Electronic device including electrostatic discharge path

Abstract

According to one embodiment disclosed herein, an electronic device may comprise: a housing including a side member formed of a conductive material; a printed circuit board disposed in an inner space of the housing; and a conductive connection member electrically connecting the side member and the printed circuit board. According to one embodiment, the printed circuit board may include a conductive pattern formed to correspond to the conductive connection member. According to one embodiment, the conductive pattern may include a first conductive member and a second conductive member spaced a designated distance apart from each other. In one embodiment, the movement path of static electricity that flows in through the conductive connection member may be formed such that the static electricity moves to the first conductive member, the second conductive member, and the ground of the printed circuit board. In addition to the various embodiments disclosed herein, various other embodiments may be possible.

Description

Electronic devices containing electrostatic discharge paths

[0001] Embodiments of the present disclosure relate to an electronic device including an electrostatic discharge path.

[0002] Electrostatic discharge (ESD) can occur between electronic components and electrical objects made of conductive materials. ESD can refer to an electrical phenomenon that occurs when charges accumulated by various factors instantly move to another part. ESD can occur in electronic components due to static electricity accumulated inside or outside an electronic device. In particular, static electricity can be applied through conductive connecting members that connect the side of an electronic device to a printed circuit board arranged in an internal space of the electronic device. In this case, damage to electronic components caused by the static electricity can be prevented through an ESD protection device.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] However, electrostatic protection devices may contain parasitic components, which may cause not only static electricity applied through conductive connecting elements, but also wireless signals in certain frequency bands to be induced into the electrostatic protection device. As wireless signals are induced into the electrostatic protection device, performance degradation of wireless signals in certain frequency bands may occur.

[0005] An electronic device according to various embodiments of the present disclosure may include a conductive pattern formed on a printed circuit board to correspond to a conductive connecting member and including a first conductive member and a second conductive member spaced apart at a specified interval. The electronic device may form a path for static electricity to move so that static electricity introduced through the conductive connecting member moves to the first conductive member, the second conductive member, and the ground of the printed circuit board.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing including a side member formed of a conductive material, a printed circuit board arranged in an internal space of the housing, and a conductive connecting member electrically connecting the side member and the printed circuit board. According to one embodiment, the printed circuit board may include a conductive pattern formed to correspond to the conductive connecting member. According to one embodiment, the conductive pattern may include a first conductive member and a second conductive member arranged to be spaced apart from each other by a specified interval. In one embodiment, a movement path of static electricity may be formed such that static electricity introduced through the conductive connecting member moves to the first conductive member, the second conductive member, and the ground of the printed circuit board.

[0007] An electronic device according to one embodiment of the present disclosure can prevent damage to electronic components caused by static electricity by forming a path for static electricity to move so that static electricity introduced through a conductive connecting member moves to a first conductive member, a second conductive member, and the ground of a printed circuit board. In addition, a wireless signal of a specific frequency band (e.g., a wireless signal of a high frequency band) may not be transmitted along the path for static electricity to move, thereby preventing a wireless signal of a specific frequency band from moving to the ground of the printed circuit board, thereby preventing a degradation in the performance of a wireless signal of a specific frequency band.

[0008] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0009] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIGS. 2A and 2B are front and rear views of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0012] FIGS. 3A and 3B are front and rear views of a folded state of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 4 is a schematic diagram illustrating an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 5 is a schematic diagram of a rear view of a portion of a configuration of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0015] FIGS. 6A and 6B are diagrams illustrating the printed circuit board of FIG. 5 according to one embodiment of the present disclosure.

[0016] FIG. 7 is a drawing for explaining a movement path of static electricity according to one embodiment of the present disclosure.

[0017] FIG. 8A is a circuit for explaining a movement path of static electricity using a conductive pattern according to one embodiment of the present disclosure.

[0018] FIG. 8b is a circuit for explaining a movement path of static electricity using a conductive pattern according to one embodiment of the present disclosure.

[0019] FIG. 9 is a drawing for explaining conductive patterns formed on the printed circuit board of FIG. 5 according to one embodiment of the present disclosure.

[0020] FIG. 10 is a drawing for explaining a dummy element included in a printed circuit board according to one embodiment of the present disclosure.

[0021] FIG. 11 is a circuit for explaining a movement path of static electricity using a conductive pattern and a dummy element according to one embodiment of the present disclosure.

[0022] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0023] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] FIGS. 2A and 2B are front and rear views of an electronic device (200) in an unfolded state according to one embodiment of the present disclosure. FIGS. 3A and 3B are front and rear views of an electronic device (200) in a folded state according to one embodiment of the present disclosure.

[0047] According to various embodiments, the embodiments disclosed in FIG. 1 may be included in the embodiments disclosed in FIGS. 2A to 3B. For example, the electronic device (200) disclosed in FIGS. 2A to 3B may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a communication module (190), an antenna module (197), and / or a subscriber identification module (196) disclosed in FIG. 1.

[0048] Referring to FIGS. 2A to 3B , an electronic device (200) according to various embodiments of the present disclosure may include a pair of housings (e.g., a first housing (210), a second housing (220)) that are rotatably coupled about a folding axis (A) through a hinge module (e.g., a hinge plate (320) and a hinge device of FIG. 4 ) so as to be foldable with respect to each other, a flexible display (230) (e.g., a first display, a foldable display, or a main display) disposed through the pair of housings (210, 220), and / or a sub-display (300) (e.g., a second display) disposed through the second housing (220).

[0049] According to various embodiments, at least a portion of the hinge module (e.g., the hinge plate (320) of FIG. 4) may be positioned so as not to be visible from the outside through the first housing (210) and the second housing (220), and in an unfolded state, may be positioned so as not to be visible from the outside through a hinge cover (310) (e.g., the hinge housing) that covers the foldable portion.

[0050] In this document, the surface on which the flexible display (230) is placed may be defined as the front side (e.g., in the z-axis direction) of the electronic device (200), and the surface opposite the front side may be defined as the back side (e.g., in the -z-axis direction) of the electronic device (200). The surface surrounding the space between the front side and the back side may be defined as the side surface of the electronic device (200).

[0051] According to various embodiments, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via a hinge module (e.g., a hinge plate (320) of FIG. 4). The pair of housings (210, 220) are not limited to the shapes and combinations illustrated in FIGS. 2A to 3B and may be implemented by other shapes or combinations and / or combinations of parts. For example, the first housing (210) and the second housing (220) may be arranged on opposite sides (e.g., in the x-axis direction and the -x-axis direction) with respect to a folding axis (A) and may have a shape that is overall symmetrical with respect to the folding axis (A). According to various embodiments, the first housing (210) and the second housing (220) may also be folded asymmetrically with respect to the folding axis (A). The angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0052] According to various embodiments, when the electronic device (200) is in an unfolded state, the first housing (210) may be connected to a first side (e.g., in the x-axis direction) of a hinge module (e.g., the hinge plate (320) of FIG. 4) and may include a first side member (213) arranged to face the front of the electronic device (200), a second side member (212) facing the opposite direction of the first side member (211), and / or a first side member (213) surrounding at least a portion of a first space between the first side member (211) and the second side member (212).

[0053] According to various embodiments, when the electronic device (200) is in an unfolded state, the second housing (220) may be connected to a second side (e.g., in the -x-axis direction) of a hinge module (e.g., the hinge plate (320) of FIG. 4) and may include a third side member (221) arranged to face the front of the electronic device (200), a fourth side member (222) facing the opposite direction of the third side member (221), and / or a second side member (223) surrounding at least a portion of a second space between the third side member (221) and the fourth side member (222).

[0054] According to various embodiments, the first side (211) may face substantially in the same direction as the third side (221) in an unfolded state and may at least partially face the third side (221) in a folded state.

[0055] According to various embodiments, the electronic device (200) may include a recess (201) formed to accommodate a flexible display (230) through a structural combination of the first housing (210) and the second housing (220). The recess (201) may have substantially the same size as the flexible display (230).

[0056] According to various embodiments, the hinge cover (310) (e.g., hinge housing) may be disposed between the first housing (210) and the second housing (220). The hinge cover (310) may be disposed to cover a portion of the hinge module (e.g., hinge plate (320) of FIG. 4). The hinge cover (310) may be covered by a portion of the first housing (210) and the second housing (220), or may be exposed to the outside, depending on the unfolded state, the folded state, or the intermediate state of the electronic device (200).

[0057] According to various embodiments, when the electronic device (200) is in an unfolded state, at least a portion of the hinge cover (310) may be covered by the first housing (210) and the second housing (220) and may not be substantially exposed to the outside. When the electronic device (200) is in a folded state, at least a portion of the hinge cover (310) may be exposed to the outside between the first housing (210) and the second housing (220). When the electronic device (200) is in an intermediate state where the first housing (210) and the second housing (220) are folded with a certain angle, the hinge cover (310) may be at least partially exposed to the outside of the electronic device (200) between the first housing (210) and the second housing (220). For example, the area where the hinge cover (310) is exposed to the outside may be less than that in a completely folded state. The hinge cover (310) may include at least a partially curved surface.

[0058] According to various embodiments, when the electronic device (200) is in an unfolded state (e.g., the state of FIGS. 2A and 2B), the first housing (210) and the second housing (220) may form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the flexible display (230) may be arranged to form the same plane and face substantially the same direction (e.g., the z-axis direction). In another embodiment, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated in an outfolding manner with respect to the second housing (220) so as to be folded so that the second side (212) and the fourth side (222) face each other.

[0059] According to various embodiments, when the electronic device (200) is in a folded state (e.g., the state of FIGS. 3A and 3B), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may be arranged to face each other. In this case, the first region (230a) and the second region (230b) of the flexible display (230) may be arranged to face each other by forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with each other through the folding region (230c).

[0060] According to various embodiments, the folding area (230c) may be deformed into a curved shape having at least a certain curvature. When the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first area (230a) and the second area (230b) of the flexible display (230) may form an angle that is greater than that in the folded state and less than that in the unfolded state, and the curvature of the folding area (230c) may be less than that in the folded state and greater than that in the unfolded state.

[0061] According to various embodiments, the first housing (210) and the second housing (220) may form an angle that allows them to stop at a designated folding angle between a folded state and an unfolded state through a hinge module (e.g., a hinge plate (320) of FIG. 4) (e.g., a free stop function). In some embodiments, the first housing (210) and the second housing (220) may be continuously operated while being pressed in an unfolding direction or a folding direction based on a designated inflection angle through a hinge module (e.g., a hinge plate (320) of FIG. 4).

[0062] According to various embodiments, the electronic device (200) may include at least one of a display (e.g., a flexible display (230), a sub-display (300)), an input device (215), an audio output device (227, 228), a sensor module (217, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may omit at least one of the above-described components or may additionally include at least one other component.

[0063] According to various embodiments, the at least one display (e.g., flexible display (230), sub-display (300)) may include a flexible display (230) (e.g., first display) that is arranged to be supported by a third side (221) of a second housing (220) through a hinge module (e.g., hinge plate (320) of FIG. 4) from a first side (211) of a first housing (210), and a sub-display (300) (e.g., second display) that is arranged to be at least partially visible from the outside through a fourth side (222) in an internal space of the second housing (220). In some embodiments, the sub-display (300) may be arranged to be visible from the outside through the second side (212) in an internal space of the first housing (210). According to one embodiment, the flexible display (230) may be primarily used in the unfolded state of the electronic device (200), and the sub-display (300) may be primarily used in the folded state of the electronic device (200). According to one embodiment, the electronic device (200) may control the flexible display (230) and / or the sub-display (300) to be usable based on the folding angles of the first housing (210) and the second housing (220) in the intermediate state.

[0064] According to various embodiments, the flexible display (230) may be placed in a receiving space formed by a pair of housings (210, 220). For example, the flexible display (230) may be placed in a recess (201) formed by a pair of housings (210, 220), and may be placed so as to occupy substantially most of the front surface of the electronic device (200) when unfolded. According to one embodiment, at least a portion of the flexible display (230) may be deformed into a flat or curved surface. The flexible display (230) may include a first region (230a) facing the first housing (210), a second region (230b) facing the second housing (220), and a folding region (230c) connecting the first region (230a) and the second region (230b) and facing a hinge module (e.g., the hinge plate (320) of FIG. 4). According to one embodiment, the region division of the flexible display (230) is merely an exemplary physical division by a pair of housings (210, 220) and a hinge module (e.g., a hinge plate (320) of FIG. 4), and in reality, the flexible display (230) can be displayed as a seamless, full screen through a pair of housings (210, 220) and a hinge module (e.g., a hinge plate (320) of FIG. 4). The first region (230a) and the second region (230b) may have an overall symmetrical shape with respect to the folding region (230c), or may have a partially asymmetrical shape.

[0065] According to various embodiments, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of the first housing (210) and a second rear cover (250) disposed on a fourth side (222) of the second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223). In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate.

[0066] According to various embodiments, the first rear cover (240) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The second rear cover (250) may be formed by, for example, a substantially transparent plate, such as, for example, glass or polymer. In this case, the second display (300) may be arranged so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0067] According to various embodiments, the input module (215) may include a microphone. In some embodiments, the input module (215) may include a plurality of microphones arranged to detect the direction of sound. The input module (215) may include the input module (150) disclosed in FIG. 1.

[0068] According to various embodiments, the audio output module (227, 228) may include speakers. In one embodiment, the audio output module (227, 228) may include a call receiver (227) disposed through the fourth side (222) of the second housing (220) and an external speaker (228) disposed through at least a portion of the second side member (223) of the second housing (220). In some embodiments, the input module (215), the audio output module (227, 228), and the connector (229) may be disposed in spaces of the first housing (210) and / or the second housing (220) and may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In some embodiments, the holes formed in the first housing (210) and / or the second housing (220) may be used in common for the input module (215) and the audio output module (227, 228). In some embodiments, the audio output module (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220). The audio output module (227, 228) may include the audio output module (155) disclosed in FIG. 1.

[0069] According to various embodiments, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first side (211) of the first housing (210), a second camera module (216b) disposed on a second side (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth side (222) of the second housing (220). According to one embodiment, the electronic device (200) may include a flash (218) disposed near the second camera module (216b). The flash (218) may include, for example, a light emitting diode or a xenon lamp. According to one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on either side of the first housing (210) and / or the second housing (220). The camera module (216a, 216b, 225) may include the camera module (180) disclosed in FIG. 1.

[0070] According to various embodiments, the sensor module (217, 226) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. According to one embodiment, the sensor module (217, 226) may include a first sensor module (217) disposed on a first surface (211) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220). In some embodiments, the sensor module (217, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor). The sensor module (217, 226) may include the sensor module (176) disclosed in FIG. 1.

[0071] According to various embodiments, the electronic device (200) may further include at least one of a sensor module not shown, for example, a pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, a Hall sensor, a six-axis sensor, an acceleration sensor, an angular velocity sensor, and a fingerprint recognition sensor. In some embodiments, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0072] According to various embodiments, the key input device (219) may be arranged to be exposed to the outside through the first side member (213) of the first housing (210). In some embodiments, the key input device (219) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). In some embodiments, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 300). In another embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 300). The key input device (219) may turn the electronic device (200) on or off, or adjust the volume.

[0073] According to various embodiments, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device (e.g., an external electronic device (102, 104, 108) of FIG. 1). In some embodiments, the connector port (229) may also perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals. The connector port (229) may include a connection terminal (178) disclosed in FIG. 1.

[0074] According to various embodiments, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 300). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 300) in the interior space of at least one housing (210, 220), below an active area of ​​at least one display (230, 300), and may be arranged to be in contact with the external environment through an opening or transparent area perforated up to a cover member (e.g., a window layer (not shown) of the flexible display (230) and / or a second rear cover (250)). In one embodiment, an area where at least one display (230, 300) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. The transparent area may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by an image sensor to create an image. For example, the transparent area of ​​at least one display (230, 300) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC).In other embodiments, some camera modules or sensor modules (217, 226) may be positioned to perform their functions without being visually exposed through the display. For example, an area facing a camera module (216a, 225) and / or a sensor module (217, 226) positioned under at least one display (230, 300) (e.g., a display panel) may have an under-display camera (UDC) structure, eliminating the need for a perforated opening.

[0075] FIG. 4 is a schematic diagram illustrating an exploded perspective view of an electronic device (200) according to one embodiment of the present disclosure.

[0076] Referring to FIG. 4, the electronic device (200) may include a flexible display (230) (e.g., a first display), a sub-display (300) (e.g., a second display), a hinge plate (320) (e.g., a hinge module, a hinge device, a hinge assembly), a pair of support members (e.g., a first support member (261), a second support member (262)), at least one substrate (270) (e.g., a printed circuit board), a first housing (210), a second housing (220), a first rear cover (240), and / or a second rear cover (250).

[0077] According to various embodiments, the flexible display (230) may include a display panel (430) (e.g., a flexible display panel), a support plate (450) disposed at a lower portion (e.g., in the -z-axis direction) of the display panel (430), and a pair of metal plates (461, 462) disposed at a lower portion (e.g., in the -z-axis direction) of the support plate (450).

[0078] According to various embodiments, the display panel (430) may include a first panel area (430a) corresponding to a first area of ​​the flexible display (230) (e.g., the first area (230a) of FIG. 2A), a second panel area (430b) extending from the first panel area (430a) and corresponding to a second area of ​​the flexible display (230) (e.g., the second area (230b) of FIG. 2A), and a third panel area (430c) connecting the first panel area (430a) and the second panel area (430b) and corresponding to a folding area of ​​the flexible display (230) (e.g., the folding area (230c) of FIG. 2A).

[0079] According to various embodiments, a support plate (450) may be disposed between the display panel (430) and a pair of support members (261, 262). The support plate (450) may be formed to have a material and shape to provide a planar support structure for the first panel region (430a) and the second panel region (430b) and a bendable structure to aid in bendability for the third panel region (430c). According to one embodiment, the support plate (450) may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber reinforced plastics (FRP)). According to one embodiment, the pair of metal plates (461, 462) may include a first metal plate (461) arranged to correspond to at least a portion of the first panel area (430a) and the third panel area (430c) and a second metal plate (462) arranged to correspond to at least a portion of the second panel area (430b) and the third panel area (430c) between the support plate (450) and the pair of support members (261, 262). According to one embodiment, the pair of metal plates (461, 462) may be formed of a metal material (e.g., SUS), thereby helping to reinforce the ground connection structure and rigidity for the flexible display (230).

[0080] According to various embodiments, the sub-display (300) may be disposed in the space between the second housing (220) and the second rear cover (250). According to one embodiment, the sub-display (300) may be disposed in the space between the second housing (220) and the second rear cover (250) so as to be visible from the outside through substantially the entire area of ​​the second rear cover (250).

[0081] According to various embodiments, at least a portion of the first support member (261) may be foldably coupled to the second support member (262) via a hinge plate (320) (e.g., a hinge module). In one embodiment, the electronic device (200) may include at least one conductive connection member (263) (e.g., a flexible printed circuit board) disposed from at least a portion of the first support member (261) across the hinge plate (320) to a portion of the second support member (262). In one embodiment, the first support member (261) may be disposed in a manner that extends from the first side member (213) or is structurally coupled with the first side member (213). According to one embodiment, the electronic device (200) may include a first space (e.g., first space (2101) of FIG. 2A) provided through a first support member (261) and a first rear cover (240).

[0082] According to various embodiments, the first housing (210) (e.g., the first housing structure) may be configured by combining a first side member (213), a first support member (261), and a first rear cover (240). According to one embodiment, the second support member (262) may be arranged to extend from the second side member (223) or be structurally coupled with the second side member (223). According to one embodiment, the electronic device (200) may include a second space (e.g., the second space (2201) of FIG. 2A) provided through the second support member (262) and the second rear cover (250).

[0083] According to various embodiments, the second housing (220) (e.g., the second housing structure) may be configured by combining the second side member (223), the second support member (262), and the second rear cover (250). In one embodiment, at least one conductive connection member (263) and / or at least a portion of the hinge plate (320) may be arranged to be supported by at least a portion of a pair of support members (261, 262). In one embodiment, at least one conductive connection member (263) may be arranged in a direction transverse to the first support member (261) and the second support member (262) (e.g., in the x-axis direction and the -x-axis direction). In one embodiment, at least one conductive connection member (263) may be arranged in a direction substantially perpendicular to a folding axis (e.g., the y-axis or the folding axis (A) of FIG. 2A) (e.g., in the x-axis direction).

[0084] According to various embodiments, at least one substrate (270) may include a first substrate (271) (e.g., a first printed circuit board) disposed in a first space (2101) and a second substrate (272) (e.g., a second printed circuit board) disposed in a second space (2201). According to one embodiment, the first substrate (271) and the second substrate (272) may include at least one electronic component disposed to implement various functions of the electronic device (200). According to one embodiment, the first substrate (271) (e.g., the first printed circuit board) and the second substrate (272) (e.g., the second printed circuit board) may be electrically connected via at least one conductive connecting member (263). In one embodiment, a camera module (282) may be disposed on the first substrate (271).

[0085] According to various embodiments, the electronic device (200) may include at least one battery (291, 292). In one embodiment, the at least one battery (291, 292) may include a first battery (291) disposed in a first space (2101) of a first housing (210) and electrically connected to a first substrate (271) and a second battery (292) disposed in a second space (2201) of a second housing (220) and electrically connected to a second substrate (272). In one embodiment, the first support member (261) and the second support member (262) may further include at least one swelling hole for the first battery (291) and the second battery (292).

[0086] According to various embodiments, the first housing (210) may include a first rotation support surface (214). The second housing (220) may include a second rotation support surface (224). According to one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may include curved surfaces corresponding to the curved outer surface of the hinge cover (310). According to one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may cover the hinge cover (310) when the electronic device (200) is in an unfolded state, thereby allowing the hinge cover (310) not to be exposed to the rear surface of the electronic device (200) or only partially exposed. According to one embodiment, the first rotational support surface (214) and the second rotational support surface (224) can rotate along the outer surface of the hinge cover (310) when the electronic device (200) is in a folded state, thereby causing the hinge cover (310) to be at least partially exposed to the rear surface of the electronic device (200).

[0087] According to various embodiments, the electronic device (200) may include at least one antenna (276) (e.g., an antenna module) disposed in a first space (2201). According to one embodiment, the at least one antenna (276) may be disposed between the first battery (291) and the first rear cover (240) in the first space (2201). According to one embodiment, the at least one antenna (276) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, an ultra wide band (UWB) antenna, and / or a magnetic secure transmission (MST) antenna. According to one embodiment, the at least one antenna (276) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. According to various embodiments, the at least one antenna (276) (e.g., antenna module) is not limited to the examples described above, and may include various other antennas (e.g., mmWave antennas) as long as they can perform wireless communication with other electronic devices (e.g., electronic devices 102 and / or 104 of FIG. 1 ). For example, the antenna structure may be formed by at least a portion of the first side member (213) or the second side member (223) and / or a portion of the first support member (261) and the second support member (262), or a combination thereof.

[0088] According to various embodiments, the electronic device (200) may further include at least one electronic component assembly (274, 275) and / or additional support members (273, 277) disposed in the first space (2101) and / or the second space (2201). For example, the at least one electronic component assembly (274, 275) may include an interface connector port assembly (274) or a speaker assembly (275). For example, the additional support member (273) may include a speaker assembly (273).

[0089] According to one embodiment, the electronic device (200) has a foldable type appearance as illustrated in the embodiments disclosed in FIGS. 1 to 4 and below, but the present invention is not limited thereto. For example, the electronic device (200) may be part of a bar type (or plate type) electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The term “sliderable electronic device”, “stretchable electronic device”, and / or “rollable electronic device” may refer to an electronic device in which a display (e.g., a flexible display (230) of FIG. 2A) is wound or rolled, at least partially expanded in area, and / or can be accommodated inside a housing (e.g., a housing (e.g., a first housing (210) and / or a second housing (220) of FIGS. 2A to 4)). The slidable electronic device, the stretchable electronic device, and / or the rollable electronic device may be used by expanding the screen display area by unfolding the flexible display (230) or exposing a wider area of ​​the flexible display (230) to the outside, depending on the needs of the user.

[0090] FIG. 5 is a schematic diagram of a portion of a configuration of an electronic device (200) when in an unfolded state, as viewed from the rear, according to one embodiment of the present disclosure.

[0091] FIG. 5 according to various embodiments may be a schematic drawing of a portion of a first housing (210) and a second housing (220) with the first rear cover (240) and the second rear cover (250) omitted when the electronic device (200) disclosed in FIG. 2b is in an unfolded state, as viewed from the rear (e.g., in the -z-axis direction).

[0092] According to various embodiments, the electronic device (200) disclosed below may include embodiments of the electronic device (101) disclosed in FIG. 1 and the electronic device (200) disclosed in FIGS. 2A to 4. In the description of the electronic device (200) disclosed below, components that are substantially the same as those of the embodiments disclosed in FIGS. 1 to 4 are given the same reference numerals, and redundant descriptions of their functions may be omitted.

[0093] Referring to FIG. 5, the electronic device (200) may include a first housing (210), a hinge module (320), and a second housing (220).

[0094] According to one embodiment, the first housing (210) and the second housing (220) can operate in an unfolded or folded state, as disclosed in FIGS. 2A to 3B, with respect to the hinge module (320) (e.g., the hinge plate of FIG. 4). The hinge module (320) can rotatably couple the first housing (210) and the second housing (220).

[0095] According to one embodiment, the first housing (210) may be at least partially coupled with a first side (e.g., in the x-axis direction) of the hinge module (320). The second housing (220) may be at least partially coupled with a second side (e.g., in the -x-axis direction) of the hinge module (320). The first housing (210) may be configured to be unfoldable and foldable with respect to the second housing (220) using the hinge module (320). The second housing (220) may be configured to be unfoldable and foldable with respect to the first housing (210) using the hinge module (320).

[0096] Referring to FIG. 5, when the electronic device (200) is in an unfolded state, the first housing (210) of the electronic device (200) may be connected to a first side (e.g., in the x-axis direction) of a hinge module (e.g., the hinge plate (320) of FIG. 4), and may include a first side member (213) arranged to face the front of the electronic device (200), a second side member (212) facing the opposite direction of the first side member (211), and / or a first side member (213) surrounding at least a portion of a first space between the first side member (211) and the second side member (212).

[0097] In one embodiment, when the electronic device (200) is in an unfolded state, the second housing (220) of the electronic device (200) may be connected to a second side (e.g., in the -x-axis direction) of a hinge module (e.g., the hinge plate (320) of FIG. 4) and may include a third side member (221) arranged to face the front of the foldable electronic device (200), a fourth side member (222) facing the opposite direction of the third side member (221), and / or a second side member (223) surrounding at least a portion of a second space between the third side member (221) and the fourth side member (222).

[0098] According to various embodiments, the electronic device (200) may include a housing (e.g., a first housing (210) and a second housing (220)) in which at least a portion of a side surface (e.g., a first side member (213) and a second side member (223)) of the electronic device (200) is formed of a conductive material (e.g., a metal material). In one embodiment, the first housing (210) may include a first conductive portion (2141), a second conductive portion (2142), a third conductive portion (2143), and / or a fourth conductive portion (2144) that include a portion of the first side member (213). In one embodiment, the first conductive portion (2141) may be formed by a second segment (2132) and a fifth segment (2135). The second conductive portion (2142) can be formed through the first segment (2131) and the third segment (2133). The third conductive portion (2143) can be formed through the fifth segment (2135) and the sixth segment (2136). The fourth conductive portion (2144) can be formed through the third segment (2133) and the fourth segment (2134). In one embodiment, the second housing (220) can include a fifth conductive portion (2241), a sixth conductive portion (2242), a seventh conductive portion (2243), and / or an eighth conductive portion (2244) that comprise a portion of the second side member (223). In one embodiment, the fifth conductive portion (2241) may be formed through the eighth segment (2232) and the eleventh segment (2235). The sixth conductive portion (2242) may be formed through the seventh segment (2231) and the ninth segment (2233). The seventh conductive portion (2243) may be formed through the eleventh segment (2235) and the twelfth segment (2236). The eighth conductive portion (2244) may be formed through the ninth segment (2233) and the tenth segment (2234).

[0099] In one embodiment, the electronic device (200) may include an antenna using a first conductive portion (2141), a second conductive portion (2142), a third conductive portion (2143), a fourth conductive portion (2144), a fifth conductive portion (2241), a sixth conductive portion (2242), a seventh conductive portion (2243), and / or an eighth conductive portion (2244). For example, the wireless communication circuit (192) may be configured to transmit or receive a wireless signal in a designated frequency band (e.g., at least one of a legacy band, a sub-6 band, or an NR band) via the first conductive portion (2141), the second conductive portion (2142), the third conductive portion (2143), the fourth conductive portion (2144), the fifth conductive portion (2241), the sixth conductive portion (2242), the seventh conductive portion (2243), and / or the eighth conductive portion (2244).

[0100] In one embodiment, the electronic device (200) may include a printed circuit board (500) disposed in the interior space of the first housing (210). However, the present invention is not limited thereto, and the printed circuit board (500) may also be disposed in the interior space of the second housing (220).

[0101] In one embodiment, the first side member (213) and the second side member (223) may be formed of a conductive material. In one embodiment, the electronic device (200) may include a conductive connecting member (e.g., conductive connecting member (615, 620, 625) of FIG. 6A) for electrically connecting the first side member (213) and / or the second side member (223) to the printed circuit board (500). The conductive connecting member can be disposed inside a portion of at least one conductive member (e.g., the first conductive portion (2141), the second conductive portion (2142), the third conductive portion (2143), the fourth conductive portion (2144), the fifth conductive portion (2241), the sixth conductive portion (2242), the seventh conductive portion (2243), and / or the eighth conductive portion (2244)) to electrically connect the side member (e.g., the first side member (213) and / or the second side member (223)) to the printed circuit board (500). Accordingly, a wireless signal flowing through a conductive connecting member from a conductive portion (e.g., a first conductive portion (2141), a second conductive portion (2142), a third conductive portion (2143), a fourth conductive portion (2144), a fifth conductive portion (2241), a sixth conductive portion (2242), a seventh conductive portion (2243), and / or an eighth conductive portion (2244)) can be transmitted to a printed circuit board (500) (e.g., a tuner circuit of the printed circuit board (500)).

[0102] Hereinafter, according to various embodiments, the printed circuit board (500) is described as being disposed in proximity to the first conductive portion (2141) and the third conductive portion (2143) in the internal space of the first housing (210). However, the present invention is not limited thereto. For example, the printed circuit board (500) may be disposed in proximity to the second conductive portion (2142) and the fourth conductive portion (2144) in the internal space of the first housing (210). As another example, the printed circuit board (500) may be disposed in proximity to the fifth conductive portion (2241) and the seventh conductive portion (2243) in the internal space of the second housing (220). As yet another example, the printed circuit board (500) may be disposed in proximity to the sixth conductive portion (2242) and the eighth conductive portion (2244) in the internal space of the second housing (220).

[0103] In one embodiment, the printed circuit board (500) may be electrically connected to side members (e.g., first side member (213) and second side member (223)) via conductive connecting members. For example, the conductive connecting members may include C-clips.

[0104] In one embodiment, the printed circuit board (500) may include a conductive pattern (510, 520, and / or 530) formed to correspond to a conductive connection member. The conductive pattern (510, 520, and / or 530) may include a first conductive member and a second conductive member spaced apart from each other at a predetermined interval. Various embodiments will be described with respect to the conductive pattern including the first conductive member and the second conductive member spaced apart from each other at the predetermined interval described above, with reference to FIGS. 6A to 11 .

[0105] FIGS. 6A and 6B are diagrams illustrating a printed circuit board (500) of FIG. 5 according to one embodiment of the present disclosure.

[0106] FIG. 6A according to various embodiments is a drawing of a printed circuit board (500) viewed from the front. FIG. 6B according to various embodiments is a drawing of a printed circuit board (500) viewed from the rear.

[0107] Referring to FIGS. 6A and 6B, the printed circuit board (500) can be electrically connected to side members (e.g., the first side member (213) and the second side member (223) of FIGS. 2A and 2B) via conductive connecting members (615, 620, 625). For example, the conductive connecting members can include, but are not limited to, a C-clip.

[0108] In one embodiment, the printed circuit board (500) can include conductive patterns (510, 520, and / or 530) formed to correspond to conductive connecting members (615, 620, 625). The conductive patterns (510, 520, and / or 530) can include conductive members spaced apart at a specified interval. For example, the first conductive pattern (510) can include a first-first conductive member (5101) and a first-second conductive member (5102) spaced apart at a specified interval (690). The second conductive pattern (520) can include a second-first conductive member (5201) and a second-second conductive member (5202) spaced apart at a specified interval. Although not shown, the separation distance between the 2-1 conductive member (5201) and the 2-2 conductive member (5202) may be the same as the separation distance (690) between the 1-1 conductive member (5101) and the 1-2 conductive member (5102). The 3rd conductive pattern (530) may include the 3-1 conductive member (5301) and the 3-2 conductive member (5302) which are arranged to be spaced apart from each other by a specified interval. Although not shown, the separation distance between the 3-1 conductive member (5301) and the 3-2 conductive member (5302) may be the same as the separation distance (690) between the 1-1 conductive member (5101) and the 1-2 conductive member (5102).

[0109] In one embodiment, an insulating layer and a conductive layer may be alternately laminated on one surface of the printed circuit board (500). For example, the outer surface of the printed circuit board (500) may be formed of an insulating layer. According to one embodiment, the first-first conductive member (5101) of the first conductive pattern (510) may be formed by removing at least a portion of the insulating layer formed on the outer surface of the printed circuit board (500) so that at least a portion of the conductive layer formed under the insulating layer is exposed to the outside. The first-second conductive member (5102) of the first conductive pattern (510) may be formed by removing at least another portion of the insulating layer formed on the outer surface of the printed circuit board (500) so that at least another portion of the conductive layer formed under the insulating layer is exposed to the outside. The second-first conductive member (5201) and the second-second conductive member (5202) of the second conductive pattern (520) and the third-first conductive member (5301) and the third-second conductive member (5302) of the third conductive pattern (530) can also be formed in the same manner as the first-first conductive member (5101) and the first-second conductive member (5102).

[0110] In one embodiment, when static electricity introduced through a conductive connecting member moves to a conductive pattern (e.g., a first conductive pattern (510), a second conductive pattern (520), or a third conductive pattern (530)) (e.g., moves to a conductive pattern disposed on the back surface of a printed circuit board (500)), an arc discharge may occur between a first conductive member (e.g., a first-first conductive member (5101), a second-first conductive member (5201), or a third-first conductive member (5301)) of the conductive pattern and a second conductive member (e.g., a first-second conductive member (5102), a second-second conductive member (5202), and a third-second conductive member (5302)). By means of an arc discharge, static electricity that is transferred (e.g., jumped) from a first conductive member (e.g., a first-first conductive member (5101), a second-first conductive member (5201), or a third-first conductive member (5301)) to a second conductive member (e.g., a first-second conductive member (5102), a second-second conductive member (5202), and a third-second conductive member (5302)) can be transferred to the ground of the printed circuit board (500).

[0111] In one embodiment, the spacing (690) between conductive members included in each conductive pattern (e.g., the first conductive pattern (510), the second conductive pattern (520), or the third conductive pattern (530)) may be about 150 um, but is not limited thereto.

[0112] According to one embodiment, the following <Mathematical Formula 1> may be a mathematical formula for calculating a capacitance value between conductive members included in each conductive pattern. In one embodiment, in order to allow static electricity to move from a first conductive member (e.g., a first-first conductive member (5101), a second-first conductive member (5201), or a third-first conductive member (5301)) to a second conductive member (e.g., a first-second conductive member (5102), a second-second conductive member (5202), or a third-second conductive member (5302)) without affecting radio frequency performance, a separation distance between the conductive members may be set based on the following <Mathematical Formula 1>. For example, as the separation distance between the conductive members included in each conductive pattern becomes closer (e.g., as d becomes lower), the capacitance value between the conductive members may become higher.

[0113]

[0114] In one embodiment, the electronic device (200) may include a conductive plate (e.g., the first support member (261) of FIG. 4) disposed on a lower portion (e.g., in the -z-axis direction) of a printed circuit board (500). The printed circuit board (500) may include a contact member (e.g., the first contact member (670) and / or the second contact member (675)) that connects a ground of the printed circuit board (500) and the conductive plate (e.g., the ground of the conductive plate disposed on a lower portion (e.g., in the -z-axis direction) of the printed circuit board (500). For example, the printed circuit board (500) may include at least one contact member (e.g., the first contact member (670) and / or the second contact member (675)).

[0115] In one embodiment, the printed circuit board (500) may form a movement path (e.g., a first movement path (650), a second movement path (655), and / or a third movement path (660)) so that static electricity introduced through the conductive connecting member moves to the conductive members (e.g., a first conductive member and a second conductive member spaced apart at a specified interval) and to the ground of the printed circuit board (500).

[0116] In one embodiment, the printed circuit board (500) may include a contact member (e.g., a first contact member (670) and / or a second contact member (675)). For example, the contact member (e.g., the first contact member (670) and / or the second contact member (675)) may be positioned at a location on the printed circuit board (500) where there is a high density of current coupled to ground by noise radiated from the antenna. For example, the location of the high density of current on the printed circuit board (500) may be a location proximate to the antenna. As another example, the contact member (e.g., the first contact member (670) and / or the second contact member (675)) may also be positioned proximate to a noise source (e.g., an application processor (AP) (e.g., the processor (120) of FIG. 1)) that uses a high clock frequency.

[0117] In one embodiment, a conductive pattern (e.g., a first conductive pattern (510), a second conductive pattern (520), and / or a third conductive pattern (530)) may be formed proximate to a contact member (e.g., a first contact member (670) and / or a second contact member (675)).

[0118] In one embodiment, the electronic device (200) may include a tuner circuit (tunable IC) (e.g., a first tuner circuit (635), a second tuner circuit (640), and / or a third tuner circuit (645)) mounted on a printed circuit board (500). For example, the tuner circuit (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645)) may be mounted on the front surface of the printed circuit board (500).

[0119] In one embodiment, the electrostatic movement path (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660)) may be spaced a certain distance from the tuner circuit (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645)). For example, since the tuner circuit (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645)) has low resistance to static electricity, the movement path of the static electricity (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660)) may be formed to be spaced apart from the tuner circuit (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645)).

[0120] In one embodiment, a path of electrostatic movement (e.g., a path of movement from a conductive pattern to a contact member (e.g., a first contact member (670) and / or a second contact member (675))) can be formed close to the contact member (e.g., a first contact member (670) and / or a second contact member (675)) while being spaced apart from the tuner circuit (e.g., a first tuner circuit (635), a second tuner circuit (640), and / or a third tuner circuit (645)).

[0121] In one embodiment, static electricity transferred to the ground of the printed circuit board (500) can be discharged to the conductive plate (e.g., the ground of the conductive plate) through the contact member (e.g., the first contact member (670) and / or the second contact member (675)).

[0122] In FIGS. 6A and 6B according to various embodiments, the conductive pattern (e.g., the first conductive pattern (510), the second conductive pattern (520), and / or the third conductive pattern (530)) and the movement path of the rectifier (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660)) are described as being formed on the back side of the printed circuit board (500), but are not limited thereto. For example, the conductive pattern (e.g., the first conductive pattern (510), the second conductive pattern (520), and / or the third conductive pattern (530)) and the movement path of the rectifier (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660)) may also be formed on the front side of the printed circuit board (500).

[0123] FIG. 7 is a drawing for explaining a movement path of static electricity according to one embodiment of the present disclosure.

[0124] FIG. 7 according to one embodiment is an enlarged view of a portion of the electronic device (200), corresponding to line 7-7' of FIG. 6b.

[0125] Referring to FIG. 7, the printed circuit board (500) may be electrically connected to a side member (e.g., a first side member (213)) via a conductive connecting member (e.g., a C-clip). The printed circuit board (500) may include a conductive pattern (e.g., the first conductive pattern (510), the second conductive pattern (520), and / or the third conductive pattern (530) of FIG. 6B) formed to correspond to the conductive connecting member. The conductive pattern may include first conductive members (705) (e.g., the first-first conductive member (5101), the second-first conductive member (5201), and / or the third-first conductive member (5301) of FIG. 6B) and second conductive members (710) (e.g., the first-second conductive member (5102), the second-second conductive member (5202), and / or the third-second conductive member (5302) of FIG. 6B) spaced apart from each other at a specified interval.

[0126] In one embodiment, static electricity (720) introduced through a conductive connecting member (e.g., a C-clip) may be transferred (725) from the front surface of the printed circuit board (500) through a hole (e.g., a hole formed in the printed circuit board (500) to secure the conductive connecting member to the printed circuit board (500)) to a first conductive member (705) disposed on the back surface of the printed circuit board (500). The static electricity transferred to the first conductive member (705) may then transfer (730) (e.g., jump) to a second conductive member (710). For example, the static electricity may arc between the first conductive member (705) and the second conductive member (710), and thus, the static electricity may transfer (730) (e.g., jump) from the first conductive member (705) to the second conductive member (710). The static electricity that has moved (e.g., jumped) to the second conductive member (710) can be moved (733) to the ground of the printed circuit board (500) by a movement path (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660) of FIG. 6b) formed on the printed circuit board (e.g., the printed circuit board (500) of FIG. 5). The static electricity that has been transferred to the ground of the printed circuit board (500) (733) can be discharged by being transferred (735) to the conductive plate (740) through the contact member (e.g., the first contact member (670) and / or the second contact member (675) of FIG. 6b) and the second conductive connection member (750) (e.g., the second conductive connection member for electrically connecting the contact member and the conductive plate (740) (e.g., the first support member (261) of FIG. 4) disposed at the bottom (e.g., in the -z-axis direction) of the printed circuit board (500).

[0127] In one embodiment, static electricity (720) introduced through a conductive connecting member (e.g., a C-clip) can be induced to move to the first conductive member (705), the second conductive member (710), and the ground of the printed circuit board (500), and discharged to the conductive plate (740) (e.g., the ground of the conductive plate (740)) through a contact member (e.g., the first contact member (670) and / or the second contact member (675) of FIG. 6B) and the second conductive connecting member (750). A wireless signal of a specific frequency band (e.g., a wireless signal of a high frequency band) may not be transmitted along the path of the static electricity, and thus, the wireless signal of the specific frequency band is prevented from moving to the ground of the printed circuit board (500), thereby preventing the performance of the wireless signal of the specific frequency band (e.g., a wireless signal of a high frequency band) from being degraded.

[0128] FIG. 8A is a drawing for explaining a movement path of static electricity using a conductive pattern according to one embodiment of the present disclosure.

[0129] Referring to FIG. 8A, a printed circuit board (e.g., a printed circuit board (500) of FIG. 5) may be composed of a plurality of layers (e.g., a first layer (5001), a second layer, a third layer, ..., an n-1th layer, and an nth layer (5003)). For example, the printed circuit board (500) may be composed of a metal-insulator-metal (MIM) structure.

[0130] In one embodiment, one side of the first layer (5001) of the printed circuit board (500) may represent the front side of the printed circuit board (500) illustrated in FIG. 6A described above, and one side of the nth layer (5003) of the printed circuit board (500) may represent the back side of the printed circuit board (500) illustrated in FIG. 6B described above.

[0131] In one embodiment, static electricity may be introduced through a conductive connecting member, and a movement path of the static electricity (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660) of FIG. 6B) may be formed on an outer layer of the printed circuit board (500). For example, the movement path of the static electricity according to FIG. 8A may be formed on an n-th layer (5003) among a plurality of layers constituting the printed circuit board (500). However, the present invention is not limited thereto, and the movement path of the static electricity may also be formed on a first layer (5001) among a plurality of layers constituting the printed circuit board (500).

[0132] In one embodiment, a conductive pattern (e.g., a first conductive pattern (510), a second conductive pattern (520), or a third conductive pattern (530)) may be formed on the n-th layer (5003) of the printed circuit board (500). For example, the conductive pattern may include a first conductive member (805) (e.g., the first-first conductive member (5101), the second-first conductive member (5201), and / or the third-first conductive member (5301) of FIG. 6B ) and a second conductive member (810) (e.g., the first-second conductive member (5102), the second-second conductive member (5202), and / or the third-second conductive member (5302) of FIG. 6B ). The first conductive member (805) and the second conductive member (810) may be spaced apart from each other by a specified interval.

[0133] Static electricity introduced through a conductive connecting member according to one embodiment may be transferred (725) to a first conductive member (805) through an outer layer (e.g., n-th layer (5003)) of a printed circuit board (500). The static electricity transferred to the first conductive member (805) may be transferred (730) (e.g., jumping) to a second conductive member (810) spaced apart from the first conductive member (805). The static electricity transferred to the second conductive member (810) can be discharged by moving to the ground of the printed circuit board (500) (e.g., 733 in FIG. 7) through a movement path formed on the printed circuit board (500) (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660) in FIG. 6b), and then moving (813) (e.g., 735 in FIG. 7) to the conductive plate (740) (e.g., the ground of the conductive plate (740)) through a contact member (e.g., the first contact member (670) and / or the second contact member (675) in FIG. 6b).

[0134] FIG. 8b is a circuit for explaining a movement path of static electricity using a conductive pattern according to one embodiment of the present disclosure.

[0135] Referring to FIG. 8B, as shown in FIG. 7 according to one embodiment, static electricity introduced through a conductive connecting member (801) (e.g., a C-clip) (e.g., conductive connecting members (615, 620, 625) of FIG. 6A) may be transferred (725) to a first conductive member (805) (e.g., the 1-1 conductive member (5101), the 2-1 conductive member (5201), and / or the 3-1 conductive member (5301) of FIG. 6B, or the 1-1 conductive member (705) of FIG. 7). The static electricity transferred to the first conductive member (805) can transfer (730) (e.g., jump) to the second conductive member (810) (e.g., the first-second conductive member (5102), the second-second conductive member (5202), and / or the third-second conductive member (5302) of FIG. 6B , or the second conductive member (710) of FIG. 7 ) that is spaced apart from the first conductive member (805). For example, the static electricity can arc between the first conductive member (805) and the second conductive member (810) that are spaced apart from each other, and thus, the static electricity can transfer (730) (e.g., jump) from the first conductive member (805) to the second conductive member (810). The static electricity that has moved (e.g., jumped) to the second conductive member (810) can be moved (815) (e.g., 733 in FIG. 7) to the ground (820) of the printed circuit board (500) by a movement path (e.g., the first movement path (650), the second movement path (655), and / or the third movement path (660) in FIG. 6b) formed on the printed circuit board (e.g., the printed circuit board (500) in FIG. 5).

[0136] In one embodiment, a wireless signal of a specific frequency band (e.g., a high frequency band wireless signal) may be introduced through a conductive connecting member (801) (e.g., a C-clip). The wireless signal of a specific frequency band (e.g., a high frequency band wireless signal) may be transmitted (835, 840) to a tuner circuit (825) (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645) of FIG. 6B) through a coupling pad (830). The tuner circuit (825) may perform impedance tuning.

[0137] In one embodiment, when static electricity and / or a wireless signal of a specific frequency band (e.g., a high-frequency band wireless signal) is introduced through a conductive connecting member (801) (e.g., a C-clip), the static electricity is induced to move (725, 730, 815) to the ground of the first conductive member (805), the second conductive member (810), and the printed circuit board (500), and the wireless signal of the specific frequency band (e.g., a high-frequency band wireless signal) is transmitted (835, 840) to the tuner circuit (825) through the coupling pad (830), thereby preventing performance degradation of the wireless signal of the specific frequency band (e.g., a high-frequency band wireless signal).

[0138] In various embodiments, in FIGS. 5 to 8B, three conductive patterns, for example, a first conductive pattern (510), a second conductive pattern (520), and a third conductive pattern (530), are described as being formed on a printed circuit board (500), but the present invention is not limited thereto. For example, less than three conductive patterns (for example, at least one conductive pattern) may be formed on the printed circuit board (500). In another example, more than three conductive patterns may be formed on the printed circuit board (500). With respect to more than three conductive patterns, various embodiments will be described in FIG. 9 described below.

[0139] FIG. 9 is a drawing for explaining conductive patterns formed on the printed circuit board (500) of FIG. 5 according to one embodiment of the present disclosure.

[0140] Referring to FIG. 9, the printed circuit board (500) may have more than three conductive patterns formed thereon. For example, the more than three conductive patterns may include a first conductive pattern (905), a second conductive pattern (910), a third conductive pattern (915), a fourth conductive pattern (920), a fifth conductive pattern (925), and a sixth conductive pattern (930).

[0141] In one embodiment, each of the first conductive pattern (905), the second conductive pattern (910), the third conductive pattern (915), the fourth conductive pattern (920), the fifth conductive pattern (925), and the sixth conductive pattern (930) may include conductive members (e.g., the first conductive member (805) and the second conductive member (810)) spaced apart from each other by a specified interval (e.g., about 150 um).

[0142] In one embodiment, although not shown, the printed circuit board (500) may include at least one contact member connecting a ground of the printed circuit board (500) and a conductive plate (e.g., the first support member (261) of FIG. 4) disposed on the lower side (e.g., in the -z-axis direction) of the printed circuit board (500).

[0143] In one embodiment, each of the first conductive pattern (905), the second conductive pattern (910), the third conductive pattern (915), the fourth conductive pattern (920), the fifth conductive pattern (925), and the sixth conductive pattern (930) may be formed in proximity to at least one contact member while being spaced apart from a tuner circuit (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645) of FIG. 6B ).

[0144] In one embodiment, although not shown, a path for moving static electricity may be formed on the printed circuit board (500) to induce static electricity introduced through the conductive connecting member to move to the conductive members and the ground of the printed circuit board (500). The electronic device (200) may include a tuner circuit (e.g., the first tuner circuit (635), the second tuner circuit (640), and / or the third tuner circuit (645) of FIG. 6B) mounted on the printed circuit board (500), and since the tuner circuit has low resistance to static electricity, the path for moving static electricity may be formed to be spaced a certain distance from the tuner circuit.

[0145] FIG. 10 is a drawing for explaining a dummy element included in a printed circuit board according to one embodiment of the present disclosure.

[0146] FIG. 10 according to various embodiments is an enlarged view of a portion of a printed circuit board (500).

[0147] Referring to FIG. 10, a printed circuit board (500) may include a first conductive pattern (1010) and a second conductive pattern (1020). The first conductive pattern (1010) may include a first-first conductive member (1011) and a first-second conductive member (1013) spaced apart from each other by a specified interval (e.g., about 150 um). The second conductive pattern (1020) may include a second-first conductive member (1021) and a second-second conductive member (1023) spaced apart from each other by a specified interval (e.g., about 150 um).

[0148] In one embodiment, the printed circuit board (500) may include a first dummy element (1015) formed proximate to a second conductive member (1013) of a first conductive pattern (1010). The printed circuit board (500) may include a second dummy element (1025) formed proximate to a second conductive member (1023). In one embodiment, the first dummy element (1015) and the second dummy element (1025) may serve to consume the energy of static electricity when static electricity is introduced.

[0149] FIG. 11 is a circuit for explaining a movement path of static electricity using a conductive pattern and a dummy element according to one embodiment of the present disclosure.

[0150] The circuit illustrated in FIG. 11 according to various embodiments may further include a dummy element (1110) (e.g., the first dummy element (1015) and the second dummy element (1025) of FIG. 10) compared to the circuit illustrated in FIG. 8b described above. In FIG. 11 described below, the same configuration as that of FIG. 8b described above may be replaced with the description of FIG. 8b.

[0151] Referring to FIG. 11, a dummy element (1110) may be disposed between a second conductive member (810) and a ground (820). The dummy element (1110) may consume energy of incoming static electricity. For example, when static electricity is introduced through a conductive connecting member (801) (e.g., a C-clip), the static electricity may be induced to move (725, 730, 815) to the first conductive member (805), the second conductive member (810), and the ground of the printed circuit board (500). Before the static electricity moves from the second conductive member (710) to the ground of the printed circuit board (500), energy may be consumed by the dummy element (1110), thereby reducing ground bounce, and thereby allowing the static electricity to move stably to the ground of the printed circuit board (500).

[0152] As shown in FIGS. 10 and 11 according to one embodiment, a dummy element (1110) may be placed between the second conductive member (810) and the ground (820), and static electricity introduced through the conductive connection member (801) (e.g., C-clip) generates an arc discharge between the first conductive member (e.g., the first-first conductive member (1011), the second-first conductive member (1021) of FIG. 10, and the first conductive member (805) of FIG. 11) and the second conductive member (e.g., the first-second conductive member (1013), the second-second conductive member (1023) of FIG. 10, and the second conductive member (810) of FIG. 11), and passes through the dummy element (e.g., the first dummy element (1015), the second dummy element (1025) of FIG. 10, and the dummy element (1110) of FIG. 11) to form a printed circuit. It can be moved to the ground of the substrate (500). Before the static electricity is moved to the ground of the printed circuit board (500), the energy of the static electricity is consumed by the dummy elements (e.g., the first dummy element (1015), the second dummy element (1025) of FIG. 10, and the dummy element (1110) of FIG. 11), so that the static electricity can be stably moved to the ground of the printed circuit board (500). Accordingly, damage to electronic components caused by static electricity can be prevented.

[0153] An electronic device (200) according to one embodiment of the present disclosure may include a housing (210, 220) including side members (213, 223) formed of a conductive material. An electronic device (200) according to one embodiment may include a printed circuit board (500) disposed in an internal space of the housing (210, 220). An electronic device (200) according to one embodiment may include conductive connecting members (615, 620, 625) electrically connecting the side members (213, 223) and the printed circuit board (500). A printed circuit board (500) according to one embodiment may include conductive patterns (510, 520, 530) formed to correspond to the conductive connecting members (615, 620, 625). According to one embodiment, a conductive pattern (510, 520, 530) may include a first conductive member (5101, 5201, 5301) and a second conductive member (5102, 5202, 5302) spaced apart from each other at a specified interval. In one embodiment, a path for movement of static electricity may be formed so that static electricity introduced through the conductive connecting member (615, 620, 625) moves to the first conductive member (5101, 5201, 5301), the second conductive member (5102, 5202, 5302), and the ground of the printed circuit board (500).

[0154] An electronic device (200) according to one embodiment may include a conductive plate (740) disposed on a lower portion of a printed circuit board (500). The printed circuit board (500) according to one embodiment may include a contact member (670, 675) connecting a ground of the printed circuit board (500) and the conductive plate (740).

[0155] Static electricity transferred to the ground of the printed circuit board (500) according to one embodiment can be discharged to the conductive plate (740) through the contact member (670, 675).

[0156] According to one embodiment, an insulating layer and a conductive layer may be alternately laminated on one surface of a printed circuit board (500). An outer surface of the printed circuit board (500) according to one embodiment may be formed of an insulating layer.

[0157] According to one embodiment, a first conductive member (5101, 5201, 5301) may be formed by removing at least a portion of an insulating layer formed on an outer surface of a printed circuit board (500) so that at least a portion of a conductive layer formed under the insulating layer is exposed to the outside.

[0158] According to one embodiment, the second conductive member (5102, 5202, 5302) may be formed by removing at least another portion of an insulating layer formed on an outer surface of a printed circuit board (500) so that at least another portion of a conductive layer formed under the insulating layer is exposed to the outside.

[0159] According to one embodiment, the conductive pattern (510, 520, 530) may be formed proximate to the contact member (670, 675).

[0160] An electronic device (200) according to one embodiment may include a tuner circuit (635, 640, 645) mounted on a printed circuit board (500).

[0161] According to one embodiment, the path of movement of static electricity may be formed at a certain distance from the tuner circuit (635, 640, 645).

[0162] According to one embodiment, the conductive pattern (510, 520, 530) may be formed close to the contact member (670, 675) while being spaced a certain distance from the tuner circuit (635, 640, 645).

[0163] In one embodiment, when a wireless signal of a specific frequency band is introduced through a conductive connecting member (615, 620, 625), the wireless signal of the specific frequency band may be directed to a tuner circuit (635, 640, 645).

[0164] Static electricity introduced through the conductive connecting member (615, 620, 625) according to one embodiment can be transferred to an arc discharge generated between the first conductive member (5101, 5201, 5301) and the second conductive member (5102, 5202, 5302).

[0165] In one embodiment, the specified spacing between the first conductive member (5101, 5201, 5301) and the second conductive member (5102, 5202, 5302) may include about 150 um.

[0166] A printed circuit board (500) according to one embodiment may include a plurality of conductive patterns (905, 910, 915, 920, 925, 930).

[0167] Each of the plurality of conductive patterns (905, 910, 915, 920, 925, 930) according to one embodiment may include a plurality of conductive members spaced at a specified interval.

[0168] A printed circuit board (500) according to one embodiment may include a dummy element (1015, 1025, 1110) disposed between a second conductive member (5102, 5202, 5302) and a contact member (670, 675).

[0169] According to one embodiment, a dummy element (1015, 1025, 1110) may serve to consume the energy of static electricity.

[0170] In one embodiment, the dummy elements (1015, 1025, 1110) can dissipate the energy of static electricity, thereby reducing bounce of the printed circuit board (500) to the ground due to static electricity.

[0171] In one embodiment, the conductive connecting member (615, 620, 625) may comprise a C-clip.

[0172] In one embodiment, the path of static electricity may be formed on the front or back of the printed circuit board (500).

[0173] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0174] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0175] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. In one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0176] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0177] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0178] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (200), A housing (210, 220) including side members (213, 223) formed of a conductive material; A printed circuit board (500) placed in the internal space of the above housing (210, 220); and It includes a conductive connecting member (615, 620, 625) that electrically connects the side member (213, 223) and the printed circuit board (500), The printed circuit board (500) includes a conductive pattern (510, 520, 530) formed to correspond to the conductive connecting member (615, 620, 625), and The above conductive pattern (510, 520, 530) includes a first conductive member (5101, 5201, 5301) and a second conductive member (5102, 5202, 5302) spaced apart from each other at a specified interval, An electronic device that forms a path for the movement of static electricity so that static electricity introduced through the conductive connecting member (615, 620, 625) moves to the first conductive member (5101, 5201, 5301), the second conductive member (5102, 5202, 5302), and the ground of the printed circuit board (500).

2. In paragraph 1, Further comprising a conductive plate (740) placed on the lower portion of the printed circuit board (500), and The printed circuit board (500) is an electronic device including a contact member (670, 675) connecting the ground of the printed circuit board (500) and the conductive plate (740).

3. In paragraph 2, An electronic device in which static electricity transferred to the ground of the printed circuit board (500) is discharged to the conductive plate (740) through the contact member (670, 675).

4. In any one of paragraphs 1 to 3, On one side of the printed circuit board (500), an insulating layer and a conductive layer are alternately laminated, and The outer surface of the above printed circuit board (500) is formed with the above insulating layer, The first conductive member (5101, 5201, 5301) is formed by removing at least a portion of the insulating layer formed on the outer surface of the printed circuit board (500) so that at least a portion of the conductive layer formed under the insulating layer is exposed to the outside, and The second conductive member (5102, 5202, 5302) is an electronic device formed by removing at least another portion of the insulating layer formed on the outer surface of the printed circuit board (500) so that at least another portion of the conductive layer formed under the insulating layer is exposed to the outside.

5. In any one of paragraphs 2 to 4, An electronic device in which the above conductive pattern (510, 520, 530) is formed close to the contact member (670, 675).

6. In any one of paragraphs 1 to 5, An electronic device further comprising a tuner circuit (635, 640, 645) mounted on the printed circuit board (500).

7. In paragraph 6, An electronic device in which the above static electricity movement path is formed at a certain distance from the tuner circuit (635, 640, 645).

8. In paragraph 7, An electronic device in which the above conductive pattern (510, 520, 530) is formed close to the contact member (670, 675) while being spaced a certain distance from the tuner circuit (635, 640, 645).

9. In paragraph 8, An electronic device that, when a wireless signal of a specific frequency band is introduced through the conductive connecting member (615, 620, 625), causes the wireless signal of the specific frequency band to move to the tuner circuit (635, 640, 645).

10. In any one of paragraphs 1 to 9, An electronic device in which static electricity introduced through the conductive connecting member (615, 620, 625) is transferred as an arc discharge generated between the first conductive member (5101, 5201, 5301) and the second conductive member (5102, 5202, 5302).

11. In any one of paragraphs 1 to 10, The above specified spacing is an electronic device including about 150um.

12. In any one of paragraphs 1 to 11, The printed circuit board (500) includes a plurality of conductive patterns (905, 910, 915, 920, 925, 930), and An electronic device, wherein each of the plurality of conductive patterns (905, 910, 915, 920, 925, 930) includes a plurality of conductive members spaced apart at the specified intervals.

13. In any one of paragraphs 2 to 12, The printed circuit board (500) includes a dummy element (1015, 1025, 1110) disposed between the second conductive member (5102, 5202, 5302) and the contact member (670, 675), The above dummy elements (1015, 1025, 1110) serve to consume the energy of the static electricity, and The above dummy element (1015, 1025, 1110) is an electronic device that consumes the energy of the static electricity, thereby reducing the ground bounce of the printed circuit board (500) caused by the static electricity.

14. In any one of paragraphs 1 to 13, The above conductive connecting member (615, 620, 625) is an electronic device including a C-clip.

15. In any one of paragraphs 1 to 14, The above static electricity movement path is an electronic device that can be formed on the front or back of the printed circuit board (500).

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