SMT gasket and manufacturing method thereof

Abstract

Disclosed are a surface mount technology (SMT) gasket and a manufacturing method thereof. An SMT gasket manufacturing method according to an aspect of the present invention may comprise: a core material preparation step for preparing a core material made of a silicone foam and having a predetermined cross-sectional shape and a predetermined length; a conductive substrate attachment step for attaching a conductive substrate to the outer circumferential surface of the core material; and a cutting step for cutting, to a predetermined length, a conductive substrate-attached product produced in the conductive substrate attachment step.

Description

SMT gasket and its manufacturing method

[0001] The present invention relates to an SMT gasket and a method for manufacturing the same.

[0002] In general, electrical / electronic products are configured so that various elements and components for performing functions are mounted on a substrate and accommodated in a case, and some elements and / or components are configured to be mounted directly on the case.

[0003] These electrical / electronic products operate according to the current supplied to each component and part. In this case, electrical / electronic products have the necessary grounding structures to meet various functional requirements. For example, each component and part may be grounded to protect against damage to the product or electric shock caused by excess current discharged during function execution.

[0004] A typical grounding structure is to connect a wire or the like directly to the grounding portion (pattern or line) of the board so that any residual current can be discharged to the ground through an external conductive object, or to use a component for grounding so that the grounding portion (pattern or line) of the board is connected to the outer case of the product.

[0005] SMT gaskets are increasingly being used as grounding devices. SMT (Surface Mounter Technology) refers to the technology of mounting and soldering surface-mount components onto the surface of a circuit board.

[0006] SMT gaskets are mounted on a board to ground the board or other components mounted on the board, and elastically support the board on which the SMT gasket is mounted relative to another board or case.

[0007] Conventional SMT gaskets are manufactured by bonding a conductive substrate to the outer surface of a core silicone elastomer. In SMT gaskets manufactured this way, non-bonded or delaminated areas occur between the silicone elastomer and the conductive substrate, resulting in a decline in the grounding or elastic support function of the gasket.

[0008] Furthermore, since the silicone elastomer of the conventional SMT gasket has a strong compressive repulsion force, there was a problem of hindering the assembly of the substrate to which the conventional SMT gasket is attached with another substrate or case.

[0009] The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide an SMT gasket configured to have an appropriate compression rebound force while taking assembly into consideration, and a method for manufacturing the same.

[0010] Another object of the present invention is to provide a miniaturized SMT gasket and a method for manufacturing the same.

[0011] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0012] According to one aspect of the present invention, a method for manufacturing an SMT gasket is provided, comprising: a core manufacturing step of manufacturing a core made of silicone foam having a predetermined cross-sectional shape and a predetermined length; a conductive substrate attachment step of attaching a conductive substrate to an outer peripheral surface of the core; and a cutting step of cutting the conductive substrate attachment produced in the conductive substrate attachment step into a predetermined length.

[0013] At this time, the core manufacturing step may include a mixing step of mixing a silicone raw material, a curing agent, a foaming agent, and an anti-foaming agent; an extrusion step of extruding the mixture produced in the mixing step; and a primary curing step of primary curing the extrudate produced in the extrusion step using hot water.

[0014] At this time, the core manufacturing step may further include a second curing step of secondarily curing and foaming the first cured material produced in the first curing step using hot air; and a cooling step of cooling the second cured foam produced in the second curing step at room temperature.

[0015] Meanwhile, in the above mixing step, the silicone raw material may be mixed to have 90 to 99 parts by weight, the curing agent to have 1 to 5 parts by weight, the foaming agent to have 1 to 5 parts by weight, and the anti-foaming agent to have 0.1 to 0.5 parts by weight.

[0016] Meanwhile, the anti-foaming agent can be mixed in an amount 0.1 times that of the foaming agent.

[0017] Meanwhile, the anti-foaming agent can prevent bubbles from forming in the extruded product during the first curing step.

[0018] Meanwhile, in the extrusion step, an extruder is used, and the extruder includes a cylinder having an inlet through which the mixture is introduced, an outlet through which the extrudate is discharged, and a passageway connected to the inlet and the outlet and through which the mixture moves, and an outlet end of the passageway adjacent to the outlet may be formed to become narrower as it goes toward the outlet.

[0019] According to another aspect of the present invention, an SMT gasket manufactured by the above manufacturing method is provided.

[0020] At this time, the SMT gasket may include a core part made of silicone foam; and a conductive base layer attached to the outer surface of the core part.

[0021] At this time, the SMT gasket may have a cross-sectional shape in which the central area of ​​the bottom surface is concave toward the center of the SMT gasket.

[0022] According to another aspect of the present invention, an SMT gasket may be provided, comprising: a core member made of silicone foam; and a conductive substrate layer attached to an outer surface of the core member.

[0023] According to the above configuration, the SMT gasket according to one aspect of the present invention includes a core made of silicone foam, and thus has a relatively small but appropriate compressive repulsive force compared to a conventional gasket that uses a silicone elastomer rather than a foam-type core, thereby improving assembly with other substrates or cases.

[0024] Furthermore, in the SMT gasket manufacturing method according to one aspect of the present invention, the discharge end of the passage provided in the cylinder of the extruder used in the extrusion step is formed to become narrower toward the discharge port, thereby producing a high-density extruded product and miniaturizing the SMT gasket.

[0025] Furthermore, the SMT gasket manufacturing method according to one aspect of the present invention uses an anti-foaming agent as one of the raw materials of the mixture produced in the mixing step, thereby enabling uniform primary curing of the extruded product and manufacturing of a high-quality SMT gasket.

[0026] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0027] FIG. 1 is a cross-sectional view of an SMT gasket according to one embodiment of the present invention.

[0028] Figure 2 is a flowchart of a method for manufacturing an SMT gasket according to one embodiment of the present invention.

[0029] Figure 3 is a flowchart of a core manufacturing step according to one embodiment of the present invention.

[0030] Figure 4 is a drawing for explaining an extrusion step according to one embodiment of the present invention.

[0031] Figure 5 is a drawing for explaining a first curing step according to one embodiment of the present invention.

[0032] Figure 6 is a drawing for explaining a secondary curing step according to one embodiment of the present invention.

[0033] FIG. 7 is a perspective view showing a core material produced through a core material manufacturing step according to one embodiment of the present invention.

[0034] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0035] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0036] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0037] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0038] When a component is said to be "in front of," "behind," "above," or "below" another component, this includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if there is another component intervening therebetween. Furthermore, when a component is said to be "connected" to another component, this includes not only being directly connected to one another, but also being indirectly connected to one another, unless there are special circumstances.

[0039] Fig. 1 is a cross-sectional view of an SMT gasket according to one embodiment of the present invention. Referring to Fig. 1, the SMT gasket (10) includes a core portion (11) and a conductive substrate layer (13) attached to the outer surface of the core portion (11).

[0040] The core (11) is a part for performing the elastic support function of the SMT gasket (10). The core (11) is made of silicone foam. The SMT gasket (10) including the core (11) made of silicone foam can have a relatively small but appropriate compressive repulsive force compared to conventional gaskets that use a silicone elastomer rather than a foam-type core, thereby improving the assembling performance with other substrates or cases.

[0041] The conductive substrate layer (13) is a portion for performing the grounding function of the SMT gasket (10). The conductive substrate layer (13) may be made of a conductive film or conductive fabric.

[0042] For example, a conductive film can be manufactured by processing a conductive metal such as tin, gold, or nickel into a film. Alternatively, a conductive film can be manufactured by processing a polymer resin such as polyimide into a film and then plating the surface with a conductive metal.

[0043] For example, conductive fabrics can be made by weaving fibers plated with conductive metals such as tin, gold, or nickel.

[0044] The SMT gasket (10) has a predetermined cross-sectional shape.

[0045] In one embodiment of the present invention, the SMT gasket (10) may have a concave cross-sectional shape with a central region (13a) of the bottom surface thereof toward the center of the SMT gasket (10). Here, the bottom surface of the SMT gasket (10) is a surface facing a substrate (not shown). Two peripheral regions (13b) that are relatively convex compared to the concave central region (13a) are formed on the bottom surface of the SMT gasket (10).

[0046] At this time, the core portion (11) also has a concave cross-sectional shape in which the central region (11a) of the bottom surface is concave toward the center of the core portion (11). In addition, two peripheral regions (11b) that are relatively convex compared to the concave central region (11a) are formed on the bottom surface of the core portion (11).

[0047] An SMT gasket (10) having a cross-section as described above is formed so that two peripheral regions (13b) are mounted on a substrate (not shown). In this case, the SMT gasket (10) can be stably mounted on the substrate through two points.

[0048] Alternatively, although not shown, the SMT gasket may have a cross-section of rectangular, square, trapezoidal, or polygonal shape.

[0049] Meanwhile, according to one embodiment of the present invention, the SMT gasket (10) includes a core (11) made of silicone foam. When manufacturing the silicone foam constituting the core (11), an anti-foaming agent may be used as one of the raw materials. In this case, the silicone foam constituting the core (11) contains an anti-foaming agent.

[0050] The anti-foaming agent prevents the formation of bubbles in the extrudate, an intermediate product of the silicone foam manufacturing process, during the primary curing process, thereby ensuring uniform primary curing of the extrudate. Consequently, a high-quality SMT gasket (10) can be manufactured. This will be described further below.

[0051] Furthermore, according to one embodiment of the present invention, a high-density extruded product can be produced during the manufacturing process of the silicone foam constituting the core portion (11) of the SMT gasket (10), thereby enabling the manufacture of a miniaturized SMT gasket (1) having the elasticity desired by the manufacturer. This will be described later.

[0052] Hereinafter, a method for manufacturing an SMT gasket according to one embodiment of the present invention will be described.

[0053] FIG. 2 is a flowchart of a method for manufacturing an SMT gasket according to an embodiment of the present invention, FIG. 3 is a flowchart of a core material manufacturing step according to an embodiment of the present invention, FIG. 4 is a drawing for explaining an extrusion step according to an embodiment of the present invention, FIG. 5 is a drawing for explaining a first curing step according to an embodiment of the present invention, FIG. 6 is a drawing for explaining a second curing step according to an embodiment of the present invention, and FIG. 7 is a perspective view showing a core material produced through a core material manufacturing step according to an embodiment of the present invention.

[0054] First, referring to FIG. 2, a method for manufacturing an SMT gasket according to one embodiment of the present invention includes a core material manufacturing step (S100), a conductive substrate attachment step (S200), and a cutting step (S300).

[0055] Referring to FIG. 2 and FIG. 7, in the core manufacturing step (S100), a core (50) made of silicone foam having a predetermined cross-sectional shape and a predetermined length is manufactured.

[0056] In one embodiment of the present invention, the core (50) may have the same cross-sectional shape as the core portion (11) illustrated in FIG. 1. Furthermore, the core (50) may have a length ranging from several meters to several hundred meters. However, the cross-sectional shape and length of the core (50) are merely exemplary and do not limit the technical concept of the present invention.

[0057] When a core material (50) having a predetermined length is cut to a set length, it can become a core material portion (11) constituting the SMT gasket (10) shown in Fig. 1.

[0058] Referring to FIGS. 2 and 3, the core manufacturing step (S100) includes a mixing step (S110), an extrusion step (S120), a primary curing step (S130), a secondary curing step (S140), and a cooling step (S150).

[0059] In the mixing step (S110), silicone raw materials, a curing agent, a foaming agent, and an anti-foaming agent are mixed. At this time, known products can be used as the mixed silicone raw materials, curing agent, foaming agent, and anti-foaming agent.

[0060] In one embodiment of the present invention, the silicone raw material, curing agent, foaming agent, and anti-foaming agent may be mixed into a dough form using a mixer. For example, a mixer equipped with two rollers may be used to create a dough-like mixture, but is not limited thereto.

[0061] In the mixing step (S110), the silicone raw material can be mixed to have 90 to 99 parts by weight, the curing agent to have 1 to 5 parts by weight, the foaming agent to have 1 to 5 parts by weight, and the anti-foaming agent to have 0.1 to 0.5 parts by weight.

[0062] Here, the anti-foaming agent prevents or delays the generation of bubbles in the extrudate (43) that is the target of primary curing during the primary curing step (S130) described later, thereby achieving uniform primary curing. This will be described later.

[0063] It is preferable that the anti-foaming agent be mixed in an amount 0.1 times that of the foaming agent. In other words, the mixing ratio of the anti-foaming agent and the foaming agent is 1:10. If the anti-foaming agent exceeds 0.1 times that of the foaming agent, the foaming of the silicone foam constituting the core material (50) may be significantly delayed or incomplete, which may deteriorate the quality of the core material (50). Furthermore, if the anti-foaming agent is less than 0.1 times that of the foaming agent, the primary curing may be uneven, which may deteriorate the quality of the core material (50).

[0064] The dough-like mixture produced in the mixing step (S110) can be moved to the next step manually by a worker or by a known transport device such as a conveyor device.

[0065] Referring to FIGS. 3 and 4, in the extrusion step (S120), the mixture (41) generated in the mixing step (S110) is extruded. Here, the extruded mixture (41) is referred to as an extrudate (43), and the extrudate (43) is generated through the extrusion step (S120).

[0066] An extruder (100) is used to extrude the mixture (41). In one embodiment of the present invention, the extrudate (43) can be continuously produced by the extruder (100). In other words, the mixture (41) can be continuously extruded by the extruder (100).

[0067] In one embodiment of the present invention, the extruder (100) may be a screw type extruder (100).

[0068] At this time, the extruder (100) may include a cylinder (110), a screw (130), and a driving motor (150).

[0069] The cylinder (110) has an inlet (111) and an outlet (112). In addition, the cylinder (110) has a passage (113) connected to the inlet (111) and the outlet (112) and through which the mixture (41) introduced through the inlet (111) moves. A hopper (120) may be installed in the cylinder (110) to allow the mixture (41) to easily be introduced toward the inlet (111).

[0070] The screw (130) is formed to extend in the longitudinal direction of the passage (113) of the cylinder (110). The screw (130) may include a screw rod (131) extending in one direction and a screw wing (133) formed on the screw rod (131).

[0071] The screw blades (133) may be formed to extend in a spiral shape in the longitudinal direction of the screw rod (131). Alternatively, the screw blades (133) may be provided in multiple numbers, and the multiple screw blades (133) may be spaced apart and arranged along the screw rod (131).

[0072] The drive motor (150) is operably connected to the screw (130) and provides driving force to rotate the screw (130).

[0073] When the driving motor (150) rotates the screw (130), the mixture (41) introduced into the passage (113) is pushed by the screw (130) and moves along the passage (113) toward the discharge port (112).

[0074] At this time, a certain pressure is applied to the mixture (41) moving along the passage (113) so that the mixture (41) is tightly compacted. At this time, the mixture (41) is extruded through the outlet (112) in a state where its density has increased.

[0075] In one embodiment of the present invention, the discharge end (114) of the passage (113) is formed to become narrower as it goes toward the discharge port (112). In other words, the discharge end (114) of the passage (113) has an inclined surface (114a) inclined toward the discharge port (112).

[0076] As the mixture (41) moves toward the discharge port (112) through the discharge end (114) of the increasingly narrow passage (113), an increasingly greater pressure is applied. In this case, the mixture (41) becomes more tightly packed before being discharged through the discharge port (112), and the density of the mixture (41) further increases.

[0077] Since the discharge end (114) of the passage (113) has a shape that gradually narrows toward the discharge port (112), a high-density extrudate (43) can be produced.

[0078] In this case, even if the cross-sectional size of the extruded product (43) is reduced, the manufacturer can produce a core material (50) having the elasticity desired by the manufacturer. In this case, the SMT gasket (10) can be miniaturized. For example, the SMT gasket (10) can be miniaturized to a width of 4 mm or less, but is not limited thereto.

[0079] Furthermore, the extrudate (43) having a high density can be easily submerged in hot water (W) used in the first curing step (S130) described later without floating, so that uniform and effective first curing can be achieved.

[0080] Meanwhile, the density of the mixture (41) discharged from the extruder (100) may vary depending on the inclination angle of the inclined surface (114a) of the discharge end (114) of the passage (113).

[0081] For example, the inclined surface (114a) of the discharge end (114) of the passage section (113) may be formed to have an inclination angle of 5 degrees or more and 10 degrees or less with respect to the center line of the passage section (113). If the inclined surface (114a) of the discharge end (114) is less than 5 degrees with respect to the center line of the passage section (113), the extrudate (43) does not have sufficient density, and if it exceeds 10 degrees, it becomes difficult for the mixture (41) to pass through the discharge end (114) and excessive energy is required for passage.

[0082] In one embodiment of the present invention, the extrudate (43) produced by the extruder (100) may have a concave cross-sectional shape in which the central region of the bottom surface is concave toward the longitudinal center of the extrudate (43).

[0083] At this time, the cross-sectional shape of the extrudate (43) corresponds to the cross-section of the core portion (11) illustrated in Fig. 1. For reference, the cross-sectional shape of the extrudate (43) corresponds to the shape of the outlet (112) of the extruder (100).

[0084] Referring to FIGS. 3 and 5, in the first curing step (S130), the extrudate (43) produced in the extrusion step (S120) is first cured by hot water (W). Here, the extrudate (43) that is first cured through the first curing step (S130) is called a first cured product (45).

[0085] More specifically, a water tank (210) containing hot water (W) may be placed at the point where the extrudate (43) falls. When the extrudate (43) falls into the water tank (210) and is immersed in the hot water (W), primary curing of the extrudate (43) occurs. In the primary curing step (S130), the surface of the extrudate (43) is cured.

[0086] The hot water (W) has a temperature higher than that of the extrudate (43) produced from the extruder (100). If the temperature of the hot water (W) is lower than that of the extrudate (43), a rapid temperature change may cause cracks to occur on the surface of the extrudate (43), resulting in quality problems.

[0087] The anti-foaming agent contained in the extrudate (43) prevents bubbles from forming in the extrudate (43) during primary curing. If bubbles form in the extrudate (43) during the primary curing process, the extrudate (43) floats above the surface of the hot water (W), preventing the extrudate (43) from being cured uniformly.

[0088] Therefore, the anti-foaming agent prevents the formation of bubbles in the extrudate (43) during the primary curing process, thereby enabling the extrudate (43) to be cured uniformly throughout under the surface of the hot water (W).

[0089] On the other hand, the anti-foaming agent prevents bubbles from forming on the surface of the extrudate (43) during the primary curing process.

[0090] In this case, the first cured extruded product (43), i.e., the first cured product (45), can have a smoothly cured surface without the generation of bubbles. In this case, the core material (50) manufactured through the core material manufacturing step (S100) also has a smooth surface, and the adhesion area with the conductive substrate described later increases, thereby facilitating the adhesion of the core material (50) and the conductive substrate.

[0091] Meanwhile, a floating prevention member (220) may be installed in the water tank (210) to prevent the extrudate (43) submerged in warm water (W) from floating to the surface of the water. The floating prevention member (220) may be placed apart from the point where the extrudate (43) falls.

[0092] In one embodiment of the present invention, the primary cured product (45) can be transported to the next process by the first conveyor device (230).

[0093] At this time, the first conveyor device (230) may be manufactured so that a portion thereof is positioned below the surface of the hot water (W) filled in the tank (210). At this time, the extrudate (43) produced in the extruder (100) may fall onto a portion of the first conveyor device (230) that is positioned below the surface of the hot water (W).

[0094] In this case, the extrudate (43) can be primarily cured while being moved by the first conveyor device (230) while being immersed in hot water (W).

[0095] Referring to FIGS. 3 and 6, in the secondary curing step (S140), the primary cured product (45) is secondarily cured and foamed by hot air. Here, the primary cured product (45) that is secondarily cured and foamed through the secondary curing step (S140) is called a secondarily cured foam (47).

[0096] In one embodiment of the present invention, in the secondary curing step (S140), secondary curing and foaming of the primary cured product (45) may be performed simultaneously or with a time difference.

[0097] In one embodiment of the present invention, the temperature of the hot air used in the secondary curing step (S140) is higher than the temperature of the hot water (W) used in the primary curing step (S130). If the curing temperature in the secondary curing step (S140) is not higher than the curing temperature in the primary curing step (S130), heat is not transferred toward the center of the primary cured product (45), making it difficult to perform effective and sufficient secondary curing.

[0098] In one embodiment of the present invention, a chamber (310) in which hot air is supplied may be used in the secondary curing step (S140). A hot air nozzle for spraying hot air may be formed inside the chamber (310).

[0099] At this time, the chamber (310) may have a structure extending in one direction. The primary cured material (45) is introduced into the chamber (310) by the second conveyor device (330), and is secondarily cured and foamed inside the chamber (310). Then, the second cured foamed material (47), which is the result of second curing and foaming inside the chamber (310), is discharged outside the chamber (310) by the second conveyor device (330).

[0100] The second conveyor device (330) used in the second curing step (S140) may be the first conveyor device (230) used in the first curing step (S130). At this time, the first curing step (S130) and the second curing step (S140) may be performed using the same conveyor device (310, 330).

[0101] However, the second conveyor device (330) used in the second curing step (S140) may be different from the first conveyor device (230) used in the first curing step (S130).

[0102] The first cured product (45) that is exposed to hot air while moving in the longitudinal direction of the chamber (310) inside the chamber (310) is secondarily cured and foamed.

[0103] Hot air higher than the primary curing temperature (i.e., the temperature of hot water (W)) transfers heat from the surface of the primary cured product (45) toward the center, thereby causing the primary cured product (45) to undergo secondary curing. During the secondary curing process, foaming of the primary cured product (45) occurs simultaneously or sequentially.

[0104] The mixture (41) produced in the mixing step (S110) is finally processed into a silicone foam form through the extrusion step (S120), the first curing step (S130), and the second curing step (S140).

[0105] Referring to FIGS. 3 and 7, in the cooling step (S150), the secondary curing foam (47) generated in the secondary curing step (S140) is cooled at room temperature. For example, the secondary curing foam (47) discharged from the chamber (310) of FIG. 6 can be moved to a separate location and cooled at room temperature.

[0106] The secondary curing foam (47) generated in the secondary curing step (S140) becomes a completed silicone foam that constitutes the core material (50) only after going through the cooling step (S150).

[0107] A core material (50) made of silicone foam can be manufactured by going through the above-described mixing step (S110), extrusion step (S120), first curing step (S130), second curing step (S140), and cooling step (S150).

[0108] In one embodiment of the present invention, the core material (50) made of silicone foam includes an anti-foaming agent as one of the raw materials.

[0109] In one embodiment of the present invention, the extrudate (43) produced in the extrusion step (S120), the primary cured product (45) produced in the primary curing step (S130), the secondary cured foam (47) produced in the secondary curing step (S140), and the silicone foam produced in the cooling step (S150) can be continuously connected.

[0110] Alternatively, the extrudate (43) produced in the extrusion step (S120), the primary cured product (45) produced in the primary curing step (S130), the secondary cured foam (47) produced in the secondary curing step (S140), and the silicone foam produced in the cooling step (S150) may each be produced in separate forms.

[0111] Referring to FIG. 2 and FIG. 7, in the conductive substrate attachment step (S200), a conductive substrate (not shown) is attached to the outer surface of the core material (50).

[0112] The conductive substrate may be formed of a film or fabric. The conductive substrate may be formed to have a predetermined width and length.

[0113] In one embodiment of the present invention, the conductive substrate may have a width corresponding to the circumference of the cross-section of the core material (50) produced in the core material manufacturing step (S100), for example, the cross-section of the core portion (11) illustrated in FIG. 1. In this case, the conductive substrate may entirely surround the circumference of the cross-section of the core material (50) produced in the core material manufacturing step (S100).

[0114] In one embodiment of the present invention, the conductive substrate may have a length greater than the length of the core material (50) produced in the core material production step (S100). In this case, the conductive substrate may entirely surround the core material (50) produced in the core material production step (S100) in the longitudinal direction.

[0115] If the conductive substrate attached to the outer surface of the core material (50) is cut to a set length, it can become a conductive substrate layer (13) constituting the SMT gasket (10) illustrated in FIG. 1.

[0116] In one embodiment of the present invention, the conductive substrate may be attached to the outer surface of the core material (50) by an adhesive (not shown). At this time, the adhesive may be applied to one surface of the conductive substrate or to the outer surface of the core material (50).

[0117] The conductive material can be rolled up and stored in a roll form. At this time, in the conductive material attachment step (S200), the conductive material can be unrolled from the roll and attached to the outer surface of the core material (50).

[0118] The conductive substrate attachment step (S200) can be performed manually by a worker or automatically by automatic attachment equipment. Hereinafter, for convenience of explanation, the result produced in the conductive substrate attachment step (S200) is referred to as a conductive substrate attachment.

[0119] Referring to Fig. 2, in the cutting step (S300), the conductive substrate attachment is cut to a predetermined length.

[0120] More specifically, the conductive substrate attachment produced through the conductive substrate attachment step (S200) has a predetermined length. At this time, the conductive substrate attachment is manufactured to be significantly longer than the SMT gasket desired by the manufacturer to increase manufacturing efficiency and facilitate mass production.

[0121] At this time, the conductive substrate attachment needs to be cut to the length of the SMT gasket desired by the manufacturer. Therefore, in the cutting step (S300), the conductive substrate attachment is cut to the set length. The cut portion of the conductive substrate attachment becomes the SMT gasket (10) to be manufactured, as shown in FIG. 1.

[0122] The SMT gasket manufacturing method according to one embodiment of the present invention, as described above, can produce a high-density extruded product (43) and miniaturize the SMT gasket (10) by forming the discharge end (114) of the passage (113) provided in the cylinder (110) of the extruder (100) used in the extrusion step (S120) to become narrower as it goes toward the discharge port (112).

[0123] Furthermore, in a method for manufacturing an SMT gasket according to one embodiment of the present invention, by using an anti-foaming agent as one of the raw materials of a mixture (41) produced in a mixing step (S110), primary curing of an extruded product (43) can be performed uniformly, and a high-quality SMT gasket (10) can be manufactured.

[0124] Furthermore, the SMT gasket (10) according to one embodiment of the present invention includes a core (11) made of silicone foam, and thus has a relatively small but appropriate compressive repulsive force compared to a conventional gasket that uses a silicone elastomer rather than a foam-type core, thereby improving assembly with other substrates or cases.

[0125] Although the embodiments of the present invention have been described above, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

Claims

1. A core manufacturing step of manufacturing a core made of silicone foam having a predetermined cross-sectional shape and a predetermined length; A conductive substrate attachment step of attaching a conductive substrate to the outer surface of the core material; and A method for manufacturing an SMT gasket, comprising a cutting step of cutting a conductive substrate attachment material generated in the above conductive substrate attachment step into a predetermined length.

2. In paragraph 1, The above core manufacturing steps are: A mixing step of mixing silicone raw materials, curing agent, foaming agent and anti-foaming agent; An extrusion step for extruding the mixture produced in the above mixing step; and A method for manufacturing an SMT gasket, comprising a first curing step of first curing the extrudate produced in the above extrusion step using hot water.

3. In paragraph 2, The above core manufacturing steps are: A second curing step in which the first cured product produced in the first curing step is cured and foamed by hot air; and A method for manufacturing an SMT gasket, further comprising a cooling step of cooling the secondary curing foam produced in the secondary curing step at room temperature.

4. In paragraph 2, In the above mixing step, A method for manufacturing an SMT gasket, wherein the above silicone raw material is mixed to have 90 to 99 parts by weight, the above curing agent to have 1 to 5 parts by weight, the above foaming agent to have 1 to 5 parts by weight, and the above anti-foaming agent to have 0.1 to 0.5 parts by weight.

5. In paragraph 2, A method for manufacturing an SMT gasket, wherein the above-mentioned anti-foaming agent is mixed in an amount 0.1 times that of the above-mentioned foaming agent.

6. In paragraph 2, The above anti-foaming agent is, A method for manufacturing an SMT gasket, which prevents bubbles from forming in the extruded product during the first curing step.

7. In paragraph 2, In the above extrusion step, an extruder is used, The extruder includes a cylinder having an inlet through which the mixture is introduced, an outlet through which the extrudate is discharged, and a passageway connected to the inlet and the outlet through which the mixture moves. A method for manufacturing an SMT gasket, wherein the discharge end of the passage adjacent to the discharge port is formed to become narrower as it approaches the discharge port.

8. An SMT gasket manufactured by a manufacturing method according to any one of claims 1 to 7.

9. In paragraph 8, Seismic core made of silicone foam; and SMT gasket including a conductive base layer attached to the outer surface of the core portion 10. In paragraph 9, The above SMT gasket is, An SMT gasket, wherein the central area of ​​the bottom surface has a concave cross-sectional shape toward the center of the SMT gasket.

11. Seismic core made of silicone foam; and An SMT gasket comprising a conductive substrate layer attached to the outer surface of the core portion.

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