Image sensor package and camera device comprising same

Abstract

Disclosed, in an embodiment of the present invention, is an image sensor package comprising: a substrate; an image sensor disposed on the substrate; a pad disposed on the substrate; a connection member having one end connected to the image sensor and the other end connected to the pad, wherein the pad comprises a first layer of metal, a second layer disposed on the first layer and including a metal oxide, and a third layer disposed on the second layer, wherein, when an upper surface of the third layer is analyzed by XPS, the binding energy of a first peak is between 74 (eV) and 76 (eV), and when an upper surface of the second layer is analyzed by XPS, the binding energy of a second peak is between 74 (eV) and 76 (eV), the first peak being greater than the second peak.

Description

Image sensor package and camera device including the same

[0001] An embodiment according to the present invention relates to an image sensor package and a camera device including the same.

[0002] The automotive industry is actively developing various advanced driver assistance systems (ADAS) to enhance driver and passenger safety and improve driving convenience. These systems include lane departure warning (LDW), forward collision avoidance (FCA), autonomous emergency braking (AEB), parking assistance systems (PAS), blind spot detection (BSD), and surround view monitoring (SVM).

[0003] One of the core components of this ADAS technology is the camera device or camera module mounted on the exterior and interior of the vehicle. Automotive camera devices capture images and perform tasks such as object recognition, distance calculation, and driving environment analysis based on these images, providing the foundational data for ADAS and autonomous driving systems.

[0004] For example, vehicle cameras can be used in a variety of applications, including front-facing cameras, rear-facing cameras, side cameras, and interior cameras. Furthermore, vehicle cameras are used for a variety of purposes, including forward-facing object detection, lane recognition, securing visibility when reversing, parking assistance, blind spot detection, lane change assistance, driver monitoring (DMS), and occupant detection.

[0005] In this way, the camera module of a vehicle camera used for various purposes must operate stably even under harsh environmental conditions outside the vehicle (e.g., vibration, high / low temperature, moisture, dust, light scattering, etc.). Accordingly, high reliability, high-definition video capture, small size, excellent durability, fast response speed, and low power consumption are required.

[0006] In addition, recent developments are underway to enable more precise object recognition and environmental analysis through fusion with radar, LiDAR, and ultrasonic sensors, beyond the operation of cameras alone.

[0007] Accordingly, requirements for camera image processing technology, communication interfaces, and system integration structures are becoming increasingly complex.

[0008] Although various attempts have been made to miniaturize and improve the performance of vehicle cameras, problems still exist, such as sensitivity to changes in the external environment, image distortion, reduced field of view due to foreign substances, and poor real-time data processing performance.

[0009] In particular, there is a growing demand for cameras with improved durability and reliability in response to changing environmental conditions.

[0010] An embodiment of the present invention provides an image sensor package and a semiconductor package including the same, in which the surface properties of the pad are improved by providing a specific ratio of fluorine to the pad within the image sensor package, thereby improving bonding strength with wires and enhancing chemical stability, thereby improving reliability.

[0011] In addition, the embodiment performs plasma treatment on the pad so that the pad has a third layer of metal oxide fluoride and / or metal fluoride on the first layer of the metal material and the second layer of the metal oxide layer, and the different size differences between the first peak, the second peak, and the third peak in the XPS analysis effectively improve the corrosion resistance while providing high bonding strength so that the fluorine in the pad is not a contaminant, thereby providing an image sensor package and a semiconductor package including the same with improved electrical reliability.

[0012] The problem to be solved in the embodiment is not limited to this, and it can be said that the purpose or effect that can be understood from the solution or implementation form of the problem described below is also included.

[0013] An image sensor package according to an embodiment of the present invention includes: a substrate; an image sensor disposed on the substrate; a pad disposed on the substrate; and a connecting member having one end connected to the image sensor and the other end connected to the pad; wherein the pad includes a first layer of metal; a second layer including a metal oxide disposed on the first layer; and a third layer disposed on the second layer, wherein when an XPS analysis is performed on an upper surface of the third layer, the binding energy has a first peak at 74 (eV) to 76 (eV), and when an XPS analysis is performed on an upper surface of the second layer, the binding energy has a second peak at 74 (eV) to 76 (eV), and the first peak is greater than the second peak.

[0014] When XPS analysis is performed on the upper surface of the second layer, a third peak may be present at a binding energy of 70 (eV) to 73 (eV).

[0015] The third peak may be smaller than the second peak.

[0016] The difference in binding energy between the first peak and the second peak may be smaller than the difference in binding energy between the second peak and the third peak.

[0017] The intensity difference between the first peak and the second peak may be smaller than the intensity difference between the second peak and the third peak.

[0018] The difference in intensity between the first peak and the second peak may be smaller than the intensity of the second peak.

[0019] The difference in intensity between the second peak and the third peak may be less than 0.5 times the intensity of the first peak.

[0020] The intensity of the second peak may be less than twice the intensity of the third peak.

[0021] The third peak may be smaller than the first peak.

[0022] The first layer may include aluminum (Al), the second layer may include aluminum oxide (AlxOy), and the third layer may include aluminum fluoride oxide (AlOF).

[0023] The atomic % of fluorine in the above pad may be from 1% to 15%.

[0024] An embodiment of the present invention implements an image sensor package and a semiconductor package including the same, in which the surface properties of the pad are improved by providing a specific ratio of fluorine to the pad within the image sensor package, thereby improving bonding strength with wires and enhancing chemical stability, thereby improving reliability.

[0025] In addition, the embodiment performs plasma treatment on the pad so that the pad has a third layer of metal oxide fluoride and / or metal fluoride on the first layer of metal material and the second layer of metal oxide layer, and the different size differences between the first peak, the second peak, and the third peak in the XPS analysis effectively improve the corrosion resistance without the fluorine in the pad being a contaminant, while providing high bonding strength, thereby enabling the implementation of an image sensor package and a semiconductor package including the same with improved electrical reliability.

[0026] The various advantageous and beneficial effects of the present invention are not limited to the above-described contents, and will be more easily understood in the course of explaining specific embodiments of the present invention.

[0027] Fig. 1 is a cross-sectional view of a camera device according to an embodiment;

[0028] FIG. 2 is a cross-sectional view of an image sensor package according to one embodiment of the present invention;

[0029] FIG. 3 is a perspective view of an image sensor according to one embodiment of the present invention;

[0030] FIG. 4 is a graph of an X-ray photoelectron spectroscopy (XPS) spectrum for the third layer of the pad in an image sensor package according to an embodiment;

[0031] FIG. 5 is a graph of an XPS spectrum for a second layer of a pad in an image sensor package according to an embodiment.

[0032] Figure 6 is a full graph of XPS spectra for the third layer and the second layer of the pad in the image sensor package.

[0033] Figure 7 is an enlarged view of part K1 in Figure 6,

[0034] Fig. 8 is a perspective view of a mobile terminal to which a camera device according to an embodiment is applied.

[0035] Fig. 9 is a perspective view of a vehicle to which a camera device according to an embodiment is applied.

[0036] The present invention can be modified in various ways and has various embodiments, and specific embodiments are illustrated and described in the drawings. However, this is not to be construed as a specific embodiment of the present invention.

[0037] It is not intended to be limited to the embodiments, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention.

[0038] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but may be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments may be selectively combined or substituted for use.

[0039] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0040] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “and (and) at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0041] Terms that include ordinal numbers, such as "second," "first," etc., may be used to describe various components, but the components are not limited by the terms. The terms are used solely to distinguish one component from another. For example, without departing from the scope of the present invention, a second component may be referred to as a "first component," and similarly, a first component may also be referred to as a "second component." The terms "and / or" include a combination of multiple related items described herein or any of multiple related items described herein. These terms are only used to distinguish the component from other components and are not limited by the nature, order, or sequence of the component.

[0042] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0043] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0044] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0045] Additionally, the expression that configuration A is positioned between configurations B and C should also include the meaning that configuration A is positioned so that it overlaps configurations B and C at least partially in the horizontal and / or vertical directions.

[0046] Expressions referring to directions include horizontal directions, vertical directions, and include a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction. These are referred to as a first horizontal direction (X-axis), a second horizontal direction (Y-axis), and a vertical direction (Z-axis) according to the Cartesian coordinate system, and the meaning of overlapping along the horizontal direction should also include the meaning of overlapping along the first horizontal direction and / or overlapping along the second horizontal direction.

[0047] Additionally, the statement that component A is exposed from component B should be understood to mean that component A is exposed from component B, not that component A is exposed from the entire product. That is, when it is stated that component A is exposed from component B, it should be understood to mean that component A is at least partially covered by component C.

[0048] Furthermore, when it is described that a component A is in "contact" with a component B, it may include not only cases where that component is in "contact" with the other component directly, but also cases where that component is "contacted" by another component between that component and the other component. Thus, if a component A is to be understood only as being in "direct contact" with a component B, it is described as being in "direct contact."

[0049] In addition, when it is written that configuration A is 'covered' by configuration B, it should be understood that configuration A is covered by configuration B, and that the part for the function and purpose to be solved is covered, and unless there are special circumstances, it should not be understood that the entire configuration A is covered by configuration B.

[0050] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0051] Before describing the embodiment, an electronic device (e.g., a camera device, a camera module, etc.) to which the image sensor package of the embodiment is applied will be briefly described. The electronic device includes a main board (not shown). The main board may be physically and / or electrically connected to various components.

[0052] Additionally, the electronic device may be a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a vehicle, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an automotive device, etc. However, the present invention is not limited thereto, and it is obvious that the electronic device may be any other electronic device that processes images.

[0053] FIG. 1 is a cross-sectional view of a camera device according to an embodiment, FIG. 2 is a cross-sectional view of an image sensor package according to an embodiment of the present invention, and FIG. 3 is a perspective view of an image sensor according to an embodiment of the present invention.

[0054] Figure 1 is a cross-sectional view of an example of a camera device, and Figure 2 is a cross-sectional view of another example of a camera device.

[0055] Referring to FIG. 1, a camera device (10) may include a substrate (12), an image sensor (14) disposed on the substrate (12), a filter layer (16) disposed on the image sensor (14), and a lens assembly (18) disposed on the filter layer (16). The substrate (12), the image sensor (14), the filter layer (16), and the lens assembly (18) may be accommodated within a housing (20).

[0056] The substrate (12) may include a flexible printed circuit board (FPCB), a rigid flexible printed circuit board (RFPCB), or a ceramic printed circuit board. For example, the substrate (12) may be a ceramic substrate. For example, the substrate (12) may include AlN or Al2O3.

[0057] An image sensor (14) is placed on a substrate (12), and a wire (22) may be bonded to the image sensor (14) and the substrate (12). The image sensor (14) collects incident light to generate an image signal, and the semiconductor element used in the image sensor (14) may be formed as a CCD (Charged Coupled Device) sensor or a CMOS (Complementary Metal-Oxide Semiconductor) sensor, and may be a semiconductor element that captures an image of a person or an object and outputs an electrical signal.

[0058] In addition, the image sensor (14) may include a plurality of pixels arranged in a matrix form. Each pixel may include a photoelectric conversion element and at least one transistor for sequentially outputting the voltage level of the photoelectric conversion element. The area where the plurality of pixels are arranged may be an active area of ​​the image sensor (14). The active area of ​​the image sensor (14) may be mixed with the light receiving unit.

[0059] The filter layer (16) may be implemented as a glass substrate, and the glass substrate may be a transparent or translucent substrate made of glass material. The filter layer (16) may restrict or allow light of a predetermined wavelength to pass through. For example, the filter layer (16) may block infrared rays. To this end, the glass substrate may be subjected to an IR blocking treatment to form the filter layer (16). For example, an IR blocking film may be disposed on at least one of the two surfaces of the glass substrate.

[0060] The lens assembly (18) includes at least one lens, and can refract incident light with a predetermined field of view and focal length and transmit the refracted light to the image sensor (14). The lens assembly (18) can be moved by an actuator (not shown). When the lens assembly (18) includes a plurality of lenses, each lens can be aligned with respect to a central axis to form an optical system. Here, the central axis can be identical to the optical axis of the optical system.

[0061] The lens assembly (18) may include a fixed focal length lens. The fixed focal length lens may also be referred to as a "single focal length lens" or a "single lens." Alternatively, the lens assembly (18) may include a variable lens. The variable lens may be a focus variable lens. Furthermore, the variable lens may be a lens whose focus is adjustable. The variable lens may be at least one of a liquid lens, a polymer lens, a liquid crystal lens, a VCM type, and an SMA type. The liquid lens may include a liquid lens containing one liquid and a liquid lens containing two liquids.

[0062] In order to maintain the filter layer (16) and the image sensor (14) at a predetermined interval and to stably support the filter layer (16), a molding member (24) may be placed between the substrate (12), the image sensor (14), and the filter layer (16). The molding member (24) may mold the wire (22) bonded to the image sensor (14) and the substrate (12). As a result, the wire (22) may be stably fixed.

[0063] In an embodiment of the present invention, an image sensor package with improved reliability is provided.

[0064] Referring to FIGS. 2 and 3, an image sensor package (100) according to one embodiment of the present invention includes a substrate (110), an image sensor (120) disposed on the substrate (110), a first support member (130) disposed on the image sensor (120), a filter layer (140) disposed on the image sensor (120), a second support member (150) disposed on the substrate (110) from a side of the image sensor (120), a molding member (160) disposed between the first support member (130) and the second support member (150), and a wire member (170) disposed between the first support member (130) and the second support member (150), one end of which is connected to the image sensor (120) and the other end of which is connected to the substrate (110). Each component may correspond to the component described in FIG. 1.

[0065] And the image sensor (120) includes an active area (122) and a non-active area (124) surrounding the active area (122). As described above, the active area (122) of the image sensor (120) is a light-receiving unit in which a plurality of pixels are arranged, and a pad (126) for wire bonding may be formed in the non-active area (124). The pad (126) may be located on a substrate of the image sensor (120). Accordingly, the substrate in contact with the pad (126) described below may mean a circuit board of the image sensor (120). The pad (126) according to an embodiment of the present invention may be located in the non-active area of ​​the image sensor or on the substrate. And one end of the wire may be connected to the image sensor through a pad or the like. The other end of the wire may also be connected to the substrate through a pad or the like.

[0066] As an example, the pad (126) may be made of a metal for electrical connection. The pad (126) may include a metal (e.g., Al). And the pad (126) may be made of multiple layers. The pad (126) may include a first layer (L1), a second layer (L2), and a third layer (L3).

[0067] The first layer (L1) may be located at the lowermost portion of the pad (126). The first layer (L1) may be in contact with a substrate (or an inactive area). Here, the substrate may include a substrate of an image sensor in addition to a circuit board. The first layer (L1) may be formed of the aforementioned metal material. For example, the first layer (L1) may include aluminum (Al).

[0068] The second layer (L2) may be disposed on the first layer (L1). That is, the second layer (L2) may be located between the first layer (L1) and the third layer (L3). The second layer (L2) may include the metal material of the first layer (L1). The second layer (L2) may include a metal oxide. For example, the second layer (L2) may include aluminum oxide (AlxOy).

[0069] The third layer (L3) may be disposed on the second layer (L2). The third layer (L3) may be in contact with the wire. The third layer (L3) may include a metal oxide fluoride or a metal fluoride. For example, the third layer (L3) may include aluminum oxide fluoride (AlOF) and aluminum fluoride (AlF). The third layer (L3) may be formed by plasma treatment as described below. For example, the third layer (L3) may be formed on the second layer (L2) by converting a gas containing fluorine into a plasma state using a high-frequency power source and then reacting the ions and radicals with a substrate and a pad. Accordingly, the pad (126) may include fluorine (F) due to the third layer (L3) and the plasma treatment. The atomic ratio of fluorine (F) in the entire pad (126) may be 1% to 15%. At this time, if the atomic ratio (at %) of fluorine (F) in the entire pad (126) is less than 1%, chemical stability may be reduced. In addition, if the atomic ratio (at %) of fluorine (F) in the entire pad (126) is greater than 15%, the contamination level of the pad may increase, which may deteriorate the connection or bonding with the wire. Therefore, there is a limit to the reduction in electrical reliability.

[0070] FIG. 4 is a graph of an X-ray photoelectron spectroscopy (XPS) spectrum for a third layer of a pad in an image sensor package according to an embodiment, and FIG. 5 is a graph of an XPS spectrum for a second layer of a pad in an image sensor package according to an embodiment. FIG. 6 is a full graph of XPS spectra for the third layer and the second layer of a pad in an image sensor package, and FIG. 7 is an enlarged view of a portion K1 in FIG. 6.

[0071] First, FIG. 4 is a graph of an X-ray photoelectron spectroscopy (XPS) spectrum for a pad (e.g., an upper surface of the pad) in an image sensor package according to an embodiment, and FIG. 5 is a graph of an XPS spectrum for a second layer of the pad (e.g., an upper surface of the second layer) in an image sensor package according to an embodiment.

[0072] In the pad according to the embodiment, the thickness of the first layer relative to the total thickness may be 1:0.97 to 1:0.99. For example, the thickness of the first layer in the pad may be 1 μm to 3 μm. The second layer may be 3 nm to 30 nm or less. And the thickness of the third layer may be 1 nm to 10 nm. Accordingly, the XPS (X-ray Photoelectron Spectroscopy) spectrum in FIG. 4 may be a result of XPS analysis performed on the surface after etching or removing within a range of 10 nm from the upper surface or the surface of the upper surface of the pad. And the XPS spectrum in FIG. 5 may be a result of XPS analysis performed on the surface after etching or removing within a range of 10 nm to 40 nm from the upper surface of the pad.

[0073] FIG. 6 is a graph combining the XPS spectra of FIGS. 4 and 5, showing an XPS spectrum (SP1) which is a result of XPS analysis performed on the surface after the upper surface or at least a portion of the third layer or pad is removed by etching or separation, and an X-ray Photoelectron Spectroscopy (XPS) spectrum (SP2) which is a result of XPS analysis performed on the surface of the second layer (or at least a portion of the second layer) exposed after the third layer (L3) is removed by etching or separation.

[0074] First, X-ray photoelectron spectroscopy (XPS) is a technique for analyzing the chemical state of the surface of a target object. XPS is a technology that measures photoelectrons emitted from the surface of a material to analyze the elemental composition and chemical bonding state of that surface. XPS can analyze a region with a depth of nm on the sample surface. For example, XPS can analyze a region with a depth of 10 nm to 20 nm. Through XPS analysis, substances adsorbed on the surface, attached contaminants, and oxide layers can be analyzed.

[0075] This XPS is performed by irradiating the surface of a target with high-energy X-rays, and when photoelectrons are emitted from the atoms on the surface, the emitted photoelectrons are detected by an analysis device, and the elements and chemical states (e.g., oxidation states) are analyzed based on the binding energy of each photoelectron. In other words, since each element has a unique binding energy, the elements contained in the sample can be identified by analyzing the binding energy through XPS. In addition, since the energy of the emitted photoelectrons changes depending on the chemical environment of the emitted atoms, the chemical state (e.g., oxidation state) of the elements can be identified by analyzing the subtle changes in binding energy through XPS. In addition, XPS can quantitatively analyze the relative intensity of elements present on the surface. Therefore, the relative intensity difference for each element can be analyzed based on the intensity or density of the 'counts per second, signal intensity (c / s)' described below. In the XPS spectrum graph, the X-axis represents bonding energy or electron binding energy, and the unit can generally be electron volts (eV). The Y-axis in the graph stands for "c / s" (counts per second), which can be a value representing the number of photoelectrons detected per second in XPS measurements. The Y-axis is described below as "intensity," etc.

[0076] Furthermore, as XPS analysis conditions, a source with an energy of 1 kV to 15 kV can be applied to XPS analysis. In addition, the beam size can be 10 μm to 500 μm. In addition, as sputtering conditions, an ion source may be used with argon ions (Ar+), and the ion energy can be 1 keV to 5 keV. The sputtering rate can be measured in nm / min units. However, these conditions can be modified depending on the adjusted conditions or sample. In this example, the beam size is 120 μm, and the energy of the X-ray source is set to 3 kV.

[0077] First, as illustrated in FIG. 4, when performing XPS analysis on the third layer (L3) of the pad, a first peak (P1) having the greatest intensity may exist in the XPS spectrum (SP1) at a binding energy of 66 (eV) to 86 (eV). Furthermore, the first peak (P1) may have the greatest intensity among binding energies of 70 (eV) to 80 (eV). In addition, the first peak (P1) may also have the greatest intensity at a binding energy of 74 (eV) to 76 (eV). That is, when performing XPS analysis as described above, the spectrum may have the first peak (P1).

[0078] Additionally, the binding energy in the XPS spectrum below may be 66 (eV) to 86 (eV). The first peak (P1) may indicate the intensity of aluminum oxide fluoride (AlOF) and aluminum fluoride (ALF). That is, aluminum oxide fluoride and / or aluminum fluoride may exist on the upper portion of the pad (126).

[0079] Accordingly, the chemical stability of the pad can be significantly increased. That is, the presence of aluminum oxide and aluminum fluoride suppresses oxidation or corrosion of the pad surface, thereby increasing the chemical stability and corrosion resistance of the pad. Furthermore, as described below, bonding strength to substrates (wires) and the like can also be enhanced. Consequently, the reliability of the image sensor package can be improved.

[0080] In addition, when analyzing the second layer (L2) of the pad of the image sensor package as illustrated in FIG. 5, a second peak (P2) having the greatest intensity may exist at a binding energy of 66 (eV) to 86 (eV) in the XPS spectrum (SP2). In addition, the XPS spectrum may have a second peak (P2) having the greatest intensity at a binding energy of 70 (eV) to 80 (eV). In addition, the XPS spectrum may have a second peak (P2) having the greatest intensity at a binding energy of 74 (eV) to 76 (eV).

[0081] Additionally, when analyzing the second layer (L2) of the pad of the image sensor package by XPS, the XPS spectrum may have a third peak (P3) having the greatest intensity at a binding energy of 73 (eV) or less. Furthermore, the third peak (P3) in the spectrum may have the greatest intensity at a binding energy of 70 (eV) to 73 (eV).

[0082] The intensity of the second peak (P2) may be greater than the intensity of the third peak (P3). Alternatively, the intensity of the third peak (P3) may be less than the intensity of the second peak (P2).

[0083] This configuration further enhances surface protection, i.e., corrosion resistance, of the pad. Furthermore, interface stability for subsequent processing is further improved, and surface adhesion is significantly secured.

[0084] Referring further to FIGS. 6 and 7, the XPS spectrum (SP1+SP2) will be described below, and the description of intensity, binding energy, etc. will be described based on the XPS spectrum. In the XPS spectrum, the first peak (P1) may be greater than the second peak (P2). That is, the intensity (i1) of the first peak (P1) may be greater than the intensity (i2) of the second peak (P2). Furthermore, the binding energy corresponding to the first peak (P1) may be greater than the binding energy corresponding to the second peak (P2).

[0085] That is, the aforementioned plasma treatment on the second layer (L2) may further form metal oxide fluoride and / or metal fluoride on the metal and metal oxide (or nitride) in the pad. Accordingly, the pad may include metal, metal oxide, metal oxide fluoride and / or metal fluoride. In particular, the proportion of the metal itself throughout the pad may be reduced.

[0086] In particular, the surface properties of the pad can be modified by controlling the aluminum fluoride (AlF₃) introduced through plasma treatment. Furthermore, as described above, the ratio of fluorine within the pad can also be controlled.

[0087] Accordingly, the pad has improved corrosion resistance, and the bonding strength between the pad and the substrate (or wire) is also greatly improved, so that the electrical reliability of the image sensor package can be further improved.

[0088] Additionally, the intensity difference (ig1) between the first peak (P1) and the second peak (P2) may be smaller than the intensity difference (ig2) between the second peak (P2) and the third peak (P3).

[0089] Additionally, the difference in intensity (ig1) between the first peak (P1) and the second peak (P2) may be smaller than the intensity (i2) of the second peak (P2) and smaller than the intensity (i3) of the third peak (P3).

[0090] Additionally, the intensity difference (ig2) between the second peak (P2) and the third peak (P3) may be less than 0.5 times the intensity (i1) of the first peak (P1).

[0091] In other words, the intensity difference between the first peak (P1) and the second peak (P2) may be relatively greater than the intensity difference between each other compared to the third peak (P3).

[0092] Accordingly, the upper surface (or surface) of the pad is fluorinated or oxidized, so that the corrosion resistance can be further improved by maintaining the chemical stability of the pad.

[0093] Additionally, the intensity (i2) of the second peak (P2) may be less than twice the intensity (i3) of the third peak (P3). By this configuration, the corrosion resistance of the pad is further improved, so that cracks, etc. from the lower first layer can be easily prevented from penetrating into the interior from the external environment.

[0094] And in the XPS spectrum, the difference in binding energy (bg1) between the first peak (P1) and the second peak (P2) may be smaller than the difference in binding energy (bg2) between the second peak (P2) and the third peak (P3).

[0095] By this configuration, the pad according to the embodiment can have a surface and intermediate region (e.g., the second layer) with more oxidized and fluorinated metal than metal (Al). Accordingly, the pad can provide improved corrosion resistance, increased chemical stability, easier selectivity in etching processes, etc., and improved thermal stability.

[0096] Furthermore, a valley (VR) may exist between the second peak (P2) and the third peak (P3) in the spectrum (SP2). The intensity of the valley (VR) may be less than the intensity (i3) of the third peak (P3). The binding energy of the valley (VR) may be located within the range of 72 (eV) and 74 (eV). Furthermore, the intensity of the valley (VR) may be greater than the intensity of the binding energy corresponding to the valley (VR) in the spectrum (SP1). Accordingly, it can be seen that the metal specific gravity decreases as it approaches the upper surface of the pad. That is, it can be seen more clearly that the closer the location is to the upper surface of the pad, the lower the content of the metal component is, and accordingly, the metal oxide fluoride or metal fluoride increases, thereby improving the chemical stability.

[0097] Fig. 8 is a perspective view of a mobile terminal to which a camera device according to an embodiment is applied.

[0098] As illustrated in FIG. 8, the mobile terminal (1500) of the embodiment may include a camera device (1000), a flash module (1530), and an autofocus device (1510) provided on the rear.

[0099] The camera device (1000) may include an image capturing function and an autofocus function. For example, the camera device (1000) may include an autofocus function using an image.

[0100] The camera device (1000) processes still or moving image frames obtained by an image sensor in a shooting mode or a video call mode.

[0101] The processed image frame can be displayed on a predetermined display unit and stored in memory. A camera (not shown) may also be placed on the front of the mobile terminal body.

[0102] For example, the camera device (1000) may include a first camera device and a second camera device, and OIS may be implemented together with AF or zoom functions by the first camera device (1000A).

[0103] The flash module (1530) may include a light-emitting element that emits light internally. The flash module (1530) may be operated by the camera operation of the mobile terminal or by the user's control.

[0104] The autofocus device (1510) may include one of the packages of surface-emitting laser devices as the light-emitting unit.

[0105] The autofocus device (1510) may include an autofocus function using a laser. The autofocus device (1510) may be primarily used in conditions where the autofocus function using the image of the camera device (1000) is degraded, such as at a close range of 10 m or less or in a dark environment.

[0106] The autofocus device (1510) may include a light emitting unit including a vertical cavity surface emitting laser (VCSEL) semiconductor device and a light receiving unit that converts light energy into electrical energy, such as a photodiode.

[0107] Fig. 9 is a perspective view of a vehicle to which a camera device according to an embodiment is applied.

[0108] For example, FIG. 9 is an exterior view of a vehicle equipped with a vehicle driving assistance device to which a camera device (1000) according to an embodiment is applied.

[0109] Referring to FIG. 9, the vehicle (700) of the embodiment may be equipped with wheels (13FL, 13FR) that rotate by a power source and a predetermined sensor. The sensor may be a camera sensor, but is not limited thereto.

[0110] The camera may be a camera sensor to which a camera device (1000) according to an embodiment is applied. The vehicle (700) according to the embodiment can obtain image information through a camera that captures a front image or a surrounding image, and can use the image information to determine a lane non-identification situation and create a virtual lane when the lane is not identified.

[0111] For example, a camera can capture the front of a vehicle (700) to obtain a front image, and a processor (not shown) can analyze an object included in the front image to obtain image information.

[0112] For example, if a camera captures images of objects such as lanes, adjacent vehicles, obstructions, and indirect road markings, such as median strips, curbs, and street trees, the processor can detect these objects and include them in the image information. At this time, the processor can obtain distance information from the objects detected by the camera to further supplement the image information.

[0113] The image information may be information about an object captured in the image. Such a camera may include an image sensor and an image processing module.

[0114] A camera can process still or moving images obtained by an image sensor (e.g., CMOS or CCD).

[0115] The image processing module can process still images or videos acquired through an image sensor, extract necessary information, and transmit the extracted information to the processor.

[0116] At this time, the camera may include a stereo camera to improve the measurement accuracy of the object and to secure more information such as the distance between the vehicle (700) and the object, but is not limited thereto.

[0117] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by those skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as being included within the scope of the embodiments.

[0118] Although the above description focuses on examples, these are merely examples and are not intended to limit the examples. Those skilled in the art will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present examples. For example, each component specifically shown in the examples can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

Claims

1. Substrate; An image sensor disposed on the substrate; a pad disposed on the substrate; and A connecting member having one end connected to the image sensor and the other end connected to the pad; The pad comprises a first layer of metal; a second layer comprising a metal oxide disposed on the first layer; and a third layer disposed on the second layer. When XPS analysis was performed on the upper surface of the third layer, the binding energy had a first peak at 74 (eV) to 76 (eV), When XPS analysis was performed on the upper surface of the second layer, the binding energy had a second peak at 74 (eV) to 76 (eV), An image sensor package wherein the first peak is greater than the second peak.

2. In paragraph 1, An image sensor package having a third peak at a binding energy of 70 (eV) to 73 (eV) when analyzed by XPS on the upper surface of the second layer.

3. In paragraph 2, An image sensor package wherein the third peak is smaller than the second peak.

4. In paragraph 2, An image sensor package wherein the difference in binding energy between the first peak and the second peak is smaller than the difference in binding energy between the second peak and the third peak.

5. In paragraph 2, An image sensor package wherein the intensity difference between the first peak and the second peak is smaller than the intensity difference between the second peak and the third peak.

6. In paragraph 2, An image sensor package wherein the difference in intensity between the first peak and the second peak is smaller than the intensity of the second peak.

7. In paragraph 2, An image sensor package wherein the difference in intensity between the second peak and the third peak is less than 0.5 times the intensity of the first peak.

8. In paragraph 2, An image sensor package wherein the intensity of the second peak is less than twice the intensity of the third peak.

9. In paragraph 2, An image sensor package wherein the third peak is smaller than the first peak.

10. In paragraph 2, The first layer comprises aluminum (Al), The second layer comprises aluminum oxide (AlxOy), The third layer is an image sensor package comprising aluminum fluoride oxide (AlOF).

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