Solder paste, solder joined body, and method for producing solder joined body

WO2025254166A1PCT designated stage Publication Date: 2025-12-11MITSUBISHI MATERIALS CORP
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Patent Information

Application Number
PCT/JP2025/020310
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-05
Filing Date
2025-06-04
Publication Date
2025-12-11

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Abstract

This solder paste contains solder powder and spacer powder (21). The melting temperature of the spacer powder (21) is higher than the melting temperature of the solder powder. The spacer powder (21) does not dissolve even when heated for 5 minutes at a temperature 20°C higher than the melting point of the solder powder in a state in which the spacer powder (21) is in contact with a melt of the solder powder. The difference between the lower 10% diameter (D10) and the upper 10% diameter (D90) of the particle diameter of the spacer powder (21) is 30 µm or less. The planar filling rate of the spacer powder (21) when applied and heat-treated is less than 50%.
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Citation Information

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