Conveying and pecvd processing apparatus

Abstract

The present invention relates to a conveying and PECVD processing apparatus, comprising a rack, a first conveying unit, a second conveying unit, a loading and unloading unit, a transfer unit and a furnace tube unit, wherein the rack has a lower-layer area and an upper-layer area; a first conveying zone, a second conveying zone and a loading and unloading zone are sequentially provided in the lower-layer area; a processing zone is provided in the upper-layer area; a transfer zone brings the upper-layer area into communication with the lower-layer area; the first conveying unit is arranged in the first conveying zone; the second conveying unit is arranged in the second conveying zone; the loading and unloading unit is arranged in the loading and unloading zone; the transfer unit is arranged in the transfer zone; and the furnace tube unit is arranged in the processing zone. The PECVD furnace tube unit and an automatic loading and unloading mechanism of the present invention are integrated, such that the conveying and PECVD processing apparatus has a small occupied space, a compact structure, a high cost-performance ratio, a high degree of automation and high stability; moreover, the effect that a carrier stably and reliably enters and exits from the furnace tube unit can be realized.

Description

A conveying and PECVD processing device

[0001] This application claims priority to Chinese Patent Application No. 2024218992015, filed on August 7, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application belongs to the technical field of solar cell processing, and specifically relates to a conveying and PECVD processing device. BACKGROUND

[0003] Currently, PECVD (Plasma Enhanced Chemical Vaper Deposition) is a commonly used thin film deposition technology in the semiconductor industry. The thin film deposited by PECVD has excellent electrical properties, good substrate adhesion, and excellent step coverage. Due to these advantages, it has a wide range of applications in ultra-large scale integrated circuits, optoelectronic devices, MEMS, etc.

[0004] In the manufacturing process of crystalline silicon solar cells, a tubular PECVD processing device is usually used to manufacture silicon wafers. Before processing, the silicon wafers from the previous process are taken out by a carrier and loaded into a graphite boat. After the silicon wafers are placed, the graphite boat is sent into the reaction cavity of the process equipment for PECVD processing. After PECVD processing, the graphite boat is sent out, and after it cools down, the PECVD-processed silicon wafers are taken out from the graphite boat, loaded into the carrier, and sent to the next process.

[0005] The traditional tubular PECVD process equipment and front-end automation equipment adopt a linear layout, which results in a large volume of corresponding machines, a large floor space, and a lot of wasted space. SUMMARY

[0006] The purpose of the present application is to provide a conveying and PECVD processing device.

[0007] To achieve the above purpose, the technical solution adopted by the present application is as follows:

[0008] A conveying and PECVD processing device, comprising:

[0009] A rack, the rack having a lower area and an upper area, the lower area being sequentially provided with a first transmission area, a second transmission area, and a loading and unloading area, the upper area being provided with a processing area, and a flow area being connected to the upper area and the lower area;

[0010] A first transmission unit, the first transmission unit being arranged in the first transmission area and being used for conveying empty / full first carriers;

[0011] The second conveying unit is arranged in the second conveying area and is used for loading or unloading the silicon wafer into or from the first carrier;

[0012] The loading and unloading unit is arranged in the loading and unloading area and is used for inserting or taking out the silicon wafer into or from the second carrier;

[0013] The flow transfer unit is arranged in the flow transfer area and is used for conveying the second carrier loaded with the silicon wafer;

[0014] The furnace pipe unit is arranged in the processing area and is used for performing the PECVD process on the silicon wafer.

[0015] Preferably, the first conveying unit comprises:

[0016] The first conveying track extends in the front-rear direction and is used for conveying the empty / full first carrier;

[0017] The first buffer module is used for storing the empty / full first carrier, and a plurality of first buffer modules are arranged and distributed in the left-right direction, and each first buffer module can store one empty / full first carrier;

[0018] The switching module is respectively connected with the first conveying track and the first buffer module and is used for transferring the empty / full first carrier on the first conveying track to the first buffer module.

[0019] Further preferably, a plurality of first conveying tracks are arranged, at least one first conveying track is used for feeding conveying, and at least one first conveying track is used for discharging conveying, so that the empty first carrier and the full first carrier can be conveyed respectively.

[0020] Further preferably, the switching module comprises a switching track and a switching sliding seat, the switching track extends in the left-right direction, the switching sliding seat is arranged on the switching track, and the switching sliding seat moves left and right on the switching track; when the switching sliding seat is connected with the first conveying track, the first carrier can be conveyed; and when the switching sliding seat is connected with the first buffer module, the first carrier can be conveyed out.

[0021] Further preferably, the number of the second conveying units is consistent with the number of the first buffer modules, each first buffer module is connected with one second conveying unit, and each second conveying unit can transfer the silicon wafer in the first carrier on the first buffer module.

[0022] Preferably, the second conveying unit comprises:

[0023] The lifting module is connected with the first conveying unit, and is used for loading or unloading the silicon wafer into or from the first carrier.

[0024] The second conveying track extends in the front-rear direction and is connected with the lifting module, and is used for conveying the silicon wafer.

[0025] The second buffer module is connected with the second conveying track, and is used for storing the silicon wafer.

[0026] Further preferably, the first conveying unit is provided in two groups, and the two groups of the first conveying unit are arranged in an up-down manner.

[0027] Preferably, the loading and unloading unit comprises:

[0028] The conveying module is connected with the flow transfer unit, and is used for placing and conveying the second carrier.

[0029] The robot is used for loading the silicon wafer sucked from the second conveying unit into the second carrier on the conveying module, or transferring the silicon wafer sucked from the second carrier on the conveying module to the second conveying unit.

[0030] Further preferably, the conveying module is arranged on the left and right sides of the robot, so that the silicon wafer to be subjected to PECVD treatment and the silicon wafer having completed PECVD treatment can be loaded and unloaded respectively.

[0031] Preferably, the flow transfer unit comprises:

[0032] The second conveying module is connected with the loading and unloading unit, and is used for conveying the second carrier loaded with the silicon wafer between the second conveying module and the loading and unloading unit.

[0033] The third buffer module is used for storing the second carrier loaded with the silicon wafer.

[0034] The conveying module is used for conveying the second carrier loaded with the silicon wafer into or out of the furnace tube unit.

[0035] The conveying module is used for conveying the second carrier loaded with the silicon wafer among the second conveying module, the third buffer module and the conveying module.

[0036] Further preferably, the second conveying module, the third buffer module and the paddle conveying module are each provided with two columns, and the third buffer module and the paddle conveying module are each provided with multiple rows; the number of the third buffer module and the paddle conveying module is consistent.

[0037] Further preferably, the conveying module comprises a pair of first guide rods, a pair of second guide rod assemblies, a conveying assembly and a driving assembly, the pair of first guide rods extends in a vertical direction, the pair of second guide rod assemblies are respectively connected to the pair of first guide rods and are movable on the pair of first guide rods, the conveying assembly is connected between the pair of second guide rod assemblies and is movable between the pair of second guide rod assemblies, and the driving assembly is used to drive the pair of second guide rod assemblies and the conveying assembly to move.

[0038] Further preferably, the second guide rod assembly comprises a second fixed guide rod and a second telescopic guide rod, the second fixed guide rod is movably connected to the first guide rod, the second telescopic guide rod is movably connected to the second fixed guide rod, the conveying assembly is movably connected to the pair of second telescopic guide rods, the second telescopic guide rod is movable on the second fixed guide rod, and the conveying assembly is movable on the second telescopic guide rod, so that the moving range of the conveying assembly is larger.

[0039] Further preferably, the conveying assembly comprises a connecting rod and a hook portion, the connecting rod is movably connected between the pair of second guide rod assemblies, the hook portion is connected to the connecting rod and is used to hook the second carrier, and the hook portion is provided in pairs, and a pair of hook portions hook the hanging ears at both ends of the second carrier.

[0040] Further preferably, the furnace pipe unit comprises a plurality of PECVD furnace bodies, the PECVD furnace bodies are horizontally arranged and provided in multiple rows, each row of the PECVD furnace bodies is provided with multiple PECVD furnace bodies, and each PECVD furnace body corresponds to a paddle conveying module.

[0041] Thanks to the above technical solution, the present application has the following advantages compared with the prior art:

[0042] The PECVD furnace pipe unit and the automatic feeding and discharging unit are integrally arranged, the present application has small footprint, is exquisite and compact, has high cost performance, high automation degree and high stability, and can realize stable and reliable entry and exit of the carrier into the furnace pipe unit. BRIEF DESCRIPTION OF DRAWINGS

[0043] Fig. 1 is a schematic diagram of the overall layout of the equipment of the present application;

[0044] Fig. 2 is a schematic diagram of the first conveying unit of the present application;

[0045] Fig. 3 is a front view of the second transfer unit of the present application;

[0046] Fig. 4 is a top view of the second transfer unit of the present application;

[0047] Fig. 5 is a front view of the loading and unloading unit of the present application;

[0048] Fig. 6 is a top view of the loading and unloading unit of the present application;

[0049] Fig. 7 is a front view of the flow transfer unit of the present application;

[0050] Fig. 8 is a perspective view of the convey module of the present application;

[0051] Fig. 9 is a front view of the convey module of the present application;

[0052] Fig. 10 is a front view of the furnace tube unit of the present application.

[0053] In the above figures:

[0054] 1, rack; 10, first transfer area; 11, second transfer area; 12, loading and unloading area; 13, processing area; 14, flow transfer area;

[0055] 2, first transfer unit; 20, first conveying track; 21, first buffer module; 22, switching module; 220, switching track; 221, switching slide;

[0056] 3, second transfer unit; 30, lifting module; 31, second conveying track; 32, second buffer module;

[0057] 4, loading and unloading unit; 40, conveying module; 41, robot hand;

[0058] 5, flow transfer unit; 50, second conveying module; 51, third buffer module; 52, paddle transfer module; 53, convey module; 530, first guide rod; 5310, second fixed guide rod; 5311, second telescopic guide rod; 5320, connecting rod; 5321, hook portion;

[0059] 6, furnace tube unit. DETAILED DESCRIPTION

[0060] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0061] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0062] A conveying and PECVD processing device as shown in FIG. 1, comprising a rack 1, a first conveying unit 2, a second conveying unit 3, a loading and unloading unit 4, a flow transfer unit 5, and a furnace tube unit 6. The following will be described in detail.

[0063] In this embodiment, the rack 1 is defined as the front end at the left side end of FIG. 1, and the rear end at the right side end; the face on which FIG. 1 is located is defined as the left side, and the opposite face is defined as the right side.

[0064] The rack 1 serves as the frame of the entire all-in-one machine, having a lower area and an upper area. The lower area is sequentially provided with a first conveying area 10, a second conveying area 11, and a loading and unloading area 12. The upper area is provided with a processing area 13. A flow transfer area 14 communicates the upper area and the lower area, i.e., the first conveying area 10, the second conveying area 11, the loading and unloading area 12, the flow transfer area 14, and the processing area 13 are sequentially distributed along a process conveying path. Correspondingly, the first conveying unit 2, the second conveying unit 3, the loading and unloading unit 4, the flow transfer unit 5, and the furnace tube unit 6 of the device are all arranged in the corresponding areas within the frame 1. It should be noted that each area is only a spatial division and does not have a structural separation. As shown in FIG. 1, these areas are distributed in a horizontal U shape. In this way, the reduction in the overall size of the device also means the reduction in the size of the rack 1.

[0065] The first conveying unit 2 is arranged in the first conveying area 10 and is used for conveying empty / full first carriers. As shown in FIG. 2, in this embodiment, the first conveying unit includes a first conveying track 20, a first buffer module 21, and a switching module 22. Among them:

[0066] The first conveying track 20 is used for conveying empty / full first carriers. The front end of the first conveying track 20 is also the inlet / outlet of the entire device. The first conveying track 20 extends horizontally in the front-rear direction and is provided with multiple tracks, at least two tracks, one for feeding and one for discharging. In this way, empty first carriers and full first carriers can be conveyed respectively, meeting the need for simultaneous conveying.

[0067] In one embodiment of the present embodiment: the first conveying unit 2 is provided with two groups, the two groups of first conveying units 2 are arranged above and below, the lower first conveying unit 2 conveys the full first carriers, and the upper first conveying unit 2 conveys the empty first carriers.

[0068] The first buffer module 21 is used for storing the empty / full first carriers. The first buffer module 21 is provided with a plurality of first buffer modules 21, which are distributed in the left-right direction, and each first buffer module 21 can store one empty / full first carrier, and five are shown in the figure. In the present embodiment: the first buffer module 21 is also provided with a track, and the full first carrier on the first buffer module 21 can be conveyed to the second conveying unit 3.

[0069] The switching module 22 is respectively connected with the first conveying track 20 and the first buffer module 21, and is used for transferring the empty / full first carrier on the first conveying track 20 to the first buffer module 21. In the present embodiment: the switching module 22 includes a switching track 220 and a switching slide 221, the switching track 220 extends horizontally in the left-right direction, the switching slide 221 is arranged on the switching track 220, and the switching slide 221 is also provided with a track, which extends horizontally in the front-back direction, the switching slide 221 moves left and right on the switching track 220, when the switching slide 221 is connected with the first conveying track 20, the first carrier can be conveyed, when the switching slide 221 is connected with the first buffer module 21, the first carrier can be conveyed out, and vice versa.

[0070] The second conveying unit 3 is arranged in the second conveying area 11, and is used for inserting or taking out the silicon wafer from the first carrier. As shown in FIGS. 3 and 4: in the present embodiment: the second conveying unit includes a lifting module 30, a second conveying track 31, and a second buffer module 32. Among them:

[0071] The lifting module 30 is connected with the first buffer module 21 of the first conveying unit 2, and is used for inserting or taking out the silicon wafer from the first carrier.

[0072] The second conveying track 31 is connected with the lifting module 30, and is used for conveying the silicon wafer. The second conveying track 31 extends horizontally in the front-back direction.

[0073] The second buffer module 32 is connected with the second conveying track 31, and is used for storing the silicon wafer.

[0074] The working process of the second conveying unit 3 is as follows: the lifting module 30 takes out the silicon wafer in the first carrier and conveys it out through the second conveying track 31 while being lifted to the second conveying track 31, and the second conveying track 31 conveys the silicon wafer to the second buffer module 32 for storage, and vice versa.

[0075] In one embodiment of the present embodiment: the number of second transfer units 3 is consistent with the number of first buffer modules 21, each first buffer module 21 is interfaced with a second transfer unit 3, and each second transfer unit 3 can transfer a silicon wafer in a first carrier on a first buffer module 21.

[0076] It should be noted that the structure of the second transfer unit 3 is not the point of the present application, and existing structures such as the transfer mechanism of CN217334037U can be used, and will not be described here.

[0077] The loading and unloading unit 4 is arranged in the loading and unloading area 12, and is used to insert or remove the silicon wafer from the second carrier, and the second carrier can adopt a graphite boat. As shown in FIGS. 5 and 6: in the present embodiment: the loading and unloading unit includes a conveying module 40 and a robot 41. Among them:

[0078] The conveying module 40 is interfaced with the flow transfer unit 5, and is used to place and convey the second carrier. In the present embodiment: the conveying module 40 is also provided with a track, and the second carrier on the conveying module 40 can be conveyed to the flow transfer unit 5.

[0079] The robot 41 is used to insert the silicon wafer sucked from the second buffer module 32 of the second transfer unit 3 into the second carrier on the conveying module 40, or to transfer the silicon wafer sucked from the second carrier on the conveying module 40 to the second buffer module 32 of the second transfer unit 3.

[0080] In one embodiment of the present embodiment: the conveying module 40 is arranged on the left and right sides of the robot 41, so that the silicon wafers requiring PECVD processing and the silicon wafers having completed PECVD processing can be loaded and unloaded respectively.

[0081] The flow transfer unit 5 is arranged in the flow transfer area, and is used to convey the second carrier loaded with the silicon wafer. As shown in FIG. 7: in the present embodiment: the flow transfer unit 5 includes: a second conveying module 50, a third buffer module 51, a paddle module 52, and a conveying module 53. Among them:

[0082] The second conveying module 50 is interfaced with the conveying module 40 of the loading and unloading unit 4, and is used to convey the second carrier loaded with the silicon wafer between the second conveying module 50 and the conveying module 40 of the loading and unloading unit 4. Similarly, the second conveying module 50 is also provided with a track, and the second carrier on the second conveying module 50 can be conveyed to the conveying module 40 of the loading and unloading unit 4.

[0083] The third buffer module 51 is used to store the second carrier loaded with the silicon wafer, such as storing the second carrier loaded with the silicon wafer to be subjected to PECVD processing, or storing the second carrier loaded with the silicon wafer having completed PECVD processing for cooling.

[0084] The paddle transfer module 52 is used to send or remove the second carrier loaded with the silicon wafer into or out of the furnace tube unit.

[0085] In the embodiment, the second conveying module 50, the third buffer module 51 and the paddle transfer module 52 are sequentially arranged from bottom to top, and each of the second conveying module 50, the third buffer module 51 and the paddle transfer module 52 is provided with two columns. The second conveying module 50 is provided with one column on the left and one column on the right. The third buffer module 51 and the paddle transfer module 52 are each provided with multiple columns from top to bottom. In the drawings, the third buffer module 51 and the paddle transfer module 52 are each provided with three columns. The number of the third buffer module 51 and the paddle transfer module 52 is consistent.

[0086] The conveying module 53 is used to convey the second carrier loaded with the silicon wafer between the second conveying module 50, the third buffer module 51 and the paddle transfer module 52.

[0087] In one embodiment of the embodiment, as shown in FIGS. 8 and 9, the conveying module 53 includes a pair of first guide rods 530, a pair of second guide rod assemblies, a conveying assembly and a driving assembly. Specifically:

[0088] The pair of first guide rods 530 are arranged on the rack 1 and each extends in the vertical direction. The pair of first guide rods 530 are distributed in front and back. The pair of second guide rod assemblies are respectively connected to the pair of first guide rods 530 and are movable on the pair of first guide rods 530. The conveying assembly is connected between the pair of second guide rod assemblies and is movable between the pair of second guide rod assemblies. The driving assembly is used to drive the pair of second guide rod assemblies and the conveying assembly to move. In this way, the second guide rod assemblies move up and down on the first guide rods 530, driving the conveying assembly to move up and down. At the same time, the assemblies move left and right between the pair of second guide rod assemblies, thereby realizing conveying in up, down, left and right directions.

[0089] In the embodiment, the second guide rod assembly includes a second fixed guide rod 5310 and a second telescopic guide rod 5311. The second fixed guide rod 5310 is movably connected to the first guide rod 530. The second telescopic guide rod 5311 is movably connected to the second fixed guide rod 5310. The conveying assembly is movably connected to the pair of second telescopic guide rods 5311. Since the second telescopic guide rod 5311 is movable on the second fixed guide rod 5310 and can move left or right relative to the second fixed guide rod 5310, the conveying assembly can move left or right on the second telescopic guide rod 5311, so that the moving range of the conveying assembly in the left-right direction is larger, meeting the conveying of various positions.

[0090] In the embodiment, the conveying assembly includes a connecting rod 5320 and a hook portion 5321, the connecting rod 5320 is movably connected between the second telescopic guide rods 5311 of the pair of second guide rod assemblies, and the hook portion 5321 is connected to the connecting rod 5320 and used for hooking the second carriers. The hook portions 5321 are usually arranged in pairs, and a pair of hook portions 5321 hook the hanging ears at the two ends of the second carrier. The hook portions 5321 are arranged in multiple groups, so that multiple groups of second carriers can be conveyed on one connecting rod 5320 at the same time. In the illustration, the hook portions 5321 are arranged in two groups, and two groups of second carriers can be conveyed at the same time.

[0091] The furnace tube unit 6 is arranged in the processing area and used for PECVD processing of the silicon wafer. In the embodiment, as shown in FIG. 10, the furnace tube unit 6 includes multiple PECVD furnace bodies, the PECVD furnace bodies are arranged horizontally and in multiple groups, each of the PECVD furnace bodies is arranged in two rows, and each row is arranged in multiple groups, for example, three groups in each row in the illustration. Each PECVD furnace body corresponds to one paddle module 52.

[0092] Compared with the prior art in which six PECVD furnace bodies are arranged vertically, the six PECVD furnace bodies are divided into two rows in the application, the height is reduced, the PECVD furnace bodies are integrated into the equipment, and the floor area of the equipment is reduced.

[0093] The above embodiments are only used to illustrate the technical concept and characteristics of the application, and the purpose is to enable those skilled in the art to understand the content of the application and implement it, and cannot limit the protection scope of the application. Any equivalent changes or modifications made according to the spirit and essence of the application should be covered within the protection scope of the application.

Claims

1. A transport and PECVD processing apparatus, characterized by: The utility model relates to a kind of wafer processing equipment, including: Rack: the rack has lower area, upper area, the lower area is sequentially provided with first transport area, second transport area, loading and unloading area, the upper area is provided with processing area, flow area is communicated the upper area, lower area; First transport unit: the first transport unit is arranged in the first transport area, for empty / full first carrier is transported; Second transport unit: the second transport unit is arranged in the second transport area, for silicon wafer is loaded into first carrier or is taken out from first carrier; Loading and unloading unit: the loading and unloading unit is arranged in the loading and unloading area, for silicon wafer is loaded into second carrier or is taken out from second carrier; Flow unit: the flow unit is arranged in the flow area, for the second carrier loaded with silicon wafer is transported; Furnace tube unit: the furnace tube unit is arranged in the processing area, for silicon wafer is treated by PECVD.

2. The transport and PECVD processing apparatus of claim 1, wherein: The first transport unit includes: First conveying track: the first conveying track extends along front-back direction, for empty / full first carrier is transported; First cache module: the first cache module is used for empty / full first carrier is deposited, the first cache module is provided with multiple, multiple first cache module is distributed in left-right direction, and each first cache module can deposit one empty / full first carrier; Switching module: the switching module is respectively connected with the first conveying track, first cache module, for empty / full first carrier on the first conveying track is transferred to the first cache module.

3. The transport and PECVD processing apparatus of claim 2, wherein: The first conveying track is provided with multiple, and at least one first conveying track is used for feeding delivery, and at least one first conveying track is used for discharge delivery.

4. The transport and PECVD processing apparatus of claim 2, wherein: The switching module includes switching track, switching slide, the switching track extends in left-right direction, the switching slide is arranged on the switching track, and the switching slide moves left and right on the switching track, when the switching slide is connected with the first conveying track, first carrier can be transported, when the switching slide is connected with the first cache module, first carrier can be transported.

5. The transport and PECVD processing apparatus of claim 2, wherein: The number of the second transport unit is consistent with the number of the first cache module, and each first cache module is connected with one second transport unit.

6. The transport and PECVD processing apparatus of claim 1 or 5, wherein: The second transport unit includes: Lifting module: the lifting module is connected with the first transport unit, and the lifting module is used for loading silicon wafer into first carrier or taking silicon wafer out of first carrier; Second conveying track: the second conveying track extends along front-back direction and is connected with the lifting module, for silicon wafer is transported; Second cache module: the second cache module is connected with the second conveying track, and the second cache module is used for storing silicon wafer.

7. The transport and PECVD processing apparatus of claim 1 or 6, wherein: The first transport unit is provided with two groups, and two first transport units are arranged in upper and lower directions.

8. The transport and PECVD processing apparatus of claim 1, wherein: The loading and unloading unit includes: First conveying module: the first conveying module is connected with the flow unit, for placing and conveying second carrier; The robot is used to insert the wafer sucked from the second conveying unit into the second carrier on the first conveying module, or transfer the wafer sucked from the second carrier on the first conveying module to the second conveying unit.

9. The transport and PECVD processing apparatus of claim 8, wherein: The first conveying module is arranged on the left and right sides of the robot.

10. The transport and PECVD processing apparatus of claim 1, wherein: The flow transfer unit comprises: The second conveying module is connected with the loading and unloading unit, and is used to convey the second carrier loaded with the wafer between the loading and unloading unit and the second conveying module; The third buffer module is used to store the second carrier loaded with the wafer; The paddle transfer module is used to send or remove the second carrier loaded with the wafer into or out of the furnace tube unit; The conveying module is used to convey the second carrier loaded with the wafer among the second conveying module, the third buffer module and the paddle transfer module.

11. The transport and PECVD processing apparatus of claim 10, wherein: The second conveying module, the third buffer module and the paddle transfer module are arranged in two rows, and each row of the third buffer module and the paddle transfer module is arranged in multiple layers.

12. The transport and PECVD processing apparatus of claim 10, wherein: The conveying module comprises a pair of first guide rods, a pair of second guide rod assemblies, a conveying assembly and a driving assembly, the first guide rods extend in the vertical direction, the second guide rod assemblies are connected to the first guide rods and can move on the first guide rods, the conveying assembly is connected between the second guide rod assemblies and can move between the second guide rod assemblies, and the driving assembly is used to drive the second guide rod assemblies and the conveying assembly to move.

13. The transport and PECVD processing apparatus of claim 12, wherein: The second guide rod assembly comprises a second fixed guide rod and a second telescopic guide rod, the second fixed guide rod is movably connected to the first guide rod, and the second telescopic guide rod is movably connected to the second fixed guide rod, and the conveying assembly is movably connected to the second telescopic guide rods.

14. The transport and PECVD processing apparatus of claim 12, wherein: The conveying assembly comprises a connecting rod and a hook portion, the connecting rod is movably connected between the second guide rod assemblies, and the hook portion is connected to the connecting rod and used to hook the second carrier.

15. The transport and PECVD processing apparatus of claim 1, wherein: The furnace tube unit comprises a plurality of PECVD furnace bodies, the PECVD furnace bodies are arranged in multiple rows and horizontally, and each row of the PECVD furnace bodies is arranged in multiple layers. Each PECVD furnace body corresponds to a paddle transfer module.

16. A transport and PECVD processing apparatus, characterized by: The rack comprises a lower area and an upper area, the lower area is sequentially provided with a first conveying area, a second conveying area and a loading and unloading area, the upper area is provided with a processing area, and a flow transfer area is connected between the upper area and the lower area. ​ The first conveying unit is arranged in the first conveying area and used for conveying the empty / full first carriers, and comprises a first conveying track used for conveying the empty / full first carriers, a first buffer module used for storing the empty / full first carriers, and a switching module respectively connected with the first conveying track and the first buffer module and used for transferring the empty / full first carriers on the first conveying track to the first buffer module. The second conveying unit is arranged in the second conveying area and used for loading or unloading the silicon wafers into / from the first carriers, and comprises a lifting module connected with the first conveying unit and used for loading or unloading the silicon wafers into / from the first carriers, a second conveying track connected with the lifting module and used for conveying the silicon wafers, and a second buffer module connected with the second conveying track and used for storing the silicon wafers. The loading / unloading unit is arranged in the loading / unloading area and used for loading or unloading the silicon wafers into / from the second carriers, and comprises a first conveying module connected with the flow transfer unit and used for placing or conveying the second carriers, a robot used for inserting the silicon wafers sucked from the second conveying unit into the second carriers on the first conveying module or transferring the silicon wafers sucked from the second carriers on the first conveying module to the second conveying unit. The furnace tube unit is arranged in the processing area and used for PECVD processing of the silicon wafers, and comprises a plurality of PECVD furnace bodies arranged horizontally and in multiple rows, each of which is provided with two rows of left and right PECVD furnace bodies arranged vertically. The flow transfer unit is arranged in the flow transfer area and used for conveying the second carriers loaded with the silicon wafers, and comprises a second conveying module connected with the loading / unloading unit and used for conveying the second carriers loaded with the silicon wafers between the loading / unloading unit, a third buffer module used for storing the second carriers loaded with the silicon wafers, a transmission paddle module used for sending or removing the second carriers loaded with the silicon wafers into or out of the furnace tube unit, and a conveying module used for conveying the second carriers loaded with the silicon wafers between the second conveying module, the third buffer module and the transmission paddle module. The flow transfer unit is arranged in the flow transfer area and used for conveying the second carriers loaded with the silicon wafers, and comprises a second conveying module connected with the loading / unloading unit and used for conveying the second carriers loaded with the silicon wafers between the loading / unloading unit, a third buffer module used for storing the second carriers loaded with the silicon wafers, a transmission paddle module used for sending or removing the second carriers loaded with the silicon wafers into or out of the furnace tube unit, and a conveying module used for conveying the second carriers loaded with the silicon wafers between the second conveying module, the third buffer module and the transmission paddle module. The third buffer module and the transmission paddle module are arranged in two rows, and each of the third buffer module and the transmission paddle module is arranged in multiple rows vertically.

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