sensor

Abstract

[Problem] To achieve a narrow bezel of a display that is disposed on a sensor in a superposed manner. [Solution] A sensor 12 includes a sensor substrate 20, a plurality of X coils Lx, and a plurality of lead-out lines PL. The sensor substrate 20 includes a coil-forming part 20a in a rectangular shape in which each side is parallel to either the y direction or the x direction, and a lead-out part 20b in a shape protruding from a side 20a1 parallel to the y direction of the coil-forming part 20a. The lead-out lines PL are formed on a second layer L2 from the coil-forming part 20a to the lead-out part 20b. A part of a long side LS1 of an X coil Lx1 disposed at a position closest to the lead-out part 20b, among the plurality of X coils Lx, is formed on a first layer L1 in the lead-out part 20b.

Description

Sensor

[0001] The present invention relates to a sensor, and more particularly to a sensor used for detecting the position of a pen by electromagnetic induction.

[0002] Position detection devices that detect the position of a pen by an electromagnetic induction method (EMR method) are known. An example of this type of position detection device is disclosed in Patent Document 1. As disclosed in Patent Document 1, this type of position detection device is configured with a sensor including a plurality of loop coils and a sensor controller, which is an integrated circuit that detects the position of the pen using this sensor.

[0003] The sensor includes a sensor substrate including a rectangular coil forming portion and an extraction portion protruding from one side of the rectangular coil forming portion, and each loop coil is formed by two turns around the coil forming portion. The multiple loop coils include multiple X coils each extending in the y direction and juxtaposed in the x direction, and multiple Y coils each extending in the x direction and juxtaposed in the y direction. Each X coil includes four long sides extending in the y direction and four short sides that connect the ends of the X coils to form two turns. Similarly, each Y coil includes four long sides extending in the x direction and four short sides that connect the ends to form two turns.

[0004] Each loop coil is connected to a sensor controller by a lead-out wiring extending from the coil forming section to the lead-out section. The sensor controller sends out an alternating magnetic field from the touch surface by passing an AC current through one of the loop coils via the lead-out wiring, and detects the position of the pen on the touch surface by receiving the alternating magnetic field sent out by the resonant circuit of the pen that has entered the sent-out alternating magnetic field at each loop coil.

[0005] Furthermore, a position detection device that detects the position of a pen on a panel surface is known. Patent Document 2 discloses an example of this type of position detection device. As shown in this document, the position detection device is configured with a sensor including a group of coils arranged on the panel surface, and an integrated circuit (hereinafter referred to as a "sensor controller") that detects the position of the pen using this sensor.

[0006] The sensor includes a rectangular sensor section and a lead-out section that extends from one side of the sensor section. Both the sensor section and the lead-out section are made of flexible substrates. The sensor section has the above-mentioned coil group formed therein, and the lead-out section has a group of lead-out wires that connect the coil group in the sensor section to the sensor controller.

[0007] The entire surface of the sensor unit is covered by a metal sheet that acts as a magnetic shield, and the sensor controller is located on the opposite side of the metal sheet from the sensor unit. Therefore, in order to connect the coils in the sensor unit to the sensor controller, the lead wires need to be routed from the sensor unit side surface of the metal sheet to the sensor controller side surface, and the lead wires are provided for this purpose. In other words, the lead wires are folded back to wrap around the edge of the metal sheet, thereby connecting the lead wires to the sensor controller.

[0008] Furthermore, in recent years, foldable displays have appeared. Examples of foldable displays are disclosed in Patent Documents 3 to 5. A foldable display is configured to be foldable along a folding line located in the center of a single large display screen.

[0009] Japanese Patent Publication No. 2019-211887 International Publication No. 2020 / 255605 US Patent Application Publication No. 2022-0294886 US Patent Application Publication No. 2023-0071229 US Patent Application Publication No. 2021-0208709

[0010] In some position detection devices, the display surface of the display also serves as the touch surface, and in such position detection devices, the coil forming portion is provided so as to overlap the display. In this case, in order to be able to detect the position of the pen in every corner of the display surface, it is necessary to make the coil forming portion larger than the display surface in plan view. However, as a result, in the past, the sensor has hindered the narrowing of the display bezel.

[0011] Therefore, one object of the present invention is to provide a sensor that can realize a narrow bezel of a display that is arranged to overlap the sensor.

[0012] Furthermore, because overlapping portions inevitably occur among the multiple loop coils formed in the coil formation section when viewed in plan, each loop coil is typically formed in two layers. Specifically, for multiple X coils, the long sides are formed in the first layer and the short sides are formed in the second layer, while for multiple Y coils, the long sides are formed in the second layer and the short sides are formed in the first layer. In this case, two wires that do not intersect with other loop coils run parallel to each other along each side of the coil formation section. Forming these wires in the first and second layers allows for a correspondingly narrower bezel for the display. However, the two wires running parallel to the side where the draw-out section is provided cannot be formed in the first and second layers due to the presence of the draw-out wires. As a result, the bezel of the display cannot be narrowed only along the side where the draw-out section is provided, and improvement was needed.

[0013] Therefore, another object of the present invention is to provide a sensor that can realize a narrow bezel of a display that is arranged to overlap the sensor, even on the side where the drawer portion is provided.

[0014] The sensor controller is mounted on an external board placed on the sensor controller side of the metal sheet. This external board also has a connection section for connecting the lead wires (hereinafter referred to as the "sensor connection section"), a connection section with the host processor, a capacitor, etc. The lead wires in the lead wire section are connected to the sensor connection section, and the sensor connection section and the sensor controller are connected by wiring within the external board.

[0015] In recent years, external circuit boards have become smaller, and as a result, sensor connection sections have also become smaller. As a result, it has become necessary to reduce the wiring pitch of the lead wires within the lead section, which requires a certain length of the lead section. The external circuit board needs to be placed inside the metal sheet from the edge by the length of the lead section, but as the lead section becomes longer, the external circuit board must be placed further inside. This means that the external circuit board will compress the installation area for other components (typically a battery) placed within the position detection device, so improvements are needed.

[0016] Therefore, yet another object of the present invention is to provide a sensor and position detection device that can reduce the wiring pitch of the group of lead wires within the lead section while allowing the external board on which the sensor connection section is mounted to be positioned closer to the edge of the metal sheet than in the background art.

[0017] Furthermore, to make a foldable display compatible with the EMR method, the EMR sensor must be foldable. To achieve this, the inventors of the present application are considering arranging a large number of deformation structures (specifically, slits or through-hole trenches) in a staggered matrix (a type of matrix in which each column is offset by half a pitch from the adjacent columns) along the folding line of the substrate that constitutes the EMR sensor. In this way, the force attempting to bend the EMR sensor is dispersed in the normal direction of the substrate by local torsional deformation, making it possible to bend the EMR sensor as a whole.

[0018] Some EMR sensors have loop coils and their leads formed across multiple layers. In this case, the wiring formed on each layer is connected to each other by via conductors. However, these via conductors are made of metal plating with poor elasticity, so they may crack due to large deformation of the substrate, especially near the deformation structure.

[0019] Therefore, a further object of the present invention is to provide a sensor that can prevent cracking of via conductors.

[0020] Furthermore, when multiple deformation structures are arranged in a staggered matrix along the bending lines, it becomes impossible to provide straight wiring across the bending lines, which makes it impossible to provide coils or lead wires across the bending lines, and so improvements were needed.

[0021] Therefore, a further object of the present invention is to provide a sensor in which a coil and a lead wire can be provided across a bending line.

[0022] In addition, in order to prevent cracking of the via conductors, it has been considered to relocate the via conductors, which have been installed in the arrangement area of ​​the deformation structure (hereinafter referred to as the "deformation area"), to outside the deformation area. However, relocating the via conductors means extending the loop coil to the location where the via conductors are to be relocated, and since such extension is impossible within the display area, the via conductors inevitably end up concentrating in the bezel area near the deformation area. As a result, it becomes impossible to meet the recent demand for narrower bezels in displays, so further improvement was necessary.

[0023] Therefore, a further object of the present invention is to provide a sensor that prevents cracking of via conductors and is also compatible with displays with narrower frame sizes.

[0024] A sensor according to a first aspect of the present invention includes a sensor substrate having a first layer and a second layer, a plurality of first loop coils each having a first long side and a second long side extending in a first direction and juxtaposed in a second direction perpendicular to the first direction, and a plurality of first lead-out wires for connecting the plurality of first loop coils to a sensor controller, wherein the sensor substrate includes a rectangular coil forming portion whose sides are parallel to either the first direction or the second direction, and a lead-out portion having a shape protruding from a first side of the coil forming portion that is parallel to the first direction, and the plurality of first lead-out wires are formed in the second layer from the coil forming portion to the lead-out portion, and a portion of the first long side of the first loop coil of the plurality of first loop coils that is positioned closest to the lead-out portion is formed in the first layer within the lead-out portion.

[0025] A sensor according to a second aspect of the present invention includes a sensor substrate having a first layer and a second layer, a plurality of first loop coils each formed by two turns having first to fourth long sides extending in a first direction and juxtaposed in a second direction perpendicular to the first direction, and a plurality of first lead-out wires for connecting the plurality of first loop coils to a sensor controller, wherein the sensor substrate includes a rectangular coil forming portion with each side parallel to either the first direction or the second direction, and a lead-out portion shaped to protrude from a side of the coil forming portion parallel to the first direction, the plurality of first lead-out wires being formed in the second layer from the coil forming portion to the lead-out portion, a portion of the first long side of the first loop coil of the plurality of first loop coils that is positioned closest to the lead-out portion being formed in the second layer within the sensor substrate, and the second long side, the third long side, and the fourth long side being formed in the first layer within the sensor substrate.

[0026] A sensor according to a third aspect of the present invention includes a sensor substrate having a first layer and a second layer, a plurality of first loop coils each formed by two turns having first to fourth long sides extending in a first direction and juxtaposed in a second direction perpendicular to the first direction, and a plurality of second loop coils each formed by two turns having fifth to eighth long sides extending in the second direction and juxtaposed in the first direction, wherein the sensor substrate includes a rectangular coil forming portion with each side parallel to either the first direction or the second direction, and a lead-out portion shaped to protrude from a side of the coil forming portion parallel to the first direction, wherein the first to fourth long sides of the first loop coils other than two first loop coils arranged outermost among the plurality of first loop coils are formed in the first layer, and the lead-out portions of the plurality of first loop coils are formed in the first layer. the second long side of the first loop coil arranged at a position farthest from the end portion is formed on the second layer, and the first long side, the third long side, and the fourth long side are formed on the first layer, the fifth and sixth long sides of the second loop coils other than the two second loop coils arranged outermost among the plurality of second loop coils are formed on the second layer, the fifth long side of one of the two second loop coils arranged outermost among the plurality of second loop coils is formed on the first layer, and the sixth long side, the seventh long side, and the eighth long side are formed on the second layer, and the seventh long side of the other of the two second loop coils arranged outermost among the plurality of second loop coils is formed on the first layer, and the fifth long side, the seventh long side, and the eighth long side are formed on the second layer.

[0027] A sensor according to a fourth aspect of the present invention includes a rectangular sensor section having a coil group, a foldable draw-out section having a shape that protrudes from one side of the sensor section, and an external substrate arranged in a position that overlaps the sensor section in a planar view, wherein the draw-out section includes a draw-out wire group for drawing the coil group to the external substrate, the external substrate includes a sensor connection section to which the draw-out wire group is connected, the draw-out section has at least two fold sections including a first fold section and a second fold section from the boundary with the sensor section to the tip, and the draw-out wire group is connected to the sensor connection section in the region between the second fold section and the tip.

[0028] A position detection device according to a fourth aspect of the present invention is a position detection device including a sensor according to the present invention.

[0029] A sensor according to a fifth aspect of the present invention is a sensor including a multilayer substrate having a deformation region that deforms when subjected to an external force, and including a first wiring extending through a first layer of the multilayer substrate and within the deformation region, a second wiring extending through a second layer of the multilayer substrate and within the deformation region, a first extension line extending through the first layer and outside the deformation region and connecting to the first wiring at the boundary of the deformation region, a second extension line extending through the second layer and outside the deformation region and connecting to the second wiring at the boundary of the deformation region, and a first via conductor located outside the deformation region and connecting the first extension line and the second extension line.

[0030] A sensor according to a sixth aspect of the present invention is a sensor including a multilayer substrate having a deformation region that deforms when subjected to an external force, and includes a first loop coil arranged within the deformation region, the first loop coil including a long side portion extending through a first layer of the multilayer substrate and within the deformation region, a short side portion extending through a second layer of the multilayer substrate and within the deformation region, a first extension line extending through the first layer and outside the deformation region and connecting to the long side portion at the boundary of the deformation region, a second extension line extending through the second layer and outside the deformation region and connecting to the short side portion at the boundary of the deformation region, and a first via conductor located outside the deformation region and connecting the first extension line and the second extension line.

[0031] A sensor according to a seventh aspect of the present invention is a sensor including a substrate, the substrate having a deformation region in which a plurality of deformation structures are arranged for deforming the substrate in response to an external force, and a first wiring formed on the substrate, the first wiring being formed so as to avoid the plurality of deformation structures within the deformation region.

[0032] A sensor according to an eighth aspect of the present invention is a sensor including a rectangular substrate whose sides extend in either a first direction or a second direction perpendicular to each other, wherein the substrate has a rectangular deformation region located inside both ends of the substrate in the first direction and arranged along the entire length of the substrate in the second direction, and the deformation region includes a deformation structure arrangement region in which deformation structures for deforming the substrate in response to external force are repeatedly arranged at a constant pitch, and a deformation structure blank region arranged along the edge of the deformation region in the first direction and in which the deformation structures are not arranged over an area larger than the pitch.

[0033] According to the first and second aspects of the present invention, the first long side of the first loop coil among the multiple first loop coils that is located closest to the pull-out portion is bypassed around the pull-out portion, making it possible to achieve a narrow bezel for the display that is superimposed on the sensor on the side of the coil forming portion on which the pull-out portion is provided.

[0034] According to the third aspect of the present invention, two long sides running parallel to each side of the coil forming portion other than the side on which the draw-out portion is provided are extended and divided into a first layer and a second layer, so that it is possible to realize a narrow bezel for the display that is superimposed on the sensor for each side of the coil forming portion other than the side on which the draw-out portion is provided.

[0035] According to the fourth aspect of the present invention, the draw-out section is folded at least twice, which makes it possible to reduce the wiring pitch of the draw-out wire group within the draw-out section while still allowing the external board on which the sensor connection section is mounted to be positioned near the edge of the metal sheet.

[0036] According to the fifth and sixth aspects of the present invention, two wirings extending within the deformation region can be connected to each other by a via conductor outside the deformation region, so that a loop coil can be formed within the deformation region without providing a via conductor within the deformation region, thereby preventing cracks in the via conductor.

[0037] According to the seventh aspect of the present invention, the wiring is formed so as to avoid a deformed structure, so that it becomes possible to provide a coil or a lead wire across the bent line.

[0038] According to the eighth aspect of the present invention, even if a deformation structure is provided, it will hardly deform when bent, and therefore a deformation structure blank area is provided along the edge of the deformation area in the first direction where no deformation structure is required, and via conductors can be arranged within this blank area. This reduces the number of via conductors that must be arranged in the bezel area near the deformation area, preventing cracks in the via conductors and making it possible to accommodate narrower frame sizes of displays.

[0039] 1A is a schematic bottom view of a position detection device 1 according to a first embodiment of the present invention, and FIG. 1B is a schematic side view of the position detection device 1 shown in FIG. 1B. It is a schematic plan view of a sensor 12 shown in FIG. 1B. It is a diagram explaining the structure of the X coil Lx and the Y coil Ly shown in FIG. 2. It is a schematic plan view of a sensor 12 according to the background art of the present invention. It is a plan view of a sensor 12 according to a second embodiment of the present invention, and FIG. 1B is a cross-sectional view of the sensor 12 taken along line A-A in FIG. 1A. It is a diagram showing the configuration of a coil group formed in a sensor unit 50. It is a diagram explaining the structure of the X coil Lx and the Y coil Ly. It is a plan view of a sensor 12 according to a third embodiment of the present invention, and FIG. 1B is a cross-sectional view of the sensor 12 taken along line B-B in FIG. 1A. It is a plan view of a sensor 12 according to the background art of the present invention, and FIG. 1B is a cross-sectional view of the sensor 12 taken along line C-C in FIG. 1A. 17A is a schematic bottom view of a position detection device 1 according to a fourth embodiment of the present invention, and FIG. 17B is a schematic side view of the position detection device 1 shown in FIG. 17A. FIG. 17B is a schematic plan view of a sensor substrate 20. FIG. 17C is a schematic plan view of a sensor substrate 20. FIG. 17D is a plan view showing the electrical connection relationship and general layout of wiring provided on the sensor substrate 20. FIG. 17E is a diagram showing a process for forming via conductors by "panel plating". FIG. 17F is a diagram showing a process for forming via conductors by "button plating". FIG. 17G is a diagram explaining the structure of an X coil Lx and a Y coil Ly. FIG. 17H is a diagram explaining a wiring innovation in the fourth embodiment of the present invention. FIG. 17H is a diagram explaining a wiring innovation in the fourth embodiment of the present invention. FIG. 17G is an enlarged view of an area A1 shown in FIG. 17B, and FIG. 17G is an enlarged view of an area A2 shown in FIG. 18B. FIG. 17H is an enlarged view of an area A3 shown in FIG. 17B, and FIG. 17G is an enlarged view of an area A4 shown in FIG. 18B. FIG. 17H is an enlarged view of an area A5 shown in FIG. 18B, and FIG. 17G is an enlarged view of an area A6 shown in FIG. 18B.

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0041] 1A is a schematic bottom view of a position detection device 1 according to a first embodiment of the present invention, and FIG. 1B is a schematic side view of the position detection device 1 shown in FIG. 1A. As shown in these figures, the position detection device 1 according to this embodiment has a structure in which a glass 10a, a display 11, a sensor 12, and a metal sheet 13 are stacked within a module frame 14. The surface of the glass 10a forms a panel surface 1a that serves as both a touch surface for receiving input from an electromagnetic induction pen 2 and a display surface for the display 11. In the following description, two directions that are orthogonal to each other on the panel surface 1a will be referred to as the x-direction and the y-direction, respectively, and a direction that is orthogonal to both the x-direction and the y-direction (the stacking direction) will be referred to as the z-direction.

[0042] The position detection device 1 also has a control board 15 including a sensor controller, which is an integrated circuit that performs processing to detect the position of the electromagnetic induction pen 2 within the panel surface 1a using the sensor 12. The control board 15 is fixed to the underside of the metal sheet 13 by a mounting 16.

[0043] The position detection device 1 also includes a central processing unit that controls the entire position detection device 1, a memory that stores programs and various data, and other components, but these components are not shown in Fig. 1. The central processing unit is a device that executes various processes by running programs stored in the memory. These various processes include outputting a video signal to the display 11, generating stroke data based on the position of the electromagnetic induction pen 2 detected by the sensor controller, and rendering the generated stroke data.

[0044] The display 11 is a display device that displays a video signal supplied from the central processing unit. There are no specific limitations on the type of the display 11, and it may be, for example, a liquid crystal display or an organic EL display.

[0045] The sensor 12 is an electronic component including multiple loop coils. The sensor controller transmits an alternating magnetic field from the panel surface 1a by passing an alternating current through one or more of the multiple loop coils that make up the sensor 12, and detects the position of the electromagnetic induction pen 2 on the panel surface 1a by having each loop coil of the sensor 12 receive the alternating magnetic field transmitted from a resonant circuit of the electromagnetic induction pen 2 that has entered the transmitted alternating magnetic field.

[0046] The sensor 12 includes a sensor substrate 20, and the plurality of loop coils are formed on this sensor substrate 20. The sensor substrate 20 includes a rectangular coil forming portion 20a that is arranged overlapping the display 11, and an extraction portion 20b that protrudes from one of the sides of the coil forming portion 20a that are parallel to the y direction.

[0047] The coil forming section 20a has a plurality of loop coils formed therein, including a plurality of X coils Lx and a plurality of Y coils Ly, as shown in Fig. 2. The lead-out section 20b also has a plurality of lead-out wires PL (see Fig. 2) formed therein for connecting each of the plurality of loop coils formed in the coil forming section 20a to a sensor controller in the control board 15. These points will be described in more detail later with reference to Fig. 2.

[0048] The lead-out portion 20b is configured to be bendable, and contacts the control board 15 arranged on the underside of the metal sheet 13 through an opening (not shown) provided in the module frame 14. The metal sheet 13 and the control board 15 are bonded together with an anisotropic conductive film (ACF) 17, a special conductive adhesive that simultaneously provides electrical connection and mechanical fixation. The multiple lead-out wires PL are connected to the sensor controller in the control board 15 via this ACF 17.

[0049] 2 is a schematic plan view of the sensor 12. As shown in the figure, the coil forming portion 20a of the sensor substrate 20 is a rectangular substrate surrounded by two sides 20a1 and 20a3 parallel to the y direction and two sides 20a2 and 20a4 parallel to the x direction. The lead-out portion 20b is configured to have a shape that protrudes from the side 20a1 of the coil forming portion 20a.

[0050] A plurality of loop coils including a plurality of X coils Lx and a plurality of Y coils Ly are formed in the coil forming section 20a. Although seven X coils Lx (X coils Lx1 to Lx7 in order from one side in the x direction) and five Y coils Ly (Y coils Ly1 to Ly5 in order from one side in the y direction) are depicted in Fig. 2, this is done to avoid cluttering the drawing, and in reality, many more X coils Lx and Y coils Ly are formed. The following description will be given assuming the number of coils shown in Fig. 2.

[0051] The sensor 12 also has a plurality of lead wires PL formed from the coil forming portion 20 a to the lead wire portion 20 b. Two lead wires PL are provided for each loop coil, and serve to connect both ends of the corresponding loop coil to the sensor controller.

[0052] The sensor substrate 20 has a layered structure including a first layer L1 and a second layer L2. While FIG. 2 shows an example in which the second layer L2 is located above the first layer L1 (on the panel surface 1a side), the reverse is also possible. The first layer L1 and the second layer L2 are each configured to allow the formation of wiring that constitutes the loop coil and the lead wire PL. The wiring formed on the first layer L1 and the wiring formed on the second layer L2 can be connected by via conductors, indicated by white circles in the figure.

[0053] 3 is a diagram illustrating the structure of the X coil Lx and the Y coil Ly. As shown in the figure, the X coil Lx and the Y coil Ly each have two turns. The two turns of the X coil Lx are realized by long sides LS1 to LS4 extending in the y direction and short sides SS1 to SS4 extending in a direction slightly inclined with respect to the x direction. Specifically, the long side LS1, short side SS1, long side LS2, short side SS2, long side LS3, short side SS3, long side LS4, short side SS4, and long side LS1 are connected in this order. The first turn is formed by the four sides from long side LS1 to short side SS2, and the second turn is formed by the four sides from long side LS3 to short side SS4. Similarly, the two turns of the Y coil Ly are realized by long sides LS5 to LS8 extending in the x direction and short sides SS5 to SS8 extending in a direction slightly inclined with respect to the y direction. Specifically, the long side LS5, short side SS5, long side LS6, short side SS6, long side LS7, short side SS7, long side LS8, short side SS8, and long side LS5 are connected in this order, with the first turn being made up of the four sides from long side LS5 to short side SS6, and the second turn being made up of the four sides from long side LS7 to short side SS8.

[0054] 3, each of the X coil Lx and the Y coil Ly has an end portion in the middle of one of its sides, and this end portion is connected to the lead line PL. The specific position of the end portion of each loop coil is determined by the wiring layout of the lead line PL.

[0055] The following will first explain the configuration of the sensor 12 according to the background art of the present invention, and then, in comparison with that, explain the configuration of the sensor 12 according to this embodiment in more detail.

[0056] FIG. 4 is a schematic plan view of a sensor 12 according to the background art of the present invention. As shown in the figure, the long sides LS1 to LS4 of each of the multiple X coils Lx are formed on the first layer L1, and the short sides SS1 to SS4 are formed on the second layer L2. These are connected by via conductors. The long sides LS5 to LS8 of each of the multiple Y coils Ly are formed on the second layer L2, and the short sides SS5 to SS8 are formed on the first layer L1. These are also connected by via conductors. By forming the wiring extending in the y direction (including a direction slightly inclined relative to the y direction) and the wiring extending in the x direction (including a direction slightly inclined relative to the x direction) on separate layers, it is possible to arrange the loop coils so that they overlap in a plan view, as illustrated in FIG. 4. The lead wires PL are formed on the second layer L2 (for some lead wires PL, on both the first layer L1 and the second layer L2) from the coil forming portion 20a to the lead wire portion 20b, using the area between the portions formed on the second layer L2 of each loop coil.

[0057] Returning to Fig. 2, compared to the configuration of Fig. 4, the sensor 12 according to the present embodiment differs from the sensor 12 according to the background art in that one of two long sides located near the outer periphery of the coil forming portion 20a of each of the two outermost Y coils Ly1 and Ly5 of the multiple Y coils Ly (specifically, the long side LS5 of the Y coil Ly1 and the long side LS6 of the Y coil Ly5) extends to the first layer L1, one of two long sides located near the outer periphery of the coil forming portion 20a of the X coil Lx7 located farthest from the lead-out portion 20b of the multiple X coils Lx (specifically, the long side LS2 of the X coil Lx7) extends to the second layer L2, and a portion of the X coil Lx1 located closest to the lead-out portion 20b of the multiple X coils Lx is formed on the first layer L1 within the lead-out portion 20b, and the remaining portion is formed on the second layer L2 within the coil forming portion 20a.

[0058] First, with regard to the Y coils Ly1 and Ly5 and the X coil Lx7, according to the configuration of the present embodiment, two long sides (specifically, long sides LS5 and LS7 of the Y coil Ly1, long sides LS6 and LS8 of the Y coil Ly5, and long sides LS2 and LS4 of the X coil Ly7) running parallel to the sides 20a2, 20a3, and 20a4 of the coil formation portion 20a without intersecting with other wiring are extended separately on the first layer L1 and the second layer L2. This allows these two long sides to extend within a narrower area in plan view than in the background art. Therefore, it is possible to realize a narrower bezel for the sides 20a2, 20a3, and 20a4 of the display 11. Note that although the two long sides are depicted slightly offset from each other in plan view in FIG. 4 , in reality, the two long sides may be extended so that they completely overlap in plan view. In this case, it is preferable to move the via conductor slightly inward to prevent one of the long sides from bulging outward due to the presence of the via conductor.

[0059] Next, with regard to the X coil Lx1, because the X coil Lx1 intersects with the lead line PL, it is not possible to completely separate the two long sides running parallel along the outer periphery of the coil formation portion 20a into the first layer L1 and the second layer L2, as with the Y coils Ly1, Ly5, and the X coil Lx7. However, the lead line PL intersects with the lead line PL, and the lead line PL is present at the portion where the lead line PL intersects with the lead line 20b, and in the past, nothing was formed on the first layer L1. The sensor 12 according to this embodiment effectively utilizes the first layer L1 of the lead line 20b, which has not been effectively utilized in the past, thereby achieving a narrow bezel for the display 11, even for the side 20a1. Specifically, one of the two long sides LS1, LS3 near the outer periphery of the coil forming portion 20a of the X coil Lx1 running parallel to side 20a1 (long side LS1 in FIG. 2) is diverted to the first layer L1 of the draw-out portion 20b in the portion where the draw-out portion 20b exists (i.e., the portion that intersects with the draw-out line PL), and is extended to the second layer L2 of the coil forming portion 20a in the portion where the draw-out portion 20b does not exist (i.e., the portion that does not intersect with the draw-out line PL), and the other (long side LS3 in FIG. 2) is extended to the first layer L1 of the coil forming portion 20a as in the conventional case, so that it is possible to achieve a narrow bezel of the display 11 also for side 20a1.

[0060] As described above, in the sensor 12 according to the present embodiment, the long side LS1 of the X coil Lx1 that is located closest to the lead-out portion 20b among the multiple X coils Lx is bypassed to the lead-out portion 20b. More specifically, the portion of the long side LS1 of the X coil Lx1 that intersects with the lead-out line PL is formed on the first layer L1 of the lead-out portion 20b, the other portion of the long side LS1 of the X coil Lx1 is formed on the second layer L2 of the coil forming portion 20a, and the long side LS3 of the X coil Lx1 is formed on the first layer L1 of the coil forming portion 20a. Therefore, in the sensor 12 according to the present embodiment, it is possible to narrow the bezel of the display 11 that is arranged to overlap the sensor 12 with respect to the side 20a1 of the coil forming portion 20a.

[0061] Furthermore, the two long sides running parallel to each of the sides 20a2, 20a3, and 20a4 of the coil forming portion 20a are extended separately into the first layer L1 and the second layer L2. Therefore, according to the sensor 12 of this embodiment, it is possible to realize a narrow bezel of the display 11 that is superimposed on the sensor 12, also for the sides 20a2, 20a3, and 20a4 of the coil forming portion 20a.

[0062] Next, second and third embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, the background art of the present invention will be described again, and then the second and third embodiments of the present invention will be described in detail.

[0063] FIG. 9( a) is a plan view of a sensor 12 according to the background art of the present invention, and FIG. 9( b) is a cross-sectional view of the sensor 12 taken along line CC in FIG. 9( a). The sensor 12 is incorporated into a position detection device compatible with electromagnetic induction pen detection using an electromagnetic induction method (EMR method), such as a laptop computer, tablet terminal, or smartphone, and, together with a sensor controller (not shown), serves to detect the position of the electromagnetic induction pen on a panel surface provided in the position detection device. In many cases, this panel surface doubles as the display surface of a display, and in this case, the sensor 12 is positioned overlapping the display. However, the present invention is also applicable to sensors incorporated into position detection devices whose panel surface does not double as the display surface.

[0064] As shown in FIG. 9( b), the sensor 12 is composed of a sensor unit 50, an extraction unit 51, an external substrate 52, a sensor connection unit 53, and a metal sheet 13. The sensor unit 50 is a rectangular flexible substrate and is composed of a group of coils arranged within the panel surface. Note that the coil group is not shown in FIG. 9 (and FIGS. 5 and 6), but the configuration of the coil group will be described in detail later with reference to FIGS. 7 and 8. The entire surface of the sensor unit 50 is covered by one surface of the metal sheet 13. This metal sheet 13 not only provides magnetic shielding, but also serves to support the sensor unit 50 to prevent it from bending. The sensor unit 50 and the metal sheet 13 are fixed together with an adhesive (not shown).

[0065] The lead-out section 51 is a flexible substrate that protrudes from the sensor section 50 and includes a group of lead-out wires PL for connecting the group of coils in the sensor section 50 to a sensor controller mounted on an external substrate 52.

[0066] The external substrate 52 is a rectangular substrate elongated in the y direction. It is disposed on the other surface of the metal sheet 13, along one side parallel to the y direction, at a position overlapping the sensor unit 50 in a plan view. A sensor connection unit 53 for connecting the lead wires PL is mounted on the external substrate 52. The illustrated mounting area 52a is an area for mounting components other than the sensor connection unit 53, and is provided on the same surface of the external substrate 52 as the sensor connection unit 53. Examples of components mounted in the mounting area 52a include an integrated circuit serving as a sensor controller, a connection unit for connecting to a host processor serving as the central processing unit of the position detection device, and a capacitor. Hereinafter, the distance between the one side of the metal sheet 13 and the external substrate 52 is referred to as distance L. The external substrate 52 and the metal sheet are also fixed together with an adhesive (not shown).

[0067] The sensor connection section 53 is typically an anisotropic conductive film (ACF), a special conductive adhesive that simultaneously provides electrical connection and mechanical fixation, but other connection means such as a simple mechanical connector may also be used. One end of each lead wire PL is connected to wiring in the external substrate 52 via the sensor connection section 53, and the other end is connected to a coil in the sensor section 50.

[0068] 9(b), the lead-out portion 51 has a folded portion FB provided so as to wrap around the edge of the metal sheet 13, thereby allowing the lead-out wires PL to extend from one surface to the other surface of the metal sheet 13 and serving to connect the lead-out wires PL to the sensor controller. The lead-out wires PL are connected to the sensor connection portion 53 in the region between the folded portion FB and the tip TI of the lead-out portion 51.

[0069] As shown in FIG. 9( a), the lead-out portion 51 has a reduced-pitch portion D in which the wiring pitch of the lead-out lines PL gradually decreases. This configuration is necessary because the wiring pitch of the sensor connection portion 53 is smaller than the wiring pitch of the lead-out lines PL in the sensor unit 50. The shape of the reduced-pitch portion D is a trapezoid with the upper base on the tip TI side and the lower base on the sensor unit 50 side. As can be seen from FIGS. 9( a) and 9(b), the need to provide the reduced-pitch portion D in the lead-out portion 51 increases the distance L accordingly. Although not shown, because a battery or the like is disposed in the area to the right of the external substrate 52 in the drawing, it is desirable to keep the distance L as short as possible (i.e., to position the external substrate 52 as close as possible to the edge of the metal sheet 13). One object of the present invention is to solve the problems of the background art and to achieve a shorter distance L than the background art while maintaining the reduced-pitch portion D (i.e., while using a small sensor connection portion 53 with a narrow wiring pitch).

[0070] Having described the background art of the present invention above, the second and third embodiments of the present invention will now be described in detail.

[0071] Fig. 5 is a plan view of the sensor 12 according to the second embodiment of the present invention, and Fig. 5(b) is a cross-sectional view of the sensor 12 taken along line A-A in Fig. 5(a). Fig. 6 is a diagram showing the configuration of the coil group formed in the sensor unit 50.

[0072] First, with reference to FIG. 6 , the configuration of the coil group formed in the sensor unit 50 will be described in detail. As shown in the figure, the sensor unit 50 has a plurality of loop coils (coil group) formed therein, including a plurality of X coils Lx and a plurality of Y coils Ly. Although FIG. 6 depicts seven X coils Lx (X coils Lx1 to Lx7 in order from one side in the x direction) and five Y coils Ly (Y coils Ly1 to Ly5 in order from one side in the y direction), this is done to avoid cluttering the drawing; in reality, many more X coils Lx and Y coils Ly will be formed. The following description will be based on the number of coils shown in FIG. 6 .

[0073] The sensor unit 50 is also provided with a plurality of lead-out lines PL (a group of lead-out lines PL). Each lead-out line PL extends from the sensor unit 50 to the lead-out section 51. Two lead-out lines PL are provided for each loop coil, and serve to connect both ends of the corresponding loop coil to the sensor controller.

[0074] The sensor unit 50 and the lead-out unit 51 are configured to have a layered structure including a first layer L1 and a second layer L2. Typically, the first layer L1 is one surface of the sensor unit 50 and the lead-out unit 51, and the second layer L2 is the other surface of the sensor unit 50 and the lead-out unit 51. The first layer L1 and the second layer L2 are configured so that wiring constituting the loop coil and the lead-out wire PL can be formed, respectively. The wiring formed on the first layer L1 and the wiring formed on the second layer L2 can be connected by via conductors indicated by white circles in the figure.

[0075] 7 is a diagram illustrating the structure of the X coil Lx and the Y coil Ly. As shown in the figure, the X coil Lx and the Y coil Ly each have two turns. The two turns of the X coil Lx are realized by long sides LS1 to LS4 extending in the y direction and short sides SS1 to SS4 extending in a direction slightly inclined with respect to the x direction. Specifically, the long side LS1, short side SS1, long side LS2, short side SS2, long side LS3, short side SS3, long side LS4, short side SS4, and long side LS1 are connected in this order. The first turn is formed by the four sides from long side LS1 to short side SS2, and the second turn is formed by the four sides from long side LS3 to short side SS4. Similarly, the two turns of the Y coil Ly are realized by long sides LS5 to LS8 extending in the x direction and short sides SS5 to SS8 extending in a direction slightly inclined with respect to the y direction. Specifically, the long side LS5, short side SS5, long side LS6, short side SS6, long side LS7, short side SS7, long side LS8, short side SS8, and long side LS5 are connected in this order, with the first turn being made up of the four sides from long side LS5 to short side SS6, and the second turn being made up of the four sides from long side LS7 to short side SS8.

[0076] 7, each of the X coil Lx and the Y coil Ly has an end portion in the middle of one of its sides, and this end portion is connected to the lead line PL. The specific position of the end portion of each loop coil is determined by the wiring layout of the lead line PL.

[0077] Returning to FIG. 6 , the long sides LS1 to LS4 of each of the multiple X coils Lx are formed on the first layer L1, and the short sides SS1 to SS4 are formed on the second layer L2. These are connected by via conductors. The long sides LS5 to LS8 of each of the multiple Y coils Ly are formed on the second layer L2, and the short sides SS5 to SS8 are formed on the first layer L1. These are also connected by via conductors. By forming the wiring extending in the y direction (including a direction slightly inclined relative to the y direction) and the wiring extending in the x direction (including a direction slightly inclined relative to the x direction) on separate layers, it is possible to arrange the loop coils so that they overlap in a planar view. The lead wires PL are formed on the second layer L2 (some lead wires PL are formed on both the first layer L1 and the second layer L2) from the sensor unit 50 to the lead wire 51, using the areas between the portions of each loop coil formed on the second layer L2.

[0078] 6 shows an example in which each lead-out line PL in the lead-out portion 51 is formed on the second layer L2, but it goes without saying that each lead-out line PL can also be formed on the first layer L1. In this case, the arrangement of each side of each X coil Lx and each Y coil Ly may be adjusted so that the portion of each lead-out line PL extending in the x direction in the sensor unit 50 is arranged on the first layer L1, or the portion of each lead-out line PL extending in the x direction in the sensor unit 50 may be arranged on the second layer L2, and each lead-out line PL may be moved to the first layer L1 by a via conductor in the lead-out portion 51 or in a region of the sensor unit 50 near the boundary BO between the sensor unit 50 and the lead-out portion 51.

[0079] The sensor controller generates an alternating magnetic field on the panel surface by supplying an alternating current to one of the X coils Lx, and then performs a process for each X coil Lx in which the Y coil Ly receives the alternating magnetic field emitted as a reflected signal by a resonant circuit in an electromagnetic induction pen that has entered the alternating magnetic field. This process obtains the reception strength of the alternating magnetic field emitted from the electromagnetic induction pen at each intersection of the X coil Lx and the Y coil Ly. The sensor controller uses the obtained reception strength to derive a distribution of reception strength on the panel surface and derives the position of the vertex as the position of the electromagnetic induction pen. The electromagnetic induction pen is also configured to modulate the transmitted alternating magnetic field using data transmitted to the sensor controller, and the sensor controller receives the data transmitted by the electromagnetic induction pen by demodulating the received alternating magnetic field. The sensor controller is configured to output the obtained position and data to the host processor.

[0080] Returning to Fig. 5, as shown in Fig. 5(b), lead-out portion 51 according to this embodiment is configured to have a first folded portion FB1 and a second folded portion FB2 extending from the boundary BO with sensor unit 50 to tip end TI. In this embodiment, external substrate 52 is disposed between sensor unit 50 (or metal sheet 13) and a region of lead-out portion 51 between second folded portion FB2 and tip end TI, as viewed in the normal direction of sensor unit 50.

[0081] 5A, the lead-out wires PL are not shown, but the lead-out portion 51 according to this embodiment is also provided with a reduced pitch portion D, similar to the lead-out portion 51 according to the background art. The reduced pitch portion D according to this embodiment is disposed between the first folded portion FB1 and the second folded portion FB2, and the width of the region of the lead-out portion 51 between the second folded portion FB2 and the tip TI is constant. The lead-out wires PL are connected to the sensor connection portion 53 in this constant-width region (the region between the second folded portion FB2 and the tip TI).

[0082] As described above, in sensor 12 according to the present embodiment, first fold portion FB1 and second fold portion FB2 are provided in lead portion 51, and in the region between second fold portion FB2 and tip TI, lead wires PL are connected to sensor connection portion 53. Therefore, sensor connection portion 53 can be disposed in the same position as pitch reduced portion D when viewed in the x direction. Therefore, as is clear from a comparison of Figures 9 and 5, sensor 12 according to the present embodiment can achieve a shorter distance L than the related art while maintaining pitch reduced portion D.

[0083] As described above, according to the sensor 12 of this embodiment, it is possible to reduce the wiring pitch of the group of lead lines PL in the lead-out section 51, while still positioning the external board 52 on which the sensor connection section 53 is mounted closer to the edge of the metal sheet 13 than in the background art.

[0084] Fig. 8(a) is a plan view of sensor 12 according to the third embodiment of the present invention, and Fig. 8(b) is a cross-sectional view of sensor 12 taken along line B-B in Fig. 8(a). As can be seen by comparing Figs. 8(a) and 8(b) with Figs. 5(a) and 5(b), sensor 12 according to this embodiment differs from sensor 12 according to the first embodiment in the folding direction of lead-out portion 51 at second folding portion FB2. In other respects, sensor 12 according to this embodiment is similar to sensor 12 according to the first embodiment, and therefore the following description will focus on the differences.

[0085] 8B, the external substrate 52 according to this embodiment is disposed between the region of the lead-out portion 51 between the first folded portion FB1 and the second folded portion FB2 and the region between the second folded portion FB2 and the tip TI, as viewed in the normal direction of the sensor unit 50. The lead-out lines PL according to this embodiment are similar to the lead-out lines PL according to the first embodiment in that they are connected to the sensor connection portion 53 in the region between the second folded portion FB2 and the tip TI, but are connected to the sensor connection portion 53 on the opposite surface of the flexible substrate from that in the first embodiment. As described above, the lead-out lines PL can be formed on either the first layer L1 or the second layer L2 shown in FIG. 6, so it is sufficient to form the lead-out lines PL on the opposite surface from that in the first embodiment.

[0086] In sensor 12 according to the present embodiment, lead-out portion 51 is also provided with first fold-back portion FB1 and second fold-back portion FB2, and lead-out wires PL are connected to sensor connection portion 53 in the region between second fold-back portion FB2 and tip TI, so that sensor connection portion 53 can be disposed in the same position as pitch reduced portion D when viewed in the x direction. Therefore, it can be said that sensor 12 according to the present embodiment also makes it possible to achieve a shorter distance L than in the background art while maintaining pitch reduced portion D.

[0087] Next, a fourth embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0088] 10(a) is a schematic bottom view of a position detection device 1 according to a fourth embodiment of the present invention, and FIG. 10(b) is a schematic side view of the position detection device 1 shown in FIG. 10(a). As shown in these figures, the position detection device 1 according to this embodiment has a structure in which a cover film 10b, a display 11, a sensor 12, and a metal sheet 13 are stacked within a module frame 14. The surface of the cover film 10b forms a panel surface 1a that serves as both a touch surface that accepts input from the electromagnetic induction pen 2 and a display surface for the display 11. In the following description, two directions that are orthogonal to each other on the panel surface 1a will be referred to as the x-direction and the y-direction, respectively, and a direction that is orthogonal to both the x-direction and the y-direction (the stacking direction) will be referred to as the z-direction.

[0089] The position detection device 1 also has a control board 15 including a sensor controller, which is an integrated circuit that performs processing to detect the position of the electromagnetic induction pen 2 within the panel surface 1a using the sensor 12. The control board 15 is fixed to the underside of the metal sheet 13 by a mounting 16.

[0090] The position detection device 1, as a whole, including the module frame 14, is configured to be valley-foldable along a folding line BA extending along the y direction. The panel surface 1a is configured of a cover film 10b rather than glass in order to achieve this valley fold, and the cover film 10b is made of a bendable material such as polyethylene terephthalate. The metal sheet 13 is also made of a bendable material such as a nickel alloy, permalloy, or amorphous metal. A hinge (not shown) for achieving the valley fold is provided on the module frame 14 at a position corresponding to the folding line BA.

[0091] In addition to the components shown in the figure, the position detection device 1 also includes a central processing unit that controls the entire position detection device 1, a memory that stores programs and various data, and other components, but these components are not shown in Figure 10. The central processing unit is a device that executes various processes by running programs stored in the memory. These various processes include outputting a video signal to the display 11, generating stroke data based on the position of the electromagnetic induction pen 2 detected by the sensor controller, and rendering the generated stroke data.

[0092] The display 11 is a display device that displays a video signal supplied from a central processing unit, and is configured to be foldable along a folding line BA. The type of display system of the display 11 is not particularly limited, but may be, for example, a liquid crystal display or an organic EL display.

[0093] The sensor 12 is an electronic component including multiple loop coils, and is configured to be able to be folded at the folding line BA. The sensor controller serves to detect the position of the electromagnetic induction pen 2 on the panel surface 1a by passing an alternating current through one or more of the multiple loop coils that make up the sensor 12, thereby transmitting an alternating magnetic field from the panel surface 1a, and receiving the alternating magnetic field transmitted from the resonant circuit of the electromagnetic induction pen 2 that has entered the transmitted alternating magnetic field with each loop coil of the sensor 12.

[0094] The sensor 12 includes a sensor substrate 20, which is a multilayer substrate, and the above-mentioned multiple loop coils are formed on this sensor substrate 20. The sensor substrate 20 includes a rectangular coil forming portion 20a arranged to overlap the display 11, and an extraction portion 20b projecting from one of the sides of the coil forming portion 20a parallel to the y direction.

[0095] In the coil forming section 20a, a plurality of loop coils including a plurality of X coils Lx and a plurality of Y coils Ly shown in Fig. 13 (described later) are formed. In addition, in the lead-out section 20b, a plurality of lead-out wires PL (see Fig. 13) are formed for connecting each of the plurality of loop coils formed in the coil forming section 20a to a sensor controller in the control board 15. These points will be described in more detail later with reference to Fig. 13.

[0096] The lead-out portion 20b is configured to be bendable and extends to the underside of the metal sheet 13 through an opening (not shown) provided in the module frame 14, where it comes into contact with the control board 15. The metal sheet 13 and the control board 15 are bonded together with an anisotropic conductive film (ACF) 17, a special conductive adhesive that simultaneously provides electrical connection and mechanical fixation. The multiple lead-out wires PL are connected to the sensor controller in the control board 15 via this ACF 17.

[0097] 11 and 12 are schematic plan views of the sensor substrate 20. Referring first to FIG. 12, the sensor substrate 20 is configured with a rectangular deformation region 30 located inside both ends of the sensor substrate 20 in the x direction (more specifically, in the center) and extending over the entire length of the sensor substrate 20 in the y direction. This deformation region 30 is provided along the folding line BA to achieve a valley fold at the folding line BA, and is configured with a deformation structure blank region 31 that is located along the edge of the deformation region 30 in the x direction, and a deformation structure arrangement region 32 that is the other region. The configuration within the deformation region 30 will be described in detail below.

[0098] 11 , a plurality of slits SL are repeatedly arranged at a constant pitch in the deformed structure arrangement region 32. Each slit SL is a physical cut provided along the y direction, and each slit SL has a length L in the y direction. The slits SL are arranged in a staggered matrix with a column-to-column pitch (x-direction pitch) of Px and a row-to-row pitch (y-direction pitch) of Py, and the position of each column in the y direction is shifted from the position of an adjacent column in the y direction by Py / 2, half the pitch Py.

[0099] The slit SL is a deformation structure for deforming the sensor substrate 20 when an external force is applied, and when a bending force is applied to the sensor substrate 20 at the bending line BA, the slit SL locally twists and deforms, thereby fulfilling the role of bending the sensor substrate 20. Note that in this embodiment, an example will be described in which a slit SL with a width of 0 (i.e., normally closed) is used as the deformation structure, but a long, narrow hole (through-hole trench) with a shape obtained by expanding the width of the slit may also be used.

[0100] The deformation structure blank area 31 is an area within the deformation area 30 where slits SL are not arranged over an area larger than the pitches Px and Py. As shown in Figure 12, the deformation structure blank area 31 is arranged along each of the two edges of the deformation area 30 in the x direction, one at a time, at a position inside both ends of the deformation area 30 in the y direction. Each deformation structure blank area 31 is configured to have the largest width at the center of the deformation area 30 in the y direction, and to become smaller in width as it moves away from there on both sides in the y direction. As a result, the deformation structure arrangement area 32 has a shape similar to the vertical cross section of a rattan stool with a narrowed center.

[0101] Note that providing a deformation structure blank area 31 within the deformation region 30 has little effect on the bending performance of the sensor substrate 20. To explain in more detail, when the position detection device 1, which is a foldable display, is configured to be valley-foldable along the bending line BA, the folding mechanism is designed primarily with the display 11 in mind. Therefore, the sensor 12, which is located behind the display 11, experiences tension in both directions in the x-direction when folded. Therefore, for experimental purposes, a sensor substrate 20 was fabricated in which the entire deformation region 30 was the deformation structure arrangement region 32. When the sensor substrate 20 was actually bent while applying tension in both directions in the x-direction, it was found that the aforementioned torsional deformation hardly occurred in the region corresponding to the deformation structure blank area 31. This means that the slit SL located in the region corresponding to the deformation structure blank area 31 does not contribute to the bending performance of the sensor substrate 20. Therefore, in this embodiment, the deformation structure blank area 31 is provided in the deformation region 30. By providing the deformation structure blank area 31 in the deformation area 30 in this way, it is possible to obtain the effect of narrowing the frame of the display 11, which will be described in detail later.

[0102] As described above, the sensor substrate 20 is a multilayer substrate, and the loop coils provided on the sensor substrate 20 and the lead wires connecting the loop coils to the sensor controller are provided across multiple layers. Via conductors are used to connect the wiring formed on each layer. Because the via conductors are formed with metal plating that has little elasticity, if the via conductors were present in the deformation structure blank area 31, they could crack due to the large deformation of the sensor substrate 20 that occurs near the slit SL. Therefore, in this embodiment, the shape of the wiring is devised so that the via conductors do not need to be placed in the deformation structure blank area 31.

[0103] Furthermore, because the slits SL are arranged in a staggered matrix, it is not possible to provide straight wiring within the deformation structure arrangement region 32. On the other hand, it is necessary to provide a large number of loop coils and lead wires in the coil formation portion 20a, some of which must extend across the bending line BA. Therefore, in this embodiment, the shape of the wiring provided within the deformation structure arrangement region 32 is also devised so that the wiring can extend across the bending line BA.

[0104] Each of the above-mentioned features will be described in detail below with reference to specific examples of wiring provided on the sensor substrate 20. First, the electrical connection relationships and general layout of the wiring provided on the sensor substrate 20 will be described below, and then each of the above-mentioned features will be described in detail.

[0105] Fig. 13 is a plan view showing the electrical connection relationships and general layout of the wiring provided on the sensor substrate 20. As shown in the figure, a plurality of loop coils including a plurality of X coils Lx and a plurality of Y coils Ly are formed in the coil formation section 20a. Although Fig. 13 depicts seven X coils Lx (X coils Lx1 to Lx7 in order from one side in the x direction) and five Y coils Ly (Y coils Ly1 to Ly5 in order from one side in the y direction), this is done to avoid cluttering the drawing, and in reality, many more X coils Lx and Y coils Ly are formed.

[0106] The sensor 12 also has a plurality of lead wires PL formed from the coil forming portion 20 a to the lead wire portion 20 b. Two lead wires PL are provided for each loop coil, and serve to connect both ends of the corresponding loop coil to the sensor controller.

[0107] The sensor substrate 20 has a layered structure including a first layer L1 and a second layer L2. While Fig. 13 shows an example in which the second layer L2 is located above the first layer L1 (on the panel surface 1a side), the reverse is also possible. The first layer L1 and the second layer L2 are each configured to allow the formation of wiring that constitutes the loop coil and the lead wire PL. The wiring formed on the first layer L1 and the wiring formed on the second layer L2 can be connected by via conductors, indicated by white circles in the figure.

[0108] The via conductors are formed by forming holes in the sensor substrate 20 and then applying metal plating. Normally, this metal plating is performed by "panel plating," which applies plating uniformly to the entire substrate. However, in this embodiment, instead of "panel plating," "button plating" is used, which applies plating only to the locations where the via conductors are to be formed. Below, we will explain the process of forming via conductors by "panel plating" and the process of forming via conductors by "button plating," and explain in detail the reason why "button plating" is used in this embodiment.

[0109] FIG. 14 illustrates the process of forming via conductors by panel plating. The initial state of the sensor substrate 20 is shown in FIG. 14( a), with copper thin films 41 and 42 formed on both sides of the core layer 40. The copper thin film 41 corresponds to the first layer L1, and the copper thin film 42 corresponds to the second layer L2. In this state, a hole H is opened in the sensor substrate 20 using plasma etching or the like, as shown in FIG. 14( b). Then, metal plating is uniformly applied to the entire substrate, covering the entire surface, including the hole H, with a plated conductor 43, as shown in FIG. 14( c). As a result, the plated conductor 43 is embedded inside the hole H, forming a via conductor V. The copper thin films 41 and 42 are then etched to form wiring constituting the loop coil and lead wire PL, as shown in FIG. 14( d). Because the wiring thus formed is entirely covered with the plated conductor 43, as shown in FIG. 14( d), it may crack when the sensor substrate 20 is bent.

[0110] FIG. 15 illustrates the process of forming via conductors by button plating. The process from the initial state in FIG. 15( a) to the opening of the hole H in FIG. 15( b) is the same as that shown in FIG. 14. When forming via conductors by button plating, after the hole H is opened, etching of the copper thin films 41 and 42 is performed before metal plating, as shown in FIG. 15( c) to form the wiring constituting the loop coil and the lead wire PL. Then, metal plating is selectively performed only at the location where the hole H is formed, thereby forming the via conductor V. The wiring formed by this process is not covered by the plated conductor 43 except in the vicinity of the via conductor V. Therefore, as long as the via conductor V is located outside the deformed structure arrangement area 32, the risk of the wiring cracking due to bending of the sensor substrate 20 is eliminated. For these reasons, in this embodiment, the via conductors are formed by button plating.

[0111] Returning to the description of the wiring provided on the sensor substrate 20, FIG. 16 is a diagram illustrating the structure of the X coil Lx and the Y coil Ly. As shown in the figure, the X coil Lx and the Y coil Ly each have two turns. The two turns of the X coil Lx are realized by long sides LS1 to LS4 extending in the y direction and short sides SS1 to SS4 extending in a direction slightly inclined with respect to the x direction. Specifically, the long side LS1, short side SS1, long side LS2, short side SS2, long side LS3, short side SS3, long side LS4, short side SS4, and long side LS1 are connected in this order, with the first turn being formed by the four sides from long side LS1 to short side SS2, and the second turn being formed by the four sides from long side LS3 to short side SS4. Similarly, the two turns of the Y coil Ly are realized by long sides LS5 to LS8 extending in the x direction and short sides SS5 to SS8 extending in a direction slightly inclined with respect to the y direction. Specifically, the long side LS5, short side SS5, long side LS6, short side SS6, long side LS7, short side SS7, long side LS8, short side SS8, and long side LS5 are connected in this order, with the first turn being made up of the four sides from long side LS5 to short side SS6, and the second turn being made up of the four sides from long side LS7 to short side SS8.

[0112] 16, each of the X coil Lx and the Y coil Ly has an end portion in the middle of one of its sides, and this end portion is connected to the lead line PL. The specific position of the end portion of each loop coil is determined by the wiring layout of the lead line PL.

[0113] 17 and 18 are diagrams illustrating the wiring innovations of this embodiment. Fig. 17 shows the wiring formed on the first layer L1, and Fig. 18 shows the wiring formed on the second layer L2. These figures show only two X coils Lx1 and Lx2 and one Y coil Ly1 as representatives of the multiple loop coils provided on the sensor substrate 20, along with a lead wire PL for connecting these three loop coils to the sensor controller. Note that the serial numbers of each coil in Figs. 17 and 18 are unrelated to the serial numbers of each coil shown in Fig. 13. 19(a) is an enlarged view of area A1 shown in FIG. 17, FIG. 19(b) is an enlarged view of area A2 shown in FIG. 18, FIG. 20(a) is an enlarged view of area A3 shown in FIG. 17, FIG. 20(b) is an enlarged view of area A4 shown in FIG. 18, FIG. 21(a) is an enlarged view of area A5 shown in FIG. 18, and FIG. 21(b) is an enlarged view of area A6 shown in FIG. 18.

[0114] 17 , the X coil Lx1 is provided in a position where all of the long sides LS1 to LS4 extend within the deformation region 30. In this case, normally, all of the via conductors connecting each long side and each short side would be provided within the deformation region 30. However, as described above, this could result in cracking, so in this embodiment, each long side and each short side is extended to the outside of the deformation region 30, and via conductors connecting them are provided outside the deformation region 30.

[0115] 19( a), one end of the long side LS1 is drawn in the x direction, avoiding the slit SL, by wiring (meandering portion) having a waveform (waveform; the same applies below) similar to that of the long side LS5 of the Y coil Ly1, which will be described later, and is then connected to an extension line LS1e1 at the boundary of the deformation region 30. The extension line LS1e1 is a wiring that serves to extend the long side LS1 to the via conductor V11 arranged outside the deformation region 30, and is connected at one end to one end of the long side LS1 and at the other end to the via conductor V11. Furthermore, one end of the long side LS3 is drawn in the x direction, avoiding the slit SL, by wiring having a waveform similar to that of the long side LS7 of the Y coil Ly1, which will be described later, and is then connected to an extension line LS3e1 at the boundary of the deformation region 30. The extension line LS3e1 is a wiring that serves to extend the long side LS3 to the via conductor V33 arranged outside the deformation region 30, and is connected at one end to one end of the long side LS3 and at the other end to the via conductor V33.

[0116] 19A, the waveform wiring of the long side LS1 and the waveform wiring of the long side LS3 are symmetrical to each other. This is to avoid a deterioration in coordinate accuracy due to the provision of a waveform portion (meandering portion), similar to the long sides LS5 and LS7 of the Y coil Ly1 described later. Details will be explained again when explaining the Y coil Ly1.

[0117] The same is true for long sides LS2 and LS4: one end of long side LS2 is drawn out in the x direction by wavy wiring, and then connected to an extension line LS2e1 at the boundary of deformation region 30, and via this extension line LS2e1, connected to via conductor V21 arranged outside deformation region 30. Furthermore, one end of long side LS4 is drawn out in the x direction by wavy wiring, and then connected to an extension line LS4e1 at the boundary of deformation region 30, and via this extension line LS4e1, connected to via conductor V43 arranged outside deformation region 30. Similar to long sides LS1 and LS3, the wavy wiring of long side LS2 and the wavy wiring of long side LS4 are symmetrical to each other.

[0118] 20(a), the long sides LS1 and LS3 are drawn in the x direction by waveform wiring that is symmetrical to one another, avoiding the slit SL, and are connected to via conductors V14 and V32 outside the deformation region 30 by extension lines LS1e2 and LS3e2, respectively.Furthermore, the long sides LS2 and LS4 are drawn in the x direction by waveform wiring that is symmetrical to one another, avoiding the slit SL, and are connected to via conductors V22 and V44 outside the deformation region 30 by extension lines LS2e2 and LS4e2, respectively.

[0119] 19(b), the short sides SS1 and SS3 are formed as a whole with parallel wavy wiring (meandering portions) similar to the two wirings that make up the lead wire PL of the X coil Lx2 (described later), avoiding the slit SL. The reason why the short sides SS1 and SS3 are formed with parallel wavy wiring is because the effect of the short sides SS1 and SS3 on the characteristics of the loop coil is small, and priority is given to extending them over a smaller area. This point will be explained again later when explaining the lead wire PL of the X coil Lx2.

[0120] Both ends of the short side SS1 are connected to extension lines SS1e1 and SS1e2, respectively, at boundaries of the deformation region 30 on opposite sides in the x direction. The extension line SS1e1 is a wiring that serves to extend the short side SS1 to the via conductor V11 arranged outside the deformation region 30, and is connected at one end to one end of the short side SS1 and at the other end to the via conductor V11. The extension line SS1e2 is a wiring that serves to extend the short side SS1 to the via conductor V21 arranged outside the deformation region 30, and is connected at one end to the other end of the short side SS1 and at the other end to the via conductor V21. Similarly, both ends of the short side SS3 are connected to extension lines SS3e1 and SS3e2, respectively, at boundaries of the deformation region 30 on opposite sides in the x direction. The extension line SS3e1 is a wiring that serves to extend the short side SS1 to the via conductor V33 arranged outside the deformation region 30, and is connected at one end to one end of the short side SS3 and at the other end to the via conductor V33. The extension line SS3e2 is a wiring that serves to extend the short side SS1 to the via conductor V43 arranged outside the deformation region 30, and is connected at one end to the other end of the short side SS3 and at the other end to the via conductor V43.

[0121] The same applies to the short sides SS2 and SS4. Briefly described with reference to FIG. 20( b), the short sides SS2 and SS4 are formed by parallel wavy wiring, avoiding the slit SL. The short side SS2 is connected at one end to the via conductor V32 outside the deformation region 30 via an extension line SS2e1, and at the other end to the via conductor V22 outside the deformation region 30 via an extension line SS2e2. The short side SS4 is connected at one end to the via conductor V14 outside the deformation region 30 via an extension line SS4e1, and at the other end to the via conductor V44 outside the deformation region 30 via an extension line SS4e2.

[0122] As described above, in this embodiment, each of the long sides and short sides of the X coil Lx1, which is arranged so that each long side and each short side extends within the deformation region 30, is connected to a via conductor outside the deformation region 30 via an extension line, so that the long sides and short sides extending within the deformation region 30 can be connected to each other by via conductors outside the deformation region 30. Therefore, it is possible to form a loop coil within the deformation region 30 without providing via conductors within the deformation region 30, and it can be said that it is possible to prevent cracking of the via conductors.

[0123] Next, focusing on the Y coil Ly1, as shown in Figure 18, in the Y coil Ly1, all of the long sides LS5 to LS8 extend across the deformation region 30 (bending line BA). However, as described above, since the slits SL are arranged in a staggered matrix, it is not possible to provide straight wiring within the deformation region 30. Therefore, in this embodiment, the long sides LS5 to LS8 are formed so as to avoid the slits SL within the deformation region 30.

[0124] 21A, each of the long sides LS5 to LS8 according to this embodiment has a serpentine portion (a portion formed in a wave shape) that extends in a serpentine manner so as to avoid the plurality of slits SL within the deformation region 30. This allows the long sides LS5 to LS8 to extend across the deformation region 30 (the bending line BA) in the sensor 12 according to this embodiment.

[0125] However, simply providing such a meandering section on each long side would change the characteristics of the loop coil compared to a case without a meandering section, thereby degrading the accuracy of the coordinates detected by the sensor controller. Therefore, in this embodiment, adjacent wiring within the same loop coil, i.e., the meandering section on long side LS5 and the meandering section on long side LS7, and the meandering section on long side LS6 and the meandering section on long side LS8, are each formed into waveforms that are line-symmetrical to each other. In other words, each meandering section is formed so that the phases of the waves are 180 degrees out of phase with each other. This allows the change in characteristics to be in the opposite direction between the first and second turns compared to a case without a meandering section, thereby canceling out and achieving the same coordinate accuracy as a loop coil without a meandering section.

[0126] Next, focusing on the X coil Lx2, the lead wire PL of the X coil Lx2 extends across the deformation region 30 (bending line BA) as shown in Fig. 18. Since the situation in which straight wiring cannot be provided within the deformation region 30 is the same as in the case of the wiring of the loop coil, in this embodiment, the lead wire PL is also provided with a meandering portion.

[0127] However, the meandering portions of the two wires that make up the lead wire PL of the X coil Lx2 are formed in parallel waveforms, as shown in Fig. 21(b). Since the lead wire PL does not have the characteristics problems that occur in the case of a loop coil, there is no need to form the meandering portions of the two wires in waveforms that are line-symmetrical to each other. On the other hand, in this embodiment, the meandering portions of the two wires are formed in parallel waveforms, so it is possible to extend the lead wire PL in a smaller area.

[0128] Finally, the reason why providing the deformation structure blank area 31 contributes to narrowing the frame of the display 11 will be explained in detail. In this embodiment, as shown in Figures 17 and 18, one end and the other end of the X coil Lx1 are provided in the middle of the long side LS1 of the X coil Lx1, and these are connected by via conductors VP to the lead lines PL of the X coil Lx1 provided on the second layer L2. When making such a connection, if the deformation structure blank area 31 is not provided within the deformation region 30 (i.e., if the entire deformation region 30 is the deformation structure arrangement region 32), the via conductors VP will be placed in the deformation structure arrangement region 32, which can cause a problem of cracking of the via conductors. Therefore, it is not possible to provide one end and the other end of the X coil Lx1 in the middle of the long side LS1 of the X coil Lx1, and on the other hand, it is not possible to extend the X coil Lx1 outside the deformation region 30 within the display region of the display 11. Therefore, it is necessary to extend the X coil Lx1 to the outside of the deformation region 30 within the bezel region of the display 11 and provide the via conductor VP there. In this embodiment, although such an extension line already exists as the above-mentioned extension line LS1e1, if one end and the other end of the X coil Lx1 were to be provided on the extension line LS1e1, it would be necessary to provide two via conductors VP and lead lines PL connected to them near the via conductors V11 and V33 shown in FIG. 19( a), which would require the area of ​​the bezel region to be expanded accordingly. The same result would occur even if one end and the other end of the X coil Lx1 were provided on another extension line. In contrast to this, according to the present embodiment, the deformation structure blank area 31 is provided within the deformation region 30, so that one end and the other end of the X coil Lx1 can be provided approximately in the middle of the long side LS1 of the X coil Lx1 as described above, and therefore it is not necessary to provide the via conductors VP and the lead wires PL within the bezel area, and therefore the provision of the deformation structure blank area 31 makes it possible to prevent the area of ​​the bezel area from expanding. The above is the reason why it can be said that the provision of the deformation structure blank area 31 is a configuration that contributes to narrowing the frame of the display 11.

[0129] As described above, according to the sensor 12 of this embodiment, two wires (for example, the long side LS1 and the short side SS1 of the X coil Lx1 shown in FIG. 17) each extending within the deformation region 30 can be connected to each other by via conductors outside the deformation region 30, so that a loop coil can be formed within the deformation region 30 without providing via conductors within the deformation region 30. This makes it possible to prevent cracks in the via conductors.

[0130] Furthermore, according to sensor 12 of the present embodiment, each wiring (for example, each long side LS5 to LS8 of Y coil Ly1 or lead wire PL of X coil Lx2 shown in FIG. 18) is formed so as to avoid slit SL, making it possible to provide loop coils and lead wires across bending line BA. Furthermore, while each long side of the Y coil is formed into a wave shape to avoid slit SL, adjacent wiring within the same Y coil employs wave shapes that are line-symmetrical to each other, so according to sensor 12 of the present embodiment, it is also possible to avoid deterioration in coordinate accuracy that would be caused by providing a wave-shaped portion within a loop coil.

[0131] Furthermore, according to the sensor 12 of this embodiment, even if a slit SL is provided, it is hardly deformed by bending, and therefore a deformation structure blank area 31 is provided along the edge of the deformation area 30 in the x direction where there is no need to place a slit SL, and it becomes possible to arrange via conductors therein. Therefore, the number of via conductors that must be arranged in the bezel area near the deformation area 30 can be reduced, which prevents cracks in the via conductors and also makes it possible to accommodate a narrower frame of the display 11.

[0132] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and it goes without saying that the present invention can be embodied in various forms without departing from the spirit of the present invention.

[0133] For example, in each of the above embodiments, examples have been described in which each loop coil constituting a coil group has two turns, but the present invention can also be applied to sensors having a coil group with loop coils having one turn or three or more turns.

[0134] In recent years, a fingerprint sensor has been placed within the screen of a display. In this case, the wiring (including the loop coil and the lead wire PL) that constitutes the sensor 12 must be formed so as to avoid the fingerprint sensor. However, it is preferable that adjacent wirings within the loop coil thus formed be formed in line-symmetrical shapes with respect to each other on either side of the fingerprint sensor, similar to the Y coil Ly1 shown in Figure 21(a). This makes it possible to obtain the same coordinate accuracy as a loop coil that does not have any parts that avoid the fingerprint sensor.

[0135] The present invention can also be configured as follows: [Configuration A1] A sensor including: a sensor substrate having a first layer and a second layer, a plurality of first loop coils each having a first long side and a second long side extending in a first direction and juxtaposed in a second direction orthogonal to the first direction, and a plurality of first lead-out wires for connecting the plurality of first loop coils to a sensor controller, wherein the sensor substrate includes a rectangular coil forming section whose sides are parallel to either the first direction or the second direction, and a lead-out portion having a shape protruding from a first side of the coil forming section that is parallel to the first direction, and the plurality of first lead-out wires are formed in the second layer from the coil forming section to the lead-out portion, and a first loop coil of the plurality of first loop coils that is positioned closest to the lead-out portion has a portion of the first long side formed in the first layer within the lead-out portion. [Configuration A2] The sensor according to Configuration A1, wherein the remainder of the first long side of the first loop coil of the plurality of first loop coils that is located closest to the lead-out portion is formed on the second layer within the coil forming portion. [Configuration A3] The sensor according to Configuration A2, wherein the first long side of the first loop coil of the plurality of first loop coils that is located closest to the lead-out portion extends closer to the outer periphery of the coil forming portion than the second long side. [Configuration A4] The sensor according to Configuration A2, wherein each of the plurality of first loop coils is formed by two turns and further has a third long side and a fourth long side extending in the first direction, and the second long side, the third long side, and the fourth long side of the first loop coil of the plurality of first loop coils that is located closest to the lead-out portion are formed on the first layer within the sensor substrate. [Configuration A5] The sensor described in Configuration A4, wherein the second long side of the first loop coil that is positioned farthest from the lead-out portion among the plurality of first loop coils is formed on the second layer within the sensor substrate, and the first long side, the third long side, and the fourth long side are formed on the first layer within the sensor substrate.[Configuration A6] The sensor described in Configuration A1, further including: a plurality of second loop coils each having a fifth long side and a sixth long side extending in the second direction and arranged side by side in the first direction; and a plurality of second lead-out wires for connecting the plurality of second loop coils to the sensor controller, wherein the plurality of second lead-out wires are formed in the second layer from the coil forming portion to the lead-out portion. [Configuration B1] A sensor including: a sensor substrate having a first layer and a second layer; a plurality of first loop coils each formed by two turns having first to fourth long sides extending in a first direction and juxtaposed in a second direction perpendicular to the first direction; and a plurality of first lead-out wires for connecting the plurality of first loop coils to a sensor controller, wherein the sensor substrate includes a rectangular coil forming section with each side parallel to either the first direction or the second direction, and a lead-out portion shaped to protrude from a side of the coil forming section parallel to the first direction, and the plurality of first lead-out wires are formed in the second layer from the coil forming section to the lead-out portion, and a first loop coil of the plurality of first loop coils that is positioned closest to the lead-out portion has a portion of the first long side formed in the second layer within the sensor substrate, and the second long side, the third long side, and the fourth long side are formed in the first layer within the sensor substrate. [Configuration B2] The sensor according to Configuration B1, wherein the remainder of the first long side of the first loop coil arranged closest to the lead-out portion among the plurality of first loop coils is formed on the first layer within the lead-out portion. [Configuration B3] The sensor according to Configuration B2, wherein the second long side of the first loop coil arranged farthest from the lead-out portion among the plurality of first loop coils is formed on the second layer within the sensor substrate, and the first long side, the third long side, and the fourth long side are formed on the first layer within the sensor substrate.[Configuration B4] The sensor described in Configuration B1 further includes: a plurality of second loop coils arranged side by side in the first direction, each of which is formed by two turns having fifth to eighth long sides extending in the second direction; and a plurality of second lead-out wires for connecting the plurality of second loop coils to the sensor controller, wherein the plurality of second lead-out wires are formed in the second layer from the coil forming portion to the lead-out portion. [Configuration B5] The sensor described in Configuration B4, wherein the fifth side of one of the two second loop coils arranged outermost among the plurality of second loop coils is formed on the first layer in the sensor substrate, and the sixth long side, the seventh long side, and the eighth long side are formed on the second layer in the sensor substrate, and the sixth side of the other of the two second loop coils arranged outermost among the plurality of second loop coils is formed on the first layer in the sensor substrate, and the fifth long side, the seventh long side, and the eighth long side are formed on the second layer in the sensor substrate.[Configuration C1] A sensor substrate having a first layer and a second layer; a plurality of first loop coils, each formed by two turns having first to fourth long sides extending in a first direction and juxtaposed in a second direction perpendicular to the first direction; and a plurality of second loop coils, each formed by two turns having fifth to eighth long sides extending in the second direction and juxtaposed in the first direction, wherein the sensor substrate includes a rectangular coil forming portion, each side of which is parallel to either the first direction or the second direction, and a lead-out portion having a shape protruding from a side of the coil forming portion parallel to the first direction, wherein the first to fourth long sides of the first loop coils other than two first loop coils arranged outermost among the plurality of first loop coils are formed in the first layer, the second long side of the first loop coil that is located farthest from the lead-out portion among the plurality of first loop coils is formed on the second layer, and the first long side, the third long side, and the fourth long side are formed on the first layer; the fifth and sixth long sides of the second loop coils other than the two second loop coils that are located outermost among the plurality of second loop coils are formed on the second layer; the fifth long side of one of the two second loop coils that are located outermost among the plurality of second loop coils is formed on the first layer, and the sixth long side, the seventh long side, and the eighth long side are formed on the second layer; and the seventh long side of the other of the two second loop coils that are located outermost among the plurality of second loop coils is formed on the first layer, and the fifth long side, the seventh long side, and the eighth long side are formed on the second layer.[Configuration C2] The sensor according to Configuration C1, further including a plurality of lead-out wires for connecting the plurality of first loop coils and the plurality of second loop coils to a sensor controller, the plurality of lead-out wires being formed on the second layer from the coil forming portion to the lead-out portion, and a portion of the first long side of the first loop coil of the plurality of first loop coils that is located closest to the lead-out portion being formed on the first layer within the lead-out portion, and the remainder being formed on the second layer within the sensor substrate. [Configuration C3] The sensor according to Configuration C2, further including a plurality of lead-out wires for connecting the plurality of first loop coils and the plurality of second loop coils to a sensor controller, the plurality of lead-out wires being formed on the second layer from the coil forming portion to the lead-out portion, [Configuration D1] A sensor comprising: a rectangular sensor unit having a coil group; a foldable lead-out portion having a shape extending beyond one side of the sensor unit; and an external substrate arranged in a position overlapping the sensor unit in a planar view, wherein the lead-out portion includes a lead-out wire group for leading the coil group to the external substrate, the external substrate includes a sensor connection portion to which the lead-out wire group is connected, the lead-out portion has at least two fold portions including a first fold portion and a second fold portion from a boundary with the sensor unit to a tip, and the lead-out wire group is connected to the sensor connection portion in a region between the second fold portion and the tip. [Configuration D2] The sensor according to Configuration D1, wherein the external substrate is arranged between the sensor unit and a region of the lead-out portion between the second fold portion and the tip, when viewed in a normal direction to the sensor unit. [Configuration D3] The sensor according to Configuration D1, wherein the external substrate is arranged, when viewed in the normal direction of the sensor unit, between a region of the lead-out portion between the first folded portion and the second folded portion and a region between the second folded portion and the tip. [Configuration D4] The sensor according to Configuration D1, wherein the lead-out portion has a reduced pitch portion in which the wiring pitch of the group of lead-out wires gradually decreases. [Configuration D5] The sensor according to Configuration D4, wherein the reduced pitch portion is arranged between the first folded portion and the second folded portion.[Configuration D6] The sensor according to Configuration D1, wherein the external substrate has a rectangular shape that is long in the arrangement direction of the lead lines in the lead line group. [Configuration D7] The sensor according to Configuration D1, including a metal sheet that covers the entire sensor unit on one surface, and the external substrate is disposed on the other surface of the metal sheet. [Configuration D8] The sensor according to Configuration D7, wherein the first folded portion is provided so as to wrap around an edge of the metal sheet. [Configuration D9] A position detection device including the sensor according to any one of Configurations D1 to D8. [Configuration E1] A sensor including a multilayer substrate having a deformation region that deforms in response to an external force, the sensor comprising: a first wiring extending through a first layer of the multilayer substrate and within the deformation region; a second wiring extending through a second layer of the multilayer substrate and within the deformation region; a first extension line extending through the first layer and outside the deformation region and connecting to the first wiring at a boundary of the deformation region; a second extension line extending through the second layer and outside the deformation region and connecting to the second wiring at a boundary of the deformation region; and a first via conductor located outside the deformation region and connecting the first extension line and the second extension line. [Configuration E2] The sensor according to Configuration E1, wherein the multilayer substrate has a plurality of deformation structures within the deformation region, and the first wiring and the second wiring each have a meandering portion that extends in a meandering manner to avoid the plurality of deformation structures. [Configuration E3] The sensor according to Configuration E2, wherein each of the plurality of deformation structures is a slit provided in the substrate. [Configuration E4] The sensor of configuration E2, wherein the meandering portion is a portion formed in a wave shape. [Configuration E5] The sensor of configuration E1, wherein the first wiring, the second wiring, the first extension line, the second extension line, and the first via conductor constitute a part of a first loop coil arranged in the deformation region. [Configuration E6] The sensor of configuration E5, wherein the first loop coil is used to detect the position of the pen on the touch surface by supplying an alternating current to the first loop coil to emit an alternating magnetic field from the touch surface, and detecting the alternating current generated in the first loop coil by the alternating magnetic field emitted from a resonant circuit mounted on a pen that has entered the alternating magnetic field.a first via conductor provided outside the deformation region, the first via conductor being formed by embedding a plated conductor in a hole provided in the multilayer substrate, and the first wiring and the second wiring being unplated except for areas near the via conductor. [Configuration F1] A sensor including a multilayer substrate having a deformation region that deforms in response to an external force, the sensor including a first loop coil disposed in the deformation region, the first loop coil including: a long side extending through a first layer of the multilayer substrate and within the deformation region, a short side extending through a second layer of the multilayer substrate and within the deformation region, a first extension line extending through the first layer and outside the deformation region and connecting to the long side at a boundary of the deformation region, a second extension line extending through the second layer and outside the deformation region and connecting to the short side at a boundary of the deformation region, and a first via conductor provided outside the deformation region, the first extension line and the second extension line being connected to [Configuration G1] A sensor including a substrate, wherein the substrate has a deformation region in which a plurality of deformation structures are arranged for deforming the substrate upon receiving an external force, and a first wiring formed on the substrate, wherein the first wiring is formed to avoid the plurality of deformation structures within the deformation region. [Configuration G2] The sensor described in Configuration G1, wherein each of the plurality of deformation structures is a slit provided in the substrate. [Configuration G3] The sensor described in Configuration G1, wherein the first wiring is formed in a waveform within the deformation region to avoid the plurality of deformation structures. [Configuration G4] The sensor described in Configuration G3, further including a second wiring formed on the substrate, wherein the first and second wirings are adjacent wirings within the same loop coil, and the second wiring is formed in a waveform within the deformation region that is line-symmetrical to the first wiring to avoid the plurality of deformation structures.[Configuration G5] The sensor of Configuration G3 further includes a second wiring formed on the substrate, the first and second wiring being wiring connected to one end and the other end of the same loop coil, and the second wiring being formed in a waveform parallel to the first wiring within the deformation region to avoid the multiple deformation structures. [Configuration H1] A sensor including a rectangular substrate extending in either a first direction or a second direction, each side of which is orthogonal to each other, the substrate having a rectangular deformation region located inside both ends of the substrate in the first direction and extending over the entire length of the substrate in the second direction, the deformation region including: a deformation structure arrangement region in which deformation structures for deforming the substrate in response to an external force are repeatedly arranged at a constant pitch; and a deformation structure blank region located along the edge of the deformation region in the first direction and in which the deformation structures are not arranged over an area larger than the pitch. [Configuration H2] The sensor of Configuration H1, in which the deformation structure blank region is located inside both ends of the deformation region in the second direction. [Configuration H3] The sensor of Configuration H1, wherein the deformation region has the deformation structure gap along each of two edges of the deformation region in the first direction. [Configuration H4] The sensor of Configuration H1, wherein the substrate is a multilayer substrate including a first layer and a second layer, further comprising: a loop coil extending in the first layer and within the deformation region; a first lead wire extending in the second layer and from outside the deformation region into the deformation region; and a first via conductor disposed in the deformation structure gap and connecting one end of the loop coil to one end of the first lead wire. [Configuration H5] The sensor of Configuration H4, further comprising: a second lead wire extending in the second layer and from outside the deformation region into the deformation region in parallel to the first lead wire; and a second via conductor disposed in the deformation structure gap and connecting the other end of the loop coil to one end of the second lead wire.

[0136] 1 Position detection device 1a Panel surface 2 Electromagnetic induction pen 10a Glass 10a Cover film 11 Display 12 Sensor 13 Metal sheet 14 Module frame 15 Control board 16 Mounting 20 Sensor substrate 20a Coil formation section 20a1 to 20a4 Side of coil formation section 20a 20b Lead-out section 30 Deformation area 31 Deformation structure blank area 32 Deformation structure arrangement area 40 Core layer 41, 42 Copper thin film 43 Plated conductor 50 Sensor section 51 Lead-out section 52 External substrate 52a Mounting area 53 Sensor connection section BA Bending line BO Boundary between sensor section 2 and lead-out section 3 D Pitch reduction section FB1 First folded section FB2 Second folded section H Hole L1 First layer L2 Second layer LS1 to LS4 Long side of X coil Lx LS1e1, LS1e2, LS2e1, LS2e2, LS3e1, LS3e2, LS4e1, LS4e2 Extension of the long side of X coil Lx LS5 to LS8 Long side of Y coil Ly SL Slit SS1 to SS4 Short side of X coil Lx SS1e1, SS1e2, SS2e1, SS2e2, SS3e1, SS3e2, SS4e1, SS4e2 Extension of the short side of X coil Lx SS5 to SS8 Short side of Y coil Ly TI Tip of lead-out section 3 Lx, Lx1 to Lx7 X coil Ly, Ly1 to Ly5 Y coil PL Lead-out wire V, V11, V14, V44, V43, V33, V32, V22, V21, VP via conductor

Claims

1. A sensor comprising: a sensor substrate having a first layer and a second layer; a plurality of first loop coils each having a first long side and a second long side extending in a first direction and juxtaposed in a second direction perpendicular to the first direction; and a plurality of first lead-out wires for connecting the plurality of first loop coils to a sensor controller, wherein the sensor substrate includes a rectangular coil forming section with each side parallel to either the first direction or the second direction, and a lead-out portion having a shape protruding from a first side of the coil forming section parallel to the first direction, the plurality of first lead-out wires being formed in the second layer from the coil forming section to the lead-out portion, and a first loop coil of the plurality of first loop coils that is positioned closest to the lead-out portion has a portion of the first long side formed in the first layer within the lead-out portion.

2. The sensor according to claim 1, wherein the remainder of the first long side of the first loop coil that is positioned closest to the lead-out portion among the plurality of first loop coils is formed in the second layer within the coil forming portion.

3. The sensor described in claim 2, wherein the first long side of the first loop coil that is located closest to the pull-out portion among the plurality of first loop coils extends closer to the outer periphery of the coil forming portion than the second long side.

4. The sensor described in claim 2, wherein each of the plurality of first loop coils is configured by two turns and further has a third long side and a fourth long side extending in the first direction, and the second long side, the third long side, and the fourth long side of the first loop coil that is positioned closest to the pull-out portion among the plurality of first loop coils is formed in the first layer within the sensor substrate.

5. The sensor described in claim 4, wherein the second long side of the first loop coil that is located farthest from the lead-out portion among the plurality of first loop coils is formed on the second layer within the sensor substrate, and the first long side, the third long side, and the fourth long side are formed on the first layer within the sensor substrate.

6. The sensor described in claim 1, further comprising: a plurality of second loop coils arranged side by side in the first direction, each having a fifth long side and a sixth long side extending in the second direction; and a plurality of second lead-out wires for connecting the plurality of second loop coils to the sensor controller, wherein the plurality of second lead-out wires are formed in the second layer from the coil forming portion to the lead-out portion.

7. A sensor comprising: a sensor substrate having a first layer and a second layer; a plurality of first loop coils each formed by two turns having first to fourth long sides extending in a first direction and juxtaposed in a second direction perpendicular to the first direction; and a plurality of first lead-out wires for connecting the plurality of first loop coils to a sensor controller, wherein the sensor substrate includes a rectangular coil forming section with each side parallel to either the first direction or the second direction, and a lead-out section shaped to protrude from a side of the coil forming section parallel to the first direction, the plurality of first lead-out wires being formed in the second layer from the coil forming section to the lead-out section, and a first loop coil of the plurality of first loop coils that is positioned closest to the lead-out section has a portion of the first long side formed in the second layer within the sensor substrate, and the second long side, the third long side, and the fourth long side are formed in the first layer within the sensor substrate.

8. The sensor according to claim 7, wherein the remainder of the first long side of the first loop coil that is located closest to the lead-out portion among the plurality of first loop coils is formed in the first layer within the lead-out portion.

9. The sensor described in claim 8, wherein the second long side of the first loop coil that is located farthest from the lead-out portion among the plurality of first loop coils is formed on the second layer within the sensor substrate, and the first long side, the third long side, and the fourth long side are formed on the first layer within the sensor substrate.

10. The sensor described in claim 7, further comprising: a plurality of second loop coils arranged side by side in the first direction, each of which is formed by two turns with fifth to eighth long sides extending in the second direction; and a plurality of second lead-out wires for connecting the plurality of second loop coils to the sensor controller, wherein the plurality of second lead-out wires are formed in the second layer from the coil forming portion to the lead-out portion.

11. The sensor described in claim 10, wherein the fifth side of one of the two second loop coils arranged outermost among the plurality of second loop coils is formed on the first layer within the sensor substrate, and the sixth long side, the seventh long side, and the eighth long side are formed on the second layer within the sensor substrate, and the sixth side of the other of the two second loop coils arranged outermost among the plurality of second loop coils is formed on the first layer within the sensor substrate, and the fifth long side, the seventh long side, and the eighth long side are formed on the second layer within the sensor substrate.

12. A sensor substrate having a first layer and a second layer; a plurality of first loop coils, each formed by two turns having first to fourth long sides extending in a first direction and juxtaposed in a second direction perpendicular to the first direction; and a plurality of second loop coils, each formed by two turns having fifth to eighth long sides extending in the second direction and juxtaposed in the first direction; wherein the sensor substrate includes a rectangular coil forming section, each side of which is parallel to either the first direction or the second direction, and a lead-out section projecting from a side of the coil forming section parallel to the first direction; and wherein the first to fourth long sides of the first loop coils other than two first loop coils arranged outermost among the plurality of first loop coils are formed in the first layer; the second long side of the first loop coil that is located farthest from the lead-out portion among the plurality of first loop coils is formed on the second layer, and the first long side, the third long side, and the fourth long side are formed on the first layer; the fifth and sixth long sides of the second loop coils other than the two second loop coils that are located outermost among the plurality of second loop coils are formed on the second layer; the fifth long side of one of the two second loop coils that are located outermost among the plurality of second loop coils is formed on the first layer, and the sixth long side, the seventh long side, and the eighth long side are formed on the second layer; and the seventh long side of the other of the two second loop coils that are located outermost among the plurality of second loop coils is formed on the first layer, and the fifth long side, the seventh long side, and the eighth long side are formed on the second layer.

13. The sensor described in claim 12, further comprising a plurality of lead-out wires for connecting the plurality of first loop coils and the plurality of second loop coils to a sensor controller, the plurality of lead-out wires being formed on the second layer from the coil forming section to the lead-out section, and a portion of the first long side of the first loop coil of the plurality of first loop coils that is positioned closest to the lead-out section being formed on the first layer within the lead-out section, and the remaining portion being formed on the second layer within the sensor substrate.

14. The sensor described in claim 13, wherein the second long side, the third long side, and the fourth long side of the first loop coil that is positioned closest to the lead-out portion among the plurality of first loop coils are formed on the first layer within the sensor substrate.

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