Press sensing apparatus and electronic device

Abstract

Embodiments of the present application provide a press sensing apparatus and an electronic device. The press sensing apparatus comprises: a circuit board, a support, and multiple sensors. Each sensor comprises a first electrode and a second electrode, the first electrode and the second electrode being separately connected to a lower surface of the circuit board, and a closed cavity being formed between the first electrode and the second electrode. The support is fixed on a housing of an electronic device, and the support abuts against a second electrode. When the press sensing apparatus receives a pressing operation, a second electrode is deformed, and the distance between a first electrode and the second electrode changes, such that a sensor generates a pressing signal. The circuit board is used for transmitting the pressing signal to a control unit, and enabling the control unit to recognize the pressing operation according to the pressing signal. The press sensing apparatus provided in the embodiments of the present application can perform global press sensing.

Description

Press detection device and electronic equipment Technical Field

[0001] This application relates to the field of electrical engineering technology, and more particularly to a pressure detection device and an electronic device. Background Technology

[0002] The touchpad is a flat panel mounted on the C-shell of a laptop. The touchpad on a laptop can recognize touch commands and press commands. When the user's finger slides on the touch area of ​​the touchpad, the cursor on the laptop can be moved. When the user's finger presses on the touchpad, the touchpad can recognize the press command and make the laptop perform the corresponding operation.

[0003] Existing touchpads use mechanical pressing structures, either in a half-area pressing mode or as individual buttons, to recognize pressing commands.

[0004] However, individual button designs occupy a portion of the touchpad's touch area, reducing the touch area's size. Furthermore, semi-domain press designs require pressing at specific locations to recognize press commands, resulting in a poor user experience for existing touchpads.

[0005] Summary of the Invention

[0006] In view of this, embodiments of this application provide a pressure detection device and an electronic device to at least partially solve the above-mentioned problems.

[0007] According to a first aspect of the present application, a press detection device is provided, applied to an electronic device, comprising: a circuit board, a bracket, and a plurality of sensors; the sensors include a first electrode and a second electrode, the first electrode and the second electrode being respectively connected to the lower surface of the circuit board, and a sealed cavity being formed between the first electrode and the second electrode; the bracket is fixed to the housing of the electronic device, and the bracket abuts against the second electrode; when the press detection device receives a press operation, the second electrode deforms, and the distance between the first electrode and the second electrode changes, causing the sensor to generate a press signal; the circuit board is used to transmit the press signal to a control unit, and to enable the control unit to identify the press operation based on the press signal.

[0008] According to a second aspect of the present application, an electronic device is provided, including a housing and a press detection device as described in the first aspect of the present application; a bracket in the press detection device is fixed to the housing.

[0009] According to the pressing detection device provided in the embodiment of the present application, when the pressing detection device receives a pressing operation, the relative distance between the first electrode and the second electrode in the sensor changes, so that the sensor can generate a pressing signal, and the circuit board can transmit the pressing signal to the control unit, so as to realize the recognition of the pressing operation of the user. Since no physical button is arranged, compared with the touchpad in the prior art in the form of a single button, the area of the touch area is larger. Since the pressing position is not limited, the pressing signal can be generated when the pressing detection device receives the pressing operation, so compared with the touchpad in the prior art in the form of a half-area pressing, the user can press at any position, without pressing at a specific position, so that the user experience is improved. Since the first electrode and the second electrode in the sensor form a closed cavity, foreign matter or liquid can be prevented from entering between the first electrode and the second electrode, so that the dustproof and waterproof performance of the pressing detection device is higher. Therefore, the pressing detection device can be used in various use scenarios, and the applicability is higher. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can be obtained by those skilled in the art based on these drawings.

[0011] FIG. 1 is a schematic diagram of a touchpad in the form of a single button provided in the embodiment of the present application;

[0012] FIG. 2 is a schematic diagram of a pressing detection device provided in the embodiment of the present application;

[0013] FIG. 3 is a schematic diagram of a bracket provided in the embodiment of the present application;

[0014] FIG. 4 is a schematic diagram of a second electrode provided in the embodiment of the present application;

[0015] FIG. 5 is a schematic diagram of a circuit board provided in the embodiment of the present application;

[0016] FIG. 6 is a schematic diagram of the second electrode and the electrically connected area after electrically connected provided in the embodiment of the present application;

[0017] FIG. 7 is a schematic diagram of another pressing detection device provided in the embodiment of the present application;

[0018] FIG. 8 is an exploded view of a pressing detection device provided in the embodiment of the present application;

[0019] FIG. 9 is a schematic diagram of a sensing part provided in the embodiment of the present application;

[0020] FIG. 10 is a schematic diagram of another circuit board according to an embodiment of the present application;

[0021] FIG. 11 is a cross-sectional view of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to make personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and in detail below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art should fall within the scope of protection of the embodiments of the present application.

[0023] As described above, the touchpad is a flat plate arranged on the shell of a notebook computer C. The touchpad on the notebook computer can recognize touch instructions and pressing instructions. When a user's finger slides on the touch area of the touchpad, the cursor in the notebook computer can be moved. When the user's finger presses on the touchpad, the touchpad can recognize the pressing instructions to make the notebook computer perform corresponding operations. The existing touchpad uses a mechanical pressing structure in a half-area pressing form or a separate key form to recognize the pressing instructions. For example, FIG. 1 is a schematic diagram of a touchpad in a separate key form according to an embodiment of the present application. As shown in FIG. 1, the touchpad in the separate key form includes two keys. A user inputs pressing instructions through the two keys. Specifically, the left key 102 can simulate the left key of a mouse, and the right key 103 can simulate the right key of a mouse. However, the separate key form occupies part of the area of the touch area 101 of the touchpad, which reduces the area of the touch area 101. Moreover, the half-area pressing form needs to be pressed at a specific position to recognize the pressing instructions. For example, the half-area pressing form needs to be pressed at the lower left corner to simulate the left key of a mouse and needs to be pressed at the lower right corner to simulate the right key of a mouse. Therefore, the existing touchpad has poor user experience.

[0024] The embodiment of the present application provides a pressing detection device, which comprises a circuit board, a support and a plurality of sensors. When the pressing detection device receives a pressing operation, the relative distance between a first electrode and a second electrode in the sensor changes, so that the sensor can generate a pressing signal. The circuit board can transmit the pressing signal to a control unit, so as to realize the recognition of the pressing operation of the user. Since no physical button is arranged, compared with the touchpad in the prior art in the form of a single button, the area of the touch area is larger. Since the pressing position is not limited, the pressing signal can be generated when the pressing detection device receives the pressing operation, so compared with the touchpad in the prior art in the form of a half-area pressing, the user can press anywhere without pressing at a specific position, so that the user experience is improved. Since the first electrode and the second electrode in the sensor form a closed cavity, foreign matter or liquid can be prevented from entering between the first electrode and the second electrode, so that the dustproof and waterproof performance of the pressing detection device is higher. Therefore, the pressing detection device can be used in various use scenarios, and the applicability is higher.

[0025] The pressing detection device provided by the present application is described below through examples.

[0026] FIG. 2 is a schematic diagram of a pressing detection device provided by the embodiment of the present application, which is applied to an electronic device. As shown in FIG. 2, the pressing detection device comprises a circuit board 202, a support 203 and a plurality of sensors. The sensors comprise a first electrode 2041 and a second electrode 2042. The first electrode 2041 and the second electrode 2042 are respectively connected with the lower surface of the circuit board 202, and a closed cavity is formed between the first electrode 2041 and the second electrode 2042. The support 203 is fixed on the shell 301 of the electronic device, and the support 203 abuts against the second electrode 2042. When the pressing detection device receives a pressing operation, the second electrode 2042 is deformed, the distance between the first electrode 2041 and the second electrode 2042 changes, so that the sensor generates a pressing signal. The circuit board 202 can transmit the pressing signal to a control unit, and the control unit can recognize the pressing operation according to the pressing signal.

[0027] The sensors are arranged between the circuit board 202 and the support 203. The support 203 is fixed on the shell 301 of the electronic device. In an example, the support 203 can be made of metal. In another example, the support 203 can be made of plastic. The support 203 can be fixed on the shell 301 of the electronic device by means of bolts, clamps or the like. The specific fixing method is not limited herein. It should be understood that the plurality of sensors can be distributed at different positions on the circuit board 202. Alternatively, the plurality of sensors can be uniformly distributed at the edges of the circuit board 202.

[0028] The first electrode 2041 and the second electrode 2042 are sealingly connected, that is, a sealed cavity is formed between the first electrode 2041 and the second electrode 2042, the sealed cavity is not communicated with the external air, in an example, the first electrode 2041 can be covered by the disc-shaped second electrode 2042, so that the sealed cavity is formed between the first electrode 2041 and the second electrode 2042, and the sealed cavity between the first electrode 2041 and the second electrode 2042 is separated from the external environment.

[0029] When the pressing detection device receives a pressing operation, for example, a user's finger pressing, the circuit board 202 is displaced in the pressure direction, and relative motion is generated with the support 203. At this time, since the support 203 is fixed on the shell 301 of the electronic device, the circuit board 202 is displaced relative to the support 203. The first electrode 2041 is arranged on the circuit board 202, and the second electrode 2042 abuts against the support 203. When the circuit board 202 is displaced relative to the support 203, the second electrode 2042 is deformed, so that the relative distance between the first electrode 2041 and the second electrode 2042 is changed, the capacitance of the sensor is changed, and thus the sensor generates a pressing signal. After the circuit board 202 receives the pressing signal sent by the sensor, the pressing signal is transmitted to the control unit. The control unit can recognize the pressing signal, and perform a pressing operation according to the pressing signal. In an example, the control unit can be a pressing detection chip arranged on the circuit board 202, a touch chip arranged on the circuit board 202, or a processor of the electronic device, and the like.

[0030] In an example, FIG. 3 is a schematic diagram of a support according to an embodiment of the present application. As shown in FIG. 3, the support 203 can be connected with the shell 301 of the electronic device through a plurality of connecting components 2031 extending from the support 203. Specifically, the connecting components 2031 can be fixed on the shell 301 of the electronic device through bolts and bolt holes of the connecting components 2031. In another example, the support 203 can also be bonded or clamped on the shell 301 of the electronic device. The specific connection mode is not limited here.

[0031] Optionally, when the pressing detection device receives the pressing operation, the relative distance between the first electrode 2041 and the second electrode 2042 changes, which causes the capacitance of the sensor to change, and thus the sensor generates a pressing signal; when the amount of change of the relative distance between the first electrode 2041 and the second electrode 2042 is different, the amount of change of the capacitance of the sensor is different, and the signal strength of the generated pressing signal is different (for example, when the pressing signal is a current signal, the amount of change of the current is different, and when the pressing signal is a voltage signal, the amount of change of the voltage is different); and when the pressing force of the pressing operation is large, the relative distance between the first electrode 2041 and the second electrode 2042 changes greatly, and thus the amount of change of the relative distance between the first electrode 2041 and the second electrode 2042 can be determined according to the signal strength of the pressing signal, and thus the pressing force of the pressing operation received by the pressing detection device can be determined; for example, when the strength of the pressing signal is large, the pressing force is large, and when the strength of the pressing signal is small, the pressing force is small, and thus the pressing operation can be detected in terms of pressure, and the pressure of the pressing operation can be determined.

[0032] It should be noted that one of the first electrode 2041 and the second electrode 2042 serves as a driving electrode to receive a driving signal generated by a control unit on the circuit board 202, and the control unit can be a touch chip, a pressing detection chip or the like; and the other of the first electrode 2041 and the second electrode 2042 serves as a receiving electrode to output a pressing signal to the control unit on the circuit board, and thus the pressing detection is realized.

[0033] In the embodiment of the present application, the pressing detection device includes the circuit board 202, the support 203 and a plurality of sensors; when the pressing detection device receives the pressing operation, the relative distance between the first electrode 2041 and the second electrode 2042 in the sensor changes, and thus the sensor generates a pressing signal; the circuit board 202 can transmit the pressing signal to the control unit, and thus the pressing operation of the user can be recognized; since no physical key is arranged, the area of the touch area is larger than that of the touch pad with a single key in the prior art; since the pressing position is not limited, the pressing signal can be generated when the pressing detection device receives the pressing operation, and thus the user can press anywhere without pressing at a specific position, and thus the user experience is improved; and since the first electrode 2041 and the second electrode 2042 in the sensor form a sealed cavity, foreign matter or liquid cannot enter between the first electrode 2041 and the second electrode 2042, and thus the dustproof and waterproof performance of the pressing detection device is high, and thus the pressing detection device can be used in various use scenarios, and thus the applicability is high.

[0034] In a possible implementation, as shown in FIG. 2, the pressing detection apparatus further includes a cover plate 201, an upper surface of the cover plate 201 provides a pressing surface, a lower surface of the cover plate 201 is attached to an upper surface of the circuit board 202, the upper surface of the cover plate 201 is opposite to the lower surface of the cover plate 201, the upper surface of the circuit board 202 is opposite to a lower surface of the circuit board 202, and the pressing detection apparatus receives a pressing operation when the cover plate 201 is pressed.

[0035] The upper surface of the cover plate 201 provides a pressing surface. In an example, the cover plate 201 can be a glass cover plate 201. The circuit board 202 is arranged between the sensor and the cover plate 201. When the cover plate 201 is pressed, for example, a user presses the cover plate 201, the pressing detection apparatus receives a pressing operation, the cover plate 201 drives the circuit board 202 to move in a pressure direction and relatively move with the support 203. At this time, since the support 203 is fixed on the shell 301 of the electronic device, the circuit board 202 relatively moves with respect to the support 203, and since the first electrode 2041 is arranged on the circuit board 202, the second electrode 2042 abuts against the support 203. When the circuit board 202 relatively moves with respect to the support 203, the second electrode 2042 deforms to change a relative distance between the first electrode 2041 and the second electrode 2042, so that a capacitance of the sensor changes, thereby causing the sensor to generate a pressing signal. Thus, the pressing operation of the user can be recognized. In an example, as shown in FIG. 2, the cover plate 201 can be attached to the circuit board 202 through a first adhesive layer 401.

[0036] Optionally, the circuit board 202 can be a circuit board 202 with a touch recognition function. At this time, the cover plate 201 can also provide a touch surface. When a finger slides on the cover plate 201, the circuit board 202 performs touch recognition on a sliding track of the finger to generate a touch recognition signal. The circuit board 202 can transmit the touch recognition signal to a touch recognition chip on the circuit board 202 or a processing unit of the electronic device, so that the electronic device performs a related operation corresponding to the finger sliding, for example, moving a cursor, moving a page, page zooming, and the like, which will not be described herein.

[0037] In the embodiments of the present application, the pressing detection apparatus further includes the cover plate 201, so that a pressing surface can be provided to the user. When the user presses the cover plate 201, the pressing detection apparatus can receive a pressing operation, so that the pressing operation of the user can be recognized through the pressing detection apparatus. Since the pressing position is not limited, a pressing signal can be generated when the cover plate 201 is pressed. Therefore, compared with the pressing detection scheme in the prior art, the user can press anywhere on the cover plate 201 without pressing at a specific position, thereby improving the user experience.

[0038] Fig. 4 is a schematic view of a second electrode according to an embodiment of the present application. As shown in Fig. 4, the second electrode 2042 comprises an integral sensing portion 20423, a deformation portion 20422 and a connecting portion 20421. The sensing portion 20423 is in a circular plate structure, and the connecting portion 20421 is in a circular ring structure. The radius of the sensing portion 20423 is smaller than the inner radius of the connecting portion 20421. The sensing portion 20423 is connected to the connecting portion 20421 through the deformation portion 20422. The sensing portion 20423 and the connecting portion 20421 are in different planes, and the center line of the sensing portion 20423 and the connecting portion 20421 is perpendicular to the circuit board 202. The connecting portion 20421 is electrically connected to the lower surface of the circuit board 202. In the direction perpendicular to the circuit board 202, the sensing portion 20423 is arranged opposite to the first electrode 2041. When the pressing detection device receives a pressing operation, the deformation portion 20422 is deformed, and the sensing portion 20423 moves towards the first electrode 2041. The change of the distance between the first electrode 2041 and the sensing portion 20423 causes the sensor to generate a pressing signal.

[0039] The sensing portion 20423 is connected to the connecting portion 20421 through the deformation portion 20422. The sensing portion 20423 is in a circular plate structure, and the connecting portion 20421 is in a circular ring structure. It should be understood that, since there is a gap between the circuit board 202 and the support 203, the connecting portion 20421 and the sensing portion 20423 are not in the same plane. Therefore, the connecting portion 20421 can be electrically connected to the circuit board 202, and the sensing portion 20423 can be in abutment with the support 203. Since the radius of the sensing portion 20423 is smaller than the inner radius of the connecting portion 20421, the deformation portion 20422 can be in a hollow circular truncated cone structure as shown in Fig. 2. The edge of the large circular surface of the circular truncated cone structure of the deformation portion 20422 is connected to the inner circle of the connecting portion 20421, and the edge of the small circular surface of the circular truncated cone structure of the deformation portion 20422 is connected to the edge of the sensing portion 20423. In this way, the sensing portion 20423, the deformation portion 20422 and the connecting portion 20421 combine to form a disc-shaped second electrode 2042.

[0040] The center line of the sensing portion 20423 and the connecting portion 20421 is perpendicular to the circuit board 202, i.e., the centers of the sensing portion 20423 and the connecting portion 20421 are located on a straight line in the direction perpendicular to the circuit board 202. In other words, in the direction perpendicular to the circuit board 202, the projections of the sensing portion 20423 and the connecting portion 20421 on the circuit board 202 share the same center.

[0041] When the pressing detection apparatus receives a pressing operation, for example, when the upper surface of the cover plate 201 is pressed, the cover plate 201 drives the circuit board 202 to move relative to the support 203, so that the relative distance between the circuit board 202 and the support 203 is reduced. At this time, because the induction portion 20423 abuts against the support 203, the circuit board 202 drives the connecting portion 20421 to move downward, so that the deformation portion 20422 is deformed, and the relative distance between the first electrode 2041 and the induction portion 20423 is reduced, and the sensor generates a pressing signal. When the pressing of the upper surface of the cover plate 201 is stopped, the deformation portion 20422 rebounds, and the circuit board 202 moves relative to the support 203, so that the relative distance between the circuit board 202 and the support 203 is increased, the relative distance between the first electrode 2041 and the induction portion 20423 is increased, until the relative distance between the first electrode 2041 and the induction portion 20423 returns to the initial state, and the sensor stops generating the pressing signal.

[0042] In an example, the second electrode 2042 can be integrally formed by stamping a metal sheet, for example, a steel sheet can be stamped to form the second electrode 2042. The material of the second electrode 2042 can be stainless steel 304 or stainless steel 301 or other metal or metal alloy.

[0043] In the embodiment of the present application, the second electrode 2042 includes a deformation portion 20422, a connecting portion 20421 and an induction portion 20423. The connecting portion 20421 is electrically connected to the circuit board 202. The deformation portion 20422 connects the induction portion 20423 and the connecting portion 20421. The induction portion 20423 abuts against the support 203. When the pressing detection apparatus receives a pressing operation, the deformation portion 20422 is deformed, and the relative distance between the first electrode 2041 and the induction portion 20423 changes, thereby generating a pressing signal, and the pressing detection is realized. Because the deformation portion 20422 is provided, when the pressing detection apparatus receives a pressing operation, the deformation portion 20422 can be deformed to make the sensor generate a pressing signal. When the pressing is stopped, the deformation portion 20422 can rebound, so that the first electrode 2041 and the induction portion 20423 return to the initial state, the sensor stops generating the pressing signal, and the pressing detection is realized.

[0044] In a possible implementation, the distance between the first electrode 2041 and the induction portion 20423 in the direction perpendicular to the circuit board 202 ranges from 0.1 mm to 0.3 mm.

[0045] In the embodiment of the present application, the distance between the first electrode 2041 and the sensing portion 20423 is in the range of [0.1mm, 0.3mm], so that when the relative distance between the first electrode 2041 and the sensing portion 20423 changes, the signal amount of the pressing signal generated is relatively large, preventing the signal amount of the pressing signal from being too small due to the relatively small distance between the first electrode 2041 and the sensing portion 20423, so that the control unit cannot recognize the pressing operation, and the sensitivity of the pressing detection device in pressing detection is improved.

[0046] FIG. 5 is a schematic view of a circuit board according to an embodiment of the present application. As shown in FIG. 5, the circuit board 202 is provided with a circular ring-shaped electrical connection area 205, the electrical connection area 205 is electrically connected with the connecting portion 20421, and the center line of the electrical connection area 205 and the connecting portion 20421 is perpendicular to the circuit board 202.

[0047] The electrical connection area 205 on the circuit board 202 can be a circular ring-shaped electrical connection area 205. It should be understood that the electrical connection area 205 is electrically connected with the connecting portion 20421. Since the connecting portion 20421 is in the shape of a circular ring, the contact area of the circular ring-shaped electrical connection area 205 is larger than that of other shapes of electrical connection area 205, for example, a point-shaped electrical connection area 205, a rectangular electrical connection area with the same area as the circular ring-shaped electrical connection area 205, and the contact area of the circular ring-shaped electrical connection area 205 and the connecting portion 20421 is larger. It should also be understood that since the first electrode 2041 and the second electrode 2042 form a sealed cavity, the circular ring-shaped electrical connection area 205 on the circuit board 202 is the same shape as the connecting portion 20421, so that the sealing performance of the sealed cavity is better. For example, if a point-shaped electrical connection area 205 is used, the connecting portion 20421 is electrically connected by multiple points, and the sealing performance is poor. In addition, the area of the circular ring-shaped electrical connection area 205 is larger, so that the sensor can generate a pressing signal with a larger signal amount.

[0048] The center line of the circular ring-shaped electrical connection area 205 and the connecting portion 20421 is perpendicular to the circuit board 202. In an example, after the connecting portion 20421 is electrically connected with the electrical connection area 205 on the circuit board 202, the electrical connection area 205 is located inside the connecting portion 20421, that is, the inner circle and the outer circle of the electrical connection area 205 are located between the inner circle and the outer circle of the connecting portion 20421.

[0049] FIG. 6 is a schematic view of the electrical connection between the second electrode and the electrical connection area according to an embodiment of the present application. As shown in FIG. 6, the electrical connection area 205 is electrically connected with the connecting portion 20421 of the second electrode 2042, the connecting portion 20421 is connected with the sensing portion 20423 through the deformation portion 20422, and the sensing portion 20423 is oppositely arranged with the first electrode 2041.

[0050] In the embodiment of the present application, the circuit board 202 is provided with a circular ring-shaped electric connection area 205, so that the connecting part 20421 on the second electrode 2042 can be electrically connected with the circular ring-shaped electric connection area 205, which can improve the sealing performance of the sealed cavity between the first electrode 2041 and the second electrode 2042, prevent foreign matter or liquid from entering the sealed cavity between the first electrode 2041 and the second electrode 2042 through the gap between the connecting part 20421 and the electric connection area 205, and the circular ring-shaped electric connection area 205 and the circular ring-shaped connecting part 20421 have the same shape. Compared with the electric connection area 205 with the same area, the electric connection area 205 with the same shape as the connecting part 20421 can ensure that the contact area between the electric connection area 205 and the connecting part 20421 is larger, thereby improving the effect of electrical connection.

[0051] In a possible implementation, the connecting part 20421 is electrically connected with the electric connection area 205 through conductive glue, or the connecting part 20421 is electrically connected with the electric connection area 205 through soldering.

[0052] In the embodiment of the present application, the connecting part 20421 is electrically connected with the electric connection area 205 through conductive glue, or the connecting part 20421 is electrically connected with the electric connection area 205 through soldering, thereby realizing the electrical connection between the second electrode 2042 and the electric connection area 205. When the relative distance between the first electrode 2041 and the sensing part 20423 changes, the distance between the energized sensing part 20423 and the energized first electrode 2041 changes, the capacitance of the sensor changes to generate a pressing signal, and the generation of the pressing signal is realized.

[0053] In a possible implementation, when the connecting part 20421 is electrically connected with the electric connection area 205 through conductive glue, the difference between the outer radius and the inner radius of the electric connection area 205 is greater than or equal to 1 mm, and when the connecting part 20421 is electrically connected with the electric connection area 205 through soldering, the difference between the outer radius and the inner radius of the electric connection area 205 is greater than or equal to 0.5 mm.

[0054] Since the soldering electrical connection has high reliability, the width of the electric connection area 205 can be relatively narrow, and the width of the circular ring of the electric connection area 205 can be greater than or equal to 0.5 mm, that is, the difference between the outer radius and the inner radius is greater than or equal to 0.5 mm. It should be understood that the circular ring-shaped electric connection area 205 is a standard circular ring, that is, the inner circle and the outer circle share the same center.

[0055] Since the reliability of the electric connection of the conductive glue is lower than that of the tin soldering electric connection, specifically, the force required for the conductive glue to break away from the electric connection under the action of an external force is much smaller than that required for the tin soldering electric connection to break away from the electric connection, therefore, compared with the tin soldering electric connection, the conductive glue needs a wider electric connection area 205 to improve the reliability, and therefore the difference between the outer radius and the inner radius of the electric connection area 205 can be greater than or equal to 1 mm, that is, when the connecting part 20421 is electrically connected to the electric connection area 205 through the conductive glue, the difference between the outer radius and the inner radius of the electric connection area 205 is greater than or equal to 1 mm.

[0056] In the embodiment of the present application, when the connecting part 20421 is electrically connected to the electric connection area 205 through the conductive glue, the difference between the outer radius and the inner radius of the electric connection area 205 is greater than or equal to 1 mm, and when the connecting part 20421 is electrically connected to the electric connection area 205 through tin soldering, the difference between the outer radius and the inner radius of the electric connection area 205 is greater than or equal to 0.5 mm, which ensures the reliability of the electric connection between the connecting part 20421 and the electric connection area 205, prevents the connecting part 20421 from breaking away from the electric connection area 205 under the action of an external force, and improves the reliability of the pressing detection device.

[0057] In a possible implementation, the first electrode 2041 is in a circular sheet structure, and a center line connecting the first electrode 2041 and the electric connection area 205 is perpendicular to the circuit board 202.

[0058] In some other examples, the first electrode 2041 can be in a rectangular, triangular or other shape, and it should be understood that, since the electric connection area 205 is in a circular ring shape and the first electrode 2041 is to be arranged inside the inner circle of the electric connection area 205, the area of the circular sheet-shaped first electrode 2041 is greater than that of the first electrode 2041 in other shapes.

[0059] In the embodiment of the present application, the first electrode 2041 is in a circular sheet structure, and a center line connecting the first electrode 2041 and the electric connection area 205 is perpendicular to the circuit board 202, and compared with the first electrode 2041 in other shapes, the circular sheet-shaped first electrode 2041 has a larger area, and therefore, compared with the electrode in other shapes, the circular sheet-shaped first electrode 2041 can make the sensor generate a larger amount of pressing signals when pressing detection is performed, and improves the sensitivity of the pressing detection.

[0060] In a possible implementation, the area of the first electrode 2041 is greater than or equal to 20 square millimeters.

[0061] In the embodiment of the present application, the area of the first electrode 2041 is greater than or equal to 20 square millimeters, and compared with the first electrode 2041 with a smaller area, the first electrode 2041 can generate a larger amount of signals, and improves the sensitivity of the pressing detection.

[0062] In a possible implementation, a difference between the inner radius of the electrically connecting area 205 and the radius of the first electrode 2041 is greater than or equal to 0.5 mm.

[0063] The electrically connecting area 205 is a circular ring-shaped electrically connecting area 205, and a line connecting the center of the electrically connecting area 205 and the first electrode 2041 is perpendicular to the circuit board 202, so the outer circle, the inner circle of the electrically connecting area 205 and the first electrode 2041 share a common center. When the difference between the inner radius of the electrically connecting area 205 and the radius of the first electrode 2041 is greater than or equal to 0.5 mm, that is, the distance between the inner circle of the electrically connecting area 205 and the edge of the first electrode 2041 is greater than or equal to 0.5 mm, the deformed portion 20422 can prevent the first electrode 2041 and the second electrode 2042 from contacting after deformation, and can prevent the electrically connecting area 205 from being electrically connected with the first electrode 2041 when the electrically connecting area 205 is electrically connected with the connecting portion 20421, for example, the excess solder electrically connects the first electrode 2041 and the electrically connecting area 205 when soldering.

[0064] In the embodiment of the present application, the difference between the inner radius of the electrically connecting area 205 and the radius of the first electrode 2041 is greater than or equal to 0.5 mm, so that the deformed portion 20422 can prevent the first electrode 2041 and the second electrode 2042 from contacting after deformation, and can prevent the electrically connecting area 205 from being electrically connected with the first electrode 2041 when the electrically connecting area 205 is electrically connected with the connecting portion 20421, thereby ensuring the normal operation of the sensor.

[0065] In a possible implementation, the radius of the sensing portion 20423 is greater than or equal to the radius of the first electrode 2041, and the first electrode 2041 is located within the edge of the projection of the sensing portion 20423 in a direction perpendicular to the circuit board 202.

[0066] The radius of the sensing portion 20423 is greater than or equal to the radius of the first electrode 2041, that is, the area of the sensing portion 20423 is greater than or equal to the area of the first electrode 2041, and in a direction perpendicular to the circuit board 202, the projection of the first electrode 2041 on the circuit board 202 is located within the projection of the sensing portion 20423 on the circuit board 202, that is, the first electrode 2041 is covered by the second electrode 2042 in a direction perpendicular to the circuit board 202.

[0067] Optionally, the line connecting the center of the first electrode 2041 and the sensing portion 20423 is perpendicular to the circuit board 202, and the first electrode 2041 and the sensing portion 20423 have the same area.

[0068] In the embodiment of the present application, the radius of the inductive portion 20423 is greater than or equal to the radius of the first electrode 2041, and the first electrode 2041 is located within the edge of the projection of the inductive portion 20423 in the direction perpendicular to the circuit board 202, so that the entire area of the first electrode 2041 can participate in the pressing detection, a pressing signal with a large signal amount can be generated, and the sensitivity of the pressing detection is improved.

[0069] In a possible implementation, the first electrode 2041 is integrated into the lower surface of the circuit board 202, or the first electrode 2041 is arranged on the lower surface of the circuit board 202.

[0070] FIG. 7 is a schematic view of another pressing detection device provided by the embodiment of the present application. As shown in FIG. 7, the first electrode 2041 can be bonded or welded on the lower surface of the circuit board 202, and the first electrode 2041 and the second electrode 2042 are electrically connected with the circuit board 202. In another implementation, as shown in FIG. 2, the first electrode 2041 can be integrated into the lower surface of the circuit board 202.

[0071] It should be noted that, in the scheme in which the first electrode 2041 is integrated into the lower surface of the circuit board 202 as shown in FIG. 2, the first electrode can be a metal layer in the circuit board, for example, a copper plating process is performed on the circuit board 202 to form the first electrode 2041 at a position corresponding to the first electrode 2041 to be arranged, and in the scheme in which the first electrode 2041 is arranged on the lower surface of the circuit board 202 as shown in FIG. 7, the first electrode 2041 can be bonded or welded with a first electrical connection area on the circuit board 202 corresponding to the first electrode 2041, for example, through conductive glue bonding or through tin soldering electrical connection. In an example, the area of the first electrical connection area corresponding to the first electrode 2041 is less than or equal to the first electrode 2041, and after the first electrode 2041 is electrically connected with the first electrical connection area, the edge of the first electrical connection area is located within the edge of the first electrode 2041, so that the first electrode 2041 covers the first electrical connection area. It should be noted that the first electrical connection area corresponding to the first electrode 2041 can be located outside the inner edge of the circular electrical connection area 205 corresponding to the second electrode 2042. For example, the circular first electrical connection area can have the same center as the electrical connection area 205, and the radius is less than the inner radius of the electrical connection area 205, so that the first electrical connection area is arranged outside the inner edge of the electrical connection area 205. It should be understood that the first electrical connection area is not in communication with the electrical connection area 205, so that the first electrode 2041 and the second electrode 2042 can be prevented from being electrically connected.

[0072] In the embodiment of the present application, the first electrode 2041 is integrated on the lower surface of the circuit board 202, or the first electrode 2041 is adhered on the lower surface of the circuit board 202. When the first electrode 2041 is integrated on the lower surface of the circuit board 202, the overall thickness of the sensor can be reduced, thereby reducing the thickness of the press detection device. When the first electrode 2041 is adhered on the lower surface of the circuit board 202, the first electrode 2041 can be easily replaced when damaged, without the need for special treatment of the circuit board 202, and the cost is low.

[0073] In a possible implementation, the plurality of sensors are distributed close to the edge of the circuit board 202, and the distance between each of the plurality of sensors and the edge of the circuit board 202 is less than or equal to 5 mm.

[0074] As shown in FIG. 6, the plurality of sensors can be distributed on the edge of the circuit board 202. It should be understood that FIG. 6 is only an example, and the number of sensors can be set as required. Alternatively, at least four sensors can be provided and distributed at the four corners of the circuit board 202. When the number of sensors is greater than 4, the sensors can be uniformly distributed along the four edges of the circuit board 202.

[0075] It should be understood that when the press detection device receives a press operation, for example, when the cover plate 201 is pressed, the displacement of the edge of the circuit board 202 relative to the center of the circuit board 202 is larger. Therefore, the press sensors are distributed at the edge of the circuit board 202, and the distance between each of the plurality of sensors and the edge of the circuit board 202 is less than or equal to 5 mm, thereby making the press detection more sensitive.

[0076] In the embodiment of the present application, the plurality of sensors are distributed close to the edge of the circuit board 202, and the distance between each of the plurality of sensors and the edge of the circuit board 202 is less than or equal to 5 mm, thereby improving the sensitivity of the press detection device in press detection, and the user can press with a smaller force to detect the press signal, thereby improving the user experience.

[0077] In a possible implementation, the sensing portion 20423 abuts against the bracket 203 through the silica gel pad 402, the distance between the edge of the sensing portion 20423 and the edge of the silica gel pad 402 is greater than or equal to 0.25 mm, and in the direction perpendicular to the circuit board 202, the projection of the silica gel pad 402 on the circuit board 202 is located within the edge of the projection of the sensing portion 20423 on the circuit board 202.

[0078] As shown in FIG. 2 and FIG. 7, the induction portion 20423 is in abutment with the support 203 through the silica gel pad 402. In an example, both ends of the silica gel pad 402 can be coated with glue, such as double-sided tape or the like. One side of the silica gel pad 402 is bonded to the induction portion 20423, and the other side of the silica gel pad 402 is bonded to the support 203. The distance between the edge of the side of the silica gel pad 402 in contact with the induction portion 20423 and the edge of the induction portion 20423 is greater than or equal to 5 mm. In an example, the silica gel pad 402 can be a cylindrical silica gel pad 402. The upper surface of the silica gel pad 402 is in contact with the induction portion 20423. The line connecting the center of the upper surface of the silica gel pad 402 and the induction portion 20423 is perpendicular to the circuit board 202. The difference between the radius of the induction portion 20423 and the radius of the upper surface of the silica gel pad 402 is greater than or equal to 0.25 mm.

[0079] FIG. 8 is an exploded view of a press detection device according to an example of the present application. As shown in FIG. 8, the lower surface of the cover plate 201 is bonded to the upper surface of the circuit board 202 through the first adhesive layer 401. The upper surface of the cover plate 201 is opposite to the lower surface. The sensor includes a first electrode 2041 and a second electrode 2042. The first electrode 2041 and the second electrode 2042 are respectively connected to the lower surface of the circuit board 202. A sealed cavity is formed between the first electrode 2041 and the second electrode 2042. The induction portion 20423 in the second electrode 2042 is in abutment with the support 203 through the silica gel pad 402. It should be understood that FIG. 8 shows a scheme in which the second electrode 2042 is electrically connected to the circuit board 202 through the conductive glue 206. Alternatively, the second electrode 2042 can also be electrically connected to the circuit board 202 through soldering.

[0080] In the example of the present application, the induction portion 20423 is in abutment with the support 203 through the silica gel pad 402. Thus, when the press detection device receives a press operation, the relative distance between the circuit board 202 and the support 203 changes. The silica gel pad 402 is pressed against the induction portion 20423, so that the deformation portion 20422 is deformed. The relative distance between the induction portion 20423 of the first electrode 2041 and the second electrode 2042 changes, so that the generation of the press signal is realized. Since the distance between the edge of the induction portion 20423 and the edge of the silica gel pad 402 is greater than or equal to 0.25 mm, the force can be concentrated on the induction portion 20423. The deformation portion 20422 in the second electrode 2042 can be successfully deformed, so that the press detection device can normally perform press detection.

[0081] In a possible implementation, the thickness of the silica gel pad 402 ranges from 0.5 mm to 1.0 mm. The Shore hardness of the silica gel pad 402 is A.

[0082] In the embodiment of the present application, the thickness of the silica gel pad 402 is in the range of [0.5mm, 1.0mm], so that the overall thickness of the pressing detection device can be reduced while ensuring that the deformed portion 20422 of the second electrode 2042 can be deformed, and the Shore hardness of the silica gel pad 402 is A, which can ensure that when the distance between the circuit board 202 and the support 203 changes, the silica gel pad 402 can deform the deformed portion 20422 of the second electrode 2042 against the sensing portion 20423, so that the sensor generates a pressing signal, ensuring that the pressing detection device can normally perform pressing detection.

[0083] FIG. 9 is a schematic view of a sensing portion according to an embodiment of the present application. As shown in FIG. 9, the sensing portion 20423 of the second electrode 2042 includes a second through hole 20424, and the edge of the second through hole 20424 is located within the edge of the silica gel pad 402. The second through hole 20424 can balance the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board when the second electrode 2042 is electrically connected to the circuit board 202.

[0084] When the second electrode 2042 is electrically connected to the electrical connection area 205 on the circuit board 202, the excess air between the second electrode 2042 and the circuit board 202 can be discharged through the second through hole 20424, so that the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 is balanced. After the second electrode 2042 is electrically connected to the circuit board 202, the silica gel pad 402 abuts against the support 203, and the silica gel pad 402 covers the second through hole 20424 when abutting, that is, the edge of the second through hole 20424 is located within the edge of the surface of the silica gel pad 402 abutting against the second electrode 2042. The silica gel pad 402 blocks the side of the second through hole 20424 close to the silica gel pad 402, so that a sealed cavity is formed between the second electrode 2042 and the first electrode 2041.

[0085] In the embodiment of the present application, the sensing portion 20423 of the second electrode 2042 includes a second through hole 20424, the edge of the second through hole 20424 is located within the edge of the silica gel pad 402, so that when the second electrode 2042 is assembled on the circuit board 202, the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 is balanced through the second through hole 20424, preventing the air from causing a gap in the electrical connection between the second electrode 2042 and the circuit board 202, and when the sensing portion 20423 of the second electrode 2042 abuts against the support 203 through the silica gel pad 402, the silica gel pad 402 blocks the second through hole 20424, forming a sealed cavity between the second electrode 2042 and the first electrode 2041, preventing foreign matter or liquid from entering between the first electrode 2041 and the second electrode 2042, and improving the dustproof and waterproof capability of the press detection device, so that the press detection device can be used in various use scenarios, and has high applicability.

[0086] In a possible implementation, the diameter of the second through hole 20424 ranges from 0.6mm to 1.0mm.

[0087] In the embodiment of the present application, the diameter of the second through hole 20424 ranges from 0.6mm to 1.0mm, so that when the second electrode 2042 is electrically connected to the circuit board 202, the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 is balanced through the second through hole 20424, and the second through hole 20424 can be blocked by the silica gel pad 402, and because the diameter of the second through hole 20424 is small, the reliability of the second electrode 2042 is higher than that of the second through hole 20424 with a larger diameter, and the reliability of the press detection device is improved.

[0088] In a possible implementation, the surface of the first electrode 2041 is covered with an insulating layer.

[0089] In an example, the insulating layer covering the surface of the first electrode 2041 is insulating ink, specifically, after the surface of the circuit board 202 is coated with insulating ink, only a hole is made on the electrical connection area 205 without making a hole on the corresponding position of the first electrode 2041, so that the surface of the first electrode 2041 is covered with insulating ink. In some other examples, the insulating layer can be an insulating layer of other materials, and the specific type of the insulating layer is not limited herein.

[0090] In the embodiment of the present application, the surface of the first electrode 2041 is covered with an insulating layer, so that when the relative distance between the sensing portion 20423 of the second electrode 2042 and the first electrode 2041 changes, the first electrode 2041 and the second electrode 2042 can be prevented from contacting, so that the sensor can normally generate a press signal, and the reliability of the press detection device is improved.

[0091] In a possible implementation, the second electrode 2042 is made of metal, and the thickness of the second electrode 2042 ranges from 0.1 mm to 0.15 mm.

[0092] In an example, the second electrode 2042 can be made of stainless steel, for example, 304 stainless steel, 301 stainless steel, or the like.

[0093] In the embodiment, the second electrode 2042 is made of metal, so that the second electrode 2042 can be electrified after being electrically connected with the circuit board 202. When the relative distance between the electrified second electrode 2042 and the electrified first electrode 2041 changes, the capacitance of the sensor changes to generate a pressing signal. The thickness of the second electrode 2042 ranges from 0.1 mm to 0.15 mm, so that the strength of the second electrode 2042 can be improved while ensuring that the overall pressing detection device is thin, preventing the connection part 20421 of the second electrode 2042 from being broken due to deformation, and improving the reliability of the pressing detection device.

[0094] FIG. 10 is a schematic diagram of another circuit board according to an embodiment of the present application. As shown in FIG. 10, the circuit board 202 is provided with a first via hole 2021 penetrating the circuit board 202. The first electrode 2041 includes a third through hole 20411 opposite to the first via hole 2021 in the direction perpendicular to the circuit board 202. The first electrode 202 is electrically connected with the control unit 207 through the electric connection line accommodated in the first via hole 2021. The third through hole 20411 can balance the air pressure on both sides of the second electrode 2042 in the direction perpendicular to the circuit board 202 when the second electrode 2042 is connected with the circuit board 202.

[0095] As shown in FIG. 10, the electric connection area 205 on the circuit board 202 can accommodate the electric connection line of the control unit 207 through the second via hole 2022. The second electrode 2042 can be electrically connected with the control unit 207 through the electric connection line accommodated in the second via hole 2022 after being electrically connected with the electric connection area 205.

[0096] In the embodiment of the present application, the first via hole 2021 is arranged on the circuit board 202, so that the first electrode 2041 can be electrically connected with the control unit 207 through the first via hole 2021, realizing the electrical connection of the first electrode 2041. Since the third through hole 20411 is arranged on the first electrode 2041, the first via hole 2021 is opposite to the third through hole 204111, and the first via hole 2021 penetrates the circuit board 202, so that the air pressure on both sides of the second electrode 2042 can be balanced when the second electrode 2042 is electrically connected with the electrical connection area 205 on the circuit board 202. Compared with the scheme of arranging the second through hole 20424 on the sensing part 20423 of the second electrode 2042 in the foregoing embodiment, since the through hole is arranged on the first electrode 2041, no through hole is arranged on the second electrode 2042, so the strength of the second electrode 2042 is higher. Since the lower surface of the cover plate 201 is attached to the upper surface of the circuit board 202, the first electrode 2041 is arranged on the circuit board 202, and the second electrode 2042 abuts against the support 203 through the silica gel pad 402, and the possibility of relative movement between the silica gel pad 402 and the second electrode 2042 is much greater than the possibility of relative movement between the cover plate 201 and the circuit board 202, so compared with arranging the second through hole 20424 on the second electrode 2042, arranging the third through hole 20411 on the first electrode 2041 can form a more airtight cavity between the first electrode 2041 and the second electrode 2042, thereby improving the sealing performance of the pressing detection device.

[0097] In a possible implementation, the diameter of the third through hole 20411 ranges from 0.15 mm to 0.3 mm.

[0098] In the embodiment of the present application, the diameter of the third through hole 20411 ranges from 0.15 mm to 0.3 mm, so that the area of the first electrode 2041 can be ensured to be larger, and the signal strength of the pressing signal can be prevented from being weakened due to the smaller area of the first electrode 2041 caused by arranging a larger third through hole 20411.

[0099] In a possible implementation, the thickness of the support 203 is greater than or equal to 0.5 mm.

[0100] The support 203 can be a support 203 made of various materials, including but not limited to plastic, stainless steel, magnesium alloy, aluminum alloy, titanium alloy, etc. To ensure the strength of the support 203, the thickness of the support 203 is greater than or equal to 0.5 mm.

[0101] In the embodiments of the present application, the thickness of the support 203 is greater than or equal to 0.5 mm, so as to ensure the strength of the support 203, so that the support 203 can be fixed on the shell 301 of the electronic device, and the reliability of the pressing detection device is improved. When the pressing detection device receives a pressing operation, for example, when the cover plate 201 is pressed, the support 203 with high strength is less likely to change position compared with the support 203 with low strength, so as to ensure that the distance between the circuit board 202 and the support 203 changes when the pressing detection device receives a pressing operation, so as to generate a pressing signal, and the pressing detection device can normally perform pressing detection.

[0102] The embodiments of the present application also provide an electronic device, which comprises a shell 301 and a pressing detection device as in any of the above embodiments. The support 203 in the pressing detection device is fixed on the shell 301.

[0103] In an example, the support 203 can be clamped or thermally adhered to the shell 301 of the electronic device. In another example, the support 203 can be fixed on the shell 301 of the electronic device by a bolt, which is not limited herein.

[0104] In a possible implementation, the electronic device comprises a notebook computer, and the support 203 in the pressing detection device is fixed on the C shell of the notebook computer.

[0105] FIG. 11 is a cross-sectional view of an electronic device according to an embodiment of the present application. As shown in FIG. 11, the support 203 in the pressing detection device is fixed on the C shell of the notebook computer by a bolt.

[0106] In the embodiments of the present application, the support 203 in the pressing detection device can be fixed on the C shell of the notebook computer, so as to fix the support 203 on the shell 301 of the electronic device. Thus, when the pressing detection device receives a pressing operation, for example, when the circuit board 201 is pressed, the second electrode 2042 on the support 203 can be deformed, so as to make the sensor 204 generate a pressing signal, and the detection of the pressing operation is realized.

[0107] It should be understood that each embodiment in the specification is described in a progressive manner, and the same or similar parts between each embodiment can be referred to each other, and each embodiment mainly describes the difference from other embodiments. Especially, for the method embodiments, since the method is basically similar to the method described in the device and system embodiments, the description is relatively simple, and the relevant parts can be referred to the description of other embodiments.

[0108] It is to be understood that the foregoing description is descriptive only, certain embodiments having been described in particularity. Other embodiments are within the scope of the claims. In some cases the acts or steps recited in the claims can be performed in a different order and still accomplish the desired results. Additionally, the processes depicted in the figures do not necessarily require the particular order shown, or sequential order to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous or necessary.

[0109] It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. It is further understood that the terms "comprising," "including," "containing," and "having" and the like, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. It is further understood that the terms "first," "second," "third," etc. are used herein merely for distinguishing between similar elements and are not necessarily used consistently in all contexts.

[0110] It is to be understood that the terms and expressions used herein are used as terms of description and not of limitation. There is no intention, therefore, of using the terms or expressions to exclude any equivalents of the features shown and described (or portions thereof). It is recognized that various modifications are possible within the scope of the claims and it is further understood that such modifications are intended to be within the scope of the claims. Other modifications, variations, and alternatives are also possible. Accordingly, the claims should be regarded as encompassing all such equivalents.

Claims

1. A pressure detection device, applied to electronic devices, characterized in that, include: Circuit board, bracket, and multiple sensors; The sensor includes a first electrode and a second electrode, which are respectively connected to the lower surface of the circuit board, and a sealed cavity is formed between the first electrode and the second electrode. The bracket is fixed to the housing of the electronic device, and the bracket abuts against the second electrode; When the pressure detection device receives a pressure operation, the second electrode deforms, and the distance between the first electrode and the second electrode changes, causing the sensor to generate a pressure signal. The circuit board is used to transmit the pressing signal to the control unit, and to enable the control unit to identify the pressing operation based on the pressing signal.

2. The pressure detection device according to claim 1, characterized in that, The device further includes: a cover plate; The upper surface of the cover plate provides a pressing surface, the lower surface of the cover plate is attached to the upper surface of the circuit board, the upper and lower surfaces of the cover plate are opposite to each other, and the upper and lower surfaces of the circuit board are opposite to each other. When the cover is pressed, the pressing detection device receives the pressing operation.

3. The pressure detection device according to claim 1, characterized in that, The second electrode includes an integrally formed sensing part, a deformation part, and a connecting part; The sensing part is a circular plate structure, and the connecting part is a circular ring structure. The radius of the sensing part is smaller than the inner circle radius of the connecting part. The sensing part and the connecting part are connected through the deformation part. The sensing part and the connecting part are on different planes, and the center line connecting the sensing part and the connecting part is perpendicular to the circuit board. The connecting part is electrically connected to the lower surface of the circuit board, and the sensing part is disposed opposite to the first electrode in a direction perpendicular to the circuit board; When the pressure detection device receives a pressure operation, the deformation part deforms, the sensing part moves towards the first electrode, and the change in distance between the first electrode and the sensing part causes the sensor to generate the pressure signal.

4. The pressure detection device according to claim 3, characterized in that, In the direction perpendicular to the circuit board, the distance between the first electrode and the sensing part ranges from [0.1mm, 0.3mm].

5. The pressure detection device according to claim 3, characterized in that, The circuit board has an annular electrical connection area, which is electrically connected to the connection part, and the center line connecting the electrical connection area and the connection part is perpendicular to the circuit board.

6. The pressure detection device according to claim 5, characterized in that, The connecting part is electrically connected to the electrical connection area by conductive adhesive, or the connecting part is electrically connected to the electrical connection area by soldering.

7. The pressure detection device according to claim 6, characterized in that, When the connecting part is electrically connected to the electrical connection area through conductive adhesive, the difference between the outer radius and the inner radius of the electrical connection area is greater than or equal to 1 mm. When the connecting part is electrically connected to the electrical connection area through soldering, the difference between the outer radius and the inner radius of the electrical connection area is greater than or equal to 0.5 mm.

8. The pressure detection device according to claim 5, characterized in that, The first electrode has a circular plate structure, and the line connecting the center of the first electrode and the electrical connection area is perpendicular to the circuit board.

9. The pressure detection device according to claim 8, characterized in that, The area of ​​the first electrode is greater than or equal to 20 square millimeters.

10. The pressure detection device according to claim 8, characterized in that, The difference between the inner radius of the electrical connection area and the radius of the first electrode is greater than or equal to 0.5 mm.

11. The pressure detection device according to claim 8, characterized in that, The radius of the sensing element is greater than or equal to the radius of the first electrode, and the first electrode is located within the edge of the projection of the sensing element in a direction perpendicular to the circuit board.

12. The pressure detection device according to claim 1, characterized in that, The first electrode is integrated into the lower surface of the circuit board, or the first electrode is disposed on the lower surface of the circuit board.

13. The pressure detection device according to claim 1, characterized in that, The plurality of sensors are distributed close to the edge of the circuit board, and the distance between the plurality of sensors and the edge of the circuit board is less than or equal to 5 mm.

14. The pressure detection device according to claim 3, characterized in that, The sensing element abuts against the bracket via a silicone pad. The distance between the edge of the sensing element and the edge of the silicone pad is greater than or equal to 0.5 mm. In a direction perpendicular to the circuit board, the projection of the silicone pad onto the circuit board is located within the edge of the projection of the sensing element onto the circuit board.

15. The pressure detection device according to claim 14, characterized in that, The thickness of the silicone pad is in the range of [0.5mm, 1.0mm], and the Shore hardness of the silicone pad is A.

16. The pressure detection device according to claim 14, characterized in that, The sensing part includes a second through hole, and the edge of the second through hole is located inside the edge of the silicone pad; The second through hole is used to balance the air pressure on both sides of the second electrode in a direction perpendicular to the circuit board when the second electrode is electrically connected to the circuit board.

17. The pressure detection device according to claim 16, characterized in that, The diameter of the second through hole ranges from [0.6 mm to 1.0 mm].

18. The pressure detection device according to claim 1, characterized in that, The surface of the first electrode is covered with an insulating layer.

19. The pressure detection device according to claim 1, characterized in that, The second electrode is made of metal and has a thickness ranging from 0.1 mm to 0.15 mm.

20. The pressure detection device according to claim 1, characterized in that, The circuit board is provided with a through hole that penetrates the circuit board, and the first electrode includes a third through hole, which is opposite to the through hole in a direction perpendicular to the circuit board; The first electrode is electrically connected to the control unit through an electrical connection wire housed in the via; The third through hole is used to balance the air pressure on both sides of the second electrode in a direction perpendicular to the circuit board when the second electrode is connected to the circuit board.

21. The pressure detection device according to claim 20, characterized in that, The diameter of the third through hole ranges from [0.15mm to 0.3mm].

22. The pressure detection device according to any one of claims 1-21, characterized in that, The thickness of the bracket is greater than or equal to 0.5 mm.

23. An electronic device, characterized in that, Includes a housing and a pressure detection device as described in any one of claims 1-22; The bracket in the pressure detection device is fixed to the outer shell.

24. The device according to claim 23, characterized in that, The electronic device includes: a laptop computer; The bracket in the pressure detection device is fixed to the C-shell of the laptop computer.

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