Board card and network device

Abstract

A board card and a network device. The board card comprises a first circuit board (1), a first optical cage (2), a first heat sink (3) and a second heat sink (4). The first optical cage (2) comprises a layer of first slots (21). Each first slot (21) comprises a first opening (22) on the slot wall close to the first circuit board (1), and a second opening (23) on the slot wall away from the first circuit board (1). The first heat sink (3) is located on the side of the first optical cage (2) close to the first circuit board (1), and has part of the structure extending into the first slots (21) through the first openings (22). The second heat sink (4) comprises a cold plate (110) and a plurality of elastic heat conduction components (120). The cold plate (110) is located on the side of the first optical cage (2) away from the first circuit board (1). The plurality of elastic heat conduction components (120) extend into a plurality of first slots (21) through a plurality of second openings (23).

Description

Boards and network devices

[0001] This disclosure claims priority to Chinese patent application No. 202410946775.1, filed on July 15, 2024, entitled "Board Card and Network Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of communication technology, and in particular to a circuit board and network device. Background Technology

[0003] Information and communications technology (ICT) equipment (such as switches) contains boards (or single boards), which include circuit boards and optical cages mounted on the circuit boards. The optical cages have slots for inserting optical modules and for making electrical connections between the optical modules and other electrical components on the circuit boards.

[0004] To dissipate heat from the optical module, a window is often made in the top wall of the optical cage, and a heat sink is added to the top wall of the optical cage. Part of the heat sink extends into the interior of the optical cage through the window and comes into contact with the optical module to absorb the heat generated by the optical module.

[0005] Currently, as the power of optical modules increases, the heat dissipation efficiency required for optical modules also increases. Summary of the Invention

[0006] This disclosure provides a circuit board and a network device. The circuit board has windows on both sides of the first slot of its first optical cage. Partial structures of the first and second heat sinks extend into the interior of the first slot through these windows. This ensures that both sides of the optical module in the first slot are in contact with the heat sink, allowing for double-sided heat dissipation and high heat dissipation efficiency. The technical solutions for the circuit board and the network device are described below.

[0007] In a first aspect, this disclosure provides a circuit board. The circuit board includes a first circuit board, a first optical cage, a first heat sink, and a second heat sink. The first optical cage is fixed to the first circuit board. The first optical cage includes a plurality of first slots arranged in a layer. Each first slot includes a first opening in the slot wall near the first circuit board and a second opening in the slot wall away from the first circuit board. The first heat sink is located on the side of the first optical cage near the first circuit board, and a portion of its structure extends into the interior of the plurality of first slots through the plurality of first openings. The second heat sink includes a cold plate and a plurality of elastic thermally conductive components. The cold plate is located on the side of the first optical cage away from the first circuit board. One side of the plurality of elastic thermally conductive components is connected to the cold plate, and the other side extends into the interior of the plurality of first slots through the plurality of second openings. The elastic thermally conductive components are elastically expandable and contractible relative to the surface of the cold plate.

[0008] The first optical cage may be one or more, and each first optical cage includes one or more first slots. For example, there may be multiple first optical cages, and each first optical cage may include two or more first slots. Each first slot is used to accommodate one optical module.

[0009] The technical solution provided in this disclosure, by respectively providing a first window and a second window on both sides of the first slot, allows a portion of the structure of the first heat sink to extend into the interior of the first slot through the first window, and a portion of the structure of the second heat sink to extend into the interior of the first slot through the second window. In this way, both sides of the optical module in the first slot are in contact with the heat sink, enabling double-sided heat dissipation of the optical module; that is, the heat of the optical module can be dissipated through the heat sinks on both sides. This improves the heat dissipation efficiency of the optical module, thereby reducing the failure rate of the optical module.

[0010] Furthermore, by configuring the second heat sink to include a common cold plate and multiple flexible heat-conducting components, with these components extending into the interior of the multiple first slots, each optical module can compress its corresponding flexible heat-conducting component during insertion into its respective slot. This ensures smooth insertion and prevents interference between the optical modules and the flexible heat-conducting components, thus avoiding insertion difficulties. This design also allows the optical modules in the multiple first slots to dissipate heat through a common cold plate, which also helps to even out the temperature of the modules, preventing individual modules from overheating.

[0011] In addition, after the optical module is inserted into the first slot, the elastic thermal conductive component can make close contact with the optical module under the elastic force of the elastic thermal conductive component, which makes the heat transfer efficiency between the optical module and the elastic thermal conductive component high, thereby improving the heat dissipation efficiency of the optical module.

[0012] In one implementation, the cold plate is either an air-cooled cold plate or a liquid-cooled cold plate. The air-cooled cold plate has fins, while the liquid-cooled cold plate contains refrigerant.

[0013] In one implementation, the cold plate includes multiple limiting grooves, each corresponding to a plurality of elastic heat-conducting components. Each elastic heat-conducting component includes a floating plate and at least one elastic heat-conducting element. A portion of the floating plate is confined within a limiting groove, while another portion is located outside the limiting groove and extends into the interior of a first slot through a second opening. The elastic heat-conducting element is located between the bottom of the floating plate and the limiting groove, and abuts against both the bottom of the floating plate and the bottom of the limiting groove. The elastic heat-conducting element is in a compressed state. The floating plate is used to contact the optical module. The heat generated by the optical module is first transferred to the floating plate, and then transferred to the cold plate via the elastic heat-conducting element.

[0014] The technical solution provided in this disclosure allows the optical module to be smoothly inserted into the first slot during the insertion process. The optical module contacts the floating plate and drives the floating plate to retract relative to the cold plate. After insertion, the elastic heat-conducting component, being in a compressed state, applies a spring force to the floating plate, ensuring close contact between the floating plate and the optical module. This results in high heat transfer efficiency between the optical module and the floating plate.

[0015] Furthermore, by setting a limiting groove on the cold plate, a portion of the structure of the elastic heat-conducting component is embedded in the cold plate. Compared with non-embedded contact solutions, the technical solution provided in this disclosure shortens the distance between the elastic heat-conducting component and the refrigerant (such as the coolant in the liquid cooling pipe) in the cold plate, reduces thermal resistance, and improves the heat transfer efficiency between the elastic heat-conducting component and the cold plate.

[0016] In one implementation, multiple elastic heat-conducting elements are arranged along the extension direction of the first slot. The extension direction of the first slot is the insertion direction of the optical module.

[0017] In one implementation, the limiting groove includes a receiving portion and a groove opening along its depth direction. The inner diameter of the groove opening is smaller than the inner diameter of the receiving portion, and two stepped surfaces are formed between the groove opening and the receiving portion. The floating plate includes a main body and two limiting portions located on both sides of the main body. The two limiting portions are located in the receiving portion and are respectively opposite to the two stepped surfaces. The main body passes through the groove opening and extends into the interior of the first slot.

[0018] In the technical solution disclosed herein, after the optical module is pulled out of the first slot, the floating plate will extend relative to the surface of the cold plate under the elastic force of the elastic heat-conducting component. Since the two limiting parts are located in the receiving part and are respectively opposite to the two stepped surfaces, when the floating plate extends to its limit position, the two limiting parts will abut against the two stepped surfaces, preventing the floating plate from disengaging from the limiting groove.

[0019] In one implementation, when the first slot does not contain an optical module, the two limiting parts of the floating plate abut against the two stepped surfaces, and the elastic heat-conducting component is compressed. Under the elastic force of the heat-conducting component, the two limiting parts are tightly fitted to the two stepped surfaces, preventing the floating plate from wobbling. When the first slot contains an optical module, the two limiting parts of the floating plate separate from the two stepped surfaces, the elastic heat-conducting component is further compressed, and the elastic force is enhanced, allowing the floating plate to fit the optical module even more tightly.

[0020] In one implementation, the side of the floating plate facing the bottom of the limiting groove includes a receiving groove, and the elastic heat-conducting element abuts against the bottom of the receiving groove.

[0021] The technical solution provided in this disclosure increases the distance between the bottom of the floating plate and the limiting groove by setting a receiving groove on the floating plate, thus providing sufficient space for the elastic heat-conducting component.

[0022] In one implementation, the bottom of the limiting groove includes a protrusion opposite to the receiving groove, and the outer diameter of the protrusion is smaller than the inner diameter of the receiving groove. An elastic heat-conducting element abuts against the side of the protrusion facing the receiving groove. A groove is formed between the protrusion and the sidewall of the limiting groove, which accommodates the limiting portion of the elastic heat-conducting element to provide sufficient space for the floating plate to move.

[0023] In one implementation, the protrusion is positioned opposite the liquid cooling pipe in the cold plate. This design of the protrusion prevents the plate walls on both sides of the liquid cooling pipe from becoming too thin.

[0024] In one implementation, the bottom of the limiting groove includes at least one first mating groove, and the side of the floating plate facing the bottom of the limiting groove includes at least one second mating groove, with the first and second mating grooves facing each other. Each elastic heat-conducting element is located between a first mating groove and a second mating groove, and is respectively in contact with the groove walls of the first and second mating grooves.

[0025] The technical solution provided in this disclosure increases the contact area between the elastic heat-conducting component and the cold plate, as well as the contact area between the elastic heat-conducting component and the floating plate, by setting a first mating groove for the bottom of the limiting groove and a second mating groove for the floating plate. This improves the heat transfer efficiency between the floating plate and the elastic heat-conducting component, and between the elastic heat-conducting component and the cold plate. Simultaneously, the first and second mating grooves also limit the movement of the elastic heat-conducting component.

[0026] In one implementation, the elastic thermally conductive component includes an elastic component and a thermally conductive component. The thermally conductive component covers the elastic component and abuts against the bottom of the floating plate and the limiting groove, respectively. The thermal conductivity of the thermally conductive component is greater than that of the elastic component, and the elastic force of the elastic component is greater than that of the thermally conductive component.

[0027] The technical solution disclosed herein, on the one hand, involves a heat-conducting component covering an elastic component, allowing heat on the floating plate to be efficiently transferred to the cold plate via the heat-conducting component. On the other hand, the elastic component drives the heat-conducting component to make close contact with the floating plate and the bottom of the limiting groove, and also drives the floating plate to make close contact with the optical module. This improves the heat transfer efficiency between the optical module and the floating plate, between the floating plate and the heat-conducting component, and between the heat-conducting component and the cold plate.

[0028] In one implementation, the elastic element is an elastic spring, the extension direction of which intersects with the bottom of the floating plate and the limiting groove. In this way, the elastic spring can apply a spring force to the floating plate, causing it to extend outward from the limiting groove.

[0029] In one implementation, the heat-conducting component includes a cylindrical structure with openings at both ends. The sidewalls of the cylindrical structure abut against the bottom of a floating plate and a limiting groove, respectively. An elastic element is located inside the cylindrical structure and abuts against its sidewalls. The cylindrical structure can be formed by winding the elastic element around a membrane structure. The membrane structure can be one or more layers.

[0030] In one implementation, the material of the elastic element includes beryllium copper alloy, tin-phosphorus alloy, phosphor bronze, stainless steel, or copper-titanium alloy.

[0031] In one implementation, the material of the thermal conductive element includes graphene, carbon-based thermal pads, silicon-based thermal pads, or carbon fibers.

[0032] In one implementation, the first circuit board includes a plurality of first openings, which are respectively connected to first windows of a plurality of first slots. A first heat sink is located on the side of the first circuit board facing away from the first light cage, and part of its structure extends into the interior of the plurality of first slots through the plurality of first openings and the plurality of first windows.

[0033] The technical solution provided in this disclosure, on the one hand, by setting the first heat sink on the side of the first circuit board away from the first optical cage, minimizes the interference of the first heat sink with the fixation of the first optical cage on the first circuit board, thus facilitating the fixation of the first optical cage on the first circuit board. On the other hand, by providing a first opening on the first circuit board, a portion of the structure of the first heat sink can still extend into the interior of the first slot through the first opening and the first window.

[0034] In one implementation, the first heat sink includes multiple air-cooled heat sinks, each corresponding to a plurality of first slots. Each air-cooled heat sink includes a substrate, fins, and bosses. The fins and bosses are arranged on both sides of the substrate. The fins are located outside the first slots, and the bosses extend into the interior of the first slots through first openings and first windows. In this way, an independent air-cooled heat sink is attached to the first circuit board, rather than a heat sink including a common cold plate. This avoids interference between the common cold plate and the components and structures on the circuit board, simplifying the board manufacturing process.

[0035] In one implementation, the first optical cage near the shell wall of the first circuit board includes multiple pins and multiple fastening connection feet, wherein each first opening has pins and fastening connection feet on both sides. The pins pass through the first circuit board and are fixedly connected to the first circuit board. The fastening connection feet pass through the first circuit board, and a portion of the fastening connection feet protrudes from the first circuit board. The air-cooled heat sink also includes multiple fasteners, each fastener engaging with the fastening connection feet on both sides of the corresponding substrate to clamp the substrate between the fastener and the first circuit board.

[0036] The technical solution provided in this disclosure achieves the fixation of the air-cooled heat sink and the optical cage when there is a circuit board between the optical cage and the air-cooled heat sink by setting the first optical cage to include a fastener connecting foot on the shell wall near the first circuit board and setting the fastener connecting foot to penetrate the first circuit board.

[0037] In one implementation, the first heat sink includes a cold plate and multiple flexible heat-conducting components. One side of each of the multiple flexible heat-conducting components is connected to the cold plate of the first heat sink, and the other side extends into the interior of multiple first slots through multiple first openings and multiple first windows. In this way, both sides of the optical module in the first slot are cooled by the cold plate. When the cold plate is a liquid-cooled cold plate, both sides of the optical module are liquid-cooled, resulting in higher heat dissipation efficiency.

[0038] In one implementation, the board further includes a second circuit board, a second optical cage, and a third heat sink. The second circuit board is arranged opposite to the first circuit board. The first optical cage is fixed to the side of the first circuit board facing the second circuit board, and the second optical cage is fixed to the side of the second circuit board facing the first circuit board. The second optical cage includes a plurality of second slots arranged in a layer. Each second slot includes a third opening on the slot wall near the second circuit board and a fourth opening on the slot wall away from the second circuit board. The second heat sink includes a plurality of resilient thermally conductive components divided into two groups. One group of resilient thermally conductive components extends into the interior of the plurality of first slots through the plurality of second openings, and the other group of resilient thermally conductive components extends into the interior of the plurality of second slots through the plurality of fourth openings. The third heat sink is located on the side of the second optical cage near the second circuit board, and a portion of the structure of the third heat sink extends into the interior of the plurality of second slots through the plurality of third openings.

[0039] The second optical cage may be one or more, and each second optical cage includes one or more second slots. For example, there may be multiple second optical cages, each including two or four second slots. Each second slot is used to accommodate one optical module.

[0040] The technical solution provided in this disclosure, through the above-mentioned arrangement, makes the two sides of the optical module in the first slot contact the first heat sink and the second heat sink respectively, and the two sides of the optical module in the second slot contact the second heat sink and the third heat sink respectively. Thus, the optical modules in the first slot and the second slot are both heat-dissipated on both sides, and the heat dissipation efficiency of the optical modules is relatively high.

[0041] Furthermore, by configuring the second heat sink, which includes a cold plate and two sets of flexible thermal conductive components, and by having the two sets of flexible thermal conductive components extend into the interiors of the first and second slots respectively, the cold plate can be shared by the optical modules in both slots. This allows the cold plate to even out the temperature of the optical modules in both slots, reducing the possibility of individual modules overheating. On the other hand, it reduces the need for four heat sinks instead of three for the dual-layer optical module's double-sided heat dissipation, thus reducing the number of heat sinks required for the board and lowering costs.

[0042] In one implementation, the second circuit board includes a plurality of second openings, each of which communicates with a third window of a plurality of second slots. A third heat sink is located on the side of the second circuit board away from the second optical cage. A portion of the structure of the third heat sink extends into the interior of the second slots through the plurality of second openings and the plurality of third windows.

[0043] The technical solution provided in this disclosure, on the one hand, by setting the third heat sink on the side of the second circuit board away from the second optical cage, minimizes the interference of the third heat sink with the fixation of the second optical cage on the second circuit board, thus facilitating the fixation of the second optical cage on the second circuit board. On the other hand, by providing a second opening on the second circuit board, a portion of the structure of the third heat sink can still extend into the interior of the second slot through the second opening and the third window.

[0044] In one implementation, both the first and third heat sinks include multiple air-cooled heat sinks. The multiple air-cooled heat sinks in the first heat sink correspond one-to-one with multiple first slots. The multiple air-cooled heat sinks in the third heat sink correspond one-to-one with multiple second slots. In this way, each of the first and second circuit boards has an independent air-cooled heat sink, rather than a heat sink including a common cold plate. This avoids interference between the common cold plate and the components and structures on the circuit board, simplifying the board manufacturing process. Furthermore, the optical modules in the first and second slots have air cooling on one side and liquid cooling on the other.

[0045] In one implementation, both the first and third heat sinks include a cold plate and multiple flexible thermally conductive components. One side of each of the multiple flexible thermally conductive components of the first heat sink is connected to the cold plate, and the other side extends into the interior of multiple first slots through multiple second openings. One side of each of the multiple flexible thermally conductive components of the third heat sink is connected to the cold plate, and the other side extends into the interior of multiple second slots through multiple fourth openings. In this way, both sides of the optical modules in the first and second slots are cooled by the cold plate. When the cold plate is a liquid-cooled cold plate, both sides of the optical module are liquid-cooled, resulting in higher heat dissipation efficiency.

[0046] Secondly, this disclosure provides a network device. The network device includes at least one board as described in any of the first aspects.

[0047] Among these, a circuit board can also be called a single-board unit. Network equipment can also be called information and communications technology (ICT) equipment. Network equipment includes switches, routers, and servers, among others.

[0048] Thirdly, this disclosure provides a heat sink. The heat sink includes a cold plate and a plurality of flexible thermally conductive components. One side of each of the plurality of flexible thermally conductive components is connected to the cold plate. The flexible thermally conductive components are capable of elastic expansion and contraction relative to the surface of the cold plate.

[0049] In one implementation, the cold plate includes multiple limiting grooves, each corresponding to a plurality of elastic heat-conducting components. Each elastic heat-conducting component includes a floating plate and at least one elastic heat-conducting element. A portion of the floating plate is confined within a limiting groove, while another portion is located outside the limiting groove. The elastic heat-conducting element is located between the floating plate and the bottom of the limiting groove, and abuts against both the floating plate and the bottom of the limiting groove.

[0050] For details regarding flexible thermal conductive components and cold plates, please refer to the relevant content in the first section, which will not be repeated here. Attached Figure Description

[0051] Figure 1 is a schematic diagram of a circuit board provided in an embodiment of this disclosure;

[0052] Figure 2 is a schematic diagram of a circuit board provided in an embodiment of this disclosure;

[0053] Figure 3 is an exploded view of a circuit board provided in an embodiment of this disclosure;

[0054] Figure 4 is a front view of a board provided in an embodiment of this disclosure;

[0055] Figure 5 is a partial cross-sectional view of a board provided in an embodiment of this disclosure;

[0056] Figure 6 is a partial cross-sectional view of a board provided in an embodiment of this disclosure;

[0057] Figure 7 is a schematic diagram of a liquid-cooled heat sink provided in an embodiment of this disclosure;

[0058] Figure 8 is a schematic diagram of a cold plate, liquid cooling pipe and flexible heat-conducting component provided in an embodiment of this disclosure;

[0059] Figure 9 is an exploded view of a liquid-cooled radiator provided in an embodiment of this disclosure;

[0060] Figure 10 is a cross-sectional view of a liquid-cooled heat sink provided in an embodiment of this disclosure;

[0061] Figure 11 is a cross-sectional view of a liquid-cooled heat sink provided in an embodiment of this disclosure;

[0062] Figure 12 is a cross-sectional view of a cold plate, a floating plate, and a liquid cooling pipe provided in an embodiment of this disclosure;

[0063] Figure 13 is a schematic diagram of an elastic thermal conductive component provided in an embodiment of this disclosure;

[0064] Figure 14 is a schematic diagram of another elastic heat-conducting component provided in an embodiment of this disclosure;

[0065] Figure 15 is a schematic diagram of a light cage provided in an embodiment of this disclosure;

[0066] Figure 16 is a schematic diagram of a mounting method of an optical cage on a circuit board according to an embodiment of this disclosure;

[0067] Figure 17 is a schematic diagram of a mounting method of an optical cage on a circuit board according to an embodiment of this disclosure;

[0068] Figure 18 is a schematic diagram of a board provided in an embodiment of this disclosure;

[0069] Figure 19 is a schematic diagram of a board provided in an embodiment of this disclosure;

[0070] Figure 20 is an exploded view of a board provided in an embodiment of this disclosure;

[0071] Figure 21 is a front view of a board provided in an embodiment of this disclosure;

[0072] Figure 22 is a partial cross-sectional view of a circuit board provided in an embodiment of this disclosure;

[0073] Figure 23 is a partial cross-sectional view of a board provided in an embodiment of this disclosure;

[0074] Figure 24 is a cross-sectional view of a liquid-cooled heat sink provided in an embodiment of this disclosure;

[0075] Figure 25 is a schematic diagram of a circuit board provided in an embodiment of this disclosure;

[0076] Figure 26 is a front view of a board provided in an embodiment of this disclosure;

[0077] Figure 27 is a front view of a board provided in an embodiment of this disclosure;

[0078] Figure 28 is a front view of a board provided in an embodiment of this disclosure.

[0079] Legend

[0080] 1. First circuit board; 11. First opening;

[0081] 2. First light cage; 21. First slot; 22. First window; 23. Second window; 24. Pin; 25. Fastener connecting foot;

[0082] 3. First radiator;

[0083] 4. Second radiator;

[0084] 5. Second circuit board; 51. Second opening;

[0085] 6. Second light cage; 61. Second slot; 62. Third window; 63. Fourth window;

[0086] 7. Third radiator;

[0087] 100. Radiator; 110. Cold plate; 111. Limiting groove; 1110. Stepped surface; 1111. Receiving part; 1112. Groove part; 1113. Protrusion; 1114. First mating groove; 1115. Groove; 120. Elastic heat-conducting component; 121. Floating plate; 1211. Main body; 1212. Limiting part; 1213. Receiving groove; 1214. Second mating groove; 1215. First inclined surface; 122. Elastic heat-conducting element; 1221. Elastic element; 1222. Heat-conducting element; 130. Liquid cooling pipe;

[0088] 200, air-cooled radiator; 210, base plate; 220, fins; 230, boss; 231, second bevel; 240, fastener. Detailed Implementation

[0089] Information and communications technology (ICT) equipment (such as switches) contains boards, which include circuit boards and optical cages mounted on the circuit boards. The optical cages have slots containing connectors that electrically connect to electrical components (such as chips) on the circuit board. The slots are used to insert optical modules, allowing the optical modules to mate with the connectors, thus enabling the board to communicate with other devices via the optical modules. ICT equipment can also be called network equipment, and the boards can be called single boards.

[0090] Optical modules generate a significant amount of heat during operation, and the higher the temperature, the higher the failure rate. Therefore, to reduce the failure rate of optical modules, it is necessary to lower their temperature.

[0091] To dissipate heat from the optical module, related technologies typically involve creating a window in the top wall of the optical cage and adding a heat sink to that wall. Part of the heat sink extends through the window into the slot of the optical cage and comes into contact with the optical module to absorb the heat generated by it. However, as the power of optical modules increases, the required heat dissipation capacity also increases, and the heat dissipation methods in related technologies are no longer sufficient to meet the heat dissipation needs of high-power optical modules.

[0092] In view of the above-mentioned technical problems, this disclosure provides a novel circuit board. As shown in Figures 1-4, the circuit board includes a first circuit board 1, a first optical cage 2, a first heat sink 3, and a second heat sink 4. The first optical cage 2 is fixed to the first circuit board 1. The first optical cage 2 includes a plurality of first slots 21 arranged in a layer. As shown in Figure 3, each first slot 21 includes a first opening 22 on the slot wall near the first circuit board 1 and a second opening 23 on the slot wall away from the first circuit board 1. As shown in Figures 4-6, the first heat sink 3 is located on the side of the first optical cage 2 near the first circuit board 1, and part of its structure (such as a boss 230) extends into the interior of the plurality of first slots 21 through the plurality of first openings 22. As shown in Figures 4-7, the second heat sink 4 includes a cold plate 110 and a plurality of elastic heat-conducting components 120. The cold plate 110 is located on the side of the first light cage 2 away from the first circuit board 1. One side of a plurality of elastic heat-conducting components 120 is connected to the cold plate 110, and the other side extends into the interior of a plurality of first slots 21 through a plurality of second openings 23. The elastic heat-conducting components 120 are capable of elastic expansion and contraction relative to the surface of the cold plate 110.

[0093] The first circuit board 1 can be a printed circuit board (PCB). There are one or more first optical cages 2, each including one or more first slots 21. For example, as shown in Figures 1-4, there are multiple first optical cages 2, each including two first slots 21. Even more exemplarily, as shown in Figure 15, each first optical cage 2 includes four first slots 21. Each first slot 21 is used to accommodate one optical module. A connector is provided inside the first slot 21, and the connector is electrically connected to electrical components on the first circuit board 1. When the optical module is inserted into the first slot 21, the optical module mates with the connector, and the board can communicate with other devices through the optical module.

[0094] The technical solution provided in this disclosure provides a first window 22 and a second window 23 on both sides of the first slot 21, allowing a portion of the structure of the first heat sink 3 to extend into the interior of the first slot 21 through the first window 22, and a portion of the structure of the second heat sink 4 to extend into the interior of the first slot 21 through the second window 23. Thus, after the optical module is inserted into the first slot 21, both sides of the optical module contact the first heat sink 3 and the second heat sink 4 respectively, achieving double-sided heat dissipation, resulting in high heat dissipation efficiency and low failure rate.

[0095] Furthermore, by configuring the second heat sink 4 to include a common cold plate 110 and multiple elastic heat-conducting components 120, and by configuring the multiple elastic heat-conducting components 120 to extend into the interior of multiple first slots 21, during the insertion of each optical module into its respective first slot 21, the optical module can compress the corresponding elastic heat-conducting component 120, causing the elastic heat-conducting component 120 to retract relative to the surface of the cold plate 110, thereby allowing the optical module to be smoothly inserted into the corresponding first slot 21. It can be understood that the design of the multiple elastic heat-conducting components 120 allows multiple optical modules to share a single cold plate 110 for heat dissipation, and the optical modules will not be unable to be inserted into the first slot 21 due to interference with the elastic heat-conducting components 120. Moreover, the cold plate 110 can evenly distribute the temperature of the optical modules in the multiple first slots 21, preventing individual optical modules from overheating.

[0096] In addition, after the optical module is inserted into the first slot 21, under the elastic force of the elastic heat-conducting component 120, the elastic heat-conducting component 120 can make close contact with the optical module, which makes the heat transfer efficiency between the optical module and the elastic heat-conducting component 120 high, thereby improving the heat dissipation efficiency of the optical module and reducing the failure rate of the optical module.

[0097] This disclosure does not limit the type of the cold plate 110. In some examples, as shown in Figures 7 and 8, the cold plate 110 is a liquid-cooled cold plate. A refrigerant flows inside the cold plate 110, circulating to continuously remove heat transferred to it. In some examples, as shown in Figure 8, the cold plate 110 includes a liquid-cooling pipe 130 containing coolant (i.e., refrigerant). The coolant circulates within the pipe, allowing the heat transferred from the optical module to the cold plate 110 via the elastic heat-conducting component 120 to be continuously removed by the coolant. In some examples, as shown in Figure 8, on a projection pattern perpendicular to the surface of the cold plate 110, multiple elastic heat-conducting components 120 partially overlap with the liquid-cooling pipe 130, facilitating heat transfer from the elastic heat-conducting components 120 to the coolant in the liquid-cooling pipe 130.

[0098] In some other examples, the cold plate 110 is an air-cooled cold plate, in which case fins are provided on the cold plate 110 for air cooling heat dissipation. The case where the cold plate 110 is an air-cooled cold plate is not shown in the figure.

[0099] The following is an exemplary description of how the elastic thermally conductive component 120 is implemented.

[0100] In some examples, as shown in Figures 9-11, the cold plate 110 includes a plurality of limiting grooves 111 (only one is shown in the figures), each corresponding to a plurality of elastic heat-conducting components 120. Each elastic heat-conducting component 120 includes a floating plate 121 and at least one elastic heat-conducting element 122. A portion of the floating plate 121 is confined within the limiting groove 111, while another portion is located outside the limiting groove 111 and extends into the interior of the first slot 21 through a second opening 23. The elastic heat-conducting element 122 is located between the bottom of the floating plate 121 and the limiting groove 111, and abuts against both the bottom of the floating plate 121 and the bottom of the limiting groove 111.

[0101] The floating plate 121 is used to contact the optical module. The heat generated by the optical module is first transferred to the floating plate 121, and then transferred to the cold plate 110 via the elastic heat conductor 122. The elastic heat conductor 122 is used to drive the floating plate 121 to move outward of the limiting groove 111, so that the floating plate 121 can elastically expand and contract relative to the surface of the cold plate 110.

[0102] The technical solution provided in this embodiment allows the optical module to be smoothly inserted into the first slot 21 during the insertion process. The optical module contacts the floating plate 121, causing it to retract relative to the surface of the cold plate 110, thus ensuring successful insertion. After insertion, the elastic heat-conducting element 122 is compressed, applying elastic force to the floating plate 121, ensuring close contact between the floating plate 121 and the optical module. This results in high heat transfer efficiency between the optical module and the floating plate 121.

[0103] Furthermore, by providing a limiting groove 111 on the cold plate 110, a portion of the structure of the elastic heat-conducting component 120 is embedded in the cold plate 110. Compared to non-embedded contact solutions, the technical solution provided by this embodiment shortens the distance between the elastic heat-conducting component 120 and the refrigerant (such as the coolant in the liquid cooling pipe 130), reduces thermal resistance, and improves the heat transfer efficiency between the elastic heat-conducting component 120 and the cold plate 110.

[0104] In some examples, as shown in Figure 6, the surface of the floating plate 121 facing the slot of the first slot 21 is a first inclined surface 1215. The first inclined surface 1215 is used to contact the optical module so that the optical module can smoothly drive the floating plate 121 to retract.

[0105] In some examples, as shown in Figure 11, the limiting groove 111 includes a receiving portion 1111 and a slot portion 1112 along the depth direction. The inner diameter of the slot portion 1112 is smaller than the inner diameter of the receiving portion 1111, and two stepped surfaces 1110 are formed between the slot portion 1112 and the receiving portion 1111. As shown in Figures 9 and 11, the floating plate 121 includes a main body portion 1211 and two limiting portions 1212, which are located on both sides of the main body portion 1211. As shown in Figure 11, the two limiting portions 1212 are located in the receiving portion 1111 and are respectively opposite to the two stepped surfaces 1110. The main body portion 1211 passes through the slot portion 1112 and extends into the interior of the first slot 21.

[0106] When the optical module is pulled out of the first slot 21, the floating plate 121 extends out relative to the surface of the cold plate 110 under the elastic force of the elastic heat-conducting element 122. Since the two limiting parts 1212 are located in the receiving part 1111 and are respectively opposite to the two stepped surfaces 1110, when the floating plate 121 extends to its limit position, the two limiting parts 1212 will abut against the two stepped surfaces 1110, so that the floating plate 121 cannot disengage from the limiting groove 111.

[0107] In some examples, when the first slot 21 does not contain an optical module, the two limiting portions 1212 of the floating plate 121 abut against the two stepped surfaces 1110 respectively, and the elastic heat-conducting element 122 is in a compressed state. Thus, under the elastic force of the elastic heat-conducting element 122, the two limiting portions 1212 are tightly fitted to the two stepped surfaces 1110, preventing the floating plate 121 from wobbling. When the first slot 21 contains an optical module, the two limiting portions 1212 of the floating plate 121 separate from the two stepped surfaces 1110 respectively, the elastic heat-conducting element 122 is further compressed, and the elastic force of the elastic heat-conducting element 122 is enhanced, allowing the floating plate 121 to fit the optical module more tightly.

[0108] The embodiments disclosed herein do not limit the implementation of the slot portion 1112. In some examples, the second heat sink 4 further includes a blocking member, which is fixedly connected to the cold plate 110 and extends partly into the limiting groove 111. The portion of the blocking member located above the bottom of the limiting groove 111 has a stepped surface 1110. The blocking member is a structural component such as a baffle or a screw.

[0109] In some examples, as shown in Figures 10-12, the side of the floating plate 121 facing the bottom of the limiting groove 111 includes a receiving groove 1213, and the elastic heat-conducting element 122 abuts against the bottom of the receiving groove 1213. By providing the receiving groove 1213 on the floating plate 121, the distance between the floating plate 121 and the bottom of the limiting groove 111 is increased, providing sufficient space for the elastic heat-conducting element 122. This allows the elastic heat-conducting element 122 to be made larger, facilitating its fabrication.

[0110] In some examples, as shown in Figures 10-12, the bottom of the limiting groove 111 includes a protrusion 1113, which faces the receiving groove 1213. The outer diameter of the protrusion 1113 is smaller than the inner diameter of the receiving groove 1213. At least one elastic heat-conducting element 122 abuts against the side of the protrusion 1113 facing the receiving groove 1213. A groove 1115 is formed between the protrusion 1113 and the sidewall of the limiting groove 111, and the groove 1115 faces the two limiting portions 1212 of the floating plate 121 to provide sufficient space for the limiting portions 1212 to move.

[0111] In some examples, as shown in Figures 10-12, the protrusion 1113 is opposite to the space where the refrigerant is located (such as the liquid cooling pipe 130). This design of the protrusion 1113 prevents the plates on both sides of the refrigerant from being too thin. In some examples, the protrusion 1113 is formed after a groove 1115 is created at the bottom of the limiting groove 111.

[0112] To improve the heat transfer efficiency between the elastic heat-conducting element 122 and the floating plate 121, in some examples, as shown in Figures 12 and 11, the bottom of the limiting groove 111 includes at least one first mating groove 1114, with each elastic heat-conducting element 122 fitting against the groove wall of the first mating groove 1114. This increases the contact area between the elastic heat-conducting element 122 and the cold plate 110, thereby improving the heat transfer efficiency between them. As shown in Figures 12 and 13, the shape of the first mating groove 1114 matches the shape of the portion of the elastic heat-conducting element 122 that fits into the first mating groove 1114. For example, the cross-section of the first mating groove 1114 is arc-shaped, and the cross-section of the portion of the elastic heat-conducting element 122 that fits into the first mating groove 1114 is also arc-shaped (as shown in Figure 13). Furthermore, the first mating groove 1114 also provides a certain degree of limiting effect on the elastic heat-conducting element 122.

[0113] In some examples, as shown in Figures 12 and 11, the side of the floating plate 121 facing the bottom of the limiting groove 111 includes at least one second mating groove 1214, with each elastic heat-conducting element 122 fitting against the groove wall of the second mating groove 1214. This increases the contact area between the elastic heat-conducting element 122 and the floating plate 121, thereby improving the heat transfer efficiency between the floating plate 121 and the elastic heat-conducting element 122. As shown in Figures 12 and 13, the shape of the second mating groove 1214 matches the shape of the portion of the elastic heat-conducting element 122 that fits into the second mating groove 1214. For example, the cross-section of the second mating groove 1214 is arc-shaped, and the cross-section of the portion of the elastic heat-conducting element 122 that fits into the second mating groove 1214 is also arc-shaped (as shown in Figure 13). Furthermore, the second mating groove 1214 also provides a certain degree of limiting effect on the elastic heat-conducting element 122.

[0114] The first mating groove 1114 and the second mating groove 1214 can coexist or one of them can be selected. In some examples, as shown in Figure 12, the first mating groove 1114 and the second mating groove 1214 coexist and are opposite each other. As shown in Figure 11, each elastic heat-conducting element 122 is located between a first mating groove 1114 and a second mating groove 1214, and is in contact with the groove walls of the first mating groove 1114 and the second mating groove 1214, respectively.

[0115] In some examples, as shown in Figure 12, the first mating groove 1114 is located on the protrusion 1113 at the bottom of the limiting groove 111. The second mating groove 1214 is located at the bottom of the receiving groove 1213 of the floating plate 121.

[0116] In other examples, the bottom of the limiting groove 111 does not have a first mating groove 1114, and the floating plate 121 does not have a second mating groove 1214. That is, the bottom of the limiting groove 111 is a plane, and the surface of the floating plate 121 facing the bottom of the limiting groove 111 is a plane. This simplifies the manufacturing of the cold plate 110 and the floating plate 121. In this case, as shown in Figure 14, the surfaces of the elastic heat-conducting element 122 that are used to contact the bottom of the floating plate 121 and the limiting groove 111 are both planes to ensure a sufficiently large contact area.

[0117] In some examples, as shown in Figures 9-11, there are multiple elastic heat-conducting elements 122. This allows for two advantages: firstly, the greater elasticity provided by multiple elements 122 enables the floating plate 121 to make closer contact with the optical module; secondly, the heat on the floating plate 121 can be transferred to the cold plate 110 more efficiently through the multiple elements 122.

[0118] In some examples, as shown in Figure 6, multiple elastic heat-conducting elements 122 are arranged sequentially along the insertion direction of the optical module. The insertion direction of the optical module is indicated by the arrow in Figure 6.

[0119] In some examples, as shown in Figures 13 and 14, the elastic heat-conducting element 122 includes an elastic element 1221 and a heat-conducting element 1222, the heat-conducting element 1222 covering the elastic element 1221, and the heat-conducting element 1222 abutting against the bottom of the floating plate 121 and the limiting groove 111 respectively.

[0120] Since the heat-conducting component 1222 covers the elastic component 1221 and abuts against the bottom of the floating plate 121 and the limiting groove 111 respectively, the heat on the floating plate 121 can be efficiently transferred to the bottom of the limiting groove 111 (i.e., the cold plate 110) through the heat-conducting component 1222. On the other hand, the elastic component 1221 drives the heat-conducting component 1222 to make close contact with the bottom of the floating plate 121 and the limiting groove 111, which also improves the efficiency of heat transfer from the floating plate 121 to the cold plate 110.

[0121] In some examples, as shown in Figures 13 and 14, the elastic element 1221 is an elastic spring, and the extension direction of the elastic spring intersects with the bottom of the floating plate 121 and the limiting groove 111.

[0122] In some examples, as shown in Figure 13, the cross-section of the elastic spring is S-shaped or Z-shaped. In other examples, as shown in Figure 14, the cross-section of the elastic spring is π-shaped.

[0123] In other examples, the elastic element 1221 is a compression spring.

[0124] In some examples, as shown in Figures 13 and 14, the heat-conducting element 1222 includes a cylindrical structure. The cylindrical structure has two end wall openings, and its side walls abut against the bottom of the floating plate 121 and the limiting groove 111, respectively. The elastic element 1221 is located inside the cylindrical structure and abuts against its side walls. In some examples, the cylindrical structure is formed by winding a membrane structure, which can be one or more layers. For example, as shown in Figures 13 and 14, the membrane structure is two layers.

[0125] In other examples, the heat-conducting element 1222 is a coating and is applied to the elastic element 1221.

[0126] In some examples, the elastic element 1221 is made of beryllium copper alloy, tin-phosphorus alloy, phosphor bronze, or copper-titanium alloy. On the one hand, the elastic element 1221 made of the above materials has good elastic properties, resulting in good elasticity of the elastic heat-conducting element 122. On the other hand, the elastic element 1221 made of the above materials also has good thermal conductivity, which facilitates the transfer of heat from the floating plate 121 to the cold plate 110 through the elastic heat-conducting element 122.

[0127] In other examples, the elastic element 1221 may also be made of stainless steel, rubber, spring steel, spring copper, or spring aluminum, etc.

[0128] In some examples, the heat conductor 1222 is made of thermal interface materials (TIMs), such as graphene, carbon-based thermal pads, silicon-based thermal pads, or carbon fibers. These materials generally have good thermal conductivity, which facilitates the transfer of heat from the floating plate 121 to the cold plate 110 via the elastic heat conductor 122.

[0129] The location of the first heat sink 3 will be described below as an example.

[0130] In some examples, as shown in Figures 1-6, the first heat sink 3 is located on the side of the first circuit board 1 facing away from the first light cage 2. The first circuit board 1 includes a plurality of first openings 11, which are respectively connected to the first windows 22 of a plurality of first slots 21. Part of the structure of the first heat sink 3 extends into the interior of the plurality of first slots 21 through the plurality of first openings 11 and the plurality of first windows 22.

[0131] In this way, on the one hand, since the first heat sink 3 is located on the side of the first circuit board 1 facing away from the first light cage 2, the first heat sink 3 causes less obstruction to the fixation of the first light cage 2 on the first circuit board 1, which is beneficial to the fixation of the first light cage 2 on the first circuit board 1. On the other hand, by setting the first circuit board 1 to include multiple first openings 11, part of the structure of the first heat sink 3 can still extend into the interior of the first slot 21 through the first openings 11 and the first window 22.

[0132] In some examples, as shown in Figures 15 and 16, the shell wall of the first optical cage 2 facing the first circuit board 1 includes a plurality of pins 24, which penetrate through the first circuit board 1 and are fixedly connected to it. Exemplarily, after the pins 24 penetrate through the first circuit board 1, they are bent on the side of the first circuit board 1 facing away from the first optical cage 2, so that the pins 24 cannot be pulled out of the first circuit board 1.

[0133] In some examples, as shown in Figures 15 and 16, pins 24 are provided on both sides of each first slot 21. This makes the first optical cage 2 more stably fixed on the first circuit board 1.

[0134] In some examples, as shown in Figures 1-4, the first heat sink 3 includes multiple air-cooled heat sinks 200, each corresponding to a single first slot 21. As shown in Figures 4-6, each air-cooled heat sink 200 includes a substrate 210, fins 220, and bosses 230, with the fins 220 and bosses 230 positioned on opposite sides of the substrate 210. The fins 220 are located outside the first slots 21, while the bosses 230 extend into the first slots 21 through a first opening 11 and a first window 22. When an optical module inserted into the first slot 21 contacts the bosses 230, the heat generated by the optical module is first transferred to the bosses 230, and then via the substrate 210 to the fins 220. The fins 220 are typically positioned in the airflow path of the fan, thus the heat on the fins 220 is carried away by the airflow.

[0135] The technical solution provided in this embodiment of the disclosure includes a first heat sink 3 comprising multiple air-cooled heat sinks 200, such that the bottom surface of the optical module inserted into the first slot 21 is air-cooled and the top surface is liquid-cooled (in the case where the cold plate 110 is a liquid-cooled cold plate). The bottom surface of the optical module is the surface opposite to the first circuit board 1, and the top surface of the optical module is opposite to the bottom surface.

[0136] To prevent the optical module from being unable to be inserted into the first slot 21 due to interference with the boss 230 during insertion, in some examples, the air-cooled heat sink 200 is mounted on the first optical cage 2 or the first circuit board 1 by means of a fastener or spring screw, allowing the air-cooled heat sink 200 to extend and retract within the first opening 22. Thus, during insertion into the first slot 21, the optical module presses against the boss 230, causing the boss 230 to move outwards from the first slot 21, allowing the optical module to be smoothly inserted. After the optical module is inserted into the first slot 21, the boss 230 will be in close contact with the optical module under the action of the fastener and spring screw, resulting in high heat transfer efficiency between the optical module and the boss 230, which is beneficial for improving the heat dissipation efficiency of the optical module.

[0137] In some examples, as shown in Figure 6, the surface of the boss 230 facing the slot of the first slot 21 is a second inclined surface 231. The second inclined surface 231 is used to contact the optical module during the insertion of the optical module so that the optical module can press the boss 230 smoothly.

[0138] In some examples, to reduce the impact of pins 24 on fixing the air-cooled heat sink 200 on the first circuit board 1, as shown in FIG17, pins 24 are arranged on both sides of the substrate 210 of the air-cooled heat sink 200, so that the substrate 210 can fit well against the first circuit board 1 without contacting the pins 24.

[0139] In some examples, as shown in Figures 15-17, the first optical cage 2 has multiple fastening connecting feet 25 near the shell wall of the first circuit board 1. These fastening connecting feet 25 penetrate the first circuit board 1, and some structures of the fastening connecting feet 25 protrude from the first circuit board 1. As shown in Figure 17, the air-cooled heat sink 200 also includes multiple fasteners 240, each fastener 240 engaging with the fastening connecting feet 25 on both sides of the corresponding substrate 210 to clamp the substrate 210 between the fastener 240 and the first circuit board 1. This achieves the goal of fixing the air-cooled heat sink 200 to the first optical cage 2 even when the first circuit board 1 is located between the first optical cage 2 and the air-cooled heat sink 200.

[0140] In some examples, as shown in Figures 15 and 16, each first slot 21 has fastener connecting feet 25 on both sides.

[0141] In some examples, as shown in Figures 15 and 16, the end of the fastener connecting foot 25 includes a hook-like structure for engaging with the fastener.

[0142] Besides the technical solution where the first heat sink 3 includes multiple air-cooled heat sinks 200, in other examples, as shown in Figure 18, the first heat sink 3 includes a cold plate 110 and multiple elastic heat-conducting components 120. One side of the multiple elastic heat-conducting components 120 of the first heat sink 3 is connected to the cold plate 110 of the first heat sink 3, and the other side extends into the interior of multiple first slots 21 through multiple first openings 11 and multiple first windows 22. In this way, both sides of the optical module inserted into the first slot 21 are liquid-cooled (when the cold plate 110 is a liquid-cooled cold plate), and the heat dissipation efficiency of the optical module is higher.

[0143] In some examples, to avoid interference between the cold plate 110 of the first heat sink 3 and the pin 24, a gap is provided between the cold plate 110 and the first circuit board 1 to accommodate the pin 24. Additionally, it is understood that since the first circuit board 1 is disposed between the cold plate 110 of the first heat sink 3 and the first optical cage 2, while no circuit board is disposed between the cold plate 110 of the second heat sink 4 and the first optical cage 2, the length of the elastic thermally conductive component 120 of the first heat sink 3 extending relative to the cold plate 110 is greater than the length of the elastic thermally conductive component 120 of the second heat sink 4 extending relative to the cold plate 110.

[0144] Besides the technical solution of placing the first heat sink 3 on the side of the first circuit board 1 facing away from the first optical cage 2 and setting the first circuit board 1 to include multiple first openings 11, in some examples, the first heat sink 3 (in the case where the first heat sink 3 includes a cold plate 110) is located between the first circuit board 1 and the first optical cage 2, and the pins 24 of the first optical cage 2 pass through the cold plate 110 and are then fixedly connected to the first circuit board 1. In other examples, a common opening is provided on the first circuit board 1, and multiple air-cooled heat sinks 200 of the first heat sink 3 pass through this common opening and are fixed to the first optical cage 2.

[0145] In some examples, as shown in Figures 19-23 and 25, the board also includes a second circuit board 5, a second optical cage 6, and a third heat sink 7. The second circuit board 5 is arranged opposite to the first circuit board 1, the first optical cage 2 is fixed to the side of the first circuit board 1 facing the second circuit board 5, and the second optical cage 6 is fixed to the side of the second circuit board 5 facing the first circuit board 1. As shown in Figure 20, the second optical cage 6 includes a plurality of second slots 61 arranged in a layer. Each second slot 61 includes a third opening 62 on the slot wall near the second circuit board 5 and a fourth opening 63 on the slot wall away from the second circuit board 5. As shown in Figures 19-23, the second heat sink 4 is located between the first optical cage 2 and the second optical cage 6. The second heat sink 4 includes a cold plate 110 and two sets of elastic heat-conducting components 120, which are arranged on both sides of the cold plate 110. One set of elastic heat-conducting components 120 extends into the interior of the first slot 21 through multiple second openings 23, and the other set of elastic heat-conducting components 120 extends into the interior of the second slot 61 through multiple fourth openings 63. As shown in Figures 19-23, the third heat sink 7 is located on the side of the second circuit board 5 away from the second optical cage 6. Part of the structure of the third heat sink 7 extends into the interior of the second slot 61 through multiple third openings 62.

[0146] The second circuit board 5 can be the same type of circuit board as the first circuit board 1. The second optical cage 6 can be the same type of optical cage as the first optical cage 2. The relevant features and fixing methods of the second optical cage 6 can be referred to the relevant content of the first optical cage 2, and will not be repeated here. The third heat sink 7 can be the same type of heat sink as the first heat sink 3.

[0147] The technical solution provided in this embodiment of the present disclosure, through the above-mentioned arrangement, makes the two sides of the optical module inserted into the first slot 21 contact the first heat sink 3 and the second heat sink 4 respectively, and the two sides of the optical module inserted into the second slot 61 contact the second heat sink 4 and the third heat sink 7 respectively. Thus, the optical modules in the first slot 21 and the second slot 61 are both heat-dissipating on both sides, and the heat dissipation efficiency of the optical modules is high.

[0148] Furthermore, by configuring the second heat sink 4, which includes a cold plate 110 and two sets of elastic heat-conducting components 120, and by having the two sets of elastic heat-conducting components 120 extend into the interiors of the first slot 21 and the second slot 61 respectively, the cold plate 110 can be shared by the optical modules in the first slot 21 and the second slot 61. In this way, on the one hand, the cold plate 110 can evenly distribute the temperature of the optical modules in the first slot 21 and the second slot 61, preventing individual optical modules from overheating. On the other hand, the double-sided heat dissipation of the dual-layer optical module only requires three heat sinks instead of four, reducing the number of heat sinks required for the board and lowering costs.

[0149] In some examples, as shown in Figure 24, both surfaces of the cold plate 110 are provided with limiting grooves 111, and parts of the two sets of elastic heat-conducting components 120 are respectively confined in the limiting grooves 111 on the two surfaces of the cold plate 110. The method of confining the elastic heat-conducting components 120 in the limiting grooves 111 can be found in Figure 24 and the aforementioned related content, and will not be repeated here.

[0150] In some examples, as shown in Figure 24, the cold plate 110 is a liquid-cooled cold plate, and at least a portion of the liquid cooling pipe 130 is located between the limiting grooves 111 on the two surfaces of the cold plate 110.

[0151] The location of the third heat sink 7 will be described below as an example.

[0152] In some examples, as shown in Figure 20, the third heat sink 7 is located on the side of the second circuit board 5 away from the second optical cage 6. The second circuit board 5 includes a plurality of second openings 51, which communicate with the third windows 62 of a plurality of second slots 61. Part of the structure of the third heat sink 7 extends into the interior of the second slots 61 through the plurality of second openings 51 and the plurality of third windows 62. In this way, on the one hand, by setting the third heat sink 7 on the side of the second circuit board 5 away from the second optical cage 6, the third heat sink 7 obstructs the fixation of the second optical cage 6 on the second circuit board 5 less, which is beneficial to the fixation of the second optical cage 6 on the second circuit board 5. On the other hand, by setting the second circuit board 5 to include a plurality of second openings 51, part of the structure of the third heat sink 7 can still extend into the interior of the second slots 61 through the second openings 51 and the third windows 62.

[0153] In some examples, as shown in Figures 19-21, both the first heat sink 3 and the third heat sink 7 include multiple air-cooled heat sinks 200. The multiple air-cooled heat sinks 200 included in the first heat sink 3 correspond one-to-one with multiple first slots 21, and the multiple air-cooled heat sinks 200 included in the third heat sink 7 correspond one-to-one with multiple second slots 61. Thus, the bottom surface of the optical module inserted into the first slot 21 and the second slot 61 is air-cooled, and the top surface is liquid-cooled (in the case where the cold plate 110 is a liquid-cooled cold plate).

[0154] In some examples, as shown in Figures 25 and 26, both the first heat sink 3 and the third heat sink 7 include a cold plate 110 and multiple flexible heat-conducting components 120. One side of the multiple flexible heat-conducting components 120 of the first heat sink 3 is connected to the cold plate 110 of the first heat sink 3, and the other side extends into the interior of multiple first slots 21 through multiple second openings 23. One side of the multiple flexible heat-conducting components 120 of the third heat sink 7 is connected to the cold plate 110 of the third heat sink 7, and the other side extends into the interior of multiple second slots 61 through multiple fourth openings 63. In this way, both sides of the optical module inserted into the first slot 21 and the second slot 61 are liquid-cooled (in the case where the cold plate 110 is a liquid-cooled cold plate), resulting in higher heat dissipation efficiency of the optical module.

[0155] Besides the technical solution of placing the third heat sink 7 on the side of the second circuit board 5 facing away from the second optical cage 6 and setting the second circuit board 5 to include multiple second openings 51, in some examples, the third heat sink 7 (in the case where the third heat sink 7 includes a cold plate 110) is located between the second circuit board 5 and the second optical cage 6, and the pins 24 of the second optical cage 6 pass through the cold plate 110 before being fixedly connected to the second circuit board 5. In other examples, a common opening is provided on the second circuit board 5, through which multiple air-cooled heat sinks 200 of the third heat sink 7 pass and are fixed to the second optical cage 6.

[0156] In cases where the first heat sink 3, the second heat sink 4, and the third heat sink 7 are all heat sinks 100, in addition to the arrangement shown in Figure 26, in other examples, as shown in Figure 27, the first heat sink 3 is located between the first circuit board 1 and the second circuit board 5. The first heat sink 3 includes a cold plate 110 and two sets of elastic heat-conducting components 120. One set of elastic heat-conducting components 120 extends into the interior of the first slot 21 through the first opening 11 and the first window 22. The other set of elastic heat-conducting components 120 extends into the interior of the second slot 61 through the second opening 51 and the third window 62. The second heat sink 4 includes a cold plate 110 and multiple elastic heat-conducting components 120, which extend into the interior of the first slot 21 through multiple second windows 23. The third heat sink 7 includes a cold plate 110 and multiple elastic heat-conducting components 120, which extend into the interior of the second slot 61 through multiple fourth windows 63.

[0157] In some examples, as shown in Figure 28, the board also includes multiple layers of optical cages and heat sinks 100. In the board shown in Figure 28, the board units shown in Figure 26 and Figure 27 are used alternately. The portion outlined by the solid line in Figure 28 represents the board unit shown in Figure 26, and the portion outlined by the dashed line in Figure 28 represents the board unit shown in Figure 27.

[0158] This disclosure also provides a network device. The network device includes one or more of the aforementioned boards. The network device may also be referred to as an ICT device. The network device includes switches, routers, and servers, etc.

[0159] This disclosure also provides a heat sink 100. As shown in Figures 7-11, the heat sink 100 includes a cold plate 110 and a plurality of elastic heat-conducting components 120. The plurality of elastic heat-conducting components 120 are connected to the cold plate 110 and are capable of elastic expansion and contraction relative to the surface of the cold plate 110. The heat sink 100 may also be referred to as a liquid-cooled heat sink or a liquid-cooled plate. The heat sink 100 can be used in circuit boards for heat dissipation of optical modules, and can also be used in other fields.

[0160] In some examples, as shown in Figures 9-11, the cold plate 110 includes a plurality of limiting grooves 111, each corresponding to a plurality of elastic heat-conducting components 120. Each elastic heat-conducting component 120 includes a floating plate 121 and an elastic heat-conducting element 122. A portion of the floating plate 121 is confined within the limiting groove 111, while another portion is located outside the limiting groove 111. The elastic heat-conducting element 122 is located between the bottom of the floating plate 121 and the limiting groove 111, and abuts against both the bottom of the floating plate 121 and the bottom of the limiting groove 111.

[0161] For details regarding the cold plate 110 and the flexible thermal conductive component 120, please refer to the aforementioned related content, which will not be repeated here.

[0162] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the scope of this disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The above descriptions are merely optional embodiments of this disclosure and are not intended to limit the disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A board card, characterized by, The board card comprises a first circuit board (1), a first optical cage (2), a first heat sink (3) and a second heat sink (4); The first optical cage (2) is fixed to the first circuit board (1), and the first optical cage (2) comprises a plurality of first slots (21) arranged in a layer, each first slot (21) comprises a first window (22) on the slot wall close to the first circuit board (1) and a second window (23) on the slot wall away from the first circuit board (1); The first heat sink (3) is located on the side of the first optical cage (2) close to the first circuit board (1), and part of the structure extends into the interior of the plurality of first slots (21) through the plurality of first windows (22); The second heat sink (4) comprises a cold plate (110) and a plurality of elastic heat conduction components (120), the cold plate (110) is located on the side of the first optical cage (2) away from the first circuit board (1), one side of the plurality of elastic heat conduction components (120) is connected with the cold plate (110), and the other side extends into the interior of the plurality of first slots (21) through the plurality of second windows (23), wherein the elastic heat conduction component (120) can elastically stretch and contract relative to the plate surface of the cold plate (110).

2. The board card according to claim 1, characterized in that, The cold plate (110) comprises a plurality of limiting grooves (111), the plurality of limiting grooves (111) correspond to the plurality of elastic heat conduction components (120) one by one, and the elastic heat conduction component (120) comprises a floating plate (121) and at least one elastic heat conduction piece (122); Part of the floating plate (121) is limited in the limiting groove (111), and the other part is located outside the limiting groove (111) and extends into the interior of the first slot (21) through the second window (23); The at least one elastic heat conduction piece (122) is located between the floating plate (121) and the groove bottom of the limiting groove (111) and abuts against the floating plate (121) and the groove bottom of the limiting groove (111) respectively.

3. The board card of claim 2, wherein, The limiting groove (111) comprises a containing part (1111) and a groove mouth part (1112) along the depth direction, the inner diameter of the groove mouth part (1112) is smaller than that of the containing part (1111), and two step faces (1110) are formed between the groove mouth part (1112) and the containing part (1111); The floating plate (121) comprises a main body part (1211) and two limiting parts (1212), and the two limiting parts (1212) are located on both sides of the main body part (1211); The two limiting parts (1212) are located in the containing part (1111) and respectively opposite to the two step faces (1110), and the main body part (1211) penetrates through the groove mouth part (1112) and extends into the interior of the first slot (21) through the second window (23).

4. The board card according to claim 2 or 3, characterized in that, The floating plate (121) comprises a containing groove (1213) on one side of the groove bottom of the limiting groove (111), and the at least one elastic heat-conducting piece (122) abuts against the cavity bottom of the containing groove (1213).

5. The board card of claim 4, wherein, The groove bottom of the limiting groove (111) comprises a protrusion (1113) opposite to the containing cavity (1213), and the outer diameter of the protrusion (1113) is smaller than the inner diameter of the containing cavity (1213). The at least one elastic heat-conducting piece (122) abuts against the protrusion (1113).

6. The board card according to any one of claims 2 to 5, characterized in that, The groove bottom of the limiting groove (111) comprises at least one first matching groove (1114), and one side of the floating plate (121) towards the groove bottom of the limiting groove (111) comprises at least one second matching groove (1214), and the first matching groove (1114) and the second matching groove (1214) are opposite to each other one by one. Each of the elastic heat-conducting pieces (122) is located between one first matching groove (1114) and one second matching groove (1214), and abuts against the groove wall of the first matching groove (1114) and the second matching groove (1214) respectively.

7. The board card according to any one of claims 2 to 6, characterized in that The elastic heat-conducting piece (122) comprises an elastic piece (1221) and a heat-conducting piece (1222). The heat-conducting piece (1222) covers the elastic piece (1221), and abuts against the groove bottom of the floating plate (121) and the limiting groove (111) respectively.

8. The board card of claim 7, wherein, The elastic piece (1221) is an elastic spring sheet, and the extension direction of the elastic spring sheet intersects with the floating plate (121) and the groove bottom of the limiting groove (111).

9. The board card according to claim 7 or 8, characterized in that, The heat-conducting piece (1222) comprises a cylindrical structure, two end walls of the cylindrical structure are open, and the side wall of the cylindrical structure abuts against the groove bottom of the floating plate (121) and the limiting groove (111) respectively. The elastic piece (1221) is located inside the cylindrical structure and abuts against the side wall of the cylindrical structure.

10. The board card according to any of claims 7-9, characterized in that, The material of the elastic piece (1221) comprises beryllium copper alloy, tin phosphorus alloy, phosphor bronze, stainless steel or copper titanium alloy.

11. The board card according to any of claims 7-10, characterized in that, The material of the heat-conducting piece (1222) comprises graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad or carbon fiber.

12. The board card according to any one of claims 1 to 11, characterized in that, The first circuit board (1) comprises a plurality of first openings (11), and the plurality of first openings (11) are in communication with the first windows (22) of the plurality of first insertion grooves (21) respectively. The first heat sink (3) is located on the side of the first circuit board (1) away from the first optical cage (2), and part of the structure extends into the interior of the plurality of first insertion grooves (21) through the plurality of first openings (11) and the plurality of first windows (22).

13. The board card of claim 12, wherein, The first heat sink (3) comprises a plurality of air-cooled heat sinks (200), and the plurality of air-cooled heat sinks (200) correspond to the plurality of first insertion grooves (21) one by one. The air-cooled radiator (200) comprises a base plate (210), fins (220) and bosses (230), the fins (220) and the bosses (230) are arranged on both sides of the base plate (210), the fins (220) are located outside the first slot (21), and the bosses (230) extend into the inside of the first slot (21) through the first opening (11) and the first window (22).

14. The board card of claim 13, wherein, The first optical cage (2) comprises a plurality of pins (24) and a plurality of buckle connecting pins (25) near the shell wall of the first circuit board (1), wherein the pins (24) and the buckle connecting pins (25) are arranged on both sides of each first window (22); The plurality of pins (24) penetrate the first circuit board (1) and are fixedly connected with the first circuit board (1), and the plurality of buckle connecting pins (25) penetrate the first circuit board (1), and part of the structure of the buckle connecting pin (25) protrudes from the first circuit board (1); The air-cooled radiator (200) further comprises a plurality of buckles (240), each buckle (240) is clamped with the buckle connecting pin (25) on both sides of the corresponding base plate (210) to clamp the base plate (210) between the buckle (240) and the first circuit board (1).

15. The board card of claim 12, wherein, The first radiator (3) comprises a cold plate (110) and a plurality of elastic heat-conducting components (120), one side of the plurality of elastic heat-conducting components (120) of the first radiator (3) is connected with the cold plate (110) of the first radiator (3), and the other side extends into the inside of the plurality of first slots (21) through the plurality of first openings (11) and the plurality of first windows (22).

16. The board card according to any of claims 1-15, characterized by The board card further comprises a second circuit board (5), a second optical cage (6) and a third radiator (7); The second circuit board (5) is arranged opposite to the first circuit board (1), the first optical cage (2) is fixed to one side of the first circuit board (1) facing the second circuit board (5), and the second optical cage (6) is fixed to one side of the second circuit board (5) facing the first circuit board (1); The second optical cage (6) comprises a plurality of second slots (61), the plurality of second slots (61) are arranged in one layer, each second slot (61) comprises a third window (62) near the slot wall of the second circuit board (5) and a fourth window (63) away from the slot wall of the second circuit board (5); The plurality of elastic heat-conducting components (120) of the second radiator (4) are divided into two groups, one group of elastic heat-conducting components (120) extends into the inside of the plurality of first slots (21) through the plurality of second windows (23), and the other group of elastic heat-conducting components (120) extends into the inside of the plurality of second slots (61) through the plurality of fourth windows (63). The third heat sink (7) is located on the side of the second optical cage (6) close to the second circuit board (5), and part of the structure of the third heat sink (7) extends into the second slot (61) through the third window (62).

17. The board card of claim 16, wherein, The second circuit board (5) includes a plurality of second openings (51), which are in one-to-one communication with the third window (62) of the second slot (61). The third heat sink (7) is located on the side of the second circuit board (5) away from the second optical cage (6), and part of the structure of the third heat sink (7) extends into the second slot (61) through the second opening (51) and the third window (62).

18. The board card according to claim 16 or 17, characterized in that The first heat sink (3) and the third heat sink (7) each include a plurality of air-cooled heat sinks (200), and the first heat sink (3) includes a plurality of air-cooled heat sinks (200) corresponding to the first slot (21), and the third heat sink (7) includes a plurality of air-cooled heat sinks (200) corresponding to the second slot (61).

19. The board card according to claim 16 or 17, characterized in that, The first heat sink (3) and the third heat sink (7) each include a cold plate (110) and a plurality of elastic heat-conducting components (120). One side of the plurality of elastic heat-conducting components (120) of the first heat sink (3) is connected to the cold plate (110) of the first heat sink (3), and the other side extends into the first slot (21) through the second window (23). One side of the plurality of elastic heat-conducting components (120) of the third heat sink (7) is connected to the cold plate (110) of the third heat sink (7), and the other side extends into the second slot (61) through the fourth window (63).

20. A network device, comprising: The network device includes a board card as claimed in any one of claims 1-19.

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