Radar head device for a photonic radar having a circuit formed in die-stacking

Abstract

The invention relates to radar head devices of photonic radar systems, which radar head devices are designed as transmitter and / or receiver modules and are used for detecting surroundings, in particular of vehicles. The invention also relates to such photonic radar systems. In order to allow a flexible and compact design and to limit resource consumption with respect to semiconductor material and installation space, the invention proposes that a radar head device (300, 300-n) for a photonic radar system (100) is created in which a signal is transmitted between a central station (200) and the radar head device (300, 300-n) by means of a modulated carrier signal transmitted via at least one optical transmission medium (400, 400-n), wherein the radar head device comprises an electronic semiconductor circuit chip (800) and a photonic semiconductor circuit chip (700), wherein the electronic semiconductor circuit chip (800) and the photonic semiconductor circuit chip (700) are connected to one another in a die-stacking arrangement (950).

Description

[0001] Description

[0002] Radar head assembly for a photonic radar with a die-stacking circuit

[0003] The invention relates to radar head devices designed as transmitter and / or receiver modules of photonic radar systems, which are used for environmental detection, in particular of vehicles, and in particular to the circuit design of the radar head devices.

[0004] In a photonic radar system, the radar signal information to be transmitted is generated in a central station, and the acquired radar echo information is evaluated in the central station. The transmission of the radar signal information to be transmitted and the acquired radar echo information is carried out optically using an optical carrier signal onto which the transmitted radar signal information and the acquired radar echo information are modulated.

[0005] A radar head unit configured as a transmitter module converts the transmitted radar signal information into an electromagnetic radar signal and transmits it via an antenna coupled to it. A radar head unit configured as a receiver module receives the reflected electromagnetic radar signal via an antenna coupled to the radar head unit. The receiver module extracts the radar echo information from this signal and modulates it onto the carrier signal for transmission back to the central station.

[0006] To achieve high angular resolution, photonic radar systems typically incorporate a multitude of radar head units, configured as transmitter and / or receiver modules, arranged at intervals from one another in an array known as an antenna array. The achievable resolution is primarily determined by the geometric size, i.e., the dimensions, of the antenna array. The generation of all transmitted radar signal information and the processing of all acquired radar echo information are performed simultaneously at the central station. The use of an optical carrier signal for signal transmission between the central station and the radar head units enables phase-locked signal transmission. When this is employed, the system is referred to as coherent processing.

[0007] Photonic radar systems of the type mentioned above are known from the prior art. Since the signal transmission between the central station and the corresponding radar head is optical, each radar head requires a photonic semiconductor circuit. The emitted electromagnetic radar signal, however, lies in a frequency range for which electronic semiconductor circuits are required for processing, e.g., amplification.

[0008] Electronically-photonically cointegrated chips or semiconductor circuits (EPICs) are known from the prior art. These are monolithic and comprise photonic devices in regions with silicon on an insulator (silicon-on-insulator) and electronic devices in regions with solid-state silicon (bulk silicon) on a wafer.

[0009] The technological effort required to manufacture these EPIC chips is very high.

[0010] From US2021 / 0257396 A1, a single- and dual-path light detection and distance measurement system (LiDAR) is known which can transmit and receive light through the back side of a photonic integrated circuit (PIC) on a silicon substrate. The PIC can be connected to an electrical integrated circuit (EIC), with one front side connected to the EIC via electrical contacts and one back side facing away from the EIC. High-density coupler elements (e.g., pixels, gratings) can transmit and receive infrared light, which propagates through the PIC layers and the back side to the objects to be detected.

[0011] US 2024 / 0036254 A1 describes high-performance optical input and output circuits for data processors.

[0012] The W02023 / 062910 A1 patent describes a distance measuring device comprising a first substrate including a first optical waveguide configured to transmit a chirp signal, a splitter configured to split the chirp signal into a transmission signal and a reference signal, and a coupler and detector block configured to output a beat signal based on the reference signal and a reflected signal. The distance measuring device includes a second substrate stacked on top of the first substrate, comprising a converter configured to output a digital beat signal based on the beat signal, and a controller configured to output an electronic control signal that controls the generation of the chirp signal. Distance measurement is performed by emitting an optical signal.

[0013] The invention is based on the objective of creating radar head devices for photonic radar systems and photonic radar systems that are simpler, and in particular more resource-efficient, to manufacture.

[0014] The problem is solved according to the invention by a radar head assembly with the features of claim 1 and a radar system with the features of claim 6. Advantageous embodiments are described in the dependent claims.

[0015] The invention is based on the idea of ​​separating the photonic and electronic circuits and implementing them on different semiconductor circuit chips, i.e., in different integrated semiconductor circuit chips. Here, an electronic semiconductor circuit chip is configured to process electrical signals in the radar wavelength range, for example, in a transmitter module to amplify received radar signal information for transmission as a radar signal via a transmitting antenna, wherein the received radar signal information is optionally multiplied with respect to its frequency before amplification and transmission. An electronic semiconductor circuit chip for a receiver module, on the other hand, is configured to derive echo signal information from a received radar echo signal, preferably provided at a frequency that corresponds to a fraction of the frequency of the transmitted radar signal.For this purpose, a mixer circuit is preferably used that processes signals in the frequency range of the emitted radar signals and generates an intermediate frequency signal that includes the radar echo information. To ensure a compact design of the radar head assembly and to facilitate integration into various vehicle components, such as a windshield, bumper, body panels, and / or interior trim panels, the photonic and electronic components are implemented on separate integrated semiconductor chips, which are coupled to each other using a die-stacking method.

[0016] In particular, a radar head device for a photonic radar system, in which signal transmission between a central station and the radar head device is carried out by means of at least one modulated carrier signal transmitted via at least one optical transmission medium, is comprising an electronic semiconductor circuit chip and a photonic semiconductor circuit chip, wherein the electronic semiconductor circuit chip and the photonic semiconductor circuit chip are connected to each other in a die-stacking arrangement.

[0017] Furthermore, a photonic radar system with a central station and at least one radar head assembly of the proposed design is created, wherein the central station is configured to generate the radar signal information to be transmitted and to modulate an optical carrier signal according to the radar signal information to be transmitted and to evaluate the detected radar echo information, wherein the detected radar echo information is modulated by the at least one radar head assembly onto the optical carrier signal provided by the central station or another optical carrier signal provided by the central station, and wherein the at least one radar head assembly is connected to the at least one radar head assembly by means of at least one optical transmission medium.

[0018] The advantage of this design is that it creates a compact circuit arrangement that is easily integrated. The footprint can be minimized and is primarily determined by the size of the photonic semiconductor circuit chip, i.e., the integrated photonic semiconductor circuit. The integrated electronic semiconductor circuit can be implemented with smaller feature sizes, allowing for a higher level of integration, which leads to a reduction in the chip size.

[0019] Overall, this reduces resource consumption, as the total wafer area required for both semiconductor circuit chips shrinks. Optical input and output coupling remains fully possible despite the die-stacking arrangement.

[0020] Here, the terms integrated semiconductor circuit, integrated semiconductor circuit chip, semiconductor circuit chip, and chip are used synonymously. They describe a physical unit comprising one or, more commonly, several components mounted on a wafer. The term "photonic" is used in connection with circuits and components designed for processing and / or interacting with optical signals. Optical signals are light signals in the broadest sense, i.e., signals in the infrared, visible, or ultraviolet wavelength range. Signals with frequencies in the range of 0.1 terahertz to approximately 1 pentahertz are considered optical signals, also referred to as photonic signals. Preferably, the frequencies or associated wavelengths lie in the near-infrared wavelength range of approximately 100 terahertz to 384 terahertz or the mid-infrared wavelength range of approximately 6 terahertz to 100 terahertz.

[0021] Electronic circuits are defined as those designed for processing electrical signals with frequencies below 300 megahertz.

[0022] To ensure connection to a power supply and / or other control lines, the die-stacking arrangement is usually placed on a printed circuit board.

[0023] Particularly in radar head units designed as transmitter modules, the integrated electronic semiconductor circuit, i.e., the integrated electronic semiconductor circuit chip, comprises an amplifier circuit that amplifies the radar signal information transmitted from the central station, including any frequency-multiplied information, so that it can be emitted as electromagnetic radiation via a transmitter antenna. The resulting power loss leads to heating of the electronic semiconductor circuit chip. To dissipate this heat and prevent thermal stress on the photonic semiconductor circuit chip, one embodiment provides that the die-stacking arrangement is positioned on the circuit board in such a way that a thermal contact is formed between the electronic semiconductor circuit chip and the circuit board. The circuit board can then act as a heat sink.For this purpose, a thermally conductive material can be provided between the electronic semiconductor circuit chip and the circuit board.

[0024] In such an embodiment, the electronic semiconductor circuit chip, the integrated electronic semiconductor circuit is preferably facing the circuit board and the integrated photonic semiconductor circuit is facing away from the circuit board.

[0025] The electronic contacts of the electronic semiconductor circuit chip, i.e., integrated electronic semiconductor circuit, are preferably formed with the printed circuit board by means of a bumper bonding.

[0026] The electrical contacts to the photonic semiconductor circuit chip facing away from the circuit board are preferably implemented by wire bonding. Other embodiments may provide that electrical connections between the electronic semiconductor circuit chip and the photonic semiconductor circuit chip are implemented by wire bonding. This offers the advantage of greater flexibility in the layout of the components in both semiconductor circuit chips. The layouts do not necessarily have to be identical.

[0027] Alternatively, it may be provided that the photonic semiconductor circuit chip and the electronic semiconductor circuit chip are contacted together by means of bumper bonding.

[0028] In some embodiments, the thermal load is such that instead of or in addition to the circuit board, a heat sink is thermally contacted with the electronic semiconductor circuit chip for heat dissipation.

[0029] In embodiments that use a heat sink instead of or in addition to the circuit board for heat dissipation, the electronic semiconductor circuit chip is preferably arranged on a side of the photonic semiconductor circuit chip facing away from the circuit board. This allows the heat sink to establish better contact with the surrounding medium in order to dissipate the heat from the heat sink.

[0030] In other embodiments, where the electronic semiconductor circuit chip is arranged on the circuit board to enable good contact and / or to dissipate some of the heat via the circuit board, the photonic semiconductor circuit chip has a recess to allow a heat sink to be placed on the electronic semiconductor circuit chip nonetheless.

[0031] In one embodiment of the radar head assembly, electrical connections between the photonic semiconductor circuit chip (integrated photonic semiconductor circuit) and the electronic semiconductor circuit chip (integrated electronic semiconductor circuit) are made by wire bonding. This allows for reliable connections, particularly when the electronic semiconductor circuit chip is smaller than the photonic semiconductor circuit chip. Other embodiments utilize bumper bonding for electrical contact between the photonic semiconductor circuit chip and the electronic semiconductor circuit chip. This enables a very compact design.

[0032] Electronic contact can be made between the printed circuit board and the die-stacking arrangement consisting of a photonic semiconductor circuit chip and an electronic semiconductor circuit chip by means of wire bonding and / or bumper bonding.

[0033] The invention will now be explained in more detail with reference to a drawing, which shows:

[0034] The invention is explained in more detail below with reference to a drawing.

[0035] Fig. 1 shows a schematic setup of a photonic radar designed as a MIMO radar;

[0036] Figures 2a to 2c show an arrangement of the radar head devices designed as transmitter and / or receiver modules on a motor vehicle;

[0037] Fig. 3 shows a schematic view of a module designed as a transmitter module.

[0038] Radar head assembly; and

[0039] Fig. 4 shows a schematic view of a receiver module.

[0040] Radar head assembly.

[0041] Figure 1 schematically depicts a photonic radar system 100. This system comprises a central station 200 and a plurality of radar head units 300, 300-n, configured as transmitter and / or receiver modules. The central station 200 and radar head units 300, 300-n are each individually coupled via two optical fibers 401, 401-n, 501, 501-n. The optical fibers 401, 401-n serve as transmission media 400 for transmitting optical signals from the central station 200 to the radar head units 300, 300-n. The optical fibers 501, 501-n serve as return transmission media 500. Additionally, the radar head units 300, 300-n are preferably connected to the central station 200 via an electronic control line 460 and an electronic return line 560. The electronic control line 460 and the electronic return line 560 can be configured as a bus system.Alternatively or additionally, the individual radar head units 300, 300-n can each be equipped with an individual control line 460 and individual electronic return line 560.

[0042] For the sake of simplicity, in the embodiment described here, it is assumed that all radar head units 300, 300-n are coupled to a transmission medium 400, 400-n and a return transmission medium 500. Radar head units designed only as transmitter modules are generally not coupled to a return transmission medium. Radar head units designed as receiver modules can also be coupled to an additional optical transmission medium, through which a further optical carrier signal can be supplied for return transmission. These simplifications also apply to the other embodiments described here. Radar head units can therefore have only one or three optical connections without this affecting the described solution.

[0043] Lowercase letters -n ... stand for natural numbers to indicate countability and distinguishability of the corresponding objects.

[0044] In the illustrated embodiment, the central station 200 is configured to generate radar signal information for transmission, wherein, in the illustrated example, this occurs at a frequency eight times lower than the transmission of a radar signal via an antenna 350, 350-n of one of the radar head units 300, 300-n configured as transmitter modules. For this purpose, the central station 200 comprises a control unit 210, which controls a coherent light source 220, preferably configured as a laser. In an environment detection operating state, radar signal information is modulated onto the at least one optical carrier signal generated by the laser 220 via a modulation unit 230. The radar signal information is, for example, a frequency-modulated continuous wave (FMCW) signal intended for transmission, divided by a factor of eight.The modulation device 230 is, for example, configured as a Mach-Zehnder modulator (MZM). The optical signal is forwarded via an optical control device 240 to a distribution device 250. In the illustrated embodiment, the distribution device 250 comprises a one-to-multiple distribution device 251. This transmits the at least one carrier signal coupled to the single input 252 to the radar head devices 300, 300-n via the corresponding transmission media 400, 400-n, which are connected to the multiple outputs 255, 255-n. The transmission media 400, 400-n are the optical waveguides 401, 401-n, i.e., preferably optical fibers 402, 402-n.

[0045] The radar head units 300, 300-n each have a fiber input 305, 305-n, to which the fiber 402-n coming from the central station 200 is connected. The at least one optical carrier signal with the modulated and transmitted radar signal information is coupled into the radar head unit 300, 300-n.

[0046] In the radar head assembly 300, 300-n, the fiber input 305, 305-n is optically coupled to a fiber output 395, 395-n, so that at least part of the optical signal transmitted to the radar head assembly 300, 300-n via the fiber 402, 402-n serving as the transmission medium 400, 400-n is transmitted back to the central station 200 via the fiber 502, 502-n serving as the return transmission medium 500, 500-n. It is understood that this feedback is omitted in transmitter modules that do not have a return transmission medium. The fiber 502, 502-n serving as the return transmission medium 500, 500-n is connected to the corresponding fiber output 395, 395-n and the detection device 260 of the central station 200.

[0047] The transmitted optical signal can be converted into an electronic signal in the radar head unit 300, 300-n, whereby the radar signal information is separated from the at least one carrier signal. The radar signal information is typically amplified and often its frequency is also multiplied in the radar head unit 300, 300-n, and then emitted as electromagnetic radiation from the corresponding antenna 350, 350-n of the radar head unit 300, 300-n as a radar signal.

[0048] The electromagnetic radiation reflected from an object in the vicinity is received as a radar echo signal by an antenna 350, 350-n of one of the radar head units 300, 300-n or by several antennas 350, 350-n of several radar head units 300, 300-n. In a mixing process, radar echo information is typically derived from the radar echo signal and generated and processed as an intermediate frequency signal. Subsequently, the at least one optical carrier signal transmitted by the radar head unit 300, 300-n is modulated according to the radar echo information and transmitted back to the central station 200 via the corresponding return transmission medium 500, 500-n. In the central station 200, the radar echo information is separated from the at least one optical carrier signal and converted into an electrical signal in a detection unit 260 during conversion into an electronic signal.The radar echo information received via the various return transmission media 500, 500-n is jointly evaluated in a processing unit 270 of the central station 200 to determine the distance, relative velocity, and relative angular position of individual objects in the surrounding area. Upon transmission to the processing unit 270, electrical signals can be digitized in a digitizing unit 280 and pre-processed in a processing unit 290, for example, subjected to a Fourier transform, which can be implemented in special modules.

[0049] Figures 2a to 2c schematically illustrate a possible distribution of the radar head units with their antennas on a motor vehicle 1000. This enables almost 360° environmental detection with high angular resolution.

[0050] In Fig. 2a, the vehicle 1000 is shown schematically from its front 1002 (Fig. 2a), in Fig. 2b from its left side 1004, and in Fig. 2c from its rear 1006. The right side of the vehicle is not shown here, but is preferably designed analogously to the left side 1004.

[0051] The diagram shows schematic small antenna symbols 1100, which indicate the positions of radar head units. On the front 1002 of the vehicle 1000, these are arranged, for example, at intervals between them, on a lower edge 1012 of a windshield 1010 and on a left side edge 1014 of the windshield (viewed from the front), essentially vertically spaced apart. Additionally, radar head units 1100 are also arranged horizontally spaced apart along a front bumper 1020.

[0052] On the left side 1004 of the vehicle 1000, shown in Fig. 2b, radar head units 1100 are arranged horizontally spaced apart from one another along a sill 1050, and radar head units 1100 are also arranged horizontally spaced apart from one another along a roof edge 1030. Additionally, radar head units are arranged substantially vertically spaced apart from one another along a B-pillar 1040.

[0053] On the rear side 1006, shown in Fig. 2c, the antenna symbols 1100, representing the radar head devices, are arranged horizontally spaced apart from each other along the rear bumper 1070 and horizontally and vertically spaced apart from each other along a lower side edge 1064 of the rear window 1060 along the left side edge 1066 of the rear window 1060 as seen from the rear.

[0054] The operating state of the environmental detection system is only simplified and briefly presented here and is known to those skilled in the art for a photonic radar system with a plurality of radar head devices designed as transmitting and / or receiving modules.

[0055] One embodiment of the radar head assembly as a transmitter module or as a receiver module is explained by way of example with reference to the following figures. It is also possible to combine components of the embodiments described here as examples to form radar head assemblies configured as both transmitter and receiver modules. The radar head assemblies are characterized by the fact that they comprise separately designed integrated semiconductor circuits (chips) for photonic components and electronic components.

[0056] Figure 3 schematically shows a radar head assembly 300 designed as a transmitter module. This comprises an integrated photonic semiconductor circuit 700 and an integral electronic semiconductor circuit 800, which are arranged in a die-stacking configuration and are functionally coupled to each other.

[0057] The integrated photonic semiconductor circuit 700 comprises a photonic coupling element 710 for coupling an optical signal into the integrated photonic semiconductor circuit 700. The optical signal is guided to the photonic integrated semiconductor circuit 700 via a fiber 402. The photonic coupling element, together with a fiber holder (not shown), forms the fiber input 305 (see Fig. 1). The integrated photonic semiconductor circuit 700 further comprises a converter device 730, preferably designed as a photodiode 720, for converting an optical signal into an electrical signal. The converter device 730 is coupled to a signal output 740. In particular, the carrier signal generated by a central unit, onto which radar signal information to be transmitted is modulated, is coupled into the integrated photonic semiconductor circuit 700 via the fiber 402, which is used as the transmission medium 400.When converting to an electrical signal, only the modulated radar signal information to be transmitted is converted into the electrical signal, and in doing so, depending on the modulation method used, the frequency is preferably already doubled. The signal output 740 is coupled to a signal input 810 of the integrated electronic semiconductor circuit 800. In the variant designed as a transmitter module, the integrated electronic semiconductor circuit 800 schematically comprises a frequency multiplier 820 and an amplifier circuit 830, which is connected to a transmitter output 840. A transmitter antenna 900 is provided at or connected to the transmitter output 840. Preferably, the die-stacking arrangement 950 is used.

[0058] Figure 4 schematically depicts a radar head assembly 300 designed as a receiver module. In a die-stacking arrangement 950, an integrated photonic semiconductor circuit 700' and an integrated electronic semiconductor circuit 800' are arranged one above the other and coupled to each other via signal transmission. The integrated photonic semiconductor circuit 700' includes a photonic coupling element 710 for coupling an optical signal into the integrated photonic semiconductor circuit 700'.

[0059] The integrated photonic semiconductor circuit 700' comprises, in addition to the components described above with the embodiment according to Fig. 3, a further photonic coupling element 750 for coupling in and out a further carrier signal after it has been modulated in an optical modulator circuit 760 within the integrated photonic semiconductor circuit 700'. The further optical carrier signal is also generated by the central station and transmitted to the integrated photonic semiconductor circuit 700' via a further fiber 402. The radar echo information modulated onto the further optical carrier signal in the optical modulator circuit 760 is provided as an electrical echo signal at an echo signal input 770.

[0060] The associated integrated electronic semiconductor circuit 800' comprises an input amplifier circuit 860 coupled to an antenna input 850. A receiver antenna 920 is coupled to the antenna input 850. A received reflected radar signal is amplified in the input amplifier circuit 860 and converted into a radar echo signal with an intermediate frequency by means of a mixer circuit 870 and provided at an echo signal output 880. To derive the echo information in the mixer, the transmitted radar signal information is provided to it in addition to the received and amplified reflected radar signal. This is provided to the integrated electronic semiconductor circuit 800' at its signal input 810. That is, the signal input 810 of the electronic semiconductor circuit 800' is also connected to the signal output 740 of the photonic semiconductor circuit in this configuration.The emitted radar signal information is separated from the carrier signal in the integrated photonic semiconductor circuit 700' analogously, as described above in connection with Fig. 3, and converted into an electrical signal.

[0061] The integrated electronic semiconductor circuit 800' and the integrated photonic semiconductor circuit 700' are preferably fabricated using different semiconductor processes. In particular, the feature sizes of the components of both integrated semiconductor circuits differ. While the photonic components have feature sizes on the order of the optical wavelength of the carrier signal, the feature sizes of the electronic components are significantly smaller. Overall, this allows for a reduction in the overall size.

[0062] In both illustrated embodiments, the integrated electronic semiconductor circuit 800, 800' and the integrated photonic semiconductor circuit 700, 700' are connected to each other in a so-called die-stacking arrangement 950. Electrical contacts between the integrated electronic semiconductor circuit 800, 800' and the integrated photonic semiconductor circuit 700, 700' can be implemented using various methods. Wire bonding or so-called bumper bonding are particularly preferred.

[0063] In wire bonding, electrical contacts are connected using fine wires. This type of electrical connection offers the advantage that, in particular, an integrated photonic semiconductor circuit chip and an integrated electronic semiconductor circuit chip, which may differ in their surface area, can be easily connected. This ensures a high degree of variability in the design and layout of individual components, especially in integrated photonic semiconductor circuits, as well as the possibility of combining different integrated photonic semiconductor circuit chips and integrated electronic semiconductor circuit chips.

[0064] Bumper bonding offers the advantage that a large number of electrical contacts can be reliably implemented in a small installation space and formed in a single manufacturing step.

[0065] In the illustrated embodiments, the photonic semiconductor circuit chip is arranged above the electronic semiconductor circuit chip. A printed circuit board 600 in Figures 3 and 4 can be considered the base of the radar head assembly 300. Electrical contact can be made by wire bonding or bumper bonding. The printed circuit board can serve as a heat sink for the wire bonding of the electronic semiconductor circuit chip to dissipate the parasitic heat generated in the electronic circuits. For this purpose, a thermal connection is preferably formed between the printed circuit board 600 and the electronic semiconductor circuit chip 800. This is particularly advantageous for radar head assemblies designed as transmitter modules.For this purpose, a thermal contact, for example using thermal paste or similar material, can be formed in certain areas between the circuit board and the electronic semiconductor chip. Alternatively or additionally, a special heat sink can be thermally coupled to the 800 series electronic semiconductor chip. The circuit board or the photonic semiconductor chip may have a recess to accommodate a heat sink, usually made of metallic material.

[0066] The functional components of the individual photonic and electronic semiconductor circuit chips and functional assemblies described here are only examples. The integrated semiconductor circuit chips can, however, have different structures. Only the separation of the photonic and electronic components is essential. The internal structure can vary. It is also possible to combine radar head assemblies configured as transmitter modules in a photonic radar system, which are formed from various combinations of photonic and electronic semiconductor circuit chips. The same applies to radar head assemblies configured as receiver modules and to radar head assemblies configured as both transmitter and receiver modules.

[0067] Reference symbol list

[0068] 100 Photonic radar system 200 Central station 210 Control unit 220 Light source (laser) 230 Modulation unit 240 Optical control unit

[0069] 250 Distribution device 251 Single-to-multiple distribution device

[0070] 252 Single input 255, 255-n Multiple output 260 Detection device 270 Calculation unit 280 Digitization device 290 Processing device

[0071] 300, 300-n radar head assembly 305, 305-n fiber input 350, 350-n antenna 395, 395-n fiber output

[0072] 400, 400n transmission medium

[0073] 401, 401n optical fiber

[0074] 402, 402-n fiber 450, 450-n further transmission medium 460 electronic control line

[0075] 500, 500-n return transmission medium

[0076] 501, 501 -n optical fiber

[0077] 502, 502-n fiber

[0078] 550, 550-n further return transmission medium 560 electronic return path 600 printed circuit board 700 integrated photonic semiconductor circuit 710 photonic coupling element

[0079] INTERNAL 720 Photodiode

[0080] 730 converter unit

[0081] 740 electrical signal output

[0082] 741 optical output

[0083] 750 additional photonic coupling elements

[0084] 760 optical modulator

[0085] 770 Echo signal input

[0086] 780 optical ring main

[0087] 800 integrated electronic semiconductor circuit

[0088] 810 electrical signal input

[0089] 811 Photodiode

[0090] 812 Converter device

[0091] 820 Frequency Multiplier

[0092] 830 amplifier circuit

[0093] 840 transmitter output

[0094] 850 Antenna input

[0095] 860 input amplifier circuit

[0096] 870 mixer circuit

[0097] 880 Echo signal output

[0098] 900 transmitter antenna

[0099] 920 receiver antenna

[0100] 950 die-stacking arrangement

[0101] 1000 motor vehicles

[0102] 1002 Front

[0103] 1004 Left side

[0104] 1006 reverse

[0105] 1100 Antenna symbol

[0106] 1010 Windscreen

[0107] 1012 bottom edge

[0108] 1014 left side edge

[0109] 1020 front bumper

[0110] 1030 Roof edge

[0111] 1040 B-pillar

[0112] 1050 sills

[0113] 1060 Rear window

[0114] 1064 lower side edge

[0115] INTERNAL 1070 rear bumper

[0116] 1100 Antenna symbol

[0117] INTERNAL

Claims

Patent claims 1. Radar head assembly (300, 300-n) for a photonic radar system (100) in which signal transmission between a central station (200) and the radar head assembly (300, 300-n) is carried out by means of a modulated carrier signal transmitted via at least one optical transmission medium (400, 400-n), comprising an electronic semiconductor circuit chip (800) and a photonic semiconductor circuit chip (700), wherein the electronic semiconductor circuit chip (800) and the photonic semiconductor circuit chip (700) are connected to each other in a die-stacking arrangement (950).

2. Radar head assembly (300, 300-n) according to claim 1 , characterized in that the die-stacking arrangement (950) is arranged on a printed circuit board (600).

3. Radar head device according to claim 2, characterized in that the die-stacking arrangement (950) is arranged on the circuit board (600) such that a thermal contact is formed between the electronic semiconductor circuit chip (800) and the circuit board (600).

4. Radar head device according to one of the preceding claims, characterized in that the photonic semiconductor circuit chip (700) and the electronic semiconductor circuit chip (800) are electrically contacted by means of bumper bonding.

5. Radar head device according to one of claims 1 to 3, characterized in that the photonic semiconductor circuit chip and the electronic semiconductor circuit chip are connected by means of wire bonding.

6. Photonic radar system (100) with a central station (200) and at least one radar head assembly (300, 300-n) according to one of claims 1 to 5, wherein the central station (200) is used to generate the radar signal information to be transmitted and RNAL The device is configured to modulate an optical carrier signal according to the radar signal information to be transmitted and to evaluate the acquired radar echo information, wherein the acquired radar echo information is modulated by the at least one radar head unit (300, 300-n) onto the optical carrier signal provided by the central station (200) or another optical carrier signal provided by the central station, and wherein the at least one radar head unit (300, 300-n) is connected to the at least one radar head unit (300, 300-n) by means of at least one optical transmission medium. RNAL

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