Thermal interface member and electronic device comprising same

Abstract

The present disclosure relates to a thermal interface member and an electronic device comprising same. The electronic device according to one embodiment of the present disclosure may comprise: a display; a bracket disposed under the display so as to support the display; an electronic component disposed under the bracket; and a thermally responsive thermal interface member disposed between the electronic component and the bracket so as to diffuse heat generated from the electronic component toward the bracket, the thermal interface member being configured to be softened on the basis of a temperature of the electronic component, wherein the thermal interface member includes a first thermal interface layer and a second thermal interface layer stacked on each other, and the ductility of the second thermal interface layer is higher than the ductility of the first thermal interface layer.

Description

Thermal interface member and electronic device including same

[0001] Embodiments of the present disclosure relate to thermal interface members and electronic devices including the same, for example, to thermally responsive thermal interface members.

[0002] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0003] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure includes a display, a bracket disposed below the display to support the display, an electronic component disposed below the bracket, and a thermally responsive thermal interface member disposed between the electronic component and the bracket to diffuse heat generated from the electronic component toward the bracket, the thermal interface member being configured to soften based on a temperature of the electronic component, wherein the thermal interface member includes a first thermal interface layer and a second thermal interface layer laminated to each other, wherein each of the first thermal interface layer and the second thermal interface layer contains a heat dissipating material, a phase change material, and a matrix copolymer configured to maintain a shape of the thermal interface member at a temperature higher than a phase transition temperature of the phase change material, and wherein a ratio of a soft domain to a hard domain of the first matrix copolymer contained in the first thermal interface layer may be smaller than a ratio of a soft domain to a hard domain of the second matrix copolymer contained in the second thermal interface layer.

[0005] An electronic device according to one embodiment of the present disclosure includes a display, a bracket disposed below the display to support the display, an electronic component disposed below the bracket, and a thermally responsive thermal interface member disposed between the electronic component and the bracket to diffuse heat generated from the electronic component toward the bracket, the thermal interface member being configured to soften based on a temperature of the electronic component, wherein the thermal interface member includes at least one first thermal interface layer and at least one second thermal interface layer alternately laminated with each other, wherein each of the at least one first thermal interface layer and the at least one second thermal interface layer contains a heat dissipating material, a phase change material, and a matrix copolymer configured to maintain a shape of the thermal interface member at a temperature higher than a phase transition temperature of the phase change material, and wherein a ratio of a soft domain to a hard domain of the first matrix copolymer contained in the first thermal interface layer may be smaller than a ratio of a soft domain to a hard domain of the second matrix copolymer contained in the second thermal interface layer.

[0006] A thermally responsive thermal interface member according to one embodiment of the present disclosure comprises a first thermal interface layer, a second thermal interface layer laminated to the first thermal interface layer and configured to have a ductility higher than a ductility of the first thermal interface layer, the second thermal interface layer comprising a first matrix copolymer contained in the first thermal interface layer, and a second matrix copolymer contained in the second thermal interface layer, the second matrix copolymer having a ratio of soft domains to hard domains greater than that of the first matrix copolymer.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a diagram illustrating an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0009] FIG. 3 is a diagram illustrating an electronic device in a folded state according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a cross-sectional view of a portion of an electronic device taken along line AA' shown in FIG. 4, showing a board assembly.

[0012] FIGS. 6 to 8 illustrate an example of a process for manufacturing a thermal interface member according to one embodiment of the present disclosure.

[0013] FIG. 9 illustrates a thermal interface member and a conductive sheet according to one embodiment of the present disclosure.

[0014] FIG. 10 illustrates laminated structures of thermal interface layers according to various embodiments of the present disclosure.

[0015] FIG. 11 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 12 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure taken along line B-B' of FIG. 11, illustrating a substrate assembly.

[0017] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0018] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0019] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0020] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may include various processing circuits and / or multiple processors. For example, as used in this specification and claims, the term "processor" may include various processing circuits including at least one processor, one or more of which may be configured to individually and / or collectively perform the various functions described below in a distributed manner. As described below, when "processor," "at least one processor," and "one or more processors" are described as being configured to perform multiple functions, this includes, for example, instances where one processor performs some functions and another processor performs other functions, and instances where a single processor performs all of the stated functions. Furthermore, as an example, the at least one processor may include a combination of processors that perform the various functions described in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions.

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0045] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0046] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] The description of the electronic device (101) described with reference to FIG. 1 can be substantially equally applied to the electronic device (200) described with reference to FIGS. 2 to 10 and the electronic device described with reference to FIGS. 11 and 12, to the extent that they are not mutually disposed.

[0049] FIG. 2 is a diagram illustrating an electronic device (200) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 is a diagram illustrating an electronic device (200) in a folded state according to one embodiment of the present disclosure.

[0050] Referring to FIGS. 2 and 3, according to one embodiment of the present disclosure, an electronic device (200) may include a set housing (201), a hinge cover (230) covering a foldable portion of the set housing (201), and a flexible or foldable display (240) (hereinafter, simply referred to as “display” 240) disposed in the set housing (201). According to one embodiment, a surface on which the display (240) is disposed may be defined as a front surface of the electronic device (200) (e.g., a first front surface (210a) and a second front surface (220a)). A surface opposite to the front surface may be defined as a back surface of the electronic device (200) (e.g., a first back surface (210b) and a second back surface (220b)). Additionally, the surface surrounding the space between the front and back may be defined as a side surface of the electronic device (200) (e.g., a first side surface (211a) and a second side surface (221a)).

[0051] According to one embodiment of the present disclosure, the set housing (201) may include a first housing (210), a second housing (220) rotatably or pivotally coupled to the first housing (210), a first rear cover (280), a second rear cover (290), and a hinge assembly. The first housing (210) may be referred to as a first bracket (210). The second housing (220) may be referred to as a second bracket (220). The hinge assembly may provide at least one folding axis (F) that serves as a center of folding or unfolding of the electronic device (200) of the first housing (210) and / or the second housing (220).

[0052] According to one embodiment of the present disclosure, the first housing (210) may be connected to the hinge assembly and include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) may be connected to the hinge assembly and include a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction. Accordingly, the electronic device (200) may be variable between a folded state and an unfolded state. In the folded state of the electronic device (200), the first front surface (210a) may face the second front surface (220a), and in the unfolded state, the third direction may be substantially parallel to the first direction.

[0053] According to one embodiment of the present disclosure, the first housing (210) and the second housing (220) may be disposed on both sides with respect to the folding axis (F). For example, the first housing (210) and the second housing (220) may have a shape that is overall symmetrical with respect to the folding axis (F). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (200) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment of the present disclosure, the second housing (220), unlike the first housing (210), additionally includes a sensor area (224) in which various sensors (e.g., a front camera) are disposed, but may have a shape that is substantially symmetrical with respect to the first housing (210) in other areas. According to one embodiment, the folding axis (F) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (F) is provided along the longitudinal direction (Y-axis direction) of the electronic device (200), but the direction of the folding axis (F) is not limited thereto. For example, depending on the external design or the user's usage habits, the electronic device (200) may be understood to include a folding axis (F) extending along the width direction (e.g., X-axis direction).

[0054] According to one embodiment of the present disclosure, the electronic device (200) may include a structure into which a digital pen can be inserted. For example, a hole (223) into which the digital pen can be inserted may be formed on a side of the first housing (210) or a side of the second housing (220) of the electronic device (200).

[0055] According to one embodiment of the present disclosure, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a selected size to support the display (240). At least a portion formed of the metallic material may provide a ground for the electronic device (200).

[0056] According to one embodiment of the present disclosure, the sensor area (224) may be formed to have a predetermined area adjacent to one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. For example, in another embodiment, the sensor area (224) may be provided in another corner of the second housing (220), an arbitrary area between the upper corner and the lower corner, or in the first housing (210). According to one embodiment, components for performing various functions built into the electronic device (200) may be visually exposed to the front of the electronic device (200) through the sensor area (224) or through one or more openings provided in the sensor area (224). In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0057] According to one embodiment of the present disclosure, the first rear cover (280) is disposed on one side of the folding axis (F) on the rear surface of the electronic device (200) and may have, for example, a substantially rectangular periphery, and the periphery may be wrapped by the first housing (210). Similarly, the second rear cover (290) is disposed on the other side of the folding axis (F) on the rear surface of the electronic device (200) and may have the periphery wrapped by the second housing (220).

[0058] According to one embodiment of the present disclosure, the first rear cover (280) and the second rear cover (290) may have substantially symmetrical shapes with respect to the folding axis (F). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device (200) may include the first rear cover (280) and the second rear cover (290) of various shapes.

[0059] According to one embodiment of the present disclosure, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which various components (e.g., a printed circuit board or a battery) of the electronic device (200) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (200). For example, at least a portion of a sub-display (e.g., the sub-display (244) of FIG. 4) may be visually exposed through the first rear area (282) of the first rear cover (280). In another embodiment, one or more components or sensors may be visually exposed through the second rear area (292) of the second rear cover (290). In various embodiments, the sensor may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0060] According to one embodiment of the present disclosure, a front camera visually exposed to the front of the electronic device (200) through one or more openings provided in the sensor area (224) or a camera module (206) visually exposed through the second rear area (292) of the second rear cover (290) may include one or more lenses, image sensors, and / or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0061] Referring to FIG. 3, according to one embodiment of the present disclosure, the hinge cover (230) may be configured to be disposed between the first housing (210) and the second housing (220) and cover an internal component (e.g., the hinge assembly). According to one embodiment, the hinge cover (230) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (200) (unfolded state or folded state). For example, in the unfolded state, the hinge cover (230) may be substantially covered by the first housing (210) and the second housing (220), and in the folded state, most of the outer surface of the hinge cover (230) may be exposed to the outside.

[0062] According to one embodiment, as illustrated in FIG. 2, when the electronic device (200) is in an unfolded state, the hinge cover (230) may be covered by the first housing (210) and the second housing (220) and may not be exposed. As another example, as illustrated in FIG. 2, when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge cover (230) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (230) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. In one embodiment, the hinge cover (230) may include a curved surface.

[0063] According to one embodiment of the present disclosure, the display (240) may be disposed in the set housing (201). For example, the display (240) may be mounted on a recess formed by the set housing (201) and may form at least a portion of the front surface of the electronic device (200). Accordingly, the front surface of the electronic device (200) may include the display (240), a portion of the first housing (210) adjacent to the display (240) and a portion of the second housing (220). The rear surface of the electronic device (200) may include a first rear cover (280), a portion of the first housing (210) adjacent to the first rear cover (280), a second rear cover (290), and a portion of the second housing (220) adjacent to the second rear cover (290).

[0064] According to one embodiment of the present disclosure, the display (240) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. According to one embodiment, the display (240) may include a folding area (243), a first display area (241) arranged on one side (e.g., the left side of the folding area (243) illustrated in FIG. 2) with respect to the folding area (243), and a second display area (242) arranged on the other side (e.g., the right side of the folding area (243) illustrated in FIG. 2). The division of the areas of the display (240) is exemplary, and the display (240) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 1, the display (240) may be divided into regions by a folding region (243) extending parallel to the Y-axis or a folding axis (F, see FIG. 2), but in other embodiments, the display (240) may be divided into regions based on other folding regions (e.g., a folding region parallel to the X-axis) or other folding axes (e.g., a folding axis parallel to the X-axis).

[0065] According to one embodiment of the present disclosure, the display (240) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer (not shown) configured to detect a magnetic field type stylus pen.

[0066] According to one embodiment of the present disclosure, the first display area (241) and the second display area (242) may have an overall symmetrical shape centered on the folding area (243). According to one embodiment (not shown), the second display area (242), unlike the first display area (241), may include a cut notch depending on the presence of the sensor area (224), but may have a shape symmetrical with respect to the first display area (241) in other areas. In other words, the first display area (241) and the second display area (242) may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0067] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display (240) according to the state of the electronic device (200) (e.g., unfolded state and folded state) will be described.

[0068] According to one embodiment of the present disclosure, when the electronic device (200) is in a flat state (see FIG. 2), the first housing (210) and the second housing (220) may be arranged to form a substantially 180-degree angle and the first display area (241) and the second display area (242) may face substantially the same direction. For example, in the flat state, the surface of the first display area (241) and the surface of the second display area (242) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (243) may form the same plane as the first display area (241) and the second display area (242).

[0069] According to one embodiment of the present disclosure, when the electronic device (200) is in a folded state (e.g., see FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (241) of the display (240) and the surface of the second display area (242) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may substantially face each other. The folding area (243) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0070] According to one embodiment of the present disclosure, when the electronic device (200) is in an intermediate state (folded state) (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (241) of the display (240) and the surface of the second display area (242) may form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state. The folding area (243) may be formed as a curved surface having at least a certain curvature, and the curvature at this time may be smaller than that in the folded state.

[0071] FIG. 4 is an exploded perspective view of an electronic device (200) according to one embodiment of the present disclosure.

[0072] Referring to FIG. 4, an electronic device (200) according to one embodiment of the present disclosure may include a display (240), and a first bracket (210) and a second bracket (220) positioned below the display (240) to support the display (240). The second bracket (220) may include a plate portion (B) configured to support the display (240) and positioned above the thermal interface member (330). The plate portion (B) may have a shape extending parallel to the display (240). The display (240) may be stably supported by the plate portion (B), and the plate portion (B) and the display (240) may contact each other, or a buffer member may be interposed therebetween.

[0073] According to one embodiment of the present disclosure, the second bracket (220) may include a wall portion (W) connected to an edge of the plate portion (B) and extending along an edge of the display (240). The description of the plate portion (B) and the wall portion (W) of the second bracket (220) may be substantially identically applied to the first bracket (210).

[0074] According to one embodiment of the present disclosure, an electronic device (200) may include a substrate assembly (300) including electronic components and electrical elements for operation of the electronic device (200). The substrate assembly (300) may be disposed inside the electronic device (200). The substrate assembly (300) may be disposed below the plate portion (B) of the second bracket (220). The substrate assembly (300) will be described in detail below with reference to FIG. 5 .

[0075] According to one embodiment of the present disclosure, the electronic device (200) may include heat spreading members (V1, V2). For convenience of explanation, the heat spreading members (V1, V2) illustrated in FIG. 4 may be referred to as a first heat spreading member (V1) and a second heat spreading member (V2). The heat spreading members (V1, V2) may be configured to spread heat generated in the substrate assembly (300). The first heat spreading member (V1) may be disposed between the plate portion (B) of the second bracket (220) and the substrate assembly (300). The second heat spreading member (V2) may be disposed between the second rear cover (290) and the substrate assembly (300).

[0076] According to one embodiment of the present disclosure, an electronic device (200) may have a structure in which a substrate assembly (300), a first heat diffusion member (V1), a plate portion (B) of a second bracket (220), and a display (240) are sequentially stacked. The direction in which the substrate assembly (300), the first heat diffusion member (V1), the plate portion (B) of the second bracket (220), and the display (240) are sequentially stacked may be referred to as a stacking direction (SD).

[0077] FIG. 5 is a cross-sectional view of a portion of an electronic device (200) taken along line AA' shown in FIG. 4, showing a substrate assembly (300).

[0078] Referring to FIGS. 4 and 5 , a substrate assembly (300) according to one embodiment of the present disclosure may include a printed circuit board (310). The printed circuit board (310) may include a first side (311) and a second side (312) facing opposite directions. Electrical components, such as capacitors, inductors, and integrated circuits, may be disposed on the first side (311) and / or the second side (312) of the printed circuit board (310). As an example, the first side (311) of the printed circuit board (310) may face the same direction as the front side (220a, see FIG. 2) of the electronic device (200). As an example, the second side (312) of the printed circuit board (310) may face the same direction as the rear side (220b, see FIG. 2) of the electronic device (200).

[0079] According to one embodiment of the present disclosure, a substrate assembly (300) may include an electronic component (E) disposed on a printed circuit board (310). The electronic component (E) may be disposed on a first surface (311) of the printed circuit board (310). The electronic component (E) may be disposed below the second bracket (220). The electronic component (E) may be an integrated circuit. As an example, the electronic component (E) may be a processor (120, see FIG. 1).

[0080] According to one embodiment of the present disclosure, a substrate assembly (300) may include a plurality of electrical components (C). The plurality of electrical components (C) may be disposed on a second surface (312) of a printed circuit board (310). The plurality of electrical components (C) may include components such as capacitors, inductors, and resistors.

[0081] According to one embodiment of the present disclosure, the substrate assembly (300) may include a first shield can (321) disposed on a first surface (311) of a printed circuit board (310). The first shield can (321) may surround an electronic component (E). The first shield can (321) may include an opening in which a thermal interface member (330) is disposed.

[0082] According to one embodiment of the present disclosure, the substrate assembly (300) may include a second shield can (322) disposed on a second side (312) of a printed circuit board (310). The second shield can (322) may surround an electronic component (E). The second shield can (322) may include an opening in which a heat dissipation member (330') is disposed. The heat dissipation member (330') will be described in detail below.

[0083] According to one embodiment of the present disclosure, the substrate assembly (300) may include a first thermally conductive sheet (341) disposed between a first thermal diffusion sheet (V1) and a thermal interface member (330). The first thermally conductive sheet (341) may be disposed on the thermal interface member (330). The first thermally conductive sheet (341) may cover the opening of the first shield can (321). Heat generated from the electronic component (E) may be transferred to the plate portion (B) side of the second bracket (220) along the thermal interface member (330), the first thermally conductive sheet (341), and the first thermal diffusion sheet (V1). The heat transferred to the plate portion (B) side of the second bracket (220) may be diffused along the second bracket (220).

[0084] According to one embodiment of the present disclosure, the first thermally conductive sheet (341) may be conductive. For example, the first thermally conductive sheet (341) may be a copper thin film. A first adhesive member (D1) may be disposed between the first thermally conductive sheets (341). A second adhesive member (D2) may be disposed between the first thermally conductive sheets (341) and the first shield can (321). The first adhesive member (D1) and the second adhesive member (D2) may be conductive. The first shield can (321), the first thermally conductive sheet (341), the first adhesive member (D1), and the second adhesive member (D2) may form a shielding structure that surrounds the electronic component (E) as a whole.

[0085] According to one embodiment of the present disclosure, the substrate assembly (300) may include a second heat-conducting sheet (342) covering the opening of the second shield can (322). Heat generated from the electronic component (E) and / or the plurality of electric elements (C) may be transferred to the second heat diffusion member (V2) along the heat dissipation member (330') and the second heat-conducting sheet (342).

[0086] According to one embodiment of the present disclosure, the second thermally conductive sheet (342) may be conductive. As an example, the second thermally conductive sheet (342) may be a copper thin film. The second shield can (322) and the second thermally conductive sheet (342) may form a shielding structure that entirely surrounds the electronic component (E).

[0087] According to one embodiment of the present disclosure, the substrate assembly (300) may include a thermal interface member (330) configured to dissipate heat generated from an electronic component (E). The thermal interface member (330) may be disposed between the electronic component (E) and a first heat diffusion sheet (V1). The thermal interface member (330) may diffuse heat generated from the electronic component (E) toward the first heat diffusion sheet (V1). The thermal interface member (330) may be disposed between the electronic component (E) and the bracket (220) to diffuse heat generated from the electronic component (E) toward the bracket (220).

[0088] According to one embodiment of the present disclosure, the thermal interface member (330) may be configured to exhibit thermally reactive behavior. The thermal interface member (330) may be configured to absorb ambient heat and soften. As an example, the thermal interface member (330) may be understood as a thermally reactive member configured to transition from a solid state to a softened rubbery state due to heat generated from an electronic component (E).

[0089] According to one embodiment of the present disclosure, an electronic component (E) may include a plurality of integrated circuits (E1, E2) spaced apart from each other. The plurality of integrated circuits (E1, E2) may include a first integrated circuit (E1) and a second integrated circuit (E2) in contact with the thermal interface member (330). As an example, the first integrated circuit (E1) may be a processor (120, see FIG. 1), and the second integrated circuit (E2) may be a power management integrated circuit (e.g., a power management module (188) of FIG. 1).

[0090] According to one embodiment of the present disclosure, the thermal interface member (330) may include sheet portions (331, 332) on which the first thermal interface layer (331) and the second thermal interface layer (332) are positioned. The sheet portions (331, 332) may contact an upper surface of the first integrated circuit (E1). The thermal interface member (330) may include a protruding portion (333) that protrudes from the sheet portions (331, 332) toward an upper surface of the second integrated circuit (E2). The protruding portion (333) may contact an upper surface of the second integrated circuit (E2).

[0091] According to one embodiment of the present disclosure, the sheet portions (331, 332) of the thermal interface member (330) may include a first thermal interface layer (331) and a second thermal interface layer (332) that are laminated to each other. FIG. 5 exemplarily illustrates a structure in which the first thermal interface layer (331) is laminated on a top surface of an electronic component (E), and the second thermal interface layer (332) is laminated on the first thermal interface layer (331).

[0092] According to one embodiment of the present disclosure, the stiffness of the first thermal interface layer (331) and the stiffness of the second thermal interface layer (332) may be different from each other. The stiffness of the second thermal interface layer (332) may be less than the stiffness of the first thermal interface layer (331). The ductility of the second thermal interface layer (332) may be greater than the ductility of the first thermal interface layer (331). The second thermal interface layer (332) may be disposed closer to the display (240) than the first thermal interface layer (331). The second thermal interface layer (332) may be disposed closer to the bracket (220) than the first thermal interface layer (331). In the lamination direction (SD), the thickness of the second thermal interface layer (332) may be greater than the thickness of the first thermal interface layer (331).

[0093] According to one embodiment of the present disclosure, the substrate assembly (300) may include a heat dissipation member (330'). The heat dissipation member (330') may be disposed between the printed circuit board (310) and the second heat-conducting sheet (342). The heat dissipation member (330') may have a form that penetrates between the plurality of electric elements (C). The heat dissipation member (330') may be configured to diffuse heat generated from the plurality of electric elements (C) toward the second heat-conducting sheet (342).

[0094] According to one embodiment of the present disclosure, the description of the thermal interface member (330) described with reference to FIGS. 5 to 10 may be substantially identically applied to the heat dissipation member (330') to the extent that they are not mutually disposed. For example, the heat dissipation member (330') may be configured to exhibit thermal reactivity behavior similar to the thermal interface member (330) and may include a plurality of thermal interface layers (e.g., a first thermal interface layer (331) and a second thermal interface layer (332)).

[0095] Figures 6 to 8 illustrate an example of a process for manufacturing a thermal interface member (330) according to one embodiment of the present disclosure. Figure 6 illustrates a first thermal interface sheet (331R) and a second thermal interface sheet (332R) in a rubber state before being bonded. Figure 7 illustrates a process for punching the first thermal interface sheet (331') and the second thermal interface sheet (332') in a solid state bonded to each other into a predetermined shape. Figure 8 illustrates a cross-section of a thermal interface member (330) manufactured by punching according to one embodiment of the present disclosure.

[0096] Referring to FIGS. 5 to 8, a thermal interface member (330) according to an embodiment of the present disclosure may be configured to exhibit thermoresponsive behavior. The thermal interface member (330) may be configured to soften based on the temperature of the electronic component (E). The thermal interface member (330) may be heated by absorbing ambient heat and may transition to a rubbery state. For example, the thermal interface member (330) may be solid at room temperature, and when the surface temperature of the electronic component (E) increases due to the operation of the electronic component (E), heat may be transferred to the thermal interface member (330) in contact with the electronic component (E), and the transferred heat may soften the thermal interface member (330) to a rubbery state. Since heat around the thermal interface member (330) is absorbed during the phase transition process of the thermal interface member (330), the thermal interface member (330) can have high thermal conductivity (e.g., 5 to 6 W / m·K).

[0097] According to one embodiment of the present disclosure, each of the first thermal interface layer (331) and the second thermal interface layer (332) included in the thermal interface member (330) may contain a heat dissipation material (H1, H2). As an example, the heat dissipation material (H1, H2) may be aluminum oxide (Al2O3) or aluminum nitride (AlN). As another example, the heat dissipation material (H1, H2) may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0098] For convenience of explanation, the heat dissipation material contained in the first thermal interface layer (331) may be named a first heat dissipation material (H1), and the heat dissipation material contained in the second thermal interface layer (332) may be named a second heat dissipation material (H2). The first heat dissipation material (H1) and the second heat dissipation material (H2) may be the same material. In another embodiment, the first heat dissipation material (H1) and the second heat dissipation material (H2) may be different materials.

[0099] According to one embodiment of the present disclosure, each of the first thermal interface layer (331) and the second thermal interface layer (332) may contain a phase change material (P). For example, the phase change material (P) may include a paraffin-based material or PEG (Polyethylene Glycol), which is a temperature-sensitive material. The phase change material (P) may be a temperature-responsive material, and as an example, may be a thermoplastic polymer.

[0100] For convenience of explanation, the phase change material contained in the first thermal interface layer (331) may be named a first phase change material (P1), and the phase change material contained in the second thermal interface layer (332) may be named a second phase change material (P2). The first phase change material (P1) and the second phase change material (P2) may be the same material. According to another embodiment, the first phase change material (P1) and the second phase change material (P2) may be different materials.

[0101] According to one embodiment of the present disclosure, the phase change material (P) may be in a solid phase at a temperature lower than a phase transition temperature, and may be in a liquid phase or a rubbery state at a temperature higher than the phase transition temperature. As an example, the phase transition temperature may be a temperature of 45 degrees Celsius to 65 degrees Celsius. The phase transition temperature of the phase change material (P) may be understood as a specific temperature or a predetermined temperature range including the specific temperature.

[0102] According to one embodiment of the present disclosure, the phase change material (P) may be in a solid state at room temperature. The heat dissipation member (430) may be configured to be in a solid state at room temperature (Tr). As an example, the room temperature (Tr) may be a temperature of 15 degrees Celsius to 25 degrees Celsius. The phase transition temperature of the phase change material (P) may be higher than the room temperature.

[0103] According to one embodiment of the present disclosure, the phase transition temperature of the phase change material (P) may be lower than the operating temperature of the electronic component (E). The operating temperature of the electronic component (E) may be understood as a temperature caused by heat generation of the electronic component (E) measured during the operation of the electronic component (E), and may be measured through at least one thermistor included in the electronic component (E).

[0104] According to one embodiment of the present disclosure, the phase transition temperature of the phase change material (P) may be lower than the throttling temperature of the electronic component (E). The throttling may be a temporary reduction in the performance of the electronic component (E) to prevent the temperature or power consumption of the electronic component (E) from exceeding a specific threshold.

[0105] According to one embodiment of the present disclosure, when the thermal interface member (330) is in a solid state, the transportation, placement, and assembly of the thermal interface member (330) may be easier compared to when the thermal interface member (330) is in a gel or rubber state. Since the solid thermal interface member (330) has a certain level of stiffness or more, structural deformation (e.g., stamping or pressing) of the thermal interface member (330) that may occur during the assembly and transportation process may be reduced. Such structural deformation may cause a local deterioration in the heat transfer performance of the thermal interface member (330).

[0106] According to one embodiment of the present disclosure, the thermal interface member (330) may include a matrix material (M) configured to maintain the shape of the thermal interface member (330) at a temperature higher than the phase transition temperature of the phase change material (P). At a temperature higher than the phase transition temperature of the phase change material (P), the thermal interface member (330) may be maintained in a rubbery state by the matrix material (M).

[0107] The matrix material (M) functions as a frame of the heat dissipation member (430), so that the shape of the heat dissipation member (430) can be substantially maintained even if the temperature of the heat dissipation member (430) rises above the phase transition temperature (Tc). As an example, the matrix material may be a rubber-based material. The matrix material is not limited to a rubber-based material, and may be replaced with a material that can function as a frame. For example, the matrix material (M) may include silicone, an acrylic resin, and / or SEBS (styrene-ethylene-butylene-styrene).

[0108] According to one embodiment of the present disclosure, a thermal interface member (330) may include a plurality (e.g., two) of thermal interface layers (331, 332) having different ductility. The plurality of thermal interface layers (331, 332) may include a first thermal interface layer (331) and a second thermal interface layer (332). As an example, the stiffness of the second thermal interface layer (332) may be lower than the stiffness of the first thermal interface layer (331).

[0109] When the rigidity of the thermal interface member (330) is higher than the allowable range (when the ductility is lower than the allowable range), structural deformation may occur in the surrounding structure (e.g., the plate portion (B) of the second bracket (220) and / or the display (240)) due to the rigidity of the thermal interface member (330). For example, when assembling the substrate assembly (300) by sequentially stacking the first thermally conductive sheet (341), the second bracket (220), and the display (240) after placing the thermal interface member (330) on top of the electronic component (E), if the thermal interface member (330) is not completely compressed due to the rigidity of the thermal interface member (330), structural deformation such as the second bracket (220) and the display (240) protruding may occur. When the rigidity of the thermal interface member (330) is lower than the allowable range (when the ductility is higher than the allowable range), the member may easily break or tear during the shape processing process as shown in FIG. 7.

[0110] According to one embodiment of the present disclosure, a thermal interface member (330) includes a first thermal interface layer (331) having relatively high rigidity and a second thermal interface layer (332) having relatively high ductility, so that occurrence of defects occurring during the structural deformation or shape processing of the surrounding structure mentioned above can be minimized, prevented, and / or reduced.

[0111] According to one embodiment of the present disclosure, the yield load of the second bracket (220) may be greater than the yield load of the thermal interface member (330) based on the stacking direction (SD) in which the electronic component (E), the thermal interface member (330), the bracket (220), and the display (240) are sequentially stacked. More specifically, the yield load of the plate portion (B) of the second bracket (220) based on the stacking direction (SD) may be greater than the yield load of the thermal interface member (330) in a rubber state at the operating temperature of the electronic component (E) based on the stacking direction (SD).

[0112] According to one embodiment of the present disclosure, the yield load based on the stacking direction (SD) may be understood as the minimum force applied in the stacking direction (SD) that causes plastic deformation. As an example, the yield load of the thermal interface member (330) based on the stacking direction (SD) may be understood as a force that compresses the thermal interface member (330). At the operating temperature of the electronic component (E), the compressive load of the first thermal interface layer (331) in the stacking direction (SD) may be greater than the compressive load of the second thermal interface layer (332).

[0113] According to one embodiment of the present disclosure, the heat dissipation material (H) is a material that determines the thermal conductivity of the thermal interface member (330), but as the content of the heat dissipation material (H) increases, the rigidity of the thermal interface member (330) may increase. However, when the content of the heat dissipation material (H) is lowered in order to increase the ductility of the thermal interface member (330), the thermal conductivity of the thermal interface member (330) may decrease. Therefore, in order to increase the ductility of the thermal interface member (330) without reducing the content of the heat dissipation material (H), the rigidity and ductility of the thermal interface member (330) may be controlled by adjusting the ratio (e.g., weight ratio) of the hard domain and the soft domain of the matrix material (M).

[0114] According to one embodiment of the present disclosure, the matrix material (M) may include SEBS (styrene-ethylene-butylene-styrene, hereinafter referred to as SEBS) including a hard block (e.g., a styrene block) that increases the rigidity of the thermal interface member (330) and a soft block (ethylene-butylene block) that increases the ductility. The chemical formula of the SEBS is as shown in [Chemical Formula 1] below. As another example, the matrix material (M) may include polyurethane.

[0115]

[0116] According to one embodiment of the present disclosure, a thermal interface member (330) may include a first matrix copolymer (M1) contained in a first thermal interface layer (331) and a second matrix copolymer (M2) contained in a second thermal interface layer (332). The first matrix copolymer (M1) and the second matrix copolymer (M2) may have different ratios (e.g., weight ratios) between soft domains and hard domains. For example, the ratio (e.g., weight ratio) of styrene blocks to ethylene-butylene blocks contained in the first matrix copolymer (M1) may be greater than the ratio (e.g., weight ratio) of styrene blocks to ethylene-butylene blocks contained in the second matrix copolymer (M2).

[0117] According to one embodiment of the present disclosure, the ratio (e.g., weight ratio) of the styrene block to the ethylene-butylene block of the first thermal interface layer (331) and the second thermal interface layer (332), and the resulting compressive load of the first thermal interface layer (331) and the second thermal interface layer (332), are as shown in [Table 1] below. The compressive load (gf) described in [Table 1] is a value in gram-force and can be understood as a load applied based on the stacking direction (SD) at the operating temperature of the electronic component (E).

[0118] Item 1st column interface layer 2nd column interface layer Styrene block: Ethylene-butylene block 30:70 15:85 Compressive load (gf) 1445919

[0119] According to one embodiment of the present disclosure, the ratio (e.g., weight ratio) of the soft domain to the hard domain of the first matrix copolymer (M1) contained in the first thermal interface layer (331) may be smaller than the ratio (e.g., weight ratio) of the soft domain to the hard domain of the second matrix copolymer (M2) contained in the second thermal interface layer (332). The ductility of the second thermal interface layer (332) containing the second matrix copolymer (M2) may be higher than the ductility of the first thermal interface layer (331) containing the first matrix copolymer (M1).

[0120] According to one embodiment of the present disclosure, the hard domain may be understood as a region occupied by a block included in the first matrix copolymer (M1) or the second matrix copolymer (M2) that affects the rigidity of the first thermal interface layer (331) containing the first matrix copolymer (M1) or the second thermal interface layer (332) containing the second matrix copolymer (M2). The soft domain may be understood as a region occupied by a block included in the first matrix copolymer (M1) or the second matrix copolymer (M2) that affects the ductility of the first thermal interface layer (331) containing the first matrix copolymer (M1) or the second thermal interface layer (332) containing the second matrix copolymer (M2).

[0121] For example, based on the first matrix copolymer (M1), as the ratio (e.g., weight ratio) of the hard domain increases, the stiffness of the first thermal interface layer (331) containing the first matrix copolymer (M1) may increase. In addition, based on the first matrix copolymer (M1), as the ratio (e.g., weight ratio) of the soft domain increases, the ductility of the first thermal interface layer (331) containing the first matrix copolymer (M1) may increase.

[0122] For example, based on the second matrix copolymer (M2), as the ratio (e.g., weight ratio) of the hard domain increases, the stiffness of the second thermal interface layer (332) containing the second matrix copolymer (M2) may increase. In addition, based on the second matrix copolymer (M2), as the ratio (e.g., weight ratio) of the soft domain increases, the ductility of the second thermal interface layer (332) containing the first matrix copolymer (M2) may increase.

[0123] According to one embodiment of the present disclosure, the first thermal interface layer (331) and the second thermal interface layer (332) can be fused to each other by heat at a temperature higher than the phase transition temperature of the phase change material (P1, P2). When an adhesive member is interposed between the first thermal interface layer (331) and the second thermal interface layer (332), and the first thermal interface layer (331) and the second thermal interface layer (332) are adhered to each other, the adhesive member acts as a thermal resistance, and thus the thermal conductivity of the thermal interface member (330) can be reduced compared to a case where the adhesive member is not present.

[0124] According to one embodiment of the present disclosure, the thermal interface member (330) can be fused to each other by, for example, a thermocompression process performed under a temperature environment of 90 to 110 degrees Celsius, which is higher than the phase transition temperature of the phase change materials (P1, P2), and a pressure of 20 to 30 psi. In a temperature range higher than the phase transition temperature, the first thermal interface layer (331) and the second thermal interface layer (332) can be fused to each other without an adhesive member due to the adhesiveness of the phase change materials (P1, P2) contained in the first thermal interface layer (331) and the second thermal interface layer (332), and thus, the thermal resistance between the first thermal interface layer (331) and the second thermal interface layer (332) can be eliminated.

[0125] Referring to FIG. 6, the first thermal interface sheet and the second thermal interface sheet according to one embodiment of the present disclosure can be transitioned into a rubber state at a temperature range higher than the phase transition temperature of the phase change material (P1, P2). The first thermal interface sheet may be understood as a raw material of the first thermal interface layer before being formed into the thermal interface member (330) according to one embodiment of the present disclosure. The second thermal interface sheet may be understood as a raw material of the second thermal interface layer before being formed into the thermal interface member (330) according to one embodiment of the present disclosure. The first thermal interface sheet (331R) and the second thermal interface sheet (332R) transitioned into a rubber state by heat may be joined to each other to become one member (330') as illustrated in FIG. 7.

[0126] Referring to FIG. 7, according to one embodiment of the present disclosure, the first thermal interface sheet and the second thermal interface sheet, which are combined into one member (330') and cooled to a solid state, may be punched along a cutting line (CL) of a predetermined shape to produce a thermal interface member (330). Depending on the shape of the cutting line (CL) or the number of the thermal interface sheets, the shape of the heat dissipation member (430) may vary. As an example, FIGS. 6 to 8 illustrate a case where there are two thermal interface sheets (e.g., a first thermal interface sheet and a second thermal interface sheet), but as illustrated in FIG. 5, a thermal interface member (330) including a protruding portion (333) may be understood as a case where there are three thermal interface sheets.

[0127] Referring to FIG. 8, according to one embodiment of the present disclosure, a thermal interface member (330) manufactured by being pressed and then bonded together may include a first thermal interface layer (331) and a second thermal interface layer (332). Since the first thermal interface layer (331) and the second thermal interface layer (332) are bonded to each other by the adhesiveness of the phase change material (P1, P2), the boundary (F) between the first thermal interface layer (331) and the second thermal interface layer (332) may be substantially difficult to observe with the naked eye.

[0128] FIG. 9 illustrates a thermal interface member (330) and a conductive sheet (341) according to one embodiment of the present disclosure.

[0129] Referring to FIGS. 5 and 9, a thermal interface member (330) according to one embodiment of the present disclosure may include a plurality of protruding portions (333-1, 333-2). The plurality of protruding portions (333-1, 333-2) may include a first protruding portion (333-1) and a second protruding portion (333-2). The first protruding portion (333-1) may be understood to contact the second integrated circuit (E) illustrated in FIG. 5. The second protruding portion (333-2), although not illustrated, may contact other electronic components disposed on a printed circuit board (310, see FIG. 5). Therefore, according to one embodiment of the present disclosure, the thermal interface member (330) can effectively spread heat by contacting a plurality of electronic components (e.g., a first electronic component (E1) and a second electronic component (E2)) having different heights protruding from the printed circuit board (310) through a plurality of protruding portions (333-1, 333-2).

[0130] FIG. 10 illustrates laminated structures of thermal interface layers (HL, SL) according to various embodiments of the present disclosure.

[0131] The description of the first thermal interface layer (331) described with reference to FIGS. 5 to 9 can be substantially equally applied to the hard layer (HL) described with reference to FIG. 10 to the extent that they are not arranged with each other. The description of the second thermal interface layer (332) described with reference to FIGS. 5 to 9 can be substantially equally applied to the soft layer (SL) described with reference to FIG. 10 to the extent that they are not arranged with each other.

[0132] Referring to FIG. 10, according to various embodiments of the present disclosure, a thermal interface member may include at least one rigid layer (HL) and at least one ductile layer (SL). The rigid layer (HL) may be referred to as a rigid thermal interface layer. The ductile layer (SL) may be referred to as a ductile thermal interface layer. The rigid layer (HL) may have a higher rigidity than the ductile layer (SL). The ductile layer (SL) may have a higher ductility than the rigid layer (HL). At least one rigid layer (HL) and at least one ductile layer (SL) may be alternately laminated.

[0133] Although not illustrated in FIG. 10, (A) to (D) represent thermal interface members according to various embodiments of the present disclosure, and the stacking order from bottom to top may be substantially the same as the stacking order (SD) described with reference to FIG. 5. As an example, the thermal interface member illustrated in FIG. 10 (A) may be understood to have a structure in which a flexible layer (SL), a rigid layer (HL), and a flexible layer (SL) are sequentially stacked on the upper surface of an electronic component (E).

[0134] The thermal interface member illustrated in (A) of FIG. 10 may have a structure in which a flexible layer (SL), a rigid layer (HL), and a flexible layer (SL) are sequentially and alternately laminated from an electronic component (E, see FIG. 5). The thermal interface member illustrated in (B) of FIG. 10 may have a structure in which a rigid layer (HL), a flexible layer (SL), and a rigid layer (HL) are sequentially and alternately laminated from an electronic component (E, see FIG. 5). The thermal interface member illustrated in (C) of FIG. 10 may have a structure in which a flexible layer (SL), a rigid layer (HL), a flexible layer (SL), and a rigid layer (HL) are sequentially and alternately laminated from an electronic component (E, see FIG. 5). The thermal interface member illustrated in (D) of Fig. 10 may have a structure in which a rigid layer (HL), a flexible layer (SL), a rigid layer (HL), and a flexible layer (SL) are sequentially and alternately laminated from an electronic component (E, see Fig. 5).

[0135] FIG. 11 is an exploded perspective view showing the front of an electronic device (101) according to one embodiment of the present disclosure. FIG. 12 is a cross-sectional view of a portion of the electronic device (101) according to one embodiment of the present disclosure taken along line B-B' of FIG. 11, illustrating a substrate assembly (400).

[0136] The description of components described with reference to FIGS. 2 to 10 (e.g., substrate assembly (300), printed circuit board (310), electronic component (E), shield can (321, 322), thermal interface member (330), thermal conductive sheets (341, 342), and / or heat spreading member (V1, V2)) can be substantially identically applied to components of the same name described with reference to FIGS. 11 and 12 (e.g., substrate assembly (500), printed circuit board (510), electronic component (E1', E2'), shield can (520), thermal interface member (530), thermal conductive sheets (541, 542), and / or heat spreading member (V')) to the extent that they are not mutually arranged.

[0137] Referring to FIG. 11, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure may include a bracket (410) (or housing), a front plate (420), a display (430), at least one printed circuit board (or board assembly) (440a, 440b), a battery (450), a support member (460) (e.g., a rear case), a camera assembly (407), and a rear plate (480).

[0138] According to one embodiment of the present disclosure, when an electronic device (101) includes a plurality of printed circuit boards (440a, 440b), it can electrically connect different printed circuit boards by including at least one flexible printed circuit board (440c). For example, the printed circuit boards (440a, 440b) can include a first circuit board (440a) positioned above a battery (450) and a second circuit board (440b) positioned below, and the flexible printed circuit board (440c) can electrically connect the first circuit board (440a) and the second circuit board (440b).

[0139] According to one embodiment of the present disclosure, the electronic device (101) may include a bracket (410) (or housing) including a plate portion (B') and a wall portion (W'). The description of the plate portion (B) and the wall portion (W) of the second bracket (220) described with reference to FIG. 4 may be substantially identically applied to the plate portion (B') and the wall portion (W') of the bracket (410) of the same name described with reference to FIGS. 11 and 12 to the extent that they are not mutually arranged.

[0140] According to one embodiment of the present disclosure, the front plate (420) may be coupled to the wall portion (W') of the bracket (410) via an adhesive member. The front plate (420) may be referred to as a front cover. The rear plate (480) may be referred to as a rear cover. The edge of the rear plate (480) may be supported by the wall portion (W') of the bracket (410). The bracket (410) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (440a, 440b) or a battery (450).

[0141] According to one embodiment of the present disclosure, the support member (460) may include, for example, an upper support member (460a) and a lower support member (460b). In one embodiment, the upper support member (460a) may be arranged to surround a printed circuit board (440a, 440b) (e.g., a first circuit board (440a)).

[0142] In one embodiment of the present disclosure, a circuit device (e.g., a processor, a communication module, or a memory) implemented in the form of an integrated circuit chip or various electrical / electronic components may be placed on a printed circuit board (440a, 440b), and according to an embodiment, the printed circuit board (440a, 440b) may be provided with an electromagnetic shielding environment from a support member (460). In one embodiment, the lower support member (460b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. Electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board that is not illustrated.

[0143] According to one embodiment of the present disclosure, a battery (450) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (450) may be disposed substantially on the same plane as, for example, a printed circuit board (440a, 440b). The battery (450) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0144] According to one embodiment of the present disclosure, an electronic device (101) may include a heat spreading member (V') configured to spread heat. The heat spreading member (V') may be disposed on a plate portion (B') of a bracket (410). Heat generated in a substrate assembly (500) may be spread through the plate portion (B') of the bracket (410) and the heat spreading member (V').

[0145] Referring to FIGS. 11 and 12 , an electronic device (101) according to one embodiment of the present disclosure may include a substrate assembly (500). The substrate assembly (500) may include a printed circuit board (510). At least one electronic component (E1', E2') may be disposed on the printed circuit board (510). The substrate assembly (500) may include electronic components (E1', E2') disposed on the printed circuit board (510). The electronic components (E1', E2') may include a first electronic component (E1') disposed on the printed circuit board (510) and a second electronic component (E2') disposed on the first electronic component (E1'). As an example, the first electronic component (E1') may be a processor (120, see FIG. 1), and the second electronic component (E') may be a memory (130, see FIG. 1) connected to the first electronic component (E1').

[0146] According to one embodiment of the present disclosure, a substrate assembly (500) may include a thermal interface member (530) configured to diffuse heat generated from electronic components (E1', E2') toward a bracket (410). The thermal interface member (530) may be in contact with the first electronic component (E1') and the second electronic component (E2'). Heat generated from the first electronic component (E1') and the second electronic component (E2') may diffuse toward the heat diffusion member (V') through the thermal interface member (530).

[0147] The thermal interface member (530) may include a sheet portion (533, 534) that contacts the upper surface of the second electronic component (E1') and a protruding portion (531, 532) that protrudes from the sheet portion (533, 534) and contacts the upper surface of the first electronic component (E1'). The description of the sheet portion (331, 332) and the protruding portion (333) of the thermal interface member (330) described with reference to FIGS. 5 and 9 may be substantially identically applied to the sheet portion (533, 534) and the protruding portion (531, 532) of the thermal interface member (530) described with reference to FIG. 12 to the extent that they are not mutually arranged.

[0148] According to one embodiment of the present disclosure, the sheet portions (533, 534) of the thermal interface member (530) may include a first thermal interface layer (534) and a second thermal interface layer (533). The description of the first thermal interface layer (331) and the second thermal interface layer (332) described with reference to FIGS. 5 to 10 may be substantially identically applied to the first thermal interface layer (534) and the second thermal interface layer (533) of the same name described with reference to FIG. 12, to the extent that they are not arranged with each other.

[0149] According to one embodiment of the present disclosure, the substrate assembly (500) may include a first thermally conductive sheet (541) disposed between the thermal interface member (530) and the plate portion (B') of the bracket (410). As an example, the first thermally conductive sheet (541) may be a copper thin film. Heat generated from the electronic components (E1', E2') may be configured to diffuse toward the bracket (410) through the thermal interface member (500) and the first thermally conductive sheet (541).

[0150] According to one embodiment of the present disclosure, the substrate assembly (500) may include a second thermally conductive sheet (542) disposed between the shield can (520) and the first thermally conductive sheet (541). As an example, the second thermally conductive sheet (542) may be a copper thin film having a hole formed therein corresponding to the opening of the shield can (520). Heat generated from the electronic components (E1', E2') may be configured to diffuse toward the bracket (410) through the thermal interface member (500) and the second thermally conductive sheet (542).

[0151] As the integration and performance of electronic components (e.g., processors, memory, etc.) increase, their heat generation increases. However, if the heat generated by these electronic components is not dissipated, it can affect the operation of electronic devices (e.g., performance degradation due to throttling). Therefore, extensive research is being conducted on thermal interface materials for heat dissipation in electronic components.

[0152] A problem to be solved in the present disclosure may be to reduce the stiffness of a thermal interface member without reducing the thermal conductivity of the thermal interface member.

[0153] The problem to be solved in the present disclosure may be to provide a thermal interface member that has high compressibility and is easy to manufacture in various shapes.

[0154] The problems to be addressed in this disclosure are not limited to the problems mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0155] A thermal interface member and an electronic device including the same according to various embodiments of the present disclosure can reduce the stiffness of a thermal interface member without reducing the thermal conductivity of the thermal interface member by controlling the ratio (e.g., weight ratio) of a soft domain and a hard domain of a matrix material contained in the thermal interface member.

[0156] A thermal interface member and an electronic device including the same according to various embodiments of the present disclosure can provide a thermal interface member having high compressibility and being easy to manufacture in various shapes through a structure in which layers having different compressive strengths are laminated.

[0157] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the above description.

[0158] According to one embodiment of the present disclosure, an electronic device may include a display (240) and a bracket (220) positioned below the display (240) to support the display (240).

[0159] According to one embodiment of the present disclosure, the electronic device may include an electronic component (E) disposed below the bracket (220).

[0160] According to one embodiment of the present disclosure, the electronic device may include a thermoresponsive thermal interface member (330) disposed between the electronic component (E) and the bracket (220) to diffuse heat generated from the electronic component (E) toward the bracket (220).

[0161] According to one embodiment of the present disclosure, the thermal interface member (330) may exhibit thermoresponsive behavior in which the state changes depending on the temperature.

[0162] According to one embodiment of the present disclosure, the thermal interface member (330) may be configured to soften based on the temperature of the electronic component (E).

[0163] According to one embodiment of the present disclosure, the thermal interface member (330) may include a first thermal interface layer (331) and a second thermal interface layer (332) that are laminated to each other.

[0164] According to one embodiment of the present disclosure, each of the first thermal interface layer (331) and the second thermal interface layer (332) included in the thermal interface member (330) may contain a heat dissipation material (H1, H2).

[0165] According to one embodiment of the present disclosure, each of the first thermal interface layer (331) and the second thermal interface layer (332) may contain a phase change material (P1, P2).

[0166] According to one embodiment of the present disclosure, each of the first thermal interface layer (331) and the second thermal interface layer (332) may contain a matrix copolymer (M1, M2) configured to maintain the shape of the thermal interface member (330) at a temperature higher than the phase transition temperature of the phase change material (P1, P2).

[0167] According to one embodiment of the present disclosure, the ratio (e.g., weight ratio) of the soft domain to the hard domain of the first matrix copolymer (M1) contained in the first thermal interface layer (331) may be smaller than the ratio (e.g., weight ratio) of the soft domain to the hard domain of the second matrix copolymer (M2) contained in the second thermal interface layer (332).

[0168] According to one embodiment of the present disclosure, the second thermal interface layer (332) may be disposed closer to the display (240) than the first thermal interface layer (331).

[0169] According to one embodiment of the present disclosure, the first thermal interface layer (331) may be in contact with the upper surface of the electronic component (E), and the second thermal interface layer (332) may be laminated on the first thermal interface layer (331).

[0170] According to one embodiment of the present disclosure, the second thermal interface layer (SL) may be disposed closer to the electronic component (E) than the first thermal interface layer (HL).

[0171] According to one embodiment of the present disclosure, the second thermal interface layer (SL) may be in contact with the upper surface of the electronic component (E), and the first thermal interface layer (HL) may be laminated on the second thermal interface layer (SL).

[0172] According to one embodiment of the present disclosure, the hard domain of each of the first matrix copolymer (M1) and the second matrix copolymer (M2) may include a styrene block.

[0173] According to one embodiment of the present disclosure, the soft domain of each of the first matrix copolymer (M1) and the second matrix copolymer (M2) may include an ethylene-butylene block.

[0174] According to one embodiment of the present disclosure, the thermal interface member (330) may be configured to exhibit thermoresponsive behavior in which it is in a solid state at room temperature and becomes at least partially in a rubbery state at the operating temperature of the electronic component (E).

[0175] According to one embodiment of the present disclosure, based on a stacking direction (SD) in which the electronic component (E), the thermal interface member (330), the bracket (220), and the display (240) are sequentially stacked, the yield load of the bracket (220) may be greater than the yield load of the thermal interface member (330).

[0176] According to one embodiment of the present disclosure, at the operating temperature of the electronic component (E), the compressive load of the first thermal interface layer (331) in the stacking direction (SD) may be greater than the compressive load of the second thermal interface layer (332).

[0177] According to one embodiment of the present disclosure, in the stacking direction (SD), the thickness of the second thermal interface layer (332) may be greater than the thickness of the first thermal interface layer (331).

[0178] According to one embodiment of the present disclosure, the first thermal interface layer (331) and the second thermal interface layer (332) can be fused to each other by heat at a temperature higher than the phase transition temperature of the phase change material (P1, P2).

[0179] According to one embodiment of the present disclosure, the electronic component (E) may include a first integrated circuit (E1) and a second integrated circuit (E2) that are spaced apart from each other and in contact with the thermal interface member (330).

[0180] According to one embodiment of the present disclosure, the thermal interface member (330) may include a sheet portion (331, 332) on which the first thermal interface layer (331) and the second thermal interface layer (332) are positioned and which contacts the upper surface of the first integrated circuit (E1).

[0181] According to one embodiment of the present disclosure, the thermal interface member (330) may include a protruding portion (333) that protrudes from the sheet portion (331, 332) toward the upper surface of the second integrated circuit (E2) and contacts the upper surface of the second integrated circuit (E2).

[0182] According to one embodiment of the present disclosure, the bracket (220) may include a plate portion (B) configured to support the display (240) and positioned above the thermal interface member (330).

[0183] According to one embodiment of the present disclosure, the bracket (220) may include a wall portion (W) connected to an edge of the plate portion (B) and extending along an edge of the display (240).

[0184] According to one embodiment of the present disclosure, the thermal interface member (330) may be configured to contain 90 wt% or more of the heat dissipating material (H1, H2) and have a thermal conductivity of 5 to 6 W / m·K.

[0185] According to one embodiment of the present disclosure, the first thermal interface layer (HL) and the second thermal interface layer (SL) may be at least one (e.g., a plurality) and may be alternately laminated.

[0186] According to one embodiment of the present disclosure, the ductility of the second thermal interface layer (332) can be configured to have a higher ductility than the ductility of the first thermal interface layer (331).

[0187] According to one embodiment of the present disclosure, the first thermal interface layer (331) and the second thermal interface layer (332) can be thermally joined to each other at a temperature higher than the phase transition temperature of the phase change material (P1, P2).

[0188] According to one embodiment of the present disclosure, the thermal interface member (330) may have a structure in which the first thermal interface layer (HL) and the second thermal interface layer (SL) are alternately laminated.

[0189] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (200), display (240); A bracket (220) positioned below the display (240) to support the display (240); Electronic components (E) placed below the above bracket (220); and A thermoresponsive thermal interface member (330) is disposed between the electronic component (E) and the bracket (220) to spread heat generated from the electronic component (E) toward the bracket (220), and is configured to soften based on the temperature of the electronic component (E). The above thermal interface member (330) is A first thermal interface layer (331) and a second thermal interface layer (332) are laminated to each other, and each of the first thermal interface layer (331) and the second thermal interface layer (332) contains a heat dissipation material (H1, H2), a phase change material (P1, P2), and a matrix copolymer (M1, M2) configured to maintain the shape of the thermal interface member (330) at a temperature higher than the phase transition temperature of the phase change material (P1, P2). An electronic device in which the ratio of the soft domain to the hard domain of the first matrix copolymer (M1) contained in the first thermal interface layer (331) is smaller than the ratio of the soft domain to the hard domain of the second matrix copolymer (M2) contained in the second thermal interface layer (332).

2. In paragraph 1, The above second thermal interface layer (332) is An electronic device positioned closer to the display (240) than the first thermal interface layer (331).

3. In paragraph 2, An electronic device in which the first thermal interface layer (331) contacts the upper surface of the electronic component (E), and the second thermal interface layer (332) is laminated on the first thermal interface layer (331).

4. In paragraph 1, The above second thermal interface layer (SL) is, An electronic device positioned closer to the electronic component (E) than the first thermal interface layer (HL).

5. In paragraph 4, An electronic device in which the second thermal interface layer (SL) is in contact with the upper surface of the electronic component (E), and the first thermal interface layer (HL) is laminated on the second thermal interface layer (SL).

6. In any one of paragraphs 1 to 5, The hard domain of each of the first matrix copolymer (M1) and the second matrix copolymer (M2) includes a styrene block, An electronic device wherein each of the soft domains of the first matrix copolymer (M1) and the second matrix copolymer (M2) includes an ethylene-butylene block.

7. In any one of paragraphs 1 to 6, The above thermal interface member (330) is An electronic device configured to exhibit thermoresponsive behavior that is solid at room temperature and at least partially rubbery at the operating temperature of the electronic component (E).

8. In any one of paragraphs 1 to 7, An electronic device in which the yield load of the bracket (220) is greater than the yield load of the thermal interface member (330) based on the stacking direction (SD) in which the electronic component (E), the thermal interface member (330), the bracket (220), and the display (240) are sequentially stacked.

9. In paragraph 8, An electronic device in which, at the operating temperature of the electronic component (E), the compressive load of the first thermal interface layer (331) in the stacking direction (SD) is greater than the compressive load of the second thermal interface layer (332).

10. In paragraph 8 or 9, An electronic device in which, in the above lamination direction (SD), the thickness of the second thermal interface layer (332) is greater than the thickness of the first thermal interface layer (331).

11. In any one of paragraphs 1 to 10, The above first thermal interface layer (331) and the above second thermal interface layer (332) are, An electronic device in which phase change materials (P1, P2) are joined together by heat at a temperature higher than the phase transition temperature.

12. In any one of paragraphs 1 to 11, The above electronic component (E) is A first integrated circuit (E1) and a second integrated circuit (E2) are spaced apart from each other and are in contact with the thermal interface member (330), The above thermal interface member (330) is: A sheet portion (331, 332) on which the first thermal interface layer (331) and the second thermal interface layer (332) are positioned and which contacts the upper surface of the first integrated circuit (E1); and An electronic device including a protruding portion (333) protruding from the sheet portion (331, 332) toward the upper surface of the second integrated circuit (E2) and contacting the upper surface of the second integrated circuit (E2).

13. In any one of paragraphs 1 to 12, The above bracket (220) is: A plate portion (B) configured to support the display (240) and positioned above the thermal interface member (330); and An electronic device comprising a wall portion (W) connected to the edge of the plate portion (B) and extending along the edge of the display (240).

14. In any one of paragraphs 1 to 13, The above thermal interface member (330) is An electronic device comprising 90 wt% or more of the heat-dissipating material (H1, H2) and having a thermal conductivity of 5 to 6 W / m·K.

15. In the thermoresponsive thermal interface member (330), Containing a heat dissipating material (H1, H2), a phase change material (P1, P2), and a matrix material (M1, M2) configured to maintain the thermal interface member (330) in a rubbery state at a temperature higher than the phase transition temperature of the phase change material (P1, P2), It includes a first thermal interface layer (331) and a second thermal interface layer (332) that is fused to the first thermal interface layer and configured to have a higher ductility than the ductility of the first thermal interface layer (331). The above matrix materials (M1, M2) are: A first matrix copolymer (M1) contained in the first thermal interface layer (331); and A thermal interface member comprising a second matrix copolymer (M2) contained in the second thermal interface layer (331) and having a greater ratio of soft domains to hard domains than that of the first matrix copolymer.

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