Adjustment mechanism and semiconductor process device

Abstract

The present application provides an adjustment mechanism and a semiconductor process device. The adjustment mechanism comprises: a mounting flange fixedly arranged in a reaction chamber, wherein a gas showerhead axially runs through the mounting flange; a moving flange movable relative to the mounting flange, wherein the moving flange is connected to the gas showerhead; locking members connected to the mounting flange and the moving flange and used for implementing locking and unlocking between the mounting flange and the moving flange; and adjustment members movably connected to the mounting flange and the moving flange and used for adjusting the relative position between the moving flange and the mounting flange, so that the moving flange drives the gas showerhead to perform position adjustment. Since the adjustment mechanism locks the gas showerhead by using the locking members, fluctuations in the distance and levelness between the gas showerhead and a silicon wafer are avoided.

Description

Adjusting mechanism, semiconductor process equipment TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to an adjusting mechanism and a semiconductor process equipment. BACKGROUND

[0002] The gas shower head is a core component of a CVD (CVD, full name: Chemical Vapor Deposition) device and an ALD (ALD, full name: Atomic Layer Deposition) device, which is used to input process gas into a reaction chamber to form a thin film on a silicon wafer, and needs to maintain a constant gas flow field between the silicon wafer during the thin film generation process. Precise control of the gas flow field requires precise adjustment of the distance and level between the gas shower head and the silicon wafer.

[0003] At present, the adjusting mechanism for adjusting the distance and level between the gas shower head and the silicon wafer is achieved by spring compression after the position and level of the gas shower head are adjusted (the silicon wafer is kept horizontal in the reaction chamber). Since the spring is prone to elastic deformation, when the vacuum degree of the reaction chamber changes, the gas shower head is also prone to overcome the compression force of the spring and cause fluctuations in the distance and level from the silicon wafer, affecting the film formation quality. SUMMARY

[0004] Therefore, the present application provides an adjusting mechanism which can improve the stability of the gas shower head and thus improve the generation quality of the thin film. In addition, the present application also provides a semiconductor process equipment with the above adjusting mechanism.

[0005] In order to achieve the above purpose, the present application provides the following technical solutions:

[0006] According to one aspect of the present application, an adjusting mechanism is disclosed for connecting a reaction chamber and a gas shower head and adjusting the position between the gas shower head, comprising:

[0007] A mounting flange is fixedly arranged in the reaction chamber, and the gas shower head axially penetrates the mounting flange;

[0008] A moving flange is movable relative to the mounting flange, and the moving flange is connected with the gas shower head;

[0009] A locking member is connected with the mounting flange and the moving flange, and is used to realize locking and unlocking between the mounting flange and the moving flange;

[0010] An adjusting member movably connected with the mounting flange and the moving flange, used to adjust the relative position between the moving flange and the mounting flange, so that the moving flange drives the gas shower head to adjust the position.

[0011] In some embodiments, one of the locking member and the adjusting member is a hollow structure and is sleeved outside the other.

[0012] In some embodiments, the adjusting mechanism further comprises a moving flange, which is detachably arranged on the moving flange and is in heat-conducting connection with the gas shower head, and the cooling flange is provided with a cooling channel for guiding the cooling medium.

[0013] In some embodiments, the cooling flange comprises a plurality of cooling flanges with different heat conductivity coefficients, each of which can be assembled with the moving flange and cooperates with the mounting flange, the locking member and the adjusting member.

[0014] In some embodiments, the cooling flange comprises at least two annular parts which are arranged in axial stacking and fixedly connected.

[0015] In some embodiments, the moving flange is provided with a first threaded hole, the adjusting member is a threaded member which is in threaded connection with the first threaded hole, and one end of the adjusting member which passes through the first threaded hole is in abutment with the mounting flange.

[0016] In some embodiments, the adjusting member is a hollow structure and is sleeved outside the locking member, and

[0017] The mounting flange is provided with a second threaded hole, one end of the locking member which passes through the adjusting member is a threaded end which can be in threaded connection with the second threaded hole, and the other end of the locking member which does not pass through the adjusting member is provided with a flange which can abut against the adjusting member.

[0018] In some embodiments, the cooling flange is provided with a protruding part on the end face which is in abutment with the moving flange, the protruding part is located in the flange hole of the moving flange and is fixedly and heat-conductingly connected with the gas shower head.

[0019] In some embodiments, the cooling channel extends around the protruding part in the circumferential direction of the cooling flange, and the cooling flange is provided with a radially protruding cooling liquid inlet connector and a cooling liquid outlet connector, and the two ends of the cooling channel are respectively in communication with the cooling liquid inlet connector and the cooling liquid outlet connector.

[0020] In some embodiments, the adjusting mechanism as described above, wherein the mounting flange and the moving flange are communicated through a bellows, and the gas shower head penetrates the bellows.

[0021] The cooling flange is provided with a purge gas path, and the gas blown out by the purge gas path enters the gap between the bellows and the gas shower head.

[0022] In some embodiments, the adjusting mechanism as described above, wherein the purge gas path comprises:

[0023] An air inlet connector is arranged on the cooling flange.

[0024] An annular gas path is arranged on the cooling flange and surrounds the protruding portion in the circumferential direction of the cooling flange.

[0025] A plurality of uniform flow holes are in communication with the annular gas path and are axially arranged on the cooling flange to form a plurality of gas outlets.

[0026] In some embodiments, the adjusting mechanism as described above, wherein the mounting flange and the moving flange are communicated through a bellows, and,

[0027] An annular connecting groove is arranged on the end surface of the mounting flange facing the moving flange, and one end of the bellows is located in the annular connecting groove and connected with the bottom wall of the annular connecting groove.

[0028] In some embodiments, the adjusting mechanism as described above, wherein the annular portion comprises a first annular portion and a second annular portion, and a splicing groove is arranged on the joint surface of the first annular portion and the second annular portion, and the cooling channel is formed by splicing the splicing groove on the first annular portion with the splicing groove on the second annular portion.

[0029] According to another aspect of the present application, a semiconductor process equipment is also disclosed, comprising a reaction chamber, a gas shower head, and an adjusting mechanism connected between the gas shower head and the reaction chamber and adjusting the position of the gas shower head, wherein the adjusting mechanism is the adjusting mechanism as described above.

[0030] The adjusting mechanism is fixedly arranged on the reaction chamber through the mounting flange, the moving flange is connected to the mounting flange through the adjusting member and the locking member, the gas shower head is connected to the moving flange, and extends into the reaction chamber along the axial direction of the moving flange and the mounting flange after penetrating through the moving flange and the mounting flange, and in the unlocked state of the locking member, the multiple adjusting members distributed in the circumferential direction of the moving flange can adjust the position of the moving flange, that is, the whole or part of the moving flange is moved to approach or move away from the mounting flange along the axial direction, since the gas shower head is connected to the moving flange, the gas shower head can be moved and the levelness can be changed along with the movement of the moving flange, so that the distance and the levelness between the gas shower head and the silicon wafer are adjusted, and after the adjustment is completed, the locking (that is, the locking and fixing) between the mounting flange and the moving flange is realized through the locking member, so that the firm connection between the moving flange and the mounting flange is realized, that is, the firm connection between the gas shower head and the reaction chamber is realized, and even if the vacuum degree of the reaction chamber changes, the gas shower head will not be displaced, and the distance and the levelness between the gas shower head and the silicon wafer are prevented from fluctuating. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0032] Fig. 1 is a structural schematic view of the adjusting mechanism, the gas shower head and the reaction chamber provided by the embodiment of the present application;

[0033] Fig. 2 is a top view of Fig. 1;

[0034] Fig. 3 is a sectional view of Fig. 2;

[0035] Fig. 4 is a top view of the cooling flange;

[0036] Fig. 5 is a sectional view of Fig. 4;

[0037] Fig. 6 is a sectional view of Fig. 5;

[0038] Fig. 7 is a top view of the mounting flange and the moving flange;

[0039] Fig. 8 is a sectional view of Fig. 7;

[0040] Fig. 9 is a top view of the gas shower head;

[0041] Fig. 10 is a sectional view of Fig. 9;

[0042] Fig. 11 is a structural schematic view of the adjusting mechanism, the gas shower head and the reaction chamber.

[0043] Fig. 12 is a structural diagram of the adjustment mechanism, the gas shower head and the silicon wafer, and the heater.

[0044] In Figs. 1-12: 1-adjustment mechanism, 2-gas shower head, 3-reaction chamber, 4-silicon wafer, 5-heater; 11-mounting flange, 12-moving flange, 13-locking member, 14-adjustment member, 15-cooling flange, 16-bellow, 17-first sealing ring, 18-second sealing ring, 19-third sealing ring; 111-second threaded hole, 112-annular connecting groove, 113-third through hole; 121-first threaded hole, 122-third threaded hole, 123-second sealing groove; 1501-cooling channel, 1502-protrusion, 1503-first sealing surface, 1504-second sealing surface, 1505-cooling liquid inlet joint, 1506-cooling liquid outlet joint, 1507-gas inlet joint, 1508-annular gas path, 1509-uniform flow hole, 1510-first annular part, 1511-splicing groove, 1512-first through hole, 1513-second through hole; 21-shower part, 22-penetrating part, 23-gas inlet end, 24-contact surface, 25-fourth threaded hole, 26-first sealing groove; 31-fifth threaded hole, 32-third sealing groove. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0046] As shown in FIGS. 1-12, the embodiment of the present application provides a regulating mechanism 1 for installing on a semiconductor process equipment to set a gas shower head 2 on a reaction chamber 3 of the semiconductor process equipment and capable of regulating the position of the gas shower head 2, which mainly comprises a mounting flange 11, a moving flange 12, a locking member 13 and a regulating member 14, wherein the mounting flange 11 is fixedly arranged on the reaction chamber 3, specifically on the upper cover of the reaction chamber 3, and is the installation base of the moving flange 12, the locking member 13, the regulating member 14 and the gas shower head 2, that is, the other components of the regulating mechanism 1 and the gas shower head 2 are all installed on the reaction chamber 3 through the mounting flange 11; the moving flange 12 is movably arranged on the mounting flange 11 and the gas shower head 2 is fixedly arranged on the moving flange 12, so that the movement of the moving flange 12 relative to the mounting flange 11 drives the movement of the gas shower head 2 relative to the reaction chamber 3 (and the silicon wafer 4 horizontally and fixedly arranged in the reaction chamber 3), thereby realizing the regulation of the distance and the levelness between the gas shower head 2 and the silicon wafer 4 (since the silicon wafer 4 is fixedly placed on the heater 5 in the reaction chamber 3, the movement and the change of the levelness of the gas shower head 2 can realize the regulation of the distance and the levelness between the gas shower head 2 and the silicon wafer 4), when the gas shower head 2 is connected with the moving flange 12, the part of the gas shower head 2 (i.e. the penetrating part 22 described below) outside the reaction chamber 3 is first axially penetrated through the mounting flange 11, the bellows 16 described below and the moving flange 12 and then connected, while the other part of the gas shower head 2 (i.e. the showering part 21 described below) is located in the reaction chamber 3 for spraying process gas to the silicon wafer 4; the locking member 13 is a component for locking the moving flange 12, after the moving flange 12 drives the gas shower head 2 to move to the position, the locking of the moving flange 12 relative to the mounting flange 11 can be realized by operating the locking member 13, so that the moving flange 12 cannot change the position relative to the mounting flange 11, thereby the gas shower head 2 cannot change the position relative to the reaction chamber 3 and the silicon wafer 4 in the reaction chamber 3 (the change of the position includes the change of the distance and the levelness), thereby realizing the stable setting of the gas shower head 2 in the reaction chamber 3, avoiding the fluctuation of the distance and the levelness between the gas shower head 2 and the silicon wafer 4 due to the change of the vacuum degree of the reaction chamber 3, when it is necessary to regulate the position of the gas shower head 2, the unlocking of the moving flange 12 can be realized by the locking member 13, so that the moving flange 12 can drive the gas shower head 2 to move, thereby realizing the change of the distance and the levelness between the gas shower head 2 and the silicon wafer 4.The adjusting member 14 is used to adjust the position of the moving flange 12 relative to the mounting flange, that is, the adjusting member 14 is a component for moving the moving flange 12 and the gas shower head 2 thereon, and the adjusting member 14 is movably connected with the mounting flange 11 and the moving flange 12, the movement including movement, rotation and self stretching, and the connection includes abutting and natural contact, that is, the adjusting member 14 can realize the movement of the moving flange 12 relative to the mounting flange 11 through the movement, rotation and self stretching and the connection (abutting or natural contact) with the mounting flange 11 and the moving flange 12, for example, the adjusting member 14 can realize the distance adjustment between the two by rotating relative to the moving flange 12 and abutting with the mounting flange 11, so as to drive the gas shower head 2 to move, and more preferably, the adjusting member 14 is also provided with a plurality of adjusting members 14, which are distributed in the circumferential direction of the mounting flange 11 and the moving flange 12, for example, in the circumferential direction, the adjusting members 14 are equally spaced (or equally angularly) distributed, when the adjusting members 14 of different angles are operated respectively, the levelness of the moving flange 12 and the gas shower head 2 can be changed. Compared with the adjusting mechanism in the prior art, the adjusting mechanism 1 has the following advantages: on the one hand, the spring compression method for positioning the adjusted gas shower head 2 is no longer used, but the locking member 13 is used to lock and fix the adjusted gas shower head 2, and this positioning method is less likely to be elastically deformed, and compared with the spring which is easy to be elastically deformed, has more stable and reliable positioning effect, and can realize firm positioning of the gas shower head 2, even if the vacuum degree of the reaction chamber 3 changes, the gas shower head 2 will not be displaced, avoiding the distance and levelness of the gas shower head 2 and the silicon wafer 4 from fluctuating, and ensuring the generation quality of the thin film.

[0047] In some prior art, the spring compression position of the adjusting member connected with the gas shower head is different from the support and adjustment position of the gas shower head, which will cause the adjusting member to be deformed due to unbalanced force, and affect the control accuracy of the distance and levelness between the gas shower head and the silicon wafer.

[0048] In order to solve the technical problem, in the above structure, one of the locking member 13 and the adjusting member 14 can be provided as a hollow structure and is sleeved outside the other, that is, the adjusting member 14 can be provided as a hollow structure and the locking member 13 is passed through and arranged inside the adjusting member 14, or the locking member 13 can be provided as a hollow structure and the adjusting member 14 is passed through and arranged inside the locking member 13, so that the adjusting point position and the locking point position on the mounting flange 11 and the moving flange 12 coincide. By sleeving the adjusting member 14 and the locking member, the setting positions of the adjusting member 14 and the locking member 13 on the moving flange 12 and the mounting flange 11 coincide, that is, the positions of the moving flange 12 and the mounting flange 11 subjected to the locking force are the positions subjected to the adjusting force, and since the directions of the two forces are opposite, the setting can balance the axial stress of the moving flange 12 and the mounting flange 11, eliminate the bending moment between the moving flange 12 and the mounting flange 11, avoid stress deformation, and improve the adjusting efficiency and accuracy of the gas shower head 2.

[0049] Further, as shown in FIG. 1-6, the above-mentioned adjusting mechanism 1 further comprises a cooling flange 15 detachably arranged on the moving flange 12 and in heat-conducting connection with the gas shower head 2, the cooling flange 15 is capable of leading out the heat of the gas shower head 2 to achieve heat dissipation of the gas shower head 2, and the cooling flange 15 comprises a plurality of cooling flanges 15 with different heat conductivity coefficients, each cooling flange 15 is capable of being assembled with the moving flange 12 and matched with the mounting flange 11, the locking member 13 and the adjusting member 14. In some processes, the temperature of the gas shower head 2 needs to be adjusted and controlled, but the adjusting mechanism in the prior art is of an integrated structure, i.e. the entire adjusting mechanism is composed of a single material, and the heat conductivity coefficient thereof is fixed and unchangeable, which leads to the fact that the heat dissipation effect of the adjusting mechanism on the gas shower head 2 cannot be adjusted, and the diversified process requirements cannot be met. Moreover, when the adjusting mechanism in the prior art of the integrated structure cannot meet the requirements of different processes, the entire adjusting mechanism has to be replaced, which leads to an increase in production cost. In the present application, the adjusting mechanism 1 is provided with a plurality of cooling flanges 15 with different materials, so that each cooling flange 15 has a different heat conductivity coefficient, and therefore, the cooling flange 15 can have different heat dissipation effects on the gas shower head 2. It can be understood that the cooling flange 15 is not only detachably connected with the moving flange 12, but also detachably connected with the gas shower head 2, and therefore, the cooling flange 15 with different heat conductivity coefficients can be replaced to be connected with the moving flange 12 and the gas shower head 2 to change the temperature of the gas shower head 2 and the gas parameters (the change of the gas parameters, for example, the cooling flange 15 with different materials is selected according to the process gas to match the process gas) to a different degree, so that the gas shower head 2 has more (or less) heat conduction to the cooling flange 15 to exchange heat with the cooling medium in the cooling flange 15, and the temperature of the gas shower head 2 is more targetedly reduced (or increased). At the same time, by arranging the cooling flange 15, the moving flange 12 and the gas shower head 2 in a split structure, only a part of the adjusting mechanism 1 (i.e. the cooling flange 15) can be replaced to meet the requirements of different process equipment and realize different functions, so that the universality of the adjusting mechanism 1 is higher.

[0050] In order to improve the heat dissipation efficiency of the cooling flange 15 to the gas spraying head 2, as shown in FIGS. 4-6 and FIG. 11, the cooling flange 15 is also provided with a cooling channel 1501 for guiding the cooling medium, so that the cooling flange 15 not only exchanges heat with the environment through its outer surface to achieve heat dissipation, but also can more efficiently take away heat by flowing the cooling medium inside the cooling flange 15, wherein the cooling medium can be a liquid medium with higher heat exchange efficiency, such as cooling water or cooling oil, etc., so that the cooling flange 15 is a liquid cooling component, or the cooling medium flowing in the cooling channel 1501 can be a gas, such as air, etc., so that the cooling flange 15 is an air cooling component. In this application, the connection mode of the moving flange 12 and the gas spraying head 2 is indirect connection, the moving flange 12 is connected with the cooling flange 15, and the cooling flange 15 is connected with the gas spraying head 2, that is, the moving flange 12 is connected with the gas spraying head 2 through the cooling flange 15, and the cooling flange 15 is a component directly connected with the gas spraying head 2, so the cooling flange 15 is provided with heat dissipation function and the cooling channel 1501 to improve the heat dissipation efficiency of the cooling flange 15, which can better achieve temperature control of the gas spraying head 2. Specifically, as shown in FIGS. 9 and 10, the gas spraying head 2 has a contact surface 24, and as shown in FIG. 5, the cooling flange 15 has a first sealing surface 1503. The contact surface 24 and the first sealing surface 1503 are respectively the surfaces of the gas spraying head 2 and the cooling flange 15 that contact and adhere to each other. Therefore, the heat on the gas spraying head 2 is conducted to the cooling flange 15 through the contact of the contact surface 24 and the first sealing surface 1503, and the cooling liquid flows in the cooling channel 1501 to take away the heat conducted from the gas spraying head 2 to the cooling flange 15, thereby achieving cooling of the gas spraying head 2.

[0051] In some embodiments, as shown in FIGS. 1-12, the first threaded hole 121 is formed in the mobile flange 12, the adjusting member 14 is a threaded member screwing with the first threaded hole 121, and the end of the adjusting member 14 penetrating through the first threaded hole 121 abuts against the mounting flange 11. This structure realizes the adjustment of the mobile flange 12 by screwing the adjusting member 14 and the mobile flange 12 together. Specifically, the adjusting member 14 is set as a threaded member such as a bolt or a sleeve, and the first threaded hole 121 is formed in the mobile flange 12 along the axial direction of the mobile flange 12. The adjusting member 14 can be screwed into the first threaded hole 121 to realize the threaded connection with the first threaded hole 121. With the continuous screwing, the adjusting member 14 can be screwed to the state that the end thereof penetrates out of the first threaded hole 121 and abuts against the mounting flange 11 below the mobile flange 12. Under the gravity of the mobile flange 12, the cooling flange 15, and the gas shower head 2, the end of the adjusting member 14 penetrating out of the first threaded hole 121 always abuts against the mounting flange 11. Then, when the adjusting member 14 is screwed again, the length of the adjusting member 14 penetrating out of the first threaded hole 121 can be changed, so that the distance between the mobile flange 12 and the mounting flange 11 is changed, and the position of the mobile flange 12 and the gas shower head 2 thereon is changed. As described above, the adjusting member 14 is provided with a plurality of adjusting members in the circumferential direction of the mobile flange 12 and the mounting flange 11. Correspondingly, the first threaded hole 121 formed in the mobile flange 12 is also a plurality of circumferentially distributed first threaded holes, and each adjusting member 14 penetrates through a first threaded hole 121 to abut against the mounting flange 11. In this case, by screwing the adjusting members 14 at different positions, the lifting of different parts of the mobile flange 12 and the gas shower head 2 in the circumferential direction can be realized, so that the distance and the levelness of the gas shower head 2 are adjusted. In this structure, the adjusting member 14 can be screwed by a torque wrench, so that the locking force of each adjusting member 14 after screwing is consistent, and the accurate adjustment of the distance and the levelness of the gas shower head 2 is realized. The adjusting member 14 is selected as a threaded member, and the threaded hole is formed in the mobile flange 12 to cooperate with the adjusting member 14. This not only realizes the fine adjustment of the distance and the levelness by the threaded hole with high machining precision, but also makes the adjusting member 14 have higher adjusting precision, and the structure of the threaded member and the threaded hole is simple and easy to process, which is more suitable for use in the adjusting mechanism 1 provided in the present application. In addition, the adjusting member 14 can also have other structures. For example, the adjusting member 14 can be a telescopic member arranged between the mobile flange 12 and the mounting flange 11 and capable of being telescoped, such as a telescopic sleeve or a scissor mechanism.

[0052] In some embodiments, as shown in FIGS. 1-12, the adjusting member 14 is a hollow structure and is sleeved outside the locking member 13 (i.e., the adjusting member 14 can be provided as a threaded sleeve), and the mounting flange 11 is provided with a second threaded hole 111, and the end of the locking member 13 that passes through the adjusting member 14 is a threaded end that can be threadedly connected with the second threaded hole 111, and the other end of the locking member 13 that does not pass through the adjusting member 14 is provided with a flange that can abut against the adjusting member 14. In one aspect, the adjusting member 14 is preferably a hollow structure, and the locking member 13 passes through the adjusting member 14 that is provided with a through hole; in another aspect, the locking manner of the locking member 13 with the mounting flange 11 is also selected as threaded connection, and the locking manner of the locking member 13 with the moving flange 12 is selected as blocking and abutting, specifically, the end of the locking member 13 that passes through the through hole is a threaded end, and the other end of the locking member 13 that does not pass through the through hole is provided with a flange, which is similar to a bolt, or the locking member 13 can be provided as a bolt, and the mounting flange 11 is provided with a second threaded hole 111, and after the threaded end of the locking member 13 passes through the through hole, it can be screwed into the second threaded hole 111 to be connected with the second threaded hole 111, and as the locking member 13 penetrates into the second threaded hole 111, the flange will abut against the adjusting member 14 because the outer diameter of the flange is greater than the inner diameter of the through hole, so that the locking of the adjusting member 14 and the moving flange 12 is realized by the bolt-shaped locking member 13, and since the locking member 13 is sleeved by the adjusting member 14, the positions of the fixing points and the adjusting points on the moving flange 12 and the mounting flange 11 coincide, so that the opposite forces can be counteracted to avoid the bending moment of the moving flange 12 and the stress deformation. Further, in order to more fully counteract the stress of the moving flange 12 and the mounting flange 11 in the axial direction, the locking member 13 and the adjusting member 14 can be coaxially sleeved, that is, the through hole provided on the adjusting member 14 is preferably a shaft hole, and correspondingly, the first threaded hole 121 on the moving flange 12 and the second threaded hole 111 on the mounting flange 11 are also coaxially arranged. By sleeving the adjusting member 14 outside the locking member 13, the diameter of the second thread on the mounting flange 11 can be smaller than the diameter of the first threaded hole 121 on the moving flange 12, so that the end of the adjusting member 14 that passes through the first threaded hole 121 directly abuts against the surface of the mounting flange 11, and the abutting position is the annular position outside the opening of the second threaded hole 111, so that the adjusting accuracy and the machining accuracy can be improved. The locking member 13 can also be other structures or types, for example, the locking member 13 can be a magnetic member that can be magnetically connected with the mounting flange 11, and the magnetic attraction force of the locking member 13 is greater than the maximum fluctuation force generated when the vacuum degree of the reverse chamber changes.

[0053] Alternatively, the locking member 13 can also be a hollow structure and is sleeved outside the adjusting member 14, that is, the structure of the locking member 13 and the adjusting member 14 is interchanged, so that the locking member 13 is a threaded sleeve and the adjusting member 14 is a bolt-shaped, and the locking member 13 on the outside is also required to be threadedly connected with the first threaded hole 121 and the second threaded hole 111, while the inner wall of the locking member 13 is also provided with threads, which can be matched with the threads on the adjusting member 14 on the inside (the threads on the adjusting member 14 can still be the threads matched with the first threaded hole 121 in FIG. 11), so as to realize the connection of the adjusting member 14 and the moving flange 12 through the threads of the inner wall and the outer wall of the locking member 13, and the abutting end of the adjusting member 14 abuts on the bottom wall of the second threaded hole 111. When adjusting the position, first, the locking member 13 on the outside is screwed under the condition that the adjusting member 14 does not rotate, so that the end of the locking member 13 penetrating out of the first threaded hole 121 is detached from the second threaded hole 111, so as to release the locking and fixing of the moving flange 12 and the mounting flange 11, and then the adjusting member 14 is screwed under the condition that the locking member 13 does not rotate in the first threaded hole 121, since the adjusting member 14 abuts on the bottom wall of the second threaded hole 111 of the mounting flange 11, and the threads on the adjusting member 14 are engaged with the threads on the inner wall of the locking member 13, so that screwing the adjusting member 14 can make the locking member 13 and the moving flange 12 (since the locking member 13 does not rotate in the first threaded hole 121, so the locking member 13 and the moving flange 12 at this time can be regarded as fixed connection) move synchronously relative to the mounting flange 11 through the engagement of the threads, so as to realize the adjustment of the distance and the levelness of the gas spraying head 2, and finally, the locking member 13 is reversely screwed under the condition that the adjusting member 14 does not rotate, so that the locking member 13 is inserted into the second threaded hole 111 again to realize the locking of the moving flange 12 and the mounting flange 11. The non-rotation of the locking member 13 and the adjusting member 14 can be realized by using a wrench or a screwdriver.

[0054] It should be noted that, in order to realize the adjustment of the levelness of the gas spraying head 2, the adjusting member 14 is provided with a plurality of adjusting members 14 in the circumferential direction of the moving flange 12 and the mounting flange 11, and in the case that the adjusting member 14 and the locking member 13 are sleeved, the number of the locking member 13 can be flexibly set under the condition that the locking function is normally realized, for example, one locking member 13 can be arranged in each adjusting member 14 to maximize the working stability and reliability of the adjusting mechanism 1, or only a part of the adjusting member 14 can be provided with the locking member 13, for example, one locking member 13 is arranged in each of the two adjusting members 14 symmetrically arranged in the circumferential direction.

[0055] As shown in FIG. 3, FIG. 5 and FIG. 11, the protruding part 1502 is arranged on the end face of the cooling flange 15 abutting against the moving flange 12. The protruding part 1502 protruding along the axial direction of the cooling flange 15 extends into the flange hole of the moving flange 12 and is fixed and heat-conducting connected with the gas shower head 2. The protruding part 1502 is the structure of the cooling flange 15 for connecting with the gas shower head 2, which extends into the flange hole of the moving flange 12 can be more stable and more convenient to connect with the gas shower head 2. The protruding part 1502 is circular and located at the central part of the end face of the moving flange 12. The center of the protruding part 1502 is provided with a flange hole penetrating through the cooling flange 15, so that the gas inlet end 23 of the gas shower head 2 passes through. The surface of the protruding part 1502 forms the first sealing surface 1503 connected and sealed with the gas shower head 2. The part of the surface of the end face of the cooling flange 15 surrounding the protruding part 1502 forms the second sealing surface 1504 connected and sealed with the moving flange 12. By arranging the protruding part 1502, the matching structure of the cooling flange 15, the gas shower head 2 and the moving flange 12 can be optimized, the connection stability of the gas shower head 2 and the cooling flange 15 is improved, and the cooling effect of the cooling flange 15 on the gas shower head 2 is also improved. At the same time, it is also beneficial to the compensation of process gas into the reaction chamber 3 described later.

[0056] Further, as shown in FIG. 4 and FIG. 5, the cooling channel 1501 extends around the protruding part 1502 in the circumferential direction of the cooling flange 15. The cooling flange 15 is provided with a radially protruding cooling liquid inlet joint 1505 and a cooling liquid outlet joint 1506. The two ends of the cooling channel 1501 are respectively communicated with the cooling liquid inlet joint 1505 and the cooling liquid outlet joint 1506. By making the cooling channel 1501 extend in the circumferential direction of the cooling flange 15, not only the length of the cooling channel 1501 can be increased, but also the cooling channel 1501 can be more evenly distributed on the cooling flange 15, so that the cooling liquid can flow through the cooling flange 15 more fully, thereby improving the cooling effect of the cooling flange 15 as much as possible. Since the gas shower head 2 is connected to the protruding part 1502, the arrangement of the cooling channel 1501 around the protruding part 1502 can more fully and efficiently take away the heat transferred from the gas shower head 2 to the cooling flange 15. The cooling liquid inlet joint 1505 is connected with the external pipeline for introducing cooling liquid into the cooling channel 1501. The cooling liquid flows in the cooling channel 1501 to absorb the heat of the gas shower head 2, and then flows out of the cooling channel 1501 from the cooling liquid outlet joint 1506. The cooling liquid outlet joint 1506 is also connected with the external pipeline to send away the cooling liquid absorbing heat. In order to optimize the structure, facilitate the connection of the pipeline and the arrangement of the threaded hole and other structures on the cooling flange 15, the cooling liquid inlet joint 1505 and the cooling liquid outlet joint 1506 are arranged at the edge part of the cooling flange 15 and protrude in the radial direction of the cooling flange 15.

[0057] And, as shown in FIG. 3, FIG. 8 and FIG. 11, the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 are communicated through the bellows 16, and the gas shower head 2 passes through the bellows 16, and there are radial gaps between the protrusion 1502 and the flange hole wall of the moving flange 12, between the gas shower head 2 and the bellows 16, and between the gas shower head 2 and the flange hole wall of the mounting flange 11; the purge gas path is arranged on the cooling flange 15, and the gas blown out of the purge gas path enters the gap between the bellows 16 and the gas shower head 2, that is, the gas outlet of the purge gas path is located between the protrusion 1502 and the flange hole wall of the moving flange 12 and communicates with the radial gap, so that the purge gas blown out of the gas outlet can enter the reaction chamber 3 through the flange hole of the moving flange 12, the bellows 16 and the flange hole of the mounting flange 11 in turn. In some processes, process gas needs to be filled into the reaction chamber 3 to compensate for the pressure in the reaction chamber 3, so the purge gas path is arranged on the cooling flange 15, and in order to ensure that the process gas can enter the reaction chamber 3 through the purge gas path, the bellows 16 is arranged between the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 to realize the communication of the two flange holes, and the gas shower head 2 connected with the cooling flange 15 passes through the bellows 16, and the bellows 16 is selected because it can stretch and contract, so as to ensure the normal adjustment between the moving flange 12 and the mounting flange 11, and in order to better adapt to different process gases and prolong the service life of the bellows 16, the material of the bellows 16 is preferably metal. The gas outlet of the purge gas path is located between the protrusion 1502 and the flange hole wall of the moving flange 12, the inner diameter of the bellows 16 is greater than the inner diameters of the flange holes of the moving flange 12 and the mounting flange 11, and through the arrangement of the above-mentioned multiple radial gaps, the process gas can smoothly enter the reaction chamber 3 to realize pressure compensation, so that when the flow of other process gases changes, the pressure in the reaction chamber 3 can be balanced by changing the flow of the gas.

[0058] And, the process gas is blown into the reaction chamber 3 through the above-mentioned multiple radial gaps in turn, which can not only realize pressure compensation, but also avoid the gas and particles in the reaction chamber 3 from entering the radial gaps, so as to avoid pollution to the radial gaps, and even the blown gas can also purge the radial gaps to clean the radial gaps.

[0059] In the above structure, the cooling channel 1501 for guiding the cooling liquid and the purge gas path for guiding the gas are arranged on the detachable cooling flange 15, so that the structure of the adjusting mechanism 1 is optimized and the function layout is more reasonable, that is, the connecting structure of the water path, the gas path and the gas spraying head 2 are arranged on the cooling flange 15, and the mounting flange 11 and the moving flange 12 only serve to adjust the distance and the levelness of the gas spraying head 2, so that different process equipment requirements can be met by only replacing the cooling flange 15, the design of the adjusting mechanism 1 is more reasonable, the cost is lower, and the universality is higher.

[0060] As shown in FIGS. 2-5 and 11, the purge gas path includes an air inlet joint 1507, an annular gas path 1508 and a plurality of uniform flow holes 1509, the air inlet joint 1507 is protrusively arranged on the cooling flange 15, the annular gas path 1508 is arranged on the cooling flange 15 and surrounds the protruding portion 1502 in the circumferential direction of the cooling flange 15, and the plurality of uniform flow holes 1509 are in communication with the annular gas path 1508 and are axially arranged on the cooling flange 15 to form a plurality of gas outlets uniformly distributed around the protruding portion 1502. By arranging the purge gas path in this way, the process gas can enter the annular gas path 1508 from the air inlet joint 1507, be guided by the annular gas path 1508 to be distributed in the circumferential direction of the protruding portion 1502, and then be blown from the upper part of the gas spraying head 2 into the radial gap through the uniform flow holes 1509 to form a gas curtain around the protruding portion 1502. The gas curtain passes through the flange holes of the moving flange 12, the corrugated pipe 16 and the flange holes of the mounting flange 11, and finally enters the reaction chamber 3 and passes through the upper surface of the silicon wafer 4 for thin film growth.

[0061] In some embodiments, as shown in FIG. 8, the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 are communicated through the corrugated pipe 16, and an annular connecting groove 112 is arranged on the end surface of the mounting flange 11 facing the moving flange 12, and the corrugated pipe 16 extends into the annular connecting groove 112 and is connected to the bottom wall of the annular connecting groove 112. The inner diameter of the annular connecting groove 112 is larger than that of the flange hole of the mounting flange 11, so that the corrugated pipe 16 is surrounded outside the flange hole of the mounting flange 11. By arranging the annular connecting groove 112 and connecting the corrugated pipe 16 to the groove bottom wall, the length of the corrugated pipe 16 can be increased, so that the moving flange 12 can have a larger adjusting stroke and a larger adjusting amount, and the working performance of the gas spraying head 2 is more prominent. Specifically, the annular connecting groove 112 can be formed in cooperation with the flange hole of the mounting flange 11, that is, the annular connecting groove 112 and the flange hole are combined to form a stepped hole, the end of the stepped hole close to the moving flange 12 has a larger diameter to become the annular connecting groove 112, and the end of the stepped hole away from the moving flange 12 is the flange hole, and the corrugated pipe 16 is connected to the stepped surface of the stepped hole.

[0062] In addition, the cooling flange 15 comprises at least two annular portions which are axially stacked and fixedly connected. In the specific processing, the at least two annular portions can be first processed according to the structure of the cooling flange 15, then the annular portions are axially stacked, and finally the adjacent annular portions are welded to finally form the cooling flange 15. In this way, the cooling flange 15 is manufactured, which facilitates the processing and manufacturing of the cooling flange 15 provided with the cooling channel 1501 and the purge gas path, and reduces the manufacturing difficulty of the cooling flange 15.

[0063] As shown in FIGS. 4-6, the annular portion comprises a first annular portion 1510 and a second annular portion, and the joint surface of the first annular portion 1510 and the second annular portion is provided with a splicing groove 1511, and the cooling channel 1501 is formed by splicing the splicing groove 1511 on the first annular portion 1510 and the splicing groove 1511 on the second annular portion. Through such a setting, the splicing groove 1511 can be first processed on the annular portion, and then the circumferentially closed cooling channel 1501 is formed by splicing the splicing groove 1511, so that the cooling channel 1501 can be more simply and conveniently processed and formed. Similarly, the purge gas path on the cooling flange 15 can also be processed and formed in this way.

[0064] In the present application, as shown in FIGS. 4-11, the connection between the cooling flange 15 and the moving flange 12, the connection between the cooling flange 15 and the gas shower head 2, and the connection between the mounting flange 11 and the reaction chamber 3 are all achieved by the cooperation of bolts and threaded holes, and are all achieved by sealing rings. In the specific arrangement, a plurality of first through holes 1512 and a plurality of second through holes 1513 are arranged on the cooling flange 15, a plurality of third threaded holes 122 are arranged on the moving flange 12, a plurality of fourth threaded holes 25 are arranged on the gas shower head 2, a plurality of third through holes 113 are arranged on the mounting flange 11, and a plurality of fifth threaded holes 31 are arranged on the reaction chamber 3. In the connection, the bolts pass through the first through holes 1512 and extend into the third threaded holes 122 and are threadedly connected with the third threaded holes 122 to achieve the fixed connection of the cooling flange 15 and the moving flange 12, the bolts pass through the second through holes 1513 and extend into the fourth threaded holes 25 and are threadedly connected with the fourth threaded holes 25 to achieve the fixed connection of the cooling flange 15 and the gas shower head 2, and the bolts pass through the third through holes 113 and extend into the fifth threaded holes 31 and are threadedly connected with the fifth threaded holes 31 to achieve the fixed connection of the mounting flange 11 and the reaction chamber 3. At the same time, the first sealing groove 26 is arranged on the gas shower head 2, the second sealing groove 123 is arranged on the moving flange 12, and the third sealing groove 32 is arranged on the reaction chamber 3. The first sealing ring 17 is arranged in the first sealing groove 26 and achieves the sealing connection of the cooling flange 15 and the gas shower head 2 by abutting against the first sealing surface 1503, the second sealing ring 18 is arranged in the second sealing groove 123 and achieves the sealing connection of the cooling flange 15 and the moving flange 12 by abutting against the second sealing surface 1504, and the third sealing ring 19 is arranged in the third sealing groove 32 and achieves the sealing connection of the mounting flange 11 and the gas reaction chamber 3 by abutting against the mounting flange 11, thereby achieving the sealing isolation of the radial gap from the outside, so that the process gas can smoothly enter the reaction chamber 3 from the purge gas path.

[0065] In addition, the present application also provides a semiconductor process equipment, which comprises the reaction chamber 3, the gas shower head 2, and the adjusting mechanism 1 for mounting the gas shower head 2 on the reaction chamber 3 and adjusting the position of the gas shower head 2. The adjusting mechanism 1 is the above-mentioned adjusting mechanism 1.

[0066] Since the semiconductor process equipment has the above-mentioned adjusting mechanism 1, the beneficial effects of the semiconductor process equipment brought by the adjusting mechanism 1 are described above, and will not be repeated here.

[0067] As shown in FIGS. 9-11, the gas showerhead 2 of the semiconductor process equipment comprises: a shower portion 21 located in the reaction chamber 3 and having a plurality of gas outlets uniformly distributed; a penetrating portion 22 in communication with the shower portion 21 and used for guiding the process gas to the shower portion 21 and penetrating the upper cover of the reaction chamber 3, the mounting flange 11 and the moving flange 12; and a gas inlet end 23 in communication with an end of the penetrating portion 22 away from the shower portion 21 and penetrating the cooling flange 15; wherein the end of the penetrating portion 22 away from the shower portion 21 is provided with a plurality of fourth threaded holes 25 and a first sealing groove 26, so as to be fixedly connected with the cooling flange 15 by being threadedly connected with the bolts penetrating the cooling flange 15. The gas showerhead 2 with the above structure is matched with the adjusting mechanism 1, so that the adjusting effect can be more efficiently and accurately improved, and the thin film can be generated with high quality.

[0068] The above describes the basic principles of the present application in combination with specific embodiments. However, it should be noted that the advantages, advantages, effects and the like mentioned in the present application are only examples and not limitations, and these advantages, advantages, effects and the like cannot be considered as the necessary possession of each embodiment of the present application. In addition, the above disclosed specific details are only for the purpose of example and understanding, and are not limited to the present application.

[0069] The block diagrams of the devices, apparatuses, equipment, systems involved in the present application are only illustrative examples and are not intended to require or imply the connection, arrangement, configuration shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any manner. Words such as "include", "contain", "have" and the like are open-ended words, which mean "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0070] It should also be noted that in the devices, equipment and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombination should be considered as equivalent solutions of the present application.

[0071] The above description of the disclosed aspects is provided so that any person skilled in the art can make or use the present application. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0072] It should be understood that the limiting words "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments of the present application are only used for more clearly explaining the technical solutions, and cannot be used to limit the protection scope of the present application.

[0073] The above description is given for the purpose of illustration and description. Furthermore, this description does not intend to limit the embodiments of the present application to the forms disclosed herein. Although several example aspects and embodiments have been discussed above, those of ordinary skill in the art will appreciate a variety of modifications, alternatives, permutations, additions, and sub-combinations of the described aspects and embodiments.

Claims

1. An adjustment mechanism, characterized by A device for connecting a reaction chamber with a gas shower head and adjusting the position of the gas shower head, comprising: a mounting flange fixedly arranged on the reaction chamber, the gas shower head axially penetrating the mounting flange; a moving flange movable relative to the mounting flange, the moving flange being connected with the gas shower head; a locking member connected with the mounting flange and the moving flange, for locking and unlocking between the mounting flange and the moving flange; an adjusting member movably connected with the mounting flange and the moving flange, for adjusting the relative position between the moving flange and the mounting flange, so that the moving flange drives the gas shower head to adjust the position.

2. The adjustment mechanism of claim 1, wherein, One of the locking member and the adjusting member is a hollow structure and is sleeved on the outside of the other.

3. The adjustment mechanism of claim 1, wherein, Further comprising: a cooling flange detachably arranged on the moving flange and in heat-conducting connection with the gas shower head, the cooling flange being provided with a cooling channel for guiding a cooling medium.

4. The adjustment mechanism of claim 3, wherein, The cooling flange comprises a plurality of portions with different heat conductivities, each of the cooling flanges can be assembled with the moving flange and cooperates with the mounting flange, the locking member and the adjusting member.

5. The adjustment mechanism of claim 3, wherein, The cooling flange comprises at least two annular portions axially stacked and fixedly connected.

6. The adjustment mechanism of claim 1, wherein, The moving flange is provided with a first threaded hole, the adjusting member is a threaded member in threaded connection with the first threaded hole, and one end of the adjusting member penetrating the first threaded hole is in abutment with the mounting flange.

7. Adjusting mechanism according to claim 1 or 6, characterized in that The adjusting member is a hollow structure and is sleeved on the outside of the locking member, and The mounting flange is provided with a second threaded hole, one end of the locking member penetrating the adjusting member is a threaded end in threaded connection with the second threaded hole, and the other end of the locking member not penetrating the adjusting member is provided with a flange in abutment with the adjusting member.

8. The adjustment mechanism of claim 3, wherein, The end surface of the cooling flange in abutment with the moving flange is provided with a protruding portion, the protruding portion is located in a flange hole of the moving flange and is fixedly and heat-conductingly connected with the gas shower head.

9. The adjustment mechanism of claim 8, wherein, In the circumferential direction of the cooling flange, the cooling channel extends around the protruding portion, and the cooling flange is provided with a radially protruding cooling liquid inlet joint and a cooling liquid outlet joint, and two ends of the cooling channel are in communication with the cooling liquid inlet joint and the cooling liquid outlet joint, respectively.

10. The adjustment mechanism of claim 8, wherein, The mounting flange and the moving flange are communicated through a bellows, and the gas shower head penetrates the bellows; The cooling flange is provided with a purge gas path, and the gas blown out of the purge gas path enters the gap between the bellows and the gas shower head.

11. The adjustment mechanism of claim 10, wherein, The purge gas path comprises: a gas inlet joint arranged on the cooling flange; an annular gas path arranged on the cooling flange and surrounding the protruding portion in the circumferential direction of the cooling flange; a plurality of uniform flow holes in communication with the annular gas path and axially arranged on the cooling flange to form a plurality of gas outlets.

12. The adjustment mechanism of claim 1, wherein, The mounting flange and the moving flange are communicated through a bellows, and An annular connecting groove is formed on the end face of the mounting flange facing the moving flange, and one end of the bellows is located in the annular connecting groove and connected with the bottom wall of the annular connecting groove.

13. The adjustment mechanism of claim 5, wherein, The annular part comprises a first annular part and a second annular part, and a splicing groove is formed on the joint surface of the first annular part and the second annular part, and the cooling channel is formed by splicing the splicing groove on the first annular part and the splicing groove on the second annular part.

14. A semiconductor process apparatus characterized by comprising: The adjusting mechanism is the adjusting mechanism according to any one of claims 1-13.

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