Electronic device comprising heat dissipation member

Abstract

According to one embodiment disclosed herein, an electronic device may be provided. The electronic device may comprise: a circuit board; a shielding member which is disposed on or above a first surface of the circuit board and includes an opening and a first space that is formed, on the inside, between the shielding member and the first surface; a first heat dissipation member which is disposed on the first surface of the circuit board, is positioned in the first space and the opening, includes a second space formed on the inside, and is a solid; a first electronic component and a second electronic component which are disposed spaced apart from each other, inside the second space, on the first surface of the circuit board; and a shielding sheet which faces the shielding member and is disposed outside the shielding member so as to be in contact with a portion of the first heat dissipation member disposed in the opening.

Description

Electronic devices including heat dissipation elements

[0001] Examples of the present disclosure relate to electronic devices including heat dissipation members.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a circuit board, a shielding member disposed on or above a first surface of the circuit board and including an opening and a first space formed between the opening and the first surface on an inner side, a solid first heat dissipation member disposed on the first surface of the circuit board and including the first space and a second space formed on an inner side of the opening, a first electronic component and a second electronic component spaced apart from each other on the first surface of the circuit board within the second space, and a shielding sheet disposed on an outer side of the shielding member so as to face the shielding member and contact a portion of the first heat dissipation member disposed in the opening.

[0005] According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a circuit board, a shielding member disposed on or above a first surface of the circuit board and including an opening and a first space formed between the opening and the first surface on an inner side, a first heat dissipation member disposed on the first surface of the circuit board and positioned in the first space and the opening and including a second space on an inner side, the first heat dissipation member being solid, first electronic components and second electronic components spaced apart from each other on the first surface of the circuit board within the second space, a shielding sheet disposed on an outer side of the shielding member so as to face the shielding member and contact a portion of the first heat dissipation member disposed in the opening, and a second heat dissipation member being solid and disposed on the shielding sheet, the second heat dissipation member being disposed facing the first heat dissipation member with at least a portion of the shielding sheet interposed therebetween. The first heat dissipation member further includes a first surface (a first side) that contacts the shielding sheet and a side surface facing in a direction intersecting the direction in which the first surface faces, wherein the side surface may be disposed between the first electronic component and the shielding member or between the second electronic component and the shielding member.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a plan view of a substrate assembly according to one embodiment of the present disclosure.

[0012] FIG. 6A is a cross-sectional side view taken along line A-A' of FIG. 5 of a substrate assembly according to one embodiment of the present disclosure.

[0013] FIG. 6b is a cross-sectional side view taken along line A-A' of FIG. 5 of a substrate assembly according to one embodiment of the present disclosure.

[0014] FIG. 7 is an exploded perspective view of a substrate assembly according to one embodiment of the present disclosure.

[0015] FIG. 8A is a front exploded perspective view of a portion of a substrate assembly according to one embodiment of the present disclosure.

[0016] FIG. 8b is a rear exploded perspective view of a portion of a substrate assembly according to one embodiment of the present disclosure.

[0017] FIG. 9 is a plan view illustrating a first heat dissipation member of a substrate assembly according to one embodiment of the present disclosure.

[0018] FIG. 10A is a conceptual diagram illustrating a method for manufacturing a first heat dissipation member according to one embodiment of the present disclosure.

[0019] FIG. 10b is a conceptual diagram illustrating a method for manufacturing a first heat dissipation member according to one embodiment of the present disclosure.

[0020] FIG. 10c is a conceptual diagram illustrating a method for manufacturing a first heat dissipation member according to one embodiment of the present disclosure.

[0021] Figure 11a is a conceptual diagram showing a part of the laminated structure of a conventional substrate assembly.

[0022] FIG. 11b is a conceptual diagram illustrating a partial laminated structure of a substrate assembly according to one embodiment of the present disclosure.

[0023] FIG. 11c is a thermal image of an electronic device including the substrate assembly of FIG. 11a.

[0024] FIG. 11d is a thermal image of an electronic device including the substrate assembly of FIG. 11b.

[0025] FIG. 12A is a cross-sectional side view of a substrate assembly according to one embodiment of the present disclosure.

[0026] FIG. 12b is a cross-sectional side view of a substrate assembly according to one embodiment of the present disclosure.

[0027] FIG. 13A is a cross-sectional side view of a substrate assembly according to one embodiment of the present disclosure.

[0028] FIG. 13b is a cross-sectional side view of a substrate assembly according to one embodiment of the present disclosure.

[0029] FIG. 13c is a cross-sectional side view of a substrate assembly according to one embodiment of the present disclosure.

[0030] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0031] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0032] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0033] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0034] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0035] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0058] FIG. 2 is a front perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 3 is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0059] The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0060] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0061] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0062] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0063] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0064] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0065] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0066] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0067] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) may receive at least a portion of light incident on the first side (210A) (or front side) of the electronic device (101) through the display (201) within the electronic device (101). According to one embodiment, the first camera module (205) and / or the sensor module (204) may be arranged so as to be in contact with the external environment through a transparent area from the internal space of the electronic device (101) to the front plate (202) of the display (201). Additionally, some of the sensor modules (204) may be arranged so as to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device.

[0068] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a substrate assembly (e.g., the first substrate assembly (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received by a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or processor (e.g., processor (180) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0069] The camera modules (205, 212, 213) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0070] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras or triple cameras) each having different properties (e.g., angles of view) or functions. For example, the electronic device (101) may include a plurality of camera modules (205, 212) each having a different angle of view, and the electronic device (101) may control the camera modules (205, 212) to change the angle of view of the camera modules (205, 212) operated in the electronic device (101) based on a user's selection. For example, at least one of the plurality of camera modules (205, 212) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (205, 212) may be a front camera, and at least another may be a rear camera. Additionally, the plurality of camera modules (205, 212) may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting a distance to a subject.

[0071] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0072] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0073] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0074] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0075] Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side bezel structure (or side bezel structure) (222), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one substrate assembly (or printed circuit board) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear plate (211) of FIG. 3). may include. According to one embodiment, when including a plurality of substrate assemblies (240a, 240b), the electronic device (101) may include at least one flexible circuit board (240c) to electrically connect different substrate assemblies. For example, the substrate assemblies (240a, 240b) may include a first substrate assembly (240a) positioned above (e.g., in the +Y-axis direction) the battery (245) and a second substrate assembly (240b) positioned below (e.g., in the -Y-axis direction), and the flexible circuit board (240c) may electrically connect the first substrate assembly (240a) and the second substrate assembly (240b).

[0076] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0077] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed within the electronic device (101) and connected to or formed integrally with the side bezel structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side bezel structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the substrate assembly (240a, 240b) may be disposed on the other side.

[0078] In one embodiment, the support structure (221) and the side bezel structure (222) may be combined and referred to as a front case or housing (220). In one embodiment, the housing (220) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as a substrate assembly (240a, 240b) or a battery (245). In one embodiment, the housing (220) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side bezel structure (222), a front plate (202), and / or a back plate (290). In one embodiment, the front or back of the housing (220) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a substrate assembly (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) arranged to be exposed to the outside through at least a portion of the display (201).

[0079] In one embodiment, the camera module (230) can include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIG. 2 or 3 (e.g., camera modules (205, 212, 213)). In one embodiment, the camera module (230) can be disposed on a portion of the support structure (221) adjacent to the substrate assembly (240a, 240b). In one embodiment, the camera module (230) can be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) can receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).

[0080] According to one embodiment, a circuit device implemented in the form of an integrated circuit chip (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electrical / electronic components may be disposed on the substrate assembly (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In some embodiments, the substrate assembly (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).

[0081] In one embodiment, the first substrate assembly (240a) may include a circuit board (241) (e.g., a printed circuit board) and a shielding member (242) disposed on the circuit board (241). For example, the shielding member (242) (e.g., a shield can) may surround at least a portion of various electrical / electronic components disposed on the circuit board (241) and shield them from electromagnetic interference caused by other electrical / electronic components in the vicinity. In one embodiment, the first substrate assembly (240a) may include a heat dissipation member (243) having a portion disposed in an opening (2421) of the shielding member (242). For example, the first substrate assembly (240a) may further include a shielding sheet (e.g., the shielding sheet (360) of FIG. 6a) (or a conductive sheet) and / or an additional heat dissipation member (e.g., the second heat dissipation member (370) of FIG. 6a) (or a heat dissipation sheet) disposed on the upper surface (e.g., the +Z direction surface) of the shielding member (242) and the heat dissipation member (243).

[0082] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the substrate assembly (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0083] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a substrate assembly (240a, 240b) (e.g., a first substrate assembly (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first substrate assembly (240a) interposed therebetween.

[0084] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed. In one embodiment, electrical / electronic components, such as interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional substrate assembly (not shown). In this case, the lower rear case (250b) can be placed to surround the additional substrate assembly (not shown) together with another part of the support structure (221). For example, the interfaces placed on the additional substrate assembly (not shown) or the lower rear case (250b) (not shown) can be placed corresponding to the sound hole (207) or the connector holes (208, 209) of FIG. 2.

[0085] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side bezel structure (222).

[0086] FIG. 5 is a plan view of a substrate assembly according to one embodiment of the present disclosure. FIG. 6a is a side cross-sectional view taken along line A-A' of FIG. 5 of the substrate assembly according to one embodiment of the present disclosure. FIG. 6b is a side cross-sectional view taken along line A-A' of FIG. 5 of the substrate assembly according to one embodiment of the present disclosure. FIG. 7 is an exploded perspective view of a substrate assembly according to one embodiment of the present disclosure.

[0087] The substrate assembly (300) of FIGS. 5, 6a, 6b and 7 may be identical to or similar to all or part of the configuration of the first substrate assembly (240a) of FIG. 4.

[0088] Referring to FIGS. 5, 6A, 6B, and 7, according to one embodiment, the substrate assembly (300) may include a circuit board (310) (e.g., the circuit board (241) of FIG. 4), a first electronic component (320), a second electronic component (330), a shielding member (340) (e.g., the shielding member (242) of FIG. 4), a first heat dissipation member (350) (e.g., the first heat dissipation member (243) of FIG. 4), and a shielding sheet (360). According to one embodiment, the substrate assembly (300) may further include a second heat dissipation member (370) and / or a bonding member (345) disposed between the shielding sheet (360) and the second heat dissipation member (370). In one embodiment, the electronic device (e.g., the electronic device (101) of FIGS. 1 to 4) may further include a support structure (380) (e.g., the support structure (221) of FIG. 4) and / or a vapor chamber (e.g., the vapor chamber (390) of FIGS. 12A, 12B, 13A, 13B, and 13) laminated or disposed on the shielding sheet (360) and / or the second heat dissipation member (370). In one embodiment, some components of the substrate assembly (300) (e.g., the shielding sheet (360), the bonding member (345), and / or the second heat dissipation member (370)) may be omitted.

[0089] According to one embodiment, a circuit board (310) (e.g., a printed circuit board) may include a first surface (310a) and a second surface (310b) opposite the first surface (310a). A board assembly (300) may include a shielding member (340), a first heat dissipation member (350), a first electronic component (320), and a second electronic component (330) disposed on the first surface (310a) of the circuit board (310).

[0090] According to one embodiment, the first electronic component (320) and the second electronic component (330) may be disposed inside the first heat dissipation member (350) (e.g., the second space (S2)). According to one embodiment, the first electronic component (320) and the second electronic component (330) may be disposed spaced apart from each other on the first surface (310a) of the circuit board (310).

[0091] According to one embodiment, the first electronic component (320) may include at least one processing core (321) disposed on a first surface (310a) of the circuit board (310). For example, the processing core (321) may be a processor (e.g., the processor (120)). For example, the processing core (321) may include a central processing unit or an application processor and a main processor (e.g., the main processor (121)). According to one embodiment, the first electronic component (320) may include a first memory (322) (e.g., the memory (130) of FIG. 1) electrically connected to the processing core (321). For example, the first memory (322) may be operatively connected to the processing core (321) and may store instructions to be executed by the processing core (321). According to one embodiment, the first memory (322) may be arranged or stacked on the upper surface (e.g., the +Z direction surface) of the processing core (321), but the arrangement relationship between the first memory (322) and the processing core (321) is not limited and may be changed, and for example, the first memory (322) and the processing core (321) may be arranged adjacent to each other on the first surface (310a) of the circuit board (310).

[0092] According to one embodiment, the second electronic component (330) may include a plurality of electrical / electronic components arranged on the first surface (310a) of the circuit board (310). For example, the electrical / electronic components of the second electronic component (330) may be arranged spaced apart from each other. According to one embodiment, the second electronic component (330) may include a second memory (331) (e.g., the memory (130) of FIG. 1), a charging circuit (332) (direct charger integrated circuit, DCIC) and / or a power management circuit (333) (e.g., the power management module (188) of FIG. 1). For example, the second memory (331) may include a volatile memory (e.g., the volatile memory (132) of FIG. 1). For example, the power management circuit (333) may include a power management integrated circuit (PMIC). However, the electrical / electronic components (e.g., second memory (331), charging circuit (332), and power management circuit (333)) included in the second electronic component (330) are only examples and are not limited and may be changed.

[0093] Referring to FIGS. 6A and 6B , according to one embodiment, heat inside the substrate assembly (300) may be dissipated to the outside of the electronic device (e.g., the electronic device (101) of FIGS. 1 to 4 ) in a flow as indicated by the arrows in FIGS. 6A and 6B . According to one embodiment, the first heat dissipation member (350) and / or the second heat dissipation member (370) may be configured to transmit heat dissipated from the first electronic component (320) and / or the second electronic component (330), which are heat sources, to the outside while diffusing the heat to a low-temperature region of the electronic device (101). In the present disclosure, the heat dissipated from the second electronic component (330) may be understood as, for example, heat generated by the operation of the second electronic component (330) or heat generated in the first electronic component (320) and transferred to the second electronic component (330) through the circuit board (310).

[0094] Referring to FIGS. 6A and 6B , according to one embodiment, heat emitted from the first electronic component (320) and / or the second electronic component (330) and transferred to the first heat dissipation member (350) may be transferred in the direction in which the shielding sheet (360) is positioned (or to the shielding sheet (360)). Referring to FIGS. 6A and 6B , according to one embodiment, a portion of the heat generated from the first electronic component (320) may be transferred to the circuit board (310), and at least a portion of the heat transferred to the circuit board (310) may be transferred through the shielding member (340) in the direction in which the shielding sheet (360) is positioned (or to the shielding sheet (360)). According to one embodiment, the heat transferred to the shielding sheet (360) may be released to the outside of the electronic device (101) through the second heat dissipation member (370) and the support structure (380). According to one embodiment, when the electronic device (101) further includes a vapor chamber (390), the heat transferred to the shielding sheet (360) may be transferred from the support structure (380) to the vapor chamber (390), transferred from the vapor chamber (390) to the support structure (380), or transferred to the support structure (380) and the vapor chamber (390) and then released to the outside of the electronic device (101). For example, the support structure (380) may be formed of a material having high thermal conductivity (e.g., metal) and may have, for example, a plate shape.

[0095] According to one embodiment, the shielding member (340) may be disposed on the first surface (310a) of the circuit board (310). According to one embodiment, the shielding member (340) may include a first space (S1) formed on the inside and a first opening (3401) (e.g., the opening (2421) of FIG. 4) connected to the first space (S1). For example, the first opening (3401) may be formed to penetrate a portion of an upper wall (e.g., a +Z direction wall) of the shielding member (340) that is spaced apart from the first surface (310a) of the circuit board (310) and faces the first surface (310a). For example, the shielding member (340) may include a conductive material such as metal, and may be, for example, a shield can. For example, a part of the first heat dissipation member (350) may be placed in the first opening (3401).

[0096] According to one embodiment, a first heat dissipation member (350) may be disposed on a first side (310a) of a circuit board (310) and positioned in a first space (S1) and a first opening (3401) of a shielding member (340). According to one embodiment, the first heat dissipation member (350) may include a first surface (a first side) (350a), a second surface (a second side) (350b) opposite the first surface (350a), and a third surface (a third side) (350c) connecting the first surface (350a) and the second surface (350b). According to one embodiment, the first surface (350a) of the first heat dissipation member (350) may be in contact with the shielding sheet (360) to transfer heat to the shielding sheet (360). For example, the third surface (350c) may face the shielding member (340) and be spaced apart from the shielding member (340).

[0097] According to one embodiment, the second surface (350b) of the first heat dissipation member (350) may face the first surface (310a) of the circuit board (310) and may be at least partially spaced apart from the first surface (310a) or may at least partially contact the first surface (310a). Referring to FIGS. 6A and 6B, the first heat dissipation member (350) may include a first portion (3501) in which the second surface (350b) is spaced apart from the first surface (310a) of the circuit board (310) by a specified distance (h1). For example, the specified distance (h1) may include two or more numerical values, and may be changed depending on the state of the first heat dissipation member (350) depending on the ambient temperature. Referring to FIG. 6b, the first heat dissipation member (350) may include a second portion (3502) in which a second surface (350b) contacts the first surface (310a) of the circuit board (310). In one embodiment, the first heat dissipation member (350) may not include the first portion (3501) described above, and in which the second surface (350b) contacts the first surface (310a) of the circuit board (310).

[0098] In one embodiment, the first heat dissipation member (350) may include a second space (S2) on the inside. In one embodiment, the first heat dissipation member (350) may be solid below a set temperature.

[0099] According to one embodiment, referring to FIG. 6A, the first heat dissipation member (350) may include at least a portion in contact with the first surface (310a) of the circuit board (310) and at least a portion spaced apart from the first surface (310a) of the circuit board (310). According to one embodiment, referring to FIG. 6A, the first heat dissipation member (350) may be at least partially in contact with or spaced apart from the first electronic component (320) and / or the second electronic component (330). For example, at least a portion of the first heat dissipation member (350) may be disposed between the first electronic component (320) and the second electronic component (330). For example, at least a portion of the first heat dissipation member (350) may also be disposed between adjacent second electronic components (330).

[0100] According to one embodiment, the second space (S2) of the first heat dissipation member (350) may be formed to correspond to the shapes of the first electronic component (320) and the second electronic component (330) disposed inside. As described below with reference to FIG. 9, the thickness (e.g., Z-axis direction thickness) of different regions (e.g., regions (R) of FIG. 9) of the first heat dissipation member (350) may be set differently depending on the height (e.g., Z-axis direction height) of the facing first electronic component (320) or second electronic component (330).

[0101] According to one embodiment, the first heat dissipation member (350) may include heat dissipation particles and a heat-responsive material (or phase change material, temperature-sensitive material). According to one embodiment, the heat dissipation particles may include aluminum oxide (Al2O3) and / or aluminum nitride (AlN). For example, the heat dissipation particles may include carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), and / or manganese oxide (ZnO). According to one embodiment, the heat-responsive material may include a paraffin-based material. For example, the heat-responsive material may further include a thermoplastic elastomer. For example, the thermoplastic elastomer may include a styrene-based elastomer such as SEBS (styrene-ethylene-butadiene-styrene). According to one embodiment, the first heat dissipation member (350) may further include a matrix material. For example, the matrix material may include a rubber-based material.

[0102] In one embodiment, the thermoresponsive material may be solid at a temperature below a threshold temperature (or phase transition temperature), and may be liquid or gel at a temperature above the threshold temperature. For example, the threshold temperature of the thermoresponsive material may be greater than or equal to about 45 degrees Celsius and less than or equal to about 65 degrees Celsius, or greater than or equal to about 50 degrees Celsius and less than or equal to about 60 degrees Celsius. For example, the thermoresponsive material may be solid at room temperature (Tr) (e.g., about 15 degrees Celsius to about 25 degrees Celsius).

[0103] According to one embodiment, the first heat dissipation member (350) can be in a solid state at a temperature lower than the first set temperature. According to one embodiment, the first heat dissipation member (350) can be maintained in a liquid or molten solid state with high viscosity at a temperature higher than the limit temperature of the heat reactive material by including heat dissipation particles in a ratio of about 9 times or more than the heat reactive material. The term "solid state" in the present disclosure can be understood to include a liquid or molten solid state with high viscosity. For example, the first set temperature of the first heat dissipation member (350) can be higher than or equal to the limit temperature of the heat reactive material described above. For example, the first set temperature of the first heat dissipation member (350) can be about 45 degrees or more and about 70 degrees or less, or about 50 degrees or more and about 60 degrees or less, and as an example, can be about 50 degrees.

[0104] According to one embodiment, the first heat dissipation member (350) may include about 90% or more or about 95% or more of heat dissipation particles (e.g., aluminum oxide (Al2O3) and / or aluminum nitride (AlN)), and the remainder may include about 10% or less or about 5% or less of a heat-responsive material, wherein the heat-responsive material may further include a thermoplastic elastomer (e.g., SEBS) and paraffin. However, the components and composition ratio constituting the heat-responsive material are not limited, and some components may be replaced, omitted, or added, and the composition ratio may be changed, depending on factors such as the first set temperature.

[0105] According to one embodiment, the first heat dissipation member (350) is provided in a solid state, and thus, compared to a liquid or gel state, the effective area may be larger and the heat conduction performance may be improved. In the present disclosure, “heat conduction performance” may refer to vertical heat conduction performance. For example, “heat conduction performance” may refer to heat transfer efficiency along a heat transfer path in a vertical direction (e.g., Z direction), for example, referring to FIG. 6A, the performance in which heat generated from the first electronic component (320) is transferred in the order of the first heat dissipation member (350), the shielding sheet (360), the second heat dissipation member (370), and the support structure (380). In the present disclosure, the “effective area” may be an indicator of the heat conduction performance when the first heat dissipation member (350) is assembled into the substrate assembly (300). For example, the “effective area” may represent a ratio of the height at which the first heat dissipation member (350) is compressed in the height direction (e.g., in the Z direction) by the shielding sheet (360) and then restored to the height before being compressed when the substrate assembly (300) is disassembled after being assembled to the substrate assembly (300). For example, as the effective area increases, the heat conduction performance when assembled to the substrate assembly (300) may also be improved. For example, when the first heat dissipation member (350) is in a solid state, the ratio (or effective area) at which the first heat dissipation member (350) is compressed in the height direction (e.g., in the Z direction) by the shielding sheet (360) and then restored to the height before being compressed when the substrate assembly (300) is disassembled may be greater than when the first heat dissipation member (350) is in a liquid or gel state, and the heat conduction performance when assembled to the substrate assembly (300) may also be greater.

[0106] According to one embodiment, the compressive force of the first heat dissipation member (350) may be about 20% or more. In the present disclosure, the “compressive force” may represent a repulsive force against a pressing force, and for example, the material may be harder the greater the compressive force. For example, the first heat dissipation member (350) may be provided with a compressive force value (e.g., about 20%) or more, thereby ensuring the effective area and heat conduction performance of the design value. For example, when the compressive force of the first heat dissipation member (350) is less than about 20%, it may be difficult to secure the heat conduction performance of the design value and the effective area representing the design value.

[0107] In one embodiment, the compressibility of the first heat dissipation member (350) may be greater than about 20% and less than about 30%. As an example, the compressibility of the first heat dissipation member (350) may be about 25%. In the present disclosure, the “compressibility” may indicate the degree of compression when pressurized with 1 kgf, and for example, the larger the compressibility, the softer or softer the material may be. In one embodiment, the compressibility of the first heat dissipation member (350) may be greater than the compressibility of the second heat dissipation member (370). For example, the first heat dissipation member (350) may be provided in a compressibility within a specified range (e.g., greater than about 20% and less than about 30%), thereby being provided in a thin film form (e.g., less than about 2 mm) and having a compressive force greater than or equal to a specified value (e.g., about 20%), while being provided in a solid state that is soft enough not to cause deformation of other members when assembled to the substrate assembly (300). For example, when the compression ratio of the first heat dissipation member (350) is less than about 20%, the first heat dissipation member (350) may be too hard and cause damage or deformation of other members when assembled to the substrate assembly (300). For example, when the compression ratio of the first heat dissipation member (350) is greater than about 30%, the first heat dissipation member (350) may be too soft and thus the manufacturability may be reduced, and for example, defects such as peeling or detachment may occur during the process of forming the first heat dissipation member (350) through mold processing and then separating it.

[0108] According to one embodiment, the second heat dissipation member (370) may include heat dissipation particles and a heat-responsive material (or phase change material, temperature-sensitive material). According to one embodiment, the heat dissipation particles may include aluminum oxide (Al2O3) and / or aluminum nitride (AlN). For example, the heat dissipation particles may include carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), and / or manganese oxide (ZnO). For example, the heat-responsive material may further include a thermoplastic elastomer. For example, the thermoplastic elastomer may include a styrene-based elastomer such as SEBS (styrene-ethylene-butadiene-styrene). According to one embodiment, the second heat dissipation member (370) may further include a matrix material. For example, the matrix material may include a rubber-based material. According to one embodiment, the thermally reactive material of the second heat dissipation member (370) may include a paraffin-based material, and according to one embodiment, may not include a paraffin-based material.

[0109] In one embodiment, the thermoresponsive material may be solid at a temperature below a threshold temperature (or phase transition temperature), and may be liquid or gel at a temperature above the threshold temperature. For example, the threshold temperature of the thermoresponsive material may be greater than or equal to about 45 degrees Celsius and less than or equal to about 65 degrees Celsius, or greater than or equal to about 50 degrees Celsius and less than or equal to about 60 degrees Celsius. For example, the thermoresponsive material may be solid at room temperature (Tr) (e.g., about 15 degrees Celsius to about 25 degrees Celsius).

[0110] According to one embodiment, the second heat dissipation member (370) can be in a solid state at a temperature lower than the second set temperature. According to one embodiment, the second heat dissipation member (370) can be maintained in a liquid or molten solid state with a high viscosity at a temperature higher than the limit temperature of the heat reactive material by including heat dissipation particles in a ratio of about 9 times or more than the heat reactive material. The term "solid" in the present disclosure can be understood to include a liquid or molten solid state with a high viscosity. For example, the second set temperature of the second heat dissipation member (370) can be higher than or equal to the limit temperature of the heat reactive material described above. For example, the second set temperature of the second heat dissipation member (370) can be about 45 degrees Celsius or higher and about 70 degrees Celsius or lower, or about 50 degrees Celsius or higher and about 60 degrees Celsius or lower. According to one embodiment, the second set temperature of the second heat dissipation member (370) can be lower than the first set temperature of the first heat dissipation member (350) described above.

[0111] According to one embodiment, the second heat dissipation member (370) may include about 90% or more or about 95% or more of heat dissipation particles (e.g., aluminum oxide (Al2O3) and / or aluminum nitride (AlN)), and the remainder may include about 10% or less or about 5% or less of a heat-responsive material, wherein the heat-responsive material may further include a thermoplastic elastomer (e.g., SEBS). However, the components and composition ratio constituting the heat-responsive material are not limited, and some components may be replaced, omitted, or added, and the composition ratio may be changed, depending on factors such as a set temperature.

[0112] According to one embodiment, the second heat dissipation member (370) may be implemented in the form of a thin film having a thickness of about 0.08 mm to about 1.2 mm, for example, about 0.1 mm. According to one embodiment, the second heat dissipation member (370) may be formed in a solid state having a compressibility of about 20% or more, whereby the thermal resistance at the interface with the shielding sheet (360) and the support structure (380) may be reduced and the vertical heat conduction performance may be improved.

[0113] In one embodiment, the shielding sheet (360) (or conductive sheet, conductive layer) can be laminated on the shielding member (340) and the first heat dissipation member (350). In one embodiment, the shielding sheet (360) can be disposed outside the first space (S1) of the shielding member (340). In one embodiment, the shielding sheet (360) can at least partially face the shielding member (340) and can be disposed to be in contact with at least a portion of the first heat dissipation member (350).

[0114] In one embodiment, the substrate assembly (300) may further include a bonding member (345) disposed between the shielding member (340) and the shielding sheet (360). For example, the bonding member (345) may include a conductive material and may be bonded to the shielding member (340) and the shielding sheet (360). Referring to FIG. 7, in one embodiment, the bonding member (345) may include a second opening (3411) having a shape corresponding to the first opening (3401) of the shielding member (340). For example, the size of the second opening (3451) may be substantially the same as or larger than the first opening (3401). Referring to FIGS. 6A and 7, according to one embodiment, the first heat dissipation member (350) can be arranged from the first space (S1) to the first opening (3401) and the second opening (3411).

[0115] FIG. 8A is a front exploded perspective view of a portion of a substrate assembly according to one embodiment of the present disclosure. FIG. 8B is a rear exploded perspective view of a portion of a substrate assembly according to one embodiment of the present disclosure. FIG. 9 is a plan view illustrating a first heat dissipation member of a substrate assembly according to one embodiment of the present disclosure.

[0116] The substrate assembly (300) of FIG. 9 may be referred to as the substrate assembly (300) of FIGS. 6A and 7. The circuit board (310) and the first heat dissipation member (350) of FIGS. 8A and 8B may be referred to as the circuit board (310) and the first heat dissipation member (350) of FIGS. 6A and 7.

[0117] According to one embodiment, the second space (S2) of the first heat dissipation member (350) may be formed to correspond to the shapes of the first electronic component (320) and the second electronic component (330) disposed inside. As described below with reference to FIG. 9, the thickness (e.g., Z-axis direction thickness) of different regions (e.g., regions (R) of FIG. 9) of the first heat dissipation member (350) may be set differently depending on the height (e.g., Z-axis direction height) of the facing first electronic component (320) or second electronic component (330).

[0118] Referring to FIGS. 8b and 9 , according to one embodiment, the regions (R) of the second surface (350b) (or inner surface) of the first heat dissipation member (350) may include a plurality of regions divided according to the shape, height, and / or type of the facing first electronic component (320) or second electronic component (330). For example, the regions (R) may include a first region (R1), a second region (R2), a third region (R3), a fourth region (R4), a fifth region (R5), a sixth region (R6), a seventh region (R7), and / or an eighth region (R8).

[0119] According to one embodiment, the third region (R3) may face the first electronic component (320). For example, at least some of the other regions (R1, R2, R4, R5, R6, R7) excluding the third region (R3) may face the second electronic component (330). For example, the first region (R1) may face the second memory (331). For example, the sixth region (R3) may face the power management circuit (333). For example, the eighth region (R8) may face the charging circuit (332). According to one embodiment, the height of the third region (R3) facing the first electronic component (320) may be greater than the other regions (R1, R2, R4, R5, R6, R7). For example, the thickness (e.g., Z-axis direction thickness) of the third region (R3) facing the first electronic component (320) may be smaller than the thicknesses (e.g., Z-axis direction thickness) of the other regions (R1, R2, R4, R5, R6, R7). In the present disclosure, the height of a specific region (R1, R2, R3, R4, R5, R6, or R7) among the regions (R) may mean a vertical distance or a shortest distance (e.g., Z-axis direction distance) from the specific region to a first surface (e.g., the first surface (310a) of FIG. 6A) of a circuit board (e.g., the circuit board (310) of FIG. 6A).

[0120] However, the arrangement, size, and number of sub-areas of the areas (R) of the present disclosure are not limited and may vary depending on the shape, height, and / or type of electrical / electronic components placed face to face. Furthermore, the shape of the sub-areas of the areas (R) is not limited and may be formed in a grid or rectangular shape as illustrated in FIG. 9, or may be formed in other polygonal, circular, and / or irregular shapes.

[0121] FIG. 10A is a conceptual diagram illustrating a method for manufacturing a first heat dissipation member according to an embodiment of the present disclosure. FIG. 10B is a conceptual diagram illustrating a method for manufacturing a first heat dissipation member according to an embodiment of the present disclosure. FIG. 10C is a conceptual diagram illustrating a method for manufacturing a first heat dissipation member according to an embodiment of the present disclosure.

[0122] FIGS. 10A to 10C are conceptual diagrams for explaining a process for manufacturing a first heat dissipation member (350) according to the above-described embodiment(s) with reference to FIGS. 5, 6A, 7, 8A, 8B, 9, 10A, and 10B. The description of the first heat dissipation member (350) according to the above-described embodiment(s) with reference to FIGS. 5, 6A, 7, 8A, 8B, 9, 10A, and 10B may not be repeated hereinbelow.

[0123] Referring to Fig. 10a, a fabric (11) for forming a first heat dissipation member (350) (or a heat dissipation member (20) of Fig. 10c) may be provided. According to one embodiment, when a single fabric (11) is used to manufacture the first heat dissipation member (350), the manufacturing process may be simplified and the bonding strength of each part of the manufactured first heat dissipation member (350) may be improved, compared to a method of laminating and punching multiple pieces of fabric. Referring to Fig. 10b, a thermocompression molding process may be used to form a shape by applying heat and pressure to the fabric (11) using a mold (P) to manufacture the first heat dissipation member (350). For example, by using the thermocompression molding process, a soft fabric (11) having a compression ratio of about 20% or more can be processed into various shapes, compared to a method of laminating and punching multiple pieces of fabric. Referring to Fig. 10b, a single fabric (11) before processing can be provided as a processed fabric (12) after thermocompression molding. A concave portion (121) corresponding to the surface shape of the mold (P) can be formed on the processed fabric (12). Referring to Figs. 10b and 10c, for example, the outer portion of the processed fabric (12) can be punched or removed along the dotted line portion of Fig. 10b, thereby providing a heat dissipation member (20) (or first heat dissipation member (350)) of Fig. 10c.

[0124] Figure 11a is a conceptual diagram showing a part of the laminated structure of a conventional substrate assembly.

[0125] FIG. 11b is a conceptual diagram illustrating a partial laminated structure of a substrate assembly according to one embodiment of the present disclosure.

[0126] FIG. 11c is a thermal image of an electronic device including the substrate assembly of FIG. 11a.

[0127] FIG. 11d is a thermal image of an electronic device including the substrate assembly of FIG. 11b.

[0128] The second laminated structure (M2) of FIG. 11b may represent a structure in which a bonding member (345), a shielding sheet (360), and a second heat dissipation member (370) are laminated as a part of the substrate assembly (300) according to the above-described embodiment(s) with reference to FIGS. 5, 6a, 7, 8a, 8b, 9, 10a, and 10b, as shown in FIGS. 10a to 10c. The first laminated structure (M1) of FIG. 11a may represent a structure in which a bonding member (M), a shielding sheet (C), and a heat dissipation coating (T) for bonding to a shielding member (e.g., a shield can) in an existing substrate assembly are laminated as a comparison group for comparing thermal conductivity performance with the second laminated structure (M2) of FIG. 11b.

[0129] For example, the compression ratio of the heat dissipation coating (T) of the first laminated structure (M1) may be about 5%, and the compression ratio of the second heat dissipation member (370) of the second laminated structure (M2) may be about 20%. For example, the thickness (e.g., thickness in the Z-axis direction) of the heat dissipation coating (T) may be about 28 μm, and the thickness (e.g., thickness in the Z-axis direction) of the second heat dissipation member (370) may be about 120 μm. According to an experimental example according to the above conditions, the vertical thermal conductivity (e.g., thermal conductivity in the Z-axis direction) of the first laminated structure (M1) may be about 1.22 W / mK, and the vertical thermal conductivity of the second laminated structure (M2) may be about 2.0 W / Mk. For example, the temperature (T) above the heat dissipation coating (T) max ) and the temperature (T) under the shielding sheet (C) junction ) is the temperature above the second heat-dissipating member (T max ) and the temperature (T) under the shielding sheet (360) junction) may be greater than the second temperature difference (e.g., about 13 degrees Celsius) between the first and second stacked structures. That is, the second stacked structure (M2) corresponding to the substrate assembly (300) according to the above-described embodiment(s) with reference to FIGS. 5, 6a, 7, 8a, 8b, 9, 10a, and 10b may provide vertical heat transfer performance compared to the first stacked structure (M1), which is a conventional structure. FIG. 11c is a thermal image of an electronic device including the first stacked structure (M1), and FIG. 11d is a thermal image of an electronic device including the second stacked structure (M2). Referring to FIGS. 11c and 11d, it can be confirmed that the temperature of the portion indicated by box H1 in FIG. 11d corresponding thereto is lower than the temperature of the portion indicated by box H1 in FIG. 11c.

[0130] FIG. 12A is a side cross-sectional view of a substrate assembly according to one embodiment of the present disclosure. FIG. 12B is a side cross-sectional view of a substrate assembly according to one embodiment of the present disclosure. FIG. 13A is a side cross-sectional view of a substrate assembly according to one embodiment of the present disclosure. FIG. 13B is a side cross-sectional view of a substrate assembly according to one embodiment of the present disclosure. FIG. 13C is a side cross-sectional view of a substrate assembly according to one embodiment of the present disclosure.

[0131] Referring to FIGS. 12A, 12B, and 13A to 13C, according to one embodiment, the electronic device (101) may further include a vapor chamber (390). According to one embodiment, the support structure (380) may include a mounting portion (3801) for positioning the vapor chamber (390). For example, the mounting portion (3801) may be a recess (e.g., FIGS. 12A, 12B, 13A, and 13B) or a hole (e.g., FIG. 13C) having a shape corresponding to the shape of the vapor chamber (390). According to one embodiment, the vapor chamber (390) may be configured to receive heat generated from the first electronic component (320) and / or the second electronic component (330) and release it to the outside of the electronic device (e.g., the electronic device (101) of FIGS. 1 to 4).

[0132] Referring to FIGS. 12A, 13A, and 13B, according to one embodiment, at least a portion of the support structure (380) may be disposed between the second heat dissipation member (370) and the vapor chamber (390). Referring to FIGS. 12B and 13C, according to one embodiment, the support structure (380) may be disposed in a first region of the second heat dissipation member (370) and the vapor chamber (390) may be disposed to contact a second region around the first region. Referring to FIG. 12B, according to one embodiment, the vapor chamber (390) may be disposed between the second heat dissipation member (370) and the support structure (380). Referring to FIG. 13C, according to one embodiment, the vapor chamber (390) may be disposed in a mounting portion (3801) formed through the support structure (380). Referring to FIG. 13A, according to one embodiment, the first electronic component (320) may include a processing core (321), and the first memory (e.g., the first memory (322) of FIGS. 12A, 12B, 13B, and 13C) may be omitted from the first electronic component (320), or may be included in the configuration indicated by 321 in FIG. 13A (e.g., the processing core (321)). Referring to FIG. 13B, according to one embodiment, the bonding member (345) may be omitted from the substrate assembly (300).

[0133] In general, electronic components such as a processor and a memory disposed on a main circuit board may be one of the main heat sources of an electronic device. For example, a heat dissipation structure in which a heat dissipation member (hereinafter referred to as a first heat-responsive heat dissipation member) including a heat-responsive material is disposed on the upper surface of the processor and memory (or the first electronic component) has been used in the past. However, such a first heat-responsive heat dissipation member may have a limitation in that it cannot provide a heat dissipation effect for heat generated from other electrical / electronic components (or second electronic components) around the processor and memory or heat generated from the processor and memory and transferred to other electronic components through the circuit board.

[0134] In addition, conventionally, a shielding sheet (e.g., a metal sheet or a nano film) may be further disposed on the upper surface of a shielding member (e.g., a shield can) in which a first thermally reactive heat dissipating member is accommodated, and a thin film heat dissipating coating may be formed on the shielding sheet. The heat dissipating coating is intended to transfer heat transferred to the shielding sheet through a portion in contact with a support structure or vapor chamber of the electronic device, but there may be a problem in that the heat conduction efficiency is deteriorated due to high interfacial thermal resistance between the shielding sheet and the shielding member.

[0135] These first thermally responsive heat-dissipating members and thermally responsive coatings can be provided in a liquid or gel form in the past. In this case, compared to the thermally responsive heat-dissipating members in a solid state, the repulsive force against the shielding sheet after assembly in the electronic device may be reduced, resulting in a large interfacial thermal resistance through the shielding sheet and a deterioration in vertical heat conduction performance. In this case, when the first thermally responsive heat-dissipating member and thermally responsive coating in a solid state, as in the conventional method, is manufactured from a silicon-based material, it is difficult to implement the first thermally responsive heat-dissipating member and thermally responsive coating in a thin film form while having a compressive force exceeding a set value to secure a repulsive force against the shielding sheet.

[0136] Various embodiments of the present disclosure are intended to solve at least the problems and / or disadvantages described above, and to provide at least the advantages described below. A substrate assembly of an electronic device according to one embodiment of the present disclosure includes a first heat dissipation member that surrounds not only a processor and a memory (or a first electronic component), which are main heat sources disposed on a circuit board, but also other electrical / electronic components (or second electronic components) disposed around the processor and the memory, thereby providing expanded and improved heat dissipation performance compared to existing heat dissipation members that are thermally connected only to the processor and the memory.

[0137] A substrate assembly of an electronic device according to one embodiment of the present disclosure can provide improved vertical heat conduction performance by forming the first heat dissipation member and the second heat dissipation member with a solid heat-responsive material, thereby lowering the interfacial thermal resistance in the heat transfer path compared to when the first heat dissipation member and the second heat dissipation member are formed with a liquid or gel heat-responsive material.

[0138] However, the problems to be solved in this disclosure are not limited to the problems mentioned above, and may be determined in various ways without departing from the overall perspective of this disclosure.

[0139] The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document may be provided.

[0140] According to an embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a circuit board (241; 310), a shielding member (242; 340) disposed on a first surface (310a) of the circuit board and including an opening (3401) and a first space (S1) formed between the opening and the first surface on the inside, a solid first heat dissipation member (243; 350) disposed on or above the first surface of the circuit board and including a second space (S2) formed on the inside and positioned in the first space and the opening, a first electronic component (320) and a second electronic component (330) spaced apart from each other on the first surface of the circuit board within the second space, and a shielding sheet (360) disposed on the outside of the shielding member so as to face the shielding member and contact a part of the first heat dissipation member disposed in the opening.

[0141] According to one embodiment, the shielding sheet further includes a solid second heat dissipation member (370), wherein at least a portion of the shielding sheet can be disposed between the first heat dissipation member and the second heat dissipation member.

[0142] According to one embodiment, the compressibility of the first heat dissipating member may be greater than the compressibility of the second heat dissipating member.

[0143] According to one embodiment, the first heat dissipation member may include a first surface (a first side) (350a) in contact with the shielding sheet, a second surface (a second side) (350b) facing in an opposite direction to the first surface, and a third surface (a third side) (350c) connecting the first surface and the second surface.

[0144] According to one embodiment, the third surface of the first heat dissipation member may be spaced apart from the shielding member, and the second surface of the first heat dissipation member may be disposed to face the first electronic component, the second electronic component, and the first surface of the circuit board.

[0145] According to one embodiment, the compression ratio of the first heat dissipation member may be greater than 20% and less than 30%.

[0146] According to one embodiment, the compressive force of the first heat dissipating member may be 20% or greater.

[0147] According to one embodiment, the first heat dissipating member may be composed of a material including paraffin.

[0148] According to one embodiment, the shielding member may further include a conductive adhesive member (345) disposed between the shielding member and the shielding sheet.

[0149] According to one embodiment, the first electronic component may include at least one processing core (321) disposed on the first surface of the circuit board and a first memory (322) operatively connected to the at least one processing core.

[0150] According to one embodiment, the first heat dissipation member is configured to transfer heat received from at least one of the first electronic component or the second electronic component to the shielding sheet, and the shielding member may be configured to transfer heat received from the circuit board to the shielding sheet.

[0151] According to one embodiment, the electronic device may further include a vapor chamber (390) disposed facing the shielding sheet and configured to receive heat from the shielding sheet and radiate it to the outside.

[0152] According to one embodiment, the device further comprises a support structure (380) arranged to contact a first region of the second heat dissipation member, wherein the vapor chamber is arranged to contact a second region around the first region of the second heat dissipation member, or at least a portion of the support structure may be arranged between the second heat dissipation member and the vapor chamber.

[0153] In one embodiment, the vapor chamber may be positioned so as to contact a portion of the second heat dissipation member. The electronic device may further include a support structure (380) positioned facing the second heat dissipation member through the vapor chamber.

[0154] According to one embodiment, the first heat dissipation member may include at least a portion in contact with the first surface of the circuit board and at least a portion spaced apart from the first surface of the circuit board.

[0155] According to one embodiment, the first heat dissipation member includes a plurality of regions (R) facing the first electronic component or the second electronic component, and at least some of the plurality of regions may have different heights from the first surface measured in a direction perpendicular to the first surface.

[0156] According to one embodiment, the first heat dissipation member includes a plurality of regions (R) facing the first electronic component or the second electronic component, and at least some of the plurality of regions can be formed to have different thicknesses.

[0157] In one embodiment, the shielding member and the shielding sheet may include a conductive material.

[0158] According to an embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device comprises a circuit board (241; 310), a shielding member (242; 340) disposed on or above a first surface (310a) of the circuit board and having an opening (3401) and a first space (S1) formed between the first surface and the first surface on the inside, a solid first heat dissipation member (243; 350) disposed on the first surface of the circuit board and having a second space (S2) formed on the inside and positioned in the first space and the opening, a first electronic component (320) and a second electronic component (330) spaced apart from each other on the first surface of the circuit board within the second space, a shielding sheet (360) disposed on the outside of the shielding member so as to face the shielding member and come into contact with a part of the first heat dissipation member disposed in the opening, and disposed on the shielding sheet. A solid second heat dissipation member (370) may include the second heat dissipation member, which is disposed facing the first heat dissipation member with at least a portion of the shielding sheet interposed therebetween. The first heat dissipation member further includes a first surface (a first side) (350a) that contacts the shielding sheet and a side surface (350c) that faces a direction intersecting the direction in which the first surface faces, and the side surface may be disposed between the first electronic component and the shielding member or between the second electronic component and the shielding member.

[0159] According to one embodiment, the first heat dissipation member is composed of a material including paraffin, and the compressibility of the first heat dissipation member is greater than 20% and less than 30% and may be greater than the compressibility of the second heat dissipation member.

[0160] It will be apparent to those skilled in the art that the present invention is not limited to the above-described embodiments and drawings, and that various substitutions, modifications, and changes are possible within the technical scope of the present invention.

[0161] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0162] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0163] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0164] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0165] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0166] According to one embodiment, the method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0167] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Circuit board (241; 310); A shielding member (242; 340) disposed on the first surface (310a) of the circuit board and including an opening (3401) and a first space (S1) formed between the first surface and the inner surface; A solid first heat dissipation member (243; 350) disposed on or above the first surface of the circuit board, positioned in the first space and the opening, and including a second space (S2) formed inside; A first electronic component (320) and a second electronic component (330) spaced apart from each other on the first surface of the circuit board within the second space; and An electronic device comprising a shielding sheet (360) disposed on the outside of the shielding member so as to face the shielding member and come into contact with a portion of the first heat dissipation member disposed in the opening.

2. In paragraph 1, An electronic device further comprising a second solid heat dissipation member (370) disposed on the shielding sheet, wherein at least a portion of the shielding sheet is disposed between the first heat dissipation member and the second heat dissipation member.

3. In paragraph 2, An electronic device wherein the compressibility of the first heat dissipation member is greater than the compressibility of the second heat dissipation member.

4. In any one of paragraphs 1 to 3, An electronic device, wherein the first heat dissipation member comprises a first surface (a first side) (350a) in contact with the shielding sheet, a second surface (a second side) (350b) facing in an opposite direction to the first surface, and a third surface (a third side) (350c) connecting the first surface and the second surface.

5. In paragraph 4, An electronic device wherein the third surface of the first heat dissipation member is spaced apart from the shielding member, and the second surface of the first heat dissipation member is disposed facing the first electronic component, the second electronic component, and the first surface of the circuit board.

6. In any one of paragraphs 1 to 5, An electronic device wherein the compression ratio of the first heat dissipation member is greater than 20% and less than 30%.

7. In any one of paragraphs 1 to 6, An electronic device wherein the compressive force of the first heat dissipation member is 20% or more.

8. In any one of paragraphs 1 to 7, An electronic device wherein the first heat dissipation member is made of a material containing paraffin.

9. In any one of paragraphs 1 to 8, An electronic device further comprising a conductive adhesive member (345) disposed between the shielding member and the shielding sheet.

10. In any one of paragraphs 1 to 9, An electronic device, wherein the first electronic component comprises at least one processing core (321) disposed on the first surface of the circuit board and a first memory (322) operatively connected to the at least one processing core.

11. In any one of paragraphs 2 to 10, An electronic device wherein the first heat dissipation member is configured to transfer heat received from at least one of the first electronic component or the second electronic component to the shielding sheet, and the shielding member is configured to transfer heat received from the circuit board to the shielding sheet.

12. In paragraph 11, An electronic device further comprising a vapor chamber (390) disposed facing the shielding sheet and configured to receive heat from the shielding sheet and release it to the outside of the electronic device.

13. In paragraph 12, An electronic device further comprising a support structure (380) arranged to contact a first region of the second heat dissipation member, wherein the vapor chamber is arranged to contact a second region around the first region of the second heat dissipation member, or at least a portion of the support structure is arranged between the second heat dissipation member and the vapor chamber.

14. In paragraph 12, The vapor chamber is arranged to contact a portion of the second heat dissipation member, An electronic device, wherein the electronic device further includes a support structure (380) disposed facing the second heat dissipation member through the vapor chamber.

15. In any one of paragraphs 1 to 14, An electronic device, wherein the first heat dissipation member includes at least one portion in contact with the first surface of the circuit board and at least one portion spaced apart from the first surface of the circuit board.

Images