Method for the production of an adhesive structure, involving provision of electrical charge carriers

Abstract

Illustrated and described is a method for producing an adhesive structure (1), the adhesive structure (1) having one layer or a plurality of layers which are disposed one above the other and are produced successively, wherein the layer or each of the plurality of layers is made of a self-adhesive compound, wherein the layer or each of the plurality of layers is produced in such a way that the layer or each of the plurality of layers has at least one edge portion (5) that extends peripherally around the particular layer or peripherally around a particular portion of the layer, wherein the layer or the first produced layer of the plurality of layers is brought in contact with a surface (23) of a transfer unit (9) on a first side (25) of the adhesive structure (1), and while the layer or the first produced layer of the plurality of layers is brought in contact with the surface (23) of the transfer unit (9), the layer or the first produced layer of the plurality of layers is supplied with electrical charge carriers such that an electrical force (37) acts on the layer or the first produced layer of the plurality of layers in a direction towards the surface (23) of the transfer unit (9). Also illustrated and described in an apparatus (35) for producing an adhesive structure (1).

Description

[0001] Method for producing an adhesive structure by providing electrical charge carriers

[0002] The present invention relates to a method for producing an adhesive structure.

[0003] Methods for producing an adhesive structure are known from the prior art. For example, the adhesive structure can have one or more layers arranged one above the other and produced sequentially. The layer, or each layer of the multiple layers, can be formed from an adhesive compound. The layer, or each layer of the multiple layers, can be produced such that it has at least one edge section arranged around the corresponding layer or around a corresponding section of the layer. One or more edge sections can be created, for example, using manufacturing processes that can also be referred to as 3D printing, additive manufacturing, generative manufacturing, or rapid prototyping technologies.For example, adhesive structures can be manufactured using additive manufacturing techniques such as Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF). This involves layering the adhesive structure layer by layer to create the adhesive. Additive manufacturing allows for the creation of complex three-dimensional shapes that are either impossible or require extensive post-processing to produce using other manufacturing methods. An adhesive structure produced in this way can then be brought into contact with the surface of a transfer unit, particularly during its production, to facilitate transport to a specific location for a particular application.

[0004] In general, for methods to produce an adhesive structure, it is desirable that a sufficiently high adhesive effect can be provided between a layer of the adhesive structure and the transfer unit or between a previously produced layer of the adhesive structure and the transfer unit, and that, when using the adhesive structure, the adhesive effect is low enough to allow the adhesive structure to be removed from the transfer unit and to subject the adhesive structure to only a low mechanical stress.

[0005] It is therefore an object of the present invention that, when producing the adhesive structure, a sufficiently high adhesive effect is provided between the layer of the adhesive structure and the transfer unit or between the first produced layer of the adhesive structure and the transfer unit, and that, when using the adhesive structure, the adhesive effect is low enough to allow the adhesive structure to be removed from the transfer unit and to subject the adhesive structure to only a low mechanical stress.

[0006] According to a first aspect of the invention, the aforementioned problem is solved by a method with the features of claim 1. The method is provided for producing an adhesive structure. The adhesive structure comprises one or more layers or is built up from several layers. The several layers are arranged one above the other and are produced sequentially. The layer or each layer of the several layers is formed from an adhesive compound. The layer or each layer of the several layers is produced such that the layer or each layer of the several layers has at least one edge section arranged circumferentially around the corresponding layer or around a corresponding section of the layer. The layer or a first produced layer of the several layers is brought into contact with a surface of a transfer unit on a first side of the adhesive structure.While the layer or the first layer produced of the multiple layers is brought into contact with the surface of the transfer unit, the layer or the first layer produced of the multiple layers is supplied with electrical charge carriers in such a way that an electrical force acts on the layer or the first layer produced of the multiple layers in a direction towards the surface of the transfer unit.

[0007] As already described, the method for producing the adhesive structure is provided. The adhesive structure is adhesive in its manufactured state. In particular, the adhesive structure has a surface that faces towards its surroundings, so that this surface of the adhesive structure can be brought into contact with various other surfaces and then form good adhesion with these surfaces. Preferably, the adhesive structure, and especially its surface, exhibits permanent tackiness at room temperature. Preferably, the adhesive structure, and especially its surface, can form good adhesion with the other surfaces under slight pressure. In particular, the adhesive structure is a pressure-sensitive adhesive.

[0008] As previously described, the adhesive structure comprises one or more layers, or is composed of several layers. Preferably, the adhesive structure comprises one layer, which can also be referred to as the first layer. Alternatively, and more preferably, the adhesive structure comprises several layers. Preferably, the several layers comprise a first layer and a second layer. In the case that the adhesive structure comprises several layers, or is composed of several layers, the layers are arranged one above the other and are produced sequentially.

[0009] As previously described, the layer, or each layer of the multiple layers, is formed from an adhesive compound. In the case where the adhesive structure comprises the layer, the layer is formed from an adhesive compound. In the alternative case where the adhesive structure comprises or is composed of multiple layers, each layer of the multiple layers is formed from an adhesive compound. Preferably, each layer of the multiple layers is formed from the same adhesive compound. Preferably, the adhesive compound is first melted during the production of each layer and then solidifies again to form the corresponding layer. Preferably, the solidified state of the adhesive compound is a state in which the adhesive compound ensures the tackiness of the adhesive structure.In this case, the adhesive compound is preferably an extremely high-viscosity elastic liquid with a glass transition temperature of less than -10 °C, so that the stickiness of the adhesive structure is ensured at room temperature.

[0010] In the process according to the invention, an adhesive compound is built up as a single layer or as a sequence of superimposed layers. It is inherent in the nature of the process that, if the adhesive compound is built up as a sequence of superimposed layers, these layers are no longer necessarily recognizable as such in the final product. Rather, the individual layers can merge into one another. The result of a process according to the invention is therefore preferably a single adhesive compound that is perceived only as such and not as a multi-layered structure. The term "layers" in this context refers only to the process and the layer-by-layer construction of the adhesive compound carried out therein.

[0011] The method according to the invention is preferably a method for producing an adhesive compound (adhesive structure (1)), wherein the adhesive compound is produced by additive manufacturing through the sequential deposition of several layers on top of each other, wherein each layer of the several layers is produced such that it has at least one edge section (5) arranged circumferentially around the corresponding layer or circumferentially around a corresponding section of the layer, wherein a first produced layer of the several layers is brought into contact with a surface (23) of a transfer unit (9) on a first side (25) of the adhesive compound, and wherein, while the first produced layer of the several layers is brought into contact with the surface (23) of the transfer unit (9), the first produced layer of the several layers is supplied with electrical charge carriers,that an electric force (37) acts on the first produced layer of the several layers in one direction towards the surface (23) of the transfer unit (9).

[0012] As previously described, the layer, or each layer of the multiple layers, is manufactured such that it has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer. In the case where the adhesive structure comprises the layer, the layer is manufactured such that it has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer. In the alternative case where the adhesive structure comprises the multiple layers, each layer of the multiple layers is manufactured such that it has at least the corresponding edge section arranged around the corresponding layer or around a corresponding section of the corresponding layer.By manufacturing the layer, or each layer of the multiple layers, such that it has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer, it is ensured that the layer, or each layer of the multiple layers, is manufactured directly as the corresponding layer is intended to be for the adhesive structure. This applies in particular to manufacturing each layer such that it extends in the principal plane of the corresponding layer according to a predetermined extent, so that the corresponding layer does not require any further processing.This specifically excludes any change in the extent of the corresponding layer within the main extent plane of the corresponding layer during the production of the corresponding layer, which is the case, for example, when producing stamped parts using dies and which can also be referred to as stamped parts.By manufacturing the layer or each layer of the multiple layers in such a way that the layer or each layer of the multiple layers has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer, it is ensured that the corresponding layer and thus also the adhesive structure can be manufactured in a particularly resource-efficient manner, since, in particular, compared to the production of die-cut parts that are punched out from a blank and thus create sections of the blank that are not die-cut parts and therefore have to be disposed of or recycled, no such sections are produced, which can also be referred to as die-cut slugs.

[0013] As previously described, the layer, or the first layer produced of any multiple layers, is brought into contact with the surface of the transfer unit on the first side of the adhesive structure. In the case where the adhesive structure consists of a single layer, the layer is brought into contact with the surface of the transfer unit on the first side of the adhesive structure. Alternatively, in the case where the adhesive structure consists of multiple layers, the first layer produced of any multiple layers is brought into contact with the surface of the transfer unit on the first side of the adhesive structure; the subsequent layer is then applied to this first layer, the next layer to the second layer, and so on.By bringing the layer or the first layer produced of the multiple layers on the first side of the adhesive structure into contact with the surface of the transfer unit, it is ensured that the adhesive structure, after it has been produced, can be moved by means of the transfer unit to a location where it can be separated from the surface of the transfer unit and brought into contact with a surface of a component in order to produce a device that has the adhesive structure and the component.

[0014] As previously described, when the layer, or the first layer produced among the multiple layers, is brought into contact with the surface of the transfer unit, it is supplied with electrical charge carriers such that the electrical force acts on the layer, or the first layer produced among the multiple layers, in a direction towards the surface of the transfer unit. Therefore, in the case where the adhesive structure comprises the layer, when the layer is brought into contact with the surface of the transfer unit, it is supplied with electrical charge carriers such that the electrical force acts on the layer in a direction towards the surface of the transfer unit.In the alternative case where the adhesive structure has or is composed of multiple layers, the first layer of the multi-layered structure is supplied with electrical charge carriers when it is brought into contact with the surface of the transfer unit. This electrical force acts on the first layer of the multi-layered structure in a direction towards the surface of the transfer unit. This force presses the layer, or the first layer of the multi-layered structure, against the surface of the transfer unit, thus providing a slight adhesive effect between the layer and the surface of the transfer unit during its formation.This low adhesive strength is sufficient to bond the layer and the surface of the transfer unit, or the first layer produced among the multiple layers and the surface of the transfer unit, sufficiently strongly during the production of the adhesive structure and subsequent transport. Furthermore, this low adhesive strength is ideal for later use of the adhesive structure, as it allows the adhesive structure to be removed from the surface of the transfer unit, and this removal is particularly gentle on the adhesive structure. Preferably, the layer, or the first layer produced among the multiple layers, is brought into contact with the surface of the transfer unit section by section.The layer, or the first layer produced among the multiple layers, is supplied with electrical charge carriers in such a way that the corresponding section, which is currently in contact with the surface of the transfer unit, is supplied with these charge carriers. This creates an electrical force acting on the corresponding section, which is currently in contact with the surface of the transfer unit, in a direction towards the surface of the transfer unit. By supplying the corresponding section, which is currently in contact with the surface of the transfer unit, with the electrical charge carriers, a particularly precise force is exerted on the layer, or the first layer produced among the multiple layers.It has been found that the electrical charge carriers in the manufactured adhesive structure dissipate. This can be caused, for example, by positive and negative charge carriers coming so close to each other that, from the moment they are in close proximity, they no longer exert an electrical force component. The dissipation of the electrical charge carriers ensures that the adhesive structure can be easily separated from the surface of the transfer unit and brought into contact with the surface of a component.In summary, it can be stated that the present invention provides both a sufficiently high adhesive effect between the layer of the adhesive structure and the transfer unit or between the first layer of the adhesive structure produced and the transfer unit when producing the adhesive structure, and also that the adhesive effect is low enough when using the adhesive structure to allow the adhesive structure to be removed from the transfer unit and to subject the adhesive structure to only a low mechanical stress.

[0015] In one embodiment, the layer or the first layer produced among the multiple layers is supplied with negative electrical charge carriers. In another embodiment, the layer or the first layer produced among the multiple layers is supplied with positive electrical charge carriers. The fact that the layer or the first layer produced among the multiple layers can be supplied with either negative or positive electrical charge carriers ensures that the method can be adapted to different situations.In connection with the present invention, it is preferably understood that the layer or the first layer of the multiple layers is supplied with electrical charge carriers, and that an electrical voltage is applied to a unit consisting of the at least partially produced layer and the transfer unit, or to a unit consisting of the at least partially produced first layer of the multiple layers and the transfer unit, such that opposite charge carriers accumulate in or on the layer or the first layer of the multiple layers and in or on the transfer unit, such that an electrical force acts on the layer or the first layer of the multiple layers in a direction towards the surface of the transfer unit.For example, electrons, which can also be described as negative charge carriers, can accumulate in or on the layer or the first layer produced among the multiple layers, and there can be a shortage or lack of electrons in or on the transfer unit, a state that can also be described as a concentration of positive charge carriers in or on the transfer unit. For example, electrons can also accumulate in or on the transfer unit, and there can be a shortage or lack of electrons in or on the layer or the first layer produced among the multiple layers.

[0016] In one embodiment, the transfer unit is a film. By using a film as the transfer unit, a particularly lightweight transfer unit is provided, allowing the adhesive structure to be transported in a particularly resource-efficient manner.

[0017] A particularly preferred transfer unit is a film coated with a release agent, for example, a silicone-coated PET film. In particular, the transfer unit is a release liner. The inventive method makes it possible to apply the first layer of an adhesive structure, especially a pressure-sensitive adhesive, to a challenging substrate such as a release liner with sufficient bond strength during additive manufacturing to prevent premature detachment of the adhesive structure during transport. In particular, sufficient initial adhesion is generated to deposit the material of the adhesive structure onto the release liner's surface, which is otherwise unsuitable for this purpose. In this way, it becomes possible to selectively produce pressure-sensitive adhesive structures with a specific shape and thus without material loss, which can then be transported to the point of use.This eliminates the need to print the adhesive directly onto the substrate intended for bonding.

[0018] In one embodiment, a liner is brought into contact with the adhesive structure on a second side opposite the first side. By bringing the liner into contact with the adhesive structure on the second side opposite the first side, it is ensured that the adhesive structure can be protected from contamination by means of the liner. Meanwhile, after the adhesive structure has been produced, it is transferred by the transfer unit to a location where the layer, or the first layer produced of the multiple layers, on the first side of the adhesive structure can be separated from the surface of the transfer unit. The layer, or the first layer produced of the multiple layers, on the first side of the adhesive structure can then be brought into contact with a surface of a first component. After the liner has been removed,the layer, or a recently produced layer of the multiple layers on the second side of the adhesive structure, can be brought into contact with a surface of a second component to produce a device.

[0019] In one embodiment, the pressure-sensitive adhesive is at least partially meltable, wherein the adhesive is conveyed by an extruder through a heated nozzle to form the layer or each layer of the multiple layers, such that the adhesive melts and then solidifies again to form the layer or each layer of the multiple layers. The fact that the adhesive is at least partially meltable ensures that it can be melted at least partially in order to be applied to the transfer unit in its molten state.By extruding the adhesive compound through the heated nozzle in such a way that it melts and then solidifies to form the layer or each layer of the multi-layer system, it is ensured that the layer or each layer of the multi-layer system, and thus the adhesive structure, can be produced using Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF). Preferably, the adhesive structure is produced using additive manufacturing. Preferably, the solidified state of the adhesive compound is one in which the adhesive compound ensures the tackiness of the adhesive structure.In this case, the adhesive compound is preferably an extremely high-viscosity elastic liquid with a glass transition temperature of less than -10 °C, so that the stickiness of the adhesive structure is ensured at room temperature.

[0020] According to a second aspect of the invention, the aforementioned problem is solved by a method with the features of claim 7. The method is provided for manufacturing a device. The device comprises a component and an adhesive structure manufactured by a method according to the first aspect of the invention. The component and the manufactured adhesive structure are provided. The layer, or the first layer manufactured of the multiple layers, is separated from the surface of the transfer unit on the first side of the adhesive structure. The layer, or the first layer manufactured of the multiple layers, is brought into contact with a surface of the component on the first side of the adhesive structure.The features, technical effects and / or advantages described in connection with the method according to the first aspect of the invention also apply, at least analogously, to the method according to the second aspect of the invention, so that a corresponding repetition is omitted here.

[0021] According to a third aspect of the invention, the aforementioned problem is solved by a device with the features of claim 8. The device is configured for producing an adhesive structure. The adhesive structure comprises one or more layers arranged one above the other and produced sequentially. The layer, or each layer of the multiple layers, is formed from an adhesive compound. The device includes a mounting unit with a mounting surface and a charge carrier supply unit that can supply the layer, or the first layer produced of the multiple layers, with electrical charge carriers.The device's inclusion of a charge carrier supply unit capable of supplying the layer, or the first layer produced of the multi-layers, with electrical charge carriers ensures that electrical charge carriers can be supplied in such a way that, while the layer, or the first layer produced of the multi-layers, is being brought into contact with the surface of the transfer unit, the layer, or the first layer produced of the multi-layers, is being supplied with electrical charge carriers. This ensures that, while the layer, or the first layer produced of the multi-layers, is being brought into contact with the surface of the transfer unit, an electrical force is exerted on the layer, or the first layer produced of the multi-layers, in a direction towards the surface of the transfer unit by means of the electrical charge carriers.With the aid of this force, the layer or the first layer produced of the multiple layers is pressed against the surface of the transfer unit, so that during the production of the layer or the first layer produced of the multiple layers, a slight adhesive effect can be provided between the layer and the surface of the transfer unit or between the first layer produced of the multiple layers and the surface of the transfer unit, and this slight adhesive effect, due to the force exerted on the layer or the first layer produced of the multiple layers by the electrical charge carriers, is sufficient to bond the layer or the first layer produced of the multiple layers and the surface of the transfer unit sufficiently strongly during the production of the adhesive structure and during subsequent transport.Furthermore, this low adhesive strength is ideal for subsequent use of the adhesive structure, as the adhesive structure can be removed from the surface of the transfer unit, and this is particularly associated with low mechanical stress on the adhesive structure. The features, technical effects, and / or advantages described in connection with the method according to the first aspect and those described in connection with the method according to the second aspect of the invention also apply, at least analogously, to the device according to the third aspect of the invention, so that a corresponding repetition is omitted here.

[0022] In one embodiment, the device includes a material supply unit for providing the adhesive compound, wherein the load carrier supply unit and the material supply unit are connected to each other. This connection ensures that the load carrier supply unit follows the movement of the material supply unit, thus providing a mechanically simple coupling between the movement of the load carrier supply unit and the movement of the material supply unit. Although the steps of the method according to the first aspect of the invention and the steps of the method according to the second aspect of the invention are each described in a specific sequence, the present invention is not limited to these respective sequences.Rather, the individual steps can be carried out in any sensible order, and in particular at least partially in parallel with each other.

[0023] Further features, advantages, and applications of the present invention will become apparent from the following description of the exemplary embodiments and the figures. All features described and / or illustrated, individually and in any combination, constitute the subject matter of the invention, irrespective of their composition in the individual claims or their cross-references. In the figures, the same reference numerals denote identical or similar objects.

[0024] Figures 1 and 2 each show a schematic representation of an adhesive structure that has been produced using a first embodiment of a method according to the invention for producing the adhesive structure.

[0025] Figures 3 and 4 each show a schematic representation of an adhesive structure that has been produced using a second embodiment of the inventive method for producing the adhesive structure.

[0026] Figure 5 shows a schematic representation while the adhesive structure shown schematically in Figures 1 and 2 is produced using the first embodiment of the inventive method for producing the adhesive structure.

[0027] Figure 6 shows a schematic representation of the first embodiment of the inventive method for producing the adhesive structure,

[0028] Figure 7 shows a schematic representation of a device equipped with a first

[0029] An embodiment of a method for manufacturing the device according to the invention has been produced.

[0030] Figure 8 shows a schematic representation of the first embodiment of the inventive method for manufacturing the device,

[0031] Figure 9 shows a schematic representation of the second embodiment of the inventive method for producing the adhesive structure,

[0032] Figure 10 shows a schematic representation of a device that has been manufactured using a second embodiment of the inventive method for manufacturing the device. Figure 11 shows a schematic representation of the second embodiment of the inventive method for manufacturing the device.

[0033] Figure 12 shows a schematic representation of a section of a first

[0034] Embodiment of a device according to the invention for producing an adhesive structure,

[0035] Figure 13 shows a schematic representation of a section of a second

[0036] embodiment of a device according to the invention for producing an adhesive structure, and

[0037] Figure 14 shows a schematic representation of a section of a third

[0038] Embodiment of a device according to the invention for producing an adhesive structure.

[0039] Figures 1 and 2 each show a schematic representation of an adhesive structure 1 produced using a first embodiment of a method according to the invention for producing the adhesive structure 1; Figures 3 and 4 each show a schematic representation of an adhesive structure 1 produced using a second embodiment of the method according to the invention for producing the adhesive structure 1; Figure 5 shows a schematic representation while the adhesive structure 1 shown schematically in Figures 1 and 2 is being produced using the first embodiment of the method according to the invention for producing the adhesive structure 1; and Figure 6 shows a schematic representation of the first embodiment of the method according to the invention for producing the adhesive structure 1.

[0040] The adhesive structure 1, schematically depicted in Figures 1 and 2, has a layer, which can also be referred to as the first layer 3. This layer is formed from an adhesive compound. The layer has a circumferential edge section 5. The first layer 3 extends in a principal plane of extension of the first layer 3, and the circumferential edge section 5 also extends in the principal plane of the first layer 3. The edge section 5 extends circumferentially around a straight line perpendicular to the principal plane of extension of the first layer 3. In the principal plane of extension of the first layer 3, the edge section 5 has a surface that faces a surrounding area 7 of the adhesive structure 1. Figure 1 also shows a transfer unit 9, a liner 11, and an application unit 13. Figure 2 shows the transfer unit 9 and the application unit 13.Figure 2 is a top view, corresponding to a top-to-bottom view in Figure 1. To better illustrate the adhesive structure 1, the liner 11 is omitted in Figure 2. The adhesive structure 1, schematically depicted in Figures 3 and 4, comprises several layers: a first layer 3 and a second layer 15. The first layer 3 and the second layer 15 are arranged one above the other. Both the first layer 3 and the second layer 15 are formed from an adhesive compound. The first layer 3 has a circumferential edge section 5. The first layer 3 extends in a principal plane of extension, and the circumferential edge section 5 also extends in the principal plane of extension of the first layer 3.The edge section 5 extends circumferentially around a straight line arranged perpendicular to the principal extension plane of the first layer 3. In the principal extension plane of the first layer 3, the edge section 5 has a surface that faces a surrounding area 7 of the adhesive structure 1. The second layer 15 has three sections, each of which has an edge section 5 arranged circumferentially around the corresponding section of the layer. Each of the three sections of the second layer 15 extends in a principal extension plane of the second layer 15, and each edge section 5 arranged circumferentially around the corresponding section of the three sections of the second layer 15 also extends in the principal extension plane of the second layer 15. Each edge section 5 extends circumferentially around a corresponding straight line arranged perpendicular to the principal extension plane of the second layer 15.In the main extension plane of the second layer 15, each edge section 5 has a corresponding surface facing an environment 7 of the adhesive structure 1. Figure 3 also shows a transfer unit 9, a liner 11, and an application unit 13. Figure 4 shows the transfer unit 9 and the application unit 13. Figure 4 is a top view corresponding to a top-down view in Figure 3. To better illustrate the adhesive structure 1, the liner 11 is omitted in Figure 4.

[0041] As already described, Figure 5 shows a schematic representation, while the adhesive structure 1, schematically depicted in Figures 1 and 2, is produced using the first embodiment of the method according to the invention. In Figure 5, in addition to the adhesive structure 1 already produced in sections, the transfer unit 9, and the application unit 13, an extruder 17 and a heated nozzle 19 are shown. The adhesive material intended for the adhesive structure 1 is conveyed by the extruder 17 towards the heated nozzle 19. The adhesive material is melted by the heated nozzle 19, which is heated during the production of the adhesive structure 1, and the molten adhesive material is applied to the transfer unit 9. The molten adhesive material then solidifies again during and / or after it has been applied to the transfer unit 9.To apply the pressure-sensitive adhesive to the transfer unit 9, the heated nozzle 19, which is movably mounted on a frame, is moved parallel to the main plane of the layer being produced, thus producing the layer section by section. The current direction of movement of the heated nozzle 19 is symbolized by an arrow in Figure 5. The pressure-sensitive adhesive is applied to the transfer unit 9 continuously, or, to produce individual sections of a layer, intermittently. The heated nozzle 19 is moved, for example, along a first direction parallel to the main plane of the layer and / or along a second direction perpendicular to the first direction and parallel to the main plane of the layer.Alternatively, the heated nozzle 19 can be fixedly attached to a frame, and the system unit 13 can be movably attached to a frame, so that the system unit 13 is moved parallel to the main plane of extension of the corresponding layer being produced to apply the adhesive to the transfer unit 9, thus producing the corresponding layer section by section. Each of these two described processes can also be referred to as Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF). As already described, Figure 5 shows the schematic representation during the production of the adhesive structure 1, which is schematically depicted in Figures 1 and 2, using the first embodiment of the process according to the invention.The adhesive structure 1 shown schematically in Figures 3 and 4 is produced in a similar manner using the second embodiment of the method according to the invention.

[0042] As already described, Figure 6 shows a schematic representation of the first embodiment of the inventive method for producing the adhesive structure 1. In a first process step 101 of the method, the pressure-sensitive adhesive for producing the adhesive structure 1 and the transfer unit 9 are provided. The transfer unit 9 is a film. Because the transfer unit 9 is a film, it is ensured that a transfer unit 9 with a particularly low weight is provided, so that the adhesive structure 1 can be transported with the transfer unit 9 in a particularly resource-efficient manner. The transfer unit 9 is brought into contact with a surface 21 of the application unit 13 on a first side of the transfer unit 9 and connected to it in such a way that the transfer unit 9 and the application unit 13 are firmly connected to each other during the production of the adhesive structure 1.When producing the first layer 3, either the heated nozzle 19 can be moved relative to the system unit 13, or the system unit 13 can be moved relative to the heated nozzle 19, so that the heated nozzle 19 is also moved relative to the transfer unit 9, or the transfer unit 9 is moved relative to the heated nozzle 19.

[0043] In a second process step 102, a primer is applied to a surface 23 of the transfer unit 9 before the layer, i.e., the first layer 3, is brought into contact with the surface 23 of the transfer unit 9 on a first side 25 of the adhesive structure 1. Applying the primer to the surface 23 of the transfer unit 9 before the layer, i.e., the first layer 3, is brought into contact with the surface 23 of the transfer unit 9 on the first side 25 ensures that the adhesion between the adhesive structure 1 and the transfer unit 9 is improved, so that the first layer 3 adheres particularly well to the surface 23 of the transfer unit 9 when applied. Preferably, the second process step 102 is carried out before the first process step 101. Alternatively, preferably, the second process step 102 is carried out after the first process step 101.In each of these two alternatives, the second process step 102 is carried out before the third process step 103.

[0044] In a third process step 103, the first layer 3 is produced. The first layer 3 is produced in such a way that it is gradually produced and applied to the surface 23 of the transfer unit 9. In doing so, the first layer 3 is brought into contact with the surface 23 of the transfer unit 9 on the first side 25 of the adhesive structure 1.By bringing the first layer 3 on the first side 25 of the adhesive structure 1 into contact with the surface 23 of the transfer unit 9, the adhesive structure 1, once it has been produced, can be moved by the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a component to produce a device 29. The production of the device 29 will be discussed in detail later.

[0045] In the third process step 103, the first layer 3 is produced such that it has the edge section 5 arranged around its perimeter as described above. By producing the first layer 3 with this edge section 5, it is ensured that the first layer 3 is manufactured directly in the form required for the adhesive structure 1. This applies in particular to producing the first layer 3 such that it extends in its main plane of extent according to a predetermined extent, thus eliminating the need for further processing.This specifically excludes any alteration of the extent of the first layer 3 within its main plane of extent during the production of the first layer 3, which occurs, for example, when manufacturing die-cut parts, which are produced using dies and can also be referred to as stamped parts. By manufacturing the first layer 3 in such a way that it has the circumferential edge section 5 surrounding it, it is ensured that the first layer 3, and thus also the adhesive structure 1, can be produced in a particularly resource-efficient manner. This is especially important compared to the production of die-cut parts, which are punched out from a blank and thus create sections of the blank that are not die-cut parts and therefore have to be disposed of or recycled. In this case, no such sections, which can also be referred to as stamping slugs, are produced.

[0046] Furthermore, the pressure-sensitive adhesive is at least partially meltable. This partial meltability ensures that the adhesive can be partially melted and applied to the transfer unit 9 in its molten state. To form the first layer 3, the adhesive is conveyed by the previously described extruder 17 and through the previously described heated nozzle 19, causing it to melt and then solidify again. The first layer 3, and thus the adhesive structure 1, can therefore be produced using Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF).

[0047] In a fourth process step 104, a liner 11 is brought into contact with the adhesive structure 1 on one of the two opposite sides 27 of the adhesive structure 1. In the example shown, the liner 11 is brought into contact with the first layer 3 of the adhesive structure 1 on the second side 27 of the adhesive structure 1.By bringing the liner 11 into contact with the adhesive structure 1 on the second side 27 opposite the first side 25, it is ensured that the adhesive structure 1 can be protected from contamination by means of the liner 11, while the adhesive structure 1, after it has been produced, is transferred by means of the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a first component 31 and, after the liner 11 has been removed again, the first layer 3 on the second side 27 of the adhesive structure 1 can be brought into contact with a surface of a second component 33 in order to produce a device 29.The manufacture of device 29 will be discussed in detail later.

[0048] The described process is intended for producing the adhesive structure 1. The first layer 3 is brought into contact with the surface 23 of the transfer unit 9. The transfer unit 9 ensures a certain degree of dimensional stability for transporting the adhesive structure 1, so that in its manufactured state, the first layer 3 of the adhesive structure 1 is initially in contact with the surface 23 of the transfer unit 9. For further use of the adhesive structure 1, the contact between the first layer 3 and the surface 23 of the transfer unit 9 can be broken, and the adhesive structure 1 can remain in its manufactured state. The first layer 3 is also brought into contact with the liner 11. The liner 11 provides a certain degree of protection for transporting the adhesive structure 1, so that in its manufactured state, the first layer 3 of the adhesive structure 1 is initially in contact with the liner 11.For further use of the adhesive structure 1, the contact between the first layer 3 and the liner 11 can be broken again, and the adhesive structure 1 can remain in its manufactured state. These circumstances can be considered part of the manufacturing process of the adhesive structure 1 in connection with the present invention.

[0049] Figure 7 shows a schematic representation of a device 29 that has been manufactured using a first embodiment of a method according to the invention for manufacturing the device 29, and Figure 8 shows a schematic representation of the first embodiment of the method according to the invention for manufacturing the device 29. The method already described for manufacturing the adhesive structure 1 can be incorporated into a method for manufacturing the device 29. The device 29 comprises the adhesive structure 1, a first component 31, which is a mobile phone, and a second component 33, which is a battery. The first component 31 and the second component 33 can be joined together using the adhesive structure 1.For example, if an old mobile phone battery is to be replaced by a new battery, i.e., by the second component 33, the old battery can first be detached from the mobile phone and the old adhesive structure that connected the old battery and the mobile phone removed. Now, the adhesive structure 1 and the second component 33, i.e., the new battery, can be prepared, and after both the adhesive structure 1 and the transfer unit 9 and the adhesive structure 1 and the liner 11 have been separated, the new battery and the mobile phone can be connected using the adhesive structure 1.

[0050] In the method for manufacturing the device 29, which comprises the manufactured adhesive structure 1, the first component 31, and the second component 33, the adhesive structure 1, the first component 31, and the second component 33 are provided in a first process step 101. In a second process step 102, the first layer 3 on the second side 27 of the adhesive structure 1 is separated from the liner 11 and brought into contact with the second component 33 on the second side 27 of the adhesive structure 1. In a third process step 103, the first layer 3 on the first side 25 of the adhesive structure 1 is separated from the surface 23 of the transfer unit 9, and the first layer 3 on the first side 25 of the adhesive structure 1 is brought into contact with a surface of the first component 31.

[0051] Figure 9 shows a schematic representation of the second embodiment of the inventive method for producing the adhesive structure 1, Figure 10 shows a schematic representation of a device 29 which has been produced using a second embodiment of the inventive method for producing the device 29, and Figure 11 shows a schematic representation of the second embodiment of the inventive method for producing the device 29.

[0052] In a first process step 101 of the second embodiment of the inventive method for producing the adhesive structure 1, schematically illustrated in Figure 9, the pressure-sensitive adhesive for producing the adhesive structure 1 and the transfer unit 9 are provided. Here, too, the transfer unit 9 is a film. Because the transfer unit 9 is a film, it is ensured that a transfer unit 9 with a particularly low weight is provided, so that the adhesive structure 1 can be transported with the transfer unit 9 in a particularly resource-efficient manner. The transfer unit 9 is brought into contact with a surface 21 of the application unit 13 on a first side of the transfer unit 9 and connected to it in such a way that the transfer unit 9 and the application unit 13 are firmly connected to each other during the production of the adhesive structure 1.When producing the first layer 3, either the heated nozzle 19 can be moved relative to the system unit 13, or the system unit 13 can be moved relative to the heated nozzle 19, so that the heated nozzle 19 is then also moved relative to the transfer unit 9, or the transfer unit 9 is moved relative to the heated nozzle 19. In a second process step 102, a primer is applied to a surface 23 of the transfer unit 9 before the first layer produced of the multiple layers, i.e., the first layer 3, is brought into contact with the surface 23 of the transfer unit 9 on a first side 25 of the adhesive structure 1.By applying the primer to the surface 23 of the transfer unit 9 before the first layer 3 on the first side 25 of the adhesive structure 1 is brought into contact with the surface 23 of the transfer unit 9, the adhesion between the adhesive structure 1 and the transfer unit 9 is improved, ensuring that the first layer 3 adheres particularly well to the surface 23 of the transfer unit 9 when applied. Preferably, the second process step 102 is carried out before the first process step 101. Alternatively, preferably, the second process step 102 is carried out after the first process step 101. In each of these two alternatives, the second process step 102 is carried out before the third process step 103.

[0053] In a third process step 103, the multiple layers, i.e., the first layer 3 and the second layer 15, are produced. First, the first layer 3 is produced in such a way that it is gradually produced and applied to the surface 23 of the transfer unit 9. In doing so, the first layer 3 is brought into contact with the surface 23 of the transfer unit 9 on the first side 25 of the adhesive structure 1.By bringing the first layer 3 on the first side 25 of the adhesive structure 1 into contact with the surface 23 of the transfer unit 9, the adhesive structure 1, once produced, can be transferred by the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a component to produce a device 29. The production of the device 29 will be discussed in detail later. After the first layer 3 has been produced, the second layer 15 is produced by gradually applying it to a surface of the first layer 3 facing away from the transfer unit 9.The multiple layers, i.e., the first layer 3 and the second layer 15, are therefore produced one after the other.

[0054] In the third process step 103, each layer, i.e., the first layer 3 and the second layer 15, is produced such that the first layer 3 has the edge section 5 already described arranged around the first layer 3 and the second layer 15 has several sections, each section of the several sections having a corresponding edge section 5 already described arranged around the corresponding section of the second layer 15.By manufacturing each layer, i.e., the first layer 3 and the second layer 15, such that the first layer 3 has the edge section 5 already described arranged around the first layer 3 and the second layer 15 has several sections, each section of which has a corresponding edge section 5 already described arranged around the corresponding section of the second layer 15, it is ensured that the first layer 3 and the second layer 15 are manufactured directly as they are intended to be for the adhesive structure 1.This applies in particular to the production of the first layer 3 and the second layer 15 such that the first layer 3 and the second layer 15 each extend in a corresponding principal extent plane of the respective layer according to a predetermined extent, so that the first layer 3 and the second layer 15 do not subsequently require further processing. This specifically excludes any change in the extent of the first layer 3 and the second layer 15 within the corresponding principal extent plane of the respective layer during the production of the first layer 3 and the second layer 15, which is the case, for example, when producing stamped parts manufactured using dies.By manufacturing each layer, i.e., the first layer 3 and the second layer 15, such that the first layer 3 has the previously described circumferential edge section 5 arranged around the first layer 3, and the second layer 15 has several sections, each section of which has a corresponding previously described circumferential edge section 5 arranged around the corresponding section of the second layer 15, it is ensured that the first layer 3 and the second layer 15, and thus also the adhesive structure 1, can be manufactured in a particularly resource-efficient manner. This is especially true compared to the production of die-cut parts, which are punched out from a blank and thus create sections of the blank that are not die-cut parts and therefore have to be disposed of or recycled. In this case, no such sections, which can also be referred to as die-cut slugs, are produced.

[0055] In the second embodiment of the inventive method for producing the adhesive structure 1, schematically depicted in Figure 9, the pressure-sensitive adhesive is also meltable at least in sections. This meltability ensures that the adhesive can be melted at least in sections in order to be applied to the transfer unit 9 in its molten state. To form the first layer 3 and the second layer 15, the pressure-sensitive adhesive is conveyed by the previously described extruder 17 and through the previously described heated nozzle 19 in such a way that the adhesive melts and then solidifies again to form the first layer 3 and the second layer 15.The first layer 3 and the second layer 15 can be produced, and therefore the adhesive structure 1 can be produced using Fused Deposition Modeling (FDM), Fused Layer Modelling (FLM), Liquid Additive Manufacturing (LAM) or Fused Granulate Fabrication (FGF).

[0056] In the second embodiment of the inventive method for producing the adhesive structure 1, schematically depicted in Figure 9, a liner 11 is brought into contact with the adhesive structure 1 in a fourth process step 104 on a second side 27 of the adhesive structure 1 opposite the first side 25. In the illustrated example, the liner 11 is brought into contact with the second layer 15 of the adhesive structure 1 on the second side 27 of the adhesive structure 1.By bringing the liner 11 into contact with the adhesive structure 1 on the second side 27 opposite the first side 25, it is ensured that the adhesive structure 1 can be protected from contamination by means of the liner 11, while the adhesive structure 1, after it has been produced, is moved by means of the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a first component 31 and, after the liner 11 has been removed again, the second layer 15 on the second side 27 of the adhesive structure 1 can be brought into contact with a surface of a second component 33 in order to produce a device 29.The manufacture of device 29 will be discussed in detail later.

[0057] The described process is intended for producing the adhesive structure 1. The first layer 3 is brought into contact with the surface 23 of the transfer unit 9. The transfer unit 9 ensures a certain degree of dimensional stability for transporting the adhesive structure 1, so that in its manufactured state, the first layer 3 of the adhesive structure 1 is initially in contact with the surface 23 of the transfer unit 9. For further use of the adhesive structure 1, the contact between the first layer 3 and the surface 23 of the transfer unit 9 can be broken, and the adhesive structure 1 can remain in its manufactured state. In addition, the second layer 15 is brought into contact with the liner 11. The liner 11 provides a certain degree of protection for transporting the adhesive structure 1, so that in its manufactured state, the second layer 15 of the adhesive structure 1 is initially in contact with the liner 11.For further use of the adhesive structure 1, the contact between the second layer 15 and the liner 11 can be broken again, and the adhesive structure 1 can remain in its manufactured state. These circumstances can be considered part of the manufacturing process of the adhesive structure 1 in connection with the present invention.

[0058] As already described, Figure 10 shows a schematic representation of the device 29, which has been manufactured using the second embodiment of the inventive method for manufacturing the device 29, and Figure 11 shows a schematic representation of the second embodiment of the inventive method for manufacturing the device 29. The previously described method for manufacturing the adhesive structure 1 can be incorporated into a method for manufacturing the device 29. The device 29 comprises the adhesive structure 1, a first component 31, which is a mobile phone, and a second component 33, which is a battery. The first component 31 and the second component 33 can be joined together using the adhesive structure 1.For example, if an old mobile phone battery is to be replaced by a new battery, i.e., by the second component 33, the old battery can first be detached from the mobile phone and the old adhesive structure that connected the old battery and the mobile phone removed. Now, the adhesive structure 1 and the second component 33, i.e., the new battery, can be prepared, and after both the adhesive structure 1 and the transfer unit 9 and the adhesive structure 1 and the liner 11 have been separated, the new battery and the mobile phone can be connected using the adhesive structure 1.

[0059] In the method for manufacturing the device 29, which comprises the manufactured adhesive structure 1, the first component 31, and the second component 33, the adhesive structure 1, the first component 31, and the second component 33 are provided in a first process step 101. In a second process step 102, the second layer 15 on the second side 27 of the adhesive structure 1 is separated from the liner 11 and brought into contact with the second component 33 on the second side 27 of the adhesive structure 1. In a third process step 103, the first layer of the multiple layers, i.e., the first layer 3, is separated from the surface 23 of the transfer unit 9 on the first side 25 of the adhesive structure 1, and the first layer of the multiple layers, i.e., the first layer 3, is brought into contact with a surface of the first component 31 on the first side 25 of the adhesive structure 1.

[0060] Figure 12 shows a schematic representation of a section of a first embodiment of a device 35 according to the invention for producing an adhesive structure 1, Figure 13 shows a schematic representation of a section of a second embodiment of a device 35 according to the invention for producing an adhesive structure, and Figure 14 shows a schematic representation of a section of a third embodiment of a device 35 according to the invention for producing an adhesive structure 1. Figure 5 shows a section of a fourth embodiment of the device 35 according to the invention for producing an adhesive structure 1.In the previously described methods for producing the adhesive structure 1, in the third process step 103 the first layer 3 is produced such that, while the first layer 3 is brought into contact with the surface 23 of the transfer unit 9, the first layer 3 is supplied with electrical charge carriers such that an electric force 37 acts on the first layer 3 in a direction towards the surface 23 of the transfer unit 9. The electric force 37 is symbolized by an arrow in Figures 5, 12, 13 and 14.By supplying the first layer 3 with electrical charge carriers such that an electrical force 37 acts on the first layer 3 in a direction towards the surface 23 of the transfer unit 9, it is ensured that a force in a direction towards the surface 23 of the transfer unit 9 is exerted on the first layer 3 by means of the electrical charge carriers while the first layer 3 is brought into contact with the surface 23 of the transfer unit 9.This force presses the first layer 3 against the surface 23 of the transfer unit 9, thus providing a slight adhesive effect between the first layer 3 and the surface 23 of the transfer unit 9 during its production. This slight adhesive effect, due to the force exerted on the first layer 3 by means of the electrical charge carriers, is sufficient to bond the first layer 3 and the surface 23 of the transfer unit 9 strongly enough during the production of the adhesive structure 1 and during subsequent transport. Furthermore, this slight adhesive effect is optimal for later use of the adhesive structure 1, as it allows the adhesive structure 1 to be removed from the surface 23 of the transfer unit 9, and this removal is particularly gentle on the adhesive structure 1.The first layer 3 is brought into contact with the surface 23 of the transfer unit 9 section by section. The first layer 3 is supplied with electrical charge carriers such that the corresponding section being brought into contact with the surface 23 of the transfer unit 9 is supplied with these charge carriers. Thus, an electrical force 37 acts on the corresponding section being brought into contact with the surface 23 of the transfer unit 9 in a direction towards the surface 23 of the transfer unit 9. By supplying the corresponding section being brought into contact with the surface 23 of the transfer unit 9 with the electrical charge carriers, a particularly precise force is exerted on the first layer 3.

[0061] The first layer 3 can be supplied with negative electrical charge carriers. Alternatively, the first layer 3 can be supplied with positive electrical charge carriers. This flexibility in supplying the first layer 3 with either negative or positive electrical charge carriers ensures that the process can be adapted to different situations.In the context of the present invention, it is preferably understood that the first layer 3 is supplied with electrical charge carriers, meaning that an electrical voltage is applied to the unit consisting of the at least partially produced first layer 3 and the transfer unit 9, such that opposite charge carriers accumulate in or on the first layer 3 and in or on the transfer unit 9, so that an electric force 37 acts on the first layer 3 in a direction towards the surface 23 of the transfer unit 9. For example, electrons, which can also be referred to as negative charge carriers, can accumulate in or on the first layer 3, and there can be a deficiency or absence of electrons in or on the transfer unit 9, a state which can also be described as the accumulation of positive charge carriers in or on the transfer unit 9.For example, electrons may accumulate in or on the transfer unit 9, and there may be a shortage or lack of electrons in or on the first layer 3.

[0062] As previously described, Figures 5, 12, 13, and 14 show sections of the device 35 for producing an adhesive structure 1. The device 35 comprises the previously described application unit 13 with a contact surface, which is the previously described surface 21 of the application unit 13, and a charge carrier supply unit 39 for supplying electrical charge carriers. The charge carrier supply unit 39 can supply the first layer 3 with electrical charge carriers. With the aid of the charge carrier supply unit 39, electrical charge carriers can be supplied such that, while the first layer 3 is being brought into contact with the surface 23 of the transfer unit 9, the first layer 3 is supplied with electrical charge carriers.As previously described, this ensures that while the first layer 3 is brought into contact with the surface 23 of the transfer unit 9, an electrical force 37 is exerted on the first layer 3 in a direction towards the surface 23 of the transfer unit 9 by means of the electrical charge carriers. This force presses the first layer 3 against the surface 23 of the transfer unit 9, so that a slight adhesive effect can be provided between the first layer 3 and the surface 23 of the transfer unit 9 during the formation of the first layer 3. This slight adhesive effect, due to the force exerted on the first layer 3 by the electrical charge carriers, is sufficient to bond the first layer 3 and the surface 23 of the transfer unit 9 strongly enough during the formation of the adhesive structure 1 and during subsequent transport.Furthermore, this low adhesive strength is optimal for the subsequent use of the adhesive structure 1, as the adhesive structure 1 can be removed from the surface 23 of the transfer unit 9, and this is particularly associated with low mechanical stress on the adhesive structure 1. The device 35 also includes a material supply unit 41 for supplying the adhesive compound. The material supply unit 41 includes the previously described extruder 17 and the previously described heated nozzle 19. In the device 35 for producing the adhesive structure 1 shown in Figure 5, the charge carrier supply unit 39 and the material supply unit 41 are connected to each other.By connecting the load carrier supply unit 39 and the material supply unit 41, it is ensured that the load carrier supply unit 39 follows a movement of the material supply unit 41, thus ensuring a mechanically particularly simple coupling of the movement of the load carrier supply unit 39 and the movement of the material supply unit 41.

[0063] In the first embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 12, the charge carrier supply unit 39 comprises a voltage source 43 and an electrode 45. The voltage source 43 is electrically connected to both the electrode 45 and the transfer unit 9, so that an electrical voltage can be applied between the electrode 45 and the transfer unit 9. The electrically conductive connection between the voltage source 43 and the transfer unit 9 is also electrically connected to "ground" 47. While the first layer 3 is brought into contact with the surface 23 of the transfer unit 9, the electrode 45 is brought into contact with the section of the first layer 3 that is currently in contact with the surface 23 of the transfer unit 9.The first embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 12, is designed such that while the first layer 3 is being brought into contact with the surface 23 of the transfer unit 9, the electrode 45 can be arranged at a distance from, but in close proximity to, the section of the first layer 3 that is currently being brought into contact with the surface 23 of the transfer unit 9. The electrode 45 can also be referred to as an HV electrode (high-voltage electrode). The charge carrier supply unit 39 can thus supply the first layer 3 with electrical charge carriers.

[0064] In the second embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 13, the charge carrier supply unit 39 also has a voltage source 43. The voltage source 43 is electrically connected to both the material supply unit 41, specifically to the heated nozzle 19, and the transfer unit 9, so that an electrical voltage can be applied between the material supply unit 41, specifically the heated nozzle 19, and the transfer unit 9. The electrically conductive connection between the voltage source 43 and the transfer unit 9 is also electrically connected to "ground" 47.While the first layer 3 is being brought into contact with the surface 23 of the transfer unit 9, the material supply unit 41, specifically the heated nozzle 19, is brought into contact with the section of the first layer 3 that is currently being brought into contact with the surface 23 of the transfer unit 9. The charge carrier supply unit 39 can thus supply the first layer 3 with electrical charge carriers.

[0065] In the third embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 14, the charge carrier supply unit 39 also has a voltage source 43. The voltage source 43 is electrically connected to both the material supply unit 41, specifically to the heated nozzle 19, and the transfer unit 9, so that an electrical voltage can be applied between the material supply unit 41, specifically to the heated nozzle 19, and the transfer unit 9. The electrically conductive connection between the voltage source 43 and the material supply unit 41, specifically to the heated nozzle 19, is also electrically connected to "ground" 47.While the first layer 3 is being brought into contact with the surface 23 of the transfer unit 9, the material supply unit 41, specifically the heated nozzle 19, is brought into contact with the section of the first layer 3 that is currently being brought into contact with the surface 23 of the transfer unit 9. The charge carrier supply unit 39 can thus supply the first layer 3 with electrical charge carriers.

[0066] In the first embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 12, in the second embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 13, and in the third embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 14, the voltage source 43 can be electrically connected to the transfer unit 9, so that an electrical voltage can be applied to the combination of the first layer 3 and the transfer unit 9 in order to supply the first layer 3 with electrical charge carriers while the first layer 3 is being brought into contact with the surface 23 of the transfer unit 9.that an electrical force 37 acts on the first layer 3 in a direction towards the surface 23 of the transfer unit 9. Alternatively, in the first embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 12, in the second embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 13, and in the third embodiment of the device 35 according to the invention for producing an adhesive structure 1, shown schematically in section 14, the voltage source 43 can be electrically connected to the application unit 13, so that an electrical voltage can be applied to a combination of the first layer 3 and the application unit 13, and thus also indirectly to the combination of the first layer 3 and the transfer unit 9, in order to,While the first layer 3 is brought into contact with the surface 23 of the transfer unit 9, the first layer 3 is supplied with electrical charge carriers such that an electrical force 37 acts on the first layer 3 in a direction towards the surface 23 of the transfer unit 9. If the voltage source 43 is electrically connected to the system unit 13, a particularly simple electrical connection is provided, since the system unit 13, as a section of the device 35 for producing an adhesive structure 1, can be permanently electrically connected to the voltage source 43. As already described in connection with different embodiments, the first layer 3 is supplied with electrical charge carriers such thatthat an electric force 37 acts on the first layer 3 in a direction towards the surface 23 of the transfer unit 9. In the manufactured state of the adhesive structure 1, the electric charge carriers dissipate. The dissipation of the electric charge carriers can be ensured, for example, by bringing positive and negative charge carriers so close to each other that, from the moment they are in close proximity, no electric force component of the electric force 37 emanates from these charge carriers. The dissipation of the electric charge carriers ensures that the first layer 3 on the first side 25 of the adhesive structure 1 can be easily separated from the surface 23 of the transfer unit 9 and that the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of the first component 31.

[0067] Although the steps of the described methods are presented in a specific order, the present invention is not limited to this order. Rather, the individual steps can be carried out in any meaningful order, and in particular, at least partially in parallel with one another.

[0068] It should be further noted that "having" does not exclude any other elements or steps, and "a" or "an" does not exclude a plurality. It should also be noted that features described with reference to one of the above embodiments may also be used in combination with other features of other embodiments described above. Reference numerals in the claims are not to be considered as a limitation.

[0069] Reference symbol list

[0070] I adhesive structure

[0071] 3 first shift

[0072] 5. Marginal section

[0073] 7 Environment of the adhesive structure

[0074] 9 transfer unit

[0075] II Liner

[0076] 13 plant units

[0077] 15 second shift

[0078] 17 extruders

[0079] 19 heated nozzles

[0080] 21 Surface area of ​​the plant unit

[0081] 23 Surface area of ​​the transfer unit

[0082] 25 first page of the adhesive structure

[0083] 27 second side of the adhesive structure

[0084] 29 Device with an adhesive structure

[0085] 31 first component

[0086] 33 second component

[0087] 35 Device for producing an adhesive structure

[0088] 37 electric power

[0089] 39 Load carrier provision unit

[0090] 41 Material supply unit

[0091] 43 Voltage source

[0092] 45 electrode

[0093] 47 Earth

[0094] 101 First procedural step

[0095] 102 second procedural step

[0096] 103 third procedural step

[0097] 104 fourth procedural step

Claims

Claims 1. Method for producing an adhesive structure (1), wherein the adhesive structure (1) comprises one or more layers arranged one above the other and produced successively, wherein the layer or each layer of the multiple layers is formed from an adhesive composition, wherein the layer or each layer of the multiple layers is produced such that the layer or each layer of the multiple layers has at least one edge section (5) arranged circumferentially around the corresponding layer or around a corresponding section of the layer, wherein the layer or a first produced layer of the multiple layers is brought into contact with a surface (23) of a transfer unit (9) on a first side (25) of the adhesive structure (1), and wherein, while the layer or the first produced layer of the multiple layers is brought into contact with the surface (23) of the transfer unit (9),the layer or the first layer produced of the several layers is supplied with electrical charge carriers in such a way that an electrical force (37) acts on the layer or the first layer produced of the several layers in a direction towards the surface (23) of the transfer unit (9).

2. Method according to the preceding claim, wherein the layer or the first layer produced of the multiple layers is supplied with negative electrical charge carriers.

3. Method according to claim 1, wherein the layer or the first layer produced of the multiple layers is supplied with positive electrical charge carriers.

4. Method according to any of the preceding claims, wherein the transfer unit (9) is a release liner.

5. Method according to one of the preceding claims, wherein a liner (11) is brought into contact with the adhesive structure (1) on a second side (27) opposite the first side (25) of the adhesive structure (1).

6. A method according to any of the preceding claims, wherein the pressure-sensitive adhesive is meltable at least in sections, wherein the pressure-sensitive adhesive is extruded (17) to form the layer or each layer of the multiple layers. a heated nozzle (19) is conveyed in such a way that the adhesive melts and solidifies again to form the layer or each layer of the several layers.

7. Method for producing a device (29) comprising a component and an adhesive structure (1) produced by a method according to one of the preceding claims, wherein the component and the produced adhesive structure (1) are provided, the layer or the first produced layer of the multiple layers on the first side (25) of the adhesive structure (1) is separated from the surface (23) of the transfer unit (9), and the layer or the first produced layer of the multiple layers on the first side (25) of the adhesive structure (1) is brought into contact with a surface of the component.

8. Device (35) for producing an adhesive structure (1), wherein the adhesive structure (1) comprises one or more layers arranged one above the other and produced successively, wherein the layer or each layer of the multiple layers is formed from an adhesive compound, wherein the device (35) comprises a mounting unit (13) with a mounting surface and a charge carrier supply unit (39) that can supply the layer or the first layer produced of the multiple layers with electrical charge carriers.

9. Device (35) according to claim 8, wherein the device (35) has a material supply unit (41) for supplying the adhesive compound, wherein the load carrier supply unit (39) and the material supply unit (41) are connected to each other.

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