Package

Abstract

The purpose of the present invention is to integrate a light-emitting element and a light-receiving element while suppressing thermal interference between the light-emitting element and the light-receiving element.　A package (100) is provided with: a substrate (120) on which a light-receiving element (111) is mounted; a base (130) on which a light-emitting element (142) is mounted and which is separated from the substrate (120); and a connection member (125) that connects the base (130) and the substrate (120). The connection member (125) may be extended in the horizontal direction from above the substrate (120) and connected to the base (130). The connection member (125) may be formed around the light-receiving element (111) on the substrate (120). The thermal conductivity of the connection member (125) may be 0.04 W / mK or less. The connection member (125) may be connected to the side surface of the base (130).

Description

package

[0001] The present technology relates to a package, and more particularly to a package in which a light emitting element and a light receiving element are integrated.

[0002] In order to reduce the space required for optical devices, there are techniques for integrating a light emitting element and a light receiving element. For example, a technique is disclosed in which a metal base on which a light receiving / emitting element is mounted is fitted into a hollow portion provided in a wiring substrate (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2005-347486

[0004] However, in the above-mentioned conventional technology, there is a risk that the heat generated by the light emitting element will affect the characteristics of the light receiving element because there is a large amount of thermal interference between the light emitting element and the light receiving element.

[0005] The present technology was developed in view of such circumstances, and aims to enable integration of a light-emitting element and a light-receiving element while suppressing thermal interference between the light-emitting element and the light-receiving element.

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof is a package including a substrate on which a light receiving element is mounted, a base on which a light emitting element is mounted and spaced apart from the substrate, and a connecting member connecting the base and the substrate, thereby achieving the effect of integrating the light receiving element and the light emitting element while suppressing thermal interference between the light receiving element and the light emitting element.

[0007] In the first aspect, the thermal conductivity of the connection member may be 0.04 W / mK or less. This provides the effect of integrating the base and the substrate while suppressing heat flow from the base to the substrate.

[0008] In the first aspect, the connecting member may extend horizontally from the substrate and be connected to the base, thereby integrating the base and the substrate and aligning the light-receiving surface of the light-receiving element with the light-emitting surface of the light-emitting element.

[0009] In the first aspect, the connecting member may be connected to a side surface of the base, thereby preventing the substrate from blocking light emission from the light-emitting element and integrating the base and the substrate.

[0010] In the first aspect, the connecting member may be connected to the upper surface of the base, and the base and the substrate may be horizontally adjacent to each other with a gap therebetween, thereby achieving the effect of mounting the base and the substrate on the same mounting surface while separating and integrating the base and the substrate.

[0011] In addition, in the first aspect, the gap may further include a low thermal conductor having a thermal conductivity lower than that of the substrate, thereby suppressing heat flow from the base to the substrate while mounting the base and the substrate on the same mounting surface.

[0012] In the first aspect, the thermal conductivity of the low thermal conductor may be 0.02 W / mK or less, thereby providing an effect of integrating the base and the substrate while suppressing heat flow from the base to the substrate.

[0013] In addition, in the first aspect, the device may further include a thermal conductor embedded in the substrate below the connecting member and having a higher thermal conductivity than the substrate, thereby improving heat dissipation from the substrate while integrating the base and the substrate via the connecting member.

[0014] In the first aspect, the connecting member may be formed on the substrate around the light receiving element, thereby providing an effect of sealing the light receiving element while supporting a transparent member on the light receiving element with the connecting member.

[0015] In the first aspect, the material of the base may be metal and the material of the connecting member may be resin, thereby suppressing thermal interference between the light receiving element and the light emitting element and improving heat dissipation from the light emitting element.

[0016] The second aspect of the present invention is a package including a substrate on which a light-receiving element is mounted, a base on which a light-emitting element is mounted, and a connecting member connecting the base and the substrate, the connecting member having a lower thermal conductivity than the substrate, thereby suppressing thermal interference between the light-receiving element and the light-emitting element and integrating the light-receiving element and the light-emitting element.

[0017] In the second aspect, the thermal conductivity of the connection member may be 0.04 W / mK or less. This provides the effect of integrating the base and the substrate while suppressing heat flow from the base to the substrate.

[0018] In addition, in the second aspect, the connecting member may extend horizontally from the substrate and be connected to the base, thereby integrating the base and the substrate and aligning the direction of the light-receiving surface of the light-receiving element with the direction of the light-emitting surface of the light-emitting element.

[0019] In the second aspect, the connecting member may be formed on the substrate around the light receiving element, thereby providing an effect of sealing the light receiving element while supporting a transparent member on the light receiving element with the connecting member.

[0020] The third aspect is a package including a base on which a light-emitting element is mounted, and a substrate on which the base and a light-receiving element are mounted on the same surface while being spaced apart from each other, thereby suppressing thermal interference between the light-receiving element and the light-emitting element and allowing the light-receiving element and the light-emitting element to be mounted on the same substrate.

[0021] In addition, in the third aspect, the light receiving element and the light emitting element may further include a heat sink attached to the base, thereby improving the dissipation of heat from the light emitting element and allowing the light receiving element and the light emitting element to be mounted on the same substrate.

[0022] In addition, in the third aspect, the light receiving element may further include a first frame member spaced apart from the base and arranged around the light receiving element, and a first transparent member arranged on the first frame member, thereby providing the effect of sealing the light receiving element while supporting the first transparent member on the light receiving element with the first frame member.

[0023] In addition, in the third aspect, the light emitting device may further include a flexible substrate disposed along the base and electrically connecting the light emitting element and the substrate, thereby providing the effect of allowing the light emitting element to be disposed on the substrate via the base, while the wiring connected to the light emitting element is connected to the substrate.

[0024] In addition, in a third aspect, the light-emitting device may include a second frame member disposed around the light-emitting element and a second transparent member disposed on the second frame member, and the flexible substrate may be electrically connected to the substrate through the second frame member. This provides the effect of sealing the light-emitting element with the second frame member while electrically connecting the flexible substrate connected to the light-emitting element to the substrate.

[0025] 10 is a diagram illustrating an example of a configuration of a package according to a first embodiment. 11 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the first embodiment. 12 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the first embodiment. 13 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the first embodiment. 14 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the first embodiment. 15 is a diagram illustrating an example of a configuration of a package according to a second embodiment. 16 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the second embodiment. 17 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the second embodiment. 18 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the third embodiment. 19 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the third embodiment. 20 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the third embodiment. 21 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the fourth embodiment. 22 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the fourth embodiment. 23 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the fifth embodiment. 24 is a cross-sectional view illustrating an example of a configuration of a package according to the sixth embodiment. 25 is a cross-sectional view illustrating an example of a configuration of a package according to the seventh embodiment. 26 is a cross-sectional view illustrating an example of a configuration of a package according to the eighth embodiment. 27 is a plan view illustrating an example of a configuration of a package according to the ninth embodiment. 28 is a diagram illustrating an example of a configuration of a package according to a tenth embodiment. 29 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the tenth embodiment. 30 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the ten It is a figure which shows the structural example of the package based on twelfth embodiment. It is a figure which shows the structural example of the package based on thirteenth embodiment. It is a block diagram which shows the schematic structural example of the vehicle control system. It is an explanatory diagram which shows an example of the installation position of the imaging part.

[0026] Hereinafter, modes for implementing the present technology (hereinafter referred to as embodiments) will be described. The descriptions will be made in the following order: 1. First embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up is connected to a base on which a light-emitting element is mounted via a molding material) 2. Second embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up is connected to a base on which a light-emitting element is mounted via a molding material, and a reflective material is provided on the base) 3. Third embodiment (an example in which a mounting substrate on which a light-receiving element is mounted by flip-chip mounting is connected to a base on which a light-emitting element is mounted via a molding material) 4. Fourth embodiment (an example in which a mounting substrate on which a light-receiving element is mounted by flip-chip mounting is connected to a base on which a light-emitting element is mounted via a molding material, and a reflective material is provided on the base) 5. Fifth embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up is connected to a base on which a light-emitting element is mounted via a molding material, and the mounting substrate extends below the base) 6. 6. Sixth embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up and a base on which a light-emitting element is mounted are connected via a molding material, and a heat insulating section is provided between the mounting substrate and the base) 7. Seventh embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up and a base on which a light-emitting element is mounted are connected via a molding material, and a heat dissipation section is provided on the base) 8. Eighth embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up and a base on which a vertically emitting light-emitting element is mounted are connected via a molding material) 9. Ninth embodiment (an example in which a mounting substrate on which a light-receiving element is mounted face-up and a base on which a light-emitting element is mounted are connected via a molding material, and the connection position between the mounting substrate and the base is changed) 10. Tenth embodiment (an example in which a base on which a light-emitting element is mounted face-up is placed on a mounting substrate on which a light-receiving element is mounted face-up, and the sealing material for the light-receiving element and the sealing material for the light-emitting element are spaced apart) 11. 11. Eleventh embodiment (an example in which a base on which a light-emitting element is mounted is disposed on a mounting substrate on which a light-receiving element is mounted face-up, and a heat sink is provided on the base) 12. Twelfth embodiment (an example in which a base on which a light-emitting element is mounted is disposed on a mounting substrate on which a light-receiving element is mounted face-up, the light-emitting element is sealed with a sealing material, and the light-emitting element is connected to the mounting substrate via a flexible substrate)13. Thirteenth embodiment (an example in which a base on which a light-emitting element is mounted is disposed on a mounting substrate on which a light-receiving element is mounted face-up, the light-emitting element is sealed with a header, and the light-emitting element is connected to the mounting substrate via a flexible substrate) 14. Example of application to a moving body

[0027] 1. First Embodiment Fig. 1 is a diagram showing an example of the configuration of a package according to a first embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 100, and "b" in the figure is a plan view showing the example of the configuration of the package 100. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure. Furthermore, the drawings used in the following description may differ in scale and shape from the actual structure to make each configuration easier to understand.

[0028] In the figure, the package 100 includes a mounting substrate 120, a base 130, and a sealing material 125. The mounting substrate 120 and the base 130 are connected to each other via the sealing material 125. The mounting substrate 120 is an example of a substrate as defined in the claims. The sealing material 125 is an example of a connecting member as defined in the claims.

[0029] The chip 111 is mounted on the mounting substrate 120. The mounting substrate 120 may be a ball grid array (BGA), a pin grid array (PGA), or a land grid array (LGA). In this case, terminals 123 may be drawn out from the rear surface of the mounting substrate 120. The terminals 123 may be pins standing upright on the rear surface of the mounting substrate 120. The base material of the mounting substrate 120 may be, for example, ceramic or resin. Wiring 121 and bonding pads 122 are formed on the mounting substrate 120. The mounting substrate 120 may be a multilayer substrate. In this case, vias used for interlayer connection may be formed in the mounting substrate 120. The bonding pads 122 are arranged on the surface of the mounting substrate 120. Bonding wires 116 can be connected to the bonding pads 122.

[0030] A thermal conductor 124 may be embedded in the mounting substrate 120. The thermal conductivity of the thermal conductor 124 may be higher than the thermal conductivity of the base material of the mounting substrate 120. The thermal conductor 124 may penetrate the mounting substrate 120 in the thickness direction. The thermal conductor 124 is preferably disposed near the base 130. In this case, the thermal conductor 124 can be disposed under the sealing material 125. The thermal conductor 124 may be in contact with the sealing material 125. The thermal conductor 124 is preferably disposed far from the chip 111. The material of the thermal conductor 124 may be the same as the material of the wiring 121. The material of the thermal conductor 124 may be graphite or a composite material containing graphite. The composite material containing graphite may be formed by bonding a metal or ceramic to graphite or by plating the graphite.

[0031] The chip 111 is mounted face up on the mounting substrate 120. The chip 111 can be bonded to the mounting substrate 120 via a die bond material 127. The die bond material 127 may be a paste material such as Ag paste, or a solder material such as Sn. At this time, heat generated from the chip 111 is dissipated mainly via the heat dissipation path P1.

[0032] The chip 111 is connected to the mounting substrate 120 via bonding wires 116. At this time, pad electrodes 113 to which the bonding wires 116 are connected can be formed on the chip 111. The bonding wires 116 can be made of a metal such as Au or Al.

[0033] A light receiving element is formed on the chip 111. The light receiving element may be an image sensor such as a charged coupled device (CCD) sensor, a complementary metal-oxide semiconductor (CMOS) sensor, or an event-based vision sensor. The light received by the image sensor may be visible light, near infrared light (NIR), short wavelength infrared light (SWIR), ultraviolet light, or X-rays. The substrate material used for the chip 111 may be Si, GaAs, SiC, GaN, InGaAs, InP, InGaAsP, or the like.

[0034] For example, a CMOS image sensor can be formed on the chip 111. In this case, a light receiving region 112 is provided on the chip 111. In the light receiving region 112, pixels and pixel transistors are arranged in a matrix along the row and column directions. Photodiodes or SPADs (Single Photon Avalanche Diodes) may be formed on the pixels. A color filter 114 is formed on the light receiving region 112 for each pixel. An on-chip lens 115 is formed on the color filter 114 for each pixel. The color filter 114 and the on-chip lens 115 are made of a material such as SiO ２ An insulating film such as SiN or SiCN, or a transparent resin such as acrylic or polycarbonate can be used. The color filter 114 may contain a pigment. The color filter 114 may have, for example, a Bayer array or a quad-Bayer array. The color filter 114 may include an RGB filter, a complementary color filter, or a white filter. A lens, a color splitter, or a deflector made of a metasurface may be formed on the light receiving region 112.

[0035] A transparent substrate 126 is disposed above the chip 111 at a distance. At this time, the transparent substrate 126 is supported on the mounting substrate 120 via a sealing material 125 and bonded to the mounting substrate 120. The transparent substrate 126 may be a glass substrate, a quartz substrate, or a transparent resin substrate such as acrylic or polycarbonate. The transparent substrate 126 is made of Al, depending on the wavelength of light received by the chip 111. ２ O ３ , CaF ２ , MgF ２ Alternatively, LiF or the like may be used.

[0036] Chips 142 and 143 are mounted on the base 130. In this case, the chip 142 may be mounted on the base 130 via a submount 141. Here, the base 130 may be provided with a vertical surface on which the submount 141 is mounted and an inclined surface on which the chip 143 is mounted. In this case, heat generated from the chip 142 is dissipated mainly via heat dissipation path P2. Heat generated from the chip 142 can also be dissipated via heat dissipation path P3.

[0037] The chip 142 is connected to the submount 141 via a bonding wire 144. At this time, electrodes to which the bonding wire 144 is connected may be formed on the chip 142. The submount 141 is connected to the terminal 132 via a bonding wire 145. At this time, electrodes to which the bonding wires 144 and 145 are connected may be formed on the submount 141.

[0038] The base 130 and the submount 141 can be made of a material with better thermal conductivity than the base material of the mounting substrate 120. The base 130 can be made of a metal such as Al or Cu. In this case, a plating layer of Ni, Au, or the like can be formed on the surface of the base 130. Terminals 132 and 133 are formed on the base 130. The terminal 132 can penetrate the base 130 and protrude from the surface of the base 130. In this case, the terminal 132 can be insulated from the base 130 via an insulating layer 131 embedded in the base 130. The insulating layer 131 can be made of, for example, low-melting-point glass. The terminals 132 and 133 can stand upright on the back surface of the base 130.

[0039] A light-emitting element is formed on the chip 142. The light-emitting element is, for example, an edge-emitting semiconductor laser. The light-emitting element may include a wavelength conversion element or a light modulation element. The light emitted by the light-emitting element may be infrared light, red light, green light, or blue light. The material used for the light-emitting element may be a semiconductor such as GaAs, GaAlAs, InGaAsP, GaN, or ZnSe.

[0040] A light receiving element is formed on chip 143. The light receiving element is, for example, a photodiode. In this case, the light receiving element can be used to monitor light emitted from the light emitting element formed on chip 142. The material used for the light receiving element may be Si, GaAs, SiC, GaN, InGaAs, InP, InGaAsP, or the like.

[0041] A transparent substrate 152 is disposed on an end surface of the chip 142 at a distance. At this time, the transparent substrate 152 is supported on the base 130 via a header 151. The transparent substrate 152 can transmit light emitted from a light-emitting element formed on the chip 142.

[0042] The header 151 is bonded onto the base 130. Here, a bonding surface of the header 151 can be formed on the periphery of the base 130. An opening KA is formed on the upper surface of the header 151. The opening KA can be positioned at the emission position of the light-emitting element formed on the chip 142. In this case, the opening KA can be closed by a transparent substrate 152. The transparent substrate 152 can be fixed to the upper surface of the header 151 via a bonding material 153. The header 151 may have a cylindrical outer shape. The header 151 can be made of a metal such as Ni or Cu. The bonding material 153 can be made of a low-melting-point glass. In this case, by bonding the header 151 to the base 130, a hermetic seal can be achieved, ensuring higher airtightness than with resin-based materials.

[0043] The encapsulant 125 is positioned between the mounting substrate 120 and the transparent substrate 126. In this case, the encapsulant 125 may support the transparent substrate 126 on the chip 111 while spacing it apart. The encapsulant 125 may be continuously disposed along the outer periphery of the mounting substrate 120. In this case, the inner periphery of the encapsulant 125 may be positioned outside the bonding pads 122.

[0044] Furthermore, the sealing material 125 connects the mounting substrate 120 and the base 130. For example, the sealing material 125 may extend horizontally from above the mounting substrate 120 and be connected to the base 130. In this case, the sealing material 125 may be connected to the side surface of the base 130. Here, the sealing material 125 can be spaced apart from the mounting substrate 120 and support the base 130 on the side of the mounting substrate 120. The mounting substrate 120 and the base 130 may be integrated based on molding of the sealing material 125. In this case, the upper surface of the sealing material 125 can be configured as a molded surface.

[0045] The encapsulant 125 can have heat insulating properties that prevent heat generated by the chip 142 from being transmitted to the chip 111. In this case, the thermal conductivity of the encapsulant 125 is preferably 0.04 W / mK or less. The encapsulant 125 may be a molding resin or a potting resin. The material of the encapsulant 125 may be a thermosetting resin or a UV-curable resin. For example, the material of the encapsulant 125 may be a silicone-based resin, a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin. The encapsulant 125 may contain an inorganic or organic filler to improve reliability. The filler material may be glass. The encapsulant 125 may be blackened to reduce flare on the light-receiving region 112. For example, the encapsulant 125 may contain a black pigment such as carbon black or a filler such as carbon fiber.

[0046] 2 to 5 are diagrams showing an example of a method for manufacturing a package according to the first embodiment. Note that Fig. 2 and Fig. 3 show a method for mounting a light-emitting element and a light-receiving element on a mounting substrate 120 and a base 130 connected to each other via a sealing material 125. Fig. 4 and Fig. 5 show a method for connecting the mounting substrate 120 and the base 130 to each other via the sealing material 125 based on molding. Note that Fig. 4 and Fig. 5 show a process for connecting the mounting substrates 120 and the bases 130 of two packages 100.

[0047] 2A, the mounting substrate 120 and the base 130 are connected via the sealing material 125. Then, the mounting substrate 120 and the base 130 connected via the sealing material 125 are mounted on a jig JG. The jig JG has an opening KA0 into which the terminals 123, 132, and 133 can be inserted. At this time, the terminals 123, 132, and 133 can be inserted into the opening KA0, and the bottom surface of the mounting substrate 120 can be brought into contact with the top surface of the jig JG.

[0048] 2B, chip 142 is mounted on base 130 via submount 141, and chip 143 is mounted on base 130. Then, chip 142 is connected to submount 141 via bonding wire 144, and submount 141 is connected to terminal 132 via bonding wire 145.

[0049] 3A, the header 151 to which the transparent substrate 152 is fixed is bonded onto the base 130. A hermetic seal can be applied to bond the header 151 and the base 130.

[0050] 3B, the chip 111 is mounted on the mounting substrate 120 via the die bond material 127. Then, the chip 111 is connected to the mounting substrate 120 via the bonding wires 116.

[0051] Next, as shown in FIG. 1, a transparent substrate 126 is placed on the chip 111 and bonded to a sealing material 125 .

[0052] Before the steps of FIGS. 2 and 3, the mounting substrate 120 and the base 130 can be connected to each other via a sealing material 125 .

[0053] At this time, as shown in Fig. 4a, molds DK and UK are arranged above and below the mounting substrate 120 and the base 130. The mold DK has an upper surface UM and a lower surface DM. The step between the upper surface UM and the lower surface DM can correspond to the thickness of the mounting substrate 120. An opening K1 is formed in the lower surface DM, into which the terminal 123 can be inserted. An opening K2 is formed in the upper surface UM, into which the terminals 132 and 133 can be inserted.

[0054] The mold UK is provided with a cavity CAV and a partition PA. The cavity CAV can accommodate the mounting surface of the base 130 on which the submount 141 is mounted and the terminals 132 protruding from the base 130. The cavity CAV can be sealed by contacting the mold UK with the upper surface of the peripheral portion of the base 130. In this case, the step of the cavity CAV can be positioned inside the base 130. The partition PA can be positioned along the inner peripheral surface of the encapsulant 125. In this case, the partition PA can separate the space between the mounting substrate 120 and the transparent substrate 126 from the encapsulant 125. The height of the partition PA can correspond to the thickness of the peripheral portion of the base 130. The inclination of the partition PA can correspond to the inclination of the inner peripheral surface of the encapsulant 125. Here, a mold surface MD can be provided between the partition PA and the cavity CAV.

[0055] Next, as shown in FIG. 4B, the mounting substrate 120 and the base 130 are placed on the mold DK, and then the mold UK is lowered to sandwich the mounting substrate 120 and the base 130 between the molds DK and UK. At this time, the terminal 123 can be inserted into the opening K1 to bring the bottom surface of the mounting substrate 120 into contact with the lower surface DM. Furthermore, the terminals 132 and 133 can be inserted into the opening K2 to bring the bottom surface of the base 130 into contact with the upper surface UM. The tip of the partition PA can be brought into contact with the top surface of the mounting substrate 120, and the end of the mold surface MD can be brought into contact with the upper surface of the periphery of the base 130. At this time, the mold resin used for the encapsulant 125 can be injected from the outside and filled into the space SP surrounded by the mold surface MD, the side surface of the base 130, the top surface of the mounting substrate 120, and the partition PA.

[0056] 5A, a molding resin is injected into the space SP and cured to form the sealing material 125 on the mounting substrate 120. At this time, the sealing material 125 can be bonded to the side surface of the base 130 while preventing the sealing material 125 from entering the cavity CAV. Note that the molding may be performed by transfer molding or compression molding.

[0057] 5B, the sealing material 125 bonded to the side surface of the base 130 is formed on the mounting substrate 120 in a lump, and then the molds UK and DK are removed. Then, the sealing material 125 bonded to the side surface of the base 130 and the mounting substrate 120 are diced into individual packages 100.

[0058] As described above, in the first embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 130 on which the light emitting element is mounted are connected via the sealing material 125. At this time, the mounting substrate 120 and the base 130 can be spaced apart from each other. This makes it possible to integrate the light receiving element and the light emitting element while suppressing thermal interference between them. Therefore, it is possible to reduce the mounting area of ​​the light receiving element and the light emitting element while suppressing the influence of heat generated by the light emitting element on the characteristics of the light receiving element.

[0059] Although the first embodiment described above shows an example in which the mounting substrate 120 and the base 130 are bonded via the sealing material 125, the mounting substrate 120 and the base 130 may be bonded to the sealing material 125 via an adhesive. In order to improve the thermal insulation of heat generated by the light emitting element, a heat-cut insulating paint such as a ceramic vacuum balloon may be applied to the side surfaces of the mounting substrate 120, the sealing material 125, the base 130, the header 151, etc.

[0060] 2. Second Embodiment In the first embodiment described above, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 130 on which the light emitting element is mounted are connected at a distance via the sealing material 125. In this second embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base on which the light emitting element is mounted are connected at a distance via the sealing material, and a reflective material is provided on the base.

[0061] 6 is a diagram showing an example of the configuration of a package according to the second embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 200, and "b" in the figure is a plan view showing the example of the configuration of the package 200. "a" in the figure shows the example of the configuration cut along line B1-B2 in "b" in the figure.

[0062] In the figure, this package 200 includes a mounting substrate 220, chips 242 and 243, a base 230, a transparent substrate 252, and a submount 241, instead of the mounting substrate 120, chips 142 and 143, base 130, transparent substrate 152, and submount 141 of the first embodiment described above. Furthermore, this package 200 is obtained by removing the bonding wires 144 and 145 from the package 100 of the first embodiment described above. Furthermore, this package 200 is obtained by adding a reflective material 232 to the package 100 of the first embodiment described above. Other configurations of the package 200 of the second embodiment are similar to those of the package 100 of the first embodiment described above. Note that, although the following description will show an example in which the laser chip is flip-chip mounted, the laser chip may be connected by bump connection or wire bond connection.

[0063] The chip 111 is mounted on the mounting substrate 220. Wiring 221 is formed on the mounting substrate 220. The mounting substrate 220 may be a multilayer substrate. In this case, vias used for interlayer connection may be formed in the mounting substrate 220. Furthermore, land electrodes to which protruding electrodes such as solder balls or pillar electrodes are joined may be formed on the back surface side of the mounting substrate 220. Other configurations of the mounting substrate 220 of the second embodiment are similar to the configuration of the mounting substrate 120 of the first embodiment described above.

[0064] The base 230 is connected to the mounting substrate 120 via a sealing material 125. In this case, the sealing material 125 can support the base 230 by separating the base 230 from the mounting substrate 120. For example, the sealing material 125 may extend horizontally from above the mounting substrate 120 and be connected to the side surface of the base 230. The base 230 extends downward below the sealing material 125. Here, the height direction position of the bottom surface of the base 230 may be equal to the height direction position of the bottom surface of the mounting substrate 120. In this case, a gap is formed between the side surface of the base 230 and the side surface of the mounting substrate 120. A heat insulating member 233 may be provided in the gap between the side surface of the base 230 and the side surface of the mounting substrate 120. The thermal conductivity of the heat insulating member 233 can be lower than the thermal conductivity of the base material of the mounting substrate 120. In this case, the thermal conductivity of the heat insulating member 233 is preferably 0.02 W / mK or less. The material of the heat insulating member 233 may be, for example, a foamable resin or a resin to which a binder is added. The heat insulating member 233 may also be empty space. The heat insulating member 233 is an example of a low thermal conductor as defined in the claims.

[0065] The base 230 is divided by separators 231. For example, the separators 231 can divide the base 230 into four parts. In this case, the separators 231 can penetrate the base 230 in the thickness direction. The planar shape of the separators 231 can be a cross shape. Each of the parts of the base 230 divided by the separators 231 can be used as an electrode. The material of the separators 231 can be an insulator such as a resin.

[0066] Chips 242 and 243 are mounted on the base 230. The chips 242 and 243 may be mounted on the base 230 via a submount 241. In this case, the base 230 may have a horizontal surface on which the submount 241 is mounted. The chip 242 may be flip-chip mounted on the submount 241. In this case, electrodes to which the chips 242 and 243 are connected may be formed on the submount 241. An inclined surface may be provided around the horizontal surface of the base 230 on which the submount 241 is mounted. The inclined surface may include a curved surface. In this case, a cavity CAV2 is formed in the base 230 to accommodate the submount 241 and the chips 242 and 243. A reflective material 232 is provided on the inclined surface of the base 230. The reflective material 232 may be a reflective plate such as a mirror, or may be a reflective film. In this case, heat generated by the chip 242 is dissipated mainly via the heat dissipation path P22. Moreover, heat generated from the chip 242 can also be dissipated via the heat dissipation path P23.

[0067] The base 230 and the submount 241 may be made of a material having better thermal conductivity than the base material of the mounting substrate 120. The base 230 may be made of a metal such as Al or Cu. In this case, a plating layer of Ni, Au, or the like may be formed on the surface of the base 230.

[0068] A light-emitting element is formed on chip 242. The light-emitting element is, for example, an edge-emitting semiconductor laser. The light-emitting element may include a wavelength conversion element or an optical modulation element. A light-receiving element is formed on chip 243. The light-receiving element is, for example, a photodiode. In this case, the light-receiving element can be used to monitor the light emitted from the light-emitting element formed on chip 242.

[0069] A transparent substrate 252 is disposed above and spaced from the chip 242. At this time, the transparent substrate 252 is supported above the cavity CAV2 via the top surface of the base 130 surrounding the cavity CAV2. The transparent substrate 252 is capable of transmitting light emitted from the light-emitting element formed on the chip 242. Here, laser light is emitted horizontally from the edge-emitting semiconductor laser formed on the chip 242. Then, the laser light is reflected by the reflector 232, its direction is changed to the vertical direction, and it is emitted through the transparent substrate 252.

[0070] 7 and 8 are cross-sectional views showing an example of a method for manufacturing a package according to the second embodiment. These drawings show a method for mounting a light emitting element and a light receiving element on a mounting substrate 120 and a base 230 connected to each other via a sealing material 125.

[0071] In FIG. 7A, the mounting substrate 120 and the base 230 are connected via a sealing material 125 .

[0072] 7B, the chips 242 and 243 are mounted on the base 230 via the submount 241. At this time, the chip 242 can be flip-chip mounted.

[0073] Next, as shown in FIG. 8a, a transparent substrate 252 is bonded to the top surface of the base 230 around the cavity CAV2.

[0074] 8B, the chip 111 is mounted on the mounting substrate 120 via the die bond material 127. Then, the chip 111 is connected to the mounting substrate 120 via the bonding wires 116.

[0075] Next, as shown in FIG. 6, a transparent substrate 126 is placed on the chip 111 and bonded to a sealing material 125 .

[0076] As described above, in the second embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 230 on which the light emitting element is mounted are connected via the sealing material 125, and the reflector 232 is provided on the inclined surface of the base 230. This makes it possible to suppress the complexity of the configuration of the base 230 while emitting laser light in a direction perpendicular to the base 230, even when an edge-emitting semiconductor laser is used as the light emitting element, and also makes it possible to integrate the light receiving element and the light emitting element while suppressing thermal interference between the light receiving element and the light emitting element.

[0077] 3. Third Embodiment In the above-described first embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 130 on which the light emitting element is mounted are connected at a distance via the sealing material 125. In this third embodiment, the mounting substrate on which the light receiving element is mounted face-down and the base 130 on which the light emitting element is mounted are connected via the sealing material 125.

[0078] FIG. 9 is a cross-sectional view showing an example of the configuration of a package according to the third embodiment.

[0079] In the figure, this package 300 includes a mounting substrate 320, a chip 311, and an underfill 327 instead of the mounting substrate 120, the chip 111, and the die bond material 127 of the first embodiment described above. Also, this package 300 is obtained by removing the bonding wire 116 from the package 100 of the first embodiment described above. Other configurations of the package 300 of the third embodiment are similar to the configuration of the package 100 of the first embodiment described above.

[0080] The mounting substrate 320 and the base 130 are connected to each other via a sealing material 125. A chip 311 is mounted on the mounting substrate 320. Terminals 323 are drawn out from the back surface side of the mounting substrate 320. The base material of the mounting substrate 320 may be, for example, ceramic or resin. Wiring 321 is formed on the mounting substrate 320. The mounting substrate 320 may be a multilayer substrate. In this case, vias used for interlayer connection may be formed in the mounting substrate 320.

[0081] Furthermore, a thermal conductor 324 may be embedded in the mounting substrate 320. The thermal conductivity of the thermal conductor 324 may be higher than the thermal conductivity of the base material of the mounting substrate 320. The thermal conductor 324 may penetrate the mounting substrate 320 in the thickness direction. The thermal conductor 324 may be disposed under the sealing material 125.

[0082] The chip 311 is flip-chip mounted on the mounting substrate 320. In flip-chip mounting of the chip 311, protruding electrodes such as solder balls or pillar electrodes may be used. An underfill 316 may be filled between the chip 311 and the mounting substrate 320. The underfill 316 may be made of an insulating material such as resin.

[0083] A light receiving element is formed on the chip 311. For example, a CMOS image sensor can be formed on the chip 311 as the light receiving element. In this case, a light receiving region 312 is provided on the chip 311. In the light receiving region 312, pixels and pixel transistors are arranged in a matrix along the row and column directions. A color filter 114 is formed on the light receiving region 312 for each pixel. An on-chip lens 115 is formed on the color filter 114 for each pixel.

[0084] FIG. 10 is a cross-sectional view showing an example of a method for manufacturing a package according to the third embodiment.

[0085] In the manufacturing method of this package 300, step a in FIGS. 2 and 3 is carried out.

[0086] 10, the chip 311 is flip-chip mounted on the mounting substrate 320. Then, an underfill 316 is filled between the chip 311 and the mounting substrate 320.

[0087] Next, as shown in FIG. 9, a transparent substrate 126 is placed on the chip 311 and bonded to a sealing material 125 .

[0088] As described above, in the third embodiment, the mounting substrate 320 on which the light receiving element is flip-chip mounted and the base 130 on which the light emitting element is mounted are connected via the sealing material 125. This makes it possible to integrate the light receiving element and the light emitting element while reducing the mounting area of ​​the chip 311 on which the light receiving element is formed, and also makes it possible to suppress thermal interference between the light receiving element and the light emitting element.

[0089] 4. Fourth Embodiment In the second embodiment described above, mounting substrate 120 on which a light receiving element is mounted face-up and base 230 on which a light emitting element is mounted are connected at a distance via sealing material 125, and reflector 232 is provided on the inclined surface of base 230. In this fourth embodiment, mounting substrate 320 on which a light receiving element is mounted face-down and base 230 on which a light emitting element is mounted are connected via sealing material 125, and reflector 232 is provided on the inclined surface of base 230.

[0090] FIG. 11 is a cross-sectional view showing an example of the configuration of a package according to the fourth embodiment.

[0091] In the figure, this package 400 includes the mounting substrate 320, chip 311, and underfill 327 of the third embodiment described above, instead of the mounting substrate 120, chip 111, and die bond material 127 of the second embodiment described above. Furthermore, this package 400 is obtained by removing the bonding wire 116 from the package 200 of the second embodiment described above. At this time, the mounting substrate 320 and the base 230 are connected to each other via the sealing material 125. The remaining configuration of the package 400 of the fourth embodiment is the same as the configuration of the package 200 of the second embodiment described above.

[0092] FIG. 12 is a cross-sectional view showing an example of a method for manufacturing a package according to the fourth embodiment.

[0093] In the manufacturing method of this package 400, step a in FIGS. 7 and 8 is carried out.

[0094] 12, the chip 311 is flip-chip mounted on the mounting substrate 320. Then, an underfill 316 is filled between the chip 311 and the mounting substrate 320.

[0095] Next, as shown in FIG. 11, a transparent substrate 126 is placed on the chip 311 and bonded to a sealing material 125 .

[0096] As described above, in the fourth embodiment, mounting substrate 320 on which the light receiving element is flip-chip mounted and base 230 on which the light emitting element is mounted are connected via sealing material 125, and reflector 232 is provided on the inclined surface of base 230. This makes it possible to suppress the complexity of the configuration of base 230 and emit laser light in a direction perpendicular to base 230, even when an edge-emitting semiconductor laser is used as the light emitting element, and also makes it possible to integrate the light receiving element and the light emitting element while reducing the mounting area of ​​chip 311 on which the light receiving element is formed and the thermal interference between the light receiving element and the light emitting element.

[0097] 5. Fifth Embodiment In the first embodiment described above, the mounting substrate 120 on which the light receiving element is flip-chip mounted and the base 130 on which the light emitting element is mounted are connected at a distance via the sealing material 125. In this fifth embodiment, the mounting substrate on which the light receiving element is flip-chip mounted and the base 130 on which the light emitting element is mounted are connected via the sealing material 125, and the mounting substrate extends below the base 130.

[0098] FIG. 13 is a cross-sectional view showing an example of the configuration of a package according to the fifth embodiment.

[0099] In the figure, this package 500 includes a mounting substrate 520 instead of the mounting substrate 120 of the first embodiment described above. The other configuration of the package 500 of the fifth embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0100] The mounting substrate 520 and the base 130 are connected to each other via a sealing material 125. The mounting substrate 520 extends below the base 130. At this time, an end of the base 130 may be disposed on the mounting substrate 520. The chip 111 is mounted on the mounting substrate 520. Terminals 523 are drawn out from the rear surface side of the mounting substrate 520. Wiring 521 is formed on the mounting substrate 520. The mounting substrate 520 may be a multilayer substrate. At this time, vias used for interlayer connection may be formed in the mounting substrate 520.

[0101] Furthermore, a thermal conductor 524 may be embedded in the mounting substrate 520. The thermal conductivity of the thermal conductor 524 may be higher than the thermal conductivity of the base material of the mounting substrate 520. The thermal conductor 524 may penetrate the mounting substrate 520 in the thickness direction. The thermal conductor 524 may be disposed below the base 130. In this case, the thermal conductor 524 may be in contact with the bottom surface of the base 130.

[0102] As described above, in the fifth embodiment, the mounting substrate 520 on which the light receiving element is flip-chip mounted and the base 130 on which the light emitting element is mounted are connected via the sealing material 125, and the mounting substrate 520 extends below the base 130. At this time, the thermal conductor 524 can be brought into contact with the base 130. This allows heat flowing from the light emitting element into the mounting substrate 520 to be dissipated via the thermal conductor 124, and the light receiving element and the light emitting element can be integrated while suppressing thermal interference between them.

[0103] 6. Sixth Embodiment In the first embodiment described above, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 130 on which the light emitting element is mounted are connected at a distance via the sealing material 125. In this sixth embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base on which the light emitting element is mounted are connected at a distance via the sealing material, and a heat insulating section is provided between the mounting substrate 120 and the base.

[0104] FIG. 14 is a cross-sectional view showing an example of the configuration of a package according to the sixth embodiment.

[0105] In the figure, this package 600 includes a base 630 and a sealing material 625 instead of the base 130 and the sealing material 125 of the first embodiment described above. The other configuration of the package 600 of the sixth embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0106] The mounting substrate 120 and the base 630 are connected to each other via a sealing material 625. The lower part of the base 630 extends in its height direction. In this case, the height direction position of the bottom surface of the base 630 can be made equal to the height direction position of the back surface of the mounting substrate 120. Other configurations of the base 630 of the sixth embodiment are similar to the configuration of the base 130 of the first embodiment described above.

[0107] The encapsulant 625 is positioned between the mounting substrate 120 and the transparent substrate 126. In this case, the encapsulant 625 may support the transparent substrate 126 on the chip 111 while spacing it apart. The encapsulant 625 may be continuously disposed along the outer periphery of the mounting substrate 120. In this case, the inner periphery of the encapsulant 625 may be positioned outside the bonding pads 122.

[0108] Furthermore, the sealing material 625 connects the mounting substrate 120 and the base 630. For example, the sealing material 625 may extend horizontally from above the mounting substrate 120 and be connected to the base 630. In this case, the sealing material 625 may be connected to the side surface of the base 630. Here, the sealing material 625 can support the base 630 on the side of the mounting substrate 120 while being spaced apart from the mounting substrate 120.

[0109] The sealing material 625 also extends between the side surface of the mounting substrate 120 and the side surface of the base 630. The tip of the extension 625A of the sealing material 625 may extend to the position of the bottom surface of the base 630. In this case, the extension 625A of the sealing material 625 can be bonded to the side surface of the base 630. A heat insulating portion 601 can be provided between the extension 625A of the sealing material 625 and the side surface of the mounting substrate 120. The heat insulating portion 601 may be made of, for example, a foamable resin or a resin to which a binder is added. The heat insulating portion 601 may also be a space. A heat-cut insulating paint such as a ceramic vacuum balloon may be applied to the side surface of the extension 625A.

[0110] As described above, in the sixth embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 630 on which the light emitting element is mounted are connected via the sealing material 625, and the heat insulating section 601 is provided between the mounting substrate 120 and the base 630. This makes it possible to integrate the light receiving element and the light emitting element while suppressing thermal interference between them, and also makes it possible to align the heights of the mounting surfaces of the mounting substrate 120 and the base 630 while enabling a hermetic seal of the base 630.

[0111] 7. Seventh Embodiment In the second embodiment described above, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 230 on which the light emitting element is mounted are connected to each other at a distance via the sealing material 125, and the reflective material 232 is provided on the inclined surface of the base 230. In this seventh embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 230 on which the light emitting element is mounted are connected to each other at a distance via the sealing material, and the reflective material 232 is provided on the inclined surface of the base 230, and a heat dissipation section is provided on the base 230.

[0112] FIG. 15 is a cross-sectional view showing an example of the configuration of a package according to the seventh embodiment.

[0113] In the figure, this package 700 includes a base 730 and a sealing material 725 instead of the base 230 and the sealing material 125 of the second embodiment described above. Furthermore, this package 700 includes a heat dissipation unit 701 in addition to the package 200 of the second embodiment described above. Other configurations of the package 700 of the seventh embodiment are similar to the configuration of the package 200 of the second embodiment described above.

[0114] The mounting substrate 120 and the base 730 are connected to each other via a sealing material 725. In this case, the base 730 is disposed adjacent to the mounting substrate 120 in the horizontal direction. The shape of the base 730 may be cylindrical. Here, the position of the bottom surface of the base 730 in the height direction may be equal to the position of the bottom surface of the mounting substrate 120 in the height direction.

[0115] The base 730 is divided by separators 731. For example, the separators 731 can divide the base 730 into four parts. In this case, the separators 731 can penetrate the base 730 in the thickness direction. The planar shape of the separators 731 can be a cross shape. Each of the parts of the base 730 divided by the separators 731 can be used as an electrode. Other configurations of the base 730 of the seventh embodiment are the same as the configuration of the base 230 of the second embodiment described above.

[0116] The encapsulant 725 supports the base 730 by separating the base 730 from the mounting substrate 120. For example, the encapsulant 725 may extend horizontally from above the mounting substrate 120 and connect to the side and top surfaces of the base 730. A gap is formed between the side surface of the base 730 and the side surface of the mounting substrate 120. In this case, the encapsulant 725 may extend into the gap between the side surface of the base 730 and the side surface of the mounting substrate 120. The tip of the extension 725A of the encapsulant 725 may extend to the bottom surface of the base 730. In this case, the extension 725A of the encapsulant 725 may be bonded to the side surface of the base 730 and the side surface of the mounting substrate 120. A slit SL1 may be formed in the extension 725A of the encapsulant 725. The slit SL1 can block heat generated by the light-emitting element formed on the chip 242 from flowing into the mounting substrate 120.

[0117] Furthermore, the sealing material 725 on the mounting substrate 120 extends onto the base 730. An extension 725B of the sealing material 725 is disposed around the submount 241. The extension 725B of the sealing material 725 can be formed continuously around the submount 241. In this case, the extension 725B of the sealing material 725 can be bonded to the upper surface of the base 730. An inclined surface is formed on the extension 725B of the sealing material 725. A reflector 232 is provided on the inclined surface of the extension 725B of the sealing material 725. The inclined surface of the sealing material 725 may include a curved surface. The reflector 232 may be formed on the inclined surface of the sealing material 725 based on a molded interconnect device (MID). A slit SL2 may be formed between the sealing material 725 on the mounting substrate 120 and the extension 725B of the sealing material 725. The slits SL2 can block heat generated by the light emitting elements formed on the chip 242 from flowing into the mounting substrate 120. A heat-insulating paint such as a ceramic vacuum balloon may be applied to the side surfaces of each of the slits SL1 and SL2.

[0118] On the mounting substrate 120, the encapsulant 725 is positioned between the mounting substrate 120 and the transparent substrate 126. In this case, the encapsulant 725 can support the transparent substrate 126 while spacing it apart from the chip 111. The encapsulant 725 can be continuously disposed along the outer periphery of the mounting substrate 120. In this case, the inner periphery of the encapsulant 725 can be positioned outside the bonding pads 122.

[0119] The heat dissipation section 701 dissipates heat generated by the light emitting element formed on the chip 242. The heat dissipation section 701 may be bonded to the side surface of the base 730. The heat dissipation section 701 may be a metal block such as Cu or Al, a heat sink, a vapor chamber, or a Peltier element.

[0120] As described above, in the seventh embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 230 on which the light emitting element is mounted are connected at a distance via the sealing material 725, the reflector 232 is provided on the inclined surface of the base 230, and the heat dissipation section 701 is provided on the base 230. This makes it possible to suppress thermal interference between the light receiving element and the light emitting element, dissipate heat flowing out from the light emitting element via the heat dissipation section 701, and integrate the light receiving element and the light emitting element.

[0121] 8. Eighth Embodiment In the second embodiment described above, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 230 on which the light emitting element is mounted are connected to each other at a distance via the sealing material 125, and the reflector 232 is provided on the inclined surface of the base 230. In this eighth embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base on which the vertical light emitting type light emitting element is mounted are connected to each other via the sealing material 125.

[0122] FIG. 16 is a cross-sectional view showing an example of the configuration of a package according to the eighth embodiment.

[0123] In the figure, this package 800 includes chips 842 and 843, a base 830, a mounting substrate 820, and a submount 841 instead of the chips 242 and 243, base 230, mounting substrate 120, and submount 241 of the second embodiment described above. Also, this package 800 has a light-shielding plate 832 and a heat dissipation member 833 added to the package 200 of the second embodiment described above. Other configurations of the package 800 of the eighth embodiment are similar to the configuration of the package 200 of the second embodiment described above.

[0124] The chip 111 is mounted on the mounting substrate 820. Wiring 821 is formed on the mounting substrate 820. The mounting substrate 820 may be a multilayer substrate. In this case, vias used for interlayer connection may be formed in the mounting substrate 820. Furthermore, land electrodes to which protruding electrodes such as solder balls or pillar electrodes are joined may be formed on the back surface side of the mounting substrate 820.

[0125] A heat dissipation member 833 is embedded in the mounting substrate 820. The heat dissipation member 833 can be disposed under the chip 111. The heat dissipation member 833 may penetrate the mounting substrate 820. The heat dissipation member 833 may be a metal block such as Cu or Al, or may be a thermal via or a metal coin. Other configurations of the mounting substrate 820 of the eighth embodiment are similar to the configuration of the mounting substrate 120 of the second embodiment described above.

[0126] The base 830 is connected to the mounting substrate 820 via the sealing material 125. In this case, the sealing material 125 can support the base 830 by separating the base 830 from the mounting substrate 820. For example, the sealing material 125 may extend horizontally from above the mounting substrate 820 and be connected to the side surface of the base 830. The base 830 extends downward below the sealing material 125. Here, the height direction position of the bottom surface of the base 830 may be equal to the height direction position of the bottom surface of the mounting substrate 820. In this case, a gap is formed between the side surface of the base 830 and the side surface of the mounting substrate 820. A heat insulating member 233 may be provided in the gap between the side surface of the base 830 and the side surface of the mounting substrate 820.

[0127] The base 830 is divided by separators 831. For example, the separators 831 can divide the base 830 into four parts. In this case, the separators 831 can penetrate the base 830 in the thickness direction. The planar shape of the separators 831 can be a cross shape. Each part of the base 830 divided by the separators 831 can be used as an electrode.

[0128] Chips 842 and 843 are mounted on the base 830. The chips 842 and 843 may be mounted on the base 830 via a submount 841. In this case, the base 830 may have a horizontal surface on which the submount 841 is mounted. The chip 842 may be flip-chip mounted on the submount 841. In this case, electrodes to which the chips 842 and 843 are connected may be formed on the submount 841. Vertical surfaces may be provided around the horizontal surface of the base 830 on which the submount 841 is mounted. In this case, a cavity CAV3 is formed in the base 830 to accommodate the submount 841 and the chips 842 and 843.

[0129] A vertical light-emitting element is formed on chip 842. The light-emitting element is, for example, a surface-emitting semiconductor laser. A light-receiving element is formed on chip 843. The light-receiving element is, for example, a photodiode. In this case, the light-receiving element can be used to monitor light emitted from the light-emitting element formed on chip 842.

[0130] The transparent substrate 252 is disposed above and spaced from the chip 842. At this time, the transparent substrate 252 is supported above the cavity CAV3 via the horizontal surface surrounding the cavity CAV3. The transparent substrate 252 can transmit light emitted from the light-emitting element formed on the chip 842.

[0131] The light-shielding plate 832 prevents light from the light-emitting element formed on the chip 842 from entering the light-receiving region 112 formed on the chip 111. The light-shielding plate 832 can be disposed between the transparent substrates 126 and 252. In this case, the light-shielding plate 832 may be located on the sealing material 125. The material of the light-shielding plate 832 may be a metal such as stainless steel or aluminum, a black resin, or an inorganic material such as ceramic.

[0132] As described above, in the eighth embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 830 on which the vertical light emitting element is mounted are connected at a distance via the sealing material 125. This makes it possible to emit laser light in a direction perpendicular to the base 830 while preventing the configuration of the base 830 from becoming complicated, and also makes it possible to integrate the light receiving element and the light emitting element while preventing thermal interference between the light receiving element and the light emitting element.

[0133] 9. Ninth Embodiment In the first embodiment described above, the mounting substrate 120 on which the light receiving element is mounted face-up and the base 130 on which the light emitting element is mounted are connected at a distance via the sealing material 125. In this ninth embodiment, the mounting substrate 120 on which the light receiving element is mounted face-up and the base on which the light emitting element is mounted are connected at a distance via the sealing material, and the connection position between the mounting substrate 120 and the base is changed.

[0134] 17 is a plan view showing a configuration example of a package according to the ninth embodiment. In the figure, "a" indicates a first configuration example of the package according to the ninth embodiment. "b" indicates a second configuration example of the package according to the ninth embodiment. "c" indicates a third configuration example of the package according to the ninth embodiment.

[0135] In the figure, the first configuration example of the package includes a sealing material 125A instead of the sealing material 125 of the first embodiment described above. The other configurations of the first configuration example of the package of the ninth embodiment are the same as the configuration of the package 100 of the first embodiment described above.

[0136] Sealant 125A connects mounting substrate 120 and base 130. In this case, base 130 can be disposed at an end of mounting substrate 120. A light-emitting area LA1 is provided on base 130. Chips 142 and 143 of the first embodiment described above are mounted on light-emitting area LA1.

[0137] In the figure, the second configuration example of the package includes a sealing material 125B instead of the sealing material 125 of the first embodiment described above. Also, in this second configuration example of the package, a base 130B is added to the package 100 of the first embodiment described above. Other configurations of the second configuration example of the package of the ninth embodiment are similar to the configuration of the package 100 of the first embodiment described above.

[0138] The sealing material 125B connects the mounting substrate 120 to the bases 130 and 130B. In this case, the bases 130 and 130B can be respectively disposed at the center of opposing sides of the mounting substrate 120. Note that the bases 130 and 130B may also be disposed at other positions, such as at the end of the mounting substrate 120.

[0139] A light-emitting area LA2 is provided on the base 130B. A chip on which a light-emitting element is formed can be mounted in the light-emitting area LA2. The wavelength of the light-emitting element arranged on the base 130B can be made different from the wavelength of the light-emitting element arranged on the base 130. For example, an infrared laser may be arranged on the base 130, and a visible light laser may be arranged on the base 130B.

[0140] In C of the figure, this third configuration example of the package includes a sealing material 125C and a base 130C instead of the sealing material 125 and base 130 of the first embodiment described above. Also, this third configuration example of the package adds a base 130D to the package 100 of the first embodiment described above. Other configurations of the third configuration example of the package of the ninth embodiment are similar to the configuration of the package 100 of the first embodiment described above.

[0141] The sealing material 125C connects the mounting substrate 120 to the bases 130C and 130D. The bases 130C and 130D can be disposed at the center of opposing sides of the mounting substrate 120. The width of the sealing material 125C on the base 130C side can be equal to the width of the light-emitting region LA1. The width of the sealing material 125C on the base 130D side can be equal to the width of the mounting substrate 120. The width of the base 130C can be equal to the width of the mounting substrate 120. The width of the base 130D can be equal to the width of the light-emitting region LA2. This improves the heat dissipation of the base 130C on the base 130C side, while improving the strength of the sealing material 125C on the base 130D side while reducing the weight of the base 130D.

[0142] A light-emitting area LA2 is provided on the base 130D. A chip on which a light-emitting element is formed can be mounted in the light-emitting area LA2. The wavelength of the light-emitting element arranged on the base 130C can be made different from the wavelength of the light-emitting element arranged on the base 130D. For example, an infrared laser may be arranged on the base 130C, and a visible light laser may be arranged on the base 130D.

[0143] In this way, in the ninth embodiment described above, the mounting substrate 120 on which the light receiving element is mounted face-up and the base on which the light emitting element is mounted are connected at a distance via a sealing material, and the connection position between the mounting substrate 120 and the base is changed. This makes it possible to integrate one or more light emitting elements and the light receiving element while suppressing thermal interference between the light receiving element and the light emitting element, and also alleviates restrictions on the positional relationship between the light receiving element and the light emitting element.

[0144] 10. Tenth Embodiment In the first embodiment described above, mounting substrate 120 on which a light-receiving element is mounted face-up and base 130 on which a light-emitting element is mounted are connected at a distance via sealing material 125. In this tenth embodiment, a base on which a light-emitting element is mounted is disposed on mounting substrate 120 on which a light-receiving element is mounted face-up, and the sealing material of the light-receiving element is spaced apart from the frame member of the light-emitting element.

[0145] 18 is a diagram showing an example of the configuration of a package according to the tenth embodiment, in which "a" in the figure is a cross-sectional view showing the example of the configuration of the package 1000, and "b" in the figure is a plan view showing the example of the configuration of the package 1000.

[0146] In the figure, this package 1000 includes a mounting substrate 1020, chips 1042 and 1043, a base 1030, a sealing material 1025, a frame member 1051, a transparent substrate 1052, a flexible substrate 1041, and bonding wires 1044, instead of the mounting substrate 120, chips 142 and 143, a base 130, a sealing material 125, a header 151, a transparent substrate 152, a submount 141, and bonding wires 144 of the first embodiment described above. Furthermore, this package 1000 is obtained by removing the bonding wires 145 from the package 100 of the first embodiment described above. The other configurations of the package 1000 of the tenth embodiment are similar to those of the package 100 of the first embodiment described above.

[0147] The chip 111 and the base 1030 are mounted on the mounting substrate 1020. Wiring 1021 is formed on the mounting substrate 1020. The mounting substrate 1020 may be a multilayer substrate. In this case, vias used for interlayer connection may be formed in the mounting substrate 1020. Furthermore, land electrodes to which protruding electrodes such as solder balls or pillar electrodes are joined may be formed on the back side of the mounting substrate 1020.

[0148] Furthermore, thermal conductors 1024 and 1026 may be embedded in the mounting substrate 1020. The thermal conductivity of the thermal conductors 1024 and 1026 may be higher than the thermal conductivity of the base material of the mounting substrate 1020. The thermal conductors 1024 and 1026 may penetrate the mounting substrate 1020 in the thickness direction. The thermal conductor 1024 may be disposed below the base 1030. In this case, the thermal conductor 1024 may be in contact with the bottom surface of the base 1030. The thermal conductor 1026 may be disposed below the chip 111. Other configurations of the mounting substrate 1020 of the tenth embodiment are similar to the configuration of the mounting substrate 120 of the first embodiment described above.

[0149] The encapsulant 1025 is positioned between the mounting substrate 1020 and the transparent substrate 126. The encapsulant 1025 can support the transparent substrate 126 on the chip 111 while spacing it apart. The encapsulant 1025 can be continuously disposed along the outer periphery of the mounting substrate 1020. The inner periphery of the encapsulant 1025 can be positioned outside the bonding pads 122. The encapsulant 1025 can be a molding resin or a potting resin. The material of the encapsulant 1025 can be a thermosetting resin or an ultraviolet-curing resin. The encapsulant 1025 can contain an inorganic or organic filler to improve reliability. The encapsulant 1025 can be blackened to reduce flare on the light-receiving region 112. For example, the encapsulant 1025 can contain a black pigment such as carbon black or a filler such as carbon fiber.

[0150] The base 1030 is disposed on the mounting substrate 1020. The base 1030 can be disposed on the mounting substrate 1020 adjacent to the sealing material 1025 and spaced apart from the sealing material 1025. The base 1030 can be disposed on the mounting substrate 1020 so that the mounting surfaces of the chips 1042 and 1043 stand upright on the mounting substrate 1020. In this case, the mounting surfaces of the chips 1042 and 1043 can be provided on the side surfaces of the base 1030. The base 1030 may be block-shaped. The base 1030 and the mounting substrate 1020 may be joined using an adhesive or a solder material. When the base 1030 and the mounting substrate 1020 are joined via a solder material, a metal layer may be formed on the mounting position of the base 1030 on the mounting substrate 1020. The material of this metal layer may be, for example, Cu. This metal layer may be plated with Au.

[0151] The base 1030 may be made of a material having better thermal conductivity than the base material of the mounting substrate 1020. The base 1030 may be made of a metal such as Al or Cu. In this case, a plating layer of Ni, Au, or the like may be formed on the surface of the base 1030.

[0152] A flexible substrate 1041 is disposed on the mounting surface of the base 1030. The flexible substrate 1041 can be extended onto the mounting substrate 1020 and connected to the wiring 1021. In this case, the flexible substrate 1041 can be extended along the side surface of the base 1030. The flexible substrate 1041 can be connected to the wiring 1021 using a solder material, or can be connected to the wiring 1021 via a connector. In this case, a connector connected to the flexible substrate 1041 can be attached to the mounting substrate 1020. Chips 1042 and 1043 are mounted on the flexible substrate 1041. The chip 1042 is connected to the flexible substrate 1041 via a bonding wire 1044. The chip 1043 can be flip-chip mounted on the flexible substrate 1041. The chip 1043 may also be mounted on the flexible substrate 1041 via an anisotropic conductive film (ACF). At this time, electrodes and wiring connected to the respective chips 1042 and 1043 can be formed on the flexible substrate 1041 .

[0153] A heat dissipation member 1045 is embedded in the flexible substrate 1041. The thermal conductivity of the heat dissipation member 1045 can be higher than the thermal conductivity of the base material of the flexible substrate 1041. The heat dissipation member 1045 may penetrate the flexible substrate 1041 in the thickness direction. In this case, the heat dissipation member 1045 may be in contact with the base 1030 or may be bonded to the base 1030. The heat dissipation member 1045 is desirably disposed below the chip 1042. The material of the heat dissipation member 1045 may be the same as the material of the wiring of the flexible substrate 1041. The material of the heat dissipation member 1045 may be graphite or a composite material containing graphite.

[0154] A light-emitting element is formed on the chip 1042. The light-emitting element is, for example, an edge-emitting semiconductor laser. The light-emitting element may include a wavelength conversion element or an optical modulation element. A driver IC (Integrated Circuit) is formed on the chip 1043. The driver IC drives the light-emitting element formed on the chip 1042. The chip 1043 may also include a monitor diode. In this case, the driver IC can drive the light-emitting element based on the monitoring results of the light emitted from the light-emitting element. In this case, the chip 1042 can be placed on the upper surface side of the base 1030 with the light-emitting surface of the light-emitting element facing upward.

[0155] A frame member 1051 is disposed on the mounting surface of the chips 1042, 1043 so as to cover the chips 1042, 1043 and the bonding wires 1044. The frame member 1051 is disposed at a distance from the chips 1042, 1043 and the bonding wires 1044 and can seal the chips 1042, 1043 and the bonding wires 1044. The frame member 1051 can be bonded to the mounting surface of the chips 1042, 1043 so as to straddle the flexible substrate 1041. A space is formed between the frame member 1051 and the sealing material 1025. At this time, the frame member 1051 and the sealing material 1025 can be thermally isolated via the space.

[0156] An opening KA10 is formed in one of the side surfaces of the frame member 1051 on the side surface facing the upper surface of the base 1030. The opening KA10 can be disposed at the emission position of the light-emitting element formed on the chip 1042. In this case, the opening KA10 can be covered with a transparent substrate 1052. The transparent substrate 1052 can transmit light emitted from the light-emitting element formed on the chip 1042. The material of the frame member 1051 may be, for example, resin, metal such as stainless steel, or inorganic material such as ceramic.

[0157] 19 to 21 are cross-sectional views showing an example of a method for manufacturing a package according to the tenth embodiment.

[0158] 19A, a base 1030 is prepared. At this time, the base 1030 may be placed on a jig.

[0159] 19B, a flexible substrate 1041 is attached to the side surface of the base 1030. An adhesive may be used for this attachment. At this time, electrodes and wiring are formed in advance on the flexible substrate 1041, and a heat dissipation member 1045 is embedded in the flexible substrate 1041.

[0160] 19C, chips 1042 and 1043 are mounted on flexible substrate 1041. Then, chip 1042 is connected to flexible substrate 1041 via bonding wire 1044.

[0161] 19d, a frame member 1051 is joined to the side surface of the base 1030 so as to straddle the flexible substrate 1041. A transparent substrate 1052 is attached to the frame member 1051 in advance.

[0162] On the other hand, as shown in FIG. 20A, the chip 111 is mounted on the mounting substrate 1020 via the die bond material 127 .

[0163] 20B, a sealing material 1025 is formed on the mounting substrate 1020. The sealing material 1025 can be disposed around the chip 111. The sealing material 1025 may be formed by molding, potting, or dispensing.

[0164] Next, as shown in FIG. 21A, the chip 111 is connected to the mounting substrate 1020 via bonding wires 116.

[0165] Next, as shown in Fig. 21b, the base 1030 to which the frame member 1051 has been joined in Fig. 19d is joined onto the mounting substrate 1020. For this joining, an adhesive material or a solder material may be used.

[0166] Next, as shown in FIG. 18, a transparent substrate 126 is placed on the chip 111 and bonded to a sealing material 1025 .

[0167] In this way, in the above-described tenth embodiment, base 1030 on which a light-emitting element is mounted is placed on mounting substrate 1020 on which a light-receiving element is mounted face-up, and sealing material 1025 of the light-receiving element is spaced apart from frame member 1051 of the light-emitting element. This makes it possible to mount base 1030 on which a light-emitting element is mounted and the light-receiving element on mounting substrate 1020 while suppressing thermal interference between the light-receiving element and the light-emitting element.

[0168] 11. Eleventh Embodiment In the above-described tenth embodiment, base 1030 on which a light-emitting element is mounted is disposed on mounting substrate 1020 on which a light-receiving element is mounted face-up, and sealing material 1025 of the light-receiving element is spaced apart from frame member 1051 of the light-emitting element. In this eleventh embodiment, a heat sink is attached to base 1030 which is disposed apart from sealing material 1025 on mounting substrate 120 on which a light-receiving element is mounted face-up.

[0169] 22 is a diagram showing an example of the configuration of a package according to the eleventh embodiment, in which a is a cross-sectional view showing the example of the configuration of the package 1100, and b is a plan view showing the example of the configuration of the package 1100.

[0170] In the figure, this package 1100 is obtained by adding heat sinks 1101 and 1102 to the package 1000 of the above-described tenth embodiment. The other configuration of the package 1100 of the eleventh embodiment is the same as the configuration of the package 1000 of the above-described tenth embodiment.

[0171] The heat sinks 1101 and 1102 are attached to the base 1030. The heat sinks 1101 and 1102 may be attached to the top or side surface of the base 1030. Fins may be provided on each of the heat sinks 1101 and 1102. Vapor chambers, Peltier elements, or the like may be attached instead of the heat sinks 1101 and 1102.

[0172] As described above, in the eleventh embodiment, the heat sinks 1101 and 1102 are attached to the base 1030, which is disposed apart from the sealing material 1025 on the mounting substrate 1020 on which the light receiving element is mounted face-up. This makes it possible to mount the light receiving element and the base 1030 on which the light emitting element is mounted on the mounting substrate 120 while suppressing thermal interference between the light receiving element and the light emitting element, and also improves the dissipation of heat generated by the light emitting element.

[0173] 12. Twelfth Embodiment In the above-described tenth embodiment, base 1030 on which an edge-emitting light-emitting element is mounted is disposed on mounting substrate 1020 on which a light-receiving element is mounted face-up, and sealing material 1025 of the light-receiving element is spaced apart from frame member 1051 of the light-emitting element. In this twelfth embodiment, base 1030 on which a vertical-emitting light-emitting element is mounted is disposed apart from sealing material 1025 on mounting substrate 1020 on which a light-receiving element is mounted face-up, and sealing material is used to seal the light-emitting element.

[0174] 23 is a diagram showing an example of the configuration of a package according to the twelfth embodiment, in which a is a cross-sectional view showing the example of the configuration of a package 1200, and b is a plan view showing the example of the configuration of the package 1200.

[0175] In the figure, this package 1200 includes a chip 1242, a base 1230, a sealing material 1232, a transparent substrate 1252, and a flexible substrate 1261, instead of the chip 1042, base 1030, frame member 1051, transparent substrate 1052, and flexible substrate 1041 of the tenth embodiment described above. Furthermore, this package 1200 is obtained by adding a submount 1241 and a heat dissipation member 1243 to the package 1000 of the tenth embodiment described above. Furthermore, this package 1200 is obtained by removing the chip 1043 and bonding wires 1044 from the package 1000 of the tenth embodiment described above. Other configurations of the package 1200 of the twelfth embodiment are the same as those of the package 1000 of the tenth embodiment described above.

[0176] The base 1230 is disposed on the mounting substrate 1020 adjacent to the sealing material 1025 in the horizontal direction. The base 1230 may be block-shaped. Here, the base 1230 is disposed on the mounting substrate 1020 spaced apart from the sealing material 1025. A space is formed between the base 1230 and the sealing material 1025. At this time, the base 1230 and the sealing material 1025 can be thermally isolated via the space.

[0177] The base 1230 may be made of a material having better thermal conductivity than the base material of the mounting substrate 1020. The base 1230 may be made of a metal such as Al or Cu. In this case, a plating layer of Ni, Au, or the like may be formed on the surface of the base 1230.

[0178] A flexible substrate 1261 is disposed on the mounting surface of the base 1230. The flexible substrate 1261 can be extended onto the mounting substrate 1020 via the side surface of the base 1230 and connected to the wiring 1021. At this time, the flexible substrate 1261 can be bent at the boundary between the top surface and the side surface of the base 1230.

[0179] A chip 1242 is mounted on the flexible substrate 1261. A light-emitting element is formed on the chip 1242. The light-emitting element is, for example, a surface-emitting semiconductor laser. The chip 1242 may be mounted on the flexible substrate 1261 via a submount 1241. In this case, the submount 1241 can be flip-chip mounted on the flexible substrate 1261. Wiring 1262 connected to the chip 1242 is formed on the flexible substrate 1261.

[0180] A heat dissipation member 1243 may be disposed between the submount 1241 and the base 1230. The thermal conductivity of the heat dissipation member 1243 can be higher than the thermal conductivity of the base material of the flexible substrate 1261. The heat dissipation member 1243 may be in contact with the submount 1241 and the base 1230, or may be bonded to the submount 1241 and the base 1230. The material of the heat dissipation member 1243 may be a metal such as Cu or Al, graphite, or a composite material containing graphite.

[0181] The encapsulant 1232 is disposed around the submount 1241. In this case, the encapsulant 1232 can be bonded to the upper surface of the base 1230 around the submount 1241. An inclined surface may be formed on the encapsulant 1232. In this case, a cavity CAV4 in which the chip 1242 is housed is formed on the base 1230. The encapsulant 1232 may be formed on the flexible substrate 1261 and the base 1230 based on IME (In-mold Electronics).

[0182] A transparent substrate 1252 is disposed above and spaced from the chip 1242. At this time, the transparent substrate 1252 is supported by the sealing material 1232 so as to close the cavity CAV4. The transparent substrate 1252 can transmit light emitted from the light-emitting element formed on the chip 1242.

[0183] As described above, in the twelfth embodiment, the base 1230 on which the vertical light-emitting element is mounted is disposed on the mounting substrate 1020 on which the light-receiving element is mounted face-up, at a distance from the sealing material 1025, and the sealing material 1232 is used to seal the light-emitting element. This makes it possible to mount the base 1030 on which the vertical light-emitting element is mounted and the light-receiving element on the mounting substrate 1020 while suppressing thermal interference between the light-receiving element and the vertical light-emitting element.

[0184] 13. Thirteenth Embodiment In the twelfth embodiment described above, a base 1230 on which a vertical light-emitting type light-emitting element is mounted is disposed apart from the sealing material 1025 on a mounting substrate 1020 on which a light-receiving element is mounted face-up, and the light-emitting element is sealed using a sealing material 1232. In this thirteenth embodiment, a base 1230 on which a vertical light-emitting type light-emitting element is mounted is disposed apart from the sealing material 1025 on a mounting substrate 1020 on which a light-receiving element is mounted face-up, and a frame member is used to seal the light-emitting element.

[0185] 24 is a diagram showing an example of the configuration of a package according to the thirteenth embodiment, in which a is a cross-sectional view showing the example of the configuration of a package 1300, and b is a plan view showing the example of the configuration of the package 1300.

[0186] In the figure, this package 1300 includes a frame member 1301 instead of the sealing material 1232 and transparent substrate 1262 of the twelfth embodiment described above. The other configuration of the package 1300 of the thirteenth embodiment is the same as the configuration of the package 1200 of the twelfth embodiment described above.

[0187] The frame member 1301 is disposed at a distance from the chip 1242 and the submount 1241 and can seal the chip 1242 and the submount 1241. The frame member 1301 can be bonded to the base 1230 so as to straddle the flexible substrate 1261. An adhesive may be used for this bonding. The material of the frame member 1301 may be, for example, a transparent resin such as acrylic or polycarbonate, glass, or quartz.

[0188] As described above, in the thirteenth embodiment, the base 1230 on which the vertical light-emitting element is mounted is disposed on the mounting substrate 1020 on which the light-receiving element is mounted face-up, at a distance from the sealing material 1025, and the frame member 1301 is used to seal the light-emitting element. This makes it possible to mount the base 1230 on which the vertical light-emitting element is mounted and the light-receiving element on the mounting substrate 1020 while suppressing thermal interference between the light-receiving element and the vertical light-emitting element.

[0189] In the above-described tenth to thirteenth embodiments, an example was shown in which the chip 111 was mounted face-up on the mounting substrate 1020 and the chip 111 and the mounting substrate 1020 were connected via bonding wires 116. Alternatively, a configuration in which the chip 311 of the above-described third embodiment was flip-chip mounted on the mounting substrate may be applied to the above-described tenth to thirteenth embodiments. Furthermore, in the above-described tenth to thirteenth embodiments, an example was shown in which a flexible substrate was used to connect the elements on the base to the mounting substrate. However, MID wiring may be used to connect the elements on the base to the mounting substrate, or wiring may be formed on the base based on an inkjet method or an aerosol jet method. Furthermore, in the above-described twelfth and thirteenth embodiments, the heat sink or the like of the above-described eleventh embodiment may be attached to the base.

[0190] 14. Application Examples to Mobile Bodies The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0191] FIG. 25 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0192] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 25, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0193] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0194] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0195] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0196] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0197] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0198] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0199] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0200] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0201] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying the passengers of the vehicle or the outside of the vehicle of information. In the example of Fig. 25, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0202] FIG. 26 is a diagram showing an example of the installation position of the imaging unit 12031.

[0203] In FIG. 26, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0204] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0205] 26 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0206] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0207] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0208] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0209] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0210] The foregoing has described an example of a vehicle control system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to the imaging unit 12031 of the above-described configuration. Specifically, for example, each of the packages 100 to 1300 according to the above-described embodiment can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the vehicle control system 12000, the imaging unit 12031 can be made more compact while improving its reliability.

[0211] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology with the same title correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist. Furthermore, the effects described in this specification are merely examples and are not limited, and other effects may also be present.

[0212] The present technology may also be configured as follows. (1) A package comprising: a substrate on which a light-receiving element is mounted; a base on which a light-emitting element is mounted and spaced apart from the substrate; and a connecting member connecting the base and the substrate. (2) The package according to (1), wherein the connecting member has a thermal conductivity of 0.04 W / mK or less. (3) The package according to (1) or (2), wherein the connecting member extends horizontally from above the substrate and is connected to the base. (4) The package according to any of (1) to (3), wherein the connecting member is connected to a side surface of the base. (5) The package according to any of (1) to (3), wherein the connecting member is connected to an upper surface of the base, and the base and the substrate are horizontally adjacent to each other via a gap. (6) The package according to (5), further comprising: a low thermal conductor positioned in the gap and having a thermal conductivity lower than that of the substrate. (7) The package according to (6), wherein the thermal conductivity of the low thermal conductor is 0.02 W / mK or less. (8) The package according to any one of (1) to (7), wherein the thermal conductor is embedded in the substrate below the connecting member and has a higher thermal conductivity than the substrate. (9) The package according to any one of (1) to (8), wherein the connecting member is formed on the substrate around the light-receiving element. (10) The package according to any one of (1) to (9), wherein the base is made of metal and the connecting member is made of resin. (11) A package comprising: a substrate on which a light-receiving element is mounted; a base on which a light-emitting element is mounted; and a connecting member connecting the base and the substrate, wherein the thermal conductivity of the connecting member is lower than that of the substrate. (12) The package according to (11), wherein the thermal conductivity of the connecting member is 0.04 W / mK or less. (13) The package according to (11) or (12), wherein the connecting member extends horizontally from above the substrate and is connected to the base. (14) The package according to any one of (11) to (13), wherein the connecting member is formed on the substrate around the light receiving element. (15) A package comprising: a base on which a light emitting element is mounted; and a substrate on which the base and the light receiving element are mounted on the same surface with a gap therebetween.(16) The package according to (15), further comprising a heat sink attached to the base. (17) The package according to (15) or (16), further comprising a first frame member spaced apart from the base and arranged around the light receiving element, and a first transparent member arranged on the first frame member. (18) The package according to any of (15) to (17), further comprising a flexible substrate arranged along the base and electrically connecting the light emitting element and the substrate. (19) The package according to (18), further comprising a second frame member arranged around the light emitting element, and a second transparent member arranged on the second frame member, the flexible substrate being electrically connected to the substrate through the second frame member.

[0213] 100 Package 111, 142, 143 Chip 112 Light receiving region 113 Pad electrode 114 Color filter 115 On-chip lens 116, 144, 145 Bonding wire 120 Mounting substrate 121 Wiring 122 Bonding pad 123, 132, 133 Terminal 124 Thermal conductor 125 Sealing material 126, 152 Transparent substrate 127 Die bond material 130 Base 131 Insulating layer 141 Submount 151 Header 153 Bonding material

Claims

1. A package comprising: a substrate on which a light-receiving element is mounted; a base on which a light-emitting element is mounted and which is spaced apart from the substrate; and a connecting member which connects the base and the substrate.

2. The package according to claim 1, wherein the thermal conductivity of the connecting member is 0.04 W / mK or less.

3. The package according to claim 1, wherein the connecting member extends horizontally from above the substrate and is connected to the base.

4. The package according to claim 1, wherein the connecting member is connected to a side surface of the base.

5. The package according to claim 1, wherein the connecting member is connected to the upper surface of the base, and the base and the substrate are horizontally adjacent to each other with a gap therebetween.

6. The package according to claim 5, further comprising a low thermal conductor positioned in the gap and having a thermal conductivity lower than that of the substrate.

7. The package according to claim 6, wherein the thermal conductivity of the low thermal conductor is 0.02 W / mK or less.

8. The package according to claim 1, further comprising a thermal conductor embedded in the substrate below the connecting member and having a higher thermal conductivity than the substrate.

9. The package according to claim 1, wherein the connecting member is formed on the substrate around the light receiving element.

10. The package according to claim 1, wherein the base is made of metal and the connecting member is made of resin.

11. A package comprising: a substrate on which a light-receiving element is mounted; a base on which a light-emitting element is mounted; and a connecting member that connects the base and the substrate, wherein the thermal conductivity of the connecting member is lower than the thermal conductivity of the substrate.

12. The package according to claim 11, wherein the thermal conductivity of the connecting member is 0.04 W / mK or less.

13. The package according to claim 11, wherein the connecting member extends horizontally from above the substrate and is connected to the base.

14. The package according to claim 11, wherein the connecting member is formed on the substrate around the light receiving element.

15. A package comprising: a base on which a light-emitting element is mounted; and a substrate on which the base and a light-receiving element are mounted on the same surface and spaced apart from each other.

16. The package of claim 15, further comprising a heat sink attached to the base.

17. The package according to claim 15, further comprising: a first frame member disposed around the light receiving element and spaced apart from the base; and a first transparent member disposed on the first frame member.

18. The package according to claim 15, further comprising a flexible substrate disposed along the base and electrically connecting the light emitting element and the substrate.

19. The package according to claim 18, comprising: a second frame member arranged around the light-emitting element; and a second transparent member arranged on the second frame member, wherein the flexible substrate is electrically connected to the substrate through the second frame member.

Images