Thermal management system and vehicle

Abstract

A thermal management system (400) and a vehicle (1000), relating to the technical field of thermal management. The vehicle (1000) comprises the thermal management system (400). The thermal management system (400) comprises a thermal management structure (11), a first water pump (121), a second water pump (122), a first cooler (21), and a condenser (22); the first water pump (121), the second water pump (122), the first cooler (21), and the condenser (22) are all mounted on the thermal management structure (11); the thermal management structure (11) is internally provided with a first flow channel (101) and a second flow channel (102), and the thermal management structure (11) is provided with a first connecting portion (1111), a second connecting portion (1112), a third connecting portion (1113), and a fourth connecting portion (1114); the first water pump (121), the first cooler (21), the first connecting portion (1111), and the second connecting portion (1112) are all communicated with the first flow channel (101), and the second water pump (122), the condenser (22), the third connecting portion (1113), and the fourth connecting portion (1114) are all communicated with the second flow channel (102); a first connecting pipe is connected between an outlet of the condenser (22) and an inlet of the first cooler (21), a first connection port (24) is connected to an inlet of the condenser (22), and a second connection port (2621) is connected to an outlet of the first cooler (21). In this way, the layout rationality and compactness of the thermal management system (400) can be improved, and the size of the thermal management system (400) can be reduced.

Description

Heat management system and vehicle

[0001] Cross-reference to related applications

[0002] The present application claims priority from the Chinese patent application No. 202421958796.7 filed on August 13, 2024, and entitled "Heat management system and vehicle", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application belongs to the technical field of heat management, and more particularly relates to a heat management system and a vehicle. BACKGROUND

[0004] In the related art, a heat management system usually includes devices such as a cooler, a condenser, and a water pump. The large number of devices makes it difficult to reasonably arrange the multiple devices of the heat management system, resulting in a large volume of the heat management system, a large occupied space, and a low space utilization rate of the vehicle. SUMMARY

[0005] In view of the above problems, the purpose of the embodiments of the present application is to provide a heat management system and a vehicle, which can improve the layout rationality of the heat management system.

[0006] The technical solution adopted by the embodiments of the present application is as follows:

[0007] In a first aspect, the embodiments of the present application provide a heat management system, which comprises a heat management structure, a first water pump, a second water pump, a first cooler, and a condenser. The first water pump, the second water pump, the first cooler, and the condenser are all installed on the heat management structure. The heat management structure is provided with a first flow channel and a second flow channel, and the heat management structure is provided with a first connecting part, a second connecting part, a third connecting part, and a fourth connecting part. The first water pump, the first cooler, the first connecting part, and the second connecting part are all communicated with the first flow channel, and the second water pump, the condenser, the third connecting part, and the fourth connecting part are all communicated with the second flow channel. A first connecting pipe is connected between the outlet of the condenser and the inlet of the first cooler, the inlet of the condenser is connected with a first interface, and the outlet of the first cooler is connected with a second interface.

[0008] The heat management system provided by the embodiments of the present application has the first water pump, the second water pump, the first cooler and the condenser all mounted on the heat management structure, and the first flow channel and the second flow channel are arranged in the heat management structure, the first water pump and the first cooler are both communicated with the first flow channel in the heat management structure, so that the first cooling liquid circuit can be formed. The second water pump and the condenser are both communicated with the second flow channel in the heat management structure, so that the second cooling liquid circuit can also be formed. The outlet of the condenser and the inlet of the first cooler are connected by the first connecting pipe, so that the refrigerant circuit can be formed. In this way, the first water pump, the second water pump, the first cooler and the condenser are integrated on the heat management structure, the layout rationality and compactness of the first water pump, the second water pump, the first cooler and the condenser are improved, and the design of the pipelines for forming multiple cooling liquid circuits is saved, so as to help reduce the volume and the occupied space of the heat management system, and improve the space utilization of the vehicle.

[0009] In some embodiments, the heat management system further comprises a liquid storage dryer mounted on the heat management structure, the inlet of the liquid storage dryer is communicated with the outlet of the condenser, and the outlet of the liquid storage dryer and the inlet of the first cooler are connected by the first connecting pipe.

[0010] By mounting the liquid storage dryer on the heat management structure, and connecting the outlet of the liquid storage dryer and the inlet of the first cooler by the first connecting pipe, the liquid storage dryer can be integrated on the heat management structure, which helps to improve the layout compactness of the heat management system, so as to reduce the volume of the heat management system.

[0011] In some embodiments, at least part of the liquid storage dryer is arranged between the condenser and the first cooler along the distribution direction of the condenser and the first cooler.

[0012] By arranging at least part of the liquid storage dryer between the condenser and the first cooler, the condenser, the liquid storage dryer and the first cooler can be distributed along the flow direction of the refrigerant, so that the layout of the condenser, the liquid storage dryer and the first cooler on the heat management structure is very reasonable, which helps to improve the layout compactness of the condenser, the liquid storage dryer and the first cooler, so as to help reduce the volume of the heat management system.

[0013] In some embodiments, the inlet of the liquid storage dryer is mounted on the outlet of the condenser to realize the communication.

[0014] In this way, the design of the refrigerant flow channel plate and the pipeline for realizing the communication between the liquid storage dryer and the condenser can be saved, so that the compactness of the liquid storage dryer and the condenser can be improved, which helps to reduce the volume of the heat management system.

[0015] In some embodiments, the heat management system further comprises a valve island structure, the valve island structure comprising a first valve island part and a second valve island part, the first valve island part and the second valve island part are both mounted on the first cooler; the first valve island part is communicated with the inlet of the first cooler, and the first valve island part and the outlet of the condenser are communicated through a first connecting pipe; the second valve island part is communicated with the outlet of the first cooler, and a second interface is arranged on the second valve island part.

[0016] By arranging the valve island structure, the first connecting pipe is connected between the first valve island part and the outlet of the condenser, and the second interface is arranged on the second valve island part, so that the connection of the devices in the refrigerant circuit is facilitated, and the design of the pipeline can be saved, thereby simplifying the structure of the heat management system.

[0017] In some embodiments, the heat management system further comprises a first valve body, the first valve body is mounted on the first valve island part and communicated between the first connecting pipe and the inlet of the first cooler.

[0018] By mounting the first valve island part on the first cooler and mounting the first valve body on the first valve island part, the first valve body does not occupy the space between the condenser and the first cooler, which helps to improve the compactness of the layout of the devices in the refrigerant circuit, thereby helping to reduce the volume of the heat management system.

[0019] In some embodiments, the heat management system further comprises a second connecting pipe;

[0020] The second connecting pipe is mounted on the first valve island part and communicated with the first valve body through the first valve island part; or the second connecting pipe is communicated between the outlet of the condenser and the first connecting pipe; or the second connecting pipe is connected to the first interface.

[0021] By arranging the second connecting pipe, the refrigerant can be injected into the refrigerant circuit through the second connecting pipe without passing through the refrigerant flow channel plate, which helps to reduce the volume of the heat management system.

[0022] In some embodiments, a third interface is arranged on the first valve island part; the heat management system further comprises a second valve body, the second valve body is mounted on the first valve island part and communicated between the first connecting pipe and the third interface through the first valve island part; a fourth interface is arranged on the second valve island part, and the fourth interface is communicated with the second interface through the second valve island part.

[0023] By mounting the first valve island part on the first cooler and mounting the second valve body on the first valve island part, the second valve body does not occupy the space between the condenser and the first cooler, which helps to improve the compactness of the layout of the devices in the refrigerant circuit, thereby helping to reduce the volume of the heat management system.

[0024] In some embodiments, the first valve body and / or the second valve body comprises an expansion valve.

[0025] In this way, the first valve body can throttle and depress the refrigerant from the first connecting pipe, so as to facilitate the refrigerant to cool the coolant in the first cooler. And / or, the second valve body can throttle and depress the refrigerant from the first connecting pipe, so as to facilitate the refrigerant to cool in the evaporator.

[0026] In some embodiments, the thermal management system further comprises a third connecting pipe, which is mounted on the first valve body island and is communicated with the third interface through the first valve island.

[0027] By arranging the third connecting pipe, the refrigerant can be injected into the refrigerant circuit through the third connecting pipe without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system.

[0028] In some embodiments, the thermal management structure comprises:

[0029] The thermal management component is internally provided with the first flow channel and the second flow channel, and is provided with the first connecting part, the second connecting part, the third connecting part and the fourth connecting part; the first water pump and the second water pump are both mounted on the thermal management component.

[0030] The mounting frame is mounted on the thermal management component, and the first cooler and the condenser are both mounted on the mounting frame.

[0031] By arranging the thermal management structure to comprise the thermal management component and the mounting frame, the refrigerant side part can be mounted on the mounting frame, which facilitates the integration of multiple devices in the thermal management system, so as to improve the layout rationality of the thermal management system and reduce the volume of the thermal management system.

[0032] In some embodiments, at least part of the mounting frame is mounted on one side of the thermal management component, and the first water pump and the second water pump are both mounted on the other side of the thermal management component.

[0033] In this way, the layout of each device in the thermal management system is more reasonable and compact, which helps to reduce the volume of the thermal management system.

[0034] In some embodiments, the mounting frame is provided with a support for mounting on an external device.

[0035] In this way, the thermal management system can be mounted on the external device.

[0036] In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first flow channel and the second flow channel.

[0037] By detachably connecting the water tank to the mounting frame, the position of the water tank can be very flexible, which facilitates the arrangement of the thermal management system in the vehicle. In some embodiments, the thermal management system further comprises a water tank, which is detachably mounted on the mounting frame, and the water tank is communicated with the first

[0038] In some embodiments, the heat management structure is provided with a fifth interface, the fifth interface is communicated with the first flow channel and the second flow channel, and the fifth interface is used for connecting the water tank.

[0039] By communicating with the first flow channel and the second flow channel through the fifth interface, and connecting the water tank through the fifth interface, the cooling liquid in the water tank can be directly or indirectly injected into the first flow channel and the second flow channel through the fifth interface, so that multiple water tanks do not need to be arranged for multiple flow channels, and multiple injection operations do not need to be sequentially performed, so that the cooling liquid can be conveniently injected into the first flow channel and the second flow channel.

[0040] In some embodiments, the heat management system further comprises a water tank, the water tank is communicated with the first flow channel and the second flow channel, and the water tank is provided with a plurality of spaced apart exhaust ports.

[0041] By arranging a plurality of exhaust ports, the exhaust efficiency of the heat management system can be improved.

[0042] In some embodiments, the heat management structure is further provided with a fifth connecting portion and a sixth connecting portion, the fifth connecting portion and the sixth connecting portion are both communicated with the first flow channel, and are used for respectively communicating with the heating device.

[0043] By adopting the above technical solution, the heat management system can perform heat management operations of heating and cooling.

[0044] In some embodiments, the heat management structure is further provided with a third flow channel, and the heat management structure is further provided with a seventh connecting portion and an eighth connecting portion; the heat management system further comprises a third water pump, the third water pump is installed on the heat management structure, and the third water pump, the seventh connecting portion and the eighth connecting portion are all communicated with the third flow channel.

[0045] The third flow channel is communicated with the first cooler; or the third flow channel is communicated with the condenser, and the heat management structure is further provided with a ninth connecting portion and a tenth connecting portion, the ninth connecting portion and the tenth connecting portion are used for respectively connecting the second cooler.

[0046] By adopting the above technical solution, the heat management system can form a third cooling liquid circuit, so that at least three cooling liquid circuits can be formed in the heat management system to perform heat management on different devices requiring heat management.

[0047] In some embodiments, the heat management structure is provided with a sixth interface and a seventh interface, the sixth interface and the seventh interface are both communicated with the second flow channel; the condenser is communicated with the sixth interface and the seventh interface to be communicated with the second flow channel; the heat management structure is provided with a first mounting portion communicated with the second flow channel and the third flow channel, the first mounting portion is installed with a third valve body, the third flow channel is communicated with the seventh interface through the third valve body, and the third flow channel is also communicated with the sixth interface.

[0048] And / or, the heat management structure is provided with a second mounting portion in communication with the first flow channel and the third flow channel, and the fourth valve body is mounted on the second mounting portion.

[0049] By adopting the technical scheme, the cooling liquid can flow between the second flow channel and the third flow channel, and / or flow between the first flow channel and the third flow channel, so that the cooling liquid in the water tank can enter the first flow channel, the second flow channel and the third flow channel, and the cooling liquid in the three cooling liquid circuits can circulate smoothly, thereby performing corresponding heat management work.

[0050] In some embodiments, the heat management structure is further provided with a third mounting portion in communication with the first flow channel and the third flow channel, and the fifth valve body is mounted on the third mounting portion, and the first cooler is in communication between the fourth valve body and the fifth valve body.

[0051] In this way, the flow of the cooling liquid in the first flow channel and the third flow channel can be controlled, thereby facilitating the realization of multiple heat management modes of the heat management system.

[0052] In a second aspect, the embodiments of the present application provide a vehicle.

[0053] The vehicle provided by the embodiments of the present application can improve the rationality and compactness of the layout of the heat management system by adopting the heat management system related by the above embodiments, which helps to reduce the volume and occupied space of the heat management system, thereby improving the space utilization of the vehicle.

[0054] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the embodiments of the present application can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following will describe the specific embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0055] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or exemplary technical description, obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0056] Fig. 1 is a schematic view of a vehicle provided by some embodiments of the present application;

[0057] Fig. 2 is a schematic view of a heat management system provided by some embodiments of the present application;

[0058] Fig. 3 is a partial schematic view of a heat management system provided by some embodiments of the present application;

[0059] FIG. 4 is a partial perspective view of a thermal management system according to some embodiments of the present application;

[0060] FIG. 5 is an enlarged view of A in FIG. 4;

[0061] FIG. 6 is a perspective view of a thermal management component of a thermal management system according to some embodiments of the present application;

[0062] FIG. 7 is a perspective view of a thermal management component of a thermal management system according to some embodiments of the present application;

[0063] FIG. 8 is a perspective view of a mounting frame of a thermal management system according to some embodiments of the present application;

[0064] FIG. 9 is a perspective view of a water tank of a thermal management system according to some embodiments of the present application.

[0065] In the drawings, reference 1000 denotes a vehicle, 100 a battery, 200 a controller, 300 an electric motor, 400 a thermal management system, 10 a coolant side portion, 101 a first flow channel, 102 a second flow channel, 103 a third flow channel, 11 a thermal management structure, 111 a thermal management component, 1111 a first connecting portion, 1112 a second connecting portion, 1113 a third connecting portion, 1114 a fourth connecting portion, 1115 a fifth connecting portion, 1116 a sixth connecting portion, 1117 a seventh connecting portion, 1118 an eighth connecting portion, 1119 a ninth connecting portion, 1120 a tenth connecting portion, 1121 a fifth interface, 1122 a sixth interface, 1123 a seventh interface, 1124 a first mounting portion, 1125 a second mounting portion, 1126 a third mounting portion, 1127 a ninth interface, 1128 a tenth interface, 1129 a fourth mounting portion, 1130 a fifth mounting portion, 1131 a sixth mounting portion, 112 a mounting frame, 11021 a frame body, 11022 a support, 12 a water pump assembly, 121 a first water pump, 122 a second water pump, 123 a third water pump, 13 a water tank, 1301 an eighth interface, 1302 an exhaust port, 14 a second cooler, 15 a valve assembly, 151 a third valve body, 152 a fourth valve body, 153 a fifth valve body, 16 a heating device, 20 a refrigerant side portion, 21 a first cooler, 22 a condenser, 23 a piping assembly, 231 a second connecting pipe, 232 a third connecting pipe, 24 a first interface, 25 a liquid accumulator dryer, 26 a valve island structure, 261 a first valve island portion, 2611 a third interface, 262 a second valve island portion, 2621 a second interface, 2622 a fourth interface, 27 a first valve body, 28 a second valve body, 29 a compressor, 30 a heater core, and 40 an evaporator. DETAILED DESCRIPTION

[0066] The embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components have the same or similar designations and functions throughout. The embodiments described below are exemplary and are intended to explain the present application, and are not to be understood to limit the present application.

[0067] In the description of the present application, it is to be understood that the orientations or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are merely intended to facilitate the description of the present application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0068] In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0069] In the description of the present application, the meaning of "multiple" is more than two, and "more than two" includes two, unless otherwise explicitly specified and limited. Accordingly, the meaning of "multiple groups" is more than two groups, including two groups.

[0070] In the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0071] In the description of the present application, the term "and / or" is merely a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the existence of A, the existence of A and B, and the existence of B. In addition, in the present application, the character " / ", generally represents that the front and rear associated objects have an "or" relationship.

[0072] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "adjacent", "adjacent to" refer to close in position. For example, there are three components A1, A2 and B, the distance between A1 and B is greater than the distance between A2 and B, then A2 is closer to B than A1, that is, A2 is adjacent to B, and it can also be said that B is adjacent to A2, in other words, A2 is adjacent to B. For another example, when there are multiple C components, the multiple C components are C1, C2, CN respectively, when one of the C components, such as C2, is closer to the B component than the other C components, then B is adjacent to C2, and it can also be said that C2 is adjacent to B, in other words, C2 is adjacent to B.

[0073] Although the present application has been described with reference to the preferred embodiments, various improvements can be made thereto without departing from the scope of the application, and equivalent substitutions can be made thereto. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0074] In the related art, a thermal management system can generally include a cooler, a condenser, a water pump and the like, and the devices are relatively numerous, which makes it difficult to reasonably arrange the devices of the thermal management system, so that the thermal management system has a large volume and occupies a large space, resulting in a low space utilization rate of the vehicle.

[0075] In some cases, the devices of the thermal management system are generally arranged in a scattered manner, which makes the integration of the thermal management system low, resulting in a large volume of the thermal management system. Moreover, when the devices are arranged in a scattered manner, the devices are generally connected by pipelines, and a plurality of cooling liquid circuits are generally formed in the thermal management system, which makes the pipelines on the thermal management system very numerous and disordered, and a large space is required, so that the thermal management system has a large volume.

[0076] Based on the above considerations, the embodiment of the present application provides a thermal management system and a vehicle. The first water pump, the second water pump, the first cooler and the condenser are all installed on the thermal management structure, and the first flow channel and the second flow channel are arranged in the thermal management structure. The first water pump and the first cooler are both communicated with the first flow channel in the thermal management structure, so that the first cooling liquid circuit can be formed. The second water pump and the condenser are both communicated with the second flow channel in the thermal management structure, so that the second cooling liquid circuit can also be formed. The outlet of the condenser and the inlet of the first cooler are connected by the first connecting pipe, so that the refrigerant circuit can be formed. In this way, the first water pump, the second water pump, the first cooler and the condenser are integrated on the thermal management structure, the layout rationality and compactness of the first water pump, the second water pump, the first cooler and the condenser are improved, and the design of the pipelines for forming multiple cooling liquid circuits is saved, thereby helping to reduce the volume and the occupied space of the thermal management system, and improving the space utilization of the vehicle.

[0077] The thermal management system provided by the embodiment of the present application can be applied to a vehicle, and is used for thermal management of at least one device or space in a battery, an electric machine, a passenger cabin of the vehicle, etc.

[0078] The vehicle can be a fuel automobile, a gas automobile or a new energy automobile according to the power source, and the new energy automobile can be a pure electric automobile, a hybrid automobile or a range extended automobile, etc. The vehicle can be a front drive automobile, a rear drive automobile or a four-wheel drive automobile according to the driving mode.

[0079] The thermal management system provided by the embodiment of the present application can also be applied to other devices except the vehicle, so as to perform thermal management on a device or space to be managed in the other device.

[0080] In some embodiments, referring to FIG. 1, which is a schematic diagram of a vehicle 1000 provided by some embodiments of the present application. The vehicle 1000 is internally provided with a battery 100, which can be arranged at the bottom, the head or the tail of the vehicle 1000. The battery 100 can be used for power supply of the vehicle 1000, for example, the battery 100 can be used as an operating power supply of the vehicle 1000.

[0081] In some embodiments, referring to FIG. 1, the vehicle 1000 can further include a controller 200 and an electric machine 300, the controller 200 being used to control the battery 100 to supply power to the electric machine 300, for example, to meet the power demand of the vehicle 1000 during starting, navigation and driving.

[0082] In some embodiments, the battery 100 can not only be used as an operating power supply of the vehicle 1000, but also be used as a driving power supply of the vehicle 1000, instead of or partially instead of fuel or natural gas to provide driving power for the vehicle 1000.

[0083] The battery 100 can be a single physical module including one or more battery cells to provide higher voltage and capacity. When there are multiple battery cells, the multiple battery cells are connected in series, in parallel, or in a mixed connection, which means that the multiple battery cells are connected in both series and parallel.

[0084] In some embodiments, the battery 100 can be a battery module. When there are multiple battery cells, the multiple battery cells are arranged and fixed to form a battery module.

[0085] In some embodiments, the battery 100 can be a battery pack, which can include a case and battery cells. As an example, the battery cells can be directly accommodated in the case. As an example, the battery cells can also be first formed into a battery module and then accommodated in the case.

[0086] As an example, the multiple battery cells can be fixed to form a battery module by a cable tie or the like.

[0087] As an example, the multiple battery cells can also be fixed to form a battery module by an end plate, a side plate, or the like.

[0088] A battery cell refers to the smallest unit that stores and outputs electric energy. The battery cell can be a secondary battery or a primary battery. The battery cell can be, but is not limited to, a metal battery, a lithium-sulfur battery, a sodium-ion battery, or a magnesium-ion battery. The battery cell can have a cylindrical shape, a flat shape, a cuboid shape, or other shapes.

[0089] Please refer to FIG. 2 to FIG. 7, and combine with other drawings. FIG. 2 is a schematic diagram of a thermal management system 400 according to some embodiments of the present application, FIG. 3 is a partial schematic diagram of the thermal management system 400 according to some embodiments of the present application, FIG. 4 is a partial perspective structural diagram of the thermal management system 400 according to some embodiments of the present application, FIG. 5 is an enlarged view of A in FIG. 4, FIG. 6 is a perspective structural diagram 1 of a thermal management component 111 of the thermal management system 400 according to some embodiments of the present application, and FIG. 7 is a perspective structural diagram 2 of the thermal management component 111 of the thermal management system 400 according to some embodiments of the present application. The thermal management system 400 according to some embodiments of the present application comprises a thermal management structure 11, a first water pump 121, a second water pump 122, a first cooler 21, and a condenser 22, and the first water pump 121, the second water pump 122, the first cooler 21, and the condenser 22 are all mounted on the thermal management structure 11. The thermal management structure 11 is provided with a first flow channel 101 and a second flow channel 102, and the thermal management structure 11 is provided with a first connecting portion 1111, a second connecting portion 1112, a third connecting portion 1113, and a fourth connecting portion 1114. The first water pump 121, the first cooler 21, the first connecting portion 1111, and the second connecting portion 1112 are all communicated with the first flow channel 101, and the second water pump 122, the condenser 22, the third connecting portion 1113, and the fourth connecting portion 1114 are all communicated with the second flow channel 102. A first connecting pipe is connected between an outlet of the condenser 22 and an inlet of the first cooler 21, a first interface 24 is connected to an inlet of the condenser 22, and a second interface 2621 is connected to an outlet of the first cooler 21.

[0090] It should be noted that the thermal management system 400 can comprise a coolant side part 10 and a refrigerant side part 20. The coolant side part 10 can comprise the above-mentioned thermal management structure 11, the first water pump 121, and the second water pump 122, and the refrigerant side part 20 can comprise the above-mentioned first cooler 21 and the condenser 22.

[0091] The thermal management structure 11 refers to a structure provided with a flow channel. The flow channel provided in the thermal management structure 11 can be divided into the first flow channel 101 and the second flow channel 102, and the first flow channel 101 and the second flow channel 102 are both passages inside the thermal management structure 11. Specifically, the first flow channel 101 and the second flow channel 102 are both used for passing coolant.

[0092] The first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, and the fourth connecting portion 1114 are all connecting portions on the thermal management structure 11, and are used for connecting devices that need to be thermally managed, which can be but are not limited to the battery 100, the motor 300, the heater core 30, and the like.

[0093] The first water pump 121 and the second water pump 122 are both water pumps, which refer to machines for conveying liquid. Specifically, the first water pump 121 and the second water pump 122 are both used for conveying coolant. Among them, the first water pump 121 is communicated with the first flow channel 101, which means that the inlet of the first water pump 121 and the outlet of the first water pump 121 are both communicated with the first flow channel 101. The second water pump 122 is communicated with the second flow channel 102, which means that the inlet of the second water pump 122 and the outlet of the second water pump 122 are both communicated with the second flow channel 102.

[0094] The first cooler 21 belongs to one of the heat exchangers, which is used for cooling liquid. Specifically, the first cooler 21 is used for cooling coolant. Among them, the first cooler 21 can be a shell-and-tube cooler, a plate cooler, etc.

[0095] It should be noted that the fourth flow channel and the fifth flow channel are provided in the first cooler 21 and are isolated from each other. The first cooler 21 is communicated with the first flow channel 101, which means that the inlet of the fourth flow channel and the outlet of the fourth flow channel are both communicated with the first flow channel 101.

[0096] The condenser 22 belongs to one of the heat exchangers, which can convert gas or vapor into liquid during work. Specifically, the condenser 22 will release heat during work, so that the coolant can be warmed up. Among them, the condenser 22 can be a shell-and-tube condenser 22, a plate condenser 22, etc.

[0097] It should be noted that the sixth flow channel and the seventh flow channel are provided in the condenser 22 and are isolated from each other. The condenser 22 is communicated with the second flow channel 102, which means that the inlet of the sixth flow channel and the outlet of the sixth flow channel are both communicated with the second flow channel 102.

[0098] The outlet of the condenser 22 and the inlet of the first cooler 21 are connected by a first connecting pipe, which means that the outlet of the seventh flow channel and the inlet of the fifth flow channel are connected by a first connecting pipe, that is, the opposite ends of the first connecting pipe can be connected to the outlet of the seventh flow channel and the inlet of the fifth flow channel, respectively. In this way, the outlet of the seventh flow channel and the inlet of the fifth flow channel can be communicated through the first connecting pipe. Among them, the first connecting pipe is a pipe structure.

[0099] The inlet of the condenser 22 is connected with a first interface 24, which means that the first interface 24 is connected to the inlet of the seventh flow channel, so that the first interface 24 can be communicated with the seventh flow channel through the inlet of the seventh flow channel.

[0100] The outlet of the first cooler 21 is connected with a second interface 2621, which means that the second interface 2621 is connected to the outlet of the fifth flow channel, so that the second interface 2621 can be communicated with the fifth flow channel through the outlet of the fifth flow channel.

[0101] It can be understood that, in each embodiment of the present application, unless otherwise specified, the inlet of the condenser 22 is the inlet of the seventh flow channel of the condenser 22, the outlet of the condenser 22 is the outlet of the seventh flow channel of the condenser 22, the inlet of the first cooler 21 is the inlet of the fifth flow channel of the first cooler 21, and the outlet of the first cooler 21 is the outlet of the fifth flow channel of the first cooler 21.

[0102] The first interface 24 and the second interface 2621 can be connected to the compressor 29, but are not limited to this. As an example, as shown in FIG. 2 and in combination with other figures, the first interface 24 is connected to the outlet of the compressor 29, and the second interface 2621 is connected to the inlet of the compressor 29.

[0103] Based on this, the first water pump 121 and the first cooler 21 are both connected to the first flow channel 101 in the thermal management structure 11, so that the first cooling liquid circuit can be formed. As an example, as shown in FIG. 2 and in combination with other figures, the first connecting part 1111 is connected to the inlet of the battery 100, and the second connecting part 1112 is connected to the outlet of the battery 100, so that the first water pump 121, the first cooler 21 and the battery 100 can form the first cooling liquid circuit. Among them, the first flow channel 101 is a flow channel in the first cooling liquid circuit. In this way, under the pumping action of the first water pump 121, the cooling liquid in the fourth flow channel of the first cooler 21 can flow from the outlet of the fourth flow channel to the battery 100, and then return to the fourth flow channel through the inlet of the fourth flow channel, so as to realize the circulation of the cooling liquid, and the cooling liquid can perform cooling, heating and other thermal management operations on the battery 100 during the circulation.

[0104] The second water pump 122 and the condenser 22 are both connected to the second flow channel 102 in the thermal management structure 11, so that the second cooling liquid circuit can be formed. As an example, as shown in FIG. 2 and in combination with other figures, the third connecting part 1113 is connected to the inlet of the heater core 30, and the fourth connecting part 1114 is connected to the outlet of the heater core 30, so that the second water pump 122, the condenser 22 and the heater core 30 can form the second cooling liquid circuit. Among them, the second flow channel 102 is a flow channel in the second cooling liquid circuit. In this way, under the pumping action of the second water pump 122, the cooling liquid in the sixth flow channel of the condenser 22 can flow from the outlet of the sixth flow channel to the heater core 30, and then return to the sixth flow channel through the inlet of the sixth flow channel, so as to realize the circulation of the cooling liquid, and the cooling liquid can perform thermal management on the heater core 30 during the circulation.

[0105] The first connecting pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, so that the outlet of the condenser 22 and the inlet of the first cooler 21 are communicated through the first connecting pipe, thereby forming a refrigerant circuit. As an example, as shown in FIG. 2, and in combination with other figures, the first interface 24 is connected to the outlet of the compressor 29, and the second interface 2621 is connected to the inlet of the compressor 29, so that the condenser 22, the first connecting pipe, the first cooler 21, and the compressor 29 can form a refrigerant circuit. In this way, the refrigerant can first pass through the compression of the compressor 29, and then flow into the seventh flow channel of the condenser 22 through the first interface 24 and the inlet of the condenser 22 in sequence, and then flow into the fifth flow channel of the first cooler 21 through the outlet of the condenser 22, the first connecting pipe, and the inlet of the first cooler 21 in sequence, and finally flow back into the compressor 29 from the outlet of the first cooler 21 and the second interface 2621 in sequence, so as to realize the circulation of the refrigerant.

[0106] Further, when the refrigerant flows into the seventh flow channel of the condenser 22, the refrigerant can be condensed and heat released in the condenser 22. The cooling liquid in the sixth flow channel can exchange heat with the refrigerant in the seventh flow channel, so that the cooling liquid in the sixth flow channel absorbs heat and warms up. The cooling liquid that has absorbed heat and warmed up can flow to the heater core 30 under the pumping action of the second water pump 122, thereby providing warming action to the heater core 30, so that the heater core 30 can provide warm air. That is, the cooling liquid in the second cooling liquid circuit can exchange heat with the refrigerant in the condenser 22, thereby providing heating and warming action to the heater core 30. As an example, the heater core 30 is used to provide warm air to the passenger compartment of the vehicle 1000.

[0107] When the refrigerant flows into the fifth flow channel of the first cooler 21, the refrigerant can absorb heat and vaporize in the first cooler 21. The cooling liquid in the fourth flow channel can exchange heat with the refrigerant in the fifth flow channel, so that the cooling liquid in the fourth flow channel cools down. The cooling liquid that has cooled down can flow to the battery 100 under the pumping action of the first water pump 121, thereby performing thermal management on the battery 100, for example, cooling and cooling down the battery 100. That is, the cooling liquid in the first cooling liquid circuit can exchange heat with the refrigerant in the first cooler 21, thereby performing thermal management on the battery 100. For example, the cooling liquid in the first cooling liquid circuit can provide cooling and cooling down action to the battery 100.

[0108] The cooling liquid can be a medium for heat exchange, such as water, oil, etc.

[0109] The heat management system 400 provided by the embodiment of the present application is characterized in that the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22 are all mounted on the heat management structure 11, and the first flow channel 101 and the second flow channel 102 are arranged in the heat management structure 11, the first water pump 121 and the first cooler 21 are both communicated with the first flow channel 101 in the heat management structure 11, so that the first cooling liquid circuit can be formed. The second water pump 122 and the condenser 22 are both communicated with the second flow channel 102 in the heat management structure 11, so that the second cooling liquid circuit can be formed. The outlet of the condenser 22 and the inlet of the first cooler 21 are connected by the first connecting pipe, so that the outlet of the condenser 22 and the inlet of the first cooler 21 can be communicated by the first connecting pipe, and the refrigerant circuit can be formed. In this way, the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22 are all integrated on the heat management structure 11, which improves the layout rationality and compactness of the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22, and saves the design of the pipelines for forming multiple cooling liquid circuits, thereby helping to reduce the volume and space occupation of the heat management system 400, and helping to improve the space utilization of the vehicle 1000.

[0110] In addition, the heat management system 400 generally has multiple cooling liquid circuits, for example, can include but is not limited to the first cooling liquid circuit and the second cooling liquid circuit mentioned above. The connection of the devices in multiple cooling liquid circuits by pipelines will result in a large number of pipelines and complex layout, which will inevitably cause the risk of cooling liquid leakage and serious heat loss. In the embodiment of the present application, the first flow channel 101 and the second flow channel 102 inside the heat management structure 11 are designed, which saves the pipeline design of multiple cooling liquid circuits, reduces the risk of cooling liquid leakage, reduces heat loss, and also simplifies the assembly process of the heat management system 400.

[0111] In addition, the first connecting pipe is connected between the outlet of the condenser 22 and the inlet of the first cooler 21, which saves the design of the refrigerant flow channel plate for realizing the communication of the condenser 22, the first cooler 21 and other devices in the refrigerant circuit, thereby facilitating the communication between the condenser 22 and the first cooler 21, and helping to improve the layout compactness and rationality of the condenser 22 and the first cooler 21, so as to reduce the volume and space occupation of the heat management system 400, thereby improving the space utilization of the vehicle 1000. In addition, the design of the first connecting pipe can also reduce the problem of heavy weight caused by the design of the refrigerant flow channel plate.

[0112] In some embodiments, the first water pump 121, the second water pump 122, the first cooler 21 and the condenser 22 can be mounted on the heat management structure 11 by bolt fixing, rivet fixing, buckle fixing and the like.

[0113] In some embodiments, please refer to FIG. 2 to FIG. 4, and combine with other figures. The thermal management system 400 further comprises the battery 100, the heater core 30 and the compressor 29.

[0114] The inlet of the battery 100 is connected to the first connecting part 1111, and the outlet of the battery 100 is connected to the second connecting part 1112. The inlet of the heater core 30 is connected to the third connecting part 1113, and the outlet of the heater core 30 is connected to the fourth connecting part 1114. The inlet of the compressor 29 is connected to the second interface 2621, and the outlet of the compressor 29 is connected to the first interface 24.

[0115] In some embodiments, please refer to FIG. 2 to FIG. 4, and combine with other figures. The thermal management system 400 further comprises a liquid storage dryer 25, which is installed on the thermal management structure 11. The inlet of the liquid storage dryer 25 is connected to the outlet of the condenser 22, and the outlet of the liquid storage dryer 25 and the inlet of the first cooler 21 are connected by the first connecting pipe.

[0116] The liquid storage dryer 25 refers to a dryer for storing liquid. Specifically, the liquid storage dryer 25 is connected between the inlet of the first cooler 21 and the outlet of the condenser 22, for storing the excess refrigerant liquid from the condenser 22.

[0117] The first connecting pipe is connected between the outlet of the liquid storage dryer 25 and the inlet of the first cooler 21, which means that the opposite ends of the first connecting pipe are connected to the outlet of the liquid storage dryer 25 and the inlet of the first cooler 21 respectively, so that the outlet of the liquid storage dryer 25 and the inlet of the first cooler 21 can be connected by the first connecting pipe.

[0118] In this way, the condenser 22, the liquid storage dryer 25, the first connecting pipe, the first cooler 21 and the compressor 29 can form a refrigerant circuit, so that the refrigerant can pass through the compressor 29, the condenser 22, the liquid storage dryer 25, the first connecting pipe and the first cooler 21 in turn, and then flow back to the compressor 29.

[0119] By installing the liquid storage dryer 25 on the thermal management structure 11, and connecting the outlet of the liquid storage dryer 25 and the inlet of the first cooler 21 by the first connecting pipe, the liquid storage dryer 25 can be integrated on the thermal management structure 11, which helps to improve the layout compactness of the thermal management system 400, so as to reduce the volume of the thermal management system 400.

[0120] In some embodiments, please refer to FIG. 4, and combine with other figures. At least part of the liquid storage dryer 25 is arranged between the condenser 22 and the first cooler 21 along the distribution direction of the condenser 22 and the first cooler 21.

[0121] The inlet of the liquid accumulator 25 is communicated with the outlet of the condenser 22, and the outlet of the liquid accumulator 25 is connected to the inlet of the first cooler 21 through a first connecting pipe, so that the refrigerant can flow through the condenser 22, the liquid accumulator 25 and the first cooler 21 in sequence. In addition, at least part of the liquid accumulator 25 is arranged between the condenser 22 and the first cooler 21, so that the condenser 22, the liquid accumulator 25 and the first cooler 21 can be distributed along the flow direction of the refrigerant, thereby making the layout of the condenser 22, the liquid accumulator 25 and the first cooler 21 on the thermal management structure 11 very reasonable, which is conducive to improving the compactness of the layout of the condenser 22, the liquid accumulator 25 and the first cooler 21, thereby helping to reduce the volume of the thermal management system 400.

[0122] In some embodiments, the inlet of the liquid accumulator 25 is mounted on the outlet of the condenser 22 to realize the communication.

[0123] In this way, the design of the refrigerant flow channel plate and the pipeline for realizing the communication between the liquid accumulator 25 and the condenser 22 can be omitted, thereby improving the compactness of the liquid accumulator 25 and the condenser 22, so as to help to reduce the volume of the thermal management system 400.

[0124] In some embodiments, please refer to FIGS. 2 to 5, and combine with other drawings. The thermal management system 400 further comprises a valve island structure 26, the valve island structure 26 comprises a first valve island part 261 and a second valve island part 262, and the first valve island part 261 and the second valve island part 262 are both mounted on the first cooler 21. The first valve island part 261 is communicated with the inlet of the first cooler 21, and the first valve island part 261 and the outlet of the condenser 22 are communicated through a first connecting pipe. The second valve island part 262 is communicated with the outlet of the first cooler 21, and a second interface 2621 is arranged on the second valve island part 262.

[0125] The valve island structure 26 refers to a control component composed of a plurality of electrically controlled valves, which is used for controlling the refrigerant. The first valve island part 261 and the second valve island part 262 are two parts of the valve island structure 26.

[0126] The refrigerant in the seventh flow channel of the condenser 22 can flow to the first valve island part 261 through the first connecting pipe, and then enter the fifth flow channel of the first cooler 21, and then flow out from the second interface 2621.

[0127] Through the arrangement of the valve island structure 26, the first connecting pipe is connected between the first valve island part 261 and the outlet of the condenser 22, and the second interface 2621 is arranged on the second valve island part 262, which is conducive to the connection of the devices in the refrigerant circuit, and can save the design of the pipeline, so as to simplify the structure of the thermal management system 400.

[0128] Specifically, opposite ends of the first connecting pipe are connected to the first valve island 261 and the outlet of the liquid accumulator dryer 25, respectively.

[0129] In some embodiments, referring to Figs. 4 and 5, and in conjunction with other figures. The thermal management system 400 further comprises a first valve body 27, which is mounted on the first valve island 261 and is in communication between the first connecting pipe and the inlet of the first cooler 21.

[0130] The first valve body 27 is a valve for controlling the opening and closing between the first connecting pipe and the inlet of the first cooler 21.

[0131] Specifically, when the first valve body 27 is open, the refrigerant in the condenser 22 can flow to the first valve island 261 through the first connecting pipe, and then flow into the first cooler 21 through the first valve body 27. When the first valve body 27 is open, the refrigerant flowing out of the first condenser 22 is difficult to flow into the first cooler 21.

[0132] The first valve body 27 can be, but is not limited to, a pressure valve, a solenoid valve, an expansion valve, etc.

[0133] By mounting the first valve island 261 on the first cooler 21 and mounting the first valve body 27 on the first valve island 261, the first valve body 27 does not occupy the space between the condenser 22 and the first cooler 21, which helps to improve the layout compactness of the multiple devices in the refrigerant circuit, thereby helping to reduce the volume of the thermal management system 400.

[0134] In some embodiments, referring to Figs. 4 and 5, and in conjunction with other figures. The thermal management system 400 further comprises a second connecting pipe 231.

[0135] The second connecting pipe 231 is a pipe structure for injecting refrigerant into the refrigerant circuit.

[0136] In some embodiments, referring to Figs. 4 and 5, and in conjunction with other figures. The second connecting pipe 231 is mounted on the first valve island 261 and is in communication with the first valve body 27 through the first valve island 261.

[0137] In this way, the refrigerant can enter the first valve island 261 through the second connecting pipe 231, and then enter the first valve body 27. When the first valve body 27 is open, the refrigerant can enter the first cooler 21 through the first valve body 27.

[0138] In other embodiments, the second connecting pipe 231 is in communication between the outlet of the condenser 22 and the first connecting pipe.

[0139] In this way, the refrigerant can enter the first connection pipe through the second connection pipe 231, and then enter the first valve island 261 through the first connection pipe to enter the first cooler 21.

[0140] In yet other embodiments, the second connection pipe 231 is connected to the first interface 24.

[0141] In this way, the refrigerant can enter the first interface 24 through the second connection pipe 231 to enter the condenser 22, and then enter the first valve island 261 through the first connection pipe and the first valve body 27 to enter the first cooler 21.

[0142] The provision of the second connection pipe 231 allows the refrigerant to be injected into the refrigerant circuit through the second connection pipe 231 without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system 400.

[0143] In some embodiments, please refer to FIG. 4 and FIG. 5, and in combination with other drawings. The first valve island 261 is provided with a third interface 2611. The thermal management system 400 further comprises a second valve body 28, which is installed on the first valve island 261 and is connected between the first connection pipe and the third interface 2611 through the first valve island 261. The second valve island 262 is provided with a fourth interface 2622, which is connected to the second interface 2621 through the second valve island 262.

[0144] The second valve body 28 is a valve for controlling the opening and closing between the first connection pipe and the third interface 2611.

[0145] The refrigerant in the condenser 22 can flow into the first valve island 261 through the first connection pipe, and then flow into the second valve body 28. When the second valve body 28 is opened, the refrigerant can flow into the third interface 2611 through the second valve body 28.

[0146] As an example, as shown in FIG. 2, FIG. 4 and FIG. 5, the third interface 2611 is used to connect the inlet of the evaporator 40, and the fourth interface 2622 is used to connect the outlet of the evaporator 40.

[0147] In this way, the refrigerant can be vaporized under the action of the evaporator 40, and flow into the second valve island 262 through the fourth interface 2622 from the outlet of the evaporator 40, and then flow into the second interface 2621 through the second valve island 262 to enter the compressor 29 from the inlet of the compressor 29. Then, the refrigerant enters the condenser 22 from the first interface 24, and then enters the first valve island 261 through the first connection pipe from the outlet of the condenser 22.

[0148] When the first valve body 27 is open and the second valve body 28 is closed, the refrigerant in the first valve island 261 enters the first cooler 21 through the first valve body 27, and then enters the compressor 29 through the second interface 2621. When the second valve body 28 is open and the first valve body 27 is closed, the refrigerant in the first valve island 261 flows to the third interface 2611 through the second valve body 28, thereby flowing back to the evaporator 40 from the inlet of the evaporator 40.

[0149] The second valve body 28 may, but is not limited to, be a pressure valve, a solenoid valve, an expansion valve, etc.

[0150] In this way, by controlling the first valve body 27 and the second valve body 28, the use mode of the refrigerant backflow can be controlled. Specifically, when the first valve body 27 is open and the second valve body 28 is closed, the refrigerant from the condenser 22 enters the first cooler 21, thereby cooling the cooling liquid in the second cooling liquid circuit. When the second valve body 28 is open and the first valve body 27 is closed, the refrigerant from the condenser 22 enters the evaporator 40, thereby evaporating and absorbing heat, so that the evaporator 40 is used to provide cold air. Thus, the thermal management system 400 provided by the embodiment can not only perform thermal management on the battery 100, but also cooperate with the warm air core 30 and the evaporator 40 to provide warm air or cold air.

[0151] By mounting the first valve island 261 on the first cooler 21 and mounting the second valve body 28 on the first valve island 261, the second valve body 28 does not occupy the space between the condenser 22 and the first cooler 21, which helps to improve the layout compactness of the plurality of devices in the refrigerant circuit, thereby helping to reduce the volume of the thermal management system 400.

[0152] In some embodiments, please refer to FIG. 4 and FIG. 5, and combine with other drawings. The first valve body 27 is an expansion valve.

[0153] In this way, the first valve body 27 can throttle and depressurize the refrigerant from the first connecting pipe, thereby facilitating the refrigerant to cool the cooling liquid in the first cooler 21.

[0154] In some embodiments, please refer to FIG. 4 and FIG. 5, and combine with other drawings. The second valve body 28 includes an expansion valve.

[0155] In this way, the second valve body 28 can throttle and depressurize the refrigerant from the first connecting pipe, thereby facilitating the refrigerant to cool the cooling liquid in the first cooler 21.

[0156] In some embodiments, referring to Figs. 4 and 5, and in conjunction with other figures. The thermal management system 400 further comprises a third connecting pipe 232, which is installed on the first valve island 27 and is communicated with the third interface 2611 through the first valve island part 261.

[0157] The third connecting pipe 232 is a pipe structure for injecting refrigerant into the refrigerant circuit.

[0158] In this way, the refrigerant can enter the first valve island part 261 through the third connecting pipe 232, and then flow to the third interface 2611 to flow to the evaporator 40.

[0159] By providing the third connecting pipe 232, the refrigerant can be injected into the refrigerant circuit through the third connecting pipe 232 without passing through the refrigerant flow channel plate, which helps to reduce the volume of the thermal management system 400.

[0160] It should be noted here that the second connecting pipe 231 is used to inject high-pressure refrigerant into the refrigerant circuit, so that the refrigerant can enter the first cooler 21 through the first valve body 27. The third connecting pipe 232 is used to inject low-pressure refrigerant into the refrigerant circuit, so that the refrigerant can enter the evaporator 40.

[0161] In some embodiments, referring to Figs. 2 to 4, and in conjunction with other figures. The thermal management structure 11 comprises a thermal management component 111 and a mounting rack 112. The thermal management component 111 is provided with the first flow channel 101 and the second flow channel 102, and is provided with the first connecting part 1111, the second connecting part 1112, the third connecting part 1113 and the fourth connecting part 1114. The first water pump 121 and the second water pump 122 are both installed on the thermal management component 111. The mounting rack 112 is installed on the thermal management component 111, and the first cooler 21 and the condenser 22 are both installed on the mounting rack 112.

[0162] The thermal management component 111 can be but is not limited to a flow channel plate.

[0163] By providing the thermal management structure 11 to comprise the thermal management component 111 and the mounting rack 112, the refrigerant side part 20 can be installed on the mounting rack 112, which facilitates the integration of multiple devices in the thermal management system 400, thereby improving the layout rationality of the thermal management system 400 and reducing the volume of the thermal management system 400.

[0164] In some embodiments, as shown in Figs. 3 and 4, the liquid storage dryer 25 is installed on the mounting rack 112.

[0165] In some embodiments, please refer to FIG. 3 and FIG. 4, and combine with other drawings. At least part of the mounting rack 112 is mounted on one side of the heat management component 111, and the first water pump 121 and the second water pump 122 are both mounted on the other side of the heat management component 111.

[0166] By mounting at least part of the mounting rack 112 on one side of the heat management component 111, and mounting the first cooler 21 and the condenser 22 on the mounting rack 112, the first cooler 21 and the condenser 22 are located on one side of the heat management component 111, and the first water pump 121 and the second water pump 122 are arranged on the other side of the heat management component 111.

[0167] In this way, the layout of each device in the heat management system 400 is reasonable and compact, which helps to reduce the volume of the heat management system 400.

[0168] In some embodiments, please refer to FIG. 3, FIG. 4 and FIG. 8, and combine with other drawings. FIG. 8 is a perspective view of the mounting rack 112 of the heat management system 400 provided in some embodiments of the present application. The mounting rack 112 is provided with a bracket 11022 for mounting on an external device.

[0169] It can be understood that the mounting rack 112 includes a rack body 11021 and a bracket 11022 provided on the rack body 11021, the rack body 11021 is mounted on the heat management component 111, and the bracket 11022 is used for mounting on an external device. The bracket 11022 can be mounted on a whole vehicle, but is not limited thereto.

[0170] It can be understood that the mounting rack 112 includes a rack body 11021 and a bracket 11022 provided on the rack body 11021, the rack body 11021 is mounted on the heat management component 111, and the bracket 11022 is used for mounting on an external device. The bracket 11022 can be mounted on a whole vehicle, but is not limited thereto.

[0171] The bracket 11022 can be provided as one or more.

[0172] In this way, the heat management system 400 is conveniently mounted on an external device.

[0173] In some embodiments, please refer to FIG. 3, FIG. 4 and FIG. 9, and combine with other drawings. FIG. 9 is a perspective view of the water tank 13 of the heat management system 400 provided in some embodiments of the present application. The heat management system 400 further includes a water tank 13, which is communicated with the first flow channel 101 and the second flow channel 102.

[0174] The water tank 13 refers to a containing structure for storing cooling liquid.

[0175] The water tank 13 is connected to the first flow channel 101 and the second flow channel 102. Specifically, the water tank 13 can be directly or indirectly connected to the first flow channel 101, and the water tank 13 can also be directly or indirectly connected to the second flow channel 102. For example, the water tank 13 can be directly connected to the first flow channel 101, and the first flow channel 101 and the second flow channel 102 are connected through a multi-way valve, so that the cooling liquid in the water tank 13 can flow into the first flow channel 101, and then flow into the second flow channel 102 through the multi-way valve between the first flow channel 101 and the second flow channel 102, so that the water tank 13 and the second flow channel 102 are indirectly connected. That is, the water tank 13 is connected to the first flow channel 101, which means that the cooling liquid in the water tank 13 can flow into the first flow channel 101. Correspondingly, the water tank 13 is connected to the second flow channel 102, which means that the cooling liquid in the water tank 13 can flow into the second flow channel 102. That is, the cooling liquid in the water tank 13 can flow into the first flow channel 101 and the second flow channel 102, so that the water tank 13 is connected to the first flow channel 101 and the second flow channel 102.

[0176] Specifically, the water tank 13 is provided with an eighth interface 1301 connected to the internal space of the water tank 13. The water tank 13 is connected to the first flow channel 101 and the second flow channel 102 through the eighth interface 1301.

[0177] In some embodiments, please refer to FIG. 3, FIG. 4 and FIG. 9, and combine with other drawings. The water tank 13 is detachably mounted on the mounting frame 112.

[0178] The water tank 13 and the mounting frame 112 can be fixed by bolt fixing, rivet fixing, etc.

[0179] The water tank 13 is detachably connected to the mounting frame 112, so that the position of the water tank 13 can be very flexible, which facilitates the arrangement of the thermal management system 400 in the vehicle 1000.

[0180] In some embodiments, please refer to FIG. 7, and combine with other drawings. The fifth interface 1121 is provided on the thermal management structure 11, and the fifth interface 1121 is connected to the first flow channel 101 and the second flow channel 102, and the fifth interface 1121 is used for connecting the water tank 13.

[0181] The fifth interface 1121 is connected to the first flow channel 101 and the second flow channel 102. Specifically, the fifth interface 1121 can be directly or indirectly connected to the first flow channel 101, and the fifth interface 1121 can also be directly or indirectly connected to the second flow channel 102.

[0182] Specifically, the water tank 13 is connected to the fifth interface 1121 through the eighth interface 1301.

[0183] The fifth interface 1121 is connected to the first flow channel 101 and the second flow channel 102, and is used to connect the water tank 13, so that the cooling liquid in the water tank 13 can be directly or indirectly injected into the first flow channel 101 and the second flow channel 102 through the fifth interface 1121, so that multiple water tanks 13 do not need to be arranged for multiple flow channels, and multiple injection operations do not need to be sequentially performed, so that the cooling liquid can be conveniently injected into the first flow channel 101 and the second flow channel 102.

[0184] In some embodiments, please refer to FIG. 3, FIG. 4 and FIG. 9, and combine with other drawings. The thermal management system 400 further comprises a water tank 13 connected to the first flow channel 101 and the second flow channel 102, and the water tank 13 is provided with a plurality of spaced-apart exhaust ports 1302.

[0185] The exhaust port 1302 refers to an opening for exhaust gas.

[0186] By arranging a plurality of exhaust ports 1302, the exhaust efficiency of the thermal management system 400 can be improved.

[0187] As an example, the water tank 13 is provided with two spaced-apart exhaust ports 1302.

[0188] In some embodiments, please refer to FIG. 4 and FIG. 6, and combine with other drawings. The thermal management structure 11 is further provided with a fifth connecting portion 1115 and a sixth connecting portion 1116, both of which are connected to the first flow channel 101 and used to respectively connect the heating device 16.

[0189] The fifth connecting portion 1115 and the sixth connecting portion 1116 are both connecting portions on the thermal management structure 11.

[0190] The heating device 16 refers to a device for heating, and is specifically used for heating the cooling liquid. The heating device 16 can be but is not limited to a PCT (Positive Temperature Coefficient) heater.

[0191] Specifically, the fifth connecting portion 1115 is connected to the inlet of the heating device 16, and the sixth connecting portion 1116 is connected to the outlet of the heating device 16. In this way, the battery 100, the first water pump 121, the heating device 16 and the first cooler 21 can form a first cooling liquid circuit. The cooling liquid can be cooled under the action of the first cooler 21, and heated and warmed under the action of the heating device 16, and then the battery 100 is thermally managed.

[0192] By adopting the above technical solution, the thermal management system 400 can perform heating and warming and cooling thermal management operations.

[0193] In some embodiments, please refer to Figs. 2-7, and in combination with other figures. The third flow channel 103 is further provided inside the thermal management structure 11, and the thermal management structure 11 is further provided with a seventh connecting part 1117 and an eighth connecting part 1118. The thermal management system 400 further comprises a third water pump 123, which is installed on the thermal management structure 11, and the third water pump 123, the seventh connecting part 1117 and the eighth connecting part 1118 are all communicated with the third flow channel 103.

[0194] The third flow channel 103 is a flow channel inside the thermal management structure 11, and specifically, the third flow channel 103 is provided inside the thermal management part 111.

[0195] The seventh connecting part 1117 and the eighth connecting part 1118 are connecting parts on the thermal management structure 11, which are used to connect devices that need thermal management, which can be but are not limited to the battery 100, the motor 300, the heater core 30, etc. As an example, the seventh connecting part 1117 is connected to the inlet of the motor 300, the eighth connecting part 1118 is connected to the outlet of the motor 300, the first connecting part 1111 is connected to the inlet of the battery 100, and the second connecting part 1112 is connected to the outlet of the battery 100.

[0196] The third water pump 123 is a water pump, which refers to a machine used to transport liquid. The third water pump 123 is communicated with the third flow channel 103, which means that the inlet of the third water pump 123 is communicated with the third flow channel 103, and the outlet of the third water pump 123 is communicated with the third flow channel 103.

[0197] In some embodiments, please refer to Figs. 2-7, the third flow channel 103 is communicated with the condenser 22, and the thermal management structure 11 is further provided with a ninth connecting part 1119 and a tenth connecting part 1120, which are used to connect the second cooler 14 respectively.

[0198] The ninth connecting part 1119 and the tenth connecting part 1120 are connecting parts on the thermal management structure 11, the ninth connecting part 1119 is used to connect the inlet of the second cooler 14, and the tenth connecting part 1120 is used to connect the outlet of the second cooler 14.

[0199] The third flow channel 103 is communicated with the condenser 22, specifically, the opposite ends of the sixth flow channel of the condenser 22 are respectively communicated with the third flow channel 103.

[0200] In this way, the condenser 22, the third water pump 123, the second cooler 14 and the motor 300 can constitute a third cooling liquid circuit. Under the pumping action of the third water pump 123, the cooling liquid in the condenser 22 can flow to the second cooler 14 to be cooled under the cooling action of the second cooler 14, and then flow to the motor 300 to cool the motor 300, and then flow back to the condenser 22.

[0201] In some embodiments, the third flow channel 103 is in communication with the first cooler 21.

[0202] Specifically, the inlet of the fourth flow channel of the first cooler 21 and the outlet of the fourth flow channel are in communication with the third flow channel 103, respectively.

[0203] In this way, the first cooler 21, the third water pump 123 and the motor 300 can constitute a third cooling liquid circuit. Under the action of the third water pump 123, the cooling liquid in the first cooler 21 can be cooled and then flow to the motor 300 to cool the motor 300, and then flow back to the first cooler 21.

[0204] By adopting the above technical solution, the heat management system 400 can form a third cooling liquid circuit, so that at least three cooling liquid circuits can be formed in the heat management system 400 to heat manage different devices requiring heat management.

[0205] It should be noted here that the water tank 13 can be directly or indirectly in communication with the third flow channel 103, so that the cooling liquid in the water tank 13 can be injected into the third cooling liquid circuit.

[0206] In some embodiments, please refer to FIGS. 2 to 7, and combine with other drawings. The heat management structure 11 is provided with a sixth interface 1122 and a seventh interface 1123, both of which are in communication with the second flow channel 102. The condenser 22 is in communication with the sixth interface 1122 and the seventh interface 1123 to be in communication with the second flow channel 102. The heat management structure 11 is provided with a first mounting portion 1124 in communication with the second flow channel 102 and the third flow channel 103, and the third valve body 151 is mounted on the first mounting portion 1124. The third flow channel 103 is in communication with the seventh interface 1123 through the third valve body 151, and the third flow channel 103 is also in communication with the sixth interface 1122.

[0207] The inlet of the sixth flow channel of the condenser 22 is in communication with the sixth interface 1122, and the outlet of the sixth flow channel is in communication with the seventh interface 1123, so that the condenser 22 is in communication with the second flow channel 102 through the sixth interface 1122 and the seventh interface 1123.

[0208] The third valve body 151 is a valve for controlling the flow of cooling liquid in the second flow channel 102 or the third flow channel 103.

[0209] The first mounting portion 1124 refers to a mounting portion for mounting the third valve body 151. The first mounting portion 1124 is in communication with the second flow channel 102 and the third flow channel 103, and the third valve body 151 is mounted on the first mounting portion 1124, so that the third valve body 151 can be in communication with the second flow channel 102 and the third flow channel 103.

[0210] The third valve body 151 is arranged between the third flow channel 103 and the seventh interface 1123, and is communicated with the sixth interface 1122.

[0211] In this way, the cooling liquid in the condenser 22 can flow to the seventh interface 1123, and by adjusting the third valve body 151, the cooling liquid at the seventh interface 1123 can flow to the second flow channel 102 through the third valve body 151, and then flow to the heater core 30 under the pumping action of the second water pump 122, and then return to the condenser 22 through the sixth interface 1122. By adjusting the third valve body 151, the cooling liquid at the seventh interface 1123 can flow to the third flow channel 103 through the third valve body 151, and then flow to the motor 300 under the pumping action of the third water pump 123, and then return to the condenser 22 through the sixth interface 1122.

[0212] In this way, the second flow channel 102 and the third flow channel 103 can be communicated, so that the cooling liquid can flow from the second flow channel 102 to the third flow channel 103 or from the third flow channel 103 to the second flow channel 102.

[0213] In some embodiments, please refer to FIGS. 2 to 7, and combine with other drawings. The thermal management structure 11 is provided with a second mounting portion 1125, the second mounting portion 1125 is communicated with the first flow channel 101 and the third flow channel 103, and the fourth valve body 152 is mounted on the second mounting portion 1125.

[0214] The second mounting portion 1125 is a mounting portion for mounting the fourth valve body 152, and the second mounting portion 1125 is distributed apart from the first mounting portion 1124. The second mounting portion 1125 is communicated with the first flow channel 101 and the third flow channel 103, and the fourth valve body 152 is mounted on the second mounting portion 1125, so that the fourth valve body 152 is communicated with the first flow channel 101 and the third flow channel 103.

[0215] In this way, under the action of the first water pump 121, the cooling liquid in the third flow channel 103 can flow to the first flow channel 101 through the fourth valve body 152, and then circulate in the first cooling liquid circuit. Under the action of the third water pump 123, the cooling liquid in the first flow channel 101 can also flow to the third flow channel 103 through the fourth valve body 152, and then circulate in the third cooling liquid circuit.

[0216] By adopting the technical scheme, the cooling liquid can flow between the second flow channel 102 and the third flow channel 103 and / or flow between the first flow channel 101 and the third flow channel 103, so that the cooling liquid in the water tank 13 can enter the first flow channel 101, the second flow channel 102 and the third flow channel 103, and the cooling liquid in the three cooling liquid circuits can circulate smoothly, so that corresponding heat management work can be performed.

[0217] In addition, by arranging the first mounting portion 1124 on the heat management structure 11 and mounting the third valve body 151 on the first mounting portion 1124, the third valve body 151 can realize the communication between the second flow channel 102 and the third flow channel 103, so that the third valve body 151 can be arranged compactly in the heat management system 400, and the volume of the heat management system 400 can be reduced.

[0218] In addition, by arranging the second mounting portion 1125 on the heat management structure 11 and mounting the fourth valve body 152 on the second mounting portion 1125, the fourth valve body 152 can realize the communication between the first flow channel 101 and the third flow channel 103, so that the fourth valve body 152 can be arranged compactly in the heat management system 400, and the volume of the heat management system 400 can be reduced.

[0219] In some embodiments, please refer to FIGS. 2 to 7, and combine with other drawings. The heat management structure 11 further comprises a third mounting portion 1126, the third mounting portion 1126 is in communication with the first flow channel 101 and the third flow channel 103, and a fifth valve body 153 is mounted on the third mounting portion 1126. The first cooler 21 is in communication between the fourth valve body 152 and the fifth valve body 153.

[0220] The third mounting portion 1126 is a mounting portion for mounting the fifth valve body 153, and the second mounting portion 1125, the first mounting portion 1124 and the third mounting portion 1126 are spaced apart. The third mounting portion 1126 is in communication with the first flow channel 101 and the third flow channel 103, and the fifth valve body 153 is mounted on the third mounting portion 1126, so that the fifth valve body 153 is in communication with the first flow channel 101 and the third flow channel 103.

[0221] The first cooler 21 is in communication between the fourth valve body 152 and the fifth valve body 153, that is, the inlet of the fourth flow channel of the first cooler 21 is in communication with the fifth valve body 153, and the outlet of the fourth flow channel is in communication with the fourth valve body 152.

[0222] In this way, the flow of the cooling liquid in the first flow channel 101 and the third flow channel 103 can be controlled, so that various heat management modes of the heat management system 400 can be realized.

[0223] The third valve body 151 can be but is not limited to a three-way valve, the fourth valve body 152 can be but is not limited to a five-way valve, and the fifth valve body 153 can be but is not limited to a six-way valve.

[0224] In some embodiments, please refer to FIG. 2 and FIG. 7, and combine with other figures. The heat management component 111 is further provided with a fourth mounting portion 1129. The fourth mounting portion 1129 is communicated with the first flow channel 101, and the first water pump 121 is mounted on the fourth mounting portion 1129. In this way, the first water pump 121 can be communicated with the first flow channel 101 through the fourth mounting portion 1129.

[0225] In some embodiments, please refer to FIG. 2 and FIG. 7, and combine with other figures. The heat management component 111 is further provided with a fifth mounting portion 1130. The fifth mounting portion 1130 is communicated with the second flow channel 102, and the second water pump 122 is mounted on the fifth mounting portion 1130. In this way, the second water pump 122 can be communicated with the second flow channel 102 through the fifth mounting portion 1130.

[0226] In some embodiments, please refer to FIG. 2 and FIG. 7, and combine with other figures. The heat management component 111 is further provided with a sixth mounting portion 1131. The sixth mounting portion 1131 is communicated with the third flow channel 103, and the third water pump 123 is mounted on the sixth mounting portion 1131. In this way, the third water pump 123 can be communicated with the third flow channel 103 through the sixth mounting portion 1131.

[0227] By mounting the first water pump 121, the second water pump 122 and the third water pump 123 on the corresponding mounting portions of the heat management component 111, the corresponding flow channels can be communicated. In this way, the integration of the heat management system 400 can be improved, and the volume of the heat management system 400 can be reduced.

[0228] It should be noted that the first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, the fourth connecting portion 1114, the fifth connecting portion 1115, the sixth connecting portion 1116, the seventh connecting portion 1117, the eighth connecting portion 1118, the ninth connecting portion 1119, the tenth connecting portion 1120, the first mounting portion 1124, the second mounting portion 1125, the third mounting portion 1126, the fourth mounting portion 1129, the fifth mounting portion 1130 and the sixth mounting portion 1131 are distributed on the heat management component 111, and specifically, the first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, the fourth connecting portion 1114, the fifth connecting portion 1115, the sixth connecting portion 1116, the seventh connecting portion 1117, the eighth connecting portion 1118, the ninth connecting portion 1119, the tenth connecting portion 1120, the first mounting portion 1124, the second mounting portion 1125, the third mounting portion 1126, the fourth mounting portion 1129, the fifth mounting portion 1130 and the sixth mounting portion 1131 are partial structures of the heat management component 111.

[0229] In addition, the first connecting portion 1111, the second connecting portion 1112, the third connecting portion 1113, the fourth connecting portion 1114, the fifth connecting portion 1115, the sixth connecting portion 1116, the seventh connecting portion 1117 and the eighth connecting portion 1118 are arranged on one side of the heat management component 111, and the condenser 22, the first cooler 21 and the liquid storage dryer 25 are also arranged on the side of the heat management component 111.

[0230] The ninth connecting portion 1119, the tenth connecting portion 1120, the first mounting portion 1124, the second mounting portion 1125, the third mounting portion 1126, the fourth mounting portion 1129, the fifth mounting portion 1130 and the sixth mounting portion 1131 are arranged on the other side of the heat management component 111.

[0231] In some embodiments, referring to FIG. 4 and FIG. 6, and in combination with other drawings. The ninth interface 1127 and the tenth interface 1128 are further arranged on the heat management component 111, and the ninth interface 1127 and the tenth interface 1128 are both communicated with the first flow channel 101. The ninth interface 1127 is connected to the inlet of the fourth flow channel of the first cooler 21, and the tenth interface 1128 is connected to the outlet of the fourth flow channel of the first cooler 21. In this way, the integration of the first cooler 21 and the heat management structure 11 can be improved.

[0232] It should be noted that the third valve body 151, the fourth valve body 152 and the fifth valve body 153 can constitute the valve assembly 15, the first water pump 121, the second water pump 122 and the third water pump 123 can constitute the water pump assembly 12, and the second connecting pipe 231 and the third connecting pipe 232 can constitute the pipeline assembly 23.

[0233] Please refer to FIG. 1 and FIG. 2, and combine other drawings. The vehicle 1000 provided by the embodiment of the present application comprises the thermal management system 400. In the embodiment, the thermal management system 400 is the same as the thermal management system 400 in the previous embodiment, and the related description of the thermal management system 400 in the previous embodiment is referred to.

[0234] The vehicle 1000 provided by the embodiment of the present application can improve the layout rationality and compactness of the thermal management system 400, and help to reduce the volume and space occupation of the thermal management system 400, so as to improve the space utilization of the vehicle 1000.

[0235] As one of the embodiments of the present application, as shown in FIG. 2 to FIG. 8, the thermal management system 400 comprises a thermal management structure 11, a first water pump 121, a second water pump 122, a third water pump 123, a water tank 13, a first cooler 21, a condenser 22, a liquid storage dryer 25, a first valve body 27, a second valve body 28, a third valve body 151, a fourth valve body 152 and a fifth valve body 153. The thermal management structure 11 comprises a thermal management component 111 and a mounting bracket 112 mounted on one side of the thermal management component 111, and the water tank 13 is detachably mounted on the mounting bracket 112. The first cooler 21, the condenser 22 and the liquid storage dryer 25 are all mounted on the mounting bracket 112. The thermal management component 111 is provided with a first flow channel 101, a second flow channel 102 and a third flow channel 103, and one side of the thermal management component 111 is provided with a first connecting portion 1111, a second connecting portion 1112, a third connecting portion 1113, a fourth connecting portion 1114, a fifth connecting portion 1115, a sixth connecting portion 1116, a seventh connecting portion 1117, an eighth connecting portion 1118, a sixth interface 1122, a seventh interface 1123, a ninth interface 1127 and a tenth interface 1128, and the other side of the thermal management component 111 is provided with a first mounting portion 1124, a second mounting portion 1125, a third mounting portion 1126, a fourth mounting portion 1129, a fifth mounting portion 1130, a sixth mounting portion 1131, a ninth connecting portion 1119, a tenth connecting portion 1120 and a fifth interface 1121.

[0236] The first connecting portion 1111, the second connecting portion 1112, the fifth connecting portion 1115, the sixth connecting portion 1116, the fourth mounting portion 1129, the ninth interface 1127 and the tenth interface 1128 are all communicated with the first flow channel 101, the first connecting portion 1111 and the second connecting portion 1112 are respectively used for connecting the battery 100, the fifth connecting portion 1115 and the sixth connecting portion 1116 are respectively used for connecting the heating device 16, the first water pump 121 is mounted on the fourth mounting portion 1129, and the first cooler 21 is provided with the fourth flow channel and the fifth flow channel which are distributed at intervals, and the fourth flow channel of the first cooler 21 is respectively communicated with the ninth interface 1127 and the tenth interface 1128, so that the first cooler 21, the heating device 16, the first water pump 121 and the battery 100 form a first cooling liquid circuit.

[0237] The third connecting portion 1113, the fourth connecting portion 1114, the sixth interface 1122, the seventh interface 1123 and the fifth mounting portion 1130 are all communicated with the second flow channel 102, the third connecting portion 1113 and the fourth connecting portion 1114 are respectively connected with the heater core 30, the second water pump 122 is mounted on the fifth mounting portion 1130, and the condenser 22 is provided with the sixth flow channel and the seventh flow channel which are distributed at intervals, the sixth flow channel of the condenser 22 is respectively communicated with the sixth interface 1122 and the seventh interface 1123, so that the condenser 22, the second water pump 122 and the heater core 30 form a second cooling liquid circuit.

[0238] The seventh connecting portion 1117, the eighth connecting portion 1118, the ninth connecting portion 1119, the tenth connecting portion 1120 and the sixth mounting portion 1131 are all communicated with the third flow channel 103, and the sixth interface 1122 and the seventh interface 1123 are communicated with the third flow channel 103, the seventh connecting portion 1117 and the eighth connecting portion 1118 are respectively connected with the motor 300, the ninth connecting portion 1119 and the tenth connecting portion 1120 are respectively connected with the second cooler 14, and the third water pump 123 is mounted on the sixth mounting portion 1131, so that the condenser 22, the third water pump 123, the second cooler 14 and the motor 300 form a third cooling liquid circuit.

[0239] The first installation part 1124 is communicated with the second flow channel 102 and the third flow channel 103, and the third valve body 151 is installed on the first installation part 1124, the third valve body 151 is arranged between the seventh interface 1123 and the third flow channel 103, and the third flow channel 103 is communicated with the sixth interface 1122. The second installation part 1125 and the third installation part 1126 are both communicated with the first flow channel 101 and the third flow channel 103, and the ninth interface 1127 and the tenth interface 1128 are both communicated between the second installation part 1125 and the third installation part 1126, the fourth valve body 152 is installed on the second installation part 1125, and the fifth valve body 153 is installed on the third installation part 1126. The third valve body 151 is a three-way valve, the fourth valve body 152 is a five-way valve, and the fifth valve body 153 is a six-way valve.

[0240] At least part of the liquid storage dryer 25 is arranged between the first cooler 21 and the condenser 22, the inlet of the condenser 22 is provided with the first interface 24, and the inlet of the liquid storage dryer 25 is connected to the outlet of the condenser 22. The first cooler 21 is provided with a valve island structure 26, the valve island structure 26 includes a first valve island part 261 and a second valve island part 262, and the first valve island part 261 is communicated with the outlet of the liquid storage dryer 25 through a first connecting pipe. The first valve island part 261 is communicated with the inlet of the first cooler 21, the first valve body 27 is installed on the first valve island part 261 and is communicated between the inlet of the first cooler 21 and the first connecting pipe. The first valve island part 261 is further provided with a second connecting pipe 231 communicated with the first valve body 27. The first valve island part 261 is further provided with the second valve body 28, the first valve island part 261 is provided with a third interface 2611, and the second valve body 28 is communicated between the first connecting pipe and the third interface 2611. The second valve island part 262 is communicated with the outlet of the first cooler 21 and is provided with a second interface 2621 and a fourth interface 2622, and the fourth interface 2622 is communicated with the second interface 2621 through the second valve island part 262. The first interface 24 and the second interface 2621 are respectively connected to the compressor 29, and the third interface 2611 and the fourth interface 2622 are respectively connected to the evaporator 40. The first valve island part 261 is further provided with a third connecting pipe 232, and the third connecting pipe 232 is communicated with the third interface 2611 through the first valve island part 261.

[0241] The above only describes optional embodiments of the present application and is not used to limit the present application. The present application can have various changes and modifications for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of claims of the present application.

Claims

1. A thermal management system, wherein, The heat management system comprises a heat management structure, a first water pump, a second water pump, a first cooler and a condenser, the first water pump, the second water pump, the first cooler and the condenser are all mounted on the heat management structure; the heat management structure is internally provided with a first flow channel and a second flow channel, and the heat management structure is provided with a first connecting part, a second connecting part, a third connecting part and a fourth connecting part; the first water pump, the first cooler, the first connecting part and the second connecting part are all communicated with the first flow channel, the second water pump, the condenser, the third connecting part and the fourth connecting part are all communicated with the second flow channel; a first connecting pipe is connected between the outlet of the condenser and the inlet of the first cooler, and a first interface is connected to the inlet of the condenser, and a second interface is connected to the outlet of the first cooler.

2. The thermal management system of claim 1, wherein, The heat management system further comprises a liquid storage dryer mounted on the heat management structure, the inlet of the liquid storage dryer is communicated with the outlet of the condenser, and the first connecting pipe is connected between the outlet of the liquid storage dryer and the inlet of the first cooler.

3. The thermal management system of claim 2, wherein, At least part of the liquid storage dryer is arranged between the condenser and the first cooler along the distribution direction of the condenser and the first cooler.

4. The thermal management system of claim 2 or 3, wherein, The inlet of the liquid storage dryer is mounted on the outlet of the condenser to realize communication.

5. The thermal management system of any of claims 1-4, wherein, The heat management system further comprises a valve island structure, the valve island structure comprises a first valve island part and a second valve island part, the first valve island part and the second valve island part are both mounted on the first cooler; the first valve island part is communicated with the inlet of the first cooler, and the first valve island part and the outlet of the condenser are communicated through the first connecting pipe; the second valve island part is communicated with the outlet of the first cooler, and the second interface is arranged on the second valve island part.

6. The thermal management system of claim 5, wherein, The heat management system further comprises a first valve body, the first valve body is mounted on the first valve island part and communicated between the first connecting pipe and the inlet of the first cooler.

7. The thermal management system of claim 6, wherein, The heat management system further comprises a second connecting pipe; The second connecting pipe is mounted on the first valve island part and communicated with the first valve body through the first valve island part; or the second connecting pipe is communicated between the outlet of the condenser and the first connecting pipe; or the second connecting pipe is connected to the first interface.

8. The thermal management system of claim 6 or 7, wherein, The first valve island part is provided with a third interface; the heat management system further comprises a second valve body, the second valve body is mounted on the first valve island part and communicated between the first connecting pipe and the third interface through the first valve island part; the second valve island part is provided with a fourth interface, and the fourth interface is communicated with the second interface through the second valve island part.

9. The thermal management system of claim 8, wherein, The first valve body and / or the second valve body comprises an expansion valve.

10. The thermal management system of claim 8 or 9, wherein, The heat management system further comprises a third connecting pipe, the third connecting pipe is mounted on the first valve body island and communicated with the third interface through the first valve island part.

11. The thermal management system of any of claims 1-10, wherein, The heat management structure comprises: The heat management component is internally provided with the first flow channel and the second flow channel, and is provided with the first connecting portion, the second connecting portion, the third connecting portion and the fourth connecting portion; the first water pump and the second water pump are both mounted on the heat management component; The mounting rack is mounted on the heat management component, and the first cooler and the condenser are both mounted on the mounting rack.

12. The thermal management system of claim 11, wherein, At least part of the mounting rack is mounted on one side of the heat management component, and the first water pump and the second water pump are both mounted on the other side of the heat management component.

13. The thermal management system of claim 11 or 12, wherein, The mounting rack is provided with a support for mounting on an external device.

14. The thermal management system of any of claims 11-13, wherein, The heat management system further comprises a water tank, which is detachably mounted on the mounting rack, and the water tank is communicated with the first flow channel and the second flow channel.

15. The thermal management system of any of claims 1-14, wherein, The heat management structure is further provided with a fifth interface, which is communicated with the first flow channel and the second flow channel, and the fifth interface is used for connecting a water tank.

16. The thermal management system of any one of claims 1-15, wherein, The heat management system further comprises a water tank, which is communicated with the first flow channel and the second flow channel, and the water tank is provided with a plurality of spaced exhaust ports.

17. The thermal management system of any of claims 1-16, wherein, The heat management structure is further provided with a fifth connecting portion and a sixth connecting portion, both of which are communicated with the first flow channel and used for connecting heating devices respectively.

18. The thermal management system of any of claims 1-17, wherein, The heat management structure is further provided with a third flow channel and a seventh connecting portion and an eighth connecting portion; the heat management system further comprises a third water pump, which is mounted on the heat management structure, and the third water pump, the seventh connecting portion and the eighth connecting portion are all communicated with the third flow channel; The third flow channel is communicated with the first cooler, or the third flow channel is communicated with the condenser, and the heat management structure is further provided with a ninth connecting portion and a tenth connecting portion, which are used for connecting a second cooler respectively.

19. The thermal management system of claim 18, wherein, The heat management structure is provided with a sixth interface and a seventh interface, both of which are communicated with the second flow channel; the condenser is communicated with the sixth interface and the seventh interface to be communicated with the second flow channel; the heat management structure is provided with a first mounting portion communicated with the second flow channel and the third flow channel, the first mounting portion is mounted with a third valve body, the third flow channel is communicated with the seventh interface through the third valve body, and the third flow channel is further communicated with the sixth interface; And / or, the heat management structure is provided with a second mounting portion communicated with the first flow channel and the third flow channel, and the second mounting portion is mounted with a fourth valve body.

20. The thermal management system of claim 19, wherein, The heat management structure is further provided with a third mounting portion communicated with the first flow channel and the third flow channel, the third mounting portion is mounted with a fifth valve body, and the first cooler is communicated between the fourth valve body and the fifth valve body.

21. A vehicle, wherein, The heat management system comprises the heat management system according to any one of claims 1-20.

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