Vapor chamber, battery and battery module

Abstract

Provided in the present application are a vapor chamber, a battery and a battery module. The vapor chamber comprises a plate body and a reinforcing structure, wherein an inner cavity is formed in the plate body; the plate body comprises a first plate and a second plate arranged opposite each other, the first plate and the second plate enclosing at least a part of the inner cavity; the reinforcing structure is arranged on the first plate and is located in the inner cavity; and the compressive strength of each vapor chamber (100) is greater than or equal to 2.5 MPa.

Description

A heat plate, a battery and a battery module

[0001] The present application claims priority to the Chinese patent application No. 202421845706.3, 202421845752.3, filed on July 31, 2024, to the Chinese patent application No. 202422989763.5, filed on December 4, 2024, the contents of all of the above applications are hereby incorporated by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of batteries, in particular to a heat plate, a battery and a battery module. BACKGROUND

[0003] The heat plate is a phase change heat transfer element, which uses the latent heat of phase change of working fluid to take away heat, and is the most potential heat management method to solve the heat dissipation problem of products and equipment. At present, the heat plate is mainly applied to the heat dissipation of electronic equipment, and has excellent heat conduction performance, large heat transfer area and good uniform temperature performance; especially the thickness is ultra-thin, and the size can be adjusted according to the actual heat dissipation requirement. SUMMARY

[0004] In the related art, the heat plate is applied to the battery, and the battery will expand due to the rise of temperature during work. The thickness of the heat plate is relatively thin, and the external pressure bearing capacity and the internal anti-expansion capacity are relatively weak, which is easy to bend and deform or even break. Although the reinforcing structure arranged on the outside of the heat plate can enhance the strength of the heat plate, it will cause the overall size of the battery to increase.

[0005] In a first aspect, the present application provides a heat plate. The heat plate comprises:

[0006] a plate body, which is formed with an inner cavity, the plate body comprising a first plate body and a second plate body arranged oppositely, the first plate body and the second plate body surrounding at least part of the inner cavity; and

[0007] a reinforcing structure, which is arranged on the first plate body and located in the inner cavity.

[0008] The compressive strength of the heat plate is greater than or equal to 2.5 MPa.

[0009] In a second aspect, the present application further provides a battery. The battery comprises the heat plate.

[0010] In a third aspect, the present application further provides a battery module. The battery module comprises the heat plate or the battery. ADVANTAGEOUS EFFECTS

[0011] The heat plate comprises a plate body, the plate body is formed with an inner cavity, a reinforcing structure is arranged in the inner cavity, the reinforcing structure can support the plate body and strengthen the structural strength of the plate body, thereby improving the pressure bearing capacity and anti-expansion capacity of the heat plate, improving the structural strength of the heat plate, avoiding the bending deformation or fracture of the heat plate, and improving the service life of the heat plate. At the same time, the reinforcing structure is arranged in the inner cavity, does not occupy additional space, and does not affect the overall size of the battery. In addition, the compressive strength of the heat plate is greater than or equal to 2.5 MPa, which can avoid the extrusion deformation of the heat plate caused by the expansion of the battery, and improve the service life of the heat plate. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 is a structural schematic diagram of some implementations of the heat plate provided by the present application;

[0013] Fig. 2 is a full-section schematic diagram of the heat plate in Fig. 1;

[0014] Fig. 3 is an enlarged schematic diagram of A in Fig. 2;

[0015] Fig. 4 is a structural schematic diagram of some implementations of the first plate body in Fig. 1;

[0016] Fig. 5 is a structural schematic diagram of another view of the first plate body in Fig. 4;

[0017] Fig. 6 is a structural schematic diagram of some other implementations of the first plate body in Fig. 1;

[0018] Fig. 7 is a structural schematic diagram of some other implementations of the first plate body in Fig. 1;

[0019] Fig. 8 is a full-section schematic diagram of the plate body in Fig. 1;

[0020] Fig. 9 is a full-section schematic diagram of another view of the heat plate in Fig. 1;

[0021] Fig. 10 is an enlarged schematic diagram of A0 in Fig. 9;

[0022] Fig. 11 is a structural schematic diagram of some implementations of the plate body in Fig. 1;

[0023] Fig. 12 is an enlarged schematic diagram of B0 in Fig. 11;

[0024] Fig. 13 is a structural schematic diagram of some implementations of the heat plate provided by the present application;

[0025] Fig. 14 is a structural schematic diagram of some other implementations of the heat plate provided by the present application;

[0026] Fig. 15 is a structural schematic diagram of some other implementations of the heat plate provided by the present application.

[0027] Fig. 16 is a structural schematic diagram of some other implementations of the first plate body in Fig. 1;

[0028] Fig. 17 is an enlarged schematic view of CO in Fig. 16;

[0029] Fig. 18 is a structural schematic view of some implementations of the second plate body in Fig. 1;

[0030] Fig. 19 is an enlarged schematic view of D0 in Fig. 18;

[0031] Fig. 20 is a sectional view of some other implementations of the heat plate in Fig. 1;

[0032] Fig. 21 is an enlarged schematic view of E0 in Fig. 20;

[0033] Fig. 22 is an enlarged schematic view of F0 in Fig. 21.

[0034] Legend of reference signs:

[0035] 100, heat plate; 101, plate body; 102, inner cavity; 103, first plate body; 104, second plate body; 105, reinforcing structure; 106, reinforcing rib assembly; 107, reinforcing rib row; 108, first reinforcing rib; 109, second reinforcing rib; 110, first part; 111, second part; 112, third part; 113, third reinforcing rib; 114, wick; 115, wick mounting passage; 116, wire mesh; 117, first support row; 118, first support column; 119, support mounting passage; 120, second support row; 121, support column; 122, liquid inlet; 123, second support column; 124, support structure; 106a, core material layer; 107a, protective layer; 108a, bottom plate; 109a, side plate; 110a, mounting plate; 111b, first containing groove; 112b, first connecting wall; 121b, second containing groove; 122b, second connecting wall; 21, first groove; 211, first side edge; 212, second side edge; 22, convex part; 23, containing cavity. Embodiment of the present application

[0036] In the related art, the heat plate 100 is applied in a battery. The battery expands due to temperature rise during operation. The thickness of the heat plate 100 is relatively thin. The external pressure bearing capacity and the internal anti-expansion capacity are relatively weak. The heat plate 100 is easily bent and deformed or even broken. Although the reinforcing structure 105 provided on the outside of the heat plate 100 can enhance the strength of the heat plate 100, it will cause the overall size of the battery to increase.

[0037] In view of this, the present application provides a heat plate 100. Figs. 1 to 22 are structural schematic views of an embodiment of the heat plate 100 provided by the present application. The heat plate 100 provided by the present application has strong pressure bearing capacity and strong anti-expansion capacity, and does not affect the overall size of the battery. The heat plate 100 will be described in detail below in combination with the main drawings.

[0038] Referring to FIG. 1, FIG. 2 and FIG. 3, the vapor chamber 100 includes a plate body 101 and a reinforcing structure 105, the plate body 101 is formed with an inner cavity 102, a working fluid is arranged in the inner cavity 102 and configured to perform heat transfer. The plate body 101 includes a first plate body 103 and a second plate body 104 arranged oppositely, the first plate body 103 and the second plate body 104 enclose at least part of the inner cavity 102; the reinforcing structure 105 is arranged on the first plate body 103 and located in the inner cavity 102; wherein the compressive strength of the vapor chamber 100 is greater than or equal to 2.5 MPa.

[0039] The vapor chamber 100 provided by the present application is applied to a battery shell, has a simple structure and low manufacturing cost, and has high heat diffusion capacity. The vapor chamber 100 includes a plate body 101, the plate body 101 is formed with an inner cavity 102, and a plurality of reinforcing structures 105 are arranged in the inner cavity 102. The reinforcing structures 105 can support the plate body and strengthen the structural strength of the plate body 101, thereby improving the pressure bearing capacity and anti-expansion capacity of the vapor chamber 100, improving the structural strength of the vapor chamber 100, avoiding the bending deformation or fracture of the vapor chamber 100, and improving the service life of the vapor chamber 100. At the same time, the reinforcing structures 105 are arranged in the inner cavity 102, do not occupy additional space, and do not affect the overall size of the battery. In addition, the compressive strength of the vapor chamber 100 is greater than or equal to 2.5 MPa, which can solve the extrusion deformation of the vapor chamber 100 caused by the expansion of the battery in the related art, and improve the service life of the vapor chamber 100.

[0040] In some embodiments, the first plate body 103 is a lower shell plate, and the second plate body 104 is an upper shell plate. The upper shell plate and the lower shell plate are respectively formed with a first accommodating groove 111b and a second accommodating groove 121b, and are welded and connected to communicate the first accommodating groove 111b and the second accommodating groove 121b to form the inner cavity 102. It should be noted that the specific position of the reinforcing structure 105 is not limited, as long as it is located in the inner cavity 102. In some embodiments, the reinforcing structure 105 is arranged on the first plate body 103, and of course the reinforcing structure 105 can also be arranged on the second plate body 104, which can be selected according to the actual situation. Since the first plate body 103 is a lower shell plate, arranging the reinforcing structure 105 on the first plate body 103 is more convenient for the welding connection of the first plate body 103 and the second plate body 104.

[0041] The welding manner of the first plate body 103 and the second plate body 104 is not limited, and can be brazing, laser penetration welding, resistance welding, etc., which is selected according to the specific material of the first plate body 103 and the second plate body 104. For example, in some embodiments, when the material of the first plate body 103 and the second plate body 104 is stainless steel, the first plate body 103 and the second plate body 104 are welded by laser penetration welding. In some other embodiments, when the material of the first plate body 103 and the second plate body 104 is aluminum alloy or copper alloy, the first plate body 103 and the second plate body 104 are welded by brazing, and the solder is solder paste or magnesium alloy welding wire. In some other embodiments, when the material of the first plate body 103 and the second plate body 104 is aluminum alloy, the first plate body 103 and the second plate body 104 are welded by resistance welding, and the solder is aluminum alloy welding wire.

[0042] Please refer to FIG. 4 and FIG. 5, the specific type of the reinforcing structure 105 is not limited, as long as it can meet the compression strength of the vapor chamber 100, in the embodiment, the reinforcing structure 105 includes a plurality of reinforcing rib assemblies 106, the plurality of reinforcing rib assemblies 106 are arranged at intervals along the width direction of the plate body, each reinforcing rib assembly 106 includes a plurality of reinforcing rib rows 107, the plurality of reinforcing rib rows 107 are arranged at intervals along the width direction of the plate body. In some embodiments, each reinforcing rib row 107 includes a plurality of first reinforcing ribs 108, the plurality of first reinforcing ribs 108 are arranged at intervals along the length direction of the plate body 101, and the plurality of reinforcing rib rows 107 are arranged at intervals along the length direction of the plate body 101. In the width direction of the plate body 101, the ends of the two adjacent first reinforcing ribs 108 correspond, so that the plurality of first reinforcing ribs 108 are arranged in an array. It should be noted that the plurality of first reinforcing ribs 108 are arranged in an array and uniformly arranged on the first plate body 103, which can improve the uniformity of the stress of the plate body 101, so that the structural strength of each part of the plate body 101 is basically the same, thereby improving the overall structural strength of the plate body 101, avoiding the situation that the local strength is insufficient, leading to the local deformation of the vapor chamber 100, and improving the service life of the vapor chamber 100.

[0043] In some embodiments, each reinforcing rib row 107 includes a plurality of first reinforcing ribs 108, and the plurality of first reinforcing ribs 108 are uniformly arranged. In some embodiments, in the length direction of the plate body 101, the distance between the two adjacent first reinforcing ribs 108 is the same. In some other embodiments, in the length direction of the plate body 101, the distance between the two adjacent first reinforcing ribs 108 is arranged in an increasing or decreasing manner. The specific arrangement manner can be selected according to the actual situation, which is not limited here.

[0044] As the application environment of the vapor chamber 100 is different, the force or expansion force applied to each part of the vapor chamber 100 is also different. Referring to FIG. 4 and FIG. 5, in the embodiment, each reinforcing rib row 107 further comprises a second reinforcing rib 109, and a plurality of second reinforcing ribs 109 are arranged in an array; wherein the length of at least one second reinforcing rib 109 is less than the length of at least one first reinforcing rib 108. The length of the second reinforcing rib 109 is less than the length of the first reinforcing rib 108, the first reinforcing rib 108 can be applied to the area with larger force, and the second reinforcing rib 109 can be applied to the area with smaller force, and the first reinforcing rib 108 and the second reinforcing rib 109 are reasonably distributed to provide space utilization.

[0045] Generally, the battery shell has six shell surfaces, and the vapor chamber 100 can be applied to any one of the shell surfaces of the battery shell, or can be applied to multiple shell surfaces at the same time, for example, the vapor chamber 100 is applied to two adjacent shell surfaces of the battery shell. When the vapor chamber 100 is applied to two adjacent shell surfaces of the battery shell, two independent vapor chambers 100 can be placed on the two shell surfaces of the battery shell, and then the two vapor chambers 100 are welded or connected in other ways. In another embodiment, referring to FIG. 6, the vapor chamber 100 is bent so that it can serve as two shell surfaces of the battery shell. The size of the battery can be selected according to the size of the battery.

[0046] In other embodiments, the vapor chamber 100 can also be used as a cooling plate. The battery comprises a battery shell and a core package group, the core package group is installed in the battery shell, and the vapor chamber 100 is installed between the core package group and the battery shell to cool the core package; the core package group further comprises a plurality of core package rows, and the plurality of core package rows are arranged at intervals. In order to improve the cooling efficiency, the vapor chamber 100 can also be arranged between two adjacent core package rows, so as to realize cooling on multiple sides, improve the cooling efficiency, and avoid thermal runaway.

[0047] In some embodiments, in order to enable the vapor chamber 100 to meet different application scenarios, in the present embodiment, the first plate body 103 further comprises a first portion 110, a second portion 111 and a third portion 112, the second portion 111 is connected between the first portion 110 and the third portion 112, and the first portion 110, the second portion 111 and the third portion 112 are integrally formed. A plurality of first reinforcing ribs 108 are arranged on the first portion 110, and a plurality of second reinforcing ribs 109 are arranged on the third portion 112; the second portion 111 can be bent. For example, referring to FIG. 4, in an embodiment, when the vapor chamber 100 is applied to a certain shell surface of a battery shell, the second portion 111 is a flat plate, and the first portion 110, the second portion 111 and the third portion 112 are located on the same plane. In another embodiment, referring to FIG. 6, when the vapor chamber 100 is applied to adjacent two shell surfaces of a battery shell, the second portion 111 is bent at this time, the second portion 111 is a bent plate, and the first portion 110 and the third portion 112 are located on different planes.

[0048] In some embodiments, when the first portion 110 and the third portion 112 are located on the same plane, the vapor chamber 100 is a "1" type structure. When the first portion 110 and the third portion 112 are located on different planes, the vapor chamber 100 is an "L" type structure. Two "L" type vapor chambers 100 can be combined to form a "T" type vapor chamber 100. The selection can be made according to actual conditions.

[0049] In some embodiments, when the second portion 111 is a bent plate, the angle of the second portion 111 is α, and α is 90-95°. In an embodiment, α is 90°.

[0050] In some embodiments, the reinforcing structure 105 further comprises a third reinforcing rib 113, the third reinforcing rib 113 extends along the width direction of the plate body 101 and is arranged on the second portion 111. The third reinforcing rib 113 serves to improve the structural strength of the second portion 111. When the second portion 111 is a bent plate, the vapor chamber 100 needs to be bent, and the third reinforcing rib 113 can improve the structural strength of the vapor chamber 100 to avoid breakage of the vapor chamber 100 during bending.

[0051] In some embodiments, referring to FIG. 1, the vapor chamber 100 further comprises a plurality of wick 114s, the plurality of wick 114s extend along the length direction of the plate body 101 and are arranged in the inner cavity 102 in the width direction of the plate body 101. A wick mounting channel 115 is formed between two adjacent reinforcing rib assemblies 106, the wick mounting channel 115 extends along the length direction of the plate body 101, and the wick mounting channel 115 is configured to mount the wick 114. The wick 114 can absorb working fluid and diffuse the working fluid into the inner cavity 102, so that the working fluid can fill the inner cavity 102 and improve the heat dissipation capacity.

[0052] In some embodiments, the width of the wick mounting channel 115 is 14-20 mm. The width of the wick mounting channel 115 can be 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, or 20 mm.

[0053] In some embodiments, referring to FIG. 1, the wick mounting channel 115 is disposed in the inner cavity 102 and above the plurality of wicks 114.

[0054] In some embodiments, the reinforcing structure 105 further comprises a support structure 124, the support structure 124 comprises a plurality of first support rows 117, each first support row 117 comprises a plurality of first support columns 118, the plurality of first support columns 118 are disposed in the inner cavity 102, one end of the plurality of support columns is connected to the first plate body 103, the other end of the plurality of support columns is connected to the second plate body 104, and the plurality of support columns are used to support the first plate body 103 and the second plate body 104. In some embodiments, in the same reinforcing rib assembly 106, a support mounting channel 119 is disposed between two adjacent reinforcing rib rows 107, and the support mounting channel 119 is configured to mount the plurality of first support rows 117. In this way, the first support row 117 and the first reinforcing rib 108 do not affect each other, and the space utilization is high.

[0055] It should be noted that, in order to avoid interference with the installation of the wick 114, the plurality of first support columns 118 are not disposed in the wick mounting channel 115.

[0056] In some embodiments, in the same support mounting channel 119, two adjacent first support rows 117 are staggered with each other. The two adjacent first support rows 117 are a first support row a and a first support row b, the first support row a comprises a plurality of first support columns a, the first support row b comprises a plurality of first support columns b, and the middle of two adjacent first support columns a corresponds to a first support column b. In this way, the compressive strength of the wick 114 can be improved.

[0057] In some embodiments, since the first reinforcing rib 108 and the second reinforcing rib 109 are generally disposed at the middle position of the first plate body 103, the strength of the edge position of the first plate body 103 is weak. In order to increase the structural strength of the edge position of the first plate body 103, the reinforcing structure 105 further comprises a plurality of second support rows 120 and a plurality of support columns 121, and the plurality of second support rows 120 and the plurality of support columns 121 surround the plurality of reinforcing rib assemblies 106. In this embodiment, two second support rows 120 and two support columns 121 are provided, the two second support rows 120 are disposed on both sides of the reinforcing structure 105 along the width direction of the plate body 101, and the two support columns 121 are disposed on both sides of the reinforcing structure 105 along the length direction of the plate body 101.

[0058] In the embodiment, each second support row 120 includes a plurality of second support columns 123. It should be noted that, due to the small space of the edge of the first plate body 103, in order to place more second support columns 123, the density of the plurality of second support columns 123 in the second support row 120 is relatively high. The distribution density of the plurality of first support columns 118 is less than that of the plurality of second support columns 123.

[0059] In some embodiments, the plurality of first support columns 118 are regularly arranged. In other embodiments, the plurality of first support columns 118 are irregularly arranged. It should be noted that, although the plurality of first support columns 118 are irregularly arranged, considering that the liquid absorption core installation channel 115 needs to install the liquid absorption core 114, in order to avoid interference with the installation of the liquid absorption core 114, the plurality of first support columns 118 are not arranged in the liquid absorption core installation channel 115.

[0060] In some embodiments, a plurality of vias corresponding to the first support columns 118 are formed on the wire mesh 116. The first support columns 118 pass through the vias and are connected to the second plate body 104. In this way, the first support columns 118 can also fix the wire mesh 116, thereby improving the stability of the structure of the vapor chamber 100. The diameter of the via is 10-15 mm. The diameter of the via can be 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, or other data not listed.

[0061] In some embodiments, the diameter of the first support column 118 is 1-3 mm. The diameter of the first support column 118 can be 1 mm, 1.2 mm, 1.5 mm, 1.6 mm, 1.8 mm, 2 mm, 2.1 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.7 mm, 2.9 mm, 3 mm, or other data not listed. When the plurality of first support columns 118 are regularly arranged, the distance between the axes of two adjacent first support columns 118 is 4-8 mm. The distance between the axes of two adjacent first support columns 118 can be 4 mm, 4.2 mm, 4.5 mm, 4.7 mm, 4.8 mm, 5 mm, 5.1 mm, 5.4 mm, 5.5 mm, 5.9 mm, 6 mm, 6.6 mm, 6.9 mm, 7 mm, 7.1 mm, 7.2 mm, 7.3 mm, 7.8, 8 mm, or other data not listed.

[0062] In some embodiments, the sum of the areas of the orthographic projections of the reinforcing structures 105 on the first plate body 103 is S1, and the area of the cross section of the inner cavity 102 is S2, wherein (1:124)≤(S1 / S2)≤(0.5:1). It should be noted that when S1 / S2 is less than 1 / 124, the number of reinforcing structures 105 is small, resulting in low structural strength of the vapor chamber 100, which is prone to deformation or even breakage during use. When S1 / S2 is greater than 0.5, the reinforcing structures 105 occupy a large volume of the inner cavity 102, resulting in a small amount of working fluid in the inner cavity 102 and low cooling efficiency of the vapor chamber 100.

[0063] In some embodiments, referring to FIG. 5, the length of the vapor chamber 100 is L1, and the length of each first reinforcing rib 108 is L2, wherein L2 / L1=(0.1~0.7):1. It should be noted that the length of the first reinforcing rib 108 should not be too long or too short. When L2 / L1 is less than 0.1, the length of the first reinforcing rib 108 is too short, and in order to meet the structural strength of the vapor chamber 100, the number of first reinforcing ribs 108 will increase, resulting in increased manufacturing difficulty and manufacturing cost. When L2 / L1 is greater than 0.7, the length of the first reinforcing rib 108 increases, which also results in increased manufacturing difficulty and manufacturing cost.

[0064] In some embodiments, referring to FIG. 5, the width of the plate body 101 is H1, and the width of each first reinforcing rib 108 is H2, wherein H2 / H1=(0.01~0.5):1. It should be noted that the width of the first reinforcing rib 108 should not be too long or too short. When H2 / H1 is less than 0.01, the width of the first reinforcing rib 108 is too short, and in order to meet the structural strength of the vapor chamber 100, the number of first reinforcing ribs 108 will increase, resulting in increased manufacturing difficulty and manufacturing cost. When H2 / H1 is greater than 0.1, the width of the first reinforcing rib 108 increases, which also results in increased manufacturing difficulty and manufacturing cost.

[0065] In some embodiments, referring to FIG. 5, the length of each second reinforcing rib 109 is L3, wherein L3 / L1=(0.1~0.2):1. It should be noted that the width of the second reinforcing rib 109 should not be too long or too short. When L3 / L1 is less than 0.1, the width of the second reinforcing rib 109 is too short, and in order to meet the structural strength of the vapor chamber 100, the number of second reinforcing ribs 109 will increase, resulting in increased manufacturing difficulty and manufacturing cost. When L2 / L1 is greater than 0.2, the width of the second reinforcing rib 109 increases, which also results in increased manufacturing difficulty and manufacturing cost.

[0066] In some embodiments, referring to FIG. 5, the width of the plate body 101 is H1, and the width of each second reinforcing rib 109 is H3, where H3 / H1=(0.01~0.5):1. It should be noted that the width of the second reinforcing rib 109 should not be too long or too short. When H3 / H1 is less than 0.01, the width of the second reinforcing rib 109 is too short, and in order to meet the structural strength of the vapor chamber 100, the number of second reinforcing ribs 109 will increase, resulting in increased manufacturing difficulty and increased manufacturing cost. When H3 / H1 is greater than 0.1, the width of the second reinforcing rib 109 increases, which also results in increased manufacturing difficulty and increased manufacturing cost.

[0067] In some embodiments, referring to FIG. 1, the vapor chamber 100 further has a liquid inlet 122 formed thereon, which communicates with the inner cavity 102 and is used to input working fluid into the inner cavity 102.

[0068] It should be noted that the specific material of the vapor chamber 100 is not limited and can be selected according to actual conditions. In some embodiments, the vapor chamber 100 includes a stainless steel vapor chamber 100, and the specific material type is SUS. The stainless steel vapor chamber 100 has higher strength, stronger deformation resistance, and strong heat conduction capacity.

[0069] In an embodiment, a mold is used to remove materials on the first plate body 103 by etching or other processes to manufacture the first reinforcing rib 108, the second reinforcing rib 109, the third reinforcing rib 113, the first support column 118, and the second support column 123, which can increase the structural strength and deformation resistance of the vapor chamber 100.

[0070] In another embodiment, referring to FIG. 7, the outer side of the first plate body 103 is recessed away from the inner cavity 102, and the inner side of the first plate body 103 is protruded close to the inner cavity 102, thereby forming the reinforcing structure 105. The first plate body 103 is placed on a punch press, and a punch is aligned with the outer side of the first plate body, and the outer side is punched toward the inner side to form the reinforcing structure 105 on the first plate body 103. In this way, material can be saved.

[0071] In this embodiment, referring to FIG. 7, the reinforcing structure 105 is integrally formed by punching, that is, the first plate body 103 is placed on a punch press, and the first reinforcing rib 108, the second reinforcing rib 109, the third reinforcing rib 113, the first support column 118, and the second support column 123 are respectively formed on the first plate body by the punch press. The forming process is simple, and raw materials are saved.

[0072] In some embodiments, the at least partially reinforced structure 105 is welded to the second plate body 104, and the first plate body 103 and the second plate body 104 form the inner cavity 102 for containing the working fluid, so the structure strength of the area forming the inner cavity 102 is weak, in order to improve the structure strength of this part, a plurality of first support columns 118 and a plurality of second support columns 123 are welded to the second plate body 104, in this way, the first plate body 103 and the second plate body 104 are supported by the plurality of first support columns 118 and the plurality of second support columns 123, thereby improving the structure strength of the vapor chamber 100; in addition, the welding connection mode facilitates automated production and improves production efficiency.

[0073] It should be noted that in the related art, the vapor chamber 100 includes an upper shell and a lower shell, and the inner cavity 102 is formed between the lower shell and the upper shell, and the inner cavity 102 is provided with the working fluid, and the upper shell and the lower shell are generally made of copper, which causes the upper shell and the lower shell to be easily corroded, and the service life of the vapor chamber 100 is reduced. In order to avoid this problem, in some embodiments, referring to FIGS. 1 and 8, the vapor chamber 100 includes a plate body 101, and the plate body 101 forms the inner cavity 102, and the inner cavity 102 is provided with the working fluid for heat transfer. The plate body 101 includes two plate bodies oppositely arranged along a first direction, and at least one plate body includes a core material layer 106a and a protective layer 107a located on at least one side of the core material layer 106a in the first direction; the thickness of the core material layer 106a is B1, the thickness of the protective layer 107a is A1, and A1:B1=(0.0005~0.2):1. The structure is simple, the corrosion resistance is strong, and the service life is long. The plate body includes the core material layer 106a and the protective layer 107a, the protective layer 107a is arranged on the core material layer 106a, can protect the core material layer 106a, form a dense passivation film on the outer surface of the core material layer 106a, effectively prevent the core material layer 106a from reacting with other substances, thereby prolonging the service life of the vapor chamber 100; at the same time, the thickness of the core material layer 106a is B1, the thickness of the protective layer 107a is A1, and A1:B1=(0.0005~0.2):1, within this range, the core material layer 106a can be prevented from being corroded, the service life of the vapor chamber 100 is improved, and at the same time, the thickness of the vapor chamber 100 will not be too thick, and the occupied space will not be increased.

[0074] In some embodiments, the core material layer 106a includes a stainless steel layer or a copper layer, and the protective layer 107a includes any one of a nickel layer, a chromium layer, a zinc layer, an organic coating layer, and a Teflon coating layer,

[0075] The core material layer 106a includes a stainless steel layer and a copper layer, which have relatively poor activity and generally do not react with other substances, and have good corrosion resistance. In addition, the stainless steel layer and the copper layer have strong structural strength and are not prone to deformation, which can improve the service life of the vapor chamber 100. In addition, the core material layer 106a is provided with a protective layer 107a, which includes any one of a nickel layer, a chromium layer, a zinc layer, an organic coating layer, and a Teflon coating layer. The nickel layer, the chromium layer, the zinc layer, the organic coating layer, and the Teflon coating layer have poor activity and generally do not react with other substances. The protective layer 107a is arranged on the core material layer 106a to protect the core material layer 106a, form a dense passivation film on the outer surface of the core material layer 106a, effectively prevent the core material layer 106a from reacting with other substances, and thus prolong the service life of the vapor chamber 100. In addition, the protective layer 107a can also improve the appearance of the plate, making the appearance of the vapor chamber 100 more beautiful.

[0076] It should be noted that when A1 / B1 is less than 0.0005, the thickness of the core material layer 106a is small, which results in a small thickness of the plate body and weak structural strength of the plate body. In addition, the thickness of the protective layer 107a is also small, and the working fluid or the electrolyte or the colloid can easily penetrate into the core material layer 106a during use, which can cause the core material layer 106a to be corroded and the vapor chamber 100 to be easily damaged during use, thereby affecting the service life of the vapor chamber 100. When A1 / B1 is greater than 0.2, the thickness of the core material layer 106a is large, and the thickness of the protective layer 107a is also large, which results in an increase in the overall size of the vapor chamber 100 and an increase in the occupied space.

[0077] In some embodiments, the thickness of the protective layer 107a is 0.001-0.05 mm. The thickness of the protective layer 107a can be 0.001 mm, 0.002 mm, 0.005 mm, 0.006 mm, 0.01 mm, 0.015 mm, 0.018 mm, 0.022 mm, 0.025 mm, 0.026 mm, 0.028 mm, 0.03 mm, 0.031 mm, 0.035 mm, 0.038 mm, 0.04 mm, 0.042 mm, 0.047 mm, 0.05 mm, or other data not listed.

[0078] It should be noted that the positional relationship between the core material layer 106a and the protective layer 107a is not limited. In an embodiment, the inner cavity 102 of the vapor chamber 100 is provided with a working fluid. In order to avoid corrosion of the two plate bodies by the working fluid, the side of the two plate bodies in contact with the working fluid is provided with the protective layer 107a. In this way, the material can be saved, and the cost can be reduced. In another embodiment, the vapor chamber 100 is applied to a battery. One side of the plate body needs to be in contact with the working fluid, and the other side of the plate body needs to be in contact with the electrolyte or colloid. Therefore, in order to avoid corrosion of the plate body, the protective layer 107a is wrapped outside the core material layer 106a.

[0079] In the embodiment, the two plate bodies are respectively a first plate body 103 and a second plate body 104. The first plate body 103 is a lower shell plate, and the second plate body 104 is an upper shell plate. The upper shell plate and the lower shell plate are connected by welding.

[0080] In the embodiment, in order to improve the service life of the vapor chamber 100, the protective layer 107a wraps the core material layer 106a. The protective layer 107a is formed outside the core material layer 106a by vacuum ion plating. The vacuum ion plating operation is simple, the cost is small, and the plating layer is stable. The protective layer 107a and the core material layer 106a can be in close contact, so that the protective layer 107a forms a dense passivation film on the outer surface of the core material layer 106a, effectively prevents the core material layer 106a from reacting with other substances, and prolongs the service life of the vapor chamber 100. The specific operation mode and matters needing attention of vacuum ion plating can refer to the conventional settings in the art, which will not be described here.

[0081] In some embodiments, referring to FIGS. 11 and 12, each plate body includes a bottom plate 108a, a side plate 109a, and a mounting plate 110a. The side plate 109a is arranged around the bottom plate 108a. The mounting plate 110a is bently connected to an end of the side plate 109a away from the bottom plate 108a and extends toward a direction away from the bottom plate 108a. In actual operation, the bottom plates 108a of the two plate bodies correspond to each other, the side plates 109a of the two plate bodies correspond to each other, and the mounting plates 110a of the two plate bodies correspond to each other. The two mounting plates 110a of the two plate bodies are connected by a welding connection. The welding connection can improve the connection strength of the two plate bodies and also improve the sealing performance of the vapor chamber 100.

[0082] In the embodiment, the mounting plate 110a has oppositely arranged inner and outer sides, the inner side is the side close to the inner cavity 102, and the outer side is the side away from the inner cavity 102. The mounting plate 110a is further formed with a welding side between the inner side and the outer side, and the welding connection part is configured by welding the two mounting plates 110a at the welding side of the mounting plate 110a; it should be noted that the welding side actually does not exist, and the welding side refers to a position to which the welding gun is aligned for welding in the welding process. In the embodiment, the welding gun is aligned with the welding side for welding from the welding side, and the welding connection part refers to the part connected by the two mounting plates 110a after welding.

[0083] The shortest distance between the welding side and the end of the mounting plate 110a away from the side plate 109a is C1, and 5mm≤C1≤15mm. It should be noted that when C1 is less than 5mm, the welding gun is inclined to the outer side in the welding process, the welding area of the two plate bodies is small, the connection strength of the two plate bodies is not enough, and the two plate bodies are easy to break in the use process, resulting in leakage of the working fluid in the inner cavity 102. When C1 is greater than 15mm, the welding gun is inclined to the inner side, and the inner cavity 102 is often provided with a reinforcing structure 105 for support. When the position of the welding gun is close to the inner side, the welding energy will affect the reinforcing structure 105 in the inner cavity 102 in the welding process, causing the reinforcing structure 105 to deform, thereby affecting the overall structural strength of the vapor chamber 100. In the embodiment, C1 can be 5mm, 5.5mm, 6mm, 6.2mm, 6.8mm, 7mm, 7.7mm, 7.9mm, 8mm, 8.5mm, 8.6mm, 8.7mm, 9mm, 10mm, 11.2mm, 12mm, 12.5mm, 13mm, 14mm, 15mm or other data not listed.

[0084] In the embodiment, the two plate bodies are a first plate body 103 and a second plate body 104, the first plate body 103 comprises a first bottom plate 108a and a first side plate 109a, the second plate body 104 comprises a second bottom plate 108a and a second side plate 109a, the first bottom plate 108a and the first side plate 109a enclose a first recess, the second bottom plate 108a and the second side plate 109a enclose a second recess, and the first recess and the second recess are communicated to form the inner cavity 102. It should be noted that the vapor chamber 100 further comprises a reinforcing structure 105, the reinforcing structure 105 is arranged in one of the plate bodies and located in the inner cavity 102, the reinforcing structure 105 can support the plate body 101, reinforce the structural strength of the plate body 101, thereby improving the pressure bearing capacity and anti-expansion capacity of the vapor chamber 100, improving the structural strength of the vapor chamber 100, avoiding the bending deformation or fracture of the vapor chamber 100, and improving the service life of the vapor chamber 100. At the same time, the reinforcing structure 105 is arranged in the inner cavity 102, does not occupy additional space, and does not affect the overall size of the battery.

[0085] In the embodiment, the first recess and the second recess are made by stamping. A plate is placed on a stamping die, a punch is aligned with the place to be stamped, and after stamping, the bottom plate 108a, the side plate 109a and the mounting plate 110a are formed on the plate. The stamping method can save materials, and there is no gap between the bottom plate 108a, the side plate 109a and the mounting plate 110a, and the sealing performance is good.

[0086] In some embodiments, the vapor chamber 100 further comprises a plurality of liquid absorption cores 114 and a wire mesh 116, the plurality of liquid absorption cores 114 are located in the inner cavity 102, the plurality of liquid absorption cores 114 are located in one of the plate bodies, the plurality of liquid absorption cores 114 are arranged along the length direction of the plate body 101, and the plurality of liquid absorption cores 114 are arranged in the inner cavity 102 along the width direction of the plate body 101, and the wire mesh 116 is arranged between the plurality of liquid absorption cores 114 and the other plate body.

[0087] It should be noted that the specific materials of the liquid absorption core 114 and the wire mesh 116 are not limited, and can be selected according to actual conditions. In the embodiment, the liquid absorption core 114 is a stainless steel liquid absorption core 114, and the wire mesh 116 is a stainless steel wire mesh 116. The stainless steel material has strong corrosion resistance and high structural strength, and is not easily damaged. In some other embodiments, the liquid absorption core 114 is a copper liquid absorption core 114, and the wire mesh 116 is a copper wire mesh 116.

[0088] In some embodiments, referring to FIGS. 9 and 10, the overall thickness of the vapor chamber 100 is H10, the thickness of the first plate body 103 is H21, and H21:H10=(0.01~0.2):1. When H21 / H10 is less than 0.01, the thickness of the first plate body 103 is too thin, and the structural strength is weak, which is easy to be damaged during use. When H21 / H10 is greater than 0.2, the thickness of the first plate body 103 is too thick, the heat conduction and heat transfer performance are reduced, and the occupied space is increased. The thickness of the second plate body 104 is H22, and H22:H10=(0.01~0.2):1. When H22 / H10 is less than 0.01, the thickness of the second plate body 104 is too thin, and the structural strength is weak, which is easy to be damaged during use. When H21 / H10 is greater than 0.2, the thickness of the second plate body 104 is too thick, the heat conduction and heat transfer performance are reduced, and the occupied space is increased.

[0089] In some embodiments, referring to FIGS. 9 and 10, the thickness of the wire mesh 116 is H30, and H30:H10=(0.01~0.7):1. When H30 / H10 is less than 0.01, the thickness of the wire mesh 116 is too thin, and the heat conduction performance is reduced. When H30 / H10 is greater than 0.7, the thickness of the wire mesh 116 is too large, the space of the inner cavity 102 is increased, the amount of working fluid in the inner cavity 102 is reduced, and the performance of the vapor chamber 100 is affected.

[0090] In some embodiments, referring to FIGS. 9 and 10, the thickness of the wick 114 is H40, and H40:H10=(0.015~0.8):1. It should be noted that when H40 / H10 is less than 0.015, the thickness of the wick 114 is too thin, and the heat conduction and heat transfer performance are reduced. When H40 / H10 is greater than 0.8, the thickness of the wick 114 is too large, the space of the inner cavity 102 is increased, the amount of working fluid in the inner cavity 102 is reduced, and the performance of the vapor chamber 100 is affected.

[0091] In some embodiments, the overall thickness of the vapor chamber 100 is 0.2~15mm, and H10 can be 0.2mm, 0.21mm, 0.23mm, 0.25mm, 0.3mm, 0.31mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.45mm, 0.48mm, 0.5mm, 0.55mm, 0.6mm, 0.64mm, 0.7mm, 0.77mm, 0.8mm, 0.9mm, 1mm, 1.5mm, 1.8mm, 2mm, 2.2mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12.5mm, 13mm, 14mm, 14.5mm, 15mm, or other data not listed.

[0092] The thickness of the plate body (the first plate body 103 or the second plate body 104) is 0.02-3 mm, which can be 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.1 mm, 0.2 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm, 1.6 mm, 1.8 mm, 2 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.8 mm, 3 mm or other data not listed.

[0093] The thickness of the wire mesh 116 is 0.011-0.3 mm, and H30 can be 0.011 mm, 0.012 mm, 0.013 mm, 0.015 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.15 mm, 0.16 mm, 0.18 mm, 0.2 mm or other data not listed.

[0094] The thickness of the liquid absorption core 114 is 0.08-0.5 mm, and H40 can be 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.15 mm, 0.16 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.25 mm, 0.28 mm, 0.3 mm, 0.32 mm, 0.33 mm, 0.34 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.41 mm, 0.42 mm, 0.45 mm, 0.48 mm, 0.49 mm, 0.5 mm or other data not listed.

[0095] It should be noted that when the thickness of H10 decreases, the thicknesses of H21, H22, H30 and H40 also decrease, and when the thickness of H10 increases, the thicknesses of H21, H22, H30 and H40 also increase.

[0096] The plate body 101 includes a first part 110, a second part 111 and a third part 112, and the second part 111 is connected between the first part 110 and the third part 112. Referring to FIG. 13, in some embodiments, the first part 110 and the third part 112 are located in the same plane, and the heat plate 100 is a “” type structure. Referring to FIG. 14, in other embodiments, the first part 110 and the third part 112 are located in different planes, and the heat plate 100 is an “L” type structure. In an embodiment, referring to FIG. 15, two “L” type heat plates 100 can be combined to form a “T” type heat plate 100. It should be noted that the selection can be made according to the actual situation.

[0097] In some embodiments, referring to FIG. 1, the heat plate 100 further has a liquid inlet 122 formed thereon, the liquid inlet 122 is in communication with the inner cavity 102, and the liquid inlet 122 is provided with a liquid injection pipe in communication with the outside, which is used for inputting the working fluid into the inner cavity 102.

[0098] The application also provides a preparation method of the vapor chamber 100, and the specific preparation steps are as follows:

[0099] The materials are selected, and the first plate body 103, the second plate body 104, the wire mesh 116, the liquid absorbing core 114 and the liquid injection pipe are made of stainless steel.

[0100] The first plate body 103 and the second plate body 104 are placed on a punch machine, and the first plate body 103 is formed with a first groove and the second plate body 104 is formed with a second groove through punch forming.

[0101] The first plate body 103, the second plate body 104, the wire mesh 116, the liquid absorbing core 114 and the liquid injection pipe are cleaned through ultrasonic cleaning.

[0102] The reinforcing structure 105 is sequentially welded on the first plate body 103.

[0103] The first plate body 103 and the second plate body 104 are coated through a vacuum deposition plating method, so that the outer side of the first plate body 103 and the second plate body 104 is wrapped with a protective layer 107a.

[0104] The first plate body 103 is placed on an operation table, the liquid absorbing core 114 is installed on the first plate body 103, the wire mesh 116 is placed on the liquid absorbing core 114, the second plate body 104 is placed on the first plate body 103, and then edge sealing is performed through laser welding, so that the first plate body 103 and the second plate body 104 are welded together.

[0105] The liquid injection pipe is welded on the liquid inlet 122, pure water is injected into the inner cavity 102 through the liquid injection pipe, then the inner cavity 102 is vacuumized (the vacuum is 0.08 torr), and then laser welding is performed to obtain the vapor chamber 100.

[0106] The vapor chamber 100 is subjected to aging test (test condition: 85±5℃, 12~24h), and whether the performance of the vapor chamber 100 is attenuated is detected.

[0107] The vapor chamber 100 is subjected to air tightness test (test condition: helium pressurization 0.16~0.6Mpa, 4h), and whether the performance of the vapor chamber 100 is attenuated is detected.

[0108] It should be noted that the test method and performance detection of the aging test and the air tightness test can refer to the conventional settings in the field, and will not be described here.

[0109] In some embodiments, the reinforcing structure 105 includes a plurality of support columns, the plurality of support columns are arranged on the first plate body 103 at intervals, the distance between two adjacent support columns is 5~15mm, and the diameter of each support column is 1~5mm. The mesh number of the wire mesh 116 is 200~250 meshes.

[0110] It should be noted that in the related art, the upper shell plate and the lower shell plate are connected by welding, and in the welding process, the solder is easy to overflow and contaminate the structures such as the wick 114 inside the vapor chamber 100, and the overflow of the solder causes the local thickness of the vapor chamber 100 to increase, and the heat conduction effect is reduced. In order to avoid this problem, please refer to FIGS. 1, 16 and 18, the vapor chamber includes a plate body 101, the plate body 101 includes a first plate body and a second plate body 104 arranged opposite to each other, the first plate body 103 and the second plate body 104 enclose an inner cavity 102, and the first plate body 103 and / or the second plate body 104 is provided with a first groove 21, the first groove 21 is arranged around the inner cavity 102, and the first groove 21 is provided with solder for welding the first plate body 103 and the second plate body 104. The first plate body and / or the second plate body 104 is provided with the first groove 21, and the first groove 21 is provided with the solder. When the first plate body 103 and the second plate body 104 are welded, the solder is filled in the first groove 21 after melting, which can avoid the overflow of the solder to the inner cavity 102 and contaminate other structures in the inner cavity 102. At the same time, the solder is arranged in the first groove 21, which can not only improve the connection strength of the first plate body 103 and the second plate body 104, but also prevent the solder from overflowing in the welding process, so as to ensure that the thickness of the vapor chamber 100 is basically consistent, avoid the local thickness of the vapor chamber 100 increasing due to the overflow of the solder, and affect the heat conduction effect of the vapor chamber 100.

[0111] It should be noted that the specific position of the first groove 21 is not limited, which can be selected according to the actual situation. In some embodiments, the first groove 21 is formed on the first plate body 103. In other embodiments, the first groove 21 is formed on the second plate body 104. In other embodiments, the first groove 21 is arranged on the first plate body 103 and the second plate body 104.

[0112] In some embodiments, please refer to FIG. 1, the first plate body 103 is a lower shell plate, the second plate body 104 is an upper shell plate, the upper shell plate and the lower shell plate are respectively provided with a first accommodating groove 111b and a second accommodating groove 121b, and the upper shell plate and the lower shell plate are welded to communicate the first accommodating groove 111b and the second accommodating groove 121b to form the inner cavity 102. It should be noted that the vapor chamber 100 is also provided with a first reinforcing structure 105, and the specific position of the first reinforcing structure 105 is not limited, which only needs to be located in the inner cavity 102. In some embodiments, the first reinforcing structure 105 is arranged on the first plate body 103, and of course the first reinforcing structure 105 can also be arranged on the second plate body 104, which can be selected according to the actual situation. Since the first plate body 103 is a lower shell plate, the first reinforcing structure 105 is arranged on the first plate body 103, which is more convenient for the welding connection of the first plate body 103 and the second plate body 104.

[0113] In some embodiments, the working fluid is arranged in the inner cavity 102 for heat exchange. It should be noted that the type of working fluid is not limited, which can be selected according to actual application. For example, the working fluid can be lubricating oil, water, cold air, alcohol compound, etc.

[0114] Please refer to FIG. 16, FIG. 17 and FIG. 4, the first plate body 103 is formed with a first accommodating groove 111b, the edge of the first accommodating groove 111b is outwardly folded to form a first connecting wall 112b, the second plate body 104 is formed with a second accommodating groove 121b, the edge of the second accommodating groove 121b is outwardly folded to form a second connecting wall 122b, the first connecting wall 112b corresponds to the second connecting wall 122b, and in the actual welding process, the first plate body 103 and the second plate body 104 are welded and connected by welding the first connecting wall 112b and the second connecting wall 122b. The first connecting wall 112b is provided with a first groove 21 on the side facing the second plate body 104, and the second plate body 104 covers the first groove 21. In this embodiment, the first groove 21 is used to accommodate the solder, and the second connecting wall 122b serves as a "cover plate" to cover the first groove 21, so as to form an accommodating cavity 23 between the first groove 21 and the second connecting wall 122b. During welding, the solder melts and fills the accommodating cavity 23. Since the second connecting wall 122b covers the first groove 21, it can prevent the solder from overflowing out of the first groove 21, thereby avoiding the solder from overflowing into the inner cavity 102 and polluting the inner cavity 102.

[0115] Please refer to FIG. 20, FIG. 21 and FIG. 22, the first groove 21 has a first side edge 211 close to the inner cavity 102 and a second side edge 212 away from the inner cavity 102, the vertical distance between the first side edge 211 and the second side edge 212 is D1, and the width of the first connecting wall 112b is D4, wherein 0.05≤D1 / D4≤0.25. It should be noted that the width of the first groove 21 should not be too wide or too small. When D1 / D4 is less than 0.05, the width of the first groove 21 is too narrow, and the volume of the first groove 21 is reduced. When the volume of the solder is unchanged, the solder will still overflow out of the first groove 21 and flow into the inner cavity 102 during welding, polluting the inner cavity 102. When the volume of the solder is reduced, it will lead to a reduction in the connection strength of the first plate body 103 and the second plate body 104, which is prone to splitting during use. When D1 / D4 is greater than 0.25, the width of the first groove 21 is too large, which reduces the strength of the first connecting wall 112b, and the first connecting wall 112b is prone to breaking during welding.

[0116] It should be noted that the specific position of the first groove 21 is not limited, and can be set according to actual conditions. In the embodiment, the vertical distance from the first side edge 211 to the edge of the inner cavity 102 is D2, and the vertical distance from the second side edge 212 to the side of the first connecting wall 112b away from the inner cavity 102 is D3, and 0.9≤D2 / D3≤1.1. When D2 / D3 is less than 0.9, the first groove 21 is too close to the inner cavity 102, and the solder is also easy to penetrate into the inner cavity 102 during the welding process, polluting the inner cavity 102. When D2 / D3 is greater than 1.1, the first groove 21 is too far away from the inner cavity 102, which can effectively avoid the penetration and pollution of the solder, but when the first groove 21 is too close to the edge of the first connecting wall 112b, the edge of the first connecting wall 112b is easy to crack during the welding process. The first groove 21 is located at the middle position of the first connecting wall 112b, that is, D2=D3, and such setting can also ensure the uniformity of the stress of the first connecting wall 112b during the welding process.

[0117] In some embodiments, referring to FIGS. 18 and 19, the edge of the second plate body 104 is formed with a second connecting wall 122b corresponding to the first connecting wall 112b, and the side of the second connecting wall 122b facing the first connecting wall 112b is provided with a protrusion 22 covering the first groove 21. In the actual installation process, the solder is first placed in the first groove 21, and then the second plate body 104 is covered on the first plate body 103, so that the protrusion 22 corresponds to the first groove 21, and the protrusion 22 can be clamped in the first groove 21 during the covering process. On the one hand, the protrusion 22 cooperates with the first groove 21 to pre-fix the first plate body 103 and the second plate body 104, which is convenient for the operator to operate; on the other hand, the protrusion 22 cooperates with the first groove 21 to fix the solder in the first groove 21, avoiding the penetration of the solder, thereby protecting the inner cavity 102 and avoiding the pollution of the inner cavity 102.

[0118] Referring to FIGS. 20 and 21, along the thickness direction of the first plate body 103, the height of the protrusion 22 is E1, and the depth of the first groove 21 is E2, and E1 is less than E2. In the embodiment, the height of the protrusion 22 is less than the depth of the first groove 21, and the purpose of such setting is to avoid the protrusion 22 extruding the solder when cooperating with the first groove 21, causing the solder to penetrate and pollute the inner cavity 102. At the same time, since the height of the protrusion 22 is less than the depth of the first groove 21, a containing cavity 23 is formed between the first groove 21 and the protrusion 22, and the solder is arranged in the containing cavity 23. The containing cavity 23 is used for containing the solder, thereby avoiding the overflow of the solder and the pollution of the inner cavity 102.

[0119] In some embodiments, E2 = E1 + F1, F1 is the first coefficient, 0.05mm ≤ F1 ≤ 0.15mm. It should be noted that F1 is the depth of the accommodating cavity 23, when F1 is less than 0.05, the height of the convex part 22 is too high, resulting in the depth of the accommodating cavity 23 being too shallow, when the volume of the solder is unchanged, during welding, the solder will still overflow the first groove 21 and flow to the inner cavity 102, polluting the inner cavity 102; when the solder is correspondingly reduced, it will cause the connection strength of the first plate body 103 and the second plate body 104 to be reduced, and it is easy to split during use. When F1 is greater than 0.15, the height of the convex part 22 is too small, resulting in an increase in the volume of the accommodating cavity 23, and a reduction in the sealing effect of the accommodating cavity 23, and the solder is easy to overflow. In the present embodiment, F1 can be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm or other data not listed.

[0120] Please refer to FIG. 20, FIG. 21 and FIG. 22, the thickness of the first connecting wall 112b is E3, 0.06 ≤ E2 / E3 ≤ 0.7; it should be noted that when E2 / E3 is less than 0.06, the depth of the first groove 21 is too small, the volume of the first groove 21 is reduced, when the volume of the solder is unchanged, during welding, the solder will still overflow the first groove 21 and flow to the inner cavity 102, polluting the inner cavity 102; when the solder is correspondingly reduced, it will cause the connection strength of the first plate body 103 and the second plate body 104 to be reduced, and it is easy to split during use. When E2 / E3 is greater than 0.7, the depth of the first groove 21 is increased, the structural strength of the first connecting wall 112b is reduced, and it is easy to be damaged.

[0121] In some embodiments, the thickness of the second connecting wall 122b is E4, 0.05 ≤ E1 / E4 ≤ 0.6. When E1 / E4 is less than 0.05, the height of the convex part 22 is too small, resulting in an increase in the volume of the accommodating cavity 23, and a reduction in the sealing effect of the accommodating cavity 23, and the solder is easy to overflow. When E1 / E4 is greater than 0.6, the height of the convex part 22 is too high, resulting in the depth of the accommodating cavity 23 being too shallow, when the volume of the solder is unchanged, during welding, the solder will still overflow the first groove 21 and flow to the inner cavity 102, polluting the inner cavity 102; when the solder is correspondingly reduced, it will cause the connection strength of the first plate body 103 and the second plate body 104 to be reduced, and it is easy to split during use.

[0122] In some embodiments, the volume of the accommodating cavity 2323 is V1, the volume of the solder is V2, and 0.65≤V2 / V1≤1. It should be noted that when V2 / V1 is less than 0.65, the capacity of the solder is too small, the welding strength of the first plate body 103 and the second plate body 104 is reduced, and defects such as false welding are prone to occur. When V2 / V1 is greater than 1, the capacity of the solder is too large, and penetration is prone to occur during welding, flowing into the inner cavity 102 and polluting the inner cavity 102.

[0123] Referring to FIGS. 20 and 21, the slot width of the first slot 21 is F1, the width of the convex portion 22 is F2, F1=F2+F2, F2 is a second coefficient, and 0.03mm≤F2≤0.05mm. It should be noted that the purpose of such a setting is to facilitate the cover of the first plate body 103 and the second plate body 104, and the convex portion 22 is clearance-fitted with the first slot 21, which facilitates the operation of the operator. F2 can be 0.03mm, 0.04mm, 0.05mm, or other data not listed.

[0124] In some embodiments, the heating plate 100 further comprises a plurality of liquid absorbing wicks 114 and a wire mesh 116. The plurality of liquid absorbing wicks 114 are located in the inner cavity 102. The plurality of liquid absorbing wicks 114 are arranged on the first plate body 103 and extend along the length direction of the plate body 101. The plurality of liquid absorbing wicks 114 are arranged in the inner cavity 102 and are spaced apart along the width direction of the plate body 101. The wire mesh 116 is arranged between the plurality of liquid absorbing wicks 114 and the second plate body 104.

[0125] It should be noted that the specific materials of the liquid absorbing wicks 114 and the wire mesh 116 are not limited and can be selected according to actual conditions. In this embodiment, the liquid absorbing wicks 114 are stainless steel liquid absorbing wicks 114, and the wire mesh 116 is a stainless steel wire mesh 116. The stainless steel material has strong corrosion resistance and high structural strength and is not easily damaged. In some other embodiments, the liquid absorbing wicks 114 are copper liquid absorbing wicks 114, and the wire mesh 116 is a copper wire mesh 116.

[0126] In some embodiments, referring to FIG. 1, the heating plate 100 further comprises a liquid inlet 122. The liquid inlet 122 is in communication with the inner cavity 102. The liquid inlet 122 is provided with a liquid injection pipe. The liquid injection pipe is in communication with the outside and is used for inputting working fluid into the inner cavity 102.

[0127] The plate body 101 comprises a first part 110, a second part 111 and a third part 112, and the second part 111 is connected between the first part 110 and the third part 112. Referring to FIG. 9, in some embodiments, the first part 110 and the third part 112 are located in the same plane, and the vapor chamber 100 is of a “1” type structure. Referring to FIG. 10, in some other embodiments, the first part 110 and the third part 112 are located in different planes, and the vapor chamber 100 is of an “L” type structure. Referring to FIG. 11, two “L” type vapor chambers 100 can be combined to form a “T” type vapor chamber 100.

[0128] The application also provides a battery comprising the vapor chamber 100. The specific structure of the vapor chamber 100 is not described again, and since the battery adopts all the technical solutions of all the embodiments of the vapor chamber 100, the battery at least has all the beneficial effects brought by the technical solutions of the embodiments of the vapor chamber 100, which are not described again.

[0129] In an embodiment, the battery further comprises a battery shell, and the battery shell is formed by the vapor chamber 100, that is, the six sides of the battery shell can be formed by the vapor chamber 100. In this way, space can be saved and space utilization can be improved. It should be noted that the six vapor chambers 100 can be in communication with each other or not, which can be selected according to actual conditions.

[0130] In some embodiments, the battery shell has six shell surfaces, and the vapor chamber 100 can be applied to any one of the shell surfaces of the battery shell or can be applied to multiple shell surfaces at the same time, for example, the vapor chamber 100 is applied to two adjacent shell surfaces of the battery shell. The first part 110 of the vapor chamber 100 corresponds to one shell surface, and the second part 111 of the vapor chamber 100 corresponds to another shell surface, so that the vapor chamber 100 can serve as two shell surfaces of the battery shell. The size of the battery module can be selected as needed.

[0131] In some other embodiments, the vapor chamber 100 can also be used in the battery. The battery comprises a battery shell and a core pack group, the core pack group is installed in the battery shell, the core pack group comprises at least one core pack, the first part 110 of the vapor chamber 100 corresponds to one side surface of the core pack, and the second part 111 of the vapor chamber 100 corresponds to another side surface of the core pack. In order to uniformly heat the adjacent core packs, the vapor chamber 100 can also be arranged between the two adjacent core packs, the temperature of multiple side surfaces can be balanced, the temperature of the high-temperature part can be conducted to the low-temperature part directly cooled by the cooling plate, the cooling efficiency can be improved, and thermal runaway can be avoided.

[0132] In some other embodiments, the heat plate 100 can also be used in a battery module including a plurality of batteries, the first part 110 of the heat plate 100 corresponds to one side of the battery shell, the second part 111 of the heat plate 100 corresponds to the other side of the battery shell, and the heat plate 100 can also be arranged between two adjacent batteries to achieve temperature balance of multiple sides, so as to conduct the temperature of the high-temperature part to the low-temperature part cooled directly by the cooling plate.

[0133] The technical solutions of the present application are further described in detail in combination with specific examples and data. It should be understood that the following examples are only used to explain the present application and do not limit the present application.

[0134] It should be noted that the welding method of Examples 1 to 3, Comparative Examples 1 and 2 is soldering, and the solder used is solder paste.

[0135] Example 1

[0136] The first plate body has a first groove formed thereon, and the second plate body has a protrusion formed thereon, the height of the protrusion is 0.1 mm, and the depth of the first groove is 0.15 mm.

[0137] Verification:

[0138] The heat plate is subjected to air tightness detection, and the air tightness of the heat plate is qualified;

[0139] The heat plate is cut, and after cutting, the internal structure of the heat plate is observed, and it is found that there is no solder on the wick and the wire mesh.

[0140] Example 2

[0141] The first plate body has a first groove formed thereon, and the second plate body has a protrusion formed thereon, the height of the protrusion is 0.1 mm, and the depth of the first groove is 0.2 mm.

[0142] Verification:

[0143] The heat plate is subjected to air tightness detection, and the air tightness of the heat plate is qualified;

[0144] The heat plate is cut, and after cutting, the internal structure of the heat plate is observed, and it is found that there is no solder on the wick and the wire mesh.

[0145] Example 3

[0146] The first plate body has a first groove formed thereon, and the second plate body has a protrusion formed thereon, the height of the protrusion is 0.1 mm, and the depth of the first groove is 0.25 mm.

[0147] Verification:

[0148] The heat plate is subjected to air tightness detection, and the air tightness of the heat plate is qualified;

[0149] The uniform heat plate is cut, and the structure inside the uniform heat plate is observed after cutting. It is found that there is no solder on the liquid absorption core and the wire mesh.

[0150] Comparative Example 1

[0151] The first plate body is formed with a first groove, and the second plate body is formed with a convex part. The height of the convex part is 0.15 mm, and the depth of the first groove is 0.1 mm.

[0152] Verification:

[0153] The uniform heat plate is subjected to air tightness detection, and the air tightness shows NG.

[0154] The uniform heat plate is cut, and the structure inside the uniform heat plate is observed after cutting. It is found that there is solder on the liquid absorption core, and the liquid absorption core is contaminated.

[0155] Comparative Example 2

[0156] The first plate body is formed with a first groove, and the second plate body is formed with a convex part. The height of the convex part is 0.05 mm, and the depth of the first groove is 0.2 mm.

[0157] Verification:

[0158] The uniform heat plate is subjected to air tightness detection, and the air tightness shows NG.

[0159] The uniform heat plate is cut, and the structure inside the uniform heat plate is observed after cutting. It is found that there is no solder on the liquid absorption core and the wire mesh.

Claims

1. A vapor chamber (100) comprising: a plate body (101) formed with an inner cavity (102), the plate body (101) comprising a first plate body (103) and a second plate body (104) oppositely arranged, the first plate body (103) and the second plate body (104) enclosing at least a portion of the inner cavity (102); and a reinforcing structure (105) arranged on the first plate body (103) and located in the inner cavity (102); wherein the vapor chamber (100) has a compressive strength greater than or equal to 2.5 MPa.

2. The vapor chamber (100) of claim 1, wherein The reinforcing structure (105) comprises a plurality of reinforcing rib assemblies (106), each of the reinforcing rib assemblies (106) comprising a plurality of reinforcing rib rows (107), each of the reinforcing rib rows (107) comprising a plurality of first reinforcing ribs (108) arranged in an array.

3. The vapor chamber (100) of claim 2, wherein Each of the reinforcing rib rows (107) further comprises a plurality of second reinforcing ribs (109) arranged in an array, at least one of the second reinforcing ribs (109) having a length smaller than that of at least one of the first reinforcing ribs (108). The first plate body (103) further comprises a first portion (110), a second portion (111) and a third portion (112), the second portion (111) being connected between the first portion (110) and the third portion (112), the plurality of first reinforcing ribs (108) being arranged on the first portion (110), the plurality of second reinforcing ribs (109) being arranged on the third portion (112), and the second portion (111) comprising a flat plate or a bent plate.

4. The vapor chamber (100) of claim 3, wherein The reinforcing structure (105) further comprises a third reinforcing rib (113) extending along a width direction of the plate body (101) and arranged on the second portion (111). 5.The vapor chamber (100) according to any one of claims 2-4, further comprising a plurality of wick cores (114), a wick core mounting passage (115) being formed between any two adjacent reinforcing rib assemblies (106), and the wick core (114) being mounted in the wick core mounting passage (115).

6. The vapor chamber (100) of claim 5, wherein The wick core (114) comprises any one of a wick core and a copper wick core.

7. The heating plate (100) according to any one of claims 2-6, wherein The reinforcing structure (105) further comprises a support structure comprising a plurality of first support rows (117), each of the first support rows (117) comprising a plurality of first support columns (118) arranged uniformly along a length direction of the plate body (101). In the same reinforcing rib assembly (106), a support mounting passage (119) is arranged between any two adjacent reinforcing rib rows (107), and the plurality of first support rows (117) are mounted in the support mounting passage (119).

8. The heating plate (100) according to claim 7, wherein In the same support mounting passage (119), any two adjacent first support rows (117) are staggered with respect to each other.

9. The vapor chamber (100) of claim 7 or 8, wherein The reinforcing structure (105) further comprises a plurality of second support rows (120) and a plurality of support columns (121), and the plurality of second support rows (120) and the plurality of support columns (121) surround the plurality of reinforcing rib assemblies (106).

10. The heating plate (100) according to claim 9, wherein Each of the second support rows (120) comprises a plurality of second support columns (123), and the distribution density of the plurality of first support columns (118) is less than that of the plurality of second support columns (123).

11. The vapor chamber (100) according to any one of claims 2-10, wherein The reinforcing structure (105) further comprises a support structure (124), and the support structure (124) comprises a plurality of first support columns (118). In the same reinforcing rib assembly (106), a support mounting channel (119) is arranged between two adjacent reinforcing rib rows (107), the plurality of first support columns (118) are mounted in the support mounting channel (119), and the plurality of first support columns (118) are arranged in a random manner.

12. The heating plate (100) according to any one of claims 3-11, wherein The sum of the areas of the orthographic projections of the reinforcing structure (105) on the first plate body (103) is S1, and the area of the cross section of the inner cavity (102) is S2, wherein (1:124)≤(S1 / S2)≤(0.5:1).

13. The wick plate (100) according to claim 12, wherein The length of the vapor chamber (100) is L1, the length of each first reinforcing rib (108) is L2, and L2 / L1=(0.1~0.7):1; and / or, The width of the plate body (101) is H1, the width of each first reinforcing rib (108) is H2, and H2 / H1=(0.01~0.5):

1.

14. The wick plate (100) according to claim 12 or 13, wherein The length of the vapor chamber (100) is L1, the length of each second reinforcing rib (109) is L3, and L3 / L1=(0.1~0.2):1; and / or, The width of the plate body (101) is H1, the width of each second reinforcing rib (109) is H3, and H3 / H1=(0.01~0.5):

1.

15. The vapor chamber (100) of any of claims 1-14, wherein, The outer side of the first plate body (103) away from the inner cavity (102) is recessed, and the inner side of the first plate body (103) close to the inner cavity (102) is protruded, so as to form the reinforcing structure (105).

16. The vapor chamber (100) of any of claims 1-15, wherein, The vapor chamber (100) comprises a stainless steel vapor chamber, and the reinforcing structure (105) is integrally formed by stamping.

17. The vapor chamber (100) of any of claims 1-16, wherein, The vapor chamber (100) comprises a stainless steel vapor chamber, and at least part of the reinforcing structure (105) is welded to the second plate body (104).

18. The vapor chamber (100) of any of claims 1-17, wherein, The first plate body (103) and the second plate body (104) are arranged oppositely along a first direction, at least one of the first plate body (103) and the second plate body (104) comprises a core material layer (106a) and a protective layer (107a) located on at least one side of the core material layer (106a) in the first direction, the thickness of the core material layer (106a) is B1, the thickness of the protective layer (107a) is A1, and A1:B1=(0.0005~0.2):

1.

19. The wick plate (100) of claim 18, wherein The core material layer (106a) comprises a stainless steel layer or a copper layer, and the protective layer (107a) comprises any one of a nickel layer, a chromium layer, a zinc layer, an organic coating layer and a Teflon coating layer.

20. The wick plate (100) according to claim 18 or 19, wherein The core material layer (106a) is provided with the protective layer (107a) formed by a vacuum ion plating method on opposite sides thereof.

21. The heating plate (100) according to any one of claims 18-20, wherein The first plate body (103) and the second plate body (104) each comprise: a bottom plate (108a); a side plate (109a) arranged around the bottom plate (108a); and a mounting plate (110a) connected to an end of the side plate (109a) away from the bottom plate (108a) in a bent manner and extending away from the bottom plate (108a); the mounting plate of the first plate body (103) and the mounting plate (110a) of the second plate body (104) are connected by a welding connection part.

22. The wick plate (100) of claim 21, wherein The welding connection part is configured to be formed by welding the two mounting plates (110a) at a welding edge of the mounting plate (110a); the shortest distance between the welding edge and an end of the mounting plate (110a) away from the side plate (109a) is C1, and 5mm≤C1≤15mm.

23. The wick plate (100) according to claim 21 or 22, wherein The bottom plate (108a) and the side plate (109a) enclose a groove; the groove of the first plate body (103) and the groove of the second plate body (104) are in communication to form the inner cavity (102), and the inner cavity (102) is provided with a working fluid.

24. The wick plate (100) of claim 23, wherein The first plate body (103) has the groove formed by stamping; and / or The second plate body (104) has the groove formed by stamping.

25. The heating plate (100) according to any one of claims 5-24, a plurality of wicks (114) are arranged on a side of the first plate body facing the second plate body; The heating plate (100) further comprises a wire mesh (116), and the wire mesh (116) is arranged on a side of the plurality of wicks (114) away from the first plate body.

26. The wick plate (100) of claim 25, wherein The wire mesh (116) comprises any one of a stainless steel wire mesh and a copper wire mesh.

27. The vapor chamber (100) of claim 25, wherein, The overall thickness of the heating plate (100) is H10, the thickness of the first plate body (103) is H21, and H21:H10=(0.01~0.2):1; and / or The overall thickness of the heating plate (100) is H10, the thickness of the second plate body (104) is H22, and H22:H10=(0.01~0.2):1; and / or The overall thickness of the heating plate (100) is H10, the thickness of the wire mesh (116) is H30, and H30:H10=(0.01~0.7):1; and / or The overall thickness of the heating plate (100) is H10, the thickness of the wick (114) is H40, and H40:H10=(0.015~0.8):

1.

28. The vapor chamber (100) of any of claims 1-27, wherein, A first slot (21) is arranged on the first plate body (103) and / or the second plate body (104), the first slot (21) is arranged around the inner cavity (102), and the first slot (21) is provided with a solder for welding the first plate body (103) and the second plate body (104).

29. The wick plate (100) of claim 28, wherein An edge of the first plate body (103) is formed with a first connecting wall (112b) which is adjacent to the inner cavity (102), and the first connecting wall (112b) is provided with the first slot (21) on a side facing the second plate body (104), and the second plate body (104) covers the first slot (21).

30. The wick plate (100) of claim 29, wherein The first slot (21) has a first side (211) close to the inner cavity (102) and a second side (212) away from the inner cavity (102), a vertical distance between the first side (211) and the second side (212) is D1, and a width of the first connecting wall (112b) is D4, wherein 0.05≤D1 / D4≤0.

25.

31. The wick plate (100) of claim 30, wherein A vertical distance between the first side (211) and an edge of the inner cavity (102) is D2, and a vertical distance between the second side (212) and a side of the first connecting wall (112b) away from the inner cavity (102) is D3, wherein 0.9≤D2 / D3≤1.

1.

32. The heating plate (100) according to any one of claims 29-31, wherein An edge of the second plate body (104) is formed with a second connecting wall (122b) which is adjacent to the inner cavity (102), and the second connecting wall (122b) corresponds to the first connecting wall (112b), and the second connecting wall (122b) is provided with a convex part (22) on a side facing the first connecting wall (112b), and the convex part (22) is embedded in the first slot (21).

33. The wick plate (100) of claim 32, wherein Along a thickness direction of the first plate body (103), a height of the convex part (22) is E1, and a depth of the first slot (21) is E2, and the E1 is less than the E2, so that an accommodation cavity (23) is formed between the first slot (21) and the convex part (22), and the solder is arranged in the accommodation cavity (23).

34. The wick plate (100) of claim 33, wherein E2=E1+b1, b1 is a first coefficient, and 0.05mm≤b1≤0.15mm.

35. The wick plate (100) according to claim 33 or 34, wherein A thickness of the first connecting wall (112b) is E3, and 0.06≤E2 / E3≤0.7; and / or, A thickness of the second connecting wall (122b) is E4, and 0.05≤E1 / E4≤0.

6.

36. The heating plate (100) according to any one of claims 33-35, wherein A volume of the accommodation cavity (23) is V1, and a volume of the solder is V2, and 0.65≤V2 / V1≤1.

37. The vapor chamber (100) according to any one of claims 32-36, characterized in that A slot width of the first slot (21) is F1, and a width of the convex part (22) is F2, F1=F2+b2, b2 is a second coefficient, and 0.03mm≤b2≤0.05mm.

38. The heating plate (100) according to any one of claims 1 to 37, wherein A shape of a cross section of the vapor chamber (100) includes at least one of a "1" type, an "L" type, and a "T" type. 39.A battery comprising the vapor chamber according to any one of claims 1-38.

40. A battery module comprising the vapor chamber (100) of any one of claims 1-38 or the battery of claim 39.

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