the reflective layer 72. Therefore, like the reflective layer 72, the light-shielding wall 74 also reflects, toward the inside of the light-guiding layer 60, light that passes through the light-guiding layer 60 and strikes the surface of the light-shielding wall 74.

[0060] The resin material of the resin molded portion 70 that forms the reflective layer 72 and the light-shielding wall 74 preferably includes at least one selected from the group consisting of polypropylene resin (PP), polystyrene resin (PS), acrylonitrile butadiene styrene resin (ABS), polycarbonate resin (PC), polyvinyl chloride resin (PVC), and acrylic resin (PMMA). Furthermore, the resin molded portion 70 that forms the reflective layer 72 and the light-shielding wall 74 is preferably white or translucent. It is more preferable that the resin molded portion 70 be made of a white resin. When the resin molded portion 70 is white, reflectivity is likely to be increased, improving luminous efficiency.

[0061] The resin molded portion 70, which includes the reflective layer 72 and the light-shielding walls 74, surrounds the light guide layer 60. This reduces uneven light emission and suppresses light leakage to the outside due to the light reflection effect at the interface between the light guide layer 60 and the resin molded portion 70. Here, the light guide layer 60 is covered on all four sides by the light-shielding walls 74. Furthermore, one main surface of the light guide layer 60 is covered by a reflective wall. Here, the entire portion of the light guide layer 60 that contacts the surface opposite the base layer 20 is made of a reflective layer 72 made of a white or translucent resin. Here, the light guide layer 60 is formed of a uniform material, and the surface material of the light guide layer 60 is also uniform. Similarly, the resin molded portion 70 is formed of a uniform material, and the surface material of the resin molded portion 70 is also uniform. Therefore, the combination of materials at the contact portion between the light guide layer 60 and the resin molded portion 70 is uniform.

[0062] The resin molded portion 70 is provided so as to fill the concave surface on the first surface 21 of the base layer 20. The resin molded portion 70 also functions as a housing for the electrical component 10. As shown in FIG. 4 , the base layer 20 here has a third region 27 in contact with the light guide layer 60 and a fourth region 28 in contact with the resin molded portion 70.

[0063] A gate mark 76 is formed in the resin molded portion 70 that is insert molded using a mold. The gate mark 76 is a portion that remains in the resin molded portion 70 as a mark of the gate. The gate mark 76 is provided at a position that overlaps with the extension portion 24A. Specifically, the gate is a portion that serves as an entrance for pouring resin into the mold. Immediately after the resin molded portion 70 is formed, the resin remaining at the gate is usually connected to the resin molded portion 70. For example, the gate mark 76 is a mark left when the resin molded portion 70 and the resin remaining at the gate are separated. The gate mark 76 will be described in more detail below along with the manufacturing method of the electrical component 10.

[0064] <Manufacturing Method> A manufacturing method for the electrical component 10 will be described.

[0065] First, as shown in Fig. 5, a base material layer 20 is prepared, which is provided with a base material film layer 20A and a decorative layer 20B. At this time, the base material layer 20 is in the form of a flat film having an area larger than that of the state when used as the electrical equipment 10. Then, a conductive paste is applied in a predetermined pattern to a first region 25 of the first surface 21 of the base material layer 20, where the decorative layer 20B is provided, and the pattern is heated and cured to form a coating that becomes the conductive layer 30. Furthermore, an electrostatic switch electrode 40 is formed in a second region 26 of the first surface 21 of the base material layer 20, where the decorative layer 20B is not provided.

[0066] Next, as shown in Figure 6, the base layer 20 and the conductive layer 30 are three-dimensionally formed. The three-dimensional forming is performed by vacuum forming, high-pressure forming, or vacuum / pressure forming. Here, the base layer 20 is three-dimensionally formed so that it has a main body portion 23 and an extension portion 24, and the first surface 21 of the main body portion 23 is concave and the second surface 22 is convex. The portion of the conductive layer 30 that overlaps the main body portion 23 is also three-dimensionally formed. After that, excess portions of the base layer 20 are cut off by Thomson punching or press punching.

[0067] Next, as shown in Fig. 7, electronic components (LEDs 50, resistors, capacitors, control IC chips, etc.) are mounted on the conductive layer 30 with low-temperature solder 32. Here, the LEDs 50 are mounted on the LED pattern with low-temperature solder 32. Mounting with low-temperature solder 32 is performed by a localized instantaneous heating method using an infrared laser or the like. In this way, the circuit components 12 are formed.

[0068] 8, the mounting portion of the LED 50 and the backlight display area formed by the LED 50 are molded with a transparent resin (thermosetting resin or UV-curable resin) to form the light guide layer 60. Here, the light guide layer 60 is provided in a portion including the periphery of the LED 50 and the periphery of the electrostatic switch electrode 40. In this way, the circuit component 12 with the light guide layer 60 is formed.

[0069] Next, the circuit component 12 with the light-guiding layer 60 is placed in a mold as an insert. A fluid resin is poured into the mold to form a resin molded portion 70 that forms the light-shielding wall 74 and the reflective layer 72. Insert molding using a mold will be described with further reference to FIGS. 9 to 15 . FIG. 9 is a perspective view of a mold 80. FIG. 10 is an exploded perspective view of the mold 80. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 9 . FIG. 12 is a diagram showing how the fluid resin R flows. FIG. 12 is an enlarged view of region A3 in FIG. 11 . FIG. 13 is a diagram showing how the resin at the gate portion is removed. FIG. 14 is a cross-sectional view of the electrical component 10 after the resin at the gate portion has been removed. FIG. 15 is a rear view of the electrical component 10 after the resin at the gate portion has been removed. Note that in FIGS. 9 to 14 , illustrations of components of the circuit component 12 other than the base layer 20 are omitted.

[0070] The mold 80 includes a first mold part 81, a second mold part 84, and a third mold part 86. The second mold part 84 faces the first mold part 81. The third mold part 86 is fitted into the second mold part 84. The first mold part 81 and the second mold part 84 form the resin molding part 70. A gate 87, which serves as an inlet for the flowing resin R, is defined between the second mold part 84 and the third mold part 86.

[0071] The first mold part 81 includes a accommodating portion 82. The accommodating portion 82 is a recess formed on the surface of the first mold part 81 facing the second mold part 84. A portion of the circuit component 12 (here, a portion including the main body portion 23 of the base layer 20) that is to be the placement target for the resin molded portion 70 is placed in the accommodating portion 82. The circuit component 12 is placed so that the first surface 21 of the base layer 20 faces the second mold part 84 and the second surface 22 faces the first mold part 81. The circuit component 12 is placed so that the extension portion 24A of the base layer 20 is located on the third mold part 86 side.

[0072] The first mold part 81 includes a pin 83. The pin 83 is located outside the accommodation portion 82. The pin 83 is located on the opposite side of the accommodation portion 82 from the third mold part 86. With the circuit component 12 placed in a predetermined position relative to the first mold part 81, the pin 83 passes through the through-hole 24h of the extension portion 24B. This positions the circuit component 12 in a predetermined position relative to the mold 80. The extension portion 24B is sandwiched between the first mold part 81 and the second mold part 84. No resin molding portion 70 is provided on the main surface of the extension portion 24B.

[0073] A recess is formed on the surface of the third mold part 86 facing the second mold part 84. The recess forms a gate 87. The gate 87 includes a first path 88 and a second path 89 downstream of the first path 88. The first path 88 has a substantially uniform cross section and continues linearly in the Y direction. The second path 89 has a triangular shape in plan view. The dimension of the second path 89 in the width direction (here, the X direction) gradually increases from the first path 88 side toward the storage section 82 side.

[0074] After the circuit component 12 is placed in the first mold part 81, the third mold part 86 is fitted into the first mold part 81. The extension portion 24A is sandwiched in the Z direction by the first mold part 81 and the third mold part 86. The portion of the first mold part 81 that sandwiches the extension portion 24A is the peripheral edge of the accommodation part 82. The portion of the third mold part 86 that sandwiches the extension portion 24A is the portion that forms the second path 89. At the Y-direction end of the third mold part 86, the second path 89 is formed in the middle portion in the X direction, and the second path 89 is not formed at both X-direction ends. The dimension of the third mold part 86 in the X direction is approximately the same as the dimension of the extension portion 24A in the X direction. In the X direction, both ends of the second path 89 are located outside both ends of the extension portion 24A.

[0075] After the circuit components 12 and the third mold component 86 have been placed in the first mold component 81, the second mold component 84 is placed, completing preparation of the mold 80. Then, fluid resin R is poured into the mold 80. As shown in FIG. 12 , the fluid resin R flows through the first path 88 and the second path 89 of the gate 87 and reaches the first surface 21 of the base material layer 20 near the boundary between the extension portion 24A and the main body portion 23 of the base material layer 20. In other words, the fluid resin R first comes into contact with an area of ​​the first surface 21 that is more inward than the outer edge. This prevents the outer edge of the base material layer 20 from being caught in the fluid resin R.

[0076] The fluid resin R that has reached the first surface 21 of the base layer 20 permeates into the accommodation portion 82. The fluid resin R then spreads over a predetermined range within the accommodation portion 82. Here, the predetermined range is the entire surface of the first surface 21 of the main body portion 23. The fluid resin R spreads toward the outer edge of the first surface 21. At this time, in the portion where the light guide layer 60 and the conductive layer 30 are provided, the fluid resin R flows over the light guide layer 60 and the conductive layer 30. Because the electrostatic switch electrode 40 and the light source 50 are located inside the light guide layer 60, the fluid resin R is prevented from coming into contact with the electrostatic switch electrode 40 and the light source 50.

[0077] The fluid resin R that has spread over a predetermined range solidifies to form a resin portion including the molded resin portion 70. In the resin portion immediately after the fluid resin R solidifies, the gate resin portion G remaining at the gate 87 is also integrated with the molded resin portion 70. As shown in FIG. 13 , by cutting the gate resin portion G at a predetermined position with a cutting tool C, unnecessary portions of the gate resin portion G are cut off, and the molded resin portion 70 having a predetermined shape is completed. This completes the electrical component 10 shown in FIG. 1 . The gate resin portion G shown by the two-dot chain line in FIG. 13 is integrated with the molded resin portion 70, while the gate resin portion G shown by the solid line is separated from the molded resin portion 70.

[0078] The cut marks left by the separation of the gate resin part G are gate marks 76. Cut marks Ga corresponding to the gate marks 76 are formed in the gate resin part G. In each drawing, the gate marks 76 and the cut marks Ga are shown as continuous notches, but may also be flat surfaces.

[0079] 14 , the gate mark 76 may be formed on a surface of the resin molded portion 70 facing the direction in which the extending portion 24A protrudes (here, the Y direction). The surface of the resin molded portion 70 on which the gate mark 76 is formed may be a surface that contacts the first surface 21 of the extending portion 24A and intersects with the first surface 21. The gate mark 76 may be formed on a surface that faces the same side as the first surface 21 of the extending portion 24A (here, the Z direction).

[0080] In the example shown in FIG. 15 , the gate resin portion G is cut off at the downstream end of the second path 89. Therefore, the gate resin portion G is cut off so that almost none of it remains in the resin molding portion 70. The gate resin portion G may also be cut off so that a portion of it remains in the resin molding portion 70. For example, the gate resin portion G may be cut off between the first path 88 and the second path 89 so that the triangular portion of the gate resin portion G formed in the second path 89 remains in the resin molding portion 70. In this case, the triangular portion of the gate resin portion G formed in the second path 89 can also be considered to be the gate mark. During molding, the third mold part 86 is positioned between the triangular portion of the gate resin portion G formed in the second path 89 and the first surface 21 of the extension portion 24A. Therefore, the triangular portion of the gate resin portion G formed in the second path 89 and the first surface 21 of the extension portion 24A do not contact each other, or even if they contact each other, they are not fused together.

[0081] The width dimension of the extension portion 24A is larger than the width dimension of the gate mark 76. In the example shown in FIG. 15 , dimension D1 indicates the width dimension of the gate mark 76. Dimension D2 indicates the width dimension of the extension portion 24A. Dimensions D1 and D2 are the dimensions of the portion extending along the first surface 21. Here, dimensions D1 and D2 are the dimensions of the portion extending along the X direction. The width dimension of the gate mark 76 is the same as the width dimension of the downstream end of the second path 89. The width dimension of the extension portion 24A is, for example, the dimension of the portion of the extension portion 24A that connects to the main body portion 23. As shown in FIG. 15 , dimension D2 is larger than dimension D1. Furthermore, both X-direction ends of the gate mark 76 are located between both X-direction ends of the extension portion 24A.

[0082] As shown in FIG. 1 , for example, the electrical component 10 is connected to a device 92 via a connection wiring 90. The conductive layer 30 has a connection portion 31 with the connection wiring 90. In the electrical component 10, the connection portion 31 is provided on the extension portion 24B. The connection portion 31 is not covered by the resin molded portion 70. The connection portion 31 of the conductive layer 30 extends from the main body portion 23 to the extension portion 24B. The connection wiring 90 is, for example, a flexible printed circuit board (FPC). The connection wiring 90 may be wiring other than an FPC. The device 92 is, for example, a control device such as an electronic control unit (ECU). The device 92 may be a device other than a control device.

[0083] The extension portion 24B also has a pair of through holes 24h formed therein for passing the pins 83. Here, the conductive layer 30 in the extension portion 24B extends from the base end of the extension portion 24B on the main body portion 23 side through between the pair of through holes 24h to the tip of the extension portion 24B on the side opposite the main body portion 23 side. For example, a connection portion 31 is provided at the tip of the extension portion 24B.

[0084] <Effects, etc.> In the electrical equipment 10 configured as described above, the resin molded portion 70 is provided, for example, for insulating and protecting the conductive layer 30. Because the gate mark 76 of the resin molded portion 70 is positioned to overlap the extension portion 24A, the entrance of the fluid resin R poured into the mold 80 during insert molding is located at the extension portion 24A. This prevents the edge of the base layer 20 in the main body portion 23 from being caught in the fluid resin R flowing from outside the edge, thereby preventing deformation of the edge of the base layer 20 in the main body portion 23. Furthermore, because the fluid resin R flows from the extension portion 24A side adjacent to the main body portion 23, the thermal effects on the main body portion 23 are reduced. Furthermore, the fluid resin R is prevented from flowing toward the second surface 22 of the base layer 20.

[0085] Furthermore, the width dimension D2 of the extension portion 24A is larger than the width dimension D1 of the gate mark 76. As a result, both ends of the gate 87 in the width direction (here, the X direction) are located on the extension portion 24A, which more reliably prevents the outer edge of the base material layer 20 from being caught in the fluid resin R and the fluid resin R from flowing toward the second surface 22 of the base material layer 20.

[0086] Furthermore, since the main body 23 has a three-dimensional shape with the first surface 21 being concave and the second surface 22 being convex, if the extension 24A were not present, the outer edge of the main body 23 would be easily caught in the fluid resin R. Even in this case, the provision of the flat extension 24A can more reliably prevent the outer edge of the main body 23 from being caught in the fluid resin R.

[0087] The base layer 20 also includes a base film layer 20A and a decorative layer 20B laminated to the base film layer 20A. The decorative layer 20B contains a colorant and appears on the first surface 21 of the base layer 20. The decorative layer 20B can be affected by heat. For example, if the temperature of the fluid resin R is too high, the colorant, such as paint or ink, may flow due to the fluid resin R. Even in this case, the gate marks 76 are provided on the extension portion 24A, which separates the main body portion 23 from the gate 87, thereby suppressing the thermal effect of the fluid resin R on the decorative layer 20B in the main body portion 23.

[0088] The circuit component 12 also includes a light source 50 mounted on the conductive layer 30 and a light guide layer 60 surrounding the light source 50, and the resin molded portion 70 includes a reflective layer 72 that contacts the light guide layer 60 and reflects light from the light source 50. This makes it possible to suppress deformation of the edge of the base layer 20 due to the flowing resin R when the resin reflective layer 72 is provided on the base layer 20.

[0089] [Note] Fig. 16 is a rear view showing an electrical component 110 according to a modified example. In the first embodiment, the connection portion 31 is described as being provided on the extension portion 24B without the gate mark 76, but this is not a required configuration. The connection portion 31 may be provided at a position other than the extension portion 24B. For example, the connection portion 31 may be provided on the main body portion 23. Also, for example, the connection portion 31 may be provided on the extension portion 24A with the gate mark 76, as in the electrical component 110 shown in Fig. 16.

[0090] Specifically, in the electrical component 110, the conductive layer 30 extends to the first surface 21 of the extending portion 24A, and the conductive layer 30 of the extending portion 24A is provided with a connection portion 31 with the connection wiring 90. This makes it easy to connect the conductive layer 30 and the connection wiring 90 using the connection portion 31 of the extending portion 24A after the resin molded portion 70 is molded.

[0091] Furthermore, in the electrical component 110, the path of the conductive layer 30 on the extension portion 24A avoids the gate marks 76. Specifically, the conductive layer 30 passes through a position in the molded resin portion 70 that is further outward in the X direction than the gate marks 76, and extends from the main body portion 23 toward the extension portion 24A. As shown in FIG. 16 , the conductive layer 30 on the extension portion 24A extends along the outer edge of the triangular gate resin portion G toward the tip of the extension portion 24A on the side opposite to the main body portion 23. Note that although the conductive layer 30 on the extension portion 24A is provided on both sides of the triangular gate resin portion G, it may be provided on only one side.

[0092] Here, the portion of the extension portion 24A that corresponds to the gate mark 76 is more affected by the heat of the fluid resin R than the portion that does not correspond to the gate mark 76. The path of the conductive layer 30 in the extension portion 24A is a path that avoids the gate mark 76, so that the effect of heat on the conductive layer 30 in the extension portion 24A can be suppressed.

[0093] The resin molding portion 70 is located downstream of the gate 87 along the path of the fluid resin R. Therefore, the thermal effect on the conductive layer 30 in the main body 23 is smaller than at the position of the gate 87. Furthermore, when the connection portion 31 is provided in the extension portion 24B as in the above-described electrical component 10, the path of the fluid resin R is not set in the extension portion 24B, and therefore the thermal effect on the conductive layer 30 in the extension portion 24B is small.

[0094] The electrical component 110 also includes a protective resin portion 34. The protective resin portion 34 is a separate component from the molded resin portion 70. The protective resin portion 34 covers the first surface 21 of the extension portion 24A and the conductive layer 30 of the extension portion 24A. This protects the conductive layer 30 of the extension portion 24A. The protective resin portion 34 is provided at a position that avoids the connection portion 31 with the connection wiring 90. The protective resin portion 34 may be, for example, an adhesive sheet.

[0095] In addition, although the electrical components 10 and 110 have been described as being touch panel devices, this is not a required configuration. The electrical components 10 and 110 may be devices other than touch panel devices. In this case, the electrical components do not need to include LEDs and light guide layers. If the electrical components do not include LEDs, it is preferable that the electrical components include electronic elements other than LEDs.

[0096] Furthermore, although the bonding layer 32 on which the LED 50 is mounted has been described as being made of low-temperature solder 32, this is not a required configuration. The bonding layer 32 on which the LED 50 is mounted may be made of a material other than low-temperature solder 32, such as a conductive adhesive. When the bonding layer 32 is made of a conductive adhesive, the conductive layer 30 does not need to have solder wettability. Therefore, even when three-dimensionally molding a circuit component 12 in which a conductive layer 30 made of a conductive paste coating is provided on a base layer 20, it is easy to select a material for the coating that is easy to stretch. In other words, it is possible to consider stretchability and electrical connectivity after stretching without considering solder wettability, thereby broadening the range of material selection.

[0097] Such conductive adhesive may be, for example, Ag-based or Ni-based. In the case of conductive adhesive mounting, since solder wettability is not required, the average particle diameter of the filler may be smaller than 6 μm. For example, in the case of conductive adhesive mounting, the average particle diameter of the filler is preferably 1 μm or more.

[0098] In the case of conductive adhesive mounting, since solder wettability is not required, the particle shape may be a shape other than flake or scale shape. In the case of conductive adhesive mounting, the particle shape may include at least one shape selected from the group consisting of spherical, flake, dendritic, and scale shapes.

[0099] Even when a conductive adhesive is used, it is preferable that the filler have an average particle size of 5 μm or more and that the filler particles have a flake or scale-like shape in order to suppress an increase in resistance when the conductive layer 30 is stretched during three-dimensional molding. When the filler has an average particle size of 5 μm or more and that the filler particles have a flake or scale-like shape, the filler particles are more likely to come into surface contact with each other. Therefore, even when the conductive layer 30 is stretched, contact points between the filler particles are more likely to be secured, making it easier to suppress an increase in resistance.

[0100] In the case of conductive adhesive mounting, since solder wettability is not required, the mass fraction of the filler in the coating may be 90 wt% or less. For example, the mass fraction of the filler in the coating may be 70 wt% to 95 wt%, or 80 wt% to 90 wt%. If the filler loading is too low, the resistance will be high, and if it is too high, flexibility will be impaired.

[0101] Alternatively, the light guide layer 60 and the resin molded portion 70 may face each other with a gap therebetween. An air layer may be provided between the light guide layer 60 and the resin molded portion 70. The air layer may be used as the reflective layer 72.

[0102] The configurations described in the above embodiments and modifications can be combined as appropriate as long as they are not mutually contradictory.

[0103] REFERENCE SIGNS LIST 10, 110 Electrical equipment 12 Circuit component 14 Indicator 20 Base material layer 20A Base material film layer 20B Decorative layer 21 First surface 22 Second surface 23 Main body portion 24, 24A, 24B Extension portion 24h Through hole 25 First region 26 Second region 27 Third region 28 Fourth region 30 Conductive layer 31 Connection portion 32 Bonding layer (low-temperature solder) 34 Protective resin portion 40 Electrostatic switch electrode 50 LED (light source) 60 Light-guiding layer 70 Resin molded portion 72 Reflective layer 74 Light-shielding wall 76 Gate mark 80 Mold 81 First mold part 82 Storage portion 83 Pin 84 Second mold part 86 Third mold part 87 Gate 88 First path 89 Second path 90 Connection wiring 92 Equipment C Cutting tool D1, D2 Dimensions G Gate resin part Ga Cutting mark R Flow resin UF Finger

Claims

1. An electrical device comprising: a circuit component including a film-like base layer having a first surface and a second surface facing inversely to each other, and a conductive layer laminated on the first surface of the base layer; and a resin molded part insert-molded with the circuit component as an insert, wherein the base layer has a main body portion on which the resin molded part is provided, and an extension portion extending from the main body portion, the conductive layer is partially provided on the first surface of the main body portion, the resin molded part is laminated on the conductive layer and the first surface of the main body portion, and a gate trace of the resin molded part is provided in a position overlapping with the extension portion.

2. An electrical component according to claim 1, wherein the conductive layer extends to the first surface of the extension portion, and the conductive layer of the extension portion is provided with a connection portion for connection with a connection wiring.

3. An electrical component according to claim 2, wherein the path of the conductive layer in the extension portion is a path that avoids the gate trace.

4. An electrical component according to claim 2 or 3, comprising a protective resin part that is a separate part from the resin molded part and covers the first surface of the extension part and the conductive layer of the extension part.

5. An electrical component according to any one of claims 1 to 3, wherein the width of the extension is greater than the width of the gate mark.

6. An electrical device according to any one of claims 1 to 3, wherein the main body has a three-dimensional shape in which the first surface is concave and the second surface is convex, and the extension has a flat shape in which both the first surface and the second surface are flat.

7. An electrical device according to any one of claims 1 to 3, wherein the base layer has a base film layer and a decorative layer laminated on the base film layer, the decorative layer having a colorant and appearing on the first surface of the base layer.

8. An electrical device according to any one of claims 1 to 3, wherein the circuit component includes a light source mounted on the conductive layer and a light guide layer surrounding the light source, and the resin molded portion includes a reflective layer in contact with the light guide layer to reflect light from the light source.

Images