Composite material, composite material layer, and thermal interface material with thermal conductivity properties

Abstract

The subject application relates to a composite material that may include a silicone-based matrix component, and a filler package component. The filler package component may include a first thermally conductive filler component and a second thermally conductive filler component. The first thermally conductive filler component may have an average particle size of at least about 30 microns and not greater than about 150 microns, and the second thermally conductive filler component may have an average particle size of at least about 1 micron and not greater than about 10 microns. The composite material may have a thermal conductivity of at least about 1.0 W / mk and not greater than about 5.0 W / mk.

Description

[0001] COMPOSITE MATERIAL, COMPOSITE MATERIAL LAYER, AND THERMAL INTERFACE MATERIAL WITH THERMAL CONDUCTIVITY PROPERTIES

[0002] TECHNICAL FIELD

[0003] The present disclosure relates to a composite material, and a thermal interface material, in particular, a composite material, and a thermal interface material for use as a gap filler in various applications, for example, in a battery pack or battery module, and methods of forming the same.

[0004] BACKGROUND ART

[0005] Composite materials may be designed for high temperature protection in various applications, for example, for use as gap fillers in electric vehicle battery packs or battery modules for electronic vehicles. However, in these, and in other applications, such gap fillers are commonly required to be soft for compression while also guaranteeing excellent contact between interfaces. Accordingly, there is a continuing need for improved gap filler designs that balance compression capability with excellent thermal conductivity.

[0006] SUMMARY

[0007] According to a first aspect, a composite material may include a silicone-based matrix component, and a filler package component. The filler package component may include a first thermally conductive filler component and a second thermally conductive filler component. The first thermally conductive filler component may have an average particle size of at least about 30 microns and not greater than about 150 microns, and the second thermally conductive filler component may have an average particle size of at least about 1 micron and not greater than about 10 microns. The composite material may have a thermal conductivity of at least about 1.0 W / mk and not greater than about 5.0 W / mk.

[0008] According to another aspect, a composite material may include a silicone-based matrix component, and a filler package component. The filler package component may include a first thermally conductive filler component and a second thermally conductive filler component. The first thermally conductive filler component may have an average particle size of at least about 30 microns and not greater than about 150 microns, and the second thermally conductive filler component may have an average particle size of at least about 1 micron and not greater than about 10 microns. The composite material may have a hardness of at least about 20 Shore OO and not greater than about 70 Shore OO.

[0009] According to yet another aspect, a thermal interface material may include a silicone- based matrix component, and a filler package component. The filler package component may include a first thermally conductive filler component and a second thermally conductive filler component. The first thermally conductive filler component may have an average particle size of at least about 30 microns and not greater than about 150 microns, and the second thermally conductive filler component may have an average particle size of at least about 1 micron and not greater than about 10 microns. The composite material may have a thermal conductivity of at least about 1.0 W / mk and not greater than about 6.0 W / mk.

[0010] According to another aspect, a thermal interface material may include a silicone-based matrix component, and a filler package component. The filler package component may include a first thermally conductive filler component and a second thermally conductive filler component. The first thermally conductive filler component may have an average particle size of at least about 30 microns and not greater than about 150 microns, and the second thermally conductive filler component may have an average particle size of at least about 1 micron and not greater than about 10 microns. The composite material may have a hardness of at least about 20 Shore OO and not greater than about 70 Shore OO.

[0011] BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Embodiments are illustrated by way of example and are not limited to the accompanying figures.

[0013] FIG. 1 includes an illustration of an example composite material according to certain embodiments described herein.

[0014] Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale.

[0015] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The following discussion will focus on specific implementations and embodiments of the teachings. The detailed description is provided to assist in describing certain embodiments and should not be interpreted as a limitation on the scope or applicability of the disclosure or teachings. It will be appreciated that other embodiments can be used based on the disclosure and teachings as provided herein.

[0017] The terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a method, article, or apparatus that comprises a list of features is not necessarily limited only to those features but may include other features not expressly listed or inherent to such method, article, or apparatus. Further, unless expressly stated to the contrary, “or” refers to an inclusive-or and not to an exclusive-or. For example, a condition A or B is satisfied by any one of the following: A is true (or present), and B is false (or not present), A is false (or not present), and B is true (or present), and both A and B are true (or present).

[0018] Also, the use of “a” or “an” is employed to describe elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be read to include one, at least one, or the singular as also including the plural, or vice versa, unless it is clear that it is meant otherwise. For example, when a single item is described herein, more than one item may be used in place of a single item. Similarly, where more than one item is described herein, a single item may be substituted for that more than one item.

[0019] Embodiments described herein are generally directed to a composite material that may include a silicone-based matrix component, a reinforcing filler component distributed within the silicone-based matrix component, and a ceramization filler composition distributed within the silicone-based matrix component.

[0020] For purposes of illustration, FIG. 1 shows a composite material 100 according to embodiments described herein. As shown in FIG. 1, a composite material 100 may include a silicone-based matrix component 110, and a filler package component 120 distributed within the silicone-based matrix component 110. As further shown in FIG. 1, the filler package component 120 may include a first thermally conductive filler component 123 and a second thermally conductive filler component 125.

[0021] According to particular embodiments, the silicone-based matrix component 110 of the composite material 100 may include a particular material. For example, the silicone-based matrix component 110 may include silicone. According to yet other embodiments, the silicone-based matrix component 110 may consist of silicone.

[0022] According to still other embodiments, the silicone-based matrix may include a polysiloxane matrix. According to yet other embodiments, the silicone-based matrix component 110 may include a poly dimethylsiloxane gum having an average molecule weight between 300,000 and 800,000, or a liquid polydimethylsiloxane polymer having a viscosity of between 50 cst and 100,000 cst. According to yet other embodiments, the silicone-based matrix component 110 may include a vinyl and Si-hydrogen group which can react with each other in the presence of a platinum catalyst, a peroxide catalyst, a tin catalyst, or a titanium catalyst.

[0023] According to still other embodiments, the composite material 100 may include a particular content of the silicone-based matrix component 110. For example, the composite material 100 may include a silicone-based matrix component content of at least about 5 wt.% for a total weight of the composite material 100, such as, at least about 5.5 wt.% or at least about 6 wt.% or at least about 6.5 wt.% or at least about 7 wt.% or at least about 7.5 wt.% or at least about 8 wt.% or even at least about 8.5 wt.%. According to still other embodiments, the composite material 100 may include a silicone-based matrix component content of not greater than about 15 wt.% for a total weight of the composite material 100, such as, not greater than about 14.5 wt.% or not greater than about 14 wt.% or not greater than about 13.5 wt.% or even not greater than about 13 wt.%. It will be appreciated that composite material 100 may include a silicone-based matrix component content of any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the composite material 100 may include a silicone-based matrix component content of any value between any of the minimum and maximum values noted above.

[0024] According to still other embodiments, the composite material 100 may further include a platinum complex hydrosilylation catalyst. According to yet other embodiments, the composite material 100 may include a platinum complex hydrosilylation catalyst at a content of at least about 3 ppm of the composite material.

[0025] According to yet other embodiments, the composite material 100 may include a particular content of the first thermally conductive filler component 123 relative to the second thermally conductive filler component 125. For purposes of embodiments described herein, the composite material may be described has having a particular thermally conductive filler component content ratio TCF1 / TCF2, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the composite material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the composite material. For example, the composite material 100 may have a thermally conductive filler component content ratio TCF1 / TCF2 of at least about 1.2, such as, at least about 1.3 or at least about 1.4 or at least about 1.5 or at least about 1.6 or at least about 1.7 or at least about 1.8 or at least about 1.9 or even at least about 2.0. According to still other embodiments, the composite material 100 may have a thermally conductive filler component ratio TCF1 / TCF2 of not greater than about 3.0, such as, not greater than about 2.9 or not greater than about 2.8 or not greater than about 2.7 or not greater than about 2.6 or even not greater than about 2.5. It will be appreciated that composite material 100 may include a thermally conductive filler component ratio TCF1 / TCF2 of any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the composite material 100 may include a thermally conductive filler component ratio TCF1 / TCF2 of any value between any of the minimum and maximum values noted above.

[0026] According to still other embodiments, the composite material 100 may include a particular content of the filler package component 120. For example, the composite material 100 may include a filler package component content of at least about 85 wt.% for a total weight of the composite material 100, such as, at least about 85.5 wt.% or at least about 86 wt.% or at least about 86.5 wt.% or at least about 87 wt.% or at least about 87.5 wt.% or at least about 88 wt.% or at least about 88.5 wt.% or at least about 89 wt.% or at least about 89.5 wt.% or even at least about 90 wt.%. According to still other embodiments, the composite material 100 may include a filler package component content of not greater than about 95 wt.% for a total weight of the composite material 100, such as, not greater than about 94.5 wt.% or not greater than about 94 wt.% or not greater than about 93.5 wt.% or not greater than about 93.0 wt.% or not greater than about 92.5 wt.% or not greater than about 92.0 wt.% or not greater than about 91.5 wt.% or not greater than about 91.0 wt.% or even not greater than about 90.5 wt.%. It will be appreciated that composite material 100 may include a filler package component content of any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the composite material 100 may include a filler package component content of any value between any of the minimum and maximum values noted above.

[0027] According to particular embodiments, the first thermally conductive filler component 123 may have a particular average particle size as measured according to ASTM E2651. For example, the first thermally conductive filler component 123 may have an average particle size of at least about 30 microns, such as, at least about 35 microns or at least about 40 microns or at least about 45 microns or at least about 50 microns or at least about 55 microns or at least about 60 microns or at least about 65 microns or at least about 70 microns or even at least about 75 microns. According to still other embodiments, the first thermally conductive filler component 123 may have an average particle size of not greater than about 150 microns, such as, not greater than about 145 microns or not greater than about 140 microns or not greater than about 135 microns or not greater than about 130 microns or not greater than about 125 microns or not greater than about 120 microns or not greater than about 115 microns or not greater than about 110 microns or not greater than about 105 microns or even not greater than about 100 microns. It will be appreciated that the average particle size of the first thermally conductive filler component 123 may be any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the average particle size of the first thermally conductive filler component 123 may be any value between any of the minimum and maximum values noted above.

[0028] According to still other embodiments, the composite material 100 may include a particular content of the first thermally conductive filler component 123. For example, the composite material 100 may include a first thermally conductive filler component content of at least about 40 wt.% for a total weight of the composite material 100, such as, at least about 43 wt.% or at least about 45 wt.% or at least about 48 wt.% or at least about 50 wt.% or at least about 53 wt.% or at least about 55 wt.% or at least about 58 wt.% or even at least about 60 wt.%. According to still other embodiments, the composite material 100 may include a first thermally conductive filler component content of not greater than about 70 wt.% for a total weight of the composite material 100, such as, not greater than about 69 wt.% or not greater than about 68 wt.% or not greater than about 67 wt.% or not greater than about 65 wt.% or not greater than about 64 wt.% or not greater than about 63 wt.% or not greater than about 62 wt.% or even not greater than about 61.0 wt.%. It will be appreciated that composite material 100 may include a first thermally conductive filler component content of any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the composite material 100 may include a first thermally conductive filler component content of any value between any of the minimum and maximum values noted above.

[0029] According to certain embodiments, the first thermally conductive filler component 123 may include a particular material. According to certain embodiments, the first thermally conductive filler component 123 may include alumina. According to still other embodiments, the first thermally conductive component may consist of alumina. According to certain other embodiments, the first thermally conductive filler component 123 may include aluminum hydroxide (ATH). According to still other embodiments, the first thermally conductive component may consist of aluminum hydroxide (ATH). According to certain other embodiments, the first thermally conductive filler component 123 may include any combination of alumina and aluminum hydroxide (ATH). According to still other embodiments, the first thermally conductive component may consist of any combination of alumina and aluminum hydroxide (ATH).

[0030] According to certain embodiments, the first thermally conductive filler component 123 may include a particular material. According to certain embodiments, the first thermally conductive filler component 123 may include spherical alumina. According to still other embodiments, the first thermally conductive component may consist of spherical alumina. According to certain other embodiments, the first thermally conductive filler component 123 may include spherical aluminum hydroxide (ATH). According to still other embodiments, the first thermally conductive component may consist of spherical aluminum hydroxide (ATH). According to certain other embodiments, the first thermally conductive filler component 123 may include any combination of spherical alumina and spherical aluminum hydroxide (ATH). According to still other embodiments, the first thermally conductive component may consist of any combination of spherical alumina and spherical aluminum hydroxide (ATH).

[0031] According to particular embodiments, the second thermally conductive filler component 125 may have a particular average particle size as measured according to ASTM E2651. For example, the second thermally conductive filler component 125 may have an average particle size of at least about 1 micron, such as, at least about 1.5 microns or at least about 2 microns or at least about 2.5 microns or at least about 3 microns or at least about 3.5 microns or at least about 4 microns or even at least about 4.5 microns. According to still other embodiments, the second thermally conductive filler component 125 may have an average particle size of not greater than about 10 microns, such as, not greater than about 9.5 microns or not greater than about 9 microns or not greater than about 8.5 microns or not greater than about 8.0 microns or not greater than about 7.5 microns or not greater than about 7 microns or not greater than about 6.5 microns or not greater than about 6 microns or even not greater than about 5.5 microns. It will be appreciated that the average particle size of the second thermally conductive filler component 125 may be any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the average particle size of the second thermally conductive filler component 125 may be any value between any of the minimum and maximum values noted above.

[0032] According to still other embodiments, the composite material 100 may include a particular content of the second thermally conductive filler component 125. For example, the composite material 100 may include a second thermally conductive filler component content of at least about 15 wt.% for a total weight of the composite material 100, such as, at least about 18 wt.% or at least about 20 wt.% or at least about 23 wt.% or at least about 25 wt.% or at least about 28 wt.% or at least about 30 wt.% or at least about 33 wt.% or even at least about 35 wt.%. According to still other embodiments, the composite material 100 may include a second thermally conductive filler component content of not greater than about 45 wt.% for a total weight of the composite material 100, such as, not greater than about 44 wt.% or not greater than about 43 wt.% or not greater than about 42 wt.% or not greater than about 41 wt.% or not greater than about 40 wt.% or not greater than about 39 wt.% or not greater than about 38 wt.% or even not greater than about 37.0 wt.%. It will be appreciated that composite material 100 may include a second thermally conductive filler component content of any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the composite material 100 may include a second thermally conductive filler component content of any value between any of the minimum and maximum values noted above.

[0033] According to certain embodiments, the second thermally conductive filler component 125 may include a particular material. According to certain embodiments, the second thermally conductive filler component 125 may include alumina. According to still other embodiments, the second thermally conductive component may consist of alumina. According to certain other embodiments, the second thermally conductive filler component 125 may include aluminum hydroxide (ATH). According to still other embodiments, the second thermally conductive component may consist of aluminum hydroxide (ATH). According to certain other embodiments, the second thermally conductive filler component 125 may include any combination of alumina and aluminum hydroxide (ATH). According to still other embodiments, the second thermally conductive component may consist of any combination of alumina and aluminum hydroxide (ATH).

[0034] According to certain embodiments, the second thermally conductive filler component 125 may include a particular material. According to certain embodiments, the second thermally conductive filler component 125 may include spherical alumina. According to still other embodiments, the second thermally conductive component may consist of spherical alumina. According to certain other embodiments, the second thermally conductive filler component 125 may include spherical aluminum hydroxide (ATH). According to still other embodiments, the second thermally conductive component may consist of spherical aluminum hydroxide (ATH). According to certain other embodiments, the second thermally conductive filler component 125 may include any combination of spherical alumina and spherical aluminum hydroxide (ATH). According to still other embodiments, the second thermally conductive component may consist of any combination of spherical alumina and spherical aluminum hydroxide (ATH).

[0035] According to still other embodiments, the composite material 100 may further include a mono-vinyl functionalized oil.

[0036] According to still other embodiments, the composite material 100 may include a particular content of mono-vinyl functionalized oil. For example, the composite material 100 may include a mono-vinyl functionalized oil content of at least about 2 wt.% for a total weight of the composite material 100, such as, at least about 2.1 wt.% or at least about 2.2 wt.% or even at least about 2.3 wt.%. According to still other embodiments, the composite material 100 may include a mono-vinyl functionalized oil content of not greater than about 3 wt.% for a total weight of the composite material 100, such as, not greater than about 2.9 wt.% or not greater than about 2.8 wt.% or even not greater than about 2.7 wt.%. It will be appreciated that composite material 100 may include a mono-vinyl functionalized oil content of any value within a range between any of the minimum and maximum values noted above. It will be further appreciated that the composite material 100 may include a mono-vinyl functionalized oil content of any value between any of the minimum and maximum values noted above.

[0037] According to yet other embodiments, the composite material 100 may have a particular density. For the purpose of embodiments described herein, the density of the composite material 100 may be determined according to ASTM D792. According to certain embodiments, the composite material 100 may have a density of not greater than about 3.5 g / cc, such as, not greater than about 3.4 g / cc or not greater than about 3.3 g / cc or not greater than about 3.2 g / cc or not greater than about 3.1 g / cc or not greater than about 3.0 g / cc or even not greater than about 2.9 g / cc. According to yet other embodiments, the composite material 100 may have a density of at least about 2.0 g / cc, such as, at least about 2.1 g / cc or at least about 2.2 g / cc or at least about 2.3 g / cc or at least about 2.4 g / cc or even at least about 2.5 g / cc. It will be appreciated that the density of the composite material 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the density of the composite material 100 may be any value between any of the minimum and maximum values noted above.

[0038] According to yet other embodiments, the composite material 100 may have a particular hardness. For the purpose of embodiments described herein, the hardness of the composite material 100 may be determined according to ASTM D2240. According to certain embodiments, the composite material 100 may have a hardness of at least about 20 Shore OO, such as, at least about 21 Shore OO or at least about 22 Shore OO or at least about 23

[0039] Shore OO or at least about 24 Shore OO or at least about 25 Shore OO or at least about 26

[0040] Shore OO or at least about 27 Shore OO or at least about 28 Shore OO or at least about 29

[0041] Shore OO or at least about 30 Shore OO or at least about 31 Shore OO or at least about 32

[0042] Shore OO or at least about 33 Shore OO or at least about 34 Shore OO or even at least about

[0043] 35 Shore OO. According to yet other embodiments, the composite material 100 may have a hardness of not greater than about 70 Shore OO, such as, not greater than about 70 Shore OO or not greater than about 69 Shore 00 or not greater than about 68 Shore 00 or not greater than about 67 Shore 00 or not greater than about 66 Shore 00 or even not greater than about 65 Shore 00. It will be appreciated that the hardness of the composite material 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the hardness of the composite material 100 may be any value between any of the minimum and maximum values noted above.

[0044] According to yet other embodiments, the composite material 100 may have a particular thermal conductivity. For the purpose of embodiments described herein, the thermal conductivity of the composite material 100 may be determined according to ASTM D5470. According to certain embodiments, the composite material 100 may have a thermal conductivity of at least about 1.0 W / mk, such as, at least about 1.1 W / mk or at least about 1.2 W / mk or at least about 1.3 W / mk or at least about 1.4 W / mk or at least about 1.5 W / mk or at least about 1.6 W / mk or at least about 1.7 W / mk or at least about 1.8 W / mk or at least about

[0045] 1.9 W / mk or at least about 2.0 W / mk or at least about 2.1 W / mk or at least about 2.2 W / mk or at least about 2.3 W / mk or at least about 2.4 W / mk or at least about 2.5 W / mk or at least about 2.6 W / mk or at least about 2.7 W / mk or at least about 2.8 W / mk or even at least about

[0046] 2.9 W / mk. According to yet other embodiments, the composite material 100 may have a thermal conductivity of not greater than about 5.0 W / mk, such as, not greater than about 4.9 W / mk or not greater than about 4.8 W / mk or not greater than about 4.7 W / mk or not greater than about 4.6 W / mk or not greater than about 4.5 W / mk or not greater than about 4.4 W / mk or not greater than about 4.3 W / mk or not greater than about 4.2 W / mk or not greater than about 4.1 W / mk or not greater than about 4.0 W / mk or not greater than about 3.9 W / mk or not greater than about 3.8 W / mk or not greater than about 3.7 W / mk or not greater than about 3.6 W / mk or not greater than about 3.5 W / mk or not greater than about 3.4 W / mk or not greater than about 3.3 W / mk or not greater than about 3.2 W / mk or not greater than about 3.1 W / mk or even not greater than about 3.0 W / mk. It will be appreciated that the thermal conductivity of the composite material 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the thermal conductivity of the composite material 100 may be any value between any of the minimum and maximum values noted above.

[0047] According to yet other embodiments, the composite material 100 may have a particular deflection force under compression as measured according to the following method; 1) the sample is kept at RT for 24hrs after curing, 2) the sample dimension is 14 mm in diameter and 2.5+ / -0.1 mm in thickness, 3) the sample is compressed with rate of 0.5 mm / s until it reaches 30% deflection, and 4) the force to deflect after 60 seconds compression is recorded as deflection force. For purposes of this method, the average deflection force is taken from at least three tests. According to certain embodiments, the composite material 100 may have a deflection force of at least about 2 psi, such as, at least about 3 psi or at least about 4 psi or at least about 5 psi or at least about 6 psi or at least about 7 psi or at least about 8 psi or at least about 9 psi or at least about 10 psi or at least about 13 psi or at least about 15 psi or at least about 18 psi or at least about 20 psi or even at least about 23 psi. According to yet other embodiments, the composite material 100 may have a deflection force of not greater than about 40 psi, such as, not greater than about 39 psi or not greater than about 38 psi or not greater than about 37 psi or not greater than about 36 psi or not greater than about 35 psi or not greater than about 34 psi or not greater than about 33 psi or not greater than about 32 psi or not greater than about 31 psi or not greater than about 30 psi or not greater than about 29 psi or not greater than about 28 psi or even not greater than about 27 psi. It will be appreciated that the deflection force of the composite material 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the deflection force of the composite material 100 may be any value between any of the minimum and maximum values noted above.

[0048] Referring now to embodiments of the composite material layer, the composite material described herein may be formed as a layer of material. It will be appreciated that according to particular embodiments, a composite material layer described herein may include any of the components described herein with reference to the composite material 100. It will be further appreciated that according to particular embodiments, a composite material layer described herein may have any of the characteristics described herein with reference to the composite material 100.

[0049] According to yet other embodiments, the composite material layer may have a particular thickness. For example, the composite material layer may have a thickness of at least about 0.2 mm, such as, at least about 0.5 mm or at least about 1.0 mm or at least about

[0050] 1.5 mm or at least about 2.0 mm or at least about 2.5 mm or at least about 3.0 mm or at least about 3.5 mm or at least about 4.0 mm or at least about 4.5 mm or even at least about 5.0 mm. According to still other embodiments, the composite material layer may have a thickness of not greater than about 10 mm, such as, not greater than about 9.5 mm or not greater than about 9.0 mm or not greater than about 8.5 mm or not greater than about 8.0 mm or not greater than about 7.5 mm or not greater than about 7.0 mm or not greater than about

[0051] 6.5 mm or even not greater than about 6.0 mm. It will be appreciated that the thickness of the composite material layer may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the thickness of the composite material layer may be any value between any of the minimum and maximum values noted above.

[0052] According to yet other embodiments, the composite material layer may have a particular density. For the purpose of embodiments described herein, the density of the composite material layer may be determined according to ASTM D792. According to certain embodiments, the composite material layer may have a density of not greater than about 3.5 g / cc, such as, not greater than about 3.4 g / cc or not greater than about 3.3 g / cc or not greater than about 3.2 g / cc or not greater than about 3.1 g / cc or not greater than about 3.0 g / cc or even not greater than about 2.9 g / cc. According to yet other embodiments, the composite material layer may have a density of at least about 2.0 g / cc, such as, at least about 2.1 g / cc or at least about 2.2 g / cc or at least about 2.3 g / cc or at least about 2.4 g / cc or even at least about 2.5 g / cc. It will be appreciated that the density of the composite material layer may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the density of the composite material layer may be any value between any of the minimum and maximum values noted above.

[0053] According to yet other embodiments, the composite material layer may have a particular hardness. For the purpose of embodiments described herein, the hardness of the composite material layer may be determined according to ASTM D2240. According to certain embodiments, the composite material layer may have a hardness of at least about 20 Shore 00, such as, at least about 21 Shore 00 or at least about 22 Shore 00 or at least about 23 Shore 00 or at least about 24 Shore 00 or at least about 25 Shore 00 or at least about 26

[0054] Shore 00 or at least about 27 Shore 00 or at least about 28 Shore 00 or at least about 29

[0055] Shore 00 or at least about 30 Shore 00 or at least about 31 Shore 00 or at least about 32

[0056] Shore 00 or at least about 33 Shore 00 or at least about 34 Shore 00 or even at least about

[0057] 35 Shore 00. According to yet other embodiments, the composite material layer may have a hardness of not greater than about 70 Shore 00, such as, not greater than about 70 Shore 00 or not greater than about 69 Shore 00 or not greater than about 68 Shore 00 or not greater than about 67 Shore 00 or not greater than about 66 Shore 00 or even not greater than about 65 Shore 00. It will be appreciated that the hardness of the composite material layer may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the hardness of the composite material layer may be any value between any of the minimum and maximum values noted above. According to yet other embodiments, the composite material layer may have a particular thermal conductivity. For the purpose of embodiments described herein, the thermal conductivity of the composite material layer may be determined according to ASTM D5470. According to certain embodiments, the composite material layer may have a thermal conductivity of at least about 1.0 W / mk, such as, at least about 1.1 W / mk or at least about 1.2 W / mk or at least about 1.3 W / mk or at least about 1.4 W / mk or at least about 1.5 W / mk or at least about 1.6 W / mk or at least about 1.7 W / mk or at least about 1.8 W / mk or at least about

[0058] 1.9 W / mk or at least about 2.0 W / mk or at least about 2.1 W / mk or at least about 2.2 W / mk or at least about 2.3 W / mk or at least about 2.4 W / mk or at least about 2.5 W / mk or at least about 2.6 W / mk or at least about 2.7 W / mk or at least about 2.8 W / mk or even at least about

[0059] 2.9 W / mk. According to yet other embodiments, the composite material layer may have a thermal conductivity of not greater than about 5.0 W / mk, such as, not greater than about 4.9 W / mk or not greater than about 4.8 W / mk or not greater than about 4.7 W / mk or not greater than about 4.6 W / mk or not greater than about 4.5 W / mk or not greater than about 4.4 W / mk or not greater than about 4.3 W / mk or not greater than about 4.2 W / mk or not greater than about 4.1 W / mk or not greater than about 4.0 W / mk or not greater than about 3.9 W / mk or not greater than about 3.8 W / mk or not greater than about 3.7 W / mk or not greater than about 3.6 W / mk or not greater than about 3.5 W / mk or not greater than about 3.4 W / mk or not greater than about 3.3 W / mk or not greater than about 3.2 W / mk or not greater than about 3.1 W / mk or even not greater than about 3.0 W / mk. It will be appreciated that the thermal conductivity of the composite material layer may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the thermal conductivity of the composite material layer may be any value between any of the minimum and maximum values noted above.

[0060] According to yet other embodiments, the composite material layer may have a particular deflection force under compression as measured according to the following method; 1) the sample is kept at RT for 24hrs after curing, 2) the sample dimension is 14 mm in diameter and 2.5+ / -0.1 mm in thickness, 3) the sample is compressed with rate of 0.5 mm / s until it reaches 30% deflection, and 4) the force to deflect after 60 seconds compression is recorded as deflection force. For purposes of this method, the average deflection force is taken from at least three tests. According to certain embodiments, the composite material may have a deflection force of at least about 2 psi, such as, at least about 3 psi or at least about 4 psi or at least about 5 psi or at least about 6 psi or at least about 7 psi or at least about 8 psi or at least about 9 psi or at least about 10 psi or at least about 13 psi or at least about 15 psi or at least about 18 psi or at least about 20 psi or even at least about 23 psi. According to yet other embodiments, the composite material may have a deflection force of not greater than about 40 psi, such as, not greater than about 39 psi or not greater than about 38 psi or not greater than about 37 psi or not greater than about 36 psi or not greater than about 35 psi or not greater than about 34 psi or not greater than about 33 psi or not greater than about 32 psi or not greater than about 31 psi or not greater than about 30 psi or not greater than about 29 psi or not greater than about 28 psi or even not greater than about 27 psi. It will be appreciated that the deflection force of the composite material may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the deflection force of the composite material may be any value between any of the minimum and maximum values noted above.

[0061] According to certain embodiments, composite material layers described herein may be formed according to any acceptable forming process for a composite material layer.

[0062] Turning now to additional embodiments described herein, such embodiments are generally directed to a thermal interface material for a battery module that may include a composite material, or a composite material layer as described herein. It will be appreciated that according to particular embodiments, a thermal interface material described herein may include any of the components described herein with reference to the composite material 100. It will be further appreciated that according to particular embodiments, a thermal interface material described herein may have any of the characteristics described herein with reference to the composite material 100.

[0063] Many different aspects and embodiments are possible. Some of those aspects and embodiments are described herein. After reading this specification, skilled artisans will appreciate that those aspects and embodiments are only illustrative and do not limit the scope of the present invention. Embodiments may be in accordance with any one or more of the embodiments as listed below.

[0064] Embodiment 1. A composite material comprising: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises: a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the composite material comprises a thermal conductivity of at least about 1.0 W / mk and not greater than about 5.0 W / mk. Embodiment 2. A composite material comprising: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises: a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the composite material comprises a hardness of at least about 20 Shore 00 and not greater than about 70 Shore 00.

[0065] Embodiment 3. The composite material of embodiment 1, wherein the composite material comprises a hardness of at least about 20 Shore 00.

[0066] Embodiment 4. The composite material of embodiment 1, wherein the composite material comprises a hardness of not greater than about 70 Shore 00.

[0067] Embodiment 5. The composite material of embodiment 2, wherein the composite material comprises a thermal conductivity of at least about 1.0 W / mk.

[0068] Embodiment 6. The composite material of embodiment 2, wherein the composite material comprises a thermal conductivity of not greater than about 5.0 W / mk.

[0069] Embodiment 7. The composite material of any one of embodiments 1 and 2, wherein the composite material has a deflection force of at least about 2 psi.

[0070] Embodiment 8. The composite material of any one of embodiments 1 and 2, wherein the composite material has a deflection force of not greater than about 40 psi.

[0071] Embodiment 9. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a thermally conductive filler component content ratio TCF1 / TCF2 of at least about 1.2, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the composite material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the composite material.

[0072] Embodiment 10. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a thermally conductive filler component content ratio TCF1 / TCF2 of not greater than about 3.0, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the composite material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the composite material.

[0073] Embodiment 11. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a silicone-based matrix component content of at least about 5 wt.% for a total weight of the composite material. Embodiment 12. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a silicone-based matrix component content of not greater than about 15 wt.% for a total weight of the composite material.

[0074] Embodiment 13. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a filler package component content of at least about 85 wt.% for a total weight of the composite material.

[0075] Embodiment 14. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a filler package component content of not greater than about 95 wt.% for a total weight of the composite material.

[0076] Embodiment 15. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a first thermally conductive filler component content of at least about 40 wt.% for a total weight of the composite material.

[0077] Embodiment 16. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a first thermally conductive filler component content of not greater than about 70 wt.% for a total weight of the composite material.

[0078] Embodiment 17. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a second thermally conductive filler component content of at least about 15 wt.% for a total weight of the composite material.

[0079] Embodiment 18. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a second thermally conductive filler component content of not greater than about 45 wt.% for a total weight of the composite material.

[0080] Embodiment 19. The composite material of any one of embodiments 1 and 2, wherein the silicone-based matrix comprises a polysiloxane matrix.

[0081] Embodiment 20. The composite material of any one of embodiments 1 and 2, wherein the silicone-based matrix component comprises a poly dimethyl siloxane gum having an average molecule weight between 300,000 and 800,000, or a liquid poly dimethyl siloxane polymer having a viscosity of between 50 cst and 100 000 cst.

[0082] Embodiment 21. The composite material of any one of embodiments 1 and 2, wherein the composite material further comprises a platinum complex hydrosilylation catalyst distributed within the silicone-based matrix component.

[0083] Embodiment 22. The composite material of any one of embodiments 1 and 2, wherein the silicone-based matrix component comprises a vinyl and Si-hydrogen group which can react with each other in the presence of a platinum catalyst, a peroxide catalyst, a tin catalyst, or a titanium catalyst. Embodiment 23. The composite material of any one of embodiments 1 and 2, wherein the composite material further comprises a mono-vinyl functionalized silicone oil.

[0084] Embodiment 24. The composite material of embodiment 23, wherein the composite material comprises a mono-vinyl functionalized silicone oil content of at least about 2 wt.% for a total weight of the composite material.

[0085] Embodiment 25. The composite material of embodiment 23, wherein the composite material comprises a mono-vinyl functionalized silicone oil content of not greater than about 3 wt.% for a total weight of the composite material.

[0086] Embodiment 26. The composite material of any one of embodiments 1 and 2, wherein the first thermally conductive filler component comprises alumina, aluminum hydroxide (ATH) or any combination thereof.

[0087] Embodiment 27. The composite material of any one of embodiments 1 and 2, wherein the first thermally conductive filler component comprises spherical alumina, spherical aluminum hydroxide (ATH) or any combination thereof.

[0088] Embodiment 28. The composite material of any one of embodiments 1 and 2, wherein the second thermally conductive filler comprises alumina, aluminum hydroxide (ATH) or any combination thereof.

[0089] Embodiment 29. The composite material of any one of embodiments 1 and 2, wherein the second thermally conductive filler comprises spherical alumina, spherical aluminum hydroxide (ATH) or any combination thereof.

[0090] Embodiment 30. The composite material or composite material layer of embodiment 21, wherein the composite material comprises a platinum complex hydrosilylation catalyst content of at least about 3 ppm of the composite material.

[0091] Embodiment 31. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a density of not greater than about 3.5 g / cc.

[0092] Embodiment 32. The composite material of any one of embodiments 1 and 2, wherein the composite material comprises a density of at least about 2.0 g / cc.

[0093] Embodiment 33. A thermal interface material for a battery module, wherein the thermal interface material comprises: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises: a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the thermal interface material comprises a thermal conductivity of at least about 1.0 W / mk and not greater than about 5.0 W / mk.

[0094] Embodiment 34. A thermal interface material for a battery module, wherein the thermal interface material comprises: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises: a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the thermal interface material comprises a hardness of at least about 20 Shore OO and not greater than about 70 Shore OO.

[0095] Embodiment 35. The thermal interface material of embodiment 33, wherein the thermal interface material comprises a hardness of at least about 20 Shore OO.

[0096] Embodiment 36. The thermal interface material of embodiment 33, wherein the thermal interface material comprises a hardness of not greater than about 70 Shore OO.

[0097] Embodiment 37. The thermal interface material of embodiment 34, wherein the thermal interface material comprises a thermal conductivity of at least about 1.0 W / mk.

[0098] Embodiment 38. The thermal interface material of embodiment 34, wherein the thermal interface material comprises a thermal conductivity of not greater than about 5.0 W / mk.

[0099] Embodiment 39. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material has a deflection force of at least about 2 psi.

[0100] Embodiment 40. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material has deflection force of not greater than about 40 psi.

[0101] Embodiment 41. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a thermally conductive filler component content ratio TCF1 / TCF2 of at least about 1.2, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the thermal interface material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the thermal interface material.

[0102] Embodiment 42. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a thermally conductive filler component content ratio TCF1 / TCF2 of not greater than about 3.0, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the thermal interface material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the thermal interface material.

[0103] Embodiment 43. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a silicone-based matrix component content of at least about 5 wt.% for a total weight of the thermal interface material.

[0104] Embodiment 44. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a silicone-based matrix component content of not greater than about 15 wt.% for a total weight of the thermal interface material.

[0105] Embodiment 45. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a filler package component content of at least about 85 wt.% for a total weight of the thermal interface material.

[0106] Embodiment 46. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a filler package component content of not greater than about 95 wt.% for a total weight of the thermal interface material.

[0107] Embodiment 47. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a first thermally conductive filler component content of at least about 40 wt.% for a total weight of the thermal interface material.

[0108] Embodiment 48. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a first thermally conductive filler component content of not greater than about 70 wt.% for a total weight of the thermal interface material.

[0109] Embodiment 49. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a second thermally conductive filler component content of at least about 15 wt.% for a total weight of the thermal interface material.

[0110] Embodiment 50. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a second thermally conductive filler component content of not greater than about 45 wt.% for a total weight of the thermal interface material.

[0111] Embodiment 51. The thermal interface material of any one of embodiments 33 and 34, wherein the silicone-based matrix comprises a polysiloxane matrix.

[0112] Embodiment 52. The thermal interface material of any one of embodiments 33 and 34, wherein the silicone-based matrix component comprises a polydimethylsiloxane gum having an average molecule weight between 300,000 and 800,000, or a liquid poly dimethylsiloxane polymer having a viscosity of between 50 cst and 100 000 cst.

[0113] Embodiment 53. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material further comprises a platinum complex hydrosilylation catalyst distributed within the silicone-based matrix component.

[0114] Embodiment 54. The thermal interface material of any one of embodiments 33 and 34, wherein the silicone-based matrix component comprises a vinyl and Si-hydrogen group which can react with each other in the presence of a platinum catalyst, a peroxide catalyst, a tin catalyst, or a titanium catalyst.

[0115] Embodiment 55. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material further comprises a mono-vinyl functionalized silicone oil.

[0116] Embodiment 56. The thermal interface material of embodiment 23, wherein the thermal interface material comprises a mono-vinyl functionalized silicone oil content of at least about 2 wt.% for a total weight of the thermal interface material.

[0117] Embodiment 57. The thermal interface material of embodiment 23, wherein the thermal interface material comprises a mono-vinyl functionalized silicone oil content of not greater than about 3 wt.% for a total weight of the thermal interface material.

[0118] Embodiment 58. The thermal interface material of any one of embodiments 33 and 34, wherein the first thermally conductive filler comprises alumina, aluminum hydroxide (ATH) or any combination thereof.

[0119] Embodiment 59. The thermal interface material of any one of embodiments 33 and 34, wherein the first thermally conductive filler comprises spherical alumina, spherical aluminum hydroxide (ATH) or any combination thereof.

[0120] Embodiment 60. The thermal interface material of any one of embodiments 33 and 34, wherein the second thermally conductive filler comprises alumina, aluminum hydroxide (ATH) or any combination thereof.

[0121] Embodiment 61. The thermal interface material of any one of embodiments 33 and 34, wherein the second thermally conductive filler comprises spherical alumina, spherical aluminum hydroxide (ATH) or any combination thereof.

[0122] Embodiment 62. The thermal interface material or thermal interface material layer of embodiment 61, wherein the thermal interface material comprises a platinum complex hydrosilylation catalyst content of at least about 3 ppm of the thermal interface material. Embodiment 63. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a density of not greater than about 3.5 g / cc.

[0123] Embodiment 64. The thermal interface material of any one of embodiments 33 and 34, wherein the thermal interface material comprises a density of at least about 2.0 g / cc.

[0124] Note that not all of the activities described above in the general description, or the examples are required, that a portion of a specific activity may not be required, and that one or more further activities may be performed in addition to those described. Still further, the order in which activities are listed is not necessarily the order in which they are performed.

[0125] Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any feature(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature of any or all the claims.

[0126] The specification and illustrations of the embodiments described herein are intended to provide a general understanding of the structure of the various embodiments. The specification and illustrations are not intended to serve as an exhaustive and comprehensive description of all the elements and features of apparatus and systems that use the structures or methods described herein. Separate embodiments may also be provided in combination in a single embodiment, and conversely, various features that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any subcombination. Further, reference to values stated in ranges includes each and every value within that range. Many other embodiments may be apparent to skilled artisans only after reading this specification. Other embodiments may be used and derived from the disclosure, such that a structural substitution, logical substitution, or another change may be made without departing from the scope of the disclosure. Accordingly, the disclosure is to be regarded as illustrative rather than restrictive.

Claims

WHAT IS CLAIMED IS:

1. A composite material comprising: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises: a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the composite material comprises a thermal conductivity of at least about 1.0 W / mk and not greater than about 5.0 W / mk.

2. A composite material comprising: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises: a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the composite material comprises a hardness of at least about 20 Shore OO and not greater than about 70 Shore OO.

3. The composite material of claim 1, wherein the composite material comprises a hardness of at least about 20 Shore OO.

4. The composite material of claim 1, wherein the composite material comprises a hardness of not greater than about 70 Shore OO.

5. The composite material of claim 2, wherein the composite material comprises a thermal conductivity of at least about 1.0 W / mk.

6. The composite material of claim 2, wherein the composite material comprises a thermal conductivity of not greater than about 5.0 W / mk.

7. The composite material of any one of claims 1 and 2, wherein the composite material has a deflection force of at least about 2 psi.

8. The composite material of any one of claims 1 and 2, wherein the composite material has a deflection force of not greater than about 40 psi.

9. The composite material of any one of claims 1 and 2, wherein the composite material comprises a thermally conductive filler component content ratio TCF1 / TCF2 of at least about 1.2, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the composite material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the composite material.

10. The composite material of any one of claims 1 and 2, wherein the composite material comprises a thermally conductive filler component content ratio TCF1 / TCF2 of not greater than about 3.0, where TCF1 is equal to the content of the first thermally conductive filler component in wt.% for a total weight of the composite material, and TCF2 is equal to the content for the second thermally conductive filler component in wt.% for a total weight of the composite material.

11. The composite material of any one of claims 1 and 2, wherein the composite material comprises a silicone-based matrix component content of at least about 5 wt.% for a total weight of the composite material.

12. The composite material of any one of claims 1 and 2, wherein the composite material comprises a silicone-based matrix component content of not greater than about 15 wt.% for a total weight of the composite material.

13. The composite material of any one of claims 1 and 2, wherein the composite material comprises a filler package component content of at least about 85 wt.% for a total weight of the composite material.

14. The composite material of any one of claims 1 and 2, wherein the composite material comprises a filler package component content of not greater than about 95 wt.% for a total weight of the composite material.

15. A thermal interface material for a battery module, wherein the thermal interface material comprises: a silicone-based matrix component, and a filler package component, wherein the filler package component comprises:a first thermally conductive filler component having an average particle size of at least about 30 microns and not greater than about 150 microns, and a second thermally conductive filler component having an average particle size of at least about 1 micron and not greater than about 10 microns, and wherein the thermal interface material comprises a thermal conductivity of at least about 1.0 W / mk and not greater than about 5.0 W / mk.

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