Host backplane, valve control apparatus, and valve control system

Abstract

The present application relates to the technical field of power distribution control, and provides a host backplane (10), a valve control apparatus, and a valve control system. The host backplane (10) separates slot positions of a mainboard slot (110), CPU board slots (120A, 120B), and power supply board slots (160A, 160B), which generate more heat, by means of the slot positions of other slots, and also arranges the slot positions of the power supply board slots (160A, 160B) at edges of the backplane (10), facilitating faster heat dissipation and improving the heat dissipation efficiency of the mainboard slot (110), the CPU board slots (120A, 120B), and the power supply board slots (160A, 160B), such that the inserted CPU communication boards, mainboard, and power supply boards can all operate at a higher power, thereby ameliorating the problems of power decreases caused by poor heat dissipation, and reduced computing power and communication reliability.

Description

Host backboard, valve control device and valve control system

[0001] This application claims priority to the Chinese patent application No. 202421522443.2, filed on June 28, 2024, and entitled "Host backboard, valve control device and valve control system", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application belongs to the technical field of power distribution control, and particularly relates to a host backboard, a valve control device and a valve control system. BACKGROUND

[0003] The high-voltage direct-hanging energy storage valve control device is an important hub between the direct-current control protection and the energy storage valve sub-module. More and more data need to be processed, which has higher requirements for the computing power and bandwidth of the chip, and the power consumption of the device will inevitably increase. However, the current valve control device has low heat dissipation efficiency, which leads to insufficient computing power and affects communication reliability. Therefore, how to improve the heat dissipation effect and guarantee the communication reliability is a problem that needs to be solved urgently.

[0004] CONTENT OF THE APPLICATION

[0005] In view of the above problems, the present application provides a host backboard, a valve control device and a valve control system, which aims to solve the problem of low heat dissipation efficiency of the valve control device, which leads to insufficient computing power and affects communication reliability.

[0006] In a first aspect, the embodiments of the present application provide a host backboard, comprising a circuit bottom plate, wherein the circuit bottom plate is provided with a mainboard slot, two CPU board slots, a plurality of interface board slots, an incoming board slot, an outgoing board slot and two power board slots:

[0007] The two CPU board slots are adjacently arranged on opposite sides of the mainboard slot, and the mainboard slot and the two CPU board slots are arranged between the two power board slots; the plurality of interface board slots, the incoming board slot and the outgoing board slot are arranged between the two CPU board slots and the two power board slots.

[0008] In the technical scheme of the embodiments of the present application, the slot positions of the mainboard slot, the CPU board slot and the power board slot with large heat generation are separated by the slot positions of other slots, and the slot positions of the power board slots are arranged at the edges of the backboard, which are all conducive to accelerating heat dissipation and improving the heat dissipation efficiency of the mainboard slot, the CPU board slot and the power board slot. The CPU communication board, the mainboard and the power board inserted can work at a higher power, thereby improving the problem of power reduction, reduced computing power and communication reliability caused by poor heat dissipation.

[0009] In some embodiments, the plurality of interface board slots are located on one side of one of the CPU board slots away from the mainboard slot; the access-in board slot is located on the side of the other CPU board slot away from the mainboard slot; and the access-out board slot is located adjacent to the access-in board slot.

[0010] In the technical scheme of the embodiments of the present application, the plurality of interface board slots and the access-in board slot are respectively arranged on the two sides of the two CPU board slots away from the mainboard slot, which facilitates the arrangement and management of the interface boards inserted into the interface board slots, and facilitates the arrangement and management of the access-in board and the access-out board.

[0011] In some embodiments, the connectors on the two CPU board slots and the connector on the same interface board slot are connected by signal transmission lines of equal length and signal receiving lines of equal length.

[0012] In the technical scheme of the embodiments of the present application, by setting the signal transmission / receiving lines between the connectors of different CPU boards and the connector of the same interface board to be equal in length, the communication between different CPU boards and the same interface board can be received / sent as synchronously as possible, the timing is kept consistent, the requirement of synchronous communication is met as much as possible, and higher speed communication is achieved. In some embodiments, the different CPU board connectors and the same interface board connector both have signal transmission / receiving lines, which can still maintain effective communication when a single signal transmission / receiving line fails, thereby improving the reliability of the system.

[0013] In some embodiments, the two CPU board slots and the mainboard slot are each provided with a connector and an optical communication module, and the optical communication modules and the connectors are arranged in intervals.

[0014] In the technical scheme of the embodiments of the present application, the optical communication modules and the connectors are arranged in intervals, which is conducive to heat dissipation of the optical communication modules and improves the communication efficiency.

[0015] In some embodiments, a power supply line is further included, and the two power supply board slots are respectively electrically connected to the mainboard slot, the two CPU board slots, the plurality of interface board slots, the access-in board slot, and the access-out board slot through corresponding power supply lines.

[0016] In the technical scheme of the embodiments of the present application, the two power supply boards can respectively supply power to the devices inserted into the backboard, and when single power supply is used, the two power supply boards can back up each other, thereby improving the reliability of power supply; when double power supply is used, the power of the devices can be improved, thereby improving the computing power and communication reliability.

[0017] In some embodiments, the slot width of the CPU board slot and the slot width of the mainboard slot are greater than the slot width of the interface board slot.

[0018] In the technical solution of the embodiment of the application, the slot width of the CPU board slot with a large heat dissipation amount and the slot width of the mainboard slot are set to be greater than the slot width of other slots on the backboard with a limited area, the heat dissipation efficiency of the slot of the CPU board slot and the slot of the mainboard slot is increased, the CPU communication board and the mainboard plugged in can work at a higher power, and the computing power and communication reliability are improved.

[0019] In some embodiments, the slot width of the power board slot is greater than the slot width of the interface board slot.

[0020] In the technical solution of the embodiment of the application, the slot width of the power board slot with a large heat dissipation amount is set to be greater than the slot width of other slots on the backboard with a limited area, the heat dissipation efficiency of the slot of the power board slot is increased, and the problem of power supply power reduction caused by poor heat dissipation is improved.

[0021] In some embodiments, the slot width of the power board slot is less than the slot width of the CPU board slot.

[0022] In the technical solution of the embodiment of the application, on the backboard with a limited area, and on the premise that the power board slot is arranged at the edge of the backboard, in order to improve the heat dissipation efficiency of the other slots plugged in, the slot width of the power board slot can be appropriately set to be less than the slot width of the CPU board slot, which is beneficial to the heat dissipation of the slot of the CPU board slot and other slots.

[0023] In some embodiments, the slot width of the CPU board slot is consistent with the slot width of the mainboard slot; the slot width of the inlet board slot and the slot width of the outlet board slot are consistent with the slot width of the interface board slot.

[0024] In the technical solution of the embodiment of the application, the slot width of slots with similar heat dissipation amounts is also set to be similar, which is beneficial to the layout of the backboard and the case, and is also beneficial to balanced heat dissipation, and is also beneficial to arranging the communication wires of the same type of slot and other slots to be equal in length, and is beneficial to synchronous communication.

[0025] In some embodiments, the two CPU board slots and the mainboard slot each include a bus interface.

[0026] In the technical solution of the embodiment of the application, an implementation manner of a high-speed communication interface is provided.

[0027] In some embodiments, the mainboard slot, the plurality of interface board slots, the inlet board slot and the outlet board slot each include a low-voltage differential signal interface.

[0028] In the technical solution of the embodiment of the application, an implementation manner of a high-speed communication interface is provided.

[0029] In a second aspect, the embodiment of the present application provides a valve control device, which comprises the host backboard, a mainboard, two CPU communication boards, a plurality of interface boards, an input board, an output board and two power supply boards, the mainboard is plugged into the mainboard slot of the host backboard, the two CPU communication boards are plugged into the two CPU board slots of the host backboard respectively, the plurality of interface boards are plugged into the plurality of interface board slots of the host backboard respectively, the input board is plugged into the input board slot of the host backboard, the output board is plugged into the output board slot of the host backboard, and the two power supply boards are plugged into the two power supply board slots of the host backboard respectively.

[0030] In the technical scheme of the embodiment of the present application, the valve control device uses other boards to be plugged into the host backboard, so that higher heat dissipation efficiency can be obtained, and higher computing power and reliable communication performance can be obtained when high power operation is required.

[0031] In some embodiments, the mainboard and the two CPU communication boards are in serial bus communication through a first bus and a second bus respectively.

[0032] In the technical scheme of the embodiment of the present application, an implementation of a high-speed communication interface is provided.

[0033] In some embodiments, the mainboard, the input board and the output board are connected through a first low-voltage differential signal line, a second low-voltage differential signal line and a plurality of third low-voltage differential signal lines.

[0034] The mainboard and the input board are connected through the first low-voltage differential signal line.

[0035] The mainboard and the output board are connected through the second low-voltage differential signal line.

[0036] The mainboard and the plurality of interface boards are connected one by one through the plurality of third low-voltage differential signal lines.

[0037] In the technical scheme of the embodiment of the present application, an implementation of a high-speed communication interface is provided.

[0038] In a third aspect, the embodiment of the present application provides a valve control system, which comprises the valve control device and a plurality of expansion devices, each of the expansion devices is in communication connection with the two CPU communication boards of the valve control device.

[0039] In the technical scheme of the embodiment of the present application, the valve control device with high power, computing power and communication capability is used, and a plurality of expansion devices can be expanded to realize cross-communication data redundancy and improve the reliability of the valve control system.

[0040] In some embodiments, the valve control system further comprises a centralized control device, and the centralized control device is in communication connection with the mainboard of the valve control device.

[0041] The technical scheme of the embodiment of the present application sets the centralized control device, which can facilitate centralized control of the valve control system and improve work efficiency.

[0042] In some embodiments, a switch driving board is further included, which is connected with the input board and the output board of the valve control device.

[0043] The technical scheme of the embodiment of the present application sets the switch driving board, which can facilitate switch control of the valve control system and improve work efficiency.

[0044] In some embodiments, a collection board is further included, which is connected with one of the interface boards of the valve control device, and is used for collecting current and / or voltage.

[0045] The technical scheme of the embodiment of the present application sets the collection board, which can facilitate centralized collection and management of current and / or voltage parameters of the valve control system and improve work efficiency.

[0046] The above description is only a summary of the technical scheme of the present application, in order to make the technical means of the present application more clearly understood, and can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0047] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Moreover, the same reference numerals in the attached drawings refer to the same or like components throughout the several drawings. In the drawings:

[0048] FIG. 1 shows a structural schematic diagram of a host backboard provided by an embodiment of the present application;

[0049] FIG. 2 shows a structural schematic diagram of a valve control device provided by an embodiment of the present application;

[0050] FIG. 3 shows a structural schematic diagram of a valve control system provided by an embodiment of the present application. DETAILED DESCRIPTION

[0051] The embodiments of the technical scheme of the present application will be described in detail below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical scheme of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application; the use of the terms "including," "comprising," or "having" and variations thereof herein is intended to be broad and encompass the terms "consisting of" and "consisting essentially of" and variations thereof. Unless otherwise required by context, singular terms shall include pluralities and vice versa. Unless otherwise required by context, the use herein of the singular is also to be construed as a use of the plural and vice versa.

[0053] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise explicitly and specifically limited.

[0054] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily independent or alternative embodiments to each other. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0055] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0056] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two), and similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0057] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanical connection, or it can be electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0058] The high-voltage direct-hanging energy storage valve control device (hereinafter referred to as the valve control device) is an important hub between the direct-current control protection and the energy storage valve sub-module. More and more data need to be processed, and the chip has higher requirements for computing power and bandwidth. Consequently, the power consumption of the device will inevitably increase, which requires reliable power supply of the high-power power board. How to improve the heat dissipation effect and guarantee the communication reliability is a problem that needs to be solved in the prior art.

[0059] In view of the deficiencies of the prior art, a host backplane with improved heat dissipation efficiency is provided.

[0060] According to some embodiments of the present application, referring to FIG. 1, FIG. 1 shows a structural schematic diagram of a host backplane provided by an embodiment of the present application. For ease of illustration, only parts related to the present embodiment are shown, and the details are as follows:

[0061] The host backplane 10 comprises a circuit base plate 100, wherein the circuit base plate 100 is provided with a mainboard slot 110, two central processing unit (CPU) board slots 120A and 120B, a plurality of interface (i.e. I / O port) board slots 130a-130b, an input board slot 140, an output board slot 150, and two power board slots 160A and 160B.

[0062] The two CPU board slots 120A and 120B are adjacently arranged on opposite sides of the mainboard slot 110; the mainboard slot 110 and the two CPU board slots 120A and 120B are arranged between the two power board slots 160A and 160B; the plurality of interface board slots 130a-130b, the input board slot 140, and the output board slot 150 are arranged between the two CPU board slots 120A and 120B and the two power board slots 160A and 160B.

[0063] The two CPU board slots 120A and 120B are adjacently arranged on opposite sides of the mainboard slot 110; the mainboard slot 110 and the two CPU board slots 120A and 120B are arranged between the two power board slots 160A and 160B; the plurality of interface board slots 130a-130b, the input board slot 140, and the output board slot 150 are arranged between the two CPU board slots 120A and 120B and the two power board slots 160A and 160B.

[0064] The CPU boards inserted into the two CPU board slots 120A and 120B can also be referred to as CPU control boards or CPU communication boards, and the slots can also be referred to as interface faceplates or connector faceplates. In the example shown in FIG. 1, the plurality of interface board slots 130a-130d include an interface board slot 130a, an interface board slot 130b, an interface board slot 130c, and an interface board slot 130d.

[0065] In the embodiment, at least one of the interface board slots 130a, 130b, 130c, 130d, the incoming board slot 140, and the outgoing board slot 150 is arranged between the CPU board slot 120A and the power supply board slot 160A, and the order is not limited, or at least one is arranged between the CPU board slot 120B and the power supply board slot 160B, and the order is not limited.

[0066] In the technical solution of the embodiment of the application, the slot positions of the main board slot 110, the CPU board slots 120A and 120B, and the power supply board slots 160A and 160B are separated by the slot positions of other slots, and the slot positions of the power supply board slots 160A and 160B are arranged at the edges of the backboard 10, which are all conducive to accelerating heat dissipation and improving the heat dissipation efficiency of the main board slot 110, the CPU board slots 120A and 120B, and the power supply board slots 160A and 160B, so that the plugged-in CPU communication board, main board, and power supply board can work at a higher power, thereby improving the problem of power reduction and reducing the computing power and communication reliability caused by poor heat dissipation.

[0067] In some embodiments, the plurality of interface board slots 130a-130d are located on the side of one of the CPU board slots 120A away from the main board slot 110. The incoming board slot 140 is located on the side of the other CPU board slot 120B away from the main board slot 110; the incoming board slot 140 is arranged adjacent to the outgoing board slot 150.

[0068] In the technical solution of the embodiment of the application, the plurality of interface board slots 130a-130d and the incoming board slot 140 and the outgoing board slot 150 are arranged on the two sides of the two CPU board slots 120A and 120B away from the main board slot 110, which facilitates the arrangement and management of the interface boards plugged into the interface board slots 130a-130d, and also facilitates the arrangement and management of the incoming board and the outgoing board.

[0069] In some embodiments, the connectors 121 and 122 on the two CPU board slots 120A and 120B are connected to the connectors 131 on the same interface board (for example, 130d) slot via equal-length signal transmission lines and equal-length signal reception lines.

[0070] For example, the equal-length signal transmission lines and the equal-length signal reception lines are copper cladding arranged on the circuit bottom plate 100 or a flat cable connected to the circuit bottom plate 100.

[0071] In the technical solution of the embodiment of the application, the signal receiving and transmitting lines of the connectors of different CPU boards and the connector of the same interface board are set to be equal in length, so that the communication between different CPU boards and the same interface board can be received / sent as synchronously as possible, the timing is consistent, the requirement of synchronous communication is met as much as possible, and higher speed communication is met. In some embodiments, the different CPU board connectors and the same interface board connector all have signal receiving and transmitting lines, so that effective communication can still be maintained when a single signal receiving and transmitting line fails, and the reliability of the system is improved.

[0072] In some embodiments, the two CPU board slots 120A, 120B are provided with connectors 121, 122 and optical communication modules 123, 124, the mainboard slot 110 is provided with a connector 111 and an optical communication module 112, and the optical communication modules 123, 124, 112 and the connectors 121, 122, 111 are arranged at intervals. This is conducive to heat dissipation of the optical communication modules 123, 124, 112 and improves communication efficiency.

[0073] In some embodiments, the host backboard 10 further includes power supply lines, and the two power supply board slots 160A, 160B are respectively electrically connected to the mainboard slot 110, the two CPU board slots 120A, 120B, the plurality of interface board slots 130a-130d, the input board slot 140 and the output board slot 150 through corresponding power supply lines.

[0074] Among them, the power supply lines are divided into two groups, respectively corresponding to the two power supply board slots 160A, 160B, for respectively outputting the power supply output by the two power supply board slots 160A, 160B to each slot. Alternatively, the power supply lines include power supply bus lines electrically connected to each slot, and the two power supply board slots 160A, 160B respectively output power supply to the power supply bus lines to supply power to each slot. The power supply lines are, for example, copper traces on the circuit board 100.

[0075] In the technical solution of the embodiment of the application, the two power supply board slots 160A, 160B can respectively supply power to the board cards plugged into the host backboard 10. When single power supply is used, the two power supply boards can back up each other, improving the reliability of power supply; when double power supply is used, the power of the device can be improved, thereby improving the computing power and communication reliability.

[0076] In some embodiments, the slot width L1 of the CPU board slot 120A, the slot width L1 of the CPU board slot 120B, and the slot width L2 of the mainboard slot 110 are greater than the slot width L4 of the interface board slots 130a-130d. The slot width can be understood as the width of the shell or edge of the interface or connector.

[0077] The slot width L1 of the two CPU board slots 120A and the slot width L1 of the CPU board slot 120B are similar or consistent, and the slot width L4 of the interface board slots 130a-130d is similar or consistent.

[0078] In the technical solution of the embodiment of the application, the slot width L1 of the CPU board slots 120A and 120B with a large heat dissipation amount and the slot width L2 of the main board slot 110 are set to be greater than the slot widths of other slots on the host backboard 10 with a limited area, so as to increase the heat dissipation efficiency of the slots of the CPU board slots 120A and 120B and the main board slot 110, and make the plugged CPU communication board and main board work at a higher power, thereby improving the computing power and communication reliability.

[0079] In some embodiments, the slot width L4 of the power board slots 160A and 160B is greater than the slot width L3 of each interface board slot 130a-130d.

[0080] The slot width L4 of the two power board slots 160A and 160B is similar or consistent.

[0081] In the technical solution of the embodiment of the application, the slot width of the power board slots 160A and 160B with a large heat dissipation amount is set to be greater than the slot widths of other slots on the host backboard 10 with a limited area, so as to increase the heat dissipation efficiency of the slots of the power board slots 160A and 160B, and improve the problem of power supply power reduction caused by poor heat dissipation.

[0082] In some embodiments, the slot width L4 of the power board slots 160A and 160B is less than the slot width L1 of the CPU board slots 120A and 120B.

[0083] In the technical solution of the embodiment of the application, on the backboard with a limited area, and on the premise that the power board slots 160A and 160B are arranged at the edge of the backboard, in order to improve the heat dissipation efficiency of the devices plugged into other slots, the slot width L4 of the power board slots 160A and 160B can be appropriately set to be less than the slot width L1 of the CPU board slots 120A and 120B, which is beneficial to the heat dissipation of the slots of the CPU board slots 120A and 120B and other slots.

[0084] In some embodiments, the slot width L1 of the CPU board slots 120A and 120B is consistent with the slot width L2 of the main board slot 110; the slot width L5 of the inlet board slot 140 and the slot width L6 of the outlet board slot 150 are consistent with the slot width L3 of the interface board slots 130a-130d.

[0085] The slot width of the slot positions with similar heat generation is also set to be similar in the technical solution of the embodiment of the application, which is beneficial to the layout of the backboard and the case, and is also beneficial to balanced heat dissipation, and is also beneficial to arranging the communication wires of the same type of slot and other slots to be equal in length, and is beneficial to synchronous communication.

[0086] In some embodiments, the two CPU board slots 120A, 120B and the mainboard slot 110 each include a bus interface. The bus interface is, for example, a Gigabit Transceiver (GT) interface, which can achieve a data transmission rate of 2Gbps.

[0087] In some embodiments, the mainboard slot 110, the plurality of interface board slots 130a-130d, the input board slot 140, and the output board slot 150 each include a Low-Voltage Differential Signaling (LVDS) interface, which can achieve a data transmission rate of 100Mbps-500Mbps, and has low power consumption and low error rate.

[0088] In one example, the host backboard 10 includes eleven slot positions, from left to right: the power board slot 160A (8TE), the interface board slot 130a (5TE), the interface board slot 130b (5TE), the interface board slot 130c (5TE), the interface board slot 130d (12TE), the CPU board slot 120A (12TE), the mainboard slot 110 (12TE), the CPU board slot 120B (12TE), the input board slot 140 (5TE), the output board slot 150 (5TE), and the power board slot 160B (8TE), where 1TE is 5.08mm. In this way, by optimizing the slot position and the small panel width of the plug-in of the host backboard 10, the overall heat dissipation effect of the CPU board and the valve control device is improved.

[0089] According to some embodiments of the application, referring to FIG. 2, FIG. 2 shows a structural schematic diagram of a valve control device provided by an embodiment of the application. For ease of illustration, only parts related to the embodiment are shown, and are described in detail as follows:

[0090] The valve control device includes the main machine backboard 10 as above, and a main board 210, two CPU communication boards 210A and 210B, a plurality of interface boards 230a-230d, an incoming board 240, an outgoing board 250, and two power supply boards 260A and 260B. The main board 210 is plugged into the main board slot 110 of the main machine backboard 10. The two CPU communication boards 210A and 210B are plugged into the two CPU board slots 120A and 120B of the main machine backboard 10, respectively. The plurality of interface boards 230a-230d are plugged into the plurality of interface board slots 130a-130d of the main machine backboard 10, respectively. The incoming board 240 is plugged into the incoming board slot 140 of the main machine backboard 10. The outgoing board 250 is plugged into the outgoing board slot 150 of the main machine backboard 10. The two power supply boards 260A and 260B are plugged into the two power supply board slots 160A and 160B of the main machine backboard 10, respectively.

[0091] The incoming board 240 collects the on and off states of the circuit breaker switches of the energy storage valve sub-modules. The outgoing board 250 is used to control the opening and closing of the circuit breakers. The two power supply boards 260A and 260B are used to supply power to the valve control device, and can realize online replacement in the case of any failure of the two power supply boards 260A and 260B and the two CPU communication boards 210A and 210B.

[0092] In the technical scheme of the embodiments of the present application, the valve control device uses other board cards plugged into the above-mentioned main machine backboard 10, which can achieve higher heat dissipation efficiency, higher computing power, and reliable communication performance when high power operation is required.

[0093] In some embodiments, the valve control device further includes a first bus and a second bus. The main board 210 and the two CPU communication boards 210A and 210B communicate through the first bus and the second bus, respectively, to realize cross communication control redundancy. The first bus and the second bus are, for example, Gigabit Transceivers (GTs), which can achieve a data transmission rate of 2 Gbps.

[0094] In some embodiments, the valve control device further includes a first Low-Voltage Differential Signaling (LVDS) line, a second LVDS line, and a plurality of third LVDS lines. The main board 210 is connected to the incoming board 240 through the first LVDS line. The main board 210 is connected to the outgoing board 250 through the second LVDS line.

[0095] The main board 210 and the plurality of interface boards 230a-230d are connected one-to-one through the plurality of third LVDS lines, respectively, which can achieve a data transmission rate of 100 Mbps-500 Mbps, low power consumption, and low error rate.

[0096] In one example, the valve control device is improved as described above, and the valve control device can work at 80W-120W; the power of the CPU communication boards 210A, 210B is 20W-30W.

[0097] The maximum temperature of the CPU communication boards 210A, 210B under normal temperature (for example, 25℃) is 75℃, which meets the authentication and test requirements. Before the improvement, the working temperature of the CPU communication boards 210A, 210B is 105℃ under high temperature (for example, 55℃) aging test; after the improvement, the working temperature of the CPU communication boards 210A, 210B can be reduced to below 100℃ junction temperature, which meets the authentication and test requirements.

[0098] According to some embodiments of the present application, referring to FIG. 3, FIG. 3 shows a structural schematic diagram of a valve control system provided by an embodiment of the present application. For ease of illustration, only parts related to the present embodiment are shown, and the details are as follows:

[0099] The valve control system includes the valve control device as above and a plurality of extension devices 310, each of which is in communication connection with the two CPU communication boards 210A, 210B of the valve control device.

[0100] For example, the extension device 310 includes a CPU board-A and a CPU board-B. In the example of FIG. 3, the two CPU communication boards 210A, 210B can be connected with four extension devices 310 through GT interconnection, realizing 2Gbps communication and cross-communication data redundancy.

[0101] In the technical solution of the present embodiment, the valve control device with higher power, computing power and communication capability is used, and a plurality of extension devices 310 can be expanded to realize cross-communication data redundancy and improve the reliability of the valve control system.

[0102] In some embodiments, the valve control system further includes a centralized control device 320, which is in communication connection with the mainboard 210 of the valve control device.

[0103] The centralized control device 320 is for example a control panel, which facilitates centralized control of the valve control system and improves work efficiency.

[0104] In some embodiments, the valve control system further includes a switch driving board 330, which is connected with the input board 240 and the output board 250 of the valve control device.

[0105] The switch driving board 330 can be provided with various switch driving circuits, such as transistor driving circuits and relay driving circuits.

[0106] In some embodiments, the valve control system further comprises a collection board 340 connected with one of the interface boards 230a / 230b / 230c / 230d of the valve control device, and the collection board 340 is configured to collect current and / or voltage.

[0107] For example, the collection board 340 comprises a current and / or voltage electronic transformer, and one of the interface boards 230a / 230b / 230c / 230d is in communication with the collection board 340 to collect secondary voltage and current values of the current and / or voltage electronic transformer.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application. In particular, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A host backplane, wherein, The circuit bottom plate is provided with a mainboard slot, two CPU board slots, a plurality of interface board slots, an input board slot, an output board slot and two power supply board slots: The two CPU board slots are arranged adjacent to opposite sides of the mainboard slot; the mainboard slot, the two CPU board slots are arranged between the two power supply board slots; a plurality of interface board slots, the input board slot and the output board slot are arranged between the two CPU board slots and the two power supply board slots.

2. The host backplane of claim 1, wherein, A plurality of interface board slots are located on one side of one of the CPU board slots away from the mainboard slot; the input board slot is located on one side of the other CPU board slot away from the mainboard slot; the output board slot is arranged adjacent to the input board slot.

3. The host backplane of claim 1 or 2, wherein, The connectors on the two CPU board slots and the connectors on the same interface board slot are connected by equal length signal transmission lines and equal length signal receiving lines.

4. The host backplane of any of claims 1 to 3, wherein, The two CPU board slots and the mainboard slot are provided with connectors and optical communication modules, and the optical communication modules and the connectors are arranged at intervals.

5. The host backplane of any of claims 1 to 4, wherein, It also includes a power supply circuit, and the two power supply board slots are respectively connected to the mainboard slot, the two CPU board slots, the plurality of interface board slots, the input board slot, the output board slot through the corresponding power supply circuit.

6. The host backplane of any of claims 1 to 5, wherein, The slot width of the CPU board slot and the slot width of the mainboard slot are greater than the slot width of the interface board slot.

7. The host backplane of any of claims 1 to 5, wherein, The slot width of the power supply board slot is greater than the slot width of the interface board slot.

8. The host backplane of claim 7, wherein, The slot width of the power supply board slot is less than the slot width of the CPU board slot.

9. The host backplane of claim 7, wherein, The slot width of the CPU board slot is consistent with the slot width of the mainboard slot; the slot width of the input board slot and the slot width of the output board slot are consistent with the slot width of the interface board slot.

10. A valve control device wherein, The main host backboard, the mainboard, the two CPU communication boards, the plurality of interface boards, the input board, the output board and the two power supply boards are connected through the mainboard slot, the two CPU board slots, the plurality of interface board slots, the input board slot, the output board slot and the two power supply board slots.

11. The valve control device of claim 10, wherein, It also includes a first low-voltage differential signal line, a second low-voltage differential signal line and a plurality of third low-voltage differential signal lines; The mainboard and the input board are connected through the first low-voltage differential signal line; The mainboard and the output board are connected through the second low-voltage differential signal line; The mainboard and the plurality of interface boards are connected one by one through the plurality of third low-voltage differential signal lines.

12. A valve control system wherein, The valve control device and a plurality of expansion devices are connected.

13. The valve control system of claim 12, wherein, The control device further comprises a central control device, which is connected with the main board of the valve control device.

14. The valve control system of claim 12 or 13, wherein, The control device further comprises a switch driving board, which is connected with the input board and the output board of the valve control device.

15. The valve control system of any one of claims 12 to 14, wherein, The control device further comprises a collection board, which is connected with one of the interface boards of the valve control device, and is used for collecting current and / or voltage.

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