Electrical connection device

Abstract

Provided is an electrical connection device comprising: a probe in which a front end part comes into contact with an object to be tested; a wiring board in which surface electrode wiring is arranged on a first surface opposite to a base end part of the probe; and probe pads arranged on the first surface. The probe pads are disposed so as to be separated from the surface electrode wiring inside through holes passing through the surface electrode wiring in the thickness direction. The base end part of the probe is connected to either the surface electrode wiring or the probe pads.

Description

Electrical Connection Device

[0001] The present invention relates to an electrical connecting device used for testing electrical characteristics of an object to be tested.

[0002] In order to measure the electrical characteristics of an object under test, such as an integrated circuit, an electrical connection device is used to electrically connect the object under test to an inspection device. The electrical connection device includes a probe that is brought into contact with the object under test and a wiring board that electrically connects the probe to the inspection device.

[0003] The probe has one end (hereinafter referred to as the "tip end") that contacts the object under test, and the other end (hereinafter referred to as the "base end"). The base end of the probe is electrically connected to the internal wiring of the wiring board. The internal wiring of the wiring board includes signal wiring that transmits electrical signals between the signal terminal of the object under test and the testing device, ground wiring that supplies a ground voltage to the object under test, and power supply wiring that supplies a power supply voltage to the object under test.

[0004] JP 2018-179934 A

[0005] Wiring boards including multiple inner layers are commonly used, with ground wiring and power supply wiring as separate wiring layers. However, it is predicted that it will be difficult to measure the electrical characteristics of an object under test with high accuracy with wiring boards that use only inner layers as wiring layers. The present invention aims to provide an electrical connection device including a wiring board that can accurately measure the electrical characteristics of an object under test.

[0006] An electrical connecting device according to one aspect of the present invention includes a probe whose tip end contacts an object to be tested, a wiring substrate having surface electrode wiring arranged on a first surface facing the base end of the probe, and a probe pad arranged on the first surface. The probe pad is arranged inside a through-hole that penetrates the surface electrode wiring in the thickness direction and is spaced apart from the surface electrode wiring. The base end of the probe is connected to either the surface electrode wiring or the probe pad.

[0007] According to the present invention, it is possible to provide an electrical connecting device including a wiring board that can accurately measure the electrical characteristics of an object to be inspected.

[0008] Fig. 1 is a schematic diagram showing the configuration of an electrical connecting device according to an embodiment. Fig. 2 is a schematic plan view of a wiring substrate of the electrical connecting device according to an embodiment. Fig. 3 is a schematic diagram showing the configuration of an electrical connecting device according to a first modified example of the embodiment. Fig. 4 is a schematic diagram showing the configuration of an electrical connecting device according to a second modified example of the embodiment.

[0009] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, arrangements, etc. of the components of the embodiments of the present invention are not limited to those described below.

[0010] An electrical connection device 1 according to the embodiment shown in Fig. 1 is used to measure electrical characteristics of a test object 2. The electrical connection device 1 includes a probe 10, a probe guide 20 that supports the probe 10, and a wiring board 30 stacked on the probe guide 20. The probe 10 is a non-limiting notation for each of the signal probe 10S, ground probe 10G, and power probe 10V shown in Fig. 1. The probe 10 has a tip end that is one end that contacts a terminal (not shown) of the test object 2, and a base end that is the other end.

[0011] Hereinafter, the direction in which the wiring substrate 30 is located as viewed from the probe guide 20 will be referred to as the upward direction, and the direction in which the probe guide 20 is located as viewed from the wiring substrate 30 will be referred to as the downward direction. The upward surface will be referred to as the upper surface, and the downward surface will be referred to as the lower surface. The first surface 301 of the wiring substrate 30 is the lower surface, and the second surface 302 of the wiring substrate 30 is the upper surface.

[0012] The signal probe 10S is a probe that transmits an electrical signal between the test object 2 and the test device. The ground probe 10G is a probe that supplies a ground voltage to the test object 2. The power supply probe 10V is a probe that supplies a power supply voltage to the test object 2. The material of the probes 10 may be, for example, nickel (Ni) or a nickel alloy.

[0013] The probe guide 20 has a guide hole 200 that penetrates from the lower surface facing the test object 2 to the upper surface facing the wiring board 30. The probe guide 20 supports the probe 10 in a state where it has passed through the guide hole 200. The material of the probe guide 20 is, for example, an insulating material such as ceramic.

[0014] Surface electrode wiring 31B is arranged on a first surface 301 of the wiring substrate 30 facing the base end of the probe 10. The surface electrode wiring 31B is provided with a plurality of through holes 300 that penetrate the surface electrode wiring 31B in the thickness direction. Inside the through holes 300, probe pads 31P are arranged on the first surface 301 at a distance from the surface electrode wiring 31B. The surface electrode wiring 31B and the probe pads 31P of the wiring substrate 30 may abut against the upper surface of the probe guide 20.

[0015] The probe pad 31P and the surface electrode wiring 31B are electrically insulated from each other. In the electrical connecting device 1 shown in Fig. 1, there is a space between the surface electrode wiring 31B and the probe pad 31P. The base end of the probe 10 is connected to either the surface electrode wiring 31B or the probe pad 31P.

[0016] The base ends of the plurality of probes 10, which are set to the same potential during testing of the test object 2, are electrically connected to the same surface electrode wiring 31B. In the electrical connection device 1 shown in Fig. 1, the base ends of the plurality of ground probes 10G, which are set to the ground voltage, are connected to one surface electrode wiring 31B. In other words, the surface electrode wiring 31B of the wiring board 30 is part of the ground wiring that supplies the ground voltage to the test object 2.

[0017] The base ends of the signal probe 10S and the power supply probe 10V are connected to a probe pad 31P. As shown in Fig. 1, only one probe 10 may be connected to one probe pad 31P. Alternatively, the base ends of multiple power supply probes 10V that are set to the same potential when measuring the DUT 2 may be connected to the same probe pad 31P. In order to connect the base ends of multiple probes 10 to one probe pad 31P, the inner diameter of any one of the through holes 300 may be wider than the inner diameters of the other through holes 300.

[0018] As described above, the base ends of the probes 10 that are set to the same potential among the multiple probes 10 supported by the probe guide 20 are connected to the surface electrode wiring 31B. On the other hand, the base ends of the other probes 10, excluding the probe 10 connected to the surface electrode wiring 31B, are connected to the probe pad 31P arranged inside the through hole 300.

[0019] The wiring substrate 30 has a structure in which wiring electrically connected to the surface electrode wiring 31B or the probe pad 31P is disposed inside. For example, the surface electrode wiring 31B is electrically connected to the internal electrode wiring 33B through a contact via 34B disposed inside the wiring substrate 30. The internal electrode wiring 33B is electrically connected to the electrode terminal 32 disposed on the second surface 302 facing in the opposite direction to the first surface 301 of the wiring substrate 30 through internal wiring (not shown). Although not shown, similar to the surface electrode wiring 31B, the probe pad 31P is electrically connected to the electrode terminal 32 disposed on the second surface 302 through a contact via and internal wiring disposed inside the wiring substrate 30.

[0020] The wiring board 30 may have a structure in which multiple internal wiring layers are stacked in the thickness direction of the wiring board 30. For example, the wiring board 30 may have a stacked structure in which the internal wiring electrically connected to the ground probe 10G, the internal wiring electrically connected to the signal probe 10S, and the internal wiring electrically connected to the power supply probe 10V are arranged on different wiring layers. The number of internal wiring layers of the wiring board 30 can be set as desired.

[0021] The wiring substrate 30 may be, for example, a space transformer that widens the spacing between the electrode terminals 32 electrically connected to adjacent probes 10 compared to the spacing between the base ends of the adjacent probes 10. The electrode terminals 32 are electrically connected to an inspection device such as a tester. The wiring substrate 30 may be, for example, a ceramic substrate or an MLO (Multi-Layer Organic) substrate.

[0022] A printed circuit board may be placed on the upper surface of the wiring board 30. For example, the electrode terminals 32 of the wiring board 30 may be connected to the electrode terminals of the printed circuit board via pogo pins or the like. In the electrical connection device 1 in which a printed circuit board is stacked on the wiring board 30, the probes 10 and the inspection device are electrically connected via the wiring of the printed circuit board that is connected to the electrode terminals 32 of the wiring board 30.

[0023] In the electrical connection device 1, a ground voltage is supplied to the ground probe 10G via the electrode terminal 32, the internal electrode wiring 33B, and the surface electrode wiring 31B. In other words, the internal electrode wiring 33B and the surface electrode wiring 31B are part of the ground wiring that supplies the ground voltage to the DUT 2. Also, in the electrical connection device 1, a power supply voltage is supplied to the power supply probe 10V via the electrode terminal 32, the internal wiring, and the probe pad 31P. In other words, the probe pad 31P connected to the power supply probe 10V is part of the power supply wiring that supplies the power supply voltage to the DUT 2.

[0024] 2 shows a plan view of the first surface 301 of the wiring substrate 30. FIG. 1 is a cross-sectional view taken along the II direction in FIG. 2. Surface electrode wiring 31B is arranged over substantially the entire surface of the first surface 301. A through hole 300 is provided at a predetermined position in the surface electrode wiring 31B, and a probe pad 31P is arranged inside the through hole 300. The probe pad 31P is arranged at a distance from the inner wall of the through hole 300, and the surface electrode wiring 31B and the probe pad 31P are electrically insulated from each other.

[0025] The area where the through-holes 300 of the surface electrode wiring 31B are provided can be set arbitrarily. For example, the through-holes 300 are provided to match the positions of the base ends of the power supply probe 10V and the signal probe 10S. The base end of the ground probe 10G is connected to the surface electrode wiring 31B in an arbitrary area where the through-holes 300 are not formed. In FIG. 2 , the position of the surface electrode wiring 31B to which the base end of the ground probe 10G is connected is indicated by a dashed line.

[0026] As described above, in the electrical connection device 1 according to the embodiment, the surface electrode wiring 31B is arranged so as to cover substantially the entire first surface 301 of the wiring board 30. This solves the problem of being unable to perform electrical measurements of the DUT 2 due to an insufficient number of internal wiring layers in the wiring board 30. Furthermore, in the electrical connection device 1, a ground voltage is supplied to the DUT 2 from the surface electrode wiring 31B, which is arranged closer to the probe 10 than the internal wiring of the wiring board 30. This reduces the electrical resistance of the ground wiring of the electrical connection device 1. This allows the electrical characteristics of the DUT 2 to be accurately measured.

[0027] Furthermore, according to the electrical connecting device 1, the flat surface electrode wiring 31B is disposed in the vicinity of the probe 10, thereby making the device 2 more resistant to noise applied from the outside to the test object 2. In other words, according to the electrical connecting device 1, it is possible to obtain an even greater effect in terms of measures against electromagnetic susceptibility (EMS).

[0028] 3 has an insulating material 40 embedded between the surface electrode wiring 31B and the probe pad 31P. That is, in the through-hole 300 of the surface electrode wiring 31B, the surface electrode wiring 31B and the probe pad 31P are electrically insulated by the insulating material 40. According to the electrical connection device 1 shown in FIG. 3, the electrical insulation between the surface electrode wiring 31B and the probe pad 31P can be more reliably achieved. The insulating material 40 may be, for example, a resin.

[0029] <Second Modification> As in the electrical connection device 1 according to the second modification shown in FIG. 4 , a recess may be provided on the first surface 301 of the wiring substrate 30, and the surface electrode wiring 31B and the probe pad 31P may be disposed within the recess. That is, the surface electrode wiring 31B and the probe pad 31P may be embedded with their surfaces exposed on the first surface 301 of the wiring substrate 30. For example, the material for the surface electrode wiring 31B may be poured into the recess provided on the first surface 301 of the wiring substrate 30, and the material may be patterned to form the surface electrode wiring 31B and the probe pad 31P. The electrical connection device 1 shown in FIG. 4 can reduce the thickness of the wiring substrate 30 in the plate thickness direction. In the wiring substrate 30 shown in FIG. 4 , the through-hole 300 may also be filled with the insulating material 40.

[0030] Although the present invention has been described above by way of the embodiments, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.

[0031] For example, the case where the base end of the probe 10 is brought into contact with the surface electrode wiring 31B has been described above as an example. However, a probe pad may be disposed on the surface of the surface electrode wiring 31B, and the base end of the probe 10 may be brought into contact with the probe pad.

[0032] Furthermore, although the above description has been given of the case where the surface electrode wiring 31B is a ground wiring, the surface electrode wiring 31B may be a power supply wiring that supplies a power supply voltage to the test object 2. In this case, the base end of the power supply probe 10V is connected to the surface electrode wiring 31B. Then, the base end of the ground probe 10G is connected to a probe pad 31P arranged inside the through-hole 300 of the surface electrode wiring 31B.

[0033] As such, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters according to the scope of the claims that are appropriate from the above description.

[0034] REFERENCE SIGNS LIST 1 Electrical connection device 2 Test object 10 Probe 10G Ground probe 10S Signal probe 10V Power supply probe 20 Probe guide 30 Wiring board 31B Surface electrode wiring 31P Probe pad 32 Electrode terminal 33B Internal electrode wiring 34B Contact via 40 Insulating material 200 Guide hole 300 Through hole 301 First surface 302 Second surface

Claims

1. An electrical connection device used for testing an object to be tested, comprising: a probe whose tip contacts the object to be tested; a wiring board having surface electrode wiring arranged on a first surface facing the base end of the probe; and a probe pad arranged on the first surface, inside a through-hole that passes through the surface electrode wiring in the thickness direction, and spaced apart from the surface electrode wiring, wherein the base end of the probe is connected to either the surface electrode wiring or the probe pad.

2. The electrical connecting device according to claim 1, wherein there is a space between said surface electrode wiring and said probe pad.

3. The electrical connecting device according to claim 1, wherein an insulating material is embedded between the surface electrode wiring and the probe pad.

4. An electrical connection device according to any one of claims 1 to 3, wherein the base ends of a plurality of the probes set to the same potential during inspection of the object to be inspected are electrically connected to the same surface electrode wiring.

5. The electrical connecting device according to claim 4, wherein the surface electrode wiring is a ground wiring that supplies a ground voltage to the inspection object.

6. The electrical connecting device according to claim 4, wherein the surface electrode wiring is a power supply wiring that supplies a power supply voltage to the inspection object.

7. The electrical connecting device according to any one of claims 1 to 6, wherein an internal electrode wiring electrically connected to the surface electrode wiring is disposed inside the wiring board.

8. The electrical connection device according to claim 7, wherein electrode terminals electrically connected to the internal electrode wiring are arranged on a second surface of the wiring board facing in the opposite direction to the first surface, and the wiring board is a space transformer that widens the spacing between the electrode terminals electrically connected to each of the adjacent probes to be greater than the spacing between the base ends of the adjacent probes.

9. The electrical connecting device according to any one of claims 1 to 8, wherein the surface electrode wiring is embedded in the wiring board with its surface exposed on the first surface.

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