Film-forming device and method for displacing mask sheet
The film forming apparatus addresses adhesion inconsistencies by using a displacement mechanism to press the mask sheet against the substrate, ensuring consistent film formation despite substrate irregularities.
Patent Information
- Application Number
- PCT/JP2024/023868
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2026-01-08
AI Technical Summary
Existing film forming technologies face issues with inconsistent adhesion between the mask sheet and substrate due to differences in substrate shape or warping, leading to insufficient film formation in areas with large gaps.
A film forming apparatus with a displacement mechanism that includes a mask sheet, a moving member, and a displacement mechanism to press the mask sheet against the substrate, using a movable member and a spring or magnet to ensure close contact and improve adhesion.
Enhances adhesion between the mask sheet and substrate, maintaining close contact even in peripheral regions, reducing the impact of substrate unevenness, and improving film formation consistency.
Smart Images

Figure JP2024023868_08012026_PF_FP_ABST
Abstract
Description
Film forming apparatus and mask sheet displacement method
[0001] The present disclosure relates to a film forming apparatus and a method for displacing a mask sheet.
[0002] Patent Document 1 discloses a mask assembly capable of manufacturing a display device having a precise pattern, a display device manufacturing apparatus, and a display device manufacturing method.
[0003] Japanese Patent Application Publication No. 2021-130873
[0004] In the invention of Patent Document 1, differences in adhesion between the mask sheet and the substrate occur depending on the shape of the stage on which the substrate is placed or the warping state of the substrate, and film formation is insufficient in areas where the gap between the mask sheet and the substrate is large (shadow areas).
[0005] The present disclosure provides a film forming apparatus and a mask sheet displacement method that improves adhesion between a mask sheet and a substrate.
[0006] In order to solve the above-mentioned problems, a film formation apparatus according to one embodiment of the present disclosure is a film formation apparatus that forms a film of a film formation material on a substrate, and includes a mask sheet, a moving member that moves the substrate and the mask sheet in a direction that brings them closer to each other, and a displacement mechanism that supports the peripheral region of the mask sheet and displaces the peripheral region in the direction of the substrate by pressing the mask sheet against the substrate in response to the action of the moving member.
[0007] In order to solve the above-mentioned problems, a method for displacing a mask sheet according to one embodiment of the present disclosure is a method for displacing a mask sheet in a film forming apparatus that forms a film of a film forming material on a substrate, and includes the steps of preparing a mask sheet and a moving member that moves the substrate and the mask sheet in a direction that brings them closer to each other, and displacing the peripheral region of the mask sheet in the direction where the substrate is located by pressing the substrate against the mask sheet with the moving member.
[0008] 1 shows a schematic cross-sectional view of a film forming apparatus according to the present disclosure; FIG. 2 shows a perspective view of a main part of the film forming apparatus; FIG. 3 is a schematic diagram showing a state when a mask sheet is pressed against a substrate due to the operation of a stage; FIG. 4 shows a schematic cross-sectional view of a mask frame having a concave cross-section and a displacement mechanism fixed to the mask frame; FIG. 5 is a diagram showing a formation process of the displacement mechanism; FIG. 6 shows a schematic perspective view of a mask frame supporting the displacement mechanism; FIG. 7 shows a schematic perspective view of a mask sheet and a displacement mechanism; FIG. 8 is a diagram for explaining the operation of the displacement mechanism; and FIG. 9 is a flowchart for explaining a method of displacing a mask sheet.
[0009] The following describes an embodiment of the present disclosure with reference to Figures 1 to 9. For the sake of convenience, components having the same functions as those described in a specific embodiment will be denoted by the same reference numerals, and their description may be omitted.
[0010] 1 shows a schematic cross-sectional view of a film forming apparatus 1 according to the present disclosure. In FIG. 1, the vertical direction of the drawing is defined as the Z-axis direction. In addition, in the Z-axis direction, the side on which gravity is applied is referred to as the lower side (lower side of the drawing), and the opposite side is referred to as the upper side (upper side of the drawing).
[0011] The film formation apparatus 1 is a film formation apparatus that forms a film of a film formation material on a substrate 30. The film formation apparatus 1 may be, but is not limited to, a CVD (Chemical Vapor Deposition) apparatus, a sputtering apparatus, a vacuum deposition apparatus, or the like. The film formation apparatus 1 has a vacuum chamber (not shown) that is evacuated by a vacuum pump (not shown), and the substrate 30 is transported into the vacuum chamber. The film formation apparatus 1 includes a mask sheet 10, a mask frame 11, a drive shaft 13, a stage 14, and a displacement mechanism 20.
[0012] The mask sheet 10 is used to form a specific pattern on a substrate 30. The mask sheet 10 is supported by a displacement mechanism 20 (described later), and the displacement mechanism 20 is supported by a mask frame 11.
[0013] The mask frame 11 has a rectangular shape in plan view that is slightly larger than the mask sheet 10. The plan view refers to the view from a direction perpendicular to the main surface of the mask sheet 10 (i.e., a direction parallel to the Z axis).
[0014] The drive unit shaft 13 extends in the Z-axis direction and supports the mask frame 11 at the upper end side of the Z-axis. The drive unit shaft 13 may support the mask frame 11 so that it can move in the vertical direction. In this case, the drive unit shaft 13 moves the displacement mechanism 20 supported by the mask frame 11 in the vertical direction, and therefore can also be said to be a moving member that moves the mask sheet 10 and the substrate 30 in a direction that brings them closer to each other.
[0015] The stage 14 supports the substrate 30. The stage 14 may support the substrate 30 movably in the direction of the mask sheet 10. In this case, the stage 14 can also be said to be a moving member that moves the mask sheet 10 and the substrate 30 in a direction that brings them closer to each other. In the following description, it is assumed that the stage 14 supports the substrate 30 movably in the direction of the mask sheet 10.
[0016] The displacement mechanism 20 is supported by the mask frame 11 and supports the peripheral region of the mask sheet 10. The displacement mechanism 20 displaces the peripheral region of the mask sheet 10 in the direction toward the substrate 30 as the mask sheet 10 is pressed against the substrate 30 by the operation of the stage 14.
[0017] 2 is a perspective view of a main part of the film forming apparatus 1. As shown in FIG. 2, the film forming apparatus 1 has, but is not limited to, a plurality of displacement mechanisms 20 arranged at regular intervals. Each of the plurality of displacement mechanisms 20 supports a peripheral region of the mask sheet 10. Although not shown, the displacement mechanisms 20 may be realized by a configuration in which the displacement mechanisms 20 are provided only at each of the four corners of the rectangular mask sheet 10. Depending on the size of the mask sheet 10, the mask sheet 10 can be supported by four displacement mechanisms 20, thereby reducing the number of displacement mechanisms 20.
[0018] Fig. 3 is a schematic diagram showing the state when the mask sheet 10 is pressed against the substrate 30 in response to the operation of the stage 14. Reference numeral 300 in Fig. 3 is a schematic cross-sectional view of the film forming apparatus 1 when the mask sheet 10 is pressed against the substrate 30 in response to the operation of the stage 14. Reference numeral 301 in Fig. 3 is an enlarged view of a main part of region A in the drawing indicated by reference numeral 300, and is a schematic diagram showing the state of the displacement mechanism 20 when the mask sheet 10 is pressed against the substrate 30 in response to the operation of the stage 14.
[0019] 3, the substrate 30 comes into contact with the mask sheet 10 and presses the mask sheet 10 upward due to the operation of the stage 14, which has moved upward from the state shown in FIG. 1. Since the mask sheet 10 is supported by the displacement mechanism 20, an upward force is applied to the displacement mechanism 20.
[0020] 3, the displacement mechanism 20 is composed of a movable member 21, a shaft 22, and a spring 23. As shown in the figure, the movable member 21 adheres to the peripheral region of the mask sheet 10 by welding or the like. In the example shown in the figure, the movable member 21 has a rectangular parallelepiped shape, and although not limited thereto, adheres to the mask sheet 10 on its upper surface.
[0021] FIG. 4 shows a schematic cross-sectional view of the mask frame 11 having a concave cross section and the displacement mechanism 20 fixed to the mask frame 11.
[0022] Referring to FIG. 4, the mask frame 11 has a concave cross section, and the displacement mechanism 20 is fixed inside the concave section.
[0023] More specifically, the movable member 21 of the displacement mechanism 20 has a through-hole 21A that passes through the movable member 21 in the Z-axis direction, and a shaft 22 is inserted into the through-hole 21A.
[0024] The shaft 22 is a rod-shaped member inserted in the Z direction through a through-hole 21A formed in the movable member 21. The shaft 22 supports the movable member 21 so that it can move in the up and down direction. Both the upper and lower ends of the shaft 22 are fixed to surfaces of the mask frame 11 that are perpendicular to the Z-axis direction.
[0025] The spring 23 is inserted into the shaft 22 above the movable member 21 between the mask frame 11 and the movable member 21 .
[0026] 5 is a diagram showing the process of forming the displacement mechanism 20. Reference numeral 500 in FIG. 5 indicates the preparation of the movable member 21 having the through-hole 21A. Reference numeral 501 in FIG. 5 indicates the state after the shaft 22 has been inserted into the through-hole 21A of the movable member 21. Reference numeral 502 in FIG. 5 indicates the insertion of the spring 23 onto the shaft 22 on the upper side of the movable member 21. The displacement mechanism 20 is formed in this manner, and is then fixed to the mask frame 11.
[0027] 6 is a schematic perspective view of the mask frame 11 that supports the displacement mechanism 20. As described above, the mask frame 11 supports both the upper and lower ends of the shaft 22 of the displacement mechanism 20. The mask frame 11 has an outer shape that is slightly larger than the mask sheet 10 in a plan view.
[0028] 7 shows a schematic perspective view of the mask sheet 10 and the displacement mechanisms 20. Each displacement mechanism 20 brings the peripheral region of the mask sheet 10 into close contact with a movable member 21 to support the mask sheet 10. A plurality of displacement mechanisms 20 are provided at regular intervals, although this is not a limitation, along the four sides of the rectangular mask sheet 10. The number of displacement mechanisms 20 may be determined appropriately depending on the size of the mask sheet 10.
[0029] 8 is a diagram illustrating the operation of the displacement mechanism 20. The diagram indicated by reference numeral 800 in FIG. 8 shows a state before the stage 14 moves the substrate 30 upward (referred to as "State 1"). The diagram indicated by reference numeral 801 in FIG. 8 shows a state when the stage 14 is moving the substrate 30 upward (referred to as "State 2"). The diagram indicated by reference numeral 802 in FIG. 8 shows a state when the stage 14 has moved the substrate 30 upward, the substrate 30 has come into contact with the mask sheet 10, and the substrate 30 is pressing the mask sheet 10 upward (referred to as "State 3").
[0030] In state 1 and state 2, the substrate 30 is not in contact with the mask sheet 10, and the displacement mechanism 20 has not started to operate.
[0031] In State 3, the stage 14 moves the substrate 30 upward, causing the substrate 30 to come into contact with the mask sheet 10 and press the mask sheet 10 upward. As a result, the movable member 21, which is in close contact with the mask sheet 10, also moves upward ("arrow F1"). When the movable member 21 moves upward, it presses the spring 23 provided on the upper surface of the movable member 21 upward. Because the upper end of the spring 23 is in contact with the mask frame 11, the spring 23 applies a downward restoring force to the movable member 21 that is generated as the movable member 21 moves upward ("arrow F2").
[0032] The film forming apparatus 1 can use a magnet that performs the same function as the spring 23 instead of the spring 23. Specifically, a first magnet is provided on the upper surface of the movable member 21. Furthermore, a second magnet that is different from the first magnet is provided within the surface of the mask frame 11 that faces the upper surface of the movable member 21. The first magnet and the second magnet are configured so that when they approach each other, a repulsive force acts to repel each other. This allows the film forming apparatus 1 to use a magnet that performs the same function as the spring 23 instead of the spring 23.
[0033] In this way, the film forming apparatus 1 has a free end (movable) for the connection between the mask sheet 10 and the mask frame 11. This increases the degree of freedom of the mask sheet 10 in the Z direction when it comes into contact with the substrate 30.
[0034] Furthermore, with regard to the displacement mechanism 20, the movable member 21 is movable in the Z direction, but its movement in a plane perpendicular to the Z direction (hereinafter referred to as the "XY plane") is restricted. By providing a plurality of displacement mechanisms 20 having such a configuration in the peripheral region of the mask sheet 10, the film forming apparatus 1 can improve the adhesion between the mask sheet 10 and the substrate 30 in the Z direction while ensuring the alignment accuracy of the mask sheet 10 in the XY plane.
[0035] According to the above configuration, even if a gap would conventionally occur between the peripheral region of the mask sheet 10 and the substrate 30, the film formation apparatus 1 according to the present disclosure can apply a force that presses the peripheral region of the mask sheet 10 downward by the displacement mechanism 20. As a result, the film formation apparatus 1 can maintain close contact between the mask sheet 10 and the substrate 30 even in the peripheral region of the mask sheet 10.
[0036] Typically, the stage 14 has micron-level unevenness within its surface, although this varies from stage to stage. In this regard, the film formation apparatus 1 can reduce the effect of the individual differences in unevenness present within the surface of the stage 14 and improve the adhesion between the peripheral region of the substrate 30 and the mask sheet 10. In other words, the adhesion between the peripheral region of the substrate 30 and the mask sheet 10 can be flexibly improved in accordance with the individual differences in unevenness of the stage 14. This effect becomes more advantageous as the substrate 30 becomes larger.
[0037] (Method) FIG. 9 is a flowchart illustrating a method for displacing the mask sheet 10. As shown in FIG.
[0038] First, in S10, the mask sheet 10 and the stage 14 (or the drive shaft 13) that moves the substrate 30 and the mask sheet 10 in a direction that brings them closer to each other are prepared.
[0039] Next, in S20, the stage 14 (or the drive unit shaft 13) presses the substrate 30 against the mask sheet 10, thereby displacing the mask sheet 10 in the direction in which the substrate 30 is positioned.
[0040] According to the above, a method for displacing the mask sheet 10 that achieves the above-mentioned various effects can be realized.
[0041] The method for displacing the mask sheet 10 according to the present disclosure can also be expressed as follows.
[0042] A method for displacing a mask sheet in a vapor deposition device that deposits a vapor deposition material on a substrate includes the steps of preparing a mask sheet, a stage that movably supports the substrate in the direction of the mask sheet, a movable member that movably supports the mask sheet in the vertical direction when the mask sheet side is the upper side and the substrate side is the lower side, and a biasing member that biases the movable member with a downward restoring force that occurs as the movable member moves upward, and displacing a peripheral region of the mask sheet in the direction where the substrate is located by pressing the substrate against the mask sheet with the stage.
[0043] The present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the disclosed technical means are also included in the technical scope of the present disclosure. Furthermore, new technical features can be formed by combining the disclosed technical means.
[0044] REFERENCE SIGNS LIST 1 film forming apparatus 10 mask sheet 11 mask frame 13 drive shaft 14 stage 20 displacement mechanism 21 movable member 22 shaft 23 spring 30 substrate
Claims
1. A film formation apparatus for forming a film of a film material on a substrate, comprising: a mask sheet; a moving member that moves the substrate and the mask sheet in a direction that brings them closer to each other; and a displacement mechanism that supports a peripheral region of the mask sheet and displaces the peripheral region in the direction of the substrate by pressing the mask sheet against the substrate in response to the action of the moving member.
2. The film forming apparatus of claim 1, wherein, when the mask sheet side is the upper side and the substrate side is the lower side, the displacement mechanism comprises: a movable member that supports the mask sheet so that it can be moved in the vertical direction; and a biasing member that biases the movable member with a downward restoring force that occurs as the movable member moves upward.
3. The film deposition apparatus according to claim 2, wherein the biasing member biases the movable member with the restoring force, thereby displacing the peripheral region of the mask sheet toward the substrate.
4. The film deposition apparatus according to claim 2 or 3, wherein the biasing member is a spring or a magnet.
5. A film forming apparatus according to any one of claims 1 to 4, wherein the displacement mechanisms are provided at the four corners of the rectangular mask sheet.
6. The film forming apparatus according to any one of claims 1 to 5, wherein the film forming apparatus is a CVD (Chemical Vapor Deposition) apparatus.
7. A method for displacing a mask sheet in a film forming apparatus that forms a film of a film forming material on a substrate, comprising: a step of preparing a mask sheet and a moving member that moves the substrate and the mask sheet in a direction that brings them closer to each other; and a step of pressing the substrate against the mask sheet with the moving member, thereby displacing the peripheral region of the mask sheet in the direction that the substrate is located.
Citation Information
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