Pressure control method and device, and semiconductor process apparatus

By real-time detection of the set pressure and measured pressure during the pressure control process, the movement direction of the pressure regulating valve and the timing of ending open-loop regulation are adjusted, thus solving the problems of pressure lag or pressure advance and improving the stability of the pressure in the reaction chamber and the process quality.

WO2025252155A1PCT designated stage Publication Date: 2025-12-11BEIJING AURASKY ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/CN2025/099327
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-06
Filing Date
2025-06-05
Publication Date
2025-12-11

AI Technical Summary

Technical Problem

In the existing technology, the pressure control in the reaction chamber has problems of pressure lag or pressure advance, which leads to inaccurate timing of ending open-loop regulation and long closed-loop regulation time, affecting the process quality of the product.

Method used

By acquiring the set pressure and the measured pressure of the reaction chamber, if they are inconsistent, the movement direction of the pressure regulating valve is determined based on the measured pressure and the set pressure. The measured pressure is continuously acquired during the movement of the pressure regulating valve until it reaches the range near the set pressure, at which point the movement stops and closed-loop regulation is performed.

Benefits of technology

This resulted in a shorter response time for the pressure control process, improved pressure stability within the reaction chamber, and ensured the product's process quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure provides a pressure control method and device, and a semiconductor process apparatus. The method comprises: acquiring set pressure and measured pressure of a reaction chamber; if the measured pressure is inconsistent with the set pressure, determining a movement direction of a pressure regulating valve on the basis of the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the movement direction; during movement of the pressure regulating valve, continuously acquiring the measured pressure, and when the measured pressure falls within a set range near the set pressure, controlling the pressure regulating valve to stop moving; and on the basis of the measured pressure and the set pressure, performing closed-loop regulation on the pressure regulating valve. By ending open-loop regulation in advance or delaying the ending of the open-loop regulation, the present application avoids pressure hysteresis or pressure advance, so that the timing for ending open-loop regulation (or the timing for starting the closed-loop regulation) is relatively accurate, and the closed-loop regulation time is relatively short, and thus, the response time of the whole pressure control procedure is relatively short, the pressure in the reaction chamber is relatively stable, and the process quality of a product is ensured.
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Description

Pressure control method and device and semiconductor process equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and particularly relates to a pressure control method, device and semiconductor process equipment. BACKGROUND

[0002] In the fields of semiconductor manufacturing, photovoltaic, etc., there are vacuum environments everywhere, and most processes are carried out in reaction chambers. The pressure in the reaction chamber greater than or less than the set pressure will affect the process quality of the product, so it is necessary to ensure the stability of the pressure in the reaction chamber.

[0003] In the related art, a pressure to location (PTL) strategy is used to control the pressure in the reaction chamber. Specifically, first, open-loop adjustment is performed, that is, according to the set pressure, the pressure regulating valve is controlled to move to the corresponding opening degree position according to the pressure position template, and then the open-loop adjustment is ended, and closed-loop adjustment is performed, that is, according to the difference between the measured pressure in the reaction chamber and the set pressure, the pressure regulating valve is adjusted in closed loop. However, the above method has the following problems: when the open-loop adjustment is performed, if the reaction gas flow in the reaction chamber is consistent with the flow corresponding to the pressure position template, the open-loop adjustment is ended, at this time, although the pressure regulating valve has moved to the corresponding opening degree position, the pressure in the reaction chamber has not reached the set pressure, and there is a problem of pressure lag, if the reaction gas flow in the reaction chamber is not consistent with the flow corresponding to the pressure position template, if the pressure position template is not updated in time, there will be a problem of pressure lag or pressure advance (the pressure regulating valve has not moved to the corresponding opening degree position, but the pressure in the reaction chamber has reached the set pressure before the open-loop adjustment is ended). Pressure lag or pressure advance leads to inaccurate timing of ending open-loop adjustment (or starting closed-loop adjustment), long closed-loop adjustment time, and further leads to long response time of the entire pressure control process, unstable pressure in the reaction chamber, and affects the process quality of the product. SUMMARY

[0004] The embodiments of the present application aim to provide a pressure control method, device and semiconductor process equipment to solve the problem of pressure lag or pressure advance in the related art, which leads to inaccurate timing of ending open-loop adjustment (or starting closed-loop adjustment), long closed-loop adjustment time, and further leads to long response time of the entire pressure control process, unstable pressure in the reaction chamber, and affects the process quality of the product.

[0005] To achieve the above object, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a pressure control method, comprising: obtaining a set pressure and a measured pressure of a reaction chamber; if the measured pressure and the set pressure are inconsistent, determining a movement direction of a pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the movement direction; during the movement of the pressure regulating valve, continuously obtaining the measured pressure, and when the measured pressure reaches a set range near the set pressure, controlling the pressure regulating valve to stop moving; and performing closed-loop regulation on the pressure regulating valve according to the measured pressure and the set pressure.

[0007] In a second aspect, an embodiment of the present application provides a pressure control device, comprising: a processor, a memory, and a program or instruction stored in the memory and executable on the processor, and when the program or instruction is executed by the processor, the steps of the method according to the first aspect of the present application are implemented.

[0008] In a third aspect, an embodiment of the present application provides a semiconductor process equipment, comprising: a reaction chamber, a pressure regulating valve arranged on an exhaust pipeline of the reaction chamber, and a control unit electrically connected with the pressure regulating valve, and the control unit is provided with the pressure control device according to the second aspect of the present application.

[0009] The above-mentioned at least one technical solution adopted by the embodiments of the present application can achieve the following beneficial effects:

[0010] When the pressure in the reaction chamber is controlled, the set pressure and the measured pressure of the reaction chamber are obtained, if the measured pressure and the set pressure are inconsistent, the movement direction of the pressure regulating valve is determined according to the measured pressure and the set pressure, and the pressure regulating valve is controlled to move in the movement direction, and during the movement of the pressure regulating valve, the measured pressure is continuously obtained, and when the measured pressure reaches a set range near the set pressure, the pressure regulating valve is controlled to stop moving, and the pressure regulating valve is closed-loop regulated according to the measured pressure and the set pressure. When the pressure in the reaction chamber is controlled, whether to end the open-loop regulation is determined by detecting whether the measured pressure reaches a set range near the set pressure in real time during the open-loop regulation (determining the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the movement direction), and the open-loop regulation is ended in advance or delayed, so that the pressure is not lagged or advanced, the timing of ending the open-loop regulation (or the timing of starting the closed-loop regulation) is relatively accurate, the closed-loop regulation time is relatively short, and the response time of the whole pressure control process is relatively short, the pressure in the reaction chamber is relatively stable, and the process quality of the product is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0011] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0012] Fig. 1 is a flow diagram of a pressure control method according to an embodiment of the present application;

[0013] Fig. 2 is a schematic diagram of an application scenario of a pressure control method according to an embodiment of the present application;

[0014] Fig. 3 is a flow diagram of a pressure control method according to another embodiment of the present application;

[0015] Fig. 4 is a flow diagram of a pressure control method according to another embodiment of the present application;

[0016] Fig. 5 is a flow diagram of a pressure control method according to another embodiment of the present application;

[0017] Fig. 6 is a schematic diagram of actual pressure control of one-time open-loop adjustment and closed-loop adjustment in the related art in a pressure lag situation;

[0018] Fig. 7 is a schematic diagram of actual pressure control of one-time open-loop adjustment and closed-loop adjustment in an embodiment of the present application in a pressure lag situation;

[0019] Fig. 8 is a schematic diagram of actual pressure control of one-time open-loop adjustment and closed-loop adjustment in the related art in a pressure advance situation;

[0020] Fig. 9 is a schematic diagram of actual pressure control of one-time open-loop adjustment and closed-loop adjustment in an embodiment of the present application in a pressure advance situation;

[0021] Fig. 10 is a schematic diagram of a structure of a pressure control device according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to make the objects, technical solutions and advantages of the present application clearer, the following will describe the technical solutions of the present application with reference to the embodiments of the present application and the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0023] The terms "first", "second", etc. in this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein. In addition, "and / or" in this application means at least one of the connected objects, and the character " / " generally means that the front and rear associated objects are in a "or" relationship. It should be noted that the data involved in this application is obtained with the authorization of the user.

[0024] In the fields of semiconductor manufacturing, photovoltaic, etc., there are vacuum environments everywhere, and most processes are carried out in reaction chambers. The pressure in the reaction chamber will affect the process quality of the product if it is greater than or less than the set pressure, so it is necessary to ensure that the pressure in the reaction chamber is stable. In the related art, the position pressure PTL strategy is used to control the pressure in the reaction chamber, which is as follows: first, open-loop adjustment is performed, that is, according to the set pressure, the pressure regulating valve is controlled to move to the corresponding opening degree position according to the pressure position template, and then the open-loop adjustment is ended, and closed-loop adjustment is performed, that is, according to the difference between the measured pressure in the reaction chamber and the set pressure, the pressure regulating valve is adjusted in closed loop. However, the above-mentioned method may have the following problems: when performing open-loop adjustment, if the reaction gas flow in the reaction chamber is consistent with the flow corresponding to the pressure position template, the open-loop adjustment is ended, at this time, although the pressure regulating valve has moved to the corresponding opening degree position, the pressure in the reaction chamber has not reached the set pressure, and there is a problem of pressure hysteresis. If the reaction gas flow in the reaction chamber is not consistent with the flow corresponding to the pressure position template, and the pressure position template is not updated in time, there will be a problem of pressure hysteresis or pressure advance (the pressure regulating valve has not moved to the corresponding opening degree position, but the pressure in the reaction chamber has reached the set pressure before the open-loop adjustment is ended). Pressure hysteresis or pressure advance leads to inaccurate timing of ending open-loop adjustment (or starting closed-loop adjustment), longer closed-loop adjustment time, and longer response time of the entire pressure control process, which leads to unstable pressure in the reaction chamber and affects the process quality of the product. Therefore, the present application proposes a pressure control method, device and semiconductor process equipment to solve the problem of pressure hysteresis or pressure advance in the related art, which leads to inaccurate timing of ending open-loop adjustment (or starting closed-loop adjustment), longer closed-loop adjustment time, and longer response time of the entire pressure control process, which leads to unstable pressure in the reaction chamber and affects the process quality of the product.

[0025] The technical solutions provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0026] FIG. 1 is a flow diagram of a pressure control method according to an embodiment of the present application. As shown in FIG. 1, the pressure control method according to the embodiment of the present application can specifically include the following steps:

[0027] S101, acquiring a set pressure and a measured pressure of the reaction chamber.

[0028] In the embodiments of the present application, the execution subject of the pressure control method is a pressure control device, which can be arranged in a control unit of a semiconductor process equipment (for example, a semiconductor furnace tube equipment) having a reaction chamber.

[0029] FIG. 2 is a schematic diagram of an application scenario of the pressure control method according to the embodiments of the present application. As shown in FIG. 2, the semiconductor process equipment includes:

[0030] The reaction chamber 1 is used to provide a reaction space, so that the mixed input various process gases (for example, mixed gas of oxygen O2, hydrogen H2 and nitrogen N2) react in the reaction chamber 1. The gas required by the semiconductor process (the flow rate of which can change) enters the reaction chamber 1 through the gas inlet of the reaction chamber 1, and is discharged from the exhaust port of the reaction chamber 1 after reacting in the reaction chamber 1.

[0031] The pressure measurement module 2 is arranged on the exhaust pipe between the reaction chamber 1 and the pressure regulating valve 3 through a three-way joint. One end of the pressure measurement module 2 is connected to the exhaust port of the reaction chamber 1, and the other end is connected to the gas inlet of the pressure regulating valve 3. The collected pressure signal is input to the pressure control device.

[0032] The pressure regulating valve 3 is arranged on the exhaust pipe. The gas flowing into the gas inlet of the pressure regulating valve 3 flows out to the vacuum generator 4 through the gas outlet of the pressure regulating valve 3. The pressure regulating valve 3 can specifically include but is not limited to a butterfly valve, a pendulum valve, a needle valve, a ball valve and the like driven by a stepper motor.

[0033] The vacuum generator 4 is connected to the gas outlet of the pressure regulating valve 3, and is used to provide suction force for the pressure regulating valve 3. It should be noted that a gas source (for example, nitrogen N2) needs to be provided for the vacuum generator 4 when the system is working. Different pressures of the gas source can provide different suction forces for the vacuum generator 4. The pressure control method according to the embodiments of the present application maintains the suction force of the vacuum generator 4 unchanged when implemented.

[0034] The control unit 5 is arranged in the control unit 5. The pressure control device adjusts the opening degree of the pressure regulating valve 3 based on the set pressure input by the pressure input module 6 and the measured pressure input by the pressure measurement module 2, so as to change the pressure in the reaction chamber 1, and finally stabilize the pressure in the reaction chamber 1 at the set pressure, so as to realize the pressure control method according to the embodiments of the present application. The control unit 5 is an embedded control system having functions of a central processing unit (CPU), a memory, an analog-to-digital converter, a digital-to-analog converter and an input device, and various programs are executed by the CPU.

[0035] A pressure input module 6 is configured to change the set pressure and input the set pressure to the pressure control device.

[0036] The set pressure is the pressure that the user sets as the desired pressure reached by the reaction chamber, i.e. the pressure when the pressure of the reaction chamber is controlled and stabilized. The set pressure can be input by the user to the pressure control device in real time according to the process, for example, the user can input the set pressure to the pressure control device through the pressure input module with a human-computer interaction interface, or the user can set the set pressure in advance and input it to the pressure control device at the set time. The pressure input module can be a personal computer (PC) and can input the set pressure to the pressure control device in the form of a digital signal or an analog signal.

[0037] The measured pressure is the actual pressure in the reaction chamber measured by the pressure measurement module, which can be a vacuum pressure gauge. The pressure measurement module can be installed on the exhaust pipe between the reaction chamber and the pressure regulating valve through a three-way joint. One end of the pressure measurement module is connected to the exhaust port of the reaction chamber, and the other end is connected to the inlet end of the pressure regulating valve. The collected pressure signal is input to the pressure control device.

[0038] It should be noted that the measured pressure and the set pressure can be absolute pressure or relative pressure, and the relative pressure is the difference between the absolute pressure and the atmospheric pressure.

[0039] The control unit can also be provided with a measured pressure calculation module for analog-digital conversion of the pressure signal input by the pressure measurement module. When the measured pressure input to the pressure control device is relative pressure, the measured pressure (which is absolute pressure at this time) input by the pressure measurement module can also be used to calculate the difference between the atmospheric pressure, so as to obtain the relative atmospheric pressure (which is relative pressure at this time) and input it to the pressure control device, compatible with two kinds of pressure control (absolute pressure control and relative pressure control).

[0040] As understood by those skilled in the art, the set pressure is input by the pressure input module to the pressure control device when the set pressure is changed and the pressure control process is started. The measured pressure can be periodically input to the pressure control device by the pressure measurement module, or the pressure control device can actively obtain it from the pressure measurement module after receiving a new set pressure.

[0041] S102, if the measured pressure and the set pressure are inconsistent, the movement direction of the pressure regulating valve is determined according to the measured pressure and the set pressure, and the pressure regulating valve is controlled to move in the movement direction.

[0042] In the embodiments of the present application, if the measured pressure is equal to the set pressure, it is determined that the measured pressure is consistent with the set pressure, and if the measured pressure is not equal to the set pressure, it is determined that the measured pressure is inconsistent with the set pressure. In actual operation, due to the existence of errors, an error range can be set in advance, for example, the error range can be set pressure ± n or set pressure ± 1%, if the measured pressure is within the error range of the set pressure, it is determined that the measured pressure is consistent with the set pressure, and if the measured pressure is outside the error range of the set pressure, it is determined that the measured pressure is inconsistent with the set pressure.

[0043] If the measured pressure is inconsistent with the set pressure, the pressure control process needs to be started, and if the measured pressure is consistent with the set pressure, the pressure control process does not need to be started.

[0044] After the pressure control process is started, open-loop regulation is first performed, that is, the movement direction of the pressure regulating valve is determined according to the measured pressure and the set pressure, and the pressure regulating valve is controlled to move in the movement direction, that is, the opening degree of the pressure regulating valve is controlled to be larger or smaller.

[0045] Specifically, if the measured pressure is less than the set pressure, pressure increasing control needs to be performed: first, the movement direction of the pressure regulating valve is determined to be the direction in which the opening degree position is reduced, and the pressure regulating valve is controlled to move in the direction in which the opening degree position is reduced. If the measured pressure is greater than the set pressure, pressure decreasing control needs to be performed: first, the movement direction of the pressure regulating valve is determined to be the direction in which the opening degree position is increased, and the pressure regulating valve is controlled to move in the direction in which the opening degree position is increased.

[0046] In the process of moving the pressure regulating valve, the measured pressure is continuously acquired, and when the measured pressure reaches the set range near the set pressure, the movement of the pressure regulating valve is stopped.

[0047] In the embodiments of the present application, in the process of open-loop regulation, the pressure in the reaction chamber continuously changes towards the set pressure, the measured pressure is continuously detected, and when the measured pressure reaches the set pressure or approaches the set pressure (that is, reaches the set range near the set pressure), the open-loop regulation is stopped, that is, the movement of the pressure regulating valve is stopped, and subsequent closed-loop regulation is performed.

[0048] As a first feasible implementation, the set range can be a set multiple of the set pressure. The value range of the set multiple can be 0 to 0.1. For example, when the value of the set multiple is 0, the open-loop regulation is stopped when the measured pressure reaches the set pressure, and subsequent closed-loop regulation is performed. For another example, when the value of the set multiple is 0.1, the open-loop regulation is stopped when the measured pressure reaches the range of (set pressure-0.1×set pressure, set pressure+0.1×set pressure), that is, the range of (0.9×set pressure, 1.1×set pressure), and subsequent closed-loop regulation is performed.

[0049] As a second possible implementation, the setting range can also be a setting pressure difference value. The setting pressure difference value can be in a range of 0 to 10 Pa. For example, when the setting pressure difference value is 0, the open-loop regulation is stopped and the subsequent closed-loop regulation is performed when the measured pressure reaches the setting pressure. For another example, when the setting pressure difference value is 10, the open-loop regulation is stopped and the subsequent closed-loop regulation is performed when the measured pressure is in a range of (setting pressure-10, setting pressure+10).

[0050] Those skilled in the art can understand that, in the pressure increasing control, the open-loop regulation is stopped when the measured pressure is higher than the lower limit value in the above range, for example, 0.9*setting pressure, setting pressure-10. In the pressure decreasing control, the open-loop regulation is stopped and the subsequent closed-loop regulation is performed when the measured pressure is lower than the lower limit value in the above range, for example, 1.1*setting pressure, setting pressure+10.

[0051] In the open-loop regulation process, whether to end the open-loop regulation is determined by detecting whether the measured pressure is in the setting range near the setting pressure, so that the open-loop regulation is ended in advance or delayed, that is, the timing of ending the open-loop regulation is changed, that is, the timing of starting the closed-loop regulation is changed.

[0052] Taking the pressure increasing control as an example, compared with the related art, in the case that the flow rate of the reaction chamber is constant or the flow rate change causes pressure hysteresis, the pressure regulating valve is still controlled to continue to move after the pressure regulating valve moves to the corresponding opening degree position corresponding to the setting pressure, which is equivalent to secondary open-loop regulation, so that the open-loop regulation is ended in delay, so that the measured pressure is closer to the setting pressure when the open-loop regulation is ended, and thus the time of the subsequent closed-loop regulation is shorter. In the case that the flow rate change causes pressure advance, compared with the related art, the pressure regulating valve is no longer controlled to continue to move when the pressure regulating valve has not moved to the corresponding opening degree position corresponding to the setting pressure, so that the open-loop regulation is ended in advance, so that the measured pressure is closer to the setting pressure when the open-loop regulation is ended, and thus the time of the subsequent closed-loop regulation is shorter. The principle in the pressure decreasing control is similar to the principle in the above pressure increasing control, which is not described herein.

[0053] S104, performing closed-loop regulation on the pressure regulating valve according to the measured pressure and the setting pressure.

[0054] In the embodiment of the present application, as a first feasible implementation, the specific process of closed-loop adjustment is as follows: a difference between the measured pressure and the set pressure is calculated, an opening position adjustment amount of the pressure regulating valve is calculated according to the difference and a preset adjustment coefficient, for example, a proportional, integral, and derivative (PID) adjustment coefficient, the pressure regulating valve is adjusted according to the opening position adjustment amount, and after the adjustment is completed, the measured pressure is reacquired, and the step of calculating the difference between the measured pressure and the set pressure is returned. Through the closed-loop adjustment, the pressure in the reaction chamber is stabilized at the set pressure. The opening position adjustment amount is an operation amount by which the opening position needs to be increased or decreased, for example, if the opening position adjustment amount is 10, the control pressure regulating valve is moved from the current opening position to the opening position of the current opening position + 10.

[0055] To clearly illustrate the specific process of the pressure control method of the feasible implementation (i.e., the first feasible implementation), the following will be described in detail in combination with FIG. 3. As shown in FIG. 3, the pressure control method of the embodiment of the present application specifically includes the following steps:

[0056] S301, a set pressure and a measured pressure of a reaction chamber are acquired.

[0057] S302, it is judged whether the set pressure and the measured pressure are consistent. If yes, step S310 is executed. If no, step S303 is executed.

[0058] S303, a movement direction of a pressure regulating valve is determined according to the measured pressure and the set pressure, and the pressure regulating valve is controlled to move in the movement direction.

[0059] S304, in the movement process of the pressure regulating valve, the measured pressure is continuously acquired, and when the measured pressure reaches a set range near the set pressure, the pressure regulating valve is controlled to stop moving.

[0060] S305, a difference between the measured pressure and the set pressure is calculated.

[0061] S306, it is judged whether the difference is zero. If yes, step S310 is executed. If no, step S307 is executed.

[0062] S307, an opening position adjustment amount of the pressure regulating valve is calculated according to the difference and a preset adjustment coefficient.

[0063] S308, the pressure regulating valve is adjusted according to the opening position adjustment amount.

[0064] S309, after the adjustment is completed, the measured pressure is reacquired. The step S305 is returned.

[0065] S310, the pressure control flow is ended.

[0066] As the second feasible implementation, the specific process of the closed-loop adjustment is as follows: the difference between the measured pressure and the set pressure is calculated, the opening position adjustment amount of the pressure regulating valve is calculated according to the difference and a preset adjustment coefficient, for example, a proportional integral derivative PID adjustment coefficient, the pressure regulating valve is adjusted according to the opening position adjustment amount, and after the adjustment is completed, the measured pressure is reacquired, and the step S102 of the open-loop adjustment is returned, that is, if the measured pressure and the set pressure are inconsistent, the movement direction of the pressure regulating valve is determined according to the measured pressure and the set pressure, and the pressure regulating valve is controlled to move in the movement direction. Through continuous multiple open-loop adjustment and closed-loop adjustment, the pressure in the reaction chamber is stabilized at the set pressure.

[0067] It should be noted that in the pressure control process when the set pressure changes, the first feasible implementation only needs to perform open-loop adjustment and closed-loop adjustment once, while in the pressure control process when the set pressure changes, the second feasible implementation needs to perform multiple cycle adjustments of once open-loop adjustment and once closed-loop adjustment, and returns to open-loop adjustment in the closed-loop adjustment process, thereby reducing the time of closed-loop adjustment.

[0068] To clearly illustrate the specific process of the pressure control method of the feasible implementation (that is, the second feasible implementation), the following will be described in detail in combination with FIG. 4.

[0069] S401, the set pressure and the measured pressure of the reaction chamber are acquired.

[0070] S402, it is judged whether the set pressure and the measured pressure are consistent. If yes, step S410 is performed. If no, step S403 is performed.

[0071] S403, the movement direction of the pressure regulating valve is determined according to the measured pressure and the set pressure, and the pressure regulating valve is controlled to move in the movement direction.

[0072] S404, in the movement process of the pressure regulating valve, the measured pressure is continuously acquired, and when the measured pressure reaches the set range near the set pressure, the movement of the pressure regulating valve is controlled to stop.

[0073] S405, the difference between the measured pressure and the set pressure is calculated.

[0074] S406, it is judged whether the difference is zero. If yes, step S410 is performed. If no, step S407 is performed.

[0075] S407, the opening position adjustment amount of the pressure regulating valve is calculated according to the difference and a preset adjustment coefficient.

[0076] S408, the pressure regulating valve is adjusted according to the opening position adjustment amount.

[0077] S409, after the adjustment, re-acquire the measured pressure. Return to step S402.

[0078] S410, end the pressure control process.

[0079] As a third feasible implementation, the specific process of closed-loop adjustment is as follows: calculate the difference between the measured pressure and the set pressure, calculate the opening position adjustment amount of the pressure regulating valve according to the difference and the preset adjustment coefficient, such as the proportional integral derivative PID adjustment coefficient; adjust the pressure regulating valve according to the opening position adjustment amount; and return to the step S103 of the above open-loop adjustment phase "during the movement of the pressure regulating valve, continuously acquire the measured pressure, and control the pressure regulating valve to stop moving when the measured pressure reaches the set range near the set pressure". Through continuous multiple open-loop adjustment and closed-loop adjustment, the pressure in the reaction chamber is stabilized at the set pressure.

[0080] It should be noted here that the first feasible implementation only needs to perform open-loop adjustment and closed-loop adjustment once in the pressure control process when the set pressure changes, while the third feasible implementation is similar to the second feasible implementation, which needs to continuously perform multiple cycle adjustments of one open-loop adjustment and one closed-loop adjustment in the pressure control process when the set pressure changes, returns to open-loop adjustment in the closed-loop adjustment process, and reduces the time of closed-loop adjustment.

[0081] To clearly illustrate the specific process of the pressure control method of this feasible implementation (i.e. the third feasible implementation), the following will be described in detail in combination with FIG. 5.

[0082] S501, acquire the set pressure and the measured pressure of the reaction chamber.

[0083] S502, determine whether the set pressure and the measured pressure are consistent. If yes, execute step S509. If no, execute step S503.

[0084] S503, determine the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, and control the pressure regulating valve to move in the movement direction.

[0085] S504, during the movement of the pressure regulating valve, continuously acquire the measured pressure, and control the pressure regulating valve to stop moving when the measured pressure reaches the set range near the set pressure.

[0086] S505, calculate the difference between the measured pressure and the set pressure.

[0087] S506, determine whether the difference is zero. If yes, execute step S509. If no, execute step S507.

[0088] S507, calculate the opening position adjustment amount of the pressure regulating valve according to the difference and a preset adjustment coefficient.

[0089] S508, adjust the pressure regulating valve according to the opening position adjustment amount. Return to step S504.

[0090] S509, end the pressure control process.

[0091] Further, the "determining the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the movement direction" in step S102 can be implemented by the following steps: obtaining a target opening position corresponding to the set pressure according to the set pressure and a pre-stored pressure position template, the pressure position template including a plurality of pressures and a plurality of corresponding opening positions; and controlling the pressure regulating valve to move to the target opening position.

[0092] Specifically, the pressure data corresponding to different opening positions of the reaction chamber at a certain fixed flow rate can be pre-collected to establish and store a pressure position template. The fixed flow rate should be within the range of the minimum flow rate and the maximum flow rate used in the test process step. After obtaining the set pressure, the opening position corresponding to the set pressure is searched in the stored pressure position template, which is recorded as the target opening position. The direction from the current opening position to the target opening position is the movement direction of the pressure regulating valve, and the pressure regulating valve is controlled to move to the target opening position to realize the movement of the pressure regulating valve in the determined movement direction.

[0093] It should be noted that, compared with the related art which needs to establish a pressure position template at different flow rates to realize opening adjustment, the embodiment of the present application only needs to establish a pressure position template at one flow rate to realize opening adjustment, and the scheme is simpler.

[0094] To clearly illustrate the pressure control method of the embodiment of the present application, the following takes the pressure increase control process (the set pressure is increased from P0 to P2) as an example, and the actual pressure control schematic diagram shown in FIGS. 6-9 is used for detailed description.

[0095] First case: pressure hysteresis

[0096] FIG. 6 is an actual pressure control schematic diagram of one open-loop adjustment and closed-loop adjustment in the related art, and FIG. 7 is an actual pressure control schematic diagram of one open-loop adjustment and closed-loop adjustment in the embodiment of the present application.

[0097] As shown in FIG. 6 and FIG. 7, before performing the pressure control process, the current set pressure is P0, the current opening degree is L2, a new set pressure P2 is set, P2>P0, and the opening degree corresponding to P1'(P0

[0098] The second case: pressure in advance

[0099] FIG. 8 is a schematic diagram of actual pressure control of one open-loop adjustment and closed-loop adjustment in the related art, and FIG. 9 is a schematic diagram of actual pressure control of one open-loop adjustment and closed-loop adjustment in the embodiment of the present application.

[0100] As shown in FIG. 8 and FIG. 9, before performing the pressure control process, the current set pressure is P0, the current opening degree is L2, a new set pressure P2 is set, P2>P0, and the opening degree corresponding to P1'(P0

[0101] In summary, the pressure control method of the embodiments of the present application, when controlling the pressure in the reaction chamber, obtains the set pressure and the measured pressure of the reaction chamber, if the measured pressure and the set pressure are inconsistent, determines the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, controls the pressure regulating valve to move in the movement direction, and in the movement process of the pressure regulating valve, continuously obtains the measured pressure, and when the measured pressure reaches the set range near the set pressure, controls the pressure regulating valve to stop moving, and according to the measured pressure and the set pressure, performs closed-loop regulation on the pressure regulating valve. When the embodiments of the present application control the pressure in the reaction chamber, by detecting whether the measured pressure reaches the set range near the set pressure in the open-loop regulation process (determining the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the movement direction), whether to end the open-loop regulation is determined, the open-loop regulation is ended in advance or delayed, the pressure lag or the pressure in advance is avoided, the timing of ending the open-loop regulation (or the timing of starting the closed-loop regulation) is relatively accurate, the closed-loop regulation time is relatively short, and then the response time of the whole pressure control process is relatively short, the pressure in the reaction chamber is relatively stable, and the process quality of the product is ensured. The opening degree regulation is realized based on the pre-stored pressure position template, and the scheme is simpler. The open-loop regulation is returned in the closed-loop regulation process, and the time of the closed-loop regulation is further reduced.

[0102] The embodiments of the present application also provide a pressure control device. As shown in FIG. 10, the pressure control device 1000 includes a processor 1001, a memory 1002, and a program or instruction stored in the memory 1002 and executable on the processor 1001, and the program or instruction is executed by the processor 1001 to implement the steps of the pressure control method of any of the above embodiments.

[0103] The pressure control device of the embodiment of the present application, when controlling the pressure in the reaction chamber, acquires the set pressure and the measured pressure of the reaction chamber, if the measured pressure and the set pressure are inconsistent, determines the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, controls the pressure regulating valve to move along the movement direction, and in the movement process of the pressure regulating valve, continuously acquires the measured pressure, and when the measured pressure reaches the set range near the set pressure, controls the pressure regulating valve to stop moving, and according to the measured pressure and the set pressure, performs closed-loop regulation on the pressure regulating valve. When controlling the pressure in the reaction chamber, the embodiment of the present application determines whether to end the open-loop regulation by detecting in real time whether the measured pressure reaches the set range near the set pressure in the open-loop regulation process (determining the movement direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move along the movement direction), ending the open-loop regulation in advance or delaying the end, avoiding pressure lag or pressure in advance, so that the timing of ending the open-loop regulation (or the timing of starting the closed-loop regulation) is relatively accurate, the closed-loop regulation time is relatively short, and the response time of the whole pressure control process is relatively short, the pressure in the reaction chamber is relatively stable, and the process quality of the product is guaranteed. The opening degree regulation is realized based on the pre-stored pressure position template, and the scheme is simpler. The open-loop regulation is returned in the closed-loop regulation process, and the time of the closed-loop regulation is further reduced.

[0104] The embodiment of the present application also provides a semiconductor process equipment. As shown in FIG. 2, the semiconductor process equipment comprises a reaction chamber 1, a pressure regulating valve 3 and a control unit 5, the pressure regulating valve 3 is arranged on the exhaust pipeline of the reaction chamber 1, the control unit 5 is electrically connected with the pressure regulating valve 3, and the control unit 5 is provided with the pressure control device shown in the above embodiment.

[0105] Further, as shown in FIG. 2, the semiconductor process equipment further comprises a pressure measuring module 2 and a pressure input module 6. The pressure measuring module 2 is arranged on the exhaust pipeline between the reaction chamber 1 and the pressure regulating valve 3, is electrically connected with the control unit 5, is used for measuring the measured pressure in the reaction chamber 1, and inputs the measured pressure to the control unit 5. The pressure input module 6 is electrically connected with the control unit 5, is used for acquiring the set pressure input by a user, and inputs the set pressure to the control unit 5.

[0106] The semiconductor process equipment provided by the embodiments of the present application, when controlling the pressure in the reaction chamber, obtains the set pressure and the measured pressure of the reaction chamber, if the measured pressure and the set pressure are inconsistent, determines the moving direction of the pressure regulating valve according to the measured pressure and the set pressure, controls the pressure regulating valve to move in the moving direction, continuously obtains the measured pressure in the moving process of the pressure regulating valve, and controls the pressure regulating valve to stop moving when the measured pressure reaches the set range near the set pressure, and adjusts the pressure regulating valve in a closed loop according to the measured pressure and the set pressure. When controlling the pressure in the reaction chamber, the embodiments of the present application determine whether to end the open loop adjustment by detecting whether the measured pressure reaches the set range near the set pressure in real time in the open loop adjustment (determining the moving direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the moving direction), and ending the open loop adjustment in advance or delaying the ending, to avoid pressure lag or pressure in advance, so that the timing of ending the open loop adjustment (or the timing of starting the closed loop adjustment) is relatively accurate, the closed loop adjustment time is relatively short, and the response time of the whole pressure control process is relatively short, the pressure in the reaction chamber is relatively stable, and the process quality of the product is ensured. The opening degree adjustment is realized based on the pre-stored pressure position template, and the scheme is simpler. The open loop adjustment is returned in the closed loop adjustment process, to further reduce the closed loop adjustment time.

[0107] The embodiments of the present application also provide a readable storage medium, and the readable storage medium stores one or more computer programs, the one or more computer programs include instructions, and the program or instructions can make the processor in the semiconductor process equipment execute the processes of the pressure control method embodiments when the program or instructions are executed by the processor in the semiconductor process equipment including a plurality of application programs, and are specifically used for executing the steps of any one of the pressure control method embodiments.

[0108] The readable storage medium of the embodiment of the present application, when controlling the pressure in the reaction chamber, acquires the set pressure and the measured pressure of the reaction chamber, if the measured pressure and the set pressure are inconsistent, determines the moving direction of the pressure regulating valve according to the measured pressure and the set pressure, controls the pressure regulating valve to move along the moving direction, and continuously acquires the measured pressure in the moving process of the pressure regulating valve, and controls the pressure regulating valve to stop moving when the measured pressure reaches the set range near the set pressure, and controls the pressure regulating valve to stop moving according to the measured pressure and the set pressure. The embodiment of the present application controls the pressure in the reaction chamber, and determines whether to end the open-loop regulation by detecting whether the measured pressure reaches the set range near the set pressure in the open-loop regulation (determining the moving direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move along the moving direction), so as to end the open-loop regulation in advance or delay the end, avoid the pressure lag or the pressure in advance, make the timing of ending the open-loop regulation (or the timing of starting the closed-loop regulation) relatively accurate, shorten the closed-loop regulation time, and further shorten the response time of the whole pressure control process, so that the pressure in the reaction chamber is relatively stable, and the process quality of the product is ensured. The opening degree regulation is realized based on the pre-stored pressure position template, and the scheme is simpler. The open-loop regulation is returned in the closed-loop regulation process, and the closed-loop regulation time is further reduced.

[0109] The system, device, module or unit described in the above embodiments can be specifically implemented by a computer chip or entity, or by a product with certain functions. A typical implementation device is a computer. Specifically, the computer may, for example, be a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an electronic mail device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0110] For the convenience of description, the above device is described as various units by function. Of course, the functions of each unit can be implemented in the same or more software and / or hardware in the implementation of the present application.

[0111] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system or a computer program product. Therefore, the present application can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Moreover, the present application can take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0112] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks.

[0113] These computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart block or blocks.

[0114] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks.

[0115] In one typical configuration, the computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0116] The memory can include non-persistent memory and / or volatile memory, such as random access memory (RAM) and / or cache memory, for storing, in general, data and / or program instructions. The memory can also include non-volatile memory, such as read-only memory (ROM), electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory, or non-volatile random access memory (NVRAM) for storing, in general, data and / or program instructions. The memory is an example of computer readable media.

[0117] Computer-readable media includes permanent and non-permanent, movable and non-movable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible by a computing device. According to the definition herein, computer-readable media does not include transitory media such as modulated data signals and carriers.

[0118] It should also be noted that the terms "comprising", "containing", or any other variant thereof are intended to encompass non-exclusive inclusion, such that processes, methods, articles or devices that comprise a list of elements not only include those elements, but also include other elements not expressly listed or inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0119] The present application can be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The present application can also be practiced in distributed computing environments where tasks are performed by remote processing devices that are connected through a communication network. In a distributed computing environment, program modules can be located in both local and remote computer storage media including storage devices.

[0120] Each embodiment in the specification is described in a progressive manner, and the same or similar parts between each embodiment can be referred to each other, and each embodiment focuses on the difference from other embodiments. In particular, for system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the method embodiment.

[0121] The above merely provides an example of the present application, and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall fall into the scope of claims of the present application.

Claims

1. A pressure control method, characterized by, The method comprises: acquiring a set pressure and a measured pressure of a reaction chamber; if the measured pressure and the set pressure are inconsistent, determining a moving direction of a pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the moving direction; during the movement of the pressure regulating valve, continuously acquiring the measured pressure, and when the measured pressure reaches a set range near the set pressure, controlling the pressure regulating valve to stop moving; performing closed-loop regulation on the pressure regulating valve according to the measured pressure and the set pressure.

2. The method of claim 1, wherein, The method of determining the moving direction of the pressure regulating valve according to the measured pressure and the set pressure comprises: if the measured pressure is less than the set pressure, determining that the moving direction of the pressure regulating valve is a direction in which an opening degree position is reduced; if the measured pressure is greater than the set pressure, determining that the moving direction of the pressure regulating valve is a direction in which the opening degree position is increased.

3. The method according to claim 1 or 2, characterized in that, The method of determining the moving direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the moving direction comprises: acquiring a target opening degree position corresponding to the set pressure according to the set pressure and a pre-stored pressure position template, wherein the pressure position template comprises a plurality of pressures and a plurality of opening degree positions corresponding to the plurality of pressures; controlling the pressure regulating valve to move to the target opening degree position.

4. The method of claim 1, wherein, The set range is a set multiple of the set pressure.

5. The method of claim 4, wherein, The set multiple is in a range of 0 to 0.

1.

6. The method of claim 1, wherein, The method of performing closed-loop regulation on the pressure regulating valve according to the measured pressure and the set pressure comprises: calculating a difference between the measured pressure and the set pressure; calculating an opening degree position regulation amount of the pressure regulating valve according to the difference and a pre-set regulation coefficient; regulating the pressure regulating valve according to the opening degree position regulation amount; after the regulation ends, re-acquiring the measured pressure, and returning to the step of calculating the difference between the measured pressure and the set pressure.

7. The method of claim 1, wherein, The method of performing closed-loop regulation on the pressure regulating valve according to the measured pressure and the set pressure comprises: calculating a difference between the measured pressure and the set pressure; calculating an opening degree position regulation amount of the pressure regulating valve according to the difference and a pre-set regulation coefficient; regulating the pressure regulating valve according to the opening degree position regulation amount; after the regulation ends, re-acquiring the measured pressure, and returning to the step of determining the moving direction of the pressure regulating valve according to the measured pressure and the set pressure, and controlling the pressure regulating valve to move in the moving direction.

8. The method of claim 1, wherein, The method of performing closed-loop regulation on the pressure regulating valve according to the measured pressure and the set pressure comprises: calculating a difference between the measured pressure and the set pressure; calculating an opening degree position regulation amount of the pressure regulating valve according to the difference and a pre-set regulation coefficient; regulating the pressure regulating valve according to the opening degree position regulation amount; According to the opening position adjustment amount, the pressure regulating valve is adjusted, and the step of continuously acquiring the measured pressure during the movement of the pressure regulating valve and controlling the pressure regulating valve to stop moving when the measured pressure reaches a set range near the set pressure is returned.

9. The method of claim 1, wherein, The set pressure and the measured pressure are absolute pressures or relative pressures, and the relative pressure is the difference between the absolute pressure and the atmospheric pressure.

10. A pressure control device, characterized by It comprises: a processor, a memory, and a program or instruction stored on the memory and executable on the processor, which, when executed by the processor, implements the steps of the method according to any one of claims 1-9.

11. A semiconductor process apparatus, characterized by, It comprises: a reaction chamber, a pressure regulating valve arranged on an exhaust pipeline of the reaction chamber, and a control unit electrically connected with the pressure regulating valve, wherein the control unit is provided with the pressure control device according to claim 10.

12. The semiconductor process apparatus according to claim 11, wherein It further comprises: a pressure measuring module and a pressure input module; the pressure measuring module is arranged on the exhaust pipeline between the reaction chamber and the pressure regulating valve, is electrically connected with the control unit, is used for measuring the measured pressure in the reaction chamber, and inputs the measured pressure into the control unit; the pressure input module is electrically connected with the control unit, is used for acquiring the set pressure input by a user, and inputs the set pressure into the control unit.

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