Method for printing at least one electronic device on a substrate and for subsequently encapsulating the at least one electronic device, and assembly obtainable by implementation of said method

Abstract

A method is disclosed for printing at least one electronic device on a substrate (3) and for subsequently encapsulating the at least one electronic device, and an assembly obtainable by implementation of this method. The method comprises the steps of: providing a substrate (3); printing on the substrate (3) a first electronic device (1), for example a photovoltaic module; providing at least one electrical conductor (41, 42) that is arranged to be connected to the first electronic device (1) and to at least one second electronic device (2), for example an RFID antenna and an integrated circuit; temporarily applying a support (4) on the substrate (3); removing, for example by die-cutting, an area of the substrate (3) that laterally borders both the first electronic device (1) and the at least one electrical conductor (41, 42), so that the substrate (3) presents a through opening (5) that is arranged at the area of the substrate (3) that has been removed and that surrounds the first electronic device (1) forming an open ring; applying, through a first adhesive layer (71), a first barrier layer (61) on one face of the substrate (3), thus covering the first electronic device (1) and the at least one electrical conductor (41, 42); removing the support (4); applying, through a second adhesive layer (72), a second barrier layer (62) on the other face of the substrate (3) to which the support (4) had previously been applied, so as to form together with the first barrier layer (61) a capsule (6) containing the first electronic device (1) and the at least one electrical conductor (41, 42).

Description

[0001] METHOD FOR PRINTING AT LEAST ONE ELECTRONIC DEVICE ON A SUBSTRATE AND FOR SUBSEQUENTLY ENCAPSULATING THE AT LEAST ONE ELECTRONIC DEVICE, AND ASSEMBLY OBTAINABLE BY IMPLEMENTATION OF SAID METHOD

[0002] DESCRIPTION

[0003] FIELD OF THE INVENTION

[0004] The present invention falls within the technical field relating to the printing of an electronic device and of electrical connections on the face of a flexible substrate. More particularly, the invention relates to the encapsulation of said electronic device, once it has been printed on the substrate.

[0005] DESCRIPTION OF THE PRIOR ART

[0006] A known substrate: has the shape of a sheet, is flexible, is electrically insulating and can be printed with electrically conductive ink, that is, with conduction properties. On one face of said substrate, a first electronic device and electrical connections departing from said first electronic device can therefore be printed. On the same face of the substrate, at least one second electronic device to be connected to the first electronic device by means of the aforementioned electrical connections can be arranged, by printing or fixing. For example, the first electronic device can be a photovoltaic module and the at least one second electronic device can comprise an antenna and an integrated circuit to collectively form an RFID system; in particular, the antenna can be printed on the face of the substrate while the integrated circuit can be fixed on the same face of the substrate.

[0007] The substrate can be identified in a tape unwound from a coil, on which multiple electronic devices can be printed and optionally fixed to form electronic circuits arranged one after the other; at a later time, the coil can be cut to separate these electronic circuits from each other.

[0008] As is known, a printed electronic device is sensitive to oxygen and moisture, both of which are capable of significantly degrading it.

[0009] The substrate is typically made of polyethylene terephthalate (PET) or polypropylene (PP), which are materials that are not capable of offering sufficient barrier properties against oxygen and moisture.

[0010] Therefore, it is known to apply on both faces of the substrate a barrier film capable of protecting the two faces of the substrate and its edges from oxygen and moisture, thereby encapsulating the entire electronic circuit comprising the printed first electronic device, the at least one second electronic device and the electrical connections.

[0011] However, this entails drawbacks.

[0012] The production process may involve the printing of the first electronic device and the printing or fixing of the at least one second electronic device (for example, an antenna and an integrated circuit, as mentioned above) at distinct and subsequent stations: in order to fully encapsulate the electronic circuit, it is necessary to apply the barrier film only after the electronic circuit has been completed, that is, after also printing or fixing the at least one second electronic device, which means leaving the first electronic device exposed to oxygen and moisture for a certain period of time, with the risk that it may thus degrade.

[0013] Alternatively, performing a partial protection of only the first electronic device, by applying a barrier film on the first face and on the second face of the first portion, thus excluding the protection of the edges of the substrate, and subsequently completing the encapsulation after the electronic circuit has been made, does not resolve the aforementioned drawback: in fact, before the encapsulation has been completed, oxygen and moisture can still reach the first electronic device through the part of the substrate that has not yet been encapsulated, once again posing the risk that the first electronic device may degrade.

[0014] In any case, the application of the barrier film also on the edges of the substrate requires a prior cutting of the substrate before the encapsulation phase: if the substrate is identified in a tape unwound from a coil, by cutting the substrate into a multitude of parts, rewinding into a coil is no longer possible.

[0015] Moreover, if the at least one second electronic device is not printable (for example, it is an integrated circuit) and therefore does not in itself need to be protected from oxygen and moisture and to be encapsulated, the use of barrier film also on it appears to be a waste of material and, therefore, an undesirable additional cost. In any case, there may be cases in which the at least one second electronic device must not be encapsulated, for example when it is a humidity sensor. SUMMARY OF THE INVENTION

[0016] In light of the above, the object of the present invention is to overcome the aforementioned drawbacks.

[0017] Said object is achieved by means of a method for encapsulating an electronic device that has been printed on a substrate, in accordance with claim 1, and by means of an assembly, in accordance with claim 7, which is obtainable by implementing said method.

[0018] Advantageously, with the encapsulation, the through opening of the substrate is occupied by a material that does not allow the passage of oxygen and moisture. Therefore, oxygen and moisture can reach the first electronic device only by following a longer path, through the at least one electrical conductor, which leads to a significant reduction in the probability that the first electronic device may degrade.

[0019] Further embodiments, defined in the dependent claims, provide that the through opening is even more extended, in order to further increase the length — and therefore the difficulty — of the path that oxygen and moisture would need to follow to reach the first electronic device.

[0020] BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Specific embodiments of the invention will be described in the following of the present discussion, in accordance with what is set out in the claims and with the aid of the attached drawing sheets, in which: figures 1-5 are top views of a substrate having the shape of a sheet, showing some of the steps that are implemented by a method for printing at least one electronic device on a substrate and for subsequently encapsulating the at least one electronic device, which is the subject of the present invention, in accordance with a first embodiment; figure 6 is the view of section VI-VI of figure 1 ; figure 7 is the same view as figure 6 after an additional step of the method that is the subject of the present invention has been carried out; figure 8 is the view of section VII I— VII I of figure 2; figure 9 is the view of section IX— IX of figure 3; figure 10 is the view of section X-X of figure 4; figures 11, 12 are each the same view as figure 10 after two successive steps of the method that is the subject of the present invention have been carried out; figure 13 is the view of section XII I— XI II of figure 5; figures 14-21 are views similar to figures 6-13, but refer to a second embodiment of the method that is the subject of the present invention; figure 23 is an enlarged scale view of a part of figure 3; figures 22, 24-26 are the same views as figure 23 but show alternatives of how the at least one electrical conductor that is connected to the first electronic device can be developed so as to be longer.

[0022] DESCRIPTION OF PREFERRED EMBODIMENTS

[0023] With reference to the attached drawing sheets, a method for printing at least one electronic device on a substrate and for subsequently encapsulating the at least one electronic device, which is the subject of the present invention, comprises the steps of: providing a substrate (3) (figures 1 , 6, 14) which: has the shape of a sheet; has a first face (11); has a second face (12) that is opposed to the first face (11); is flexible; is electrically insulating; comprises a first portion (21) on which ink with electrical properties can be printed at least on the first face (11); comprises a second portion (22) that is adjacent to the first portion (21); printing on the first face (11) of the first portion (21) of the substrate (3) a first electronic device (1) comprising at least a first connection terminal (31) (figures 2, 8, 15); providing on the first face (11) at least of the first portion (21) of the substrate (3) at least one electrical conductor (41, 42) that is arranged to be connected: to the at least one first connection terminal (31) of the first electronic device (1) (figures 2, 8, 15); and to at least one second connection terminal (32) of at least one second electronic device (2) (figures 5, 13, 21), which at least one second electronic device (2) can be positioned on the second portion (22) of the substrate (3); providing a support (4) (figures 7, 16) that is removable, that has the shape of a sheet, that is flexible and that is electrically insulating; applying the support (4) on the first face (11) (figure 16) at least of the first portion (21) of the substrate (3) (in accordance with figure 16, the support (4) is applied on the first face (11) both of the first portion (21) and of the second portion (22)) or on the second face (12) (figure 7) at least of the first portion

[0024] (21) of the substrate (3) (in accordance with figure 7, the support (4) is applied on the second face (12) both of the first portion (21) and of the second portion

[0025] (22)); removing an area of the substrate (3) (figures 3, 9, 15) that comprises a first sub-area (51) (indicated only in figure 2) that laterally borders both the first electronic device (1) and the at least one electrical conductor (41, 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1), so that the substrate (3) presents at least one through opening (5) that is arranged at the area of the substrate (3) that has been removed and that surrounds the first electronic device (1) up to the connection of the at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1); providing a first barrier layer (61) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; providing a first adhesive layer (71) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; applying, through the first adhesive layer (71), the first barrier layer (61) on the face at least of the first portion (21) of the substrate (3) that is opposite to the one where the support (4) was applied, thus covering: the first electronic device (1); the at least one electrical conductor (41, 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1); and the support (4) at the area of the substrate (3) that has been removed (figures 4, 10, 18); removing the support (4) (figures 11, 19); providing a second barrier layer (62) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; providing a second adhesive layer (72) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; applying, through the second adhesive layer (72), the second barrier layer (62) on the face at least of the first portion (21) of the substrate (3) to which the support (4) was previously applied, so as to form together with the first barrier layer (61) a capsule (6) containing the first electronic device (1) and the at least one electrical conductor (41, 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1) (figures 12, 20).

[0026] Through the encapsulation, the through opening (5) of the substrate (3) is thus occupied by a material having a certain degree of resistance to oxygen and moisture permeation, which is preferably identified in the first adhesive layer (71).

[0027] By the expression “electrical properties” it is meant conduction properties, or semi-conduction properties, or also dielectric properties that vary in response to an external stimulus (such as variations in humidity or temperature, for example).

[0028] The through opening (5) can have the shape of an open ring, with a width of the corresponding opposed walls, which delimit the same through opening (5), of at least 0.1 mm, preferably of at least 3 mm.

[0029] The first electronic device (1) may be, for example, a photovoltaic module, a capacitor, an electrochromic display, a battery, a sensor, a logic circuit, or a light-emitting diode (oLED).

[0030] Instead, the at least one second electronic device (2) may be, for example, an RFID system consisting of antenna and chip, a Bluetooth communication module, a hybrid integrated circuit, a ceramic capacitor, a supercapacitor (for example, electrolytic or tantalum) or a battery. Some examples of electronic circuits comprising the first electronic device (1) and the at least one second electronic device (2) are the following: battery or photovoltaic module (first electronic device (1)) that powers the integrated circuit of a semi-passive or active RFID system; battery or photovoltaic module (first electronic device (1)) that powers a hybrid circuit; light or temperature sensor (first electronic device (1)) connected to the I2C port of a Bluetooth communication module; an electrochromic display (first electronic device (1)) connected to the corresponding hybrid driving circuit and battery; an oLED (first electronic device (1)) powered by a battery.

[0031] The degree of resistance to oxygen permeation is the higher the lower the so- called OTR (Oxygen Transmission Rate): preferably, the OTR must be less than 10 cm3m2d1; the degree of resistance to moisture permeation is the higher the lower the so-called WVTR (Water Vapor Transmission Rate): preferably, the WVTR must be less than 10 g m2d1.

[0032] The substrate (3) can be formed by multiple layers: for example, one layer can be made of dielectric material and / or another layer can be made of conductive material. Each of the aforementioned layers can be present in the first portion (21) and / or in the second portion (22).

[0033] At least the first face (11) of the first portion (21) of the substrate (3) has the property of being printable with ink having electrical properties: in this regard, the first face (11) of the first portion (21) may have undergone a surface treatment, or may have been covered with a printable film applied by means of adhesives or printed by coating techniques.

[0034] The substrate (3) can be made of polyethylene terephthalate (PET) or polypropylene (PP). The substrate (3) can have a thickness between 2 pm and 300 pm, preferably between 20 pm and 150 pm.

[0035] The second portion (22) of the substrate (3) may lack, on at least one of its faces, the property of being printable with ink having electrical properties. Such property is in fact not necessary, for example, when the at least one second electronic device (2) is not to be made by printing ink with electrical properties on said second portion (22), as in the case in which the at least one second device is an integrated circuit.

[0036] Preferably, the first portion (21) and the second portion (22) both comprise the first face (11) and the second face (12).

[0037] The at least one electrical conductor (41, 42) may be of the type printable on the first face (11) of the first portion (21) of the substrate (3).

[0038] In the case in which the first face (11) of the second portion (22) of the substrate (3) is also printable with ink having electrical properties, the at least one electrical conductor (41, 42) can also be printed on the first face (11) of the second portion (22) of the substrate (3), thus extending between the first face (11) of the first portion (21) and the first face (11) of the second portion (22). This solution has been illustrated in the figures, in which the at least one electrical conductor (41, 42) comprises a first electrical conductor (41) and a second electrical conductor (42).

[0039] In the case in which the second portion (22) of the substrate (3) is not printable with ink having electrical properties, the at least one electrical conductor (41 , 42) may comprise at least one first electrical conductor (41) that is printed only on the first face (11) of the first portion (21) of the substrate (3), and at least one second electrical conductor (42) that is connected to the at least one first electrical conductor (41) and that is also connected to the at least one second connection terminal (32) of the at least one second electronic device (2) (solution not illustrated). The at least one second electrical conductor (42) may be obtained by a known subtractive technique, starting from a surface layer of copper or aluminum (chemical etching), or may be a conductive tab fixable by adhesive on the first face (11) of the second portion (22) of the substrate (3).

[0040] Alternatively, the at least one electrical conductor (41 , 42) may not be printed, even in part: for example, it may be obtained by a known subtractive technique, starting from a surface layer of copper or aluminum (chemical etching), or may be a conductive tab fixable by adhesive on the first face (11) of the substrate (3).

[0041] The at least one first connection terminal (31) may comprise, for example, two connection terminals of the first electronic device (1): this is evident from figures 25 and 26, but also in the other figures 2, 3, 22-24, which are schematic, it can be considered that there may be two connection terminals of the first electronic device (1), although they are not expressly illustrated. The illustrated figures are, as mentioned, schematic, and the at least one first connection terminal (31) is not distinguishable from the at least one electrical conductor (41 , 42). In addition, the at least one second connection terminal (32) may also comprise, for example, two connection terminals of the second electronic device (even though they are not expressly illustrated), while the at least one conductor may comprise a pair of conductors (also not illustrated) which are connected, on one side, to the two connection terminals of the first electronic device (1) and, on the other side, to the two connection terminals of the second electronic device. Analogous considerations apply when the at least one electrical conductor (41 , 42) comprises at least one first electrical conductor (41) and at least one second electrical conductor (42).

[0042] The at least one second electronic device (2) is preferably positioned on the first face (11) of the second portion (22).

[0043] The positioning of the at least one second electronic device (2) on the second portion (22) can take place before or after the implementation of the above- mentioned method steps, for example by fixing or by printing ink with electrical properties.

[0044] The support (4) can be adhesive or can adhere to the face of the substrate (3) by electrostatic action. In the first case, it is an adhesion made possible by the presence of an adhesive material that establishes a chemical attraction force such as to hold the support (4) together with the substrate (3); such adhesive material can be a glue or a double-sided film. In the second case, the adhesion between the two materials occurs through electrostatic forces that are intrinsically present on the surface of the support (4) or induced on the surface of the support (4).

[0045] The first adhesive layer (71) and the second adhesive layer (72) may comprise UV-curing or thermally-curing resins, or may be double-sided adhesives or thermo-activated lacquers to be previously coupled to the first barrier layer (61) and to the second barrier layer (62), respectively.

[0046] The area of the substrate (3) that is removed may be part only of the first portion (21) of the substrate (3) (see, for example, figure 3) or may be part of both the first portion (21) of the substrate (3) and the second portion (22) of the substrate (3) (solution not illustrated).

[0047] Preferably, the step of applying the support (4) on the first face (11) at least of the first portion (21) of the substrate (3) or on the second face (12) at least of the first portion (21) of the substrate (3) is carried out before the step of removing an area of the substrate (3). Preferably, the at least one electrical conductor (41, 42) extends along a path that includes a plurality of direction changes (80, 81) to make it longer (see figures 22-24, 26); the area of the substrate (3) to be removed also includes at least one second sub-area (52) (indicated only in figure 2) that laterally borders the at least one electrical conductor (41 , 42) at least up to a first direction change (81) of the plurality of direction changes (80, 81) from the connection with the at least one first connection terminal (31) of the first electronic device (1), so that the through opening (5) also extends at the second sub-area (52) that has been removed; the capsule (6) formed by the first barrier layer (61) and the second barrier layer (62) also contains the portion of the at least one electrical conductor (41, 42) that laterally borders the at least one second sub-area (52).

[0048] In figure 22, the direction changes of the plurality of direction changes (80, 81) are four in number, in figure 23 (in accordance with the first embodiment) they are three in number, in figure 24 they are two in number, and in figure 26 they are one in number. In accordance with figure 25, there are no direction changes of the plurality of direction changes (80, 81).

[0049] Preferably, the step of removing an area of the substrate (3) is carried out from the side of the face of the substrate (3) that is opposite to the one where the support (4) was applied.

[0050] Preferably, the step of removing an area of the substrate (3) includes the substep of die-cutting the substrate (3).

[0051] Preferably, the substrate (3) is identified in a tape (figures 1-5 show in particular a portion of said tape) that is unwound from a coil (not illustrated).

[0052] An assembly (figures 5, 13, 21) obtainable through the method described above is also the subject of the present invention, wherein: it comprises a substrate (3) that: has a first face (11); has a second face (12) that is opposed to the first face (11); is flexible; is electrically insulating; comprises a first portion (21) on which ink with electrical properties can be printed at least on the first face (11); comprises a second portion (22) that is adjacent to the first portion (21); it comprises a first electronic device (1) comprising at least a first connection terminal (31), which first electronic device (1) is printed on the first face (11) of the first portion (21) of the substrate (3); it comprises at least one second electronic device (2) that is positioned on the second portion (22) of the substrate (3) and that comprises at least one second connection terminal (32) that is connected to the at least one electrical conductor (41 , 42); it comprises at least one electrical conductor (41 , 42) that is arranged on the first face (11) of the substrate (3) and that is connected both to the at least one first connection terminal (31) of the first electronic device (1) and to the at least one second connection terminal (32) of the at least one second electronic device (2); the substrate (3) presents a through opening (5) that laterally borders at least the first electronic device (1) and the at least one electrical conductor (41 , 42) at least at the connection of the same at least one electrical conductor (41 , 42) with the at least one first connection terminal (31) of the first electronic device (1), so that the through opening (5) surrounds the first electronic device (1) up to the connection of the at least one electrical conductor (41 , 42) with the at least one first connection terminal (31) of the first electronic device (1); it comprises a first barrier layer (61) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; it comprises a first adhesive layer (71) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; it comprises a second barrier layer (62) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; it comprises a second adhesive layer (72) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; the first barrier layer (61) is arranged, by means of the first adhesive layer

[0053] (71), on a face at least of the first portion (21) of the substrate (3) and the second barrier layer (62) is arranged, by means of the second adhesive layer

[0054] (72), on the other face at least of the first portion (21) of the substrate (3) so as to form together a capsule (6) containing the first electronic device (1) and the at least one electrical conductor (41 , 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1).

[0055] Preferably, the at least one electrical conductor (41, 42) extends along a path that includes a plurality of direction changes (80, 81) to make it longer; the through opening (5) of the substrate (3) laterally borders the at least one electrical conductor (41 , 42) at least up to a first direction change (81) of the plurality of direction changes (80, 81) from the connection with the at least one first connection terminal (31) of the first electronic device (1); the capsule (6) formed by the first barrier layer (61) and the second barrier layer (62) contains the at least one electrical conductor (41, 42) at least up to the first direction change (81) of the plurality of direction changes (80, 81) from the connection with the at least one first connection terminal (31) of the first electronic device (1).

[0056] Preferably, the first electronic device (1) is identified in a photovoltaic module, or a capacitor, or an electrochromic display, or a battery, or a sensor, or a logic circuit, or a light-emitting diode (oLED).

[0057] Preferably, the at least one second electronic device (2) is identified in an RFID device, or a Bluetooth communication module, or a hybrid integrated circuit, or a ceramic capacitor, or a supercapacitor or a battery.

[0058] A brief description of the method in question follows, in accordance with the first embodiment shown in figures 1-13.

[0059] The substrate (3) is initially provided, figures 1, 6, which, as stated, may be part of a tape that is unwound from a coil.

[0060] Then, figure 7, the support (4) is applied on the second face (12) of the first portion (21) of the substrate (3) and of the second portion (22) of the substrate (3).

[0061] Before or after (figures 2, 8) the application of the support (4), the first electronic device (1) is printed on the first face (11) of the first portion (21) of the substrate (3), and the at least one electrical conductor (41, 42) is provided on the first face (11) of the substrate (3), which is connected to the at least one first connection terminal (31) of the first electronic device (1).

[0062] Then, both the first sub-area (51) and the second sub-area (52) are removed, so that the substrate (3) presents the through opening (5) (figures 3, 9). At this point, the first barrier layer (61) is applied, through the first adhesive layer (71), on the first face (11) of the first portion (21) of the substrate (3) and partially on the first face (11) of the second portion (22) of the substrate (3), figures 4, 10.

[0063] Subsequently, the support (4) is removed, figure 11 , and the second barrier layer (62) is applied, through the second adhesive layer (72), on the second face (12) of the first portion (21) of the substrate (3) and partially on the second face (12) of the second portion (22) of the substrate (3), forming the said capsule (6), figure 12.

[0064] Finally (although this step could have been performed earlier), the at least one second electronic device (2) is positioned on the second portion (22) of the substrate (3), preferably on the first face (11) of the substrate (3), figures 5, 13. In the example illustrated in these figures, the at least one second electrical conductor (42) (being part of the at least one electrical conductor (41 , 42)) is applied simultaneously (or in sub-steps consecutive to each other) with the positioning of the at least one second electronic device (2).

[0065] Figures 14-21 instead show a second embodiment of the method in question. A brief description follows.

[0066] The substrate (3) is initially provided, figure 14.

[0067] Then, figure 15, the first electronic device (1) is printed on the first face (11) of the first portion (21) of the substrate (3), and the at least one electrical conductor (41, 42) is provided on the first face (11) of the substrate (3), which is connected to the at least one first connection terminal (31) of the first electronic device (1).

[0068] Subsequently, figure 16, the support (4) is applied on the first face (11) of the first portion (21) of the substrate (3) and of the second portion (22) of the substrate (3).

[0069] Then, both the first sub-area (51) and the second sub-area (52) are removed, so that the substrate (3) presents the through opening (5) (figure 17).

[0070] At this point, the first barrier layer (61) is applied, through the first adhesive layer (71), on the second face (12) of the first portion (21) of the substrate (3) and partially on the second face (12) of the second portion (22) of the substrate (3), figure 18. Subsequently, the support (4) is removed, figure 19, and the second barrier layer (62) is applied, through the second adhesive layer (72), on the first face (11) of the first portion (21) of the substrate (3) and partially on the first face (11) of the second portion (22) of the substrate (3), forming the said capsule (6), figure 20.

[0071] Finally, both the at least one second electronic device (2) and the at least one second electrical conductor (42) are positioned on the first face (11) of the second portion (22) of the substrate (3), figure 21.

[0072] It is understood that the above has been described by way of example and not limitation, and that any constructional variants are to be considered as falling within the protective scope of the present technical solution, as hereinafter claimed.

Claims

CLAIMS1. Method for printing at least one electronic device on a substrate (3) and for subsequently encapsulating the at least one electronic device, comprising the steps of: providing a substrate (3) that: has the shape of a sheet; has a first face (11); has a second face (12) opposed to the first face (11); is flexible; is electrically insulating; comprises a first portion (21) on which ink with electrical properties can be printed at least on the first face (11); comprises a second portion (22) adjacent to the first portion (21); printing on the first face (11) of the first portion (21) of the substrate (3) a first electronic device (1) comprising at least a first connection terminal (31); providing on the first face (11) of the substrate (3) at least one electrical conductor (41, 42) that is arranged to connect: to the at least one first connection terminal (31) of the first electronic device (1); and to at least one second connection terminal (32) of at least one second electronic device (2), which at least one second electronic device (2) can be positioned on the second portion (22) of the substrate (3); characterized by comprising the steps of: providing a support (4) that is removable, that has the shape of a sheet, that is flexible and that is electrically insulating; applying the support (4) on the first face (11) at least of the first portion (21) of the substrate (3) or on the second face (12) at least of the first portion (21) of the substrate (3); removing an area of the substrate (3) that comprises a first sub-area (51) which laterally borders both the first electronic device (1) and the at least one electrical conductor (41, 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1), so that the substrate (3) presents a through opening (5) that is arranged at the area of the substrate (3) that has been removed and that surrounds the first electronic device (1) up to the connection of the at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1);providing a first barrier layer (61) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; providing a first adhesive layer (71) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; applying, through the first adhesive layer (71), the first barrier layer (61) on the face at least of the first portion (21) of the substrate (3) that is opposite to the one where the support (4) was applied, thus covering: the first electronic device (1); the at least one electrical conductor (41, 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1); and the support (4) in correspondence with at least the area of the substrate (3) that has been removed; removing the support (4); providing a second barrier layer (62) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; providing a second adhesive layer (72) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; applying, through the second adhesive layer (72), the second barrier layer (62) on the face at least of the first portion (21) of the substrate (3) to which the support (4) was previously applied, so as to form together with the first barrier layer (61) a capsule (6) containing the first electronic device (1) and the at least one electrical conductor (41, 42) at least at the connection of the same at least one electrical conductor (41, 42) with the at least one first connection terminal (31) of the first electronic device (1).

2. Method according to the preceding claim, wherein: the step of applying the support (4) on the first face (11) at least of the first portion (21) of the substrate (3) or on the second face (12) at least of the first portion (21) of the substrate (3) is carried out before the step of removing an area of the substrate (3).

3. Method according to claim 1 or 2, wherein: the at least one electrical conductor (41, 42) extends along a path thatincludes a plurality of direction changes (80, 81) to make it longer; the area of the substrate (3) to be removed also includes at least one second sub-area (52) which laterally borders the at least one electrical conductor (41, 42) at least up to a first direction change (81) of the plurality of direction changes (80, 81) from the connection with the at least one first connection terminal (31) of the first electronic device (1), so that the through opening (5) also extends at the second sub-area (52) that has been removed; the capsule (6) formed by the first barrier layer (61) and the second barrier layer (62) also contains the portion of the at least one electrical conductor (41, 42) which laterally borders the at least one second sub-area (52).

4. Method according to claim 1 or 2 or 3, wherein the step of removing an area of the substrate (3) is carried out from the side of the face of the substrate (3) that is opposite to the one where the support (4) was applied.

5. Method according to the preceding claim, wherein the step of removing an area of the substrate (3) includes the sub-step of die-cutting the substrate (3).

6. Method according to any one of the preceding claims, wherein the substrate (3) is identified in a tape that is unwound from a coil.

7. Assembly obtainable by the method of claim 1, wherein: it comprises a substrate (3) that: has a first face (11); has a second face (12) opposed to the first face (11); is flexible; is electrically insulating; comprises a first portion (21) on which ink with electrical properties can be printed at least on the first face (11); comprises a second portion (22) that is adjacent to the first portion (21); it comprises a first electronic device (1) that includes at least a first connection terminal (31), which first electronic device (1) is printed on the first face (11) of the first portion (21) of the substrate (3); it comprises at least one second electronic device (2) that is positioned on the second portion (22) of the substrate (3) and that includes at least one second connection terminal (32) that is connected to the at least one electrical conductor (41, 42); it comprises at least one electrical conductor (41, 42) that is arranged on the first face (11) of the substrate (3) and that is connected both to the at least one first connection terminal (31) of the first electronic device (1) and to the at leastone second connection terminal (32) of the at least one second electronic device (2); characterized by the fact that: the substrate (3) has a through opening (5) that laterally borders the at least the first electronic device (1) and the at least one electrical conductor (41 , 42) at least at the connection of the same at least one electrical conductor (41 , 42) with the at least one first connection terminal (31) of the first electronic device (1) so that the through opening (5) surrounds the first electronic device (1) up to the connection of the at least one electrical conductor (41 , 42) with the at least one first connection terminal (31) of the first electronic device (1); it comprises a first barrier layer (61) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; it comprises a first adhesive layer (71) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; it comprises a second barrier layer (62) that has the shape of a sheet, that is flexible, that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; it comprises a second adhesive layer (72) that is electrically insulating and that has a certain degree of resistance to oxygen and moisture permeation; the first barrier layer (61) is arranged, by means of the first adhesive layer(71), on a face at least of the first portion (21) of the substrate (3) and the second barrier layer (62) is arranged, by means of the second adhesive layer(72), on the other face at least of the first portion (21) of the substrate (3) so as to form together a capsule (6) containing the first electronic device (1) and the at least one electrical conductor (41 , 42) at least in correspondence with the connection of the same at least one electrical conductor (41 , 42) with the at least one first connection terminal (31) of the first electronic device (1).

8. Assembly according to the preceding claim, wherein: the at least one electrical conductor (41 , 42) extends along a path that includes a plurality of direction changes (80, 81) to make it longer; the through opening (5) of the substrate (3) laterally borders the at least one electrical conductor (41 , 42) at least up to a first direction change (81) of theplurality of direction changes (80, 81) from the connection with the at least one first connection terminal (31) of the first electronic device (1); the capsule (6) formed by the first barrier layer (61) and the second barrier layer (62) contains the at least one electrical conductor (41 , 42) at least up to the first direction change (81) of the plurality of direction changes (80, 81) from the connection with the at least one first connection terminal (31) of the first electronic device (1).

9. Assembly according to claim 7 or 8, wherein the first electronic device (1) is identified in a photovoltaic module, or a capacitor, or an electrochromic display, or a battery, or a sensor, or a logic circuit, or a light-emitting diode (oLED).

10. Assembly according to any one of claims 7 to 9, wherein the at least one second electronic device (2) is identified in an RFID device, or a Bluetooth communication module, or a hybrid integrated circuit, or a ceramic capacitor, or a supercapacitor or a battery.

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