Heating furnace and semiconductor deposition system

Abstract

The present application discloses a heating furnace and a semiconductor deposition system. The heating furnace comprises a thermal insulation tube and a process tube. The thermal insulation tube is sleeved on the periphery of the process tube. The process tube and the thermal insulation tube are spaced apart to form a heat conduction space, and heating members are arranged at intervals in the heat conduction space. The heating furnace further comprises at least two gas outlet groups and at least two gas inlet pipes which are in one-to-one correspondence to the gas outlet groups. Each gas outlet group comprises at least one gas outlet pipe, the gas outlet pipes are each arranged between adjacent heating members, and each gas outlet pipe is provided with gas outlet holes communicated with the heat conduction space. The gas outlet pipes in a same gas outlet group are separately communicated with a same gas inlet pipe. By means of the described method, the heating furnace of the present application can implement effective zoned temperature control of the heating furnace by means of the gas inlet pipes and the gas outlet groups.

Description

Heating furnace and semiconductor deposition system

[0001] This application claims priority to Chinese Patent Application No. 2024111899594, filed on August 28, 2024, entitled “Heating Furnace and Semiconductor Deposition System”, which is incorporated herein by reference. [Technical Field]

[0002] This application relates to the field of semiconductor technology, and in particular to heating furnaces and semiconductor deposition systems. [Background Technology]

[0003] In semiconductor deposition equipment, a furnace is typically used to heat the substrate to a specific temperature to meet the process conditions required for deposition. In related technologies, the furnace needs to be cooled down after heating before the next step of the process can proceed. The cooling time of the furnace directly affects the deposition process time and thus the throughput. Furthermore, furnace heating may require preheating, and a prolonged preheating time also impacts throughput. [Summary of the Invention]

[0004] Embodiments of this application provide a heating furnace and a semiconductor deposition system, wherein the heating furnace can effectively control the temperature of the heating furnace in zones.

[0005] In a first aspect, embodiments of this application provide a heating furnace. The heating furnace includes an insulation pipe and a process pipe. The insulation pipe is sleeved around the outer periphery of the process pipe. A heat-conducting space is formed between the process pipe and the insulation pipe, and heating elements are arranged at intervals along the axial direction of the process pipe within the heat-conducting space. The heating furnace also includes at least two air outlet groups and at least two air inlet pipes corresponding to each air outlet group. Each air outlet group includes at least one air outlet pipe, which is disposed between adjacent heating elements and has an air outlet hole communicating with the heat-conducting space. The air outlet pipes in the same air outlet group are respectively connected to the same air inlet pipe.

[0006] Optionally, multiple heating elements are spaced apart along the axial direction of the process tube;

[0007] Alternatively, multiple heating elements may be arranged at intervals along the circumference of the process tube.

[0008] Optionally, the heating furnace also includes an exhaust pipe located near one end of the process pipe and connected to the heat conduction space.

[0009] Optionally, the outlet pipes in the same outlet group are arranged adjacent to each other.

[0010] Optionally, the intake pipe is equipped with a regulating valve, and a temperature detection component is also installed in the process pipe and / or the heat conduction space, with the regulating valve and the temperature detection component being communicatively connected.

[0011] Optionally, multiple heating elements are spaced apart along the axial direction of the process pipe, and the exhaust pipe includes an extension section and a surrounding section connected to each other. The surrounding section is arranged circumferentially around the process pipe, and the extension section is used to connect to the intake pipe.

[0012] Optionally, multiple heating elements are spaced apart along the axial direction of the process tube, and multiple air outlets are spaced apart around the process tube in the circumferential direction of the air outlet pipe, with the air outlets facing the process tube.

[0013] Optionally, multiple heating elements are arranged at intervals along the circumference of the process tube, and at least two air outlet groups are arranged at intervals along the axial direction of the process tube, with air outlet pipes in the same air outlet group arranged at intervals along the circumference of the process tube.

[0014] Optionally, the gas outlet pipe includes multiple first gas outlet sections and multiple second gas outlet sections connected to each other. The multiple first gas outlet sections are arranged side by side along the axial direction of the process pipe and extend circumferentially along the process pipe. The multiple second gas outlet sections are respectively connected to the adjacent ends of two adjacent first gas outlet sections.

[0015] Optionally, at least one partition is provided in the heat conduction space, which divides the heat conduction space into multiple subspaces, which are isolated from each other. The heating furnace includes multiple exhaust pipes, which are connected to the subspaces one by one.

[0016] Secondly, embodiments of this application provide a semiconductor deposition system. The semiconductor deposition system includes a gas supply device and the aforementioned heating furnace, wherein the gas supply device is used to supply gas into the gas outlet pipe.

[0017] Optionally, the heating furnace also includes an exhaust pipe, one end of which is connected to the heat conduction space and the other end of which is connected to the cooling equipment.

[0018] The cooling equipment includes a cooling chamber, a liquid inlet pipe, and a level gauge. The level gauge is installed inside the cooling chamber, which is connected to the air extraction pipe, the liquid inlet pipe, and the outside. The cooling chamber is used to hold the cooling substrate.

[0019] Optionally, the heating furnace also includes an exhaust pipe, one end of which is connected to the heat conduction space and the other end of which is connected to the heat exchange device.

[0020] The heat exchange device includes a heat exchange chamber and heat exchange pipes. The heat exchange chamber is connected to the exhaust pipe, and the heat exchange pipes are coiled inside the heat exchange chamber and isolated from the heat exchange chamber.

[0021] The beneficial effects of this application are as follows: Unlike existing technologies, by setting up different parallel gas outlet groups within the heat-conducting space of the heating furnace, different gas outlet groups can be controlled to exit gas by controlling different gas inlet pipes. These different gas outlet groups correspond to different areas of the process tube. This method creates different temperature control zones. During the temperature control of the heating furnace, specific gas inlet pipes can be controlled to enter gas, and specific gas outlet groups can be controlled to exit gas, thereby achieving cooling of specific areas of the process tube. By setting up gas outlet pipes, gas from the gas supply equipment can be introduced into the heat-conducting space, thereby reducing the temperature of the heat-conducting space and also reducing the temperature of the heating elements and process tube. By setting separate gas outlet pipes between the heating elements, the introduced gas can enter the heat-conducting space and between the heating elements evenly, which helps improve the uniformity of cooling. The heating furnace of this application can effectively control the temperature of the heating furnace in zones through gas inlet pipes and gas outlet groups. The semiconductor deposition system provided by this application can further improve the temperature control rate of the heating furnace, shorten the temperature control time, reduce process time, and increase production capacity. [Attached Image Description]

[0022] Figure 1 is a structural schematic diagram of an embodiment of the heating furnace of this application;

[0023] Figure 2 is a cross-sectional structural diagram of the heating furnace shown in Figure 1;

[0024] Figure 3 is a partially enlarged structural schematic diagram of the cross-sectional view shown in Figure 2;

[0025] Figure 4 is a schematic diagram of the structure of an embodiment of the deposition system of this application;

[0026] Figure 5 is a schematic diagram of another embodiment of the deposition system of this application;

[0027] Figure 6 is a structural schematic diagram of an embodiment of the air inlet pipe and air outlet pipe of this application;

[0028] Figure 7 is a structural schematic diagram of an embodiment of the air inlet pipe and air outlet pipe of this application;

[0029] Figure 8 is a cross-sectional structural schematic diagram of another embodiment of the heating furnace shown in Figure 1.

[0030] Reference numerals: 1-Semiconductor deposition system; 10-Heating furnace, 11-Insulation pipe, 12-Process pipe, 13-Heat conduction space, 131-Gap section, 132-Subspace, 14-Heating element, 15-Outlet pipe, 151-Circulating section, 152-Extension section, 1511-Outlet, 16-Inlet pipe, 17-Regulating valve, 18-Extraction pipe, 19-Negative pressure pump; 20-Cooling equipment, 21-Cooling chamber, 22-Liquid inlet pipe, 23-Level gauge; 30-Heat exchange device, 31-Heat exchange chamber, 311-Inlet, 32-Heat exchange pipe.

Detailed Implementation Methods

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0032] In semiconductor deposition equipment, a heating furnace is typically used to heat the substrate to a specific temperature to meet the process conditions required for deposition. After heating, the furnace needs to be cooled before the next process can proceed. The cooling time of the furnace directly affects the deposition process time and thus the throughput. Process time is a crucial factor affecting throughput. Analysis shows that increasing the furnace's cooling rate and shortening the cooling time can effectively reduce process time and increase throughput. In related technologies, the cooling methods used result in uneven cooling rates across different temperature zones within the furnace, making it impossible to adjust the rate individually. This leads to the furnace constantly switching its power output on and off, damaging the heating elements and increasing the time required for temperature adjustment. To address these technical problems, this application provides the following embodiments.

[0033] Referring to Figures 1, 4, and 5, this application provides a semiconductor deposition system 1. The semiconductor deposition system 1 includes a gas supply device and a heating furnace 10. The gas supply device provides gas at a temperature lower than the temperature inside the process tube 12, thereby cooling the heating furnace 10. The semiconductor deposition system 1 may also include a cooling device 20 or a heat exchange device 30, as detailed in the following embodiments. In other embodiments, the gas supply device may also provide gas at a temperature higher than the temperature inside the process tube 12, thereby preheating the process tube 12.

[0034] Referring to Figures 1 to 3, this application embodiment provides a heating furnace 10. The heating furnace 10 includes a heat-insulating tube 11 and a process tube 12. The heat-insulating tube 11 is sleeved around the outer periphery of the process tube 12. The interior of the process tube 12 is used to accommodate a substrate or a carrier such as a quartz boat or a wafer carrier. Optionally, a process gas can also be introduced into the interior of the process tube 12 to achieve thin film deposition on the substrate. The process tube 12 can be a quartz tube. The process tube 12 can also be made of high-temperature resistant materials such as silicon carbide or ceramics. The heat-insulating tube 11 is used to reduce heat loss during the heating process. The material of the heat-insulating tube 11 can be a high-temperature resistant material such as ceramic fiber or alumina fiber.

[0035] A heat-conducting space 13 is formed between the process tube 12 and the insulation tube 11. Heating elements 14 are arranged at intervals along the axial direction or circumferential direction of the process tube 12 within the heat-conducting space 13. The heat-conducting space 13 can accommodate the heating elements 14. The heat-conducting space 13 can transfer the heat generated by the heating elements 14 to the process tube 12, thereby achieving heating or cooling of the process tube 12.

[0036] The heating furnace 10 also includes at least two air outlet groups and at least two air inlet pipes 16 corresponding to each air outlet group. Each air outlet group includes at least one air outlet pipe 15, which are respectively disposed between adjacent heating elements 14. At least one air outlet pipe 15 in the same air outlet group is connected to the same air inlet pipe 16. In other words, the different air outlet groups are connected in parallel, and different air outlet groups can independently intake air through different air inlet pipes 16, and different air outlet groups can independently exhaust air. The air outlet pipe 15 has an air outlet hole 1511 communicating with the heat conduction space 13. Optionally, the heating element 14 and the air outlet pipe 15 are embedded in the inner wall of the insulation pipe 11.

[0037] By providing exhaust pipes 15, low-temperature gas from the gas supply equipment can be introduced into the heat-conducting space 13, thereby reducing the temperature of the heat-conducting space 13 and also lowering the temperatures of the heating elements 14 and the process tube 12. By providing exhaust pipes 15 between the heating elements 14, the introduced gas can be evenly distributed into the heat-conducting space 13 and between the heating elements 14. On one hand, gas can be simultaneously introduced into the exhaust pipes 15; in this case, providing exhaust pipes 15 between the heating elements 14 separately is beneficial for uniform cooling. On the other hand, by introducing gas into different exhaust pipes 15, zoned cooling can be achieved.

[0038] Furthermore, by setting different exhaust groups in parallel, controlling the intake of different intake pipes 16 allows for the control of the exhaust of different exhaust groups. Different exhaust groups correspond to different areas of the process tube 12. This method creates different temperature control zones. During temperature control of the heating furnace 10, specific intake pipes 16 can be controlled to allow air intake, and specific exhaust groups can be controlled to allow air exhaust, thereby achieving cooling of specific areas of the process tube 12.

[0039] In some embodiments, a plurality of heating elements 14 are arranged at intervals along the axial direction of the process tube 12 within the heat conduction space 13. Each heating element 14 is arranged circumferentially around the process tube 12. Each heating element 14 may be arranged independently of each other, or the plurality of heating elements 14 may be connected in parallel.

[0040] In other embodiments, a plurality of heating elements 14 are arranged at intervals along the axial direction of the process tube 12 within the heat-conducting space 13. Each heating element 14 is arranged circumferentially around the process tube 12. Each heating element 14 may extend along a spiral direction. The plurality of heating elements 14 may be connected end-to-end in series to form a heating element 14 spirally extending around the outer periphery of the process tube 12.

[0041] In some embodiments, multiple heating elements 14 are spaced apart circumferentially along the process tube 12, and the heating elements 14 can extend along the axial direction of the process tube 12. Multiple heating elements 14 arranged circumferentially can heat the process tube 12. Multiple heating elements 14 arranged circumferentially can constitute a heating group, and multiple heating groups can be arranged along the axial direction of the process tube 12. In this way, each heating group can heat a region of the process tube 12, and the region corresponding to each heating group naturally forms a temperature zone. Heating elements 14 within the same heating group can be activated simultaneously to heat the region corresponding to that heating group. The size of the temperature zone corresponding to the heating group can be controlled by setting different extension lengths of the heating elements 14 along the axial direction of the process tube 12.

[0042] Furthermore, multiple exhaust pipes 15 are spaced apart along the circumference of the process pipe 12, and are positioned between adjacent heating elements 14 in the circumferential direction. These circumferentially spaced exhaust pipes 15 can form a aforementioned exhaust group. The exhaust pipes 15 in the same exhaust group are connected to the same inlet pipe 16. Multiple exhaust groups are also spaced apart along the axial direction of the process pipe 12. By setting multiple exhaust groups, multiple heating groups can be corresponding to multiple temperature zones formed by the heating groups. The exhaust pipes 15 in the exhaust group corresponding to the same temperature zone are controlled by the same inlet pipe 16, thereby enabling the exhaust group to preheat or cool that temperature zone.

[0043] Specifically, multiple heating elements 14 can be spaced apart along the circumference of the process tube 12. Each heating element 14 includes multiple first heating sections and multiple second heating sections. The multiple first heating sections are arranged side-by-side along the axial direction of the process tube 12 and extend circumferentially. The multiple second heating sections are respectively connected to the adjacent ends of two adjacent first heating sections. Further, multiple heating elements 14 arranged circumferentially along the process tube 12 constitute a heating group. Multiple heating groups are arranged side-by-side along the axial direction of the process tube 12. The heating elements 14 in the same heating group can be connected in series or in parallel. The connection between heating groups is a parallel connection.

[0044] Furthermore, the exhaust pipe 15 is disposed between circumferentially adjacent heating elements 14. The exhaust pipe 15 includes multiple first exhaust sections and multiple second exhaust sections. The multiple first exhaust sections are arranged side-by-side along the axial direction of the process pipe 12 and extend circumferentially along the process pipe 12. The multiple second exhaust sections are respectively connected to the adjacent ends of two adjacent first exhaust sections. In other words, in this embodiment, the exhaust pipe 15 can be configured to conform to the shape of the heating element 14, thereby allowing the exhaust pipe 15 to better match the shape of the heating element 14, making the heat conduction distance more uniform, and improving the uniformity of cooling.

[0045] In other embodiments, the process tube 12 needs to be preheated. In this case, the gas outlet pipe 15 can also introduce gas with a temperature higher than that of the process tube 12 or the heating element 14 to achieve preheating of the process tube 12. The following embodiments of this application use the cooling of the heating furnace 10 as an example. The heat exchange process for preheating the heating furnace 10 may differ in method, but the principle is the same.

[0046] In some embodiments, the heating furnace 10 further includes an extraction pipe 18, which is disposed near one end of the process pipe 12 and communicates with the heat-conducting space 13. The extraction pipe 18 is capable of removing gas from the heat-conducting space 13. With continuous gas discharge from the outlet pipe 15 and continuous gas extraction from the extraction pipe 18, airflow circulation can be formed within the heat-conducting space 13, thereby increasing the cooling rate.

[0047] In some embodiments, referring to FIG4, the heating furnace 10 further includes an exhaust pipe 18, one end of which is connected to the heat conduction space 13, and the other end of which is connected to the cooling device 20.

[0048] The cooling device 20 includes a cooling chamber 21, a liquid inlet pipe 22, and a level gauge 23, with the level gauge 23 located within the cooling chamber 21. The cooling chamber 21 is connected to an exhaust pipe 18, the liquid inlet pipe 22, and the outside. The cooling chamber 21 holds the cooling substrate, which can be a coolant such as water or oil. The exhaust pipe 18 draws hot air from the heat-conducting space 13 into the cooling chamber 21. The cooling substrate within the cooling chamber 21 absorbs heat from the hot air, lowering its temperature and allowing for safe discharge. During heat absorption, the cooling substrate evaporates, reducing its quantity. The level gauge 23 detects the remaining amount of cooling substrate and issues a warning or control signal. The liquid inlet pipe 22 introduces the cooling substrate into the cooling chamber 21. Optionally, the cooling device 20 includes a control valve. The control valve is communicatively connected to the level gauge 23. If the level gauge 23 detects that the remaining amount of cooling substrate in the cooling chamber 21 is lower than the preset level, it can send a signal to open the control valve to replenish the cooling substrate. After the cooling substrate is replenished, the level gauge 23 can send a signal to close the control valve.

[0049] In some embodiments, referring to FIG5, the heating furnace 10 further includes an exhaust pipe 18, one end of which is connected to the heat conduction space 13, and the other end of which is connected to the heat exchange device 30.

[0050] The heat exchange device 30 includes a heat exchange chamber 31 and a heat exchange pipe 32. The heat exchange chamber 31 is connected to the exhaust pipe 18, and the heat exchange pipe 32 is coiled inside the heat exchange chamber 31 and is isolated from the heat exchange chamber 31. The heat exchange chamber 31 can accommodate the heat exchange pipe 32. The heat exchange chamber 31 can also accommodate the hot gas discharged from the exhaust pipe 18. The heat exchange pipe 32 can hold the liquid or gas that needs to be heated. The hot gas discharged from the exhaust pipe 18 can diffuse within the heat exchange chamber 31, thereby heating the heat exchange pipe 32 coiled within the heat exchange chamber 31 and the liquid or gas inside it, to achieve heat reuse. The coiling of the heat exchange pipe 32 within the heat exchange chamber 31 increases the contact area with the hot gas, thereby increasing the heat exchange efficiency.

[0051] In some embodiments, the heat exchange chamber 31 has a plurality of spaced-apart air inlets 311, and the exhaust pipe 18 is connected to the air inlets 311 through a plurality of branches. The spaced-apart air inlets 311 allow the hot air to be evenly distributed within the heat exchange chamber 31.

[0052] Based on the above embodiments, a negative pressure pump 19 is provided between the air extraction pipe 18 and the cooling device 20 or between the air extraction pipe 18 and the heat exchange device 30. The negative pressure pump 19 is the power source for the air extraction pipe 18 to generate suction force.

[0053] In some embodiments, as shown in Figures 1, 6, and 7, the heating furnace 10 further includes an air inlet pipe 16. The air inlet pipe 16 can be made of high-temperature resistant materials such as ceramic or silicon carbide. The air inlet pipe 16 is connected to the air outlet pipe 15, and each air inlet pipe 16 is individually equipped with a regulating valve 17. The air inlet pipe 16 can be connected to a gas supply device, thereby providing a gas source to the air outlet pipe 15. Optionally, an insulation pipe 11 is installed through the air inlet pipe 16. The regulating valve 17 installed in the air inlet pipe 16 can regulate the air intake, thereby controlling the airflow switch and flow rate in the air outlet pipe 15. The regulating valve 17 can be one or more types of speed control valves or solenoid valves. The air inlet pipe 16 and the air outlet pipe 15 can be connected in a one-to-one correspondence, or multiple air outlet pipes 15 can be connected to one air inlet pipe 16.

[0054] In some embodiments, the air inlet pipe 16 is provided with a regulating valve 17. A temperature detection component is also provided inside the process pipe 12. The temperature detection component can detect the temperature inside the process pipe 12, and / or the temperature detection component can detect the temperature of the heat-conducting space 13 of the process pipe. The temperature detection component can be a thermocouple thermometer or an infrared thermometer, etc., and is not specifically limited here. The regulating valve 17 and the temperature detection component are communicatively connected. Specifically, any one or both of the regulating valve 17 and the temperature detection component can be provided with an electrical control component. The heating furnace 10 may also include a separate electrical control component connecting the temperature detection component and the regulating valve 17. The regulating valve 17 can respond to the temperature detected by the temperature detection component. When the temperature exceeds a preset value, the regulating valve 17 corresponding to the corresponding temperature zone can be opened, thereby cooling the process pipe 12.

[0055] The electrical control component can be a circuit board with a chip or a programmable logic controller (PLC), etc., and is not specifically limited here. In addition to controlling the opening and closing of the regulating valve 17, the electrical control component can also control the flow rate of the regulating valve 17, thereby optimizing the control of cooling.

[0056] In some embodiments, the exhaust pipes 15 in the same exhaust group are arranged adjacent to each other. For example, in Figures 6 and 7, the same intake pipe 16 connects to three or fewer adjacent exhaust pipes 15. One exhaust pipe 15 can be connected one-to-one with one intake pipe 16. Alternatively, two adjacent exhaust pipes 15 can be connected to the same intake pipe 16. Or, three adjacent exhaust pipes 15 can be connected to the same intake pipe 16. In other words, the intake pipe 16 and the exhaust pipe 15 are connected in series. Specifically, two adjacent exhaust pipes 15 can be connected in parallel and then connected in series with the same intake pipe 16. Alternatively, three adjacent exhaust pipes 15 can be connected in parallel and then connected in series with the same intake pipe 16. In other embodiments, the exhaust group can consist of four, five, six, or more adjacent exhaust pipes 15, which is not specifically limited here.

[0057] Furthermore, each inlet pipe 16 can be independently equipped with a regulating valve 17, which controls the inlet switch or flow rate. Through the aforementioned technical solution, zoned control of cooling in the outlet pipe 15 can be achieved. Specifically, a thermocouple can be installed inside the process pipe 12. The regulating valve 17 is communicatively connected to the thermocouple. When the temperature in a certain temperature zone of the process pipe 12 is too high, the corresponding regulating valve 17 can be opened via electrical control. Adjusting the regulating valve 17 allows cooling gas to enter the heat-conducting space 13 through the inlet pipe 16 and outlet pipe 15, directly cooling the corresponding process pipe 12 and heating element 14, thus lowering the temperature of the vented temperature zone. The rate of temperature decrease can be controlled by the regulating valve 17 through flow rate adjustment, achieving rapid cooling in localized areas. This method ensures uniform cooling rates in each temperature zone of the heating furnace 10 and allows for individual adjustment of the cooling rate, which helps reduce damage to the heating element 14 and shortens the cooling process time.

[0058] In some embodiments, the exhaust duct 15 includes an extension 152 and a surrounding section 151 connected to each other. The surrounding section 151 is arranged circumferentially around the process pipe 12, and the extension 152 is used to connect to the intake duct 16. The extension 152 connects the surrounding section 151 and the intake duct 16. Optionally, the extension 152 extends from the heat-conducting space 13 through the insulation pipe 11 to the outside to facilitate connection with the intake duct 16. The surrounding section 151 can conduct cooling gas to the circumference of the process pipe 12, thereby allowing the cooling gas to enter the heat-conducting space 13 uniformly from the circumference of the process pipe 12.

[0059] In some embodiments, the surrounding section 151 is arranged in an arc shape. Optionally, the surrounding section 151 is arranged in a semi-circular shape. In some embodiments, two air outlet pipes 15 are provided between two adjacent heating elements 14, which are arranged opposite each other on both sides of the process tube 12. The surrounding sections 151 of the two air outlet pipes 15 can be joined to form a near-circumference, so that cooling gas can be introduced into the circumference of the process tube 12. The two air outlet pipes 15 can be connected to each other through extension sections 152, or they can be connected to each other through extension sections 152 to the same air inlet pipe 16. The above methods facilitate the installation of the heating furnace 10.

[0060] In some embodiments, the exhaust pipe 15 surrounds the circumference of the process pipe 12, and multiple exhaust holes 1511 are provided at intervals along the circumference, with the exhaust holes 1511 facing the process pipe 12. By providing multiple exhaust holes 1511 at intervals, cooling gas can be uniformly sprayed into the heat-conducting space 13.

[0061] In some embodiments, referring to FIG8, at least one partition 131 is provided in the heat-conducting space 13, dividing the heat-conducting space 13 into multiple sub-spaces 132, which are isolated from each other. The heating furnace 10 includes multiple exhaust pipes 18, which are arranged one-to-one with the sub-spaces 132 and are connected to each other. If the heat-conducting space 13 is fully connected, the exhaust process occurs simultaneously in each temperature zone, and the cooling of different temperature zones will affect each other.

[0062] To prevent localized temperature control from affecting other areas, the heat-conducting space 13 can be divided into multiple sub-spaces 132, each evacuated through a separate extraction pipe 18, thus reducing the mutual influence of cooling between sub-spaces 132. For example, as shown in Figure 8, the insulation pipe 11 and the process pipe 12 form relatively independent chambers, with each temperature zone isolated from the others. The opening and closing of the extraction pipe 18 can be linked to the opening and closing of the regulating valve 17. For example, when one sub-space 132 overheats, the regulating valve 17 corresponding to that sub-space 132 opens, and the extraction pipe 18 begins to extract air. Cooling gas enters the sub-space 132 and is drawn away from the extraction pipe 18, enabling rapid cooling of a single sub-space 132 (i.e., a single temperature zone). The cooling process has minimal impact on other temperature zones. Multiple extraction pipes 18 are connected to the aforementioned heat exchange device 30 or cooling equipment 20. Optionally, the extraction pipes 18 can be connected to a main pipeline, through which hot gas is extracted. Similarly, a negative pressure pump 19 is installed between the extraction pipe 18 and the heat exchange device 30, or between the extraction pipe 18 and the cooling equipment 20, or between the extraction pipe 18 and the main pipe. The negative pressure pump 19 is the power source for the extraction pipe 18 to generate suction force.

[0063] In some embodiments, referring to FIG8, the insulation pipe 11 includes multiple insulation sections arranged side by side, which are sleeved on the outer periphery of the process pipe 12. The multiple insulation sections are connected end to end to form a complete insulation pipe 11. Each insulation section can cooperate with the process pipe 12 to form the aforementioned subspace 132.

[0064] Furthermore, the spacer 131 can be provided at the end of the insulation pipe 11. The spacer 131 can also be integrally formed with the insulation pipe 11.

[0065] Specifically, in some embodiments, one end of the insulation section extends toward the process pipe 12 and is provided with a spacer 131, while the other end of the insulation section is open. After multiple insulation sections are connected end to end, the spacer 131 can isolate one end of the subspace 132 within the insulation section having the spacer 131, and can also seal the opening of adjacent insulation sections, thus isolating one end of the subspace 132 within adjacent insulation sections and separating the subspaces 132.

[0066] In other embodiments, the two ends of the insulation section extend toward the process pipe 12 and are respectively provided with a first sub-spacer and a second sub-spacer. The first sub-spacer, the second sub-spacer, the inner wall of the insulation section, and the outer wall of the process pipe 12 can form an independent subspace 132. After the insulation sections are connected end to end, the first sub-spacer and the second sub-spacer of two adjacent insulation sections can be joined together to form the aforementioned spacer 131.

[0067] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A heating furnace, wherein, include: Insulation pipe; The process pipe, wherein the insulation pipe is sleeved around the outer periphery of the process pipe; A heat-conducting space is formed between the process tube and the insulation tube, and multiple heating elements are arranged at intervals within the heat-conducting space; The heating furnace further includes at least two air outlet groups and at least two air inlet pipes corresponding to each air outlet group. Each air outlet group includes at least one air outlet pipe, and the air outlet pipes are respectively disposed between adjacent heating elements. The air outlet pipes have air outlet holes communicating with the heat conduction space. The air outlet pipes in the same air outlet group are respectively connected to the same air inlet pipe.

2. The heating furnace according to claim 1, wherein: Multiple heating elements are spaced apart along the axial direction of the process tube; Alternatively, multiple heating elements may be arranged at circumferential intervals along the process tube.

3. The heating furnace according to claim 1, wherein: The heating furnace also includes an exhaust pipe, which is located near one end of the process pipe and is connected to the heat conduction space.

4. The heating furnace according to claim 1, wherein: The gas outlet pipes in the same gas outlet group are arranged adjacent to each other.

5. The heating furnace according to claim 1, wherein: The air intake pipe is equipped with a regulating valve, and a temperature detection component is also installed in the process pipe and / or the heat conduction space. The regulating valve and the temperature detection component are communicatively connected.

6. The heating furnace according to claim 1, wherein: The heating elements are arranged in multiple intervals along the axial direction of the process tube. The air outlet pipe includes an extension section and a surrounding section connected to each other. The surrounding section is arranged around the circumference of the process tube, and the extension section is used to connect to the air inlet pipe.

7. The heating furnace according to claim 1 or 6, wherein: The heating element is provided in multiple locations at intervals along the axial direction of the process tube, and the air outlet pipe is provided with multiple air outlet holes at intervals around the circumference of the process tube, with the air outlet holes facing the process tube.

8. The heating furnace according to claim 1, wherein: The heating elements are arranged in multiple circumferentially along the process tube, and at least two gas outlet groups are arranged at intervals along the axial direction of the process tube. The gas outlet pipes in the same gas outlet group are arranged at intervals along the circumferential direction.

9. The heating furnace according to claim 8, wherein: The air outlet pipe includes a plurality of first air outlet sections and a plurality of second air outlet sections connected to each other. The plurality of first air outlet sections are arranged side by side along the axial direction and extend along the circumferential direction. Multiple second air outlet sections are respectively connected to the adjacent ends of two adjacent first air outlet sections.

10. The heating furnace according to claim 1, wherein: The heat-conducting space is provided with at least one partition, which divides the heat-conducting space into multiple subspaces. The subspaces are isolated from each other. The heating furnace includes multiple exhaust pipes, which are connected to each of the subspaces in a one-to-one correspondence.

11. A semiconductor deposition system, wherein, include: The gas supply device and the heating furnace according to any one of claims 1-10, wherein the gas supply device is used to supply gas into the gas outlet pipe.

12. The deposition system according to claim 11, wherein: The heating furnace also includes an exhaust pipe, one end of which is connected to the heat conduction space, and the other end of which is connected to a cooling device. The cooling device includes a cooling chamber, a liquid inlet pipe, and a liquid level gauge. The liquid level gauge is installed inside the cooling chamber. The cooling chamber is connected to the air extraction pipe, the liquid inlet pipe, and the outside. The cooling chamber is used to hold the cooling substrate.

13. The deposition system according to claim 11, wherein: The heating furnace also includes an exhaust pipe, one end of which is connected to the heat conduction space, and the other end of which is connected to the heat exchange device. The heat exchange device includes a heat exchange chamber and a heat exchange pipe. The heat exchange chamber is connected to the exhaust pipe. The heat exchange pipe is coiled inside the heat exchange chamber and is isolated from the heat exchange chamber.

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