Wafer boat support rod, electrode introduction assembly, and semiconductor processing device

Abstract

The present disclosure provides a wafer boat support rod, an electrode introduction assembly, and a semiconductor processing device. The wafer boat support rod comprises an insulated support rod body; an accommodating groove is formed on the peripheral side of the support rod body and is used for accommodating the electrode introduction assembly of the semiconductor processing apparatus; and one end of the accommodating groove extends to a first end of the support rod body and is an open end for allowing the electrode introduction assembly to move into or out of the accommodating groove. The present solution can solve the problem in the prior art that an electrode introduction structure needs to be removed from a furnace opening during maintenance.

Description

wafer carrier support rod, electrode introduction assembly and semiconductor processing equipment Technical Field

[0001] This application relates to the field of semiconductor manufacturing, specifically to a wafer carrier boat support rod, an electrode introduction assembly, and semiconductor processing equipment. Background Technology

[0002] One step in the solar silicon wafer manufacturing process is the fabrication of an anti-reflective coating using plasma-enhanced chemical vapor deposition (PECVD) to improve the light conversion efficiency of solar cells. Currently, the mainstream coating process in the photovoltaic market uses tubular single-boat PECVD equipment. However, with technological advancements and increasing capacity requirements, dual-boat and multi-boat PECVD equipment represents the main future development direction for matching equipment capacity.

[0003] In existing dual-boat PECVD equipment, one of the two substrate boats (i.e., graphite boats) adjacent to the furnace tail end is electrically connected to the RF power supply via two electrode rods, while the other adjacent to the furnace mouth end is electrically connected to two other electrode rods via an electrode introduction structure. These two electrode rods are fixed to the furnace door at the furnace mouth end and are also electrically connected to the RF power supply. After a period of use in high-temperature and coating environments, process films may adhere to the electrode introduction structure, potentially causing poor contact or even short circuits between the electrode introduction structure and the substrate boat's feet, affecting process performance. Therefore, regular maintenance of the electrode introduction structure is necessary. However, maintenance requires disassembling the electrode introduction structure from the furnace mouth, necessitating cooling of the process chamber and pausing the equipment's automation system before disassembly. These operations lead to excessively long maintenance times, reduced throughput, and an increased probability of damage to quartz components within the process chamber, such as the quartz chamber itself. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer carrier boat support rod, an electrode introduction assembly, and a semiconductor processing equipment, which can solve the problem that the electrode introduction structure needs to be disassembled from the furnace opening during maintenance in the prior art.

[0005] To achieve the purpose of this application, a wafer carrier support rod is provided, which is applied to semiconductor processing equipment and includes an insulated support rod body; the peripheral side of the support rod body is provided with a receiving groove for receiving the electrode introduction assembly of the semiconductor processing equipment;

[0006] One end of the receiving groove extends to the first end of the support rod body and is an open end, for the electrode introduction assembly to be moved into or out of the receiving groove.

[0007] In some embodiments, the support rod body is tubular, and the tubular support rod body has a through groove extending through the thickness of the tube wall, with one end of the through groove extending to the first end of the support rod body; the portion of the space enclosed by the tube wall corresponding to the through groove constitutes the receiving groove.

[0008] In some embodiments, the support rod body includes a first rod portion and a second rod portion connected in sequence, the end of the first rod portion away from the second rod portion is the first end of the support rod body, and the receiving groove is formed in the first rod portion.

[0009] In some embodiments, the second rod portion includes a rod portion body and a first insulating support tube sleeved around the rod portion body.

[0010] In some embodiments, the second rod portion further includes at least two second insulating support tubes, which are sleeved around the rod portion body and respectively disposed on both sides of the first insulating support tube to define the position of the first insulating support tube in the extension direction of the rod portion body.

[0011] The outer diameter of the second insulating support tube is smaller than the outer diameter of the first insulating support tube.

[0012] As another technical solution, this application also provides an electrode introduction assembly adapted to the above-mentioned wafer carrier support rod provided in this application. The electrode introduction assembly is used to be disposed in the receiving groove and includes a conductive support structure and an electrode introduction structure, wherein...

[0013] The conductive support structure has a support surface that extends from the opening of the receiving groove and is used to support and electrically contact the substrate boat; one end of the electrode introduction structure is electrically connected to the conductive support structure, and the length of the electrode introduction structure in the extending direction of the receiving groove is greater than the length of the receiving groove in the extending direction.

[0014] In some embodiments, the conductive support structure is configured to allow the support surface to rotate adaptively under the gravity of the slide boat.

[0015] In some embodiments, the conductive support structure includes a first conductive support member and a second conductive support member, the support surface being disposed on the first conductive support member; the second conductive support member is electrically connected to one end of the electrode introduction structure;

[0016] One of the first conductive support and the second conductive support is provided with a spherical convex surface, and the other is provided with a spherical concave surface. The spherical convex surface and the spherical concave surface cooperate to enable the support surface to rotate adaptively under the gravity of the carrier boat.

[0017] In some embodiments, the conductive support structure further includes an insulating support base, wherein the insulating support base is provided with a connection channel, and the connection channel is provided with a first opening and a second opening on the top surface of the insulating support base and the side surface near the electrode introduction structure, respectively.

[0018] The second conductive support is disposed in the connection channel, and a portion of the second conductive support extends out from the first opening. One of the spherical convex surface and the spherical convex surface is disposed on the extended portion of the second conductive support. The second conductive support is electrically connected to the electrode introduction structure through the second opening.

[0019] The first conductive support is disposed above the insulating support base, and the other of the spherical convex surface is disposed at the bottom of the first conductive support.

[0020] In some embodiments, the top surface of the insulating support is provided with a limiting groove, and the first opening is provided at the bottom surface of the limiting groove; a portion of the first conductive support is provided in the limiting groove, and there is a gap between the first conductive support and the bottom surface of the limiting groove.

[0021] In some embodiments, the electrode introduction structure includes a conductive rod and an insulating tube sleeved on the conductive rod;

[0022] The conductive rod extends into the connection channel through the second opening and is electrically connected to the second conductive support.

[0023] In some embodiments, a portion of the insulating support extends from the opening of the receiving groove, and the side of the insulating support opposite to the electrode introduction structure is used to abut against the end face of the receiving groove away from the open end.

[0024] The side of the insulating support facing the electrode introduction structure abuts against one end of the insulating tube.

[0025] In some embodiments, the lower end of the second conductive support is provided with a connecting protrusion, and the outer peripheral dimension of the connecting protrusion is smaller than the outer peripheral dimension of the second conductive support, so as to form a stepped surface at the lower end of the second conductive support.

[0026] The outer peripheral surface of the conductive rod abuts against the stepped surface to support the second conductive support member. The outer peripheral surface of the conductive rod is provided with a connecting recess, and the connecting protrusion is located in the connecting recess. The outer peripheral surface of the connecting protrusion cooperates with the inner peripheral surface of the connecting recess.

[0027] In some embodiments, the insulating tube includes a first insulating tube and a second insulating tube sleeved around the periphery of the first insulating tube. The walls of both the first and second insulating tubes have axially extending seams, and the seams of the first and second insulating tubes are staggered in the circumferential direction.

[0028] In some embodiments, the electrode introduction assembly further includes an insulating support structure for covering the electrode introduction structure.

[0029] In some embodiments, the insulating support structure includes a plurality of support blocks, which abut against each other sequentially along the extending direction of the receiving groove;

[0030] The plurality of support blocks include at least one first support block and at least one second support block, wherein the first support block is used to support the slide boat; the second support block is lower than the support surface of the first support block, and the second support block is used to define the position of the first support block along the extension direction of the receiving groove.

[0031] As another technical solution, this application also provides a semiconductor processing apparatus, including a process chamber and a first cavity door and a second cavity door disposed on both sides of the cavity of the process chamber, wherein the first cavity door is openable and closable, and further including at least two wafer boat support rods and at least two electrode introduction assemblies, wherein the wafer boat support rods are the wafer boat support rods provided in this application, and the electrode introduction assemblies are the electrode introduction assemblies provided in this application, and each of the electrode introduction assemblies is accommodated in the receiving groove of each of the wafer boat support rods;

[0032] The second cavity door is connected to the first end of each of the support rod bodies; the second end of each of the support rod bodies away from the first end is connected to the side of the cavity where the first cavity door is located.

[0033] In some embodiments, the second cavity is provided with at least two inlets for at least two of the electrode introduction components to pass through respectively, and at least two electrode connection components are also provided on the outside of the second cavity, each of the electrode connection components being used to electrically connect each of the electrode introduction components to the radio frequency power supply respectively.

[0034] In some embodiments, the electrode connection assembly includes a connector structure, which is sealed to the second cavity at a position corresponding to the inlet for sealing the inlet, and a first hollow portion is provided on the surface of the connector structure relative to the inlet, wherein a heat insulation structure is provided in the first hollow portion.

[0035] In some embodiments, the heat insulation structure includes a plurality of heat insulation plates spaced apart along the extension direction of the support rod body, and at least one fastener that passes through the plurality of heat insulation plates along the extension direction of the support rod body and is fixedly connected to the connecting seat structure.

[0036] Each of the fasteners is fitted with a spacer between each pair of adjacent heat insulation plates and between the heat insulation plate and the connecting seat structure.

[0037] In some embodiments, the electrode connection assembly further includes a conductive connector;

[0038] The connector structure also includes a second hollow portion, one end of which communicates with the first hollow portion, and the other end extends to the surface of the connector structure opposite to the inlet. The conductive connector passes through the second hollow portion, one end of which extends into the first hollow portion and has a blind hole. The other end of the conductive connector is used for electrical connection with the radio frequency power supply. One end of the electrode introduction assembly is inserted into the blind hole, and an axial gap is left between it and the blind end of the blind hole. The portion of the electrode introduction assembly inserted into the blind hole is in electrical contact with the hole wall of the blind hole.

[0039] In some embodiments, the electrode connection assembly further includes an insulating sleeve disposed in the second hollow portion and with one end extending into the first hollow portion. The insulating sleeve is fitted around the conductive connector to electrically insulate the conductive connector from the connector structure.

[0040] In some embodiments, the electrode introduction structure includes a conductive rod and an insulating tube sleeved on the conductive rod; the insulating tube includes a first insulating tube and a second insulating tube sleeved around the periphery of the first insulating tube;

[0041] One end of the first insulating tube abuts against the insulating sleeve; a portion of the second insulating tube is fitted onto the portion of the insulating sleeve that extends into the first hollow portion.

[0042] This application has the following beneficial effects:

[0043] The wafer carrier support rod provided in this application has an insulated support rod body with a accommodating groove on its periphery for accommodating an electrode introduction assembly of a semiconductor processing equipment. This allows the electrode introduction assembly to extend from the groove opening, supporting and electrically contacting the wafer carrier, thereby enabling electrical connection between the wafer carrier and the radio frequency power supply. Furthermore, by extending one end of the accommodating groove to the first end of the support rod body, and making it an open end, the electrode introduction assembly can be moved in or out of the accommodating groove. This allows for the replacement of the electrode introduction assembly by pulling it out from the first end of the support rod body and inserting a new electrode introduction assembly into the accommodating groove. This replacement can be achieved through an inlet provided on the cavity door (e.g., the furnace door at the furnace tail end), eliminating the need for disassembly from the furnace opening, cooling of the process chamber, and suspension of the equipment's automation system, thus shortening maintenance time and increasing production capacity. Moreover, since cooling of the process chamber is unnecessary, quartz components such as the quartz cavity within the process chamber do not experience drastic temperature changes, reducing the probability of damage.

[0044] The electrode introduction assembly provided in this application is adapted to the wafer carrier support rod provided in this application. It is disposed in the receiving groove of the wafer carrier support rod and includes a conductive support structure and an electrode introduction structure. The conductive support structure has a support surface that extends from the opening of the receiving groove to support and electrically contact the wafer carrier. One end of the electrode introduction structure is electrically connected to the conductive support structure. The length of the electrode introduction structure in the extending direction of the receiving groove is greater than the length of the receiving groove in the extending direction. This not only enables the electrode introduction structure to electrically connect the supported wafer carrier to the radio frequency power supply through the conductive support structure, but also allows the electrode introduction assembly to be pulled out from the first end of the support rod body from the receiving groove, and a new electrode introduction assembly to be inserted into the receiving groove from the first end of the support rod body. This allows for the replacement of the electrode introduction assembly. This replacement method can be achieved through the inlet provided on the cavity door (e.g., the furnace door at the furnace tail end), thus eliminating the need for disassembly from the furnace opening, cooling of the process chamber, and suspension of the equipment's automation system. This reduces maintenance time and increases production capacity. Moreover, since there is no need to cool the process chamber, the quartz components in the process chamber, such as the quartz cavity, do not experience drastic temperature changes, reducing the probability of damage.

[0045] The semiconductor processing equipment provided in this application, by adopting the aforementioned wafer carrier support rod and electrode introduction assembly, can replace the electrode introduction assembly without disassembling it from the furnace opening, without cooling the process chamber, and without pausing the equipment's automation system, thereby shortening maintenance time and increasing production capacity. Attached Figure Description

[0046] Figure 1 is a structural diagram of the semiconductor processing equipment provided in an embodiment of this application at one angle when the cavity is not shown;

[0047] Figure 2 is a structural diagram of the semiconductor processing equipment provided in the embodiment of this application from another angle when the cavity is not shown;

[0048] Figure 3 is a structural diagram of a semiconductor processing apparatus provided in an embodiment of this application when the cavity and wafer carrier are not shown;

[0049] Figure 4 is a partial structural diagram of the support rod body used in the embodiment of this application;

[0050] Figure 5 is an exploded view of the support rod body provided in the embodiment of this application during the process of the electrode introduction assembly being pulled out of the receiving groove;

[0051] Figure 6 is an enlarged view of region I in Figure 5;

[0052] Figure 7 is a cross-sectional view of the electrode introduction assembly used in the embodiments of this application;

[0053] Figure 8 is an enlarged view of region II in Figure 7;

[0054] Figure 9 is an enlarged view of region III in Figure 7;

[0055] Figure 10 is a partial enlarged view of the electrode introduction component and the conductive support structure used in the embodiments of this application;

[0056] Figure 11 shows four radial cross-sectional views at the four feet of the first substrate boat when the support rod body and electrode introduction assembly used in the embodiment of this application support the four feet of the first substrate boat.

[0057] Figure 12 is another structural diagram of the semiconductor processing equipment provided in the embodiment of this application when the cavity and wafer carrier are not shown;

[0058] Figure 13 is a partial cross-sectional view of the semiconductor processing equipment provided in the embodiment of this application at the inlet;

[0059] Figure 14 is an enlarged view of region IV in Figure 13;

[0060] Figure 15 is a partial cross-sectional view of the connecting seat structure used in the embodiment of this application. Detailed Implementation

[0061] To enable those skilled in the art to better understand the technical solutions of this application, the following detailed description of the wafer carrier support rod, electrode introduction assembly, and semiconductor processing equipment provided in this application is provided in conjunction with the accompanying drawings.

[0062] This application provides a wafer carrier boat support rod for use in semiconductor processing equipment, such as a Plasma Enhanced Chemical Vapor Deposition (PECVD) device. This PECVD device can be a single-boat PECVD device, or a dual-boat or multi-boat PECVD device. Referring to Figures 1 and 2, the PECVD device mainly includes a process chamber for providing a vacuum process environment. The chamber body (not shown in the figures) is, for example, a quartz tube. The quartz tube can be horizontal or vertical. A first chamber door 101 and a second chamber door 102 are respectively provided at both ends along its axial direction (e.g., parallel to the horizontal plane) to seal the internal space of the quartz tube, forming a sealed space. Furthermore, the first chamber door 101 (also known as the furnace door at the furnace opening end) is sealed to the quartz tube, for example, through the furnace opening flange 103, and the first chamber door 101 is configured to be openable and closable to open or close the furnace opening. When the furnace opening is open, the wafer carrier boat 104 can be moved from the furnace opening into the process tube or from the process tube.

[0063] The wafer carrier boat support rod 200 provided in this embodiment is used for installation in the aforementioned process chamber. Referring to Figures 3 and 4, and in conjunction with Figures 1 and 2, the wafer carrier boat support rod 200 includes an insulated support rod body 201. This support rod body 201 is made of an insulating material with good load-bearing capacity, such as silicon. The support rod body 201 is used to support at least one wafer carrier boat 104 in the process chamber. Each wafer carrier boat 104 typically has four feet, which are located, for example, at the four corners of the rectangular outline of the wafer carrier boat 104. In this case, two support rod bodies 201 need to be installed in the process chamber. The two support rod bodies 201 are arranged opposite each other in a direction parallel to the horizontal plane to jointly support at least one wafer carrier boat 104; that is, each support rod body 201 is used to directly or indirectly support two of the feet of the wafer carrier boat 104. Figures 1 and 2 show two support rod bodies 201 used to jointly support two sheet carrier boats 104. The two sheet carrier boats 104 are arranged sequentially along the extension direction of the support rod bodies 201 (i.e., the axial direction of the support rod bodies 201). The sheet carrier boat 104 closer to the first cavity door 101 is the first sheet carrier boat 104a, and the sheet carrier boat 104 closer to the second cavity door 102 (also known as the furnace door at the tail end of the furnace) is the second sheet carrier boat 104b. However, the embodiments of this application are not limited to this. In practical applications, the two support rod bodies 201 can also be used to jointly support one sheet carrier boat 104, or three or more sheet carrier boats 104. In addition, depending on the specific structure of the wafer carrier in practice, the number of support rod bodies 201 installed in the process chamber can be three, four or more. At least one wafer carrier can be supported by two support rod bodies 201, or by three, four or more support rod bodies 201. Furthermore, when at least one wafer carrier is supported by two support rod bodies 201, four, six or more even numbers of support rod bodies 201 can also be provided, with each pair of adjacent support rod bodies 201 supporting at least one wafer carrier. This application embodiment does not limit this.

[0064] Referring to Figure 4, a receiving groove 201a is formed on the periphery of the support rod body 201 for accommodating the electrode introduction assembly 202 of the semiconductor processing equipment. One end of the receiving groove 201a extends to the first end 201b of the support rod body 201 and is an open end, allowing the electrode introduction assembly 202 to move into or out of the receiving groove 201a. Since one end of the receiving groove 201a extends to the first end of the support rod body 201 and is an open end, the receiving groove 201a communicates with the outside of the support rod body 201 on the periphery and at the first end 201b.

[0065] In some embodiments, the support rod body 201 is tubular, and the tubular support rod body 201 has a hollow space (i.e., the space surrounded by the tube wall) extending through its axial direction. A through groove penetrating the thickness of the tube wall is formed in the tube wall of the tubular support rod body 201, and one end of the through groove extends to the first end 201b of the support rod body 201. The portion of the hollow space (i.e., the space surrounded by the tube wall) corresponding to the through groove constitutes the aforementioned receiving groove 201a. The tubular support rod body 201 only needs to be machined with the aforementioned through groove to form the receiving groove 201a, making processing more convenient. Of course, in practical applications, the support rod body 201 can also be partially tubular, that is, only the portion corresponding to the through groove is tubular, while the remaining portion is a solid column.

[0066] As shown in Figures 2 and 3, taking the installation of two support rod bodies 201 in the process chamber as an example, the receiving grooves 201a of the two support rod bodies 201 are respectively used to receive two electrode introduction assemblies 202, and the openings of the receiving grooves 201a of the two support rod bodies 201 face upwards. Each electrode introduction assembly 202 has a contact end and a connection end. The contact end of each electrode introduction assembly 202 extends from the opening of the receiving groove 201a it belongs to, and is used to support and electrically contact one of the wafer carriers 104. A first foot 1041; the first foot 1041 refers to the foot among the four feet of the substrate boat 104 that is supported and electrically contacted by the contact end of the electrode introduction assembly 202. The first foot 1041 is conductive, so that a portion of the substrate boat 104 is electrically connected to the contact end of one electrode introduction assembly 202 through one of the first foot 1041, and another portion of the substrate boat 104 is electrically connected to the contact end of another electrode introduction assembly 202 through the other first foot 1041. By extending one end of the receiving groove 201a to the first end of the support rod body 201, and making it an open end, the connection ends of the two electrode introduction assemblies 202 can extend from the first end 201b of the support rod body 201 and be electrically connected to the positive and negative terminals of the RF power supply, respectively, thereby realizing that the two first feet 1041 are electrically connected to the positive and negative terminals of the RF power supply, respectively.

[0067] Specifically, each wafer carrier 104 includes multiple wafers (graphite wafers) arranged sequentially along a direction perpendicular to the extension direction of the support rod body 201, with a certain interval between each pair of adjacent wafers. A wafer (e.g., a silicon wafer) is carried on either side of this interval between each pair of adjacent wafers. Furthermore, the multiple wafers are divided into two groups, with each pair of adjacent wafers located in different groups. That is, wafers with odd-numbered sequences are located in one group, while wafers with even-numbered sequences are located in the other group. Based on this, as shown in Figure 1, the wafer carrier 104 has electrical connection structures 107 on both sides of the extension direction of the support rod body 201. These two electrical connection structures 107 are used to electrically connect each wafer in the two groups, respectively, while different groups of wafers are not electrically connected. As shown in Figure 2, the two first boat feet 1041 are electrically connected to the two electrical connection structures 107 respectively, or the two first boat feet 1041 are electrically connected to one of the electrical connection structures 107, so that the two first boat feet 1041 are electrically connected to the boat pieces in the two sets of boat pieces respectively. The specific structure of the electrical connection structure 107 that realizes the above function is well known in the art and will not be described in detail here.

[0068] Furthermore, for a substrate carrier 104 having two aforementioned first boat feet 1041, taking the first substrate carrier 104a near the first cavity gate 101 shown in FIG2 as an example, its two first boat feet 1041 are respectively supported by the contact ends of the electrode introduction assembly 202 on the two support rod bodies 201, that is, the two support rod bodies 201 indirectly support the two first boat feet 1041. The other two boat feet of the first substrate carrier 104a besides the first boat feet 1041 (hereinafter referred to as the second boat feet 1042) are directly supported by the two support rod bodies 201, or by corresponding components on the two support rod bodies 201 (described in detail below), but electrically insulated. If the two support rod bodies 201 are used to support two wafer carrier boats 104, taking the first wafer carrier boat 104a and the second wafer carrier boat 104b shown in Figure 2 as examples, two of the four boat feet of the first wafer carrier boat 104a are first boat feet 1041, which are supported and electrically contacted by the contact ends of the two electrode introduction components 202, respectively. The other two are second boat feet 1042, which are directly supported by the two support rod bodies 201, respectively. All four boat feet of the second wafer carrier boat 104b are second boat feet 1042, which are all supported by corresponding components on the two support rod bodies 201 (described in detail later), but are electrically insulated.

[0069] As shown in Figure 6, by extending one end of the receiving groove 201a to the first end 201b of the support rod body 201, and making it an open end, the electrode introduction assembly 202 can be moved into or out of the receiving groove 201a from the first end 201b of the support rod body 201. When both support rod bodies 201 are installed in the process chamber, the electrode introduction assembly 202 can move relative to the support rod body 201 along its extension direction. In this way, the electrode introduction assembly 202 can be pulled out of the receiving groove 201a from the first end 201b of the support rod body 201. Figure 6 illustrates the process of pulling the electrode introduction assembly 202 out of the receiving groove 201a. After being pulled out, the new electrode introduction assembly 202 is inserted into the receiving groove 201a from the first end 201b of the support rod body 201, thus replacing the electrode introduction assembly 202. This replacement method can be achieved through the inlet 108 (as shown in Figure 13) provided on the second chamber door 102 (i.e., the furnace door at the tail end of the furnace), thereby eliminating the need for disassembly from the furnace opening, cooling of the process chamber (to open the first chamber door 101), and pausing the equipment's automation system, thereby shortening maintenance time and increasing production capacity. Moreover, since there is no need to cool the process chamber, the quartz components in the process chamber, such as the quartz cavity, do not experience drastic temperature changes, reducing the probability of damage.

[0070] It is easy to understand that when the support rod body 201 is installed in the process chamber, the first end 201b of the support rod body 201 is correspondingly provided with the inlet 108 on the second chamber door 102 (i.e. the furnace door at the tail end of the furnace) so that the electrode introduction assembly 202 can be pulled out from the receiving groove 201a through the inlet 108 and pulled out to the outside of the process chamber.

[0071] For a slide carrier 104 having two first slide carriers 1041 as described above, taking the first slide carrier 104a near the first cavity gate 101 shown in FIG2 as an example, its two first slide carriers 1041 are respectively supported by the contact ends of the electrode introduction assembly 202 on the two support rod bodies 201, that is, the two support rod bodies 201 indirectly support the two first slide carriers 1041. The two second boat feet 1042 of the first substrate carrier 104a are directly supported by two support rod bodies 201. In this case, as shown in FIG3, in some embodiments, the structures of the two support rod bodies 201 are different. Specifically, the lengths of the receiving grooves 201a on the two support rod bodies 201 are different. This allows the contact ends of the two electrode introduction assemblies 202 respectively provided in the receiving grooves 201a on the two support rod bodies 201 to be in different positions on the support rod bodies 201. For example, in FIG3, the contact end of the electrode introduction assembly 202 located on the right is closer to the first cavity gate 101 than the contact end of the electrode introduction assembly 202 located on the left. This can be applied to the case where the two first boat feet 1041 of the first substrate carrier 104a are distributed on the diagonal of the rectangular outline of the first substrate carrier 104a, that is, one of the two first boat feet 1041 is closer to the first cavity gate 101 than the other.

[0072] In the above configuration, the two second feet 1042 of the first substrate carrier 104a are also distributed along the diagonal of the rectangular outline of the first substrate carrier 104a. The support rod body 201 on the left in Figure 3 is used to directly support one of the second feet 1042 of the first substrate carrier 104a, while the support rod body 201 on the right is supported by a corresponding component (described in detail below) and electrically insulates the other second foot 1042 of the first substrate carrier 104a. Thus, by using two support rod bodies 201 of different lengths in the receiving groove 201a to jointly support the first substrate carrier 104a, the situation where the two first feet 1041 of the first substrate carrier 104a are distributed along the diagonal of the rectangular outline of the first substrate carrier 104a can be applied. Based on supporting the four feet of the first substrate carrier 104a, the two first feet 1041 of the first substrate carrier 104a are electrically connected to the positive and negative terminals of the radio frequency power supply through two electrode introduction components 202, respectively. In addition, the four feet of the second carrier boat 104b are all second boat feet 1042, and are supported by corresponding parts on the two support rod bodies 201 (described in detail below) and are electrically insulated.

[0073] In some other embodiments, as shown in FIG12, the two support rod bodies 201 have the same structure. Specifically, the receiving grooves 201a on the two support rod bodies 201 have the same length. This allows the contact ends of the two electrode introduction components 202 respectively provided in the receiving grooves 201a on the two support rod bodies 201 to be in the same position on the support rod bodies 201. For example, in FIG12, the contact ends of the two electrode introduction components 202 are at the same distance from the first cavity gate 101. This can be applied to the case where the two first boat feet 1041 of the first substrate boat 104a are distributed on the edge line of the rectangular outline of the substrate boat 104, that is, the two first boat feet 1041 are at the same distance from the first cavity gate 101 and are far away from the first cavity gate 101 relative to the two second boat feet 1042.

[0074] In the above scenario, the two second feet 1042 of the first wafer carrier 104a are also distributed along the edge of the rectangular outline of the first wafer carrier 104a. In Figure 12, the two support rod bodies 201 are used to directly support and electrically insulate the two second feet 1042 of the first wafer carrier 104a near the first cavity door 101. Thus, by using two support rod bodies 201 of the same length as the receiving groove 201a to jointly support the first wafer carrier 104a, the situation where the two first feet 1041 of the first wafer carrier 104a are distributed along the edge of the rectangular outline of the first wafer carrier 104a can be applied. Based on supporting the four feet of the first wafer carrier 104a, the two first feet 1041 of the first wafer carrier 104a are electrically connected to the positive and negative terminals of the radio frequency power supply through the two electrode introduction components 202, respectively. In addition, the four feet of the second carrier boat 104b are all second boat feet 1042, and are supported by corresponding parts on the two support rod bodies 201 (described in detail below) and are electrically insulated.

[0075] As shown in Figure 3, the two support rod bodies 201 with different lengths of receiving groove 201a each include a first rod portion and a second rod portion connected in sequence. The end of the first rod portion away from the second rod portion is the first end 201b of the support rod body 201, and the receiving groove 201a is formed in this first rod portion. It is easy to understand that the two support rod bodies 201 with different lengths of receiving groove 201a have different lengths of their second rod portions. Furthermore, the longer second rod portion is used to directly support and electrically insulate one of the second boat feet 1042 of the first carrier boat 104a, while the shorter second rod portion does not support the boat foot.

[0076] As shown in Figure 12, the two support rod bodies 201 of the same length in the receiving groove 201a have the same length of the second rod part, and are used to directly support the two second boat feet 1042 of the first carrier boat 104a.

[0077] The second rod portion used to directly support and electrically insulate the second boat foot 1042 includes, for example, a rod body and a first insulating support tube 206 sleeved around the rod body. The first insulating support tube 206, for example, is a ceramic tube used to directly support and electrically insulate the second boat foot 1042. In some embodiments, to ensure the levelness of the wafer boat, the support surface of the first insulating support tube 206 is flush with the contact end of the electrode introduction assembly 202.

[0078] Furthermore, in some embodiments, the second rod portion used to directly support and electrically insulate the second boat foot 1042 further includes at least two second insulating support tubes 207, such as ceramic tubes. The at least two second insulating support tubes 207 are sleeved around the rod body and respectively disposed on both sides of the first insulating support tube 206, defining the position of the first insulating support tube 206 in the extending direction of the rod body. This prevents the first insulating support tube 206 from shifting along the extending direction of the second rod portion, thereby ensuring that the corresponding second boat foot 1042 can smoothly contact the first insulating support tube 206. In some embodiments, the outer diameter of the second insulating support tube 207 is smaller than the outer diameter of the first insulating support tube 206 to reduce costs.

[0079] As shown in Figure 12, the two support rod bodies 201 with the same length in the receiving groove 201a have the same structure and function of the second rod part as the longer second rod part in Figure 3, which will not be described again here.

[0080] In addition, in some embodiments, as shown in FIG3, the second rod portion that does not support the boat foot may include a rod body and a second insulating support tube 207 sleeved around the rod body. The second insulating support tube 207 is used to protect the rod body and limit the electrode introduction assembly 202.

[0081] In summary, the wafer carrier support rod 200 provided in this application embodiment has an insulated support rod body 201 with a accommodating groove 201a on its periphery for accommodating the electrode introduction component 202 of the semiconductor processing equipment, so that the electrode introduction component 202 can extend from the groove opening of the accommodating groove 201a, support and electrically contact the wafer carrier, thereby realizing the electrical connection of the wafer carrier to the radio frequency power supply. Based on this, by extending one end of the receiving groove 201a to the first end 201b of the support rod body 201, and making it an open end, the electrode introduction assembly 202 can be moved into or out of the receiving groove 201a. In this way, the electrode introduction assembly 202 can be pulled out of the receiving groove 201a from the first end 201b of the support rod body 201, and a new electrode introduction assembly 202 can be inserted into the receiving groove 201a from the first end 201b of the support rod body 201, thus enabling the replacement of the electrode introduction assembly 202. This replacement method can be achieved through an inlet provided on the cavity door (e.g., the furnace door at the furnace tail end), thus eliminating the need for disassembly from the furnace opening, cooling of the process chamber, and suspension of the equipment's automation system, thereby shortening maintenance time and increasing production capacity. Moreover, since there is no need to cool the process chamber, quartz components such as the quartz cavity in the process chamber do not experience drastic temperature changes, reducing the probability of damage.

[0082] As another technical solution, as shown in Figures 3, 5, and 7, this application embodiment also provides an electrode introduction assembly 202, which is adapted to the wafer carrier boat support rod 200 provided in this application embodiment. The electrode introduction assembly 202 is used to be disposed in the receiving groove 201a and includes a conductive support structure 203 and an electrode introduction structure 204. As shown in Figure 8, the conductive support structure 203 has a support surface 2031a that serves as the contact end, that is, the support surface 2031a is used to support and electrically contact the wafer carrier boat 104 (i.e., the first boat foot 1041). One end of the electrode introduction structure 204 is electrically connected to the conductive support structure 203, and the length of the electrode introduction structure 204 in the extending direction of the receiving groove 201a is greater than the length of the receiving groove 201a in its extending direction. This allows the other end of the electrode introduction structure 204 to extend from the open end of the receiving groove 201a, so that it can be used as the connection end of the electrode introduction assembly 202 and electrically connected to the positive or negative terminal of the radio frequency power supply.

[0083] In existing technologies, the electrode introduction structure involves introducing two transmission rods from the cavity gate into the process chamber. Each transmission rod makes electrical contact with the corresponding foot of the wafer carrier boat via an electrode block. However, since the electrode block is clamped onto the transmission rod, it is prone to deflection relative to the transmission rod during use, resulting in angular deflection of the electrode block. This causes a gap at the contact point between the electrode block and the foot after the foot of the wafer carrier boat is placed on the deflected electrode block. This gap can also generate a process film on the exposed surface of the electrode block during processing, causing abnormal radio frequency transmission and preventing the wafer carrier boat from performing the process normally. Consequently, the reliability and stability of the electrode introduction structure are low. Moreover, abnormal radio frequency transmission requires cooling and shutdown for maintenance, severely impacting production schedules. To address this technical problem, in some embodiments, the conductive support structure 203 is configured to allow the support surface 2031a to adaptively rotate under the gravity of the wafer carrier boat 104, so that the support surface 2031a fits against the corresponding first foot 1041. Specifically, when the corresponding first boat foot 1041 is placed on the support surface 2031a, the support surface 2031a will adaptively rotate under the gravity of the carrier boat 104, thereby adapting to the positional changes of the first boat foot 1041. This ensures that the support surface 2031a and the first boat foot 1041 always remain in close contact without any gaps. This avoids the gap problem at the contact point between the electrode block and the boat foot caused by the angular deflection of the electrode block in the prior art, increases the effective contact area, and prevents problems such as abnormal radio frequency transmission and coating caused by gaps. This not only improves the reliability and stability of the electrode introduction device but also extends the service life of the conductive support structure 203, reduces the frequency of cooling down and maintenance, and increases production capacity.

[0084] In some embodiments, in order to enable the support surface 2031a to rotate adaptively under the gravity of the slide boat 104, as shown in FIG8, the conductive support structure 203 includes a first conductive support member 2031 and a second conductive support member 2034, both of which are made of conductive material. The support surface 2031a is disposed on the first conductive support member 2031; the second conductive support member 2034 is electrically connected to one end of the electrode introduction structure 204; one of the first conductive support member 2031 and the second conductive support member 2034 is provided with a spherical convex surface 2034b, and the other is provided with a spherical concave surface 2032c. The spherical convex surface 2034b and the spherical concave surface 2032c cooperate to enable the support surface 2031a to rotate adaptively under the gravity of the slide boat 104. The combination of the aforementioned spherical convex surface 2034b and spherical concave surface 2032c forms a spherical universal connection structure between the first conductive support 2031 and the second conductive support 2034. When the corresponding first boat foot 1041 is placed on the support surface 2031a on the first conductive support 2031, the first conductive support 2031 can deflect at any angle in the circumferential direction under the gravity of the carrier boat 104, thereby adapting to the positional changes of the first boat foot 1041 so that the support surface 2031a and the first boat foot 1041 always remain in contact. In one example, the first conductive support 2031 is flat, and the second conductive support 2034 is cylindrical. In this case, the top surface of the first conductive support 2031 is the support surface 2031a, and a spherical concave surface 2032c is provided at the center of the bottom of the first conductive support 2031. The second conductive support 2034 is vertically arranged, and its top end is provided with a spherical convex surface 2034b. The spherical convex surface 2034b cooperates with the spherical concave surface 2032c so that the support surface 2031a on the first conductive support 2031 can tilt at any angle in the circumferential direction. Further, in some embodiments, the conductive support structure 203 also includes an angle limiting structure (described in detail below). This angle limiting structure is used to limit the extreme position of the first conductive support 2031 tilting at any angle in the circumferential direction, so as to prevent the first conductive support 2031 from tilting too much and causing the first boat foot 1041 to be unable to be placed smoothly on the support surface 2031a.

[0085] In some embodiments, as shown in Figures 8 and 10, the conductive support structure 203 further includes an insulating support 2032, which is made of ceramic, for example. In some embodiments, a portion of the insulating support 2032 extends from the opening of the receiving groove 201a, and the side 2032d of the insulating support 2032 facing away from the electrode introduction structure 204 abuts against the end face of the receiving groove 201a away from its open end, while the side 2032b of the insulating support 2032 facing the electrode introduction structure 204 abuts against one end of the electrode introduction structure 204. In this way, the position of the insulating support 2032 in the extending direction of the support rod body 201 can be defined, preventing it from shifting along the extending direction of the support rod body 201, thereby ensuring that the corresponding first boat foot 1041 can smoothly contact the support surface 2031a.

[0086] As shown in Figure 8, the insulating support 2032 is provided with a connecting channel 2033. The connecting channel 2033 has a first opening on the top surface of the insulating support 2032 and a second opening on the side surface 2032b near the electrode introduction structure 204. A second conductive support 2034 is disposed in the connecting channel 2033, with a portion of the second conductive support 2034 extending from the first opening. A spherical convex surface 2034b is disposed on the extended portion of the second conductive support 2034. The second conductive support 2034 is electrically connected to the electrode introduction structure 204 through the second opening. A first conductive support 2031 is disposed above the insulating support 2032, and a spherical concave surface 2032c is disposed at the bottom of the first conductive support 2031 and mates with it. Alternatively, in practical applications, the spherical concave surface 2032c can be disposed on the extended portion of the second conductive support 2034, and the spherical convex surface 2034b can be disposed on the bottom of the first conductive support 2031.

[0087] As can be seen from the above, the connection channel 2033 is used to accommodate the lower part of the second conductive support 2034, a part of the electrode introduction structure 204, and the connection between the two, to prevent arcing between these parts and the carrier boat 104, thus preventing abnormal radio frequency discharge. Based on this, one of the spherical convex surface 2034b and spherical concave surface 2032c provided on the portion of the second conductive support 2034 extending from the first opening is used to cooperate with the other of the spherical convex surface 2034b and spherical concave surface 2032c on the bottom of the first conductive support 2031.

[0088] In some embodiments, the top surface of the insulating support 2032 is provided with a limiting groove 2032a, and a first opening is provided at the bottom surface of the limiting groove 2032a; a portion of the first conductive support 2031 is disposed in the limiting groove 2032a, and there is a gap between the first conductive support 2031 and the bottom surface of the limiting groove 2032a. The bottom surface of the limiting groove 2032a can prevent the tilted first conductive support 2031 from continuing to tilt. The limiting groove 2032a serves as the angle limiting structure to limit the extreme position of the first conductive support 2031 tilting at any angle in the circumferential direction, preventing the first conductive support 2031 from tilting too much and causing the first boat foot 1041 to be unable to be smoothly placed on the support surface 2031a. Of course, in practical applications, the angle limiting structure can also use other structures to limit the extreme position of the first conductive support 2031 tilting at any angle in the circumferential direction, and the embodiments of this application do not limit this.

[0089] One end of the electrode introduction structure 204 is electrically connected to the conductive support structure 203, and the other end serves as the connection end of the electrode introduction assembly 202 for electrical connection to the positive or negative terminal of the RF power supply, respectively. In some embodiments, as shown in Figures 7 to 9, the electrode introduction structure 204 includes a conductive rod 2041 and an insulating tube 2042 sleeved on the conductive rod 2041. One end of the conductive rod 2041 is electrically connected to the conductive support structure 203, and the other end serves as the connection end of the electrode introduction assembly 202 for electrical connection to the positive or negative terminal of the RF power supply. The insulating tube 2042 is sleeved on the conductive rod 2041 to prevent arcing between the conductive rod 2041 and the carrier boat 104, thus preventing abnormal RF discharge.

[0090] As shown in Figure 8, the conductive rod 2041 extends through the second opening into the connecting channel 2033 and is electrically connected to the second conductive support 2034. When the corresponding first boat foot 1041 contacts the support surface 2031a, it is electrically connected to the positive or negative terminal of the RF power supply sequentially through the first conductive support 2031, the second conductive support 2034, and the conductive rod 2041. In practical applications, the conductive rod 2041 can be a one-piece structure or a segmented structure; the segmented structure is more convenient to process and install.

[0091] Furthermore, in some embodiments, as shown in FIG8, the lower end of the second conductive support 2034 is provided with a connecting protrusion 2034a, and the outer peripheral dimension of the connecting protrusion 2034a is smaller than the outer peripheral dimension of the second conductive support 2034, so as to form a stepped surface at the lower end of the second conductive support 2034. Taking the second conductive support 2034 as a columnar shape as an example, the connecting protrusion 2034a is also columnar, and the outer diameter of the connecting protrusion 2034a is smaller than the outer diameter of the second conductive support 2034. The area surrounding the lower end face of the second conductive support 2034 on the outer peripheral surface of the connecting protrusion 2034a is the aforementioned stepped surface. The outer peripheral surface of the conductive rod 2041 abuts against the stepped surface to support the second conductive support 2034, and the outer peripheral surface of the conductive rod 2041 is provided with a connecting recess. The aforementioned connecting protrusion 2034a is located in the connecting recess, and the outer peripheral surface of the connecting protrusion 2034a cooperates with the inner peripheral surface of the connecting recess. This design allows for a tighter connection between the conductive rod 2041 and the second conductive support 2034, while also making disassembly easier. Furthermore, the mating of the outer circumferential surface of the connecting protrusion 2034a with the inner circumferential surface of the connecting recess solves the problem of threaded connections easily seizing at high temperatures. This avoids the need to replace both the conductive rod 2041 and the second conductive support 2034 due to their inability to be disassembled, thereby reducing usage costs.

[0092] In some embodiments, as shown in Figures 7 to 9, the insulating tube 2042 is, for example, a ceramic tube. The insulating tube 2042 includes a first insulating tube 2042b and a second insulating tube 2042a nested around the first insulating tube 2042b. Both the walls of the first insulating tube 2042b and the second insulating tube 2042a have axially extending seams (not shown in the figures), and the seams of the first insulating tube 2042b and the second insulating tube 2042a are staggered circumferentially. This avoids leakage at the seam of the first insulating tube 2042b and the second insulating tube 2042a, and more effectively prevents arcing between the conductive rod 2041 and the carrier boat 104, thus preventing abnormal radio frequency discharge. The seam of the first insulating tube 2042b and the second insulating tube 2042a is formed by bending the insulating material until its two ends are joined during processing. Of course, in practical applications, the first insulating tube 2042b and the second insulating tube 2042a can also be made into a seamless insulating tube 2042 using other processing methods.

[0093] In practical applications, the first insulating tube 2042b can be a one-piece structure or a segmented structure; the segmented structure is easier to process and install. The second insulating tube 2042a is preferably a one-piece structure to avoid leakage.

[0094] In some embodiments, the electrode introduction assembly 202 further includes an insulating support structure for covering the electrode introduction structure 204. The insulating support structure is the corresponding component in the above embodiments used to support and electrically insulate the second boat foot 1042. Based on this, since the insulating support structure is supported by the electrode introduction structure 204, when the electrode introduction assembly 202 is pulled out of or inserted into the receiving groove 201a from the first end 201b of the support rod body 201, the insulating support structure can be pulled out of or inserted into the receiving groove 201a together with the electrode introduction structure 204.

[0095] The insulating support structure that achieves the above functions can be of various types. For example, the insulating support structure includes multiple support blocks that abut against each other sequentially along the extension direction of the receiving groove 201a. As shown in Figures 3 and 5, the multiple support blocks include at least one first support block 208 and at least one second support block 205. The first support block 208 is used to support the second boat foot 1042. The second support block 205 is lower than the support surface of the first support block 208, and the second support block 205, together with the corresponding component located on the opposite side of the first support block 208 (e.g., other second support blocks 205, insulating support base 2032, or other first support blocks 208), defines the position of the first support block 208 along the extension direction of the receiving groove 201a to prevent it from shifting along the extension direction of the support rod body 201, thereby ensuring that the corresponding second boat foot 1042 can smoothly contact the top surface of the first support block 208. It is easy to understand that the position of each first support block 208 on the same support rod body 201 in the extending direction of the receiving groove 201a is determined according to the position of the corresponding second boat foot 1042. In this case, there may be a gap between two first support blocks 208, a gap between a first support block 208 and the insulating support seat 2032, and a gap between a first support block 208 and the first end 201b of the support rod body 201. By providing at least one second support block 205 in these gaps and adapting its total length to the length of the gap, the positioning of each first support block 208 can be achieved, thus restricting it to the position corresponding to the corresponding second boat foot 1042. In addition, by making the second support block 205 lower than the first support block 208, it can be ensured that the corresponding second boat foot 1042 is supported by the first support block 208.

[0096] In a specific embodiment, as shown in Figures 2 and 3, two support rod bodies 201 installed in the process chamber are used to jointly support two wafer carrier boats 104. The wafer carrier boat 104 closer to the first chamber door 101 is the first wafer carrier boat 104a, while the wafer carrier boat 104 closer to the second chamber door 102 (also known as the furnace door at the tail end of the furnace) is the second wafer carrier boat 104b. The first slide carrier 104a is a slide carrier 104 having two of the aforementioned first slide feet 1041, and its other two slide feet are second slide feet 1042. As shown in FIG11, among the four slide feet of the first slide carrier 104a, the second slide foot 1042 near the first cavity 101 is shown in FIG11 (A), the first slide foot 1041 near the first cavity 101 is shown in FIG11 (B), the first slide foot 1041 near the second cavity 102 is shown in FIG11 (C), and the second slide foot 1042 near the second cavity 102 is shown in FIG11 (D). Taking the upper part of Figure 11 as the side closer to the first cavity 101 and the lower part as the side closer to the second cavity 102 as an example, the two first boat feet 1041 of the first boat 104a are the two boat feet on a diagonal line among the four boat feet of the first boat 104a. That is, when the first boat 104a is placed on the two support rod bodies 201, one of the first boat feet 1041 is closer to the first cavity 101, while the other first boat foot 1041 is closer to the second cavity 102. Furthermore, the two second feet 1042 of the first slide carrier 104a are the two feet on the other diagonal of the four feet of the first slide carrier 104a. That is, one second foot 1042 is close to the first cavity door 101, and the other second foot 1042 is close to the second cavity door 102. The first foot 1041 and the second foot 1042 close to the first cavity door 101 are equidistant from the first cavity door 101, and the first foot 1041 and the second foot 1042 close to the second cavity door 102 are equidistant from the first cavity door 101. All four feet of the second slide carrier 104b are second feet 1042.

[0097] In this case, the two support rod bodies 201 are respectively the first support rod body (the support rod body 201 on the right in Figure 3) and the second support rod body (the support rod body 201 on the left in Figure 3). The length of the receiving groove 201a on the first support rod body is greater than the length of the receiving groove 201a on the second support rod body. The conductive support structure 203 located in the receiving groove 201a on the first support rod body is used to support the first boat foot 1041 of the first carrier boat 104a near the first cavity door 101 (i.e., the first boat foot 1041 shown in Figure (B) of Figure 11). In some embodiments, the top edge of the insulating support seat 2032 in the conductive support structure 203 is provided with a chamfer 2032e to avoid the first boat foot 1041 and prevent collision. The conductive support structure 203 located in the receiving groove 201a on the main body of the second support rod is used to support the first boat foot 1041 of the first sheet carrier boat 104a near the second cavity door 102 (i.e., the first boat foot 1041 shown in Figure 11(C)). Moreover, the insulating support structure provided on the top of the receiving groove 201a on the main body of the first support rod includes three first support blocks 208 and three second support blocks 205. The first first support block 208a on the main body of the first support rod is used to support the second boat foot 1042 of the first sheet carrier boat 104a near the second cavity door 102 (i.e., the second boat foot 1042 shown in Figure 11(D)). A first second support block 205a is provided at a distance between the first first support block 208a on the main body of the first support rod and the conductive support structure 203. The first second support block 205a is a segmented structure in Figure 3, but in actual applications, it can also be a one-piece structure. The second first support block 208b on the main body of the first support rod supports the second boat foot 1042 of the second sheet carrier 104b near the first cavity 101, and the second first support block 208b abuts against the first first support block 208a. The third first support block 208c on the main body of the first support rod supports the second boat foot 1042 of the second sheet carrier 104b near the second cavity 102. A second second support block 205b is provided at a distance between the third first support block 208c and the second first support block 208b. The second second support block 205b is a segmented structure in Figure 3, but in practical applications, it can also be a one-piece structure. A third second support block 205c is provided at a distance between the third first support block 208c and the corresponding component at the first end of the main body of the first support rod (described in detail below). The third second support block 205c is a segmented structure in Figure 3, but in practical applications, it can also be a one-piece structure. In addition, there is one insulating support tube sleeved on the main body of the first support rod, which is the second insulating support tube 207.

[0098] Similarly, the insulating support structure located at the top of the receiving groove 201a on the second support rod body includes two first support blocks 208 and two second support blocks 205, as shown in Figures 3 and 5. The first first support block 208a on the second support rod body supports the second boat foot 1042 of the second sheet carrier 104b near the first cavity door 101, and the first first support block 208a abuts against the conductive support structure 203. The second first support block 208b on the second support rod body supports the second boat foot 1042 of the second sheet carrier 104b near the second cavity door 102. A first second support block 205a is provided between the second first support block 208b and the first first support block 208a on the second support rod body. The first second support block 205a is a segmented structure in Figure 3, but in practical applications, it can also be a one-piece structure. In addition, there are three insulating support tubes sleeved on the second support rod body, namely one first insulating support tube 206 and two second insulating support tubes 207. The first insulating support tube 206 on the second support rod body is located between the two second insulating support tubes 207 and abuts against them. The first insulating support tube 206 is used to support the second boat foot 1042 of the first carrier boat 104a near the first cavity door 101 (i.e., the second boat foot 1042 shown in Figure 11(A)).

[0099] In another specific embodiment, as shown in FIG12, two support rod bodies 201 are used to jointly support two sheet carrier boats. The sheet carrier boat closer to the first cavity door 101 is the first sheet carrier boat, and the sheet carrier boat closer to the second cavity door 102 (also known as the furnace door at the tail end of the furnace) is the second sheet carrier boat. The first sheet carrier boat is a sheet carrier boat 104 with two of the aforementioned first boat feet 1041. Its other two boat feet besides the first boat feet 1041 are the second boat feet 1042. The two first boat feet 1041 of the first sheet carrier boat are the two boat feet close to the second cavity door 102 when the first sheet carrier boat 104a is placed on the two support rod bodies 201. Furthermore, the two second feet 1042 of the first film carrier boat are the two feet closest to the first cavity door 101 among the four feet of the first film carrier boat, and the two first feet 1041 are equidistant from either the first cavity door 101 or the second cavity door 102, and the two second feet 1042 are equidistant from either the first cavity door 101 or the second cavity door 102. All four feet of the second film carrier boat 104b are second feet 1042. In this case, the receiving grooves 201a on the two support rod bodies 201 have the same axial length, and the conductive support structures 203 located in the receiving grooves 201a on the two support rod bodies 201 are used to support the two first feet 1041 of the first film carrier boat that are close to the second cavity door 102, respectively. Furthermore, the insulating support structure provided on the top of the receiving groove 201a on each support rod body 201 includes two first support blocks 208 and two second support blocks 205. The first support block 208a is used to support the second boat foot 1042 of the second sheet carrier boat near the first cavity door 101, and the first support block 208a abuts against the conductive support structure 203. The second support block 208b is used to support the second boat foot 1042 of the second sheet carrier boat near the second cavity door 102. The second support block 205a is provided at the interval between the second support block 208b and the first support block 208a. The first support block 205a is a segmented structure in FIG. 11, but in practical applications, it can also be a one-piece structure. In addition, there are three insulating support tubes sleeved on each support rod body 201, namely one first insulating support tube 206 and two second insulating support tubes 207. The first insulating support tube 206 is located between the two second insulating support tubes 207 and abuts against them. The first insulating support tube 206 is used to support the second boat foot 1042 of the first carrier boat 104a near the first cavity door 101.

[0100] In summary, the electrode introduction assembly 202 provided in this application embodiment is adapted to the wafer carrier support rod 200 provided in this application embodiment, and is disposed in the receiving groove 201a of the wafer carrier support rod 200. It includes a conductive support structure 203 and an electrode introduction structure 204. The conductive support structure 203 has a support surface 2031a, which extends from the opening of the receiving groove 201a to support and electrically contact the wafer carrier 104. One end of the electrode introduction structure 204 is electrically connected to the conductive support structure 203. The length of the electrode introduction structure 204 in the extending direction of the receiving groove 201a is greater than the length of the receiving groove 201a in the extending direction. This not only... The electrode introduction structure 204 can electrically connect the supported wafer boat 104 to the radio frequency power supply via the conductive support structure 203. Furthermore, the electrode introduction assembly 202 can be pulled out from the first end of the support rod body 201 from the receiving groove 201a, and a new electrode introduction assembly 202 can be inserted into the receiving groove 201a from the first end 201b of the support rod body 201. This allows for the replacement of the electrode introduction assembly 202, which can be achieved through an inlet provided on the cavity door (e.g., the furnace door at the furnace tail end). This eliminates the need for disassembly from the furnace opening, cooling of the process chamber, and suspension of the equipment's automation system, thereby shortening maintenance time and increasing production capacity. Moreover, since cooling of the process chamber is unnecessary, quartz components such as the quartz cavity within the process chamber do not experience drastic temperature changes, reducing the probability of damage.

[0101] As another technical solution, please refer to Figures 1 and 2 together. This application embodiment also provides a semiconductor processing apparatus, including a process chamber and a first chamber door 101 and a second chamber door 102 disposed on both sides of a cavity body (not shown in the figures) within the process chamber. The first chamber door 101 is openable and closable. This semiconductor processing apparatus is, for example, a Plasma Enhanced Chemical Vapor Deposition (PECVD) apparatus, and can be a single-boat PECVD apparatus, or a dual-boat or multi-boat PECVD apparatus. The PECVD apparatus mainly includes a process chamber for providing a vacuum process environment. The cavity body of the process chamber is, for example, a quartz tube, which can be horizontal or vertical. The first chamber door 101 and the second chamber door 102 are respectively disposed at both ends of the quartz tube along its axial direction (e.g., parallel to the horizontal plane) to seal the internal space of the quartz tube to form a sealed space. Furthermore, the first chamber door 101 (also known as the furnace door at the furnace opening end) is sealed to the quartz tube, for example, through the furnace opening flange 103, and the first chamber door 101 is configured to be openable and closable to open or close the furnace opening. When the furnace opening is open, the wafer carrier boat 104 can be moved from the furnace opening into the process tube or from the process tube.

[0102] The semiconductor processing equipment provided in this application embodiment also includes at least two of the above-mentioned wafer carrier support rods 200 and at least two of the above-mentioned electrode introduction assemblies 202. Each electrode introduction assembly 202 is housed in the receiving groove 201a of each wafer carrier support rod 200; the second cavity gate 102 is connected to the first end 201b of each support rod body 201; the second end of each support rod body 201 away from the first end 201b is connected to the side of the cavity where the first cavity gate 101 is located.

[0103] In some embodiments, the second cavity 102 is provided with at least two inlets 108 for at least two electrode introduction assemblies 202 to pass through respectively, and at least two electrode connection assemblies 300 are also provided on the outside of the second cavity 102, each electrode connection assembly 300 being used to electrically connect each electrode introduction assembly 202 to the radio frequency power supply respectively.

[0104] In some embodiments, as shown in Figures 13 and 14, two first fixing brackets 110 are provided on the second cavity door 102 and at the bottom of each inlet 108. The two first fixing brackets 110 are used to support two support rod bodies 201 respectively, so that the first end 201b of each support rod body 201 can be opposite to the corresponding inlet 108.

[0105] In some embodiments, as shown in Figures 2 and 3, two second fixed brackets 109 are provided on the furnace port flange 103 of the first cavity door 101. The two second fixed brackets 109 are used to support the second ends of the two support rod bodies 201 respectively.

[0106] In some embodiments, as shown in FIG14, the electrode connection assembly 300 includes a connector structure 302 that is sealingly connected to the second cavity door 102 at a position corresponding to the inlet 108, for sealing the inlet 108. The connector structure 302 is configured to be at least partially removable so that it can be removed during installation or replacement of the electrode inlet assembly 202 to open the inlet 108. After the installation or replacement of the electrode inlet assembly 202 is completed, the connector structure 302 is reinstalled to seal the inlet 108.

[0107] Furthermore, a first hollow portion 303 is provided on the surface of the connecting seat structure 302 relative to the inlet 108. A heat insulation structure is provided in the first hollow portion 303 to block heat radiation, thereby protecting components such as the sealing ring located outside the heat insulation structure to prevent failure due to overheating.

[0108] As shown in Figures 14 and 15, the heat insulation structure that achieves the above-mentioned function includes, for example, a plurality of heat insulation plates 501 spaced apart along the extension direction of the support rod body 201, and at least one fastener 502. The fastener 502 passes through the plurality of heat insulation plates 501 along the extension direction of the support rod body 201 and is fixedly connected to the connecting seat structure 302, thereby fixing the plurality of heat insulation plates 501 to the connecting seat structure 302. The fastener 502 is, for example, a fastening screw. On each fastener 502, and between each pair of adjacent heat insulation plates 501 and between the heat insulation plate 501 and the connecting seat, a spacer 503 is provided to maintain a fixed distance between each pair of adjacent heat insulation plates 501 and between the heat insulation plate 501 and the connecting seat, thereby further improving the heat insulation effect.

[0109] In some embodiments, as shown in Figures 14 and 15, the electrode connection assembly 300 further includes a conductive connector 305; and the connector structure 302 is further provided with a second hollow portion, one end of which communicates with the first hollow portion 303, and the other end extends to the surface of the connector structure 302 opposite to the inlet 108; the conductive connector 305 passes through the second hollow portion, one end of which extends into the first hollow portion 303 and is provided with a blind hole 3051, and the other end of which is used for electrical connection with the positive or negative terminal of the radio frequency power supply. The electrode introduction assembly 202 is connected at one end (i.e., one end of the conductive rod 2041) and inserted into the blind hole 3051. An axial gap A is provided between the connection end and the blind end of the blind hole 3051 to allow sufficient space for the thermal expansion of the electrode introduction assembly 202 (e.g., the conductive rod 2041). The portion of the electrode introduction assembly 202 (e.g., the conductive rod 2041) inserted into the blind hole 3051 is in electrical contact with the hole wall of the blind hole 3051. The outer diameter of the portion of the conductive rod 2041 inserted into the blind hole 3051 is, for example, smaller than the outer diameter of the other portions of the conductive rod 2041. When the electrode introduction component 202 (e.g., conductive rod 2041) is in a free state, it is coaxial with the blind hole 3051. This allows the portion of the electrode introduction component 202 (e.g., conductive rod 2041) inserted into the blind hole 3051 to make close contact with the hole wall of the blind hole 3051 under the gravity of the electrode introduction component 202 (e.g., conductive rod 2041), thereby enabling good conduction of radio frequency current.

[0110] In some embodiments, the electrode connection assembly 300 further includes an insulating sleeve 306, which is disposed in the second hollow portion and extends into the first hollow portion 303 at one end. The insulating sleeve 306 is sleeved around the conductive connector 305 to electrically insulate the conductive connector 305 from the connector structure 302.

[0111] In some embodiments, the electrode introduction structure 204 includes a conductive rod 2041 and an insulating tube 2042 (including a second insulating tube 2042a and a first insulating tube 2042b) sleeved on the conductive rod 2041; the side 2032b of the insulating support 2032 near the first end 201b (as shown in FIG. 10) abuts against one end of the insulating tube 2042; the conductive rod 2041 extends through the second opening into the connecting channel 2033 and is electrically connected to the second conductive support 2034; the insulating tube 2042 includes a first insulating tube 2042b and a second insulating tube 2042a nested around the first insulating tube 2042b; as shown in FIG. 14, one end of the first insulating tube 2042b near the connecting end of the electrode introduction assembly 202 (i.e., one end of the conductive rod 2041) abuts against the insulating sleeve 306; a portion of the second insulating tube 2042a is sleeved on the portion of the insulating sleeve 306 that extends into the first hollow portion 303. By fitting a portion of the second insulating tube 2042a onto the portion of the insulating sleeve 306 that extends into the first hollow portion 303, the second insulating tube 2042a and the insulating sleeve 306 can be nested together to prevent leakage at the connection between the second insulating tube 2042a and the insulating sleeve 306.

[0112] There are various ways to make the connecting seat structure 302 detachable. For example, as shown in Figures 14 and 15, the connecting seat structure 302 includes a fixed seat 3021, a first connecting seat 3022, and a second connecting seat 3023. The fixed seat 3021 is annular, and one end of the fixed seat 3021 is sealed to the second cavity 102, for example, by welding. The fixed seat 3021 surrounds the inlet 108. A connecting flange 3021a is provided at the end of the fixed seat 3021 away from the second cavity 102. The first connecting seat 3022 is, for example, plate-shaped and is fixedly connected to the connecting flange 3021a by a detachable fastener. A first sealing ring 304 is provided between the first connecting seat 3022 and the connecting flange 3021a. The surface of the first connecting seat 3022 facing the inlet 108 and the inner circumferential surface of the fixed seat 3021 together constitute the aforementioned first hollow portion 303. The first sealing ring 304 is used to seal the gap between the first connecting seat 3022 and the connecting flange 3021a to ensure the sealing of the first hollow portion 303. In some embodiments, the above-mentioned detachable fastener is, for example, a chain clamp 301. The above-mentioned fastener 502 is, for example, a fastening screw, for threaded connection with the threaded hole on the surface of the first connecting seat 3022 facing the inlet 108.

[0113] Furthermore, the first connecting seat 3022 is provided with a through hole extending through it in a direction parallel to the axis of the inlet 108. The second connecting seat 3023 is columnar, with one end of the second connecting seat 3023 passing through the through hole, and the outer peripheral surface of the second connecting seat 3023 sealingly fitting with the wall of the through hole. The second connecting seat 3023 is provided with a first central through hole extending along the axis of the through hole, serving as the aforementioned second hollow portion. The conductive connector 305 passes through the first central through hole, with one end of the conductive connector 305 extending into the first hollow portion 303, and is provided with a blind hole 3051. The connecting end of the electrode introduction assembly 202 (i.e., one end of the conductive rod 2041) is inserted into the blind hole 3051. The other end of the conductive connector 305 extends out from the end of the first central through hole opposite to the inlet 108. An insulating sleeve 306 is inserted through the first central through hole and fitted onto the conductive connector 305. The insulating sleeve 306 completely covers the outer peripheral surface of the conductive connector 305 except for the protruding portion, which is a portion of the conductive connector 305 extending from the end of the first central through hole away from the inlet 108.

[0114] Furthermore, in some embodiments, the connector structure 302 further includes a third connector 3024, a conductor 307, and a coaxial cable socket 308. A portion of the insulating sleeve 306 extends from the end of the first central through hole away from the inlet 108, and a first positioning flange 306a is provided on the outer periphery of this portion. The second connector 3023 has a second positioning flange 3023a at the end away from the inlet 108. The first positioning flange 306a is stacked on the surface of the second positioning flange 3023a away from the inlet 108, and a second sealing ring 311 is provided between the first positioning flange 306a and the second positioning flange 3023a to seal the gap between them, thereby ensuring the sealing of the second hollow portion. The third connector 3024 is stacked on the surface of the second positioning flange 3023a away from the inlet 108, and a receiving groove 3024a for accommodating the first positioning flange 306a is provided on the surface of the third connector 3024 facing the second connector 3023. Furthermore, a second central through hole is provided through the third connector 3024, which is coaxially arranged with the first central through hole. The aforementioned protruding portion of the conductive connector 305 extends into the second central through hole. A portion of the conductor 307 is disposed in the second central through hole, and a threaded hole 307a is provided on the end face facing the conductive connector 305. The outer peripheral surface of the aforementioned protruding portion of the conductive connector 305 is provided with external threads for threaded engagement with the threaded hole 307a. In addition, an insulating ring 309 is also provided in the second central through hole. The insulating ring 309 is sleeved on the aforementioned protruding portion of the conductive connector 305 and the conductor 307 for electrical insulation between them and the third connector 3024. Another portion of conductor 307 extends from one end of the second central through-hole away from the inlet 108. A coaxial cable socket 308 is fitted onto this portion of conductor 307. The coaxial cable socket 308 is used to connect and fix a cable to the positive or negative terminal of the RF power supply, and to electrically connect the cable to conductor 307. Furthermore, a third sealing ring 310 is provided between the insulating ring 309 and the first positioning flange 306a, and around the aforementioned protruding portion of the conductive connector 305, to seal the gap between the insulating sleeve 306 and the conductive connector 305.

[0115] In some embodiments, an insulating support structure (the second insulating block 205 closest to the fastener 502 shown in FIG14) disposed on the top of the receiving groove 201a on the first support rod body abuts against the fastener 502 at one end near the first end 201b of the support rod body 201, thereby limiting the position of the corresponding first support member on the support rod body.

[0116] The semiconductor processing equipment provided in this application embodiment, by adopting the wafer carrier boat support rod 200 and electrode introduction assembly 202 provided in this application embodiment, can shorten maintenance time and increase production capacity without cooling the process chamber and pausing the equipment's automation system when replacing the electrode introduction assembly 202.

[0117] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A wafer carrier boat support rod, used in semiconductor processing equipment, characterized in that, The support rod body is provided with a receiving groove on the peripheral side for receiving an electrode introduction assembly of the semiconductor processing equipment; One end of the receiving groove extends to the first end of the support rod body and is an open end for moving the electrode introduction assembly into or out of the receiving groove.

2. The slide boat support rod of claim 1, wherein, The support rod body is tubular, the tube wall of the tubular support rod body is provided with a through groove extending through the thickness of the tube wall, one end of the through groove extends to the first end of the support rod body; the part of the space surrounded by the tube wall corresponding to the through groove constitutes the receiving groove.

3. The slide boat support rod of claim 1 or 2, wherein, The support rod body comprises a first rod part and a second rod part connected in sequence, the first end of the support rod body is the end of the first rod part away from the second rod part, and the receiving groove is provided in the first rod part.

4. The slide boat support rod of claim 3, wherein, The second rod part comprises a rod part body and a first insulating support tube sleeved around the rod part body.

5. The slide boat support rod of claim 4, wherein, The second rod part further comprises at least two second insulating support tubes, the at least two second insulating support tubes are sleeved around the rod part body and are respectively arranged on both sides of the first insulating support tube, for limiting the position of the first insulating support tube in the extension direction of the rod part body; The outer diameter of the second insulating support tube is smaller than the outer diameter of the first insulating support tube.

6. An electrode introduction assembly characterized by, The electrode introduction assembly is arranged in the receiving groove and comprises a conductive support structure and an electrode introduction structure, wherein, The conductive support structure has a support surface extending from the opening of the receiving groove for supporting and electrically contacting the wafer boat; one end of the electrode introduction structure is electrically connected with the conductive support structure, and the length of the electrode introduction structure in the extension direction of the receiving groove is greater than the length of the receiving groove in the extension direction.

7. The electrode introduction assembly of claim 6, wherein, The conductive support structure is arranged to enable the support surface to adaptively rotate under the gravity of the wafer boat.

8. The electrode introduction assembly of claim 7, wherein, The conductive support structure comprises a first conductive support member and a second conductive support member, the support surface is arranged on the first conductive support member; the second conductive support member is electrically connected with one end of the electrode introduction structure; One of the first conductive support member and the second conductive support member is provided with a spherical convex surface, and the other is provided with a spherical concave surface, the spherical convex surface and the spherical concave surface are matched to enable the support surface to adaptively rotate under the gravity of the wafer boat.

9. The electrode introduction assembly of claim 8, wherein, The conductive support structure further comprises an insulating support seat, the insulating support seat is provided with a connecting channel, the connecting channel is provided with a first opening and a second opening on the top surface and the side surface close to the electrode introduction structure respectively; The second conductive support member is arranged in the connecting channel, and a part of the second conductive support member extends out of the first opening, one of the spherical convex surface and the spherical concave surface is arranged on the part of the second conductive support member extending out; the second conductive support member is electrically connected with the electrode introduction structure through the second opening; The first conductive support is arranged above the insulating support base, and the spherical convex surface and the other one of the spherical convex surfaces are arranged at the bottom of the first conductive support.

10. The electrode introduction assembly of claim 9, wherein, The top surface of the insulating support base is provided with a limiting groove, and the first opening is arranged at the groove bottom surface of the limiting groove; a part of the first conductive support is arranged in the limiting groove, and there is a gap between the first conductive support and the groove bottom surface of the limiting groove.

11. The electrode introduction assembly of claim 9, wherein, The electrode introduction structure comprises a conductive rod and an insulating tube sleeved on the conductive rod. The conductive rod extends into the connecting channel through the second opening and is electrically connected with the second conductive support.

12. The electrode introduction assembly of claim 11, wherein, A part of the insulating support base extends from the slot opening of the accommodating groove, and the side surface of the insulating support base away from the electrode introduction structure is used to abut against the end surface of the accommodating groove away from the open end; The side surface of the insulating support base facing the electrode introduction structure abuts against one end of the insulating tube.

13. The electrode introduction assembly of claim 11, wherein, The lower end of the second conductive support is provided with a connecting convex part, and the outer peripheral size of the connecting convex part is smaller than the outer peripheral size of the second conductive support, so as to form a stepped surface at the lower end of the second conductive support; The outer peripheral surface of the conductive rod abuts against the stepped surface for supporting the second conductive support, and the outer peripheral surface of the conductive rod is provided with a connecting concave part, the connecting convex part is located in the connecting concave part, and the outer peripheral surface of the connecting convex part matches the inner peripheral surface of the connecting concave part.

14. The electrode introduction assembly of claim 11, wherein, The insulating tube comprises a first insulating tube and a second insulating tube sleeved on the periphery of the first insulating tube, the tube walls of the first insulating tube and the second insulating tube are provided with axially extending seams, and the seams of the first insulating tube and the second insulating tube are circumferentially staggered with each other.

15. The electrode introduction assembly of any of claims 6-14, wherein, The electrode introduction assembly further comprises an insulating support structure for covering the electrode introduction structure.

16. The electrode introduction assembly of claim 15, wherein, The insulating support structure comprises a plurality of support blocks, and the plurality of support blocks abut against each other in the extension direction of the accommodating groove. The plurality of support blocks comprise at least one first support block and at least one second support block, wherein the first support block is used for supporting the slide boat; the second support block is lower than the support surface of the first support block, and the second support block is used for limiting the position of the first support block in the extension direction of the accommodating groove.

17. A semiconductor processing apparatus comprising a process chamber and a first door and a second door disposed on either side of a cavity of the process chamber, wherein, The first cavity door can be opened and closed, and further comprising at least two slide boat support rods and at least two electrode introduction assemblies, the slide boat support rod adopts the slide boat support rod as claimed in any one of claims 1-5, the electrode introduction assembly adopts the electrode introduction assembly as claimed in any one of claims 6-16, and each electrode introduction assembly is accommodated in the accommodating groove of each slide boat support rod; The second cavity door is connected with the first end of each support rod body; and the second end of each support rod body away from the first end is connected with the side of the cavity body where the first cavity door is located.

18. The semiconductor processing apparatus of claim 17, wherein, The second cavity door is provided with at least two electrode introduction assemblies, and the second cavity door is provided with at least two electrode connection assemblies outside the second cavity door.

19. The semiconductor processing apparatus of claim 18, wherein, The electrode connection assembly comprises a connecting seat structure, the connecting seat structure is sealingly connected with the second cavity door at a position corresponding to the introduction port, and is used for sealing the introduction port.

20. The semiconductor processing apparatus of claim 19, wherein, The heat insulation structure comprises a plurality of heat insulation plates arranged at intervals along the extension direction of the support rod body, and at least one fastener penetrating through the plurality of heat insulation plates along the extension direction of the support rod body and fixedly connected with the connecting seat structure. Each of the fasteners is sleeved with a spacer between each of the two adjacent heat insulation plates and between the heat insulation plate and the connecting seat structure.

21. The semiconductor processing apparatus of claim 19, wherein, The electrode connection assembly further comprises an electrically conductive connecting piece. The connecting seat structure is further provided with a second hollow portion, one end of the second hollow portion is in communication with the first hollow portion, and the other end penetrates to the surface of the connecting seat structure away from the introduction port; the electrically conductive connecting piece is arranged in the second hollow portion, one end of the electrically conductive connecting piece extends into the first hollow portion and is provided with a blind hole, the other end of the electrically conductive connecting piece is used for electrically connecting with the radio frequency power supply; one end of the electrode introduction assembly is inserted into the blind hole, and an axial gap is left between the electrode introduction assembly and the blind end of the blind hole; the part of the electrode introduction assembly inserted into the blind hole is in electrical contact with the hole wall of the blind hole.

22. The semiconductor processing apparatus of claim 21, wherein, The electrode connection assembly further comprises an insulating sleeve, the insulating sleeve is arranged in the second hollow portion and one end extends into the first hollow portion, the insulating sleeve is sleeved around the electrically conductive connecting piece, and is used for electrically insulating the electrically conductive connecting piece from the connecting seat structure.

23. The semiconductor processing apparatus of claim 22, wherein, The electrode introduction structure comprises an electrically conductive rod and an insulating tube sleeved on the electrically conductive rod; the insulating tube comprises a first insulating tube and a second insulating tube sleeved on the periphery of the first insulating tube; One end of the first insulating tube abuts against the insulating sleeve; a part of the second insulating tube is sleeved on the part of the insulating sleeve extending into the first hollow portion.

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