Photosensitive composition and display device using same

Abstract

A photosensitive composition of the present invention comprises hollow silica particles, and comprises a resin comprising repeating units represented by chemical formula (1) and chemical formula (2), so as to enable low temperature (100°C or below) curing, and thus can prevent damage to an organic element layer, which is caused by heat during processing. Therefore, provided is a pattern or a film, which is a light-shielding layer of an organic light-emitting display device and has excellent resolution while implementing both light-shielding properties and low reflection properties, an organic light-emitting display device comprising the light-shielding layer, and an electronic device comprising the organic light-emitting display device can be provided.

Description

Photosensitive composition and display device using the same

[0001] The present invention relates to a photosensitive composition and an organic light-emitting display device using the photosensitive composition.

[0002] Liquid crystal display devices (LCDs) and organic light-emitting display devices (OLEDs) are widely used in display devices. In particular, organic light-emitting display devices feature low power consumption, fast response speed, high color reproducibility, high brightness, and wide viewing angles.

[0003] Black photosensitive resin compositions are essential materials for the manufacture of display elements such as color filters, liquid crystal display materials, organic light-emitting diodes (EL), and display panel materials. For example, color filters such as color liquid crystal displays require a black matrix or light-shielding barrier at the boundary between red, green, and blue coloring layers to enhance display contrast and coloring effects, and these are primarily formed from a black photosensitive resin composition.

[0004] In particular, recent developments in OLED displays are geared toward higher brightness and higher color reproducibility. Attempts are being made to achieve these goals by reducing the reflectance of outdoor light. Consequently, efforts are ongoing to lower the reflectance of black matrices and light-shielding barriers. Furthermore, as resolutions increase (to 8k), the need for fine black matrix patterns is also increasing.

[0005] The main method being developed to reduce the reflectivity of displays is to apply AR (Anti Reflective) film and AG (Anti Glare) film, which are anti-reflection films of polarizing films.

[0006] However, this method has now reached its limits, and efforts are continuing to reduce reflectivity through other methods.

[0007] Meanwhile, after depositing an organic layer including a light-emitting layer in the organic light-emitting display device, a photopatterning process may be performed to form a sealing layer, a color filter, an insulating layer of a touch screen panel, etc. on the organic layer.

[0008] The post-heat treatment process in the above-mentioned photopatterning process is a process of applying heat to the pattern formed in the development process to finally harden it, and a low process temperature is required to prevent the organic layer from being damaged by heat.

[0009] Therefore, for photosensitive compositions that form sealing layers, color filters, and insulating layers of touch screen panels, the post-heat treatment process must be performed at a temperature of 100°C or lower. However, in the case of conventional photosensitive compositions, when the post-heat treatment process is performed at a temperature of 100°C or lower, there was a problem in that the stability of the patterns obtained after curing was low.

[0010] To overcome this, a photosensitive composition is required that not only enables sufficient photocuring during the exposure process during the photopatterning process, but also enables heat curing at low temperatures during the subsequent post-heat treatment process, thereby ensuring pattern stability.

[0011] In order to solve the problems of the above-mentioned prior art, the present invention provides a photosensitive composition that simultaneously implements light-blocking properties and low-reflection properties, while also having excellent adhesion and resolution.

[0012] In addition, one embodiment of the present invention is to provide a photosensitive composition having high resolution and stability, including a novel photosensitive resin capable of photocuring and low-temperature heat curing.

[0013] Another embodiment is to provide a pattern or film manufactured using the photosensitive composition.

[0014] Another embodiment is to provide an organic light-emitting display device including the above pattern or film.

[0015] Another embodiment is to provide an electronic device including the organic light-emitting display device.

[0016] The photosensitive composition according to the present invention,

[0017] (1) A copolymer resin comprising a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2);

[0018] (2) Reactive unsaturated compounds;

[0019] (3) Photoinitiator;

[0020] (4) hollow silica particles; and

[0021] (5) It is preferable to include a solvent.

[0022] Chemical formula (1) Chemical formula (2)

[0023]

[0024] In the above chemical formula (1) and chemical formula (2),

[0025] 1) * indicates the part where the combination is connected as a repeating unit,

[0026] 2) R 1 and R 2 are independently hydrogen or C1~C 20 is an alkyl group,

[0027] 3) L 1 and L 2 are independently a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene,

[0028] 4) a and b are integers from 0 to 500, independently of each other.

[0029] 5) X 1C2~C containing oxygen atoms 30 is a heterocycle,

[0030] 6) X 2 is the following chemical formula (2-1) or chemical formula (2-2),

[0031] Chemical Formula (2-1) Chemical Formula (2-2)

[0032]

[0033] In the above chemical formula (2-1) and chemical formula (2-2),

[0034] 6-1) * indicates the binding position,

[0035] 6-2) L 20 is a single bond or C1~C 30 is alkylene,

[0036] 6-3) R 4 is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0037] 6-4) n is an integer from 1 to 10,

[0038] 7) The above R 1 , R 2 , R 4 , X 1 , X 2 , L 1 , L 2 and L 20 are respectively deuterium; halogen; C1~C 30 Alkyl group or C6~C30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

[0039] In the repeating unit structure represented by the above chemical formula (1), X 1 It is preferable that the structure be one of the structures represented by the following chemical formulas (1-1) to (1-3).

[0040] Chemical Formula (1-1) Chemical Formula (1-2) Chemical Formula (1-3)

[0041]

[0042] It is preferable that the above copolymer resin further includes at least one of a repeating unit represented by chemical formula (3) and a repeating unit represented by chemical formula (4).

[0043] Chemical formula (3) Chemical formula (4)

[0044]

[0045] In the above chemical formula (3) and chemical formula (4),

[0046] 1) R5 and R 6 are independently hydrogen or C1~C 20 is an alkyl group,

[0047] 2) L 3 is a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene,

[0048] 3) Ar 1 Silver C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C3~C 30 Cycloalkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0049] 4) c and d are independent integers from 1 to 500.

[0050] In the repeating unit structure represented by the above chemical formula (3), Ar 1 Silver C3~C 30 Cycloalkyl group or C6~C 30 It is preferable that it is an aryl group.

[0051] In the repeating unit structure represented by the above chemical formula (3), Ar 1 It is preferable that the structure is represented by the following chemical formula (3-1) or chemical formula (3-2).

[0052] Chemical Formula (3-1) Chemical Formula (3-2)

[0053]

[0054] When the total repeating unit of the above copolymer resin is assumed to be 100 mol%, it is preferable that the repeating unit represented by chemical formula (1) is 5 to 20 mol%; the repeating unit represented by chemical formula (2) is 5 to 20 mol%; the repeating unit represented by chemical formula (3) is 20 to 50 mol%; and the repeating unit represented by chemical formula (4) is 20 to 50 mol%.

[0055] It is preferable that the weight average molecular weight of the above copolymer resin is 1,000 to 100,000 g / mol.

[0056] It is preferable that the total amount of the above copolymer resin is 3 to 70 wt% based on the total amount of the photosensitive resin composition.

[0057] The size of the above hollow silica particles is preferably 30 nm to 450 nm.

[0058] It is preferable that the hollow silica particles in the above photosensitive composition be included in an amount of 0.1% to 20% by weight based on the solid content excluding the solvent.

[0059] It is preferable that the refractive index of the above hollow silica particles be 1.10 to 1.41.

[0060] It is preferable that the porosity of the above hollow silica particles is 20 to 95 volume%.

[0061] It is preferable that the above hollow silica particles have a sphericity of 1.05 to 1.5.

[0062] The specific surface area of ​​the above hollow silica particles is 10 to 2000 m 2 / g is preferable.

[0063] It is preferable that the above alkali-soluble resin further includes a resin including a repeating unit represented by chemical formula (5) in addition to the copolymer resin of the first clause.

[0064] Chemical formula (5)

[0065]

[0066] In the above chemical formula (5),

[0067] 1) * indicates the part where the combination is connected as a repeating unit,

[0068] 2) R 7 and R 8 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0069] 3) R 7 and R 8 Each adjacent tile can form a ring,

[0070] 4) e and f are integers from 0 to 4, independently of each other.

[0071] 5) Y 1 is a single bond, O, CO, SO2, CR'R", SiR'R", chemical formula (A) or chemical formula (B),

[0072] 5-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0073] 5-2) R' and R" can each form adjacent tile rings,

[0074] Chemical formula (A)

[0075]

[0076] Chemical formula (B)

[0077]

[0078] In the above chemical formula (A) and chemical formula (B),

[0079] 5-3) * indicates the binding position,

[0080] 5-4) Y 3 is O, S, SO2 or NR',

[0081] 5-5) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0082] 5-6) R 9 ~R 12 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0083] 5-7) R 9 ~R 12 Each adjacent tile can form a ring,

[0084] 5-8) g~j are integers from 0 to 4, independently of each other,

[0085] 6) Y 2 is a fluorenyl group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0086] 7) A 1 and A 2 are independently of each other chemical formula (C) or chemical formula (D),

[0087] Chemical formula (C)

[0088]

[0089] Chemical formula (D)

[0090]

[0091] In the above chemical formula (C) and chemical formula (D),

[0092] 7-1) * indicates the binding position,

[0093] 7-2) R 13 ~R 16 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0094] 7-3) Z 1 and Z 2 are independently of each other chemical formula (E) or chemical formula (F),

[0095] Chemical formula (E)

[0096]

[0097] Chemical formula (F)

[0098]

[0099] 7-3-1) * indicates the bonding position,

[0100] 7-3-2) R 17 ~R 21 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0101] 7-3-3) L 4 ~L 6 are independently a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene,

[0102] 7-3-4) k and l are independent integers from 0 to 3; provided that k+l= 3,

[0103] 8) In a resin containing a repeating unit represented by chemical formula (5), the ratio of chemical formula (C) and chemical formula (D) is 1:9 to 9:1,

[0104] 9) The above R 7 ~R 21 , R', R", Y 1 ~Y 3 and L 4 ~L 6 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

[0105] It is preferable that the weight average molecular weight of the resin including the repeating unit represented by the above chemical formula (5) is 1,000 to 100,000 g / mol.

[0106] Among the above alkali-soluble resins, the weight ratio of the copolymer resin and the resin containing the repeating unit represented by the above chemical formula (5) is preferably 7:3 to 3:7.

[0107] It is preferable that the above reactive unsaturated compound is included in an amount of 1 to 50 wt% based on the total amount of the photosensitive composition.

[0108] It is preferable that the photoinitiator is included in an amount of 0.01 to 10 wt% based on the total amount of the photosensitive composition.

[0109] It is preferable that the above photosensitive composition additionally contains a coloring agent.

[0110] It is preferable that the above coloring agent includes at least one of an inorganic pigment and an organic pigment.

[0111] It is preferable that the above colorant is included in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

[0112] It is preferable that the above colorant be pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0113] It is preferable that the average particle diameter of the above colorant is 5 nm to 200 nm.

[0114] As another specific example, the present invention provides a pattern or film formed from the photosensitive composition.

[0115] As another specific example, the present invention provides an organic light-emitting display device including the pattern or film.

[0116] It is preferable that at least one of the flat layer, organic light-emitting element layer, sealing layer, touch panel, and color filter of the organic light-emitting display device includes the pattern or film.

[0117] As another specific example, the present invention provides an electronic device including the display device and a control unit for driving the display device.

[0118] The photosensitive composition of the present invention comprises hollow silica particles and a resin comprising repeating units represented by chemical formulae (1) and (2), and thus enables low-temperature curing (100°C or less), thereby preventing damage to the organic element layer due to heat during the process. Therefore, it is possible to provide a pattern or film as a light-shielding layer of an organic light-emitting display device that simultaneously implements light-shielding characteristics and low-reflection characteristics while also having excellent resolution, an organic light-emitting display device including the light-shielding layer, and an electronic device including the organic light-emitting display device.

[0119] Figure 1 conceptually illustrates a display device for implementing the present invention.

[0120] Figures 2 and 3 are representative illustrations of chemical formula (1) and chemical formula (2) according to the present invention.

[0121] The photosensitive composition according to the present invention,

[0122] (1) A copolymer resin comprising a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2);

[0123] (2) Reactive unsaturated compounds;

[0124] (3) Photoinitiator;

[0125] (4) hollow silica particles; and

[0126] (5) It is preferable to include a solvent.

[0127] Chemical formula (1) Chemical formula (2)

[0128]

[0129] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When assigning reference numerals to components in each drawing, identical components may be assigned the same numerals, as much as possible, even if they are shown in different drawings.

[0130] When describing the present invention, detailed descriptions of related known components or functions may be omitted if they are deemed to obscure the gist of the present invention. When "includes," "has," and "consists of" are used in this specification, other parts may be added, unless "only" is used. When a component is expressed in the singular, it may also include plurals, unless otherwise explicitly stated.

[0131] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of the present invention. These terms are only intended to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0132] In a description of the positional relationship of components, when it is described that two or more components are "connected," "combined," or "connected," it should be understood that the two or more components may be directly "connected," "combined," or "connected," but that the two or more components may also be further "interposed" with another component to be "connected," "combined," or "connected." Here, the other component may be included in one or more of the two or more components that are "connected," "combined," or "connected" to each other.

[0133] Furthermore, when a component such as a layer, membrane, region, or plate is said to be "on" or "over" another component, it should be understood that this includes not only the case where it is "directly on" the other component, but also the case where there are other components in between. Conversely, when a component is said to be "directly on" another part, it should be understood that there are no other components in between.

[0134] In the description of the temporal flow relationship related to components, operation methods, or manufacturing methods, for example, when the temporal or flow relationship is described as “after”, “following”, “next to”, “before”, etc., it may also include cases where it is not continuous, unless “immediately” or “directly” is used.

[0135] Meanwhile, when numerical values ​​or corresponding information for components are mentioned, even without separate explicit description, the numerical values ​​or corresponding information may be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impact, noise, etc.).

[0136] The terms used in this specification and the appended claims have the following meanings, unless otherwise stated, without departing from the spirit of the present invention.

[0137] The term “halo” or “halogen” as used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I) unless otherwise stated.

[0138] The term "alkyl" or "alkyl group" as used in this application, unless otherwise stated, means a radical of a saturated aliphatic functional group having 1 to 60 carbon atoms connected by a single bond, including a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0139] The term “haloalkyl group” or “halogenalkyl group” as used in this application means an alkyl group substituted with a halogen, unless otherwise stated.

[0140] The term "alkenyl" or "alkynyl" as used in this application, unless otherwise stated, refers to a group having a double bond or a triple bond, including a straight or branched chain group, and having 2 to 60 carbon atoms, but is not limited thereto.

[0141] The term "cycloalkyl" as used in this application, unless otherwise stated, means, but is not limited to, an alkyl group forming a ring having 3 to 60 carbon atoms.

[0142] The term “alkoxy group” or “alkyloxy group” used in this application means an alkyl group to which an oxygen radical is bonded, and unless otherwise stated, has 1 to 60 carbon atoms, but is not limited thereto.

[0143] The term “alkenoxyl group,” “alkenoxy group,” “alkenyloxy group,” or “alkenyloxy group” as used in this application means an alkenyl group having an oxygen radical attached thereto, and unless otherwise stated, has from 2 to 60 carbon atoms, but is not limited thereto.

[0144] The terms "aryl group" and "arylene group" used in this application, unless otherwise stated, each have 6 to 60 carbon atoms, but are not limited thereto. The aryl group or arylene group in this application includes a single ring, a ring aggregate, a fused multiple ring compound, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, a substituted fluorenyl group, and the arylene group may include a fluorenylene group, a substituted fluorenylene group.

[0145] The term "ring assemblies" as used herein means two or more ring systems (single ring or fused ring systems) directly connected to each other via single or double bonds, wherein the number of such direct links between rings is one less than the total number of ring systems in the compound. Ring assemblies may be formed by the same or different ring systems being directly connected to each other via single or double bonds.

[0146] In the present application, since the aryl group includes a ring aggregate, the aryl group includes biphenyl and terphenyl in which a single aromatic ring, a benzene ring, is connected by a single bond. In addition, the aryl group also includes a compound in which an aromatic single ring and an aromatic ring system fused together are connected by a single bond, and thus, for example, the aryl group also includes a compound in which an aromatic single ring, a benzene ring, and an aromatic ring system fused together, a fluorene ring, are connected by a single bond.

[0147] The term "fused multiple ring system" as used in this application means a fused ring structure sharing at least two atoms, and includes a structure in which two or more hydrocarbon ring systems are fused, and a structure in which at least one heterocyclic system containing at least one heteroatom is fused, etc. Such fused multiple ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or a combination of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0148] The term "spiro compound" used in this application has a "spiro union," which means a connection formed by two rings sharing only one atom. In this case, the atom shared between the two rings is called a "spiro atom," and depending on the number of spiro atoms contained in a compound, these are called "monospiro-," "dicepiro-," and "trispiro-" compounds, respectively.

[0149] As used herein, the terms "fluorenyl group", "fluorenylene group", and "fluorenetriyl group" mean, unless otherwise stated, a monovalent, divalent, or trivalent functional group in which R, R', R", and R'" in the following structures are all hydrogen, and a "substituted fluorenyl group", a "substituted fluorenylene group", or a "substituted fluorenetriyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, and includes a case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In the present specification, regardless of the valence such as monovalent, divalent, or trivalent, a fluorenyl group, a fluorenylene group, and a fluorenetriyl group may all be referred to as a fluorene group.

[0150]

[0151] In addition, the R, R', R" and R'" can each independently be an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms, for example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclic group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be a monovalent functional group or a divalent functional group of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0152] The term "heterocyclic group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group" but also non-aromatic rings, and unless otherwise stated means a ring having 2 to 60 carbon atoms each containing one or more heteroatoms, but is not limited thereto. The term "heteroatom" used in this application represents N, O, S, P or Si unless otherwise stated, and the heterocyclic group means a monocyclic ring, ring aggregate, fused multiple ring system, spiro compound, etc. containing a heteroatom.

[0153] For example, “heterocyclic group” may also include compounds that contain heteroatom groups such as SO2, P=O, etc. instead of ring-forming carbon, such as the compounds below.

[0154]

[0155] The term "ring" as used in this application includes monocyclic and polycyclic rings, and includes hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and includes aromatic and non-aromatic rings.

[0156] The term "polycyclic" as used in this application includes ring assemblies such as biphenyls, terphenyls, etc., fused multiple ring systems and spiro compounds, including aromatic as well as non-aromatic, and including hydrocarbon rings as well as heterocycles containing at least one heteroatom.

[0157] The term "aliphatic ring" used in this application refers to a cyclic hydrocarbon other than an aromatic hydrocarbon, and includes a single ring, a ring aggregate, a fused multiple ring system, a spiro compound, etc., and unless otherwise specified, refers to a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, even if an aromatic ring, benzene, and a non-aromatic ring, cyclohexane, are fused, it is considered an aliphatic ring.

[0158] Also, when prefixes are named consecutively, it means that the substituents are listed in the order they were first written. For example, in the case of an arylalkoxy group, it means an alkoxy group substituted with an aryl group, in the case of an alkoxycarbonyl group, it means a carbonyl group substituted with an alkoxy group, and in the case of an arylcarbonylalkenyl group, it means an alkenyl group substituted with an arylcarbonyl group, where the arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0159] Also, unless explicitly stated otherwise, the term "substituted" in the term "substituted or unsubstituted" used in this application means deuterium, halogen, amino group, nitrile group, nitro group, C1~C 30 Alkyl group of C1~C 30 Alkoxy group, C1~C 30 Alkylamine group of C1~C 30 Alkylthiophene group, C6~C 30 Arylthiophene group, C2~C 30 Alkenyl group, C2~C 30 Alkyne group, C3~C 30 Cycloalkyl group, C6~C 30 Aryl group of C6~C substituted with deuterium 30 Aryl group of C8~C30 C2~C containing at least one heteroatom selected from the group consisting of arylalkenyl group, silane group, boron group, germanium group, and O, N, S, Si and P 30 It means that it is substituted with one or more substituents selected from the group consisting of heterocyclic groups, but is not limited to these substituents.

[0160] In this application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclic group, etc., which are exemplified as examples of each symbol and its substituent, may be described as the 'name of the functional group reflecting the valence', but may also be described as the 'name of the parent compound'. For example, in the case of 'phenanthrene', which is a type of aryl group, the name of the group may be described by distinguishing the valence, such as 'phenanthryl (group)' for the monovalent 'group' and 'phenantrylene (group)' for the divalent group, but the name of the parent compound, 'phenanthrene', may also be described regardless of the valence.

[0161] Similarly, in the case of pyrimidine, regardless of the valence, it can be written as 'pyrimidine', or in the case of monovalent, it can be written as pyrimidinyl (group), in the case of divalent, it can be written as the 'group name' of the corresponding valence, such as pyrimidinylene (group). Accordingly, in the present application, when the type of substituent is written as the name of the parent compound, it can mean an n-valent 'group' formed by the elimination of a hydrogen atom bonded to a carbon atom and / or heteroatom of the parent compound.

[0162] In addition, in this specification, numbers or alphabets indicating positions may be omitted when describing compound names or substituent names. For example, pyrido[4,3-d]pyrimidine may be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine as benzofuropyrimidine, 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Accordingly, both benzo[g]quinoxaline and benzo[f]quinoxaline may be described as benzoquinoxaline.

[0163] Additionally, unless explicitly stated otherwise, the chemical formulas used in this application are applied in the same manner as the substituent definitions by the index definitions of the chemical formulas below.

[0164]

[0165] Here, if a is an integer of 0, the substituent R 1 means that it is absent, that is, when a is 0, it means that all the carbons forming the benzene ring are bonded with hydrogen, and in this case, the indication of hydrogen bonded to carbon can be omitted and the chemical formula or compound can be described. In addition, when a is an integer of 1, one substituent R 1 It binds to one of the carbons forming the benzene ring, and when a is an integer of 2 or 3, it can bind as follows, for example, and when a is an integer of 4 to 6, it binds to the carbon of the benzene ring in a similar manner, and when a is an integer of 2 or more, R 1 may be the same or different.

[0166]

[0167] Unless otherwise stated in this application, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused multiple ring, and the single ring and the formed fused multiple ring include a hydrocarbon ring as well as a heterocycle containing at least one heteroatom, and may include aromatic and non-aromatic rings.

[0168] Additionally, unless otherwise stated herein, when indicating a condensed ring, the number in the expression "number-condensed ring" indicates the number of condensed rings. For example, a form in which three rings are condensed together, such as anthracene, phenanthrene, and benzoquinazoline, can be expressed as a 3-condensed ring.

[0169] Meanwhile, the term "bridged bicyclic compound" used in this application, unless otherwise specified, refers to a compound in which two rings share three or more atoms to form a ring. The shared atoms may include carbon or heteroatoms.

[0170] In the present application, the organic electric element may mean a component(s) between an anode and a cathode, or may mean an organic light-emitting diode including an anode and a cathode and a component(s) positioned therebetween.

[0171] In addition, in some cases, the display device in the present application may mean an organic electric element, an organic light-emitting diode, and a panel including the same, or may mean an electronic device including a panel and a circuit. Here, for example, the electronic device may include a lighting device, a solar cell, a portable or mobile terminal (e.g., a smart phone, a tablet, a PDA, an electronic dictionary, a PMP, etc.), a navigation terminal, a game machine, various TVs, various computer monitors, etc., and is not limited thereto, and may be any form of device as long as it includes the above-mentioned component(s).

[0172] Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention, which is defined solely by the scope of the claims set forth below.

[0173] A photosensitive composition for forming a light-blocking layer of an organic light-emitting display device according to one embodiment of the present invention comprises an alkali-soluble resin, a reactive unsaturated compound, a photoinitiator, hollow silica particles, and a solvent. In addition to the above components, a colorant may be additionally included.

[0174] Each component is described in detail below.

[0175] (1) Alkali-soluble resin

[0176] A photosensitive resin composition according to one embodiment of the present invention comprises a copolymer resin including a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2) as an alkali-soluble resin.

[0177] Chemical formula (1) Chemical formula (2)

[0178]

[0179] In the above chemical formula (1) and chemical formula (2),

[0180] 1) * indicates the part where the combination is connected as a repeating unit,

[0181] 2) R 1 and R 2 are independently hydrogen or C1~C 20 is an alkyl group,

[0182] 3) L 1 and L 2 are independently a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene,

[0183] 4) a and b are integers from 0 to 500, independently of each other.

[0184] 5) X 1 C2~C containing oxygen atoms 30 is a heterocycle,

[0185] 6) X 2 is the following chemical formula (2-1) or chemical formula (2-2),

[0186] Chemical Formula (2-1) Chemical Formula (2-2)

[0187]

[0188] In the above chemical formula (2-1) and chemical formula (2-2),

[0189] 6-1) * indicates the binding position,

[0190] 6-2) L 20 is a single bond or C1~C 30 is alkylene,

[0191] 6-3) R 4 is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0192] 6-4) n is an integer from 1 to 10,

[0193] 7) The above R 1 , R 2 , R 4 , X 1 , X 2 , L 1 , L 2 and L 20 are respectively deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

[0194] The above R 4 If it is an aryl group, preferably C6~C 30 Aryl group of, more preferably C6~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0195] Above X 1 , R 4 and L 1 ~L 2 In this case, it is preferably C2~C 30 A heterocyclic group, more preferably C2~C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0196] The above R 4 When it is a fluorenyl group, it may preferably be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, etc.

[0197] Above L 1 ~L 2 If it is an arylene group, preferably C6~C 30 Arylene group, more preferably C6~C 18 It may be an arylene group, such as phenyl, biphenyl, naphthyl, terphenyl, etc.

[0198] The above R 1 ~R 2 and R 4If it is an alkyl group, preferably C1~C 10 It can be an alkyl group, for example, methyl, t-butyl, etc.

[0199] The above R 4 If it is an alkoxyl group, preferably C1~C 20 Alkoxyl group of, more preferably C1~C 10 It may be an alkoxyl group, such as methoxy, t-butoxy, etc.

[0200] The above R 1 , R 2 , R 4 , X 1 , X 2 , L 1 , L 2 and L 20 The ring formed by the bonding of adjacent groups is C6~C 60 Aromatic ring group; Fluorenyl group; C2~C containing at least one heteroatom among O, N, S, Si and P 60 Heterocyclic group of; or C3~C 60 It may be an aliphatic ring group, for example, when adjacent groups are bonded to each other to form an aromatic ring, preferably C6~C 20 An aromatic ring, more preferably C6~C 14 It can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0201] Among the repeating unit structures represented by the above chemical formula (1), X 1 It is preferable that the structure includes an epoxide or oxetane moiety, and it is preferably one of the structures represented by the following chemical formulas (1-1) to (1-3).

[0202] Chemical Formula (1-1) Chemical Formula (1-2) Chemical Formula (1-3)

[0203]

[0204] Among the repeating unit structures represented by the above chemical formula (1), X1 When the structure is one of the chemical formulas (1-1) to (1-3), cross-linking is formed between the resins during the post-heat treatment process during the photopatterning process, thereby increasing the stability of the pattern and improving the developability and resolution.

[0205] In the repeating unit structure represented by the above chemical formula (1) and the repeating unit structure represented by the chemical formula (2), R 1 and R 2 It is preferred that they are independently hydrogen or methyl, with methyl being most preferred.

[0206] The above copolymer resin may further include a repeating unit represented by chemical formula (3) and a repeating unit represented by chemical formula (4) in addition to the repeating unit represented by chemical formula (1) and the repeating unit represented by chemical formula (2).

[0207] Chemical formula (3) Chemical formula (4)

[0208]

[0209] In the above chemical formula (3) and chemical formula (4),

[0210] 1) R 5 and R 6 are independently hydrogen or C1~C 20 is an alkyl group,

[0211] 2) L 3 is a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene,

[0212] 3) Ar 1 Silver C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20Alkyl group of; C3~C 30 Cycloalkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0213] 4) c and d are independent integers from 1 to 500.

[0214] Among the repeating unit structures represented by the above chemical formula (3), Ar 1 Silver C6~C 30 Cycloalkyl group or C6~C 30 It is preferable that it is an aryl group, more preferably a structure represented by chemical formula (3-1) or chemical formula (3-2), and most preferably a structure represented by chemical formula (3-1).

[0215] Chemical Formula (3-1) Chemical Formula (3-2)

[0216]

[0217] The above Ar 1 When the structure is represented by this chemical formula (3-1) or chemical formula (3-2), the Tg of the copolymer resin has a value suitable for use as a composition for forming a color filter, pixel separation part, and flat layer of an organic light-emitting display device and an insulating film of a touch panel.

[0218] In particular, Ar 1 In the case of a structure represented by this chemical formula (3-1), it is unstable as a leaving group, so the bond between the ester moiety and the cyclohexyl moiety among the repeating units represented by chemical formula (3) is stable and not easily broken.

[0219] In the repeating unit structure represented by the above chemical formula (3) and the repeating unit structure represented by the chemical formula (4), R 5 and R 6It is preferred that it is hydrogen or methyl independently of each other, and methyl is most preferred.

[0220] When the above copolymer resin includes all of the repeating units represented by chemical formulas (1) to (4), when assuming that the total repeating units of the copolymer resin are 100 mol%, it is preferable that the repeating unit represented by chemical formula (1) is 5 to 20 mol%; the repeating unit represented by chemical formula (2) is 5 to 20 mol%; the repeating unit represented by chemical formula (3) is 20 to 50 mol%; and the repeating unit represented by chemical formula (4) is 20 to 50 mol%.

[0221] When a photopatterning process is performed using a photosensitive resin composition including a copolymer resin in which repeating units represented by the above chemical formulas (1) to (4) are included in the above ratios, sufficient photocuring is performed in the exposure process, so that a high-resolution primary pattern is formed without residue or pattern tearing in the development process, and even if the post-heat treatment process is performed at 100°C or lower, thermal curing of the primary pattern is performed, so that a final pattern with high stability and improved resolution can be obtained.

[0222] The weight average molecular weight of the copolymer resin may be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the copolymer resin is within the above range, a pattern is formed well without residue during the manufacture of a pattern layer, and there is no loss of film thickness during development, and a good pattern can be obtained.

[0223] The total amount of the above copolymer resin may be comprised in an amount of 3 to 70 wt%, more preferably 10 to 40 wt%, based on the total amount of the photosensitive resin composition. When the above copolymer resin is comprised within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0224] A photosensitive resin composition according to one embodiment of the present invention may further include a copolymer resin as a first alkali-soluble resin, and a resin including a repeating unit represented by the following chemical formula (5) as a second alkali-soluble resin.

[0225] Chemical formula (5)

[0226]

[0227] In the above chemical formula (5),

[0228] 1) * indicates the part where the combination is connected as a repeating unit,

[0229] 2) R 7 and R 8 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0230] 3) R 7 and R 8 Each adjacent tile can form a ring,

[0231] 4) e and f are integers from 0 to 4, independently of each other.

[0232] 5) Y 1 is a single bond, O, CO, SO2, CR'R", SiR'R", chemical formula (A) or chemical formula (B),

[0233] 5-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0234] 5-2) R' and R" can each form adjacent tile rings,

[0235] Examples of R' or R" combining to form a ring include:

[0236]

[0237]

[0238] Chemical formula (A)

[0239]

[0240] Chemical formula (B)

[0241]

[0242] In the above chemical formula (A) and chemical formula (B),

[0243] 5-3) * indicates the binding position,

[0244] 5-4) Y 3 is O, S, SO2 or NR',

[0245] 5-5) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0246] 5-6) R 9 ~R 12 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0247] 5-7) R 9 ~R 12 Each adjacent tile can form a ring,

[0248] 5-8) g~j are integers from 0 to 4, independently of each other,

[0249] 6) Y 2 is a fluorenyl group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0250] 7) A 1 and A 2 are independently of each other chemical formula (C) or chemical formula (D),

[0251] Chemical formula (C)

[0252]

[0253] Chemical formula (D)

[0254]

[0255] In the above chemical formula (C) and chemical formula (D),

[0256] 7-1) * indicates the binding position,

[0257] 7-2) R 13 ~R 16 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0258] 7-3) Z 1 and Z 2 are independently of each other chemical formula (E) or chemical formula (F),

[0259] Chemical formula (E)

[0260]

[0261] Chemical formula (F)

[0262]

[0263] 7-3-1) * indicates the bonding position,

[0264] 7-3-2) R 17 ~R 21 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0265] 7-3-3) L 4 ~L 6 are independently a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene,

[0266] 7-3-4) k and l are independent integers from 0 to 3; provided that k+l= 3,

[0267] 8) The above R 7 ~R 21 , R', R”, Y 1 ~Y 3 and L 4 ~L 6 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

[0268] The weight average molecular weight of the resin including the repeating unit represented by the above chemical formula (5) may be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the second binder resin is within the above range, the pattern is formed well without residue during the manufacture of the pattern layer, there is no loss of film thickness during development, and a good pattern can be obtained.

[0269] When the main chain of the resin including the repeating unit represented by the above chemical formula (5) contains the structure represented by the chemical formula (C) and the structure represented by the chemical formula (D) in a ratio of 1:9 to 9:1, it has a relatively network structure compared to a resin including only one of the structures represented by the chemical formula (C) and the structure represented by the chemical formula (D), and due to its structural characteristics, it effectively forms intermolecular bonds with surrounding compounds, thereby improving the resolution of the pattern and reducing the amount of outgas generated.

[0270] The ratio of chemical formula (E) and chemical formula (F) within the polymer chain of the resin represented by the above chemical formula (5) is preferably 2:0 to 1:1, and most preferably 1.5:0.5. If the ratio of chemical formula (F) is higher than that of chemical formula (E), residue may be generated due to excessively high adhesion, and the amount of outgassing may also increase significantly. When the ratio of chemical formula (E) and chemical formula (F) is 1.5:0.5, the pattern resolution is the best and the amount of outgassing is also satisfactory.

[0271] When the photosensitive resin composition includes a first alkali-soluble resin and a second alkali-soluble resin, the total amount of the first alkali-soluble resin and the second alkali-soluble resin may be included in an amount of 3 to 70 wt%, more preferably 10 to 40 wt%, based on the total amount of the photosensitive composition. When the resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0272] In addition, it is preferable that the weight ratio of the first alkali-soluble resin and the second alkali-soluble resin in the photosensitive resin composition is 7:3 to 3:7. When the two types of resins are included in the above ratio, the photosensitive composition undergoes thermal curing at a low temperature, and outgassing is reduced, showing a tendency for the accuracy and stability of the pattern to be improved.

[0273] The photosensitive resin composition of the present invention may further include an acrylic resin in addition to the first alkaline-soluble resin and the second alkaline-soluble resin. The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units. The acrylic resin may be a copolymer of ethylenically unsaturated monomers including 2 to 10 kinds of acrylates and / or methacrylates, and may have a weight average molecular weight of 5,000 to 30,000 g / mol.

[0274] (2) Reactive unsaturated compounds

[0275] A photosensitive composition for forming a light-blocking layer of an organic light-emitting display device according to one embodiment of the present invention comprises a reactive unsaturated compound capable of being crosslinked by radicals in an exposure step.

[0276] The above reactive unsaturated compound has an ethylenically unsaturated double bond, and thus can sufficiently polymerize upon exposure to light in a pattern forming process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0277] Specific examples of the above reactive unsaturated compounds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxyacrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0278] Examples of commercially available products of the above reactive unsaturated compounds are as follows.

[0279] Examples of the bifunctional ester of the above (meth)acrylic acid include Aronix M-210, M-240, M-6200, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nihon Kayaku Industry Co., Ltd.; and V-260, V-312, V-335 HP, etc. from Osaka Yuki Chemical Industry Co., Ltd.

[0280] Examples of the trifunctional ester of the above (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nihon Kayaku Industry Co., Ltd.; and V-295, V-300, V-360, etc. from Osaka Yuki Kayaku Industry Co., Ltd.

[0281] The above products can be used alone or in combination of two or more.

[0282] The above reactive unsaturated compound may be used after being treated with an acid anhydride to provide better developability. The reactive unsaturated compound may be included in an amount of 1 to 50 wt%, for example, 5 to 30 wt%, based on the total amount of the photosensitive resin composition. When the reactive unsaturated compound is included within the above range, sufficient curing occurs upon exposure in the pattern formation process, resulting in excellent reliability. The pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion.

[0283] (3) Photoinitiator

[0284] A photosensitive composition for forming a light-blocking layer of an organic light-emitting display device according to one embodiment of the present invention may include the following photoinitiator, and an oxime ester compound may be used alone or in combination of two or more types as the photoinitiator.

[0285] The photoinitiator that can be used in combination with the above oxime ester compound is a photoinitiator used in a photosensitive resin composition, and examples thereof include acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, and triazine compounds.

[0286] Examples of the above oxime ester compounds include 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione2-oxime-O-benzoate, Examples thereof include 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butane-1-one oxime-O-acetate, 1-(4-methylsulfanyl-phenyl)-butane-1-one oxime-O-acetate, hydroxyimino-(4-methylsulfanyl-phenyl)-acetic acid ethyl ester-O-acetate, and hydroxyimino-(4-methylsulfanyl-phenyl)-acetic acid ethyl ester-O-benzoate.

[0287] Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0288] Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0289] Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

[0290] Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, etc.

[0291] Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-s(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, and 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine.

[0292] In addition to the above compound, the above photoinitiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

[0293] The above photoinitiator may be a radical polymerization initiator, such as a peroxide-based compound or an azobis-based compound.

[0294] Examples of the above peroxide compounds include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; Examples thereof include dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and t-butylperoxyvaleric acid n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytrimethyl adipate; and percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyarylcarbonate.

[0295] Examples of the above azobis compounds include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2, -azobis(methylisobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleic acid).

[0296] The above photoinitiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0297] The photoinitiator may be included in an amount of 0.01 to 10 wt%, for example, 0.1 to 5 wt%, based on the total amount of the photosensitive composition. When the photoinitiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, thereby obtaining excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

[0298] (4) Colorant

[0299] The photosensitive resin composition according to one embodiment of the present invention may contain various pigments and dyes, such as pigments, independently or together, to color the pattern, and both organic pigments and inorganic pigments may be used as the pigments.

[0300] The above pigments include red pigment, green pigment, blue pigment, yellow pigment, black pigment, etc.

[0301] The above pigments may be used alone or in combination of two or more, and are not limited to these examples.

[0302] Examples of the above red pigments include CI Red Pigment 254, CI Red Pigment 255, CI Red Pigment 264, CI Red Pigment 270, CI Red Pigment 272, CI Red Pigment 177, CI Red Pigment 89, etc.

[0303] Examples of the above green pigments include halogen-substituted copper phthalocyanine pigments such as CI Green Pigment 36, CI Green Pigment 7, etc.

[0304] Examples of the above blue pigments include copper phthalocyanine pigments such as CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, CI blue pigment 16, etc.

[0305] Examples of the above yellow pigments include isoindoline pigments such as CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, and nickel complex pigments such as CI Yellow Pigment 150.

[0306] Examples of the above black pigments include benzofuranone black, lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0307] A dispersant may be used together with the photosensitive resin composition to disperse the pigment. Specifically, the pigment may be surface-treated with the dispersant in advance and used, or the dispersant may be added together with the pigment during the preparation of the photosensitive resin composition. The dispersant may be a nonionic dispersant, anionic dispersant, cationic dispersant, or the like.

[0308] Specific examples of the above dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxide adducts, alkyl amines, etc., and these may be used alone or in combination of two or more.

[0309] Examples of commercially available products of the above dispersant include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450 from BASF; Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or Ajinomoto's PB711, PB821, etc.

[0310] The dispersant may be included in an amount of 0.1 to 15 wt% based on the total amount of the photosensitive resin composition. When the dispersant is included within the above range, the dispersibility of the photosensitive resin composition is excellent, and thus, stability, developability, and patternability are excellent when producing a light-shielding layer.

[0311] The above pigment may also be used after being pretreated with a water-soluble inorganic salt and a wetting agent. When the pigment is used after being pretreated as described above, the primary particle size of the pigment can be refined. The pretreatment may be performed through a step of kneading the pigment with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained in the kneading step. The kneading may be performed at a temperature of 40°C to 100°C, and the filtration and washing may be performed by washing the inorganic salt with water or the like, followed by filtration.

[0312] Examples of the above water-soluble inorganic salts include, but are not limited to, sodium chloride and potassium chloride.

[0313] The above wetting agent acts as a medium that allows the pigment and the water-soluble inorganic salt to be uniformly mixed and the pigment to be easily pulverized, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol, and these may be used alone or in combination of two or more.

[0314] The pigment that has undergone the above-described kneading step may have an average particle diameter of 20 nm to 110 nm. When the average particle diameter of the pigment is within the above range, it can effectively form fine patterns while exhibiting excellent heat and light resistance.

[0315] Meanwhile, specific examples of the dyes include CI solvent dyes, yellow dyes such as CI solvent yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162, 163; red dyes such as CI solvent red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, 179; orange dyes such as CI solvent orange 2, 7, 11, 15, 26, 41, 45, 56, 62; Examples include blue dyes such as CI Solvent Blue 5, 35, 36, 37, 44, 59, 67, and 70; violet dyes such as CI Solvent Violet 8, 9, 13, 14, 36, 37, 47, and 49; and green dyes such as CI Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, and 35.

[0316] Among them, CI solvent dyes having excellent solubility in organic solvents, CI solvent yellow 14, 16, 21, 56, 151, 79, 93; CI solvent red 8, 49, 89, 111, 122, 132, 146, 179; CI solvent orange 41, 45, 62; CI solvent blue 35, 36, 44, 45, 70; and CI solvent violet 13 are preferable. In particular, CI solvent yellow 21, 79; CI solvent red 8, 122, 132; and CI solvent orange 45, 62 are more preferable.

[0317] Also, as CI acid dyes, CI Acid Yellow 1, 3, 7, 9, 11, 17, 23, 25, 29, 34, 36, 38, 40, 42, 54, 65, 72, 73, 76, 79, 98, 99, 111, 112, 113, 114, 116, 119, 123, 128, 134, 135, 138, 139, 140, 144, 150, 155, 157, 160, 161, 163, 168, 169, 172, 177, 178, 179, 184, 190, 193, Yellow dyes such as 196, 197, 199, 202, 203, 204, 205, 207, 212, 214, 220, 221, 228, 230, 232, 235, 238, 240, 242, 243, 251; CI Acid Red 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 80, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 133, 134, 138, 143, 145, 150, 151, 158, 176, 182, 183, 198, 206, 211, 215, 216, 217, 227, 228, 249, 252, 257, Red dyes such as 258, 260, 261, 266, 268, 270, 274, 277, 280, 281, 195, 308, 312, 315, 316, 339, 341, 345, 346, 349, 382, ​​383, 394, 401, 412, 417, 418, 422, 426; Orange dyes such as CI Acid Orange 6, 7, 8, 10, 12, 26, 50, 51, 52, 56, 62, 63, 64, 74, 75, 94, 95, 107, 108, 169, 173; CIBlue dyes such as Acid Blue 1, 7, 9, 15, 18, 23, 25, 27, 29, 40, 42, 45, 51, 62, 70, 74, 80, 83, 86, 87, 90, 92, 96, 103, 112, 113, 120, 129, 138, 147, 150, 158, 171, 182, 192, 210, 242, 243, 256, 259, 267, 278, 280, 285, 290, 296, 315, 324:1, 335, 340; There are purple dyes such as CI Acid Violet 6B, 7, 9, 17, 19, 66, etc.; green dyes such as CI Acid Green 1, 3, 5, 9, 16, 25, 27, 50, 58, 63, 65, 80, 104, 105, 106, 109, etc.

[0318] Among the above acid dyes, CI Acid Yellow 42; CI Acid Red 92; CI Acid Blue 80, 90; CI Acid Violet 66; and CI Acid Green 27, which have excellent solubility in organic solvents, are preferred.

[0319] Also, as CI Direct dyes, yellow dyes such as CI Direct Yellow 2, 33, 34, 35, 38, 39, 43, 47, 50, 54, 58, 68, 69, 70, 71, 86, 93, 94, 95, 98, 102, 108, 109, 129, 136, 138, 141, etc.; Red dyes such as CI Direct Red 79, 82, 83, 84, 91, 92, 96, 97, 98, 99, 105, 106, 107, 172, 173, 176, 177, 179, 181, 182, 184, 204, 207, 211, 213, 218, 220, 221, 222, 232, 233, 234, 241, 243, 246, 250; Orange dyes such as CI Direct Orange 34, 39, 41, 46, 50, 52, 56, 57, 61, 64, 65, 68, 70, 96, 97, 106, 107; CI Direct Blue 38, 44, 57, 70, 77, 80, 81, 84, 85, 86, 90, 93, 94, 95, 97, 98, 99, 100, 101, 106, 107, 108, 109, 113, 114, 115, 117, 119, 137, 149, 150, 153, 155, 156, 158, 159, 160, 161, 162, 163, 164, 166, 167, 170, 171, 172, 173, 188, 189, 190, Blue dyes such as 192, 193, 194, 196, 198, 199, 200, 207, 209, 210, 212, 213, 214, 222, 228, 229, 237, 238, 242, 243, 244, 245, 247, 248, 250, 251, 252, 256, 257, 259, 260, 268, 274, 275, 293; Violet dyes such as CI Direct Violet 47, 52, 54, 59, 60, 65, 66, 79, 80, 81, 82, 84, 89, 90, 93, 95, 96, 103, 104; CIExamples include green dyes such as Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, and 82.

[0320] Also, yellow dyes such as CI Modanto Yellow 5, 8, 10, 16, 20, 26, 30, 31, 33, 42, 43, 45, 56, 61, 62, 65 as CI Modanto dyes; red dyes such as CI Modanto Red 1, 2, 3, 4, 9, 11, 12, 14, 17, 18, 19, 22, 23, 24, 25, 26, 30, 32, 33, 36, 37, 38, 39, 41, 43, 45, 46, 48, 53, 56, 63, 71, 74, 85, 86, 88, 90, 94, 95; Orange dyes such as CI Modanto Orange 3, 4, 5, 8, 12, 13, 14, 20, 21, 23, 24, 28, 29, 32, 34, 35, 36, 37, 42, 43, 47, 48; Blue dyes such as CI Modanto Blue 1, 2, 3, 7, 8, 9, 12, 13, 15, 16, 19, 20, 21, 22, 23, 24, 26, 30, 31, 32, 39, 40, 41, 43, 44, 48, 49, 53, 61, 74, 77, 83, 84; Examples include purple dyes such as CI Modanto Violet 1, 2, 4, 5, 7, 14, 22, 24, 30, 31, 32, 37, 40, 41, 44, 45, 47, 48, 53, 58; and green dyes such as CI Modanto Green 1, 3, 4, 5, 10, 15, 19, 26, 29, 33, 34, 35, 41, 43, 53.

[0321] In the present invention, the pigments or dyes may be used alone or in combination of two or more.

[0322] The above pigments and dyes may be included in an amount of 1 to 40 wt%, more specifically 8 to 30 wt%, based on the total amount of the photosensitive resin composition. When the pigments are included within the above range, the pattern has excellent curability and adhesion, and can sufficiently express colors according to the intended purpose.

[0323] (5) Hollow silica particles

[0324] A photosensitive composition for forming a light-blocking layer of an organic light-emitting display device according to one embodiment of the present invention comprises hollow silica particles. The hollow silica particles are silica particles having cavities within the particles.

[0325] Silica particles containing gas within the particles, such as the hollow silica particles described above, have high dispersibility, and thus the pattern linearity of the cured film (light-shielding layer) formed by curing the photosensitive composition of the present invention is improved. Furthermore, by using silica particles containing gas within the particles, the refractive index of the light-shielding layer comprising the hollow silica particles can be lowered.

[0326] The above hollow silica particles may have an average particle diameter of 30 to 450 nm, and preferably an average particle diameter of 50 to 400 nm. When the average particle diameter of the hollow silica particles is within the above range, the hollow silica particles themselves have high mechanical strength, so they are not easily broken even if cavities are present inside the particles, which is preferable. In addition, within the above range, the hollow silica particles do not agglomerate with each other, have excellent dispersion stability, and can uniformly exist in the light-shielding layer. Therefore, it is preferable that no deviation in reflectivity occurs in the light-shielding layer. In addition, when forming a light-shielding layer pattern, the influence of the hollow silica particles exposed to the surface of the pattern is small, so that the resolution of the pattern is excellent.

[0327] The average particle diameter of the above hollow silica particles can be obtained by randomly selecting 100 particles, measuring the major and minor axis lengths of the particles, and taking the average of the above-described measurements. In addition, the average particle diameter of the above hollow silica particles can be measured by the Cumulant method using a particle size distribution meter "Particle Size Analyzer FPAR-1000" (manufactured by Otsuka Electronics Co., Ltd.) of the dynamic light scattering method.

[0328] In addition, the refractive index of the hollow silica particles is preferably 1.10 to 1.41, and more preferably 1.10 to 1.35. By using the hollow silica particles having a lower refractive index compared to the refractive index of general silica particles (1.45 to 1.47), the refractive index of the light-shielding layer can be made lower than the refractive index of a light-shielding film containing only general silica particles.

[0329] The refractive index of the hollow silica particles can be determined from a transparent mixture obtained by mixing the silica particles processed into a powder form with a standard refractive liquid having a known refractive index. In this case, the refractive index of the standard refractive liquid of the mixture is referred to as the refractive index of the hollow silica particles. In addition, the refractive index of the hollow silica particles can be measured using an Abbe refractometer.

[0330] In addition, the hollow silica particles can have a controlled ratio of internal cavities (hereinafter referred to as "porosity"). Since the hollow silica particles have different refractive indices depending on the particle diameter, it is easy to control the refractive index of the light-shielding layer. The "porosity" refers to the ratio of internal cavities within the particles.

[0331] The hollow silica particles described above can lower the refractive index as the porosity of the particles increases. Therefore, the porosity of the hollow silica particles is preferably 20% by volume or more, preferably 20 to 95% by volume, more preferably 25 to 90% by volume, even more preferably 30 to 90% by volume, and particularly preferably 35 to 90% by volume. When the porosity is within the above range, a light-shielding layer having a desired refractive index can be easily obtained. In addition, since reflection caused by the difference in refractive index between the transparent substrate and the light-shielding film can be suppressed, reflection can be suppressed without installing an antireflection film or the like on a separate substrate.

[0332] The porosity of the hollow silica particles can be obtained using a transmission electron microscope. Since the hollow portion of the hollow silica particles has a low density and the contrast of the hollow portion is low in the transmission electron microscope photograph, the outer portion and the hollow portion of the hollow silica particles can be confirmed. From the above microscope photograph, the longest and shortest diameters of the hollow silica particles are first measured, and the average value is taken as the particle diameter. Assuming the particle shape is spherical, the volume V1 is obtained. Next, the longest and shortest diameters of the hollow portion of the particle are measured, and the average value is taken as the diameter of the cavity. Assuming the cavity shape is spherical, the volume V2 is obtained. The porosity can be expressed as the ratio of the volume V2 to the volume V1.

[0333] The shape of the hollow silica particles is not particularly limited, as long as they have the desired porosity. They may be spherical or elliptical. The shape of the hollow silica particles used in the present invention is preferably spherical.

[0334] The hollow silica particles preferably have a sphericity of 1.05 to 1.5. When the sphericity of the hollow silica particles is within the above range, the particle shape becomes close to a sphere. Therefore, the hollow silica particles can be uniformly dispersed within a thin light-shielding layer, and a light-shielding layer can be formed in which the hollow silica particles are not exposed to the outside from the film surface while maintaining the flatness of the light-shielding layer surface. Accordingly, a light-shielding layer having a low refractive index and sufficient strength can be obtained.

[0335] The sphericity of the above hollow silica particles can be obtained from the ratio of the longest and shortest diameters of the particles (the average value of 100 random silica particles). Here, the longest and shortest diameters of the hollow silica particles are values ​​obtained by photographing the silica particles with a transmission electron microscope and measuring the longest and shortest diameters of the hollow silica particles from the obtained microscopic image.

[0336] The hollow silica particles may be either crystalline or amorphous, and may be monodisperse particles or aggregated particles as long as they satisfy a specified particle size.

[0337] The specific surface area of ​​hollow silica particles is 10 to 2000 m 2 / g is preferable, 20~1800m 2 / g is more desirable, 50~1500m 2 / g is most desirable.

[0338] The above hollow silica particles can be mixed with the black colorant, dispersant, resin, and organic solvent, or can be prepared as a dispersion alone without the black colorant, and the black photosensitive resin composition of the present invention can include the dispersion.

[0339] In order to stabilize the dispersion in the above dispersion or to increase the compatibility or bonding property with the alkali-soluble resin and the reactive unsaturated compound component, the hollow silica particles may be subjected to physical surface treatment such as plasma discharge treatment and corona discharge treatment, or chemical surface treatment with a surfactant, coupling agent, etc. The use of a coupling agent is preferred. As the coupling agent, an alkoxy metal compound (e.g., titanium coupling agent, silane coupling agent) is preferably used. Among these, silane coupling treatment is effective. That is, the surface of the hollow silica particles may be treated with an inorganic or organic substance so that they can be dissolved or dispersed in an organic solvent.

[0340] As hollow silica particles, commercially available products can be preferably used.

[0341] Examples of hollow silica particles that can be used include the Sluria series (e.g., isopropanol (IPA) dispersion or 4-methyl-2-pentanone (MIBK) dispersion) and OSCAL series from JGC C&C; the Snowtex series (e.g., IPA dispersion, ethylene glycol dispersion, methyl ethyl ketone (MEK) dispersion, dimethylacetamide dispersion, MIBK dispersion, propylene glycol monomethyl acetate dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, ethyl acetate dispersion, butyl acetate dispersion, xylene-n-butanol dispersion, or toluene dispersion) from Nissan Chemical Industries, Ltd.; SiliNax from Nittetsu Mining Co., Ltd.; the PL series (e.g., IPA dispersion) from Fuso Chemical Co., Ltd.; the Aerosil series (e.g., propylene glycol acetate dispersion, ethylene glycol dispersion, or MIBK dispersion) from EVONIK. and the AERODISP series of EVONIK products.

[0342] Hollow silica particles may be used singly, or two or more types may be used in combination. For example, hollow silica particles and porous silica particles may be used in combination.

[0343] The above hollow silica particles are included in an amount of 20 wt% or less (excluding solvent) based on the total amount of the black photosensitive resin composition.

[0344] For example, the hollow silica particles may be included in an amount of 0.1 wt% to 20 wt% based on the total amount of the black photosensitive resin composition. When the hollow silica particles are included in an amount of 0.1 wt% to 20 wt% based on the total amount of the black photosensitive resin composition, there is an effect of lowering the refractive index of the film or pattern formed.

[0345] When the hollow silica particles are included in an amount of less than 0.1 wt% based on the total amount of the photosensitive composition, the effect of lowering the refractive index does not sufficiently occur, and when the hollow silica particles are included in an amount of 20 wt% or more based on the total amount of the photosensitive composition, the developability of the black photosensitive resin composition may be reduced during patterning, resulting in the generation of residue or a decrease in resolution, which may be undesirable.

[0346] (6) Solvent

[0347] In one embodiment of the present invention, the solvent may be a material that is compatible with the alkali-soluble resin, the reactive unsaturated compound, the photoinitiator, the black colorant, and the hollow silica particles but does not react with them.

[0348] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate;2-oxy-2-methyl propionic acid esters such as methyl 2-oxy-2-methyl propionic acid, ethyl 2-oxy-2-methyl propionic acid, etc.; monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methyl propionic acid alkyls such as methyl 2-methoxy-2-methyl propionic acid, ethyl 2-ethoxy-2-methyl propionic acid; esters such as ethyl 2-hydroxypropionic acid, ethyl 2-hydroxy-2-methyl propionic acid, ethyl hydroxyacetate, methyl 2-hydroxy-3-methyl butanoate; ketone acid esters such as ethyl pyruvate, etc.;

[0349] In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can also be used.

[0350] Among the above solvents, taking compatibility and reactivity into consideration, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as 2-hydroxypropionate ethyl; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0351] The solvent may be included as a remainder based on the total amount of the photosensitive resin composition, and specifically, may be included at 50 to 90 wt%. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the manufacture of a pattern layer.

[0352] (7) Other additives

[0353] The above photosensitive composition may further include additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acryloxy group; a leveling agent; a fluorinated surfactant; a silicone surfactant; and a radical polymerization initiator to prevent stains or spots during application, improve leveling performance, and prevent the formation of residues due to non-development.

[0354] For example, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc.

[0355] Examples of the above silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryl oxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy propyl trimethoxy silane, β-epoxy cyclohexyl ethyl trimethoxysilane, etc., and these may be used alone or in combination of two or more.

[0356] The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, adhesion, storability, etc. are excellent.

[0357] In addition, the photosensitive resin composition may further include a surfactant, such as a fluorinated surfactant or a silicone surfactant, to improve coating properties and prevent defects, if necessary.

[0358] As the above fluorinated surfactant, BM Chemie's BM-1000 ® , BM-1100 ® Mecha Pack F 142D by Dai Nippon Inki Kagaku Kogyo Co., Ltd. ® , East F 172 ®, East F 173 ® , East F 183 ® Back; Prorad FC-135 from Sumitomo 3M Co., Ltd. ® , East FC-170C ® , East FC-430 ® , East FC-431 ® Saffron S-112 from Asahi Glass Co., Ltd. ® , East S-113 ® , East S-131 ® , East S-141 ® , East S145 ® SH-28PA from Toray Silicone Co., Ltd. ® , East-190 ® , East-193 ® , SZ-6032 ® , SF-8428 ® Fluorinated surfactants sold under the names of etc. can be used.

[0359] As the above silicone surfactant, BASF's EFKA ® 3030, EFKA ® 3034, EFKA ® 3886, etc.; 3030, 3085, 3236 from AFCONA; BYK-379, BYK-3550, BYK-3751, BYK-3754 from BYK can be used.

[0360] The above surfactant may be used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the surfactant is included within the above range, coating uniformity is ensured, staining does not occur, and wetting on a glass substrate is excellent. In addition, other additives such as antioxidants and stabilizers may be added in a certain amount to the photosensitive resin composition within a range that does not impair the physical properties.

[0361] Another embodiment of the present invention can provide an organic light-emitting display device.

[0362] Hereinafter, referring to FIG. 1, an organic light-emitting display device will be described. An organic light-emitting display device according to an embodiment of the present invention includes a substrate (1), a TFT layer (2) on the substrate, a flattening layer (3) on the TFT layer, an organic light-emitting element layer on the flattening layer, a sealing layer (8) disposed on the organic light-emitting element layer, a touch panel (9) disposed on the sealing layer, and a color filter disposed on the touch panel, wherein at least one of the flattening layer, the organic light-emitting element layer, the sealing layer, the touch panel, and the color filter includes a pattern or film formed with a photosensitive composition of the present invention.

[0363] More specifically, the organic light-emitting display device includes a planarization layer, a pixel definition film, and a color separation unit as a light-shielding layer, and is an organic light-emitting display device characterized in that at least one of the planarization layer, the pixel definition film, and the color separation unit includes a pattern or film formed from the photosensitive composition of the present invention. The pattern or film is formed from a photosensitive composition containing an alkali-soluble resin including a repeating unit represented by the chemical formula (1), hollow silica, and a black pigment as essential components.

[0364] The above substrate (1) may be a flexible substrate. The substrate may be made of a plastic having excellent heat resistance and durability, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyarylate (PAR), polyetherimide (PEI), and polyethersulfone (PES).

[0365] However, the present invention is not limited thereto, and various flexible materials such as metal foil or thin glass may be used.

[0366] Meanwhile, the substrate may be a rigid substrate, and in this case, the substrate may be made of a glass material with SiO2 as its main component.

[0367] In the case of a bottom emission type in which an image is implemented in the direction of the substrate, the substrate must be formed of a transparent material. However, in the case of a top emission type in which an image is implemented in the opposite direction of the substrate, the substrate does not necessarily need to be formed of a transparent material. In this case, the substrate may be formed of a metal. In the case of forming the substrate of a metal, the substrate may include, but is not limited to, one or more selected from the group consisting of carbon, iron, chromium, manganese, nickel, titanium, molybdenum, and stainless steel (SUS).

[0368] A TFT layer (2) may be arranged on the above substrate. The term TFT layer mentioned in this specification refers to a thin film transistor (TFT) array for driving an organic light-emitting element, and means a driving part for displaying an image. In Fig. 1, only an organic light-emitting element and a driving thin film transistor for driving the organic light-emitting element are illustrated, but this is only for the convenience of explanation, and the present invention is not limited to what is illustrated, and it is obvious to those skilled in the art that a plurality of thin film transistors, storage capacitors, and various types of wiring may be further included.

[0369] The TFT layer may be covered and protected by a planarization layer (3). The planarization layer may include an inorganic insulating film and / or an organic insulating film. Examples of inorganic insulating films that may be used in the planarization layer include silicon oxide (SiO2), silicon nitride (SiN). x), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zirconium oxide (ZrO2), barium strontium titanate (BST), lead zirconate-titanate (PZT), etc.

[0370] In addition, examples of organic insulating films that can be used in the flat layer may include general-purpose polymers (PMMA, PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof.

[0371] Meanwhile, the flat layer may have a composite laminated structure of an inorganic insulating film and an organic insulating film.

[0372] In addition, the flattening layer may include the photosensitive composition of the present invention. Since the details regarding the photosensitive composition of the present invention are the same as those according to the above-described embodiment of the present invention, they will be omitted. When forming the flattening layer with the photosensitive composition of the present invention, the refractive index of the flattening layer is reduced by the hollow silica particles included in the photosensitive resin composition of the present invention, thereby lowering the reflectance for external light, which is very preferable.

[0373] In addition, the alkali-soluble resin of the present invention, which has excellent compatibility with the hollow silica particles, can form a high-resolution flat layer pattern, and has the effect of reducing outgassing, thereby improving pattern reliability, which is preferable. In addition, the photosensitive resin composition of the present invention is even more preferable because it has the effect of improving the visibility of an organic light-emitting display device by absorbing light incident from the outside by including a black colorant.

[0374] An organic light-emitting element layer may be formed on the above-mentioned flat layer. The organic light-emitting element layer may include a pixel electrode (4) formed on the flat layer, a counter electrode (7) positioned opposite to the pixel electrode, and an organic layer (6) interposed therebetween. When a voltage is applied between the pixel electrode and the counter electrode, the organic layer may emit light.

[0375] The organic layer can emit red light, green light, blue light, or white light. When the organic layer emits white light, the organic light-emitting display device can further include blue, green, and red color filters to express a color image, or when the organic layer emits red, green, or blue light, to increase color purity and light efficiency.

[0376] Organic light-emitting displays can be classified into bottom emission types, top emission types, and dual emission types depending on the direction of emission. In a bottom emission type organic light-emitting display, the pixel electrode is provided as a light-transmitting electrode, and the opposite electrode is provided as a reflective electrode. In a top emission type organic light-emitting display, the pixel electrode is provided as a reflective electrode, and the opposite electrode is provided as a semi-transmissive electrode.

[0377] In the present invention, the organic light-emitting element is described based on a front-emitting type in which light is emitted in the direction of the sealing layer.

[0378] The pixel electrode may be a reflective electrode. The pixel electrode may include a laminated structure of a reflective layer and a transparent or semitransparent electrode layer having a high work function. The reflective layer may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or an alloy thereof. The transparent or semitransparent electrode layer may include at least one material selected from transparent conductive oxide materials such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO).

[0379] The pixel electrode can be patterned and formed in an island shape corresponding to each pixel.

[0380] Additionally, the pixel electrode can function as an anode electrode.

[0381] Meanwhile, a pixel definition film (5) may be disposed on the pixel electrode, which includes a predetermined opening that covers the edge of the pixel electrode and exposes the center of the pixel electrode. An organic layer including an organic light-emitting layer that emits light may be disposed on the area defined by the opening. The area where the organic layer is disposed may be defined as a light-emitting area.

[0382] Meanwhile, when forming a light-emitting region within the opening of the pixel-defining film, a region protruding by the pixel-defining film is arranged between the light-emitting regions, and since no organic light-emitting layer is formed in this protruding region, it can be defined as a non-light-emitting region. The pixel-defining film may include the photosensitive composition of the present invention. Since the details regarding the photosensitive composition of the present invention are the same as those according to the above-described embodiment of the present invention, they will be omitted.

[0383] When forming a pixel-defining film using the photosensitive composition of the present invention, the refractive index of the pixel-defining film is reduced by the hollow silica particles included in the photosensitive composition of the present invention, thereby lowering the reflectance to external light, which is highly desirable. In addition, a high-resolution pixel-defining film pattern can be formed by the alkali-soluble resin of the present invention, which has excellent compatibility with the hollow silica particles, and the reliability of the pattern is improved due to the effect of reducing outgassing, which is desirable.

[0384] In addition, the photosensitive resin composition of the present invention is more preferable because it has the effect of improving the visibility of an organic light-emitting display device by absorbing light incident from the outside by including a black colorant.

[0385] The counter electrode may be formed as a transparent electrode. The counter electrode may be a semi-permeable film formed of a thin metal having a low work function, such as Li, Ca, LiF / Ca, LiF / Al, Al, Mg, or Ag. To compensate for the high resistance problem of the thin metal semi-permeable film, a transparent conductive film made of a transparent conductive oxide may be laminated on the metal semi-permeable film.

[0386] The counter electrode can be formed across the entire surface of the substrate in the form of a common electrode.

[0387] Additionally, such a counter electrode can function as a cathode electrode.

[0388] The polarities of the pixel electrode and the counter electrode as described above may be opposite to each other.

[0389] The organic layer includes an organic light-emitting layer that emits light, and the organic light-emitting layer may use a low-molecular organic material or a high-molecular organic material. When the organic light-emitting layer is a low-molecular organic layer formed of a low-molecular organic material, a hole transport layer (HTL) and a hole injection layer (HIL) may be arranged in the direction of the pixel electrode with the organic light-emitting layer as the center, and an electron transport layer (ETL) and an electron injection layer (EIL) may be arranged in the direction of the opposite electrode. Of course, other functional layers may be stacked in addition to the hole injection layer, hole transport layer, electron transport layer, and electron injection layer.

[0390] A sealing layer (8) may be disposed on the organic light-emitting element layer to cover the organic light-emitting element layer. The organic light-emitting element included in the organic light-emitting element layer is composed of organic materials and can be easily deteriorated by external moisture or oxygen. Therefore, the organic light-emitting element layer must be sealed to protect the organic light-emitting element. The sealing layer may have a structure in which a plurality of inorganic films and a plurality of organic films are alternately laminated as a means for sealing the organic light-emitting element layer.

[0391] In the organic light-emitting display device of the present embodiment, it is preferable to form a sealing layer by using a thin film in which a plurality of inorganic films and a plurality of organic films are alternately laminated rather than a sealing substrate, and by using a thin film as a sealing means, it is possible to easily implement flexibility and thinning of the organic light-emitting display device.

[0392] The sealing layer may include a plurality of inorganic films and a plurality of organic films. The inorganic films and the organic films may be alternately laminated.

[0393] The inorganic films may be formed of metal oxides, metal nitrides, metal carbides, or combinations thereof. For example, the inorganic films may be formed of aluminum oxide, silicon oxide, or silicon nitride. In another example, the inorganic films may comprise a laminated structure of multiple inorganic insulating layers. The inorganic films may function to inhibit external moisture and / or oxygen from penetrating into the organic light-emitting element layer.

[0394] The organic films may be polymeric organic compounds. For example, the organic films may include any one of epoxy, acrylate, or urethane acrylate. The organic films may function to relieve internal stress in the inorganic films, or to compensate for defects and smooth the inorganic films.

[0395] The order of lamination of the inorganic and organic films constituting the above sealing layer is not limited, and an organic film or an inorganic film may be laminated on the organic light-emitting element layer, and the uppermost layer of the sealing layer may also be an organic film or an inorganic film.

[0396] A touch panel (9) may be formed on the sealing layer. The touch panel may include a first touch electrode formed on the sealing layer, a second touch electrode positioned opposite thereto, and an insulating layer interposed therebetween.

[0397] The first touch electrode and the second touch electrode may be formed in a grid pattern or a specific pattern shape. The first touch electrode may be formed in contact with the upper portion of the sealing layer, and an inorganic layer may be additionally provided between the sealing layer and the first touch electrode.

[0398] The above first touch electrode and second touch electrode may be formed of ITO or a metal mesh, and are preferably formed of a metal mesh.

[0399] Metal mesh is an electrode manufactured by printing opaque metals (copper, silver, gold, aluminum, etc.) in a grid shape with a thickness of 1 to 7 ㎛. Since it uses highly conductive metal, it has a very low resistance value, which allows for a fast touch response speed, makes it easy to implement large screens, and has the advantage of being cheaper than ITO film. In addition, metal mesh electrodes have superior durability against repeated bending compared to ITO electrodes, making them suitable for use as touch panel electrodes for foldable displays.

[0400] It is preferable that the above touch panel be a capacitive touch panel that uses the capacitance of the human body when a user touches it to recognize the part where the amount of current has changed, calculate the size, and detect the location.

[0401] It is obvious to those skilled in the art that the organic light-emitting display device of the present invention is not limited to what is shown, and may further include a Control IC that converts an analog signal transmitted from a touch panel into a digital signal and controls coordinate values ​​necessary for determining the coordinates of a touch area, an optically transparent adhesive, a flexible printed circuit board (FPCB) on which conductive and signal line patterns are formed to transmit various signals to electronic components, and other various electronic components and various wirings.

[0402] A color filter may be formed on the above touch panel. The color filter may be manufactured in advance and provided in the organic light-emitting display device, or a process of forming the color filter directly on the touch panel may be performed.

[0403] The above color filter is positioned on the upper portion of the touch panel and may include a color portion (10) aligned vertically with the light-emitting area of ​​the organic light-emitting element layer and a color separation portion (11) aligned vertically with the non-light-emitting area and separating the color portion.

[0404] The photosensitive composition of the present invention can be included in a color separation unit to absorb and block external light incident on an organic light-emitting display device, thereby improving outdoor visibility. When the photosensitive composition of the present invention is used to form a color separation unit of a color filter, the hollow silica particles included in the photosensitive composition of the present invention can reduce the refractive index of the color separation unit, thereby lowering the reflectance for external light, which is highly desirable.

[0405] In addition, a high-resolution color separation pattern can be formed by the alkali-soluble resin of the present invention having excellent compatibility with the hollow silica particles, and the reliability of the pattern is improved due to the effect of reducing outgassing, which is preferable.

[0406] In addition, the photosensitive composition of the present invention is more preferable because it has the effect of improving the visibility of an organic light-emitting display device by absorbing light incident from the outside by including a black colorant.

[0407] In addition, since the photosensitive composition of the present invention has high photosensitivity, even if the post-heat treatment process during the photopatterning process is performed at 100°C or lower, the pattern is sufficiently cured, and heat resistance and chemical resistance of the color separation pattern are secured, so that the color separation portion can be formed without causing heat-induced damage to the organic material layer of the organic light-emitting element layer.

[0408] It is obvious to those skilled in the art that the positions of each layer in the structure of the organic light-emitting display device described above are not limited, and that multiple functional layers with specific purposes and functions can be additionally arranged between each layer, and the organic light-emitting display device of the present invention is not limited to the structure and drawings described above.

[0409] Hereinafter, synthetic examples and examples according to the present invention are specifically described, but the synthetic examples and examples of the present invention are not limited thereto.

[0410] Synthesis Example A (Synthesis of hollow silica)

[0411] Synthesis Example A-1 (Synthesis of hollow silica 1)

[0412] In a 3000 ml 3-necked round-bottom flask equipped with a distillation column, add 1600 g (20 mol) of cyclohexane (Sigma Aldrich), 560 g (0.93 mol) of polyoxyethylene tert-octylphenyl ether (Sigma Aldrich), 360 g (3.57 mol) of 1-hexanol (Sigma Aldrich), and 88 g of water. Stir at room temperature for 30 minutes, then add 5.8 g (0.03 mol) of tetraethylorthosilicate (Sigma Aldrich) and stir for an additional 2 hours. Add 45 g of ammonia water (Daejung Chemical Gold / 29 wt% aqueous solution), stir for 10 hours, and add 1 g (5.6 mmol) of (3-aminopropyl)trimethoxysilane (Sigma Aldrich) diluted in 6 g of ethanol and dropwise over 30 minutes. After stirring for an additional 6 hours at room temperature, 1 L of ethanol was added, and 3 g of hollow silica nanoparticles with a diameter of 50 nm were obtained using a centrifuge.

[0413] Synthesis Example A-2 (Synthesis of hollow silica 2)

[0414] In a 250 ml 3-necked round-bottom flask equipped with a distillation column, add 1.5 g of poly(vinyl pyrrolidone) (Mw: 40,000, Sigma Aldrich), 10 g (0.096 mol) of styrene (Sigma Aldrich), 0.5 g (0.003 mol) of azobisisobutyronitrile (Sigma Aldrich), 5 g (0.278 mol) of purified water, and 45 g (0.977 mol) of ethanol, stir at 350 RPM, and add nitrogen. After increasing the temperature to 70°C and maintaining it for 3 hours, add 0.6 g of [2-(Methacryloyloxy)ethyl]trimethylammonium chloride (75 wt% in water, Sigma Aldrich), and stir for 3 hours. After cooling to 50℃, 4ml of ammonia water (25wt%, Sigma Aldrich) was added, 10g (0.048mol) of tetraethylorthosilicate (Sigma Aldrich) was added, and the mixture was stirred for an additional 2 hours, cooled, and 100ml of ethanol was added. Then, 13g of particles having a diameter of 400nm and containing internal polystyrene in the silica shell were obtained using a centrifuge. After calcining the particles at 800℃ for 1 hour using a furnace (Revodix) to remove the internal polystyrene, 2g of hollow silica nanoparticles having a diameter of 400nm were obtained.

[0415] Synthesis Example A-3 (Synthesis of hollow silica 3)

[0416] Except that the amount of poly(vinyl pyrrolidone) (Mw: 40,000, Sigma Aldrich) in Synthesis Example A-2 was reduced from 1.5 g to 0.5 g and the stirring speed was reduced from 350 RPM to 250 RPM, the same procedure as in Synthesis Example 1-2 was followed to obtain 2 g of hollow silica nanoparticles having a diameter of 1 μm.

[0417] [Synthesis of alkali-soluble resin]

[0418] Synthesis example (synthesis of the first binder resin)

[0419] Synthesis Examples 1-1 to 1-5 (Synthesis of Binders 1-1 to 1-5)

[0420] All raw materials except Karenz BEI were added to a 500 ml 3-neck round bottom flask equipped with a distillation column according to Table 1 below, the temperature was raised to 80°C and reacted for 4 hours, then the temperature was lowered to 25°C and allowed to stand for 4 hours, then the temperature was raised again to 50°C, Karenz BEI was added, and stirred for 4 hours to obtain polymer solutions of Binder 1-1 to 1-5.

[0421] Synthesis Example 1-1 (Binder 1-1) Synthesis Example 1-2 (Binder 1-2) Synthesis Example 1-3 (Binder 1-3) Synthesis Example 1-4 (Binder 1-4) Synthesis Example 1-5 (Binder 1-5) Methacrylic acid (Sigma aldrich) 20 g (0.232 mol) 20 g (0.232 mol) 20 g (0.232 mol) 20 g (0.232 mol) 20 g (0.232 mol) 2-Hydroxyethyl methacrylate (Sigma aldrich) 10 g (0.077 mol) 10 g (0.077 mol) 10 g (0.077 mol) 10 g (0.077 mol) 10 g (0.077 mol) Benzyl methacrylate (Sigma aldrich) 55 g (0.312 mol) 55 g (0.312 mol) 55 g (0.312 mol) - - Cyclohexylmethyl methacrylate (Chemieliva) - - - 56.9 g (0.312 mol) 56.9 g (0.312 mol) Glycidyl methacrylate (Sigma aldrich) 15 g (0.106 mol) - 15 g (0.106 mol) - - (3-ethyloxetan-3-yl)methyl methacrylate (Eternal) - 15 g (0.081 mol) - 15 g (0.081 mol) - (7-oxabicyclo[4.1.0]heptan-3-yl)methyl methacrylate (Cyclomer M100, Daicel) - - 15 g (0.076 mol) - - Karenz BEI (Showa denko) 19.5 g (0.087 mol) 19.5 g (0.087 mol) 19.5 g (0.087 mol) 19.5 g (0.087 mol) 19.5 g (0.087 mol) AIBN (radical initiator) (Sigma aldrich) 7 g (0.043 mol) 7 g (0.043 mol) 7 g (0.043 mol) 7 g (0.043 mol) 7 g (0.043 mol)PGMEA (solvent)(Daicel)233g233g233g233g233gSolid content31 %31 %31 %31 %31 %Weight average molecular weight11,000 g / mol10,700 g / mol11,100 g / mol11,300 g / mol11,400 g / mol.

[0422] (Binder 1-1)

[0423]

[0424] In Binder 1-1, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 43 mol%; j is 14 mol%; k ​​is 32 mol%; and l is 11 mol%.

[0425] (Binder 1-2)

[0426]

[0427] In Binder 1-2, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 44 mol%; j is 12 mol%; k ​​is 33 mol%; and l is 11 mol%.

[0428] (Binder 1-3)

[0429]

[0430] In Binder 1-3, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 45 mol%; j is 11 mol%; k ​​is 33 mol%; and l is 11 mol%.

[0431] (Binder 1-4)

[0432]

[0433] In Binder 1-4, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 43 mol%; j is 14 mol%; k ​​is 32 mol%; and l is 11 mol%.

[0434] (Binder 1-5)

[0435]

[0436] In Binder 1-5, i, j, k, and l represent each repeating unit. Assuming the total to be 100 mol%, i is 44 mol%; j is 12 mol%; k ​​is 33 mol%; and l is 11 mol%.

[0437] Synthesis Examples 1-6 to 1-10 (Synthesis of Binders 1-6 to 1-10)

[0438] All raw materials except Karenz AOI were added to a 500 ml 3-neck round bottom flask equipped with a distillation column according to Table 2 below, the temperature was raised to 80°C and reacted for 4 hours, then the temperature was lowered to 25°C and allowed to stand for 4 hours, then the temperature was raised again to 50°C, Karenz AOI was added, and stirred for 4 hours to obtain a polymer solution of Binder 1-6 to 1-10.

[0439] Synthesis Examples 1-6 (Binder 1-6) Synthesis Example 1-7 (Binder 1-7) Synthesis Example 1-8 (Binder 1-8) Synthesis Example 1-9 (Binder 1-9) Synthesis Example 1-10 (Binder 1-10) Methacrylic acid (Sigma aldrich) 20 g (0.232 mol) 20 g (0.232 mol) 20 g (0.232 mol) 20 g (0.232 mol) 20 g (0.232 mol) 2-Hydroxyethyl methacrylate (Sigma aldrich) 10 g (0.077 mol) 10 g (0.077 mol) 10 g (0.077 mol) 10 g (0.077 mol) 10 g (0.077 mol) Benzyl methacrylate (Sigma aldrich) 55 g (0.312 mol) 55 g (0.312 mol) 55 g (0.312 mol) - - Cyclohexylmethyl methacrylate (Chemieliva) - - - 56.9 g (0.312 mol) 56.9 g (0.312 mol) Glycidyl methacrylate (Sigma aldrich) 15 g (0.106 mol) - 15 g (0.106 mol) - - (3-ethyloxetan-3-yl)methyl methacrylate (Eternal) - 15 g (0.081 mol) - 15 g (0.081 mol) - (7-oxabicyclo[4.1.0]heptan-3-yl)methyl methacrylate (Cyclomer M100, Daicel) - - 15 g (0.076 mol) - - Karenz AOI (Showa denko) 10.8 g (0.077 mol) 10.8 g (0.077 mol) 10.8 g (0.077 mol) 10.8 g (0.077 mol) 10.8 g (0.077 mol) AIBN (radical initiator) (Sigma aldrich) 7 g (0.043 mol) 7 g (0.043 mol) 7 g (0.043 mol) 7 g (0.043 mol) 7 g (0.043 mol)PGMEA (solvent)(Daicel)233g233g233g233g233gSolid content31 %31 %31 %31 %31 %Weight average molecular weight (g / mol)10,500 g / mol10,400 g / mol10,800 g / mol11,000 g / mol11,070 g / mol.

[0440] (Binder 1-6)

[0441]

[0442] In Binder 1-6, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 43 mol%; j is 14 mol%; k ​​is 32 mol%; and l is 11 mol%.

[0443] (Binder 1-7)

[0444]

[0445] In Binder 1-7, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 44 mol%; j is 12 mol%; k ​​is 33 mol%; and l is 11 mol%.

[0446] (Binder 1-8)

[0447]

[0448] In Binder 1-8, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 45 mol%; j is 11 mol%; k ​​is 33 mol%; and l is 11 mol%.

[0449] (Binder 1-9)

[0450]

[0451] In Binder 1-9, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 43 mol%; j is 14 mol%; k ​​is 32 mol%; and l is 11 mol%.

[0452] (Binder 1-10)

[0453]

[0454] In Binder 1-10, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 44 mol%; j is 12 mol%; k ​​is 33 mol%; and l is 11 mol%.

[0455] Synthesis examples 1-11 to 1-13 (synthesis of binders 1-11 to 1-13)

[0456] Binder 1-12 and 1-13 were synthesized by adding all raw materials according to Table 3 below to a 500 ml 3-neck round bottom flask equipped with a distillation column, heating to 80℃, and reacting for 4 hours to obtain Binder 1-12 and Binder 1-13. Binder 1-11 was synthesized by adding all raw materials except Karenz AOI, heating to 80℃, reacting for 4 hours, then lowering the temperature to 25℃, waiting for 4 hours, then heating again to 50℃, adding Karenz AOI, and stirring for 4 hours.

[0457] Synthesis Example 1-11 (Binder 1-11) Synthesis Example 1-12 (Binder 1-12) Synthesis Example 1-13 (Binder 1-13) Methacrylic acid (Sigma aldrich) 20g (0.232 mol) 20g (0.232 mol) 20g (0.232 mol) 2-Hydroxyethyl methacrylate (Sigma aldrich company) 10g (0.077 mol) 10g (0.077 mol) 10g (0.077 mol) Benzyl methacrylate (Sigma aldrich company) 70g (0.397 mol) - 70g (0.397 mol) Cyclohexylmethyl methacrylate (Chemieliva company) - 56.9g (0.312 mol)-Glycidyl methacrylate-15g(0.106 mol)-Karenz AOI (Showa denko) 10.8g (0.077 mol)--AIBN (radical initiator) (Sigma aldrich) 7g (0.043 mol) 7g (0.043 mol) 7g (0.043 mol) PGMEA (solvent) (Daicel) 233g 233g 233g Solids 31% 30% 30% Weight average molecular weight (g / mol) 11,100 g / mol 10,100 g / mol 10,200 g / mol

[0458] (Binder 1-11)

[0459]

[0460] In Binder 1-11, i, j, and k represent each repeating unit, and assuming the total to be 100 mol%, i is 56 mol%; j is 11 mol%; and k is 33 mol%.

[0461] (Binder 1-12)

[0462]

[0463] In Binder 1-12, i, j, k, and l represent each repeating unit, and assuming the total to be 100 mol%, i is 43 mol%; j is 14 mol%; k ​​is 32 mol%; and l is 11 mol%.

[0464] (Binder 1-13)

[0465]

[0466] In Binder 1-13, i, j, and k represent each repeating unit, and assuming the total to be 100 mol%, i is 56 mol%; j is 11 mol%; and k is 33 mol%.

[0467] Synthesis Example 2 (Synthesis of the Second Binder Resin)

[0468] Synthesis Example 2-1 (Preparation of Compound 1-1)

[0469] 9,9'-Bisphenol fluorene 80 g (0.228 mol, Sigma Aldrich Co.), glycidyl chloride 42.67 g (0.461 mol, Sigma Aldrich Co.), and anhydrous potassium carbonate 191 g (1.38 mol) were placed in a 1500 ml 3-neck round-bottom flask equipped with a distillation column together with 600 ml of dimethylformamide, heated to 80°C, and reacted for 4 hours. After lowering the temperature to 25°C, the reaction solution was filtered, and the filtrate was added dropwise to 1000 ml of water with stirring, and the precipitated powder was filtered, washed with water, and dried under reduced pressure at 40°C to obtain 100 g (216 mmol) of compound 1-1. The obtained powder showed a purity of 98% as a result of HPLC purity analysis.

[0470] (Compound 1-1)

[0471]

[0472] Synthesis Example 2-2 (Synthesis of monomers 1-1 to 1-3)

[0473] 25 g (54 mmol) of compound 1-1 obtained in Synthetic Example 2-1, 7.9 g (0.11 mol, Daejung Chemicals & Metals Co., Ltd.), 0.03 g (0.16 mmol, Daejung Chemicals & Metals Co., Ltd.) of acrylic acid, 0.03 g (0.16 mmol, Daejung Chemicals & Metals Co., Ltd.) of benzyltriethylammonium chloride, and 0.01 g (0.05 mmol, Daejung Chemicals & Metals Co., Ltd.) of hydroquinone were placed in a 300 ml 3-neck round-bottom flask equipped with a distillation column, along with 52 g of toluene (Sigma Aldrich Co., Ltd.), and stirred at 110°C for 6 hours. After the reaction was completed, toluene was removed by distillation under reduced pressure to obtain the product. After filling 500 g of silica gel 60 (230-400 mesh, Merck) into a glass column with a diameter of 220 mm, 20 g of the product was filled, and separation was performed using 10 L of a solvent containing a mixture of hexane and ethyl acetate in a volume ratio of 4:1, to separate monomers 1-1 to 1-3.

[0474] (monomer 1-1)

[0475]

[0476] (monomer 1-2)

[0477]

[0478] (monomer 1-3)

[0479]

[0480] Synthesis Examples 2-3 to 2-9 (Synthesis of Polymers 1-1 to 1-7)

[0481] Monomer 1-1, monomer 1-2 and monomer 1-3 obtained in Synthesis Example 2-2 were each placed in a 50 ml 3-neck round-bottom flask equipped with a distillation column so that the total amount was 5 g (8.2 mmol), as shown in Table 4 below, and 0.005 g (0.03 mmol, Daejung Chemicals & Metals Co., Ltd.) of Benzyltriethyl ammonium chloride, 0.001 g (0.01 mmol, Daejung Chemicals & Metals Co., Ltd.) of hydroquinone and 14 g (Sigma Aldrich Co., Ltd.) of propylene glycol methyl ether acetate were placed in the 3-neck round-bottom flask equipped with a distillation column, and 1.21 g (4 mmol, Mitsubishi Gas Co., Ltd.) of biphenyltetracarboxylic dianhydride and 0.38 g (2 mmol, Sigma Aldrich Co., Ltd.) of tetrahydrophthalic acid were added, and then stirred at 110°C for 6 hours. After the reaction was completed, the reaction solution was recovered to obtain polymers 1-1 to 1-7 containing repeating units of monomers 1-1, 1-2, and 1-3 in the form of a solution with a solid content of 45%. The molecular weight of the synthesized polymers was analyzed using gel permeation chromatography (Agilent).

[0482] Synthesis Example 2-3 (Polymer 1-1) Synthesis Example 2-4 (Polymer 1-2) Synthesis Example 2-5 (Polymer 1-3) Synthesis Example 2-6 (Polymer 1-4) Synthesis Example 2-7 (Polymer 1-5) Synthesis Example 2-8 (Polymer 1-6) Synthesis Example 2-9 (Polymer 1-7) Monomer 1-13 g (4.95 mmol) 1 g (1.65 mmol) 1 g (1.65 mmol) 4.25 g (7.01 mmol) 0.25 g (0.41 mmol) 5 g (8.24 mmol) 0 g Monomer 1-21 g (1.65 mmol) 3 g (4.95 mmol) 1 g (1.65 mmol) 0.25 g (0.41 mmol) 4.25 g (7.01 mmol) 0 g 5 g (8.24 mmol) Monomer 1-31 g(1.65 mmol)1 g(1.65 mmol)3 g(4.95 mmol)0.5 g(0.83 mmol)0.5 g(0.83 mmol)0 g0 gWeight Average molecular weight4,800 g / mol4,200 g / mol4,600 g / mol4,400 g / mol4,100 g / mol5,200 g / mol3,300 g / mol

[0483] Synthesis Example 2-10 (Synthesis of Compound 2-1)

[0484] In a 3-neck round-bottom flask equipped with a distillation column connected to cooling water, 20 g (0.147 mol) of trichloro silane (Gelest) and 17.51 ​​g (0.147 mol) of 6-chloro-1-hexene (Aldrich) are dissolved in 200 ml of ethyl acetate, 0.02 g of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex solution (2 wt% in xylene / Aldrich) is added, nitrogen is added, the temperature is raised to 75°C, and the reaction is carried out for 5 hours. After the solution is filtered with a 0.1 μm Teflon membrane, the platinum catalyst is removed. After that, 15.6 g (0.487 mol) of methanol was added dropwise at room temperature for 30 minutes, and then the temperature was raised to 50℃ and reacted for an additional 2 hours. The reaction solution was distilled under reduced pressure to remove the solvent. 24 g (0.1 mol) of 6-Chlorohexyltrimethoxysilane thus obtained, 8 g (0.15 mol) of sodium methoxide (Aldrich), 187 ml (0.15 mol) of hydrogen sulfide THF solution (0.8 M concentration), and 100 ml of methanol were placed in an autoclave and the reaction was carried out at 100℃ for 2 hours. After cooling the reaction solution, 100 ml of hydrogen chloride in methanol (1.25 M concentration) was added dropwise at room temperature for 30 minutes, and the generated salt was filtered off and distilled under reduced pressure to obtain 23 g of compound 2-1.

[0485] (Compound 2-1)

[0486]

[0487] Synthesis Example 2-11 (Synthesis of Compound 2-2)

[0488] The same procedure was followed as in Synthesis Example 2-10, except that 9-Chloro-1-nonene (AK Scientific) 23.7 (0.147 mol) was used instead of 6-chloro-1-hexene.

[0489] (Compound 2-2)

[0490]

[0491] Synthesis Example 2-12 (Synthesis of Compound 2-3)

[0492] The same procedure was followed as in Synthesis Example 2-10, except that 30 g (0.147 mol) of 12-Chloro-1-dodecene (Atomax Chemicals) was used instead of 6-chloro-1-hexene.

[0493] (Compound 2-3)

[0494]

[0495] Synthesis Example 2-13 (Synthesis of Compound 2-4)

[0496] After removing platinum from Synthesis Example 2-10, the same procedure was followed, except that 22.4 g (0.487 mol) of ethanol (Aldrich) was used instead of the introduced methanol.

[0497] (Compound 2-4)

[0498]

[0499] Synthesis Example 2-14 (Synthesis of Compound 2-5)

[0500] After removing platinum from Synthesis Example 2-10, the same procedure was followed, except that 36 g (0.487 mol) of 1-butanol (Aldrich) was used instead of the introduced methanol.

[0501] (Compound 2-5)

[0502]

[0503] Synthesis Example 2-15 (Synthesis of Compound 2-6)

[0504] The same procedure was followed as in Synthesis Example 2-10, except that 18 g (0.147 mol) of dichloromethylsilane was used instead of trichlorosilane.

[0505] (Compound 2-6)

[0506]

[0507] Synthesis Example 2-16 (Synthesis of Binder 2-1)

[0508] In 360 g of the solution of Polymer 1-1 manufactured in Synthesis Example 2-3, 6.36 g (34 mmol) of KBM 803 (3-(Trimethoxysilyl)-1-propanethiol (Shinetsu Co.), the same as compound 2-7, was added, the temperature was raised to 60°C, and the mixture was stirred for 4 hours to obtain binder 2-1, a cardo-based binder resin with a silane group substituted like compound 2-7.

[0509] (Compound 2-7)

[0510]

[0511] Synthesis Examples 2-17 to 2-22 (Synthesis of Binder 2-2 to Binder 2-7)

[0512] Except that Polymer 1-2 to Polymer 1-7 described in Table 5 below were used instead of the solution of Polymer 1-1 in Synthesis Example 2-16, silane group-substituted cardo-based binder resins Binder 2-2 to Binder 2-7 were prepared in the same manner as in Synthesis Example 2-16.

[0513] Synthesis Example 2-16 (Binder 2-1) Synthesis Example 2-17 (Binder 2-2) Synthesis Example 2-18 (Binder 2-3) Synthesis Example 2-19 (Binder 2-4) Synthesis Example 2-20 (Binder 2-5) Synthesis Example 2-21 (Binder 2-6) Synthesis Example 2-22 (Binder 2-7) Polymer backbone Polymer 1-1 Polymer 1-2 Polymer 1-3 Polymer 1-4 Polymer 1-5 Polymer 1-6 Polymer 1-7 Silane group Compound 2-7 Compound 2-7 Compound 2-7 Compound 2-7 Compound 2-7 Compound 2-7 Solid content 34 % 34 % 34 % 34 % 34 % 34 % Weight Average molecular weight 4,880 g / mol 4,250 g / mol 4,680 g / mol 4,430 g / mol 4,140 g / mol 5,270 g / mol 3,320 g / mol

[0514] Synthesis Example 2-23 (Manufacture of Binder 2-8)

[0515] 8.1 g (34 mmol) of 6-(Trimethoxysilyl)-1-hexanethiol (compound 2-1) was added to 360 g of the solution of Polymer 1-1 manufactured in Synthesis Example 2-3, and the temperature was raised to 60°C, followed by stirring for 4 hours to obtain Binder 2-8, a cardo-based binder resin substituted with a silane group similar to that of compound 2-1.

[0516] Synthesis Examples 2-24 to 2-29 (Manufacture of Binder 2-9 to Binder 2-14)

[0517] Except that Polymer 1-2 to Polymer 1-7 described in Table 6 below were used instead of the solution of Polymer 1-1 in Synthesis Example 2-23, cardo-based binder resins Binder 2-9 to Binder 2-14 having a substituted silane group were manufactured in the same manner as in Synthesis Example 2-23.

[0518] Synthesis Example 2-23 (Binder 2-8) Synthesis Example 2-24 (Binder 2-9) Synthesis Example 2-25 (Binder 2-10) Synthesis Example 2-26 (Binder 2-11) Synthesis Example 2-27 (Binder 2-12) Synthesis Example 2-28 (Binder 2-13) Synthesis Example 2-29 (Binder 2-14) Polymer backbonePolymer 1-1Polymer 1-2Polymer 1-3Polymer 1-4Polymer 1-5Polymer 1-6Polymer 1-7Silane groupCompound 2-1Compound 2-1Compound 2-1Compound 2-1Compound 2-1Compound 2-1Solid content34 %34 %34 %34 %34 %34 %34 %Weight Average molecular weight 4,900 g / mol 4,280 g / mol 4,690 g / mol 4,470 g / mol 4,160 g / mol 5,290 g / mol 3,360 g / mol

[0519] Synthesis Example 2-30 (Manufacture of Binder 2-15)

[0520] 9.53 g (34 mmol) of 6-(Triethoxysilyl)-1-hexanethiol (compound 2-4) was added to 360 g of the solution of Polymer 1-1 manufactured in Synthesis Example 2-3, and the temperature was raised to 60°C, followed by stirring for 4 hours to obtain Binder 2-15, a cardo-based binder resin substituted with a silane group like compound 2-4.

[0521] Synthesis Examples 2-31 to 2-36 (Manufacture of Binder 2-16 to Binder 2-21)

[0522] Except that Polymer 1-2 to Polymer 1-7 described in Table 7 below were used instead of the solution of Polymer 1-1 in Synthesis Example 2-30, cardo-based binder resins Binder 2-16 to Binder 2-21 having a substituted silane group were prepared in the same manner as in Synthesis Example 2-30.

[0523] Synthesis Example 2-30 (Binder 2-15) Synthesis Example 2-31 (Binder 2-16) Synthesis Example 2-32 (Binder 2-17) Synthesis Example 2-33 (Binder 2-18) Synthesis Example 2-34 (Binder 2-19) Synthesis Example 2-35 (Binder 2-20) Synthesis Example 2-36 (Binder 2-21) Polymer backbonePolymer 1-1Polymer 1-2Polymer 1-3Polymer 1-4Polymer 1-5Polymer 1-6Polymer 1-7Silane groupCompound 2-4Compound 2-4Compound 2-4Compound 2-4Compound 2-4Compound 2-4Solid content34 %34 %34 %34 %34 %34 %34 %Weight average molecular weight4,900 g / mol4,290 g / mol4,690 g / mol4,480 g / mol4,180 g / mol5,290 g / mol3,380 g / mol

[0524] Manufacturing Example 1 (Manufacture of red pigment dispersion)

[0525] 15 g of Irgaphor Red BT-CF (red pigment / BASF), 8.5 g of Disperbyk 163 (BYK), and 6.5 g of the polymer solution obtained in Manufacturing Example 2 were dispersed in 70 g of propylene glycol methyl ether acetate and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) using a paint shaker (Asada) for 10 hours to obtain a dispersion.

[0526] Examples 1 to 11

[0527] A photosensitive composition was prepared with the composition shown in Tables 8 and 9 below.

[0528] Photosensitive composition Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Red pigment dispersion of Preparation Example 1 3030303030303030303030M600 (Miwon Corporation) 7777777777OXE-02 (BASF) 0.50.50.50.50.50.50.50.50.50.5 Hollow silica 13-3-3-3-3 Hollow silica 2-3-3-3-3-3 Binder 1-17 Binder 1-27 Binder 1-37 Binder 1-47 Binder 1-57 Binder 1-67 Binder 1-77 Binder 1-87 Binder 1-97 Binder 1-107 Propylene glycol methyl ether acetate (Daicel) 52.552.552.552.552.552.552.552.552.552.552.5

[0529] Photosensitive composition Example 11 Example 12 Example 13 Example 14 Example 15 Red pigment dispersion of Preparation Example 1 3030303030 M600 (Miwon Corporation) 77777 OXE-02 (BASF) 0.5 0.5 0.5 0.5 0.5 0.5 Hollow silica 13-3-3 Hollow silica 2-3-3 Binder 1-14 Binder 1-24 Binder 1-44 Binder 1-64 Binder 1-104 Binder 2-133 Binder 2-23 Binder 2-933 Propylene glycol methyl ether acetate (Daicel) 52.552.552.552.552.5

[0530] Comparative Examples 1 to 5

[0531] A photosensitive composition was prepared with the composition shown in Table 10 below.

[0532] Photosensitive composition Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Red pigment dispersion of Preparation Example 1 30303030303030 M600 (Miwon Corporation) 777777 OXE-02 (BASF) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Hollow silica 133 ---- Hollow silica 2 -- 3 33 3 Hollow silica 3 -- -- 3 Binder 1-117 4 Binder 1-127 4 Binder 1-137 Binder 2-13 Binder 2-233 Propylene glycol methyl ether acetate (Daicel) 52.552.552.552.552.552.5

[0533] The method for manufacturing a pattern using the composition prepared above is as follows (photolithography step).

[0534] (1) Application and film formation stage

[0535] The aforementioned red photosensitive resin composition was applied to a washed 10 cm x 10 cm ITO / Ag substrate using a spin coater to a thickness of 3 ㎛, and then heated at a temperature of 100°C for 1 minute to remove the solvent, thereby forming a coating film.

[0536] (2) Exposure stage

[0537] In order to form the required pattern on the obtained film, a mask of a predetermined shape was inserted, and then an active line of 190 nm to 500 nm was irradiated. The exposure device used was MA-6, and the exposure dose was 100 mJ / cm 2 was investigated.

[0538] (3) Phenomenon stage

[0539] Following the above exposure step, the film was developed by dipping in AZEM AX 300 MIF developer at 25°C for 1 minute, and then washed with water to dissolve and remove the unexposed portion, leaving only the exposed portion to form an image pattern.

[0540] (4) Post-processing stage

[0541] In order to obtain an image pattern obtained by the above phenomenon with excellent heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc., a post-baking process was performed in an oven at 100°C for 30 minutes.

[0542] (5) Measurement of the minimum pattern size above the description

[0543] The minimum pattern size of the patterns of the photosensitive compositions of Examples 1 to 15 and Comparative Examples 1 to 5 obtained through the above post-processing step was measured on the substrate using an optical microscope (Nikon).

[0544] (6) Outgas measurement

[0545] After forming a film on a glass substrate using the photosensitive compositions of Examples 1 to 15 and Comparative Examples 1 to 5 through steps (1) to (4) above, six specimens were prepared by cutting them into a size of 1 cm x 3 cm. The outgas was captured at 250°C for 30 minutes using JTD-505² from JAI. After measuring toluene black samples (100, 500, 1,000 ppm) using QP2020 GC / MS from Shimadzu, a calibration curve was created, and the amount of outgas generated from the captured samples was measured.

[0546] (7) Measurement of chemical resistance

[0547] The thickness of each pattern obtained through steps (1) to (4) above was measured for the photosensitive compositions of Examples 1 to 15 and Comparative Examples 1 to 5, and after placing them in propyl glycol methyl ether acetate at a temperature of 50°C for 5 minutes, the thickness of the pattern was measured and the change in thickness was observed to measure chemical resistance.

[0548] The outgassing amount of the patterns obtained through the above photolithography step and the maximum resolution of the pattern formed on the substrate (the minimum size pattern on the substrate) were measured and shown in Tables 11 to 13.

[0549] Photosensitive composition Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Minimum pattern size (㎛) 3.4 3.23.23.3 3.23.7 ​​3.6 3.7 3.6 3.7 Outgas generation amount (ppm) 2.4 2.5 2.4 2.22.12.6 2.8 2.4 2.12.2

[0550] Photosensitive composition Example 11 Example 12 Example 13 Example 14 Example 15 Minimum pattern size (㎛) on substrate 2.9 3.0 3.2 2.9 3.1 Outgas generation amount (ppm) 2.1 2.0 2.3 2.0 2.4

[0551] Photosensitive composition Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6 Minimum pattern size (㎛) on substrate 4.4 10.3 12.6 6.7 8.8 8.8 Outgas generation amount (ppm) 7.3 5.5 12.46.46.5 6.0

[0552] The chemical resistance measurement results of the patterns obtained through the above photolithography step are shown in Tables 14 to 16 below.

[0553] Photosensitive composition Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Thickness of pattern after post-treatment step (㎛) 2.5 2.5 2.5 2.5 3 2.5 1 2.5 4 2.5 3 2.5 2.5 2.5 2.5 2.5 0 2.5 2 Thickness of pattern after solvent immersion (㎛) (propyl glycol methyl ether acetate, 50℃, 5 min) 2.4 4 2.4 3 2.4 6 2.4 6 2.4 9 2.3 7 2.3 3 2.3 2.3 2.4 4 2.4 7 Thickness reduction after chemical resistance test (㎛) 0.08 0.09 0.07 0.05 0.05 0.16 0.19 0.2 0.06 0.05

[0554] Photosensitive composition Example 11 Example 12 Example 13 Example 14 Example 15 Thickness of pattern after post-treatment step (㎛) 2.53 2.54 2.52 2.50 2.53 Thickness of pattern after solvent immersion (㎛) (propyl glycol methyl ether acetate, 50℃, 5 min) 2.45 2.47 2.36 2.42 2.44 Thickness reduction after chemical resistance test (㎛) 0.08 0.07 0.16 0.08 0.09

[0555] Photosensitive composition Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Thickness of pattern after post-processing step (㎛) 2.53 2.54 2.54 2.53 2.52 2.52 Thickness of pattern after solvent immersion (㎛) (propyl glycol methyl ether acetate, 50℃, 5 min) 1.86 2.06 1.33 1.86 1.94 1.93 Thickness reduction after chemical resistance test (㎛) 0.67 0.48 1.21 0.67 0.58 0.59

[0556] In the case of Examples 1 to 10 using a copolymer resin including both the repeating unit represented by the chemical formula (1) and the repeating unit represented by the chemical formula (2) in Table 11, it can be confirmed that the minimum pattern size on the substrate is smaller, resulting in excellent resolution, and significantly less outgassing, compared to Comparative Example 1 or Comparative Example 2 using a copolymer resin including only one of the repeating unit represented by the chemical formula (1) and the repeating unit represented by the chemical formula (2) in Table 13, and Comparative Example 3 using a copolymer resin not including the repeating unit represented by the chemical formula (1) and the repeating unit represented by the chemical formula (2). It is believed that this is because, in the case of a copolymer resin including both the repeating unit represented by the chemical formula (1) and the repeating unit represented by the chemical formula (2), sufficient curing is achieved not only in the exposure process but also in the post-treatment process performed at 100°C or lower.

[0557] In addition, when comparing the chemical resistance of Examples 1 to 10 of Table 14 and Comparative Examples 1 to 3 of Table 16, it can be confirmed that in the case of Examples 1 to 10 using a copolymer resin including both a repeating unit represented by Chemical Formula (1) and a repeating unit represented by Chemical Formula (2), sufficient curing is achieved in the exposure process and the post-treatment process performed at 100°C or lower, resulting in little thickness reduction and excellent chemical resistance even after solvent immersion.

[0558] In Examples 11 to 15, in which a copolymer resin including both the repeating unit represented by Chemical Formula (1) and the repeating unit represented by Chemical Formula (2) in Table 12 and a resin including the repeating unit represented by Chemical Formula (5) were used together, compared to Comparative Examples 4 to 6, in which a copolymer resin including only one of the repeating unit represented by Chemical Formula (1) and the repeating unit represented by Chemical Formula (2) in Table 13 and a resin including the repeating unit represented by Chemical Formula (5) were used together, the minimum pattern size on the substrate was small, showing excellent resolution, and it was confirmed that the amount of outgas generated was significantly less.

[0559] In addition, when comparing the chemical resistance of Examples 11 to 15 and Comparative Examples 4 to 6 through Tables 15 and 16, it can be confirmed that in the case of Examples 11 to 15, which used both a copolymer resin including a repeating unit represented by Chemical Formula (1) and a repeating unit represented by Chemical Formula (2) and a resin including a repeating unit represented by Chemical Formula (5), sufficient curing was performed in the exposure process and the post-treatment process performed at 100°C or lower, resulting in excellent chemical resistance, compared to Comparative Examples 4 to 6.

[0560] (8) Optical density and reflectance evaluation

[0561] The composition was spin-coated on a glass substrate, pre-baked at about 100°C for 90 seconds, and applied to a thickness of about 1.2 μm. Then, after cooling to room temperature for 60 seconds, the entire surface was irradiated with ultraviolet rays of 30 mJ / cm2 using an ultra-high pressure mercury lamp to induce a photocuring reaction of the photosensitive portion. The exposed substrate was developed by spraying in a 0.043% KOH aqueous solution at room temperature, and then washed with a pure solvent for 60 seconds. After drying at room temperature, it was post-baked in a convection oven at 230°C for 30 minutes to obtain a full-surface specimen. After the formation of the specimen, the optical density was measured using an X-rite equipment, and the reflectance was measured using a CM-3700A (Konica Minolta) equipment, and the results are shown in Table 17 below.

[0562] (9) Resolution evaluation

[0563] The composition was spin-coated on a glass substrate and pre-heat-treated at about 100°C for 90 seconds to form a film having a thickness of about 1.3 μm. After cooling to room temperature for 60 seconds, 40 mJ / cm2 of ultraviolet light was irradiated on a mask having split pattern sizes using an ultra-high-pressure mercury lamp to induce a photocuring reaction in the photosensitive portion. The exposed substrate was developed by spraying in a 0.043% KOH aqueous solution at room temperature and then washed with a pure solvent for 60 seconds. After drying at room temperature, it was post-heat-treated in a convection oven at 230°C for 30 minutes to obtain a patterned specimen. After the specimen was formed, the resolution was measured using BX-51 (Olympus) equipment, and the results are shown in Table 17 below.

[0564] Optical density ( / ㎛) Reflectivity (%) Resolution (㎛) Example 1 ◎◎◎ Example 2 ◎◎◎ Example 3 ◎◎◎ Example 4 ◎◎◎ Example 5 ○○○ Example 6 ○◎○ Example 7 ○◎◎ Example 8 ◎◎◎ Example 9 ◎○◎ Example 10 ◎○○ Example 11 ○◎○ Example 12 ○◎○ Example 13 ○○◎ Example 14 ◎○◎ Example 15 ◎○◎ Comparative Example 1 △△○ Comparative Example 2 △△△ Comparative Example 3 △△△ Comparative Example 4 ○△○ Comparative Example 5 ○△△ Comparative Example 6 △△△

[0565] <Optical density, reflectance, and resolution evaluation criteria>

[0566] - Optical density: ◎(>4.5), ○(4.5≥x>4.2), △(≤4.2)

[0567] - Reflectance: ◎(<5.5), ○(5.9>x≥5.5), △(≥5.9)

[0568] - Resolution: ◎(<4), ○(7>x≥4), △(≥7)

[0569] From the above Table 17, it can be confirmed that in Examples 1 to 15 using the hollow silica particles and alkali-soluble resin of the present invention, the optical density is high and the reflectance is low, the minimum pattern size on the substrate is small, the resolution is excellent, and the amount of outgas generated is low compared to Comparative Example 6 using the alkali-soluble resin of the present invention but not including the hollow silica particles.

[0570] From the above Table 17, it can be confirmed that in Examples 1 to 15 using the hollow silica particles and alkali-soluble resin of the present invention, the optical density is high and the reflectance is low compared to Comparative Examples 1 to 5 including the hollow silica particles but not using the alkali-soluble resin of the present invention, and the minimum pattern size on the substrate is small, so that the resolution is excellent, and in particular, the amount of outgas generated is low.

[0571] The present invention is not limited to the above embodiments and can be manufactured in various different forms.

[0572] The above description is merely an example of the present invention, and those skilled in the art will appreciate that various modifications may be made without departing from the essential characteristics of the present invention.

[0573] Accordingly, the embodiments disclosed herein are intended to illustrate, rather than limit, the present invention, and the spirit and scope of the present invention are not limited by these embodiments. The scope of protection of the present invention should be interpreted by the claims, and all techniques within the scope equivalent thereto should be interpreted as being included within the scope of the present invention.

[0574] (Explanation of symbols)

[0575] 1: Substrate 2: TFT layer

[0576] 3: Flat layer 4: Pixel electrode

[0577] 5: Pixel defining film 6: Organic layer

[0578] 7: Counter electrode 8: Sealing layer

[0579] 9: Touch panel 10: Color section

[0580] 11: Color separation section

[0581] The present invention relates to a photosensitive composition and an organic light-emitting display device using the photosensitive composition.

Claims

1. (1) A copolymer resin comprising a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2); (2) Reactive unsaturated compounds; (3) Photoinitiator; (4) hollow silica particles; and (5) Photosensitive composition comprising a solvent: Chemical formula (1) Chemical formula (2) In the above chemical formula (1) and chemical formula (2), 1) * indicates the part where the combination is connected as a repeating unit, 2) R 1 and R 2 are independently hydrogen or C1~C 20 is an alkyl group, 3) L 1 and L 2 are independently a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene, 4) a and b are integers from 0 to 500, independently of each other. 5) X 1 C2~C containing oxygen atoms 30 is a heterocycle, 6) X 2 is the following chemical formula (2-1) or chemical formula (2-2), Chemical Formula (2-1) Chemical Formula (2-2) In the above chemical formula (2-1) and chemical formula (2-2), 6-1) * indicates the binding position, 6-2) L 20 is a single bond or C1~C 30 is alkylene, 6-3) R 4 is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 6-4) n is an integer from 1 to 10, 7) The above R 1 , R 2 , R 4 , X 1 , X 2 , L 1 , L 2 and L 20 are respectively deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

2. In the first paragraph, X in the repeating unit structure represented by the chemical formula (1) 1 A photosensitive composition characterized by having any one of the structures represented by the following chemical formulas (1-1) to (1-3): Chemical Formula (1-1) Chemical Formula (1-2) Chemical Formula (1-3) 3. A photosensitive composition according to claim 1, characterized in that the copolymer resin further comprises at least one of a repeating unit represented by chemical formula (3) and a repeating unit represented by chemical formula (4): Chemical formula (3) Chemical formula (4) In the above chemical formula (3) and chemical formula (4), 1) R 5 and R 6 are independently hydrogen or C1~C 20 is an alkyl group, 2) L 3 is a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene, 3) Ar 1 Silver C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C3~C 30 Cycloalkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 4) c and d are independent integers from 1 to 500.

4. In the third paragraph, Ar in the repeating unit structure represented by the chemical formula (3) 1 Silver C3~C 30 Cycloalkyl group or C6~C 30 A photosensitive composition characterized by an aryl group.

5. In the third paragraph, Ar in the repeating unit structure represented by the chemical formula (3) 1 A photosensitive composition characterized by having a structure represented by the following chemical formula (3-1) or chemical formula (3-2): Chemical Formula (3-1) Chemical Formula (3-2) 6. A photosensitive composition characterized in that, in the third paragraph, when the total repeating unit of the copolymer resin is assumed to be 100 mol%, the repeating unit represented by chemical formula (1) is 5 to 20 mol%; the repeating unit represented by chemical formula (2) is 5 to 20 mol%; the repeating unit represented by chemical formula (3) is 20 to 50 mol%; and the repeating unit represented by chemical formula (4) is 20 to 50 mol%.

7. A photosensitive composition according to claim 1 or 3, characterized in that the weight average molecular weight of the copolymer resin is 1,000 to 100,000 g / mol.

8. A photosensitive composition according to claim 1, characterized in that the total amount of the copolymer resin is 3 to 70 wt% based on the total amount of the photosensitive resin composition.

9. A photosensitive composition according to claim 1, wherein the size of the hollow silica particles is 30 nm to 450 nm.

10. A photosensitive composition according to claim 1, characterized in that the hollow silica particles in the photosensitive composition are contained in an amount of 0.1% to 20% by weight based on the solid content excluding the solvent.

11. A photosensitive composition according to claim 1, wherein the hollow silica particles have a refractive index of 1.10 to 1.

41.

12. A photosensitive composition according to claim 1, wherein the porosity of the hollow silica particles is 20 to 95 volume%.

13. A photosensitive composition according to claim 1, wherein the hollow silica particles have a sphericity of 1.05 to 1.

5.

14. In the first paragraph, the specific surface area of ​​the hollow silica particles is 10 to 2000 m 2 A photosensitive composition characterized by being / g.

15. A photosensitive composition according to claim 1, wherein the alkali-soluble resin further comprises a resin including a repeating unit represented by chemical formula (5) in addition to the copolymer resin of claim 1: Chemical formula (5) In the above chemical formula (5), 1) * indicates the part where the combination is connected as a repeating unit, 2) R 7 and R 8 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 3) R 7 and R 8 Each adjacent tile can form a ring, 4) e and f are integers from 0 to 4, independently of each other. 5) Y 1 is a single bond, O, CO, SO2, CR'R", SiR'R", chemical formula (A) or chemical formula (B), 5-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 5-2) R' and R" can each form adjacent tile rings, Chemical formula (A) Chemical formula (B) In the above chemical formula (A) and chemical formula (B), 5-3) * indicates the binding position, 5-4) Y 3 is O, S, SO2 or NR', 5-5) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 5-6) R 9 ~R 12 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 5-7) R 9 ~R 12 Each adjacent tile can form a ring, 5-8) g~j are integers from 0 to 4, independently of each other, 6) Y 2 is a fluorenyl group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof, 7) A 1 and A 2 are independently of each other chemical formula (C) or chemical formula (D), Chemical formula (C) Chemical formula (D) In the above chemical formula (C) and chemical formula (D), 7-1) * indicates the binding position, 7-2) R 13 ~R 16 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 7-3) Z 1 and Z 2 are independently of each other chemical formula (E) or chemical formula (F), Chemical formula (E) Chemical formula (F) 7-3-1) * indicates the bonding position, 7-3-2) R 17 ~R 21 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 7-3-3) L 4 ~L 6 are independently a single bond, fluorenylene group, C1~C 30 alkylene, C6~C 30 Arylene, C2~C 30 Heterocyclic ring or C1~C 30 is an alkoxylene, 7-3-4) k and l are independent integers from 0 to 3; provided that k+l= 3, 8) In a resin containing a repeating unit represented by chemical formula (5), the ratio of chemical formula (C) and chemical formula (D) is 1:9 to 9:1, 9) The above R 7 ~R 21 , R', R", Y 1 ~Y 3 and L 4 ~L 6 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

16. A photosensitive composition in claim 15, wherein the weight average molecular weight of the resin including the repeating unit represented by the chemical formula (5) is 1,000 to 100,000 g / mol.

17. A photosensitive composition according to claim 15, wherein the weight ratio of the copolymer resin of claim 1 and the resin containing the repeating unit represented by the chemical formula (5) among the alkali-soluble resins is 7:3 to 3:

7.

18. A photosensitive composition according to claim 1, characterized in that the reactive unsaturated compound is contained in an amount of 1 to 50 wt% based on the total amount of the photosensitive composition.

19. A photosensitive composition according to claim 1, characterized in that the photoinitiator is contained in an amount of 0.01 to 10 wt% based on the total amount of the photosensitive composition.

20. A photosensitive composition according to claim 1, characterized in that a colorant is additionally included.

21. A photosensitive composition according to claim 1, characterized in that the colorant comprises at least one of an inorganic pigment and an organic pigment.

22. A photosensitive composition according to claim 1, characterized in that the colorant is contained in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

23. A photosensitive composition according to claim 1, characterized in that the colorant is pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

24. A photosensitive composition according to claim 1, characterized in that the average particle diameter of the colorant is 5 nm to 200 nm.

25. A pattern or film formed with a photosensitive composition according to paragraph 1.

26. An organic light-emitting display device comprising a pattern or film according to Article 25.

27. An organic light-emitting display device according to claim 26, characterized in that at least one of a flat layer, an organic light-emitting element layer, a sealing layer, a touch panel, and a color filter includes the pattern or film.

28. An electronic device including a display device of Article 26 and a control unit for driving the display device.

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