A connecting element, an assembly and a method

Abstract

A connecting element for providing contact between a quantum processor with a large number of qubits and a plurality of signal cables, which connecting element comprises a plurality of RGBs which at one edge all have a plurality of exposed conductors for contacting the processor and with a number of staggered opposite portions where connectors of all RGBs are available for connection with the cables. The RGBs may have ground planes for preventing crosstalk between the conductors of neighbouring RGBs. The assembly may be cooled by a common cooling plate which may also cool the processor. The edge portions or the chip has an electrically conductive layer e.g. preventing fields in the RGBs from entering the chip or fields from the outside from entering into the RGBs.

Description

[0001] A CONNECTING ELEMENT, AN ASSEMBLY AND A METHOD

[0002] The present invention relates to a connecting element configured to provide connection between e.g. electrically conducting portions of a processor chip and a number of connectors or other interfacing elements. In particular, the connecting element is configured to provide contact to a quantum chip with a large number of qubits.

[0003] Relevant technology may be seen in NL2030907B1, US2020 / 084882, US2019 / 027800 and AU2023 / 217913.

[0004] In a first aspect, the invention relates a connecting element comprising a plurality of plateshaped elements, where each plate-shaped element has a first end, a second end and an edge portion at the first end, each plate-shaped element comprising : a. a first insulative layer having a first surface and a second surface, b. a plurality of conductive pathways provided on the first surface or inside the first insulative layer and being directed from the first end toward the second end, the conductive pathways being exposed at the edge portion, c. a plurality of interfacing elements, each interfacing element being configured to provide a signal or power to a conductive pathway or derive a signal or power therefrom, d. a first conductive layer between the conductive pathways of neighbouring plateshaped elements, and e. a second electrically conducting layer on the edge portions of the plate-shaped elements, wherein :

[0005] • the plurality of plate-shaped elements are stacked on top of each other, and

[0006] • the second conducting layer is electrically connected to one or more conductive pathways and / or the first conductive layer of at least one plate-shaped element, the second electrically conducting layer not being electrically connected to at least one exposed conductive pathway. In this context, a plate-shaped element may be a medium for connecting electrical elements into a circuit. The plate-shaped element may have an even thickness. Its thickness may be at least 2 times smaller than its other dimensions, such as dimensions of main surfaces thereof. For example, the plate-shaped element may be a printed circuit board (PCB). The thickness of the plate-shaped element may be uniform throughout. The plate-shaped elements may have any shape, such as plane / straight or bent / warped. The plate-shaped elements may have the same shape or the same overall shape. Portions of the plate-shaped elements, such as at the edge portions, may have the same shape. Preferably, the stacked elements have shapes so that facing, neighbouring outer surfaces of the plate-shaped elements are parallel so, that no gaps are seen between the stacked elements.

[0007] The plate-shaped element comprises a first insulative layer. In this context an insulative layer may be a region through which electricity is unable to pass / to be transmitted through. The insulative layer comprises a first and a second surface. The insulative layer may be made from any non-conductive material such as plastics, rubber or a polymer such as FR4, CEM, PTFE ceramics, semiconductors or the like. The insulative layer may have an even or a varying thickness, where the thickness is defined perpendicular to e.g. the first surface. The thickness may be between 0.05 mm to 10mm, such as 0.2mm-2.8mm.

[0008] The first surface may be one of the flat shapes or areas defined by the two larger dimensions of the insulative layer. The second surface of the insulative layer may be a second flat shape or area made by the two larger dimensions of the insulative and may be positioned opposite and parallel to the first surface.

[0009] The plate-shaped element comprises a first edge. The first edge may be defined as a flat shape, area, or surface between, often approximately perpendicular (plus or minus 45 degrees) to the first and second surfaces of the insulative layer. The edge is preferably at an outer portion of the plate-shaped element. The conductive pathways are exposed at the edge portion whereby the material of the conductive pathways extends to the edge portion and may be electrically connected to (galvanically, inductively or capacitively) from the edge portion or from outside of the edge portion. A conductive pathway may be an electrical conductor extending to the edge portion so that a galvanic connection thereto may be obtained at the edge portion. Alternatively, the conductive pathway may be configured for inductive or capacitive signal / power transfer and may thus comprise means at the edge portion for such transfer to an element external to the plate-shaped element. Also, microwave transmission may be catered for by the exposed surfaces, as microwave transmission is a preferred signal transport manner in especially low temperature systems such as quantum computing. The plate-shaped element also comprises a first end. In this context the first end is at the first edge. The first end may comprise the edge portion.

[0010] The plate-shaped element also comprises a second end. The second end may be located a distance away from the first end or the edge portion such as between 1cm to 10cm or more, along a length of the plate-shaped element. Often the first and second ends would be in opposite portions of the plate-shaped element. Thus, the first end and the second end may be opposite, perpendicular or at an angle (between 30- 180 degrees) to each other.

[0011] The plate-shaped element comprises a plurality of conductive pathways directed from the first end toward the second end. In this context a conductive pathway comprises a material configured to carry electrical signals. The conductive pathway may be made from copper, or another electrically conductive material.

[0012] The function of the pathways may be to conduct electrical signal. Alternatively or additionally, the pathways may be configured to transmit microwave signals. It is preferred that all pathways are impedance matched to 50 Ohms, or another desired resistance, and that all dielectric materials are selected for low microwave loss in the relevant frequency ranges, typically up to 8 GHz. It is highly preferred that pulses in the microwave frequency range are not distorted.

[0013] It is preferred that the conductive pathways have superconducting properties at the operating temperature, which may be below 4K or even below IK. Then, each pathway may comprise two layers of which one may be superconducting, where the other layer may be non-superconducting but which has a with a high thermal conductivity. Often, superconductors are poor thermal conductors. Then, one layer may provide an optimal electrical conductance and the other may provide an optimal best thermal conductance.

[0014] Thus, the most preferred embodiment has each pathway comprise or made of a bi-layer of copper and a superconductor. The most typically used superconductor would be aluminum, but it could also be rhenium, tantalum, or a niobium alloy such as NiTi. The pathway may alternatively comprise or be a tri-layer, with copper as the base layer, rhenium or aluminum as the superconducting layer, and gold as a surface layer for the lowest contact resistance.

[0015] The conductive pathways may have any dimensions such as a thickness, often perpendicular to the first surface, of between 0.01 and 1 mm. A width of a conductive pathway may be selected freely, such as approximately between 0.01- 1.5 mm. The conductive pathway be provided along a straight line between the first and second end, or the conductive pathway may be curved, or contain corners. The conductive pathway may span the whole of the distance between the first and second end, or the conductive pathway may span part of the distance between the first and second end.

[0016] A conductive pathway may extend between the edge portion, where it is exposed, and a pertaining interfacing element. Alternatively, a conductive pathway may extend a portion of that distance, such as from the edge portion, such as if an electrical component is provided on or in the plate-shaped element for receiving or delivering power / signal to the conductive pathway. In that situation, another or the same pathway may extend from an interfacing element to that component. Such components may be passive or active components and may e.g. e used for filtering, multiplexing, signal amplification, signal generation or signal processing on the plate-shaped element. Then, one component may be connected to more than one interfacing element and / or more than one exposed portion to e.g. receive multiple signals and / or output multiple signals.

[0017] The conductive pathways are exposed at the first edge. The way the conductive pathways are exposed at the first edge may be in a clearly defined pattern at the edge allowing an external system to accurately interface with them. Then, the exposed portions of the pathways may be provided, for a plate-shaped element, such as each plate-shaped element, along a straight line with predefined distances. Then, the exposed portions may have relative positions which are predetermined so that they may be positioned vis-a-vis a chip or the like having a corresponding pattern of conducting elements so that each exposed portion may engage a portion of the chip.

[0018] It may be desired to ensure that the plurality of conductive pathways remain isolated from each other so as to avoid interference or short circuiting. Therefore, the conductive pathways are provided on a first surface of, or inside the first insulative layer. The exposed conductive pathways at the edge portion may also be situated on the first surface of the insulative layer.

[0019] Each plate shaped element comprises a plurality of interfacing elements, each interfacing element is attached to or forms part of the pertaining plate-shaped element and is electrically, inductively or capacitively connected to a conductive pathway. In this context an interfacing element may be an electromechanical device used to create an electrical link between parts of an electrical circuit, or between different electrical circuits, thereby joining them into a larger circuit. The electrical connection may be or cater for a galvanic connection, an inductive connection and / or a capacitive connection. The interfacing elements may be large enough that a human operator can interface with them. The interfacing elements may be configured to have a wire and / or cable attached to them. The interfacing elements may be standard connectors such as SMA connectors or the like. The interfacing elements may additionally or alternatively be pads, contacts, pins or the like configured to facilitate e.g. a galvanic solder connection, a pinching / friction engagement, capacitive coupling or the like to an external device.

[0020] Actually, the interfacing elements may be exposed portions of the pathways at another edge.

[0021] The interfacing elements may additionally or alternatively be configured to provide an inductive or capacitive connection to an external device. Thus, a signal may be transmitted to or from an external source / receiver to the system via the interfacing elements, along the conductive pathways and to the exposed conductive pathways.

[0022] The interfacing elements may be or form part of FLEX PBCs. Thus, a signal may be transmitted to or from an external source / receiver to the system via the interfacing elements, along the conductive pathways and to the exposed portions of the conductive pathways.

[0023] The system comprises a plurality of the plate-shaped elements stacked on top of each other. In this context, to stack may mean to pile or arrange components one on top of each other.

[0024] A first conductive layer is provided between conductive pathways of neighbouring plateshaped elements. In this context a conductive layer is a sheet shaped region of an electrically conductive material. The first conductive layer may be made of copper, gold, or another electrically conductive material. The first conductive layer may be the same material as the conductive pathways.

[0025] The first conductive layer may have the purpose of preventing interference between pathways of adjacent or neighbouring plate-shaped elements. Thus, the first conductive layer may define a plane and have an outer circumference inside which at least a major portion of the pathways of at least one of the plate-shaped element and the neighbouring plate-shaped element, are provided. The first conductive layer may span the whole of the second and / or first surface, or it may cover parts or regions of the first and / or second surface. The first conductive layer may have a thickness of between 0.01 - 2.8 mm.

[0026] The first conductive layer may be parallel to the second and / or first surface of the insulative layer.

[0027] The first conductive layer may also or alternatively facilitate thermal management as will be described below. The first conductive layer may form part of a plate-shaped element, or it may be provided as a separate element provided in the stack of elements.

[0028] The plate-shaped elements are stacked. In this manner, adjacent edges of the edge portions of adjacent plate-shaped element may lie in the same plane, so that the first edges of each of the plate-shaped elements form a predetermined plane. Then, the exposed portions of the pathways will be positioned at or on that plane, so that the exposed portions may all engage conducting elements provided on a plane surface. Additionally, the positions of the exposed portions may be selected or defined for each plate-shaped element so that these have a desired relation to the positions of those of the other plate-shaped elements.

[0029] The exposed portions, such as outer portions, central portions or active portions thereof may all intersect the plan. Often the plane is a smooth or flat plane intercepting, such as within a predetermined uncertainty, all exposed surfaces or all edge portions.

[0030] Overall, the positions of the exposed portions on the plane may be selected to correspond to a number of connecting or conducting portions of one or more chips so that the chips may be connected to the exposed portions to communicate or receive power via the pathways.

[0031] In this context, the predetermined plane may be a flat surface, such as in a plane perpendicular to the first surface of the insulative layer. Alternatively, the predetermined plane may be a flat surface at an angle of between 10 and 90, such as 70-90 degrees to the first surface of the insulative layer. Further, alternatively, the predetermined plane may be curved. Stacking the plate-shaped elements so that the edges form a plane, and thus the exposed conductive pathways may be arranged in a clearly defined pattern. Thus, an external circuit, such as a chip, may be able to accurately interface with each of the individual exposed conductive pathways, even though the surface area of the individual exposed conductive pathways may be rather small. The shape and / or angle of the plane may be determined by the shape of the circuit / chip which the exposed conductive pathways are desired connecting to.

[0032] The connecting element, in this aspect of the invention, further comprises a second electrically conducting layer on the edge portion of the plate-shaped element. Individual plate-shaped elements may have individual second layers, or the second layer may be formed over multiple edge portions. The second conducting layer is electrically connected to one or more conductive pathways and / or the first conductive layer of at least one plateshaped element. The second electrically conducting layer is not electrically connected to at least one exposed conductive pathway. In this context the second conducting layer may be a region where electricity is able to easily pass / be transmitted through. The second conductive layer may be sheet-shaped, parallel to the first edge(s) and span the whole of the first edge of the plate-shaped element(s), allowing space between the second conducting layer and the exposed conductive pathways. Alternatively, the second conducting layer may span only part of the first edge. This second conducting layer may act to shield the pathways in the assembly from signals from the surroundings.

[0033] This second conducting layer may be made of the same material(s) as the conductive pathways if desired.

[0034] The second conducting layer may be operative to block or dampen signals and fields travelling inside the plate-shaped elements, so that no or less effect is seen outside of the plate-shaped elements. The second layer may additionally or alternatively act to prevent signals from the outside from entering into the plate-shaped elements. In addition or alternatively, the second layer may form part of a signal path, such as a return path for a signal carried by a pathway. The second conducting layer may be provided over all edge surfaces at the same time or may be provided to individual edge portions. The second conducting layer may be grounded or connected through a first layer and / or one or more conductive pathways so as to, for example, be connected to an interfacing element for electrical connection to desired electronics or potentials. The second conducting layer is not connected to all exposed conductive pathways, so that non-connected exposed conductive pathways may carry signals independently of and outside of the second conducting layer.

[0035] The second layer may be continuous over an edge surface or all edge surfaces. Alternatively, the second layer may be formed by a plurality of non-overlapping layer portions which may each receive a separate signal, potential or the like.

[0036] In general, the second conducting layer may cover at least 20%, such as at least 305, such as at least 40%, such as at least 50%, such as at least 60%, such as at least 70%, such as at least 75%, such as at least 80%, such as at least 90% of the edge surfaces of one, more or all plate-shaped elements. It may be desired that the second conducting layer covers all of the edge surfaces except the exposed pathways, which are not connected to the second layer, and an area around each such exposed pathway.

[0037] In a preferred embodiment, the edges of the plate-shaped elements all lie in the same straight / plane plane, such as a plane perpendicular to or at a non-zero angle to a general plane of one or all of the plate-shaped elements. Clearly, multiple circuits / chips may be connected to the connecting element, such as at different portions of the edges so that they contact different ones of the exposed portions.

[0038] Naturally, one plate-shaped element may have multiple pathways, such as provided in different planes, depths or layers therein, where a first conductive layer may be provided between such planes / depths / layers with pathways. Thus, the plate-shaped element may be a multi-level or multi-layer PCB.

[0039] In one embodiment, one or each plate-shaped element comprises a first conductive layer. In this embodiment the first conductive layer may be attached to the second surface of the insulative layer of the plate-shaped element. In other words, the second surface may be in contact with the first conductive layer. The first conductive layer may be adhered, such as glued, to the second surface, or it may be attached via additional fastenings such as screws, nails or the like. Alternatively, the first layer may be provided inside the insulative layer.

[0040] As previously discussed, the first conductive layer may span the entirety of the surface area of the second surface, or the first conductive layer may encompass part of the second surface. The first conductive layer may be positioned within the insulative layer, in this instance the first conductive layer may be held in place by the internal structure of the insulative layer.

[0041] An alternative may be for the first conductive layer to be separate from the plate-shaped element and the first layer and the plate-shaped element to come into contact when stacked together.

[0042] Some plate-shaped elements or each plate-shaped element may comprise a non-conducting coating or element on one or both of the first and second surfaces or on the pathways and the first conductive layer. The non-conducting coating or element may act to provide a barrier between the conductive pathways and conducting elements of neighbouring plateshaped elements. The non-conducting coating or element may span / cover the entire area of the first and / or second surface, or it may only cover part of the surface. The non-conducting coating or element may cover only the conductive pathways and / or the first conductive layer. The non-conducting coating or element may be made from any non-conducting material, such as acrylic, silicone, epoxy, urethane, parylene, rubber, plastic, polymer, ceramics or the like. The non-conducting coating or element may be a glue and therefore may have the additional benefit of attaching one plate-shaped element to one another.

[0043] At least one plate-shaped element may further comprise at least one additional pathway provided on the first surface or inside the first insulative layer and being positioned between two neighbouring conductive pathways of the plate-shaped element. In this context, an additional pathway may be embodied as the conductive pathways. The additional pathway may be made from the same material and potentially in the same method step as the conductive pathways. The additional pathway is conductive and may be made of e.g. copper, or another electrically conductive material. The thickness of the additional pathway may be approximately between 0.01- 1 mm. The width of the additional pathway may be approximately between 0.01- 1.5 mm. The additional pathway may be a straight line extending from the first end and extending toward the second end, or the additional pathway may be curved, or contain corners. The additional pathway may be parallel to the neighbouring conductive pathways. The additional pathway may span the whole of the distance between the first and second end, or the additional pathway may span part of the distance between the first and second end. Moreover, the additional pathway may be exposed at the first edge in a similar way to the conductive pathways. The additional pathway may carry a ground signal and may provide shielding to help prevent cross talk between the neighbouring conductive pathways.

[0044] Moreover, the additional pathway may be galvanically attached to the first conductive layer. This galvanic connection may be through one or more vias located in the insulative layer and along the additional pathway. One via may suffice but a number of vias may be desired to provide further signal insulation also through the insulative material.

[0045] At least one interfacing element may comprise a connector being attached to the pertaining plate-shaped element. In this context a connector may be an electromechanical device used to create an electrical link between the conductive pathways and outside of the system. The connector may be a socket-like device configured to have a plug-like device inserted into it to form a galvanic connection or vice versa. Examples of such connectors are USB connectors, USB-C connectors, Micro-USB, SMA, SMP, or the like. Alternative the connectors may be screw connector terminals, Pogo Pins, spring contacts, or the like. Alternatively, the connectors may be FLEX PCBs.

[0046] One embodiment of the invention relates to the connecting element wherein: each plate-shaped element has a length, along a direction from the first toward the second end of the pertaining plate-shaped element, the interfacing elements of the pertaining plate-shaped element have a maximum extent along the direction, a first plate-shaped element has a length no less than that of a neighbouring, second plate-shaped element plus the maximum extent of the interfacing and the interfacing elements of the first plate-shaped element are provided at the second end of the first plate-shaped element.

[0047] In this context, the length may be the distance between the first edge and the edge opposite the first edge of the plate-shaped element. The length may be between 5 mm and 100cm or more, such as between 2cm and 20 cm.

[0048] In this context, maximum extent may be the relevant size of the interfacing element in the direction between the first and second end. If the interfacing element comprises a connector or a conductive pad, the maximum extent of the interfacing element may be the size of the connector or pad. Alternatively, the connector may comprise (for example) a housing or other additional components, in addition to an area for facilitating galvanic connection. Therefore, in this instance, the maximum extent may be only the size of the area for facilitating galvanic connection. The maximum extent may be between 0.5mm and 50mm or more.

[0049] In this context, neighbouring plate-shaped elements may be defined as two plate-shaped elements that are directly adjacent to each other in the stack. Thus, neighbouring plateshaped elements may be the plate-shaped elements above or below a first plate-shaped element.

[0050] It may be the aim of this embodiment to increase the number of interfacing elements and thus conductive pathways of the plate-shaped elements, whilst keeping the length of the edge portions to a minimum. Therefore, in this embodiment the plate-shaped elements may be stacked on top of each other so that the edge portions of each plate-shaped element align, and the interfacing elements of each plate-shaped element may be visible and accessible and not blocked by other plate-shaped elements.

[0051] A similar structure may be achieved by staggering other portions of the plate-shaped elements in relation to each other, so that portions of one plate-shaped element, where the interfacing elements are provided, are not covered the any other plate-shaped element, such as when all plate-shaped elements are projected on to the same plane, so that an operator may engage the interfacing elements of all plate-shaped elements.

[0052] One embodiment of the invention relates to the plate-shaped elements being plane elements provided with a first distance between the first ends of adjacent plate-shaped elements and with a second distance between the plate-shaped elements at a third distance from the first ends along a direction from the first end toward the second end of the pertaining plateshaped element, the second distance exceeding the first distance. Naturally, the first, second and third distances may vary, such as up to 25%, between pairs of plate-shaped elements. Then, from the first edges, the plate-shaped elements flare out and thus provide space for engagement of the interfacing elements at the surface portions away from the edges. In this context, the first distance may be the length between the first edge of a first plate-shaped element and the first edge of a second plate-shaped element. The first distance may be between 0.2mm to 5mm. In this context, the third distance may be the length of the plate shaped element between the first and the second end. The third distance may be between 5mm and 100mm or more. In this context, the second distance may be the length between the first surface of the insulative layer on one plate-shaped element and the first surface of the insulative layer on a second plate-shaped element, measured at the third distance. The second distance may exceed a maximum extent of the interfacing element in a direction perpendicular to the plane of the plate-shaped element. In other words, the second distance may be larger than the relevant part of the interfacing element. The second distance may exceed the first distance so that an angle may be formed between the two plate-shaped elements. The angle may be between 5 and 80 degrees. Thus, the overall effect of this embodiment may be that the stacked plate-shaped elements fan out, which may allow the interfacing elements on each of the plate-shaped elements to be visible and easily accessed. Note that, in this situation, the edges of all plate-shaped elements may not be perpendicular to the first and second surfaces of the insulative layer of the pertaining plate-shaped element.

[0053] In one embodiment, at least one of the plate-shaped elements comprises a flex PCB. A Flex PCB is a non-rigid printed circuit board. Thus, this embodiment may be beneficial as it may allow the individual plate-shaped elements to fan out or even be transported, individually or in concert / bulk out of the vacuum and to the room temperature electronics, whereby the interfacing elements on each plate-shaped element may be easier to access. Additionally flex PCBs may be thinner than traditional rigid PCBs thus reducing the overall size of the connecting element. Then, more exposed portions may be possible for the same overall size of the combined edge portions of the plate-shaped elements.

[0054] One embodiment further comprises a thermally conducting plate, such as a plate coextending with the plate-shaped elements from the first ends thereof to or toward the second ends thereof. In this context, the thermally conductive plate may be a, usually solid, element made from a material that allows the flow / transfer of heat. The thermally conductive plate may be made from a metal, such as copper, gold, silver or other materials with high thermal conductivity. The thermally conducting plate may be the same size and / or shape as the plate-shaped elements, or the thermally conducting plate may extend beyond the plate shaped element(s). The thermally conductive plate may be smaller in some dimensions than the plate-shaped elements. The thermally conducting plate may provide thermal management for the plate-shaped elements. The thermally conducting plate may also provide thermal management for devices external to the connecting element.

[0055] In this embodiment, at least one first conductive layer may be thermally connected to the thermally conducting plate. The first conductive layer may be directly adjacent to the thermally conducting plate and the two may be fixed together by glue, or by screws, nails or other fastening elements. Thermally conducting elements may be provided through the plateshaped elements for thermally connecting the thermally conducting plate to the individual first conductive layers. This may be obtained by providing each plate-shaped element with holes or gaps in the insulative layer and providing a conductive spacer in the hole or gap while ensuring thermal conductivity between the spacer, the first conductive layer and the thermally conducting plate. A conductive spacer may be a solid element made from a material that allows the flow / transfer of heat. The conductive spacer may be made from copper, silver, gold or another material with good thermal conductivity. The conductive spacer may be the same thickness as the insulative layer, or it may be slightly thicker (i.e., between 0.1 and 3mm thicker). The inclusion of the conductive spacer to the system may allow thermal conductivity between the thermally conducting plate and first conductive layers of a plurality of plate-shaped elements that are not in direct contact with thermally conducting plate. The conductive spacer may be a washer and, if the first conductive layer also comprises an appropriate hole, this may allow a screw, bolt or other fastening to pass through the stack of plate-shaped elements fixing the stack together.

[0056] At least one of the plate-shaped elements may have a first width at the first end and a second width at the second end, where the second width exceeds the first width. In this context the width is at an angle to, such as perpendicular to, the direction from the first end toward the second end. This may be achieved by a trapezium shaped plate, or by a T shaped plate. Clearly, other shapes where one end is greater than the other also exist and may be used. This shape of plate-shaped element may have the advantage of reducing the overall surface area of the chip, whilst maintaining enough room for the interfacing elements at one end and maintaining a small area for interfacing with small external circuits / chips at the other.

[0057] Another aspect of the invention relates to an assembly of a processing chip and a connecting element according to the first aspect of the invention, wherein the chip has a surface comprising a plurality of electrically conducting areas, each area being electrically or capacitively / inductively connected to an exposed conductive pathway of the connecting element.

[0058] Clearly, all embodiments, situations, considerations, alternatives and preferences made in relation to the first aspect of the invention are equally relevant for the second aspect of the invention.

[0059] In this context a processing chip may be a logic circuitry that responds to and processes the basic instructions. The processing chip may be a quantum chip, such as a quantum processor with between 1 and 10,000 qubits or more. The processing chip may alternatively be an integrated circuit. The processing chip has a surface comprising a plurality of electrically conducting areas. Naturally, not all areas of the chip need be connected to an exposed portion of a pathway, and not all exposed pathways need be connected to the chip.

[0060] Alternatively, the chip may comprise an intermediate interface to which the chip may be connected, and which has the surface with the electrically conducting areas. In this manner, the intermediate interface may adapt the lay-out of connecting elements of the chip to that of the connecting element. An intermediate interface may interface multiple chips thereto and therefore with the connecting element. An intermediate interface could be or comprise a multilayer PCB, a thick film circuit board, or the like, which has electrically conducting elements on two sides, one for interfacing with the connecting element and one for interfacing with the chip(s), and therein has interconnections with pairs or more of such electrically conducting elements from both surfaces. Clearly, an intermediate interface may also comprise components as described above, if processing is also desired of signals between the connecting element and the chip(s).

[0061] Also, multiple chips may be provided, where each chip is connected to different ones of the exposed portions.

[0062] In this context the surface may be a flat external surface of a processing chip or intermediate interface. In this context the electrically conducting areas may be regions on the surface of the processing chip / interface where electricity may flow and / or microwaves may travel. Each of the electrically conducting areas is electronically connected to an exposed conductive pathway. The electrical connection may allow signals to be passed between the connecting element and the processing chip / interface. The electrical connection may be galvanic, or inductive / capacitive.

[0063] Naturally, the connection between an exposed portion and a conducting area may be provided by soldering these elements to each other. However, it may be desired to instead provide one or more electrically conducting elements, where each conducting element is provided between the electrically / capacitively / inductively conducting area and the pertaining one of the exposed conductive pathways. These electrically conducting elements may be solid objects made of a material which allows electricity to flow therein. Types of electrically conducting elements may be solder balls, springs, or bump bonds. The inclusion of electrically conducting elements to the assembly may increase the accuracy and precision of the interfacing between the electrically / capacitively / inductively conducting area and the exposed conductive pathways. Also, it may more easily be ensured that all pairs of an exposed portion and a conducting area are in fact interconnected as desired. Furthermore, the conducting elements may help to overcome thermal expansion differences of the connected parts.

[0064] A third aspect of the invention relates to an assembly of a processing chip and a connecting element, where: the connecting element comprises a plurality of plate-shaped elements, where each plate-shaped element has a first end, a second end and an edge portion at the first end, each plate-shaped element comprising : a. a first insulative layer having a first surface and a second surface, b. a plurality of conductive pathways provided on the first surface or inside the first insulative layer and being directed from the first end toward the second end, the conductive pathways being exposed at the edge portion, and c. a plurality of interfacing elements, each interfacing element being configured to provide a signal or power to a conductive pathway or derive a signal or power therefrom, wherein:

[0065] • the plurality of plate-shaped elements are stacked on top of each other, a first conductive layer is provided between the conductive pathways of neighbouring plate-shaped elements, and the chip has: o a surface comprising a plurality of electrically conducting areas, each area being electrically or capacitively / inductively connected to an exposed conductive pathway of the connecting element and o a second electrically conducting layer on the surface, the second conducting layer being electrically connected to one or more electrically conductive areas and / or the first conductive layer of at least one plate-shaped element, the second electrically conducting layer not being electrically connected to at least one electrically conductive area.

[0066] Naturally, all embodiments, situations, considerations, preferences and the like described in relation to any of the above aspects of the invention are equally relevant to this aspect of the invention. In this aspect of the invention, the above-mentioned second electrically conducting layer is not required on the edge portion, as a second electrically conducting layer is provided on the surface and thus in a position corresponding to that of the above-described second electrically conducing layer on the edge portions. A function of the second electrically conducting layer, in any of the two situations, is to dampen or prevent signals and fields travelling in the plate-shaped elements from entering into the chip beyond the surface thereof. The corresponding position may be an area defined by the edge surfaces when projected on to the surface.

[0067] Other than the position of the second electrically conducting layer, the function and embodiments and the like of the assembly may be as described above.

[0068] The second electrically conducting layer may be connected to one or more electrically conducting areas and may be connected to an exposed conductive pathway in that manner. Additionally or alternatively, the second electrically conducting layer may be connected to a first electrically conductive layer. Often the second layer is desired on a particular potential provided via an interfacing element, and this potential may be provided via any first layer, conductive pathway, and / or electrically conductive area. Naturally, the connection may be galvanic and directly or indirectly.

[0069] Preferably, the second layer covers an area of the surface corresponding to that of the edge surfaces of the connecting element when connected to the chip, except for the area of the non-connected conductive pathways or conductive areas and an area around each of these. The second layer may cover at least 20%, such as at least 30%, such as at least 40%, such as at least 50%, such as at least 60%, such as at least 70%, such as at least 75%, such as at least 80%, such as at least 90% of an area corresponding to the combined area of all edge surfaces of all plate-shaped elements. As mentioned, it is desired that at least one of the electrically conductive areas is not connected to the second electrically conductive area, as this electrically conductive area may than carry signals independently of the second electrically conductive layer.

[0070] Naturally, a non-conducting layer may be provided on top of the second layer. The nonconducting layer will then not cover the conductive areas so as to allow electrical connection to these.

[0071] A fourth aspect of the invention relates to a method of producing a conducting element according to the first aspect of the invention, the method comprising the steps of: providing the plurality of plate-shaped elements and the first layers, stacking the plate-shaped elements and the first layers and positioning the edge portions so that they define the predetermined plane, providing the edge portions with the second conducting layer, and fixing the plate-shaped elements to each other.

[0072] Naturally, all embodiments, situations, considerations, preferences and the like described in relation to any of the above aspects of the invention are equally relevant to this aspect of the invention.

[0073] A plate-shaped element may be provided simply in the form of a PCB with the pathways on one surface of the insulating layer and the conducting layer on the other surface. One of these surfaces, or each surface, may then be provided with an insulating layer or coating.

[0074] Naturally, more complex systems exist, such as where the plate-shaped elements have pathways at different depths from the first surface, where the conducting layer is provided inside of the plate-shaped element or is provided as a separate element. However, having stacked the elements, the structure should be a number of first conductive layers with pathways there between, where the pathways preferably are not galvanically connected to a first layer, but the first layers may be connected if desired.

[0075] Additional pathways may be provided, such as in the same step as the conductive pathways. The additional pathways may be connected galvanically to the first conductive layer such as by one or more vias in the insulative material of the plate-shaped element. The stacking may comprise positioning the plate-shaped elements in a desired order and / or in a desired position in relation to each other. The stacking may comprise also fixing the plate-shaped elements in relation to each other. This fixing may be by gluing or mechanical fixing, such as using screws. Especially in vacuum applications, glues may not be desired.

[0076] When providing a plate-shaped element, part of the insulating layer may be removed and replaced by a thermally conducting element also in connection with the first conductive layers of the assembly. Then, thermal controlling may take place via such connections and the first conducting layers.

[0077] The above thermally conducting plate may be provided and some or all of the plate-like elements may be attached to the plate.

[0078] The stacking also comprises positioning the edge portions in the desired relation. Alternatively, this may be performed after fixing the plate-shaped element to each other. In this situation, the plate-shaped elements may be machined, such as polished, to provide the desired edge portions, the desired exposed portions and the desired shape of the edge portions and / or relative positions of the exposed portions.

[0079] . The second layer may be provided individually to edge portions before the fixing step or may be provided to all or multiple edge portions after the fixing step and after a potential machining step.

[0080] A final aspect of the invention relates to a method of providing an assembly according to the second or third aspect of the invention, the method comprising : providing the processing chip, providing the connecting element, providing electrical / inducive / capacitive connections between pairs of a conducting area and an exposed conductive pathway.

[0081] Naturally, all embodiments, situations, considerations, preferences and the like described in relation to any of the above aspects of the invention are equally relevant to this aspect of the invention. In this context, the processing chip may be any type of chip, such as a processor. The chip may be a quantum processor chip with any number of qubits and / or other components or circuits or any other conducting element, such as a PCB or thick film chip. The chip may comprise an intermediate interface as described above. In fact, multiple chips may be attached to an intermediate interface.

[0082] The chip or interface preferably comprises a surface with a plurality of electrically conducting surfaces or elements. Each such element may be configured to communicate via a galvanic connection, a capacitive connection and / or an inductive connection.

[0083] The chip has the second conducting layer on its surface. This layer may be connected one or more of the conductive areas and / or a first electrically conducting layer and / or an exposed pathway.

[0084] The electrically conducting surfaces or elements preferably define a predetermined plane, such as a plane or straight plane. This plane may be defined by the outermost portions of these surfaces or elements.

[0085] The connecting element comprises a number of edge portions at which a plurality of pathways have exposed portions. The edge portions or the exposed portions also define a plane, and the plane determined by the edge portions or exposed portions preferably corresponds to the plane defined by the electrically conducting surfaces or elements so that at least substantially all exposed portions touch the electrically conducting surfaces or elements when at least 10% thereof do.

[0086] The step of providing electrical / inducive / capacitive connections between pairs of a conducting area and an exposed conductive pathway may comprise a soldering step but may be performed by a number of other techniques.

[0087] It may not be desired that all exposed portions obtain galvanic connection to the corresponding electrically conducting surfaces or elements. Inductive or capacitive coupling may alternatively be desired. Thus, it may be desired to provide a separate element, such as an electrically conductive element, between a pair of an exposed portion and an electrically conducting surface or element. Such a separate element may be a solder ball, solder bump, spring, resilient, conducting element or the like.

[0088] As explained above, the assembly may comprise a thermally conducting plate which may be used for cooling the assembly. In this aspect of the invention, the chip may further be thermally connected to the thermally conducting plate so that also the chip is cooled. In the following, preferred embodiments of the invention will be described with reference to the drawing, wherein:

[0089] Figure 1 shows a first embodiment of the connecting element assembly. Figure 2 shows a second embodiment of the plate-shaped element.

[0090] Figure 3 shows an embodiment of the two plate-shaped elements stacked on top of each other.

[0091] Figure 4 shows an embodiment of the plate-shaped element including an additional pathway.

[0092] Figure 5 shows an embodiment of the plate-shaped element including a first conductive layer on one of the edges.

[0093] Figure 6 shows two embodiments of the plate-shaped element where the plateshaped element is broader at one end than the other.

[0094] Figure 7 shows an embodiment of the invention where the distance between two neighbouring plate-shaped elements is smaller at one end than the other.

[0095] Figure 8 shows an embodiment of the invention where six plate-shaped elements are stacked together and conductively attached to a thermally insulating plate.

[0096] Figure 9 shows an alternative system where the connectors and attached to a chip directly via a plurality of wires.

[0097] Figure 1 shows a first embodiment of an assembly comprising a connecting element of the invention comprising a plurality of plate-shaped elements 1 stacked to form a unitary structure. In this context a plate shaped element is medium for connecting electrical elements into a circuit; the plate-shaped element may be a PCB. Through the individual plate shaped elements, the structure provides an electrical connection between larger connectors 8 and smaller electrical elements 18, that may be located, for example, on a quantum device chip 19. Therefore, one end of each of the plurality of plate-shaped elements comprise connectors 8, whereby wires 81 can be connected to each connector 8 by a human operator. At the other end of each of the plates are exposed portions 61 of conductive pathways 6 that are positioned in a pattern which is able to interface accurately and efficiently with the smaller electrical elements 18 on the (for example) quantum device chip 19. The exposed portions 61 are linked to the larger connectors 8 by conductive pathways 6. The plurality of plate-shaped elements 1 are stacked in a way to create exposed surfaces, at the upper end of the drawing, whereby the connectors 8 are easily accessible for the human operators.

[0098] Thus, high quality, accurate signals may be sent from and from the quantum device, between large and small connectors (8 and 18 respectively).

[0099] Figure 2 illustrates a second embodiment of one of the plate-shaped elements 1. Note that although the plate-shaped elements in Figure 2 have a different shape from those of Figure 1, the components thereof are the same. The plate shaped element has a first end 2 and a second end 3. Note that in this embodiment, the second end 3 and the first end 2 are parallel to each other, but in other embodiments the two ends may be perpendicular to each other. Note that in this embodiment the plate shaped element 1 is approximately rectangular, however in other embodiments the plate shaped element 1 may be broader / wider at one end than the other, or the plate-shaped element may be arrow shaped, circular, triangular or the like.

[0100] The plate-shaped element 1 comprises a first insulative layer 5, the first insulative layer has a first and second surface (51 and 52 respectively). The insulative layer may be made from any desired material such as rubber, plastics, or a polymer, such as FR4, CEM, PTFE or the like.

[0101] On or within the first insulative layer 5 are the plurality of conductive pathways 6. The conductive pathways 6 are directed between the first and second ends (4 and 3 respectively) of the plate-shaped element 1. The conductive pathways 6 may allow RF signals, or other types of signals to travel along / in it.. Note that the plurality of conductive pathways 6 may also lie on the first surface 51, rather than within it. In the case wherein the conductive pathways 6 are sitting on top of the first surface 51, it may be preferred to have an insulative layer on top of it.

[0102] An edge portion 4 is provided at the first end and the exposed portions 61 of the pathways 6 are seen at this edge 4 Note that the surface area of the exposed conductive pathways 61 may be very small, for example between 0,1 - 1 mm.

[0103] A first conductive layer 7 is provided. This layer may have multiple functions, such as shielding the pathways of one plate-shaped element from those of a neighbouring plateshaped element. Also or alternatively, the layer may be used for thermalizing (cooling) the assembly. The first conductive layer 7 may be made from copper or a similarly electronically conductive material.

[0104] The layer may be provided as part of a plate-shaped element or it may be provided as a separate element provided in the stacking of the plate-shaped element.

[0105] This layer is desired galvanically separate from the pathways 6, so an insulating layer 5 is provided between the pathways and the layer. Naturally, the pathways may simply be provided on one side of a slab of an insulating material where the layer is provided on the other side, as would easily be obtained using a PCB. Clearly, the pathways could alternatively be provided inside the material, where these would also be prevented from short circuiting with the layer. It is desired that the first layer 7 also is not galvanically connected to the pathways 6 of an adjacent or neighbouring plate-shaped element 1, so an insulating layer may be provided on the first layer 7 or on the pathways 6 so that stacking will not result in such galvanic connection.

[0106] In one embodiment the first conductive layer 7 spans the entirety of the first insulative layer 5, although in other embodiments, only part thereof, such as only part of the second surface 52, may be covered by the first conductive layer 7.

[0107] It may be desired, to obtain shielding between pathways of two neighbouring plate-shaped element, that the first layer 7 covers at least substantially all of but preferably all of the pathways of at least one of the plate-shaped elements when these pathways are projected on to a plane of the first layer 7. In this manner, no direct line from a pathway of one plateshaped element can reach a pathway of the other plate-shaped element without intersecting the first layer 7.

[0108] Note that the plate-shaped element 1 may be made from a FLEX PCB whereby the insulative layer 5 is made from a flexible polymer allowing the overall structure of the plate-shaped element 1 to be non-rigid.

[0109] Also shown in Figure 2 is a plurality of connectors 8 which are positioned at, or close to the second end 3. In this embodiment, the connectors are standard SMA connectors although other types of connectors exist and may be used instead. The connectors 8 may allow RF cables to be attached to them, thus allowing RF signals to be transmitted to other parts of the system. The connectors 8 are attached electronically to the conductive pathways 6 and thus this allows RF signals (note, other types of signals exist and may be used instead) to be transmitted from the connectors 8 to the exposed conductive pathways 61 at the edge portion 4. In this embodiment the connectors 8 are much larger than the exposed conductive pathways 61 and therefore are easier for a human operator to interface with. Note that the plate-shaped elements 1 may also comprise other electronic components or processors on or within them to carry out tasks either related, or unrelated to the transfer of the signals. An advantage by the shape of Figure 1 is that many connectors can be positioned in a single line and that the connectors of different plate-shaped elements may be staggered by simply extending one plate-shaped element vis-a-vis the neighbouring one.

[0110] Figure 3 shows the plate-shaped elements 1 stacked on top of each other so that the edge portions 4, and thus the exposed conductive pathways 6 form a plane 10 (in this embodiment the plane is a 2D vertical surface, however other planes also exist and may be formed). In figure 3, a distance is provided between the plate-shaped elements merely to enhance clarity. In the actual assembly, the plate-shaped elements would touch each other (if no element with the first layer 7 was required).

[0111] The manufacturing of the assembly may comprise first stacking the plate-shaped elements and then machining these (such as by polishing), to provide the edges 4 and the exposed portions 61. This machining may adapt the edges to form the desired plane shape and may expose the portions 61. The stacking should provide the portions 61 in the desired positions, but the machining may shape the edges.

[0112] The plane 10 may allow the exposed conductive pathways 61 to sit in a pattern which is adapted to the chip and thus more accurately interface with e.g. a quantum device.

[0113] Also shown in Figure 3 is a non-conductive coating 9, which is positioned on the first surface 51 of each plate-shaped element 1. The non-conductive coating may alternatively be positioned on the second surface 52. The non-conductive coating 9 may have the benefit of preventing electrical contact between neighbouring conductive pathways 6 / first conductive layers 7 so that any signals travelling along the conductive pathway are not interfered with. In some embodiments, the non-conductive coating 9 may be a layer of coating or glue over the conductive pathways. The non-conductive coating 9 may also comprise metal powder mixed within it, for example copper or silver, with the purpose of stabilising / filtering the signals transmitted through the conductive pathways. Such metal powder will also improve thermal management of the assembly.

[0114] In figure 2, the lower plate-shaped element 1 is longer than the upper plate-shaped element 1 so that the connectors 8 are available and thus more easily accessed by a human operator. In other words, the plate-shaped elements 1 have a length, 12, which is the distance between the first and second ends (2 and 3 respectively), and the lower plate-shaped element 1 has a length, 12, that is greater than that of the upper plate-shaped element by at least the size of the connectors 8. In other embodiments, the lower plate-shaped element 1 may be broader / wider than the upper plate shaped element 1 so that the same effect is achieved but now with a space for the connectors not at the top but at the sides. Alternatively, the lower plate shaped element 1 and the upper plate shaped element 1 may be non-parallel (i.e., at an angle between respective planes of the elements) to each other so that the distance between the first ends 2 of the two plate-shaped element 1 is smaller than the distance at the second ends 3 of the plate shaped elements 1, again with the effect of more space and visibility of the connectors 8. Moreover, using layout methods such as those described within this paragraph also allows for scalability. In these Figures only two plateshaped elements 1 are depicted, although an indefinite amount of plate-shaped elements, such as 5, 10, 15, 20, 25, 50, 75, 100, 200, or more may be connected in this manner. Figure 4 shows a plate-shaped element with an additional pathway 11 provided within the insulative layer and positioned in between two conductive pathways 6. There may also be an electrical connection between the additional pathway 11 and the first conductive layer 7. This electrical connection may be a via 112. Multiple vias 112 may be placed along the additional pathway 11. The additional pathway 11 may be used to carry a ground signal. Note that the additional pathways 11 may also be exposed at the edge 4. This additional pathway then acts to further shield the pathways 6 but now also between pathways on the same plate-shaped element. Additional pathways may be provided between all neighbouring pairs of pathways 6 on the plate-shaped element.

[0115] In another embodiment, shown in Figure 5, an electrically conducting layer 41 is included on the edge portion 4. As shown, the electrically conducting layer 41 is connected to the first conducting layer 7 but is not connected to the exposed portions 61 of the conductive pathways 6. A pad or space 62 is provided around the exposed portions 61.

[0116] If additional pathways 11 are provided, these may also or alternatively be connected to the electrically conducting end layer 41, thus enclosing the conductive pathways 6 on all sides to offer additional shielding. Note that, to assemble this embodiment, the plate-shaped elements 1 are preferably first stacked, then machined, if desired, to expose the exposed portions 61 of the conductive pathways 6, whereafter the electrically conducting layer 41 is applied to the combined edges 4 of the plate-shaped elements 1.

[0117] As previously discussed, the plate-shaped element 1 may be of a shape other than a rectangular shape. Figure 6 shows two embodiments where the plate shaped element whereby the width 13 of the first end is smaller than the width 14 of the second end. The exposed conductive pathways 61 may have a much smaller surface area than the connectors 8 and therefore the overall space (or width 13) required at the first end 2 may be much less than the second end 3. Thus, shaping the plate-shaped element 1 in this way has the benefit of reducing the overall size of the shape-plated element and potentially the material cost for the part.

[0118] In the previous embodiments described above, the two neighbouring plate elements 1 are provided parallel to each other. However, as shown in Figure 7, the plate elements 1 may be at an angle to each other, so that the distance 15 between the first end 2 of the plate elements 1 is smaller than the distance 16 between the second end 3 of the plate elements 1. The distance 16 between the second ends 3 of the plate elements 1 should be large enough so that the connectors 8 may be easily accessed between the plate elements. Figure 8 shows an embodiment of the invention where a thermally conducting plate 17 is attached to and in contact with the first conductive layers 7 of or between the plate-shaped elements 1. Note that the plate-shaped elements 1 are preferably attached to each other so that there is no movement / gap between the plates. In Figure 8, six plate-shaped elements 1 are positioned surrounding the thermally conducting plate 17 which extends in the direction between the first end 2 and second end 3. The thermally conductive plate 17 may be made of copper, or a metal with the same conductive properties.

[0119] The conductive plate may be attached, at the right end, to a cooling surface of a diluting fridge and, at the left end, to a quantum device 19, thus cooling not only the plate-shaped elements but also the quantum device.

[0120] In this embodiment, the first conductive layers 7 of each of the plate-shaped elements may be thermally connected by thermally conductive spacers 91. It may be preferable that part of the insulating layer 5 is removed and replaced with a thermally conductive spacer 91 so that conductive contact may be achieved. Note that these thermally conductive spacers 91 may be washers. A screw or similar fixing elements may be passed through the washers to link each plate-shaped element 1 to the thermally conductive plate 17. Then, the cooling of the plate 17 may be transferred via the screw and washers to the first layers 7 and thus into the stacked plate-shaped elements.

[0121] Note that in alternative systems a thermally conducting plate 17 may not be used, if thermal management is not critical to the system application or if it is achieved in other manners.

[0122] Figure 8 also shows how a processing chip 19 may be attached galvanically to the connecting element 20. The connection may alternatively be inductive or capacitive for one, multiple or all exposed portions 61.

[0123] The chip 19 has a plurality of conducting, capacitive or inductive portions 18 provided on a surface thereof, the portions or the surface defining a plane, and in a predetermined pattern. It is desired that the exposed portions 61 define a similar pattern and that the plane thereof corresponds to that of the chip, so that the exposed portions 61 may engage the portions on the chip on a one-to-one basis. Naturally, not all portions on the chip and not all portions on the assembly 20 need be used.

[0124] The connection between a portion 61 and a portion 18 may be galvanic, inductive or capacitive. The connection may be directly between the portions 61 and 18 or an additional element, such as a solder ball, spring, bump bond or the like, that may align with the exposed conductive pathways 61 to form the desired signal transfer from the portion 61to the portion 18.

[0125] In figure 8, two versions of the chip 19 are seen. The bottom illustration, compared to the top illustration, has an electrically conducting layer 41 with a pad or space 62 provided around at least some of the conducting, capacitive or inductive portions 18 so that there is no galvanic contact between the layer 41 and the portions 18. This layer may be provided in addition to or as an alternative to the layer 41 provided on the edge portion 4. Preferably, the layer 41 is connected to a first conductive layer 7 and / or one or more of the portions 18 so as to be connected to an exposed surface 61 so that it may be grounded via a connector 8. The layer(s) 41 has the advantage that it prevents or dampens signals and fields travelling inside the plate shaped elements 1 from reaching the chip 19. Figure 9 shows an alternative system. Individual wires 21 configured to carry an RF (or the like) signal connect each of the connectors 8 with the electronic connections 18 on the processing chip 19.

[0126] In the above examples, connectors 8 are described for interfacing between the pathways 6 and the surroundings, such as further electronics. However, other types of connections or interfacing elements may be used, such as elements configured for other types of attachment, engagement or the like. A simple conducting pad may be used, which may be engaged by a spring-loaded element, such as a crocodile clip or the like, or to which a conductor or cable may be connected by e.g. soldering, biasing or the like.

[0127] As mentioned, the assembly may be particularly suited for use in cryo temperature settings where signal transfer to / from room temperature is always a challenge. Such signals and power may be transmitted via individual cables but may be transferred also in flexprints or multi-conductor cables whereby a much lower number of feedthroughs may be required. Naturally, the plate-shaped elements may themselves be such flexprints, or conductors of a flexprint may be attached to the interfacing elements of a plate-shaped element. Clearly, the interfacing elements of a plate-shaped element may be positioned and made suitable for engagement of a flexprint so that the flexprint may be used for transporting signals between the plate-shaped element and room temperature electronics.

Claims

CLAIMS1. A connecting element comprising a plurality of plate-shaped elements, where each plateshaped element has a first end, a second end and an edge portion at the first end, each plate-shaped element comprising : a. a first insulative layer having a first surface and a second surface, b. a plurality of conductive pathways provided on the first surface or inside the first insulative layer and being directed from the first end toward the second end, the conductive pathways being exposed at the edge portion, c. a plurality of interfacing elements, each interfacing element being configured to provide a signal or power to a conductive pathway or derive a signal or power therefrom, d. a first conductive layer between the conductive pathways of neighbouring plateshaped elements, and e. a second electrically conducting layer on the edge portion of the plate-shaped element, wherein:• the plurality of plate-shaped elements are stacked on top of each other and• the second conducting layers is electrically connected to one or more conductive pathways and / or the first conductive layer of at least one plate-shaped element, the second electrically conducting layers not being electrically connected to at least one exposed conductive pathway,.

2. A connecting element according to claim 1, wherein each plate-shaped element comprises a first conductive layer.

3. A connecting element according to any of claims 1 and 2, wherein each plate-shaped element comprises a non-conducting coating or element on one or both of the first and second surfaces.

4. A connecting element according to any of the preceding claims, wherein at least one plateshaped element comprises at least one additional pathway provided on the first surface or inside the first insulative layer and being positioned between two neighbouring conductive pathways.

5. A connecting element according to any of the preceding claims, wherein at least one interfacing element comprises a connector being attached to the pertaining plate-shaped element.

6. A connecting element according to any of the preceding claims, wherein : each plate-shaped element has a length, along a direction from the first toward the second end of the pertaining plate-shaped element, the interfacing elements of the pertaining plate-shaped element have a maximum extent along the direction, a first plate-shaped element has a length no less than that of a neighbouring, second plate-shaped element plus the maximum extent of the interfacing elements and the interfacing elements of the first plate-shaped element are provided at the second end of the first plate-shaped element.

7. A connecting element according to any of the preceding claims, wherein the plate-shaped elements are plane elements provided with a first distance between the first ends of adjacent plate-shaped elements and with a second distance between the plate-shaped elements at a third distance from the first ends along a direction from the first end toward the second end of the pertaining plate-shaped element, the second distance exceeding the first distance.

8. A connecting element according to any of the preceding claims, wherein at least one of the plate-shaped elements comprises a flex PCB.

9. A connecting element according to any of the preceding claims, further comprising a thermally conducting plate co-extending with the plate-shaped elements from the first ends thereof to the second end thereof.

10. A connecting element according to any of the preceding claims, wherein the conductive pathways are superconducting at a temperature below 4K.

11. An assembly of a processing chip and a connecting element according to any of the preceding claims, wherein the chip has a surface comprising a plurality of electrically conducting areas, each area being electrically or capacitively / inductively connected to an exposed conductive pathway of the connecting element.

12. An assembly according to claim 11, further comprising one or more electrically conducting elements each provided between an electrically / capacitively / inductively conducting area and an exposed conductive pathway.

13. An assembly of a processing chip and a connecting element, where: the connecting element comprises a plurality of plate-shaped elements, where each plate-shaped element has a first end, a second end and an edge portion at the first end, each plate-shaped element comprising : a. a first insulative layer having a first surface and a second surface, b. a plurality of conductive pathways provided on the first surface or inside the first insulative layer and being directed from the first end toward the second end, the conductive pathways being exposed at the edge portion, and c. a plurality of interfacing elements, each interfacing element being configured to provide a signal or power to a conductive pathway or derive a signal or power therefrom, wherein:• the plurality of plate-shaped elements are stacked on top of each other,• a first conductive layer is provided between the conductive pathways of neighbouring plate-shaped elements, and• the chip has: o a surface comprising a plurality of electrically conducting areas, each area being electrically or capacitively / inductively connected to an exposed conductive pathway of the connecting element and o a second electrically conducting layer on the surface, the second conducting layer being electrically connected to one or more electrically conductive areasand / or the first conductive layer of at least one plate-shaped element, the second electrically conducting layer not being electrically connected to at least one electrically conductive area.

14. A method of producing a conducting element according to any of claims 1-10, the method comprising the steps of: providing the plurality of plate-shaped elements and the first layers, stacking the plate-shaped elements and the layers and positioning the edge portions so that they define the predetermined plane, providing the edge portions with the second conducting layer, and - fixing the plate-shaped elements to each other.

15. A method of providing an assembly according to any of claims 11- 13, the method comprising : providing the processing chip, providing the connecting element, - providing electrical / inducive / capacitive connections between pairs of a conducting area and an exposed conductive pathway.

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